METHOD FOR MANUFACTURING AN ELECTRICAL CIRCUIT MODULE AND ELECTRICAL CIRCUIT MODULE

Description

State of the art

[0001] The invention is based on a device or a method according to the class of the independent claims.

[0002] An important future field for radar applications is the automotive industry, where the installation of radar modules, such as high-frequency radar sensors, throughout the entire vehicle body will increasingly be required to ensure complete visibility. In this context, the greatest possible miniaturization of radar modules is becoming increasingly important.

[0003] DE 10 2007 044 754 A1 shows a method for producing an electronic assembly, in which an electronic component mounted on a printed circuit board is mounted and contacted on an insulating layer of a conductive foil, which in turn is laminated onto a printed circuit board carrier with the electronic component mounted thereon.

[0004] From US 2015 / 207216 A1, a module with a substrate on one side of which an antenna is arranged and on the other side of which a highly integrated microwave circuit is arranged is known.

[0005] It is known from US 2011 / 075384 A1 that sensitive electronic components can be mounted on a printed circuit board within an electronic device. To isolate a sensitive component from voltages that may occur during an accidental impact event, the electronic component can be isolated using a groove in the printed circuit board. The electronic component can be mounted to a component mounting area using solder pads, which can be surrounded by the groove on some or all sides. Flexible circuit structures bridging the groove or a portion of the rigid printed circuit board can be used to hold the component mounting area in place. The flexible circuit structures can be provided as separate structures or as an integral part of the printed circuit board.

[0006] US 2010 / 206621 A1 shows a printed circuit board with a built-in component, including, among other things, an insulating plate, a first wiring pattern on an upper surface of the insulating plate and a plurality of electrodes on the upper surface of the insulating plate. A solder resist surrounds the electrodes. Disclosure of the invention

[0007] Against this background, the approach presented here provides a method for producing an electrical circuit module and an electrical circuit module according to the main claims. The measures listed in the dependent claims enable advantageous refinements and improvements of the device specified in the independent claim.

[0008] In the construction of a radar module, an arrangement of a contacting side of an electronic circuit manufactured using embedded wafer-level ball grid array technology on a second main side of a circuit carrier, on the first main side of which at least one antenna element is arranged, enables a considerably increased use of space on the electronic circuit carrier and thus an advantageous miniaturization of the radar module.

[0009] A method for manufacturing an electrical circuit module with the following steps is presented: Providing a circuit carrier with at least one antenna element arranged on a first main side of the circuit carrier for emitting electromagnetic radiation and at least one electrical contact arranged on a second main side of the circuit carrier; providing an electronic circuit manufactured using embedded wafer-level ball grid array technology; and arranging the electronic circuit with a contacting side of the electronic circuit on the second main side of the circuit carrier in order to electrically conductively contact the contacting side with the electrical contact.

[0010] The electrical circuit module can also be referred to as an electrical circuit device and can be used, for example, in a vehicle for radar detection of the vehicle's surroundings. According to one embodiment, the electrical circuit module can comprise a plurality of electrical and / or electronic components as well as carriers for the components. The circuit carrier can be a substrate for the mechanical fastening and electrical connection of the electronic circuit and, if appropriate, further components. For the electrical connection, the circuit carrier can have a plurality of electrical contacts in the form of electrically conductive layers or plies, in particular on the second main side. The main sides of the circuit carrier can be represented by the sides with the largest dimensions of the circuit carrier.The antenna element can be in the form of a planar antenna structure on the first main side of the circuit carrier.

[0011] The electronic circuit can be, for example, an integrated circuit or a semiconductor component. Embedded wafer-level ball grid array technology, or eWLB technology for short, is a special housing design for electronic circuits, particularly integrated circuits, in which a large number of contacts can be accommodated on the semiconductor die of the electronic circuit. The circuit housing is manufactured on an artificial wafer, which can provide additional space for further solder contacts through a potting compound formed around the semiconductor die. In particular, the electronic circuit is a high-frequency electronic circuit, particularly one manufactured using embedded wafer-level ball grid array technology.

[0012] The contacting side of the electronic circuit can be an electrically active or activatable side of the electronic circuit having at least one electrical contact.

[0013] The process can be carried out fully or partially automatically by a handling robot.

[0014] The circuit concept proposed here enables complete encapsulation of sensitive components, thus achieving high reliability. Furthermore, cost-intensive substrate and packaging technology can be replaced or reduced to a single, small component. Cost-effective production of the electrical circuit module is also possible by implementing a batch process in panel sizes using PCB-like technologies.

[0015] According to the concept presented here, electrical circuits or circuit modules with proven high reliability can be manufactured, in which line crossings can also be realized by integrating one or more line levels.

[0016] In a further development of the approach proposed here, for example, the integration of any necessary heat sinks or thermal vias into the electrical circuit module can be easily realized.

[0017] According to the invention, in the step of providing a circuit carrier, the circuit carrier is provided with at least a first circuit carrier layer and a second circuit carrier layer laminated onto the first circuit carrier layer. The first circuit carrier layer comprises the first main side of the circuit carrier, and the second circuit carrier layer comprises the second main side of the circuit carrier. Thus, the circuit carrier can be readily manufactured in a specification-dependent height and, in particular, can be provided with electrical lines laminated between the circuit carrier layers.

[0018] In particular, in the step of providing a circuit carrier, the first circuit carrier layer can comprise a material with a dielectric constant in a range between 2.5 and 3.5, in particular with a dielectric constant of 3, and / or with a dissipation factor value in a range between 0.0010 and 0.0025, in particular with a dissipation factor value of 0.0017. This embodiment ensures optimal high-frequency properties of the circuit carrier.

[0019] It is also advantageous if, in the step of providing a circuit carrier, the second circuit carrier layer comprises a textile semi-finished product pre-impregnated with reactive resins. This allows the circuit carrier to be manufactured quickly and cost-effectively.

[0020] In the step of providing a circuit carrier, the first circuit carrier layer and the second circuit carrier layer are also provided in the form of a foil. This allows the circuit carrier to be given advantageous flexibility and deformability in addition to a low overall height.

[0021] Furthermore, in the step of providing a circuit carrier, the first circuit carrier layer and / or the second circuit carrier layer are provided with a thickness in the range between 25 µm and 150 µm. This allows the circuit carrier to be realized, depending on the specifications, with an optimal balance between low overall height and optimal high-frequency properties.

[0022] According to a further embodiment, in the step of providing a circuit carrier, the circuit carrier can be provided with at least one electrical line laminated between the first circuit carrier layer and the second circuit carrier layer. In this way, the contacting options of the electrical circuit module can be easily increased and improved.

[0023] The method may include a step of producing the circuit carrier. A first circuit carrier layer may be provided for the circuit carrier, and a second circuit carrier layer may be laminated onto the first circuit carrier layer to firmly bond the first circuit carrier layer and the second circuit carrier layer.

[0024] According to a further embodiment, the method may include a step of fixing the electronic circuit to the circuit carrier in order to permanently attach the electronic circuit to the circuit carrier. In addition to optimal current transfer, this can ensure the robustness of the electrical circuit module during use.

[0025] For example, in the fixing step, at least one contact bump of the electronic circuit arranged on the contacting side of the electronic circuit can be attached or contacted to the electrical contact of the circuit carrier using flip-chip assembly technology, for example, by soldering, gluing, or welding. According to this embodiment, additional bonding wires for electrically contacting the electronic circuit can advantageously be dispensed with.

[0026] Alternatively, in the fixing step, at least one electrical line of the electronic circuit located on the contact side of the electronic circuit can be galvanically contacted to the electrical contact of the circuit carrier. This particularly fast and cost-effective fixing method also eliminates the need for bonding wires.

[0027] The method may further comprise a step of placing the circuit carrier with the second main side onto a liquid or pasty composite material to form a printed circuit board of the electronic circuit module embedding the electronic circuit. Thus, the electronic circuit can advantageously be completely surrounded by printed circuit board material and optimally protected from damage.

[0028] For example, the composite material can be a material that combines epoxy resin and fiberglass fabric. This design allows the circuit board to be robust and cost-effective.

[0029] It may also be advantageous if the method includes a step of milling out a portion of at least the circuit carrier that is laterally adjacent to the electronic circuit. This allows the electronic circuit to be at least partially exposed laterally and more easily deformed three-dimensionally. Furthermore, bending of antenna structures is also possible.

[0030] An electrical circuit module with the following features is also presented: a circuit carrier with at least one antenna element arranged on a first main side of the circuit carrier for emitting electromagnetic radiation and at least one electrical contact arranged on a second main side of the circuit carrier; and an electronic circuit manufactured using embedded wafer-level ball grid array technology, in particular an electronic high-frequency circuit manufactured using embedded wafer-level ball grid array technology, which is arranged with a contacting side of the electronic circuit on the second main side of the circuit carrier and makes electrically conductive contact with the electrical contact.

[0031] This embodiment of the invention in the form of an electrical circuit module also allows the problem underlying the invention to be solved quickly and efficiently.

[0032] Embodiments of the invention are illustrated in the drawings and explained in more detail in the following description. It shows: Fig. 1 a schematic representation of an electrical circuit module according to an embodiment; Fig. 2 a flowchart of a method for manufacturing an electrical circuit module according to an embodiment; Fig. 3 a schematic representation of an electrical circuit module according to a further embodiment; Fig. 4 a representation of an electrical circuit module in a semi-flexible design according to an embodiment; Fig. 5 a detailed section of the Fig. 4 shown circuit module in semi-flex design; and Fig. 6 a schematic representation of a vehicle with an electrical circuit module integrated into a body part of the vehicle according to an embodiment.

[0033] In the following description of advantageous embodiments of the present invention, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0034] Fig. 1 shows a schematic representation of an electrical circuit module 100 according to an embodiment of the concept presented here. The electrical circuit module 100 can be used, for example, in combination with a control unit for a vehicle as a radar sensor or part of a radar sensor and has a circuit carrier 102, an antenna element 104, and an electronic circuit 106.

[0035] The antenna element 104 is designed in the form of a planar antenna structure and is arranged on a first main side 108 of the circuit carrier 102. For example, the antenna element 104 is in the form of a foil. The antenna element 104 is designed to emit electromagnetic radiation in the high-frequency range. On a second main side 110 opposite the first main side 108, the circuit carrier 102 has an electrical contact 112 in the form of a conductor track.

[0036] The electronic circuit 106 has a contacting side 114 on one main side and is arranged with the contacting side 114 in electrically conductive contact with the electrical contact 112 on the second main side 110 of the circuit carrier 102. The exemplary electronic circuit 106 is Fig. 1 It is an integrated circuit (IC). The IC 106 is designed, for example, to supply the antenna element 104 with electrical power. The IC 106 is manufactured using the embedded wafer-level ball grid array (eWLB) technology explained above and accordingly has a plurality of electrical contacts on the contacting side 114.

[0037] In the Fig. 1 In the embodiment of the electrical circuit module 100 shown, the electronic circuit 106 is galvanically contacted with the contacting side 114 to the electrical contact 112 of the circuit carrier 102 and is thus permanently fixed to the circuit carrier 102 with a large current transfer area.

[0038] Fig. 2 shows a flowchart of a method 200 for manufacturing an electrical circuit module. The method 200 can be used to manufacture a variant of the Fig. 1 shown electrical circuit module manually or by means of a handling robot.

[0039] In a manufacturing step 202, a structured circuit carrier is produced using known flex-foil technology. In particular, in the manufacturing step 202, the circuit carrier is formed as a laminate of multiple circuit carrier layers or films made of the same or different materials. Preferably, a substrate material with a low dielectric constant and a low loss factor is used as the dielectric, since suitable prepreg materials required for multilayer formation of the circuit carrier are available. Depending on the specific high-frequency requirements, the individual layers are produced in a predetermined thickness in a range between 25 µm and 150 µm, so that the maximum total thickness of the circuit carrier is approximately 300 µm. The circuit carrier produced in step 202 is also referred to as an interposer.

[0040] According to one embodiment, in the manufacturing step 202, at least one antenna element is attached to a first main side of the circuit carrier, and furthermore, electrical contacts are structured or attached, in particular, to a second main side of the circuit carrier. In the manufacturing step 202, electrical contacts or electrical lines can also be laminated between individual layers of the circuit carrier.

[0041] In a provision step 204, the circuit carrier is provided. In a further provision step 206, at least one electronic circuit manufactured using embedded wafer-level ball grid array technology is provided.

[0042] In a subsequent step of arranging 208, the antenna element is arranged on a first main side of the circuit carrier and the electronic circuit is arranged on the second main side of the circuit carrier in such a way that it contacts the electrical contact of the circuit carrier with a contacting side.

[0043] In a fixing step 210, the electronic circuit and, if applicable, other electrical or electronic high-frequency components are mounted and fixed to the circuit carrier. Known technologies such as soldering the package or IC are possible here. Alternatively, by omitting the contact bumps on the package, contacting can be achieved directly during the fabrication of the conductor structures and, if necessary, during the processing of vias in the circuit carrier using galvanic contacts.

[0044] In a placement step 212, the circuit carrier or interposer is placed with its second main side onto a liquid or pasty composite material in order to laminate and contact the interposer to additional circuit board cores using printed circuit board technology. The electronic circuit is then embedded in the circuit board.

[0045] In an optional milling step 214, areas to the side of the electronic circuit are milled free to form so-called semi-flex areas of the electrical circuit module.

[0046] In an exemplary final step 216 of the method 200, a connector is mounted on the finished circuit board for a possible connection of the electrical circuit module to a voltage source.

[0047] Fig. 3 shows a schematic representation of a further embodiment of the electrical circuit module or high-frequency module 100 manufactured according to the approach proposed here using single-embedding technology. Fig. 3 shows a variant of the circuit module 100, in which the circuit carrier 102 forms a top side of the finished printed circuit board module and the electronic circuit 106 is embedded in a composite mass 300 of the printed circuit board module.

[0048] As already explained above, the circuit carrier 102 is present as a laminate and comprises a first circuit carrier layer 302 and a second circuit carrier layer 304 laminated onto the first circuit carrier layer 302. Both circuit carrier layers 302, 304 are in the form of films with a thickness in the range between 25 µm and 150 µm. For example, the first circuit carrier layer 302 has a thickness of 50 µm and the second circuit carrier layer 304 has a thickness of 75 µm. The entire circuit carrier 102 thus has a thickness of 125 µm. The circuit carrier layers 302, 304 can each be formed from one layer or from multiple layers of the respective laminate material used.

[0049] A main side of the first circuit carrier layer 302 facing away from the second circuit carrier layer 304 forms the first main side 108 of the circuit carrier 102, and a main side of the second circuit carrier layer 304 facing away from the first circuit carrier layer 302 forms the second main side 110 of the circuit carrier 102.

[0050] In the Fig. 3 In the embodiment of the high-frequency module 100 shown, the first circuit carrier layer 302 forming the dielectric or part of the dielectric of the circuit carrier 102 was made of a material with a dielectric constant of 3. The use of a material with a dielectric constant in a range between 2.5 and 3.5 is generally considered advantageous here.

[0051] Specifically, the Fig. 3 In the exemplary embodiment shown, a laminate is used to produce the first circuit carrier layer 302, which laminate comprises high-quality substrate materials with special material properties. The required properties of the material to be used for the first circuit carrier layer 302, in order to make the material suitable for applications, particularly in the millimeter-wave frequency range, include a dielectric constant with the lowest possible loss, furthermore dielectric properties that are stable over a wide frequency and temperature range, a dielectric constant that is stable up to 20 GHz between -55 and +125°C, and a low loss factor of at most 0.0017.

[0052] The material used for the second circuit carrier layer 304 in the Fig. 3 In the embodiment of the electrical circuit module 100 shown, a high-frequency-capable so-called prepreg material is used to form a backplane for the first circuit carrier layer 302. The prepreg material (prepreg: short for preimpregnated fibers) is, for example, a composite material made of fibers in the form of a woven fabric and pre-crosslinked reactive resins with which the fibers are pre-impregnated. The second circuit carrier layer 304, formed from the prepreg material as a textile semi-finished product, is cured under temperature and pressure during the manufacturing process of the circuit carrier 102 and firmly connected to the first circuit carrier layer 302 or laminated thereto. To form a laminate, a first circuit carrier layer 302 made of a first suitable material can be combined with a second circuit carrier layer 304 made of a further material that differs from the first material.A combination of different materials is also conceivable as the material for the second circuit carrier layer 304, e.g., a Ro3003 HF material.

[0053] In the Fig. 3 In the embodiment of the electrical circuit module 100 shown, a second antenna element 306 is arranged on the first main side 108 of the circuit carrier 102, spaced apart from the first antenna element 104. The antenna elements 104, 306 are flat, foil-shaped antenna structures 104, 306. The antenna elements 104, 306 together form a broadband antenna of the electrical circuit module 100 for emitting radar radiation.

[0054] On the second main side 110 of the circuit carrier 102, electrical contacts 112 are arranged or structured in the form of conductor tracks of different lengths and at different distances. Furthermore, in the Fig. 3 In the embodiment of the electrical circuit module 100 shown, a plurality of five further electrical contacts 112 in the form of spaced-apart electrical conductors are laminated into the second circuit carrier layer 304 at a short distance from the first circuit carrier layer 302.

[0055] The electronic circuit or high-frequency circuit 106 manufactured using embedded wafer-level ball grid array technology is in the Fig. 3 In the embodiment shown, it is implemented as an MMIC (monolithic microwave integrated circuit). The MMIC 106 is arranged opposite the antenna elements 104, 306 on the underside or second main side 110 of the circuit carrier 102. The MMIC 106 is positioned on the second main side 110 such that, with respect to the circuit carrier 102, it partially overlaps the first antenna element 104.

[0056] In the Fig. 3 In the embodiment shown, the MMIC 106 is mounted using flip-chip assembly technology on the underside 110 of the circuit carrier 102. Because the MMIC 106 is manufactured using eWLB technology, numerous contact bumps 308 present on the contacting side 114 of the MMIC 106 are contacted, for example by means of solder connections, to electrical contacts 112 positioned correspondingly on the second main side 110 of the circuit carrier 102. For example, a number of electrical contacts 112 corresponds to a number of solder points or contact bumps 308 present on the contacting side 114 of the electronic circuit 106.

[0057] In the Fig. 3 In the embodiment shown, a gap between the contact side 114 of the MMIC 106 and the second main side 110 of the circuit carrier 102, which gap is predetermined by the height of the contact bumps 308, is filled with a so-called underfiller 310. According to embodiments, the underfiller 310 is a conductive or non-conductive adhesive, for example, an NCA adhesive. The underfill process can also be carried out directly with the laminating resin material using appropriate lamination parameters.

[0058] In the Fig. 3 In the exemplary high-frequency module 100 shown, the circuit carrier 102 in conjunction with the composite material 300 forms a printed circuit board 311, in which the electronic circuit 106 is embedded in one or more layers of the composite material 300, which connect to the second main side 110 of the circuit carrier 102. In the case of the electrical circuit module 100 in Fig. 3 The composite material 300 used is a composite material that combines epoxy resin and fiberglass fabric. Specifically, the composite material 300 is an FR4-class material, which is characterized by its flame-retardant and flame-resistant properties.

[0059] During the production of the electrical circuit module 100, the composite material 300 was combined in a pasty or liquid state with the circuit carrier 102 by placing the circuit carrier or interposer 102 with the second main side 110 onto the composite material 300 and pressing the electronic circuit 106 into the composite material 300. Subsequently, the circuit carrier 102 was laminated onto the composite material 300. In the Fig. 3 In the cured state of the circuit board 311 shown, the electronic circuit 106 is thus firmly enclosed on all sides by the composite material 300 and embedded therein, with the exception of the contacting side 114.

[0060] In the Fig. 3 In the exemplary embodiment of the high-frequency circuit 100 shown, metal components 312 in the form of metal layers are introduced or laminated into the composite material 300 to dissipate heat from the electrical and / or electronic components, in particular the MMIC 106. Thus, the electronic circuit 106 can advantageously be cooled, in particular, via its rear side opposite the contacting side 114, but also by so-called thermal bumps on the front side. Instead of the metal layers 112 or in addition to the metal layers 112, additional electrical contacts 112 can be incorporated into the composite material 300 according to exemplary embodiments.

[0061] In the Fig. 3 In the embodiment of the electronic circuit module 100 shown, further conductor tracks 112 and / or metal layers 312 are provided on a main side 314 of the layer of the printed circuit board composite material 300 facing away from the circuit carrier 102.

[0062] Overall, the Fig. 3 The exemplary high-frequency module 100 shown, including the antenna structures 104, 306, has ten layers, wherein the antenna structures 104, 306 have a first layer, the first circuit carrier layer 302 has a second layer, the electrical contacts 112 laminated between the circuit carrier layers 302, 304 have a third layer, the second circuit carrier layer 304 has a fourth layer, the electrical contacts 112 arranged on a main side of the composite mass layer 300 adjacent to the circuit carrier 102 have a fifth layer, the composite mass layer 300 has a sixth layer, a first metal layer 312 in the composite mass layer 300 has a seventh layer, a second metal layer in the composite mass layer 300 has an eighth layer, the second main side 314 of the composite mass 300 has a ninth layer, and the electrical contacts 112 arranged on the main side 314 of the composite mass layer 300 arranged electrical contacts 112 forms a tenth layer of the module 100.

[0063] In the Fig. 3 In the embodiment of the electrical circuit module 100 shown, copper was used as the material for the electrical contacts or conductor tracks 112 and the metal components 312. Other materials with good conductivity can also be used.

[0064] The representation of the high-frequency module 100 constructed according to the concept proposed herein of embedding radar eWLB packages 106 and producing multilayer RF structures 102, 300 in Fig. 3 illustrates the significantly increased space utilization on the electronic circuit carrier 102 by mounting the high-frequency IC 106 and, if applicable, evaluation electronics below the antenna structures 104, 306. The dimensions of the antennas 104, 306 determine the size of the package 106. The complete encapsulation of sensitive components such as the IC 106 creates a high level of reliability for the electrical circuit module 100. In particular, the technology proposed here can significantly improve copper adhesion to the substrate materials 300, 302, 304 due to the stress caused by the assembly of the high-frequency IC 106.

[0065] The particularly in Fig. 3 The multi-layer structure of the high-frequency substrates 300, 302, 304 shown enables the advantageous increased miniaturization of the radar module 100. In particular, the prepreg materials used enable the production of one or more superimposed high-frequency suitable layers 304. According to the concept presented here, the radar IC 106 can be mounted directly on one of these layers 304 without requiring area on the top side 108 of the circuit carrier 102, where the area-determining antennas 104, 306 are attached. For this purpose, as in Fig. 3 As shown, the packaged eWLB radar IC 106 is mounted on the bottom side 110 of the radio frequency stack 102 and then laminated into the circuit board 311 during the manufacture of the remaining circuit board 311.

[0066] According to the circuit concept presented here, the use of specially prepared circuit boards, which, for example, require cavities, as well as various complex wire bond connections, can be dispensed with. Complex, high-frequency-compatible through-holes through the circuit board 311, which are detrimental to high-frequency performance, are also unnecessary.

[0067] By manufacturing the high-frequency module 100 shown here using flex-foil technology, the finished module 100 can be deformed in spatial directions despite its relatively large height, e.g., for installation in complex or curved body parts of a vehicle.

[0068] In addition, milling free parts of the circuit carrier 102 enables bending of antenna structures on the RF laminate 302.

[0069] Fig. 4 shows a representation of a variant of the electrical circuit module 100 in the so-called SemiFlex design. In this case, parts of the printed circuit board 311 adjacent to the sides of the electronic circuit 106 are milled away, thus exposing the electronic circuit 106 except for narrow webs for supporting the electronic circuit 106. This Fig. 4 The subsequent processing of the finished high-frequency module 100 shown in FIG. 1 enables the circuit board 311 to be deformed, from which the high-frequency IC 106 is excluded and thus protected from the risk of breakage. Such a deformable circuit board 311 can be easily inserted into small and narrow installation spaces, e.g., in a vehicle body. Fig. 4 The SemiFlex structure shown can also be called a Montageflex structure.

[0070] If the outer layers, preferably those on the back of the circuit board 311, are used as so-called base layers for a so-called SemiFlex layer, they can be used by means of a plug contact for a simple connection of the radar module 100 to a control unit of a vehicle.

[0071] Fig. 5 shows a detailed section of the Fig. 4 shown electrical circuit module 100 in SemiFlex design.

[0072] The Figuren 1 , 3 , 4 und 5 The exemplary electrical circuit modules 100 shown are constructed, according to exemplary embodiments, on the basis of high-frequency foils structured according to known printed circuit board technologies. Depending on the specification, the foils can be manufactured in one, two, or even multiple layers. The assembly of the electronic and high-frequency components can be carried out using cost-effective planar technology. Protection of the electronics can be easily achieved by laminating the RF components. According to exemplary embodiments, multi-layer structures for the evaluation electronics are manufactured using lamination technology and galvanic connection of the interposer. In principle, the arrangement of several RF modules on one foil is feasible.

[0073] Fig. 61 shows a schematic representation of a possible use of the electrical circuit module 100 manufactured according to the concept presented here as a radar sensor or part of a radar sensor in a vehicle 600. The vehicle 600 is a road vehicle 600 such as a passenger car or truck. The electrical circuit module 100 is concealedly installed in a bumper 602 of the vehicle 600 for radar detection of objects in the vicinity of the vehicle 600.

[0074] The electrical circuit module 100 is connected to a central control unit 604 of the vehicle 600 via a cable system, e.g., a CAN bus, of the vehicle 600.

[0075] If an embodiment includes an "and / or" link between a first feature and a second feature, this should be read as meaning that the embodiment according to one embodiment has both the first feature and the second feature and according to another embodiment has either only the first feature or only the second feature.

Claims

1. Method (200) for producing an electrical circuit module (100), wherein the method (200) comprises the following steps: providing (204) a circuit carrier (102) having at least one antenna element (104; 306), arranged on a first main side (108) of the circuit carrier (102), for emitting electromagnetic radiation and at least one electrical contact (112), arranged on a second main side (110) of the circuit carrier (102); providing (206) an electronic circuit (106), produced using embedded wafer level ball grid array technology, in the form of an electronic high-frequency circuit, produced using embedded wafer level ball grid array technology; and arranging (208) the electronic circuit (106) by way of a contact-making side (114) of the electronic circuit (106) on the second main side (110) of the circuit carrier (102) in order to electrically conductively contact-connect the contact-making side (114) to the electrical contact (112), characterized in that, in the step of providing (204) a circuit carrier (102), the circuit carrier (102) is provided with at least one first circuit carrier layer (302) and a second circuit carrier layer (304) laminated to the first circuit carrier layer (302), wherein the first circuit carrier layer (302) comprises the first main side (108) of the circuit carrier (102) and the second circuit carrier layer (304) comprises the second main side (110) of the circuit carrier (102), wherein, in the step of providing (204) a circuit carrier (102), the first circuit carrier layer (302) and the second circuit carrier layer (304) are provided designed as a film having a thickness in the range between 25 µm and 150 µm.

2. Method (200) according to Claim 1, wherein, in the step of providing (204) a circuit carrier (102), the first circuit carrier layer (302) comprises a material having a dielectric number in a range between 2.5 and 3.5, in particular having a dielectric number of 3, and / or having a loss factor value in a range between 0.0010 and 0.0025, in particular having a loss factor value of 0.0017.

3. Method (200) according to either one of the preceding claims, wherein, in the step of providing (204) a circuit carrier (102), the second circuit carrier layer (304) comprises a semi-finished textile product pre-impregnated with reaction resins.

4. Method (200) according to any one of the preceding claims, wherein, in the step of providing (204) a circuit carrier (102), the circuit carrier (102) is provided with at least one electrical line (112) laminated between the first circuit carrier layer (302) and the second circuit carrier layer (304).

5. Method (200) according to any one of the preceding claims, having a step of producing (202) the circuit carrier (102), wherein a first circuit carrier layer (302) is provided for the circuit carrier (102) and a second circuit carrier layer (304) for the circuit carrier (102) is laminated to the first circuit carrier layer (302) in order to connect the first circuit carrier layer (302) and the second circuit carrier layer (304) in an integrally bonded manner.

6. Method (200) according to any one of the preceding claims, having a step of fixing (210) the electronic circuit (106) to the circuit carrier (102) in order to permanently attach the electronic circuit (106) to the circuit carrier (102).

7. Method (200) according to Claim 6, wherein, in the fixing step (210), at least one bump (308) of the electronic circuit (106) arranged on the contact-making side (114) of the electronic circuit (106) is attached, in particular soldered, adhesively bonded or welded, to the electrical contact (112) of the circuit carrier (102).

8. Method (200) according to Claim 6, wherein, in the fixing step, at least one electrical line of the electronic circuit (106) arranged on the contact-making side (114) of the electronic circuit (106) is electrically contact-connected to the electrical contact (112) of the circuit carrier (102).

9. Method (200) according to any one of the preceding claims, having a step of applying (212) the circuit carrier (102) by way of the second main side (110) to a liquid or pasty composite material (300) in order to form a printed circuit board (311) of the electronic circuit module (100) embedding the electronic circuit (106).

10. Method (200) according to Claim 9, wherein, in the application step (212), the circuit carrier (102) is applied to a composite material (300) comprising epoxy resin and glass fibre fabric.

11. Method (200) according to any one of the preceding claims, having a step of milling (214) a section of at least the circuit carrier (102) laterally adjacent to the electronic circuit (106) in order to at least partially expose the electronic circuit (106) laterally and enable bending of antenna structures.

12. Electrical circuit module (100) having the following features: a circuit carrier (102) having at least one antenna element (104; 306), arranged on a first main side (108) of the circuit carrier (102), for emitting electromagnetic radiation and at least one electrical contact (112), arranged on a second main side (110) of the circuit carrier (102); and an electronic circuit (106), produced using embedded wafer level ball grid array technology, in the form of an electronic high-frequency circuit, produced using embedded wafer level ball grid array technology, said high-frequency circuit being arranged on the second main side (110) of the circuit carrier (102) by way of a contact-making side (114) of the electronic circuit (106) and electrically conductively contact-connecting the electrical contact (112), characterized in that the circuit carrier (102) has at least one first circuit carrier layer (302) and a second circuit carrier layer (304) laminated to the first circuit carrier layer (302), wherein the first circuit carrier layer (302) comprises the first main side (108) of the circuit carrier (102) and the second circuit carrier layer (304) comprises the second main side (110) of the circuit carrier (102), wherein the first circuit carrier layer (302) and the second circuit carrier layer (304) are designed as a film having a thickness in the range between 25 µm and 150 µm.