Cleaning tool and cleaning method

Abstract

To provide a cleaning tool which allows the interior of a dustproof cover to be cleaned without disassembling the dust-proof cover.SOLUTION: A cleaning tool 100 for cleaning a grinding device 1 which includes: a chuck table 52 capable of holding and rotating a wafer W; grinding means 3 rotatably including a grinding wheel 34 for grinding the water W held by the chuck table 52; a grinding water nozzle 13 for supplying grinding water L to the wafer W held by the chuck table 52 and to the grinding wheel 34; and a dustproof cover 14 covering a grinding region where the wafer W held by the chuck table 52 is ground by the grinding wheel 34, comprises: a base 102 held by the chuck table 52; and a scattering part 103 which is formed on an upper surface 102a of the base 102 in order to scatter the grinding water L supplied from the grinding water nozzle 13 to the inside of the dustproof cover 14.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a cleaning jig for cleaning a grinding device, and a cleaning method using the cleaning jig. [Background technology]

[0002] A wafer has a number of devices such as ICs and LSIs formed on its front surface, separated by planned dividing lines. The back surface is ground by a grinding machine to form the wafer into a specified thickness. The wafer is then divided into individual device chips by a dicing machine and laser processing machine. These chips are then used in electrical devices such as mobile phones and personal computers.

[0003] The grinding apparatus includes a rotatable chuck table for holding a wafer, grinding means having a rotatable grinding wheel for grinding the wafer held on the chuck table, grinding water supply means for supplying grinding water to the wafer and grinding wheel held on the chuck table, and a dust cover for covering the grinding area where the wafer held on the chuck table is ground with the grinding wheel, and can finish the wafer to the desired thickness (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-153090 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the configuration in which the grinding area is covered with the above-mentioned dust cover, grinding water containing contaminants such as grinding chips generated when grinding a wafer is scattered onto the inside of the dust cover, and the contaminants adhere to the inside of the dust cover, contaminating it. As a result, the dust cover must be periodically removed, disassembled, and cleaned, resulting in poor productivity.

[0006] Furthermore, if the above-mentioned cleaning is neglected, there is a problem that clumps of contaminants adhering to the inside of the dust cover may fall onto the ground wafer or onto the cover table covering the periphery of the chuck table, thereby contaminating the wafer.

[0007] The present invention has been made in consideration of the above-mentioned facts, and its main technical object is to provide a cleaning jig that enables the inside of a dust cover to be cleaned without disassembling the dust cover, and a cleaning method for a grinding device using the cleaning jig. [Means for solving the problem]

[0008] In order to solve the above-mentioned main technical problems, according to the present invention, there is provided a cleaning jig for cleaning a grinding apparatus including a rotatable chuck table for holding a wafer, a grinding means having a rotatable grinding wheel for grinding the wafer held on the chuck table, a grinding water nozzle for supplying grinding water to the wafer and the grinding wheel held on the chuck table, and a dust cover for covering a grinding area in which the wafer held on the chuck table is ground with the grinding wheel, the cleaning jig including a base held on the chuck table, and a scattering portion formed on an upper surface of the base for scattering the grinding water supplied from the grinding water nozzle to the inside of the dust cover.

[0009] The scattering portion preferably includes an annular outer wall formed on the outer periphery of the base, and an uneven portion formed on the inside of the outer wall for scattering the grinding water. The base is preferably formed in a disk shape having the same outer shape as the wafer in a plan view.

[0010] Furthermore, according to the present invention, there is provided a cleaning method using the above-mentioned cleaning jig, comprising: a holding step of holding the cleaning jig on the chuck table; a positioning step of positioning the chuck table holding the cleaning jig in the grinding area; and a cleaning step of rotating the chuck table and supplying grinding water from the grinding water nozzle to the cleaning jig held on the chuck table and splashing the water to clean the inside of the dust cover. Effect of the Invention

[0011] The cleaning tool of the present invention is a cleaning tool for cleaning a grinding device including a rotatable chuck table for holding a wafer, a grinding means having a rotatable grinding wheel for grinding the wafer held on the chuck table, a grinding water nozzle for supplying grinding water to the wafer and the grinding wheel held on the chuck table, and a dust cover for covering a grinding area where the wafer held on the chuck table is ground with the grinding wheel, the cleaning tool including a base held on the chuck table, and a grinding water nozzle formed on the upper surface of the base for supplying grinding water to the grinding water nozzle. and a scattering section that scatters the grinding water that is sprayed onto the inside of the dustproof cover. Therefore, by holding this cleaning jig on a chuck table and positioning it in the grinding area, and rotating the chuck table while supplying grinding water from the grinding water nozzle to the cleaning jig held on the chuck table, the grinding water is scattered onto the inside of the dustproof cover, thereby efficiently cleaning the inside of the dustproof cover, and cleaning can be performed without disassembling the dustproof cover, thereby eliminating the problem of having to periodically disassemble and clean the dustproof cover, which results in poor productivity.

[0012] In addition, the cleaning method of the present invention includes a holding step of holding the above-mentioned cleaning jig on a chuck table, a positioning step of positioning the chuck table holding the cleaning jig in the grinding area, and a cleaning step of rotating the chuck table and supplying grinding water from the grinding water nozzle to the cleaning jig held on the chuck table and splashing it to clean the inside of the dustproof cover.This makes it possible to clean the dustproof cover without disassembling it, thereby eliminating the problem of having to periodically disassemble and clean the dustproof cover, which results in poor productivity. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is an overall perspective view of the grinding device. [Diagram 2] 2A is a perspective view of a first cleaning jig applied to the grinding apparatus shown in FIG. 1, and FIG. 2B is a cross-sectional view of the first cleaning jig shown in FIG. [Diagram 3] FIG. 2 is a perspective view showing an embodiment of the holding step of the cleaning method of the present invention. [Figure 4] FIG. 2 is a perspective view showing an embodiment of a positioning step in the cleaning method of the present invention. [Diagram 5] FIG. 2 is a perspective view showing an embodiment of the cleaning step of the cleaning method of the present invention. [Figure 6] FIG. 13(a) is a plan view of the second cleaning jig, and (b) to (d) are enlarged perspective views showing a part of the scattering portion of the second cleaning jig. [Figure 7] FIG. 2A is a plan view of a third cleaning jig, and FIG. 2B is an enlarged perspective view showing a part of a scattering portion of the third cleaning jig. [Figure 8] FIG. 13(a) is a plan view of a fourth cleaning jig, and FIG. 13(b) is an enlarged perspective view showing a part of a scattering portion of the fourth cleaning jig. [Figure 9] FIG. 13(a) is a plan view of the fifth cleaning jig, and FIG. 13(b) is an enlarged perspective view showing a part of a scattering portion of the fifth cleaning jig. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of a cleaning jig configured according to the present invention and a cleaning method carried out using the cleaning jig will be described in detail with reference to the accompanying drawings.

[0015] FIG. 1 shows a perspective view of a grinding apparatus 1 suitable for carrying out a cleaning method using a cleaning jig of the present embodiment.

[0016] The grinding apparatus 1 includes a substantially rectangular parallelepiped housing 2, which includes a grinding means 3 for grinding a wafer W as a workpiece, a holding means 5 including a chuck table 52 configured to hold and rotate the wafer W, a first cassette 6 arranged on the front side in the drawing for accommodating the wafer W before grinding, a second cassette 7 arranged on the other side of the first cassette 6 in the X-axis direction in the drawing for accommodating the wafer W after grinding, a temporary placement means 8 arranged adjacent to the first cassette 6 in the Y-axis direction in the drawing for aligning the wafer W, a cleaning means 9 arranged adjacent to the second cassette 7 in the Y-axis direction, and a cleaning means 9 for carrying out the wafer W stored in the first cassette 6 to the temporary placement means 8, grinding is performed on the wafer W, and the wafer W is cleaned by the cleaning means 9. The apparatus further includes a first transport means 10 for transporting the wafer W placed on the temporary placement means 8 and centered to the second cassette 7, a second transport means 11 for transporting the wafer W placed on the temporary placement means 8 and centered onto the chuck table 52 of the holding means 5 positioned at the load / unload position (front side in the figure), a third transport means 12 for transporting the wafer W after grinding from the chuck table 52 positioned at the load / unload position to the cleaning means 9, a grinding water nozzle 13 for supplying grinding water to the wafer W held on the chuck table 52 positioned in the grinding area directly below the grinding means 3 and to the grinding wheel 34 of the grinding means 3, a dust cover 14 for covering the grinding area where the wafer W held on the chuck table 52 is ground with the grinding wheel 34, and a control means (not shown). For convenience of explanation, FIG. 1 shows the dust cover 14 removed upward from a predetermined position (indicated by a dashed line) covering the grinding region.

[0017] The grinding means 3 is mounted so as to be movable in the vertical direction along a pair of guide rails 22, 22 extending in the vertical direction on the inner surface of the support wall 21 erected on the rear end side of the device housing 2. The grinding means 3 includes a unit housing 31, a wheel mount 33 disposed on the lower end of a rotating shaft 32 rotatably supported by the unit housing 31, a grinding wheel 34 mounted on the wheel mount 33 and having a plurality of grinding stones 35 arranged in an annular shape on the lower surface side, an electric motor 36 mounted on the upper end of the unit housing 31 for rotating the wheel mount 33, and a movable base 38 for supporting the unit housing 31 via a support member 37. The movable base 38 is provided with a guided groove that slidably fits onto the above-mentioned guide rails 22, 22, and supports the grinding means 3 so as to be movable in the vertical direction.

[0018] The illustrated grinding device 1 includes a vertical feed means 39 that moves the moving base 38 of the grinding means 3 up and down along the guide rails 22, 22. The vertical feed means 39 includes a pulse motor 39a, a male screw rod 39b that is arranged in parallel with the guide rails 22, 22 in the vertical direction, rotatably supported by the support wall 21, and rotated by the pulse motor 39a, and a female screw block (not shown) that is attached to the moving base 38 and screwed with the male screw rod 39b. The grinding means 3 is moved in the Z-axis direction (vertical direction) by driving the male screw rod 39b forward and backward by the pulse motor 39a. Furthermore, an operation panel 15 is arranged on the front side of the device housing 2 where the first conveying means 10 is arranged, for instructing the control means (not shown) to start and stop grinding and for specifying grinding conditions, and a display means (not shown) that displays processing information and the like is also connected to the control means.

[0019] The holding means 5 includes a cover table 51 and a chuck table 52 disposed at the center of the cover table 51 so as to protrude upward. The chuck table 52 is connected to a suction means (not shown) and has a breathable holding surface on which the wafer W is held, and negative pressure can be generated on the holding surface by operating the suction means. The chuck table 52 is rotatably supported and rotated by a rotation drive source (not shown). In addition, a parallel feed means (not shown) is disposed in the device housing 2 for moving the chuck table 52 in the Y-axis direction indicated by the arrow Y, which is parallel to the horizontal plane, and the chuck table 52 can be moved between a carry-in / out position on the front side in the Y-axis direction and a grinding area directly below the grinding means 3.

[0020] Between the side walls 2a, 2a of the device housing 2 and around the chuck table 52, a water pan 23 for receiving grinding water containing contaminants such as grinding chips is formed. A drain port 23a is provided on the bottom surface of the water pan 23 on the grinding area side, so that the grinding water containing the contaminants can be discharged.

[0021] The dust cover 14 is provided with a cover member 14a having an approximately box shape as a whole, and the cover member 14a has an upper wall 14b, a front wall 14c, and side walls 14d, 14d. The side walls 14d, 14d of the dust cover 14 have downward shoulder surfaces 14e, 14e, which are disposed on the upper surfaces of the side walls 2a, 2a of the device housing 2. The upper wall 14b of the cover member 14a is provided with a circular opening 14f that allows the grinding wheel 34 to pass through, and a cylindrical member 14g is provided extending upward from the periphery of the circular opening 14f. Approximately half of the cylindrical member 14g and a part of the upper wall 14b form a maintenance and inspection door 14h that can be opened and closed relative to the upper wall 14b, and a maintenance and inspection door 14i is formed adjacent to the door 14h. A suction duct 14j (only a portion of which is shown) connected to a suction means (not shown) is provided on the upper wall 14b, which sucks in contaminants and the like that are scattered inside the dust cover 14 and reduces the pressure inside the dust cover 14 to prevent the contaminants and the like from leaking outside the dust cover 14.

[0022] 2 shows a first cleaning jig 100 configured according to the present invention. The first cleaning jig 100 includes a base 102 held by the chuck table 52 of the grinding device 1 described above, and a scattering section 103 formed on an upper surface 102a of the base 102 and scattering the grinding water supplied from the grinding water nozzle 13 described above to the inside of the dust cover 14. The first cleaning jig 100 will be described in more detail below.

[0023] The illustrated base 102 is formed in a disk shape with a flat lower surface 102b so that it can be sucked and held by the chuck table 52, and has the same outer shape as the wafer W, which is the workpiece, in a plan view. It is formed with dimensions corresponding to the holding surface of the chuck table 52. The base 102 is formed of, for example, silicon, glass, metal, etc. The scattering part 103 is formed by an uneven part formed on the upper surface 102a of the base 102. The scattering part 103 of the first cleaning jig 100 shown in FIGS. 2(a) and 2(b) is configured to include an annular outer wall 104 formed on the outer periphery of the base 102 and convex upward, and a convex part 105 formed on the upper surface 102a of the base 102 inside the outer wall 104 and for scattering grinding water. The inner surface 104a of the outer wall 104 can be formed as an inclined surface, so that the grinding water supplied as cleaning water is easily scattered outward when performing a cleaning method described later. The convex portion 105 is formed by removing parts of an annular convex portion at equal intervals, and is designed to bounce back the grinding water supplied toward the upper surface 102a of the first cleaning jig 100 and disperse it efficiently.

[0024] The first cleaning jig 100 is generally configured as described above, and a cleaning method using this first cleaning jig 100 will be described below.

[0025] The cleaning method described below can be performed at any timing or periodically. It should be performed periodically, for example, by storing the above-mentioned first cleaning jig 100 at a predetermined position in the first cassette 6 storing the unprocessed wafers W, processing all the wafers W stored in the first cassette 6, and finally carrying out the first cleaning jig 100 from the first cassette 6 to perform the cleaning method described below.

[0026] (holding process) In the above-mentioned grinding apparatus 1, when all the wafers W accommodated in the first cassette 6 are ground by the grinding means 3, a cleaning method for cleaning the inside of the dust cover 14, which is set to be periodically performed by a control means (not shown), is executed. When the cleaning method is executed, the above-mentioned first transport means 10 is operated to carry out the first cleaning jig 100 accommodated in a predetermined position (for example, the lowest stage) of the first cassette 6, and the first cleaning jig 100 is placed on the temporary placement means 8 and centered. Next, the first cleaning jig 100 placed on the temporary placement means 8 is sucked by the second transport means 11 and transported onto the chuck table 52 positioned at the carry-in / out position on the front side in FIG. 1, and placed with the upper surface 102a on which the scattering portion 103 is formed facing upward as shown in FIG. 3. Once the first cleaning jig 100 has been placed on the chuck table 52 in this manner, a suction means (not shown) is activated to generate negative suction pressure on the holding surface of the chuck table 52, thereby holding the first cleaning jig 100 by suction, thereby completing the holding process.

[0027] (Positioning process) Next, the above-mentioned parallel feed means is operated to move the chuck table 52 in the Y-axis direction shown by the arrow R1 in Fig. 4, and a positioning step is performed to position the chuck table 52 in the above-mentioned grinding area. Although the dustproof cover 14 is omitted in Fig. 4, the grinding area in which the chuck table 52 is positioned by the positioning step is the inside of the above-mentioned dustproof cover 14, and is the area in which the grinding water nozzle 13 is disposed.

[0028] (Cleaning process) After the above-mentioned positioning step is performed, as shown in FIG. 5, the chuck table 52 is rotated in the direction indicated by the arrow R2 at a predetermined rotation speed (e.g., 300 to 1000 rpm), and the grinding water L (pure water is used in this embodiment) is supplied from the nozzle 13a of the grinding water nozzle 13 toward the upper surface 102a of the first cleaning jig 100 held on the chuck table 52 for a preset period of time. The amount of the grinding water L supplied at this time is, for example, 4 to 5 L / min. As a result, the grinding water L supplied from the grinding water nozzle 13 collides with the annular outer wall 104 and the protruding portion 105 constituting the scattering portion 103 of the first cleaning jig 100 rotating together with the chuck table 52, and is scattered upward and outward. In this way, the action of the first cleaning jig 100 placed on the chuck table 52 and held by suction causes the grinding water L to splash onto the inside of the dust cover 14, causing contaminants such as grinding chips adhering to the dust cover 14 to be detached, and cleaning the inside of the dust cover 14. The contaminants detached from the dust cover 14 and the grinding water L supplied from the grinding water nozzle 13 flow into the water pan 23 and are discharged from the drain outlet 23a, completing the cleaning process. With the above, the cleaning method of this embodiment is completed.

[0029] When carrying out the above-mentioned cleaning step, the grinding wheel 34 of the grinding means 3 is positioned several centimeters above the chuck table 52 so as not to interfere with cleaning in the cleaning step, and the circular opening 14f is closed. This makes it possible to prevent the grinding water L supplied from the grinding water nozzle 13 and scattered from the scattering part 103 of the first cleaning jig 100 from scattering outside the dust cover 14, and also makes it possible to clean the underside of the grinding wheel 34.

[0030] According to the above-described first cleaning jig 100 and the cleaning method using the first cleaning jig 100, the grinding water L supplied from the grinding water nozzle 13 collides with the scattering portion 103 of the first cleaning jig 100 and is scattered, so that it is possible to efficiently clean the inside of the dust cover 14 without disassembling the dust cover 14, thereby eliminating the problem of poor productivity due to the need to periodically disassemble and clean the dust cover 14.

[0031] The cleaning jig of the present invention is not limited to the above-described first cleaning jig 100. Modified examples of the cleaning jig constructed based on the present invention will be described with reference to Figs.

[0032] A second cleaning jig 110 formed according to the present invention is shown in Fig. 6. Fig. 6(a) is a plan view of the second cleaning jig 110, and Fig. 6(b) is an enlarged perspective view of a scattering portion 113A of the region indicated by A in Fig. 6(a).

[0033] 6(a), the second cleaning jig 110 includes a disk-shaped base 112 and a scattering portion 113A formed on the outer circumferential region of the base 112. The base 112 can be formed in the same form as the base 102 of the first cleaning jig 100 described above, and is formed from, for example, silicon, glass, metal, or the like.

[0034] The scattering section 113A forms an uneven section on the base 112, and is composed of an outer wall 114 formed in a ring shape on the outer periphery of the base 112, and a plurality of protrusions 115 formed along the inner side of the outer wall 114. The outer wall 114 is formed in a shape substantially similar to that of the outer wall 104 of the first cleaning jig 100 described above. The protrusions 115 are substantially triangular prisms with inclined surfaces 115a in the circumferential direction, and are disposed at equal intervals along the outer wall 114.

[0035] The above-mentioned cleaning method can be carried out using the second cleaning jig 110 having the scattering part 113A as described above (the procedure for carrying out the cleaning method is the same as that for the cleaning method using the first cleaning jig 100 described above, so a detailed description will be omitted). By carrying out the cleaning method including the above-mentioned holding step, positioning step, and cleaning step using this second cleaning jig 110, the grinding water L supplied from the grinding water nozzle 13 collides with the outer wall 114 of the scattering part 113A and the convex part 115 described above, and is scattered upward and outward along the inclined surface 115a of the convex part 115, so that the inside of the dust cover 14 can be efficiently cleaned without disassembling the dust cover 14, and the problem of poor productivity due to the need to periodically disassemble and clean the dust cover 14 is eliminated.

[0036] The scattering part constituting the second cleaning jig 110 is not limited to the above-mentioned scattering part 113A. For example, scattering part 113B shown in FIG. 6(c) may be adopted instead of scattering part 113A shown in FIG. 6(b). The scattering part 113B has an outer wall 114 similar to the above-mentioned, and a plurality of convex parts 116 are arranged at equal intervals along the inner side of the outer wall 114 so as to form an uneven part on the base 112. The convex part 116 has a form similar to the above-mentioned convex part 115, but the inclined surface 116a formed in the circumferential direction is formed as a concave curved surface, and forms a gentle inclination at the position where it connects with the upper surface of the base 112, and changes to a steep inclination angle as it approaches the upper surface of the outer wall 114. Due to this configuration, when the above-mentioned cleaning method is carried out using the second cleaning jig 110 equipped with the scattering portion 113B, the grinding water L supplied from the grinding water nozzle 13 is more likely to scatter upward during the cleaning process, making it possible to efficiently clean the inner upper surface of the dust cover 14.

[0037] In addition, in the second cleaning jig 110, the scattering part 113C shown in FIG. 6(d) may be used instead of the scattering part 113A and the scattering part 113B. As can be seen from FIG. 6(d), the scattering part 113C includes the outer wall 114 and a plurality of convex parts 117 arranged at equal intervals along the inner side of the outer wall 114 as described above. The convex parts 117 are substantially rectangular prism-shaped. Due to this shape, when the above-mentioned cleaning method is carried out using the second cleaning jig 110 including the scattering part 113C, the grinding water L supplied from the grinding water nozzle 13 collides with the outer wall 114 and the convex parts 117 of the second cleaning jig 110 rotating in the direction indicated by the arrow R2 in FIG. 6(a) in the cleaning process and is scattered in various directions, so that the inside of the dust cover 14 can be efficiently cleaned.

[0038] FIG. 7 shows a third cleaning jig 120 formed according to the present invention. FIG. 7(a) is a plan view of the third cleaning jig 120, and FIG. 7(b) is an enlarged perspective view of the scattering part 123 of the region indicated by B in FIG. 7(a). As shown in the figure, the third cleaning jig 120 includes a base 122 formed in the same form as the bases 102 and 112 described above, and a scattering part 123 formed on the upper surface 122a of the base 122 and scattering the grinding water L supplied from the grinding water nozzle 13 described above to the inside of the dust cover 14. The scattering part 123 includes an outer wall 124 formed in a ring shape on the outer periphery of the base 122 so as to form an uneven part on the base 122, and a recess 125 formed on the upper surface 122a of the base 122 inside the outer wall 124. The recess 125 is formed by combining a plurality of grooves, each of which is substantially arc-shaped and passes through the center of the base 122, on the upper surface 122a of the base 122, and has a petal shape as shown in the figure.

[0039] The above-mentioned cleaning method can be suitably carried out even when the above-mentioned third cleaning jig 120 is used, and the same effects as those of the above-mentioned first cleaning jig 100 and second cleaning jig 110 can be achieved. When the above-mentioned cleaning method is carried out using the third cleaning jig 120 having the above-mentioned scattering part 123, the grinding water L supplied from the grinding water nozzle 13 collides with the outer wall 124 of the third cleaning jig 120 rotating in the direction shown by the arrow R2 in FIG. 7(a) and the recess 125 of the scattering part 123 in the cleaning process and is scattered. Since the above-mentioned recess 125 changes at various angles with respect to the direction in which the grinding water L is supplied, the grinding water L is scattered upward and outward, and the inside of the dust cover 14 can be efficiently cleaned.

[0040] The above-mentioned third cleaning jig 120 is not limited to the embodiment in which a scattering part is formed by forming a recess on the base. FIG. 8 shows a fourth cleaning jig 130 formed based on the present invention. FIG. 8(a) is a plan view of the fourth cleaning jig 130, and FIG. 8(b) is an enlarged perspective view of the scattering part 133 of the region indicated by C in FIG. 8(a). As shown in the figure, the fourth cleaning jig 130 includes a disk-shaped base 132 and a scattering part 133 formed on an upper surface 132a of the base 132 and scattering the grinding water L supplied from the grinding water nozzle 13 to the inside of the dust cover 14. The base 132 is formed in the same shape as the above-mentioned bases 102, 112, and 122. Scattering section 133 includes outer wall 134 formed in a ring shape around the outer periphery of base 132 so as to form an uneven section on base 132, and recessed section 135 formed on upper surface 132a of base 132 inside outer wall 134. Recessed section 135 is a combination of multiple linear recessed grooves passing through the center of base 132 on upper surface 132a of base 132, and as shown in the figure, forms a radial shape overall.

[0041] The above-mentioned cleaning method can be suitably carried out using the above-mentioned fourth cleaning jig 130, and the same effects as those of the above-mentioned cleaning jigs can be achieved. Even when the above-mentioned cleaning method is carried out using the fourth cleaning jig 130 having the above-mentioned scattering portion 133, the grinding water L supplied from the grinding water nozzle 13 collides with the outer wall 134 and the recessed portion 135 of the fourth cleaning jig 130 rotating in the direction shown by the arrow R2 in Fig. 8(a) in the cleaning process, and is scattered upward and outward, so that the inside of the dust cover 14 can be efficiently cleaned.

[0042] FIG. 9 shows a fifth cleaning jig 140 formed according to the present invention. FIG. 9(a) is a plan view of the fifth cleaning jig 140, and FIG. 9(b) is an enlarged perspective view of the scattering part 143 of the region indicated by D in FIG. 9(a). As shown in the figure, the fifth cleaning jig 140 includes a disk-shaped base 142 and a scattering part 143 formed on the upper surface 142a of the base 142 and scattering the grinding water L supplied from the grinding water nozzle 13 to the inside of the dust cover 14. The base 142 is formed in the same manner as the bases 102, 112, 122, and 132 described above. The scattering part 143 includes an outer wall 144 formed in a ring shape on the outer periphery of the base 142 so as to form an uneven part on the base 142, and a recessed part 145 formed on the upper surface 142a of the base 142 inside the outer wall 144. The recesses 145 are formed in the upper surface 142a of the base 142 by forming a plurality of approximately arc-shaped recess grooves at equal intervals from the outer periphery of the base 142 to the center of the base 142, and are formed in a windmill shape as shown in the figure.

[0043] The above-mentioned cleaning method can be suitably carried out using the above-mentioned fifth cleaning jig 140, and the same effects as those of the above-mentioned cleaning jigs can be achieved. When the above-mentioned cleaning method is carried out using the fifth cleaning jig 140 having the above-mentioned scattering portion 143, in the cleaning process, the grinding water L supplied from the grinding water nozzle 13 collides with the outer wall 144 and the recessed portion 145 of the fifth cleaning jig 140 rotating in the direction shown by the arrow R2 in Fig. 9(a) and is scattered upward and outward, so that the inside of the dust cover 14 can be efficiently cleaned.

[0044] As described above, the base of each cleaning jig in this embodiment has the same disk shape as the wafer W, which is the workpiece, in a plan view, so that it can be transported and carried out by the transport means 10-12 that transport the wafer W in the grinding device 1, and is formed with dimensions that allow it to be stored in the first cassette 6 and the second cassette 7 that store the wafer W. Therefore, it can be stored in the first cassette 6 together with a plurality of unprocessed wafers W and carried into the grinding device 1, and the above-mentioned cleaning method can be performed at any timing or periodically as necessary. Note that when the base of each cleaning jig is formed in the same disk shape as the wafer, it is not necessary to form a notch or the like that indicates the crystal orientation formed in the wafer on the base. [Explanation of symbols]

[0045] 1: Grinding device 2: Device housing 21:Supporting wall 22: Guide rail 3: Grinding method 31: Unit housing 32: Rotation axis 33: Wheel mount 34: Grinding wheel 35: Grinding wheel 36: Electric motor 37: Support member 38: Mobile base 39: Vertical feed means 5: Holding means 51: Cover table 52: Chuck table 6: First Cassette 7: Second Cassette 8: Temporary storage means 9: Cleaning method 10: First conveyance means 11: Second conveyance means 12: Third conveyance means 13: Grinding water nozzle 14: Dust cover 14a: Cover member 14b: Upper wall 14c: Front wall 14d: Side wall 14e:Shoulder surface 14f: Circular opening 14g: Cylindrical member 14h, 14i: Door 14j: Suction duct 15: Operation panel 100: First cleaning tool 102: Foundation 102a:Top surface 103: Splashing part 104: Exterior wall 105: Convex 110: Second cleaning tool 112: Foundation 113A: Scattering section (first modified example) 113B: Scattering section (second modified example) 113C: Scattering section (third variant) 114: Exterior wall 115, 116, 117: Convex 120: 3rd cleaning fixture 122: Foundation 122a:Top surface 123: Splashing part 124: Exterior wall 125: Recess 130: 4th cleaning fixture 132: Foundation 132a:Top surface 133: Splashing part 134: Exterior wall 135: Recess 140: 5th cleaning fixture 142: Foundation 142a:Top surface 143: Splashing part 144: Exterior wall 145: Recess W: Wafer

Claims

1. A cleaning jig for cleaning a grinding device comprising: a rotatable chuck table for holding a wafer; a grinding means having a rotatable grinding wheel for grinding the wafer held on the chuck table; a grinding water nozzle for supplying grinding water to the wafer and the grinding wheel held on the chuck table; and a dust cover for covering a grinding area where the wafer held on the chuck table is ground with the grinding wheel, A cleaning jig comprising: a base supported on the chuck table; and a scattering portion formed on an upper surface of the base for scattering the grinding water supplied from the grinding water nozzle onto the inside of the dust cover.

2. 2. The cleaning jig according to claim 1, wherein the scattering portion includes an annular outer wall formed on the outer periphery of the base, and an uneven portion formed on the inside of the outer wall for scattering the grinding water.

3. 2. The cleaning jig according to claim 1, wherein the base is formed in a disk shape having the same outer shape as the wafer in a plan view.

4. A cleaning method using the cleaning jig according to claim 1, a holding step of holding the cleaning jig on the chuck table; a positioning step of positioning the chuck table holding the cleaning jig in the grinding area; a cleaning step of rotating the chuck table and supplying grinding water from the grinding water nozzle to a cleaning jig held on the chuck table to splash the grinding water onto the inside of the dust cover; A cleaning method comprising the steps of:

Images