Connection machine

Abstract

A joining machine comprises a working head including a component assembly tool configured to receive a component and mount the component onto a workpiece by raising and lowering it along a lifting and lowering axis, the working head being configured to be driven in a horizontal direction by a horizontal drive mechanism, and a laser light irradiation section provided in the working head or the horizontal drive mechanism and configured to heat a joining material, generating a predetermined joining force, by applying laser light to at least one of the contact surfaces of the component and the workpiece that are in contact with each other and are heated, to any of the joining material, the component and the workpiece from a direction inclined with respect to the lifting and lowering axis.

Description

Technical area

[0001] The present description concerns a joining machine that joins a component to a workpiece. State of the art

[0002] A technique for mass-producing a board product with an electronic circuit by connecting a component serving as a circuit element to a board on which a circuit pattern is formed is widely used. In a board production line used for this type of production application, a line configuration is adopted that includes a solder printer that prints solder as a bonding material onto a board, a component mounter that mounts a component onto the board, and a reflow oven that heats the solder to ensure a predetermined bonding force. In addition, there is a line configuration in which the solder coats an electrode side of the component instead of being printed onto the board, or a line configuration in which a conductive paste is used instead of the solder.Furthermore, if the contact surface to be joined is other than a conductive part, a resin material or an adhesive is used as the joining material, and in many cases heating is required to ensure the specified joining force. Technical examples relating to such joining of the component are disclosed in patent literature 1 to 5.

[0003] Patent document 1 discloses a component assembler that heats a connection end of an electronic component picked up by a suction nozzle with infrared laser light, lowers the suction nozzle toward a previously solder-coated mounting plate, and fixes the solder while bringing the electronic component into contact with the plate. Patent document 2 discloses a laser soldering device in which transport means for moving a component to a soldering position and laser heating means for preheating the component and for the main heating of the solder melt are integrally formed. The laser light emitted by the laser heating means reaches the electronic component via an optical fiber and a lens in the transport means. Patent document 3 discloses a component assembler that indirectly heats a component by heating a suction nozzle with laser light applied via a semi-mirrored mirror.

[0004] Patent document 4 discloses an automatic assembly device with a transport-placement device that transports an electronic component and places the electronic component on a printed circuit board, and a pressing and heating device that performs soldering while the electronic component is being pressed down after the transport-placement device has been separated. Patent document 5 discloses a component assembler with a YAG laser device provided in a belt feeder that heats a component received in a pocket of the belt feeder, and a component arrangement device for placing the heated component on a board. Patent literature Patent Literature 1: JP-A-2000-13098 Patent literature 2: JP-A-S60-162574 Patent Literature 3: JP-A-2000-59098 Patent Literature 4: JP-A-S61-224395 Patent Literature 5: JP-A-2014-22383 Summary of the invention: Technical problem

[0005] The technical examples of Patent Literatures 1 to 5 have the following problems. That is, Patent Literature 1 does not disclose a specific configuration in which heating is performed using infrared laser light. Moreover, in Patent Literatures 2, 3, and 5, there is a concern that the heating efficiency decreases due to attenuation of the laser light, loss of heat caused by heating a part other than the required area, a time delay from heating to bonding, and the like. Furthermore, in Patent Literatures 2 to 4, a heating device configuration tends to be complicated, and there is a concern that the device cost will increase.

[0006] Although the technical examples in patent literature 1 to 5 all describe techniques for heating the solder, the joining material is not limited to the solder described above. Furthermore, the joining machine is not limited to a configuration in which an electrical component is connected to the plate on which the circuit pattern is formed, but also includes, for example, a configuration in which a mechanical component is joined to various workpieces.

[0007] An object of the present disclosure is therefore to provide a joining work machine capable of efficiently heating a joining material while suppressing an increase in device cost with a simple configuration. Solution to the problem

[0008] The present description discloses a joining machine comprising: a working head comprising a component assembly tool configured to receive a component and to mount the component onto a workpiece by raising and lowering it along a lifting and lowering axis, wherein the working head is configured to be driven in a horizontal direction by a horizontal drive mechanism;and a laser light irradiation section provided and configured in the working head or horizontal drive mechanism to apply laser light to heat a joining material, generating a predetermined joining force, by applying it to at least one of the contact surfaces of the component and the workpiece that are in contact with each other and are heated, to any of the joining material, the component and the workpiece from a direction inclined with respect to the lifting and lowering axis. Advantageous effect of the invention

[0009] In the joining machine disclosed in this description, the laser light irradiation section, configured to apply the laser light to any of the joining material, component, or workpiece from a direction inclined with respect to the lifting and lowering axis, is provided in the working head or the horizontal drive mechanism. Accordingly, by applying the laser light to any of the joining material, component, or workpiece, the loss of heat caused by heating a part other than the required area is suppressed, the attenuation of the laser light is low, and the joining material can be heated efficiently.Since the laser light irradiation section only needs to be added to the working head or the horizontal drive mechanism, which have a general configuration, it is possible to suppress the increase in device costs with a simple configuration. Short description of the drawings Fig. Figure 1 is a top view schematically representing an overall configuration of a component assembler as a first embodiment of a joining machine. Fig. Figure 2 is a perspective view of a nozzle tool provided in an assembly head (working head). Fig. Figure 3 is a perspective view of the assembly head (working head) which is equipped with a laser light irradiation section. Fig. Figure 4 shows a view of the mounting head and the laser light irradiation section from below. Fig. 5 is a side view illustrating an operation of the laser light irradiation section when a laser light source and a suction nozzle are arranged at a lifting position. Fig. 6 is a side view illustrating an operation of the laser light irradiation section when the laser light source and the suction nozzle are arranged at a lowering position. Fig. 7 is a side view illustrating an operation of the laser light irradiation section when the laser light source is arranged at the lowering position and the suction nozzle is arranged at the lifting position. Fig. 8 is a side view schematically illustrating a configuration of a laser light irradiation section of a third embodiment. Fig. 9 is a bottom view of a mounting head and a laser light irradiation section in a fourth embodiment. Description of Embodiments 1. Overall configuration of the component mounter 1 of the first embodiment

[0010] First, an overall configuration of the component mounter 1 as a first embodiment of a joining work machine will be described with reference to Fig. 1. The component mounter 1 repeatedly performs bonding work of mounting and bonding a component to a workpiece. In the first embodiment, the component is a circuit element of an electronic circuit, and the workpiece is a board K on which a circuit pattern of the electronic circuit is formed. The component mounter 1 uses, for example, a non-conductive resin material as a bonding material, which generates a predetermined bonding force by heating it. A direction from a left side to a right side on a drawing surface in Fig. 1, in which the plate K is transported, is an X-axis direction, and a direction from a lower side (front) to an upper side (back) on the drawing surface is a Y-axis direction. The component mounter 1 includes a plate transport device 2, a component feed device 3, a component transfer and bonding device 4, and a laser light irradiation section 5.

[0011] The plate transport device 2 comprises a pair of guide rails 21, a pair of conveyor belts (not shown), a clamping mechanism 23, and the like. The pair of guide rails 21 extends in the X-axis direction across the center of an upper surface of the base 10 and is mounted parallel to each other on the base 10. The pair of conveyor belts rotates along the guide rails 21 in a position where two parallel sides of the plate K are positioned, conveying the plate K to a working position near the center of the base 10. The clamping mechanism 23 pushes the conveyed plate K upward, clamps the plate K to the guide rails 21, and positions the plate K.

[0012] The component feeder 3 is arranged at a front part of the base 10. The component feeder 3 includes a plurality of tape feeders 31 and a resin material supply section 35. The tape feeders 31 have a flat shape that is elongated in the front-to-rear direction (Y-axis direction) and thin in the left-to-right direction (X-axis direction), and are arranged in the X-axis direction. Each tape feeder 31 feeds a carrier tape in which a plurality of components are accommodated in a row to the supply position 32 near a rear end. The carrier tape feeds the component so that the component can be picked up at the supply position 32.

[0013] The resin material feed section 35 is arranged on the left side of the belt feeder 31 and feeds a resin material as the bonding agent. The resin material feed section 35 comprises a reservoir tray, a refilling mechanism, and a heat retention section (not shown). The reservoir tray is designed in a shallow, upward-opening bottom shape and holds a liquid resin material. Preferably, the reservoir tray has a mechanism that levels the liquid resin level as needed. The refilling mechanism replenishes the interior of the reservoir tray with resin material when the resin material is consumed and the level decreases. The heat retention section is arranged on the underside of the reservoir tray and transfers heat to the resin material inside the reservoir tray to prevent solidification due to a temperature drop.

[0014] The resin material is cooled and solidified after being heated to or above a predetermined temperature, thereby generating the predetermined bond strength. The resin material is applied to at least one of the contact surfaces of the component and the plate K. In the first embodiment, a lower surface (contact surface) of the component is coated with the resin material through the resin material feed section 35. The present embodiment is not limited thereto, and the resin material can be applied to the contact surface on one side of the plate K to which the component is bonded. Examples of predetermined temperatures for heating the resin material include approximately 100°C. Examples of resin layer thickness include approximately 10 µm.

[0015] A material of the resin material is selected considering a material of the component or the board. The predetermined temperature and the layer thickness of the resin material are adjusted according to the material and properties of the resin material. Instead of the resin material, an adhesive of a type in which the predetermined bonding force is generated by heating to the same temperature as or higher than the predetermined temperature may also be used. Furthermore, the resin material supply section 35 may be configured to coat the component with the resin material using a brush, or it may be configured to spray the resin material onto the component from a spray nozzle.Furthermore, a configuration can be selected in which the component fed by the belt feeder 31 or the component feeder of another type is pre-coated with the resin material, and the resin material feed section 35 is omitted.

[0016] The component transfer and joining device 4 performs the component pickup and assembly, as well as the joining operation. The component transfer and joining device 4 comprises a Y-axis motion body 41, an X-axis motion body 42, a mounting head 43, a nozzle tool 44, several suction nozzles 45 corresponding to a component assembly tool, a plate recognition camera 46, a component recognition camera 47, and a nozzle station 48. The mounting head 43 is equipped with a laser light irradiation section 5 for performing the joining operation (details will be described later).

[0017] The Y-axis motion body 41 is formed from an element stretched in the X-axis direction and is driven by a Y-direction drive mechanism (not shown) to move in the Y-axis direction. The X-axis motion body 42 is mounted on the Y-axis motion body 41 and is driven by an X-direction drive mechanism (not shown) to move in the X-axis direction. The mounting head 43 is attached to a clamping mechanism (not shown) provided on the front of the X-axis motion body 42 and moves with the X-axis motion body 42 in two horizontal directions. The Y-axis moving body 41, the Y-direction driving mechanism, the X-axis moving body 42 and the X-direction driving mechanism form the horizontal driving mechanism 40, which drives the mounting head 43 in the horizontal direction.The assembly head 43 is an embodiment of a working head with a component assembly tool.

[0018] The nozzle tool 44, which has a substantially cylindrical outer shape, is provided on the underside of the mounting head 43. The nozzle tool 44 is designed as a rotating body that rotates about the vertical central axis AV (see Fig. 2) The nozzle tool 44 comprises several (twelve in the example of Fig. 1) Suction nozzles 45 rotating around the vertical central axis AV. The suction nozzle 45 is selectively supplied with negative and positive pressure air from an air supply system (not shown). Accordingly, the suction nozzle 45 performs a picking-up operation of the component from the belt feeder 31 and a mounting operation of mounting the component onto the plate K.

[0019] “Mounting” here means placing the component onto the plate K, and “connecting” means ensuring the specified connection force between the component and the plate K. That is, the connection force is not ensured solely by mounting the component. The suction nozzle 45 is an embodiment of a component mounting tool configured to receive a component and mount the component onto a workpiece by raising and lowering it along a lifting and lowering axis. The component mounting tool can be a type of mounting tool with a chuck for clamping the component, or a mounting tool of another type. A detailed configuration of the nozzle tool 44 will be described later.

[0020] The plate detection camera 46 may be provided at a front side of the mounting head 43 and may be provided at the bottom of the X-axis moving body 42. The plate detection camera 46 is arranged with an optical axis directed downward and captures an image of a position mark attached to the plate K from above. The acquired image data is subjected to image processing so that the work-performing position of the plate K is accurately determined. Examples of the plate detection camera 46 include a digital imaging device having an imaging element such as a charge-coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS).

[0021] The component recognition camera 47 is positioned on base 10 between the plate transport device 2 and the component feeder 3. The component recognition camera 47 is arranged with one optical axis pointing upwards. The component recognition camera 47 captures an image of the component held by the suction nozzle 45 from below to recognize the component as the assembly head 43 moves towards the plate K. As a result, the suitability of the resin coating condition of the component is determined, and the position and orientation of the component relative to the suction nozzle 45 are identified and taken into account during assembly. Examples of a component recognition camera 47 include a digital imaging device with an imaging element such as a CCD or CMOS.

[0022] The nozzle station 48 is located on a left side of the component detection camera 47. The nozzle station 48 holds a plurality of suction nozzles 45 in an interchangeable manner. For example, several types with different nozzle diameters are provided as a plurality of suction nozzles 45, and the suction nozzles 45 are exchanged according to different components that have different sizes. When the error rate of the picking and mounting process of a certain suction nozzle 45 increases, the suction nozzle 45 can be exchanged for another suction nozzle 45 of the same type. The mounting head 43 has the function of moving to the nozzle station 48 and automatically exchanging the suction nozzle 45. The present configuration is not limited to this, and the suction nozzle 45 can also be manually exchanged. Furthermore, the mounting head 43 can have a function of automatically exchanging the nozzle tool 44, or the nozzle tool 44 can be manually exchanged.

[0023] The component transfer bonding device 4 can repeatedly perform multiple bonding cycles on the positioned plate K. In the bonding cycle, the mounting head 43 first moves over the tape feeder 31, and the suction nozzles 45 are then lowered and raised to perform the component picking process. Next, the mounting head 43 moves over the resin material supply section 35, the suction nozzles 45 are then lowered and raised, and the bottom of the component held by the suction nozzle 45 is immersed in the resin material and coated with the resin material. Then, the mounting head 43 moves over the component recognition camera 47, and the component recognition camera 47 captures the image. Next, the mounting head 43 moves over the plate K, and the suction nozzles 45 are then lowered and raised to perform the component mounting process.

[0024] While the mounting head 43 moves from the resin material supply section 35 over the plate K, and while the suction nozzle 45 is lowered and raised above the plate K, the laser light irradiation section 5 operates at least part of the time. As a result, the bonding work is performed by heating the resin material to the predetermined temperature or higher, and then cooling and solidifying it. The mounting head 43, having completed the component mounting process, moves back toward the tape feeder 31. The bonding cycle is a generic term for the series of operations described above. 2. Nozzle tool 44

[0025] Next, a detailed configuration of the nozzle tool 44 with twelve suction nozzles 45 will be given with reference to Fig. 2. The nozzle tool 44 comprises a tool main body part 441 and a cylindrical gear 442. Furthermore, the nozzle tool 44 includes twelve sets of nozzle holders 443, elastic bodies 444, θ-axis gears 445, locking parts 446 and valve actuating parts 447, which are arranged at equal angular intervals around the vertical central axis AV.

[0026] The tool main body part 441 is mounted on the bottom of the mounting head 43, and part of its outer shape is in Fig. 2 is not shown. The tool main body part 441 is driven by an R-axis drive mechanism (not shown) provided in the mounting head 43 and rotates around the vertical center axis AV. Accordingly, the entire nozzle tool 44 rotates. Twelve sets of nozzle holders 443 are arranged at equal angular intervals at positions equidistant from the vertical center axis AV of the tool main body part 441.

[0027] The nozzle holder 443 extends in the top-bottom direction and is supported by the main tool body part 441 in a way that allows it to be raised and lowered. The suction nozzle 45 is attached to an underside of the nozzle holder 443 via an elastic body 444 ( Fig. Figure 2 shows a partial cross-section. Accordingly, the twelve suction nozzles rotate about the vertical central axis AV when the nozzle tool 44 rotates. Examples of an elastic body 444 are helical springs. Meanwhile, the θ-axis gear 445 is provided on the top of the nozzle holder 443, and the locking element 446 is provided on the radially outer side of the θ-axis gear 445. Furthermore, a valve actuating element 447 is provided for each nozzle holder 443.

[0028] The cylindrical gear 442 is arranged within the twelve θ-axis gears 445. The cylindrical gear 442 has large-diameter gears (not shown) that mesh with twelve θ-axis gears 445 on its outer circumferential surface. The cylindrical gear 442 is driven by a θ-axis drive mechanism (not shown) provided in the mounting head 43 and rotates about the vertical central axis AV. Accordingly, the cylindrical gear 442 collectively rotates twelve sets of nozzle holders 443 and suction nozzles 45. The valve actuator 447 opens and closes an airflow path (not shown) and selectively switches between negative and positive pressure air to be supplied to the suction nozzle 45.

[0029] The locking piece 446 is driven by the Z-axis drive mechanism 431, which is provided in the mounting head 43, to be raised and lowered (see arrow MV in Fig. 2). Through the lifting and lowering action of the locking part 446, the nozzle holder 443 is lifted and lowered in a range from the lifting position to the lowering position along the vertical lifting and lowering axis. Furthermore, the suction nozzle 45 is lifted and lowered via the elastic body 444. However, the Z-axis drive mechanism 431 is provided at one or more limited positions on an orbit of the suction nozzle 45, and the lifting and lowering axis is set at that position. Hereinafter, the position where the lifting and lowering axis is set is referred to as the AP position where lifting and lowering is possible.

[0030] The lifting and lowering position AP is determined by the arrangement of the Z-axis drive mechanism 431 on the mounting head 43. Accordingly, the lifting and lowering position AP does not move even when the nozzle tool 44 rotates, and only the suction nozzle 45 that has entered the lifting and lowering position AP can be lifted and lowered. The lowering position at which the Z-axis drive mechanism 431 lowers the nozzle holder 443 via the locking part 446 and a dwell time during which the nozzle holder 443 remains at the lowering position are set via the setting section 432. The setting section 432 is implemented, for example, by software that controls the operation of the Z-axis drive mechanism 431.

[0031] When the suction nozzle 45, which has received the component P, has entered the lifting and lowering position AP and is lowered toward the plate K, the nozzle holder 443 and the suction nozzle 45 are initially lowered in conjunction with each other. When the component P comes into contact with the plate K, the lowering of the suction nozzle 45 is stopped, and only the lowering of the nozzle holder 443 continues to the lowering position. As a result, the compression of the elastic body 444 is started, a compression amount further increases, and the compression force gradually increases. The compression force acts from the elastic body 444 to the component P via the suction nozzle 45, so it is a downward pressing force.

[0032] That is, the suction nozzle 45 is attached to the work head 43 via the elastic body 444 and presses the component P against the plate K with the pressing force generated by the compression of the elastic body 444. In this way, a joining state is stabilized by performing the joining work in a state where the component P is pressed against the plate K. Subsequently, when the nozzle holder 443 is raised from the lowered position, the compression amount of the elastic body 444 decreases, and the compression force gradually decreases. When the suction nozzle 45 is separated from the component P mounted on the plate K, the pressing force disappears.

[0033] Here, the adjustment section 432 sets the lowering position, at which the Z-axis drive mechanism 431 lowers the nozzle holder 443, as adjustable. When the lowering position of the nozzle holder 443 is set low, the compression of the elastic body 44 increases, and the pressure force when component P is pressed against the plate K increases. Conversely, when the lowering position of the nozzle holder 443 is set high, the compression of the elastic body 44 decreases, and the pressure force when component P is pressed against the plate K decreases. That is, the adjustment section 432 can variably adjust the pressure force of the suction nozzle 45 when the suction nozzle 45 presses component P against the plate K. The adjustment section 432 can change the pressure force depending on at least one type of component P and one type of joining material.For example, a recommended value for the pressing force during the joining work may be determined depending on the type of the joining material S, and the setting section 432 sets the pressing force according to the recommended value.

[0034] The adjustment section 432 also sets the residence time, during which the nozzle holder 443 remains in the lowered position, so that it is variable. That is, the adjustment section 432 can set a suitable residence time based on a method for performing the joining work or an expected required heating time. In addition, the adjustment section 432 can change the residence time depending on at least one of the type of component P and the type of joining material. 3. Laser light irradiation section 5

[0035] The following section describes the detailed configuration and function of laser light irradiation section 5 with reference to the Fig. 3 to 7. As described in Fig. As shown in Figure 3, the laser light irradiation section 5 is provided on each of the right and left sides of the mounting head 43. Two laser light irradiation sections 5 are arranged within a range of one length dimension of the X-axis motion body 42 in the left-right direction and do not restrict the movement of the X-axis motion body 42 and the mounting head 43 in the X-axis direction. The laser light irradiation section 5 can be provided in the X-axis motion body 42, which moves integrally with the mounting head 43 beneath the elements of the horizontal drive mechanism 40. The laser light irradiation section 5 applies laser light LL to heat the joining material S in the direction of any of the joining material S, the component P, or the plate K from a direction inclined with respect to the lifting and lowering axis.The laser light irradiation section 5 comprises an optical switching mechanism 52, a laser light source 53 and a reflection mirror 54.

[0036] The optical switching mechanism 52 is provided in contact with a top surface and a side surface (right side surface or left side surface) of the mounting head 43. The optical switching mechanism 52 is a section that switches the irradiation position at which laser light LL is applied. The optical switching mechanism 52 switches the irradiation position by changing the positions of the laser light source 53, which emits laser light LL, and the reflection mirror 54, which reflects the laser light LL, relative to the mounting head 43.

[0037] Specifically, the optical switching mechanism 52 drives the laser light source 53 and the reflection mirror 54 to be raised and lowered and switches their height positions between the lifting position HP and the lowering position LP (see Fig. 5 to 7). In the first embodiment, a servo motor is used as the optical switching mechanism 52. In a configuration where the fine adjustment described later is described, the optical switching mechanism 52, which uses the servo motor, has a fine adjustment function for the height positions of the laser light source 53 and the reflection mirror 54, in addition to a switching function for the height positions between the raised position (HP) and the lowered position (LP). The height position of the laser light source 53 can be fixed, and the optical switching mechanism 52 can only drive the reflection mirror 54 to be raised and lowered. A mechanism other than the servo motor can be used as the optical switching mechanism 52, e.g., a linear motor or an air actuation mechanism.

[0038] The laser light source 53 is formed in a vertically elongated, rectangular parallelepiped shape and is mounted by the optical switching mechanism 52 in a way that allows it to be raised and lowered. The laser light source 53 emits laser light LL downwards parallel to the raising and lowering axis. One type of laser light LL is suitable for heating the joining material, and one intensity of the laser light LL is, for example, class 4, which is the highest in the JIS standards. Accordingly, it is possible to heat the joining material S together with the component P to a temperature equal to or higher than the specified temperature by applying the laser light LL for a short time on the order of a few tens of milliseconds.

[0039] The reflecting mirror 54 is arranged below the laser light source 53 using a support element 55 and is raised and lowered integrally with the laser light source 53. The reflecting mirror 54 reflects the laser light LL emitted downwards by the laser light source 53 in an obliquely downward direction with respect to the raising and lowering axis. Accordingly, the laser light LL reaches the component P held by the suction nozzle 45. The laser light LL can be applied to the entire component P or to a part of the component P. For example, in the case of a component P where the entire underside is coated with the bonding material S, the laser light LL can be applied to the entire component P to heat the entire bonding material S.On the other hand, in a case where component P has an electrode coated with solder as a bonding material S or with conductive paste, the laser light LL can be directed to a position near the electrode that is part of component P in order to efficiently heat the electrode and the bonding material S. Furthermore, in a case where a mounting bracket is rotated by 90° when component P is mounted on the plate K, the optical switching mechanism 52 can be activated to direct the laser light LL to the electrode position of component P in order to efficiently heat the electrode.

[0040] Instead of the reflecting mirror 54, a prism or a refractive glass plate can also be used, which refracts the laser light LL downwards in the obliquely downward direction with respect to the lifting and lowering axis. The reflecting mirror 54, the prism, and the refractive glass plate are embodiments of an optical element that reflects or refracts laser light LL emitted downwards in the direction obliquely with respect to the lifting and lowering axis. The laser light irradiation section 5 can include a light path control element that regulates the extent to which the laser light LL reaches the plate K. The light path control element is, for example, formed from a metal plate that the laser light LL does not penetrate and is arranged obliquely below the component P, which is held by the suction nozzle 45 at the position AP where lifting and lowering is possible.By using the element to regulate the light path, the plate K, which is weak for laser light LL, can be protected.

[0041] In the first embodiment, as shown in Fig. As shown in Figure 4, the position AP, where lifting and lowering are possible, is set to a position corresponding to the front part of the nozzle tool 44. As shown, two sets of laser light irradiation sections 5 direct laser light LL towards component P, which is held by the suction nozzle 45 in the position AP where lifting and lowering are possible. That is, two sets of laser light irradiation sections 5 are provided jointly for several suction nozzles 45, which selectively enter the position AP where lifting and lowering are possible. The target on which the laser light LL is applied is not limited to the suction nozzle 45 at the position AP where lifting and lowering are possible and can, for example, be set to the suction nozzle 45 located immediately in front of the position AP where lifting and lowering are possible.

[0042] Furthermore, several laser light irradiation sections 5 are provided for a lifting and lowering axis (a position AP where lifting and lowering is possible). Accordingly, two beams of laser light LL from different directions are applied to a component P at the position AP where lifting and lowering is possible, so that high heating efficiency and a sufficient amount of heat can be easily ensured. In the two sets of laser light irradiation sections 5, the lifting and lowering of two laser light sources 53 is controlled synchronously with each other, and the irradiation periods of the two laser light sources 53 are controlled synchronously with each other.

[0043] As in Fig. As shown in Figure 5, when the laser light source 53 is at the lifting position HP, the laser light LL is applied to the component P held at the lifting position by the suction nozzle 45. Furthermore, as shown in Fig. 6, when the laser light source 53 is located at the lowering position LP, which is lower than the lifting position HP by the lowering distance DL, the laser light LL is applied to the component P, which is pressed against the plate K by the suction nozzle 45 lowered to the lowering position. The lowering distance DL is set to be substantially equal to a height difference between the lifting position and the lowering position of the suction nozzle 45.

[0044] Furthermore, as in Fig. Figure 7 shows that when the laser light source 53 is in the lowering position LP and the suction nozzle 45 is in the lifting position, the laser light LL is applied to the contact surface KF of the plate K to which the component P is to be connected. If the contact surface KF of the plate K is coated with the bonding material S, the laser light LL is applied to the bonding material S. In this way, the optical switching mechanism 52 can switch the irradiation position of the laser light LL by changing the positions of the laser light source 53 and the reflection mirror 54 relative to the mounting head 43 in the up-down direction.

[0045] The lifting and lowering position AP of the nozzle tool including four medium-sized suction nozzles is set to the same position as the nozzle tool 44 including twelve suction nozzles 45. Accordingly, when the nozzle tool with the four medium-sized suction nozzles is provided in the mounting head 43, the laser light irradiation section 5 can perform the same operation as for the nozzle tool 44. On the other hand, the lifting and lowering position AP of a nozzle tool (not shown) including one large suction nozzle is set to overlap the vertical center axis AV and is different from that of the nozzle tool 44. To handle this case, a configuration may be adopted in which the optical switching mechanism 52 has a function of changing the positions of the laser light source 53 and the reflection mirror 54 with respect to the mounting head 43 in the front-to-back direction.

[0046] A configuration may be adopted in which the optical switching mechanism 52 also has a function of finely adjusting the irradiation position of the laser light LL. For example, when the size or shape of the component P changes due to a difference in the type of component P, the irradiation position at which heating can be performed efficiently changes, and thus the optical switching mechanism 52 finely adjusts the irradiation position of the laser light LL. For example, with respect to two types of components that have the same bottom surface shape and different heights, the optical switching mechanism 52 finely adjusts the irradiation position of the component that has a relatively high height so that it is higher, and finely adjusts the irradiation position of the component that has a relatively low height so that it is lower. If there is a shape error, such asWhen there is a distortion in the plate K, the height position of the component P mounted on the plate K varies, and the optical switching mechanism 52 finely adjusts the irradiation position in accordance with the actual height position of the component P. 4. Operation of the component assembler 1

[0047] Next, the operation of component assembler 1 will be described, focusing on joining component P using the laser irradiation section 5. During operation of component assembler 1, several irradiation patterns of the laser irradiation section 5 can be selected according to the irradiation position or the irradiation time LL of the laser light, whether joining material S is applied to component P or plate K, and the like. The following irradiation patterns (1) to (4) will be described below. (1) Basic irradiation pattern

[0048] The laser light irradiation section 5 applies laser light LL at a time that includes a time interval during which the suction nozzle 45 brings the component P into contact with the plate K, with the laser light source 53 being in the lowering position LP (see Fig. 6) In particular, the laser light irradiation section 5 applies laser light LL in a state in which the suction nozzle 45 presses the component P against the plate K with the pressure force set by the adjustment section 432. In this case, since the component P, the bonding material S, and the plate K are stacked in the top-bottom direction, the irradiation position of the laser light LL is limited to the component P. The bonding material S can be applied to either the component P or the plate K.

[0049] In the basic irradiation pattern, the laser irradiation section 5 applies the laser light LL each time the nozzle tool 44 of the rotating body rotates and twelve suction nozzles 45 subsequently perform the assembly process. The laser irradiation section 5 indirectly heats the joining material S via component P to the specified temperature or above by applying laser light LL to component P. Afterwards, the temperature of the joining material S decreases, the joining material S solidifies, and the joining process is complete.

[0050] If there is concern that the irradiation time is insufficient, the adjustment section 432 sets the dwell time during which the nozzle holder 443 remains in the lowering position to a longer time than in a normal state, thus ensuring a sufficient irradiation time. Furthermore, the laser light irradiation section 5 can apply laser light LL during a period from immediately before the lowering of the suction nozzle 45 begins until the middle of the lowering process (see Fig. 7) Accordingly, the contact surface KF can be preheated by adjusting the irradiation position of the laser light LL to the contact surface KF of the plate K. However, since the plate has a high heat capacity, it is difficult to heat the plate K to a predetermined temperature, so heating only the plate K without heating component P cannot be used. (2) Pre-contact heating irradiation pattern

[0051] The laser light irradiation section 5 applies laser light LL in a time interval before the suction nozzle 45 brings the component P into contact with the plate K, with the laser light source 53 being in the lifting position HP (see Fig. 5) The laser light LL is directed onto component P, which is held in the lifting position by the suction nozzle 45. The bonding material S is applied to component P. The time interval before the suction nozzle 45 brings component P into contact with the plate K refers to at least a portion of the time interval between the moment the suction nozzle 45 picks up component P from the belt feeder 31 and the moment the suction nozzle 45 moves towards the plate K and is lowered.

[0052] As the nozzle tool 44 of the rotating body rotates, the laser light irradiation section 5, in the pre-contact heating irradiation pattern, subsequently applies the laser light LL to all components P that are picked up by the twelve suction nozzles 45. Accordingly, the bonding material S, which covers the underside of component P, is heated to a temperature equal to or higher than the specified temperature before contact with the plate K. Afterward, component P is mounted on the plate K, the temperature of the bonding material S decreases, the bonding material S solidifies, and the joining process is complete. (3) Heat accumulation irradiation pattern

[0053] The laser light irradiation section 5 applies laser light LL in a period of time before the suction nozzle 45 brings the component P into contact with the plate K, with the laser light source 53 being in the lifting position HP (see Fig. 5). The irradiation position of the laser light LL is limited to the component P held in the lift position by the suction nozzle 45. Unlike (2), the bonding material S is applied to the contact surface KF of the plate K. Accordingly, the laser light irradiation section 5 cannot heat the bonding material S even if the laser light LL is directed to the component P, but can accumulate the amount of heat in the component P.

[0054] As the nozzle tool 44 of the rotating body rotates, the laser light irradiation section 5, in the heat accumulation irradiation pattern, subsequently applies the laser light LL to all components P that are picked up by the twelve suction nozzles 45. Accordingly, each of the components P accumulates the heat and reaches a temperature equal to or higher than the predetermined temperature. After the suction nozzle 45 has brought the component P into contact with the plate K, the bonding material S applied to the contact surface KF of the plate K is heated by the heat accumulated in the component P to a temperature equal to or higher than the predetermined temperature. The temperature of the bonding material S then decreases, the bonding material S solidifies, and the bonding process is complete. (4) Combined irradiation pattern

[0055] The above-described (1) and (2) can be used in combination. In combination, however, the laser light irradiation section 5 raises and lowers the laser light source 53 by means of the optical switching mechanism 52. Even if the heating of the joining material S in the pre-contact heating irradiation pattern of (2) is insufficient, it is accordingly possible to stabilize the joining work by performing additional heating with the basic irradiation pattern of (1).

[0056] Furthermore, the above-described (1) and (3) can be used in combination. In the combination, however, the laser light irradiation section 5 raises and lowers the laser light source 53 by means of the optical switching mechanism 52. Even if the accumulated heat of component P in the heat accumulation irradiation pattern of (3) is insufficient, it is accordingly possible to stabilize the connection work by performing additional heating with the basic irradiation pattern of (1).

[0057] In the combination of the two cases described above, the optical switching mechanism 52 can lower the laser light source 53 and the reflection mirror 54 synchronously to coordinate with the lowering of the suction nozzle 45, which holds component P. In this operating mode, the suction nozzle 45, the laser light source 53, and the reflection mirror 54 are lowered together, and the laser light LL is applied to component P during the lowering period. Accordingly, it is possible to increase the effective irradiation time during which laser light LL acts on component P and to stabilize the bonding process.

[0058] As can be seen from the description above, the combined irradiation pattern of (4) is effective for a large component P with a high heat capacity. The heat capacity of component P is essentially determined according to the size of component P, and the irradiation pattern can be modified according to the type of component P. Since the target temperature to which heating is to be carried out is determined according to the material and properties of the bonding material S, the irradiation pattern can be modified according to the type of bonding material S.

[0059] In the component assembler 1 of the first embodiment, the assembly head 43 is provided with a laser light irradiation section 5, which applies laser light LL to any of the joining material S, the component P, and the plate K from a direction inclined with respect to the lifting and lowering axis. Accordingly, by applying the laser light LL to any of the joining material S, the component P, or the plate K, the heat loss caused by heating a part other than the required area is suppressed, the attenuation of the laser light LL is low, and the joining material can be heated efficiently. Since the laser light irradiation section 5 only needs to be added to the assembly head 43 or the horizontal drive mechanism 40, which have a general configuration, it is possible to minimize the increase in device costs with a simple configuration.

[0060] Furthermore, the laser light irradiation section 5 adopts a configuration in which the laser light source 53, which emits laser light LL in the direction parallel to the raising and lowering axis, and the reflection mirror 54, which reflects the emitted laser light LL in the direction inclined with respect to the raising and lowering axis, are combined. Accordingly, the mounting head 43 can be made compact, and a moving range of the mounting head 43 in the horizontal direction is not limited. In addition, since the laser light irradiation section 5 includes the optical switching mechanism 52, multiple irradiation patterns for heating the joining material S can be selectively performed, or multiple irradiation patterns can be used in combination. An aspect can be implemented in which the reflection mirror 54 is omitted and the laser light source 53 is inclined.In this aspect, however, since the laser light source 53 protrudes to the right and left sides of the X-axis moving body 42 and the mounting head 43 is enlarged, the moving range of the mounting head 43 in the left-right direction (X-axis direction) is slightly restricted.

[0061] Furthermore, in the prior art, a special heating device for heating the joining material is generally arranged in a preceding or subsequent process of the component assembler, but this special heating device is not required in the component assembler 1 of the first embodiment. Accordingly, line shortening and space savings of a joining work line, reduction of line construction costs, and the like can be achieved. 5. Component assembler 1 of the second embodiment

[0062] Next, a second embodiment is described in which paste solder is used as the bonding material. In the second embodiment, the configuration of the component assembler 1 is the same as described in the first embodiment. However, the solder as the bonding material is printed onto the plate K in the preceding process using a solder printer. Furthermore, the belt feeder 31 of the component feeder 3 feeds the component, including the electrode on the underside, and the resin material feed section 35 is stopped.

[0063] In the joining cycle of the second embodiment, the assembly head 43 first moves over the belt feeder 31, and the suction nozzles 45 are then lowered and raised to perform the component pickup operation. The assembly head 43 then moves over the component recognition camera 47, and the component recognition camera 47 captures the image. Next, the assembly head 43 moves over the plate K, and the suction nozzles 45 are then lowered and raised to mount the component onto the plumb line of the plate K. While the assembly head 43 moves over the plate K and while the suction nozzle 45 is being lowered and raised, the laser light irradiation section 5 operates for at least part of the time.Accordingly, the solder is melted by applying laser light LL, and the solder is solidified by a temperature decrease after melting, and a good soldering state (joining state) in which the predetermined joining force is ensured is obtained.

[0064] In the second embodiment, the component mounter 1 can selectively implement any of the basic irradiation pattern of (1), the heat accumulation irradiation pattern of (3), and the combined irradiation pattern of (1) and (3) described above, even if the bonding material is different. In the second embodiment, as in the first embodiment, the solder can be efficiently heated, and an increase in device cost can be suppressed with a simple configuration.

[0065] Furthermore, the prior art requires a reflow machine for melting the solder in a subsequent process of the component assembler that mounts the component, but the reflow machine is not required in the second embodiment. Since the joining process is completed to achieve a good solder joint, it is also possible with the component assembler 1 of the second embodiment to avoid an unstable state in which the position of the component on the solder is shifted or its position is tilted until the plate K is transported to the reflow machine. 6. Third embodiment

[0066] Next, a third embodiment, which differs from the first embodiment in a configuration of the laser light irradiation section 5A, is described with reference to Fig. 8. In the third embodiment, in the laser light irradiation section 5A, the optical switching mechanism 52 is omitted, and the height position of the laser light source 53 is fixed. Instead, an angle adjustment mechanism (not shown) is provided for adjusting an inclination angle of the reflection mirror 54A.

[0067] At a first inclination angle of the reflecting mirror 54A, which is in Fig. As shown in Figure 8, laser light LL, reflected by the reflection mirror 54A, is applied to component P, which is held in the lifting position by the suction nozzle 45. When the tilt angle of the reflection mirror 54A is adjusted by the angle adjustment mechanism to a second tilt angle closer to the vertical than the first tilt angle, the reflection direction of the laser light LL changes, as indicated by a dashed line, and the laser light LL is applied to the contact surface KF of the plate K or to the bonding material S applied to the contact surface. In this case, when the suction nozzle 45 is lowered into the lowering position, laser light LL, indicated by a dashed line, is applied to component P, which is pressed against the plate K.Since the angle adjustment mechanism switches the irradiation position of the laser light LL instead of the optical switching mechanism 52, the same processes, activities and effects are achieved in the third embodiment as in the first embodiment. 7. Fourth embodiment

[0068] Next, a fourth embodiment, which differs from the first embodiment in that the positions AP, at which raising and lowering are possible, are set to two positions and the arrangement of the laser light irradiation section 5 is different, is described with reference to Fig. 9 will be described. In the fourth embodiment, as in Fig. Figure 9 shows the positions AP, where raising and lowering is possible, where the suction nozzle 45 is raised and lowered, set at two positions corresponding to the front part and the rear part of the nozzle tool 44.

[0069] The first laser light irradiation section 5, which directs the laser light LL towards the position AP where raising and lowering is possible on the front part, is located on the right side of the mounting head 43. The second laser light irradiation section 5, which directs the laser light LL towards the position AP where raising and lowering is possible on the rear part, is located on the left side of the mounting head 43. In other words, the laser light irradiation section 5 is provided for each of the multiple raising and lowering axes (positions AP where raising and lowering is possible).

[0070] The operations, actions, and effects of the fourth embodiment are the same as those of the first embodiment, except that the number of laser light irradiation sections 5 for a lifting and lowering possible position AP is different. As in the first embodiment, two laser light irradiation sections 5 may be provided for one lifting and lowering axis (lifting and lowering possible position AP), and a total of four laser light irradiation sections 5 may be provided for two lifting and lowering axes. 8. Application and modification of the embodiment

[0071] In the first embodiment, the suction nozzle 45 does not necessarily press the component P against the plate K, and another type of component mounting tool can simply place the component P on the contact surface KF of the plate K. In this case, in the basic irradiation pattern of (1), the laser light irradiation section 5 applies the laser light LL at a timing including the period during which the suction nozzle 45 brings the component P into contact with the plate K. Furthermore, the optical switching mechanism 52 of the laser light irradiation section 5 can be omitted, the laser light source 53 can be attached to the mounting head 43, the laser light LL can be applied to the component P pressed against the plate K by the suction nozzle 45 at the lowering position, and only the basic irradiation pattern of (1) can be performed.Alternatively, the laser light source 53 can be fixed, the laser light LL can be applied to the component P, which is held at the lifting position by the suction nozzle 45, and the pre-contact heating irradiation pattern of (2) and the heat accumulation irradiation pattern (3) can be carried out selectively.

[0072] Furthermore, a configuration can be chosen in which the mounting head 43 includes only one suction nozzle 45, without including the nozzle tool 44 of the rotating body. Alternatively, a configuration can be assumed in which the mounting head 43 includes several suction nozzles 45 arranged in a row or grid configuration, without including the nozzle tool 44, and the laser light irradiation section 5 is provided to several suction nozzles 45 in a relatively movable manner. Moreover, the various aspects of the laser light irradiation section 5 described above and the various aspects of the component mounting tool provided in the mounting head 43 can be freely combined and implemented.

[0073] Furthermore, as a first modification example of the second embodiment, a configuration can be assumed in which the conductive paste is used as the bonding material and a feed section for the conductive paste is provided at the position of the resin material feed section 35. As a second modification example of the second embodiment, a configuration can be assumed in which the conductive paste is used as the bonding material and an inkjet printer in the previous process or an inkjet printer provided in the component assembler 1 prints the conductive paste onto the plate K using the injection nozzle. Various other applications or modifications can be made for the first to fourth embodiments. Industrial applicability

[0074] The configuration of the component mounter 1 described in the first to fourth embodiments is not limited to a model that connects the component P to the board K on which the circuit pattern is formed, and can be used for a connecting work machine or an assembly machine that connects components having different materials and different shapes to different workpieces. List of reference symbols

[0075] 1: Component assembler, 2: Plate transport device, 3: Component feeding device, 31: Belt feeder, 35: Resin material feed section, 4: Component transfer joining device, 40: Horizontal drive mechanism, 43: Assembly head, 431: Z-axis drive mechanism, 432: Adjustment section, 44: Nozzle tool, 443: Nozzle holder, 444: Elastic body, 45: Suction nozzle, 5, 5A: Laser light irradiation section, 52: Optical switching mechanism, 53: Laser light source, 54, 54A: Reflection mirror, AP: Position at which lifting and lowering is possible, AV: Vertical center axis, LL: Laser light, K: Plate, KF: Contact surface, P: Component, S: Joining material QUOTES CONTAINED IN THE DESCRIPTION

[0000] This list of documents submitted by the applicant was generated automatically and is included solely for the convenience of the reader. This list is not part of the German patent or utility model application. The DPMA assumes no liability for any errors or omissions. Cited patent literature

[0000] JP-A-2000-13098

[0004] JP-A-S60-162574

[0004] JP-A-2000-59098

[0004] JP-A-S61-224395

[0004] JP-A-2014-22383

[0004]

Claims

[1] A connecting work machine comprising: a work head including a component mounting tool configured to receive a component and mount the component to a workpiece by raising and lowering it along a raising and lowering axis, the work head being configured to be driven in a horizontal direction by a horizontal drive mechanism; and a laser light irradiation section provided in the work head or the horizontal drive mechanism and configured to apply laser light for heating a joining material that generates a predetermined joining force by being applied to at least one of the contact surfaces of the component and the workpiece that are in contact with each other and are heated, to any one of the joining material, the component, and the workpiece from a direction inclined with respect to the raising and lowering axis. [2] The joining work machine according to claim 1, wherein the work head includes a plurality of component mounting tools, and the laser light irradiation section is provided in common to the plurality of component mounting tools. [3] The connecting work machine according to claim 2, wherein the working head includes the plurality of component assembly tools configured to rotate about a vertical central axis and sets the lifting and lowering axis at one or more positions of a rotational path of the component assembly tool, and the laser light irradiation section is provided in common to the plurality of component mounting tools configured to selectively assume a position of the lifting and lowering axis. [4] The joining work machine according to claim 1, wherein the laser light irradiation section applies the laser light at a time including a period during which the component mounting tool brings the component into contact with the workpiece. [5] The joining machine according to claim 4, further comprising: an adjustment section configured to adjust a pressing force of the component assembly tool when the component assembly tool presses the component against the workpiece, wherein the laser light irradiation section applies the laser light in a state where the component mounting tool presses the component against the workpiece with the pressing force set by the setting section. [6] The joining work machine according to claim 5, wherein the component mounting tool is fixed to the work head via an elastic body and presses the component against the workpiece with the pressing force generated by compression of the elastic body. [7] The joining work machine according to claim 4, wherein the laser light irradiation section heats the joining material indirectly via the component by applying the laser light to the component. [8] The joining work machine according to claim 1, wherein the laser light irradiation section applies the laser light in a period before the component mounting tool brings the component into contact with the workpiece. [9] The connecting work machine according to claim 8, wherein the laser light irradiation section accumulates an amount of heat in the component by applying the laser light to the component, and the joining material applied to the contact surface of the workpiece is heated with the amount of heat accumulated in the component after the component assembly tool brings the component into contact with the workpiece. [10] The joining work machine according to claim 1, wherein the laser light irradiation section includes a laser light source configured to emit the laser light in a direction parallel to the raising and lowering axis, and an optical element configured to reflect or refract the emitted laser light in a direction inclined with respect to the raising and lowering axis. [11] The joining work machine according to claim 1, wherein a plurality of laser light irradiation sections are provided for a lifting and lowering axis. [12] The joining work machine according to claim 1, wherein the laser light irradiation section includes an optical switching mechanism configured to switch an irradiation position to which the laser light is applied. [13] The joining work machine according to claim 12, wherein the irradiation position includes two or more positions among a position of the component held by the component mounting tool, a position of the component in contact with the workpiece, a position of the joining material applied to the contact surface of the workpiece, and a position of the contact surface of the workpiece. [14] The joining work machine according to claim 10, wherein the laser light irradiation section includes an optical switching mechanism configured to switch an irradiation position to which the laser light is applied, and the optical switching mechanism switches the irradiation position by changing a position of at least one of the laser light source and the optical element with respect to the work head. [15] The joining work machine according to claim 12, wherein the optical switching mechanism also has a function of finely adjusting the irradiation position depending on a difference in a type of the component or the workpiece or depending on a shape error of the component or the workpiece. [16] The connecting work machine according to claim 1, wherein the component represents an electronic circuit, the workpiece is a plate on which a circuit pattern of the electronic circuit is formed, and the bonding material is any of a non-conductive resin material or adhesive, a conductive solder, or a conductive paste.

Images