Component mounting device and component mounting method

Abstract

To mount electronic components on a substrate with high precision.SOLUTION: A component mounting device includes: a mounting mechanism which takes out a component from a component supply part, transfers a transfer material to multiple electrodes formed on a lower surface of the component and mounts the component to a substrate; a component imaging camera which acquires a first image by imaging the component taken out by the mounting mechanism from below and acquires a second image by imaging the component in which the transfer material is transferred to the electrodes from below; and a processor. The processor recognizes an outer shape of the component and the electrodes from the first image to acquire a first recognition result, recognizes the outer shape of the component from the second image to acquire a second recognition result, calculates relative coordinates including the angle of the electrodes with respect to the outer shape of the component from the first recognition result, calculates a correction value including an angle for mounting the component to the substrate on the basis of the relative coordinates and the second recognition result and mounts the component to the substrate by using the correction value.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present disclosure relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] Patent Document 1 discloses an electronic component mounting method for mounting an electronic component, which is held by suction on a suction nozzle and has electrodes formed on its underside, on a printed circuit board. In the electronic component mounting method, a recognition processing device recognizes and processes the electrodes and external shape of the electronic component based on an image of the electronic component captured by a recognition camera that captures an image of the electronic component held by suction on the suction nozzle. In addition, in the electronic component mounting method, a calculation device calculates a difference between the external shape recognition result and the electrode recognition result of the electronic component based on the recognition processing result. After that, the electronic component mounting device determines the position of the electrode of the electronic component based on the external shape recognition result recognized by the recognition processing device based on the image of the electronic component captured by the recognition camera after flux is applied to the electrode of the electronic component by a flux transfer device and the difference. In the electronic component mounting method, a control device controls the suction nozzle to be corrected and moved so that the electrode is positioned on the land on the printed circuit board based on the determined position of the electrode, and mounts the electronic component on the printed circuit board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2007-266330 A Summary of the Invention [Problem to be solved by the invention]

[0004] In Patent Document 1, the electronic component mounting device calculates the difference between the center position of a ball grid array (hereinafter referred to as "BGA") and the center position of a group of protruding electrodes, and uses this difference to correct the positional deviation of the BGA with respect to the suction nozzle. However, if the BGA deviates in the rotational direction with respect to the suction nozzle, the accuracy of mounting the BGA on the printed circuit board may decrease.

[0005] The present disclosure has been devised in view of the above-mentioned conventional situation, and has an object to mount electronic components on a board with high precision. [Means for solving the problem]

[0006] The present disclosure provides a component mounting device comprising: a mounting mechanism that takes a component from a component supply unit, transfers a transfer material to a plurality of electrodes formed on the underside of the component, and mounts the component on a substrate; a component imaging camera that images the component taken by the mounting mechanism from below to obtain a first image, and images the component with the transfer material transferred to the electrodes from below to obtain a second image; and a processor, wherein the processor recognizes an outer shape of the component and the electrodes from the first image to obtain a first recognition result, and recognizes the outer shape of the component from the second image to obtain a second recognition result, calculates relative coordinates including an angle of the electrodes with respect to the outer shape of the component from the first recognition result, calculates a correction amount including an angle for mounting the component on the substrate based on the relative coordinates and the second recognition result, and mounts the component on the substrate using the correction amount.

[0007] The present disclosure also provides a component mounting method that includes taking a component from a component supply unit, transferring a transfer material to a plurality of electrodes formed on an underside of the component, mounting the component on a substrate, imaging the taken-out component from below to obtain a first image, and imaging the component with the transfer material transferred to the electrodes from below to obtain a second image, recognizing an outline of the component and the electrodes from the first image to obtain a first recognition result, and recognizing the outline of the component from the second image to obtain a second recognition result, calculating relative coordinates including an angle of the electrodes with respect to the outline of the component from the first recognition result, calculating a correction amount including an angle for mounting the component on the substrate based on the relative coordinates and the second recognition result, and mounting the component on the substrate using the correction amount.

[0008] These comprehensive or specific aspects may be realized as a system, an apparatus, a method, an integrated circuit, a computer program, or a recording medium, or may be realized as any combination of a system, an apparatus, a method, an integrated circuit, a computer program, and a recording medium. Effect of the Invention

[0009] According to the present disclosure, electronic components can be mounted on a substrate with high accuracy. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a perspective view of a flux supply unit in the component mounting apparatus according to the embodiment of the present invention; [Figure 3A] FIG. 1 is a first functional explanatory diagram of a flux supply unit in a component mounting apparatus according to an embodiment of the present invention; [Figure 3B] FIG. 2 is a second functional explanatory diagram of the flux supply unit in the component mounting apparatus according to the embodiment of the present invention; [Figure 4] FIG. 1 is a configuration explanatory diagram of a recognition unit in a component mounting device according to an embodiment of the present invention; [Diagram 5]FIG. 1 is a block diagram illustrating a functional configuration of a control unit of a component mounting apparatus; [Figure 6A] FIG. 1 is a diagram showing a captured image of an electronic component with bumps before flux transfer. [Figure 6B] FIG. 13 is a diagram showing a captured image of an electronic component with bumps after flux transfer. [Figure 7] Flowchart of mounting process for electronic components with bumps when recognition is performed after flux transfer [Figure 8] Flowchart of mounting process for electronic components with bumps when recognition is performed before flux transfer [Figure 9] Flowchart of mounting process of electronic components with bumps when recognizing before and after flux transfer [Figure 10] FIG. 13 is a diagram showing a method for calculating a mounting position correction amount of a component mounting device according to the present embodiment. [Figure 11] A diagram showing an example of angle definition [Figure 12] 1 is a flowchart showing the process of a component mounting operation according to the present embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, with reference to the drawings as appropriate, an embodiment specifically disclosing a component mounting apparatus and a component mounting method according to the present disclosure will be described in detail. However, more detailed explanation than necessary may be omitted. For example, detailed explanation of already well-known matters and duplicate explanation of substantially the same configuration may be omitted. This is to avoid the following explanation becoming unnecessarily redundant and to facilitate understanding by those skilled in the art. Note that the attached drawings and the following explanation are provided to enable those skilled in the art to fully understand the present disclosure, and are not intended to limit the subject matter described in the claims.

[0012] Next, an embodiment of the present invention will be described with reference to the drawings. First, a component mounting apparatus of this embodiment will be described with reference to FIG. 1. FIG. 1 is a plan view of a component mounting apparatus of an embodiment of the present invention. The component mounting apparatus 1 has a function of mounting a bump-equipped electronic component P (see FIGS. 2, 3A, and 3B) having a plurality of bumps, such as a BGA, onto a substrate 2. A substrate transport mechanism 3 is disposed on a base 1a of the component mounting apparatus 1 in the X direction (substrate transport direction). The substrate transport mechanism 3 transports the substrate 2 to be mounted in the X direction and positions it at a predetermined mounting position.

[0013] Component supply units 4A, 4B are provided on both sides of the substrate transport mechanism 3. In the component supply unit 4A on one side, a tray feeder 5 and a flux supply unit 6 are mounted in parallel in the X direction to supply bump-equipped electronic components P stored in a tray 5a. Therefore, the component supply unit 4A serves as a bump-equipped electronic component supply unit that supplies bump-equipped electronic components P. In the component supply unit 4B on the other side, multiple tape feeders 7 are set to supply small components such as chip components held on a carrier tape.

[0014] 2, the flux supply unit 6 has a function of supplying flux 8 in a coated state, which is a transfer material to be transferred to a plurality of bumps Pa (see FIG. 3) of an electronic component P with bumps held by a mounting head 11A described later. The flux 8 is a viscous fluid that has the effect of removing oxide films that adhere to the surfaces of the bumps Pa (FIG. 3A) and the surfaces of the electrodes of the substrate 2 that are connected to the bumps Pa during component mounting.

[0015] In Fig. 1, a Y-axis moving mechanism 9 equipped with a linear drive mechanism is disposed at one end of the base 1a in the X direction in the Y direction perpendicular to the X direction in a horizontal plane. Two X-axis moving mechanisms 10A and 10B similarly equipped with linear drive mechanisms are coupled to the Y-axis moving mechanism 9 so as to be freely movable in the Y direction. Mounting heads 11A and 11B are attached to the X-axis moving mechanisms 10A and 10B so as to be freely movable in the X direction. By driving the Y-axis moving mechanism 9 and the X-axis moving mechanism 10A, the mounting head 11A moves horizontally in the XY direction. Similarly, by driving the Y-axis moving mechanism 9 and the X-axis moving mechanism 10B, the mounting head 11B moves horizontally in the XY direction.

[0016] 1 and 2, the mounting heads 11A and 11B are provided with a plurality of component holding heads 11a. The component holding heads 11a are provided with suction nozzles 12 capable of suctioning bump-equipped electronic components P at their lower ends, and the suction nozzles 12 can be moved individually in the vertical direction (Z direction) by a nozzle lifting mechanism (not shown). The mounting head 11A has a function of suctioning and picking up bump-equipped electronic components P supplied from a tray feeder 5 of the component supply unit 4A, which is a bump-equipped electronic component supply unit, and mounting the bump-equipped electronic components P on a board 2 positioned at a mounting work position. The mounting head 11B has a function of suctioning and picking up components supplied from a tape feeder 7 with the suction nozzles 12 and mounting the components on a board 2 positioned at a mounting work position. In the above configuration, the Y-axis movement mechanism 9, the X-axis movement mechanisms 10A and 10B, and the mounting heads 11A and 11B constitute a component mounting mechanism that picks up bump-equipped electronic components P and chip components from the component supply units 4A and 4B, and transfers and mounts them on the board 2.

[0017] 1, a board recognition camera 14 is disposed on each of the mounting heads 11A and 11B with its imaging direction facing downward. The board recognition camera 14 moves integrally with the mounting heads 11A and 11B, and images the board 2 from above. In addition, a recognition unit 15 is disposed on the base 1a between the component supply units 4A and 4B and the board transport mechanism 3. The recognition unit 15 images, from below, components such as electronic components P with bumps and chip components held by the mounting heads 11A and 11B moving above it.

[0018] Next, the structure and function of the flux supply unit 6 will be described with reference to FIG. 2, FIG. 3A, and FIG. 3B. FIG. 2 is a perspective view of the flux supply unit in the component mounting apparatus according to an embodiment of the present invention. FIG. 3A is a first functional explanatory diagram of the flux supply unit in the component mounting apparatus according to an embodiment of the present invention. FIG. 3B is a second functional explanatory diagram of the flux supply unit in the component mounting apparatus according to an embodiment of the present invention. The flux supply unit 6 is a transfer material supply device that supplies flux 8 in a film state as a transfer material to be transferred to a plurality of bumps Pa of the bump-equipped electronic component P held by the mounting head 11A, and is configured by providing each of the parts described below on an elongated base part 20. Note that, as the transfer material, flux containing metal particles or an adhesive material may be used in addition to the flux 8.

[0019] The base part 20 is detachably attached to a feeder base (not shown) provided in the component supply part 4A from the opposite side of the access direction of the mounting head 11A indicated by the arrow a, with its longitudinal direction aligned with the Y direction. In this specification, the side where the mounting head 11A accesses the flux supply unit 6 is defined as the front side, and the opposite side is defined as the rear side. The flux supply unit 6 is provided with an engagement part 20a that engages with the feeder base to fix the base part 20, and further, a handle 21 is provided protruding from the engagement part 20a at the rear. When the flux supply unit 6 is attached to the feeder base, the lower surface side of the base part 20 is aligned with the upper surface of the feeder base, and the handle 21 is grasped and pushed forward. As a result, the engagement part 20a engages with the rear end of the feeder base, and the base part 20 is attached to a predetermined position.

[0020] A stage 24 is disposed on the upper surface of the base portion 20, the reciprocating movement of which is guided in the longitudinal direction by a guide rail 22. The stage 24 is equipped with a stage drive mechanism consisting of a motor 25, a feed screw 26, and a nut member (not shown) which is connected to the underside of the stage 24 and into which the feed screw 26 screws, and the stage 24 reciprocates in the longitudinal direction (Y direction) by driving the motor 25 forward and backward. The stage 24 is a rectangular member having a structure in which a recess with a smooth bottom is formed on the upper surface side of the stage 24, and the bottom surface of this recess serves as a coating film formation surface 24a for forming a coating film of flux 8 (see FIG. 3A).

[0021] A gate-shaped bracket 27 is disposed on the upper surface of the base portion 20 so as to straddle the stage 24, and the bracket 27 holds a squeegee unit 28. As shown in FIG. 3A, the squeegee unit 28 includes a squeegee 28a that extends downward and has a lower end that is disposed with a film-forming gap g between the film-forming surface 24a and the squeegee 28a. With the flux 8 supplied to the film-forming surface 24a, the stage 24 is moved in the film-forming direction (arrow b) as shown in FIG. 3A, whereby a film of the flux 8 having a thickness corresponding to the film-forming gap g is formed on the film-forming surface 24a. The height position of the squeegee unit 28 relative to the stage 24 is variable, so that the thickness of the flux 8 to be formed can be adjusted to a desired thickness.

[0022] A scraping section 29 is disposed behind the squeegee unit 28, and is provided with a scraper 29a that extends downward and has a lower end that abuts against the coating film formation surface 24a. The scraper 29a is biased against the coating film formation surface 24a and is always in abutment against the coating film formation surface 24a. When the stage 24 is moved with the scraper 29a in abutment against it, the flux 8 on the coating film formation surface 24a is scraped to one side by the scraper 29a. A supply needle 30a that guides the flux 8 supplied from a syringe 30 to the coating film formation surface 24a is inserted and disposed between the squeegee unit 28 and the scraping section 29.

[0023] The mounting head 11A, which has picked up an electronic component P with bumps from the tray 5a of the tray feeder 5 of the component supply section 4A, moves to above the recognition unit 15, while the mounting head 11A is moving to the flux supply unit 6. Then, as shown in Fig. 3A, the electronic component P with bumps held by the suction nozzle 12 of the component holding head 11a is lowered (arrow c) toward the stage 24 on which the flux 8 has been formed. Next, when the component holding head 11a is raised after the bumps Pa of the electronic component P with bumps are brought into contact with the flux 8 (arrow d), the flux 8 is transferred to the bumps Pa of the electronic component P with bumps, as shown in Fig. 3B.

[0024] After the flux 8 has been transferred to the bumps Pa in this manner, the component holding head 11a holding the bump-equipped electronic component P moves above the recognition unit 15. The bump-equipped electronic component P is then imaged by the recognition unit 15, and the image acquired by imaging is subjected to recognition processing by the control unit 40 (see FIG. 5) to inspect the transfer state of the flux 8 on the bump-equipped electronic component P. In inspecting the transfer state, a pass / fail judgment is made based on preset judgment criteria (for example, whether the transfer area of ​​the flux 8 transferred to the bump-equipped electronic component P is equal to or larger than a reference value, whether the deviation of the transfer position is within an allowable range, etc.).

[0025] FIG. 4 shows the configuration of the recognition unit 15 used for inspecting the transfer state. FIG. 4 is a diagram for explaining the configuration of the recognition unit in the component mounting device according to one embodiment of the present invention. The imaging section 15a of the recognition unit 15 includes an illumination section 31, a half mirror 32, and a component recognition camera 33, and this configuration captures an image of the bump Pa of the electronic component P with bumps held by the suction nozzle 12 of the component holding head 11a located above. The component recognition camera 33 receives imaging light incident from above, and acquires an optical image formed by the lens 33a as digital image data by the imaging element 33b. The acquired image is subject to recognition processing by the imaging processing section 49 of the control section 40. The component recognition camera 33 may be read as a component imaging camera.

[0026] The illumination unit 31 irradiates illumination light onto the bump-equipped electronic component P to be imaged. The illumination unit 31 is composed of a backlight illuminator 31a, a side illuminator 31b, and a coaxial illuminator 31c, each of which irradiates light from different directions. The backlight illuminator 31a irradiates light onto a background surface 12b provided on the underside of the flange 12a of the suction nozzle 12, and the reflected light that passes downward from the back surface of the bump-equipped electronic component P to be imaged is received by the component recognition camera 33 as imaging light. The side illuminator 31b irradiates light obliquely from below onto the underside of the bump-equipped electronic component P to be imaged, and the reflected light is received by the component recognition camera 33 as imaging light.

[0027] The coaxial lighting 31c also irradiates illumination light from the side onto the half mirror 32 disposed at an angle above the component recognition camera 33. This illumination light is reflected upward by the half mirror 32 and enters the underside of the bump-equipped electronic component P from the same axial direction as the optical axis of the component recognition camera 33. The illumination light is reflected downward and transmitted through the half mirror 32 to be received as imaging light by the component recognition camera 33. Note that in the imaging for inspecting the transfer state shown in this embodiment, an example is shown in which an inspection image is obtained using only the side lighting 31b and the coaxial lighting 31c.

[0028] Next, a software configuration (functional configuration) of the control unit of the component mounting device will be described with reference to Fig. 5. Fig. 5 is a block diagram illustrating an example of the functional configuration of the control unit of the component mounting device.

[0029] The control unit 40 of the component mounting apparatus 1 may be configured by a general-purpose computer including a storage device represented by a Read Only Memory and a Random Access Memory, and an arithmetic device represented by a Central Processing Unit. The arithmetic device realizes the software configuration (functional configuration) shown in FIG. 6 by reading and executing a computer program stored in the storage device. That is, each block shown in the control unit 40 in FIG. 6 represents a function realized by software. However, at least a part of the functions expressed as blocks is not limited to software, and may be realized by the physical configuration (hardware) of the "apparatus".

[0030] The control unit 40 includes a storage unit 41, a mechanism driving unit 46, a relative coordinate calculation unit 47, a correction amount calculation unit 48, and an image processing unit 49. The mechanism driving unit 46 controls the driving of the Y-axis movement mechanism 9 and the X-axis movement mechanisms 10A, 10B, 11A, and 11B. For example, the mechanism driving unit 46 controls the driving of the flux supply unit 6, the board transport mechanism 3, the component mounting mechanism 16, and the tape feed mechanism 13, and causes the flux supply unit 6, the board transport mechanism 3, the component mounting mechanism 16, and the tape feed mechanism 13 to operate in cooperation with each other. The component mounting mechanism 16 can be read as a mounting mechanism. The control unit 40 can be read as a processor.

[0031] The storage unit 41 holds at least mounting data 42, component data 43, relative coordinate information 44, and correction amount information 45. The mounting data 42 includes information such as the type of bump-equipped electronic component P to be mounted on each of the substrates 2, the mounting position and mounting attitude (e.g., orientation) of the bump-equipped electronic component P on the substrate 2, the mounting order of the bump-equipped electronic components P, and the mounting timing of the bump-equipped electronic components P. The component data 43 may include information such as the outer shape, size, and the presence or absence or number of bumps Pa for each type of bump-equipped electronic component P.

[0032] The relative coordinate information 44 stores information on the relative coordinates between the outer shape of the bump-equipped electronic component P and the bumps Pa included in the bump-equipped electronic component P, which is calculated by the relative coordinate calculation unit 47 .

[0033] The correction amount information 45 stores information on the correction amount calculated by the correction amount calculation unit 48. The correction amount is the amount of correction of the position when the bump-equipped electronic component P after the flux transfer is mounted on the substrate 2. Hereinafter, the correction amount of the position when the bump-equipped electronic component P after the flux transfer is mounted on the substrate 2 is referred to as the mounting position correction amount.

[0034] The relative coordinate calculation unit 47 calculates the relative coordinates between the outer shape of the bump-equipped electronic component P and the electrode positions included in the bump-equipped electronic component P. A specific method for calculating the relative coordinates will be described with reference to FIG.

[0035] The correction amount calculation unit 48 calculates the wearing position correction amount. A specific method for calculating the wearing position correction amount will be described with reference to FIG.

[0036] The imaging processing unit 49 includes a camera control unit 50 and a component external shape / electrode recognition unit 51. The component recognition camera 33 is controlled by the imaging processing unit 49.

[0037] The camera control unit 50 controls the imaging of the component recognition camera 33 and the light emission of the illumination unit 31 at the imaging timing.

[0038] The component external shape / electrode recognition unit 51 recognizes the external shape of the bump-equipped electronic component P imaged by the component recognition camera 33 and the positions and number of bumps Pa included therein.

[0039] Next, captured images of the electronic component with bumps will be described with reference to Fig. 6A and Fig. 6B. Fig. 6A is a view showing a captured image of the electronic component with bumps before flux transfer. Fig. 6B is a view showing a captured image of the electronic component with bumps after flux transfer.

[0040] Image IM1 is an image captured by component recognition camera 33 of bump-equipped electronic component P before flux transfer and adsorbed to suction nozzle 12. A plurality of bumps Pa are arranged on bump-equipped electronic component P. Note that the positions and number of bumps Pa are merely examples and are not limited to the examples shown in Figures 6A and 6B. The bumps Pa do not necessarily need to be arranged at equal intervals on bump-equipped electronic component P, and may be arranged at random positions as shown in Figure 6A.

[0041] Image IM2 is an image captured by component recognition camera 33 of bumped electronic component P after flux transfer, which is picked up by suction nozzle 12. Compared with image IM1 which shows bumped electronic component P before flux transfer, bumps Pa of bumped electronic component P after flux transfer become black (for example, a similar color to bumped electronic component P). This makes it difficult for component outer shape / electrode recognition unit 51 to accurately recognize bumps Pa from the captured image of bumped electronic component P after flux transfer (i.e., image IM2).

[0042] Next, the timing for recognizing an electronic component with bumps will be described with reference to Figures 7, 8, and 9. Figure 7 is a flowchart of the mounting process for an electronic component with bumps when the component is recognized after flux transfer. Figure 8 is a flowchart of the mounting process for an electronic component with bumps when the component is recognized before flux transfer. Figure 9 is a flowchart of the mounting process for an electronic component with bumps when the component is recognized before and after flux transfer.

[0043] First, the mounting process of the bump-equipped electronic component P in the case of recognition after flux will be described with reference to the flowchart of Fig. 7. The component mounting apparatus 1 first performs a suction operation of suctioning the bump-equipped electronic component P with the suction nozzle 12 (step St100).

[0044] The component mounting apparatus 1 moves the mounting head 11A or the mounting head 11B to above the flux supply unit 6. The component mounting apparatus 1 lowers the mounting head 11A or the mounting head 11B toward the stage 24 on which the flux 8 is formed, and transfers the flux to the bumps Pa included in the bump-equipped electronic component P. This completes the transfer operation of the component mounting apparatus 1 (step St101).

[0045] After completing the transfer operation of the process of step St101, the component mounting apparatus 1 moves the mounting head 11A or 11B to above the recognition unit 15 and captures an image of the bump-equipped electronic component P with the component recognition camera 33. The component outer shape / electrode recognition unit 51 of the component mounting apparatus 1 executes a recognition operation to recognize the bump-equipped electronic component P using the captured image captured by the component recognition camera 33 (step St102).

[0046] After the process of step St102, the component mounting apparatus 1 executes a mounting operation to mount the electronic component P with bumps on the substrate 2 (step St103).

[0047] This type of recognition after flux transfer has the advantage that the component mounting apparatus 1 can obtain the amount of correction required when mounting the bump-equipped electronic component P on the substrate 2 after the flux has been transferred. However, this has the problem that the accuracy of the mounting operation is reduced because the bumps Pa cannot be recognized due to the flux (i.e., the transfer material) and the amount of correction is obtained from the external shape of the bump-equipped electronic component P.

[0048] Next, the mounting process of the bump-equipped electronic component P in the case of recognition before flux transfer will be described with reference to the flowchart in Fig. 8. Note that detailed processing contents of the suction operation, recognition operation, transfer operation and mounting operation are the same as those explained in the flowchart in Fig. 7, so explanations will be omitted.

[0049] The component mounting apparatus 1 performs a pickup operation (step St200) and then a recognition operation (step St201). After the recognition operation, the component mounting apparatus 1 performs a transfer operation (step St202), and then performs a mounting operation (step St203).

[0050] In such recognition before flux transfer, the component mounting apparatus 1 can recognize the bumps Pa because it can perform the recognition operation in a state where there is no flux (i.e., transfer material) on the bumps Pa. This enables the component mounting apparatus 1 to recognize abnormalities such as chipping of the bumps Pa. However, because the component mounting apparatus 1 does not perform the recognition operation after flux transfer, there is a problem in that if the position of the bump-equipped electronic component P shifts after flux transfer, the position cannot be corrected, which reduces the accuracy of mounting the bump-equipped electronic component P on the substrate 2.

[0051] Next, the mounting process of the electronic component P having bumps in the case of recognition before and after flux transfer will be described with reference to the flow chart of FIG.

[0052] The component mounting apparatus 1 performs a pickup operation (step St300), a recognition operation (step St301), and then a transfer operation (step St302). After the transfer operation, the component mounting apparatus 1 again performs a recognition operation (step St303), and then a mounting operation (step St304).

[0053] This allows the component mounting apparatus 1 to recognize the state of the bumps Pa before the flux is transferred and detect any abnormalities, and also to obtain the amount of correction to be made when mounting the bump-equipped electronic component P on the substrate 2 from the outer position of the bump-equipped electronic component P after the flux is transferred. However, because the bumps Pa cannot be recognized due to the flux, correction cannot be made using the positions of the bumps Pa, which reduces the accuracy of the mounting operation.

[0054] In view of this situation, there is a need to calculate a correction amount when mounting an electronic component P with bumps on a substrate 2 from the positions of bumps Pa after flux transfer, and to perform the mounting operation with high accuracy.

[0055] Next, a method for calculating the mounting position correction amount of the component mounting device according to the present embodiment will be described with reference to Fig. 10 and Fig. 11. Fig. 10 is a diagram showing a method for calculating the mounting position correction amount of the component mounting device according to the present embodiment. Note that detailed processing of the suction operation and transfer operation shown in Fig. 10 is the same as that described in Fig. 7, and therefore description thereof will be omitted. Fig. 11 is a diagram showing an example of the definition of an angle.

[0056] After the suction operation, the component mounting apparatus 1 executes a pre-transfer recognition operation, which is a recognition operation before transferring flux to the bumps Pa of the bump-equipped electronic component P. As the pre-transfer recognition operation, the component mounting apparatus 1 first moves the mounting head 11A or the mounting head 11B above the recognition unit 15, and captures an image of the bump-equipped electronic component P that is being sucked onto the suction nozzle 12 by the component recognition camera 33. The component recognition camera 33 outputs the captured image to the component outer shape / electrode recognition unit 51. The component outer shape / electrode recognition unit 51 recognizes the outer shape of the bump-equipped electronic component P. The component outer shape / electrode recognition unit 51 outputs the recognition result to the relative coordinate calculation unit 47. The relative coordinate calculation unit 47 calculates the coordinates of the center position Pc of the bump-equipped electronic component P from the recognized outer shape of the bump-equipped electronic component P. The center position Pc is expressed, for example, by XY coordinates. The XY coordinates are coordinates set for the captured image, and are, for example, coordinates when any vertex of the captured image is set to (X, Y) = (0, 0). The method of setting the XY coordinates is arbitrary and is not limited to the above example. m1, y m1 ) The central position Pc is read as the first central position.

[0057] Next, the component external shape / electrode recognition unit 51 recognizes the positions of all bumps Pa included in the bump-equipped electronic component P. The component external shape / electrode recognition unit 51 calculates the positions of all recognized bumps Pa in the relative coordinate calculation unit 47. The relative coordinate calculation unit 47 finds the average position Pac of each position of all recognized bumps Pa. The average position Pac is found by adding up the X coordinates and Y coordinates of all bumps Pa, and dividing the summed X coordinates and Y coordinates by the number of bumps Pa. The average position Pac is calculated as follows: (x e, y e )

[0058] The relative coordinate calculation unit 47 calculates a bump outer shape PaF, which is the outer shape of a virtual bump Pa, having a size according to the number of bumps Pa, with the average position Pac as the center. The relative coordinate calculation unit 47 calculates a quadrangle that includes multiple bumps Pa, and sets the bump outer shape PaF within the captured image.

[0059] The relative coordinate calculation unit 47 calculates an angle θ of the bump-equipped electronic component P with respect to a predetermined direction. m1 The predetermined direction is, for example, set along one side of the captured image and is represented by a vector (referred to as the first vector) extending from an end point of the side (referred to as the first end point) to the other end point. The first end point is, for example, point P1, which is one of the vertices of the captured image IM3 shown in FIG. 11. The first vector is, for example, vector V1 shown in FIG. 11. Angle θ m1 is expressed as an angle between the first vector and a vector (called a second vector) set along a predetermined side of the bump-equipped electronic component P. The second vector is, for example, vector V2 shown in FIG. 11. Note that the angle θ m1 The definition of can be set arbitrarily and is not limited to the above example. For example, the angle θ m1 The angle θ m1 is read as the first angle.

[0060] The relative coordinate calculation unit 47 calculates θ m1 The relative coordinate calculation unit 47 converts the angle θ m1After converting it so that it is 0 degrees, the angle θ of the average position Pac e Calculate the angle θ e is the angle θ m1 The angle θ is calculated using a vector (for example, the first vector) that is set when calculating the angle θ e is expressed by, for example, the angle between the first vector and a vector (called a third vector) set along a predetermined side of the bump outline PaF. The third vector is, for example, the vector V3 shown in FIG. 11. Note that the angle θ e The definition of the angle θ can be set arbitrarily and is not limited to the above example. e can be read as the second angle.

[0061] The relative coordinate calculation unit 47 calculates the angle θ m1 When the center position Pc(x m1, y m1, θ m1 ) and the average position Pac(x e, y e, θ e ) is calculated using equation (1).

[0062]

number

[0063] The relative coordinate calculation unit 47 calculates the relative coordinate (x e-m ,y e-m ,θ e-m ) is stored in the relative coordinate information 44. e-m is interpreted as a relative angle.

[0064] After the pre-transfer recognition operation, the component mounting apparatus 1 executes the transfer operation.

[0065] After the transfer operation, the component mounting apparatus 1 executes a post-transfer recognition operation after the flux is transferred. As the post-transfer recognition operation, the component mounting apparatus 1 first moves the mounting head 11A or 11B above the recognition unit 15, and captures an image of the bump-attached electronic component P after the flux is transferred, which is adsorbed to the suction nozzle 12, with the component recognition camera 33. The component recognition camera 33 outputs the captured image to the component outer shape / electrode recognition unit 51.

[0066] The component outer shape / electrode recognition unit 51 recognizes the outer shape of the bump-equipped electronic component P. The component outer shape / electrode recognition unit 51 outputs the recognition result to the relative coordinate calculation unit 47.

[0067] The relative coordinate calculation unit 47 calculates the coordinates of the center position Pc2 from the information on the four sides (side S) of the outline of the bump-equipped electronic component P. The method of calculating the coordinates of the center position Pc2 is not limited to the method using the information on the four sides of the outline of the bump-equipped electronic component P, and it may be calculated from the coordinates of the four vertices of the bump-equipped electronic component P. If the coordinates of the center position Pc2 are (x m2 ,y m2 ,θ m2 ) The central position Pc2 is deemed to be a second central position.

[0068] The relative coordinate calculation unit 47 calculates the relative coordinates (x e-m ,y e-m ,θ e-m ) from the relative coordinate information 44. The relative coordinate calculation unit 47 obtains the relative coordinate (x e-m ,y e-m ,θ e-m ) to calculate the mounting position correction amount (x, y, θ) based on equation (2).

[0069]

number

[0070] The relative coordinate calculation unit 47 stores the calculated wearing position correction amount (x, y, θ) in the correction amount information 45. The angle θ can be read as a correction angle.

[0071] After the post-transfer recognition operation, as a mounting operation, the mechanism driving unit 46 corrects the position of the bump-equipped electronic component P based on the mounting position correction amount (x, y, θ) from the correction amount information 45, and controls the component mounting mechanism 16 to mount the bump-equipped electronic component P on the substrate 2.

[0072] As described above, before the transfer operation, the component mounting apparatus 1 calculates relative coordinates that link information on the outer shape of the bump-equipped electronic component P (i.e., the center position of the bump-equipped electronic component P calculated from the outer shape of the bump-equipped electronic component P) and information on the average position of the bumps Pa. The component mounting apparatus 1 calculates a mounting position correction amount for the bump-equipped electronic component P after the transfer operation using the relative coordinates, so that it can calculate a mounting position correction amount using information on the positions of the bumps Pa even after the transfer operation. In other words, the component mounting apparatus 1 can mount the bump-equipped electronic component P on the board 2 with high accuracy by correcting the position of the bump-equipped electronic component P from the mounting position correction amount calculated using the relative coordinates including information on the positions of the bumps Pa after the transfer operation and performing the mounting operation.

[0073] Furthermore, the component mounting apparatus 1 can calculate the amount of correction, including the rotational direction, for the positional deviation of the bump-equipped electronic component P. This allows the component mounting apparatus 1 to correct the deviation of the bump-equipped electronic component P, including not only the amount of parallel movement on the XY coordinate system but also the amount of rotation, and allows the bump-equipped electronic component P to be mounted on the substrate 2 with high accuracy.

[0074] Moreover, the component mounting apparatus 1 can detect the bumps Pa before the transfer operation, thereby detecting abnormalities such as chipping of the bumps Pa. Moreover, the component mounting apparatus 1 can detect the transfer amount of the transfer material by imaging the bump-equipped electronic component P after the transfer operation.

[0075] Next, a process of mounting an component according to this embodiment will be described with reference to Fig. 12. Fig. 12 is a flowchart showing a process of mounting an component according to this embodiment.

[0076] The mechanism driver 46 controls the mounting head 11A or the mounting head 11B of the component mounting mechanism 16 to pick up a component (for example, an electronic component P with bumps) (step St400).

[0077] The mechanism driving unit 46 moves the mounting head 11A or the mounting head 11B above the recognition unit 15. The camera control unit 50 causes the component recognition camera 33 to capture an image of the component (step St401). The image captured in the process of step St401 is interpreted as the first image.

[0078] The component outer shape / electrode recognition unit 51 recognizes the outer shape and electrodes (e.g., bumps Pa) of the component from the captured image received from the component recognition camera 33 (step St402). The component outer shape / electrode recognition unit 51 outputs the recognition result obtained in the process of step St402 to the relative coordinate calculation unit 47.

[0079] The relative coordinate calculation unit 47 calculates relative coordinates using the recognition result of the process in step St402. The relative coordinate calculation unit 47 outputs and stores the calculated relative coordinates in the relative coordinate information 44 (step St403).

[0080] The mechanism driving unit 46 moves the mounting head 11A or the mounting head 11B to above the flux supply unit 6, and dips the component in the flux to perform flux transfer (step St404).

[0081] The mechanism driving unit 46 moves the mounting head 11A or the mounting head 11B to above the recognition unit 15. The camera control unit 50 causes the component recognition camera 33 to capture an image of the component (step St405). The component recognition camera 33 outputs the captured image to the component outer shape / electrode recognition unit 51. The image captured in the process of step St405 is interpreted as a second image.

[0082] The component outer shape / electrode recognition unit 51 recognizes the outer shape of the component (step St406). The component outer shape / electrode recognition unit 51 outputs the result of recognition in the process of step St406 to the correction amount calculation unit .

[0083] The correction amount calculation unit 48 acquires information on the relative coordinates from the relative coordinate information 44. The correction amount calculation unit 48 calculates the correction amount (i.e., the wearing position correction amount) from the information on the recognition result of the process of step St406 and the relative coordinates. The correction amount calculation unit 48 outputs and stores the information on the correction amount to the correction amount information 45 (step St407).

[0084] The mechanism driving unit 46 acquires the correction amount from the correction amount information 45. The mechanism driving unit 46 drives the component mounting mechanism 16 to mount the component on the board based on the correction amount (step St408).

[0085] (Summary of this embodiment) The above description of the present embodiment discloses the following techniques.

[0086] <Technology 1> The component mounting apparatus of this embodiment includes a mounting mechanism that takes a component from a component supply unit and transfers a transfer material to multiple electrodes formed on the underside of the component to mount the component on a board; a component imaging camera that images the component taken by the mounting mechanism from below to obtain a first image and images the component with the transfer material transferred to the electrodes from below to obtain a second image; and a processor, wherein the processor recognizes the outer shape and electrodes of the component from the first image to obtain a first recognition result and recognizes the outer shape of the component from the second image to obtain a second recognition result, calculates relative coordinates including the angle of the electrodes relative to the outer shape of the component from the first recognition result, calculates a correction amount including the angle for mounting the component on the board based on the relative coordinates and the second recognition result, and mounts the component on the board using the correction amount.

[0087] As a result, the component mounting device according to the present embodiment can calculate relative coordinates including an angle linked to the information on the position of the electrode and the outer shape of the component before transferring the transfer material to the electrode, and calculate a correction amount including an angle when mounting the component on the board based on the relative coordinates. As a result, the component mounting device can mount the component on the board using a correction amount including information on the position of the electrode after transferring the transfer material, so that the component can be mounted on the board with high accuracy. In addition, since the component mounting device calculates a correction amount including angle information, it can correct the misalignment of the component in the rotational direction and mount the component on the board with high accuracy.

[0088] <Technology 2> In the component mounting device described in Technology 1, the processor calculates a first center position of the component's outline and an average position of the position coordinates of each of the multiple electrodes from the first image, and calculates relative coordinates including an angle from the first center position and the average position.

[0089] This allows the component mounting device according to this embodiment to calculate relative coordinates that link the positional information of the outer shape of the component and the electrodes.

[0090] <Technology 3> In the component mounting device described in Technology 1 or Technology 2, the processor calculates a second center position of the component's outline from the second recognition result, and calculates a correction amount including an angle for mounting the component on the board based on the relative coordinates and the second center position.

[0091] As a result, the component mounting device according to this embodiment can obtain a correction amount based on the position of the electrode by calculating the correction amount using the relative coordinates. In other words, although it is difficult for the component mounting device to accurately recognize the position of the electrode from the captured image of the component after the transfer material has been transferred, the component mounting device can obtain a correction amount based on the position of the electrode by using the relative coordinates. This allows the component mounting device to mount the component on the board with high accuracy.

[0092] <Technology 4> In a component mounting device described in any one of Techniques 1 to 3, a processor calculates an angle between a first vector set along a specified side of the periphery of the first image and a second vector set along a specified side of the outer shape of the component as a first angle of the outer shape of the component, sets a rectangle including a plurality of electrodes in the first image, calculates an angle between the first vector and a third vector set along a specified side of the periphery of the rectangle as a second angle of the electrode, calculates a relative angle between the component and the electrode from the first angle and the second angle, and calculates a relative coordinate including the relative angle.

[0093] As a result, the component mounting apparatus according to this embodiment can mount the component on the board while correcting any misalignment in the rotational direction with high accuracy.

[0094] <Technology 5> In the component mounting device described in any one of Techniques 1 to 4, the processor calculates, based on the second recognition result, an angle between the first vector and a fourth vector set along a specified side of the component's outline as a third angle, and calculates a correction angle when mounting the component on a board from the relative angle and the third angle.

[0095] As a result, the component mounting apparatus according to this embodiment can mount the component on the board with high accuracy by correcting not only the translational deviation of the component within a two-dimensional plane but also the rotational deviation of the component.

[0096] Although the embodiments have been described above with reference to the accompanying drawings, the present disclosure is not limited to such examples. It is clear that a person skilled in the art can conceive of various modifications, corrections, substitutions, additions, deletions, and equivalents within the scope of the claims, and it is understood that these also belong to the technical scope of the present disclosure. In addition, the components in the above-mentioned embodiments may be arbitrarily combined within the scope of the invention. [Industrial Applicability]

[0097] The technology disclosed herein is useful as a component mounting apparatus and a component mounting method for mounting electronic components on a board with high precision. [Explanation of symbols]

[0098] 1 Component mounting equipment 2. Board 3. Substrate transport mechanism 4A Parts supply section 6 Flux supply unit 8. Flux 13 Tape feed mechanism 14 Circuit Board Recognition Camera 14 15 Recognition Units 16 Component mounting mechanism 11A Mounting Head 31 Lighting Department 33 Parts Recognition Camera 34a Image before transfer 34b Image after transcription 40 Control section 41 Storage section 42 Implementation Data 43 Parts Data 44 Relative Coordinate Information 45 Correction amount information 46 Mechanism drive unit 47 Relative coordinate calculation section 48 Correction amount calculation section 49 Imaging Processing Unit 50 Camera control unit 51 Component outline / electrode recognition unit P Bumped electronic components Pa Bump

Claims

1. a mounting mechanism that takes out a component from a component supply unit, transfers a transfer material to a plurality of electrodes formed on a bottom surface of the component, and mounts the component on a substrate; a component imaging camera that images the component removed by the mounting mechanism from below to obtain a first image, and also images the component with the transfer material transferred to the electrode from below to obtain a second image; a processor; The processor, recognizing an outer shape of the component and the electrodes from the first image to obtain a first recognition result, and recognizing the outer shape of the component from the second image to obtain a second recognition result; calculating relative coordinates including an angle of the electrode with respect to an outer shape of the component from the first recognition result; calculating a correction amount including an angle for mounting the component on the board based on the relative coordinates and the second recognition result; Mounting the component on the board using the correction amount; Component mounting equipment.

2. the processor calculates a first center position of an outline of the component and an average position of position coordinates of each of the plurality of electrodes from the first image, and calculates the relative coordinates including an angle from the first center position and the average position. The component mounting device according to claim 1 .

3. the processor calculates a second center position of the outer shape of the component from the second recognition result, and calculates a correction amount including an angle for mounting the component on the board based on the relative coordinates and the second center position. The component mounting apparatus according to claim 2 .

4. The processor, calculating an angle between a first vector set along a predetermined side of an outer periphery of the first image and a second vector set along a predetermined side of the outline of the component as a first angle of the outline of the component; setting a rectangle including the plurality of electrodes in the first image; calculating an angle between the first vector and a third vector set along a predetermined side of the periphery of the quadrangle as a second angle of the electrode; calculating a relative angle between the component and the electrode from the first angle and the second angle; Calculating a relative coordinate including the relative angle; The component mounting apparatus according to claim 1 .

5. The processor, calculating an angle between the first vector and a fourth vector set along a predetermined side of an outer shape of the component based on the second recognition result, as a third angle; calculating a correction angle when mounting the component on the board from the relative angle and the third angle; The component mounting apparatus according to claim 4.

6. Taking out a component from a component supply unit, transferring a transfer material to a plurality of electrodes formed on a bottom surface of the component, and mounting the component on a substrate; acquiring a first image by imaging the removed component from below, and acquiring a second image by imaging the component with the transfer material transferred to the electrode from below; recognizing an outer shape of the component and the electrodes from the first image to obtain a first recognition result, and recognizing the outer shape of the component from the second image to obtain a second recognition result; calculating relative coordinates including an angle of the electrode with respect to an outer shape of the component from the first recognition result; calculating a correction amount including an angle for mounting the component on the board based on the relative coordinates and the second recognition result; Mounting the component on the board using the correction amount; Component mounting method.

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