Plasma generation mechanism and light source device

Abstract

To provide a plasma generation mechanism and a light source device which can prevent accumulation of debris generated with plasma generation.SOLUTION: A plasma generation mechanism is provided on a light source device for converting a liquid plasma raw material into plasma by irradiation with an energy beam and taking out radiation rays, and includes a rotor, a rotation driving source, a raw material supply part, a shielding part, a heating mechanism, and a liquid guiding part. The rotor has a rotation surface which is a surface rotated around a rotation axis. The rotation driving source rotates the rotor around the rotation axis. The raw material supply part supplies the plasma raw material to the rotation surface. The shielding part faces an irradiation position irradiated with the energy beam in the rotation surface. The heating mechanism heats the shielding part to a temperature equal to or higher than the melting point of the plasma raw material. The liquid guiding part guides the plasma raw material flowing from the shielding part into the raw material supply part.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a plasma generating mechanism and a light source device that supply plasma raw material to an energy beam irradiation position and generate plasma. [Background technology]

[0002] Traditionally, X-rays have been used for medical, industrial, and research purposes. In the medical field, X-rays are used for chest X-ray photography, dental X-ray photography, and CT (Computer Tomogram). In the industrial field, X-rays are used for non-destructive testing to observe the inside of materials such as structures and welds, and non-destructive tomographic testing. In the research field, X-rays are used for X-ray diffraction to analyze the crystal structure of materials, and X-ray spectroscopy (fluorescence X-ray analysis) to analyze the constituent elements of materials. Extreme ultraviolet light (hereinafter also referred to as "EUV (Extreme Ultra Violet) light") with a wavelength of 13.5 nm, which is in the soft X-ray region with a relatively long wavelength among X-rays, has been used as exposure light in recent years.

[0003] Some EUV light source devices generate EUV light by irradiating and exciting a plasma raw material such as molten tin or lithium with an energy beam to generate high-temperature plasma, from which EUV light is extracted. A method that uses laser light as an energy beam is called LPP (Laser Produced Plasma), and a method that uses discharge is called DPP (Discharge Produced Plasma) or LDP (Laser Assisted Discharge Produced Plasma).

[0004] Known LPP-type EUV light source devices generate plasma by exciting the raw material by focusing laser light on droplets of the plasma raw material. In contrast, a method has been developed in recent years to supply plasma raw material to an irradiation area of ​​laser light by using the centrifugal force of a rotor (see, for example, Patent Document 1). In this method, the rotor rotates with its lower part immersed in the stored plasma raw material, so that the plasma raw material adheres to the surface of the rotor and the plasma raw material is supplied to the irradiation area on the rotor surface. This method does not require the plasma raw material to be supplied as droplets, and therefore can obtain high-brightness radiation with a relatively simple configuration compared to the method of focusing laser light on droplets. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2014-216286 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, when a plasma raw material is irradiated with a laser beam, debris, which is vapor and mist of the plasma raw material, is generated along with the plasma. As described in Patent Document 1, when a laser beam is irradiated onto the surface of a rotor coated with a plasma raw material, a large amount of debris is ejected in the normal direction of the rotor surface and adheres to the area of ​​the cover of the rotor facing the irradiated area (hereinafter referred to as the facing area).

[0007] The stored plasma raw material is heated by a heater and melted, but the heat does not reach the vicinity of the facing region, and the debris that adheres to the facing region solidifies. If a large amount of debris is ejected, the debris will accumulate in the direction it is coming from, which may affect the EUV light emission mechanism.

[0008] Furthermore, among the plasma raw material that adheres to the surface of the rotating body, the plasma raw material that is not irradiated with the laser light is returned to the storage tank and reused. However, if debris accumulates in the opposing region, the plasma raw material does not return to the storage tank, and the stored plasma raw material decreases. In particular, when the irradiation frequency of the laser light is high, the amount of plasma raw material that is reduced increases, making it necessary to replenish it early.

[0009] In view of the above circumstances, an object of the present invention is to provide a plasma generation mechanism and a light source device capable of preventing the accumulation of debris that occurs with plasma generation. [Means for solving the problem]

[0010] In order to achieve the above-mentioned object, a plasma generation mechanism according to one embodiment of the present invention is a plasma generation mechanism provided in a light source device that converts liquid plasma raw material into plasma by irradiating it with an energy beam to extract radiation, and is provided with a rotating body, a rotation drive source, a raw material supply unit, a shielding unit, a heating mechanism, and a liquid guide unit. The rotating body has a surface of rotation that rotates around a rotation axis. The rotary drive source rotates the rotor about the rotation axis. The raw material supply unit supplies the plasma raw material to the rotating surface. The shielding portion faces an irradiation position on the surface of rotation where the energy beam is irradiated. The heating mechanism heats the shielding portion to a temperature equal to or higher than the melting point of the plasma raw material. The liquid guide portion guides the plasma raw material flowing in from the shield portion to the raw material supply portion.

[0011] According to this configuration, liquid plasma raw material is supplied to the rotating surface from the raw material supply unit, and when the energy beam is irradiated to the irradiation position on the rotating surface, plasma is generated and debris is ejected. The debris reaches the shielding unit facing the irradiation position, but since the shielding unit is heated to above the melting point of the plasma raw material, the debris that reaches the shielding unit melts and becomes liquid plasma raw material, and returns to the raw material supply unit via the liquid guiding unit. Therefore, it is possible to reuse the plasma raw material that has become debris, and the frequency of replenishment of the plasma raw material can be reduced. In addition, since the debris does not accumulate on the shielding unit, the adverse effect of the debris on the emission of radiation can be avoided.

[0012] the raw material supply unit has a storage tank that stores the plasma raw material flowing in from the liquid guiding unit, A part of the rotation surface of the rotor may be immersed in the plasma raw material stored in the storage tank.

[0013] The heating mechanism may be disposed on the opposite side of the shielding part to the rotating body.

[0014] The heating mechanism may be disposed in the reservoir.

[0015] the plasma generation mechanism further includes a cover surrounding the rotating body and having an opposing surface opposing the rotating surface; An opening is provided in the opposing surface, The shielding portion may have a shielding surface facing the irradiation position with the opening interposed therebetween.

[0016] The shielding surface may be further away from the rotating surface than the opposing surface.

[0017] the raw material supply unit has a storage tank that stores the plasma raw material flowing in from the liquid guiding unit, The opposing surface may coincide with a periphery of the storage tank when viewed in a direction perpendicular to the rotation axis.

[0018] a cover that surrounds the rotating body and has an opposing surface that faces the rotating surface; the opposing surface is located between the liquid guiding portion and the raw material supplying portion, The liquid guide portion may cause the plasma raw material flowing in from the shield portion to flow onto the opposing surface.

[0019] the shielding portion has a shielding surface facing the irradiation position, The liquid guide portion may have a liquid guide surface that gradually approaches the rotation surface from the shielding surface toward the opposing surface.

[0020] The liquid-guiding surface may be an inclined surface.

[0021] The liquid-guiding surface may be curved.

[0022] The shielding surface may have a groove through which the plasma raw material flows.

[0023] The shielding surface and the liquid-guiding surface may be hemispherical at a certain distance from the irradiation position.

[0024] the plasma generation mechanism further includes a cover surrounding the rotating body and having an opposing surface opposing the rotating surface; The liquid supply device may further include a shield having the shielding portion and the liquid guide portion, the shielding portion being detachable from the cover.

[0025] The energy beam may be a laser beam.

[0026] The radiation may be extreme ultraviolet light or x-rays.

[0027] The plasma feedstock may be tin, lithium, gadolinium, terbium, gallium, bismuth, or an alloy containing at least one of these materials.

[0028] In order to achieve the above object, a light source device according to one embodiment of the present invention is a light source device that converts a liquid plasma raw material into plasma by irradiating it with an energy beam to extract radiation, and includes a plasma generation mechanism and a beam source. The plasma generation mechanism comprises a rotating body having a rotation surface that rotates around a rotation axis, a rotary drive source that rotates the rotating body around the rotation axis, a raw material supply unit that supplies the plasma raw material to the rotating surface, a shielding unit that faces an irradiation position on the rotating surface where the energy beam is irradiated, a heating mechanism that heats the shielding unit to a temperature equal to or higher than the melting point of the plasma raw material, and a liquid guide unit that guides the plasma raw material flowing in from the shielding unit to the raw material supply unit. The beam source directs the energy beam at the irradiation location. Effect of the Invention

[0029] According to the present invention, it is possible to provide a plasma generation mechanism and a light source device capable of preventing the accumulation of debris that occurs with plasma generation. [Brief description of the drawings]

[0030] [Figure 1] 1 is a schematic diagram of a light source device according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is an enlarged view of a portion of the light source device. [Diagram 3] 3 is a schematic diagram of a plasma generating mechanism included in the light source device. FIG. [Figure 4] FIG. 2 is a perspective view of a rotating body unit included in the plasma generation mechanism. [Diagram 5] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 6] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 7] FIG. 2 is an exploded perspective view of the rotating body unit. [Figure 8] 13 is a perspective view of a second cover member included in the rotating body unit. FIG. [Figure 9] FIG. 4 is a perspective view of the second cover member. [Figure 10] FIG. 4 is a cross-sectional view of the second cover member. [Figure 11] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 12] FIG. 2 is a cross-sectional view of a partial configuration of the rotating body unit. [Figure 13] 5A to 5C are schematic diagrams showing the operation of the rotating body unit. [Figure 14] FIG. 13 is a perspective view of a rotating body unit having another configuration. [Figure 15] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 16] FIG. 13 is a perspective view of a rotating body unit having another configuration. [Figure 17] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 18] FIG. 2 is a cross-sectional view of a partial configuration of the rotating body unit. [Figure 19] FIG. 13 is a perspective view of a rotating body unit having another configuration. [Figure 20] FIG. 2 is an enlarged perspective view of a portion of the rotating body unit. [Figure 21] FIG. 2 is a cross-sectional view of the rotating body unit. [Figure 22] FIG. 2 is a cross-sectional view of a partial configuration of the rotating body unit. [Figure 23] FIG. 13 is a perspective view of a rotating body unit having another configuration. [Figure 24] FIG. 4 is an exploded perspective view of a shield provided in the rotating body unit. [Diagram 25] FIG. 2 is a cross-sectional view of a partial configuration of the rotating body unit. [Figure 26] 13 is a perspective view of a second cover member included in the rotating body unit. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0031] (First embodiment) A light source device according to a first embodiment of the present invention will be described.

[0032] [Basic configuration of light source device] Fig. 1 is a schematic diagram showing an example of the configuration of a light source device 100 according to this embodiment, and Fig. 2 is a schematic diagram showing an enlarged portion of the light source device 100. The light source device 100 is a light source device of the LPP (Laser Produced Plasma) type. That is, as shown in Fig. 2, the light source device 100 is a device that irradiates a plasma raw material 101 with an energy beam EB to excite the plasma raw material 101 to generate plasma P, and extracts radiation R emitted from the plasma P to use as a light source. The radiation R is EUV (Extreme Ultraviolet) light, X-rays, or other electromagnetic waves.

[0033] The plasma raw material 101 is liquid and is tin (Sn), lithium (Li), gadolinium (Gd), terbium (Tb), gallium (Ga), bismuth (Bi), or an alloy containing at least one of these materials. When EUV light is emitted as the radiation R, molten Sn or Li is used as the plasma raw material 101. When X-rays are emitted as the radiation R, molten Ga, Ga alloy, Sn compound, or the like is used as the plasma raw material 101.

[0034] FIG. 1 is a schematic cross-section of the light source device 100 cut along the horizontal direction at a position of a predetermined height from the installation surface, as viewed from vertically above. In FIG. 1, in order to facilitate understanding of the configuration and operation of the light source device 100, cross-sections are omitted for parts that do not require explanation of the cross-sectional configuration, etc. In the following description, the X direction is the left-right direction of the horizontal direction (the positive side of the X axis is the right side, and the negative side is the left side), the Y direction is the front-rear direction of the horizontal direction (the positive side of the Y axis is the front side, and the negative side is the rear side), and the Z direction is the vertical direction (the positive side of the Z axis is the upper side, and the negative side is the lower side). Of course, the application of this technology is not limited to the direction in which the light source device 100 is used, etc.

[0035] As shown in FIG. 1, a light source device 100 includes a housing 102, a vacuum chamber 103, an energy beam entrance chamber 104, a radiation exit chamber 105, a plasma generating mechanism 106, a control unit 107, and a beam source .

[0036] In the example shown in Fig. 1, the housing 102 is configured so that its outer shape is roughly cubic. The shape of the housing 102 is not limited to a cube, and any three-dimensional shape may be used. The housing 102 has an emission hole 102a formed on the front surface, an incidence hole 102b formed on the right side surface, and a through-hole 102c formed on the left side surface. The material of the housing 102 is not limited, and for example, a metal is used.

[0037] In this embodiment, the emission axis EA of the radiation R is set so as to pass through the emission hole 102a on the front surface and extend substantially in the Y direction (front-rear direction). The radiation R is extracted along the emission axis EA and emitted toward the front side from the emission hole 102a. Also, in this embodiment, the incidence axis IA of the energy beam EB is set so as to extend obliquely left toward the rear side from the incidence hole 102b on the right side surface.

[0038] 1, a beam source 108 that emits an energy beam EB is installed outside the housing 102. The beam source 108 is installed so that the energy beam EB enters the inside of the housing 102 along an incident axis IA. An electron beam or a laser beam can be used as the energy beam EB. The beam source 108 may be configured in any manner that is capable of emitting such an energy beam EB.

[0039] The light source device 100 is provided with a chamber section C including a plurality of chambers. Specifically, the chamber section C includes a vacuum chamber 103, an energy beam incident chamber (hereinafter simply referred to as an incident chamber) 104, and a radiation exit chamber (hereinafter simply referred to as an exit chamber) 105. The vacuum chamber 103 and the incident chamber 104 are connected to each other, and the vacuum chamber 103 and the exit chamber 105 are connected to each other.

[0040] The entrance chamber 104 is configured to be located on an entrance axis IA of the energy beam EB, and the exit chamber 105 is configured to be located on an exit axis EA of the radiation R. In addition, a plasma generation mechanism 106 that generates plasma P is arranged in the vacuum chamber 103.

[0041] In this embodiment, a chamber part C (vacuum chamber 103, entrance chamber 104, and exit chamber 105) is configured by a chamber body 109, an outer protruding part 109a protruding forward from the front surface of the chamber body 109, and two inner protruding parts 109b and 109c protruding inward from the inner peripheral surface of the chamber body 109. A metal material is used as the material of the chamber body 109.

[0042] The chamber body 109 is configured so that the outer shape is roughly a rectangular parallelepiped, and is disposed so that its front, rear, left and right faces face the front, rear, left and right faces of the housing 102. In addition, the chamber body 109 is disposed so that its right front corner between the front face and the right side face is located on the incidence axis IA of the energy beam EB.

[0043] 1, an emission hole 109d is formed in the front surface of the chamber body 109. The emission hole 109d is formed at a position aligned with the emission hole 102a in the front surface of the housing 102 on the emission axis EA of the radiation R. An outer protrusion 109a is formed so as to protrude forward from the periphery of the emission hole 109d of the chamber body 109. The outer protrusion 109a is configured to protrude farther forward than the emission hole 102a of the housing 102 so as to be inscribed in the emission hole 102a of the housing 102.

[0044] Further, an inner protrusion 109b is formed on the inner side of the chamber body 109 so as to protrude inward from the periphery of the emission hole 109d. The space surrounded by the outer protrusion 109a and the inner protrusion 109b functions as the emission chamber 105. The outer protrusion 109a and the inner protrusion 109b constituting the emission chamber 105 may themselves be called the emission chamber. The outer protrusion 109a and the inner protrusion 109b may be formed integrally with the chamber body 109, or may be formed separately and then connected to the chamber body 109. Moreover, the inner protrusion 109b may not be provided.

[0045] The exit chamber 105 is configured to have a cone shape with the exit axis EA of the radiation R as its central axis. The exit chamber 105 is configured so that, in the direction along the exit axis EA of the radiation R, the cross-sectional area is large at the center and becomes smaller toward the front and rear ends. In other words, the exit chamber 105 has a shape that narrows toward the front and rear ends. Furthermore, the exit chamber 105 is provided with openings (apertures) at the front and rear ends to pass the radiation R.

[0046] A utilization device such as a mask inspection device is connected to the front end of the emission chamber 105 (the front end of the outer protrusion 109a). In the example shown in FIG. 1, an application chamber 110 is connected as a chamber forming part of the utilization device. The pressure inside the application chamber 110 may be atmospheric pressure. Furthermore, the inside of the application chamber 110 may be purged by introducing a gas (e.g., an inert gas) from a gas injection path as necessary. Furthermore, the gas inside the application chamber 110 may be exhausted by an exhaust means not shown.

[0047] Between the emission chamber 105 and the application chamber 110, a filter film 111 is provided to physically separate the region where the plasma P is generated from the application chamber 110. The filter film 111 has a structure that allows radiation R to pass through, and prevents the plasma raw material 101 and debris that are scattered as the plasma P is generated from entering the application chamber 110.

[0048] A collector (collecting mirror) 112 is disposed inside the exit chamber 105 for guiding and collecting the radiation R that has entered the exit chamber 105 into a utilization device (inside the application chamber 110). In Fig. 1, the components of the radiation R that enter and are collected in the exit chamber 105 are shown by hatching.

[0049] Furthermore, a shielding member (central obscuration) 113 is disposed inside the emission chamber 105. The shielding member 113 is disposed on the emission axis EA of the radiation R so as to be aligned with the emission hole 109d of the chamber body 109, the emission hole 102a of the housing 102, and the filter film 111. In this embodiment, the shielding member 113 can block radiation components that are not collected by the collector 112. Note that the shielding member 113 does not necessarily have to be provided.

[0050] An entrance window 114 is provided at the front right corner of the chamber body 109. The entrance window 114 is disposed at a position aligned with the entrance hole 102b on the right side surface of the housing 102 on the entrance axis IA of the energy beam EB. An inner protrusion 109c is formed on the inside of the front right corner of the chamber body 109 so as to protrude from a position surrounding the entrance window 114 along the direction of the entrance axis IA of the energy beam EB.

[0051] Of the internal space of the chamber body 109, the space surrounded by the inner protrusion 109c functions as the incident chamber 104. The inner protrusion 109c and the right front corner portion of the chamber body 109 that constitute the incident chamber 104 can themselves be called the incident chamber. The inner protrusion 109c may be formed integrally with the chamber body 109, or may be formed separately and then connected to the chamber body 109.

[0052] The incidence chamber 104 is configured to have a cone shape with the incidence axis IA of the energy beam EB as the central axis. The incidence chamber 104 is configured to have a cross-sectional area that decreases toward the inner end of the chamber body 109 in the direction of the incidence axis IA of the energy beam EB. That is, the incidence chamber 104 has a shape that narrows toward the inner end. The incidence chamber 104 is also provided with an opening (aperture) at the inner end through which the energy beam EB passes.

[0053] A capture mechanism for capturing scattered plasma raw material 101 and debris is disposed inside injection chamber 104. In the example shown in Fig. 1, a rotary window 115, which is a plate-shaped rotating member that transmits energy beam EB and captures plasma raw material 101 and debris, is disposed as the capture mechanism. By rotating rotary window 115, the effective area of ​​the beam transmission region of rotary window 115 is increased, making it possible to reduce the frequency with which rotary window 115 needs to be replaced.

[0054] 1, the emission chamber 105 and the incidence chamber 104 are provided with gas injection paths 116a and 116b, respectively, and gas is supplied from a gas supply device (not shown) to the inside of the emission chamber 105 and the incidence chamber 104. A gas having a high transmittance for the radiation R is supplied to the emission chamber 105. A gas having a high transmittance for the energy beam EB is supplied to the incidence chamber 104.

[0055] The gas supplied to the emission chamber 105 and the incidence chamber 104 may be the same type of gas or different types of gas. For example, argon or helium can be used as a gas having high transmittance for both the energy beam EB and the radiation R. There is no limitation on the type of gas supplied to the emission chamber 105 and the incidence chamber 104. By supplying gas, it is possible to set the internal pressure of the emission chamber 105 and the incidence chamber 104 to a pressure higher than the internal pressure of the vacuum chamber 103, thereby suppressing the intrusion of debris and the like.

[0056] Of the internal space of the chamber body 109, the space excluding the internal space of the inner protruding part 109b functioning as the emission chamber 105 and the internal space of the inner protruding part 109c functioning as the incidence chamber 104 functions as the vacuum chamber 103. The part that constitutes the vacuum chamber 103 itself can also be called the vacuum chamber.

[0057] As shown in FIG. 1, the chamber body 109 has a portion that protrudes from the housing 102 to the outside through the through hole 102c on the left side surface of the housing 102, and its tip is connected to an exhaust pump 117. The specific configuration of the exhaust pump 117 is not limited, and any pump such as a vacuum pump may be used. The exhaust pump 117 exhausts the inside of the vacuum chamber 103, and the vacuum chamber 103 is depressurized. This suppresses attenuation of the radiation R generated in the vacuum chamber 103. The inside of the vacuum chamber 103 does not necessarily have to be a vacuum atmosphere as long as it is a depressurized atmosphere with respect to the entrance chamber 104 and the exit chamber 105. An inert gas may be supplied into the vacuum chamber 103.

[0058] In this embodiment, the gas outlet 118 is provided so as to extend in the left-right direction toward the region between the incident axis IA and the exit axis EA. The gas outlet 118 is provided on the right side surface of the chamber body 109 via a seal member or the like. The gas outlet 118 is connected to a gas supply device (not shown) and supplies gas into the chamber body 109. In the example shown in FIG. 1, gas is sprayed from the gas outlet 118 from the right side of the region between the incident axis IA and the exit axis EA toward the left side along the left-right direction. This makes it possible to move debris emitted from the plasma P in a direction away from the incident axis IA and the exit axis EA. In addition, the gas outlet 118 may be provided in another location of the chamber body 109 as long as it can supply gas into the chamber body 109.

[0059] The plasma generation mechanism 106 is a mechanism for generating plasma P in the vacuum chamber 103 and emitting radiation R (X-rays or EUV light). As shown in FIG. 2, the plasma generation mechanism 106 includes a rotating body 120, and an energy beam EB is incident on the rotating body 120. The rotating body 120 is disposed in the vacuum chamber 103 such that an irradiation position I of the energy beam EB is located at the intersection of an entrance axis IA and an exit axis EA. The plasma generation mechanism 106 will be described in detail later.

[0060] The control unit 107 controls the operation of each component of the light source device 100. For example, the control unit 107 controls the operation of the beam source 108 and the exhaust pump 117. The control unit 107 has hardware circuits necessary for a computer, such as a CPU and memory (RAM, ROM). The CPU loads a control program stored in the memory into the RAM and executes it, thereby executing various processes. As the control unit 107, for example, a PLD (Programmable Logic Device) such as an FPGA (Field Programmable Gate Array) or other devices such as an ASIC (Application Specific Integrated Circuit) may be used. In FIG. 1, the control unit 107 is illustrated as a schematic functional block, but the position where the control unit 107 is configured may be designed arbitrarily.

[0061] As shown in FIG. 1, in this embodiment, a radiation diagnostic unit 119 is provided in a region spatially connected to the vacuum chamber 103 on the front side of the chamber main body 109. The radiation diagnostic unit 119 is disposed at a position where radiation R emitted in a direction different from the emission axis EA of the radiation R is incident. The radiation diagnostic unit 119 measures the state of the radiation R from the plasma P. Here, the state of the radiation R refers to the physical state of the radiation R, such as the intensity, wavelength, and spectrum of the radiation R. For example, the radiation diagnostic unit 119 is configured by a detector that detects the presence or absence of radiation R and a measuring device that measures the output of radiation. The measurement results by the radiation diagnostic unit 119 are used for diagnosing the radiation R and for controlling the operation of the raw material dropping device described below.

[0062] [Configuration of plasma generation mechanism] As described above, the plasma generation mechanism 106 is a mechanism for generating plasma P in the vacuum chamber 103 and emitting radiation R (X-rays or EUV light). Fig. 3 is a schematic diagram of the plasma generation mechanism 106. As shown in Figs. 2 and 3, the plasma generation mechanism 106 includes a rotating body 120, a rotary drive source 131, a shaft portion 132, a storage tank 133, and a film thickness adjustment mechanism 134.

[0063] Rotational drive source 131 is disposed outside vacuum chamber 103, and generates rotational power for rotor 120. Rotational drive source 131 is, for example, a motor. Shaft 132 passes through chamber body 109 and housing 102 to connect rotational drive source 131 and rotor 120, and transmits the rotational power generated in rotational drive source 131 to rotor 120. Storage tank 133 is disposed vertically below rotor 120, and stores plasma raw material 101.

[0064] The rotating body 120 is disposed in the vacuum chamber 103 and is connected to a shaft portion 132. The rotating body 120 rotates by the rotation of the shaft portion 132, as shown by an arrow S in Fig. 3. Hereinafter, the rotation axis of the rotating body 120 and the shaft portion 132 is referred to as a rotation axis M.

[0065] As shown in Fig. 3, the rotor 120 has a disk shape. Hereinafter, the surface of the rotor 120 opposite the shaft portion 132 will be referred to as the rotation surface 120a. The rotation axis M is, for example, parallel to the horizontal direction (XY direction), and the rotation surface 120a is arranged so that it is parallel to the vertical direction. A portion of the rotation surface 120a is immersed in the plasma raw material 101 stored in the storage tank 133, and the plasma raw material 101 adheres to the rotation surface 120a as the rotor 120 rotates. The plasma raw material 101 adhered to the rotation surface 120a is transported to the irradiation position I as the rotor 120 rotates, and is converted into plasma by the energy beam EB irradiated to the irradiation position I.

[0066] 3, film thickness adjustment mechanism 134 is disposed on rotor 120 and adjusts the film thickness of plasma raw material 101 adhering to rotation surface 120a. Film thickness adjustment mechanism 134 is, for example, a structure having a channel structure, and is disposed inside thereof with a predetermined gap so as to sandwich rotor 120, and adjusts the film thickness of plasma raw material 101 by scraping off any plasma raw material 101 that has not flowed into the gap. Film thickness adjustment mechanism 134 is provided upstream of irradiation position I in the rotation direction of rotor 120, and determines the film thickness of plasma raw material 101 at irradiation position I.

[0067] In the plasma generation mechanism 106, the plasma raw material 101 stored in the storage tank 133 as described above adheres to the rotation surface 120a of the rotor 120, and is transported to the irradiation position I by the rotation of the rotor 120. Therefore, the storage tank 133 functions as a "raw material supply section" that supplies the plasma raw material 101 to the rotation surface 120a.

[0068] [About the Rotating Unit Configuration] The plasma generation mechanism 106 includes a rotor unit that houses the rotor 120. FIG. 4 is a perspective view showing the configuration of the rotor unit 150. As shown in the figure, the rotor unit 150 includes the rotor 120, a cover 160, and a heating mechanism 180, and the rotor 120 is housed in the cover 160. Note that the cover 160 and the heating mechanism 180 are omitted from the illustrations in FIGS. 1 to 3. FIGS. 5 and 6 are cross-sectional views of the rotor unit 150. FIG. 5 is a cross-sectional view taken along line A1-A1 (XY plane) in FIG. 4, and FIG. 6 is a cross-sectional view taken along line A2-A2 (YZ plane) in FIG. 4.

[0069] The cover 160 surrounds the rotor 120 to prevent debris from scattering, and also forms the storage tank 133. The cover 160 is made up of a first cover member 161 and a second cover member 162. FIG. 7 is an exploded perspective view of the rotor unit 150, showing the first cover member 161 and the second cover member 162 disassembled. As shown in the figure, the rotor 120 is housed inside the cover 160. Furthermore, the plasma raw material 101 is stored in the vertically lower part of the cover 160, and this vertically lower part of the cover 160 forms the storage tank 133. A heating mechanism (not shown) is provided around the storage tank 133, and the plasma raw material 101 stored in the storage tank 133 is heated and melted.

[0070] The first cover member 161 has a bottom portion 161a and a side wall portion 161b as shown in Fig. 7. The bottom portion 161a has a disk shape and has a through hole 161c provided in the center as shown in Fig. 5. The through hole 161c is a hole through which the shaft portion 132 is inserted. The side wall portion 161b has a cylindrical shape and is continuous with the periphery of the bottom portion 161a.

[0071] As shown in Fig. 7, the second cover member 162 is joined to the side wall portion 161b of the first cover member 161. Fig. 8 is a perspective view of the second cover member 162 seen from the opposite side to the rotation surface 120a, and Fig. 9 is a perspective view of the second cover member 162 seen from the rotation surface 120a side. Fig. 10 is a cross-sectional view of the second cover member 162, taken along line A3-A3 (YZ plane) in Figs. 8 and 9.

[0072] 8 to 10, the second cover member 162 has a flat plate portion 163, a shielding portion 164, and a liquid guide portion 165. The flat plate portion 163 has a flat plate shape and faces the rotation surface 120a of the rotor 120 as shown in Fig. 7. As shown in Fig. 9, the surface of the flat plate portion 163 facing the rotation surface 120a is defined as an opposing surface 163a. ​​The opposing surface 163a is a surface parallel to the rotation surface 120a, for example, a surface parallel to the vertical direction.

[0073] 9, the flat plate portion 163 is provided with an opening 163b, an entrance hole 166, and an exit hole 167. The opening 163b is an opening formed by recessing the shielding portion 164 relative to the opposing surface 163a. ​​The entrance hole 166 is provided penetrating the second cover member 162 and is a hole through which the energy beam EB enters. The exit hole 167 is also provided penetrating the second cover member 162 and is a hole through which the radiation R exits.

[0074] The opposing surface 163a forms the storage tank 133 together with the first cover member 161, as shown in Fig. 7. Fig. 11 is a plan view of the cross section of the rotator unit 150 as viewed in a direction perpendicular to the rotation axis M (Z direction), and is a cross section taken along line A4-A4 (XY plane) in Fig. 4. In this figure, the periphery T (broken line) of the storage tank 133 is shown. The periphery T is the periphery of the liquid surface of the plasma raw material 101 stored in the storage tank 133. As shown in this figure, the opposing surface 163a coincides with the periphery T when viewed in a direction perpendicular to the rotation axis M (Z direction).

[0075] The shielding portion 164 faces the irradiation position I and shields debris generated with plasma generation. FIG. 12 is a cross-sectional view of the vicinity of the shielding portion 164 of the rotating body unit 150, taken along line A2-A2 (YZ plane) in FIG. 4. As shown in the figure, the shielding portion 164 has a shielding surface 164a facing the irradiation position I of the rotation plane 120a. The shielding surface 164a is parallel to the rotation plane 120a, and can be, for example, a surface parallel to the vertical direction. Furthermore, the shielding surface 164a does not have to be a surface parallel to the rotation plane 120a, and may be a curved surface or an inclined surface, as described later.

[0076] The shielding surface 164a is recessed from the facing surface 163a, is farther away from the rotation surface 120a than the facing surface 163a, and faces the irradiation position I via an opening 163b (see FIG. 10) in the facing surface 163a. ​​As shown in FIG. 8, the shielding portion 164 has an entrance hole 166 and an exit hole 167 provided continuously with the flat plate portion 163.

[0077] Liquid guiding section 165 is provided between shielding section 164 and flat plate section 163, and guides plasma raw material 101 flowing in from shielding section 164 to storage tank 133, which is the raw material supply section. Specifically, liquid guiding section 165 has liquid guiding surface 165a located between shielding surface 164a and opposing surface 163a, as shown in Fig. 12.

[0078] Liquid guiding surface 165a has a shape that does not retain plasma raw material 101 flowing in from above shielding surface 164a. Specifically, liquid guiding surface 165a has a shape that gradually approaches rotation surface 120a from shielding surface 164a toward opposing surface 163a. ​​Figure 10 shows liquid guiding surface 165a in a curved shape. Liquid guiding surface 165a may also be in the form of an inclined surface, as described below. Furthermore, liquid guiding surface 165a does not have to have a shape that gradually approaches rotation surface 120a as a whole, and at least a portion may be in the form of a horizontal surface.

[0079] Heating mechanism 180 heats shielding part 164 to a temperature equal to or higher than the melting point of plasma raw material 101. As shown in Fig. 12, heating mechanism 180 is placed on the opposite side of shielding surface 164a of shielding part 164 and is in contact with shielding part 164. Heating mechanism 180 may also be placed on the opposite side of liquid guiding surface 165a of liquid guiding part 165. Furthermore, a heating mechanism that is placed in storage tank 133 and melts the plasma raw material 101 stored in storage tank 133 may also be used as heating mechanism 180. Heating mechanism 180 is, for example, a resistance heating heater.

[0080] [Operation and effect of light source device] The operation and effects of light source device 100 will now be described. Figure 13 is a schematic diagram showing the operation of light source device 100. In the rotating body unit 150, when the rotating body 120 rotates as described above, the plasma raw material 101 stored in the storage tank 133 adheres to the rotating surface 120a (see Figure 3). In this state, when an energy beam EB is emitted from the beam source 108 (see Figure 1), the energy beam EB enters the irradiation position I on the rotating surface 120a through the entrance hole 166 (see Figure 4).

[0081] The energy beam EB converts the plasma raw material 101 into plasma at irradiation position I, generating plasma P as shown in Fig. 13. Radiation R (see Fig. 2) is emitted from the plasma P and is emitted through the emission hole 167 (see Fig. 4). As this plasma is converted into plasma, debris D, which is vapor and mist of the plasma raw material 101, is ejected from irradiation position I as shown in Fig. 13. The debris D is ejected mainly along the normal direction H (Y direction) of the plane of rotation 120a.

[0082] Here, since the rotator unit 150 has a shielding surface 164a disposed opposite the irradiation position I, the debris D ejected from the irradiation position I reaches the shielding surface 164a. Since the shielding surface 164a is heated by the heating mechanism 180 to a temperature equal to or higher than the melting point of the plasma raw material 101, the debris D that reaches the shielding surface 164a melts and becomes liquid plasma raw material 101, which flows down over the shielding surface 164a (arrow F1 in the figure).

[0083] The plasma raw material 101 that has flowed down on shielding surface 164a flows onto liquid-leading surface 165a and continues to flow down on liquid-leading surface 165a. Because liquid-leading surface 165a has a shape that does not allow the plasma raw material 101 to be stored, the plasma raw material 101 flows down on liquid-leading surface 165a (arrow F2 in the figure) and onto opposing surface 163a. ​​The plasma raw material 101 that has flowed onto opposing surface 163a flows down on opposing surface 163a (arrow F3 in the figure) and flows into storage tank 133.

[0084] This makes it possible for the plasma raw materials 101 that are ejected as debris D to be collected in the storage tank 133 and reused. If the shielding section 164 were not provided, the debris D would reach the area of ​​the second cover member 162 facing the irradiation position I, solidify, and accumulate. The accumulated debris D could then cause blockages of the entrance hole 166 and the exit hole 167, which could adversely affect the emission of radiation R. Furthermore, when debris D accumulates, the plasma raw materials 101 do not return to the storage tank 133, and the consumption of plasma raw materials 101 increases, making it necessary to replenish plasma raw materials 101 at short intervals.

[0085] In contrast, in light source device 100, debris D does not accumulate on shielding surface 164a, and therefore does not adversely affect the emission of radiation R. Furthermore, plasma raw material 101 that is ejected as debris D returns to storage tank 133, which makes it possible to suppress the consumption of plasma raw material 101 and reduce the frequency of replenishment of plasma raw material 101.

[0086] Furthermore, shielding surface 164a is provided at a distance from rotating surface 120a with respect to opposing surface 163a (see FIG. 13). If shielding surface 164a were close to rotating surface 120a, there would be a risk that plasma raw material 101 molten on shielding surface 164a would be scattered by shock waves caused by irradiation with energy beam EB. In particular, at irradiation position I, the film thickness of plasma raw material 101 is adjusted by film thickness adjustment mechanism 134, but there is a risk that this film thickness will fluctuate due to scattered plasma raw material 101.

[0087] Furthermore, if the shielding surface 164a is close to the rotating surface 120a, the ejected debris D may collide with the shielding surface 164a and be reflected, and may adhere to the rotating surface 120a without melting. Fluctuations in the film thickness of the plasma raw material 101 at the irradiation position I and adhesion of foreign matter can cause the output of radiation R to become unstable. Therefore, by providing the shielding surface 164a at a distance from the rotating surface 120a, these problems can be eliminated and the output of radiation R can be stabilized.

[0088] It is also possible to separate opposing surface 163a from rotating surface 120a together with shielding surface 164a, but in that case the volume of storage tank 133 will increase, and the energy required to melt the stored plasma raw material 101 will increase. For this reason, it is more preferable to separate shielding surface 164a from rotating surface 120a relative to opposing surface 163a.

[0089] [Shape of the shielding part and the liquid-guiding part] The shielding portion 164 and the liquid guide portion 165 may have the following shapes. FIG. 14 is a perspective view of the rotator unit 150 in which the shielding portion 164 and the liquid guide portion 165 have other shapes. FIG. 15 is a cross-sectional view of this rotator unit 150, taken along the line A5-A5 (XY plane) in FIG. 14. As shown in these drawings, a gap 168 may be provided between the shielding portion 164 and the flat plate portion 163. As described above, the debris D generated at the irradiation position I is mainly ejected along the normal direction H (Y direction) of the rotation plane 120a (see FIG. 13), and therefore even if the gap 168 is provided, almost the entire amount of the debris D reaches the shielding surface 164a and is reused.

[0090] Fig. 16 is a perspective view of a rotating body unit 150 in which the shielding portion 164 and the liquid guide portion 165 have different shapes. Figs. 17 and 18 are cross-sectional views of this rotating body unit 150, Fig. 17 is a cross-sectional view taken along line A6-A6 (XY plane) in Fig. 16, and Fig. 18 is a cross-sectional view taken along line A7-A7 (YZ plane) in Fig. 14. As shown in these figures, the shielding portion 164 and the liquid guide portion 165 are hemispherical, and the shielding surface 164a and the liquid guide surface 165a are hemispherical with the irradiation position I as the center. In other words, the liquid guide surface 165a is curved so as to gradually approach the rotating surface 120a from the shielding surface 164a toward the opposing surface 163a.

[0091] In this structure, the shielding surface 164a and the liquid-guiding surface 165a are equidistant from the irradiation position I. Since the shock waves caused by the irradiation of the energy beam EB described above spread isotropically, it is possible to suppress the shock waves at the shielding surface 164a and the liquid-guiding surface 165a. In addition, it is also possible to suppress the reflection of the debris D by the shielding surface 164a and the liquid-guiding surface 165a.

[0092] Fig. 19 is a perspective view of a rotating body unit 150 in which the shielding portion 164 and the liquid guide portion 165 have different shapes. Fig. 20 is an enlarged view of the shielding portion 164. Figs. 21 and 22 are cross-sectional views of this rotating body unit 150, Fig. 21 being a cross-sectional view taken along line A8-A8 (XY plane) in Fig. 19, and Fig. 22 being a cross-sectional view taken along line A9-A9 (YZ plane) in Fig. 19. As shown in these figures, the shielding portion 164 and the liquid guide portion 165 are mainly shaped to have a planar structure.

[0093] Specifically, the shielding surface 164a has a shape in which its center is farthest from the rotation surface 120a in the horizontal plane (XY plane). The liquid guide surface 165a has a center which is farthest from the rotation surface 120a in the horizontal plane (XY plane), and is an inclined surface which gradually approaches the rotation surface 120a from the shielding surface 164a toward the opposing surface 163a. ​​Hereinafter, the valley-shaped portion farthest from the rotation surface 120a in the center of the shielding surface 164a and the liquid guide surface 165a is referred to as the liquid collecting portion 169.

[0094] As shown in Figures 20 and 21, grooves 170 are provided on shielding surface 164a. Grooves 170 guide the plasma raw materials 101 that flow along grooves 170 to liquid guiding surface 165a, so that the plasma raw materials 101 that flow along grooves 170 are collected in liquid collecting section 169 and can easily flow from liquid collecting section 169 onto opposing surface 163a. ​​By forming shielding section 164 and liquid guiding section 165 into a shape that is mainly planar, manufacturing is simplified. Note that although heating mechanism 180 is provided only on shielding section 164 in Figure 19, it may also be provided on liquid guiding section 165.

[0095] Fig. 23 is a perspective view of rotator unit 150 in which shielding portion 164 and liquid guide portion 165 have another configuration, and Fig. 24 is an exploded perspective view of a portion of the configuration. Fig. 25 is a cross-sectional view of this rotator unit 150, taken along line A10-A10 (XY plane) in Fig. 23. As shown in these figures, rotator unit 150 may have a shielding body 190 that is detachable from second cover member 162, and shielding body 190 may have shielding portion 164 and liquid guide portion 165.

[0096] 26 is a perspective view of the second cover member 162 in this case. As shown in the figure, the second cover member 162 is not provided with the shielding portion 164 and the liquid guide portion 165, and the flat plate portion 163 is provided with the opening 163b, the through hole 163c, the entrance hole 166, and the exit hole 167.

[0097] 24, the shield 190 has a shielding portion 164, a liquid guide portion 165, an engaging portion 191, and a through hole 192. As shown in the figure, a stud 193 is inserted into the through hole 163c. The shield 190 is fixed to the second cover member 162 by engaging the engaging portion 191 with the opening 163b and screwing a screw 194 into the stud 193 via the through hole 192. The shield 190 can be removed from the second cover member 162 by removing the screw 194. The number of studs 192 is, for example, two, but may be one or three or more.

[0098] Engagement portion 191 is provided at the end of liquid guiding portion 165 opposite shielding portion 164, and abuts against opposing surface 163a around opening 163b, fixing the lower portion of shielding body 190 to second cover member 162. Engagement portion 191 is preferably shaped so as to continue from liquid guiding surface 165a and overlap opposing surface 163a, so as to prevent plasma raw material 101 from leaking out.

[0099] In this configuration, the shield 190 can be replaced because the shield 190 is detachable from the second cover member 162. As described above, the shielding surface 164a is a surface that is directly reached by debris ejected from the irradiation position I, and therefore needs to be replaced at regular intervals. In this configuration, the shield 190 can be replaced, which provides excellent maintainability.

[0100] In addition to the above, shielding part 164 and liquid guiding part 165 can have various configurations, and shielding part 164 need only be opposed to irradiation position I. Liquid guiding part 165 need only be capable of guiding plasma raw material 101 flowing in from shielding part 164 to storage tank 133. In various configurations, shielding surface 164a can be provided with grooves 170 that guide plasma raw material 101 to liquid guiding surface 165a.

[0101] (About this disclosure) In the present disclosure, when the term "approximately" is used, this is used only to facilitate understanding of the description, and there is no special meaning in using or not using the term "approximately". That is, in the present disclosure, concepts that define the shape, size, positional relationship, state, etc., such as "center", "central", "uniform", "equal", "same", "orthogonal", "parallel", "symmetrical", "extending", "axial direction", "circular", "arc-shaped", "rectangular", "rectangular", "polygonal", "ring-shaped", "cubic", "rectangular", "cylindrical", "disk-shaped", "cone-shaped", etc., include concepts such as "substantially center", "substantially central", "substantially uniform", "substantially equal", "substantially the same", "substantially orthogonal", "substantially parallel", "substantially symmetrical", "substantially extending", "substantially axial", "substantially circular", "substantially arc-shaped", "substantially rectangular", "substantially rectangular", "substantially polygonal", "substantially ring-shaped", "substantially cube-shaped", "substantially rectangular", "substantially cylindrical", "substantially disc-shaped", "substantially cone-shaped", etc. For example, it also includes a state that is included within a predetermined range (e.g., a range of ±10%) based on the criteria of "perfectly centered," "perfectly central," "perfectly uniform," "perfectly equal," "perfectly the same," "perfectly orthogonal," "perfectly parallel," "perfectly symmetrical," "perfectly extended," "perfectly axial," "perfectly circular," "perfectly arc-shaped," "perfectly rectangular," "perfectly oblong," "perfectly polygonal," "perfectly ring-shaped," "perfectly cubic," "perfectly rectangular," "perfectly cylindrical," "perfectly disk-shaped," "perfectly cone-shaped," etc. Therefore, even if the word "approximately" is not added, the concept expressed by adding "approximately" may be included. Conversely, a perfect state is not excluded when the word "approximately" is added.

[0102] In the present disclosure, expressions using "more than", such as "greater than A" and "smaller than A", are expressions that comprehensively include both concepts that include equivalent to A and concepts that do not include equivalent to A. For example, "greater than A" is not limited to cases that do not include equivalent to A, but also includes "A or greater". Furthermore, "smaller than A" is not limited to "less than A", but also includes "A or less". When implementing the present technology, specific settings, etc. may be appropriately adopted from the concepts included in "greater than A" and "smaller than A" so that the effects described above are achieved.

[0103] It is also possible to combine at least two of the characteristic parts of the present technology described above. That is, the various characteristic parts described in each embodiment may be arbitrarily combined without distinction between the embodiments. In addition, the various effects described above are merely examples and are not limited thereto, and other effects may be exhibited. [Explanation of symbols]

[0104] 100...Light source device 101...Plasma raw material 106...Plasma generation mechanism 108...Beam source 120...rotating body 131...Rotational drive source 132…Shaft 133…Storage tank 134...Film thickness adjustment mechanism 150...Rotating unit 160…Cover 161...first cover member 162...Second cover member 164...Shielding part 165…Liquid guide part 170...Groove 180...Heating mechanism 190…shielding body

Claims

1. A plasma generation mechanism provided in a light source device that converts a liquid plasma raw material into plasma by irradiating it with an energy beam to extract radiation, a rotating body having a surface of rotation that rotates around a rotation axis; a rotation drive source that rotates the rotor around the rotation axis; a raw material supply unit that supplies the plasma raw material to the rotating surface; a shielding portion that faces an irradiation position on the rotation surface where the energy beam is irradiated; a heating mechanism for heating the shielding portion to a temperature equal to or higher than the melting point of the plasma raw material; a liquid guide portion for guiding the plasma raw material flowing in from the shielding portion to the raw material supply portion; A plasma generation mechanism comprising:

2. 2. The plasma generation mechanism according to claim 1, the raw material supply unit has a storage tank that stores the plasma raw material flowing in from the liquid guiding unit, A part of the rotation surface of the rotor is immersed in the plasma raw material stored in the storage tank. Plasma generation mechanism.

3. 2. The plasma generation mechanism according to claim 1, The heating mechanism is disposed on the opposite side of the shielding portion to the rotating body. Plasma generation mechanism.

4. The plasma generation mechanism according to claim 2, The heating mechanism is disposed in the reservoir. Plasma generation mechanism.

5. 2. The plasma generation mechanism according to claim 1, a cover that surrounds the rotating body and has an opposing surface that faces the rotating surface; An opening is provided in the opposing surface, The shielding portion has a shielding surface facing the irradiation position with the opening interposed therebetween. Plasma generation mechanism.

6. The plasma generation mechanism according to claim 5, The shielding surface is spaced farther from the rotating surface than the opposing surface. Plasma generation mechanism.

7. 7. The plasma generation mechanism according to claim 6, the raw material supply unit has a storage tank that stores the plasma raw material flowing in from the liquid guiding unit, The opposing surface coincides with the periphery of the storage tank when viewed in a direction perpendicular to the rotation axis. Plasma generation mechanism.

8. 2. The plasma generation mechanism according to claim 1, a cover that surrounds the rotating body and has an opposing surface that faces the rotating surface; the opposing surface is located between the liquid guiding portion and the raw material supplying portion, The liquid guide portion guides the plasma raw material flowing in from the shielding portion onto the opposing surface. Plasma generation mechanism.

9. 9. The plasma generation mechanism according to claim 8, the shielding portion has a shielding surface facing the irradiation position, The liquid guide portion has a liquid guide surface that gradually approaches the rotating surface from the shielding surface toward the opposing surface. Plasma generation mechanism.

10. The plasma generation mechanism according to claim 9, The liquid-guiding surface is an inclined surface. Plasma generation mechanism.

11. The plasma generation mechanism according to claim 9, The liquid-guiding surface is curved. Plasma generation mechanism.

12. The plasma generation mechanism according to claim 9, The shielding surface has a groove through which the plasma raw material flows. Plasma generation mechanism.

13. The plasma generation mechanism according to claim 9, The shielding surface and the liquid-guiding surface are hemispherical and equidistant from the irradiation position. Plasma generation mechanism.

14. 2. The plasma generation mechanism according to claim 1, a cover that surrounds the rotating body and has an opposing surface that faces the rotating surface; a shielding body having the shielding portion and the liquid guide portion and being detachable from the cover; Plasma generation mechanism.

15. 2. The plasma generation mechanism according to claim 1, A film thickness adjusting mechanism for adjusting the film thickness of the plasma raw material on the rotating surface. The plasma generating mechanism further comprises:

16. 2. The plasma generation mechanism according to claim 1, The energy beam is a laser beam. Plasma generation mechanism.

17. 2. The plasma generation mechanism according to claim 1, The radiation is extreme ultraviolet light or X-rays. Plasma generation mechanism.

18. The plasma generation mechanism according to claim 1 , The plasma raw material is tin, lithium, gadolinium, terbium, gallium, bismuth, or an alloy containing at least one of these materials. Plasma generation mechanism.

19. A light source device that converts a liquid plasma raw material into plasma by irradiating it with an energy beam and extracts radiation, a plasma generation mechanism including a rotor having a rotation surface that rotates around a rotation axis, a rotary drive source that rotates said rotor around said rotation axis, a raw material supply unit that supplies said plasma raw material to said rotation surface, a shielding unit that faces an irradiation position on said rotation surface where said energy beam is irradiated, a heating mechanism that heats said shielding unit to a temperature equal to or higher than the melting point of said plasma raw material, and a liquid guiding unit that guides the plasma raw material flowing in from said shielding unit to said raw material supply unit; a beam source for irradiating the energy beam at the irradiation position; A light source device comprising:

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