Suction mechanism, suction unit, mounting device, and module manufacturing method

Abstract

To provide a suction mechanism, a suction unit, a mounting device, and a module manufacturing method that can obtain sufficient suction force even when adsorbing a workpiece such as a semiconductor chip that has a non-contact area, and can efficiently transmit joining energy to the workpiece.SOLUTION: A joining collet 23 that has an adsorption mechanism that adsorbs a semiconductor chip 120 which is a workpiece to be adsorbed, by suction includes a non-contact portion that does not contact the semiconductor chip 120 on the side facing the semiconductor chip 120, and a contact portion 101 that protrudes from the non-contact portion and has a contact surface 102 that contacts the semiconductor chip 120. The contact portion 101 has a suction hole that sucks the semiconductor chip 120.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a suction mechanism for suctioning a workpiece such as a semiconductor chip, a suction unit, a mounting device, and a method for manufacturing a module. [Background technology]

[0002] There are various types of electronic devices, but many of them include a semiconductor package in which a semiconductor chip is mounted on a lead frame, and a circuit package in which an electronic component such as a semiconductor chip is mounted on a circuit board. Semiconductor packages and circuit packages are manufactured, for example, by the following procedure. First, a large number of integrated circuits are formed on a semiconductor wafer, and the semiconductor wafer is cut in a dicing process to divide it into semiconductor chips (dies). Then, in a bonding process, electronic components such as semiconductor chips are bonded to a lead frame or a circuit board. For a semiconductor chip to be bonded to a lead frame or a circuit board, it is necessary to electrically connect the pads of the lead frame or the circuit board and the pads of the semiconductor chip with a conductor such as gold or aluminum. As a means for achieving this, flip chip bonding is known, in which gold protruding electrodes (bumps) are provided on the pads of the semiconductor chip, the semiconductor chip is turned over to bring the protruding electrodes into contact with the pads of the circuit board, and the semiconductor chip and the circuit board are electrically connected.

[0003] In flip chip bonding, mechanical energy from a load, thermal energy from heating, and vibrational energy from ultrasonic vibrations are applied to the junction between the protruding electrodes of a semiconductor chip and the pads of a circuit board.

[0004] When applying each energy to the joining point, it is required that the energy is transmitted stably and efficiently at the contact surface between the joining collet that holds the semiconductor chip and the semiconductor chip. In recent years, semiconductor chips have become thinner, and therefore are more likely to crack when joining to a circuit board, and it is required to join without applying excessive energy. Furthermore, depending on the type of semiconductor chip, a non-contact area that must not come into contact with the joining collet is provided to protect the semiconductor chip. In this case, it is required to hold the semiconductor chip while avoiding the non-contact area and transmit the energy required for joining efficiently to the joining point.

[0005] Patent Document 1 discloses a suction device that suctions a semiconductor chip having a non-contact area. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Application Publication No. 7-66268 Summary of the Invention [Problem to be solved by the invention]

[0007] However, in order to transport the semiconductor chip while suctioning and holding it, and to efficiently transmit bonding energy to the semiconductor chip during bonding, the bonding collet must be able to suction the semiconductor chip with sufficient suction force. If sufficient suction force is not obtained, the semiconductor chip will shift in position relative to the bonding collet during transportation or bonding, making it impossible to perform high-precision bonding.

[0008] In the suction device described in Patent Document 1, a recess is provided in the collet to form an air intake hole in order to prevent contact between the non-contact area of ​​the semiconductor chip and the collet, but depending on the position of the non-contact area, sufficient suction force may not be obtained. [Means for solving the problem]

[0009] An aspect for solving the above problem is an suction mechanism that adsorbs a workpiece by suction, the suction mechanism having, on the side facing the workpiece, a non-contact portion that does not contact the workpiece, and a contact portion that protrudes from the non-contact portion that contacts the workpiece, and the contact portion has a suction hole that adsorbs the workpiece. Effect of the Invention

[0010] According to the present disclosure, it is possible to provide a suction mechanism that can obtain sufficient suction force even when suctioning a workpiece such as a semiconductor chip having a non-contact area, and can efficiently transmit joining energy to the workpiece. [Brief description of the drawings]

[0011] [Figure 1] Schematic diagram of a flip chip bonding apparatus. [Diagram 2] FIG. 4 is a side view of a semiconductor chip removal portion and a semiconductor chip mounting portion. [Diagram 3] Schematic diagram of a joining collet. [Figure 4] Schematic diagram of a semiconductor chip to be attracted to a joining collet. [Diagram 5] Schematic diagram of the joining collet suction-holding a semiconductor chip. [Figure 6] 6(a) is a schematic diagram showing the overall configuration of a liquid ejection head, and (b) is a cross-sectional view taken along line AA in FIG. [Figure 7] FIG. 2 is a perspective view showing a support member that constitutes the liquid ejection head. [Figure 8] 1A is a plan view showing a recording element substrate, which is an example of a semiconductor chip, and FIG. 1B is a plan view showing a bottom surface opposite to the top surface, the bottom surface being a side where ejection ports are formed. [Figure 9] 1A is a plan view showing a flexible wiring board as viewed from the side to be bonded to a recording element substrate, and FIG. 1B is a plan view showing a flexible wiring board as viewed from the side opposite to the side to be bonded to a recording element substrate. [Figure 10]1A and 1B are schematic diagrams illustrating a state in which a joining collet for manufacturing a discharge module holds a recording element substrate, (a) being a front view and (b) being a side view. [Figure 11] FIG. 11 is a plan view of a joining collet in the second embodiment. [Figure 12] 11A to 11C are perspective views showing a manufacturing method of the discharge module. [Figure 13] 10A to 10C are side views showing a manufacturing method of the ejection module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] [Embodiment 1] FIG. 1 is a schematic perspective view for explaining a flip chip bonding apparatus which is a mounting apparatus according to an embodiment.

[0013] The flip chip bonding device 100 includes a stand 80, a substrate supply section 50 arranged on the stand 80 for supplying a substrate 110, a substrate transport section 60 for removing and transporting a substrate from the substrate supply section 50, and a substrate storage section 70 for storing a substrate on which a semiconductor chip 120 is mounted. The flip chip bonding device 100 also includes a semiconductor chip supply section 40 arranged on the stand 80 for supplying a semiconductor chip 120 as a workpiece, a semiconductor chip placement stage 35, and a semiconductor chip removal section 30 for placing the semiconductor chip 120 on the semiconductor chip placement stage 35 from the semiconductor chip supply section 40. The flip chip bonding device 10 also includes a semiconductor chip mounting section 10 for removing the semiconductor chip 120 from the semiconductor chip placement stage 35 and mounting the semiconductor chip 120 on the substrate 110. At the tip of the semiconductor chip mounting section 10, a bonding unit 20 is arranged for applying bonding energy to the semiconductor chip 120 to bond it to the substrate 110. The bonding energy here refers to mechanical energy provided by a load, thermal energy provided by heating, vibration energy provided by ultrasonic vibration, or the like. The semiconductor chip supply unit 40 may place the semiconductor chips 120 in the state of a diced wafer, or may transfer the semiconductor chips 120 to a tray for setting and place them thereon.

[0014] Here, the coordinate axes and directions of the X-axis, Y-axis, and Z-axis of the XYZ coordinate system, which is an orthogonal coordinate system used in the following description, are defined. First, the X-axis is taken along the transport direction of the substrate transport unit 60 transported horizontally. The axis perpendicular to the stand 80, i.e., the axis along the vertical direction, is taken as the Z-axis, and the axis perpendicular to the X-axis and Z-axis is taken as the Y-axis. In the XYZ coordinate system in which the coordinate axes are defined in this way, the direction along the X-axis is taken as the X-direction. Of the X-direction, the same direction as the transport direction of the substrate transport unit 60, i.e., the direction from the substrate supply unit 50 toward the substrate storage unit 70, is taken as the +X-direction, and the opposite direction to the +X-direction is taken as the -X-direction. Also, the direction along the Y-axis is taken as the Y-direction. Of the Y-direction, the direction from the right side toward the left side of the +X-direction, i.e., the direction from the semiconductor chip supply unit 40 toward the substrate transport unit 60, is taken as the +Y-direction, and the opposite direction to the +Y-direction is taken as the -Y-direction. Also, the direction along the Z-axis is taken as the Z-direction. Of the Z directions, the vertical upward direction is defined as the +Z direction, and the vertical downward direction is defined as the -Z direction.

[0015] Substrate 110 supplied from substrate supply unit 50 is transported to a substrate mounting position by substrate transport unit 60. Semiconductor chip mounting unit 10 holding semiconductor chip 120 mounts semiconductor chip 120 on substrate 110 positioned at the substrate mounting position by bonding unit 20. Substrate 110 with semiconductor chip 120 mounted thereon is transported by substrate transport unit 60 to substrate storage unit 70 and sequentially stored.

[0016] The substrate transport unit 60 may be equipped with a heating unit such as a heater in order to provide the thermal energy required for bonding to the substrate 110. The heating unit makes it possible to heat the substrate 110 while the substrate transport unit 60 is transporting the substrate 110.

[0017] FIG. 2 is a side view of the semiconductor chip removal portion 30 and the semiconductor chip mounting portion 10 as viewed from the -X direction to the +X direction.

[0018] The semiconductor chip removal unit 30 has a removal unit Y-direction moving mechanism 31, a removal unit Z-direction moving mechanism 32, and a removal collet 33. The removal collet 33 has a suction mechanism (such as a vacuum pump or a control valve) not shown, and serves to adsorb and hold the semiconductor chip 120. The removal collet 33 is disposed at the tip of the removal unit Z-direction moving mechanism 32, and can be moved in the +Z direction and the -Z direction by the removal unit Z-direction moving mechanism 32. In addition, the removal unit Z-direction moving mechanism 32 is connected to the removal unit Y-direction moving mechanism 31, and can be moved in the +Y direction and the -Y direction by the removal unit Y-direction moving mechanism 31. In other words, the removal collet 33 can be moved in the Z direction and the Y direction.

[0019] The take-out collet 33 sucks and holds the semiconductor chip 120 placed on the semiconductor chip supply unit 40, and transports it to the semiconductor chip placement stand 35. The semiconductor chip placement stand 35 preferably has a mechanism for turning over the semiconductor chip 120 taken out from the semiconductor chip supply unit 40. In this case, the semiconductor chip 120 can be turned over from the position in which it is placed on the semiconductor chip take-out unit 30.

[0020] The semiconductor chip mounting unit 10 has a mounting unit Y-direction moving mechanism 11, a mounting unit Z-direction moving mechanism 12, and a joining unit 20 which is an example of an adsorption unit. The joining unit 20 has a vibrator 21, a vibration horn 22, and a joining collet 23 which is an example of an adsorption mechanism. The vibrator 21 uses a piezoelectric material which undergoes mechanical deformation when a voltage is applied, and generates high-frequency vibrations when a voltage is applied from a high-frequency power source. The vibration horn 22 is a member which amplifies the mechanical vibrations generated by the vibrator 21, and is attached to the vibrator 21. The joining collet 23 is attached to the vibration horn 22, and transmits the vibration energy amplified by the vibration horn 22 to the semiconductor chip 120. The joining collet 23 is disposed at the tip of the mounting unit Z-direction moving mechanism 12, and can be moved in the +Z direction and the -Z direction by the mounting unit Z-direction moving mechanism 12. In addition, the mounting unit Z-direction moving mechanism 12 is connected to the mounting unit Y-direction moving mechanism 11, and can be moved in the +Y direction and the -Y direction by the mounting unit Y-direction moving mechanism 11. That is, the joining collet 23 is movable in the Z direction and the Y direction.

[0021] The joining collet 23 can be moved in the Z direction by the mounting part Z direction moving mechanism 12, and can transmit the vibration generated by the vibrator 21 to the semiconductor chip 120 in the -Z direction (mechanical energy) via the vibration horn 22. In addition, by providing a heating part (not shown) on the joining collet 23, it is also possible to transmit thermal energy to the semiconductor chip 120. As the heating part, various means can be applied, such as a means for attaching a heat source such as a cartridge heater or a ceramic heater in contact with the joining collet 23, a means for heating the joining collet 23 by radiant heat of a heater, or a means for heating the joining collet 23 by blowing hot air onto it.

[0022] The joining collet 23 has a suction mechanism (not shown) and serves to adsorb and hold the semiconductor chip 120. The joining collet 23 adsorbs and holds the semiconductor chip 120 placed on the semiconductor chip placement stand 35, and moves it to the semiconductor chip mounting position. After aligning with the substrate at the semiconductor chip mounting position, the semiconductor chip 120 is mounted on the substrate 110 by transmitting mechanical energy, vibration energy, and thermal energy.

[0023] Fig. 3 is a schematic diagram of the joining collet 23. Fig. 3(a) is a side view of the joining collet 23 seen from the -Y direction, Fig. 3(b) is a plan view of the joining collet 23 seen from the -Z direction, and Fig. 3(c) is a cross-sectional view taken along line AA in Fig. 3(b). Fig. 4 is a schematic diagram of the semiconductor chip 120 attracted to the joining collet 23. Fig. 5 is a schematic diagram of the joining collet 23 attracting and holding the semiconductor chip 120.

[0024] The joining collet 23 is attached to the vibration horn 22 via an attachment portion 105 provided on the base portion 104. A contact portion 101 that comes into contact with the semiconductor chip 120 when the semiconductor chip 120 is sucked and held is provided on a surface 1042, which is the surface opposite to a surface 1041 on which the attachment portion 105 of the joining collet 23 is provided. On the surface 1042, the contact portion 101 protrudes by a predetermined length H in the -Z direction from a non-contact portion 107 that does not come into contact with the semiconductor chip 120. In FIG. 3, the contact portion is arranged on the surface 1042 with a first contact portion 101A and a second contact portion 101B spaced apart by a predetermined distance in the X direction.

[0025] A suction hole 103A for suction-holding the semiconductor chip 120 is provided on a contact surface 102A of the first contact portion 101A with the semiconductor chip 120. A suction hole 103B for suction-holding the semiconductor chip 120 is provided on a contact surface 102B of the second contact portion 101B with the semiconductor chip 120. The suction hole 103A and the suction hole 103B are connected to a suction path 106 provided inside the joining collet 23 and the above-mentioned suction mechanism (not shown), and the semiconductor chip 120 is sucked and sucked by the flow of gas such as compressed air or nitrogen. Both of the contact surfaces 102A and 102B come into contact with a contact area 122 of the semiconductor chip 120 described later, but the contact surface 102 is provided to be smaller than the contact area 122. When viewed in a planar view from the -Z direction, suction holes 103A and 103B are provided on the inside of contact surfaces 102A and 102B, respectively, and their entire outer periphery is surrounded by contact surfaces 102A and 102B, respectively, resulting in a structure that is less likely to cause leaks when suction is performed.

[0026] 4 is a schematic diagram of the semiconductor chip 120. The semiconductor chip 120 has a joint 123 on one side for joining to the substrate 110. The joint 123 is a member for electrically connecting to the substrate 110. The joint 123 can be formed, for example, by forming a surface of an aluminum or copper wiring with gold plating, on which a protruding electrode 124 can be formed. The joint 123 is disposed at both ends in the X direction along the short sides of the rectangular semiconductor chip 120.

[0027] A contact-prohibited area 121 and a contact area 122 are provided on the surface of the semiconductor chip 120 opposite to the surface on which the bonding portion 123 is provided. The contact areas 122 are provided so as to be located on the rear side of the bonding portion 123, and are arranged at both ends in the X direction along the short side of the semiconductor chip 120 in FIG.

[0028] 5 is a schematic diagram of the joining collet 23 suction-holding the semiconductor chip 120. The joining collet 23 has two contact parts 101A and 101B to correspond to the two contact areas 122 of the semiconductor chip 120. That is, the number of contact parts of the joining collet 23 can be set to correspond to the number of contact areas 122 of the semiconductor chip, which is the workpiece to be sucked. The contact surface 102 of the joining collet 23 is provided so as to come into contact with the semiconductor chip 120 within the contact area 122 of the semiconductor chip 120, and is arranged so as not to come into contact with the contact surface 102 in the contact area 122 of the semiconductor chip 120.

[0029] The suction hole 103 is surrounded by the contact surface 102 all around its outer edge, and the position of the suction hole 103 is determined so that the contact surface 102 is located at the rear side of the protruding electrode 124 provided on the joint portion 123. That is, the semiconductor chip 120 and the joining collet 23 come into contact with each other at the rear side of the protruding electrode 124, which is the joining point between the semiconductor chip 120 and the substrate 110. Therefore, when the semiconductor chip 120 and the substrate 110 are joined, the thrust in the -Z direction of the mounting portion Z direction moving mechanism 12 is transmitted to the joining point through the joining collet 23, and the thrust acts directly on the joining point. As with the mechanical energy due to thrust, the thermal energy and vibration energy also come into contact with the contact surface 102 and the semiconductor chip 120 at the rear side of the protruding electrode 124, which is the joining point, and energy acts directly on the joining point.

[0030] A collet, which is an example of the suction mechanism of the present disclosure, has a contact portion that protrudes from a non-contact portion and has a suction hole. When this collet is used to bring the contact portion of the collet into contact with a contact area of ​​a semiconductor chip having a non-contact area and suck the chip, a sufficient suction force can be obtained. In addition, because the collet has a sufficient suction force, misalignment is unlikely to occur and bonding energy can be efficiently transmitted to the semiconductor chip.

[0031] The area ratio of the suction holes 103 to the contact surface 102 when viewed in a plan view from the -Z direction is preferably 50% or more, and more preferably 70% or more. The larger the suction holes 103, the greater the suction force, but the upper limit is 80% or less because there is a risk that the contact area between the contact surface 102 and the workpiece will be too small. For example, in the case where the contact surface 102 of the collet has a rectangular shape with dimensions X = 2 mm and Y = 4 mm in Figs. 3 to 5, the area ratio of the suction holes 103 to the contact surface 102 is approximately 50% by setting the dimensions of the suction holes 103 to X = 1.4 mm and Y = 2.8 mm. In this case, the dimensions of the suction holes remaining on the contact surface 102 other than the suction holes are 0.3 mm x 2 in the X direction and 0.6 mm x 2 in the Y direction.

[0032] The contact portion 101 protrudes in the -Z direction from the non-contact portion 107 that does not contact the semiconductor chip 120 by a predetermined length H, and this H is preferably 0.1 mm or less. If it is 0.1 mm or less, the path of the suction path 106 that penetrates the contact portion 101 can be shortened, so that the loss of the suction force generated by the suction mechanism (not shown) can be reduced. This improves the force with which the joining collet 23 suctions and holds the semiconductor chip 120.

[0033] Moreover, it is preferable that the difference between the length H in the protruding direction of the first contact portion 101A and the length H in the protruding direction of the second contact portion 101B is 0.01 mm or less. By making the difference 0.01 mm or less, it is possible to improve the force with which the joining collet 23 attracts and holds the semiconductor chip 120 when two or more contact portions are provided.

[0034] [Embodiment 2] In the second embodiment, a method for manufacturing a discharge module of a liquid discharge head, which is an example of a module, will be described. First, the overall configuration of the liquid discharge head will be described with reference to Fig. 6. Fig. 6(a) is a schematic diagram showing the overall configuration of the liquid discharge head. Fig. 6(b) is a cross-sectional view taken along line AA in Fig. 6(a). Fig. 7 is a perspective view showing a support member constituting the liquid discharge head.

[0035] The liquid ejection head 130 ejects liquid such as ink to record an image on a recording medium, and includes an ejection module 131 including a recording element substrate 132, which is an example of a semiconductor chip 120 as a workpiece, and a flexible wiring substrate 133, and a support member 150. The recording element substrate 132 has a plurality of ejection ports 134 for ejecting liquid, and is supported by the support member 150 on the upper surface on which the ejection ports 134 are formed and on the lower surface opposite to the upper surface. The recording element substrate 132 also has a plurality of energy generating elements (not shown) that generate energy used to eject the liquid. The energy generating elements are, for example, electrothermal transducers such as resistor elements (heaters) and piezoelectric elements. The flexible wiring substrate 133 supplies electric signals and power for driving the energy generating elements to the recording element substrate 132, and is joined to an end of the upper surface of the recording element substrate 132.

[0036] The support member 150 has a base member 152 and a frame member 151 joined onto the base member 152. As a result, a recess 155 is formed in the support member 150, and the recording element substrate 132 is accommodated in the recess 155 and supported on a bottom surface 156 of the recess 155. A flow path 153 for supplying liquid to the recording element substrate 132 is opened in the bottom surface 156 of the recess 155. In addition, a groove portion 154 that communicates with the recess 155 and accommodates the flexible wiring substrate 133 is formed on the surface of the support member 150 on which the recess 155 is formed, that is, on the surface of the frame member 151. Note that, as long as the support member 150 has the recess 155 that accommodates the recording element substrate 132, it is not necessary for the support member 150 to be composed of separate members, namely the base member 152 and the frame member 151, and may be integrally formed by injection molding or the like.

[0037] The recording element substrate 132 and the flexible wiring substrate 133 are electrically connected by forming a joint 123 by flip chip bonding, and the joint 123 is sealed with a first sealing material 160. The first sealing material 160 is filled inside a dam portion (not shown) formed in the support member 150. The dam portion is formed on a bottom surface 156 of a recess 155 which is a support surface that supports the recording element substrate 132, and extends in a U-shape so as to face and surround the electrical connection portion between the recording element substrate 132 and the flexible wiring substrate 133. When viewed from a direction perpendicular to the bottom surface 156 of the support member 150, the dam portion opens on the side of the side of the recording element substrate 132 adjacent to the surface on which the joint 123 is provided. The dam portion contacts the side surface of the recording element substrate 132 outside the joints 123 provided at both ends among the multiple joints 123, and a first sealant 160 is filled inside the area surrounded by the recording element substrate 132 and the dam portion. The first sealant 160 is provided so as to connect from the inside of this area to a position covering the joints 123. A method for joining the recording element substrate 132 and the flexible wiring substrate 133 will be described in detail later.

[0038] Meanwhile, in the gap between the recess 155 and the recording element substrate 132, the dam portion and the portion excluding the first sealant 160 filled in the dam portion are filled with a second sealant 161. The second sealant 161 seals the periphery of the recording element substrate 132 to prevent liquid pools from being formed.

[0039] Figure 8 is a plan view showing a recording element substrate, which is an example of a semiconductor chip, in which Figure 8(a) shows the top surface on the side on which the ejection ports 134 are formed, and Figure 8(b) shows the bottom surface opposite the top surface on the side on which the ejection ports 134 are formed.

[0040] The recording element substrate 132 has a substrate 136 and an ejection port forming member 135 provided on the substrate 136. A plurality of ejection ports 134 are formed in the ejection port forming member 135, and four supply paths 137 are formed in the substrate 136, which communicate with the plurality of ejection ports 134 and open to the lower surface of the recording element substrate 132. The plurality of ejection ports 134 form eight ejection port rows arranged in parallel in the short-side direction of the substrate 136, and the supply paths 137 are provided for every two ejection port rows. The number of the supply paths and the number of the ejection port rows are not limited to these numbers. A plurality of energy generating elements (not shown) are formed in the substrate 136 at positions facing the plurality of ejection ports 134. A plurality of joints 123 electrically connected to the energy generating elements are formed at the end of the short-side direction of the substrate 136, and protruding electrodes 124 joined to inner leads 140 of the flexible wiring substrate 133 are formed on the joints 123. The surface of the substrate 136 on which the supply path 137 is formed comes into contact with the joining collet 23. However, the part that comes into contact is the part on the opposite surface on which the joining portion 123 and the protruding electrode 124 are formed, and this part is illustrated as a contact area 122. Also, the part on the opposite surface on which the ejection port forming member 135 is formed is illustrated as a contact prohibited area 121. Since the ejection port forming member 135 is a member that comes into contact with liquids such as ink, it is preferable that the material thereof is resistant to liquids such as ink, and for example, a photosensitive resin is used.

[0041] 9A and 9B are plan views showing a flexible wiring board, where FIG. 9A is a view seen from the side joined to the recording element substrate, and FIG. 9B is a view seen from the side opposite to the side joined to the recording element substrate.

[0042] The flexible wiring board 133 has a base film 138, a cover film 139, and wiring formed between the base film 138 and the cover film 139. The wiring is covered by the base film 138 and the cover film 139, except for an inner lead 140 connected to the recording element board 132 and an outer lead 141 electrically connected to the main body of the liquid ejection device on which the liquid ejection head 130 is mounted. Hereinafter, the inner lead is called the wiring 140, and the outer lead is called the wiring 141. The base film 138 and the cover film 139 are each made of polyimide resin or the like, and the wirings 140 and 141 are formed by patterning Cu foil or the like. Adhesive films (not shown) are used to bond the base film 138 to the wirings 140 and 141, and to bond the wirings 140 and 141 to the cover film 139. The flexible wiring board 133 of this embodiment has a single wiring layer, but may have multiple layers. In addition, a TAB tape may be used instead of the flexible wiring board 133.

[0043] Next, a method for manufacturing a discharge module, which is one of the methods for manufacturing a liquid discharge head according to this embodiment, will be described with reference to Fig. 10 to Fig. 13. Fig. 10 is a schematic diagram showing a state in which a joining collet for manufacturing a discharge module holds a recording element substrate, Fig. 10(a) is a front view, and Fig. 10(b) is a side view. Fig. 11 is a plan view of a joining collet 23 in the second embodiment.

[0044] The recording element substrate 132 is held by suction through suction holes 103 provided in a contact surface 102, which is the lower surface of a contact portion 101 provided on the joining collet 23. Since the mechanical strength of the substrate 136 is reduced due to the formation of the supply path 137, the vicinity of the supply path 137 is set as a contact prohibited area 121 during flip chip joining for the reason of preventing damage due to energy applied during flip chip joining. Therefore, the contact surface 102 comes into contact with the recording element substrate 132 at a contact area 122 on the side opposite to the side on which the discharge port 134 of the recording element substrate 132 is formed, and the contact surface 102 is provided to be smaller than the contact area 122. The suction holes 103 are provided inside the contact surface 102, and the entire outer circumference is surrounded by the contact surface 102, so that the structure does not leak suction air.

[0045] The suction hole 103 is surrounded by the contact surface 102 all around the periphery, and the arrangement of the suction hole 103 is determined so that the contact surface 102 is located at the rear surface position of the protruding electrode 124 provided on the joint portion 123. When the semiconductor chip 120 and the substrate 110 are joined, the thrust in the -Z direction of the mounting part Z direction moving mechanism 12 needs to be transmitted to the joining point through the joining collet 23. Since the recording element substrate 132 and the joining collet 23 are in contact with each other at the rear surface position of the protruding electrode 124, which is the joining point of the recording element substrate 132 and the flexible wiring substrate 133, the thrust acts directly on the joining point. The arrangement of the contact surface 102 and the suction hole 103 is determined according to the shape of the semiconductor chip 120. The arrangement of the contact surface 102 and the suction hole 103 is determined according to the position of the opening of the semiconductor chip 120, as shown in FIG. 11(a) and FIG. 11(b).

[0046] Fig. 12 is a perspective view showing a method for manufacturing the discharge module, an apparatus used for manufacturing the discharge module is omitted in Fig. 12. Fig. 13 is a side view showing the method for manufacturing the discharge module.

[0047] As described above, the recording element substrate 132 and the flexible wiring substrate 133 are bonded by flip chip bonding. To do this, first, as shown in FIG. 12(a) and FIG. 13(a), the recording element substrate 132 and the flexible wiring substrate 133 are set on the bonding collet 23 and the substrate receiving jig 170, respectively. At this time, the upper surface of the recording element substrate 132 is turned downward (face down), and the protruding electrodes 124 formed on the bonding portion 123 and the inner leads 140 of the flexible wiring substrate 133 are opposed to each other. Next, as shown in FIG. 12(b) and FIG. 13(b), the bonding collet 23 is lowered to the substrate receiving jig 170 until a predetermined gap G is formed between the recording element substrate 132 and the flexible wiring substrate 133. Then, the substrate receiving jig 170 is heated by the heating portion 25, and ultrasonic vibration is transmitted from the bonding collet 23 to bond the protruding electrodes 124 and the inner leads 140 by ultrasonic welding. In this way, the ejection module 131 is completed, and an electrical connection portion between the recording element substrate 132 and the flexible wiring substrate 133 is formed.

[0048] In this embodiment, the gap G between the recording element substrate 132 and the flexible wiring substrate 133 is set to about 20 μm, but is not limited to this and can be changed as desired depending on the size of the protruding electrode 124 and the required bonding strength, etc.

[0049] [Other embodiments] It should be noted that the present disclosure is not limited to the above-described embodiments, and many modifications and combinations are possible within the technical spirit of the present invention.

[0050] For example, the same configuration as that of the joining collet 23 may be applied to the take-out collet 33 of the first embodiment.

[0051] In addition, although the discharge module 131 was manufactured in the second embodiment, the module may be one for other purposes. It may be an imaging module in which an imaging element is mounted on a substrate, or a semiconductor module in which a semiconductor chip is mounted on a substrate. It may also be an electronic module in which electronic components are mounted on a substrate.

[0052] Furthermore, the workpiece that the collet adheres to is not limited to a semiconductor element (semiconductor chip), but may be, for example, an electronic component such as a resistor element or a capacitor. [Explanation of symbols]

[0053] 100 Flip bonding equipment (mounting equipment) 10 Semiconductor chip mounting section 11 Mounting section Y direction movement mechanism 12 Mounting section Z direction movement mechanism 20 Junction Unit 21 Transducer 22 Vibration Horn 23 Joint collet 30 Semiconductor chip removal section 31 Extraction part Y direction movement mechanism 32 Extraction part Z direction movement mechanism 33 Extraction collet 35 Semiconductor chip holder 40 Semiconductor Chip Supply Department 50 Substrate supply section 60 Substrate transport section 70 Circuit Board Storage Section 80 Mount 101 Contact part 102 Contact surface 103 Suction hole 104 Base 105 Mounting part 106 Suction Path 107 Non-contact part 110 Substrate 120 Semiconductor Chips 121 No-touch area 122 Contact area 123 Joint 124 Protruding electrode 130 Liquid ejection head 131 Discharge Module 132 Recording element board 133 Flexible wiring board 134 Discharge port 135 Discharge port forming member 136 Substrate 137 Supply route 138 Base Film 139 Cover Film 140 Wiring (inner lead) 141 Wiring (outer lead) 150 Support member 151 Frame members 152 Base material 153 Channel 154 Groove 155 Recess 156 Bottom 160 First sealing material 161 Second sealing material

Claims

1. A suction mechanism that suctions a workpiece, The suction mechanism is provided on a side facing the workpiece. A non-contact portion that does not come into contact with the workpiece; a contact portion protruding from the non-contact portion that contacts the workpiece; having The suction mechanism is characterized in that the contact portion has a suction hole that sucks the workpiece.

2. The suction mechanism according to claim 1 , wherein the contact portion is smaller than the non-contact portion when the suction mechanism is viewed in plan from a side facing the workpiece.

3. 2. The suction mechanism according to claim 1, wherein an area of ​​the suction holes in the surface of the contact portion that contacts the workpiece is 50% or more.

4. 4. The suction mechanism according to claim 3, wherein an area of ​​the suction holes in a surface of the contact portion that contacts the workpiece is 80% or less.

5. 2. The suction mechanism according to claim 1, wherein the height of the contact portion in the protruding direction is 0.1 mm or less.

6. The contact portion includes a first contact portion and a second contact portion disposed at a distance from the first contact portion, 2. The suction mechanism according to claim 1, wherein a difference between a length of the first contact portion in the protruding direction and a length of the second contact portion in the protruding direction is 0.01 mm or less.

7. 2. The suction mechanism according to claim 1, wherein the workpiece is a semiconductor chip having protruding electrodes, and the suction mechanism is a collet.

8. the semiconductor chip is a recording element substrate having a supply path through which a liquid passes, The suction mechanism according to claim 7 , wherein the contact portion of the collet does not contact the supply passage.

9. A suction unit comprising: the collet according to claim 7; and a vibrator for applying vibration energy to the collet.

10. A semiconductor chip transport device comprising: a transport device for transporting a semiconductor chip; and a suction unit according to claim 9, a mounting device for electrically connecting the semiconductor chip and the substrate by transmitting vibration to the semiconductor chip that is sucked by the suction mechanism;

11. The substrate is a flexible wiring substrate, 11. The mounting device according to claim 10, wherein a bonding energy is applied to the semiconductor chip attracted by the suction mechanism, thereby flip-chip bonding the protruding electrodes of the semiconductor chip and the inner leads of the flexible wiring board.

12. A method for manufacturing a module in which a semiconductor chip and a substrate are electrically connected, comprising the steps of: A method for manufacturing a module, comprising the steps of: applying bonding energy to the semiconductor chip by using the mounting device according to claim 10 to electrically connect the semiconductor chip and the substrate.

13. the semiconductor chip is a recording element substrate having a supply path through which a liquid passes, The method for manufacturing a module according to claim 11 , wherein the contact portion of the collet does not contact the supply path.

14. The substrate is a flexible wiring substrate, The method for manufacturing a module according to claim 12, further comprising the step of flip-chip bonding the protruding electrodes of the semiconductor chip and the inner leads of the flexible wiring board by applying bonding energy to the semiconductor chip.

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