Cooling device configured to cool an electronic component

Abstract

Title: Cooling Device Configured to Cool an Electronic Component The invention thus relates to a cooling device (3) configured to cool at least one electronic component (2), the cooling device comprising: a base (12) defining an enclosure (10) configured to receive, on a bottom (14) of the base (12), said at least one electronic component (2), and to be filled with a dielectric fluid intended to immerse this electronic component (2), a lid (16) configured to cooperate with the base (14) to close the enclosure (10), an internal structure (20) distinct from the base (12) and the lid (16), this internal structure (20) being disposed in the enclosure (10) and comprising at least one internal channel (100, 200, 300) configured to direct a portion of the dielectric fluid towards the electronic component (2), this internal channel (100, 200,300) being thermally isolated from the electronic component (2) or any other possible electronic component (2) in the enclosure (10). Figure for the abbreviation: Fig. 1,

Description

Title of the invention: Cooling device configured to cool an electronic component

[0001] The present invention relates to a cooling device configured to cool an electronic component.

[0002] It is known, in the context of cooling electronic components or a power electronic board, such as that used in an inverter, to employ a coolant circulating in a plate that is in contact with the electronic board. Such a system involves a significant fluid flow rate and is energy-intensive. Moreover, the architecture of the electronic board can complicate access, in terms of cooling, to the hottest components.

[0003] The present invention aims in particular to further improve the thermal regulation, in particular the cooling, of an electronic component.

[0004] The invention thus relates to a cooling device configured to cool at least one electronic component, the cooling device comprising: - a base defining an enclosure configured to receive, on a base surface, at least one electronic component, and to be filled with a dielectric fluid intended to immerse this electronic component, - a lid configured to cooperate with the base to close the enclosure, - an internal structure distinct from the base and the lid, this internal structure being disposed within the enclosure and comprising at least one internal channel configured to direct a portion of the dielectric fluid towards the electronic component, this internal channel being thermally isolated from the electronic component or any other possible electronic component in the enclosure.

[0005] Thanks to the invention, the electronic component(s) are cooled by direct contact with a dielectric-type cooling fluid. The internal structure advantageously optimizes the volume of dielectric fluid and directs this fluid directly and efficiently to the areas of interest to be cooled, such as electronic components. The thermally insulated internal channel allows unheated fluid to be delivered to electronic components located behind other electronic components. This balances the cooling across the row of electronic components.

[0006] Furthermore, the internal channel allows the speed of the dielectric fluid to be controlled and directed towards the electronic components requiring cooling, by example with a predetermined angle. In the invention, only a part of the dielectric fluid passes through the internal channel, and not all of the dielectric fluid that enters the enclosure.

[0007] According to one aspect of the invention, the enclosure includes at least one fluid inlet and at least one fluid outlet so that dielectric fluid can flow in the enclosure in a principal direction of flow between the fluid inlet and the fluid outlet.

[0008] According to one aspect of the invention, the internal structure extends between the inlet and outlet of the enclosure.

[0009] According to one aspect of the invention, the internal channel extends between one or more components and the cover. For example, the internal channel thus passes over electronic component(s) in the enclosure, before opening onto the electronic component that it is to cool.

[0010] According to one aspect of the invention, the enclosure includes a space between the internal structure and the electronic component and defining a path for dielectric fluid, this path being distinct from the internal channel.

[0011] According to one aspect of the invention, the outlet of the internal channel opens onto a lateral face of the electronic component.

[0012] According to another aspect of the invention, the outlet of the internal channel opens onto the top of the electronic component.

[0013] According to one aspect of the invention, the internal channel comprises a plurality of outlets, for example opening onto both the lateral face and the top of the electronic component.

[0014] According to one aspect of the invention, the internal structure comprises several internal channels. For example, each channel is configured to direct a portion of the dielectric fluid to a separate electronic component.

[0015] According to one aspect of the invention, the internal structure comprises two internal channels in succession to cool two successive electronic components.

[0016] According to one aspect of the invention, the internal channel passes completely over one of the electronic components in the enclosure.

[0017] For example, the internal channel passes over the first component in the main direction of fluid flow.

[0018] According to one aspect of the invention, the internal channel passes over only a part of the top of one of the electronic components in the enclosure.

[0019] According to one aspect of the invention, the internal channel can be provided to open onto two or more electronic components.

[0020] According to one aspect of the invention, the internal channel extends over only a portion of the total length of the enclosure, in particular in the main direction of fluid flow.

[0021] According to one aspect of the invention, the internal channel includes an inlet located opposite the inlet of the enclosure.

[0022] According to one aspect of the invention, the internal channel may also include an inlet between two successive electronic components.

[0023] According to one aspect of the invention, the internal channel makes it possible to manage the speed of the fluid and to direct it towards areas with a high need for cooling, such as electronic components, for example by presenting a predetermined angle to an outlet of this internal channel.

[0024] According to one aspect of the invention, the outlet of the internal channel forms an angle chosen for example between 10° and 45° with respect to the bottom of the base.

[0025] For example, the internal channel includes output branches and a single input branch.

[0026] For example, the internal channel includes outlet branches that are bent relative to an inlet branch of the internal channel.

[0027] According to one aspect of the invention, the output branches are parallel to each other.

[0028] Alternatively, the output branches form ramifications.

[0029] According to one aspect of the invention, the output branches form angles between them of between 5° and 45° for example.

[0030] According to one aspect of the invention, the base comprises a wall or walls configured to separate locations intended to each receive an electronic component.

[0031] Advantageously, these walls make it possible to limit, or even eliminate, dead zones for the portion of the dielectric fluid circulating in the path not channeled by the internal channel(s) of the internal structure

[0032] These dead zones are undesirable insofar as the part of the dielectric fluid in these dead zones does not participate in heat exchanges and may have a temperature higher than the temperature of the flowing dielectric fluid.

[0033] According to one aspect of the invention, the walls extend over the entire width of the base.

[0034] According to one aspect of the invention, the base comprises a flat bottom, namely non-stepped.

[0035] According to one aspect of the invention, the internal structure can be a single piece.

[0036] Alternatively, the internal structure may comprise several parts fixed together to form the internal channel(s).

[0037] According to one aspect of the invention, these parts of the internal structure can be assembled with complementary shapes, such as pins cooperating with respective grooves.

[0038] According to one aspect of the invention, these parts of the internal structure can be assembled by means of fastening such as glue or screws.

[0039] According to one aspect of the invention, each of these parts comprises at least one portion of an internal channel.

[0040] According to one aspect of the invention, certain parts may include no internal channel portion.

[0041] According to one aspect of the invention, the internal structure is made of an insulating material (in the thermal sense) such as plastic.

[0042] According to one aspect of the invention, the parts of the internal structure are obtained, for example, by molding.

[0043] According to one aspect of the invention, the internal structure can be glued or screwed onto the base and / or onto the lid, for example so that the fixed internal structure can withstand shocks and vibrations.

[0044] In one embodiment, the internal structure may have spaces of varying heights. For example, to conform to the shapes of electronic components.

[0045] The term "height" means a direction that is generally perpendicular to the plane in which the base mainly extends.

[0046] According to one aspect of the invention, the internal structure includes a housing configured to receive an electronic card.

[0047] According to one aspect of the invention, this housing is separate from the internal channel.

[0048] According to one aspect of the invention, the housing is configured to be traversed by dielectric fluid.

[0049] The housing thus defines a path for dielectric fluid.

[0050] According to one aspect of the invention, this housing is located in the upper part of the enclosure.

[0051] According to one aspect of the invention, the housing includes a fluid inlet placed opposite the inlet of the enclosure and a fluid outlet opposite the outlet of the enclosure.

[0052] The fluid entering the enclosure is thus distributed in this housing and in the internal channel.

[0053] According to one aspect of the invention, the housing for the electronic card can extend over at least a portion of the total length of the enclosure or over its entire length.

[0054] According to one aspect of the invention, the electronic board may have electronic components on at least one of its faces, in particular its upper face oriented towards the lid and / or its lower face oriented towards the base.

[0055] According to one aspect of the invention, the electronic board is fixed in the housing, for example, of the screws.

[0056] According to one aspect of the invention, the housing can receive one or more deflectors upstream of some of the components of the electronic board to direct the portion of the dielectric fluid along desired flow lines.

[0057] According to one aspect of the invention, the deflector can deflect the dielectric fluid relative to the electronic component.

[0058] This is advantageous when the electronic component of the electronic board may exhibit a fragility to the dielectric fluid.

[0059] Thus, the part of the dielectric fluid circulating in the housing does not generate wear on the fragile electronic component, for example wear on the tin solder joints of the fragile electronic component on the electronic board.

[0060] According to one aspect of the invention, the deflector can be positioned in a space formed between two consecutive fragile electronic components so as to deflect the circulation of the dielectric fluid from these two components.

[0061] According to one aspect of the invention, the deflector can be positioned in a space formed between a non-fragile electronic component and the fragile electronic component which are placed one after the other, so as to cool the non-fragile electronic component while protecting the fragile electronic component which follows.

[0062] According to one aspect of the invention, the electronic board may include an inductance component (or “inductor” in English) to be cooled with dielectric fluid.

[0063] According to one aspect of the invention, the electronic component cooled by the internal channel is connected to busbars on the bottom of the enclosure base.

[0064] In another embodiment, the internal structure includes a separator between an aerated zone comprising the electronic board and an immersed zone of dielectric fluid comprising the internal channel.

[0065] According to one aspect of the invention, the ventilated area is located above the entire submerged area between the inlet and outlet of the enclosure.

[0066] According to one aspect of the invention, the immersed area includes the electronic component fixed to the bottom of the base which has greater thermal losses than the electronic board contained in the ventilated area.

[0067] For example, the heat losses show a difference of a factor of 100 between the submerged area and the ventilated area.

[0068] According to one aspect of the invention, the separator is fixed to the enclosure lid so as to be sealed around its entire perimeter, allowing the volume of dielectric fluid to circulate only within the submerged area of ​​the internal structure. For example, the separator is fixed to the enclosure lid by sealing.

[0069] Thus, the heat generated by the electronic component in the immersed area does not dissipate towards the electronic board in the ventilated area.

[0070] Thus, the separator makes it possible to separate the aerated zone from the immersed zone, so that each zone can be cooled independently allowing thermal decoupling.

[0071] According to one aspect of the invention, the electronic board of the ventilated area is cooled by an airflow.

[0072] The invention also relates to a system comprising at least two electronic components and a cooling device as described above, configured to cool the electronic components.

[0073] Other features, details and advantages of the invention will become clearer upon reading the following description on the one hand, and several illustrative and non-limiting examples of embodiments given with reference to the accompanying schematic drawings on the other hand, in which:

[0074] [Fig-1] Fig. 1 is a cross-sectional profile view of the cooling device according to the invention;

[0075] [Fig.2] Fig.2 is a profile view of the internal structure of the device cooling illustrated in [Fig.1];

[0076] [Fig. 3] Fig. 3 is a cross-sectional profile view of another embodiment of the cooling device according to the invention;

[0077] [Fig.4] Fig.4 is a cross-sectional profile view of another embodiment of the cooling device according to the invention.

[0078] The features, variants, and different embodiments of the invention can be combined in various ways, provided they are not incompatible or mutually exclusive. In particular, variants of the invention may be conceived comprising only a selection of features, described hereafter in isolation from the other described features, if this selection of features is sufficient to confer a technical advantage and / or to differentiate the invention from the prior art.

[0079] Figure 1 shows a cooling device 3 which is part of a system 1 of the type forming an inverter, for example configured to be mounted on a motor vehicle. This system 1 includes electronic components 2, of different heights and placed in a row (components 2a, 2b and 2c are noted in the order of the row), cooled by this cooling device 3.

[0080] The cooling device 3 includes a housing 10 formed of a lid 16 which cooperates with a base 12 to close this same housing 10. This base 12 includes a flat bottom 14.

[0081] The enclosure 10 receives the electronic components 2 on the bottom 14 and can be filled with a dielectric fluid for immersing them. The enclosure 10 includes a fluid inlet 18 and a fluid outlet 19. The dielectric fluid flows in a main flow direction XP from the inlet 18 to the fluid outlet 19.

[0082] The enclosure 10 also includes an internal structure 20 separate from the base 12 and the cover 16. This internal structure 20 has spaces of varying heights to accommodate the shapes of the electronic components 2 mounted in said enclosure. The internal structure 20 extends between the fluid inlet 18 and outlet 19 and is made of an insulating material such as plastic. The internal structure 20 is, for example, glued or screwed onto the cover 16. Here, the internal structure 20 is pressed against the cover 16, and there is no provision for receiving electronic components between the internal structure 20 and the cover 16.

[0083] The internal structure 20 comprises several internal channels 100, 200 and 300 which direct a portion of the dielectric fluid respectively towards the different electronic components 2. These internal channels 100, 200 and 300 extend, according to the height, between the electronic components 2 and the cover 16, and each channel extends over only a portion of the total length of the enclosure 10, along the main flow direction XP.

[0084] The enclosure 10 further includes a space between the internal structure 20 and the electronic component 2, a space which defines a path 400 for dielectric fluid. This path 400 is distinct from the internal channels 100, 200 and 300.

[0085] In the example of [Fig. 1], the internal channel 100 passes completely over the first electronic component 2a in the main direction XP of fluid flow. The internal channel 200 passes over a portion of the apex 24 of this same first electronic component 2a and directs the fluid towards the apex 24 of this component 2a. On the other hand, the internal channel 300 passes over a portion of the apex 24 of the last electronic component 2c and directs the fluid towards the apex 24 of this component 2c.

[0086] Regarding the internal channel 100, it passes above the internal channel 200 and precedes the internal channel 300. Thus, dielectric fluid circulates in the internal channel 100 to cool the second electronic component 2b, then flows into the internal channel 300 to cool the last electronic component 2c. This type of circuit which includes several internal channels 100 and 300 allows to cool several electronic components 2 successive.

[0087] The internal channels 100, 200, and 300 each have at least three outputs, respectively 110, 210, and 310, and one input 102, 202, and 302. The internal channel 100 has three outputs 110 that open onto a lateral face 22 of the second electronic component 2b. The internal channels 200 and 300 each have three outputs 210 and 310 that open onto, respectively, the vertex 24 of the first electronic component 2a and the vertex 24 of the last electronic component 2c.

[0088] The internal channels 100 and 200 each include an inlet 102 and 202, located opposite the inlet 18 of the fluid of the enclosure 10. The internal channel 300 presents its inlet 302 between two successive electronic components 2, here between the second electronic component 2b and the last electronic component 2c.

[0089] Each of the internal channels 100, 200 and 300 includes output branches 105, 205 and 305 respectively, which lead to outputs 110, 210 and 310. On the other hand, each input 102, 202 and 302 leads to an input branch 107, 207 and 307 of the internal channels 100, 200 and 300.

[0090] These internal channels 100, 200 and 300 allow the speed of the dielectric fluid to be controlled and directed towards the electronic components 2 which require cooling. For this purpose, their outlets 110, 210 and 310 have a predetermined angle chosen between 10° and 45° with respect to the bottom 14 of the base 12.

[0091] Each of the internal channels 200 and 300 has angled output branches 205 and 305 relative to their input branches 207 and 307. The input branch 207 and 307 is parallel to the base 14 of the pedestal 12. The output branches 205 and 305 are parallel to each other for each of the internal channels 200 and 300. Internal channel 100, however, has output branches 105 that form ramifications. In this case, the output branches 105 form angles between 5° and 45° with respect to the base 14 of the pedestal 12 (or with respect to the axis XP).

[0092] The base 12 has walls 30 that separate slots 39, each intended to receive an electronic component 2. The walls 30 extend across the entire width of the base 12 (the width being measured in a direction transverse to the axis XP). These walls 30 limit the dead zones for the portion of the dielectric fluid flowing in the unchanneled path 400. These dead zones are undesirable because the portion of the dielectric fluid present there does not participate in heat exchange and may have a temperature higher than the temperature of the dielectric fluid flowing elsewhere.

[0093] Figure 2 shows the internal structure 20 which comprises three parts 22, 24, and 26 (in exploded view at the top of [Fig. 2]) fixed together to form the internal channels 100, 200 and 300. These parts 22, 24 and 26 are obtained by molding and are assembled with pins 28 cooperating with respective grooves 29 of the adjacent part. Part 22 forms the top of the internal structure 20, part 26 forms the bottom of the internal structure 20, and part 24 is interposed between the upper part 22 and the lower part 26. These parts 22, 24, and 26 each comprise a portion of internal channel 100 and / or 200 and / or 300. Of course, the internal structure 20 can be made by a different assembly, with fewer than three parts or with more than three parts.

[0094] Figure 3 presents another embodiment according to the invention of a device Cooling 3B includes an internal structure 20B which comprises a housing 40 that accommodates an electronic board 4. The internal structure 20B also includes an internal channel 200 similar to that described in the previous example. The housing 40 is separate from the internal channel 200. The internal structure 20B also features spaces of varying heights to accommodate the shapes of the electronic components 2.

[0095] Housing 40 is located in the upper part of enclosure 10 and extends along the entire length of enclosure 10. Housing 40 carries a dielectric fluid and defines a path for the dielectric fluid. This housing 40 includes a fluid inlet 42, positioned opposite the fluid inlet 18 of enclosure 10, and a fluid outlet 44 opposite the fluid outlet 19 of enclosure 10. Thus, the fluid enters enclosure 10 and is distributed both into this housing 40 and into the internal channel 200.

[0096] The electronic board 4 is fixed in the housing 40 by screws 46. This electronic board 4 carries electronic components 8 on its upper face 41 oriented towards the cover 16 and / or its lower face 43 oriented towards the base 12.

[0097] The housing 40 also receives deflectors 48 upstream of some of the electronic components 8 of the electronic board 4 to direct the portion of the dielectric fluid along desired flow lines. Thus, the deflector 48 diverts the dielectric fluid away from a fragile electronic component 81 that exhibits a weakness in the dielectric fluid, linked, for example, to its fragile solder joint to the electronic board 4. Therefore, the portion of the dielectric fluid flowing in the housing does not cause fatigue in the fragile electronic component 81.

[0098] The deflector 48 is, for example, positioned in a space formed between a non-fragile electronic component 82 and a fragile electronic component 81, which are placed one after the other. This allows the non-fragile electronic component 82 to be cooled and the fragile electronic component 81 to be protected.

[0099] The electronic card 4 includes an inductance component or "inductor" (not shown) to be cooled with dielectric fluid.

[0100] The electronic components 2 cooled by the internal channel 200 are connected to busbars (not shown) on the bottom 14 of the base 12.

[0101] Figure 4 shows another embodiment of the invention in which a cooling device 3C comprises an internal structure 20C which includes a separator 50 between a ventilated zone 52 and an immersed zone 54. The ventilated zone 52 receives the electronic board 4, which is cooled by an airflow. The immersed zone 54 includes the electronic components 2 fixed to the bottom 14 of the base 12 and an internal channel 500, which is here a simple straight section. This immersed zone 54 is filled with a dielectric fluid.

[0102] The ventilated zone 52 is located above the entire immersed zone 54 between the fluid inlet 18 and outlet 19 of the enclosure 10. The ventilated zone is closed by the cover 16. On the other hand, the separator 50, which is generally flat in shape, is fixed to the cover 16 in a sealed manner around its entire perimeter by means of a gasket 59. Thus, the volume of dielectric fluid circulates only in the immersed zone 52 of the internal structure 20C.

[0103] The internal structure 20C, with the separator 50, is formed from a single piece, for example being a molded part.

[0104] The electronic components 2 contained in the immersed zone 54 exhibit greater heat loss than the electronic board 4 contained in the ventilated zone 52. Thus, thanks to the separator 50, the heat generated by the electronic components 2 in the immersed zone 54 is not dissipated to the electronic board 4 in the ventilated zone 52. The separator 50 therefore separates the ventilated zone 52 from the immersed zone 54, so that each zone can be cooled independently. This provides thermal decoupling.

Claims

Demands

1. Cooling device (3; 3B; 3C) configured to cool at least one electronic component (2), the cooling device comprising: - a base (12) defining an enclosure (10) configured to receive, on a bottom (14) of the base (12), said at least one electronic component (2), and to be filled with a dielectric fluid intended to immerse said electronic component (2), - a cover (16) configured to cooperate with the base (14) to close the enclosure (10), - an internal structure (20; 20B;20C) separate from the base (12) and the cover (16), this internal structure (20) being disposed in the enclosure (10) and comprising at least one internal channel (100, 200, 300, 500) configured to direct a portion of the dielectric fluid towards the electronic component (2), this internal channel (100, 200, 300, 500) being thermally insulated from the electronic component (2) or any other possible electronic component (2) in the enclosure (10).;

2. Cooling device (3) according to claim 1, wherein the internal channel (100, 200, 300) comprises outlet branches and a single inlet branch.

3. Cooling device (3) according to claim 1 or 2, wherein the internal channel (100, 200, 300) comprises outlet branches angled (205, 305) relative to an inlet branch of the internal channel.

4. Cooling device (3) according to claim 2 or 3, wherein the outlet branches form ramifications or are parallel to each other.

5. Cooling device (3) according to any one of the preceding claims, wherein the internal channel (100, 200, 300) passes totally over one of the electronic components (2) in the enclosure or passes over only part of the top of one of the electronic components (2) in the enclosure.

6. Cooling device (3) according to any one of the preceding claims, wherein the base (12) has a wall (30) or walls (30) configured to separate locations (39) each intended to receive an electronic component (2).

7. Cooling device (3) according to any one of the preceding claims, wherein the internal structure (20) is glued or screwed onto the base and / or onto the lid.

8. Cooling device (3) according to any one of the preceding claims, wherein the internal structure (20) comprises several parts (22, 24, 26) fixed together to form the internal channel(s) (100, 200, 300).

9. Cooling device according to any one of the preceding claims, wherein the internal structure (20) includes a housing (40) configured to receive an electronic card (4), this housing (40) being separate from the internal channel (100, 200, 300) and configured to be traversed by dielectric fluid.

10. Cooling device according to the preceding claim, wherein the housing (40) receives one or more deflectors (48) upstream of some of the electronic components (8) of the electronic board (4) to direct the portion of the dielectric fluid along desired flow lines.

11. Cooling device according to any one of claims 1 to 8, wherein the internal structure (20) comprises a separator (50) between an aerated zone (52) comprising the electronic board (4) and an immersed zone (54) of dielectric fluid comprising the internal channel (500).

12. Cooling device according to the preceding claim, in which the separator (50) is fixed to the cover (16) of the enclosure (10) so as to be sealed around its entire perimeter.

13. Cooling device according to any one of the preceding claims, wherein the internal structure (20) has spaces of varying heights.

14. Cooling device according to any one of the preceding claims, wherein the internal structure (20) comprises several internal channels (100, 200, 300, 500).

15. System (1) comprising at least two electronic components (2) and a cooling device (3; 3B; 3C) according to the claims 1 to 14, configured to cool electronic components (2).

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