Multi-line interface for boards and substrates

Abstract

A device including a first board, a second board, and a coaxial cable coupled to the first board and the second board. The coaxial cable includes a multi-line coaxial cable configured to provide at least two electrical paths for a current between the first board and the second board. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptable and a second receptable. The first receptable is configured to couple to the first plug. The second receptable is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first current between the first board and the second board, and (ii) a second electrical path for a second current between the first board and the second board.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims priority to and the benefit of nonprovisional application Ser. No. 17 / 238,073, filed in the U.S. Patent and Trademark Office on April 22, 2021, the entire contents of which are incorporated herein by reference for all applicable purposes as if fully set forth below.

[0002] Various features relate to cables and interfaces for boards and substrates. [Background technology]

[0003] Electronic devices contain many electronic components that are near each other. These electronic components have signals traveling through them. These signals are sensitive to other signals and / or other electronic components. These signals can also leak. It is important to reduce signal leakage and isolate the signals from other nearby signals and / or electronic components. Summary of the Invention [Problem to be solved by the invention]

[0004] There is a continuing need to improve signal isolation and reduce signal leakage in electronic devices. [Means for solving the problem]

[0005] Various features relate to cables and interfaces for boards and substrates.

[0006] One example provides a device including a board and a multi-line interface coupled to the board. The multi-line interface includes a receptacle and a plug configured to be coupled to the receptacle. The receptacle includes a first receptacle metal component configured as part of a first electrical path for a first current and a second receptacle metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to be coupled to the first receptacle metal component, a second plug metal component configured to be coupled to the second receptacle metal component, and a plug metal frame configured as a shield around the first plug metal component and the second plug metal component.

[0007] Various features, nature and advantages may become apparent from the detailed description set forth below when read in conjunction with the drawings in which like reference characters identify correspondingly throughout. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 illustrates a multi-line coaxial interface with receptacles and plugs. [Diagram 2] FIG. 2 illustrates a multi-line coaxial interface with receptacles and plugs coupled to a board. [Diagram 3] FIG. 2 illustrates a multi-line coaxial interface with receptacles and plugs coupled to a board. [Figure 4] FIG. 2 shows a multi-line coaxial cable coupled to two boards. [Diagram 5] FIG. 2 is a cross-sectional view of a receptacle for a multi-line coaxial interface. [Figure 6] FIG. 1 is a cross-sectional view of a plug for a multi-line coaxial interface. [Figure 7] FIG. 2 is a cross-sectional view of a receptacle and a plug for a multi-line coaxial interface. [Figure 8]FIG. 1 illustrates a multi-line coaxial interface with receptacles and plugs. [Figure 9] FIG. 13 is a cross-sectional view of a receptacle for another multi-line coaxial interface. [Figure 10] FIG. 13 is a cross-sectional view of a plug for another multi-line coaxial interface. [Figure 11] FIG. 13 is a cross-sectional view of a receptacle and a plug for another multi-line coaxial interface. [Figure 12] FIG. 13 is a cross-sectional view of a receptacle and a plug for another multi-line coaxial interface. [Figure 13] FIG. 1 is a plan view of a portion of a board coupled to a plug for a multi-line coaxial interface. [Figure 14] FIG. 1 is a plan view of a portion of a board coupled to a plug for a multi-line coaxial interface. [Figure 15] 1 is a graph of the insulation performance of an interface for a cable. [Figure 16] 1 is a graph of the insulation performance of an interface for a multi-line coaxial cable. [Figure 17] FIG. 1 illustrates various electronic devices that may integrate the die, electronic circuits, integrated devices, integrated passive devices (IPDs), passive components, packages, and / or device packages described herein. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In the following description, specific details are given to enable a thorough understanding of various aspects of the disclosure. However, it will be understood by those skilled in the art that the aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams to avoid obscuring the aspects in unnecessary detail. In other instances, well-known circuits, structures, and techniques may not be shown in detail so as not to obscure aspects of the disclosure.

[0010] The present disclosure describes a device including a first board, a second board, and a coaxial cable coupled to the first board and the second board. The coaxial cable includes a multi-line coaxial cable configured to provide at least two electrical paths for a current between the first board and the second board. A first plug is coupled to the first board. A second plug is coupled to the second board. The coaxial cable includes a first receptable and a second receptable. The first receptable is configured to couple to the first plug. The second receptable is configured to couple to the second plug. The coaxial cable is configured to provide (i) a first electrical path for a first current between the first board and the second board, and (ii) a second electrical path for a second current between the first board and the second board. The first electrical path between the first board and the second board is fully shielded (e.g., 360 degrees shielded). The second electrical path between the first board and the second board is fully shielded. The first plug, the first receptacle, the coaxial cable, the second receptacle and the second plug are shielded. A better shielded electrical path reduces current and signal leakage, improves signal isolation and provides better quality and integrity of current and / or signals.

[0011] Example Multi-Line Interface FIG. 1 shows an interface 100 including a plug 102 and a receptacle 104. The interface 100 may be a multi-line coaxial interface configured to provide at least two electrical paths for at least two signals, each electrical path being shielded. The interface 100 may be a means for a multi-line interface. The receptacle 104 is configured to be coupled (e.g., mechanically coupled) to the plug 102 and vice versa. The interface 100 may be a connector (e.g., a multi-line coaxial connector). The plug 102 and the receptacle 104 may be separate components that may be coupled to each other and detachable from each other. The plug 102 may be a means for plug coupling. The receptacle 104 may be a means for receptacle coupling. When the receptive 104 and the plug 102 are coupled to one another, the receptive 104 and the plug 102 may allow at least two electrical currents to pass (in either direction) through the receptive 104 and the plug 102. As described further below, at least one interface 100 may be used to provide a fully shielded electrical path between two boards and / or two substrates for at least two electrical currents (e.g., electrical signals).

[0012] The plug 102 may be a multi-line coaxial plug. The plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a first region 123, a second support component 124, and a second region 125. The plug 102 is coupled to (or is part of) a cable 106. The cable 106 may be a multi-line coaxial cable. The cable 106 may include a flexible cable. The cable 106 includes a cover 160. As described further below, the plug 102 and / or the cable 106 may include other components.

[0013] The metal frame 120 may be a plug metal frame. The metal frame 120 may be configured to be coupled to ground (e.g., electrical ground). The metal frame 120 may be configured as a shield (e.g., an electromagnetic interference (EMI) shield). The first support component 122 and the second support component 124 may be surrounded by the metal frame 120. More specifically, the first support component 122 and the second support component 124 may be disposed in a chamber 121. The chamber 121 may be defined by the metal frame 120. The first support component 122 and / or the second support component 124 may include a non-metallic material (e.g., a plastic material). The first support component 122 and / or the second support component 124 may be flexible. The first support component 122 may have a rectangular cross-section (e.g., a square cross-section). The first region 123 may be defined by the first support component 122. The second support component 124 may have a rectangular cross-section (e.g., a square cross-section). The second region 125 may be defined by the second support component 124. As described further below, the plug 102 may include a first plug metal component and a second plug metal component.

[0014] The receptacle 104 may be a multi-line coaxial receptacle. The receptacle 104 includes a metal frame 140, a first metal component 142, a second metal component 144, a first region 143, and a second region 145. The first metal component 142 may be a first receptacle metal component. The second metal component 144 may be a second receptacle metal component. As described further below, the receptacle 104 may include other components. The receptacle 104 may be configured to be coupled to a board (e.g., a printed circuit board, a first board, a second board) or substrate. Different implementations may couple the receptacle 104 to the board or substrate differently. For example, solder may be used to couple the receptacle 104 to the board or substrate.

[0015] The metal frame 140 may be a receptive metal frame. The metal frame 140 may be configured as a shield (e.g., an electromagnetic interference (EMI) shield). The metal frame 140 may be configured to couple to a ground (e.g., an electrical ground). The first metal component 142 (e.g., a first receptive metal component) and the second metal component 144 (e.g., a second receptive metal component) may be surrounded by the metal frame 140. The first metal component 142 may be located in a first region 143. The second metal component 144 may be located in a second region 145. A portion of the metal frame 140 may separate the first region 143 and the second region 145. The same portion of the metal frame 140 may be located between the first metal component 142 and the second metal component 144. The metal frame 140 may be configured as a shield for (i) a first current passing through the first metal component 142 and (ii) a second current passing through the second metal component 144. The metal frame 140 may be configured to provide 360 ​​degree shielding for (i) the first current passing through the first metal component 142 and (ii) the second current passing through the second metal component 144. The metal frame 140 may be configured to insulate the current passing through the first metal component 142 from the current passing through the second metal component 144 and vice versa. The metal frame 140 may be configured to reduce current leakage through the first metal component 142 and / or the second metal component 144. The first current may include a first radio frequency (RF) signal and / or a first intermediate frequency (IF) signal. The second current may include a second radio frequency (RF) signal and / or a second intermediate frequency (IF) signal. Example signal frequencies include millimeter wave frequencies. Example signal frequencies include frequencies up to 50 GHz (e.g., 1 GHz to 50 GHz) that may be passed with improved isolation and reduced signal leakage. Improved signal isolation is further described below in at least Figures 15 and 16.

[0016] The plug 102 is configured to be coupled to the receptacle 104, and vice versa. When the plug 102 is coupled to the receptacle 104, the metal frame 140 may be disposed in the chamber 121 of the plug 102. The metal frame 140 may be coupled (e.g., mechanically coupled, electrically coupled) to the metal frame 120. The first metal component 142 may be disposed in the first region 123 of the plug 102. The second metal component 144 may be disposed in the second region 125 of the plug 102. Tension and pressure between the plug 102 and the receptacle 104 may be used to securely couple the plug 102 and the receptacle 104.

[0017] FIG. 2 shows a profile view of the receptacle coupled to the board in cross section BB. FIG. 2 also shows a profile view of the plug in cross section BB. As shown in FIG. 2, the receptacle 104 is coupled to a board 202 (e.g., a printed circuit board). Different implementations may couple the receptacle 104 to the board differently. For example, solder may be used to couple the receptacle 104 to the board 202. It should be noted that the receptacle 104 may be coupled to a substrate. The board 202 includes at least one dielectric layer 210, a plurality of interconnects 212, and a metal layer 214. The metal layer 214 may be disposed on at least one surface of the at least one dielectric layer 210. The metal layer 214 is disposed on an outer surface of the board 202. The receptacle 104 is coupled to a first surface (e.g., a top surface) of the board 202. The metal frame 140 is coupled to a metal layer 214 of the board 202. Different implementations may couple the metal frame 140 to the metal layer 214 differently. The first metal component 142 is coupled to a first plurality of interconnects from the plurality of interconnects 212 of the board 202. The first plurality of interconnects from the plurality of interconnects 212 of the board 202 may include interconnects located in at least one dielectric layer 210. Although not shown, the second metal component 144 may be coupled to a second plurality of interconnects from the plurality of interconnects 212 of the board 202. The second plurality of interconnects from the plurality of interconnects 212 of the board 202 may include interconnects located in at least one dielectric layer 210. The metal frame 140 and the metal layer 214 are configured to be coupled to ground (e.g., electrical ground). The metal frame 140 and the metal layer 214 are configured as a shield (eg, an electromagnetic interference (EMI) shield).

[0018] FIG. 2 also shows a plug coupled to a cable. As shown in FIG. 2, the plug 102 is coupled to the cable 106. In some implementations, the plug 102 may be considered a part of the cable 106. The plug 102 includes a metal frame 120 and a first metal component 222. The first metal component 222 (e.g., a first plug metal component) may be located in the first region 123 of the plug 102. Although not shown, the plug 102 may also include a second metal component (e.g., a second plug metal component). The cable 106 includes a cover 160, a dielectric layer 242, a first metal layer 245, and a metal layer 247. The cable 106 may also include a second metal layer (not shown). The metal frame 120 is coupled to the metal layer 247. The metal layer 247 may radially surround the first metal layer 245 and / or the second metal layer (not shown and configured as a second electrical path for the second current). The first metal component 222 is coupled to the first metal layer 245. A second metal component (not shown) of the plug 102 may be coupled to the second metal layer of the cable 106. The second metal component may be similar to the first metal component 222. The second metal component may be a second plug metal component. The second metal component may be located in the second region 125 of the plug 102. In some implementations, the second metal component (not shown in FIG. 2) may be represented as the second metal component 224 and / or the second metal component 824, which will be further described below in at least FIGS. 6 and 10.

[0019] FIG. 3 shows a profile view of a plug coupled to a receptacle in cross section B-B. As shown in FIG. 3, the plug 102 is coupled (e.g., mechanically coupled and electrically coupled) to the receptacle 104, and vice versa. Tension and / or pressure between the plug 102 and the receptacle 104 can securely connect them. The metal frame 120 of the plug 102 is coupled to the metal frame 140 of the receptacle 104. The first metal component 142 is coupled to the first metal component 222 of the plug 102. The first metal component 222 may be the first plug metal component. When the plug 102 is coupled to the receptacle 104, there may be at least two electrical paths extending from the cable 106, the plug 102, the receptacle 104, and the board 202. For example, a first electrical path may be defined by first metal layer 245, first metal component 222, first metal component 142, and / or a first plurality of interconnects from plurality of interconnects 212. A second electrical path (and any additional electrical paths) may be defined in a manner similar to the first electrical path. Moreover, the first electrical path and the second electrical path are completely shielded by metal layer 247, metal frame 120, metal frame 140, at least one interconnect from plurality of interconnects 212, and / or metal layer 214. For example, an interconnect from plurality of interconnects 212, which may include an interconnect located in board 202 (e.g., located in at least one dielectric layer 210), may be shielded by metal layer 214 of board 202.

[0020] FIG. 4 illustrates how a multi-line coaxial cable with a multi-line coaxial interface can be used to couple two boards. FIG. 4 illustrates a first board 202a, a second board 202b, and a cable 106. The first board 202a is coupled (e.g., mechanically coupled, electrically coupled) to the second board 202b through the cable 106. The cable 106 includes a first plug 102a and a second plug 102b. It should be noted that in some implementations, the first plug 102a and / or the second plug 102b can be considered as separate components from the cable 106. A first receptable 104a is coupled to the first board 202a. A second receptable 104b is coupled to the second board 202b.

[0021] A first electrical path between the first board 202a and the second board 202b may include (i) a first plurality of interconnects from the plurality of interconnects 212a of the first board 202a, (ii) a first metal component 142a from the first receptable 104a, (iii) a first metal component 222a from the first plug 102a, (iv) a first metal layer 245 from the cable 106, (v) a first metal component 222b from the second plug 102b, (vi) a first metal component 142b from the second receptable 104b, and (vii) a first plurality of interconnects from the plurality of interconnects 212b of the second board 202b. The first electrical path may be for a first current (e.g., a first electrical signal).

[0022] The second electrical path between the first board 202a and the second board 202b may include a path similar to that described for the first electrical path above. The second electrical path may be for a second current (e.g., a second electrical signal). The first electrical path (and any other electrical path) between the first board 202a and the second board 202b may be fully shielded (e.g., 360 degrees shielded). Full shielding provides better isolation between signals and reduces current and / or signal leakage, which may lead to better signal integrity and quality. Examples of how fully shielding one or more electrical paths may improve signal performance are further shown at least in FIG. 15 and FIG. 16 and described below.

[0023] Shielding of current traveling in the electrical path between the first board 202a and the second board 202b may be provided by (i) the metal layer 214a of the board 202a, (ii) the metal frame 140a of the first receptacle 104a, (iii) the metal frame 120a of the first plug 102a, (iv) the metal layer 247 of the cable 106, (v) the metal frame 120b of the second plug 102b, (vi) the metal frame 140b of the second receptacle 104b, and / or (vii) the metal layer 214b of the second board 202b. The metal layer 214a of the board 202a, the metal frame 140a of the first receptacle 104a, the metal frame 120a of the first plug 102a, the metal layer 247 of the cable 106, the metal frame 120b of the second plug 102b, the metal frame 140b of the second receptacle 104b, and / or the metal layer 214b of the second board 202b may be coupled to ground (e.g., electrical ground). It should be noted that instead of boards, a multi-line coaxial cable with the multi-line coaxial interface of FIG. 4 may be used to couple the two boards and / or a board-board combination.

[0024] FIG. 5 illustrates an exemplary AA cross-sectional view of the receptacle. As illustrated in FIG. 5, the receptacle 104 includes a metal frame 140, a first metal component 142, and a second metal component 144. The first metal component 142 is disposed in a first region 143 of the receptacle 104. The second metal component 144 is disposed in a second region 145 of the receptacle 104. The metal frame 140 is configured to provide 360-degree shielding (e.g., 360-degree EMI shielding) for currents traveling through the first metal component 142 and the second metal component 144. Moreover, a portion of the metal frame 140 helps to separate and insulate the currents traveling through the first metal component 142 from the currents traveling through the second metal component 144. The metal frame 140 is configured to be coupled to ground.

[0025] FIG. 6 shows an exemplary AA cross-sectional view of the plug. As shown in FIG. 6, the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, a first metal component 222 (e.g., a first plug metal component), and a second metal component 224 (e.g., a second plug metal component). The first support component 122 and the second support component 124 are disposed in the chamber 121. The first region 123 may be defined by the first support component 122. The second region 125 may be defined by the second support component 124. The first support component 122 and the second support component 124 may each be a flexible component. The first metal component 222 may be disposed in the first region 123. The second metal component 224 may be disposed in the second region 125.

[0026] FIG. 7 illustrates an exemplary AA cross-sectional view of the plug 102 and the receptacle 104 coupled to one another. As illustrated in FIG. 7, the receptacle 104 may be at least partially disposed within the plug 102. The receptacle 104 may be disposed within the chamber 121 of the plug 102. The first metal component 142 of the receptacle 104 may be disposed within the first region 123 of the plug 102. The first metal component 142 (e.g., the first receptacle metal component) may be coupled to the first metal component 222 (e.g., the first plug metal component). The second metal component 144 of the receptacle 104 may be disposed within the second region 125 of the plug 102. The second metal component 144 (e.g., the second receptacle metal component) may be coupled to the second metal component 224 (e.g., the second plug metal component). The metal frame 140 of the receptacle 104 may be in contact with the metal frame 120 of the plug 102. In some implementations, the combined cross-sectional size of the plug 102 and receptacle 104 may be approximately 3.6 mm (L) by 2.4 mm (W), or less.

[0027] It should be noted that the location, size and / or shape of the various components of the receptacle 104 and the plug 102 may vary in different implementations. Moreover, the various components may be coupled to each other in various ways and are not limited to those shown and described in this disclosure. For example, FIG. 7 shows that a side of the first metal component 142 is coupled to a side of the first metal component 222. However, the first metal component 142 may be coupled to the first metal component 222 through other portions. As mentioned above, the receptacle and / or plug may include more components than those mentioned above. FIGS. 8-10 show an exemplary receptacle and an exemplary plug with additional components. In some implementations, the receptacle and plug of FIGS. 8-10 provide a more robust and secure coupling.

[0028] FIG. 8 illustrates an interface 800 including a plug 102 and a receptacle 104. The interface 800 may be a multi-line coaxial interface configured to provide at least two electrical paths for at least two signals, where each electrical path is shielded (EMI shielded). The receptacle 104 is configured to be coupled (e.g., mechanically coupled, electrically coupled) to the plug 102, and vice versa. The interface 800 may be a means for a multi-line interface. The plug 102 may be a means for plug coupling. The receptacle 104 may be a means for receptacle coupling. The interface 800 is similar to the interface 100 of FIG. 1. However, the interface 800 may include a different configuration of components and / or additional components. As shown in Figure 8, the receptacle 104 includes a metal frame 140, a first metal component 142, a second metal component 144, at least one first support component 842, and at least one second support component 844. Figure 8 shows that the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, at least one first metal component 822, at least one first metal ground component 862, at least one second metal component 824, and at least one second metal ground component 864.

[0029] FIG. 9 illustrates an exemplary cross-sectional view of the receptacle 104 of FIG. 8 along line AA. As illustrated in FIG. 9, the receptacle 104 includes a metal frame 140, a first metal component 142, a second metal component 144, at least one first support component 842, and at least one second support component 844. The first metal component 142 and the first support component 842 are disposed in a first region 143 of the receptacle 104. The second metal component 144 and the second support component 844 are disposed in a second region 145 of the receptacle 104. The first support component 842 and / or the second support component 844 may include a non-metallic material (e.g., a plastic material). The first support component 842 and / or the second support component 844 may each be flexible. The first support component 842 is coupled to the first metal component 142. The second support component 844 may be coupled to the second metal component 144. As described further below, the at least one first support component 842 and / or the at least one second support component 844 may help provide a more secure coupling between the receptacle and the plug.

[0030] FIG. 10 illustrates an exemplary cross-sectional view of the plug 102 of FIG. 8 . As illustrated in FIG. 10 , the plug 102 includes a metal frame 120, a chamber 121, a first support component 122, a second support component 124, at least one first metal component 822, at least one first metal ground component 862, at least one second metal component 824, and at least one second metal ground component 864. The first metal component 822 may be a first plug metal component. The second metal component 824 may be a second plug metal component. In some implementations, the first metal component 822 may be represented as the first metal component 222. The metal frame 120 may include one or more protrusions 920. The protrusions may include ridges in the metal frame 120.

[0031] FIG. 11 illustrates an exemplary cross-sectional view of the plug 102 and the receptacle 104 of FIG. 8 coupled to one another. As illustrated in FIG. 11, the receptacle 104 may be at least partially disposed within the plug 102. The receptacle 104 may be disposed within the chamber 121 of the plug 102. The metal frame 120 of the plug 102 may be coupled to the metal frame 140 of the receptacle 104. For example, the protrusion 920 of the metal frame 120 may be coupled to the metal frame 140 of the receptacle 104. The first metal component 822 (e.g., the first plug metal component) of the plug 102 may be coupled to the first metal component 142 (e.g., the first receptacle metal component) of the receptacle 104. The first metal ground component 862 of the plug 102 may be coupled to the metal frame 140 of the receptacle 104. The second metal component 824 (e.g., second plug metal component) of the plug 102 may be coupled to the second metal component 144 (e.g., second receptacle metal component) of the receptacle 104. The second metal ground component 864 of the plug 102 may be coupled to the metal frame 140 of the receptacle 104. In some implementations, the first support component 122 may flex and / or bend to cause the various components to conform and / or mate with one another. Similarly, the second support component 124 may flex and / or bend to cause the various components to conform and / or mate with one another. In some implementations, the first support component 842 may be in contact with the first support component 122. In some implementations, the second support component 844 may be in contact with the second support component 124.

[0032] In some implementations, the presence of protrusions 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844) helps provide a safer and more secure coupling between the receptacle and the plug by providing the appropriate flexibility, tension, and pressure between the receptacle and the plug. It should be noted that the interface 800 may have a different number of protrusions 920, metal grounding components (e.g., 862, 864), metal components (e.g., 822, 824), and / or support components (e.g., 122, 124, 842, 844). The interface 800 may have the protrusions 920, the metal ground components (e.g., 862, 864), the metal components (e.g., 822, 824), and / or the support components (e.g., 122, 124, 842, 844) located in different locations. The interface 800 may have different shapes, configurations and / or designs for the metal frame 120, the metal frame 140, the protrusions 920, the metal ground components (e.g., 862, 864), the metal components (e.g., 822, 824), and / or the support components (e.g., 122, 124, 842, 844).

[0033] This disclosure describes an interface that allows two currents (e.g., electrical signals) to travel in a shielded electrical pathway. However, the interface is not limited to just two shielded electrical pathways. Some implementations may have more than two shielded electrical pathways.

[0034] FIG. 12 shows an interface 1200 including several receptacles (e.g., 104a, 104b, 104c, 104d) and several plugs (e.g., 102a, 102b, 102c, 102d) configured to provide eight shielded electrical paths. The interface 1200 (which may be a multi-line coaxial interface) is arranged in a 2×4 array for a total of eight shielded electrical paths. However, it should be noted that different implementations may have different numbers of receptacles and / or plugs and / or combinations thereof. For example, the array may be a 2×2 array or a 1×4 array. The interface 1200 may be one interface or several interfaces combined into one.

[0035] FIG. 13 shows a plan view of a portion of the board 202. The portion of the board 202 shown may be the portion through which the receptive 104 is coupled when the receptive 104 is coupled to the board 202. FIG. 13 shows the board 202 including a first interconnect 1342, a second interconnect 1344, a dielectric layer 210, and an interconnect 1312. The interconnect 1312 forms a rectangular shape in the board 202. The first interconnect 1342 may be configured to be coupled to a first metal component 142 of the receptive 104. The second interconnect 1344 may be configured to be coupled to a second metal component 144 of the receptive 104. The first interconnect 1342 and the second interconnect 1344 may be part of a plurality of interconnects 212. The interconnect 1312 may be configured to be coupled to a metal frame 140 of the receptacle 104. The interconnect 1312 may be part of the plurality of interconnects 212 and / or metal layer 214.

[0036] FIG. 14 shows a plan view of a portion of the board 202. FIG. 14 shows a different interconnect design for the board 202 than that shown in FIG. 13. FIG. 14 shows the board 202 including a first interconnect 1442, a second interconnect 1444, a dielectric layer 210, an interconnect 1412, and an interconnect 1414. The first interconnect 1442 may be configured to be coupled to a first metal component 142 of the receptable 104. The second interconnect 1444 may be configured to be coupled to a second metal component 144 of the receptable 104. The first interconnect 1442 and the second interconnect 1444 may be part of a plurality of interconnects 212. The interconnect 1412 and / or the interconnect 1414 may have a planar circular ring shape. The interconnects 1412 and / or the interconnects 1414 may be configured to be coupled to the metal frame 140 of the receptacle 104. The interconnects 1412 and / or the interconnects 1414 may be part of the multiple interconnects 212 and / or the metal layer 214. In some implementations, an encapsulation layer (e.g., mold, resin, epoxy resin) may be used instead of or in conjunction with the dielectric layer. The configurations shown in Figures 13 and 14 may be applicable to a substrate.

[0037] It should be noted that the present disclosure describes the receptacle 104 as being coupled to the board 202 and the plug 102 as being coupled to (or considered as part of) the cable 106. However, in some implementations, the plug 102 may be coupled to the board 202 and the receptacle 104 may be coupled to (or considered as part of) the cable 106. In some implementations, the cable 106 may (i) be coupled to (or have at) one end the receptacle 104 and (ii) be coupled to (or have at) the other end the plug 102. Such a cable 106 may be used to couple a board that includes a receptacle and another board that includes a plug. It should be noted that the use of the terms "metal component" and / or "metal ground component" in the present disclosure may refer to a component that includes a metallic material and / or an electrically conductive material. Metallic components may include other materials that are non-metallic. Similarly, the use of the term "metallic frame" in this disclosure may refer to components that include metallic and / or electrically conductive materials. Metallic frames may include other materials that are non-metallic. Coaxial interfaces and / or coaxial cables as used in this disclosure may be interfaces and / or cables that provide 360-degree shielding (e.g., 260-degree EMI shielding) across the cross section of the electrical path for electrical signals. It is noted that instead of a board, the multi-line interface described in this disclosure may be coupled to a substrate that includes at least one dielectric layer, multiple interconnects. Examples of substrates include embedded trace substrates (ETS), coreless substrates, and cored substrates. Different implementations may manufacture the substrate differently.

[0038] 15 and 16 show graphs illustrating example signal performance using different interfaces. FIG. 15 shows a graph 1500 illustrating the isolation performance of a non-multiline coaxial interface. The graph 1500 shows isolation performance for a reference profile 1510 and an interface profile 1520. As shown in FIG. 15, the isolation value for the interface profile 1520 may include a lower portion than the reference profile 1510. The reference profile 1510 may be a minimum specification requirement for the device. The higher the isolation (dB) value, the better. As shown in FIG. 15, the interface associated with the interface profile 1520 does not meet the requirements shown in the reference profile 1510.

[0039] FIG. 16 shows a graph 1600 illustrating an exemplary insulation performance of a multi-line coaxial interface (e.g., 100, 800). The graph 1600 illustrates insulation performance for a reference profile 1510 and a multi-line coaxial interface profile 1620. As shown in FIG. 16, the insulation values ​​for the multi-line coaxial interface profile 1620 are higher than the reference profile 1510 along all frequencies shown in the graph 1600. Additionally, the multi-line coaxial interface profile 1620 is higher than the interface profile 1520 of FIG. 15. As discussed above, higher insulation (dB) values ​​are better. FIG. 16 illustrates that the multi-line coaxial interface provides higher signal insulation (for the same frequency) than the non-multi-line interface of FIG. 15, resulting in improved signal quality and integrity for signals traveling in a multi-line coaxial cable between boards and / or substrates. The results shown for the multi-line coaxial interface of FIG. 16 may be applicable to signals having frequencies up to 50 GHz. For example, a multi-line interface (e.g., 100, 800, 1200) may provide at least 70 dB of isolation for all signals having frequencies up to 10 GHz traveling through the multi-line interface (e.g., between two boards coupled to the multi-line interface through a multi-line cable, between two substrates coupled to the multi-line interface through a multi-line cable).

[0040] Exemplary Electronic Devices FIG. 17 illustrates various electronic devices that may be integrated with any of the aforementioned devices, integrated devices, integrated circuit (IC) packages, integrated circuit (IC) devices, semiconductor devices, integrated circuits, dies, interposers, packages, package-on-package (PoP), system-in-package (SiP), or system-on-chip (SoC). For example, a mobile phone device 1702, a laptop computer device 1704, a fixed location terminal device 1706, a wearable device 1708, or an automotive vehicle 1710 may include a device 1700 as described herein. The device 1700 may be, for example, any of the devices and / or integrated circuit (IC) packages described herein. The devices 1702, 1704, 1706, and 1708 and the vehicle 1710 illustrated in FIG. 17 are merely examples. Other electronic devices may also feature device 1700, including, but not limited to, a group of devices (e.g., electronic devices) including mobile devices, handheld personal communications system (PCS) units, portable data units such as personal digital assistants, global positioning system (GPS) enabled devices, navigation devices, set-top boxes, music players, video players, entertainment units, fixed location data units such as meter reading equipment, communications devices, smartphones, tablet computers, computers, wearable devices (e.g., watches, glasses), Internet of Things (IoT) devices, servers, routers, electronic devices implemented in automated vehicles (e.g., autonomous vehicles), or any other device that stores or retrieves data or computer instructions, or any combination thereof.

[0041] One or more of the components, processes, features, and / or functions shown in FIGS. 1-14 and / or 17 may be rearranged and / or combined into a single component, process, feature, or function, or may be combined into several components, processes, or functions. Additional elements, components, processes, and / or functions may be further added without departing from this disclosure. It is also noted that FIGS. 1-14 and / or 17 and their corresponding description in this disclosure are not limited to dies and / or ICs. In some implementations, FIGS. 1-14 and / or 17 and their corresponding description may be used to fabricate, make, provide, and / or produce devices and / or integrated devices. In some implementations, the device may include a die, an integrated device, an integrated passive device (IPD), a die package, an integrated circuit (IC) device, a device package, an integrated circuit (IC) package, a wafer, a semiconductor device, a package-on-package (PoP) device, a heat dissipation device, and / or an interposer.

[0042] It should be noted that the figures in this disclosure may represent actual and / or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and / or transistors. In some examples, the figures may not be to scale. In some examples, for clarity, not all components and / or parts are shown. In some examples, the position, location, size and / or shape of various parts and / or components in the figures may be exemplary. In some implementations, various components and / or parts in the figures may be optional.

[0043] The word "exemplary" is used herein to mean "serving as an example, instance, or illustration." Any implementation or aspect described herein as "exemplary" should not necessarily be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term "aspect" does not require that all aspects of the disclosure include the described feature, advantage, or mode of operation. The term "coupled" is used herein to refer to a direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically contacts object B, and object B contacts object C, object A and object C may still be considered to be coupled to each other even if they do not directly physically contact each other. The term "electrically coupled" may mean that two objects are directly or indirectly coupled together such that an electric current (e.g., signal, power, ground) can travel between the two objects. Two objects that are electrically coupled may or may not have an electric current traveling between the two objects. The use of the terms "first", "second", "third" and "fourth" (and / or more than fourth) is arbitrary. Any of the components described may be a first component, a second component, a third component, or a fourth component. For example, a component referred to as a second component may be a first component, a second component, a third component, or a fourth component. The term "encapsulate" means that an object may partially encapsulate or completely encapsulate another object. The terms "top" and "bottom" are arbitrary. A component placed on top may be placed on top of a component placed on the bottom. A top component may be considered a bottom component and vice versa. As described in this disclosure, a first component placed "on" a second component may mean that the first component is placed above or below the second component, depending on how bottom or top is arbitrarily defined.In another example, a first component may be disposed over (e.g., above) a first surface of a second component, and a third component may be disposed over (e.g., below) a second surface of the second component, with the second surface facing the first surface. It is further noted that the term "over" as used in this application in the context of one component being disposed over another component may be used to mean a component on and / or within (e.g., on a surface of or embedded in) another component. Thus, for example, a first component over a second component may mean (1) that the first component is over but not in direct contact with the second component, (2) that the first component is on (e.g., on a surface of) the second component, and / or (3) that the first component is within (e.g., embedded in) the second component. A first component that is located "in" a second component may be located partially within the second component or may be located completely within the second component. As used in this disclosure, the term "about 'the value of X'" or "approximately the value of X" means within 10 percent of the 'value of X'. For example, a value of about 1 or approximately 1 means a value in the range of 0.9 to 1.1.

[0044] In some implementations, an interconnect is an element or component of a device or package that enables or facilitates an electrical connection between two points, elements, and / or components. In some implementations, an interconnect may include a trace, a via, a pad, a pillar, a metallization layer, a redistribution layer, and / or an under bump metallization (UBM) layer / interconnect. In some implementations, an interconnect may include a conductive material that may be configured to provide an electrical path for a signal (e.g., a data signal), ground, and / or power. An interconnect may include two or more elements or components. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Various implementations may use different processes and / or sequences to form an interconnect. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating process, and / or a plating process may be used to form the interconnects.

[0045] It should also be noted that various disclosures contained herein may be described as a process, which is depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe operations as a sequential process, many of the operations may be performed in parallel or simultaneously. Additionally, the order of operations may be rearranged. A process is terminated when its operations are completed.

[0046] Below, further examples are described to facilitate understanding of the present disclosure.

[0047] Aspect 1: A device comprising a board and a multi-line interface coupled to the board. The multi-line interface includes a receptacle and a plug configured to be coupled to the receptacle. The receptacle includes a first receptacle metal component configured as part of a first electrical path for a first current and a second receptacle metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to be coupled to the first receptacle metal component, a second plug metal component configured to be coupled to the second receptacle metal component, and a plug metal frame configured as a shield around the first plug metal component and the second plug metal component.

[0048] Aspect 2: The device of aspect 1, wherein the multi-line interface includes a multi-line coaxial interface.

[0049] Aspect 3: The device of aspects 1 to 2, wherein the multi-line interface is configured to provide a first electrical path for a first current through the receptacle and the plug, and the multi-line interface is configured to provide a second electrical path for a second current through the receptacle and the plug.

[0050] Aspect 4: The device of aspects 1 to 3, wherein the receptacle further comprises a receptacle metal frame configured to be coupled to a plug metal frame, the plug metal frame configured to surround the receptacle metal frame, and the plug metal frame configured to be coupled to ground.

[0051] Embodiment 5: The device of embodiment 4, wherein the plug further includes a first support component surrounding the first plug metal component and a second support component surrounding the second plug metal component.

[0052] Aspect 6: The device of Aspect 5, wherein the plug further includes a first metallic grounding component configured to be coupled to the receptive metal frame, the first metallic grounding component configured to be located between the first support component and the receptive metal frame, and a second metallic grounding component configured to be coupled to the receptive metal frame, the second metallic grounding component configured to be located between the second support component and the receptive metal frame.

[0053] Aspect 7: The device of aspects 1 to 6, wherein the plug is coupled to the board.

[0054] Embodiment 8: The device of embodiments 1 to 6, wherein the receptacle is coupled to a board.

[0055] Aspect 9: The device of aspects 1 to 8, further comprising: a cable coupled to the multi-line interface; a second multi-line interface coupled to the cable, the second multi-line interface having a second receptable and a second plug, the second plug being configured to be coupled to the second receptable; and a second board coupled to the second multi-line interface.

[0056] Example 10: The device of example 9, wherein the multi-line interface and the second multi-line interface are part of a cable.

[0057] Example 11: The device of Example 9, wherein the second receptable comprises a third receptable metal component configured as part of a first electrical path for a first current, a fourth receptable metal component configured as part of a second electrical path for a second current, and a second receptable metal frame configured as a shield around the third receptable metal component and the fourth receptable metal component of the second receptable.

[0058] Example 12: The device of Example 11, wherein the second plug comprises a third plug metal component configured to be coupled to the third receptive metal component, a fourth plug metal component configured to be coupled to the fourth receptive metal component, and a second plug metal frame configured as a shield around the third plug metal component and the fourth plug metal component.

[0059] Example 13: The device of example 12, wherein the receptive is coupled to the board and the second receptive is coupled to a second board.

[0060] Example 14: The device of example 12, wherein the plug is coupled to the board and the second plug is coupled to a second board.

[0061] Example 15: The device of example 12, wherein the receptacle is coupled to the board and the second plug is coupled to a second board.

[0062] Embodiment 16: The device of embodiments 1 to 15, wherein the plug metal frame includes at least one protrusion.

[0063] Example 17: The device of Examples 1 to 16, wherein the first current and / or the second current comprises a millimeter wave signal, a radio frequency (RF) signal, and / or an intermediate frequency (IF) signal.

[0064] Aspect 18: The device of aspects 1 to 17, wherein the board comprises at least one dielectric layer, a plurality of interconnects configured to be coupled to a first receptive metal component and a second receptive metal component, and a metal layer disposed on a surface of the at least one dielectric layer, the metal layer configured to be coupled to a plug metal frame, and the metal layer configured to be part of a shield.

[0065] Example 19: The device of example 18, wherein the first electrical path includes a first plurality of interconnects from the plurality of interconnects located in the at least one dielectric layer, and the second electrical path includes a second plurality of interconnects from the plurality of interconnects located in the at least one dielectric layer.

[0066] Aspect 20: The device of aspects 1 to 19, wherein the device includes an electronic device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in an automotive vehicle.

[0067] Aspect 21: An apparatus comprising a board and a means for multi-line interfacing. The means for multi-line interfacing comprises a means for receptive coupling and a means for plug coupling. The means for plug coupling is configured to be coupled to the means for receptive coupling. The means for multi-line interfacing is configured to (i) provide a first electrical path for a first current and (ii) provide a second electrical path for a second current. The means for plug coupling and the means for receptive coupling are configured to provide electromagnetic interference (EMI) shielding for the first electrical path for the first current and for the second electrical path for the second current.

[0068] Aspect 22: An apparatus comprising a substrate and a means for a multi-line interface. The means for a multi-line interface comprises a means for a receptive coupling and a means for a plug coupling. The means for a plug coupling is configured to be coupled to the means for a receptive coupling. The means for a multi-line interface is configured to (i) provide a first electrical path for a first current and (ii) provide a second electrical path for a second current. The means for a plug coupling and the means for a receptive coupling are configured to provide electromagnetic interference (EMI) shielding for the first electrical path for the first current and for the second electrical path for the second current.

[0069] Aspect 23: A device comprising a substrate and a multi-line interface coupled to the substrate. The multi-line interface includes a receptacle and a plug configured to be coupled to the receptacle. The receptacle includes a first receptacle metal component configured as part of a first electrical path for a first current and a second receptacle metal component configured as part of a second electrical path for a second current. The plug includes a first plug metal component configured to be coupled to the first receptacle metal component, a second plug metal component configured to be coupled to the second receptacle metal component, and a plug metal frame configured as a shield around the first plug metal component and the second plug metal component.

[0070] Various features of the present disclosure described herein may be implemented in various systems without departing from the present disclosure. It should be noted that the above aspects of the present disclosure are merely examples and should not be construed as limiting the present disclosure. The description of the aspects of the present disclosure is intended to be illustrative and is not intended to limit the scope of the claims. Thus, the present teachings can be easily applied to other types of devices, and many alternatives, modifications, and variations will be apparent to those skilled in the art. [Explanation of symbols]

[0071] 100 Interfaces 102 Plug 102a 1st plug 102b 2nd plug 102c plug 102d Plug 104 Receptable 104a 1st Receptacle 104b Second Receptacle 104c Receptable 104d Receptable 106 Cable 120 Metal Frame 120a metal frame 120b metal frame 121 Chamber 122 first support component 123 First Area 124 Second Support Component 125 Second Area 140 Metal Frame 140a metal frame 140b metal frame 142 First Metal Component 142a First metal component 142b First metal component 143 First Area 144 Second Metal Component 145 Second Area 160 Cover 202 Board 202a First Board 202b Second Board 210 Dielectric layer 212 Interconnection 212a Interconnection 212b Interconnect 214 Metal layer 214a metal layer 214b Metal layer 222 First Metal Component 222a First metal component 222b First metal component 224 Second Metal Component 242 Dielectric layer 245 First Metal Layer 247 Metal layer 800 Interface 822 First Metal Component 824 Second Metal Component 842 First Support Component 844 Second Support Component 862 Metallic Grounding Components 864 Metallic Grounding Components 920 Protrusion 1200 Interface 1312 Interconnection 1342 First Interconnect 1344 Second Interconnect 1412 Interconnection 1414 Interconnection 1442 First Interconnect 1444 Second Interconnect 1700 devices 1702 Mobile phone device, device 1704 Laptop computer device, device 1706 Fixed location terminal device, device 1708 Wearable devices, devices 1710 Motor vehicles, vehicles

Claims

1. A device having a multi-line interface, the multi-line interface comprising: (i) is receptive, a first receptive metallic component configured as part of a first electrical path for a first electrical current; and a receptacle comprising a second receptacle metal component configured as part of a second electrical path for a second current; (ii) a plug configured to be coupled to the receptacle, a first plug metal component configured to be coupled to the first receptacle metal component; a second plug metal component configured to be coupled to the second receptacle metal component; and a plug comprising a plug metal frame configured as a shield around the first plug metal component and the second plug metal component; a board coupled to the multi-line interface, the board comprising: at least one dielectric layer; a plurality of interconnects configured to be coupled to the first receptive metal component and the second receptive metal component; a metal layer disposed on a surface of the at least one dielectric layer; the metal layer is configured to be coupled to the plug metal frame; The device, wherein the metal layer is configured to be part of the shield.

2. the multi-line interface comprises a multi-line coaxial interface; or the multi-line interface is configured to provide the first electrical path for the first current through the receptacle and the plug; The device of claim 1 , wherein the multi-line interface is configured to provide the second electrical path for the second current through the receptacle and the plug.

3. the receptacle further comprises a receptacle metal frame configured to be coupled to the plug metal frame; The plug metal frame is configured to surround the receptacle metal frame, The device of claim 1 , wherein the plug metal frame is configured to be coupled to ground.

4. The plug is a first support component surrounding the first plug metal component; The device of claim 3 , further comprising a second support component surrounding the second plug metal component.

5. The plug is a first metal grounding component configured to be coupled to the receptive metal frame, the first metal grounding component configured to be installed between the first support component and the receptive metal frame; 5. The device of claim 4, further comprising: a second metal grounding component configured to be coupled to the receptacle metal frame, the second metal grounding component configured to be installed between the second support component and the receptacle metal frame.

6. the plug is coupled to the board; or The device of claim 1 , wherein the receptacle is coupled to the board.

7. a cable coupled to the multi-line interface; a second multi-line interface coupled to the cable, the second multi-line interface comprising a second receptacle and a second plug, the second plug configured to be coupled to the second receptacle; and and a second board coupled to the second multi-line interface.

8. The device of claim 7 , wherein the multi-line interface and the second multi-line interface are part of the cable.

9. The second receptacle comprises: a third receptive metallic component configured as part of the first electrical path for the first electrical current; and a fourth receptive metallic component configured as part of the second electrical path for the second electrical current; and 8. The device of claim 7, comprising a second receptacle metal frame configured as a shield around the third receptacle metal component and the fourth receptacle metal component of the second receptacle.

10. The second plug comprises: a third plug metal component configured to be coupled to the third receptacle metal component; a fourth plug metal component configured to be coupled to the fourth receptacle metal component; 10. The device of claim 9, further comprising: a second plug metal frame configured as a shield around the third plug metal component and the fourth plug metal component.

11. The receptacle is coupled to the board, The device of claim 10 , wherein the second receptacle is coupled to the second board.

12. the plug is coupled to the board; the second plug is coupled to the second board; or The receptacle is coupled to the board, The device of claim 10 , wherein the second plug is coupled to the second board.

13. the plug metal frame includes at least one protrusion; or The device of claim 1 , wherein the first current and / or the second current comprises a millimeter-wave signal.

14. the first electrical path includes a first plurality of interconnects from the plurality of interconnects disposed in the at least one dielectric layer; The device of claim 1 , wherein the second electrical path includes a second plurality of interconnects from the plurality of interconnects located in the at least one dielectric layer.

15. 10. The device of claim 1, wherein the device comprises an electronic device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smart phone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an Internet of Things (IoT) device, and a device in a motor vehicle.

Images