Substrate handling work system
The board-to-board work system addresses issues of color bleeding and false colors by using monochromatic lights and cameras to select appropriate images, achieving high-resolution color recognition with reduced processing time.
Patent Information
- Application Number
- JP2024160705
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-09-18
- Publication Date
- 2024-12-24
- Estimated Expiration
- 2039-07-26
AI Technical Summary
Existing board-to-board work systems face challenges in accurately recognizing objects as black and white images, leading to issues like color bleeding and false colors when generating color images, while using monochromatic cameras to combine black-and-white images unnecessarily prolongs imaging time for objects that can be recognized with a single-color image.
A board-to-board work system that uses a moving device with an illumination device capable of independently irradiating R, G, and B monochromatic lights, a monochromatic camera to capture images, and an image processing device to select appropriate monochromatic or composite images based on the object, eliminating color bleeding and false colors, and reducing processing time.
The system allows for high-resolution color images without color bleeding and false colors, reducing imaging time by selecting either a single monochromatic or composite image based on the object, thereby improving accuracy and efficiency in object recognition.
Smart Images

Figure 2024178273000001_ABST
Abstract
Description
[Technical field]
[0001] A substrate-related operation system is disclosed herein. [Background technology]
[0002] Conventionally, a substrate-related operation system that performs an operation on a substrate arranged on an XY plane is known. For example, Patent Document 1 discloses a substrate-related operation system that includes a head that moves on the XY plane, an illumination device that irradiates light onto the substrate, and a camera that captures an image of the substrate illuminated by the illumination device. On the other hand, as an image acquisition system, as shown in Patent Document 2, a system that acquires a first optical image and a second optical image to create a composite image is known. The composite image is a color image, and each of the first and second optical images is composed of color components of the composite color image. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2002-271099 A [Patent Document 2] JP 2004-191355 A Summary of the Invention [Problem to be solved by the invention]
[0004] In the substrate-related operation system, some objects captured by the camera can be recognized in black and white images, but others cannot. Considering this point, it is possible to acquire a color image of the object and recognize the object in the color image. In such a case, color information is often created with four pixels as one unit, but it is difficult to accurately recognize the object because of phenomena such as color bleeding and false color. On the other hand, when a color image is generated by synthesizing three black and white images captured by a monochromatic camera by irradiating each with RGB light, a high-resolution color image in which phenomena such as color bleeding and false color are eliminated can be obtained. However, since a color image is generated by synthesizing three black and white images regardless of the object, there is a problem that the image capture time is unnecessarily long for objects that can be sufficiently recognized by only black and white images.
[0005] The substrate processing system disclosed in this specification has been made to solve the above-mentioned problems, and its main purpose is to enable the appropriate use of either a high-resolution composite image or a monochrome image as needed. [Means for solving the problem]
[0006] The substrate operating system disclosed in the present specification includes: A substrate-related operation system for performing operations on a substrate arranged on an XY plane, A moving device that moves on the XY plane; an illumination device attached to the moving device and capable of independently irradiating at least two monochromatic lights of R, G, and B onto an object on the XY plane; a monochromatic camera attached to the mobile device for acquiring a monochromatic image of the object illuminated by the illumination device; an image processing device that selects one or more monochromatic lights from the at least two monochromatic lights based on the object, and if the selected monochromatic light is one, controls the lighting device and the monochromatic camera to obtain a monochromatic image of the object illuminated with the one monochromatic light and sets the monochromatic image of the object as an object inspection image, and if the selected monochromatic light is multiple, controls the lighting device and the monochromatic camera to obtain each monochromatic image of the object illuminated independently with the multiple monochromatic lights and sets a composite image obtained by combining the monochromatic images as the object inspection image; It is equipped with the following:
[0007] In this substrate operation system, one or more monochromatic lights are selected from at least two monochromatic lights based on the object, and if one monochromatic light is selected, the illumination device and the monochromatic camera are controlled to acquire a monochromatic image of the object irradiated with one monochromatic light, and the monochromatic image of the object is set as the object inspection image. If multiple monochromatic lights are selected, the illumination device and the monochromatic camera are controlled to acquire each monochromatic image of the object irradiated independently with the multiple monochromatic lights, and a composite image obtained by combining the monochromatic images is set as the object inspection image. Since the composite image obtains color information for each pixel, it is a high-resolution image in which phenomena such as color bleeding and false colors are eliminated compared to when color information is created with four pixels arranged in a square as one unit, but it takes time to capture the image because it is necessary to capture the image multiple times. Here, whether to use one monochromatic image or a composite image as the object inspection image is selected based on the object. In other words, it is possible to appropriately use one monochromatic image or a high-resolution composite image depending on the object. Therefore, the processing time is reduced compared to when a composite image is used as the object inspection image for all objects.
[0008] The object inspection image may be used for automatic inspection of the object by an image processing device, or may be displayed on a display by the image processing device so that an operator can inspect the object. [Brief description of the drawings]
[0009] [Figure 1] FIG. [Diagram 2] FIG. 2 is a schematic explanatory diagram of the configuration of a mark camera 50. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. 2 is a block diagram showing a configuration related to control of the component mounter 10. [Figure 6] A plan view of a substrate 80 having a fiducial mark 81. [Figure 7] FIG. 1 is a plan view of a substrate 80 having block skip marks 83. [Figure 8] 11 is a flowchart showing an example of an inspection routine. [Figure 9] FIG. 4 is a plan view of the board 80 after the components P1, P2, and P3 are mounted. [Figure 10] 10 is a flowchart illustrating an example of another inspection routine. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0010] A preferred embodiment of the component mounter disclosed in this specification will be described below with reference to the drawings. Fig. 1 is a perspective view of the component mounter 10, Fig. 2 is a schematic explanatory diagram of the configuration of the mark camera 50, Fig. 3 is a view from A of the epi-illumination light source 53, Fig. 4 is a view from B of the lateral illumination light source 55, and Fig. 5 is a block diagram showing the configuration related to the control of the component mounter 10. In this embodiment, the left-right direction (X-axis), the front-back direction (Y-axis), and the up-down direction (Z-axis) are as shown in Fig. 1.
[0011] The component mounter 10 includes a board transport device 18 , a head 24 , a nozzle 37 , a parts camera 40 , a mark camera 50 , a display 68 , a reel unit 70 , and a control device 60 .
[0012] The substrate transport device 18 is a device that transports and holds the substrate 80. The substrate transport device 18 includes support plates 20 and conveyor belts 22 (only one of which is shown in FIG. 1). The support plates 20 are members that extend in the left-right direction, and are provided at intervals in the front and rear of FIG. 1. The conveyor belts 22 are endlessly stretched over a driving wheel and a driven wheel provided on the left and right sides of the support plates 20. The substrate 80 is placed on the upper surfaces of the pair of conveyor belts 22 and transported from left to right. The substrate 80 can be supported from the back side by a large number of support pins 23 that are erected. Therefore, the substrate transport device 18 also serves as a substrate support device.
[0013] The head 24 is attached to the front of the X-axis slider 26. The X-axis slider 26 is attached to the front of the Y-axis slider 30. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. A pair of upper and lower guide rails 28, 28 extending in the left-right direction is provided on the front of the Y-axis slider 30. The X-axis slider 26 is slidably attached to the guide rails 28, 28. The head 24 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. The sliders 26, 30 are driven by drive motors 26a, 30a (see FIG. 5), respectively. The head 24 also incorporates a Z-axis motor 34, which adjusts the height of a nozzle 37 attached to a ball screw 35 extending along the Z axis. Furthermore, the head 24 incorporates a Q-axis motor 36 (see FIG. 5) that rotates the nozzle 37 about its axis.
[0014] The nozzle 37 is a member that sucks and holds a component at the nozzle tip, and releases the component sucked at the nozzle tip. The nozzle 37 can be supplied with pressure from a pressure supply source (not shown). For example, when negative pressure is supplied, the nozzle 37 sucks a component, and when the supply of negative pressure is stopped or positive pressure is supplied, the nozzle 37 releases the component. The nozzle 37 protrudes downward from the bottom surface of the main body of the head 24. The nozzle 37 is raised and lowered along the Z-axis direction by the Z-axis motor 34, so that the height of the component sucked by the nozzle 37 is adjusted. The nozzle 37 is rotated by the Q-axis motor 36, so that the orientation of the component sucked by the nozzle 37 is adjusted.
[0015] The part camera 40 is disposed in front of the board transport device 18. The part camera 40 has an imaging range above the part camera 40, and captures an image of the part held by the nozzle 37 from below to generate a captured image.
[0016] The mark camera 50 is provided on the lower surface of the X-axis slider 26. The mark camera 50 captures an image of an object (image capture object) from above to generate a captured image. The object of the mark camera 50 may be a component held on the tape 72 fed from the feeder 74 in the reel unit 70, a mark affixed to the board 80, a component mounted on the board 80, solder printed on the board 80, etc.
[0017] As shown in FIG. 2, the mark camera 50 includes an illumination device 51 and a camera body 58. The illumination device 51 includes a housing 52, an incident light source 53, a half mirror 54, and a side light source 55. The housing 52 is a cylindrical member that opens on the bottom surface and is attached below the camera body 58. The incident light source 53 is provided on the inner side surface of the housing 52. As shown in FIG. 3, the incident light source 53 includes red LEDs 53a that emit monochromatic light of R (red), green LEDs 53b that emit monochromatic light of G (green), and blue LEDs 53c that emit monochromatic light of B (blue), which are arranged in equal or approximately equal numbers on a rectangular support plate 53d. Each of the LEDs 53a to 53c is a rectangular base with a light emitting element arranged in the center, and a hemispherical lens is attached to cover the light emitting element. The half mirror 54 is provided obliquely on the inner side of the housing 52. The half mirror 54 reflects horizontal light from the LEDs 53a, 53b, and 53c of the incident light source 53 downward. The half mirror 54 also transmits light from below toward the camera body 58. The side-emitting light source 55 is provided horizontally near the lower opening of the housing 52. As shown in FIG. 4, the side-emitting light source 55 includes red LEDs 55a, green LEDs 55b, and blue LEDs 55c arranged in equal or nearly equal numbers on a ring-shaped support plate 55d, and emits light downward. Each of the LEDs 55a to 55c is a square base with a light-emitting element arranged in the center, and a hemispherical lens is attached to cover the light-emitting element. A diffusion plate 56 is provided below the side-emitting light source 55 in the housing 52. The light emitted from the incident light source 53 and the side-emitting light source 55 is finally diffused by the diffusion plate 56 and then irradiated onto the object. The camera body 58 generates a captured image based on the received light. The camera body 58 includes an optical system such as a lens (not shown) and an image sensor (e.g., a CCD). When light emitted from the incident light source 53 and the lateral light source 55 and reflected by the object passes through the half mirror 54 and reaches the camera body 58, the camera body 58 receives the light and generates a captured image.
[0018] The wavelength ranges of the R, G, and B colors are not particularly limited, but may be, for example, 590-780 nm for R, 490-570 nm for G, and 400-490 nm for B.
[0019] The display 68 displays various images in color or monochrome.
[0020] The reel unit 70 has a plurality of feeders 74 removably attached thereto. The feeder 74 includes a reel 71. A tape 72 is wound around the reel 71. A plurality of storage recesses 73 are provided on the surface of the tape 72 along the longitudinal direction of the tape 72. Components are stored in each storage recess 73. These components are protected by a film covering the surface of the tape 72. The tape 72 is unwound rearward from the reel 71, and the film is peeled off at a predetermined component supply position 74a of the feeder 74 to expose the components. The components sent to the predetermined component supply position 74a are sucked by the nozzle 37. The operation of the reel unit 70 is controlled by a feeder controller 76 (see FIG. 5) provided in each feeder 74.
[0021] As shown in FIG. 5, the control device 60 includes a CPU 61, a storage unit 63 (ROM, RAM, HDD, etc.), an input / output interface 65, etc., which are connected via a bus 66. The control device 60 outputs drive signals to the substrate transport device 18, the drive motor 26a of the X-axis slider 26, the drive motor 30a of the Y-axis slider 30, the Z-axis motor 34, the Q-axis motor 36, the parts camera 40, the mark camera 50, the display 68, and a pressure supply source (not shown) for the nozzle 37. The control device 60 also inputs the captured image from the parts camera 40 and the captured image from the mark camera 50. The control device 60 is connected to the feeder controller 76 of the reel unit 70 so as to be able to communicate with them. Although not shown, each slider 26, 30 is equipped with a position sensor (not shown), and the control device 60 controls the drive motors 26a, 30a of each slider 26, 30 while inputting position information from the position sensors.
[0022] Here, the substrate 80 will be described. The substrate 80 shown in FIG. 6 has a fiducial mark 81. The fiducial mark 81 is a mark provided at two diagonal corners of the substrate 80, and is used to correct the attitude (position and inclination) of the substrate 80. Here, the fiducial mark 81 is created so that it can be clearly identified from the substrate 80 by using a monochromatic image captured when irradiated with monochromatic light of R. The substrate 80 shown in FIG. 7 has a block skip mark 83. The block skip mark 83 is a mark for indicating whether the substrate block 82 is a good block or a bad block when the substrate 80 is formed so that a large number of small substrates (substrate blocks 82) can be obtained. Therefore, the block skip mark 83 is created so that a mark representing a good block (white mark in FIG. 8) and a mark representing a bad block (black mark in FIG. 8) can be distinguished from each other. Here, the block skip mark 83 is created so that it can be clearly identified from the substrate 80 by using a monochromatic image captured when irradiated with monochromatic light of R. That is, for both the fiducial mark 81 and the block skip mark 83, the R monochromatic light is selected based on the distinguishability between the marks 81 and 83 and the substrate 80 that is the background.
[0023] Next, the operation of the component mounter 10 when performing the component mounting process will be described. The CPU 61 of the control device 60 controls each part of the component mounter 10 based on a production program received from a management device (not shown) to produce a board 80 on which a plurality of types and a plurality of components are mounted. Specifically, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 so that the nozzle 37 faces the components sent to the component supply position 74a by the reel unit 70, which is a component supply device. Next, the CPU 61 controls the pressure of the nozzle 37 so that the components at the component supply position 74a are sucked by the nozzle 37. Next, the CPU 61 controls the parts camera 40 so that an image of the components sucked by the nozzle 37 is captured, and recognizes the attitude of the components based on the obtained image of the components. Next, the CPU 61 controls the X-axis slider 26 and the Y-axis slider 30 so that the components are placed directly above the designated position of the board 80, taking into account the attitude of the components sucked by the nozzle 37, and controls the pressure of the nozzle 37 so that the nozzle 37 releases the components. The CPU 61 repeatedly executes this component mounting process to mount a predetermined number and types of components on the board 80. A mounting line is formed by arranging a plurality of such component mounters 10 in the left-right direction. When the board 80 is transported from the most upstream component mounter 10 to the most downstream component mounter 10 in one mounting line, all of the predetermined components are mounted on the board 80.
[0024] Next, the operation of the component mounter 10 when inspecting an object will be described. FIG. 8 is a flow chart showing an example of an inspection routine. When the CPU 61 of the control device 60 starts the inspection routine, first, it selects monochromatic light based on the object (S100). For example, if the object is a fiducial mark 81 (see FIG. 6), the CPU 61 selects R monochromatic light from the three monochromatic lights R, G, and B. If the object is a block skip mark 83 (see FIG. 7), the CPU 61 similarly selects R monochromatic light. As described above, this is because both the fiducial mark 81 and the block skip mark 83 can be clearly distinguished from the board 80 (background) in a monochromatic image captured by irradiating R monochromatic light. On the other hand, if the object is a component on the board 80 after component mounting shown in FIG. 9 (for example, the board 80 on which mounting of all components handled by the component mounter 10 has been completed), the CPU 61 selects all monochromatic lights from the three monochromatic lights R, G, and B. 9, three types of components P1, P2, and P3 are mounted on the board 80, two components P1, six components P2, and one component P3. In a monochromatic image captured by illuminating the components P1, P2, and P3 on the board 80 with any one of monochromatic R, G, and B light, none of the components P1, P2, and P3 can be clearly distinguished from the board 80 (background), but in a composite image (color image) obtained by combining the monochromatic R, G, and B images, all of the components P1, P2, and P3 can be clearly distinguished from the board 80. In other words, all of the monochromatic RGB lights are selected based on the distinguishability between the components P1, P2, and P3 and the board 80, which is the background.
[0025] Next, the CPU 61 controls the mark camera 50 (i.e., the illumination device 51 and the camera body 58) to capture a monochromatic image of the object illuminated with the selected monochromatic light (S110), and inputs the captured monochromatic image from the mark camera 50 (S120). For example, if the selected monochromatic light is R monochromatic light, such as when the object is a fiducial mark 81 or a block skip mark 83, the CPU 61 controls the mark camera 50 to obtain a monochromatic image of the object illuminated with R monochromatic light, and inputs the monochromatic image from the mark camera 50. On the other hand, if the selected monochromatic light is all of R, G, and B monochromatic light, as in the case of the object being components P1, P2, and P3 on the board 80 after component mounting as shown in Fig. 9, the CPU 61 controls the mark camera 50 to sequentially acquire monochromatic images of the components P1, P2, and P3 illuminated with the monochromatic light of R, monochromatic images of the components P1, P2, and P3 illuminated with the monochromatic light of G, and monochromatic images of the components P1, P2, and P3 illuminated with the monochromatic light of B, and inputs these monochromatic images from the mark camera 50. When illuminating the object with monochromatic light, the lateral light source 55 of the illumination device 51 is usually used, but if the object has a glossy surface such as a metal surface, the epi-illumination light source 53 is used.
[0026] Next, the CPU 61 sets an object inspection image (S130). For example, when the object is a fiducial mark 81 or a block skip mark 83, and the CPU 61 inputs a monochromatic image of the object irradiated with monochromatic light of R from the mark camera 50, the monochromatic image is set as the object inspection image. On the other hand, when the object is components P1, P2, and P3 on the board 80 after component mounting as shown in FIG. 9, and the CPU 61 inputs monochromatic images of the object irradiated with monochromatic light of R, G, and B independently from the mark camera 50, the monochromatic images are synthesized to generate a composite image (color image), and the composite image is set as the object inspection image.
[0027] Here, the color image generated in this embodiment will be described. From a black-and-white image of an object illuminated with R monochromatic light, information is obtained that expresses the brightness of R in multiple gradations (for example, 256 gradations) for each pixel. From a black-and-white image of an object illuminated with G monochromatic light, information is obtained that expresses the brightness of G in multiple gradations for each pixel. From a black-and-white image of an object illuminated with B monochromatic light, information is obtained that expresses the brightness of B in multiple gradations for each pixel. From these pieces of information, RGB information for each pixel can be obtained, so a color image can be generated. Since RGB information is obtained for each pixel in the color image generated in this way, a high-resolution color image in which phenomena such as color bleeding and false colors are eliminated can be obtained, compared to when color information is generated for four pixels arranged in a square shape as one unit (for example, R and B arranged on one diagonal and G and G arranged on the other diagonal as one unit).
[0028] Next, the CPU 61 executes inspection of the object using the object inspection image (S140). For example, when the object is a fiducial mark 81 or a block skip mark 83, if a monochromatic image irradiated with monochromatic light of R is set as the object inspection image, the monochromatic image is used to inspect the positions of the fiducial mark 81 or the block skip mark 83. Inspection of the positions of the fiducial mark 81 or the block skip mark 83 is performed before mounting components on the board 80. By inspecting the position of the fiducial mark 81, the posture of the board 80 can be known from the position, so that subsequent component mounting can be performed with high accuracy by considering the posture. By inspecting the position of the block skip mark 83, defective board blocks 82 can be skipped and components can be mounted. Note that if the positions of the fiducial mark 81 or the block skip mark 83 cannot be recognized or are deviated from the original position beyond an allowable range, an error is detected, and the board 80 is ejected without components being mounted. On the other hand, when a color image is set as the object inspection image, as in the case of the components P1, P2, and P3 on the board 80 after component mounting as shown in Fig. 9, the positions of the components P1, P2, and P3 are inspected using the color image. As described above, the color image obtained in this embodiment is a high-resolution color image that eliminates phenomena such as color bleeding and false colors, so that the positions of the components P1, P2, and P3 can be recognized with high accuracy, and as a result, the accuracy of the inspection is improved. Note that if the positions of the components P1, P2, and P3 cannot be recognized or are deviated from their original positions beyond an allowable range, an error is detected and the board 80 is discarded.
[0029] Next, the CPU 61 stores an image according to the inspection result in the storage unit 63 (S150), and ends this routine. For example, if the object is a fiducial mark 81 or a block skip mark 83, and no error occurs, a monochromatic image of the object irradiated with R monochromatic light is stored in the storage unit 63. At this time, the monochromatic image may be compressed and stored. This is because it is not necessary to examine in detail the image when no error occurs. On the other hand, if an error occurs when the object is a fiducial mark 81 or a block skip mark 83, the mark camera 50 is controlled to capture a monochromatic image of the object irradiated independently with other monochromatic lights (i.e., G and B), and the monochromatic images of R, G, and B are stored in the storage unit 63. By doing so, the cause of the error can be investigated by examining the monochromatic images of R, G, and B later. At this time, instead of or in addition to storing the monochromatic images of R, G, and B in the storage unit 63, a color image obtained by synthesizing the monochromatic images of R, G, and B may be stored in the storage unit 63. On the other hand, if the object shown in FIG. 9 is the components P1, P2, and P3 on the board 80 after component mounting is completed, and no error occurs, the color image is stored in the storage unit 63. At this time, the color image may be compressed and stored. This is because there is no need to examine in detail the image when no error occurs. On the other hand, if the object is the components P1, P2, and P3 on the board 80 (see FIG. 9) after component mounting is completed and an error occurs, the color image is stored in the storage unit 63 without being compressed. By doing so, the cause of the error can be investigated by examining the color image later. At this time, instead of or in addition to storing the color image in the storage unit 63, the single-color images of R, G, and B may be stored in the storage unit 63.
[0030] Here, the correspondence between the components of this embodiment and the components of the board-related operation system disclosed in this specification will be described. The mounter 10 of this embodiment corresponds to the board-related operation system disclosed in this specification, the X-axis slider 26 and the Y-axis slider 30 correspond to the moving device, the lighting device 51 corresponds to the lighting device, the camera body 58 corresponds to the monochrome camera, and the control device 60 corresponds to the image processing device. In addition, the display 68 corresponds to the image display device, and the memory unit 63 corresponds to the memory device.
[0031] In the embodiment described above, whether to use one monochromatic image or a composite image as an object inspection image is selected based on the object. In other words, whether to use one monochromatic image or a high-resolution composite image can be appropriately used depending on the object. Therefore, the processing time is reduced compared to the case where a composite image is used as an object inspection image for all objects.
[0032] In addition, it determines whether to select one or all of the three RGB monochromatic lights based on the discernibility of the object from the background, so that an appropriate image is selected for inspecting the object.
[0033] Furthermore, the CPU 61 judges whether the object is good or bad based on the result of image recognition of the object in the object inspection image, and if the object is judged to be defective, it stores all the monochromatic images of the object in the three monochromatic lights of R, G, and B and / or a composite image obtained by combining all the monochromatic images in the memory unit 63. Therefore, for an object judged to be defective, it is possible to later read out all the monochromatic images and / or composite image (color image) of the object from the memory unit 63 to investigate the cause of the defect. At this time, if all the monochromatic images of the object in the three monochromatic lights of R, G, and B are not available, the missing monochromatic images are obtained and stored.
[0034] It goes without saying that the present invention is not limited to the above-described embodiment, and can be embodied in various forms within the technical scope of the present invention.
[0035] For example, instead of the inspection routine of the embodiment described above, the inspection routine of FIG. 10 may be executed. In the inspection routine of FIG. 10, the CPU 61 of the control device 60 first determines whether or not there has been a change in an event related to the object (S200). Examples of changes in an event related to the object include a change in shape data of the part that is the object, replacement of the feeder 74 that supplies the part, replacement of the nozzle 37 that picks up the part, and a change in the manufacturer or production lot of the part. If there has been no change in an event related to the object in S200, the CPU 61 executes the above-mentioned processes of S100 to S150 and ends this routine. On the other hand, if there has been a change in an event related to the object in S200, the CPU 61 controls the mark camera 50 to capture a monochromatic image of the object irradiated with each of the monochromatic lights of all RGB regardless of the object (S210), and inputs the captured monochromatic image from the mark camera 50 (S220). Next, the CPU 61 sets an image for inspecting the object (S230). Here, the CPU 61 generates a composite image (color image) by synthesizing monochromatic images of the object irradiated independently with the monochromatic light of R, G, and B input from the mark camera 50, and sets the composite image as the object inspection image. After that, the CPU 61 executes the processes of S240 and S250 similar to S140 and S150 described above, and ends this routine. In S250, if the inspection result is not an error, the CPU 61 compresses the composite image and stores it in the storage unit 63, and if the inspection result is an error, the CPU 61 stores the composite image in the storage unit 63 without compressing it. In this way, since there is a high probability that an error will occur when an event related to the object changes, it is possible to later read out the composite image (color image) of the object from the storage unit 63 and investigate in detail what effect the event change has had on the object. Note that if the inspection result is an error, the CPU 61 may store the monochromatic images of R, G, and B in the storage unit 63 instead of or in addition to storing the composite image in the storage unit 63. Even in this case, all monochrome images and / or composite images (color images) of the object can be read out from the memory unit 63 later to investigate in detail what effect the change in the event had on the object.
[0036] In the above-described embodiment, a monochromatic light was selected based on the object, and a monochromatic image illuminated with the selected monochromatic light was captured. However, when creating an image for on-machine editing to be edited on the display 68 of the component mounter 10, monochromatic images in three colors, RGB, regardless of the object, may be captured and then combined to create a composite image (color image) and displayed on the display 68.
[0037] In the above-mentioned embodiment, at the start of production, monochromatic images of the object irradiated independently with each monochromatic light of RGB are captured, and if the feature points of the object can be clearly distinguished from the background of the object in the monochromatic images of RGB, the monochromatic light of the monochromatic image may be associated with the object, and if the feature points of the object cannot be clearly seen in any of the monochromatic images, all the monochromatic lights may be associated with the object so that a composite image (color image) is obtained by combining the monochromatic images. This association may be performed by the CPU 61 of the control device 60 or by an operator. Also, until a predetermined period has elapsed after the start of production, all the monochromatic lights may be selected regardless of the object in S100 of the inspection routine, and then this association may be performed. After the association is performed, the monochromatic light associated with the object may be selected in S100 of the inspection routine.
[0038] In the inspection routine of the above-described embodiment, even in the case of an object for which one monochromatic light is selected, monochromatic images of the object irradiated independently with each of the R, G, and B monochromatic lights may be periodically synthesized, and the synthesized image (color image) may be saved.
[0039] In the above-described embodiment, the target object may be a component accommodated in the accommodation recess 73 of the tape 72 of the reel unit 70. Although the reel unit 70 has been exemplified as a component supply device of the component mounter 10, the present invention is not particularly limited to this, and for example, a tray unit that supplies components placed on a tray may be adopted. In this case, the target object may be a component placed on the tray.
[0040] In the above-described embodiment, the illumination device 51 can independently irradiate three colors, RGB, but it may also be capable of independently irradiating two colors (for example, R and G, R and B, or G and B). In that case, for an object that cannot be recognized by a single monochromatic image, a composite image may be used in which monochromatic images of the object independently irradiated with each of the two monochromatic colors are synthesized.
[0041] In the above-described embodiment, the component mounter 10 is exemplified as the substrate-related operation system, but the present invention is not particularly limited to this, and may be, for example, a solder printer arranged upstream of a mounting line in which a plurality of component mounters 10 are lined up. The solder printer is a device that prints solder at a predetermined position on the substrate 80 before components are mounted thereon, and may perform the above-described inspection routine with the solder as the target object.
[0042] In S130 of the inspection routine of the above-described embodiment, the CPU 61 may set an object inspection image and then display the object inspection image on the display 68. In this way, the operator can inspect the object by looking at the object inspection image shown on the display 68. In that case, the processes of S140 and S150 may be omitted.
[0043] In the above-described embodiment, the head 24 equipped with one nozzle 37 is used, but a rotary head equipped with a plurality of nozzles at equal intervals along the outer periphery of a cylindrical head body may also be used.
[0044] In the above embodiment, the nozzle 37 is exemplified as a member for suction-holding a component, but this is not particularly limited, and instead of the nozzle 37, for example, a mechanical chuck or an electromagnet may be provided.
[0045] The substrate-related operating system disclosed in this specification may be configured as follows.
[0046] In the substrate-related operation system disclosed in the present specification, the image processing device may display the object inspection image on an image display device, whereby an operator can check the object inspection image by looking at the image display device.
[0047] In the substrate-related operation system disclosed in this specification, the image processing device may select one or more monochromatic lights from the at least two monochromatic lights based on the distinguishability of the object from the background of the object. In this way, an appropriate image for inspecting the object is selected. For example, if the object can be distinguished from the background in a monochromatic image of the object irradiated with one monochromatic light, the one monochromatic light may be selected, and if the object cannot be distinguished from the background in any monochromatic image of the object irradiated with any monochromatic light but can be distinguished in a composite image, multiple monochromatic lights may be selected according to the monochromatic images required to generate the composite image.
[0048] In the substrate-related operation system disclosed in this specification, the lighting device may be capable of independently irradiating the object with three monochromatic lights of R, G, and B, and the image processing device may set one monochromatic light from the three monochromatic lights of R, G, and B or select all monochromatic lights based on the object. In this way, the composite image becomes a color image obtained by combining the monochromatic images of RGB.
[0049] In the substrate-related work system disclosed in this specification, the image processing device may determine whether the object is good or bad based on the result of image recognition of the object in the object inspection image, and if the object is determined to be defective, all monochromatic images of the object in the three monochromatic lights R, G, and B and / or a composite image obtained by combining all of the monochromatic images may be stored in a storage device. In this way, for an object determined to be defective, all monochromatic images and / or a composite image (color image) of the object may be read out from the storage device later to investigate the cause of the defect. At this time, if monochromatic images of the object in all three wavelengths R, G, and B are not available, the missing monochromatic images may be captured by a monochromatic camera. Alternatively,
[0050] In the substrate-related operation system disclosed in this specification, the image processing device may store in a storage device all monochromatic images of the object in the three monochromatic lights of R, G, and B and / or a composite image obtained by combining all the monochromatic images in the storage device when an event related to the object changes. In this way, when an event related to the object changes, it is possible to later read out all monochromatic images and / or a composite image (color image) of the object from the storage device and investigate how the event change has affected the object. In this case, when all monochromatic images of the object in the three wavelengths of R, G, and B are not available, the missing monochromatic images may be captured by a monochromatic camera. Examples of events related to the object that change include, for example, when the object is a component to be mounted on a substrate, when the shape data of the component is changed, when a component supply device or nozzle for supplying the component is replaced, when the manufacturer or lot of the component is changed, and so on.
[0051] In the substrate-related work system disclosed in this specification, the target object may be a mark affixed to the substrate, a component mounted on the substrate, a component placed on a component supply device that supplies components to the substrate, or solder printed on the substrate. [Industrial Applicability]
[0052] The present invention can be used in industries involving the operation of mounting components on boards. [Explanation of symbols]
[0053] 10 component mounter, 18 substrate conveyor, 20 support plate, 22 conveyor belt, 23 support pin, 24 head, 26 X-axis slider, 26a drive motor, 28 guide rail, 30 Y-axis slider, 30a drive motor, 32 guide rail, 34 Z-axis motor, 35 ball screw, 36 Q-axis motor, 37 nozzle, 40 parts camera, 50 mark camera, 51 lighting device, 52 housing, 53 incident light source, 53a red LED, 53b green LED, 53c blue LED, 53d support plate, 54 half mirror, 55 lateral light source, 55a red LED, 55b green LED, 55c blue LED, 55d support plate, 56 diffusion plate, 58 camera body, 60 control device, 61 CPU, 63 memory unit, 65 input / output interface, 66 bus, 68 Display, 70 reel unit, 71 reel, 72 tape, 73 storage recess, 74 feeder, 74a component supply position, 76 feeder controller, 80 board, 81 fiducial mark, 82 board block, 83 block skip mark, P1, P2, P3 components.
Claims
1. A substrate-related operation system for performing an operation on a substrate arranged on an XY plane, A moving device that moves on the XY plane; an illumination device attached to the moving device and capable of independently irradiating at least two monochromatic lights of R, G, and B onto an object on the XY plane; a monochromatic camera attached to the mobile device for acquiring a monochromatic image of the object illuminated by the illumination device; an image processing device that selects one or more monochromatic lights from the at least two monochromatic lights based on the object, and if one monochromatic light is selected, controls the lighting device and the monochromatic camera to obtain a monochromatic image of the object illuminated with the one monochromatic light and sets the monochromatic image of the object as an object inspection image, and if multiple monochromatic lights are selected, controls the lighting device and the monochromatic camera to obtain each monochromatic image of the object illuminated independently with the multiple monochromatic lights and sets a composite image obtained by combining the monochromatic images as the object inspection image; A substrate-related operation system comprising:
2. the image processing device displays the object inspection image on an image display device; The substrate-related operation system according to claim 1 .
3. the image processor selecting one or more monochromatic lights from the at least two monochromatic lights based on a discernibility of the object from a background of the object. The substrate-related operation system according to claim 1 .
4. The illumination device is capable of independently irradiating the object with three monochromatic lights of R, G, and B, the image processing device sets one monochromatic light from among the three monochromatic lights of R, G, and B based on the object, or selects all monochromatic lights; 4. The substrate-related operation system according to claim 1.
5. The image processing device judges whether the object is good or bad based on the result of image recognition of the object in the object inspection image, and if the object is defective, stores in a storage device all monochromatic images of the object in three monochromatic lights of R, G, and B and / or a composite image obtained by combining all the monochromatic images. The substrate-related operation system according to claim 4 .
6. When an event related to the object is changed, the image processing device stores in a storage device all monochromatic images of the object in the three monochromatic lights of R, G, and B and / or a composite image obtained by combining all the monochromatic images. The substrate-related operation system according to claim 4 .
7. the target object is a mark affixed to the board, a component mounted on the board, a component placed on a component supplying device that supplies components to the board, or solder printed on the board; 7. The substrate-related operation system according to claim 1.
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