Substrate processing method and reforming unit
JP2024175399APending Publication Date: 2024-12-18USHIO INC
Patent Information
- Application Number
- JP2023093165
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-06-06
- Publication Date
- 2024-12-18
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Abstract
To provide a substrate processing method for improving etching resistance of a side wall to obtain an expected fine pattern.SOLUTION: A substrate processing method includes: irradiating, with vacuum-ultraviolet light, an ALD film deposited on a substrate having a solid structure on a side wall of the ALD film along the solid structure to reform the ALD film; etch-backing the ALD film to leave the side wall of the ALD film along the solid structure; and etching the substrate with the ALD film that is reformed and etch-backed to be left as an etching mask.SELECTED DRAWING: Figure 1C
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Citation Information
Patent Citations
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