Resin additive, resin composition comprising inorganic particles, production method of resin additive, and production method of resin composition comprising inorganic particles

Abstract

To provide a resin additive that allows blending of a large amount of inorganic particles into a resin, allows the resin to have good flowability with improved thermal conductivity even when the blending amount of the inorganic particles is large, and dos not easily affect moldability of an encapsulation resin.SOLUTION: There is provided a resin additive added to an encapsulation resin including a hydroxy group and the resin additive includes: inorganic particles; and surface treatment layers formed on surfaces of the inorganic particles, where the surface treatment layer comprises an organic acid and has carboxyl groups on the surface thereof. The encapsulation resin comprises an epoxy resin having hydroxy groups, the inorganic particles comprises particles formed of alumina, and the surface treatment layer may comprise an organic acid including aromatic hydroxycarboxylic acids. The surface treatment layer and the encapsulation resin form ester bonds and kneading viscosity of the inorganic particles with the encapsulation resin is lower than that of inorganic particles having no surface treatment layers.SELECTED DRAWING: Figure 1

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