Device for estimating clearance, method of estimating clearance and creation method of clearance property

Abstract

To provide a device for estimating clearance which can perform estimation of clearance without using numerical calculation.SOLUTION: A device 1 for estimating clearance estimates a punching clearance of a punched worked-article. The device 1 for estimating clearance includes a characteristic value acquisition part 22 which acquires a characteristic value concerning a crystal orientation from analysis data of analysing an estimation cross-section of the punched article, and a clearance characteristic value acquisition part 23 which acquires the clearance characteristic value corresponding to the characteristic value concerning the crystal orientation acquired by the characteristic value acquisition part 22, from such clearance characteristic information that the characteristic value concerning the crystal orientation and the clearance characteristic value are associated in advance.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to a clearance estimation device, a clearance estimation method, and a clearance characteristic creating method. [Background technology]

[0002] For example, punching is a type of plastic processing, and is mainly used to make holes in plate-shaped materials or to process them into a specific shape. Punching is a very fast processing speed, and has a great cost advantage in mass production of parts. In order to maintain the punching quality, it is important to manage the clearance provided on the sliding surfaces of the upper and lower dies of the metal mold. As a conventional method for measuring this clearance, for example, Patent Document 1 discloses a clearance estimation method in which an eddy current sensor is disposed near the sliding surface and the clearance is estimated from an induced eddy current voltage. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2008-100274 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, the clearance estimation method described in Patent Document 1 requires the placement of an eddy current sensor near the sliding surface, which makes it difficult to apply to existing dies; it increases the manufacturing costs of the dies, which limits the cost benefit of applying the method to mass-produced products; and it has various problems, such as high maintenance costs for the sensor.

[0005] The present disclosure has been made in consideration of the above circumstances, and has an object to provide a clearance estimation device, a clearance estimation method, and a clearance characteristic creation method that are capable of estimating a clearance without using a sensor. [Means for solving the problem]

[0006] One aspect of the present disclosure is a clearance estimation device that estimates a punching clearance of a punched workpiece, the clearance estimation device including: a characteristic value acquisition unit that acquires a characteristic value related to crystal orientation from analysis data obtained by analyzing an evaluation cross-section of the punched workpiece; and a clearance characteristic value acquisition unit that acquires the clearance characteristic value corresponding to the characteristic value related to crystal orientation acquired by the characteristic value acquisition unit from clearance characteristic information in which the characteristic value related to crystal orientation and the clearance characteristic value are previously associated with each other.

[0007] One aspect of the present disclosure is a clearance estimation method for estimating a punching clearance of a punched workpiece, the clearance estimation method being performed by a computer to execute a characteristic value acquisition process for acquiring a characteristic value related to crystal orientation from analysis data obtained by analyzing an evaluation cross-section of the punched workpiece, and a clearance characteristic value acquisition process for acquiring the clearance characteristic value corresponding to the characteristic value related to crystal orientation acquired in the characteristic value acquisition process from clearance characteristic information in which the characteristic value related to crystal orientation and the clearance characteristic value are previously associated with each other.

[0008] One aspect of the present disclosure is a program for causing a computer to function as the clearance estimation device.

[0009] One aspect of the present disclosure is a clearance characteristic creation method for creating clearance characteristic information for estimating a punching clearance of a punched product, the clearance characteristic creation method including a test piece creation step of creating a plurality of test pieces with different punching clearances, an analysis data acquisition step of acquiring analysis data obtained by analyzing an evaluation cross-section obtained by cutting each of the test pieces, and a characteristic creation step of acquiring a characteristic value related to crystal orientation from the analysis data of each of the test pieces, and using the acquired characteristic value and the punching clearance to create clearance characteristic information in which a characteristic value related to crystal orientation and a clearance characteristic value are associated. Effect of the Invention

[0010] According to the present disclosure, an effect is achieved in that the clearance can be estimated without using a sensor. [Brief description of the drawings]

[0011] [Figure 1] 1 is a flowchart showing an example of a procedure of a clearance characteristic creation method according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a diagram showing an example of a test piece used in a clearance characteristic creation method according to an embodiment of the present disclosure. [Diagram 3] FIG. 2 is a diagram illustrating an example of a KAM map according to an embodiment of the present disclosure. [Figure 4] FIG. 2 is a diagram showing an example of clearance characteristic information according to an embodiment of the present disclosure. [Diagram 5] FIG. 2 is a diagram illustrating an example of a hardware configuration of a clearance estimation device according to an embodiment of the present disclosure. [Figure 6] FIG. 2 is a functional configuration diagram showing functions of a clearance estimation device according to an embodiment of the present disclosure. [Figure 7] 1 is a flowchart showing an example of a processing procedure of a clearance estimation method according to an embodiment of the present disclosure. [Figure 8] FIG. 4 is a diagram illustrating an example of a relationship between a plate thickness ratio of a clearance and an iron loss deterioration rate according to an embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, a clearance estimation device, a clearance estimation method, and a clearance characteristic creating method according to an embodiment of the present disclosure will be described with reference to the drawings. A clearance estimation device 1 (see FIG. 7) according to this embodiment estimates the clearance of a die, which is a manufacturing condition, based on the results of a material structure analysis of a punched product.

[0013] Before describing the clearance estimation device 1 of this embodiment, a method for creating clearance characteristic information used by the clearance estimation device 1 will be described below.

[0014] FIG. 1 is a flowchart showing an example of the procedure of a clearance characteristic creating method according to this embodiment. First, a plurality of test pieces are prepared using dies with different punching clearances (SA1: test piece preparation step). Here, the clearances of the dies are known. The test piece may be appropriately determined based on the material and processing shape used in the actual punching process for the clearance evaluation. In this embodiment, as an example, a case will be described in which a laminated electromagnetic steel sheet, in which a plurality of thin plate-shaped electromagnetic steel sheets are laminated, is punched with a plurality of dies having different clearances to create a plurality of test pieces, but the present invention is not limited to this.

[0015] Examples of punched shapes include an Epstein test piece and a ring test piece. Figure 2 shows an example of a ring test piece. Various conditions such as the thickness of the test piece (e.g., t in FIG. 2) and the punching shape (e.g., D / 2, d / 2, and Lp in FIG. 2) may be appropriately determined based on the conditions used in the actual processing step, as described above. For example, the thickness of the test piece (thickness in the lamination direction of the electromagnetic steel sheet) is, for example, about 0.10 to 0.50 mm. In addition, the number of layers is determined appropriately based on information such as the recommended number for each thickness, which is specified in standards such as JIS C 2550.

[0016] Next, analytical data is obtained by analyzing the evaluation cross-section obtained by cutting each test piece (SA2: analytical data acquisition step). For example, an analytical test on the crystal orientation is performed on the evaluation cross-section of each test piece. Here, the evaluation cross-section may be a cut surface obtained by cutting each test piece in the stacking direction at an arbitrary position. One example of an analytical test is electron backscattered diffraction pattern (EBSD). When performing EBSD, attention should be paid to the edge droop between the embedding resin and the material. The measurement step size should be sufficiently small compared to the grain size, and an optimal value should be selected.

[0017] In this embodiment, the analysis data is a local misorientation distribution of the evaluation cross section, specifically, a KAM (Kernel Average Misorientation) map. The KAM map is a map showing the misorientation between a certain measurement point and a site adjacent to or near the measurement point. The larger the distortion, the larger the misorientation, and when there is no distortion, the misorientation is zero.

[0018] An example of a KAM map is shown in FIG. 3. FIG. 3 shows a KAM map when the longitudinal section A of the ring piece shown in FIG. 2 is used as the evaluation section. The KAM map shown in FIG. 3 illustrates a case where KAM1st, which is the crystal orientation difference between the first neighboring measurement points, is used, but KAM2nd, KAM3rd, and KAM4th may also be used, which are the crystal orientation differences between the second neighboring measurement points, the third neighboring measurement points, and the fourth neighboring measurement points, respectively, and the optimal one may be selected appropriately. In FIG. 3, the minimum value is set to 0 and the maximum value is set to 5.

[0019] Next, clearance characteristic information is created using the KAM map, which is the analysis data of each test piece, and the clearance of the press die, which is the processing condition of the test piece (SA3: characteristic creation step). First, the KAM map is processed to obtain a characteristic value related to the crystal orientation. In this embodiment, the characteristic value related to the crystal orientation is the orientation difference characteristic value KAMot-edge(φ) defined as follows:

[0020] KAMot-edge(φ) = Area ratio where the KAM value is equal to or greater than the threshold value φ at the processed edge of the evaluation cross section

[0021] Here, the processed end is, for example, an area at a distance t (= plate thickness) from each side of the evaluation section, as shown in FIG. 3. The area of ​​this processed end (in the example of FIG. 3, the area of ​​the processed end = t 2 ), the ratio of the area where the KAM value is equal to or greater than the threshold value φ is calculated as the orientation difference characteristic value KAMot-edge(φ). As shown in Figure 3, there are two processed ends in the evaluation cross section, and the orientation difference characteristic value KAMot-edge(φ) is calculated for each processed end. In the case of the end of the processed part, for example a ring piece, the clearance may differ between the inner and outer circumferences, so evaluation is performed on each side.

[0022] Here, the KAM value corresponds to the crystal rotation between the measurement points, and qualitatively coincides with the magnitude of the local deformation amount. Therefore, the KAM value has a strong correlation with the clearance. The inventors have focused on the fact that the residual stress and plastic strain introduced by the shear processing of the material have a more significant effect in the region closer to the shear position, and have obtained a new finding that the occurrence of local orientation difference at the processing end close to the shear position strongly reflects the punching conditions, and have devised a method of estimating the clearance using the above-mentioned orientation difference characteristic value KAMot-edge(φ). In this way, by using the orientation difference characteristic value KAMot-edge(φ), which has a strong correlation with the clearance, it is possible to improve the estimation accuracy of the clearance.

[0023] Here, the threshold value φ can be set appropriately, but if the threshold value φ is set to 3° or more, it becomes easier to be affected by sample adjustment such as edge droop, and it becomes difficult to find a certain relationship between the orientation difference characteristic value KAMot-edge(φ) and the punching clearance. Therefore, it is advisable to set the threshold value φ to less than 3°, preferably 2° or less, and more preferably 1° or less.

[0024] In the characteristic creation step, for example, the orientation difference characteristic value KAMot-edge(φ) and the clearance characteristic value acquired for each test piece are statistically processed to obtain a calibration curve (clearance characteristic information). As a result, for example, the clearance characteristic information (calibration curve) as shown in FIG. 4 can be obtained. In this embodiment, the clearance characteristic value is a plate thickness ratio of the clearance divided by the plate thickness, but is not limited to this. For example, the clearance value itself may be used as the clearance characteristic value.

[0025] Here, the process of creating the clearance characteristic information may be performed manually by a person, or may be automatically created using an information processing device such as a computer. When using an information processing device, application software may be constructed that provides the clearance characteristic value and KAM map of each test piece as input information and automatically creates the clearance characteristic information from the input information. In addition, in FIG. 4, the calibration curve is shown as a linear function, but this is not limited to this example. For example, the calibration curve may be obtained as a polynomial function. In addition, the clearance characteristic information may be created as a function, or as a table or a map.

[0026] Next, the clearance estimation device 1 and the clearance estimation method according to this embodiment will be described. [Hardware Configuration of Clearance Estimation Device 1] Fig. 5 is a diagram showing an example of a hardware configuration of a clearance estimation device 1 according to an embodiment of the present disclosure. As shown in Fig. 5, the clearance estimation device 1 is a so-called computer, and includes, for example, a CPU (Central Processing Unit: processor) 11, a main memory (Main Memory) 12, a secondary storage (Secondary storage: memory) 13, and the like.

[0027] The main memory device 12 is composed of writable memory such as a cache memory or a RAM (Random Access Memory), and is used as a working area for reading out the execution program of the CPU 11, writing processing data by the execution program, and the like. The secondary storage device 13 is a non-transitory computer readable storage medium, such as a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, or a semiconductor memory. The clearance estimation device 1 may further include an external interface 14 which is an interface for connecting to an external device, a communication interface 15 for transmitting and receiving information to and from other devices, an input device 16 such as a keyboard or a pointing device, and a display 17 for displaying analysis results, etc.

[0028] [Function of the clearance estimation device] 6 is a functional configuration diagram showing functions of the clearance estimation device 1 according to this embodiment. As an example, a series of processes for realizing various functions is stored in the secondary storage device 13 in the form of a program, and the CPU 11 reads this program into the main storage device 12 and executes information processing and arithmetic processing to realize various functions. Note that the program may be installed in the secondary storage device 13 in advance, may be provided in a state stored in a computer-readable storage medium, or may be distributed via wired or wireless communication means. The computer-readable storage medium may be a magnetic disk, a magneto-optical disk, a CD-ROM, a DVD-ROM, a semiconductor memory, or the like.

[0029] As shown in FIG. 6, the clearance estimation device 1 includes a characteristic information storage unit 21, a characteristic value acquisition unit 22, a clearance characteristic value acquisition unit 23, and a quality evaluation unit 24. The characteristic information storage unit 21 stores clearance characteristic information in which a characteristic value related to crystal orientation and a clearance characteristic value (in this embodiment, the plate thickness ratio of the clearance) are previously associated with each other. Specifically, the clearance characteristic information created by the above-mentioned clearance characteristic creating method is stored.

[0030] The characteristic value acquiring unit 22 acquires the orientation difference characteristic value KAMot-edge(φ) from the analysis test results regarding the crystal orientation of the evaluation cross section of a punched product during the processing of the product, for example. For example, in a sampling inspection of a product, a processed product is obtained by punching a laminated steel sheet used in the product with a press die used for product processing. Then, this processed product is cut at an arbitrary position along the lamination direction of the thin plate, and an analysis test (e.g., EBSD measurement) regarding the crystal orientation is performed on the cut surface (evaluation cross section), and a characteristic value regarding the crystal orientation, more specifically, the orientation difference characteristic value KAMot-edge(φ) of the cut surface is obtained from the analysis data (e.g., KAM map). Here, the threshold value φ is the same as the threshold value (e.g., φ=1°) as that of the clearance characteristic information stored in the characteristic information storage unit 21. In addition, since there are two processed ends on the cut surface, the orientation difference characteristic value KAMot-edge(φ) is calculated for each processed end. This makes it possible to estimate the clearance of each processed end, as described later.

[0031] The clearance characteristic value acquisition unit 23 acquires a clearance characteristic value, specifically, a plate thickness ratio of the clearance, corresponding to the orientation difference characteristic value KAMot-edge(φ) acquired by the characteristic value acquisition unit 22 from the clearance characteristic information stored in the characteristic information storage unit 21. This makes it possible to estimate the clearance of the press die that punched the workpiece.

[0032] The quality evaluation unit 24 evaluates the processing quality based on, for example, the clearance characteristic value (for example, the clearance thickness ratio) acquired by the clearance characteristic value acquisition unit 23. For example, it determines whether the clearance thickness ratio is equal to or less than a preset allowable value, and if it is equal to or less than the allowable value, it determines that it is normal. On the other hand, if the clearance thickness ratio exceeds the allowable value, it notifies the operator that the product is of poor quality. This enables the operator to take appropriate measures, such as replacing and maintaining the die used for punching.

[0033] The quality evaluation unit 24 may also perform an evaluation of the clearance variation due to manufacturing variations by statistically evaluating the evaluation results of a plurality of processed products. For example, the quality evaluation unit 24 may perform an evaluation of the clearance (manufacturing conditions) variation using the average value and standard deviation of the orientation difference characteristic value KAMot-edge(φ) obtained from the EBSD measurement results of a plurality of processed products. This makes it possible to perform quality control of products based on the estimated results of the punching clearance.

[0034] Next, a clearance estimation method executed by the clearance estimation device 1 according to this embodiment will be described with reference to Fig. 7. Fig. 7 is a flowchart showing an example of a processing procedure of the clearance estimation method according to this embodiment.

[0035] First, in the product processing process, the punched product is cut at an arbitrary position along the lamination direction of the thin plate, and EBSD measurement is performed on the cut surface (evaluation cross section) to obtain a KAM map of the cut surface, and the orientation difference characteristic value KAMot-edge(φ) is obtained from the obtained KAM map (SB1). Next, a clearance characteristic value (e.g., clearance thickness value) corresponding to the orientation difference characteristic value KAMot-edge(φ) acquired in step SA1 is acquired from the clearance characteristic information stored in the characteristic information storage unit 21 (SB2). Next, a quality evaluation of the processed product is performed based on the acquired clearance characteristic value (SB3). For example, it is determined whether the clearance characteristic value exceeds a preset allowable value, and if it does, a notification to that effect is given.

[0036] As described above, according to the clearance estimation device, clearance estimation method, and clearance characteristic creation method of this embodiment, the clearance characteristic value during punching is obtained using clearance characteristic information in which the orientation difference characteristic value KAMot-edge(φ), which is a characteristic value related to crystal orientation, is previously associated with the clearance characteristic value. Here, the orientation difference characteristic value KAMot-edge(φ) is a parameter that has a strong correlation with the clearance. Since the clearance of the die during punching is estimated using the clearance characteristic information in which the orientation difference characteristic value KAMot-edge(φ) and the clearance characteristic value are associated in this way, there is no need to install a sensor in the die as in Patent Document 1. This makes it possible to avoid increases in the manufacturing costs of the die and increases in costs due to the maintenance of the sensor. In addition, the method can be applied to medium-volume production products and can be widely applied to press dies.

[0037] For example, when machining electromagnetic steel sheets used in rotating electrical machines such as motors and generators into a desired shape, punching is often used, which has a large cost advantage. However, punching can cause material deformation and residual stress to deteriorate the material properties, which can lead to a decrease in product performance. In particular, the impact of punching on the material is greatly influenced by the punching clearance, which must be appropriately managed. According to the clearance estimation device, clearance estimation method, and clearance characteristic creation method of this embodiment, by conducting a sampling inspection of a punched product of an electromagnetic steel sheet, it is possible to estimate the die clearance without the need to dismantle the die.

[0038] For example, when manufacturing a motor, a rolled material is fed to a press machine at a constant speed, and the rolled material is laminated to manufacture a motor core. Therefore, the number of motor cores that can be produced from the rolled material is often not an integer, and laminated steel sheets that do not meet the motor stacking thickness are generated. Therefore, a processed product is obtained by performing a stamping process similar to that in the manufacturing process on such laminated steel sheets that are insufficient in thickness and are to be discarded, and the clearance is estimated as described above by destructively inspecting the processed product. In this way, a stamped product is obtained using a material that is to be kept on standby, so that destructive inspection of shipped products can be avoided, and an increase in waste costs can be avoided.

[0039] Although the present disclosure has been described above using the embodiments, the technical scope of the present disclosure is not limited to the scope described in the above embodiments. Various modifications or improvements can be made to the above embodiments without departing from the gist of the disclosure, and the forms in which such modifications or improvements are made are also included in the technical scope of the present disclosure. In addition, the above embodiments may be appropriately combined. Furthermore, the processing flow described in the above embodiment is also one example, and unnecessary steps may be deleted, new steps may be added, or the processing order may be rearranged, without departing from the spirit of the present disclosure.

[0040] For example, in the above embodiment, the orientation difference characteristic value KAMot-edge(φ) is used as the characteristic value related to the crystal orientation, but the present invention is not limited to this. For example, the characteristic value related to the crystal orientation may be another parameter that reflects the distortion caused by punching. The orientation difference characteristic value KAMot-edge(φ) is an area ratio, but instead of this, a volume ratio may be used. In the case of a volume ratio, for example, a method may be used in which tissue distribution data in the cross-sectional depth direction is obtained while scraping the surface of the evaluation cross-section in the depth direction, and the volume ratio of the orientation difference characteristic value is calculated using analysis data of each evaluation cross-section. An example of a tissue field analysis method in the cross-sectional depth direction is the serial sectioning method.

[0041] In the above embodiment, the case where KAM is used as the orientation difference characteristic value is described as an example, but the present invention is not limited to this. For example, a calibration curve may be created using parameters calculated based on identified crystal orientation information such as GROD (Gross Reference Orientation Deviation), GAM (Grain Average Misorientation), and GND (Geometrically Necessary Dislocation).

[0042] In the above embodiment, the clearance estimation device 1 is described as having the characteristic information storage unit 21, but the storage location of the clearance characteristic information is not limited to this. For example, the clearance characteristic information may be stored on a cloud server or the like, and the clearance characteristic value may be obtained from the clearance characteristic information by accessing it via a communication line.

[0043] [Response example] FIG. 8 is a diagram showing an example of the relationship between the plate thickness ratio of the clearance and the iron loss degradation rate ΔW. In FIG. 8(a) to (d), the horizontal axis is the plate thickness ratio of the clearance, and the vertical axis is the iron loss degradation rate ΔW. Here, the iron loss degradation rate ΔW is the value obtained by dividing the iron loss value (W / kg) after punching by the iron loss value (W / kg) before punching. FIG. 8(a) to (d) show different combinations of excitation magnetic flux density and excitation frequency. In addition, the results of tests performed under different conditions with different SPM (Shots Per Minute) are plotted. As shown in Fig. 8(a) to (d), it can be seen that there is a strong correlation between the plate thickness ratio of the clearance and the iron loss deterioration rate ΔW under any condition. Therefore, by creating in advance information showing the relationship between the plate thickness ratio of the clearance and the iron loss deterioration rate ΔW, it becomes possible to estimate the iron loss deterioration rate ΔW from the clearance characteristic value (for example, the plate thickness ratio of the clearance) acquired in this embodiment. This also makes it possible to evaluate the quality of products using the iron loss deterioration rate ΔW.

[0044] The clearance estimation device, the clearance estimation method, and the clearance characteristic creating method described in the above-described embodiments can be understood, for example, as follows.

[0045] A clearance estimation device (1) according to a first aspect of the present disclosure is a clearance estimation device that estimates a punching clearance of a punched product, and includes a characteristic value acquisition unit (22) that acquires a characteristic value related to crystal orientation from analysis data obtained by analyzing an evaluation cross-section of the punched product, and a clearance characteristic value acquisition unit (23) that acquires, from clearance characteristic information in which a characteristic value related to crystal orientation and a clearance characteristic value are previously associated with each other, the clearance characteristic value corresponding to the characteristic value related to crystal orientation acquired by the characteristic value acquisition unit.

[0046] According to the above aspect, the clearance of the die during punching is estimated using clearance characteristic information in which the orientation difference characteristic value and the clearance characteristic value, which are parameters having a strong correlation with the clearance, are associated, so there is no need to install a sensor in the die as in Patent Document 1. This makes it possible to avoid an increase in the manufacturing cost of the die and an increase in the cost of maintaining the sensor. In addition, the method can be applied to medium-volume production products and can be widely applied to press dies.

[0047] In the clearance estimation device according to a second aspect of the present disclosure, in the above-mentioned first aspect, the characteristic value related to the crystal orientation is a region area ratio or a region volume ratio where the local orientation difference is equal to or greater than a threshold value at the processed end portion of the evaluation cross section.

[0048] The occurrence of local orientation difference at the processed end portion close to the shear position strongly reflects the punching conditions. Therefore, by estimating the clearance using characteristic values ​​that strongly reflect such punching conditions, the accuracy of the clearance estimation can be improved.

[0049] A clearance estimation device according to a third aspect of the present disclosure is, in the first aspect described above, a characteristic value relating to the crystal orientation is a region area ratio or a region volume ratio at the processed end of the evaluation cross section where the local orientation difference is equal to or greater than a threshold value, and the threshold value is set to a value less than 3°.

[0050] According to the above aspect, by setting the threshold value to a value less than 3°, the clearance characteristic value can be estimated using a characteristic value having a stronger correlation with the clearance, thereby improving the accuracy of the clearance estimation.

[0051] A clearance estimation method according to a fourth aspect of the present disclosure is a clearance estimation method for estimating a punching clearance of a punched workpiece, and includes a characteristic value acquisition process (SB1) for acquiring a characteristic value related to crystal orientation from analysis data obtained by analyzing an evaluation cross-section of the punched workpiece, and a clearance characteristic value acquisition process (SB2) for acquiring, from clearance characteristic information in which characteristic values ​​related to crystal orientation and clearance characteristic values ​​are previously associated with each other, the clearance characteristic value corresponding to the characteristic value related to crystal orientation acquired in the characteristic value acquisition process.

[0052] A program according to a fifth aspect of the present disclosure is a program for causing a computer to function as the clearance estimation device according to any one of the first to third aspects.

[0053] A clearance characteristic creation method according to a sixth aspect of the present disclosure is a clearance characteristic creation method for creating clearance characteristic information for estimating a punching clearance of a punched product, and includes a test piece creation process (SA1) for creating a plurality of test pieces with different punching clearances, an analysis data acquisition process (SA2) for acquiring analysis data obtained by analyzing an evaluation cross section obtained by cutting each of the test pieces, and a characteristic creation process (SA3) for acquiring a characteristic value related to crystal orientation from the analysis data of each of the test pieces, and using the acquired characteristic value and the punching clearance to create clearance characteristic information in which a characteristic value related to crystal orientation and a clearance characteristic value are associated with each other.

[0054] A seventh aspect of the present disclosure relates to a clearance characteristic creation method in the sixth aspect, wherein the characteristic value relating to the crystal orientation is a region area ratio or a region volume ratio at the processed end of the evaluation cross section where the local orientation difference is equal to or greater than a threshold value.

[0055] A clearance characteristic creation method according to an eighth aspect of the present disclosure is, in the sixth aspect above, a characteristic value relating to the crystal orientation is a region area ratio or a region volume ratio at the processed end of the evaluation cross section where the local orientation difference is equal to or greater than a threshold value, and the threshold value is set to a value less than 3°. [Explanation of symbols]

[0056] 1: Clearance estimation device 11: CPU 12: Main memory 13:Secondary storage device 14: External interface 15: Communication interface 16: Input device 17: Display 21:Characteristics information storage section 22: Characteristic value acquisition section 23: Clearance characteristic value acquisition unit 24: Quality Evaluation Department

Claims

1. A clearance estimation device for estimating a punching clearance of a punched workpiece, comprising: a characteristic value acquiring unit that acquires characteristic values ​​related to crystal orientation from analysis data obtained by analyzing an evaluation cross section of the punched product; a clearance characteristic value acquisition unit that acquires the clearance characteristic value corresponding to the characteristic value related to the crystal orientation acquired by the characteristic value acquisition unit from clearance characteristic information in which a characteristic value related to a crystal orientation and a clearance characteristic value are previously associated with each other; A clearance estimation device comprising:

2. The clearance estimation device according to claim 1 , wherein the characteristic value relating to the crystal orientation is a region area rate or a region volume rate in which a local orientation difference is equal to or greater than a threshold value at a processed end portion of the evaluation cross section.

3. The clearance estimation device according to claim 1, wherein the characteristic value relating to the crystal orientation is a region area ratio or a region volume ratio in which the local orientation difference is equal to or greater than a threshold value at the processed end portion of the evaluation cross section, and the threshold value is set to a value less than 3°.

4. A clearance estimation method for estimating a punching clearance of a punched workpiece, comprising the steps of: a characteristic value acquisition step of acquiring characteristic values ​​related to crystal orientation from analysis data obtained by analyzing an evaluation cross section of the punched product; a clearance characteristic value acquisition step of acquiring the clearance characteristic value corresponding to the characteristic value related to the crystal orientation acquired in the characteristic value acquisition step from clearance characteristic information in which the characteristic value related to the crystal orientation and the clearance characteristic value are previously associated with each other; The computer performs the clearance estimation method.

5. A program for causing a computer to function as the clearance estimation device according to any one of claims 1 to 3.

6. A method for creating clearance characteristic information for estimating a punching clearance of a punched workpiece, comprising the steps of: A test piece preparation process for preparing a plurality of test pieces having different punching clearances; an analysis data acquisition step of acquiring analysis data obtained by analyzing an evaluation cross section obtained by cutting each of the test pieces; a characteristic creation step of acquiring a characteristic value related to a crystal orientation from the analysis data of each of the test pieces, and creating clearance characteristic information in which the characteristic value related to the crystal orientation and the clearance characteristic value are associated with each other using the acquired characteristic value and the punching clearance; A method for creating clearance characteristics comprising the steps of:

7. The clearance characteristic creation method according to claim 6 , wherein the characteristic value relating to the crystal orientation is a region area ratio or a region volume ratio in which a local orientation difference is equal to or greater than a threshold value at a processed end portion of the evaluation cross section.

8. The clearance characteristic creation method according to claim 6, wherein the characteristic value relating to the crystal orientation is an area ratio or an area volume ratio in which the local orientation difference is equal to or greater than a threshold value at the processed end of the evaluation cross section, and the threshold value is set to a value less than 3°.

Images