Ceramic electronic component

Abstract

To provide a ceramic electronic component.SOLUTION: There is provided a ceramic electronic component including: a chip component with an approximately rectangular parallelepiped shape, in which a terminal electrode is formed on a pair of approximately rectangular chip end surfaces having a pair of chip first sides and a pair of chip second sides; and a metal terminal part provided corresponding to each chip end surface. The metal terminal part includes: an electrode facing part facing the chip end surface; a mating arm part to grip the chip component from both end sides of the chip first side; and a mounting part. The chip component is arranged such that the chip second side is along a horizontal direction. In the electrode facing part, a second through hole having a peripheral part to which a lower arm part is connected is formed corresponding to the chip component. The terminal electrode and the electrode facing part are joined by a connection member located at a place different from that of the second through hole. A joint portion formed of the lower arm part, the second through hole, and the connection member is aligned in a height direction from the mounting part in the order of the lower arm part, the second through hole, and the joint portion.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a ceramic electronic component with metal terminals, which has a chip component and a metal terminal attached to the chip component. [Background technology]

[0002] As ceramic electronic components such as ceramic capacitors, in addition to ordinary chip components that are directly surface-mounted on a substrate, chip components with metal terminals attached have been proposed. It has been reported that ceramic electronic components with metal terminals have the effect of mitigating the deformation stress that the chip components receive from the substrate after mounting and protecting the chip components from impacts, etc., and are used in fields where durability, reliability, etc. are required.

[0003] It has also been reported that metal terminals have the effect of preventing vibrations generated in chip components from being transmitted to the mounting board, and in order to enhance this effect, it has been proposed to provide a connecting portion between the mounting portion and the connection portion (electrode opposing portion) of the metal terminal. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-95490 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, conventional metal terminals that provide a connecting portion between the mounting portion and the connection portion (electrode opposing portion) have the problem that the mounting area (projected area from the Z-axis direction) of the ceramic electronic component is somewhat larger than the projected area of ​​the chip component.

[0006] The present invention has been made in consideration of the above-described circumstances, and has an object to provide a ceramic electronic component that prevents vibrations generated in a chip component from being transmitted to a mounting board via metal terminals, protects the chip component from deformation stress and impacts received from the board after mounting, and prevents an increase in the mounting area. [Means for solving the problem]

[0007] In order to achieve the above object, a ceramic electronic component according to the present invention comprises: a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces, The pair of metal terminal portions each include an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a plurality of pairs of fitting arms extending from the electrode facing portions to the chip side surfaces and configured to sandwich and hold the chip component from both ends of the first chip side; The mounting portion is connected to one of the second sides of the terminal in the electrode opposing portion, extends from the one of the second sides of the terminal toward the chip component, and has at least a portion substantially perpendicular to the electrode opposing portion.

[0008] The height direction of the metal terminal portion in the ceramic electronic component according to the present invention is the same as the direction of the first chip side, which is the longer side of the chip end face, so that the projected area in the height direction of the ceramic electronic component is small. Also, because the mounting portion is connected to the second terminal side of the electrode opposing portion, the ceramic electronic component according to the present invention has a smaller projected area in the height direction than the conventional technology in which the mounting portion is connected to the first terminal side via a connecting portion, and the mounting area can be further reduced.

[0009] In addition, since the height direction of the metal terminal portion in the ceramic electronic component according to the present invention is the same as the long side of the chip end face, even if a configuration is adopted in which a plurality of chip components are arranged in a direction parallel to the mounting surface, rather than stacked in the height direction, an increase in the mounting area is suppressed. When a plurality of chip components are arranged in a direction parallel to the mounting surface, the mounting height of such a ceramic electronic component does not change even if the number of chip components changes, so that it is suitable for mounting on a mounting board used in a device with strict requirements for low height. Furthermore, in a ceramic electronic component configured to arrange a plurality of chip components in a direction parallel to the mounting surface, only one chip component is held between the pair of fitting arms along the fitting direction, so that the bonding reliability between the chip component and the metal terminal portion is high, and the reliability against impact and vibration is also high. Furthermore, the metal terminal portion in which the pair of fitting arms hold only one chip component along the fitting direction can reliably hold the chip component even if the first side of the chip component is long.

[0010] Furthermore, in the ceramic electronic component of the present invention, the fitting arm portions clamp and hold the chip component from both ends of the first side, which is the longer side of the chip end face, so that the metal terminal portions effectively provide a stress relaxation effect, suppressing the transmission of vibrations from the chip component to the mounting board, and preventing noise.

[0011] For example, the chip component is a multilayer capacitor in which internal electrode layers and dielectric layers are laminated, A stacking direction in the chip part may be approximately parallel to the second side of the chip.

[0012] In such ceramic electronic components, the internal electrode layers are arranged perpendicular to the mounting surface, making it possible to lower the ESL compared to components in which the internal electrode layers are arranged parallel to the mounting surface. In addition, the first side of the chip that is held by the mating arm is perpendicular to the lamination direction, so there is little dimensional variation. Therefore, by holding a portion of the chip component with little dimensional variation, the metal terminal can hold the chip component more reliably.

[0013] Furthermore, for example, a first through hole may be formed in a portion of the electrode opposing portion facing the chip end surface.

[0014] Ceramic electronic components having such first through holes are easy to manufacture because, for example, after assembling the metal terminal portion and the chip component, it is possible to apply solder, conductive adhesive, or the like that electrically and mechanically connects the chip component and the metal terminal portion. Also, the state of the bonding material that electrically and mechanically connects the chip component and the metal terminal can be visually confirmed from the outside of the ceramic electronic component, which makes it possible to suppress the occurrence of manufacturing defects.

[0015] Furthermore, for example, the electrode facing portion may be formed with a plurality of protrusions that protrude toward the chip end face and come into contact with the chip end face.

[0016] The formation of the protrusions on the electrode facing portions reduces the area of ​​direct contact between the electrode facing portions and the chip end faces, preventing the problem of vibrations of the chip components being transmitted to the mounting board and suppressing the generation of noise from the ceramic electronic components. The protrusions on the electrode facing portions also form gaps between the electrode facing portions and the chip end faces. Therefore, by adjusting the gaps formed between the electrode facing portions and the chip end faces with the protrusions, the state of the bonding material that electrically and mechanically connects the chip components and the metal terminal portions can be controlled, and the bonding state between the chip components and the metal terminals can be suitably controlled.

[0017] Also, for example, the electrode opposing portion may be formed with a second through hole having a periphery to which a lower arm portion, which is one of the pairs of mating arm portions, is connected.

[0018] The metal terminal portion having the second through hole has a shape that is easily elastically deformed around the lower arm portion that supports the chip component, and therefore can effectively relieve stress generated in the ceramic electronic component and absorb vibrations. Therefore, a ceramic electronic component having such a metal terminal portion can effectively prevent acoustic noise and has good bonding reliability with the mounting board when mounted.

[0019] Also, for example, an upper arm portion that is another of the pairs of fitting arm portions may be connected to a second side of the other terminal in the electrode opposing portion, The chip component may be sandwiched between the upper arm portion and the lower arm portion from both ends of the first side of the terminal.

[0020] A metal terminal portion in which the mounting portion is connected to one of the second terminal sides and the upper arm portion is connected to the other chip second side can have a short length in the height direction (terminal first side direction), and a ceramic electronic component having such a metal terminal portion is advantageous in terms of reducing the height. Since such a metal terminal portion has a configuration in which the lower arm portion is not connected to the terminal second side, the upper arm portion and the lower arm portion can be formed at positions where they overlap with the mounting portion in the terminal second side direction. Therefore, such a ceramic electronic component is advantageous in terms of miniaturization.

[0021] Also, for example, the electrode opposing portion has a plate main body portion facing the chip end surface, and a terminal connection portion located below the plate main body portion and connecting the plate main body portion and the mounting portion, The second through hole is formed such that a peripheral portion of the second through hole spans the plate body portion and the terminal connection portion, The lower arm portion may extend from the terminal connection portion.

[0022] By having the lower arm portion extend from the terminal connection portion 36, the transmission path between the terminal electrode of the chip capacitor and the mounting board is shorter than in the case where these are connected to the plate body portion.

[0023] Also, for example, a first through hole and a second through hole having a peripheral portion to which a lower arm portion that is one of the pairs of fitting arm portions is connected and located closer to the mounting portion than the first through hole may be formed in the electrode opposing portion, The second through hole may have an opening width in a width direction parallel to the second side of the terminal that is wider than the opening width of the first through hole.

[0024] Although the width of the first through hole and the second through hole in the width direction is not particularly limited, by widening the opening width of the second through hole, the stress relaxation effect of the metal terminal portion and the effect of preventing acoustic noise can be effectively enhanced. Also, by making the opening width of the first through hole narrower than that of the second through hole, it is possible to prevent the bonding strength between the chip component and the electrode opposing portion by a bonding member or the like from becoming excessively high, so that such a ceramic electronic component can suppress acoustic noise. [Brief description of the drawings]

[0025] [Figure 1] FIG. 1 is a schematic perspective view showing a ceramic electronic component according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a front view of the ceramic electronic component shown in FIG. [Diagram 3] FIG. 3 is a left side view of the ceramic electronic component shown in FIG. [Figure 4] FIG. 4 is a top view of the ceramic electronic component shown in FIG. [Diagram 5] FIG. 5 is a bottom view of the ceramic electronic component shown in FIG. [Figure 6] FIG. 6 is a schematic cross-sectional view of the ceramic electronic component shown in FIG. [Figure 7]FIG. 7 is a schematic perspective view showing a ceramic electronic component according to a second embodiment of the present invention. [Figure 8] FIG. 8 is a front view of the ceramic electronic component shown in FIG. [Figure 9] FIG. 9 is a left side view of the ceramic electronic component shown in FIG. [Figure 10] FIG. 10 is a top view of the ceramic electronic component shown in FIG. [Figure 11] FIG. 11 is a bottom view of the ceramic electronic component shown in FIG. [Figure 12] FIG. 12 is a left side view of a ceramic electronic component according to a first modified example. [Figure 13] FIG. 13 is a left side view of a ceramic electronic component according to a second modified example. [Figure 14] FIG. 14 is a perspective view of a ceramic capacitor according to a comparative example. [Figure 15] FIG. 15 is a graph showing the measurement results of the impedance and resistance component of the ceramic capacitors according to the examples and the comparative examples. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0027] First embodiment 1 is a schematic perspective view showing a ceramic capacitor 10 according to a first embodiment of the present invention. The ceramic capacitor 10 has a chip capacitor 20 as a chip component, and a pair of metal terminal portions 30, 40. The ceramic capacitor 10 according to the first embodiment has two chip capacitors 20, but the number of chip capacitors 20 included in the ceramic capacitor 10 is not particularly limited as long as it is a plurality.

[0028] In the description of each embodiment, a ceramic capacitor having metal terminal portions 30, 40 attached to a chip capacitor 20 is taken as an example, but the ceramic electronic component of the present invention is not limited thereto, and may be a chip component other than a capacitor having metal terminal portions 30, 40 attached thereto. In the description of each embodiment, as shown in Figs. 1 to 11, the direction connecting the first side surface 20c and the second side surface 20d of the chip capacitor 20 (direction parallel to the chip second side 20h) is taken as the X-axis direction, the direction connecting the first end surface 20a and the second end surface 20b (direction parallel to the chip third side 20j) is taken as the Y-axis direction, and the direction connecting the third side surface 20e and the fourth side surface 20f (direction parallel to the chip first side 20g) is taken as the Z-axis direction.

[0029] The chip capacitor 20 has a substantially rectangular parallelepiped shape, and the two chip capacitors 20 have substantially the same shape and size. As shown in Fig. 2, the chip capacitor 20 has a pair of chip end faces facing each other, and the pair of chip end faces is composed of a first end face 20a and a second end face 20b. As shown in Figs. 1, 2, and 4, the first end face 20a and the second end face 20b are substantially rectangular, and of the four sides constituting the rectangle of the first end face 20a and the second end face 20b, a pair of longer sides are chip first sides 20g (see Fig. 2), and a pair of shorter sides are chip second sides 20h (see Fig. 3).

[0030] The chip capacitor 20 is arranged so that the first end face 20a and the second end face 20b are perpendicular to the mounting surface, in other words, so that the third chip side 20j of the chip capacitor 20 connecting the first end face 20a and the second end face 20b is parallel to the mounting surface of the ceramic capacitor 10. The mounting surface of the ceramic capacitor 10 is a surface to which the ceramic capacitor 10 is attached by solder or the like so that mounting portions 38, 48 of the metal terminal portions 30, 40 described later face each other, and is a surface parallel to the XY plane shown in FIG.

[0031] Comparing the length L1 of the chip first side 20g shown in Fig. 2 with the length L2 of the chip second side 20h shown in Fig. 4, the chip second side 20h is shorter than the chip first side 20g (L1>L2). The ratio of the lengths of the chip first side 20g and the chip second side 20h is not particularly limited, but for example, L2 / L1 is about 0.3 to 0.7.

[0032] The chip capacitor 20 is arranged so that the chip first side 20g is perpendicular to the mounting surface as shown in Fig. 2, and the chip second side 20h is parallel to the mounting surface as shown in Fig. 4. Therefore, among the first to fourth side surfaces 20c to 20f, which are the four chip side surfaces connecting the first end surface 20a and the second end surface 20b, the first side surface 20c and the second side surface 20d, which have a large area, are arranged perpendicular to the mounting surface, and the third side surface 20e and the fourth side surface 20f, which have a smaller area than the first side surface 20c and the second side surface 20d, are arranged parallel to the mounting surface. The third side surface 20e is an upper side surface facing in the opposite direction to the lower mounting parts 38, 48, and the fourth side surface 20f is a lower side surface facing the mounting parts 38, 48.

[0033] 1, 2 and 4, the first terminal electrode 22 of the chip capacitor 20 is formed so as to extend from the first end face 20a around parts of the first to fourth side faces 20c to 20f. Therefore, the first terminal electrode 22 has a portion disposed on the first end face 20a and a portion disposed on the first to fourth side faces 20c to 20f.

[0034] The second terminal electrode 24 of the chip capacitor 20 is formed so as to wrap around from the second end face 20b to other parts of the side faces 20c to 20f (parts different from the part around which the first terminal electrode 22 wraps). Therefore, the second terminal electrode 24 has a part arranged on the second end face 20b and a part arranged on the first side face 20c to the fourth side face 20f (see Figs. 1, 2 and 4). On the first side face 20c to the fourth side face 20f, the first terminal electrode 22 and the second terminal electrode 24 are formed at a predetermined distance from each other.

[0035] 6, which shows a schematic internal structure of the chip capacitor 20, the chip capacitor 20 is a laminated capacitor in which internal electrode layers 26 and dielectric layers 28 are laminated. Some of the internal electrode layers 26 are connected to the first terminal electrode 22, and others are connected to the second terminal electrode 24. The internal electrode layers 26 connected to the first terminal electrode 22 and the internal electrode layers 26 connected to the second terminal electrode 24 are laminated alternately with the dielectric layer 28 sandwiched therebetween.

[0036] As shown in Fig. 6, the lamination direction in the chip capacitor 20 is parallel to the second chip side 20h shown in Fig. 4. Therefore, the internal electrode layers 26 shown in Fig. 6 are disposed perpendicular to the mounting surface.

[0037] The material of the dielectric layers 28 in the chip capacitor 20 is not particularly limited, and may be, for example, a dielectric material such as calcium titanate, strontium titanate, barium titanate, or a mixture thereof. The thickness of each dielectric layer 28 is not particularly limited, but is generally several μm to several hundred μm. In this embodiment, the thickness is preferably 1.0 to 5.0 μm. In addition, the dielectric layers 28 are preferably mainly composed of barium titanate, which can increase the capacitance of the capacitor.

[0038] The conductive material contained in the internal electrode layer 26 is not particularly limited, but if the constituent material of the dielectric layer 28 has reduction resistance, a relatively inexpensive base metal can be used. As the base metal, Ni or a Ni alloy is preferable. As the Ni alloy, an alloy of Ni and one or more elements selected from Mn, Cr, Co, and Al is preferable, and the Ni content in the alloy is preferably 95% by weight or more. Note that Ni or a Ni alloy may contain various trace components such as P at about 0.1% by weight or less. In addition, the internal electrode layer 26 may be formed using a commercially available electrode paste. The thickness of the internal electrode layer 26 may be appropriately determined depending on the application, etc.

[0039] The material of the first and second terminal electrodes 22, 24 is not particularly limited, and typically copper, copper alloy, nickel, nickel alloy, etc. are used, but silver, silver and palladium alloy, etc. can also be used. The thickness of the first and second terminal electrodes 22, 24 is not particularly limited, and typically is about 10 to 50 μm. The surfaces of the first and second terminal electrodes 22, 24 may be coated with at least one metal film selected from Ni, Cu, Sn, etc.

[0040] The shape and size of the chip capacitor 20 may be appropriately determined depending on the purpose and use. The chip capacitor 20 is, for example, about a length (L3) of 1.0 to 6.5 mm, preferably 3.2 to 5.9 mm, a width (L1) of 0.5 to 5.5 mm, preferably 1.6 to 5.2 mm, and a thickness (L2) of 0.3 to 3.2 mm, preferably 0.8 to 2.9 mm. When there are multiple chip capacitors 20, they may be different in size and shape.

[0041] The pair of metal terminal portions 30, 40 in the ceramic capacitor 10 are provided corresponding to the first and second end faces 20a, 20b which are a pair of chip end faces. That is, the first metal terminal portion 30 which is one of the pair of metal terminal portions 30, 40 is provided corresponding to the first terminal electrode 22 which is one of the pair of terminal electrodes 22, 24, and the second metal terminal portion 40 which is the other of the pair of metal terminal portions 30, 40 is provided corresponding to the second terminal electrode 24 which is the other of the pair of terminal electrodes 22, 24.

[0042] The first metal terminal portion 30 has an electrode facing portion 36 facing the first terminal electrode 22, multiple pairs of engaging arm portions 31a, 31b, 33a, 33b that clamp the chip capacitor 20 in the Z-axis direction from both ends of the chip first side 20g, and a mounting portion 38 that extends from the electrode facing portion 36 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 36.

[0043] As shown in Figure 2, the electrode opposing portion 36 is an approximately rectangular plate-like shape having a pair of terminal first sides 36g that are approximately parallel to the chip first side 20g that is perpendicular to the mounting surface, and a pair of terminal second sides 36ha, 36hb that are approximately parallel to the chip second side 20h that is parallel to the mounting surface, as shown in Figure 3.

[0044] As shown in Figure 3 and Figure 13 relating to the first variant example, the length of the terminal second sides 36ha, 36hb parallel to the mounting surface may be equal to, slightly shorter than, or slightly longer than the length L2 of the chip second side 20h arranged parallel to the terminal second sides 36ha, 36hb, multiplied a number of times equivalent to the number of chip capacitors 20 included in the ceramic capacitor 10, 200.

[0045] For example, in a ceramic capacitor 200 according to a first modified example shown in Fig. 12, the ceramic capacitor 200 includes two chip capacitors, and the length of the terminal second sides 36ha, 36hb parallel to the mounting surface is shorter than twice the length L2 of the chip second side 20h arranged parallel to the terminal second sides 36ha, 36hb. The ceramic capacitor 200 is similar to the ceramic capacitor 10 shown in Figs. 1 to 7, except that the length of the chip second side in the chip capacitor is longer than the length of the chip second side 20h of the chip capacitor 20 according to the embodiment.

[0046] On the other hand, in the first embodiment shown in Fig. 3, the ceramic capacitor 10 includes two chip capacitors, and the length of the terminal second sides 36ha, 36hb parallel to the mounting surface is slightly longer than twice the length L2 of the chip second side 20h arranged parallel to the terminal second sides 36ha, 36hb. As shown in Fig. 3 and Fig. 12, the dimensions of the chip capacitor that can be combined with the metal terminals 30, 40 are not limited to one type, and the metal terminals 30, 40 can configure ceramic capacitors corresponding to multiple types of chip capacitors having different lengths of the chip second sides.

[0047] The electrode facing portion 36 is electrically and mechanically connected to the first terminal electrode 22 formed on the opposing first end surface 20a. For example, the electrode facing portion 36 and the first terminal electrode 22 can be connected to each other by interposing a conductive connection member such as solder or a conductive adhesive in the gap between the electrode facing portion 36 and the first terminal electrode 22 shown in Fig. 4. When the electrical connection between the first metal terminal portion 30 and the first terminal electrode 22 is achieved by the contact portion between the first terminal electrode 22 and the mating arm portions 31a, 31b, 33a, and 33b described later, a non-conductive adhesive such as an epoxy resin or a phenol resin may be used as the connection member connecting the electrode facing portion 36 and the first terminal electrode 22.

[0048] Further, first through holes 36b are formed in a portion facing the first end face 20a in the electrode opposing portion 36. Two first through holes 36b are formed to correspond to each chip capacitor 20 included in the ceramic capacitor 10, but the shape and number of the first through holes 36b are not limited to this.

[0049] A connection member that connects the electrode opposing portion 36 and the first terminal electrode 22 is provided in the first through hole 36b. The connection member is preferably made of a conductive material such as solder or a conductive adhesive, and for example, a connection member made of solder can strongly join the electrode opposing portion 36 and the first terminal electrode 22 by forming a solder bridge between the periphery of the first through hole 36b and the first terminal electrode 22.

[0050] Furthermore, the electrode opposing portion 36 is formed with a plurality of protrusions 36a that protrude toward and come into contact with the first end face 20a of the chip capacitor 20. The protrusions 36a reduce the contact area between the electrode opposing portion 36 and the first terminal electrode 22, thereby preventing vibrations generated in the chip capacitor 20 from being transmitted to the mounting board via the first metal terminal portion 30, and making noise in the ceramic capacitor 10.

[0051] Furthermore, by forming the protrusions 36a around the first through-holes 36b, it is possible to adjust the area where a connecting member such as solder is formed, and such ceramic capacitor 10 can prevent ringing while adjusting the bonding strength between the electrode opposing portion 36 and the first terminal electrode 22 within an appropriate range. Note that, in the ceramic capacitor 10, four protrusions 36a are formed around one first through-hole 36b, but the number and arrangement of the protrusions 36a are not limited to this.

[0052] A second through hole 36c having a periphery to which the lower arm portion 31b or the lower arm portion 33b, which is one of the pairs of mating arm portions 31a, 31b, 33a, 33b, is connected, is formed in the electrode opposing portion 36. The second through hole 36c is located closer to the mounting portion 38 than the first through hole 36b, and unlike the first through hole 36b, no connecting member such as solder is provided.

[0053] The first metal terminal portion 30 having such a second through hole 36c formed therein has a shape that is easily elastically deformed around the lower arm portions 31b, 33b that support the chip capacitor 20, and therefore can effectively relieve stress generated in the ceramic capacitor 10 and absorb vibrations of the chip capacitor 20. Therefore, the ceramic capacitor 10 having such a first metal terminal portion 30 can effectively prevent squealing, and has good bonding reliability with the mounting board during mounting.

[0054] Although the shape of the second through hole 36c is not particularly limited, it is preferable that the opening width of the second through hole 36c in the width direction parallel to the terminal second sides 36ha and 36hb (X-axis direction) is wider than that of the first through hole 36b. By widening the opening width of the second through hole 36c, the stress relaxation effect and the acoustic noise prevention effect of the first metal terminal portion 30 can be effectively improved. In addition, by narrowing the opening width of the first through hole 36b compared to the second through hole 36c, it is possible to prevent the bonding strength between the chip capacitor 20 and the electrode opposing portion 36 from being excessively increased due to the bonding member being spread too much, and therefore such a ceramic capacitor 10 can suppress acoustic noise.

[0055] In the electrode facing portion 36, the second through hole 36c to which the lower arm portion 31b is connected is formed at a predetermined distance in the height direction from the lower terminal second side 36hb to which the mounting portion 38 is connected, and a slit 36d is formed between the second through hole 36c and the terminal second side 36hb. In the electrode facing portion 36, the slit 36d is formed between the connection position (the lower side of the peripheral portion of the second through hole 36c) of the lower arm portion 31b located near the mounting portion 38 to the electrode facing portion 36 and the lower terminal second side 36hb to which the mounting portion 36 is connected. The slit 36d extends in a direction parallel to the terminal second sides 36ha and 36hb. The slit 36d prevents the solder used when mounting the ceramic capacitor 10 on the mounting board from creeping up the electrode facing portion 36 and can prevent the formation of a solder bridge that connects to the lower arm portions 31b and 33b and the first terminal electrode 22. Therefore, the ceramic capacitor 10 having such slits 36d formed therein has the effect of suppressing noise.

[0056] 1 and 2, the fitting arm portions 31a, 31b, 33a, and 33b of the first metal terminal portion 30 extend from the electrode facing portion 36 to the third side surface 20e or the fourth side surface 20f, which is a chip side surface of the chip capacitor 20. The lower arm portion 31b (or the lower arm portion 33b), which is one of the fitting arm portions 31a, 31b, 33a, and 33b, is connected to the peripheral portion of the second through hole 36c formed in the electrode facing portion 36. In addition, the upper arm portion 31a (or the upper arm portion 33a), which is the other one of the fitting arm portions 31a, 31b, 33a, and 33b, is connected to the upper (Z-axis positive direction) terminal second side 36ha of the electrode facing portion 36.

[0057] As shown in Fig. 1, the electrode facing portion 36 has a plate body portion 36j facing the first end surface 20a of the chip capacitor 20 and located at a height overlapping the first end surface 20a, and a terminal connection portion 36k located below the plate body portion 36j and connecting the plate body portion 36j to the mounting portion 38. The second through hole 36c is formed such that its peripheral portion straddles the plate body portion 36j and the terminal connection portion 36k, and the lower arm portions 31b, 33b extend from the terminal connection portion 36k. That is, the base ends of the lower arm portions 31b, 33b are connected to the lower side of the substantially rectangular peripheral portion of the second through hole 36c, and the lower arm portions 31b, 33b extend from their base ends while bending upward (Z-axis positive direction) and inward (Y-axis negative direction) to contact the fourth side surface 20f of the chip capacitor 20 and support the chip capacitor 20 from below (see Fig. 2). Therefore, the lower end (lower chip second side 20h) of the first side surface 20a of the chip capacitor 20 is located above the lower side of the peripheral portion of the second through hole 26c, which is the base end of the lower arm portions 31b, 33b. When the chip capacitor is viewed from the positive direction of the Y axis, as shown in Fig. 3, the lower end (lower chip second side 20h) of the first side surface 20a of the chip capacitor 20 can be seen from the side of the ceramic capacitor 10 through the second through hole 36c.

[0058] As shown in FIG. 1, the upper arm portion 31a and the lower arm portion 31b form a pair to hold one chip capacitor 20, and the upper arm portion 33a and the lower arm portion 33b form a pair to hold another chip capacitor 20. In the first metal terminal portion 30, the pair of fitting arms 31a, 31b (or the fitting arms 33a, 33b) hold one chip capacitor 20, not multiple ones, so that each chip capacitor 20 can be securely held. In addition, the pair of fitting arms 31a, 31b hold the chip capacitor 20 from both ends of the chip first side 20g, which is the long side, rather than the chip second side 20h, which is the short side of the first end surface 20a. This increases the distance between the upper arm portions 31a, 33a and the lower arm portions 31b, 33b, making it easier to absorb vibrations of the chip capacitor 20, and therefore the ceramic capacitor 10 can suitably prevent ringing.

[0059] The pair of upper arm portion 31a and lower arm portion 31b that hold chip capacitor 20 may have asymmetric shapes and may have different widthwise lengths (lengths in the X-axis direction). Since lower arm portions 31b and 33b extend from terminal connection portion 36, the transmission path between first terminal electrode 22 of chip capacitor 20 and the mounting board is shorter than when these are connected to plate body portion 36j.

[0060] The mounting portion 38 is connected to a terminal second side 36hb on the lower side (Z-axis negative direction side) of the electrode opposing portion 36. The mounting portion 38 extends from the lower terminal second side 36hb toward the chip capacitor 20 side (Y-axis negative direction side) and is bent approximately perpendicularly to the electrode opposing portion 36. Note that, from the viewpoint of preventing excessive wraparound of the solder used when mounting the chip capacitor 20 to the board, the upper surface of the mounting portion 38, which is the surface of the mounting portion 38 on the chip capacitor 20 side, preferably has lower wettability with respect to solder than the lower surface of the mounting portion 38.

[0061] 1 and 2, the ceramic capacitor 10 is mounted on a mounting surface such as a mounting board with the mounting portion 38 facing downward, and therefore the length in the Z-axis direction of the ceramic capacitor 10 is the height when mounted. In the ceramic capacitor 10, the mounting portion 38 is connected to one terminal second side 36hb of the electrode opposing portion 36, and the upper arm portions 31a, 33a are connected to the other terminal second side 36ha, so there is no wasted length in the Z-axis direction, which is advantageous for reducing the height.

[0062] Moreover, since the mounting portion 38 is connected to one of the terminal second sides 36hb in the electrode opposing portion 36, the projected area from the Z-axis direction is smaller than in the conventional technology in which the mounting portion 38 is connected to the terminal first side 36g in the electrode opposing portion 36, and it is possible to reduce the mounting area. Moreover, as shown in Fig. 1 and Fig. 5 etc., the third side surface 20e and the fourth side surface 20f, which have smaller areas among the first to fourth side surfaces 20c, 20d, 20e, 20f of the chip capacitor 20, are arranged parallel to the mounting surface, so that the mounting area can be reduced even in a configuration in which the chip capacitors 20 are not arranged overlapping in the height direction.

[0063] As shown in Figures 1 and 2, the second metal terminal portion 40 has an electrode facing portion 46 facing the second terminal electrode 24, multiple pairs of engaging arm portions 41a, 41b, 43a that clamp the chip capacitor 20 from both ends of the chip first side 20g in the Z-axis direction, and a mounting portion 48 that extends from the electrode facing portion 46 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 46.

[0064] The electrode facing portion 46 of the second metal terminal portion 40 has a pair of terminal first sides 46g substantially parallel to the chip first side 20g and a terminal second side 46ha substantially parallel to the chip second side 20h, similar to the electrode facing portion 36 of the first metal terminal portion 30, and the electrode facing portion 46 has a protrusion 46a, a first through hole, a second through hole, and a slit 46d formed therein. As shown in FIG. 1, the second metal terminal portion 40 is disposed symmetrically with respect to the first metal terminal portion 30, and its arrangement with respect to the chip capacitor 20 is different from that of the first metal terminal portion 30. However, the second metal terminal portion 40 has the same shape as the first metal terminal portion 30, except for its arrangement, and therefore detailed description will be omitted.

[0065] The material of the first metal terminal portion 30 and the second metal terminal portion 40 is not particularly limited as long as it is a metal material having electrical conductivity, and for example, iron, nickel, copper, silver, etc., or an alloy containing these can be used. In particular, it is preferable to use phosphor bronze as the material of the first and second metal terminal portions 30, 40 from the viewpoint of suppressing the resistivity of the first and second metal terminal portions 30, 40 and reducing the ESR of the ceramic capacitor 10.

[0066] A method for manufacturing the ceramic capacitor 10 will now be described.

[0067] Manufacturing method of multilayer ceramic chip capacitor 20 In the manufacture of the multilayer ceramic chip capacitor 20, first, green sheets (which become dielectric layers 28 after firing) on ​​which electrode patterns that become internal electrode layers 26 after firing are formed are laminated to prepare a laminate, and then the resulting laminate is pressed and fired to obtain a capacitor element. Furthermore, the first terminal electrode 22 and the second terminal electrode 24 are formed on the capacitor element by baking a paint for terminal electrodes and plating, etc., to obtain the chip capacitor 20. The paint for the green sheets and the paint for the internal electrode layers that are the raw materials for the laminate, the raw materials for the terminal electrodes, and the firing conditions for the laminate and the electrodes are not particularly limited, and can be determined by referring to known manufacturing methods, etc. In this embodiment, a ceramic green sheet containing barium titanate as a main component is used as the dielectric material. In addition, the terminal electrodes are immersed in Cu paste and baked to form a baked layer, and further Ni plating and Sn plating are performed to form a Cu baked layer / Ni plating layer / Sn plating layer.

[0068] Manufacturing method of the metal terminal parts 30, 40 In manufacturing the first metal terminal portion 30, first, a flat metal plate is prepared. The material of the metal plate is not particularly limited as long as it is a metal material having electrical conductivity, and for example, iron, nickel, copper, silver, etc., or an alloy containing these can be used. Next, the metal plate is machined to obtain an intermediate member having the shapes of the fitting arm portions 31a to 33b, the electrode facing portion 36, the mounting portion 38, etc.

[0069] Next, a metal coating is formed by plating on the surface of the intermediate member formed by machining, to obtain the first metal terminal portion 30. Materials used for plating are not particularly limited, but include, for example, Ni, Sn, and Cu. In addition, during plating, a resist treatment is performed on the upper surface of the mounting portion 38, so that plating can be prevented from adhering to the upper surface of the mounting portion 38. This makes it possible to generate a difference in wettability to solder between the upper surface and the lower surface of the mounting portion 38. Note that the same difference can also be generated by plating the entire intermediate member to form a metal coating, and then removing only the metal coating formed on the upper surface of the mounting portion 38 by laser peeling or the like.

[0070] In manufacturing the first metal terminal portion 30, a plurality of first metal terminal portions 30 may be formed in a state in which they are connected to each other from a continuous belt-like metal plate material. The plurality of first metal terminal portions 30 connected to each other are cut into individual pieces before being connected to the chip capacitor 20 or after being connected to the chip capacitor 20. The manufacturing method of the second metal terminal portion 40 is similar to that of the first metal terminal portion 30 .

[0071] Assembly of ceramic capacitor 10 Two chip capacitors 20 obtained as described above are prepared and arranged and held so that the second side surface 20d and the first side surface 20c are in contact with each other as shown in FIG. 1. Then, the first metal terminal portion 30 and the second metal terminal portion 40 are attached to the first terminal electrode 22 and the second terminal electrode 24, respectively. Furthermore, a connecting member such as solder is applied to the first through holes 36b of the first and second metal terminal portions 30, 40, and the solder is interposed between the electrode opposing portions 36, 46 and the first terminal electrode 22 and the second terminal electrode 24. In this way, the first and second metal terminal portions 30, 40 are electrically and mechanically connected to the first terminal electrode 22 and the second terminal electrode 24 of the chip capacitor 20, and the ceramic capacitor 10 is obtained.

[0072] Note that the connecting member such as solder may be applied in advance to the electrode opposing portions 36, 46 of the metal terminal portions 30, 40 opposing the first and second terminal electrodes 22, 24 before the first and second metal terminal portions 30, 40 are attached to the chip capacitor 20, and then remelted after assembly. Note that, if necessary, the first and second terminal electrodes 22, 24 and the mating arm portions 31a-33b, 41a-43a engaged therewith may be welded by melting the metal plating formed on the surface of either or both of them.

[0073] The ceramic capacitor 10 thus obtained has a height direction that is the same as the direction of the chip first side 20g, which is the long side of the chip capacitor 20, and the mounting parts 38, 48 are formed by bending downward from the terminal second side 36hb of the chip capacitor 20, so that the projection area of ​​the ceramic capacitor 10 from the height direction is small (see Figs. 4 and 5). Therefore, the mounting area of ​​such a ceramic capacitor 10 can be made small.

[0074] Furthermore, in a ceramic capacitor 10 configured in which multiple chip capacitors 20 are arranged in a direction parallel to the mounting surface, for example, only one chip capacitor 20 is held between a pair of mating arm portions 31a, 31b along the mating direction (Z-axis direction), resulting in high bonding reliability between the chip capacitor 20 and the metal terminal portions 30, 40 and high reliability against impact and vibration.

[0075] Furthermore, by arranging the chip capacitors 20 in a direction parallel to the mounting surface and by making the stacking direction of the chip capacitors 20 parallel to the mounting surface, the transmission path of the ceramic capacitor 10 is shortened, so that the ceramic capacitor 10 can achieve low ESL. Furthermore, since the direction in which the chip capacitor 20 is held is perpendicular to the stacking direction of the chip capacitors 20, even if the number of stacked layers of the held chip capacitor 20 changes and the length L2 of the chip second side 20h of the chip capacitor 20 changes, the first and second metal terminal portions 30, 40 can hold the chip capacitor 20 without any problems. In this way, the ceramic capacitor 10 can flexibly respond to design changes because the first and second metal terminal portions 30, 40 can hold chip capacitors 20 with various numbers of stacked layers.

[0076] In addition, the upper arm parts 31a, 33a and the lower arm parts 31b, 33b of the ceramic capacitor 10 sandwich and hold the chip capacitor 20 from both ends of the chip first side 20g, which is the long side of the first end face 20a of the chip capacitor 20. Therefore, the first and second metal terminal parts 30, 40 effectively exert a stress relaxation effect, suppress the transmission of vibration from the chip capacitor 20 to the mounting board, and prevent squealing. In particular, since the lower arm parts 31b, 33b are connected to the peripheral part of the second through hole 36c, the lower arm parts 31b, 33b that support the chip capacitor 20 and the electrode facing parts 36, 46 that support the lower arm parts 31b, 33b have a shape that is easily elastically deformed. Therefore, the first and second metal terminal parts 30, 40 can effectively relieve the stress generated in the ceramic capacitor 10 and absorb vibration.

[0077] Furthermore, since the lower arm portions 31b, 33b are connected to the periphery of the second through hole 36c, in the ceramic capacitor 10, when viewed from a direction perpendicular to the mounting surface (the Z-axis direction), the lower arm portions 31b, 33b can be disposed in a position overlapping the mounting portion 38 (see FIG. 5). Therefore, in the ceramic capacitor 10, the mounting portion 38 can be made wider, which is advantageous in terms of miniaturization.

[0078] In addition, the ceramic capacitor 10 in which the first through hole 36b is formed in the electrode opposing portion 36 can reliably connect the first and second metal terminal portions 30, 40 and the chip capacitor 20 by applying a connection member such as solder to the first through hole 36b to form a solder bridge between the periphery of the first through hole 36b and the first terminal electrode 22. In addition, since the first through hole 36b is formed, even after the chip capacitor 20 and the first and second metal terminal portions 30, 40 are assembled, a connection member such as solder can be easily interposed between the first and second terminal electrodes 22, 24 and the electrode opposing portions 36, 46. In addition, since such a first through hole 36b is formed, the ceramic capacitor 10 can easily visually check the bonding state between the first and second metal terminal portions 30, 40 and the chip capacitor 20 from the outside, thereby reducing the variation in quality and improving the yield rate.

[0079] Second embodiment Fig. 7 is a schematic perspective view of a ceramic capacitor 100 according to a second embodiment of the present invention, and Figs. 8, 9, 10, and 11 are a front view, a left side view, a top view, and a bottom view of the ceramic capacitor 100, respectively. As shown in Fig. 7, the ceramic capacitor 100 is similar to the ceramic capacitor 10 according to the first embodiment, except that it has three chip capacitors 20 and the number of first through holes 36b included in the first metal terminal portion 130 and the second metal terminal portion 140 is different. Therefore, in the description of the ceramic capacitor 100, the same parts as those in the ceramic capacitor 10 are denoted by the same reference numerals as those in the ceramic capacitor 10, and description thereof will be omitted.

[0080] As shown in Fig. 7, the chip capacitor 20 included in the ceramic capacitor 100 is similar to the chip capacitor 20 included in the ceramic capacitor 10 shown in Fig. 1. The three chip capacitors 20 included in the ceramic capacitor 100 are arranged so that the chip first side 20g is perpendicular to the mounting surface as shown in Fig. 8, and the chip second side 20h is parallel to the mounting surface as shown in Fig. 10. The three chip capacitors 20 included in the ceramic capacitor 100 are arranged parallel to the mounting surface such that the first terminal electrodes 22 of adjacent chip capacitors 20 contact each other and the second terminal electrodes 24 of adjacent chip capacitors 20 contact each other.

[0081] The first metal terminal portion 130 included in the ceramic capacitor 100 has an electrode facing portion 136 facing the first terminal electrode 22, three pairs of fitting arms 31a, 31b, 33a, 33b, 35a, 35b that grip the chip capacitor 20, and a mounting portion 138 that is bent perpendicularly from a terminal second side 136hb in the electrode facing portion 136 toward the chip capacitor 20. The electrode facing portion 136 is substantially rectangular and flat, and has a pair of terminal first sides 136g substantially parallel to the chip first side 20g, and a pair of terminal second sides 136ha, 136hb substantially parallel to the chip second side 20h.

[0082] 9, the first metal terminal portion 130 has protrusions 36a, first through holes 36b, second through holes 36c, and slits 36d formed therein, similar to the first metal terminal portion 30 shown in FIG. 3. However, the first metal terminal portion 130 has three first through holes 36b, three second through holes 36c, and three slits 36d formed therein, and one first through hole 36b, one second through hole 36c, and one slit 36d corresponds to one chip capacitor 20. The first metal terminal portion 130 has a total of twelve protrusions 36a formed therein, and four protrusions 36a correspond to one chip capacitor 20.

[0083] 10, in the first metal terminal portion 130, the upper arm portion 31a and the lower arm portion 31b hold one chip capacitor 20, the upper arm portion 33a and the lower arm portion 33b hold another chip capacitor 20, and the upper arm portion 35a and the lower arm portion 35b hold another chip capacitor 20 different from the above two. The upper arm portions 31a, 33a, and 35a are connected to the upper (Z-axis positive direction) terminal second side 136ha of the electrode opposing portion 36, and the lower arm portions 31b, 33b, and 35b are connected to the peripheral portion of the second through-hole 36c.

[0084] 8 and 11, the mounting portion 138 of the first metal terminal portion 130 is connected to a lower (Z-axis negative direction) terminal second side 136hb of the electrode opposing portion 136. The mounting portion 138 extends from the lower terminal second side 136hb toward the chip capacitor 20 (Y-axis negative direction) and is bent approximately perpendicular to the electrode opposing portion 136.

[0085] The second metal terminal portion 140 has an electrode facing portion 146 facing the second terminal electrode 24, multiple pairs of engaging arm portions 141a, 143a, 145a that clamp the chip capacitor 20 from both ends of the chip first side 20g in the Z-axis direction, and a mounting portion 148 that extends from the electrode facing portion 146 toward the chip capacitor 20, at least a portion of which is approximately perpendicular to the electrode facing portion 146.

[0086] The electrode facing portion 146 of the second metal terminal portion 140 has a pair of terminal first sides 146g substantially parallel to the chip first side 20g and a terminal second side 140ha substantially parallel to the chip second side 20h, similar to the electrode facing portion 36 of the first metal terminal portion 130, and the electrode facing portion 146 has a protrusion 46a, a first through hole, a second through hole, and a slit. As shown in FIG. 7, the second metal terminal portion 140 is disposed symmetrically with respect to the first metal terminal portion 130, and its arrangement with respect to the chip capacitor 20 is different from that of the first metal terminal portion 130. However, the second metal terminal portion 140 has a similar shape to the first metal terminal portion 130, except for its arrangement, and therefore detailed description will be omitted.

[0087] The ceramic capacitor 100 according to the second embodiment also has the same effects as the ceramic capacitor 10 according to the first embodiment. In the ceramic capacitor 100, the number of upper arm portions 31a to 33a, lower arm portions 31b to 33b, first through holes 36b, second through holes 36c, and slits 36d included in the first metal terminal portion 130 is the same as the number of chip capacitors 20 included in the ceramic capacitor 100, but the number of fitting arm portions and the like included in the ceramic capacitor 100 is not limited to this. For example, the first metal terminal portion 130 may have twice as many first through holes 36b as the chip capacitors 20, or may have one continuous long slit 36d formed therein.

[0088] Other embodiments As described above, the present invention has been described with reference to the embodiments, but the present invention is not limited to the above-mentioned embodiments, and it goes without saying that the present invention includes many other modified examples. For example, the first metal terminal portion 30 shown in Fig. 1 has the protrusion 36a, the first through hole 36b, the second through hole 36c, and the slit 36d all formed therein, but the first metal terminal portion is not limited thereto, and modified examples in which one or more of these portions are not formed are also included in the first metal terminal portion according to the present invention.

[0089] In addition, although Figures 1 to 11 do not show the connecting members that connect the first metal terminal portion 30, 130 or the second metal terminal portion 40, 140 to the chip capacitor 20, the shape, size and type of the connecting member such as solder are appropriately adjusted depending on the size of the ceramic capacitors 10, 100 and the use of the ceramic capacitors 10, 100, etc.

[0090] 13 is a left side view showing a ceramic capacitor 300 according to a second modification. The ceramic capacitor 300 according to the second modification is similar to the ceramic capacitor 10 according to the first embodiment, except that the shape of the slits 336d formed in the first and second metal terminal parts 330 is different. As shown in FIG. 13, in the first and second metal terminal parts 330, one slit 336d continuous in the X-axis direction is formed below the two second through holes 36c. In this way, the shape and number of the slits 336d are not limited as long as they are formed between the lower end (lower chip second side 20h) of the part facing the first end face 20a of the chip capacitor 20 and the terminal second side 36hb (i.e., the terminal connection part 36k).

[0091] The present invention will be described in detail below with reference to examples, but is not limited to these examples.

[0092] The impedance Z and resistance component Rs were measured for the ceramic capacitor according to the example. The ceramic capacitor according to the example has the same shape as the ceramic capacitor 100 shown in FIG. 1. The impedance Z and resistance component Rs were measured with the mounting portion of the ceramic capacitor soldered to a mounting board. The size of the ceramic capacitor according to the example and the measurement conditions for the example are as follows. Working Example <Total size of ceramic capacitor> 5.0×6.0×6.4mm <Chip parts> Size: (L3 x L1 x L2) 5.7 x 5.0 x 2.5 mm Capacitance: 15μF <Metal terminal> Material: 3-layer clad material Cu-NiFe-Cu Electrode facing part 36 size: (Z-axis direction (terminal first side 36g) x X-axis direction (terminal second side 36ha) x plate thickness) 6.3 x 5.0 x 0.1 mm Arm 33a size: (X direction x Y direction) 0.9 x 0.9 mm Mounting area size: (Y direction) 1.2mm <Measurement conditions> Frequency: 100Hz~10MHz Temperature: 25℃

[0093] Comparative Example The impedance Z and resistance component Rs of the ceramic capacitor according to the comparative example were measured in the same manner as in the embodiment. As shown in FIG. 14, the ceramic capacitor 500 according to the comparative example uses L-shaped metal terminals 501 and 502. The chip capacitor 20 of the ceramic capacitor 500 is similar to the chip capacitor 20 of the ceramic capacitor according to the embodiment. However, in the ceramic capacitor 500, the chip capacitor 20 is arranged so that the chip first side 20g, which is the long side of the rectangle constituting the chip end face, is horizontal to the mounting surface, and the two chip capacitors 20 are arranged overlapping each other in a direction perpendicular to the mounting surface (Z-axis direction). The chip capacitor 20 is fixed to the electrode facing portion 510 of the metal terminals 501 and 502 by solder. <Total size of ceramic capacitor> 5.0×6.0×6.5mm <Chip parts> Same as in the example <Metal terminal> Material: 3-layer clad material Cu-NiFe-Cu Electrode facing area size: (Z-axis direction x X-axis direction x plate thickness) 6.3 x 5.0 x 0.1 mm Without arms Mounting area size: (Y direction) 1.6mm

[0094] FIG. 15 shows a graph of the impedance Z and resistance component Rs measured using the ceramic capacitors according to the embodiment and the comparative example. In the graph shown in FIG. 15, the vertical axis represents the impedance Z and the resistance component Rs, and the horizontal axis represents the frequency. The impedance Z measured using the ceramic capacitor according to the embodiment has one extreme value (minimum value) at the resonance point, whereas the impedance Z measured using the ceramic capacitor according to the comparative example has multiple other extreme values ​​in a region higher than the resonance point. In a region higher than the resonance point where the influence of ESL appears in the impedance Z, the ceramic capacitor according to the embodiment has a smaller impedance Z value than the ceramic capacitor according to the comparative example, and it can be seen that the ceramic capacitor according to the embodiment has a lower ESL than the comparative example. [Explanation of symbols]

[0095] 10, 100...Ceramic capacitors 20...Chip capacitor 20a...first end surface 20b…Second end surface 20c…1st side 20d…Second side 20e…Third side 20f…4th side 20g…First side of tip 20h…Second side of chip 20j…Third side of chip 22...First terminal electrode 24…Second terminal electrode 26...Internal electrode layer 28...Dielectric layer 30, 130, 40, 140...Metal terminal part 31a, 33a, 35a, 41a, 43a, 45a...Upper arm portion (mating arm portion) 31b, 33b, 35b...Lower arm portion (mating arm portion) 36, 136, 46, 146...electrode opposing part 36a, 46a...Protrusion 36b...1st through hole 36c…Second through hole 36d, 46d...Slit 36g…First side of terminal 36ha, 36hb...Second side of terminal 38, 138, 48, 148…Mounting section

Claims

1. a chip component having a substantially rectangular parallelepiped shape in which terminal electrodes are formed on a pair of substantially rectangular chip end faces having a pair of chip first sides and a pair of chip second sides, the chip component being made up of the pair of chip end faces and four chip side faces connecting the pair of chip end faces, and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion that is connected to one of the second sides of the terminal in the electrode opposing portion, extends from the one of the second sides of the terminal toward the chip component, and has at least a portion that is substantially perpendicular to the electrode opposing portion, The chip component is disposed such that the chip second side is aligned along a horizontal direction, a second through hole having a peripheral edge portion to which a lower arm portion, which is one of the fitting arm portions and supports the chip component from below, is connected is formed in the electrode opposing portion in correspondence with the chip component, In the chip component, the terminal electrodes of the pair of chip end faces and the electrode opposing portions of the pair of metal terminal portions are joined by connecting members located at positions different from the second through holes, In the chip component, the lower arm portion, the second through hole and the joint point formed by the connecting member are arranged in a line in a height direction perpendicular to the horizontal direction from the mounting portion in the following order: lower arm portion, second through hole, and joint point. This is a ceramic electronic component.

2. a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal in correspondence with the chip component; 2. The ceramic electronic component according to claim 1, wherein in the chip component, the slit, the lower arm portion, and the second through hole are arranged in a line in a height direction perpendicular to the horizontal direction from the mounting portion in the following order: slit, lower arm portion, second through hole.

3. a chip component having a substantially rectangular parallelepiped shape in which terminal electrodes are formed on a pair of substantially rectangular chip end faces having a pair of chip first sides and a pair of chip second sides, the chip component being made up of the pair of chip end faces and four chip side faces connecting the pair of chip end faces, and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion that is connected to one of the second sides of the terminal in the electrode opposing portion, extends from the one of the second sides of the terminal toward the chip component, and has at least a portion that is substantially perpendicular to the electrode opposing portion, The chip component is disposed such that the chip second side is aligned along a horizontal direction, a second through hole having a peripheral edge portion to which a lower arm portion, which is one of the fitting arm portions and supports the chip component from below, is connected is formed in the electrode opposing portion in correspondence with the chip component, a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal in correspondence with the chip component; In the chip component, the slit, the lower arm portion, and the second through hole are arranged in a line in a height direction perpendicular to the horizontal direction from the mounting portion in the following order: slit, lower arm portion, second through hole. This is a ceramic electronic component.

4. a chip component having a substantially rectangular parallelepiped shape in which terminal electrodes are formed on a pair of substantially rectangular chip end faces having a pair of chip first sides and a pair of chip second sides, the chip component being made up of the pair of chip end faces and four chip side faces connecting the pair of chip end faces, and a pair of metal terminal portions provided corresponding to the pair of chip end faces; The pair of metal terminal portions each include an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a fitting arm portion extending from the electrode facing portion to a side surface of the chip and configured to sandwich and hold the chip component from both ends of the first side of the chip; a mounting portion that is connected to one of the second sides of the terminal in the electrode opposing portion, extends from the one of the second sides of the terminal toward the chip component, and has at least a portion that is substantially perpendicular to the electrode opposing portion, The chip component is disposed such that the chip second side is aligned along a horizontal direction, a second through hole having a peripheral edge portion to which a lower arm portion, which is one of the fitting arm portions and supports the chip component from below, is connected is formed in the electrode opposing portion in correspondence with the chip component, A ceramic electronic component characterized in that a slit extending in a direction parallel to the second side of the terminal is formed between the second through hole and the second side of the terminal to correspond to the chip component.

5. 5. The ceramic electronic component according to claim 1, wherein the chip second side is shorter than the chip first side.

6. 5. The ceramic electronic component according to claim 1, further comprising a plurality of the chip components, the plurality of chip components being arranged such that the chip second sides are aligned along the horizontal direction.

7. a plurality of chip components each having a substantially rectangular shape, with terminal electrodes formed on a pair of chip end faces having a pair of chip first sides and a pair of chip second sides shorter than the chip first sides, and each having a substantially rectangular shape consisting of the pair of chip end faces and four chip side faces connecting the pair of chip end faces; and a pair of metal terminal portions provided corresponding to the pair of chip end faces, The pair of metal terminal portions each include an electrode facing portion having a substantially rectangular flat plate shape and including a pair of terminal first sides substantially parallel to the chip first sides and a pair of terminal second sides substantially parallel to the chip second sides, the electrode facing portion facing the chip end surface; a plurality of pairs of fitting arms extending from the electrode facing portions to the chip side surfaces and configured to sandwich and hold the chip component from both ends of the first chip side; a mounting portion that is connected to one of the second sides of the terminal in the electrode opposing portion, extends from the one of the second sides of the terminal toward the chip component, and has at least a portion that is substantially perpendicular to the electrode opposing portion, the plurality of chip components are arranged such that the chip second sides are aligned along a horizontal direction, a connecting member is provided on a portion of the electrode opposing portion facing the chip end face, the connecting member connecting the electrode opposing portion and a portion of the terminal electrode that is disposed on the chip end face, and a plurality of first through holes are formed corresponding to each of the chip components, through which a bonding state between the metal terminal portion and each of the portions of the terminal electrodes of the plurality of chip components that are disposed on the chip end face can be visually observed from the outside, The ceramic electronic component is characterized in that the connection member is interposed between a peripheral portion of the first through hole and the terminal electrode.

8. the chip component is a multilayer capacitor in which internal electrode layers and dielectric layers are laminated, 8. The ceramic electronic component according to claim 1, wherein a lamination direction in the chip component is substantially parallel to the second chip side.

9. 8. The ceramic electronic component according to claim 7, wherein the electrode facing portion has a plurality of protrusions formed thereon, the protrusions protruding toward the chip end face and coming into contact with the chip end face.

10. The ceramic electronic component according to claim 9 , wherein the plurality of protrusions are formed around the first through hole.

Images