METHOD, DEVICE AND COMPUTER PROGRAM FOR GENERATING A WEAKNESS LINE IN A SURFACE OF A COMPONENT

Description

[0001] The present approach relates to a method and a device for generating a line of weakness in a surface of a component for a vehicle and a corresponding computer program product.

[0002] DE 10 2013 104 138 B3 describes a method for introducing a line of weakness by removing material from a fibrous coating material.

[0003] Document US 2019 / 111522 A1 (disclosing the preamble of claim 1) discloses a method for inserting a fracture line by a pulsed laser beam through material removal on a cover material.

[0004] The document US 5 882 572 A discloses a method for producing a linear attenuation by means of a laser.

[0005] The document US 2018 / 133841 A1 discloses a method and a device for producing a fracture line in a planar workpiece along a predefined contour by removing material using a laser. Disclosure of the invention

[0006] Against this background, the present approach presents a method for generating a weakening line in a surface of a component for a vehicle and a device for generating a weakening line in a surface of a component for a vehicle according to the main claims. Advantageous embodiments emerge from the respective subclaims and the following description.

[0007] The advantages achievable with the presented approach are that a weakening line in a surface of a component for a vehicle can be generated particularly quickly. According to the invention, a method for generating a weakening line in a surface of a component, a device, a computer program, and a machine-readable storage medium with such a program are defined in the respective claims 1, 9, 10, and 11.

[0008] Further embodiments of the invention are defined in the dependent claims.

[0009] A method for creating a weakening line in a surface of a component for a vehicle comprises a guiding step and a skipping step. In the guiding step, an ablation device for ablating a material from the surface is guided over a plurality of sections of a predefined linear contour using an activated laser beam to generate a desired wall thickness for at least one of the sections in order to create the weakening line. In the skipping step, the section is skipped if the section has the desired wall thickness.

[0010] The component can be a cover element for a vehicle airbag, which can be provided with predetermined breaking points in the area of ​​airbag flaps using the method presented here. The surface can be one or more plastics such as polypropylene (PP), thermoplastic polyolefin (TPO), or polyurethane, so that when the component is installed in the vehicle, it is arranged on a side of the component facing away from the vehicle occupants, i.e., invisible to vehicle occupants. The ablation device can be a laser, which carries out the ablation of the material by means of the laser beam by heating the material. To carry out a movement, the ablation device can further comprise a scanner, for example a galvanometer scanner.The majority of the sections of the predefined linear contour can be shaped differently or uniformly in any way; for example, at least one section can be shaped as a straight or curved line. The sections can be arranged so as to at least partially merge directly into one another to create a continuous weakening line, or at least partially separated from one another to create a weakening line interrupted / perforated at any distance between the sections. The distances can be the same or different from one another. Each of the sections can have a desired wall thickness, which can be the same or different from one another. The method presented here makes it possible to skip finished sections that have reached their desired wall thickness in order to shorten the machining process for creating the weakening line.In the skip step, the section can be skipped, meaning the removal device is not moved over the section. In the skip step, the removal device can be moved to a subsequent section, omitting the section. In the skip step, the contour is therefore actively modified, in particular shortened.

[0011] During the skip step, one laser beam output can be deactivated. This ensures that no material is removed during the skip, which is used to bridge a distance to a subsequent section.

[0012] It is further advantageous if the method further comprises a generation step in which a lead section is generated for a subsequent section of the contour following the section, wherein the removal device jumps to the lead section in the skipping step in order to be moved over the lead section and / or in which a follow-up section is generated for a preliminary section of the contour arranged before the section, wherein the removal device is moved over the follow-up section before the skipping step. The lead section can be generated as a section between the section and the subsequent section. In the skipping step, the removal device can jump to a start of the lead section facing the section in order to then be moved over the lead section to an end of the lead section facing the subsequent section.Accordingly, in the generation step, the follow-up section can be generated between the preliminary section and the section, and / or the removal device can be moved, before the skipping step, over a start of the follow-up section facing the preliminary section to an end of the follow-up section facing the section. When the removal device is moved over the preliminary section and / or over the follow-up section, an output of the laser beam can be deactivated. Such preliminary sections and / or follow-up sections can be generated for all sections of the contour. In the case of two directly connected sections, the removal device can jump to a start of a preliminary section of a subsequent section following the section after moving over an end of a follow-up section of a preceding section.Not only when skipping, but also when jumping between two consecutive, separately arranged sections of the contour, the ablation device can accordingly only jump to the lead section of a subsequent section and / or only jump after moving over the follow-up section of a section arranged before the subsequent section. For example, jumping / skipping can only ever take place between the ends of lead sections and / or the beginnings of follow-up sections. Such a lead section and / or follow-up section ensures that the ablation device is always guided onto the sections from the same direction, regardless of when jumping or skipping occurs after completion of a section. Moving over the lead section and / or follow-up section also creates time for synchronization between the scanner and laser.

[0013] In the generation step, the lead section can be generated that is directly connected to the subsequent section and / or the follow-up section can be generated that is directly connected to the preliminary section. For example, in the generation step, the lead section can be generated that is directly connected to the subsequent section as an extension of the latter and / or the follow-up section can be generated that is directly connected to the latter as an extension of the preliminary section. For example, an orientation of the lead section and / or the follow-up section can correspond to that of the associated section. If, for example, a section is shaped to run straight, its lead section and / or the follow-up section can also be shaped straight. In the case of a curved section, its lead section and / or the follow-up section can also be shaped to curve accordingly.

[0014] According to one embodiment, in the generation step, the lead section can be generated with a lead length that is shorter than the length of the subsequent section, and / or the trailing section can be generated with a trailing length that is shorter than the length of the preceding section. The lead section and / or the trailing section can be very short, since they serve only to align the removal device. Unnecessarily long paths can thus be avoided.

[0015] In the skipping step, the removal device can be moved directly from a preliminary section of the contour arranged before the section to a subsequent section of the contour following the section. In this way, the removal device can be moved in the skipping step along the shortest path from the preliminary section to the subsequent section, for example in a straight line without unnecessary detours. In this case, the removal device can still be moved in the skipping step from the end of the follow-up section of the preliminary section to the beginning of the preliminary section of the subsequent section. When skipping, the path with the shortest distance between a preliminary section and a section and / or the path with the shortest distance between a section and a subsequent section can advantageously always be selected.

[0016] It is also advantageous if the movement speed of the removal device is higher in the skipping step than in the guiding step. This allows the removal device to be moved at maximum speed in the skipping step. The removal device can also be moved at maximum speed when skipping between consecutive, separate, unconnected sections. Since no material processing is planned during skipping and jumping, a particularly fast movement speed can be achieved to save time. In contrast, in the guiding step, in which the surface is removed, a slower movement speed suitable for processing can be achieved for the removal device.

[0017] The method may include a further skipping step, in which a further section of the contour is skipped if the further section has the desired wall thickness or a further desired wall thickness. This serves to further save time. Accordingly, all sections that have their desired wall thickness can be skipped.

[0018] According to one embodiment, the steps of the method can be repeated until all sections of the contour each have a specific target wall thickness. This allows a complete weakening line to be created within a short period of time. To achieve the target wall thickness for the individual sections, the removal device can be repeatedly moved over the sections, whereby repeated movement over the same section can only be repeated after a defined period of time after machining. Such a time delay between the scanning cycles / machining cycles can allow the surface to cool down to prevent overheating.

[0019] A device is designed to carry out or implement the steps of a variant of a method presented here in appropriate devices. This variant of the approach in the form of a device also allows the task underlying the approach to be solved quickly and efficiently.

[0020] In this case, a device can be understood as an electrical device that processes sensor signals and outputs control and / or data signals depending on them. The device can have an interface, which can be implemented in hardware and / or software. In a hardware implementation, the interfaces can, for example, be part of a so-called system ASIC, which contains a wide variety of functions of the device. However, it is also possible for the interfaces to be separate integrated circuits or to consist at least partially of discrete components. In a software implementation, the interfaces can be software modules that are present, for example, on a microcontroller alongside other software modules.

[0021] Also advantageous is a computer program product with program code that can be stored on a machine-readable medium such as a semiconductor memory, a hard disk memory or an optical memory and is used to carry out the method according to one of the embodiments described above when the program product is executed on a computer or a device.

[0022] The approach is explained in more detail below using the attached drawings. They show: Fig. 1 a schematic representation of a contour for a line of weakness. Fig. 2 a comparison of schematically illustrated contours 100 for processing with a device according to an embodiment for producing a weakening line in a surface of a component; Fig. 3a schematic representation of a device according to an embodiment for generating a weakening line in a surface of a component; Fig. 4 a schematic representation of a device according to an embodiment for generating a weakening line in a surface of a component; and Fig. 5 a flowchart of a method according to an embodiment for generating a weakening line in a surface of a component.

[0023] In the following description of advantageous embodiments of the present approach, the same or similar reference numerals are used for the elements shown in the various figures and having a similar effect, whereby a repeated description of these elements is omitted.

[0024] Fig. 1 shows a schematic representation of a contour 100 for a line of weakness.

[0025] Described in Fig. 1A common machining process for producing the weakening line using a laser beam along the contour 100. The contour 100 is divided into three segments ID0, ID1, ID2, as an example. A controlled movement of the laser beam is usually achieved via a galvanometer scanner. The segments ID0, ID1, ID2, which indicate the weakening lines to be produced, are in Fig. 1 represented by solid outlines / lines. The dashed outlines / lines J indicate each jump of the laser beam to a point of the next ablation. During the jumps J, the laser beam is switched off, as an example.

[0026] In the example shown here, processing using the laser beam starts at point S of segment ID0 and is guided via point U to point T of segment ID0. At point T, a jump J occurs to point U. The laser beam is then guided via segment ID1 to point V. At point V, a jump J occurs to point W of segment ID2. The laser beam is then guided from point W via point V to point X of segment ID2. At point X, a jump J occurs to point S of segment ID0. At point S, the process just described is repeated until all segments ID0, ID1, ID2 have their respective target wall thicknesses.

[0027] In the example described here, segment ID0 reaches its target wall thickness after 11 machining cycles, segment ID1 reaches its target wall thickness after 16 cycles, and segment ID2 reaches its target wall thickness after 14 cycles. In the example described here, the maximum number of cycles is 16. This means that the laser beam will traverse the entire contour 100 times, regardless of whether a segment ID0, ID1, or ID2 is already rated as "OK" based on the settings, i.e., with the desired target wall thickness. Currently, it is only possible to switch off the laser at individual removal points if the predefined value for the remaining wall thickness has already been reached at that point.

[0028] The jump J between ID0 and ID1 or between ID1 and ID2 would normally run in a straight line along the processing line. This is shown only for clarity in Figure 1 shown as a curve.

[0029] In the example described here, long cycle times are achieved by constantly repeating the scanning movement and frequently switching the laser on and off.

[0030] Fig. 2 shows a comparison of schematically illustrated contours 100 for processing with a device according to an embodiment for producing a weakening line in a surface of a component. The device is shown in the Figures 3 and 4 shown.

[0031] According to one exemplary embodiment, at least one of the contours 100 can be used to create the weakening line in the surface of a cover element of an airbag cover of a vehicle airbag, for example, as marked there. According to this exemplary embodiment, the contour 100 in image section a) has, merely by way of example, seven consecutive sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 , for which the same or any desired different desired wall thicknesses are provided.

[0032] The device for generating the weakening line in the surface is designed to guide a removal device for removing a material from the surface over the plurality of sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the predefined linear contour 100 using an activated laser beam in order to generate a desired wall thickness for at least one of the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 in order to generate the weakening line. The device is further designed to cause the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 to be skipped if the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 has the desired wall thickness.

[0033] According to this exemplary embodiment, the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 are shaped differently in any desired way, for example the second section M 2 is straight and / or the fourth section M 4 is V-shaped and / or the sixth section M 6 is shaped as a curved line. According to one exemplary embodiment, the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 are arranged at least partially directly into one another in order to create a continuous weakening line or at least partially separately from one another in order to create a weakening line that is interrupted / perforated at any desired distances between the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7. The distances are the same or different from one another. According to this embodiment, each of the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 has a desired wall thickness, which are either the same or different from one another.According to this exemplary embodiment, sections M 1 , M 3 , M 5 , M 7 already have their desired target wall thicknesses, which is why the device causes these sections M 1 , M 3 , M 5 , M 7 to be skipped in order to shorten the machining process for producing the weakening line. When skipping, sections M 1 , M 3 , M 5 , M 7 are each omitted, i.e. the removal device is not guided over sections M 1 , M 3 , M 5 , M 7. When skipping, the removal device is guided to a subsequent section following the skipped section M 1 , M 3 , M 5 , M 7, omitting the skipped section M 1 , M 3 , M 5 , M 7. In the process, contour 100 is actively changed, here shortened. The skipped sections M 1 , M 3 , M 5 , M 7 are in . Fig. 2 not shown, the dashed arrows indicate jumps J when skipping the sections M 1 , M 3 , M 5 , M 7 .

[0034] According to this embodiment, the device is further designed to deactivate an output of the laser beam when skipping.

[0035] According to this exemplary embodiment, the device is designed to move the removal device during skipping on a direct path from a preliminary section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 arranged in front of the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 to a subsequent section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 following the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7. According to this exemplary embodiment, the device is further configured to increase a movement speed of the removal device during skipping compared to a movement speed when guiding over the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 during processing. According to this exemplary embodiment, the device is configured to cause all sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 to be skipped as soon as they each have their desired wall thickness.

[0036] According to this exemplary embodiment, the device is designed to guide the removal device for removing the material of the surface over the majority of the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 using the activated laser beam and to repeat the skipping of the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 with the achieved target wall thickness until all sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 each have a specific target wall thickness. According to one embodiment, the device enables repeated guidance over the same section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 at the earliest after a defined period of time after processing.

[0037] Figure section b) describes the generation of a pre-travel path (VLS) and / or post-travel path (NLS). When the switched-off laser beam jumps J to the next processing section (M 2 , M 4 , M 6 ), it is necessary to synchronize the mechanical movement with the time the laser is switched on. The laser beam should hit each ablation point at the same position with the same focus during each repeated scanning movement. Only then can it be guaranteed that the material in each hole is continuously removed up to the defined value. Skipping completed sections requires flexible synchronization between laser operation and beam position. The pre-travel path (VLS) and / or post-travel path (NLS) can create time for synchronization.According to one embodiment, the device for this purpose has a generating device which is designed to generate the lead section VLS for a subsequent section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100 following the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 , wherein the device is designed to move the removal device when jumping over to the lead section VLS in order to move the removal device over the lead section VLS and / or wherein the generating device is designed to generate the follow-up section NLS for a preliminary section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 arranged before the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 of the contour 100, wherein the device is designed to move the removal device over the follow-up section NLS before skipping.

[0038] According to this exemplary embodiment, the lead section VLS is generated as a section between the sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 and their subsequent sections M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7. According to this exemplary embodiment, the device is designed to move the removal device when skipping to a start of the lead section VLS facing the skipped section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7, in order to then move it over the lead section VLS to an end of the lead section VLS facing the subsequent section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7. Accordingly, the generating device according to this embodiment is designed to generate the follow-up section NLS between the preliminary section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 and the skipped section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7.According to this exemplary embodiment, the device is designed to move the removal device, before skipping, over a start of the follow-up section NLS facing the preliminary section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 to an end of the follow-up section NLS facing the section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7. When moving the removal device over the preliminary section VLS and / or over the follow-up section NLS, the device according to this exemplary embodiment deactivates an output of the laser beam. According to this exemplary embodiment, the generating device is designed to generate the lead section VLS, which is directly connected to the subsequent section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 and / or to generate the trailing section NLS, which is directly connected to the lead section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7.For example, according to one embodiment, the generating device generates the lead section VLS, which is directly connected to the subsequent section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 as an extension thereof, and / or the trailing section NLS, which is directly connected to the preceding section M 1 , M 2 , M 3 , M 4 , M 5 , M 6 , M 7 as an extension thereof. Thus, according to one embodiment, the lead section VLS and / or the trailing section NLS for a straight section, here sections M 1 , M 4 , is likewise generated as straight according to one embodiment. Correspondingly, the lead section VLS and / or the trailing section NLS for a curved section, here section M 6 , is likewise generated as correspondingly curved according to one embodiment.

[0039] According to one embodiment, the generating device is further configured to generate the lead section VLS, the lead length of which is shorter than a length of the subsequent section and / or to generate the trailing section NLS, the trailing length of which is shorter than a length of the preliminary section.

[0040] Image section c) optically corresponds to image section a), whereby image section c) according to this exemplary embodiment has an eighth section M 8 . The V-shaped section M 4 in image section a) is divided in image section c) into two interconnected straight sections M 4 , M 8 , which together form the V shape. The eighth section M 8 is arranged according to this exemplary embodiment between the fourth section M 4 and the fifth section M 5 .

[0041] In image section d), according to the description in image section b), the generation of a follow-up section NLS for the now straight fourth section M 4 and the generation of a lead-up section VLS for the eighth section M 8 are shown. In the two directly connected sections M 4 , M 8 , the removal device according to this embodiment jumps, after moving over an end of the follow-up section NLS of the preceding section M 4 , to a start of the lead-up section VLS of the subsequent section M 8 following section M 4 .

[0042] In image sections b) and d), the pre-travel (VLS) and post-travel (NLS) paths are generated for the sections to be processed, M 2 , M 4 , M 6 , and M 8 , respectively. These paths serve to accelerate and decelerate the movement of the laser beam. These pre-travel (VLS) and post-travel (NLS) paths with the laser switched off provide time to synchronize laser operation and the beam position. This ensures that the laser hits the first ablation point at exactly the same location, regardless of the direction from which the beam "jumps."

[0043] Furthermore, according to one embodiment, the time period / time window of the pre-travel section (VLS) is used to perform a preliminary evaluation of the process in a microcontroller and to decide whether subsequent sections should be skipped directly or not. For this purpose, according to one embodiment, the result from the previous scanning movement is retrieved, processed, and the subsequent movement sequence is controlled.

[0044] Towards the end of the process, the number of remaining sections M 2 , M 4 , M 6 , M 8 to be machined is smaller, and the time between repetitions of the scanning movements becomes shorter. This can lead to increased undesirable heat exposure to the material. To avoid this, according to one embodiment, a time delay for the next scanning movement is implemented.

[0045] The device presented here advantageously enables a method for introducing a weakening line into a cover element by laser ablation. For the safe deployment of an airbag, it is important that cover elements in the area of ​​the airbag flaps be provided with predetermined breaking points; these are achieved by introducing weakening lines. For aesthetic reasons, the weakening lines are usually inserted from a non-visible rear side of the cover element. In addition to a precisely adjustable residual tear strength of the weakening line, the highest quality standards for the surfaces are only met if the weakening line is visually and haptically imperceptible on the side of the cover element facing the passenger.

[0046] Cover elements are understood here in the broadest sense to be interior elements in vehicles, particularly instrument panels. These cover elements are designed in single- or multi-layer configurations according to various exemplary embodiments. According to one exemplary embodiment, the cover element comprises plastics such as polypropylene (PP), thermoplastic polyolefin (TPO), polyurethane (PU), and / or polyvinyl chloride. According to one exemplary embodiment, high-quality decorative layers, e.g., made of textile material or leather, are used for the visible side of the cover element facing the passenger.

[0047] Figure 3 shows a schematic representation of a device 300 according to an embodiment for generating a weakening line in a surface of a component. This can be the device shown in Fig. 2 described device 300.

[0048] According to this embodiment, the device 300 is implemented in a controller 305 of the ablation device 310. According to this embodiment, the controller 305 further comprises a laser control 315 and a scanner control 320, wherein the device 300, according to this embodiment, is connected to the scanner control 320 and the laser control 315 in a signal-transmitting manner.

[0049] According to this exemplary embodiment, the contour 100, which can also be referred to as a "figure," is designed on a PC 325 and received by the controller 305. A workpiece 330, here in the form of the surface of the cover element, is machined depending on the laser control 315 and scanner control 320. A sensor system 335 senses values ​​such as the wall thickness of the cover element at the individual sections of the contour 100. The laser control 315 is controlled depending on the sensor values ​​340 of the sensor system 335. Thanks to the device 300 presented here, the scanner control 320 is also controlled depending on the sensor values ​​340 of the sensor system 335.

[0050] In one application example, using the ablation device 310, a pulsed laser beam is directed onto the back of the cover element and guided in a linear fashion. The parameters of the laser pulse are selected such that it causes an energy input that leads to heating of the material at the respective impact location to a temperature above an ablation threshold, but the temperature in areas of the material adjacent to the respective impact location is kept below a limit temperature. This scanning movement along the weakening line to be produced is repeated several times until a defined residual wall thickness is reached on the visible side. The achieved residual wall thickness is monitored by the sensor system 335, which has a spatial resolution corresponding to the size of the impact locations.When the defined residual wall thickness / target wall thickness is reached at a single impact point, this section is skipped when the laser beam is switched off using device 300. The scanning movements are repeated (N cycles) until all impact points have reached a defined residual wall thickness. According to this exemplary embodiment, the weakening line is formed by a continuous groove or a series of grooves or holes, for example in the form of blind holes or microperforation holes, or combinations thereof. According to one exemplary embodiment, a removal depth is constant or varies along the length of the weakening line following a specific regime.

[0051] According to this exemplary embodiment, five repeated machining cycles 345 of the contour 100 are performed to generate the weakening line. In the first three machining cycles 345, the laser control / scanner control is completely aligned with the contour 100. In the fourth and fifth machining cycles 345, the laser control / scanner control is progressively less aligned with the contour 100. Thus, in the fourth and fifth machining cycles 345, an active change 350 of the contour 100 is performed, since, according to one exemplary embodiment, already completed sections are skipped.

[0052] In the approach presented here, the figure / contour 100 consists of individual subfigures in the form of sections that are skipped by the laser beam after attenuation. Each section is characterized by a defined residual wall thickness, which is achieved through a specific attenuation regime. These attenuation regimes are defined and subordinated by parameters according to one embodiment. Possible such parameters are, according to one embodiment: Type of laser radiation Laser power Pulse width Focusing Geometry of the weakening line Size and spacing of grooves and holes Number of cycles of the scanning movement Speed ​​of the scanning movement

[0053] Thanks to device 300, individual sections of the figure are skipped after their completion, i.e., when all scanned points / holes have reached the defined remaining wall thickness and have been rated "OK." In the subsequent repeated scanning movement, the switched-off laser beam skips these sections at maximum speed, according to one embodiment. This reduces the cycle time for producing the entire weakening line.

[0054] Figure 4 shows a schematic representation of a device 300 according to an embodiment for generating a weakening line in a surface of a component. This can be the device shown in Fig. 2 or 3 described device 300. As in Fig. 3As described above, the device 300 according to this exemplary embodiment is implemented in the controller 305, here in the form of a technology processor. The laser control 315 and scanner control 320 can also be referred to as a "communication processor," which is designed to communicate with the device 300, the laser 400 for generating the laser beam 407, the scanner 405, and a user interface / operating software 410. According to this exemplary embodiment, the user interface / operating software 410 comprises a recipe / specification 415 with the desired wall thicknesses in the form of desired values ​​420 for a required weakening for each section M 1 , M 2 , M 3 of the contour 100, which according to this exemplary embodiment comprises three sections M 1 , M 2 , M 3 .According to this exemplary embodiment, the target value 420 for the required weakening of the first section M 1 is 95%, the target value 420 for the required weakening of the second section M 2 is 90%, and the target value 420 for the required weakening of the third section M 3 is 98%. Furthermore, the recipe / specifications 415 according to this exemplary embodiment includes further specifications 425 such as hole type, dimensions, energy input, and speeds for each of the sections M 1 , M 2 , M 3 . According to this exemplary embodiment, the user interface / operating software 410 further includes an evaluation device / control 430 designed to compare the target values ​​420 with actual values ​​and / or to evaluate all other evaluation parameters.Individual sections M 1 , M 2 , M 3 are skipped due to the successful fulfillment of the specifications 415 at a jump speed that is faster than a marking speed when processing a not yet finished section M 1 , M 2 , M 3 . According to this exemplary embodiment, the sections M 1 , M 2 meet their specifications 415, and the third section M 3 does not meet its specifications. Therefore, according to this exemplary embodiment, the finished sections M 1 , M 2 are skipped, and the third section M 3 is processed.

[0055] According to this exemplary embodiment, the device 300 comprises a rotation activation device 435, a calculation device 440, a checking device 445, and / or a transmission device 450. According to one exemplary embodiment, the rotation activation device 435 activates a rotation n of the removal device 310 along the contour 100. The calculation device 440 calculates a contour generation / figure generation of the contour 100 for the current rotation. According to this exemplary embodiment, the checking device 445 checks the specifications 415 with actual values ​​from a sensor evaluation electronics unit 455 of the sensor system 335. For this purpose, the sensor evaluation electronics unit 455 provides sensed sensor values ​​from a sensor field 460.If not all sections M 1 , M 2 , M 3 yet meet their specifications, i.e., do not yet have their target wall thicknesses, the checking device 445 outputs an activation signal 465 to the circulation activation device 435 to activate a further circulation, with completed sections M 1 , M 2 being skipped during the further circulation. If all sections M 1 , M 2 , M 3 yet meet their specifications, i.e., have their target wall thicknesses, the checking device 445 outputs a transmission signal 470 to the transmission device 450 to transmit a result to the user interface / operating software 410.

[0056] According to one embodiment, the user interface / operating software 410 is part of the device 300.

[0057] Figure 5shows a flowchart of a method 500 according to an embodiment for generating a weakening line in a surface of a component. This can be a method 500 that is used by the method described in one of the Figures 2 to 3 described device can be controlled and / or carried out.

[0058] The method 500 comprises a guiding step 505 and a skipping step 510. In guiding step 505, an ablation device for ablating a surface material is guided over a plurality of sections of a predefined linear contour using an activated laser beam to generate a desired wall thickness for at least one of the sections to create the weakening line. In skipping step 510, the section is skipped if the section has the desired wall thickness.

[0059] Optionally, the method 500 according to this embodiment further comprises a generation step 515 in which a lead-in section is generated for a subsequent section of the contour following the section, wherein the removal device jumps to the lead-in section in the skipping step 510 in order to be moved over the lead-in section and / or in which a follow-up section is generated for a lead-in section of the contour arranged before the section, wherein the removal device is moved over the follow-up section before the skipping step 510.

[0060] The embodiments described and shown in the figures are selected only as examples. Different embodiments can be combined with each other completely or with regard to individual features. Furthermore, one embodiment can be supplemented by features of another embodiment.

[0061] Furthermore, process steps of the approach can be repeated and carried out in a different order than that described.

Claims

1. A method (500) for producing a weakening line in a surface of a component, the method (500) comprising the following steps: guiding (505) a removal apparatus (310) for removing a material from the surface over a plurality of portions (M1, M2, M3, M4, M5, M6, M7, M8) of a predefined line-shaped contour (100) using an activated laser beam (407) to create a target wall thickness for at least one of the portions (M1, M2, M3, M4, M5, M6, M7, M8) to create the weakening line; and skipping (510) the portion (M1, M2, M3, M4, M5, M6, M7, M8) if the portion (M1, M2, M3, M4, M5, M6, M7, M8) has the target wall thickness, characterized by a step (515) of generating, in which a lead-in section (VLS) for a downstream portion (M1, M2, M3, M4, M5, M6, M7, M8) following the portion (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) is generated, wherein the removal apparatus (310) jumps to the lead-in section (VLS) in the skipping step (510) in order to be moved over the lead-in section (VLS), and / or in which a lead-out section (NLS) is generated for an upstream portion (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) arranged upstream of the portion (M1, M2, M3, M4, M5, M6, M7, M8), wherein the removal apparatus (310) is moved over the lead-out section (NLS) before the skipping step (510).

2. The method (500) according to claim 1, wherein in the skipping step (510), an output of the laser beam (407) is deactivated.

3. The method (500) according to claim 1 or 2, wherein in the generating step (515), the lead-in section (VLS) is generated which is directly connected to the downstream portion (M1, M2, M3, M4, M5, M6, M7, M8) and / or the lead-out section (NLS) is generated, which is directly connected to the upstream portion (M1, M2, M3, M4, M5, M6, M7, M8).

4. The method (500) according to any of the preceding claims, in which in the generating step (515), the lead-in section (VLS) is generated, the lead-in length of which is shorter than a length of the downstream portion (M1, M2, M3, M4, M5, M6, M7, M8), and / or the lead-out section (NLS) is generated, the lead-out length of which is shorter than a length of the upstream portion (M1, M2, M3, M4, M5, M6, M7, M8).

5. The method (500) according to any of the preceding claims, wherein in the skipping step (510), the removal apparatus (310) is moved directly from an upstream portion (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) arranged upstream of the portion (M1, M2, M3, M4, M5, M6, M7, M8) to a downstream portion (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) following downstream of the portion (M1, M2, M3, M4, M5, M6, M7, M8).

6. The method (500) according to any of the preceding claims, wherein in the skipping step (510), a movement speed of the removal apparatus (310) is higher than in the guiding step (505).

7. The method (500) according to any of the preceding claims, comprising a step (510) of further skipping, in which a further portion (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) is skipped if the further portion (M1, M2, M3, M4, M5, M6, M7, M8) has the or another target wall thickness.

8. The method (500) according to any of the preceding claims, wherein the steps (505, 510, 515) of the method (500) are repeated until all portions (M1, M2, M3, M4, M5, M6, M7, M8) of the contour (100) each have a dedicated target wall thickness.

9. A device (300) in combination with a removal apparatus (310) for removing a material from the surface over a plurality of portions (M1, M2, M3, M4, M5, M6, M7, M8) of a predefined line-shaped contour (100) using an activated laser beam (407) to create, for at least one of the portions (M1, M2, M3, M4, M5, M6, M7, M8), a target wall thickness to create the weakening line, wherein the device (300) is configured to execute and / or control the steps (505, 510, 515) of the method (500) according to any of the preceding claims.

10. A computer program product with program code which, when the program is executed by a computer, causes the computer to execute the method (500) according to any of claims 1 to 8.

11. A machine-readable storage medium on which the computer program according to claim 10 is stored.