METHOD FOR MANUFACTURED ELECTRONIC COMPONENT HOUSINGS AND ELECTRONIC COMPONENT HOUSING OBTAINED BY THIS METHOD

Abstract

The invention relates to a method for manufacturing integrated circuit packages (110), in which a cavity is formed in a strip of dielectric material covered with a sheet of electrically conductive material. An electronic component (90) is placed in the cavity and encapsulated by at least partially filling the cavity with an encapsulation material (100). The bottom of the blind cavity is formed from a layer of flexible and removable material that is removed after encapsulation. The invention also relates to integrated circuit packages (110) manufactured according to this method. These integrated circuit packages (110) are, for example, of the "QFN" type.

Claims

Claims 1. A method of manufacturing integrated circuit packages, wherein - a dielectric material is provided in the form of a strip (10) extending in a longitudinal direction (L), this strip (10) having two main faces (10A, 10B), one of which (10A) is at least partially covered with a sheet (40) of electrically conductive material, - a plurality of connection units (54) are produced in the sheet (40) of electrically conductive material, these connection units (54) being distributed along the longitudinal direction (L) with a determined pitch, each connection unit (54) comprising a connection face (112) with connection pads (45), these connection pads (45) being intended for the electrical connection of the integrated circuit package (HO), - an electronic component (90) is placed at each connection unit (54) in a blind cavity (60), the bottom of this blind cavity (60) being formed from a layer of flexible and removable material (80, 80'), - the electronic component (90) is connected to at least some of the connection pads (45) of the connection unit (54) at which it is placed, - the electronic component (90) is coated in an encapsulation material (100), at the level of each connection unit (54), - the layer of flexible and removable material (80, 80') is removed after encapsulation of the electronic component (90), characterized in that the electronic component (90) is coated in an encapsulating material (100) by dispensing this material into the cavity (60).

2. Method according to claim 1, in which the connection pads (45) are in contact with the layer of flexible and removable material (80, 80'), before the latter is removed, and are flush, on the connection face (112), at the level of the encapsulating material (100) after the layer of flexible and removable material (80, 80') has been removed.

3. Method according to claim 1 or 2, comprising, before encapsulation of the electronic component (90), a step consisting of isolating at least some of the connection pads (45) from each other.

4. Method according to claim 1 or 2, comprising, after encapsulation of the electronic component (90), a step consisting of isolating at least some of the connection pads (45) from each other.

5. Method according to claim 4, in which the step of isolating at least some of the connection pads (45) from each other is concomitant with a step of individualizing electronic components (90) each corresponding respectively to a connection unit (54).

6. Method according to one of the preceding claims, in which the layer of flexible and removable material (80) has a face coated with a non-permanent adhesive.

7. Method according to one of the preceding claims, implemented roll to roll in which the connection pads (45) are isolated from each other and in which the electronic components (90) are electrically tested individually before individualization.

8. Electronic component package intended for surface mounting on an electrical circuit, this component package (110) being manufactured according to a method according to one of the preceding claims, comprising a connection face (112) and at least one electronic component (90) encapsulated in an encapsulating material (100) and connected to connection pads (45), which connection pads (45) and the electronic component (90) are flush with the connection face (112), at the level of the encapsulating material (100).

9. Housing according to claim 8, in which the encapsulating material (100) is contained in a cavity (60) at least partly limited at its periphery by an edge of the strip (10) of dielectric material.

10. Housing according to one of claims 8 and 9, comprising at least two rows of connection tracks each located on the connection face (112) at one side (114) of the component housing (110), these connection tracks being either directly connected to the electronic component (90), or connected to the electronic component (90) via connection wires.

11. Housing according to one of claims 8 to 10, in which one face of the electronic component (90) is flush with the connection face (112), at the level of the encapsulation material (100) and the connection pads (45).

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