Device and method for collecting contaminants on a semiconductor material plate

Abstract

A semiconductor wafer cleaning device comprising a housing (30) for receiving the wafer, the housing being delimited by an annular rim (31) extending around a central axis (Z), the housing comprising: a bearing area (12) extending between the central axis (Z) and the annular rim (31); a contact area (22) extending opposite the bearing area (12), the bearing area and the contact area defining a slot (32) extending between the central axis and the annular rim (31) such that the wafer can be inserted through the slot; a cavity (33) extending radially between the slot (32) and the annular rim (31), the annular cavity being configured to contain a cleaning liquid (34). Figure 4A

Description

Title of the invention: Device and method for collecting contaminants on a semiconductor material plate. Technical field

[0001] The technical field of the invention is the collection of contaminating elements on a substrate, in particular a substrate in microelectronics. EARLIER ART

[0002] In the microelectronics industry, substrates, usually referred to as "wafers," are used. These are rigid, thin, circular plates on which microfabrication steps, such as layer deposition, etching, and photolithography, are performed. The diameter of the plates can be, for example, 100 mm, 150 mm, 200 mm, or 300 mm. Each plate can contain several hundred electronic chips. Each chip can contain a very high number of transistors, for example, on the order of 1 x 10⁹ transistors per chip. Generally, the substrates are made of silicon. Each plate extends between a front face and a back face, with a thickness of [specific thickness]. The microfabrication steps are generally carried out on the front face.

[0003] Transforming a blank silicon wafer into a finished wafer requires several months of production, during which hundreds of manufacturing steps are performed to form a multitude of chips on the wafer. The wafer may be transported between different pieces of equipment. It may also be temporarily stored between manufacturing steps. To avoid compromising chip performance, controlling contamination is a particularly critical issue. Indeed, a particle of an unwanted element or submicron-sized dust settling on a wafer can render a chip unusable. To address the issue of contamination, i.e., the presence of unwanted elements (dust, particles), microfabrication operations on silicon substrates are carried out in cleanrooms, in clean and controlled environments.

[0004] Plates are generally handled by gripping their periphery or back surface. Therefore, the risk of plate contamination is greatest on these areas. It is thus important to characterize the contamination affecting the plates. Characterization means the identification and quantification of contaminants. One possibility is to circulate a drop of cleaning fluid along the periphery of a plate. The cleaning fluid is likely to collect undesirable elements. The drop is then recovered and analyzed by destructive analytical methods, for example, inductively coupled mass spectrometry. This technique is commonly referred to by the acronym ICPMS (Induced Coupled Plasma Mass Spectrometry), or X-ray fluorescence spectrometry. Prior to liquid application, the plate may undergo a surface treatment with hydrofluoric acid vapor to render it hydrophobic. This sequence of vapor treatment and liquid collection is commonly referred to as VPD-DC (Vapor Phase Decomposition - Droplet Collection).

[0005] Document FR3091009 describes a process in which the periphery of a plate is immersed in a groove containing a cleaning liquid. The cleaning liquid facilitates the collection of unwanted elements deposited on the periphery of the plate. This process allows for better control of the plate surface in contact with the cleaning liquid.

[0006] However, some plates are made of a material that is too readily absorbed by the cleaning liquid and is poorly suited to surface treatment by vaporization. These materials include SiC (silicon carbide), SiN (silicon nitride), and SiO2 (silicon dioxide). The inventors propose an alternative process, using a specific device, that does not require prior surface treatment to modify the plate's wettability. The device allows for efficient contaminant collection regardless of the wettability properties of the plate material. It also allows for precise control of the amount of cleaning liquid used and the extent of the plate treated by the liquid. Description of the invention

[0007] A first object of the invention is a device for cleaning a semiconductor wafer, the wafer having a front surface and a rear surface, the front and rear surfaces being separated by a thickness of the wafer, the device comprising a housing, intended to receive the wafer, the housing being delimited by an annular rim extending around a central axis, the housing comprising: - a support area, intended to receive the plate, the support area extending between the central axis and the annular edge; - a contact zone, annular around the central axis, extending opposite the support zone, the distance, along the central axis, between the contact zone and the support zone being greater than or equal to the thickness of the plate, the support zone and the contact zone thus defining a slot, extending between the central axis and the annular edge, so that the plate can be inserted through the slot; - a cavity, annular around the central axis, extending radially between the slit and the annular border, the annular cavity being configured to contain a cleaning liquid; - such that when the annular cavity contains the cleaning liquid, the plate, inserted in the slot, is wetted by the cleaning liquid, between the slot and the annular edge.

[0008] According to one embodiment, the annular cavity comprises a superior annular groove, extending radially between the contact zone and the annular border.

[0009] According to one embodiment, the annular cavity comprises a lower annular groove, extending radially between the support area and the annular border.

[0010] According to one embodiment, the housing extends between a lower face and an upper face, the device being such that: - the lower face and the upper face are radially delimited by the annular border; - the support area is formed on the lower face; - the contact zone is formed on the upper surface.

[0011] According to one possibility, - the support area is annular; - the lower face is hollow between the central axis and the support area, the lower face forming a ring extending between the support area and the annular border.

[0012] According to one possibility, the upper face is hollow between the central axis and the contact area, the upper face forming a ring extending between the contact area and the annular border.

[0013] According to one embodiment, the device comprises: - a support extending between a base and the lower face, the lower face being radially delimited by a lower border, annular around a first central axis; - a hood, extending between an external face and the upper face, the upper face being radially delimited by an upper rim, annular around a second central axis; - the support and the cover are separable from each other, the device being formed by an assembly of the cover on the support, the upper edge being configured to be in contact with the lower edge, to form the annular edge of the device, the first central axis and the second central axis being coincident and forming the central axis.

[0014] The support area can extend backward, along the central axis, relative to the lower edge, so as to allow insertion of the plate onto the support area, such that so that when the plate is placed in the housing, the plate is, at least in part, radially delimited by the lower edge.

[0015] The contact area can extend inward, along the central axis, relative to the upper edge, so that when the plate is placed in the housing, the plate is delimited at least in part, radially by the upper edge.

[0016] The device may include a fluidic opening, opening from the device, and extending to the annular groove, the fluidic opening being configured to allow admission of the cleaning fluid into the annular groove or removal of the cleaning fluid from the annular groove.

[0017] The fluidic opening can open from the hood of the device.

[0018] The fluidic opening can describe a part of a ring around the central axis.

[0019] The bearing area and the contact area can be formed in a material made of Teflon (registered trademark) or containing Teflon (registered trademark).

[0020] A second object of the invention is a method for collecting contaminating elements that may be present on a semiconductor wafer, using a device according to the first object of the invention, the method comprising: a. arrangement of the plate on the support area of ​​the device; b. admission of a cleaning liquid into the annular cavity, so that the liquid wets a part of the plaque extending into the annular cavity; c. removal of the cleaning fluid from the annular cavity; d. removal of the plate from the support area.

[0021] According to one embodiment, the device is a device comprising a cover and a support as defined above. The method is such that - during step a) and step d) the hood is separated from the support; - following step a) and before step b), the hood is placed on the support.

[0022] A third object of the invention is a method for manufacturing a device according to the first object of the invention, the device being manufactured by molding or by 3D printing. FIGURES

[0023] Fig. 1A is a cross-sectional view of a semiconductor wafer, usually referred to as a "wafer", an Anglo-Saxon term meaning "wafer".

[0024] Fig. 1B is a view of a semiconductor plate.

[0025] Fig. IC is a detail of one end of the plate described in relation to figures IA and IB.

[0026] Fig. 2A is a three-dimensional view of a support, forming part of the device, according to a first embodiment.

[0027] Fig. 2B is a cross-sectional view of the support shown schematically in Fig. 2A, the section being made along a plane parallel to a first central axis, around which the support extends, and passing through the latter.

[0028] Fig. 2C shows a plate arranged on the support.

[0029] Fig. 2D is a three-dimensional view of a hood, forming part of the device, according to the first embodiment.

[0030] Fig. 2E is a cross-sectional view of the hood shown schematically in Fig. 2D, the section being made along a plane parallel to a second central axis, around which the hood extends, and passing through the latter.

[0031] Fig. 2F is another cross-sectional view of the hood shown schematically in Fig. 2E, the section being made along a plane parallel to the second central axis and passing through the latter and through a fluidic opening extending through the support.

[0032] [Fig.2G]

[0033] [Fig.2H]

[0034] [Fig. 21] Figures 2G, 2H and 21 represent the device formed by the hood assembled on the support, respectively in the absence of a plate, in the presence of a plate placed in the housing defined by the device, and in the presence of a cleaning liquid in an annular cavity of the device.

[0035] Fig. 3A shows a hood according to another embodiment.

[0036] Figure [Fig. 3B] illustrates an embodiment in which the upper face, made in the support, has an annular groove.

[0037] Figure [Fig. 3C] schematically illustrates an embodiment in which the hood is annular.

[0038] [Fig.3D] The same applies to [Fig.3D].

[0039] Fig. 3E schematically illustrates an embodiment in which the support and the hood are annular.

[0040] Fig. 4A is a three-dimensional view of an embodiment in which the support and the hood are annular.

[0041] Fig. 4B is a three-dimensional view of another embodiment in which the support and the hood are annular.

[0042] [Fig.4C] is a detail of [Fig.4B].

[0043] Figure 5 schematically illustrates the main steps of a process for collecting contaminating elements that may be present on a plate, using a device according to the invention. PRESENTATION OF SPECIFIC IMPLEMENTATION METHODS

[0044] In the following text, the term plate refers to a substrate, in particular a semiconductor-based substrate, for example, but not limited to, silicon, silicon nitride, or silicon carbide. The plate may, in particular, be a circular plate.

[0045] Figures IA to IC show a plate 2, comprising a front surface 2f and a rear surface 2r. The plate 2 is delimited by a circular beveled periphery 2P. At the beveled periphery, the plate gradually tapers to a radial end 2e. The diameter of the plate 2 may be less than or equal to 100 mm, or equal to 150 mm, 200 mm, or 300 mm, or even greater. Generally, the diameter is preferably between 100 mm and 450 mm. The front surface 2f extends parallel to the rear surface 2r. The plate 2 has a border 2b, adjacent to the periphery 2P. The border generally extends radially, with a width of less than 1 cm, from the beveled periphery 2P. The 2P bevel has a 2P >f part on the front surface, and a 2P >r part on the back surface.

[0046] It is primarily at the edge 2b or the beveled periphery 2P that contaminants are likely to be present. The device described below is intended for use in collecting such contaminants. The contaminants may be dust or metallic species, for example Fe, Cr, Al, Ni, Cu, Ti, Ga, Co, Au, Ag, Pt.

[0047] Figures 2A to 21 represent a first embodiment of a device 1 according to the invention. According to this first embodiment, the device is formed by the assembly of a support and a cover. The support is described with reference to Figures 2A to 2C. The support extends parallel to a first central axis Zb between a base 10f and a face, referred to as the lower face 10f. The lower face 10f is delimited by an annular lower border 11, extending around the first central axis Zb.

[0048] The lower face 10; includes a bearing area 12, intended to receive the plate 2, such that the plate 2 rests against the bearing area 12. In this example, the bearing area 12 is circular in shape, being delimited radially by the lower edge 11. It extends radially between the lower edge 11 and the first central axis Zh. By radially, we mean in a direction perpendicular to the central axis. The shape of the bearing area 12 corresponds to the shape of the plate 2. In one possibility, the bearing area 12 may be flush with the lower edge 11, parallel to the first central axis Zi. Preferably, as shown in Figure 2B, the bearing area 12 is set back from the lower edge 11. The setback rl, parallel to the first central axis Zb, corresponds to all or part of the thickness e of the plate 2. It may, for example, be equal to half the thickness of the plate. [Fig.[2B] represents a cross-sectional view of support 10, along a cutting plane including the first central axis.

[0049] The lower face 10 comprises a containment portion 13, adjacent to the lower edge 11, and extending radially for a few mm, or even 1 cm, from of the latter. The function of the containment portion 13 is described in relation to [Fig. 2G]. The containment portion extends between the support zone 12 and the lower edge 11. The containment portion may overlap part of the support zone 12.

[0050] The support 10 has three assembly openings 15 configured to receive an assembly means. The assembly means is intended to assemble the support 10 to a cover 20 described below. The assembly openings 15 may be threaded openings configured to receive screws.

[0051] Figure 2C shows a plate 2 resting on the bearing area 12 of the support 10. The support 10 is preferably dimensioned such that when the plate 2 is held by the bearing area 12, the plate is positioned at a non-zero distance d from the lower edge 11. The distance d can be between 1 mm and 10 mm, and preferably equal to 5 mm ± 2 mm or ± 3 mm. Thus, the lower edge 11 is arranged to extend radially around the first central axis Zb from a radius R corresponding to the radius of the plate plus the distance d. Depending on the radius of the plate, the radius R is between a few centimeters and a few tens of centimeters.

[0052] Figures 2D, 2E, and 2F show the cover 20 of the device 1. The cover 20 is intended to be assembled onto the support 10, as shown in [Fig. 2G]. The cover 20 extends, along a second central axis Z2, between a face, referred to as the upper face 20s, and an outer face 20e. During the assembly of the cover 20 onto the support 10: - the upper face 20s is applied opposite the lower face 10; of the support; - the first central axis Zi and the second central axis Z2 coincide and form the same central axis Z.

[0053] The upper face 20s is delimited by an annular upper rim 21 extending around the second central axis Z2. The upper face 20s has an annular contact area 22 about the second central axis Z2, intended to come into contact with the plate 2. The contact area 22 extends radially between the upper rim 21 and the second central axis Z2. The contact area 22 may be flush with the upper rim 21. Preferably, as shown in Figure 2D, the contact area 22 is recessed relative to the upper rim 21. The recess r2, along the second central axis Z2, corresponds to all or part of the thickness of the plate 2. The recess r2 may, for example, be equal to half the thickness of the plate. The radial width L of the contact area 22 is a few millimeters or a few centimeters, for example between 2 mm and 15 mm.

[0054] The sum of the first shrinkage ri, described in relation to figure 2B, and the second shrinkage r2, preferably corresponds to the thickness e of plate 2.

[0055] The upper face 20s has an upper groove 23. The upper groove 23 is annular, around the second central axis Z2. The upper groove 23 is radially delimited on one side by the contact area 22, and on the other by the upper edge 21. The depth P of the upper groove 23, parallel to the second central axis Z2, is millimeter-sized, being between 1 mm and 10 mm, for example 5 mm ± 2 mm or ± 3 mm. The radial width 1 of the upper groove 23 is between 1 mm and 10 mm, for example 5 mm ± 2 mm or ± 3 mm.

[0056] The hood 20 has assembly openings 25, intended to be arranged opposite the assembly openings 15 made in the support 10. Thus, during assembly, each assembly opening 15 of the support 10 extends an assembly opening 25 of the hood 20.

[0057] The hood 20 has at least one fluidic opening 26, opening into the upper groove 23. The fluidic opening 26 is intended for the admission of a cleaning fluid 34 into the upper groove 23 or for the removal of the cleaning fluid from the upper groove 23. [Fig. 2F] is a cross-sectional view of the hood 20, in a plane parallel to the second central axis Z2 and passing through the fluidic opening 26.

[0058] The fluidic opening 26 can be circular, as shown in [Fig.2D], or extend along a portion of a ring, as described below.

[0059] Figure 2G shows a cross-sectional view of the device 1 formed by the assembly of the cover 20 onto the support 10. In this example, the plate has not been placed on the support 10. After assembly: - the first central axis Zi and the second central axis Z2 are coaxial and form the same central axis Z. - The upper edge 21 of the hood 20 comes into contact with the lower edge 11 of the support 10, so as to form an annular edge 31; - The contact area 22 of the cover 20 extends opposite the bearing area 12 of the support 10. The gap between the contact area 22 and the bearing area 12 corresponds approximately to the thickness e of the plate 2. By "approximately," we mean that the gap is greater than or equal to the thickness of the plate, so as to allow the plate to be held between the contact area 22 and the bearing area 12. The bearing area 12 and the contact area 22 then define an annular slot 32, into which the plate can be inserted. The annular slot 32 extends radially between the central axis Z and the annular edge 31. The annular slot 32 preferably extends radially parallel to a axis perpendicular to the transverse axis, between the support zone 12 and the contact zone 22. - The upper groove 23 extends opposite the containment portion 13 of the lower face 10; of the support 10. - The space between the lower face 10; and the upper face 20s forms a housing 30, in which the plate can, at least in part, extend.

[0060] Figure 2H shows a cross-sectional view of the device 1 formed by the assembly of the cover 20 on the support 10. In this example, the plate has been placed on the support 10. An important aspect of the invention is that when the plate is placed on the support 10, after the assembly of the cover 20 on the support 10, the upper groove 23 and the containment portion 13, delimited radially on the one hand by the contact area 22 and the bearing area 12, and on the other hand by the lower and upper edges, form an annular cavity 33. The slot 32 is preferably dimensioned so that, following the insertion of the plate into the slot, the annular cavity 33 is sealed.

[0061] The fluidic opening 26 opens into the annular cavity 33 and allows the latter to be filled with a liquid, in particular a cleaning liquid 34. [Fig.2I] shows the device 1 in which the annular cavity 33 is filled with cleaning liquid 34, the latter being shown in grey.

[0062] The cleaning fluid 34 may be a solution based on hydrochloric acid, nitric acid, hydrofluoric acid, hydrogen peroxide, or water. The cleaning fluid 34 is maintained, for a predetermined period, in the cavity 33, in contact with the plate 2, and more specifically in contact with the portion of the plate extending into the cavity 33. The cleaning fluid 34 is then removed from the cavity 33 by means of a suction device and subsequently analyzed by an analytical method as described in the prior art. The device 1 is then disassembled, and the plate 2 can be removed.

[0063] Given the dimensions of the annular cavity 33, depending on the diameter of the plate 2, the volume of cleaning liquid 34 to fill the cavity 33 is typically a few tens of mL.

[0064] An advantage of the invention is that it controls the surface of the plate wetted by the cleaning fluid 34. This is the surface of the plate opening into the cavity 33. Preferably, the device is sized to analyze a plate surface extending a few millimeters from the radial end 2e of the plate. The portion of the plate in contact with the cleaning fluid 34 includes the beveled peripheral portion 2P (bevel) as well as, partially or entirely, the edge 2b.

[0065] The invention also makes it possible to control the volume of cleaning liquid 34 acting on the plate, the latter being less than or equal to the volume of the cavity 33. The implementation of the invention is not dependent on the wetting properties of the material forming plate 2 with respect to cleaning liquid 34. Thus, it is not necessary to carry out a pretreatment aimed at modifying the wettability of the material forming the plate.

[0066] Figure 3A illustrates an embodiment in which the hood 20 has a fluidic opening 26 forming part of a ring. In this example, the hood has three annular fluidic openings 26 separated from each other. This shape facilitates the intake or discharge of the cleaning fluid 34.

[0067] Figure 3B illustrates an embodiment in which the containment portion 13 of the lower face 10 forms a lower groove 13, the dimensions of which are comparable to the upper groove 23 formed on the upper face 20s of the cover 20. The grooves 23 and 13 define the annular cavity 33. The lower groove 13 extends between the bearing area 12 and the lower edge 11. In the example shown, the bearing area 12 is annular around the central axis Z, opposite the contact area 22, the latter also being annular. Such an embodiment allows better access of the cleaning fluid 34 to the rear surface 2r of the plate, and in particular to the rear beveled peripheral portion 2p>r.

[0068] Thus, the device comprises an annular cavity 33, extending between the annular slot 32, delimited by the support zone 12 and the contact zone 22. The annular cavity 33 can be formed by the upper groove 23, extending between the contact zone 22 and the annular border 31 and / or the lower groove 13, extending between the support zone 12 and the annular border 31.

[0069] Figure 3C shows an embodiment in which the hood 20 is annular around the second central axis Z2. The hood 20 is hollow between the central axis Z and the contact area 22. This embodiment allows for better visibility of the front surface of the plate when it is inserted into the device 1. It also allows for the application of another cleaning treatment to the upper surface 2S of the plate 2. Figure 3D shows a three-dimensional view of the annular hood 20. According to this embodiment, the upper groove 23 is through-groove and opens onto the outer face 20e of the hood 20. The upper groove 23 then acts as a fluidic opening 26.

[0070] Figure 3E shows an embodiment in which the support 10 and the cover 20 are annular. The support is hollow between the central axis Z and the bearing area 12. The housing 30, intended to receive the plate, is thus annular. Such an embodiment is shown in Figure 4A. In Figure 4A, the assembly means are screws 35, passing through the assembly openings 25 and 15 respectively formed in the cover 20 and the support 10. In Figure 4A, the lower face 10 of the support 10 has a lower annular groove 13 as described in connection with Figure 3B. The area The support 12 forms an annular protrusion on the lower face 10; This limits the contact area between the rear face of the plate and the support area 12.

[0071] Figure 4B represents an embodiment analogous to that of Figure 4A, the support area 12 being flat. According to this embodiment, the containment portion 13 is flat and extends between the support area 12 and the lower edge 11. Such an embodiment primarily allows for cleaning of the upper part of the bevel 2Pjf and the edge 2b of the plate.

[0072] Regardless of the embodiment, the parts intended to be in contact with the plate are preferably made of a sufficiently flexible material, for example Teflon (registered trademark). These include, in particular, the bearing area 12 and the contact area 22. They may also include the lower and upper edges. In one embodiment, the cover and the support are made of Teflon (registered trademark). Teflon (registered trademark) has the advantage of resisting the use of aggressive cleaning liquids without releasing contaminants.

[0073] To improve the seal between two adjoining surfaces, lips can be formed in at least one of the two surfaces intended to be joined. Figure 4C is a detail of the configuration shown in Figure 4B. The sealing lips are outlined by dashed circles. Lips can be formed on the lower edge 11 and / or on the upper edge 21. This improves the seal when the upper edge is applied against the lower edge. Lips can also be formed at the slot, on the contact area 22, or on the bearing area 12, the lips then being intended to bear against the plate to form a seal.

[0074] The device can take a different configuration from a support arranged on a hood. It can, for example, be formed of two parts symmetrical to each other with respect to a plane passing through the central axis Z.

[0075] Fig. 5 schematically illustrates the main steps of a process for collecting undesirable elements that may be present at the level of a plate 2.

[0076] Step 100: positioning the plate on the support 10, the plate resting on the bearing area 12, a peripheral portion of the plate extending between the bearing area 12 and the lower edge 11, on the containment portion 13.

[0077] Step 110: application of the hood 20 onto the support 10, so that the contact area 22 rests on the plate 2. The plate is positioned between the hood and the support.

[0078] Step 120: Admission of the cleaning liquid 34, suitable for collecting elements present on the surface of the plate, into the cavity 33, so that the liquid wets a part of the plate extending into the annular groove.

[0079] Step 130: action of the cleaning liquid 34 on the parts of the plate brought into contact with it, in the cavity 33.

[0080] Step 140: evacuation of the liquid for analysis.

[0081] Step 150: removal of the cover 20 and removal of the support plate 10.

[0082] Step 160: analysis of the cleaning liquid 34, in order to identify any Remove contaminants from the plate and, if necessary, determine their concentration in the liquid, knowing that the volume of liquid introduced is known. This step is optional.

[0083] The support and the hood can be manufactured by molding, or by 3D printing (in three dimensions).

Claims

1. Demands Device (1) for cleaning a semiconductor wafer, the wafer (2) having a front surface (2f) and a rear surface (2r), the front and rear surfaces being separated by a thickness of the wafer (e), the device having a housing (30) for receiving the wafer, the housing being delimited by an annular rim (31) extending around a central axis (Z), the housing having: - a support area (12), intended to receive the plate, the support area (12) extending between the central axis (Z) and the annular border (31); - a contact zone (22), annular around the central axis, extending opposite the support zone (12), the distance, along the central axis, between the contact zone and the support zone being greater than or equal to the thickness of the plate (e), the support zone and the contact zone thus defining a slot (32), extending between the central axis and the annular edge (31), so that the plate can be inserted through the slot; - a cavity (33), annular around the central axis (Z), extending radially between the slot (32) and the annular border (31), the annular cavity being configured to contain a cleaning liquid (34); - such that when the annular cavity (33) contains the cleaning liquid (34), the plate (2), inserted in the slot (32), is wetted by the cleaning liquid, between the slot (32) and the annular border (33); in which the housing (30) extends between a lower face (10i) and an upper face (20s), the device being such that: - the lower face (10i) and the upper face (20s) are radially delimited by the annular border (31); - the support area (12) is formed on the lower face (10D; - the contact zone (22) is formed on the upper face (20s); the device comprising: - a support (10) extending between a base (10f) and the lower face (10s), the lower face being radially delimited by a lower rim (11), annular around a first central axis (Z1); - a cover (20), extending between an external face (20e) and the upper face (20s), the upper face being radially delimited by an upper rim (21), annular around a second central axis (Z2); the support (10) and the cover (20) are separable from each other, the device being formed by an assembly of the cover (20) on the support (10), the upper rim (21) being configured to be in contact with the lower rim (11), to form the annular rim (31) of the device, the first central axis (Z1) and the second central axis (Z2) being coincident and forming the central axis (Z).

2. Device according to claim 1, wherein the annular cavity (33) has an upper annular groove (23), extending radially between the contact area (22) and the annular border (31).

3. Device according to any one of claims 1 or 2, wherein the annular cavity (33) has a lower annular groove (13), extending radially between the bearing area (12) and the annular rim (31).

4. Device according to claim 3, wherein: - the support area (12) is annular; - the lower face (10i) is hollow between the central axis (Z) and the support area (12), the lower face forming a ring extending between the support area (12) and the annular border (31).

5. Device according to any one of the preceding claims, wherein the upper face (20s) is hollow between the central axis (Z) and the contact area (22), the upper face (20s) forming a ring extending between the contact area (22) and the annular border (31).

6. A device according to any one of the preceding claims, wherein the support area (12) extends inward, along the central axis (Z), relative to the lower edge (11), so as to permit an insertion of the plate (2) on the bearing area, such that when the plate is placed in the housing (30), the plate is delimited, at least in part, radially by the lower edge.

7. Device according to any one of the preceding claims, wherein the contact area (22) extends in retreat, along the central axis (Z), relative to the upper edge (21), such that when the plate is disposed in the housing (30), the plate is delimited, at least in part, radially by the upper edge.

8. Device according to any one of the preceding claims, comprising a fluidic opening (26), opening from the device, and extending to the annular groove (33), the fluidic opening being configured to allow admission of the cleaning fluid (34) into the annular groove (33) or removal of the cleaning fluid from the annular groove.

9. Device according to claim 8, wherein the fluidic opening (26) opens from the hood of the device.

10. Device according to any one of claims 8 or 9, wherein the fluidic opening (26) describes a part of a ring around the central axis (Z).

11. Device according to any one of the preceding claims, wherein the bearing area (12) and the contact area (22) are formed in a material made of Teflon (registered trademark) or comprising Teflon (registered trademark).

12. A method for collecting contaminants that may be present on a semiconductor wafer, using a device according to any one of the preceding claims, the method comprising: a. placing the wafer (2) on the support area (12) of the device; b. admitting a cleaning liquid (34) into the annular cavity (33), so that the liquid wets a portion of the wafer extending into the annular cavity; c. removing the cleaning liquid from the annular cavity; d. removing the wafer from the support area.

13. The method according to claim 12, wherein: 16 - during step a) and step d) the hood (20) is separated from the support (10); - following step a) and before step b), the hood (10) is placed on the support (20).

14. Method of manufacturing a device according to any one of claims 1 to 11, the device being manufactured by molding or by 3D printing.

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