Cooling device configured to cool at least two electronic modules

Abstract

Title: Cooling Device Configured to Cool at Least Two Electronic Modules The invention relates to a cooling device (1) configured to cool at least two electronic modules (2), each comprising an electronic board (3) on which a plurality of electronic components (4) are mounted. The cooling device (1) comprises: a housing (10) defining at least two separate enclosures (11), each configured to receive one of the electronic boards (3) with the electronic components, and to be filled with a dielectric fluid for immersing the electronic components (4). The enclosures (11) each have an inlet (12) and an outlet (14) of dielectric fluid specific to each enclosure. Figure for the abstract: Fig. 2

Description

Title of the invention: Cooling device configured to cool at least two electronic modules

[0001] The present invention relates in particular to a cooling device configured to cool at least two electronic modules.

[0002] It is known, in the context of cooling an electronic power card, such as that used in a DCDC converter (this converter being intended to transform a voltage of a direct current from a first voltage value to a second voltage value), to use a cooling liquid circulating in a plate which is in contact with the electronic card. Such a system involves a significant fluid flow rate and is energy-intensive. In addition, the architecture of the electronic card can complicate access, in terms of cooling, to the hottest components.

[0003] The present invention aims in particular to further improve the thermal regulation, in particular the cooling, of several electronic modules.

[0004] The invention thus relates to a cooling device configured to cool at least two electronic modules each comprising at least one electronic card on which a plurality of electronic components are mounted, the cooling device comprising: - a housing defining at least two separate enclosures each configured to respectively receive at least one of the electronic cards with the electronic components, and to be filled with a dielectric fluid intended to immerse the electronic components, the enclosures each having a dielectric fluid inlet and outlet which are specific to each enclosure.

[0005] Advantageously, the dielectric fluid inlet and outlet which are specific to each enclosure are configured to distribute, via the inlet, dielectric fluid only into the associated enclosure, and to evacuate, via the outlet, dielectric fluid only from the associated enclosure. The enclosures thus do not have a fluid inlet or fluid outlet which are common to both enclosures.

[0006] In the cooling device according to the invention, if desired, it is thus possible to circulate dielectric fluid in only one of the two enclosures. The invention makes it possible to use the enclosures according to different operating modes. For example, it is possible to circulate the dielectric fluid in series in the two enclosures so that the dielectric fluid passes first into one of the enclosures and then into the other of the enclosures. Alternatively, it is possible to circulate the fluid in parallel in the two enclosures, so that the dielectric fluid does not pass from one speaker to another.

[0007] Advantageously, the fluid inlet of one of the enclosures and the fluid outlet of the other of the enclosures are configured to be able, selectively, on the one hand, to be placed in fluid communication with each other to achieve a series fluid circulation, and, on the other hand, to be isolated from each other to isolate the enclosures from each other.

[0008] According to one aspect of the invention, the cooling device comprises a fluid flow modification member for selectively, on the one hand, placing the fluid inlet of one of the enclosures and the fluid outlet of the other of the enclosures in communication to achieve a fluid circulation in series, and, on the other hand, to isolate the fluid inlet of one of the enclosures and the fluid outlet of the other of the enclosures to isolate the enclosures from each other.

[0009] According to one aspect of the invention, the cooling device comprises, as a fluid flow modification member, a multi-way valve or a set of valves connected to the inlets and outlets of the enclosures so as to enable the flow within the two enclosures to be controlled.

[0010] According to one aspect of the invention, the fluid inlets and outlets of the enclosures have a section at least 5 or 10 or 20 times smaller than the passage section available for the circulation of fluid in the enclosures.

[0011] Fluid inlets and outlets are defined as primary fluid connections for distributing dielectric fluid into the enclosure and for discharging dielectric fluid from the enclosure.

[0012] The present invention makes it possible to cool several electronic components using the same cooling device. In addition, as will be seen below, the invention makes it possible to obtain efficient cooling, whatever the operating conditions of the electric vehicle because the invention makes it possible to choose, from among different operating modes of the cooling device, the most advantageous fluid circulation mode depending on the cooling requirement. For example, one type of requirement may correspond to a need for more cooling in one enclosure than in the other.

[0013] According to one aspect of the invention, the fluid flow modification member, in particular the multi-way valve or the set of valves, is configured to take at least two distinct angular positions, corresponding to two operating modes of the cooling device.

[0014] For example, a first operating mode corresponds to a parallel operating mode in which the dielectric fluid is distributed in parallel in the two enclosures. In this case, the dielectric fluid does not pass from one enclosure to the other, the valve(s) then distributing fluid to the two inlets. respective outlets of the two enclosures and evacuating the fluid coming from the two respective outlets of the two enclosures.

[0015] For example, a second mode of operation corresponds to a series mode of operation in which the dielectric fluid is distributed in series in the two enclosures. In this case, the dielectric fluid is distributed by the valve(s), first in one of the enclosures and then the fluid passes from this enclosure to the other enclosure.

[0016] According to one aspect of the invention, the fluid flow modification member, in particular a multi-way valve, is configured to take three distinct angular positions, corresponding to three operating modes of the cooling device.

[0017] According to one aspect of the invention, the multi-way valve is configured to be able to take a first angular position corresponding to a parallel operating mode in which the dielectric fluid is distributed in parallel in the two enclosures.

[0018] According to one aspect of the invention, the multi-way valve is configured to be able to take a second angular position corresponding to a first series operating mode in which the dielectric fluid is distributed first in one enclosure (called the first enclosure), possibly returns to the multi-way valve (or another valve), then passes into the other enclosure (called the second enclosure).

[0019] According to one aspect of the invention, the multi-way valve is configured to be able to take a third angular position corresponding to a second series operating mode which is reversed with respect to the first series operating mode (the flow direction is reversed). In this second series operating mode, the dielectric fluid is distributed first into the second enclosure, possibly returns to the multi-way valve (or another valve), then passes into the other enclosure, i.e. the first enclosure.

[0020] According to one aspect of the invention, at least one of the fluid inlets and outlets communicates with a dielectric fluid distributor / collector configured to distribute / collect dielectric fluid in the enclosure.

[0021] It is understood that the fluid inlets and outlets may not distribute / collect the dielectric fluid directly into the enclosure, but fluid entering through the fluid inlet first passes through the fluid distributor / collector before arriving in the enclosure, just as fluid exiting through the fluid outlet first passes through a fluid distributor / collector before leaving the enclosure.

[0022] According to one aspect of the invention, the cooling device comprises a distributor per enclosure, for example a branch distributor.

[0023] Generally speaking, what is described in connection with the distributor can be applied to a collector whose role is to collect fluid to evacuate it, unlike the distributor which brings fluid to distribute it in the enclosure. For example, the cooling device has one collector per enclosure.

[0024] The distributors / collectors of the enclosures are identical or, alternatively, have different shapes, for example branches.

[0025] According to one aspect of the invention, the fluid inlets and outlets of the enclosures are formed, at least for some, or even for all, by respectively inlet / outlet connectors, connectors on each of which an external fluid tube can be fixed. In one mode of operation, one of the fluid connectors can define the inlet of the enclosure and another of the connectors can define the outlet of this enclosure, while, in another mode of operation, the fluid inlets and outlets can be interchanged on the connectors of this enclosure.

[0026] According to one aspect of the invention, the housing comprises a junction conduit between the two enclosures, the junction conduit configured to allow the flow of fluid from one of the enclosures to the other.

[0027] The junction conduit may be equipped with a valve to open or close this junction conduit.

[0028] According to one aspect of the invention, the junction conduit belongs to the housing and is not an external element. This avoids having to make fluid connections.

[0029] According to one aspect of the invention, the two enclosures are separated from each other by a partition wall of the housing.

[0030] According to one aspect of the invention, the housing has a bottom and the two enclosures occupy two portions of the bottom of the housing. Thus, the two enclosures are arranged side by side in the housing.

[0031] In one variant, the enclosures are stacked on top of each other and the bottom enclosure rests on the bottom or forms the bottom of the housing.

[0032] According to one aspect of the invention, the enclosures may have identical volumes or different volumes.

[0033] According to one aspect of the invention, one of the enclosures may be at least twice smaller than the other enclosure.

[0034] According to one aspect of the invention, at least one of the enclosures may have a substantially parallelepiped shape.

[0035] According to one aspect of the invention, the partition which separates the two enclosures may be generally flat, for example arranged vertically.

[0036] The two enclosures may have identical heights or different heights.

[0037] According to one aspect of the invention, the outer edges of the enclosures are formed on a side wall.

[0038] Thus, to define the two enclosures, the dividing wall is placed, for example, in the center of this side wall so as to arrange the two enclosures on either side of the dividing wall.

[0039] According to one aspect of the invention, the side wall which surrounds the two enclosures has a substantially rectangular perimeter. Other shapes are of course conceivable.

[0040] According to one aspect of the invention, the housing comprises a cover configured to close at least one of the enclosures.

[0041] According to one aspect of the invention, the housing comprises an upper cover and a lower cover which are arranged in particular on the top and bottom of the side wall.

[0042] According to one aspect of the invention, the lower cover forms the bottom of the enclosure(s).

[0043] According to one aspect of the invention, the side wall is provided with electrical connectors configured to provide electrical, power and / or signal connections between the electronic cards and their components in the enclosures and external electrical equipment.

[0044] In one variant, the housing comprises two separate upper covers each configured to close one of the enclosures.

[0045] According to one aspect of the invention, the housing may also comprise two separate lower covers each configured to close one of the enclosures.

[0046] It is advantageous to have an upper and / or lower cover common to both enclosures to limit the number of parts and assembly operations.

[0047] According to one aspect of the invention, the cover, which may be the lower cover or the upper cover, comprises a dielectric fluid distributor configured to distribute dielectric fluid into the enclosure in the form of at least one jet of dielectric fluid.

[0048] A "dielectric fluid jet" is a flow of dielectric fluid that is at a higher speed than the dielectric fluid that fills the enclosure, outside of this jet. This jet makes it possible to locally create a speed differential that allows the jet to better cool the electronic components opposite the jet. The fluid distributor according to the invention is configured to distribute dielectric fluid without a drastic change in pressure losses, unlike a spray system.

[0049] In the invention, the components are completely immersed, in particular without air or gas resulting from a phase change of dielectric fluid.

[0050] Thanks to the invention, the cooling of the electronic components is done by direct contact with the dielectric type cooling fluid. This significantly improves the cooling capacity by the fluid, in particular compared tively to a classic system using a plate within which cooling fluid circulates.

[0051] According to one aspect of the invention, the dielectric fluid dispenser is configured to generate a jet of dielectric fluid on only a portion of the electronic module, on a given area.

[0052] According to one aspect of the invention, the dielectric fluid dispenser is configured to generate a plurality of jets of dielectric fluid.

[0053] According to one aspect of the invention, the cover comprises two plates, in particular made of metal such as aluminum, assembled together to form one or more dielectric fluid channels.

[0054] According to one aspect of the invention, the plates are brazed together.

[0055] According to one aspect of the invention, one of the plates is stamped to form the or the channels and the other plate is flat.

[0056] According to one aspect of the invention, the distributor / collector comprises orifices made on one of these plates.

[0057] Each cover each comprises two plates, in particular brazed together, in particular made of metal such as aluminum, assembled together to form the dielectric fluid channels which form the distributor / collector. One of the plates is stamped to form the channels and the other plate is flat.

[0058] According to one aspect of the invention, the distributor / collector comprises orifices made on one of these plates, into which the various channels of the distributor / collector open. The channels form branches, with a main section and branched sections, supplied by the connector.

[0059] According to one aspect of the invention, the branched sections are arranged on two opposite sides of the main section so that these branched sections.

[0060] According to one aspect of the invention, the orifice(s) have an oblong shape, or alternatively a circular shape or any other shape.

[0061] According to one aspect of the invention, the side walls and lower and upper covers are assembled by gluing, heat-sealing or by vibration or friction welding.

[0062] According to one aspect of the invention, the housing is made of plastic material, capable of withstanding the pressure of dielectric fluid.

[0063] According to one aspect of the invention, the housing may be provided with mechanical reinforcing ribs.

[0064] According to one aspect of the invention, the housing may be made of metal, for example aluminum alloy.

[0065] The invention also relates to a cooling method using a cooling device as described above, comprising the following step: - control the flow of dielectric fluid, in particular so that the fluid passes through one or other of the enclosures, or both, in series or in parallel.

[0066] According to one aspect of the invention, the electronic cards and their components in the two enclosures perform different electronic functions.

[0067] Other characteristics, details and advantages of the invention will emerge more clearly on reading the description which follows on the one hand, and several exemplary embodiments given for informational and non-limiting purposes with reference to the appended schematic drawings on the other hand, in which:

[0068] [Fig-1] [Fig.l] is a schematic representation, in perspective, of a device cooling according to an exemplary embodiment of the invention, with electronic modules in enclosures of the cooling device;

[0069] [Fig.2] [Fig.2] is an exploded view of the device of [Fig.l];

[0070] [Fig.3] [Fig.3] is a representation of the device of [Fig.l], in a mode of parallel operation;

[0071] [Fig.4] [Fig.4] is a representation of the device of [Fig.l], in a first serial operating mode;

[0072] [Fig.5] [Fig.5] is a representation of the device of [Fig.l], in a second serial operating mode;

[0073] [Fig.6] [Fig.6] is a representation of a multi-way valve of the device of the [Fig.l], in the parallel operating mode;

[0074] [Fig.7] [Fig.7] is a representation of a multi-way valve of the device of the [Fig.l], in the first serial operating mode;

[0075] [Fig.8] [Fig.8] is a representation of a multi-way valve of the device of the [Fig.l], in the second serial operating mode.

[0076] The features, variants and different embodiments of the invention may be combined with each other, in various combinations, provided that they are not incompatible or mutually exclusive. In particular, variants of the invention may be imagined comprising only a selection of features described below in isolation from the other features described, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0077] Figures 1 and 2 show a cooling device 1 configured to cool two electronic modules 2, each comprising at least one electronic card 3 on which a plurality of electronic components 4 are mounted. At least one of the electronic modules 2, or even both modules, is part of a DCDC converter, in particular for a motor vehicle. The cooling device 1 is part of a cooling system provided with a pump for creating fluid flow and heat exchange.

[0078] The electronic components 4 comprise, for example, MOSFET type transistors which tend to heat up considerably during operation.

[0079] The cooling device 1 comprises a housing 10 defining two separate enclosures 11 each configured to receive respectively at least one of the electronic cards 3 with the electronic components 4, and to be filled with a dielectric fluid intended to immerse the electronic components 4.

[0080] The enclosures 11 each have an inlet 12 and an outlet 14 for dielectric fluid which are specific to each enclosure 11.

[0081] The dielectric fluid inlet 12 and outlet 14 which are specific to each enclosure 11 are configured to distribute, via the inlet 12, dielectric fluid only into the associated enclosure 11, and to evacuate, via the outlet 14, dielectric fluid only from the associated enclosure 11. The enclosures 11 thus do not have a fluid inlet or fluid outlet which are common to both enclosures 11.

[0082] The fluid inlets 12 and outlets 14 of the enclosures 11 are formed by respective fluid inlet / outlet connections 15, connections 15 on each of which an external fluid tube can be fixed.

[0083] As will be seen below, in one mode of operation, one of the fluid connections 15 can define the inlet 12 of the enclosure and another of the connections 15 can define the outlet of this enclosure 11, while, in another mode of operation, the fluid inlet 12 and outlet 14 can be interchanged on the connections 15 of this enclosure. In other words, each connection 15 can, if desired, play interchangeably the role of fluid inlet and outlet of the enclosure 11.

[0084] The fluid inlet 12 of one of the enclosures 11 and the fluid outlet 14 of the other of the enclosures 11 are configured to be able, selectively, on the one hand, to be placed in fluid communication with each other to achieve a circulation of fluid in series, and, on the other hand, to be isolated from each other to isolate the enclosures 11 from each other.

[0085] The cooling device 1 comprises a fluid flow modification member for selectively, on the one hand, placing the fluid inlet 12 of one of the enclosures 11 and the fluid outlet 14 of the other of the enclosures 11 in communication to achieve a fluid circulation in series, and, on the other hand, to isolate the fluid inlet of one of the enclosures 11 and the fluid outlet of the other of the enclosures 11 to isolate the enclosures 11 from each other.

[0086] In the example described, the cooling device 1 comprises, as a fluid flow modification member, a multi-way valve 20 illustrated in FIGS. 6, 7 and 8, connected to the inlets 12 and outlets 14 of the enclosures 11 so as to enable the flow within the two enclosures 11 to be controlled.

[0087] The present invention makes it possible to cool several electronic components using the same cooling device. In addition, as will be seen below, the invention makes it possible to obtain efficient cooling, whatever the operating conditions of the electric vehicle because the invention makes it possible to choose, from among different operating modes of the cooling device, the most advantageous fluid circulation mode depending on the cooling requirement. For example, one type of requirement may correspond to a need for more cooling in one enclosure 11 than in the other.

[0088] The fluid chords 15 communicate with a dielectric fluid distributor / collector 22 configured to distribute / collect dielectric fluid in the enclosure 11.

[0089] In the example described, there are, per enclosure 11, two distributors / collectors 22 for each connection 15.

[0090] When the connection 15 acts as a fluid inlet 12, we can then speak of a distributor 22. When the connection 15 acts as a fluid outlet 14, we can then speak of a collector 22. To simplify the description, we will speak of distributors / collectors 22 which can serve, depending on the operating mode, as a distributor or a collector.

[0091] The distributors / collectors 22 are identical from one enclosure 11 to another.

[0092] Alternatively, the distributors / collectors 22 have different shapes, for example branches.

[0093] The two enclosures 11 are separated from each other by a separating partition 27 of the housing 10.

[0094] The housing 10 further comprises a bottom 28 and the two enclosures 11 occupy two portions of the bottom 28 of the housing 10. The two enclosures 11 are arranged side by side in the housing 10.

[0095] In a variant, the enclosures 11 are stacked on top of each other and the bottom enclosure 11 rests on the bottom 28 or forms the bottom of the housing 10.

[0096] The enclosures 11 may have identical volumes or, alternatively, different volumes. The two enclosures 11 may have identical heights or different heights.

[0097] The enclosures 11 have a substantially parallelepiped shape.

[0098] The partition 27 which separates the two enclosures 11 can be generally flat, arranged vertically.

[0099] The outer edges of the enclosures 11 are formed on a side wall 29.

[0100] Thus, to define the two enclosures 11, the separating partition 27 is placed, for example, in the center of this side wall 29 so as to arrange the two enclosures 11 on either side of the separating partition 27.

[0101] The side wall 29 which surrounds the two enclosures 11 has a substantially rectangular perimeter. Other shapes are of course conceivable.

[0102] The housing 10 comprises an upper cover 30 and a lower cover 31 which are arranged on the top and bottom of the side wall 29.

[0103] The lower cover 31 forms the bottom 28 of the enclosures 11.

[0104] The side wall 29 is provided with electrical connectors 33 configured to provide electrical, power and / or signal connections between the electronic cards 3 and their components 4 in the enclosures 11 and external electrical equipment.

[0105] In a variant, the housing 10 comprises two separate upper covers each configured to close one of the enclosures 11.

[0106] The housing 10 may also comprise two separate lower covers each configured to close one of the enclosures 11.

[0107] It is advantageous to have an upper and / or lower cover common to the two enclosures 11 to limit the number of parts and assembly operations.

[0108] The dielectric fluid distributors / collectors 22 configured to distribute / collect dielectric fluid in the enclosure 11 are formed on the lower cover 31 and the upper cover 30.

[0109] When the distributor / collector 22 operates as a distributor, it allows dielectric fluid to be distributed in the form of jets of dielectric fluid in the enclosure 11.

[0110] A "dielectric fluid jet" is a flow of dielectric fluid that is at a higher speed than the dielectric fluid that fills the enclosure 11, outside of this jet. This jet makes it possible to locally create a speed differential that allows the jet to better cool the electronic components opposite the jet. The fluid distributor is configured to distribute dielectric fluid without a drastic change in pressure losses, unlike a spray system.

[0111] In the invention, the electronic components 4 are completely immersed, in particular without air or gas resulting from a change in phase of dielectric fluid.

[0112] Thanks to the invention, the cooling of the electronic components is done by direct contact with the dielectric type cooling fluid. This significantly improves the cooling capacity by the fluid, in particular compared to a conventional system using a plate within which cooling fluid circulates.

[0113] The dielectric fluid distributor 22 is configured to generate a jet of dielectric fluid on only a portion of the electronic module, on given areas, by generating a plurality of jets of dielectric fluid.

[0114] The distributor 22 is supplied with dielectric fluid by the tubing or connection 15 formed on the cover 30 or 31.

[0115] Each cover 30, 31 each comprises two plates brazed together, in particular made of metal such as aluminum, assembled together to form the dielectric fluid channels which form the distributor / collector 22. One of the plates is stamped to form the channels and the other plate is flat.

[0116] The housing 10 is made of plastic, capable of withstanding the pressure of dielectric fluid, and is provided with mechanical reinforcing ribs. Alternatively, the housing 10 may be made of metal, for example aluminum alloy.

[0117] The distributor / collector 22 comprises orifices 34 made on one of these plates, into which the different channels 36, 37 of the distributor / collector 22 open. The channels 37 form branches, with a main section 36 and branched sections 37, supplied by the connector 15.

[0118] The branched sections 37 are arranged on two opposite sides of the main section 36 so that these branched sections 37.

[0119] The orifices 34 have an oblong shape, or alternatively a circular shape or any other shape.

[0120] The multi-way valve 20 is configured to take three distinct angular positions, corresponding to three operating modes of the cooling device 1.

[0121] A first operating mode, illustrated in Figures 3 and 6, corresponds to a parallel operating mode in which the dielectric fluid is distributed in parallel in the two enclosures 11. The arrows illustrate these parallel flows. In this case, the dielectric fluid does not pass from one enclosure 11 to the other, the valve 20 then distributing fluid to the two respective inlets 12A and 12C of the two enclosures 11 and discharging the fluid coming from the two respective outlets 14B and 14D of the two enclosures 11. In this parallel mode, the multi-way valve 20 puts the inlets 12A and 12C in communication with a global fluid inlet 40, and the two outlets 14B and 14D in communication with a global fluid outlet 41 (see [Fig.6])•

[0122] A second operating mode, illustrated in Figures 4 and 7, corresponds to a first series operating mode in which the dielectric fluid is distributed in series in the two enclosures 11. In this mode, the dielectric fluid is distributed by the multi-way valve 20, first in one of the enclosures 11 then the fluid passes from this enclosure 11 to the other enclosure 11. More precisely, the multi-way valve 20 distributes fluid to the fluid inlet 12A in a first of the enclosures 11, then the fluid leaves this first of the enclosures 11 via the outlet 14B to pass into a second of the enclosures 11 via the inlet 12D. Finally the fluid this second enclosure 11 via the outlet 14C. In this series mode, the multi-way valve 20 puts the inlet 12A in communication with the global fluid inlet 40, and the outlet 14C in communication with the global fluid outlet 41 (see [Fig.7]).

[0123] The multi-way valve 20 is configured to be able to take a third angular position (see [Fig.8]) corresponding to a second series operating mode which is reversed with respect to the first series operating mode of Figures 4 and 7 (the flow direction is reversed). More precisely, in this mode of Figures 5 and 8, the multi-way valve 20 distributes fluid to the fluid inlet 12C in the second of the enclosures 11, then the fluid leaves this second of the enclosures 11 via the outlet 14D to pass into the first of the enclosures 11 via the inlet 12B. Finally, the fluid leaves this first enclosure 11 via the outlet 14A.

Claims

Claims

1. Cooling device (1) configured to cool at least two electronic modules (2) each comprising at least one electronic card (3) on which a plurality of electronic components (4) are mounted, the cooling device (1) comprising: - a housing (10) defining at least two separate enclosures (11) each configured to receive respectively at least one of the electronic cards (3) with the electronic components, and to be filled with a dielectric fluid intended to immerse the electronic components (4), the enclosures (11) each having an inlet (12) and an outlet (14) of dielectric fluid which are specific to each enclosure.

2. Cooling device (1) according to the preceding claim, wherein the fluid inlet (12) of one of the enclosures (11) and the fluid outlet (14) of the other of the enclosures (11) are configured to be able, selectively, on the one hand, to be put into fluid communication with each other to achieve a circulation of fluid in series, and, on the other hand, to be isolated from each other to isolate the enclosures (11) from each other.

3. Cooling device (1) according to the preceding claim, wherein the cooling device comprises a fluid flow modification member (20) for selectively, on the one hand, placing the fluid inlet of one of the enclosures (11) and the fluid outlet of the other of the enclosures (11) in communication to achieve a fluid circulation in series, and, on the other hand, to isolate the fluid inlet of one of the enclosures and the fluid outlet of the other of the enclosures (11) to isolate the enclosures from each other.

4. Cooling device (1) according to the preceding claim, in which the cooling device comprises, as a fluid flow modification member, a multi-way valve (20) or a set of valves connected to the inlets and outlets of the enclosures so as to enable the flow within the two enclosures (11) to be controlled.

5. Cooling device (1) according to claim 3 or 4, in in which the fluid flow modification member, in particular the multi-way valve (20) or the set of valves, is configured to take at least two distinct angular positions, corresponding to two operating modes of the cooling device, in particular with a first operating mode corresponding to a parallel operating mode in which the dielectric fluid is distributed in parallel in the two enclosures (11), and a second operating mode corresponding to a series operating mode in which the dielectric fluid is distributed in series in the two enclosures (11).

6. Cooling device (1) according to one of claims 3 to 5, in which the fluid flow modification member, in particular a multi-way valve (20), is configured to take three distinct angular positions, corresponding to three operating modes of the cooling device, in particular to be able to take, in addition to a first angular position, a second angular position corresponding to a first series operating mode in which the dielectric fluid is distributed first in an enclosure (11), possibly returns to the multi-way valve (20) or another valve, then passes into the other enclosure (11), and a third angular position corresponding to a second series operating mode which is reversed with respect to the first series operating mode.

7. Cooling device (1) according to one of the preceding claims, wherein at least one of the fluid inlets (12) and outlets (14) communicates with a dielectric fluid distributor / collector (22) configured to distribute / collect dielectric fluid in the enclosure (11).

8. Cooling device (1) according to one of the preceding claims, in which the fluid inlets (12) and outlets (14) of the enclosures are formed, at least for some, or even for all, on respectively inlet / outlet connections (15), connections on each of which an external fluid tube can be fixed.

9. Cooling device (1) according to one of the preceding claims, in which the housing (10) has a bottom (28) and the two enclosures (11) occupy two plots of the bottom of the housing (10).

10. Cooling device (1) according to one of claims 1 to 8, wherein the enclosures (11) are stacked on top of each other and the enclosure (11) from the bottom rests on the bottom (28) or forms the bottom of the housing (10).

Images