ELECTRONIC CONTROL DEVICE AND METHOD FOR MANUFACTURING AN ELECTRONIC CONTROL DEVICE

Abstract

An electronic control device comprises a circuit board on which an electronic component is mounted, a conductive enclosure that houses the circuit board, and an electromagnetic shielding layer positioned between the circuit board and the enclosure. The enclosure has sockets for mounting the circuit board, and the electromagnetic shielding layer has compression areas that are pressed through the circuit board at points a predetermined distance from the sockets.

Description

Technical area

[0001] The present invention relates to an electronic control device and a method for producing an electronic control device. Background of the invention

[0002] In recent years, there has been an increasing demand for advanced driving assistance systems (ADAS) and automatic driving systems (hereinafter AD). A semiconductor component such as a central processing unit (CPU) mounted on an electronic control device for ADAS or AD has a high operating frequency, and the generation of electromagnetic wave interference is a problem. As an example of a shielding structure for reducing electromagnetic wave interference radiated to an external environment, a structure for electrically connecting a circuit board and a metal case for protecting the circuit board is known.Furthermore, PTL 1 discloses a shielding structure using an electromagnetic wave shielding plate comprising a conductive layer including a binder resin and a conductive filler, and a cushioning layer. Citation listPatent literature

[0003] PTL 1: JP 2020-057711 A Overview of the inventionTechnical problem

[0004] In an in-vehicle electronic control device including the electronic control devices for ADAS and AD, processing speed tends to increase due to the advancement of automated driving or the like. Therefore, the in-vehicle electronic control device in the vehicle urgently needs to improve the shielding performance against electromagnetic wave interference.

[0005] An object of the present invention is to provide an electronic control device capable of improving the shielding performance against electromagnetic wave interference. Solution to the problem

[0006] In order to solve the above problems, configurations described in the claims, for example, are chosen.

[0007] The present application provides several means for solving the problems described above, and one of the several means is an electronic control device including a circuit board on which an electronic component is mounted, a conductive housing that houses the circuit board, and an electromagnetic wave shielding layer disposed between the circuit board and the housing. The housing includes board sockets for mounting the circuit board, and the electromagnetic wave shielding layer includes compression portions that are pressed by the circuit board at locations spaced a predetermined distance from the board sockets. Advantageous effects of the invention

[0008] According to the present invention, the shielding performance against electromagnetic wave interference can be improved.

[0009] Problems, configurations and effects other than those described above will be clarified by the following description of embodiments. Brief description of the drawings [ Fig. 1] Fig. 1 is a perspective view of an electronic control device according to a first embodiment. [ Fig. 2] Fig. 2 is a plan view of the electronic control device according to the first embodiment. [ Fig. 3] Fig. 3 is an exploded perspective view of the electronic control device according to the first embodiment. [ Fig. 4] Fig. 4 is a schematic plan view of a circuit board according to the first embodiment. [ Fig. 5] Fig. 5 is a sectional view along the line VV of the Fig. 2 shown electronic control device. [ Fig. 6] Fig. 6 is an enlarged view of a section VI of the Fig. 5 shown electronic control device. [ Fig. 7] Fig. 7 is a flowchart for describing a method of manufacturing the electronic control device according to the first embodiment. [ Fig. 8] Fig. 8 is an enlarged sectional view of a main part of the electronic control device according to the first embodiment. [ Fig. 9] Fig. 9 is a sectional view of an electronic control device according to a second embodiment. [ Fig. 10] Fig. 10 is an enlarged sectional view of a main part of the electronic control device according to the second embodiment. [ Fig. 11] Fig. 11 is a sectional view of an electronic control device according to a third embodiment. [ Fig. 12] Fig. 12 is an enlarged sectional view of a main part of the electronic control device according to the third embodiment. [ Fig. 13] Fig. 13 is a sectional view of an electronic control device according to a fourth embodiment. [ Fig. 14] Fig. 14 is an enlarged sectional view of a main part of the electronic control device according to the fourth embodiment. [ Fig. 15] Fig. 15 is a sectional view of an electronic control device according to a fifth embodiment. [ Fig. 16] Fig. 16 is an enlarged sectional view of a main part of the electronic control device according to the fifth embodiment. [ Fig. 17] Fig. 17 is a sectional view of an electronic control device according to a sixth embodiment. [ Fig. 18] Fig. 18 is a sectional view of an electronic control device according to a seventh embodiment. [ Fig. 19] Fig. 19 is a sectional view of an electronic control device according to an eighth embodiment. [ Fig. 20] Fig. 20 is a plan view showing a main part of an electronic control device according to a ninth embodiment. [ Fig. 21] Fig. 21 is a plan view showing a main part of an electronic control device according to a tenth embodiment. Description of the embodiments

[0010] Embodiments of the present invention will be described in detail below with reference to the drawings. In this specification and the drawings, elements having substantially the same function or configuration are denoted by the same reference numerals, and redundant descriptions are omitted. <Erste Ausführungsform>

[0011] Fig. 1 is a perspective view of an electronic control device according to a first embodiment. Fig. 2 is a plan view of the electronic control device according to the first embodiment. Fig. 3 is an exploded perspective view of the electronic control device according to the first embodiment. Fig. 1 and Fig. 3 a connector to be described later is omitted.

[0012] As in the Fig. 1 to 3, an electronic control device 10 includes a circuit board 11 ( Fig. 3), on which electronic components to be described later are mounted, and a conductive housing 12 that houses the circuit board 11. The electronic control device 10 is mounted, for example, on a vehicle such as an automobile for ADAS or AD.

[0013] The housing 12 is formed in a so-called flat, substantially rectangular parallelepiped shape with a reduced height (thickness). The housing 12 has an opening 13 for connecting a connector. The housing 12 includes a metallic housing base 15 and a metallic housing cover 16. The housing base 15 and the housing cover 16 are secured together by a plurality of screws 31.

[0014] More precisely, as in Fig. 3, a plurality of cover pedestals 30 are formed on the case base 15. The cover pedestal 30 is formed integrally with the case base 15. Screw holes 34 are provided in the cover pedestals 30. On the other hand, a plurality of cover fixing holes 35 are formed in the case cover 16. The cover fixing holes 35 are through holes for fixing the case cover 16 to the case base 15. The above-described plurality of screws 31 are engaged with the screw holes 34 of the cover pedestals 30 through the corresponding cover fixing holes 35. The case cover 16 is fixed to the case base 15 by tightening the screws 31. The case cover 16 is thus fixed to the case base 15 with the screws 31, and thus the case base 15 and the case cover 16 are electrically and mechanically connected.

[0015] The housing base 15 and the housing cover 16 may be made of the same metal material or may be made of different metal materials. In a case where the housing base 15 and the housing cover 16 are made of different metal materials, the housing base 15 is made of aluminum, for example, and the housing cover 16 is made of iron, for example, to which an anti-rust treatment is applied.

[0016] In this specification, for convenience of description, a side where the housing base 15 is disposed is referred to as the bottom side, and a side where the housing cover 16 is disposed is referred to as the top side. In a case where the electronic control device 10 is mounted on the vehicle, it does not matter in which orientation the electronic control device 10 is mounted. Generally, it is preferable to mount the electronic control device 10 on the vehicle with the housing base 15 facing upward and the housing cover 16 facing downward.

[0017] The circuit board 11 is enclosed at the top and bottom by the housing base 15 and the housing cover 16. The circuit board 11 is, for example, a printed wiring board that uses glass epoxy as the base material. The circuit board 11 is formed in a substantially rectangular shape.

[0018] Fig. 4 is a schematic plan view of the circuit board according to the first embodiment.

[0019] As in Fig. As shown in Figure 4, three electronic components 17, 18, and 19, as well as two connectors 21 and 22, are mounted on the circuit board 11. The circuit board 11 includes a circuit area 25 and a ground structure 26. The electronic components 17, 18, and 19 are mounted in the circuit area 25 of the circuit board 11. The connectors 21 and 22 are mounted on an end portion of the circuit board 11.

[0020] For example, electronic components 17, 18, and 19 are LSI elements. LSI is an abbreviation for Large Scale Integration. Each of the LSI elements 17, 18, and 19 is a heat source and also a noise source. Electronic components other than the LSI elements are also mounted in the circuit area 25 of the circuit board 11, but other electronic components, circuit wiring, and the like other than the LSI elements are in Fig. 4 is omitted. The connectors 21 and 22 are mounted on the end portion of the circuit board 11. A cable-side connector (not shown) can be inserted through the opening 13 ( Fig. 1) of the housing 12 with the connectors 21 and 22.

[0021] The ground structure 26 is formed around the circuit region 25. The ground structure 26 is a structure made of, for example, a copper foil. The ground structure 26 is formed in an annular shape so that it surrounds four sides of the circuit region 25. The ground structure 26 may be formed so that it surrounds three sides of the circuit region 25.

[0022] As in Fig. As shown in Figure 3, the circuit board 11 is secured to the housing base 15 by a plurality of screws 32. The screws 32 are provided as an example of a fastening. A fastening structure of the circuit board 11 using the screws 32 will be described in detail below.

[0023] First, a plurality of circuit board sockets 36 are formed on the housing base 15. The circuit board sockets 36 are formed integrally with the housing base 15. Screw holes 37 are provided in an upper surface of the circuit board sockets 36. On the other hand, a plurality of circuit board fixing holes 33 are provided in the circuit board 11. The plurality of circuit board fixing holes 33 are through holes for fixing the circuit board 11 to the housing base 15. Each circuit board fixing hole 33 is formed on the ground pattern 26. In a portion where the circuit board fixing hole 33 is formed, a part of the ground pattern 26 is formed in a circular shape slightly larger than an inner diameter of the circuit board fixing hole 33, and the circuit board fixing hole 33 is formed in this circular portion.

[0024] The above-described plurality of screws 32 engage with the screw holes 37 of the circuit board sockets 36 through the corresponding board mounting holes 33. The circuit board 11 is fixed to the housing base 15 by tightening the screws 32. In addition, projections 38 ( Fig. 3) for positioning the circuit board. A plurality of protrusions 38 are formed at appropriate locations on the housing base 15. The circuit board 11 is screwed to the housing base 15 in a state in which it is positioned by the plurality of protrusions 38.

[0025] Raised portions 27, 28, and 29 for heat dissipation are integrally formed on the case base 15. The raised portion 27 is connected to the electronic component 17 via heat-dissipating grease. Furthermore, the raised portion 28 is connected to the electronic component 18 via heat-dissipating grease, and the raised portion 29 is connected to the electronic component 19 via heat-dissipating grease. As a result, the heat generated by the electronic components 17, 18, and 19 is transferred to the case base 15 via the heat-dissipating grease and is dissipated from an outer surface of the case base 15.

[0026] Fig. 5 is a sectional view along the line VV of the Fig. 2 shown electronic control device. Fig. 6 is an enlarged view of a section VI of the Fig. 5 shown electronic control device. Note that the Fig. 5 and Fig. 6 shows a state before the screws 32 are tightened.

[0027] As in the Fig. 5 and Fig. 6, a layer 41 for shielding electromagnetic waves is inserted between the circuit board 11 and the housing base 15. As shown in Fig. 3, the electromagnetic wave shielding layer 41 is formed by supplying an electromagnetic wave shielding material 40 to an installation base 39 formed in the housing base 15. The electromagnetic wave shielding material 40 is a conductive shielding material. The installation base 39 is formed on the housing base 15 to install the electromagnetic wave shielding layer 41. The installation base 39 is arranged along a shape of the ground structure 26 of the housing 15. Fig. 4. Therefore, the electromagnetic wave shielding layer 41 is formed by the electromagnetic wave shielding material 40 on the installation base 39, and the electromagnetic wave shielding layer 41 is disposed between the circuit board 11 and the housing base 15. As a result, the ground pattern 26 of the circuit board 11 and the housing base 15 can be electrically connected.

[0028] The electromagnetic wave shielding material 40 is, for example, a liquid or paste adhesive that is installed as a cured-in-place gasket (CIPG). The electromagnetic wave shielding material 40 is a shielding material that contains a conductive filler. For example, a metal filler, more preferably a plated metal filler, can be used as the conductive filler. A base material of the electromagnetic wave shielding material 40 is, for example, silicone, urethane, or the like.

[0029] In the following, a method of manufacturing the electronic control device according to the first embodiment will be described with reference to Fig. 7 described.

[0030] As in Fig. 7, the method for manufacturing the electronic control device includes the application step S1 of applying the electromagnetic wave shielding material 40 to the installation base 39 of the housing base 15, the board fixing step S2 of fixing the circuit board 11 to the board sockets 36 of the housing base 15, and the cover fixing step S3 of fixing the housing cover 16 to the cover socket 30 of the housing base 15. (application step)

[0031] In the application step S1, the electromagnetic wave shielding material 40 is applied to the installation base 39 of the housing base 15, for example, by an application nozzle (not shown). At this time, the electromagnetic wave shielding material 40 is applied as shown in FIGS. Fig. 5 and Fig. 6, the electromagnetic wave shielding material 40 is deposited so that portions 40a of the electromagnetic wave shielding material 40 are higher than the board sockets 36. A height of the installation base 39 and a height of the electromagnetic wave shielding material 40 are defined with an upper surface of the installation base 39 as a reference (0). The electromagnetic wave shielding material 40 is deposited near the board sockets 36 so as to be lower than the board sockets 36. In addition, the electromagnetic wave shielding material 40 is deposited so as to be higher than the board sockets 36 except in the vicinity of the board socket 36 (in other words, a position away from the board socket 36). In addition, the electromagnetic wave shielding material 40 is deposited thinly near the board sockets 36 and is deposited thickly at a position away from the board sockets 36.Thus, the electromagnetic wave shielding material 40 after application has portions (hereinafter also referred to as “first portions”) 40a with a large application thickness and higher than the board bases 36, and portions (hereinafter also referred to as “second portions”) 40b with a small application thickness and lower than the board bases 36. As adjustment of the application thickness of the electromagnetic wave shielding material 40, for example, a method of changing an application pressure (application amount per unit time) by the application nozzle, a method of changing the number of applications by the application nozzle, and the like can be considered.

[0032] After the electromagnetic wave shielding material 40 is applied to the installation base 39 of the case base 15 in this way, the electromagnetic wave shielding material 40 is cured to a predetermined hardness before performing the board-mounting step S2 to be described later. The predetermined hardness is such that, in a case where the first portions 40a of the electromagnetic wave shielding material 40 are pressed by the circuit board 11 in the board-mounting step S2 to be described later, the first portions 40a can be compressed and deformed by receiving a pressing force from the circuit board 11. The electromagnetic wave shielding layer 41 is a shielding layer formed by the electromagnetic wave shielding material 40 applied to the installation base 39. (Board mounting step)

[0033] In the board mounting step S2, the circuit board 11 is mounted to the board sockets 36 of the housing base 15 using the screws 32. At this time, the circuit board 11 is fixed by the screws 32 such that the first portions 40a of the electromagnetic wave shielding material 40 are pressed through the circuit board 11. Details will be described below.

[0034] First, the first portions 40a of the electromagnetic wave shielding material 40 are higher than the board sockets 36. As a result, the ground structure 26 of the circuit board 11 comes into contact with the first portions 40a of the electromagnetic wave shielding material 40. Furthermore, in a state where the screws 32 are screwed through the board mounting holes 33 of the circuit board 11 into the screw holes 37 of the board socket 36, and the circuit board 11 is fixed to the housing base 15 by tightening the screws 32 in this state, as shown in Fig. 8, the first portions 40a of the electromagnetic wave shielding material 40 are pressed through the circuit board 11, and these pressed portions become compression regions 41a. Furthermore, the ground structure 26 of the circuit board 11 is electrically connected to the housing base 15 through the electromagnetic wave shielding layer 41.

[0035] On the other hand, the second portions 40b of the electromagnetic wave shielding material 40 are lower than the board sockets 36. Therefore, even in a state where the circuit board 11 is fixed to the case base 15 by tightening the screws 32, the second portions 40b of the electromagnetic wave shielding material 40 are not pressed by the circuit board 11, and these non-pressed portions become non-compression regions 41b. The non-compression regions 41b are formed closer to the board sockets 36 than the compression regions 41a, and the compression regions 41a are formed at positions farther from the board sockets 36 than the non-compression regions 41b. The compression regions 41a are formed due to the presence of the non-compression regions 41b at locations spaced apart by a predetermined distance La ( Fig. 8) from the circuit board sockets 36. The predetermined distance La is equal to or less than half a wavelength of an interference frequency to be shielded. However, if the predetermined distance La is too short, when the screws 32 are tightened, a deformation amount of the circuit board 11 near the circuit board sockets 36 becomes large. Therefore, the predetermined distance La is preferably set so that the deformation amount of the circuit board 11 near the circuit board sockets 36 does not become excessively large when the screws 32 are tightened. (Step to attach the cover)

[0036] In the cover fastening step S3, the housing cover 16 is fastened to the cover sockets 30 of the housing base 15 using the screws 31. As a result, the circuit board 11 is housed in the housing 12.

[0037] In the electronic control device 10 and its manufacturing method according to the first embodiment described above, the first portions 40a of the electromagnetic wave shielding material 40 deposited on the installation base 39 of the housing base 15 higher than the board sockets 36 form the compression regions 41a pressed through the circuit board 11. In the compression regions 41a, a density of the conductive filler contained in the electromagnetic wave shielding material 40 is higher than that in the non-compression regions 41b. Therefore, an impedance of the electromagnetic wave shielding layer 41 is lower compared to a case where the electromagnetic wave shielding layer 41 does not have the compression regions 41a.Therefore, the electromagnetic wave interference shielding performance of the electromagnetic wave shielding layer 41 can be improved.

[0038] Furthermore, in the first embodiment, the circuit board 11 presses the electromagnetic wave shielding layer 41 at a position spaced apart by the predetermined distance La from the board sockets 36. This can suppress the deformation of the circuit board 11 due to the tightening of the screws 32.

[0039] Furthermore, in the first embodiment, the distance La from the board sockets 36 to the compression regions 41a is equal to or less than half the wavelength of the interference frequency to be shielded. Thus, even in a case where the non-compression regions 41b are arranged between the board sockets 36 and the compression regions 41a, the electromagnetic wave interference to be shielded can be effectively blocked by the electromagnetic wave shielding layer 41.

[0040] Furthermore, in the first embodiment, the ground pattern 26 of the circuit board 11 and the housing base 15 are electrically connected through the electromagnetic wave shielding layer 41. As a result, a potential of the ground pattern 26 is maintained at the same level as a potential of the housing 12. Therefore, the potential of the ground pattern 26 in the circuit board 11 can be stabilized.

[0041] Furthermore, in the first embodiment, an application height is adjusted when the electromagnetic wave shielding material 40 is applied to the installation base 39 of the case base 15, and thus the second portions 40b of the electromagnetic wave shielding material 40 are the non-compression regions 41b that are not pressed by the circuit board 11. The non-compression regions 41b are formed near the board sockets 36. As a result, the stress generated in the electromagnetic wave shielding layer 41 near the board sockets 36 by tightening the screws 32 can be reduced. Furthermore, in the vicinity of the board sockets 36, it is possible to reduce the deformation of the circuit board 11 due to tightening the screws 32 and the deformation of soldering portions of the electronic components due to the deformation of the circuit board 11.

[0042] Furthermore, in the first embodiment, the electromagnetic wave shielding material 40 is applied to the installation base 39 of the housing base 15 to form the electromagnetic wave shielding layer 41. As a result, the cost required to form the electromagnetic wave shielding layer can be reduced compared to a case where the electromagnetic wave shielding layer is formed by bonding components such as an electromagnetic wave shielding sheet and an EMI gasket.

[0043] Note that in the first embodiment, the electromagnetic wave shielding material 40 is applied such that the second portions 40b near the board sockets 36 are lower than the board sockets 36, but the present invention is not limited to this. The electromagnetic wave shielding material 40 may be applied such that the second portions 40b near the board sockets 36 have the same height as the board sockets 36. <Zweite Ausführungsform>

[0044] Fig. 9 is a sectional view of an electronic control device according to a second embodiment. Fig. 10 is an enlarged sectional view of a main part of the electronic control device according to the second embodiment.

[0045] As in the Fig. 9 and Fig. 10, an electronic control device 10A according to the second embodiment differs from the first embodiment ( Fig. 5) in that the compression regions 41a of the electromagnetic wave shielding layer 41 contain regions H with high compression and regions L with low compression.

[0046] The high compression region H is a region pressed by the circuit board 11 with a higher compression ratio than the low compression region L when the circuit board 11 is attached to the case base 15 with the screws 32. The low compression region L is a region pressed by the circuit board 11 with a lower compression ratio than the high compression region H, or a region not pressed by the circuit board 11, similar to the no compression regions 41b.

[0047] The high compression region H is a region where the electromagnetic wave shielding material 40 is deposited on the installation base 39 of the case base 15 higher than the board socket 36 in the above-described depositing step S1. On the other hand, the low compression region L is a region where the electromagnetic wave shielding material 40 is deposited lower than the high compression region H. Therefore, a deposit thickness of the electromagnetic wave shielding material 40 in the low compression region L is thinner than a deposit thickness of the electromagnetic wave shielding material 40 in the high compression region H.Accordingly, at a stage before the circuit board 11 is mounted, a recess 49 (Fig. Fig. 9). Note that the deposition thickness of the electromagnetic wave shielding material 40 in the low compression region L may be the same as or different from the deposition thickness of the electromagnetic wave shielding material 40 in the non-compression region 41b.

[0048] As described above, by adopting the configuration in which the compression region 41a of the electromagnetic wave shielding layer 41 includes the high compression region H and the low compression region L, the amount of use of the electromagnetic wave shielding material 40 required to form the electromagnetic wave shielding layer 41 can be reduced. As a result, the cost of the electronic control device 10A can be reduced. <Dritte Ausführungsform>

[0049] Fig. 11 is a sectional view of an electronic control device according to a third embodiment. Fig. 12 is an enlarged sectional view of a main part of the electronic control device according to the third embodiment.

[0050] As in the Fig. 11 and Fig. 12, an electronic control device 10B according to the third embodiment differs from the case of the first embodiment ( Fig. 5) in that the electromagnetic wave shielding layer 41 is arranged at a location other than near the board base 36.

[0051] The electromagnetic wave shielding layer 41 does not have the area 41b without compression ( Fig. 5) but has only the compression region 41a. To form such an electromagnetic wave shielding layer 41, when the electromagnetic wave shielding material 40 is applied to the installation base 39 in the above-described application step S1, the electromagnetic wave shielding material 40 may be applied to the position except near the board base 36. That is, the electromagnetic wave shielding material 40 is not applied near the board base 36, and the electromagnetic wave shielding material 40 is applied at a position remote from the board base 36. As a result, there is a region 50 in which the electromagnetic wave shielding layer 41 is not formed near the board base 36.In this area 50, the upper surface of the installation base 39 is not covered with the electromagnetic wave shielding material 40 (electromagnetic wave shielding layer 41).

[0052] As described above, in the third embodiment, an application area of ​​the electromagnetic wave shielding material 40 is limited to the position away from the board base 36, and thus the electromagnetic wave shielding layer 41 is disposed at a position other than near the board base 36. As a result, the usage amount of the electromagnetic wave shielding material 40 required to form the electromagnetic wave shielding layer 41 can be reduced, and the cost of the electronic control device 10B can be reduced. <Vierte Ausführungsform>

[0053] Fig. 13 is a sectional view of an electronic control device according to a fourth embodiment. Fig. 14 is an enlarged sectional view of a main part of the electronic control device according to the fourth embodiment.

[0054] As in the Fig. 13 and Fig. 14, an electronic control device 10C according to the fourth embodiment differs from the third embodiment ( Fig. 11 and Fig. 12) in that a compression region 41a of an electromagnetic wave shielding layer 41 includes a high compression region H and a low compression region L. As a result, the amount of the electromagnetic wave shielding material 40 used can be further reduced compared to the third embodiment. <Fünfte Ausführungsform>

[0055] Fig. 15 is a sectional view of an electronic control device according to a fifth embodiment. Fig. 16 is an enlarged sectional view of a main part of an electronic control device according to a fifth embodiment.

[0056] As in the Fig. 15 and Fig. 16, the electronic control device 10D according to the fifth embodiment differs from the case of the first embodiment ( Fig. 5 to 8) in that a height difference is provided in the installation base 39 of the housing base 15. Specifically, the installation base 39 of the housing base 15 includes first installation sockets 39a located far from the board sockets 36 and second installation sockets 39b located closer to the board sockets 36 than the first installation sockets 39a. Moreover, a height of the first installation socket 39a is higher than a height of the second installation socket 39b.

[0057] On the other hand, the electromagnetic wave shielding layer 41 has a compression region 41a installed on the first installation base 39a and a non-compression region 41b installed on the second installation base 39b. The compression region 41a and the non-compression region 41b are formed by applying the electromagnetic wave shielding material 40 to each of the first installation base 39a and the second installation base 39b with a uniform thickness in the above-described application step S1, and fixing the circuit board 11 to the board bases 36 using the screws 32 in the subsequent board fixing step S2.

[0058] The height of the first installation base 39a may be a height that allows the electromagnetic wave shielding material 40 applied to the first installation base 39a to be pressed against the circuit board 11 to form the compression region 41a when the circuit board 11 is attached to the board bases 36 with the screws 32.

[0059] As described above, the height difference is provided on the installation base 39 of the housing base 15, and thus the usage amount of the electromagnetic wave shielding material 40 required to form the electromagnetic wave shielding layer 41 can be reduced. Furthermore, in the deposition step S1, the deposition thickness of the electromagnetic wave shielding material 40 can be made uniform. <Sechste Ausführungsform>

[0060] Fig. 17 is a sectional view of an electronic control device according to a sixth embodiment.

[0061] As in Fig. 17, an electronic control device 10E according to the sixth embodiment differs from the case of the fifth embodiment ( Fig. 15) by forming an inclined portion 39c at a boundary between the first installation base 39a and the second installation base 39b. An inclination angle of the inclined portion 39c is an angle defined based on an upper surface of the second installation base 39b and is set in a range of, for example, 15 degrees or more and 75 degrees or less.

[0062] As described above, the inclined portion 39c is formed at the boundary between the first installation base 39a and the second installation base 39b, and thus it is possible to further reduce the stress generated in the electromagnetic wave shielding layer 41 when the circuit board 11 is fixed to the board sockets 36 of the case base 15 by using the screws 32 in the above-described board fixing step S2. <Siebte Ausführungsform>

[0063] Fig. 18 is a sectional view of an electronic control device according to a seventh embodiment.

[0064] As in Fig. 18, an electronic control device 10F according to the seventh embodiment differs from the case of the fifth embodiment ( Fig. 15) by providing a plurality of protrusions 39d on an installation surface (upper surface) of the first installation base 39a on which the electromagnetic wave shielding layer 41 is installed. In the present embodiment, for example, two protrusions 39d are formed on the installation surface of the first installation base 39a. Each protrusion 39d is formed in a convex shape on the installation surface of the first installation base 39a. Moreover, a distance P1 between the protrusions 39d adjacent to each other on the installation surface of the first installation base 39a is set to be equal to or less than half the wavelength of the interference frequency to be shielded.In addition, a distance P2 between the screw 32 for fixing the circuit board 11 and the projection 39d closest to the screw 32 is also set to be equal to or less than half the wavelength of the interference frequency to be shielded.

[0065] In a case where the plurality of protrusions 39d are formed on the installation surfaces of the first installation sockets 39a, the high compression region H is formed by the presence of the protrusion 39d in the region of the compression region 41a by applying the electromagnetic wave shielding material 40 to the first installation socket 39a and the second installation socket 39b with a uniform thickness in the above-described application step S1 and the subsequent board fixing step S2, and fixing the circuit board 11 to the board sockets 36 with the screws 32. The high compression region H is a compression region formed when the electromagnetic wave shielding material 40, which is applied so as to cover the protrusions 39d, is pressed against the circuit board 11.

[0066] In the seventh embodiment, the configuration in which the plurality of protrusions 39d are provided on the installation surface of the first installation base 39a and the high compression region H is formed by the presence of each protrusion 39d within the range of the compression region 41a is adopted, and thus, it is possible to further improve the electromagnetic wave interference shielding performance of the electromagnetic wave shielding layer 41. Moreover, in the seventh embodiment, since the distance P1 between the adjacent protrusions 39d and the distance P2 between the screw 32 and the protrusion 39d are set to be equal to or less than half the wavelength of the interference frequency to be shielded, the electromagnetic wave interference shielding performance can be further improved. <Achte Ausführungsform>

[0067] Fig. 19 is a sectional view of an electronic control device according to an eighth embodiment.

[0068] As in Fig. 19, an electronic control device 10G according to the eighth embodiment differs from the case of the fifth embodiment ( Fig. 15) in that the compression region 41a of the electromagnetic wave shielding layer 41 installed on the first installation base 39a includes a first compression region h1 and a second compression region h2 having different compression ratios from each other. The first compression region h1 is a region with a compression ratio higher than that of the second compression region h2.

[0069] The first compression area h1 and the second compression area h2 are formed by the following method.

[0070] First, in the above-described application step S1, when the electromagnetic wave shielding material 40 is applied to the first installation base 39a, the application thickness is increased at a position corresponding to the first compression region h1, and the application thickness is reduced at a position corresponding to the second compression region h2. As a result, a recess is formed on the surface (upper surface) of the electromagnetic wave shielding material 40 applied to the first installation base 39a.

[0071] Next, in the above-described board fixing step S2, in a case where the circuit board 11 is attached to the board sockets 36 with the screws 32, the electromagnetic wave shielding material 40 covering the first installation sockets 39a is pressed through the circuit board 11. At this time, a portion where the application thickness of the electromagnetic wave shielding material 40 is thick becomes the first compression region h1, and a portion where the application thickness of the electromagnetic wave shielding material 40 is thin becomes the second compression region h2.

[0072] As described above, the first compression region h1 and the second compression region h2 are provided in the electromagnetic wave shielding layer 41 installed on the first installation base 39a, and thus the usage amount of the electromagnetic wave shielding material 40 required to form the electromagnetic wave shielding layer 41 can be reduced. <Neunte Ausführungsform>

[0073] Fig. Fig. 20 is a plan view showing a main part of an electronic control device according to a ninth embodiment. Note that Fig. 20 is a diagram obtained by cutting out a section K in Fig. 2 was received. In Fig. However, the circuit board and the housing cover are not shown in Figure 20.

[0074] As in Fig. 20, an electronic control device 10H according to the ninth embodiment is characterized in that an installation width w1 of the electromagnetic wave shielding layer 41 in the vicinity (immediate proximity) of the board sockets 36 is smaller than in the case of the fifth embodiment ( Fig. 15) is wider than an installation width w2 of the electromagnetic wave shielding layer 41 in a portion except near the board sockets 36. More specifically, on the first installation socket 39a, which is distant from the board sockets 36, the compression region 41a of the electromagnetic wave shielding layer 41 is formed with a uniform installation width w2. On the other hand, on the second installation socket 39b, near the board sockets 36, the non-compression region 41b of the electromagnetic wave shielding layer 41 is formed with different installation widths w1 and w2. Specifically, in the second installation socket 39b, an installation width of the electromagnetic wave shielding layer 41 in the immediate vicinity of the board socket 36 is w1, and an installation width of the electromagnetic wave shielding layer 41 far from the board socket 36 is w2.

[0075] The electronic control device 10H according to the ninth embodiment is obtained by applying the electromagnetic wave shielding material 40 with a first application width corresponding to the installation width w1 in the vicinity (immediate vicinity) of the board base 36, and by applying the electromagnetic wave shielding material 40 with a second application width corresponding to the installation width w2 in a portion except in the vicinity of the board base 36 in the above-described application step S1.

[0076] As described above, the installation width w1 of the electromagnetic wave shielding layer 41 near the board socket 36 is set to be wider than the installation width w2 of the electromagnetic wave shielding layer 41 in the portion except near the board socket 36, and therefore, when the circuit board 11 is attached to the board sockets 36 of the case base 15 by using the screws 32 in the above-described board attachment step S2, it is possible to ensure a wide contact area between the circuit board 11 and the electromagnetic wave shielding layer 41 near the board socket 36. Therefore, the stress generated in the electromagnetic wave shielding layer 41 can be further reduced. <Zehnte Ausführungsform>

[0077] Fig. Fig. 21 is a plan view showing a main part of an electronic control device according to a tenth embodiment. Note that Fig. 21 is a diagram obtained by cutting out a section K in Fig. 2 was received. In Fig. However, the circuit board and the housing cover are not shown in Figure 21.

[0078] As in Fig. 21, an electronic control device 10J according to the tenth embodiment is characterized in that, compared with the case of the fifth embodiment ( Fig.15), an installation width w3 of the electromagnetic wave shielding layer 41 at a boundary portion between the first installation base 39a and the second installation base 39b is wider than an installation width w4 of the electromagnetic wave shielding layer 41 at a portion other than the boundary portion. Specifically, the compression region 41a of the electromagnetic wave shielding layer 41 on the first installation base 39a is formed far from the board base 36 so that both ends are wide. On the other hand, in the second installation base 39b, near the board base 36, the non-compression region 41b of the electromagnetic wave shielding layer 41 is formed so that an end portion near the first installation base 39a becomes wide.

[0079] The electronic control device 10J according to the tenth embodiment is obtained by applying the electromagnetic wave shielding material 40 such that, in the above-described applying step S1, an application width of the electromagnetic wave shielding material 40 at the boundary portion between the first installation base 39a and the second installation base 39b is wider than an application width of the electromagnetic wave shielding material 40 at the portion other than the boundary portion.

[0080] As described above, the installation width w3 of the electromagnetic wave shielding layer 41 at the boundary portion between the first installation base 39a and the second installation base 39b is set to be wider than the installation width w4 of the electromagnetic wave shielding layer 41 at the portion other than the boundary portion, and thus, it is possible to ensure a wide contact area between the circuit board 11 and the electromagnetic wave shielding layer 41 at the boundary portion when the circuit board 11 is attached to the board bases 36 of the case base 15 by using the screws 32 in the above-described board attachment step S2. Therefore, the stress generated in the electromagnetic wave shielding layer 41 can be further reduced. <Modifikationen und dergleichen>

[0081] Note that the present invention is not limited to the above-described embodiments and includes various modifications. For example, in the above-described embodiments, the contents of the present invention are described in detail for easy understanding, but the present invention is not necessarily limited to the embodiment including all the configurations described in the above-described embodiments. Moreover, part of the configuration of one embodiment may be replaced with the configuration of another embodiment. Moreover, it is also possible to add the configuration of another embodiment to the configuration of a certain embodiment. Furthermore, part of the configuration of each embodiment may be deleted, another configuration may be added, or another configuration may be replaced.

[0082] For example, in the above-described embodiments, the electromagnetic wave shielding layer 41 is disposed between the housing base 15 and the circuit board 11, but the present invention is not limited thereto. The electromagnetic wave shielding layer 41 may also be disposed between the housing cover 16 and the circuit board 11.

[0083] Furthermore, the electronic component may be mounted on only one surface of the circuit board 11 or may be mounted on both surfaces of the circuit board 11. List of reference symbols 10, 10A, 10B, 10C, 10D, 10E, 10F, 10G, 10J... electronic control device 11 Circuit board 12 housings 15 Housing base 16 Housing cover 17, 18, 19 electronic component 32 Screw (fastening) 39 Installation base 39a first installation base 39b second installation base 39c inclined section 39d lead 40 Material for shielding electromagnetic waves 41 Layer for shielding electromagnetic waves 41a Compression area 41b Area without compression 49 recess H High compression range h1 first compression area h2 second compression area L Low compression range w1, w2, w3, w4 installation width QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP 2020-057711 A

[0003]

Claims

[1] Electronic control device comprising: a circuit board on which an electronic component is mounted; a conductive housing that houses the circuit board; and a layer for shielding electromagnetic waves arranged between the circuit board and the housing, wherein the housing includes board sockets for mounting the circuit board, and the electromagnetic wave shielding layer has compression regions that are pressed by the circuit board at locations spaced a predetermined distance from the board sockets. [2] Electronic control device according to claim 1, wherein the predetermined distance is equal to or less than half a wavelength of an interference frequency to be shielded. [3] The electronic control device according to claim 1, wherein the electromagnetic wave shielding layer has non-compression regions near the board sockets. [4] The electronic control device according to claim 1, wherein the compression regions of the electromagnetic wave shielding layer include high compression regions and low compression regions. [5] The electronic control device according to claim 1, wherein the electromagnetic wave shielding layer is disposed at a location other than near the board sockets. [6] Electronic control device according to claim 1, wherein the housing contains installation bases on which the electromagnetic wave shielding layer is installed, and the installation sockets include first installation sockets that are far from the board sockets and second installation sockets that are closer to the board sockets than the first installation sockets, and wherein a height of the first installation socket is higher than a height of the second installation socket. [7] The electronic control device according to claim 6, wherein an inclined portion is formed at a boundary between the first installation base and the second installation base. [8] The electronic control device according to claim 6, wherein the housing includes a plurality of projections forming high compression regions within a region of the compression region, the projections being portions each formed in a convex shape on an installation surface of the first installation base. [9] The electronic control device according to claim 8, wherein a distance between adjacent projections of the plurality of projections is equal to or less than half a wavelength of an interference frequency to be shielded. [10] Electronic control device according to claim 8, wherein the circuit board is attached to the board sockets of the housing by a fastening, and a distance between a projection among the plurality of projections closest to the attachment and the attachment is equal to or less than half a wavelength of an interference frequency to be shielded. [11] The electronic control device according to claim 6, wherein the electromagnetic wave shielding layer installed on the first installation bases includes first compression regions and second compression regions having a lower compression degree than the first compression regions. [12] The electronic control device according to claim 1, wherein an installation width of the electromagnetic wave shielding layer in the vicinity of the board base is wider than an installation width of the electromagnetic wave shielding layer in a portion other than the vicinity of the board base. [13] The electronic control device according to claim 6, wherein an installation width of the electromagnetic wave shielding layer in a boundary portion between the first installation base and the second installation base is wider than an installation width of the electromagnetic wave shielding layer in a portion other than the boundary portion. [14] A method of manufacturing an electronic control device including a circuit board on which an electronic component is mounted, a conductive housing for accommodating the circuit board, and an electromagnetic wave shielding layer disposed between the circuit board and the housing, the method comprising: an application step of applying an electromagnetic wave shielding material to installation bases of the housing so that at least a part of the electromagnetic wave shielding material is higher than the board bases formed in the housing for fixing the circuit board; and a board fixing step of fixing the circuit board to the board sockets of the housing such that at least a part of the electromagnetic wave shielding material applied to the installation sockets of the housing is pressed through the circuit board. [15] A method for manufacturing an electronic control device according to claim 14, wherein the electromagnetic wave shielding material is applied in the application step such that the electromagnetic wave shielding material in the vicinity of the board base has the same height as the board base or is lower than the board base. [16] A method for manufacturing an electronic control device according to claim 14, wherein the electromagnetic wave shielding material is applied in the application step so as to form a recess higher than the board base on a surface of the applied electromagnetic wave shielding material. [17] A method of manufacturing an electronic control device according to claim 14, wherein the electromagnetic wave shielding material is applied to a position other than the vicinity of the board base in the applying step. [18] A method for manufacturing an electronic control device according to claim 14, wherein, in the applying step, the electromagnetic wave shielding material is applied in the vicinity of the board base with a first application width, and the electromagnetic wave shielding material is applied in a portion other than the vicinity of the board base with a second application width narrower than the first application width. [19] A method for manufacturing an electronic control device according to claim 14, wherein the installation sockets of the housing include first installation sockets that are remote from the board sockets and second installation sockets that are closer to the board sockets than the first installation sockets, and the electromagnetic wave shielding material is applied in the application step such that an application width of the electromagnetic wave shielding material at a boundary portion between the first installation base and the second installation base is wider than an application width of the electromagnetic wave shielding material at a portion other than the boundary portion.

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