PLATELET GRIPPING DEVICE

Abstract

The invention relates to a device for gripping at least one wafer of semiconductor material. The device comprises at least one gripping unit (120) including a pair of gripping members (140, 150) arranged at a distance from each other and each having a notch, the notch of one of the gripping members (140, 150) being adapted to receive an edge of said at least one wafer while the notch of the other gripping members (150, 140) being adapted to receive an opposite edge of said at least one wafer, and a displacement means (160) configured to move the gripping members (140, 150) closer together / apart from each other between a locking configuration of the at least one wafer for gripping and an insertion configuration. Figure 3

Description

Title of the invention: DEVICE FOR GRIPPING PLATES Technical field

[0001] The invention relates to the field of transporting, gripping / manipulating, or routing substrates, or wafers, of semiconductor material during the production of devices from these substrates.

[0002] The invention advantageously applies to semiconductor substrates intended for the production of photovoltaic cells, but also to semiconductor substrates intended for the production of microelectronic devices. STATE OF THE ART

[0003] During the production of semiconductor devices (for example photovoltaic, microelectronic, etc.), the wafers, from which these devices are produced, pass successively through different equipment in which they are subjected to different treatments allowing the production of the semiconductor devices: deposition of materials, etching, photolithography, etc.

[0004] During these different treatments, the wafers are conventionally held in position in the different equipment by suitable holding devices, commonly called "baskets". These devices make it possible in particular to avoid damage to the wafers, to guarantee effective application of the treatments or even to keep them immersed during chemical treatments in particular, for example by countering phenomena such as Archimedes' thrust.

[0005] Known holding devices are shown in [Fig. 1a] and [Fig. 1b] of the accompanying drawings, in particular: - [Fig. 1a] is a perspective view of a known holding device or basket, oriented vertically and into which plates are inserted; and - [Fig. lb] is a perspective view of a known immersion device, oriented horizontally and comprising a device similar to that of [Fig. la] as well as inserts, inserted into the device of [Fig. la] and each housing a plurality of plates.

[0006] These devices make it possible to hold P wafers parallel and at a distance from each other. They typically have dimensions adapted to the size of the wafers to be received. A standard wafer size can, for example, range from a square or quasi-square with a side of 156.75 mm, known as size M2, to a square or quasi-square with a side of 210 mm, known as size M12. By quasi-square, we mean a square whose corners can be cut.

[0007] The device 1 illustrated in [Fig. 1a] comprises two end plates 2 carrying bars 4 for holding the wafers P. The end plates 2 have a U shape allowing the loading / unloading of the wafers P from above (i.e. the opening part of the U) when the device 1 is arranged horizontally. The holding bars 4 are provided with separating teeth which hold the wafers P at a distance, parallel to each other. The spacing between two consecutive wafers P is typically equal to 4.76 mm for wafers of size M2 or 6.3 mm for wafers of size M12.

[0008] The device 10 illustrated in [Fig. lb] is formed by a holding device 1, similar to that of [Fig. la], and inserts 11 removably inserted into the device 1. The inserts 11 allow the holding device 1 to accommodate wafers P of a size different from that provided for the immersion device 1 itself. Each insert 11 thus comprises serrated holding bars 12 which hold the wafers P in the same way as the device of [Fig. la].

[0009] To unload the inserts P, the holding device 1 is generally oriented vertically (as illustrated in [Fig.1a]) and positioned above a handling element, such as a belt. In this way, the inserts P are oriented parallel to a direction of movement of the handling element. The holding device is then gradually lowered so that the inserts P are unloaded one by one, by friction with the handling element. This process can be similar for each insert 11 illustrated in [Fig.1b].

[0010] During this unloading process, the areas of the wafer P coming into contact with the handling element are damaged. The defects resulting from these surface degradations are included under the term "defectivity". The elements subsequently produced on these areas (where the surface of the wafer is degraded) are of lower quality.

[0011] Solutions have been developed to limit defectivity during the wafer unloading process. For example, French patent application FR 2 213 736, filed by the applicant, proposes a solution comprising a handling element, such as a belt, having a surface on which projecting support elements are provided. These support elements are intended to come into contact with an area of ​​the wafer so as to keep the rest of the wafer at a distance from the surface of the handling element. The contact surface between the wafer and the handling element is thus reduced.

[0012] By reducing the contact surface between the wafer and the handling element, the defectivity is effectively reduced. However, this solution requires contact at one face of the wafers, and more particularly at a distance from the edges (a few millimeters) in order to guarantee sufficient stability during transport. This requires sensitive areas to be kept away from the contact areas at the risk of damaging them. The usable surface area of ​​the face of the pads is then not maximized in relation to the available surface area.

[0013] Furthermore, the unloading rate with current processes is limited to one wafer at a time and is conditioned by the speed of movement of the handling element, in particular the belt, which is adapted to limit, or even avoid, the sliding of the support element on the face of the wafer, which can lead to a slowdown in the production of semiconductor devices and additional costs. Statement of the invention

[0014] In order to resolve the aforementioned drawbacks, the invention proposes, according to a first aspect, a device for gripping at least one wafer of semiconductor material. The gripping device comprises at least one gripping unit comprising a pair of gripping members arranged at a distance from each other and each comprising a notch, the notch of one of the gripping members being adapted to receive an edge of said at least one wafer while the notch of the other of the gripping members is adapted to receive an opposite edge of said at least one wafer, and a displacement means configured to bring the gripping members closer to / away from each other between a locking configuration of the at least one wafer for gripping and an insertion configuration.

[0015] The term "semiconductor material plate" or "wafer", otherwise known as "wafer" in English, is understood to mean a substrate having the shape of a straight block of small thickness, formed from a semiconductor material, generally silicon and / or germanium, and more particularly crystalline silicon. The thickness of the plate may be between 60 and 400 μm, for example of the order of 140 μm. The at least one plate may in particular be housed in a holding device.

[0016] The term "gripping unit" is understood to mean an assembly adapted to gripping a wafer by means of a pair of gripping members acting as jaws, which can be moved towards / away from each other by means of a displacement means.

[0017] "Locking" or "locking configuration" means bringing the gripping members of the same pair together sufficiently close to hold the at least one plate in position and in particular to prevent it from moving. It should be noted that locking does not necessarily involve clamping or compressing the plate between the gripping members. On the contrary, it is preferable to limit the compression forces as much as possible. pressure when locking, so as not to damage the pad.

[0018] "Insertion" or "insertion configuration" means the act of separating the gripping members from each other sufficiently to be able to insert or remove the wafer from the device.

[0019] Thanks to the gripping device, and in particular to the configuration of the pair of gripping members, it is possible to grip a wafer of semiconductor material, which is for example inserted into a holding device, by opposite edges, and thus limit, or even eliminate, contact on one face of this wafer. By gripping the wafer by its opposite edges, it is possible to transport the wafer in a sufficiently stable manner while avoiding contact with one of its faces, which thus makes it possible to take advantage of the entire available surface of the wafer.

[0020] Furthermore, this also makes it possible to grip any wafer in the holding device, unlike the belt with which the wafers must be unloaded consecutively according to their stacking order. It is therefore possible to increase the unloading rate of the wafers, for example either by using the gripping device in combination with a known handling device, or by using several gripping devices, or by using a gripping device adapted to unload several wafers at a time.

[0021] Correlatively, the invention proposes, according to a second aspect, a method for gripping at least one wafer of semiconductor material, using a gripping device as described previously. The gripping method comprises the following steps: - moving said gripping device, in its insertion configuration, until the at least one plate is located between the pair of gripping members of the at least one gripping unit, - actuate the movement means to move the device from its insertion configuration to its locking configuration for gripping the at least one wafer.

[0022] The invention finally proposes, according to a third aspect, a gripping assembly comprising a holding device, at least one wafer inserted into the holding device, a manipulator robot, and a gripping device as described previously which is mounted on the manipulator robot, the manipulator robot being configured to move the gripping device, in its insertion configuration, until the at least one wafer is located between the pair of gripping members of the at least one gripping unit, the moving means being configured to move the gripping device from its insertion configuration to its locking configuration for gripping said at least one wafer.

[0023] The invention is advantageously applicable to substrates intended for the production of devices in which the surface condition of the substrate, i.e. the quality of the semiconductor, plays a major role in the final performance of the device. In addition, the invention is advantageously applicable to devices whose production requires rapid transport of the substrates, with a high rate, during the steps preceding the protection of the surface of the substrate, i.e. the steps preceding the surface passivation of the substrate from which the transport system no longer has or has almost no impact on the quality of the semiconductor of the substrate.

[0024] The invention is advantageously applicable to thin substrates, i.e. substrates with a thickness of less than or equal to approximately 100 μm, since these substrates are more sensitive to defects than substrates several hundred microns thick. These silicon substrates are particularly intended for the production of photovoltaic cells.

[0025] Particularly simple, convenient and economical preferred features of the device according to the invention are presented below.

[0026] Each notch may have a V-shaped profile. This geometry makes it possible to further limit, or even avoid, contact between the gripping members and at least one face of the wafer. In the event of contact, the contact zone is then located along an edge or on an edge of the wafer, which is not particularly troublesome.

[0027] The device may comprise several gripping units spaced apart from each other in a direction perpendicular to a plane defined by the gripping members of each gripping unit. The device can thus grip several wafers simultaneously, which in particular makes it possible to improve the unloading rate of the wafers inserted into an immersion device. The space separating the gripping units is determined as a function of the dimensions of the wafers, in particular their thickness, and their arrangement in the holding device.

[0028] The gripping members may be configured to slide relative to each other in a direction of approaching / separating the gripping members under the action of the displacement means. This sliding movement (or according to a sliding connection) allows the device to be compact, in particular in a direction perpendicular to the direction of approaching / separating the gripping members. In addition, the dimension of the device, in this direction, remains unchanged when changing from one configuration to the other. It is thus possible to easily position the device between two plates, which are generally spaced apart by a distance of 4.76 mm or 6.3 mm depending on their dimensions.

[0029] The at least one gripping unit may comprise a third gripping member, the gripping members being arranged in a triangular configuration, the notches of two of these gripping members being adapted to receive the same edge of the at least one plate, or the at least one unit of gripping may comprise another pair of gripping members, the gripping members being arranged in a generally rectangular configuration, each pair comprising a gripping member whose notch is adapted to receive an edge of the at least one wafer and a gripping member whose notch is adapted to receive an opposite edge of said at least one wafer. The presence of two pairs of gripping members or three gripping members (one upper / lower gripping member and two lower / upper gripping members) improves stability when gripping the wafer. This therefore limits the risk of the wafer falling and / or moving when it is gripped by the device.

[0030] At least one of the gripping members is associated with a damping means configured to deform elastically beyond a predetermined stress exerted when the gripping members approach each other. The damping means makes it possible to avoid damaging the wafer by at least partially absorbing the movement of one of the gripping members on the wafer when the device passes into the locking configuration. Indeed, in the case where the gripping members come into contact with the wafer during their approach, the damping means deforms and limits the force on the wafer. The damping means may comprise a compression spring.

[0031] The movement means may comprise a digital axis. This type of actuator makes it possible to bring the gripping members closer and further apart with a variable movement speed. In addition, such an actuator makes it possible to bring the gripping members closer and further apart relatively precisely, for example to define a reception zone of predefined size.

[0032] The device may be intended to be fixed to the end of a manipulator robot arm. In this regard, the base may be provided with a connecting member adapted to connect the base to a manipulator robot, notably comprising an articulated arm. Brief description of the drawings

[0033] The present invention will be better understood on reading the description of exemplary embodiments given purely for informational purposes and in no way limiting, with reference to the appended drawings in which: - [Fig.2] schematically represents a gripping device according to an embodiment of the invention, arranged at the end of a manipulator robot, and shows the gripping device in the process of unloading, using the manipulator robot, wafers from one of the inserts of [Fig.lb]; - [Fig.3] is a perspective, schematic and partial view of the gripping device taken in isolation; - [Fig.4a] is a schematic and partial perspective view of a proximal end portion of one of the gripping members of the gripping device; - [Fig.4b] is a perspective view, schematic and partial, of another of the gripping members of the gripping device, taken in isolation; - [Fig.4c] is a schematic and partial perspective view of a distal end portion of the gripping member of [Fig.4a]; and - [Fig.5] is a perspective, schematic and partial view of the gripping device according to an alternative embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0034] Identical, similar or equivalent parts of the different figures bear the same numerical references so as to facilitate the transition from one figure to another.

[0035] [Fig. 2] shows a holding device 10, similar to that illustrated in [Fig. 1b], and handling assembly, comprising a manipulator robot 100 and a gripping device 110, which simultaneously unloads a plurality of wafers P from the holding device 10. The gripping device 110 is mounted at the end of an arm 101 of the manipulator robot 100. The manipulator robot 100 comprises a frame 102 on which the arm 101 is articulated. The handling assembly thus makes it possible to unload, in an automated manner, several wafers P simultaneously and according to different orientations from the holding device 10.

[0036] [Fig. 3] shows in isolation the gripping device 110 according to a first embodiment of the invention. This device 100 comprises a base 111 and several gripping units 120. Each gripping unit 120 is configured to grip a wafer P by opposite edges. In the illustrated example, the device 110 comprises five gripping units 120 and is thus capable of gripping five wafers P simultaneously.

[0037] Each gripping unit 120 comprises at least one pair of gripping members, namely an upper gripping member 140 and a lower gripping member 150. The gripping members 140 and 150 are arranged facing and at a distance from each other so as to define a receiving zone R between them. The receiving zone R is intended to receive a wafer P and its dimensions may vary depending on the size of the wafer.

[0038] The gripping members 140 and 150 define a plane of the gripping unit 120. The gripping units 120 are spaced apart from each other in a direction perpendicular to this plane. The distance separating two consecutive gripping units 120, in this direction, may vary depending on the thickness of the wafers P to be gripped and / or the distance separating these wafers. Indeed, the space between two 120 consecutive gripping units must allow the passage, without contact, of a P plate for gripping.

[0039] Each gripping unit 120 has a thickness, in the direction perpendicular to the plane that it defines, adapted to be able to introduce it between two consecutive plates P housed in a holding device, without coming into contact with these plates. Thus, each gripping unit has, for example, a thickness less than 4.76 mm for plates of size M2 or 6.3 mm for plates of size M12. The thickness of the gripping units can nevertheless vary according to the size of the plates.

[0040] Each gripping unit 120 comprises two supports, namely an upper support 141 and a lower support 151. The upper support 141 carries the upper gripping member 140 and the lower support 151 carries the lower gripping member 150. The supports 141 and 151 here have the shape of an elongated blade and are inscribed in the same plane, which makes it possible to limit the thickness of the gripping units 120. The gripping members 140 and 150 project respectively from a main face of the upper support 141 and the lower support 151 so as to be opposite one another.

[0041] The gripping device 110 further comprises a displacement means 160 configured to bring the gripping members 140, 150 closer to and apart from each other and thus vary a space of the receiving zone R between an insertion configuration and a locking configuration of the plate P in which the gripping members 140, 150 are brought closer relative to said insertion configuration. Actuation of the displacement means 160 makes it possible to switch from one of the locking and insertion configurations to the other.

[0042] In the illustrated example, the displacement means 160 is attached to the upper gripping member 140, which is movable relative to the base 111, while the lower gripping member 150 is fixed relative to the base 111. The actuation of the displacement means 160 thus makes it possible to vary the distance between the gripping members 140, 150 by acting only on the upper gripping member 140, which simplifies the design of the device. The displacement means 160 advantageously comprises a digital axis, in order to move the upper gripping member relatively precisely, and thus precisely adjust the distance between the gripping members 140, 150.

[0043] There is now described, with reference to Figures 4a and 4b, a mechanism allowing the upper gripping member 140 to move relative to the lower gripping member 150 in a sliding movement. [Fig. 4a] illustrates the upper gripping member 140 with the upper support 141 taken in isolation and [Fig. 4b] illustrates a proximal end portion of the lower support 141, also taken in isolation.

[0044] As shown in [Fig.4a], the lower support 151 is provided, at its proximal end, with a slot 152 adapted to receive and guide the upper support 141 in a rectilinear direction oriented towards the lower gripping member 150. Thus, the lower support 151 serves both as a support for the lower gripping member 150 and as a guide means for the upper gripping member 140.

[0045] The slot 152 has a first portion 152a along which the slot is open on the face of the lower support 151 from which the lower gripping member 150 projects, and a second portion 152b along which the slot is delimited by walls, here four in number.

[0046] In the example shown, the first portion 152a of the slot 152 is a through portion. The second portion 152b is delimited by two locking elements 153 arranged on either side of the lower support 151. One of these locking elements 153 is preferably removable to completely open the slot 152 on one of the faces of the lower support 151 and thus facilitate the insertion of the upper gripping member 140 and / or its support 141 into the slot 152.

[0047] Referring now to [Fig.4b], a portion of the upper support 141 is shaped so as to cooperate with the slot 152 according to a sliding connection. In particular, the upper support 141 has a portion of shape complementary to that of the slot 152. The upper gripping member 140 projects from a face of the upper support 141 in order to be opposite the lower gripping member 150 when the upper support 141 is received in the slot 152.

[0048] In practice, a portion of the upper support 141 is inserted into the slot 142, for example by removing one of the locking elements 153, until it comes to bear against the other of the locking elements 153. When the portion of the upper support 141 is inserted into the slot 152, the upper gripping member 140 passes through the first portion 152a of the slot 152 so as to face the lower gripping member 150. The second portion 152b holds the upper support 141 inside the slot 152, in particular during its movement under the action of the movement means 160. In fact, the gripping device 110 passes from one configuration to another without its thickness (or the thickness of a gripping unit 120) varying, which is advantageous for unloading wafers housed in a device maintenance.

[0049] Optionally, the upper gripping member 140 is attached to the upper support 141 by a damping means 142. The damping means 142 is adapted to deform, preferably elastically, when a stress exerted on the upper gripping member 140 is greater than a predefined stress. The damping means 142 makes it possible in particular to absorb, at least partially, a force exerted on the plate P by means of the upper gripping member 140. when it is moved by the moving means 160. In the example illustrated, the damping means 142 comprises a helical compression spring whose ends are connected respectively to the upper gripping member 140 and to the upper support 141.

[0050] The upper gripping member 140 comprises a notch 143 adapted to receive at least a portion of an edge, in particular an upper edge, of a plate P. The notch 143 defines a rim 144, extending substantially parallel to the upper support 141 and preventing the movement of the plate P in a direction perpendicular to a general plane of the plate P. The notch 143 here has a V-shaped profile, which makes it possible to keep the plate P at a distance from the lower support 141 while limiting the contact surface between the faces of the plate P and the walls of the notch 143.

[0051] As shown in [Fig.4c], the lower gripping member 150 is similar to the upper gripping member 140 and in fact comprises a notch 153 adapted to receive at least a portion of an edge, in particular a lower edge, of the plate P and defining a rim 154. The notch 154 also has a V-shaped profile. The lower gripping member 150 is turned towards the upper gripping member 140, so that the notches 143, 153 are opposite each other.

[0052] In the illustrated example, each gripping unit comprises two pairs of gripping members 140, 150 spaced from one another and arranged in such a way that the four gripping members 140, 150 define a rectangle, or even a square. This arrangement improves the stability of the wafer P in the receiving zone, in particular compared to a gripping unit with a single pair of gripping members. Other arrangements with four gripping members can be envisaged, in particular a trapezoidal configuration.

[0053] To simultaneously move the two upper gripping members 140, the upper supports 141 are attached to each other, preferably at their proximal end, by a connecting element. The moving means 160 is secured to the connecting element and thus acts simultaneously on each upper gripping member 140. Thanks to the connecting element, the moving means could of course comprise only one digital axis. It is also possible not to provide a connecting element, in which case the digital axes are secured to each of the upper supports and configured to move them simultaneously.

[0054] The base 111 is provided with a connection member 130 configured to allow the connection of the base 111 to the arm 101 of the manipulator robot 100.

[0055] The connection member 130 can also allow the displacement means 160 to be electrically coupled to a control module (not shown) integrated in the manipulator robot 100 and configured to operate the means of movement. Such a control module can of course be remote.

[0056] For gripping one or more wafers, in particular with a view to extracting them from the immersion device, by means of the gripping device, the method comprises the steps below.

[0057] The gripping device 110 is connected, via the connecting member 130, to the end of the arm 101 of the manipulator robot 100. If the device 110 is in its insertion configuration, it is left in this configuration. If not, the device 110 is moved from its locking configuration to its insertion configuration by actuating the movement means 160 to move the gripping members 140, 150 apart, for example by means of the control module.

[0058] The device 110 is then moved, by means of the manipulator robot 100, parallel to a main plane of the plate(s) P, until the lower gripping member 150 crosses the lower edge of the plate(s) P, while the upper gripping member 140 does not cross the upper edge, in order to be able to receive the plate(s) P in the corresponding receiving zones R. The device 110 is then moved perpendicular to the main plane of the plate(s) P, in the direction of the latter, until the plate(s) P are in their respective receiving zone R between the gripping members 140, 150 and opposite their respective notch 143, 153.

[0059] The upper gripping member 140 and the lower gripping member 150 are then brought closer to the edges of the plate(s) P. In particular, the lower gripping member 150 is first brought closer to the lower edge of the plate(s) P by moving the gripping device 110 (upwards in [Fig. 2]) parallel to the main plane of the plates P, then the upper gripping member 140 is brought closer to the upper edge of the plates P by actuating the moving means 160 to move the device 110 from its insertion configuration to its clamping configuration. It should be noted that, when the upper gripping member is moved to get closer to the upper edge, the gripping device 100 (and therefore the lower gripping member) is not moved. The plate(s) P are thus locked by the gripping members 140, 150 in the respective receiving zones R.

[0060] In the illustrated example, neither the manipulator robot 100 nor the gripping device 110 is equipped with sensors to determine the position of the gripping device relative to the wafer(s) P. In practice, the manipulator robot 100 is configured to position the gripping device at predefined locations, at which the wafer(s) P are arranged. However, the manipulator robot and / or the device The gripping robot can be equipped with sensors to detect the presence and / or contact with the wafer(s). For example, the manipulator robot can be coupled to a vision system.

[0061] When the plate(s) P are locked, the gripping members 140 and 150, and more particularly the upper gripping member, are not necessarily in contact with the edges of the plate(s) P. This is made possible by the rim of each gripping member 140 and 150, which makes it possible to hold the plate P in the receiving space without applying the slightest clamping force to the plate. It is thus preferable, in particular to avoid damaging the plate(s) P, to bring the upper gripping member 140 closer without coming into contact with the upper edge, but up to a distance such that the upper edge is at least partially received in the notch 143. It should also be noted that in the example shown, the lower edge of the plate(s) P necessarily comes into contact, by gravity, with the bottom of the notch 153 of the lower gripping members 150.

[0062] The gripping device 110 makes it possible, thanks to the configuration of its gripping member system 140 and 150, to grip a wafer P of semiconductor material, which is for example inserted into an immersion device 1 or 10, by opposite edges. The device 110 also makes it possible to select the wafers P to be gripped, for example for their unloading from the immersion device 1 or 10, unlike the belt with which the wafers P must be unloaded consecutively according to their stacking order. It is also possible, with a device 110 comprising several gripping units 120, to grip several wafers P simultaneously.

[0063] [Fig. 5] shows an alternative embodiment of the gripping device 210, in which only the number and arrangement of the upper gripping member differs from the first embodiment.

[0064] In this gripping device 210, each gripping unit 120 comprises a pair of gripping members 140 and 150 and a third gripping member 150', here aligned with the lower gripping member 150 in a direction perpendicular to the direction of approach / separation of the gripping members. The gripping members 140, 150, 150' are arranged in a triangular configuration, the upper gripping member 140 being located between the lower gripping members 150 and 150'. The stability of the wafer with such an arrangement is slightly lower than with an arrangement with four gripping members, but greater than with a device with two gripping members.

[0065] The device 210 comprises a guide support 280 for the upper gripping member 150, secured to the base 111 and arranged between the lower supports 151, 151'. The guide support 280 comprises for example a slot, similar to that described in the first embodiment.

[0066] Variants not illustrated are described below.

[0067] The moving means may comprise other types of actuators, such as hydraulic or pneumatic cylinders. The moving means may also comprise more or fewer actuators.

[0068] The gripping device may comprise more or fewer gripping units, for example between one and four or more than five.

[0069] The damping means may comprise more or fewer springs.

[0070] The notch may have other profile shapes, for example rectangular or rounded.

Claims

Claims

1. Device for gripping at least one wafer (P) of semiconductor material, characterized in that it comprises at least one gripping unit (120) comprising a pair of gripping members (140, 150, 150') arranged at a distance from each other and each comprising a notch (143, 153), the notch (143, 153) of one of the gripping members (140, 150, 150') being adapted to receive an edge of said at least one wafer (P) while the notch (153, 143) of the other of the gripping members (150, 140, 150') being adapted to receive an opposite edge of said at least one wafer (P), and a displacement means (160) configured to bring the gripping members closer to / apart from each other. (140, 150, 150') from each other between a locking configuration of the at least one plate (P) for gripping and an insertion configuration.

2. Device according to claim 1, characterized in that each notch (143; 153) has a V-shaped profile.

3. Device according to one of claims 1 or 2, characterized in that it comprises several gripping units (120) spaced from each other in a direction perpendicular to a plane defined by the gripping members (140, 150, 150') of one of the gripping units.

4. Device according to any one of claims 1 to 3, characterized in that the gripping members (140, 150, 150') are configured to slide relative to each other in a direction of approach / separation of the gripping members (140, 150, 150') under the action of the displacement means (160).

5. Device according to any one of claims 1 to 4, characterized in that said at least one gripping unit (120) comprises a third gripping member (150'), the gripping members (140, 150, 150') being arranged in a triangular configuration, the notches (143, 153) of two of these gripping members (140, 150) being adapted to receive the same edge of the at least one wafer (P), or the at least one gripping unit (120) comprises another pair of gripping members (140, 150), the gripping members (140, 150) being arranged in a generally rectangular configuration, each pair comprising a gripping member (140, 150) whose notch (143, 153) is adapted to receive an edge of at least one plate (P) and a gripping member (150, 140) of which the notch (153, 143) is adapted to receive an opposite edge of said at least one plate (P).

6. Device according to any one of claims 1 to 5, characterized in that at least one of the gripping members (140, 150, 150') is associated with a damping means (142) configured to deform elastically beyond a predetermined stress exerted when the gripping members (140, 150, 150') approach each other.

7. Device according to any one of claims 6, characterized in that the damping means (142) comprises a compression spring.

8. Device according to any one of claims 1 to 7, characterized in that the displacement means (160) comprises a digital axis.

9. Method for gripping at least one wafer (P) of semiconductor material, using a gripping device (110, 210) according to any one of claims 1 to 8, characterized in that it comprises the following steps: - moving said gripping device (110, 210), in its insertion configuration, until the at least one wafer (P) is located between the pair of gripping members (140, 150, 150') of the at least one gripping unit (120), - actuating the moving means (160) to move the gripping device (110, 210) from its insertion configuration to its locking configuration for gripping said at least one wafer (P).

10. A gripping assembly comprising a holding device (1, 10), at least one wafer (P) inserted into the holding device (1, 10), a manipulator robot (100), and a gripping device (110, 210) according to any one of claims 1 to 8 which is mounted on the manipulator robot (100), said manipulator robot (100) being configured to move the gripping device (110, 210), in its insertion configuration, until the at least one wafer (P) is located between the pair of gripping members (140, 150, 150') of the at least one gripping unit (120) and the moving means (160) being configured to move the gripping device (110, 210) from its insertion configuration to its locking configuration for gripping said at least one platelet (P).

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