Monitoring device, surface mounter, and method for adjusting position of monitoring device

Abstract

To detect improper installation of a feeder relative to a feeder bank, and to detect an object entering an area above the component supply position of the feeder.SOLUTION: There is provided a monitoring device 150 for a feeder bank 70. The feeder bank comprises a plurality of feeder installation portions in a first direction, each of which is installed with a feeder 80 that supplies electronic components W to a component supply position. The monitoring device includes: a light-projecting sensor 160 arranged at one end of the feeder bank in the first direction; and a light-receiving sensor 170 arranged at the other end of the feeder bank in the first direction and facing the light-projecting sensor across the feeder. The light-projecting sensor outputs a band-shaped linear light LC that passes above the feeder, and the light-receiving sensor receives the band-shaped linear light that passes above the feeder installed in the feeder installation portion, and the band-shaped linear light is positioned to overlap the component supply position of the feeder in a plan view, and monitors an area above the component supply position of the feeder installed in the feeder installation portion.SELECTED DRAWING: Figure 6A

Description

[Technical field]

[0001] The present invention relates to peripheral technology for feeders that supply electronic components. [Background technology]

[0002] Conventionally, a tape feeder has been known as an example of a device that supplies components to a surface mounter. Patent Document 1 discloses that "in a component mounting device that has a first mounting lane L1 and a second mounting lane L2 and is configured to be able to select an independent mounting mode or an alternate mounting mode, when a model change operation is performed in response to a change in the type of board to be mounted, if a tape feeder float detection sensor provided in the component supply unit near an opening through which a part of the operator's body or a foreign object can enter detects a part of the operator's body such as a finger or a foreign object, the component mounting mechanism that belongs to the mounting lane opposite to the mounting lane to which the component supply unit belongs stops the operation."

[0003] Furthermore, paragraph 24 of Patent Document 1 states, "The openings provided in the first component supply unit and the second component supply unit are accessible by the operator when the cart is separated. Therefore, if the first mounting head and the second mounting head operate with a part of the operator's body or a foreign object entering through the opening, it may lead to an unsafe condition. In order to prevent such an unsafe condition, the tape feeder floating detection sensor is used as an optical sensor to ensure the safety of the operator." [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2012-151332 A Summary of the Invention [Problem to be solved by the invention]

[0005] If a feeder is installed improperly relative to the feeder bank, electronic components cannot be accurately supplied, and electronic component pickup errors are likely to occur, so it is necessary to detect feeder installation improperly. Furthermore, after the surface mounter moves the mounting head above the feeder, it lowers the mounting head to the feeder height and removes the electronic components from the feeder component supply position. If there is an intrusion in the area above the feeder component supply position, there is a possibility that the mounting head will come into contact with or be interfered with by the intrusion when picking up an electronic component.

[0006] The present invention has been developed in view of the above-mentioned circumstances, and has an object to detect improper installation of a feeder relative to a feeder bank, and to detect an object entering an area above the feeder component supply position. [Means for solving the problem]

[0007] (1) A monitoring device for a feeder bank having a plurality of feeder installation sections in a first direction in which feeders that supply electronic components to a component supply position can be installed, the monitoring device including a light-projecting sensor arranged at one end of the feeder bank in the first direction, and a light-receiving sensor arranged at the other end of the feeder bank in the first direction, facing the light-projecting sensor across a feeder installed in the feeder installation section. The light-projecting sensor outputs a band-shaped line light passing above the feeder installed in the feeder installation section, and the light-receiving sensor receives the band-shaped line light passing above the feeder installed in the feeder installation section. The band-shaped line light is positioned so as to overlap the component supply position of the feeder in a plan view, and monitors the area above the component supply position of the feeder installed in the feeder installation section.

[0008] This configuration makes it possible to detect improper installation of the feeder relative to the feeder bank, and further makes it possible to detect an object entering the area above the feeder component supply position.

[0009] (2) The present invention is a surface mounting machine comprising a head unit, a feeder bank, a plurality of feeders arranged in the feeder bank, and the monitoring device described in (1), wherein the head unit has a mounting head which picks up electronic components supplied by the feeders from the component supply position and mounts them on a board, and the monitoring device may monitor an area above the component supply position of the feeder using the band-shaped line light during a board production period from the start of production of mounting electronic components on the board to the end of production.

[0010] In this way, it is possible to detect objects that enter the area above the component supply position due to problems during board production, such as a component supply tape jam, a top tape not properly taken up, or an electronic component popping out due to a feeder transport problem.

[0011] (3) In the surface mounter described in (2), the band-shaped linear light may be positioned in a range in the vertical direction, with the lower limit being the height position of the top surface of the feeder and the upper limit being the height position of the tip of the mounting head when the mounting head moves to a standby position before component removal. In this way, it is possible to accurately detect an intruding object that may come into contact with or interfere with the mounting head when removing electronic components.

[0012] (4) In the surface mounter described in (2) or (3), the monitoring device may be configured not to monitor using the strip-shaped line light during a light blocking period during which the mounting head or the electronic components held by the mounting head cut across the strip-shaped line light to remove electronic components from the feeder during the board production period. In this way, it is possible to prevent the mounting head removing electronic components from the feeder or the electronic components held by the mounting head from being erroneously detected as an intrusion.

[0013] (5) In the surface mounter described in (2) or (3), the monitoring device may set a dead zone within the monitoring range of the belt-shaped line light, the area through which the mounting head passes in order to remove electronic components from the feeder. In this way, it is possible to prevent the mounting head removing electronic components from the feeder or the electronic components held by the mounting head from being erroneously detected as intrusions.

[0014] (6) In the surface mounter according to any one of (2) to (5), after holding and removing an electronic component from the feeder, a height dimension of the electronic component removed from the feeder may be measured based on information on a height position of the mounting head at a time when the electronic component held by the mounting head passes through the strip-shaped line light. In this way, the height dimension of the electronic component can be measured by utilizing the function of a monitoring device (strip-shaped line light).

[0015] (7) The present invention is a method for adjusting the position of a monitoring device that monitors a feeder bank, comprising the steps of: adjusting the position of a light-projecting sensor relative to the feeder bank so that a strip of light passes through a slit formed in a jig installed in a feeder installation section of the feeder bank; and adjusting the position of a light-receiving sensor relative to the feeder bank so that the strip of light passing through the slit in the jig can be received. In this way, the mounting positions of the light-projecting sensor and the light-receiving sensor, which are arranged opposite each other at both ends of the feeder bank, can be accurately adjusted.

[0016] (8) The present invention is a method for adjusting the position of a monitoring device that monitors a feeder bank, comprising the steps of: capturing an image of a band-shaped line of light output from a light-projecting sensor with a camera mounted on a jig installed in a feeder installation section of the feeder bank; adjusting the position of the light-projecting sensor relative to the feeder bank so that the band-shaped line of light captured by the camera is in a predetermined position; and, after adjusting the position of the light-projecting sensor, adjusting the position of a light-receiving sensor relative to the feeder bank so that the band-shaped line of light output by the light-projecting sensor can be received. In this way, the mounting positions of the light emitting sensor and the light receiving sensor arranged opposite each other at both ends of the feeder bank can be adjusted accurately. Effect of the Invention

[0017] According to the present invention, a belt-shaped line light that monitors above the feeder can detect improper installation of the feeder relative to the feeder bank. When improper installation of the feeder is detected, the improper installation of the feeder can be notified by displaying an error or the like. In addition, if the feeder is before a component pickup operation, the XYZ axis movement operation of the surface mounter can be stopped before the component pickup operation. Furthermore, if the surface mounter is in the process of picking up a component or moving to a component mounting point, the XYZ axis movement operation of the surface mounter can be immediately stopped.

[0018] In addition, since the belt-like line light monitors the area above the component supply position of the feeder, it is possible to detect an intrusion into the area above the component supply position. If an intrusion is detected, a warning or the like is issued, thereby preventing the mounting head from coming into contact with or interfering with the intrusion when removing electronic components from the component supply position of the feeder. [Brief description of the drawings]

[0019] [Figure 1] FIG. [Diagram 2] FIG. 2 is a front view of the X-beam and head unit. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6A] FIG. 2 is a plan view of the feeder bank and the monitoring device. [Figure 6B] FIG. 2 is a front view of the feeder bank and the monitoring device. [Figure 7A] FIG. 2 is a plan view of the feeder bank and the monitoring device. [Figure 7B] FIG. 2 is a front view of the feeder bank and the monitoring device. [Figure 8] 4A to 4C are diagrams showing a standby position, a component removal position, and a raised position of a mounting head. [Figure 9A] FIG. 2 is a plan view of the feeder bank and the monitoring device. [Figure 9B] FIG. 2 is a front view of the feeder bank and the monitoring device. [Figure 10] FIG. 13 is a diagram showing an execution period of a monitoring process using a strip-shaped line light. [Figure 11] 11A and 11B are diagrams illustrating an operation of picking up an electronic component by a mounting head. [Figure 12] FIG. [Figure 13] FIG. 13 is a diagram showing a single suction operation of an electronic component by one suction nozzle. [Figure 14] 11A and 11B are diagrams illustrating a continuous suction operation of electronic components by a plurality of suction nozzles. [Figure 15] 11A and 11B are diagrams illustrating a simultaneous pickup operation of electronic components by a plurality of suction nozzles. [Figure 16] FIG. 2 is a block diagram showing an electrical configuration of the surface mounter. [Figure 17] FIG. 2 is a diagram showing a control block relating to height measurement of an electronic component. [Figure 18] FIG. 13 is an explanatory diagram of a method for measuring the height of an electronic component. [Figure 19] FIG. 13 is an explanatory diagram of a method for measuring the height of an electronic component. [Figure 20] 11A and 11B are diagrams illustrating an operation for adjusting the positions of a light projecting sensor and a light receiving sensor. [Figure 21] 11A and 11B are diagrams illustrating an operation for adjusting the positions of a light projecting sensor and a light receiving sensor. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] <Embodiment 1> 1. Overall configuration of surface mounter 1 As shown in FIG. 1, the surface mounter 1 includes a base 11, a transport conveyor 20, a driving device 30, a head unit 60, feeder banks 70A to 70D, a plurality of feeders 80 installed in the feeder banks 70A to 70D, and monitoring devices 150A to 150D.

[0021] In the following description, the longitudinal direction of base 11 (left-right direction in Figure 1) will be referred to as the X-direction, the depth direction of base 11 (up-down direction in Figure 1) will be referred to as the Y-direction, and the up-down direction in Figure 2 (the ascending and descending direction of mounting head 63) will be referred to as the Z-direction.

[0022] The transfer conveyor 20 is disposed in the center of the base 11. The transfer conveyor 20 includes a pair of transfer belts 21 that are driven to circulate in the X direction, and transfers the printed circuit board P on the transfer belts 21 in the X direction.

[0023] In this embodiment, the left side shown in Fig. 1 is the entrance, and the printed circuit board P is carried into the machine from the left side shown in Fig. 1 via the transport conveyor 20. The carried-in printed circuit board P is carried by the transport conveyor 20 to a work position in the center of the base.

[0024] As shown in FIGS. 1 and 2, the drive device 30 is composed of a pair of Y beams 41, an X beam 51, a Y-axis ball screw 45, a Y-axis motor 47, an X-axis ball screw 55, an X-axis motor 57, a Z-axis ball screw 65, and a Z-axis motor 67.

[0025] 1, the pair of Y beams 41 are located on both sides in the X direction of the base 11. The pair of Y beams 41 extend parallel to the Y direction, and support the X beam 51 slidably in the Y direction.

[0026] A Y-axis ball screw 45 extending in the Y direction and a Y-axis motor 47 at its shaft end are disposed on the upper surface of the Y beam 41. The Y-axis ball screw 45 is a drive shaft in the Y-axis direction, and a ball nut 52 fixed to the lower surface of the X beam 51 is screwed into the Y-axis ball screw 45.

[0027] By driving the Y-axis motor 47 to rotate the Y-axis ball screw 45 about its axis, the X-beam 51 and the head unit 60 can be moved in the Y direction (Y-axis servo mechanism).

[0028] 2, the X beam 51 is elongated in the X direction, and supports the head unit 60 so that it can slide along the X direction. An X-axis ball screw 55 extending in the X direction and an X-axis motor 57 are disposed on the side of the X beam 51. The X-axis ball screw 55 is a drive shaft in the X-axis direction, and a ball nut (not shown) fixed to the head unit 60 is screwed into the X-axis ball screw 55.

[0029] By driving the X-axis motor 57 to rotate the X-axis ball screw 55 about its axis, the head unit 60 can be moved in the X direction relative to the X-beam 51 (X-axis servo mechanism).

[0030] From the above, by controlling the X-axis motor 57 and the Y-axis motor 47 in a composite manner, it is possible to move the head unit 60 to any position on the base 11.

[0031] The head unit 60 has a plurality of mounting heads 63. The mounting heads 63 are arranged in a row in the X direction relative to the head unit 60. Each mounting head 63 can be moved in the vertical direction via a Z-axis ball screw 65 by driving a Z-axis motor 67 (Z-axis servo mechanism).

[0032] The mounting head 63 is a shaft that is long in the Z direction, and at its tip (lower end) is provided with a suction nozzle 68. The internal pressure of the suction nozzle 68 can be switched between negative and positive pressure to hold or release the electronic component W.

[0033] With this configuration, by operating the X-axis motor 57, the Y-axis motor 47, and the Z-axis motor 67 at a predetermined timing, the electronic components W supplied through the feeder 80 can be picked up by the mounting head 63 and mounted on the printed circuit board P.

[0034] 1 indicates a component recognition camera, and reference numeral 62 indicates a board recognition camera. The component recognition camera 15 is fixed on the base 11 with its imaging surface facing upward, and captures an image (bottom surface image) of the electronic component W picked up by the mounting head 63.

[0035] The board recognition camera 62 is fixed to the head unit 60 with its imaging surface facing downward. The board recognition camera 62 moves integrally with the head unit 60, and captures an image of an arbitrary position on the printed board P.

[0036] 2. Configuration of component supply tape 75 and feeder 80 As shown in FIG. 3, the component supply tape 75 is made up of a carrier tape 76 and a top tape 78 attached thereto.

[0037] The carrier tape 76 has component storage sections 77 at regular intervals. The component storage sections 77 are hollow and open upward, and store small electronic components W such as chip resistors.

[0038] The feeder 80 is a device that supplies electronic components W to a component supply position G by feeding the component supply tape 75 in the Y direction.

[0039] As shown in FIGS. 4 and 5, the feeder 80 includes a delivery device 90, a tape guide 97, a take-up device 100, a tape storage section 120, and a frame 81 to which these are attached.

[0040] The frame 81 is elongated in the Y direction and is made of, for example, die-cast aluminum. The frame 81 is provided with a tape passage 85 through which the component supply tape 75 passes.

[0041] The sending-out device 90 is provided on the front side of the frame 81. The sending-out device 90 includes a first motor 91, a gear train 93 consisting of a plurality of gears, and a sprocket 95. The gear train 93 transmits the power of the first motor 91 to rotate the sprocket 95.

[0042] Sprocket 95 is disposed at the upper front end of frame 81. Teeth 95A are formed at equal intervals on the outer periphery of sprocket 95. Teeth 95A of sprocket 95 engage with engaging holes 76A of component supply tape 75, and by rotating sprocket 95, component supply tape 75 can be sent out to component supply position G in front of the feeder.

[0043] The tape guide 97 is long from front to back, and is installed at the front of the top surface of the frame 81. The tape guide 97 has guide walls 97A that guide both sides of the component supply tape 75, so as to prevent the component supply tape 75 from tilting as it is fed along the top surface of the frame.

[0044] 4, a component removal hole 98A is provided in an upper wall 98 of the tape guide 97. The component removal hole 98A is provided corresponding to a component supply position G (see FIG. 5).

[0045] As shown in FIG. 5, when the top tape 78 reaches the component removal hole 98A, it is folded back upstream by an edge of the component removal hole 98A or the like and is peeled off from the carrier tape 76.

[0046] As a result, by moving the mounting head 63 to the component supply position G in accordance with the transport timing of the electronic component W, it is possible to pick up the electronic component W from the component storage section 77 of the carrier tape 76 through the component removal hole 98A.

[0047] The take-up device 100 is a device that takes up the top tape 78 peeled off from the carrier tape 76 and collects it in the tape storage section 120, and is composed of a second motor 101, a gear train 103 consisting of multiple gears, a tension roller 105, and a pinch roller 107.

[0048] 3. Monitoring equipment 150 Fig. 6A is a plan view of feeder bank 70, and Fig. 6B is a front view of feeder bank 70. As shown in Figs. 6A and 6B, feeder bank 70 includes a base 71 and a pair of side walls 73A and 73B.

[0049] The pair of side walls 73A, 73B are located on both sides of the base 71 in the X direction. A plurality of feeder installation sections 72 are provided on the base 71 at equal intervals in the X direction, allowing a plurality of feeders 80 to be arranged in the X direction. The X direction corresponds to the "first direction" of the present invention.

[0050] 1, four feeder banks 70A-70D are installed on base 11, and monitoring devices 150A-150D are installed for the four feeder banks 70A-70D, respectively. In the following description, feeder banks 70A-70D are collectively referred to as feeder bank 70, and monitoring devices 150A-150D are collectively referred to as monitoring device 150.

[0051] The monitoring device 150 is composed of a light-projecting sensor 160 and a light-receiving sensor 170. As shown in Figures 6A and 6B, the light-projecting sensor 160 is attached to one side wall 73A, and the light-receiving sensor 170 is attached to the other side wall 73B. One side wall 73A corresponds to "one end" of the present invention, and the other side wall 73B corresponds to "the other end" of the present invention.

[0052] The light projecting sensor 160 and the light receiving sensor 170 face each other across the feeders 80 arranged on the base 71. The light projecting sensor 160 has a light source 160A.

[0053] The light source 160A outputs a strip-shaped line light LC that is parallel to the X direction and has a certain width in the Y direction. The strip-shaped line light LC is a collection of light rays L that are parallel to the X direction, that is, a plurality of light rays L that are parallel to the X direction are arranged in the Y direction to form a strip in the Y direction. For example, a laser light source can be used as the light source 160A.

[0054] The light receiving sensor 170 has a line sensor 170A. The line sensor 170A has a plurality of light receiving elements in the Y direction. Each light receiving element corresponds to each light ray L of the belt-shaped line light LC, and can detect the light amount of each light ray L. That is, the light receiving sensor 170 can detect the entrance / blocking of each light ray L constituting the belt-shaped line light LC by each light receiving element.

[0055] As shown in Fig. 6B, the strip-shaped linear light LC is positioned slightly higher in the up-down direction (Z direction) than the upper surfaces of the feeders 80 attached to the base 71 (specifically, the upper surfaces of the upper walls 98 of the tape guides 97 shown in Fig. 4), and in the planar direction, as shown in Fig. 6A, the approximate center of the strip-shaped linear light LC is positioned on the straight line LG connecting the component supply positions G of the feeders 80. In this way, the strip-shaped linear light LC is positioned so as to overlap the component supply positions G of the feeders 80 arranged on the base 71 in a planar view seen from above.

[0056] If the feeder 80 is improperly installed on the base 71 (the underside of the feeder is not in close contact with the top surface of the base, causing it to be partially or completely floating), the improperly installed feeder 80A will block the band-shaped linear light LC, as shown in Figures 7A and 7B.

[0057] From the above, by detecting the blocking of the strip-like linear light LC by the light receiving sensor 170, it is possible to detect improper installation of the feeder 80A on the base 71.

[0058] Furthermore, the monitoring height of the belt-shaped linear light LC may be determined in consideration of the movement of the mounting head 63 when taking out electronic components W from the feeder 80.

[0059] 8 is a diagram showing the movement trajectory of the mounting head 63 when picking up electronic components W from the feeder 80. P1 is the standby position, P2 is the component pick-up position, and P3 is the raised position.

[0060] When the mounting head 63 takes out an electronic component W from the feeder 80, it first moves to a standby position P1 on the side of the feeder. The height position of the standby position P1 is located a predetermined distance above the height position of the top surface of the electronic component W so that the tip of the mounting head 63 (the tip of the suction nozzle 68) does not interfere with the components of the feeder 80 (tape guides, covers, etc.).

[0061] Thereafter, the mounting head 63, which has moved to the standby position P1, descends to the component removal position P2 while approaching the feeder 80 in accordance with the transport timing of the electronic component W. At the component removal position P2, the height position of the tip of the mounting head 63 (the tip of the suction nozzle 68) coincides with the height position of the upper surface of the electronic component W, and the mounting head 63 suctions the upper surface of the electronic component W.

[0062] The mounting head 63, which has picked up the electronic component W, then moves to a raised position P3 on the side of the feeder. The height position of the raised position P3 is a height position at which the electronic component W sucked and held at the nozzle tip does not interfere with structural components such as a conveyor guide (not shown) while the mounting head 63 moves over the base to mount the electronic component W on the printed circuit board P.

[0063] In Figure 8, h0 is the height position of the upper surface of feeder 80 (upper surface of tape guide 97), h1 is the height position of the tip of mounting head 63 (tip of suction nozzle 68) when it moves to standby position P1, and h3 is the height position of the lower surface of the component when mounting head 63 moves to raised position P3 after removing the component.

[0064] By installing the band-shaped line light LC in the vertical direction (Z direction) in a range H from height position h0 to height position h1, it is possible to accurately detect any intruding object that may come into contact with or interfere with the mounting head 63 when removing the electronic component (when moving from P1 to P2).

[0065] For example, as shown in FIGS. 9A and 9B, electronic components W that have jumped out of the feeder 80 and top tape 78 that has become improperly wound can be detected with high accuracy.

[0066] <Intrusion above the parts supply location> (1) An electronic component W pops out of the storage section 77 of the component supply tape 75. (2) Top Tape 78 had a winding problem

[0067] By monitoring the area above the component supply position G with a strip-shaped line light LC and detecting an intruding object, it is possible to prevent the mounting head 63 from coming into contact with or interfering with the intruding object when removing an electronic component W from the feeder 80.

[0068] 10 is a diagram showing a period during which monitoring processing is performed above the component supply position by the strip-shaped line light LC. The monitoring processing by the strip-shaped line light LC is performed for the board production period from time ta when the surface mounter 1 starts production of the printed board P to time tb when the production of the printed board P is completed. Note that the production may be for one printed board P, but also includes the case where multiple printed boards P of the same type are produced.

[0069] Furthermore, as shown in FIG. 11, while the mounting head 63 is taking out the electronic component W from the feeder 80, the suction nozzle 68 and the electronic component W sucked by the suction nozzle 68 block the belt-shaped linear light LC.

[0070] Therefore, the light blocking period A during which the suction nozzle 68 or the electronic component W held by the suction nozzle 68 cuts across the strip-shaped light line LC to take out an electronic component W from any of the feeders 80 installed in the feeder bank 70 is treated as a monitoring excluded period, during which monitoring of the space above the component supply position by the strip-shaped light line LC is not performed. Specifically, monitoring is not performed during this period by stopping the projection of the strip-shaped light line LC or invalidating the light reception result of the strip-shaped light line LC.

[0071] By excluding the light-blocking period A from monitoring, it is possible to prevent the mounting head 63, which is removing electronic components W from the feeder 80, from being erroneously detected as an intrusion.

[0072] The area above the component supply position G may be monitored only for a moment immediately before the mounting head 63 starts the component suction operation to confirm that the nozzle can descend safely.

[0073] In addition to the method of providing a monitoring exclusion period, the same effect can be obtained by a method of setting a dead zone in the monitoring range F of the belt-shaped line light LC. The dead zone can be set, for example, by masking a part of the light receiving elements constituting the light receiving sensor 170 (disabling the light receiving signal of the light beam).

[0074] 12, B1 is the first dead zone, and B2 is the second dead zone. The first dead zone B1 is a dead zone within the monitoring range F of the strip-shaped linear light LC, through which the suction nozzle 68 and the electronic component W held by the suction nozzle 68 may pass. The second dead zone B2 is a dead zone within the monitoring range F of the strip-shaped linear light LC, through which the top tape 78 peeled off from the carrier tape 76 may pass.

[0075] It is preferable that the width (monitoring range) F of the band-shaped line light LC in the Y direction is wider than the width F0 of the component removal hole 98A in the Y direction, as shown in Fig. 12. By making the width F of the band-shaped line light LC in the Y direction wider than the width F0 of the component removal hole 98A in the Y direction, it is possible to accurately detect electronic components W protruding from the component removal hole 98A and top tape 78 with poor winding.

[0076] Methods of picking up electronic components W by the mounting heads 63 include single pickup, in which one mounting head 63 picks up electronic components W from one feeder 80 as shown in FIG. 13, continuous pickup, in which two mounting heads 63A and 63B pick up electronic components W continuously from one feeder 80 as shown in FIG. 14, and simultaneous pickup, in which two mounting heads 63A and 63B pick up electronic components W simultaneously from two feeders 80A and 80B as shown in FIG. 15.

[0077] In single pickup, consecutive pickup, and simultaneous pickup, the arrangement direction of the feeders 80 to be monitored, the movement direction of the mounting head 63 when removing components, and the light emission and reception directions of the sensors 160, 170 are all parallel in the X direction (first direction), so monitoring of the sky above the component supply position G except for the light-blocking period with the band-shaped line light LC can be performed without distinguishing between the cases of single pickup of electronic components W as well as consecutive pickup and simultaneous pickup.

[0078] Furthermore, when setting a dead zone, if the suction nozzle 68 or the area through which the electronic component W picked up by the suction nozzle 68 passes when the electronic component W is taken out of the feeder 80 is monitored as the dead zone, the electronic component W can be picked up without distinguishing between single pickup, simultaneous pickup, and simultaneous pickup.

[0079] In addition, in order to distinguish between the two mounting heads 63A and 63B in FIG. 14 and FIG. 15, the first mounting head 63A is numbered "1" and the second mounting head 63B is numbered "2."

[0080] 4. Electrical configuration of surface mounter 1 16, the surface mounter 1 has a controller 210. The controller 210 has a CPU (Central Processing Unit) 211, which is a control unit, a storage unit 212, a memory 213, a display unit 214, an input device 215, a motor controller 216, a camera I / F 217, a lighting controller 218, and various I / Os 219.

[0081] The motor controller 216 is connected to the motors 47, 57, and 67 via a motor driver 221. The camera IF 217 is connected to the component recognition camera 15 and the board recognition camera 62. The lighting controller 218 is connected to the lighting unit 15A of the component recognition camera 15 and the lighting unit 62A of the board recognition camera 62.

[0082] The CPU 211 controls the rotation speed and amount of rotation of each of the axial motors 47, 57, 67 via the motor controller 216. This allows the head unit 60 to be moved to an arbitrary position on the base 11, and the mounting head 63 to perform the mounting operation of the electronic components W.

[0083] CPU 211 photographs board P with board recognition camera 62 and electronic components W with component recognition camera 15 via camera I / F 217. The position of board P on the base can be recognized from the board image. The suction state of electronic components W suction-held by mounting head 63 can be recognized from the component image.

[0084] The storage unit 212 is, for example, an HDD (hard disk drive) or an SSD (solid state drive), and stores a mounting program and various data for mounting electronic components on the printed circuit board P. The display unit 214 displays various data such as the operating status of the surface mounter 1. The input device 215 is an interface for a user, and allows the user to input data necessary for the production of the printed circuit board P.

[0085] The surface mounter 1 further has a sensor controller 225. The two sensors 160, 170 of the monitoring device 150 are connected to the sensor controller 225. Of the signal lines connecting the two sensors 160 and the sensor controller 225, Fig. 16 shows only the signal line on the light receiving sensor side, and omits the signal line on the light projecting sensor side.

[0086] The sensor controller 225 can output information on the result of receiving the strip-shaped line light LC by the light receiving sensor 170 (specifically, information on the amount of received light of each light beam L constituting the strip-shaped line light LC) in analog or digital form. Furthermore, by setting a threshold value of the rate of received light in an internal memory in the motor controller, it is possible to output a determination signal S under any condition.

[0087] For example, if the sensor controller 225 is set to output an OFF judgment signal S indicating stop to the motor controller 216 when any part of the light beams L constituting the belt-shaped line light LC is blocked, the surface mounter 1 can be immediately stopped if an abnormality occurs within the monitoring area above the component supply position.

[0088] Furthermore, when the sensor controller 225 is connected to the various IFs 222 of the control controller 210 and the determination signal S of the sensor controller 225 is input to the motor controller 216 via the various IFs 222 and the IF controller 219, a delay may occur in the signal detection of the motor controller 216, which may result in a delay in stopping the axes such as the X-axis motor 57, the Y-axis motor 47, and the Z-axis motor 67.

[0089] Delays in signal detection can be suppressed by connecting the sensor controller 225 directly to the motor controller 216 rather than to the various IFs 222 and inputting the determination signal S of the sensor controller 225 directly to the stop interlock input of the motor controller 216.

[0090] Furthermore, in this case, it is preferable that the X-axis motor 57, the Y-axis motor 47, and the Z-axis motor 67 are products equipped with electromagnetic brakes. By having electromagnetic brakes, for example, the Z-axis can stop the movement of the descending mounting head 63 due to inertia or its own weight.

[0091] 5.Effects Monitoring device 150 can detect improper installation of feeder 80 relative to feeder bank 70. If improper installation of feeder 80 is detected, it is possible to notify the user of the improper installation of feeder 80 by displaying an error on display unit 214, or the like.

[0092] During the board production period, except for the light-shielding period A, the belt-shaped line light LC is used to monitor the area above the component supply position G, thereby making it possible to detect abnormalities that occur after a component is picked up and before the next component pick-up begins. For example, it is possible to detect an infringement of the space above the component supply position G due to a poor winding of the top tape, an infringement of the space above the component supply position G due to a jam of the component supply tape 75, or an infringement of the space above the component supply position G due to an electronic component W protruding, etc.

[0093] If an intrusion (intrusion object) is detected above the component supply position G, the surface mounter 1 can be stopped or a warning issued, thereby preventing the mounting head 63 from coming into contact with or interfering with the intrusion object when removing the electronic component W from the component supply position G.

[0094] <Embodiment 2> 17, in the second embodiment, a monitoring device 150 and a Z-axis encoder 67A are used to measure the height dimension Zw of an electronic component W taken out from a feeder 80. The Z-axis encoder 67A is a detector that detects axial values ​​such as the amount of rotation and the rotation angle of a Z-axis motor 67 that moves a mounting head 63 up and down.

[0095] To explain in detail the method for measuring the height of the electronic component W, as shown in Figure 18, when the mounting head 63 without components being adsorbed is lowered from a position higher than the band-shaped line light LC, a portion of the band-shaped line light LC is blocked when the nozzle tip blocks the band-shaped line light LC.

[0096] Thereafter, the electronic component W is taken out from the feeder 80 and the mounting head 63 is raised, and when the electronic component W adsorbed and held by the mounting head 63 passes the strip-shaped linear light LC, the blocking of the strip-shaped linear light LC is released.

[0097] The height position H1 of the mounting head 63 at the time when the electronic component W passes through the strip-shaped linear light LC is higher by the height dimension of the adsorbed and held electronic component W than the height position H0 of the mounting head at the time when the nozzle tip intercepts the strip-shaped linear light LC.

[0098] Therefore, if the height position H0 of the mounting head 63 at the time when the nozzle tip blocks the strip-shaped line light LC is measured in advance and stored in memory 213, etc., the height dimension Zw of the electronic component W can be determined by the CPU 211, etc. from the height position H1 of the mounting head 63 at the time when the electronic component W passes through the strip-shaped line light LZ.

[0099] Specifically, it can be calculated using formula (1). Zw = H1 - H0 (1)

[0100] Furthermore, since the height position of the mounting head 63 can be grasped from the detection value of the Z-axis encoder 67A (axis value of the Z-axis motor 67), the height position H1 of the mounting head 63 at the time when the electronic component W passes through the strip-shaped line light LC can be calculated from the timing when the strip-shaped line light LC is unblocked (detectable by the monitoring device 150) and the detection value of the Z-axis encoder 67A at that time (axis value of the Z-axis motor 67).

[0101] The height dimension Zw of the electronic components W should be measured at least when the feeders 80 of the feeder bank 70 are replaced (when the type of electronic components is changed or when electronic components are replenished).

[0102] Furthermore, if the electronic component W is an IC component or the like that is larger in outer shape than the monitoring range F of the belt-shaped line light LC and part of the component protrudes from the monitoring range F, the height dimension of the electronic component W may be measured after rotating the electronic component W by 90 degrees using the mounting head as shown in Fig. 19. By rotating the electronic component W by 90 degrees, the entire component can be accommodated within the monitoring range F, and the height dimension of the entire component can be measured.

[0103] <Embodiment 3> In the third embodiment, a method of attaching the light projecting sensor 160 and the light receiving sensor 170 to the feeder bank 70 will be described.

[0104] 20, the sensor attachment jig 250 is a slit jig having a through-hole slit 260 on the side. The sensor attachment jig 250 can be attached to any position of the feeder bank 70, specifically, to any feeder installation portion 72 on the base 71.

[0105] The through-hole slit 260 is formed at a position determined by design on the side surface of the jig, that is, at a position corresponding to a monitoring position (a position to be monitored by the belt-like linear light LC) above the component supply position.

[0106] The shape of the through-hole slit 260 is a line in the Y direction corresponding to the band-shaped line light LC, and allows the band-shaped line light LC to pass through. Specifically, the width of the through-hole slit 260 is equal to or larger than the measurable width of the light receiving sensor 170. The width is equal to or larger than the thickness of the band-shaped line light LC, and is determined according to the measurement allowable width of the light receiving sensor 170.

[0107] When adjusting the position, first, the sensor attachment jig 250 is set in a predetermined feeder installation section 72, and the belt-like linear light LC is output from the light projecting sensor 160. Then, the attachment position of the light projecting sensor 160 relative to the feeder bank 70 (in this example, the side wall 73A shown in FIGS. 6A and 6B) is adjusted so that the belt-like linear light LC passes through the through-hole slit 260.

[0108] On the light receiving side, the attachment position of the light receiving sensor 170 relative to the feeder bank 70 (in this example, the side wall 73B shown in Figs. 6A and 6B) is adjusted so that the band-shaped linear light LC can be accurately received. Specifically, the light receiving sensor 170 is connected to a portable information terminal 280 such as a personal computer, and the attachment position relative to the feeder bank 70 is adjusted while viewing the received light waveform of the band-shaped linear light LC displayed on a monitor 290 of the portable information terminal 280. In this manner, the positions of the light projecting sensor 160 and the light receiving sensor 170 can be adjusted.

[0109] Furthermore, the sensor mounting jig 250 may be fixed to one specific location, such as the feeder installation section 72B in the center of the feeder, as shown in Figure 20, or the sensor mounting jig 250 may be moved to multiple feeder installation sections 72 on the base 71, and the positional relationship between the light-emitting sensor 160 and the light-receiving sensor 170 may be confirmed by passing the band-shaped line light LC through the through-hole slit 260 for each feeder installation section 72 and checking the light-receiving state.

[0110] For example, the positional relationship between the light-emitting sensor 160 and the light-receiving sensor 170 may be confirmed by moving the sensor mounting jig 250 to the feeder mounting sections 72A, 72C at both ends of the base, passing the band-shaped line light LC through the through-hole slits 260 for each of the feeder mounting sections 72A, 72C, and checking the light-receiving state.

[0111] Also, the sensor attachment jig 250 may be moved to all the feeder installation sections 72 on the base 71 to check the positional relationship between the light projecting sensor 160 and the light receiving sensor 170. In this way, the positions of the light projecting sensor 160 and the light receiving sensor 170 can be adjusted with high precision.

[0112] <Embodiment 4> In the third embodiment, an example has been described in which the positions of light projecting sensor 160 and light receiving sensor 170 are adjusted using sensor attachment jig (slit jig) 250. In the fourth embodiment, a camera jig is used as sensor attachment jig 350.

[0113] As shown in FIG. 21, the sensor attachment jig 350 is a camera jig equipped with a camera 360, and can be attached to any position of the feeder bank 70, specifically, to any feeder installation portion 72 on the base 71.

[0114] 21, during adjustment, the band-shaped linear light LC output from the light-projecting sensor 160 is received by the camera 360 of the sensor attachment jig 350, and the captured band-shaped linear light LC is displayed on the monitor 370. Then, while watching the monitor screen, the attachment position of the light-projecting sensor 160 relative to the feeder bank 70 (in this example, the side wall 73A shown in FIGS. 6A and 6B) is adjusted so that the band-shaped linear light LC is positioned as determined by design (a monitoring position above the component supply position).

[0115] When adjusting the position, the sensor mounting jig (camera jig) 350 may be fixed to one specific location, such as the feeder mounting section 72B in the center of the base, as shown in FIG. 21, or the sensor mounting jig (camera jig) 350 may be moved to multiple or all of the feeder mounting sections 72 and the position of the band-shaped line light LC may be checked for each feeder mounting section 72.

[0116] On the light receiving side, the attachment position of the light receiving sensor 170 relative to the feeder bank 70 (in this example, the side wall 73B shown in Figs. 6A and 6B) is adjusted so that the band-shaped linear light LC can be accurately received. Specifically, the light receiving sensor 170 is connected to a portable information terminal 280 such as a personal computer, and the attachment position relative to the feeder bank 70 is adjusted while viewing the waveform of the band-shaped linear light LC displayed on a monitor 290 of the portable information terminal 280. In this manner, the positions of the light projecting sensor 160 and the light receiving sensor 170 can be adjusted.

[0117] When the sensor mounting jig 250 (slit jig) is used, it is necessary to simultaneously adjust the position of the light projecting sensor 160 and the position of the light receiving sensor 170. When the sensor mounting jig 350 (camera jig) is used, it is possible to adjust the position of the light projecting sensor 160 and the position of the light receiving sensor 170 separately, which has the advantage that it is easy to adjust the positions of the light projecting sensor 160 and the light receiving sensor 170.

[0118] <Other embodiments> The present invention is not limited to the embodiments described above and illustrated in the drawings, and the following embodiments, for example, are also included within the technical scope of the present invention.

[0119] (1) In the first embodiment, the light source 160A of the strip-shaped line light LC is a laser light source, but the light source 160A may be a light source other than a laser light source.

[0120] (2) In the first embodiment, a roughly central portion of the strip-shaped linear light LC is arranged to overlap with the component supply position G. It is sufficient that at least a portion of the strip-shaped linear light LC overlaps with the component supply position G, and a position of the strip-shaped linear light LC that is offset from the center may overlap with the component supply position G.

[0121] (3) In the first embodiment, the lower limit of the range of the height position of the belt-shaped linear light LC is the height position h0 of the upper surface of the feeder, and the upper limit is the height position of the nozzle tip of the mounting head 63 when it moves to the standby position P1 before component removal (see FIG. 8). The upper limit may be the height position h3 of the component lower surface when the mounting head 63 moves to the raised position P3 after component removal.

[0122] (4) In the first embodiment, the electronic component W is attracted by using negative pressure. However, the electronic component W may be held by a chuck instead of by negative pressure.

[0123] (5) In the second embodiment, the height dimension Zw of the electronic component W is measured when the feeder 80 is replaced. The height dimension Zw of the electronic component W may be measured every time the electronic component is picked up. [Explanation of symbols]

[0124] 1. Surface mount machine 20...Transport conveyor 60…Head unit 63...Mounting head 70…Feeder bank 71…Bass 72…Feeder installation section 80…Feeder 150...Monitoring device 160...Light projection sensor 170...Light receiving sensor G…Parts supply position L…Light ray LC: Belt-shaped line light W: Electronic parts

Claims

1. A monitoring device for a feeder bank having a plurality of feeder installation sections in a first direction, the feeders being capable of installing feeders that supply electronic components to component supply positions, the monitoring device comprising: a light-projection sensor disposed at one end of the feeder bank in the first direction; a light receiving sensor that is disposed at the other end of the feeder bank in the first direction and faces the light projecting sensor across a feeder installed in the feeder installation section, The light-projecting sensor outputs a band-shaped line of light passing above the feeder installed in the feeder installation section, The light receiving sensor receives the band-shaped line light that has passed above the feeder installed in the feeder installation section, The monitoring device is positioned so that the band-shaped line light overlaps the component supply position of the feeder in a planar view, and monitors the area above the component supply position of the feeder installed in the feeder installation section.

2. A surface mount machine, A head unit; A feeder bank and A plurality of feeders disposed in the feeder bank; The monitoring device according to claim 1, the head unit has a mounting head that picks up electronic components supplied by the feeder from the component supply position and mounts them on a board, The monitoring device is a surface mounting machine that monitors an area above the component supply position of the feeder using the band-shaped line light during a board production period from the start of production of mounting electronic components on a board to the end of production.

3. 3. The surface mounter according to claim 2, The belt-shaped line light has a lower limit in a vertical direction at a height position of an upper surface of the feeder, The surface mounter is positioned within a range whose upper limit is the height position of the tip of the mounting head when the mounting head moves to a standby position before component removal.

4. 4. The surface mounter according to claim 2, a surface mounter in which the monitoring device does not perform monitoring using the strip-shaped line light during a light-blocking period in which the mounting head or the electronic components held by the mounting head cross the strip-shaped line light and block it in order to remove electronic components from the feeder during the board production period.

5. The surface mounter according to claim 2 or 3, The monitoring device sets, as a dead zone, an area within a monitoring range of the strip-shaped line light through which the mounting head passes in order to take out electronic components from the feeder.

6. 4. The surface mounter according to claim 2, and after holding and removing an electronic component from the feeder, measures a height dimension of the electronic component removed from the feeder based on information about a height position of the mounting head at a time when the electronic component held by the mounting head passes through the strip-shaped line light.

7. 1. A method for adjusting a position of a monitoring device for monitoring a feeder bank, comprising: adjusting a position of a light-projecting sensor relative to the feeder bank so that a strip-shaped line of light passes through a slit formed in a jig installed in a feeder installation section of the feeder bank; A method for adjusting the position of a monitoring device, comprising adjusting a position of a light receiving sensor relative to the feeder bank so that the light receiving sensor can receive the band-shaped line that has passed through a slit in the jig.

8. 1. A method for adjusting a position of a monitoring device for monitoring a feeder bank, comprising: The strip-shaped line light output from the light projection sensor is photographed by a camera mounted on a jig installed in a feeder installation section of the feeder bank, adjusting a position of the light projection sensor relative to the feeder bank so that the strip-shaped line light photographed by the camera is at a predetermined position; the position of a light receiving sensor relative to the feeder bank is adjusted so that the band-shaped line light outputted by the light projecting sensor can be received after the position of the light projecting sensor is adjusted.

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