Electronic component mounting bracket and outdoor unit of an air conditioner

Abstract

An electronic component mounting carrier (70) comprises an electronic component (10), a metal plate (30) having one surface (31) and another surface (32), and a heat dissipation component (20) which exhibits flexibility and elasticity. The heat dissipation component (20) is sandwiched between one surface (31) of the metal plate (30) and the electronic component (10), wherein a region of the heat dissipation component (20) facing the electronic component (10) is deformed to conform to the shape of the electronic component (10) and is in close contact with the electronic component (10), and the heat dissipation component (20) is in close contact with one surface of the metal plate (30). The electronic component (10) and the metal plate (30) are thermally connected via the heat dissipation component (20).

Description

Technical area

[0001] The present disclosure relates to an electronic component mounting bracket and an outdoor unit of an air conditioner. Technological background

[0002] In an air conditioner's power converter circuit, a coil is used as an electronic component in an AC unit for noise suppression / noise reduction, or in a DC unit for improving the power factor or reducing current harmonics. Various technologies have been proposed for an electronic component mounting bracket.

[0003] For example, Patent Literature 1 discloses a power converter including a toroidal coil. In the power converter described in Patent Literature 1, a coil cover accommodating the toroidal coil is in contact with a bottom surface of a substrate. An opening of the coil cover and a projection protruding upward from the bottom of a case of the power converter sandwich a heat dissipation sheet, which transfers heat generated in the toroidal coil to the case. Citation listPatent literature

[0004] Patent Literature 1: Japanese Patent Application Laid-Open No. 2020-188131 Brief description of the inventionProblem to be solved by the invention

[0005] However, in the technology described in the above Patent Literature 1, the heat dissipation sheet has low flexibility and is not in close contact with the electronic component, so that a contact area between the electronic component and the heat dissipation sheet is small, which has resulted in a problem that the heat generated in the toroidal coil is ineffectively transferred to the package.

[0006] In addition, in the technology of the above Patent Literature 1, there was a problem that a connecting portion between the electronic component and a substrate or a connecting portion between the electronic component and the case may suffer fatigue fracture due to vibration of the electronic component during transportation of the power converter.

[0007] The present disclosure has been made in view of the foregoing, and an object thereof is to provide an electronic component mounting bracket that can improve heat dissipation performance of an electronic component and suppress vibration of the electronic component. Means to solve the problem

[0008] To solve the above problems and achieve the object, an electronic component mounting bracket according to the present disclosure comprises: an electronic component; a metal plate comprising one surface and another surface; and a heat dissipation member having flexibility and elasticity. The heat dissipation member is sandwiched between one surface of the metal plate and the electronic component, wherein a portion of the heat dissipation member facing the electronic component is deformed according to a shape of the electronic component and is in close contact with the electronic component, and the heat dissipation member is in close contact with the one surface of the metal plate. The electronic component and the metal plate are thermally connected via the heat dissipation member. Effects of the invention

[0009] The electronic component mounting bracket according to the present disclosure has an effect of being able to improve the heat dissipation performance of the electronic component and suppress the vibration of the electronic component. Short description of drawings Fig. 1 is a side view illustrating an electronic component mounting bracket according to a first embodiment. Fig. 2 is a plan view illustrating the electronic component mounting bracket according to the first embodiment. Fig. 3 is a side view illustrating an electronic component mounting bracket according to a second embodiment. Fig. 4 is a plan view showing the electronic component mounting bracket according to the second embodiment. Fig. 5 is an exploded side view illustrating an electronic component mounting bracket according to a third embodiment. Fig. 6 is a side view illustrating an electronic component mounting bracket according to a fourth embodiment. Fig. 7 is a plan view showing the electronic component mounting bracket according to the fourth embodiment. Fig. 8 is a side view illustrating an electronic component mounting bracket according to a fifth embodiment. Fig. 9 is a plan view showing the electronic component mounting bracket according to the fifth embodiment. Fig. 10 is a side view illustrating an electronic component mounting bracket according to a sixth embodiment. Fig. 11 is a plan view showing the electronic component mounting bracket according to the sixth embodiment. Fig. 12 is a side view showing another electronic component mounting bracket according to the sixth embodiment. Fig. 13 is a plan view showing the other electronic component mounting substrate according to the sixth embodiment. Fig. 14 is a block diagram showing a structure of an air conditioner according to a seventh embodiment. Fig. 15 is a refrigerant cycle diagram showing a refrigeration cycle of the air conditioner according to the seventh embodiment. Fig. 16 is a first conceptual diagram illustrating a structure of an outdoor unit of an air conditioner to which the electronic component mounting substrate according to any one of the first embodiment to the sixth embodiment is attached. Fig. 17 is a second conceptual diagram showing the structure of the outdoor unit of the air conditioner to which the electronic component mounting bracket according to any one of the first embodiment to the sixth embodiment is attached. Fig. 18 is a third conceptual diagram illustrating the structure of the outdoor unit of the air conditioner to which the electronic component mounting bracket according to any one of the first embodiment to the sixth embodiment is attached. Description of embodiments

[0010] Hereinafter, an electronic component mounting bracket and an outdoor unit of an air conditioner according to the embodiments will be described in detail with reference to the drawings. Note that in the drawings, like elements are assigned the same reference numerals, and redundant descriptions are omitted. First embodiment

[0011] Fig. 1 is a side view illustrating an electronic component mounting bracket 70 according to a first embodiment. Fig. 2 is a plan view illustrating the electronic component mounting bracket 70 according to the first embodiment. Fig. 2 represents a state as seen from above an electronic component.

[0012] The electronic component mounting support (70) is a mounting support of the electronic component 10, which is designed to suppress vibration of the electronic component 10 and to efficiently dissipate heat generated in the electronic component 10. As shown in Fig. As shown in Figure 1, the electronic component mounting bracket 70 includes the electronic component 10, a heat dissipation member 20 having flexibility and elasticity, and a metal plate 30 having one surface 31 and another surface 32. In the electronic component mounting bracket 70, the heat dissipation member 20 and the electronic component 10 are installed in this order from the bottom on one surface 31 of the metal plate 30. The one surface 31 of the metal plate 30 is a top surface of the metal plate 30, which is a surface of the metal plate 30 on which the heat dissipation member 20 and the electronic component 10 are installed.

[0013] It is noted that in the first embodiment, a stacking direction in which the electronic component 10, the heat dissipation component 20 and the metal plate 30 are arranged as shown in Fig. 1, corresponds to a vertical direction. The vertical direction is a direction perpendicular to a direction in the plane of one surface 31 and the other surface 32 of the metal plate 30. Furthermore, the direction in the plane of one surface 31 and the other surface 32 of the metal plate 30 is parallel to a top surface 20a and a bottom surface 20b of the heat dissipation component 20 described below.

[0014] The electronic component 10 is a toroidal coil comprising a core 11 and a winding 12 wound around the core 11. The core 11 is formed of a magnetic material and has a toroidal shape in the direction in the plane of one surface 31 of the metal plate 30. The electronic component 10 is placed and supported on the heat dissipation component 20 while being transversely supported.

[0015] The electronic component 10 includes connecting terminals 41 attached to the ends of the winding 12. The electronic component 10 is connected via the connecting terminals 41 by means of screws 46 to terminal blocks 42 installed on electronic substrates 43 described later.

[0016] It is pointed out that Fig. 1 illustrates the case where the connecting terminals 41, the terminal blocks 42, and the screws 46 are used to connect the electronic component 10 and the electronic substrates 43, but the method for connecting the electronic component 10 and the electronic substrates 43 is not limited. For example, the electronic component 10 and the electronic substrates 43 can be connected by a method such as soldering.

[0017] The heat dissipation component 20 is sandwiched between one surface 31 of the metal plate 30 and the electronic component 10. The heat dissipation component 20 possesses flexibility and elasticity. Flexibility is a property in which a material is easily deformed. Elasticity is a property in which the shape or volume of an object changes when a force is applied to it and the shape or volume is restored when the applied force is removed. Elasticity is a property that possesses a restoring force by which an object attempts to return to its original shape or volume when a force is applied to it.

[0018] The heat dissipation member 20 is fixed to one surface 31 of the metal plate 30 in a state where the bottom surface 20b of the heat dissipation member 20 and one surface 31 of the metal plate 30 are in close contact with each other. In addition, by pressing a bottom surface of the electronic component 10 against the top surface 20a of the heat dissipation member 20, the heat dissipation member 20 is in close contact with the electronic component 10 in a state where the shape of a part of the heat dissipation member 20 on the top surface 20a side is deformed due to the flexibility of the heat dissipation member 20 to match the shape of the electronic component 10 on a bottom surface 10a side to be described later. The bottom surface of the electronic component 10 is a side of the electronic component 10 corresponding to the metal plate 30.The heat dissipation member 20 is deformed almost to its maximum in terms of flexibility to hold the electronic component 10 in a state in which the electronic component 10 does not move on the heat dissipation member 20.

[0019] The top surface 20a of the heat dissipation member 20 is a surface of the heat dissipation member 20 on a side where the electronic component 10 is arranged in the stacking direction. The bottom surface 20b of the heat dissipation member 20 is a surface of the heat dissipation member 20 on a side where the metal plate 30 is arranged in the stacking direction.

[0020] For the heat dissipation member 20, for example, a heat dissipation sheet having insulating properties is used. For example, if the upper surface 20a of the heat dissipation member 20, which is a surface of the heat dissipation member 20 facing the lower portion of the electronic component 10, is formed with an adhesive, the upper surface 20a of the heat dissipation member 20 and the lower portion of the electronic component 10 can be brought into close contact with each other, so that the upper surface 20a of the heat dissipation member 20 and the lower portion of the electronic component 10 are not separated from each other. Note that there is no limitation on a method for causing the upper surface 20a of the heat dissipation member 20 and the lower portion of the electronic component 10 to come into close contact with each other so that they do not peel off from each other.

[0021] Further, for example, when the bottom surface 20b of the heat dissipation member 20, which is a surface of the heat dissipation member 20 facing the one surface 31 of the metal plate 30, is formed to be adhesive, the bottom surface 20b of the heat dissipation member 20 and the one surface 31 of the metal plate 30 can be brought into close contact with each other, so that the bottom surface 20b of the heat dissipation member 20 and the one surface 31 of the metal plate 30 are not separated from each other. Note that a method for bringing the bottom surface 20b of the heat dissipation member 20 and the one surface 31 of the metal plate 30 into close contact with each other is not limited.

[0022] The heat dissipation member 20 may be fixed while being firmly adhered to one surface 31 of the metal plate 30. Alternatively, contact surfaces between the heat dissipation member 20 and the metal plate 30, namely the bottom surface 20b of the heat dissipation member 20 and one surface 31 of the metal plate 30, may be formed with unevennesses that match each other. In this case, when the unevennesses formed on the heat dissipation member 20 and the metal plate 30 match each other, the heat dissipation member 20 is fixed to one surface 31 of the metal plate 30.

[0023] In addition, the heat dissipation component 20 has the functionality of dissipating heat generated in the electronic component 10 during operation of the electronic component 10. As described above, the heat dissipation component 20 is in direct contact with the lower portion of the electronic component 10, thereby thermally connecting it to the electronic component 10. Therefore, heat generated in the electronic component 10 is transferred to the heat dissipation component 20. The heat dissipation component 20 can then function as a heat sink, dissipating the heat of the electronic component 10 transferred from the electronic component 10.

[0024] Furthermore, as described above, the heat dissipation member 20 is in direct contact with one surface 31 of the metal plate 30, thereby thermally connecting it to the metal plate 30. Therefore, the heat dissipation member 20 has a function of transferring heat generated in the electronic component 10 when the electronic component 10 operates to the metal plate 30.

[0025] The metal plate 30 is a base substrate that serves as a base on which the heat dissipation component 20 and the electronic component 10 are installed in the electronic component mounting bracket 70. The metal plate 30 also has a function of dissipating the heat generated in the electronic component 10 during operation of the electronic component 10. The metal plate 30 is thermally connected to the electronic component 10 via the heat dissipation component 20. This means that the heat generated in the electronic component 10 is transferred to the metal plate 30 via the heat dissipation component 20. The metal plate 30 then serves as a heat sink that dissipates the heat of the electronic component 10 transferred via the heat dissipation component 20.

[0026] Regarding the function of the base substrate and the function as the heat sink that dissipates the heat of the electronic component 10, the electronic component mounting bracket 70 adopts the metal plate 30 formed of metal, which is a material having relatively high mechanical strength and thermal conductivity among different materials.

[0027] Furthermore, as in Fig. 1, two pieces of the electronic substrate 43 are arranged above one surface 31 of the metal plate 30 so as to sandwich the heat dissipation member 20 and the electronic component 10 in the in-plane direction of one surface 31. A terminal block 42 is provided on an upper surface 43a of each of the electronic substrates 43 for electronically connecting the connection terminal 41, which is attached to the end of the coil 12 of the electronic component 10, and the electronic substrate 43. The upper surface 43a of the electronic substrate 43 is a surface opposite to a surface of the electronic substrate 43 facing the metal plate 30 side. The electronic substrates 43 are each supported and fixed by a substrate support 44 formed of a material such as resin.

[0028] The substrate carrier 44 is attached and fixed to the metal plate 30 via a support 45, which is attached to one surface 31 of the metal plate 30. This means that the substrate carrier 44 is arranged above and away from one surface 31 of the metal plate 30 and supports the electronic substrate 43. A gap 50 is formed between the substrate carrier 44 and the metal plate 30. A gap 51 is also formed between the substrate carrier 44 and the heat dissipation component 20.

[0029] In the electronic component mounting carrier 70, the gap 51 is formed between the heat dissipation member 20 and the substrate carrier 44. Therefore, in the electronic component mounting carrier 70, heat can be dissipated from a side surface of the heat dissipation member 20 facing the substrate carrier 44.

[0030] In the electronic component mounting bracket 70 having the above-described structure, the heat dissipation member 20 has flexibility, so that the heat dissipation member 20, on which the electronic component 10 is installed, supports the electronic component 10, with the upper surface 20a side of the heat dissipation member 20 deformed to match the shape of the lower portion of the electronic component 10. The electronic component 10 is thus supported and fixed by the heat dissipation member 20, with the lower portion of the electronic component 10 embedded in the heat dissipation member 20 and in close contact with the heat dissipation member 20 on the upper surface 20a side.

[0031] More specifically, in the heat dissipation member 20 on which the electronic component 10 is installed, the heat dissipation member 20 is deformed on the top surface 20a side according to the shape of the coil 12 of the electronic component 10, which generates heat during operation of the electronic component 10, and the shape of the core 11, which is in contact with the coil 12 and to which the heat generated in the coil 12 is transferred. The electronic component 10 is thus held and fixed by the heat dissipation member 20, wherein the lower portion of the electronic component 10 is embedded in the heat dissipation member 20, which is deformed according to the shape of the winding 12 and the shape of the core 11 at the lower portion of the electronic component 10, and wherein the winding 12 and the core 11 in the lower portion of the electronic component 10 are in close contact with the heat dissipation member 20 on the side of the upper surface 20a.

[0032] That is, in the electronic component mounting bracket 70, the heat dissipation member 20 is deformed according to the uneven shape of the lower portion of the electronic component 10 due to the flexibility of the heat dissipation member 20, and is in close contact with the lower portion of the electronic component 10 according to the uneven shape of the lower portion of the electronic component 10 to support the electronic component 10.

[0033] Furthermore, in the electronic component mounting bracket 70, the heat dissipation member 20 has flexibility, so that the bottom surface 20b of the heat dissipation member 20 installed on the metal plate 30 can be deformed according to the shape of one surface 31 of the metal plate 30. That is, in the electronic component mounting bracket 70, the heat dissipation member 20 is deformed according to the uneven shape of one surface 31 of the metal plate 30 and is fixed in close contact with the one surface 31 of the metal plate 30 according to the uneven shape of one surface 31 of the metal plate 30.

[0034] Therefore, in the electronic component mounting bracket 70, a large contact area is ensured between the heat dissipation member 20 and the electronic component 10, and the adhesion between the heat dissipation member 20 and the electronic component 10 is increased. Furthermore, in the electronic component mounting bracket 70, a large contact area is ensured between the heat dissipation member 20 and the metal plate 30, and the adhesion between the heat dissipation member 20 and the metal plate 30 is increased.

[0035] As a result, the electronic component mounting bracket 70 can efficiently transfer the heat generated in the electronic component 10 during the operation of the electronic component 10 to the metal plate 30 via the heat dissipation member 20, and can reduce the thermal resistance between the electronic component 10 and the metal plate 30, and can improve the performance of dissipating the heat generated in the electronic component 10.

[0036] Furthermore, in the electronic component mounting base 70, the heat dissipation member 20 is in close contact with the electronic component 10 and the metal plate 30, so that vibration of the electronic component 10 can be suppressed even when vibration is applied to the electronic component mounting base 70. By suppressing the vibration of the electronic component 10, the connecting terminals 41 or the terminal blocks 42, which are a connector between the electronic component 10 and the electronic substrates 43, do not suffer fatigue fracture due to the vibration of the electronic component 10. The connector between the electronic component 10 and the electronic substrates 43 includes the connecting terminals 41, the terminal blocks 42, and the screws 46.

[0037] Furthermore, in the electronic component mounting bracket 70, gaps 51 are formed between the heat dissipation member 20 and the substrate supports 44, so that the substrate supports 44 do not hinder the deformation of the heat dissipation member 20 in the direction lying in the plane of the one surface 31 of the metal plate 30. As a result, in the electronic component mounting bracket 70, the heat dissipation member 20 is easily brought into close contact with the lower portion of the electronic component 10 according to the shape of the lower portion of the electronic component 10, and it is also easily brought into close contact with the one surface 31 of the metal plate 30 according to the uneven shape of the one surface 31.

[0038] Further, in the electronic component mounting bracket 71, the electronic component 10 has a ring shape in the in-plane direction of one surface 31 of the metal plate 30 and is transversely deposited. Then, in the electronic component mounting bracket 71, the bottom surface 10a of the electronic component 10, which is a surface orthogonal to a central axis C of the ring shape of the electronic component 10, is arranged in contact with the top surface 20a of the heat dissipation member 20 while facing the top surface 20a. The bottom surface 10a of the electronic component 10 includes a bottom surface of the core 11 and the coil 12 wound around the bottom surface of the core 11.

[0039] In the electronic component mounting bracket 70 having the above-described structure, the heat dissipation member 20 is fixed to the bottom surface 10a, which is the surface orthogonal to the central axis C of the electronic component 10. That is, in the electronic component mounting bracket 71, the electronic component 10 is mounted while the bottom surface 10a faces the top surface 20a of the heat dissipation member 20, and the bottom surface 10a is a surface that has a relatively larger contact area with the top surface 20a of the heat dissipation member 20, which is the surface of the heat dissipation member 20 on which the electronic component 10 is installed, than with other surfaces of the heat dissipation member 20 when the electronic component 10 is transversely placed and installed on the heat dissipation member 20.Therefore, it can be said that the electronic component 10 has the ring shape in the in-plane direction of the one surface 31 of the metal plate 30 and is arranged in the state where the lower surface 10a orthogonal to the center axis C of the ring shape of the electronic component 10 faces and is in contact with the upper surface 20a of the heat dissipation member 20.

[0040] Therefore, in the electronic component mounting bracket 70, a large contact area can be ensured between the electronic component 10 and the heat dissipation member 20. As a result, in the electronic component mounting bracket 71, the adhesion between the electronic component 10 and the heat dissipation member 20 can be further increased, making it possible to more effectively prevent the connecting terminals 41 or the terminal blocks 42, which are the connectors between the electronic component 10 and the electronic substrates 43, from suffering fatigue fracture due to the vibration of the electronic component 10.

[0041] Furthermore, the electronic component mounting bracket 71 can ensure a large contact area between the electronic component 10 and the heat dissipation member 20, thereby more efficiently transferring heat generated in the electronic component 10 during operation of the electronic component 10 to the metal plate 30 via the heat dissipation member 20, reducing the thermal resistance between the electronic component 10 and the metal plate 30, and increasing the efficiency of dissipating the heat generated in the electronic component 10. Thus, by increasing the efficiency of dissipating the heat generated in the electronic component 10, the electronic component mounting bracket 71 can prevent a rise in the temperature of the electronic component 10 and prevent a malfunction of the electronic component 10 due to a rise in the temperature of the electronic component 10.

[0042] It should be noted that although the case where the electronic component 10 is a toroidal coil has been described above, the type of the electronic component 10 is not limited to the toroidal coil.

[0043] As described above, in the electronic component mounting bracket 71, the heat dissipation member 20, which has flexibility and elasticity, is in close contact with the electronic component 10 and the metal plate 30, so that vibration of the electronic component 10 can be suppressed. As a result, in the electronic component mounting bracket 71, it is possible to prevent the occurrence of fatigue fracture in the connector between the electronic component 10 and the electronic substrates 43 due to vibration of the electronic component 10 during product transportation.

[0044] Therefore, the electronic component mounting bracket 70 according to the first embodiment has an effect of being able to enhance the heat dissipation performance of the electronic component 10 by increasing the heat transfer performance from the electronic component 10 to the metal plate 30, and is further capable of suppressing the vibration of the electronic component 10. Second embodiment

[0045] Fig. 3 is a side view illustrating an electronic component mounting bracket 71 according to a second embodiment. Fig. 4 is a plan view illustrating the electronic component mounting bracket 71 according to the second embodiment. Note that, in the second embodiment, components identical to those in the above-described first embodiment are denoted by the same reference numerals assigned to those components in the first embodiment, and a detailed description of these components is omitted.

[0046] The electronic component mounting substrate 71 according to the second embodiment differs from the electronic component mounting substrate 70 according to the above-described first embodiment in that the heat dissipation member 20 has a disk shape to match the shape of the electronic component 10 in the in-plane direction of one surface 31 of the metal plate 30.

[0047] The electronic component mounting substrate 71 having the above-described structure has the same structure as the electronic component mounting substrate 70 according to the above-described first embodiment, except that the heat dissipation member 20 has a disc shape in the in-plane direction of one surface 31 of the metal plate 30. Therefore, the electronic component mounting substrate 71 has an effect similar to that of the electronic component mounting substrate 70 according to the first embodiment.

[0048] Furthermore, the electronic component mounting bracket 71 uses the heat dissipation member 20, which has a shape corresponding to the shape of the electronic component 10 in the in-plane direction of one surface 31 of the metal plate 30. Therefore, in the electronic component mounting bracket 71, the heat dissipation member 20 can be reduced in size while maintaining a portion of the heat dissipation member 20 that effectively dissipates the heat generated in the electronic component 10. The portion of the heat dissipation member 20 that effectively dissipates the heat generated in the electronic component 10 is a region in the heat dissipation member 20 that corresponds to the ring shape of the electronic component 10 in the in-plane direction of one surface 31 of the metal plate 30.

[0049] That is, in the electronic component mounting bracket 71, the electronic component 10 has a disc shape in the in-plane direction of one surface 31 of the metal plate 30. It can then be said that the heat dissipation member 20 has a disc shape that is larger than the disc shape of the electronic component 10 and follows the shape of the electronic component 10 in the in-plane direction of one surface 31 of the metal plate 30. In the in-plane direction of one surface 31 of the metal plate 30, the disc shape of the electronic component 10 and the disc shape of the heat dissipation member 20 are coaxially arranged.

[0050] As a result, the electronic component mounting bracket 71 can improve the performance of dissipating the heat generated in the electronic component 10 at a lower cost than the electronic component mounting bracket 70 according to the above-described first embodiment by improving the heat transfer performance from the electronic component 10 to the metal plate 30, and can also suppress the vibration of the electronic component 10. Therefore, the electronic component mounting bracket 71 can prevent the connecting terminals 41 or the terminal blocks 42, which are the connectors between the electronic component 10 and the electronic substrates 43, from suffering fatigue fracture due to the vibration of the electronic component 10 during product transportation at a lower cost than the electronic component mounting bracket 70. Third embodiment

[0051] Fig. 5 is an exploded side view illustrating an electronic component mounting bracket 72 according to a third embodiment. Note that, in the third embodiment, components identical to those in the above-described first embodiment are denoted by the same reference numerals as those assigned to such components in the first embodiment, and a detailed description thereof will be omitted.

[0052] The electronic component mounting bracket 72 according to the third embodiment differs from the electronic component mounting bracket 70 according to the first embodiment described above in that a recess 23 having a shape matching the shape of the lower portion of the electronic component 10 is formed in the heat dissipation member 20 on the side of the upper surface 20a.

[0053] The electronic component mounting bracket 72 having the above-described structure has the same structure as the electronic component mounting bracket 70 of the above-described first embodiment, except that the recess 23, which has a shape corresponding to the shape of the lower portion of the electronic component 10, is formed in the heat dissipation member 20 on the upper surface 20a side. Therefore, the electronic component mounting bracket 72 has an effect similar to that of the electronic component mounting bracket 70 according to the first embodiment.

[0054] In the electronic component mounting bracket 72 having the above-described structure, it can be said that the heat dissipation member 20 includes the recess 23 formed in accordance with the shape of a contact portion at which the electronic component 10 contacts the heat dissipation member 20. Therefore, in the electronic component mounting bracket 72, the heat dissipation member 20 can be brought into close contact with the lower portion of the electronic component 10 more easily. As a result, the electronic component mounting bracket 72 can more effectively improve the heat dissipation performance of the electronic component 10 by improving the heat transfer performance from the electronic component 10 to the metal plate 30 than the electronic component mounting bracket 70 according to the above-described first embodiment, and can also suppress the vibration of the electronic component 10.Therefore, the electronic component mounting bracket 72 can more effectively prevent connecting terminals 41 or terminal blocks 42, which are the connectors between the electronic component 10 and the electronic substrates 43, from suffering fatigue fracture due to the vibration of the electronic component 10 during transportation of the product than the electronic component mounting bracket 70. Fourth embodiment

[0055] Fig. 6 is a side view illustrating an electronic component mounting bracket 73 according to a fourth embodiment. Fig. 7 is a plan view illustrating the electronic component mounting bracket 73 according to the fourth embodiment. Note that, in the fourth embodiment, components identical to those in the above-described first embodiment are denoted by the same reference numerals as those assigned to such components in the first embodiment, and a detailed description of these components will be omitted.

[0056] The electronic component mounting bracket 73 according to the fourth embodiment differs from the electronic component mounting bracket 70 according to the first embodiment described above in that the heat dissipation member 20 includes a first heat dissipation member 21 and a second heat dissipation member 22 as two types of heat dissipation members 20 having different flexibility and elasticity, wherein the first heat dissipation member 21 having relatively high flexibility is arranged at a portion in contact with the electronic component 10, and the second heat dissipation member 22 having relatively high elasticity is arranged at a portion not in contact with the electronic component 10.

[0057] The electronic component mounting substrate 73 having the above-described structure has the same structure as the electronic component mounting substrate 70 according to the above-described first embodiment, except that the heat dissipation member 20 includes the first heat dissipation member 21 and the second heat dissipation member 22 as the two types of heat dissipation members 20 having different flexibility and elasticity, and the first heat dissipation member 21, which has the relatively high flexibility, is arranged on a surface in contact with the electronic component 10. Therefore, the electronic component mounting substrate 73 achieves an effect similar to that of the electronic component mounting substrate 70 according to the first embodiment.

[0058] The first heat dissipation member 21 is the heat dissipation member 20 having flexibility and elasticity in the electronic component mounting substrate 73, and is the heat dissipation member 20 having relatively higher flexibility than the second heat dissipation member 22.

[0059] Further, the second heat dissipation member 22 is the heat dissipation member 20 having flexibility and elasticity in the electronic component mounting substrate 73, and is the heat dissipation member 20 having relatively higher elasticity than that of the first heat dissipation member 21.

[0060] Then, in the electronic component mounting substrate 73, the first heat dissipation member 21, which has relatively high flexibility, is arranged at a position in contact with the electronic component 10. Specifically, in the electronic component mounting substrate 73, the first heat dissipation member 21 is provided in a square shape containing the core 11 of the electronic component 10 in the in-plane direction of one surface 31 of the metal plate 30.

[0061] By including the heat dissipation member 20 having such a structure, the electronic component mounting bracket 73 ensures a large contact area between the heat dissipation member 20 and the electronic component 10, and also increases the adhesion between the heat dissipation member 20 and the electronic component 10, as described in the first embodiment. As a result, the electronic component mounting bracket 73 can efficiently transfer the heat generated in the electronic component 10 during operation of the electronic component 10 to the metal plate 30 via the heat dissipation member 20, can reduce the thermal resistance between the electronic component 10 and the metal plate 30, and can improve the performance of dissipating the heat generated in the electronic component 10.

[0062] Further, in the electronic component mounting bracket 73, the second heat dissipation member 22, which has relatively high elasticity, is disposed at the position not in contact with the electronic component 10. More specifically, in the electronic component mounting bracket 73, the second heat dissipation member 22 is formed in a frame shape that encloses the square shape of the first heat dissipation member 21 from an outer edge side of the first heat dissipation member 21 in the in-plane direction of one surface 31 of the metal plate 30.That is, the first heat dissipation member 21 and the second heat dissipation member 22 are positioned in such a manner that, in the in-plane direction of one surface 31 of the metal plate 30, the first heat dissipation member 21, which has relatively high flexibility, is positioned in a region near the central axis C of the electronic component 10, and the second heat dissipation member 22, which has relatively high elasticity, is positioned in a region away from the central axis C of the electronic component 10. Note that the height of the first heat dissipation member 21 is set equal to the height of the second heat dissipation member 22.

[0063] With the second heat dissipation member 22 configured as described above, in the electronic component mounting bracket 73, when vibration is applied to the electronic component mounting bracket 73, deformation of the first heat dissipation member 21 due to its flexibility toward the outer edge of the rectangular shape of the first heat dissipation member 21 in the in-plane direction of one surface 31 of the metal plate 30 is prevented by the elasticity of the second heat dissipation member 22, which has a relatively high elasticity. That is, in the electronic component mounting bracket 73, deformation of the first heat dissipation member 21 is prevented by the elasticity of the second heat dissipation member 22, so that vibration of the electronic component 10 can be suppressed.

[0064] As a result, the electronic component mounting substrate 73, like the electronic component mounting substrate 70 according to the first embodiment described above, can suppress the vibration of the electronic component 10 even when vibration is applied to the electronic component mounting substrate 70. Thus, when the vibration of the electronic component 10 is suppressed, the connection terminals 41 or terminal blocks 42, which are the connectors between the electronic component 10 and the electronic substrates 43, do not suffer fatigue fracture due to the vibration of the electronic component 10. Therefore, the electronic component mounting substrate 73 in which the heat dissipation member 20 includes the first heat dissipation member 21 and the second heat dissipation member 22, can also achieve an effect similar to that of the heat dissipation member 20 of the electronic component mounting substrate 70 according to the first embodiment.

[0065] Note that the above description describes the case where, in the in-plane direction of one surface 31 of the metal plate 30, the first heat dissipation member 21 is placed in the region near the central axis C of the electronic component 10, and the second heat dissipation member 22 is placed in the region away from the central axis C of the electronic component 10. However, the placement of the first heat dissipation member 21 and the second heat dissipation member 22 is not limited to the above-described placement. The placement of the first heat dissipation member 21 and the second heat dissipation member 22 can be changed as appropriate without departing from the spirit and scope of the effect of the electronic component mounting bracket 73 according to the above-described fourth embodiment. Fifth embodiment

[0066] Fig. 8 is a side view illustrating an electronic component mounting bracket 74 according to a fifth embodiment. Fig. 9 is a plan view illustrating the electronic component mounting bracket 74 according to the fifth embodiment. Note that, in the fifth embodiment, components identical to those in the above-described first embodiment are denoted by the same reference numerals as those assigned to such components in the first embodiment, and a detailed description thereof is omitted.

[0067] The electronic component mounting substrate 74 according to the fifth embodiment differs from the electronic component mounting substrate 70 according to the first embodiment described above in that the heat dissipation member 20 is also arranged between the substrate supports 44, which fix and hold the electronic substrates 43, and the metal plate 30 in the direction lying in the plane of the one surface 31 of the metal plate 30.

[0068] The electronic component mounting bracket 74 having the above-described structure has the same structure as the electronic component mounting bracket 70 according to the above-described first embodiment, except that the heat dissipation member 20 is also arranged between the substrate supports 44, which fix and support the electronic substrates 43, and the metal plate 30 in the direction in the plane of one surface 31 of the metal plate 30. Therefore, the electronic component mounting bracket 74 achieves an effect similar to that of the electronic component mounting bracket 70 according to the first embodiment.

[0069] In the electronic component mounting carrier 74, the heat dissipation member 20, which is arranged in the gaps 50 between the substrate carriers 44 and the metal plate 30, is deformed by the downward compressive force received from the substrate carriers 44 and is in close contact with one surface 31 of the metal plate 30. As a result, the electronic substrates 43 held by the substrate carriers 44 are thermally connected to one surface 31 of the metal plate 30 via the substrate carriers 44 and the heat dissipation member 20. The downward compressive force received by the substrate carriers 44 is a compressive force received from the substrate carriers 44 in a direction perpendicular to the compressive force in the in-plane direction of one surface 31 of the metal plate 30, and is a compressive force in a direction from the heat dissipation member 20 toward the metal plate 30.

[0070] In the electronic component mounting stage 74, after the heat dissipation member 20 is disposed on the one surface 31 of the metal plate 30 including the gaps 50 between the substrate supports 44 and the metal plate 30, the substrate supports 44 are attached and fixed to the metal plate 30 via the supports 45 attached to the one surface 31 of the metal plate 30. As a result, the above-described downward compressive force is applied to the heat dissipation member 20 between the substrate supports 44 and the metal plate 30 from the top surface 20a side of the heat dissipation member 20 toward the metal plate 30. Note that, in this case, the heat dissipation member 20 disposed between the substrate supports 44 and the metal plate 30 is provided with through holes through which the supports 45 are passed.

[0071] Therefore, in the fifth embodiment, the electronic component mounting bracket is realized in which the substrate supports 44 are provided above and away from the one surface 31 of the metal plate 30, a part of the heat dissipation member 20 is sandwiched between the lower surfaces of the electronic substrates 43 projecting from the substrate supports 44 in the in-plane direction of the metal plate 30, or between the lower surface of the substrate supports 44 and the one surface 31 of the metal plate 30, is deformed by the downward force exerted by the substrate supports 44, and is in close contact with the one surface 31 of the metal plate 30, and the electronic component 10 and the electronic substrates 43 are electrically connected via a part of the heat dissipation member 20.

[0072] In the electronic component mounting bracket 74, the heat dissipation member 20 disposed between the substrate supports 44 and the metal plate 30 is deformed by the downward pressing force received from the substrate supports 44, so that the adhesion between the heat dissipation member 20 and the metal plate 30 is further improved. As a result, the electronic component mounting bracket 74 can improve the heat dissipation performance of the electronic component 10 even more reliably than the electronic component mounting bracket 70 according to the above-described first embodiment by improving the heat transfer performance from the electronic component 10 to the metal plate 30 and also suppressing the vibration of the electronic component 10.Therefore, the electronic component mounting bracket 74 can prevent the connecting terminals 41 or the terminal blocks 42, which are the connector between the electronic component 10 and the electronic substrates 43, from suffering fatigue fracture due to the vibration of the electronic component 10 during transportation of the product even more reliably than the electronic component mounting bracket 70.

[0073] Furthermore, in the electronic component mounting carrier 74, the heat dissipation member 20 is located in the gaps 50 between the substrate carriers 44 and the metal plate 30, whereby the electronic substrates 43 are thermally connected to one surface 31 of the metal plate 30 via the substrate carriers 44 and the heat dissipation member 20 arranged in the gaps 50. Therefore, in the electronic component mounting carrier 74, heat generated in the electronic substrates 43 during operation of the electronic substrates 43 can be transferred to the metal plate 30 via the substrate carriers 44 and the heat dissipation member 20 arranged in the gaps 50. As a result, the electronic component mounting carrier 74 can improve the performance of dissipating the heat generated in the electronic substrates 43 and cool the electronic substrates 43.By cooling the electronic substrates 43, the electronic component mounting carrier 74 can suppress an increase in the temperature of the electronic substrates 43 and avoid a malfunction of the electronic substrates 43 due to an increase in the temperature of the electronic substrates 43. Sixth embodiment

[0074] Fig. 10 is a side view illustrating an electronic component mounting bracket 75 according to a sixth embodiment. Fig. 11 is a plan view illustrating the electronic component mounting bracket 75 according to the sixth embodiment. Note that, in the sixth embodiment, components identical to those of the above-described first embodiment are denoted by the same reference numerals as those assigned to such components in the first embodiment, and a detailed description thereof will be omitted.

[0075] The electronic component mounting carrier 75 according to the sixth embodiment differs from the electronic component mounting carrier 70 according to the first embodiment described above in that the electronic substrate 43 and the substrate carrier 44 each include an opening formed in a region corresponding to a position at which the electronic component 10 is arranged.

[0076] This means that in the first embodiment, as shown in the Fig. 1 and Fig. 2, the two pieces of the electronic substrates 43 are arranged so as to sandwich the heat dissipation component 20 and the electronic component 10 in the direction lying in the plane of one surface 31 of the metal plate 30. Further, in the first embodiment, as shown in the Fig. 1 and Fig. 2, the two pieces of substrate carriers 44 are arranged so as to confine the heat dissipation component 20 and the electronic component 10 in the direction lying in the plane of one surface 31 of the metal plate 30.

[0077] On the other hand, in the electronic component mounting carrier 75, as shown in Fig. 10 and Fig. 11, a piece of the substrate carrier 44 is arranged above one surface 31 of the metal plate 30. Also, in the electronic component mounting carrier 75, as shown in Fig. 10 and Fig. 11, one piece of the electronic substrate 43 is held by one piece of the substrate carrier 44.

[0078] Additionally, an opening 43b is formed in the electronic substrate 43 in the region corresponding to the position at which the electronic component 10 is arranged in the direction lying in the plane of one surface 31 of the metal plate 30. Similarly, an opening 44a is formed in the substrate carrier 44 in the region corresponding to the position at which the electronic component 10 is arranged in the direction lying in the plane of one surface 31 of the metal plate 30.

[0079] The opening 43b of the electronic substrate 43 is formed at the position that includes the opening 44a of the substrate support 44 in the direction lying in the plane of one surface 31 of the metal plate 30. Furthermore, the opening 44a of the substrate support 44 and the opening 43b of the electronic substrate 43 are formed at the positions that include the core 11 of the electronic component 10 in the direction lying in the plane of one surface 31 of the metal plate 30.

[0080] Furthermore, in the electronic component mounting stage 75, like the electronic component mounting stage 74 according to the fifth embodiment described above, the heat dissipation member 20 is also arranged in the in-plane direction of one surface 31 of the metal plate 30 between the substrate support 44, which fixes and supports the electronic substrate 43, and the metal plate 30. The electronic component 10 is arranged while protruding upward from the opening 44a of the substrate support 44 and the opening 43b of the electronic substrate 43. Further, a part of the heat dissipation member 20 is exposed through the opening 44a of the substrate support 44 and the opening 43b of the electronic substrate 43.

[0081] In the electronic component mounting bracket 75 having the above-described structure, the electronic component 10 is arranged in the in-plane direction of one surface 31 of the metal plate 30 inside the opening 44a formed in the substrate bracket 44 and the opening 43b formed in the electronic substrate 43, whereby the electronic component 10 and the electronic substrate 43 can be mounted closer to each other. As a result, the electronic component mounting bracket 75 can realize the mounting bracket for the electronic component 10 in a smaller size and at a lower cost.

[0082] It should be noted that the above description has described the case where the opening 44a is formed in the substrate support 44 and the opening 43b is formed in the electronic substrate 43, but the structure that allows the electronic component 10 and the electronic substrate 43 to be closely fixed to each other as described above is not limited to the structure in which the opening 44a and the opening 43b are formed.

[0083] For example, in the Fig. 1 and Fig. 2 of the above-described first embodiment, a case is assumed in which the electronic component 10 is brought closer to the substrate carriers 44 and the electronic substrates 43 in a manner in which the electronic substrates 43 and the substrate carriers 44 do not overlap with the electronic component 10 in the direction lying in the plane of the one surface 31 of the metal plate 30.

[0084] Fig. 12 is a side view showing another electronic component mounting bracket 76 according to the sixth embodiment. Fig. 13 is a plan view illustrating the other electronic component mounting bracket 76 according to the sixth embodiment. The other electronic component mounting bracket 76 according to the sixth embodiment differs from the electronic component mounting bracket 75 according to the above-described sixth embodiment in that the electronic substrate 43 and the substrate support 44 each include a cutout formed in the region corresponding to the position where the electronic component 10 is arranged.

[0085] As in the Fig. 12 and Fig. 13, in the other electronic component mounting carrier 76, a piece of the substrate carrier 44 is arranged above the one surface 31 of the metal plate 30, as in the electronic component mounting carrier 75 according to the sixth embodiment described above. Further, as shown in the Fig. 12 and Fig. 13, in the other electronic component mounting bracket 76, one piece of the electronic substrate 43 is held by the one piece of the substrate carrier 44, as in the electronic component mounting bracket 75 according to the sixth embodiment described above.

[0086] Additionally, a cutout 43c is formed in the electronic substrate 43 in the region corresponding to the position at which the electronic component 10 is arranged in the direction lying in the plane of one surface 31 of the metal plate 30. Similarly, a cutout 44b is formed in the substrate carrier 44 in the region corresponding to the position at which the electronic component 10 is arranged in the direction lying in the plane of one surface 31 of the metal plate 30.

[0087] The cutout 43c of the electronic substrate 43 is formed in the in-plane direction of one surface 31 of the metal plate 30 at a position including the cutout 44b of the substrate support 44, except for a portion on the side where the cutout 43c is open. Furthermore, the cutout 44b of the substrate support 44 and the cutout 43c of the electronic substrate 43 are formed in the in-plane direction of one surface 31 of the metal plate 30 at positions including the core 11 of the electronic component 10.

[0088] As with the electronic component mounting bracket 75 according to the sixth embodiment described above, in the other electronic component mounting bracket 76, the heat dissipation member 20 is also arranged between the substrate support 44, which fixes and supports the electronic substrate 43, and the metal plate 30 in the direction in the plane of one surface 31 of the metal plate 30. The electronic component 10 is arranged while protruding upward from the cutout 44b of the substrate support 44 and the cutout 43c of the electronic substrate 43. Further, a part of the heat dissipation member 20 is exposed via the cutout 44b of the substrate support 44 and the cutout 43c of the electronic substrate 43.

[0089] In the other electronic component mounting bracket 76 having the above-described structure, the electronic component 10 is arranged in the in-plane direction of one surface 31 of the metal plate 30 inside the cutout 44b formed in the substrate support 44 and the cutout 43c formed in the electronic substrate 43, whereby the electronic component 10 and the electronic substrate 43 can be mounted closer to each other than in the electronic component mounting bracket 75 according to the above-described sixth embodiment. As a result, the other electronic component mounting bracket 76 can realize the mounting bracket for the electronic component 10 in a smaller size and at a lower cost than in the electronic component mounting bracket 75 according to the above-described sixth embodiment.

[0090] Therefore, in the sixth embodiment, the electronic component mounting bracket is realized in which the opening or cutout is formed in each of the electronic substrate 43 and the substrate bracket 44 at the position where the electronic component 10 is arranged in the in-plane direction of the metal plate 30.

[0091] The structure in which the opening 44a is formed in the substrate support 44 and the opening 43b is formed in the electronic substrate 43, or the structure in which the cutouts are formed in the substrate support 44 and the electronic substrate 43 can be selected as desired. Seventh embodiment

[0092] Fig. 14 is a block diagram showing a structure of an air conditioner 80 according to a seventh embodiment. Fig. 15 is a refrigerant cycle diagram illustrating a refrigeration cycle 110 of the air conditioner 80 according to the seventh embodiment. As shown in FIGS. Fig. 14 and Fig. As shown in Figure 15, the air conditioner 80 according to the seventh embodiment includes an indoor unit 80a installed in an indoor space and an outdoor unit 80b installed in an outdoor space. Note that in the drawings, like elements are designated by the same reference numerals, and redundant descriptions are omitted.

[0093] In the air conditioner 80, the indoor unit 80a, the refrigerant line 152, the outdoor unit 80b, and the refrigerant line 151 form a refrigerant cycle circuit. Further, in the air conditioner 80, a compressor 132, a four-way valve 131, an outdoor heat exchanger 133, an expansion valve 123, and an indoor heat exchanger 121 are sequentially connected in a loop using the refrigerant line 151 and the refrigerant line 152 to form the refrigeration cycle 110. The refrigerant pipe 151 and the refrigerant pipe 152 are a piping system for connecting the indoor heat exchanger 121 of the indoor unit 80a and the outdoor heat exchanger 133 of the outdoor unit 80b and circulates the refrigerant, and serves as a part of the refrigerant cycle in the refrigeration cycle 110 of the air conditioner 80.

[0094] Furthermore, an indoor fan 122 is installed in the indoor unit 80a to form an airflow that passes through the indoor heat exchanger 121. The indoor fan 122 operates when an indoor propeller 122a is driven by an indoor motor 122b.

[0095] An outdoor fan 134 is also installed in the outdoor unit 80b to generate an airflow that passes through the outdoor heat exchanger 133. The outdoor fan 134 operates when an outdoor propeller 134a is driven by an outdoor motor 134b.

[0096] Fig. 16 is a first conceptual diagram illustrating a structure of the outdoor unit 80b of the air conditioner 80 to which the electronic component mounting bracket according to any one of the first to sixth embodiments is attached. Fig. 16 shows the conceptual diagram when the outdoor unit 80b is viewed from above. Fig. 17 is a second conceptual diagram illustrating the structure of the outdoor unit 80b of the air conditioner 80 to which the electronic component mounting bracket according to any one of the first to sixth embodiments is attached. Fig. 17 shows the conceptual diagram when the outdoor unit 80b is viewed from the side. Fig. 18 is a third conceptual diagram illustrating the structure of the outdoor unit 80b of the air conditioner 80 to which the electronic component mounting bracket according to any one of the first to sixth embodiments is attached. Fig. 18 shows the conceptual diagram when the outdoor unit 80b is viewed obliquely from above. Fig. 16 to 18 illustrate a part of the structure of the outdoor unit 80b, which is seen when a part of a casing 61 of the outdoor unit 80b is removed.

[0097] The outdoor unit 80b of the air conditioner 80 has a structure in which the metal plate 30 of the electronic component mounting bracket according to any one of the first embodiment to the sixth embodiment serves as a partition, and the interior of the casing 61, which has the shape of a rectangular parallelepiped box, is divided into a machine chamber 63 and a fan chamber 64. In the case where the metal plate 30 serves as the partition, the reference numerals "30, 62" in the Fig. 16 to 18 are to be understood as the reference numeral "30." Inside the housing 61, the electronic component 10 is arranged in the machine chamber 63, and the outdoor fan 134 is arranged in the fan chamber 64. The compressor 132 is also arranged in the machine chamber 63. Furthermore, the outdoor heat exchanger 133 is arranged in the fan chamber 64.

[0098] In the outdoor unit 80b configured as described above, heat generated in the electronic component 10 and transferred to the metal plate 30 via the heat dissipation member 20 is dissipated into the air on the side of the fan chamber 64, thereby significantly improving the heat dissipation performance of the electronic component 10 or the metal plate 30, and the electronic component 10 can be efficiently cooled. Note that a heat radiator may be attached to the metal plate 30. The heat radiator includes, for example, a metallic heat sink.

[0099] Further, in the outdoor unit 80b of the air conditioner 80, the other surface 32 side of the metal plate 30 may be fixed to a fixing plate 62, and the fixing plate 62 may serve as a partition for dividing the interior of the casing 61, which has the shape of the rectangular parallelepiped box, into the machine chamber 63 and the blower chamber 64. In the case where the fixing plate 62 serves as the partition, the reference numerals "30, 62" in the Fig. 16 to 18 are to be understood as reference symbol “62”

[0100] In the outdoor unit 80b configured as described above, the other surface 32 side of the metal plate 30 is fixed to the fixing plate 62, so that the electronic component mounting bracket can be detachably fixed to the outdoor unit 80b more easily, and the assemblability of the outdoor unit 80b and the performance of the maintenance service for the outdoor unit 80b can be improved.

[0101] The structure for fixing the other surface 32 of the metal plate 30 to the fixing plate 62 includes a screw connection or the like, but the structure for fixing the other surface 32 of the metal plate 30 to the fixing plate 62 is not limited in any way. The structure for fixing the other surface 32 of the metal plate 30 to the fixing plate 62 can be changed as appropriate without deviating from the essence and scope of the effect of the structure for fixing the other surface 32 of the metal plate 30 to the fixing plate 62.

[0102] The configurations shown in the above embodiments each represent an example, so that other known technologies can be combined, the embodiments can be combined with each other, and the configurations can be partially omitted or modified without departing from the scope of the present disclosure. List of reference symbols 10 electronic component; 10a bottom; 11 core; 12 windings; 20 heat dissipation component; 20a, 43a top; 20b bottom; 21 first heat dissipation component; 22 second heat dissipation component; 23 rebound; 30 metal plate; 31 a surface; 32 other surface; 41 connection port; 42 terminal block; 43 Electronic substrate; 43b, 44a opening; 43c, 44b detail; 44 substrate carriers; 45 support; 46 screw; 50, 51 gap; 61 housings; 62 mounting plate; 63 machine room; 64 blower chamber; 70, 71, 72, 73, 74, 75 Electronic component mounting carrier; 76 other electronic component assembly carriers; 80 air conditioning; 80a indoor unit; 80b outdoor unit; 110 Refrigeration circuit; 121 interior heat exchanger; 122 interior fan; 122a interior propeller; 122b Interior engine; 123 expansion valve; 131 four-way valve; 132 compressors; 133 outdoor heat exchangers; 134 outdoor fans; 134a external propeller; 134b exterior engine; 151,152 refrigerant line; C central axis. QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2020 - 188 131

[0004]

Claims

[1] Electronic component mounting carrier, comprising: an electronic component; a metal plate comprising one surface and another surface; and a heat dissipation component which has flexibility and elasticity, whereby the heat dissipation component is sandwiched between one surface of the metal plate and the electronic component, wherein a portion of the heat dissipation component facing the electronic component is deformed to conform to a shape of the electronic component and is in close contact with the electronic component, and the heat dissipation component is in close contact with the one surface of the metal plate, and the electronic component and the metal plate are thermally connected to each other via the heat dissipation component. [2] The electronic component mounting bracket according to claim 1, wherein the electronic component is a coil comprising a core formed of a magnetic material and a winding wound around the core. [3] Electronic component mounting carrier according to claim 1 or 2, comprising: a substrate support disposed above one surface of the metal plate; and an electronic substrate held on the substrate carrier, where the electronic component and the electronic substrate are electrically connected via a connector between the electronic component and the electronic substrate. [4] The electronic component mounting bracket according to any one of claims 1 to 3, wherein the electronic component has a ring shape in an in-plane direction of the metal plate, and is arranged in a state in which a lower surface of the electronic component faces orthogonally to a center axis of the ring shape of the electronic component and is in contact with an upper surface of the heat dissipation member. [5] The electronic component mounting bracket according to claim 4, wherein the heat dissipation member has a disc shape corresponding to the shape of the electronic component in the in-plane direction of the metal plate. [6] The electronic component mounting bracket according to any one of claims 1 to 5, wherein the heat dissipation member includes a recess formed in accordance with a shape of a contact portion in which the electronic component is in contact with the heat dissipation member. [7] The electronic component mounting bracket according to any one of claims 1 to 6, wherein the heat dissipation member comprises, as two types of heat dissipation members having different flexibility and elasticity, a first heat dissipation member having a relatively high flexibility and a second heat dissipation member having a relatively high elasticity, and the first heat dissipation member is arranged on a surface in contact with the electronic component. [8] Electronic component mounting carrier according to claim 3, wherein the substrate carrier is provided above and away from one surface of the metal plate, a part of the heat dissipation component is sandwiched between one surface of the metal plate and a bottom surface of the electronic substrate, which protrudes from the substrate carrier in a direction lying in the plane of the metal plate, or a bottom surface of the substrate carrier in the direction lying in the plane of the metal plate, is deformed by a downward force exerted by the substrate carrier, and is in close contact with the one surface of the metal plate, and the electronic component and the electronic substrate are electrically connected via a part of the heat dissipation component. [9] The electronic component mounting bracket according to claim 3, wherein the electronic substrate and the substrate bracket each include an opening or a cutout formed at a position where the electronic component is arranged in an in-plane direction of the metal plate. [10] Outdoor unit of an air conditioning system, the outdoor unit comprising: a housing; and the electronic component mounting carrier according to one of claims 1 to 9, which is accommodated in the housing, wherein inside the housing there is a blower chamber and a machine chamber separated by the metal plate of the electronic component mounting carrier, the electronic component is located in the machine chamber, and a blower is arranged in the blower chamber. [11] Outdoor unit of an air conditioning system, the outdoor unit comprising: a housing; the electronic component mounting carrier according to one of claims 1 to 9, which is accommodated in the housing; and a mounting plate to which the metal plate of the electronic component mounting carrier is attached, wherein inside the housing there is a blower chamber and a machine chamber separated by the mounting plate, the electronic component is located in the machine chamber, and a blower is arranged in the blower chamber.

Images