Method for manufacturing light-emitting module and method for manufacturing light-emitting device

Abstract

To provide a method for manufacturing a light-emitting module, enabling stable thinning of the same and a method for manufacturing a light-emitting device.SOLUTION: A method for manufacturing a light-emitting module according to an embodiment comprises the steps of: preparing a first member including a light source having an electrode, and a light-guiding member having a first surface and a second surface opposite the first surface, with the light source arranged on the second surface with the electrode facing up; arranging a light-reflective resin on the second surface of the light-guiding member; arranging a film on the second surface of the light-guiding member, on the light source and on the light-reflective resin in a reduced pressure atmosphere; pressurizing the light source and the light-reflective resin by pressurizing a pressurizing member against the film; and peeling off the film.SELECTED DRAWING: Figure 10A

Description

[Technical field]

[0001] The embodiments relate to a method for manufacturing a light emitting module and a method for manufacturing a light emitting device. [Background technology]

[0002] 2. Description of the Related Art In recent years, light-emitting modules in which light sources using light-emitting diodes are arranged in a plane have been widely used as backlights for display devices and the like.

[0003] There is a demand for such light emitting modules to be thin. In order to thin the light emitting module, it is necessary to stably achieve thinning of each component of the light emitting module. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2008-059786 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of the embodiments is to provide a method for manufacturing a light emitting module and a method for manufacturing a light emitting device that can stably reduce the thickness. [Means for solving the problem]

[0006] A manufacturing method for a light-emitting module according to an embodiment includes the steps of: preparing a first member including a light source having an electrode; and a light-guiding member having a first surface and a second surface opposite the first surface, with the light source arranged on the second surface with the electrode facing up; arranging a light-reflective resin on the second surface of the light-guiding member; arranging a film on the second surface of the light-guiding member, on the light source and on the light-reflective resin in a reduced pressure atmosphere; pressing the light source and the light-reflective resin by pressing a pressing member against the film; and peeling off the film.

[0007] A manufacturing method for a light emitting device according to an embodiment includes the steps of: preparing a second member including a light emitting element including a light extraction surface, an electrode forming surface located opposite the light extraction surface, and an electrode arranged on the electrode forming surface; and a support member having the light emitting element arranged on one surface from the light extraction surface side; arranging a sealing resin on the electrode and the electrode forming surface; arranging a film on the one surface of the support member, on the light emitting element, and on the sealing resin in a reduced pressure atmosphere; pressing the light emitting element and the sealing resin by pressing a pressing member against the film; and peeling off the film. Effect of the Invention

[0008] According to the present embodiment, it is possible to provide a method for manufacturing a light emitting module and a method for manufacturing a light emitting device that can stably reduce the thickness. [Brief description of the drawings]

[0009] [Figure 1] 1 is a schematic perspective view illustrating a light-emitting module according to a first embodiment. [Diagram 2] FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. [Diagram 3] 2 is a schematic cross-sectional view illustrating a light source of the light-emitting module according to the first embodiment. [Figure 4A] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 4B] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 4C] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 5A] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 5B] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 5C] 4 is a schematic cross-sectional view showing a modified example of a light source of the light-emitting module according to the first embodiment. FIG. [Figure 6A] 3A to 3C are schematic top views illustrating the method for manufacturing the light emitting module according to the first embodiment. [Figure 6B] FIG. 6B is a schematic cross-sectional view taken along line VIB-VIB in FIG. 6A. [Figure 7] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 8A] 3A to 3C are schematic top views illustrating the method for manufacturing the light emitting module according to the first embodiment. [Figure 8B] 8B is a schematic cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. [Figure 9A] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 9B] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 10A] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 10B] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 11A] 3A to 3C are schematic top views illustrating the method for manufacturing the light emitting module according to the first embodiment. [Figure 11B] 2A to 2C are schematic perspective views illustrating a method for manufacturing the light emitting module according to the first embodiment. [Figure 12A] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 12B] 3A to 3C are schematic top views illustrating the method for manufacturing the light emitting module according to the first embodiment. [Figure 12C] FIG. 12C is a schematic cross-sectional view taken along line XIIC-XIIC in FIG. 12B. [Figure 13A] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 13B] 3A to 3C are schematic cross-sectional views illustrating a method for manufacturing the light-emitting module according to the first embodiment. [Figure 14A] FIG. 11 is a schematic cross-sectional view for explaining the amount of pressing by a roller. [Figure 14B] 10 is a graph showing the relationship between the amount of pressure applied by the roller and the thickness of the light reflective member. FIG. [Figure 15A] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 15B] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 15C] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 16A] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 16B] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 17A] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 17B] 5A to 5C are schematic cross-sectional views illustrating a method for manufacturing the light emitting device according to the second embodiment. [Figure 17C] 10A to 10C are schematic cross-sectional views illustrating a modified example of the manufacturing method for the light emitting device according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. The drawings are schematic or conceptual, and the relationship between the thickness and width of each part, the size ratio between parts, etc. are not necessarily the same as in reality. Even when the same part is shown, the dimensions and ratios may be different depending on the drawing. Also, as a cross-sectional view, an end view showing only the cut surface may be shown. In this specification and each drawing, elements similar to those described above with reference to the previous drawings are given the same reference numerals and detailed description thereof will be omitted as appropriate.

[0011] (First embodiment) (Light Emitting Module Configuration) The configuration of the light emitting module according to this embodiment will be described. FIG. 1 is a schematic perspective view illustrating the light-emitting module according to the present embodiment. FIG. 2 is a schematic cross-sectional view taken along line II-II in FIG. As shown in Fig. 1 and Fig. 2, the light emitting module 1 according to this embodiment includes a light guide member 10, a light reflective member 30, a wiring layer 40, and an insulating film 50. The light guide member 10 has a substantially plate-like shape. The light reflective member 30 is disposed below the light guide member 10. The wiring layer 40 is disposed below the light reflective member 30. The insulating film 50 is disposed below the wiring layer 40. An upper portion of the light source 20 is disposed within the light guide member 10, and a lower portion of the light source 20 is disposed within the light reflective member 30.

[0012] In describing the configuration of the light-emitting module 1 of this embodiment, there are cases where the terms "top", "upper part", and "upper" are used, and cases where the terms "bottom", "lower part", and "belower" are used. These terms are used for convenience of description, and do not necessarily correspond to the direction of gravity. In describing the configuration of the light-emitting module 1, the terms "top", "upper part", and "upper" refer to the direction from the insulating film 50 toward the light-guiding member 10, and the terms "bottom", "lower part", and "belower" refer to the direction from the light-guiding member 10 toward the insulating film 50. Furthermore, "planar view" refers to viewing from above or below.

[0013] The light emitting module 1 is divided into a plurality of units 2. The plurality of units 2 are arranged in a plane. The light guide member 10, the light reflective member 30, the wiring layer 40, and the insulating film 50 are disposed throughout the light emitting module 1 and are common to the plurality of units 2.

[0014] The light source 20 is disposed in each unit 2. The light source 20 is disposed near the center of each unit 2 in a plan view. The light reflective member 30 is formed, for example, from a resin material containing a light diffusing material, and is white overall. The light diffusing material may be, for example, titanium oxide, silica, alumina, zinc oxide, glass, or the like. Such a light reflective member 30 has a reflectance of 60% or more with respect to the light from the light source 20, and preferably has a reflectance of 90% or more.

[0015] The light reflective member 30 is disposed around the lower part of the light source 20, and is disposed below the light guide member 10. The light reflective member 30 is disposed over the entire light emitting module 1 except for at least the light source 20. The light reflective member 30 surrounds the light source 20 in a plan view, and is disposed at a distance from the light source 20. In a cross-sectional view, the light reflective member 30 has a substantially uniform thickness around the light source 20, and the thickness increases with increasing distance from the light source 20. Each unit 2 is defined by the ridge line of the light reflective member 30 that is farthest from the light source 20.

[0016] The light guide member 10 has a first surface 10a and a second surface 10b. The second surface 10b is located on the opposite side of the first surface 10a. The first surface 10a is the upper surface of the light guide member 10. The second surface 10b is the lower surface of the light guide member 10. The first surface 10a of the light guide member 10 is substantially flat. In a plan view, a recess 10c is formed on the first surface 10a at a position overlapping the light source 20. The recess 10c may be, for example, a cone-shaped, quadrangular pyramid-shaped, or hexagonal pyramid-shaped, or a polygonal pyramid-shaped, such as a truncated cone-shaped, quadrangular pyramid-shaped, or hexagonal pyramid-shaped, recess. At least the light source 20 and the light reflective member 30 are arranged on the second surface 10b of the light guide member 10.

[0017] A light adjusting member 60 is disposed in the recess 10c. The light adjusting member 60 reflects a part of the light from the light source 20 and transmits the other part. The light adjusting member 60 can have a reflectance of, for example, 70% or more for the light from the light source 20, and more preferably, 80% or more. In this embodiment, the light adjusting member 60 is disposed so that a part of the inner side surface of the recess 10c is exposed on the first surface 10a side of the light guide member 10, but it can also be disposed in the entire inside of the recess 10c. In addition, at least a part of the light adjusting member 60 faces the light reflective member 30 via the light guide member 10. This allows the light from the light source 20 to be efficiently extracted to the outside from the first surface 10a of the light guide member 10.

[0018] The light-guiding member 10 is made of a light-transmitting material, and materials such as thermoplastic resins such as acrylic resin, polycarbonate resin, cyclic polyolefin resin, polyethylene terephthalate resin, or polyester resin, thermosetting resins such as epoxy resin or silicone resin, or glass can be used.

[0019] The light adjusting member 60 may be made of, for example, a resin material containing a light diffusing material, similar to the light reflective member 30. The light adjusting member 60 may be made of, for example, a light reflective metal member such as aluminum (Al) or silver (Ag), or a Distributed Bragg Reflector (DBR). Furthermore, the light adjusting member 60 may be made of a combination of these.

[0020] The configuration of the light source 20 will be described. FIG. 3 is a schematic enlarged cross-sectional view illustrating a light source of the light emitting module according to the present embodiment. As shown in FIG. 3, the light source 20 has a light-emitting element 21. The light-emitting element 21 has a light extraction surface 21a and an electrode-forming surface 21b. The electrode-forming surface 21b is located on the opposite side to the light-extraction surface 21a. The light-extraction surface 21a is the upper surface of the light-emitting element 21, and the electrode-forming surface 21b is the lower surface of the light-emitting element 21. Light is mainly emitted from the light-extraction surface 21a. A part of the light is also emitted from the electrode-forming surface 21b, and a part of the light is also emitted from a side surface located between the light-extraction surface 21a and the electrode-forming surface 21b. A pair of electrodes 22a, 22b are arranged on the electrode-forming surface 21b. The light-emitting element 21 includes a semiconductor structure, and the pair of electrodes 22a, 22b are connected to a pair of electrodes formed in the semiconductor structure. In the semiconductor structure, for example, at least a p-type semiconductor layer, a light-emitting layer, and an n-type semiconductor layer are stacked to realize a light-emitting diode structure.

[0021] The light emitting layer may be a structure having a single active layer, such as a double heterostructure or a single quantum well structure (SQW), or a structure having a group of active layers, such as a multiple quantum well structure (MQW). The light emitting layer can emit visible light or ultraviolet light. For example, visible light can include at least light from blue to red. Examples of semiconductor structures including such a light emitting layer include In x Al y Ga 1-x-y N (0≦x, 0≦y, x+y≦1).

[0022] The light emitting element 21 may include two or more light emitting layers in the semiconductor structure. For example, the semiconductor laminate may have a structure including two or more light emitting layers between an n-type semiconductor layer and a p-type semiconductor layer, or may have a structure in which an n-type semiconductor layer, a light emitting layer, and a p-type semiconductor layer are laminated in order, and the structure may be repeated two or more times. The two or more light emitting layers may include light emitting layers having different light emitting colors, or light emitting layers having the same light emitting color. The same light emitting color may be within a range that can be considered as the same light emitting color in use, and for example, the dominant wavelength of each light emitting color may vary by about several nm. The combination of light emitting colors may be appropriately selected.

[0023] A light-transmitting member 24 is disposed on the light-emitting element 21. In a plan view, the light-transmitting member 24 is larger than the light-emitting element 21. In the light-transmitting member 24, for example, a phosphor is dispersed in a base material made of a light-transmitting resin material. The phosphor absorbs a part of the light emitted from the light-emitting element 21 and emits light of a different wavelength. In one example, the phosphor absorbs blue light emitted from the light-emitting element 21 and emits yellow light. As a result, the blue light and the yellow light are mixed, and white light is emitted from the light source 20.

[0024] The phosphor may be, for example, an yttrium-aluminum-garnet phosphor (e.g., (Y,Gd)3(Al,Ga)5O 12 :Ce), lutetium aluminum garnet phosphor (Lu3(Al,Ga)5O 12 :Ce), terbium aluminum garnet phosphor (Tb3(Al,Ga)5O 12 :Ce), CCA phosphor (Ca 10 (PO4)6C l2 :Eu), SAE phosphor (Sr4Al14O 25 :Eu), chlorosilicate phosphor (Ca8MgSi4O 16 C l2 :Eu), silicate phosphor ((Ba,Sr,Ca,Mg)2SiO4:Eu), β-sialon phosphor ((Si,Al)3(O,N)4:Eu) or α-sialon phosphor (Ca(Si,Al) 12 (O,N) 16 :Eu) and other oxynitride phosphors, LSN phosphors ((La,Y)3Si6N 11 :Ce), BSESN phosphor ((Ba,Sr)2Si5N8:Eu), SLA phosphor (SrLiAl3N4:Eu), nitride phosphors such as CASN phosphor (CaAlSiN3:Eu) or SCASN phosphor ((Sr,Ca)AlSiN3:Eu), KSF phosphor (K2SiF6:Mn), KSAF phosphor (K2(Si 1-x Al x )F6 -x:Mn where x satisfies 0 < x < 1), or a fluoride-based phosphor such as an MGF-based phosphor (3.5MgO·0.5MgF2·GeO2:Mn), a quantum dot having a perovskite structure ((Cs,FA,MA)(Pb,Sn)(F,Cl,Br,I)3 where FA and MA represent formamidinium and methylammonium, respectively), a II-VI group quantum dot (CdSe), a III-V group quantum dot (InP), or a quantum dot having a chalcopyrite structure ((Ag,Cu)(In,Ga)(S,Se)2), etc. can be used. As the phosphor added to the translucent member 24, one type of phosphor may be used, or a plurality of types of phosphors may be used. Note that the translucent member 24 may not contain a phosphor. In this case, a phosphor sheet containing a phosphor that emits red light (also referred to as a red phosphor) and a phosphor that emits green light (also referred to as a green phosphor) is disposed on the light guide member 10, or a phosphor sheet containing a red phosphor and a phosphor sheet containing a green phosphor are respectively disposed on the light guide member 10, etc., whereby the same white light can be obtained.

[0025] A translucent layer 25 is provided around the upper part of the light-emitting element 21 and between the light-emitting element 21 and the translucent member 24. The translucent layer 25 is formed by solidifying an adhesive based on a translucent resin material, for example, an epoxy resin or a silicone resin. The translucent layer 25 can contain particles made of a resin material having a refractive index lower than that of the base material. The translucent layer 25 reflects the light emitted laterally from the light-emitting element 21 on the inner surface and guides it upward. A sealing member 26 is disposed below the translucent member 24 and around the light-emitting element 21, the electrodes 22a, 22b, and the translucent layer 25.

[0026] The sealing member 26 may be made of a light-reflective material, such as silicone resin or epoxy resin, containing a light diffusing material made of particles of titanium oxide, silica, alumina, zinc oxide, or glass. The reflectance of such a sealing member 26 with respect to the light from the light-emitting element 21 may be, for example, 60% or more, and may be 90% or more. The electrodes 22a and 22b are exposed on the lower surface of the sealing member 26. The shapes of the regions where the electrodes 22a and 22b are exposed on the lower surface of the sealing member 26 are, for example, right-angled isosceles triangles, with the bases facing each other.

[0027] Returning to Figure 2, we will continue with the explanation. The fixing member 70 is disposed between an upper portion of the light source 20 and the light guide member 10. The fixing member 70 is also disposed between a lower portion of the light source 20 and the light reflective member 30. That is, in a plan view, the fixing member 70 is disposed around the light source 20. The fixing member 70 is, for example, a light-transmitting resin material, such as an epoxy resin, a silicone resin, or a mixture of these resins.

[0028] The wiring layer 40 is disposed below the light reflective member 30. The wiring layer 40 is also disposed below the light source 20. The wiring layer 40 includes wirings 41 and 42. The wiring 41 is connected to the electrode 22a below the light source 20, and the wiring 42 is connected to the electrode 22b below the light source 20. The wirings 41 and 42 supply power to the light emitting element 21 from an externally connected power source via the electrodes 22a and 22b.

[0029] The wiring layer 40 is formed by, for example, applying or printing a conductive paste. That is, the wires 41 and 42 constituting the wiring layer 40 each include a base material made of a resin material and a plurality of conductive members disposed in the base material.

[0030] (Modification of light source) In the light emitting module of this embodiment, the light source 20 is not limited to the above-mentioned configuration, and may have a light source with another configuration. 4A to 5C are schematic cross-sectional views showing modified examples of the light source of the light-emitting module according to the present embodiment. As shown in Fig. 4A, the light source 20a has a light emitting element 21, a pair of electrodes 22a, 22b, a light-transmitting member 24, a light-transmitting layer 25, a sealing member 26, and a light adjustment member 27. The configuration of this light source 20a is different from that of the light source 20 shown in Fig. 3 in that the light source 20a has a light adjustment member 27. In other respects, the configuration of the light source 20a is the same as that of the light source 20, and detailed description thereof will be omitted.

[0031] The light adjustment member 27 is disposed on the upper surface of the light-transmitting member 24. The light adjustment member 27 reflects a part of the light emitted by the light-emitting element 21 through the light-transmitting member 24 and transmits the other part. For example, the light adjustment member 27 can have a reflectance of 90% or more for the light from the light-emitting element 21. The light adjustment member 27 can have a light-transmitting resin and a light diffusing agent dispersed and contained in the light-transmitting resin. Examples of the light-transmitting resin include silicone resin and epoxy resin. Examples of the light diffusing agent include fine particles of TiO2, SiO2, Al2O3, ZrO2, ZnO, and the like. The light adjustment member 27 may be, for example, a light-reflective metal member such as Al or Ag, or a DBR. The light adjustment member 27 may be a combination of these.

[0032] As shown in Fig. 4B, the light source 20b has a light emitting element 21, a pair of electrodes 22a, 22b, a light-transmitting member 24, a light-transmitting layer 25, and a sealing member 26. The configuration of the light source 20b is different from the configuration of the light source 20 shown in Fig. 3 in the configurations of the light-transmitting member 24 and the sealing member 26. In other respects, the configuration of the light source 20b is the same as the configuration of the light source 20, and detailed description will be omitted. Note that the same material can be used for the light-transmitting member 24 and the sealing member 26 in each of the light sources 20 and 20b.

[0033] In the light source 20b of this modification, the light-transmitting member 24 is disposed on the upper surface of the light-emitting element 21 and also on each side surface of the light-emitting element 21. The sealing member 26 is disposed on the lower surface of the light-emitting element 21. The sealing member 26 is also disposed on the lower surface of the light-transmitting member 24. As in the case of the light source 20, the pair of electrodes 22a, 22b are exposed from the sealing member 26.

[0034] As shown in Fig. 4C, the light source 20c has a light emitting element 21, a pair of electrodes 22a, 22b, a light-transmitting member 24, a light-transmitting layer 25, a sealing member 26, and a light adjustment member 27. The configuration of the light source 20c is different from that of the light source 20b shown in Fig. 4B in that the light source 20c has a light adjustment member 27. In other respects, the configuration of the light source 20c is the same as that of the light source 20b, and detailed description thereof will be omitted.

[0035] The light adjusting member 27 is disposed on the upper surface of the light-transmitting member 24. The light adjusting member 27 reflects a part of the light emitted by the light-emitting element 21 through the light-transmitting member 24 and transmits the other part. For example, the light adjusting member 27 may have a reflectance of 90% or more for the light from the light-emitting element 21. The light adjusting member 27 may be made of the same material as the light adjusting member 27 of the light source 20a shown in FIG. 4A.

[0036] As shown in Fig. 5A, the light source 20d has a light emitting element 21, a pair of electrodes 22a, 22b, and a light adjustment member 27. The configuration of the light source 20d is different from the configuration of the light source 20a shown in Fig. 4A in that the light source 20d does not have the light-transmitting member 24, the light-transmitting layer 25, and the sealing member 26. In other respects, the configuration of the light source 20d is the same as the configuration of the light source 20a shown in Fig. 4A, and detailed description will be omitted. The configurations and materials of the light emitting element 21 and the pair of electrodes 22a, 22b can be the same for each of the light sources 20a and 20d.

[0037] The light adjusting member 27 is disposed on the upper surface of the light emitting element 21. Similar to the light adjusting member 27 of the light source 20a shown in Fig. 4A, the light adjusting member 27 reflects a part of the light emitted by the light emitting element 21 via the light transmitting member 24 and transmits the other part. For example, the light adjusting member 27 can have a reflectance of 90% or more for the light from the light emitting element 21.

[0038] As shown in Fig. 5B, the light source 20e includes a light emitting element 21, a pair of electrodes 22a, 22b, a light-transmitting member 24a, a light-transmitting layer 25, a sealing member 26, and a light adjustment member 27. The configuration of the light source 20e is different from the configuration of the light source 20a shown in Fig. 4A in the configuration of the light-transmitting member 24a. In other respects, the configuration of the light source 20e is the same as the configuration of the light source 20a, and detailed description thereof will be omitted.

[0039] In the light source 20e, the light-transmitting member 24a is made of a light-transmitting resin material, and the light-transmitting resin material contains, for example, a filler. By changing the concentration of the filler, it is possible to adjust the transmittance of the light emitted from the light-emitting element 21. For the light-transmitting member 24a, the same light-transmitting resin material as the light-transmitting member 24 of the light source 20a shown in FIG. 4A can be used.

[0040] As shown in FIG. 5C, the light source 20f has a light emitting element 21, a pair of electrodes 22a, 22b, a light-transmitting member 24a, a sealing member 26, and a light adjustment member 27. The configuration of the light source 20f is different from the configuration of the light source 20e shown in FIG. 5B in the configuration of the light source 20f in the configuration of the light source 20e. The light source 20f is also different in that it does not have the light-transmitting layer 25 of the light source 20e. The configuration of the light source 20f is the same as the configuration of the light source 20e in other respects, and detailed description will be omitted. The materials of the light-transmitting member 24a and the sealing member 26 can be the same in the light source 20f and the light source 20e.

[0041] In the light source 20f, the light-transmitting member 24a is disposed on the upper surface of the light-emitting element 21. The light-transmitting member 24a is also disposed on each side surface of the light-emitting element 21. The sealing member 26 is disposed on the lower surface of the light-emitting element 21. The sealing member 26 is also disposed on the lower surface of the light-transmitting member 24a.

[0042] 1 and 2, any of the light sources 20a to 20f of the modified examples can be applied instead of the light source 20 shown in Fig. 3. In the manufacturing method of the light emitting module 1 described below, the case where the light source 20 is applied will be described. In the manufacturing method of the light emitting module 1, any of the light sources 20a to 20f can be applied.

[0043] (Manufacturing method of light emitting module 1) A method for manufacturing the light emitting module 1 according to this embodiment will be described. FIG. 6A is a schematic top view illustrating the method for manufacturing the light emitting module according to this embodiment. FIG. 6B is a schematic cross-sectional view taken along line VIB-VIB in FIG. 6A. As shown in FIG. 6A, an intermediate 100 is prepared. The term "intermediate" refers to an intermediate product in the process of forming the light-emitting module 1. The intermediate 100 has a pre-cut light-guiding member 110. The intermediate 100 can include a plurality of pre-cut light-guiding members 110. In this example, the pre-cut light-guiding members 110 are arranged in a matrix. The pre-cut light-guiding members 110 are connected to adjacent pre-cut light-guiding members 110 via the regions to be cut SL. The plurality of pre-cut light-guiding members 110 are cut along the regions to be cut SL to form the light-guiding member 10 shown in FIG. 1 and FIG. 2. Hereinafter, the pre-cut light-guiding member 110 will be simply referred to as the light-guiding member 110.

[0044] As shown in Fig. 6B, the light guiding member 110 has a first surface 10a and a second surface 10b. The second surface 10b is the surface opposite to the first surface 10a. The first surface 10a and the second surface 10b of the light guiding member 110 are the same as the first surface 10a and the second surface 10b of the light guiding member 10 shown in Fig. 2. In this manner, the same reference numerals are used for the same components as those of the light emitting module 1 described in relation to Fig. 2 and the like.

[0045] In the description of the manufacturing method of the light-emitting module 1, for convenience of illustration, the direction from the first surface 10a to the second surface 10b of the light-guiding member 110 is referred to as "upper", "upper part", or "upper side", and the direction from the second surface 10b to the first surface 10a is referred to as "lower", "lower part", or "lower side". "Planar view" refers to a view from above or below. These do not necessarily coincide with the direction of gravity, as explained in the configuration of the light-emitting module 1.

[0046] The light guide member 110 has a recess 10c (hereinafter referred to as a first recess 10c) formed on the first surface 10a side. The light guide member 110 has a recess 10d (hereinafter referred to as a second recess 10d) formed on the second surface 10b side. A light adjustment member 60 is formed in the first recess 10c.

[0047] The light guide member 110 is placed with the first surface 10a facing down and the second surface 10b facing up. Therefore, the light guide member 110 is placed with the recess 10d open upward.

[0048] A groove 10e is formed between adjacent second recesses 10d. In plan view, the groove 10e is formed so as to surround the second recesses 10d, for example, and is formed in a lattice pattern over the entire light guide member 110.

[0049] 7A to 7C are schematic cross-sectional views illustrating a method for manufacturing the light emitting module according to this embodiment. The cross-sectional view of FIG. 7 is a cross-sectional view of the preform 100a taken along a position corresponding to line VIB-VIB in FIG. 6A. The light source 20 is prepared, and an intermediate body (first member) 100a is formed. Specifically, as shown in Fig. 7, the prepared light source 20 is placed on the second surface 10b of the light guide member 110 with the electrodes 22a and 22b facing up, and the intermediate body 100a is formed.

[0050] More specifically, the light source 20 is disposed in a second recess 10d formed in the second surface 10b with the electrodes 22a and 22b facing up. When disposing the light source 20 in the second recess 10d, a light-transmitting adhesive is disposed in advance in the second recess 10d, and the light source 20 is disposed in the second recess 10d via the adhesive. After disposing the light source 20, the adhesive is heated and cured together with the light guide member 110 and the light source 20. The cured adhesive forms a fixing member 70 to fix the light source 20 to the light guide member 110.

[0051] In the above description, the step of forming the intermediate body 100a is performed after the step of preparing the light guide member 110 and the step of preparing the light source 20, and the subsequent steps are also performed continuously. For example, these steps are performed in the same plant, workshop, etc. However, it is also possible to prepare an already formed intermediate body 100a in another plant, workshop, etc., and to input the prepared intermediate body 100a into the subsequent steps.

[0052] FIG. 8A is a schematic top view illustrating the method for manufacturing the light emitting module according to this embodiment. FIG. 8B is a schematic cross-sectional view taken along line VIIIB-VIIIB in FIG. 8A. As shown in FIG. 8A and FIG. 8B, the method includes a step of disposing light-reflecting resin 130 on second surface 10b of light-guiding member 110. For example, light-reflecting resin 130 is disposed along grooves 10e formed on second surface 10b of light-guiding member 110, and intermediate body 100b is formed. In this example, light-reflecting resin 130 is disposed on grooves 10e disposed along the row direction of light sources 20 arranged in a matrix. Light-reflecting resin 130 is not limited to being disposed on every groove 10e along the row direction as in this example, but may be disposed on every other groove 10e or on every third or more rows of grooves 10e. Light-reflecting resin 130 may be disposed on grooves 10e along the column direction of the matrix of light sources 20. When light-reflecting resin 130 is disposed along the column direction, light-reflecting resin 130 may be disposed on every other column or on every other or more columns. Light-reflecting resin 130 may be disposed on both grooves 10e in the row direction and grooves 10e in the column direction.

[0053] The light reflecting resin 130 is placed on the grooves 10e by using, for example, a dispenser device capable of controlling the amount of the light reflecting resin 130 dispensed.

[0054] 9A to 10B are schematic cross-sectional views illustrating a method for manufacturing a light-emitting module according to this embodiment. 9A to 10B includes a step of pressurizing light reflective resin 130 in a reduced pressure atmosphere (also referred to as a resin pressurizing step) using resin pressurizing apparatus 200. First, the configuration of resin pressurizing apparatus 200 will be described. As shown in FIGS. 9A to 10B, the resin pressurizing device 200 has an upper storage section 210, a lower storage section 220, an upper support section 230, a lower support section 240, a diaphragm structure section 250, and a drive section 260.

[0055] The upper storage section 210 is rotatably connected to the lower storage section 220 by a hinge at one end of each section. The lower storage section 220 has an internal space, and has a lower support section 240 and a diaphragm structure section 250 that are movable up and down. The upper storage section 210 closes the internal space of the lower storage section 220 by rotating by the hinge.

[0056] Upper storage section 210 has upper support section 230. Upper support section 230 is disposed on the side that closes the internal space of lower storage section 220 when upper storage section 210 rotates. Upper support section 230 and lower support section 240 are formed of, for example, a rubber-based synthetic resin, and the space closed by upper storage section 210 and lower storage section 220 can be made airtight by upper support section 230 and lower support section 240.

[0057] The diaphragm structure 250 is disposed on the upper surface of the lower support 240, and the periphery of the diaphragm structure 250 is fixed to the lower support 240. One end of the drive unit 260 is connected to the lower part of the lower support 240. The drive unit 260 is disposed so as to be movable up and down through a through hole formed in the bottom of the lower storage unit 220. Therefore, when the drive unit 260 rises, the lower support 240 and the diaphragm structure 250 move upward in the closed space 235, which is a closed internal space. The intermediate body 100b disposed in the closed space 235 is pressurized by the upper support 230 and the diaphragm structure 250.

[0058] The lower storage unit 220 has an exhaust port and an exhaust pipe that are fluidly connected to an exhaust pump and exhaust air from the closed space 235. The exhaust pump exhausts air from the closed space 235 formed by closing the upper storage unit 210 and the lower storage unit 220, and puts the closed space 235 into a reduced pressure state.

[0059] Using such a resin pressing device 200, a process is performed in which a film 140 is placed on the upper surface of the intermediate body 100b shown in Figures 8A and 8B, i.e., on the second surface 10b of the light-guiding member 110, on the light source 20 and on the light-reflective resin 130, and the light-reflective resin 130 is placed over the entire surface of the upper surface of the intermediate body 100b.

[0060] 9A, intermediate body 100b is placed on diaphragm structure 250. Film 140 is placed on upper support 230. Film 140 is adhered to upper support 230 or fixed with adhesive or the like so as not to fall off when upper storage section 210 and upper support 230 rotate and are turned upside down. The fixed position of film 140 to upper support 230 is set so that film 140 overlaps intermediate body 100b in a plan view when upper storage section 210 and upper support 230 rotate to close lower storage section 220.

[0061] 9B, the upper storage section 210 is rotated together with the upper support section 230 on which the film 140 is arranged, to close the lower storage section 220. The intermediate body 100b arranged on the diaphragm structure section 250 is arranged in the closed space 235 opposite the film 140 arranged on the upper support section 230 by the rotation of the upper storage section 210.

[0062] 10A, the driving section 260 rises. Due to the rise of the driving section 260, the lower support section 240 and the diaphragm structure section 250 are pushed upward toward the film 140. Due to the rise of the lower support section 240, the diaphragm structure section 250, and the intermediate body 100b, the light reflecting resin 130 arranged in the intermediate body 100b is pressurized between the film 140 and the light guide member 110.

[0063] At the same time that the light reflective resin 130 between the film 140 and the light guiding member 110 is pressurized by the rise of the driving unit 260, the air in the closed space 235 is exhausted by the exhaust pump. Since the closed space 235 is depressurized by the exhaust, the diaphragm structure 250, together with the intermediate body 100b, is pulled up further above the position where the driving unit 260 and the lower support unit 240 are raised.

[0064] By reducing the pressure in the closed space 235, the film 140 is brought into close contact with the upper surface of the intermediate body 100b, and pressurizes the light-reflective resin 130 from above. By applying pressure from above, the light-reflective resin 130 is stretched along the second surface 10b of the light-guiding member 110. The stretched light-reflective resin 130 covers the entire light source 20. The stretched light-reflective resin 130 also fills the grooves 10e in the row direction and spreads over the entire second surface 10b of the light-guiding member 110. By appropriately setting the air pressure in the reduced-pressure closed space 235, air bubbles remaining in the light-reflective resin 130, spaces or air bubbles between the light-reflective resin 130 and the light-guiding member 110, and spaces or air bubbles between the light-reflective resin 130 and the light source 20 are discharged.

[0065] In the above-described resin pressurizing step, the space depressurizing step of depressurizing the closed space 235 is carried out at the same time. However, for example, the space depressurizing step may be carried out after the resin pressurizing step.

[0066] As shown in Fig. 10B, when the decompression of the closed space 235 and the pressurization of the light reflective resin 130 are completed, air is again introduced into the closed space 235, and the upper storage section 210 is released from the lower storage section 220. When the upper storage section 210 rotates and the closed state is released, an intermediate body 100c is formed on the diaphragm structure section 250. The intermediate body 100c has a film 140 disposed on its upper surface. As shown in Fig. 11A described later, the film 140 is disposed on the light reflective resin 130a disposed over the entire surface of the second surface 10b of the light source 20 and the light guide member 110.

[0067] FIG. 11A is a schematic top view illustrating the method for manufacturing the light emitting module according to this embodiment. FIG. 11B is a schematic perspective view illustrating the method for manufacturing the light emitting module according to this embodiment. In the manufacturing process of the light emitting module 1 described with reference to FIGS. 11A and 11B, a resin flattening apparatus 300 is used to perform a step of pressing the light source 20 and the light reflective resin 130a (also called a flattening step). The top view shown in Fig. 11A shows intermediate body 100c formed in the resin pressurizing step described with reference to Fig. 9A to Fig. 10B. In intermediate body 100c, light reflective resin 130a is disposed over light emitting element 21 and over the entire second surface 10b of light guide member 110, and film 140 is disposed on light reflective resin 130a. FIG. 11B shows a state in which the intermediate body 100c is set in a resin flattening apparatus 300 and a flattening process is carried out by the resin flattening apparatus 300.

[0068] 11A, light reflective resin 130a is arranged so as to fill all of grooves 10e and regions to be divided SL by resin pressurizing device 200 shown in FIGS. 9A to 10B. In this state, the upper surface of light reflective resin 130a is not necessarily flat, and light reflective resin 130a covers electrodes 22a and 22b of light source 20.

[0069] As shown in FIG. 11B, the resin flattening apparatus 300 has a pressing member, for example, a roller 310. The roller 310 has a pressing surface S310. The pressing surface S310 is a surface that is pressed against the upper surface of the preform 100c. The hardness of the pressing surface S310 is lower than the hardness of the light source 20 disposed on the preform 100c. The hardness of the pressing surface S310 is higher than the hardness of the light reflective resin 130a disposed on the preform 100c. The materials of the roller 310 and the pressing surface S310 are determined so as to have such hardness.

[0070] The intermediate body 100c is placed on a placement surface 301a of the resin flattening apparatus 300. When placing the intermediate body 100c, the film 140 is placed facing upward so that the surface on which the film 140 is arranged is substantially parallel to the placement surface 301a.

[0071] Resin flattening apparatus 300 presses roller 310 in the direction of arrow AR1 from film 140 toward mounting surface 301a, which is perpendicular to mounting surface 301a. Resin flattening apparatus 300 presses intermediate body 100c with roller 310 to reduce the height of the upper surface of light reflective resin 130a from mounting surface 301a. At this time, resin flattening apparatus 300 adjusts the degree of pressing so that electrodes 22a, 22b of light source 20 are exposed from light reflective resin 130a.

[0072] Resin flattening device 300 moves roller 310 in the direction of arrow AR2 parallel to mounting surface 301a. Intermediate body 100c can be mounted in any direction with respect to the direction of arrow AR2, and is mounted, for example, so that the direction of arrow AR1 coincides with the direction along the arrangement of light reflective resin 130 shown in FIG. 8A.

[0073] Resin flattening device 300 rolls and moves the upper surface of film 140 in the direction of arrow AR2 while pressing intermediate body 100c in the direction of arrow AR1 at a desired degree by pressing surface S310 and moving roller 310. Light reflective resin 130a is flattened over the entire surface by such a flattening process. By appropriately adjusting and setting the degree of pressing, electrodes 22a, 22b of light source 20 are exposed from light reflective resin 130a.

[0074] In the resin flattening device 300, the pressing and moving of the roller 310 on the intermediate body 100c is not limited to one time, but may be multiple times. When the pressing and moving of the roller 310 is multiple times, the first pressing and moving may be performed in the direction of the arrow AR2, and then the second pressing and moving may be performed by moving in the opposite direction to the arrow AR2. The moving direction may be the same each time. After pressing and moving in the direction of the arrow AR2, the intermediate body 100c may be rotated by 90° and placed, and pressed and moved in the direction of the arrow AR2. The degree of pressing the intermediate body 100c by the roller 310 may be the same for each pressing and moving, or may be different.

[0075] 14A and 14B, the degree of pressure is adjusted and set by the amount of pressure applied by roller 310. As long as it is possible to achieve both flattening of light reflective resin 130a and exposure of electrodes 22a and 22b, the present invention is not limited to this, and for example, the pressure value may be adjusted and set by directly measuring the pressure against the rotation axis of roller 310.

[0076] FIG. 12A is a schematic cross-sectional view illustrating a method for manufacturing a light-emitting module according to an embodiment. FIG. 12B is a schematic top view illustrating the method for manufacturing the light emitting module according to this embodiment. FIG. 12C is a schematic cross-sectional view taken along line XIIC-XIIC in FIG. 12B. As shown in FIG. 12A, intermediate body 100e is formed by a process of provisionally curing light reflective resin 130a (also referred to as a provisional curing process). The provisional curing process is a process of forming provisionally cured light reflective resin 130b. The provisional curing process is performed to facilitate peeling of film 140 arranged on the upper surface of flattened light reflective resin 130b. In the provisional curing process, intermediate body 100e is formed by, for example, short-time heating. The temperature and heating time of the oven for heating intermediate body 100e are appropriately set depending on the material of the light reflective resin and the material of film 140. After the provisional curing process, a peeling process is performed to peel off film 140.

[0077] As shown in FIG. 12B and FIG. 12C, after the step of peeling off the film 140 (also called the peeling step), the light reflective resin 130b is heated at a predetermined temperature for a predetermined time to harden the light reflective member 130c (also called the main hardening step) to form the intermediate 100f. In the main hardening step, the temperature and heating time of the oven for heating the intermediate 100f are appropriately set according to the material of the light reflective resin. In this specific example, in order to facilitate peeling off the film 140, the main hardening step is performed after the provisional hardening step, but depending on the material of the film and the light reflective resin, the provisional hardening step can be omitted and only one main hardening step can be performed. The top surface of the main hardened light reflective member 130c maintains flatness, and the electrodes 22a and 22b of the light source 20 are exposed.

[0078] 13A and 13B are schematic cross-sectional views illustrating a method for manufacturing the light emitting module according to this embodiment. The cross-sectional views shown in Figs. 13A and 13B are cross-sectional views of the intermediate bodies 100g and 100h taken along a cross-sectional line corresponding to line XIIC-XIIC in Fig. 12B. As shown in Fig. 13A, an intermediate body 100g having a conductive paste disposed thereon is formed. In the intermediate body 100g, the conductive paste is disposed on the upper surface of the planarized light reflective member 130c. The intermediate body 100g is heated in an oven or the like to harden the conductive paste. As a result, the wiring layer 40 is formed.

[0079] Thereafter, the wiring layer 40 is divided into wirings 41 and 42 by laser etching. Specifically, the wiring layer 40 is irradiated with laser light L at a portion between a portion connected to the electrode 22a of the light source 20 and a portion connected to the electrode 22b, and this portion is removed. As a result, the wiring 41 connected to the electrode 22a is formed, and the wiring 42 connected to the electrode 22b is formed.

[0080] 13B, an insulating resin material is disposed so as to cover the upper surface of light reflective member 130c and wiring layer 40 including wirings 41 and 42, and is cured. As a result, an intermediate body 100h on which insulating film 50 is formed is formed.

[0081] Thereafter, the intermediate body 100h is divided along the intended division regions SL to separate the light reflective members 130c and the light guide members 110, and the light emitting modules 1 shown in FIG. 1 are formed.

[0082] A specific example in which the electrodes 22a, 22b of the light source 20 are exposed from the light reflective resin 130a in the case where the resin flattening apparatus 300 described in relation to FIG. 11B is used will be described. Fig. 14A is a schematic cross-sectional view for explaining the amount of pressing by roller 310. Fig. 14B is a graph showing the relationship between the amount of pressing by roller 310 and the position of the upper surface of the light reflecting resin relative to the positions of electrodes 22a and 22b. In FIG. 14A, in order to avoid complexity of the illustration, the films disposed on the light reflecting resin 130a and the light source 20 are omitted.

[0083] FIG. 14A shows an example of the definition of the pushing amount X. FIG. 14A also shows the change in the position of the upper surface of light reflecting resin 130a before and after the pushing of roller 310. Roller 310 and upper surface S130a of light reflecting resin 130a shown by two-dot chain lines in FIG. 14A respectively represent the positions of roller 310 and upper surface S130a before pushing. Roller 310 and upper surface S130b of light reflecting resin 130a shown by solid lines respectively represent the positions of roller 310 and upper surface S130b of light reflecting resin 130a after pushing. In the explanation related to FIG. 14A and FIG. 14B, the term "position" refers to a length in a case where first surface 10a of light guide member 110 is used as a reference, the direction perpendicular to first surface 10a, and the direction from first surface 10a toward electrodes 22a, 22b is taken as the positive direction.

[0084] As shown in FIG. 14A, the pressing amount X of the roller 310 is defined as the amount of change in the position of the rotation axis C of the roller 310 before and after pressing. Before pressing by the roller 310, the position of the upper surface S130a of the light reflective resin 130a is higher than the positions of the electrodes 22a and 22b, as shown by the dashed line in FIG. 14A. In other words, the electrodes 22a and 22b are not exposed from the light reflective resin 130a. The hardness of the pressing surface of the roller 310 is lower than the hardness of the light source 20 including the electrodes 22a and 22b, and higher than the hardness of the light reflective resin 130a. Therefore, after pressing by the roller 310, as shown by the solid line in FIG. 14A, the position of the upper surface S130b of the light reflective resin 130a is lowered to the position of the upper surface S130b of the light reflective resin 130a, while the positions of the electrodes 22a and 22b remain unchanged. Therefore, by setting the pressing amount X to an appropriate value, it becomes possible to control the length of the electrodes 22a, 22b exposed from the light reflecting resin 130a.

[0085] 14A, the positions of the tips of electrodes 22a and 22b are preset as target position Y2. Position Y1 of upper surface S130b of light reflective resin 130a after pressing by roller 310 is measured, and difference ΔY between target position Y2 and position Y1 of upper surface S130b is calculated.

[0086] Fig. 14B is a graph in which the horizontal axis represents the amount of pressing X and the vertical axis represents the difference ΔY in the position Y1 of the upper surface S130b of the light-reflective resin when the position Y2 of the tips of the electrodes 22a and 22b of the light source 20 is used as a reference. In the graph of Fig. 14B, the X-axis increases from X1 to X5, and the ΔY-axis indicates that above 0, the position Y1 of the upper surface S130b is higher than the position Y2 of the tips, and the electrodes 22a and 22b are not exposed. Below 0 on the ΔY-axis, the position Y1 of the upper surface S130b is lower than the position Y2 of the tips, and the electrodes 22a and 22b are exposed.

[0087] As shown in FIG. 14B, the position difference ΔY becomes smaller as the pressing amount X is increased. In this example, even if the pressing amount X is increased from X1 to X2, the tips of the electrodes 22a and 22b are not exposed from the upper surface S130b. If the pressing amount X is further increased to X3 or X4, the tips of the electrodes 22a and 22b are exposed from the upper surface S130b. If the pressing amount X is further increased to X5, the exposed length of the electrodes 22a and 22b becomes longer. In other words, since the position difference ΔY represents the exposed length of the electrodes 22a and 22b, it is possible to set an appropriate exposed length of the electrodes 22a and 22b by appropriately setting the pressing amount X of the roller 310.

[0088] For example, the target position Y2 may vary depending on the accuracy of molding the light source 20 and the light guiding member 110, the accuracy of arranging the light source 20 in the light guiding member 110, etc. Therefore, by setting an appropriate pushing amount X in consideration of the setting accuracy of the target position Y2, it is possible to ensure exposure of the electrodes 22a and 22b.

[0089] In this manner, the light emitting module 1 can be manufactured.

[0090] The effects of the manufacturing method for the light emitting module 1 of this embodiment will be described. In order to achieve a thin light-emitting module 1 of this embodiment, it is necessary to thin each of the members, such as the light guide member 10, the light source 20, the light reflective member 30, and the wiring layer 40. When thinning the light reflective member 30, in the process of forming the light reflective member 30, residual air bubbles and the like may cause defects such as cracks when the resin is cured. In the manufacturing method of the light-emitting module 1 of this embodiment, a resin pressurizing process is performed in the process of forming the light reflective member 30, so that it is possible to form a thin light reflective member 30 while suppressing residual air bubbles and preventing defects when curing.

[0091] In addition, in the resin pressurizing step, the light reflective resin 130 can be pressurized between the film 140 and the light guide member 110. This allows the light reflective resin 130 to be arranged almost evenly over the entire surface of the light source 20 and the second surface 10b of the light guide member 110, even if the light reflective resin 130 is not arranged over the entire surface of the light source 20 and the light guide member 110 in advance. For example, if the light reflective resin 130 is arranged linearly for each row of the matrix in which the light source 20 is arranged, or every other row, an existing dispenser device can be used. When using a dispenser device, the light reflective resin 130 is arranged linearly, so that the number of times the dispenser device is controlled for discharge can be reduced. This allows the amount of light reflective resin 130 to be uniformly controlled, and the thickness of the light reflective resin 130 to be stably controlled.

[0092] In manufacturing the light-emitting module 1, it is necessary to form the wiring layer 40 while suppressing the occurrence of defects such as disconnection. By sufficiently planarizing the surface of the light-reflective member 30 on which the wiring layer 40 is formed, it is possible to stably form the wiring layer 40. On the other hand, it is also necessary to reliably establish electrical connection between the wiring layer 40 and the electrodes 22a, 22b of the light source 20, and it is necessary to achieve both planarization of the surface of the light-reflective member 30 on which the wiring layer 40 is formed and exposure of the electrodes 22a, 22b.

[0093] The manufacturing method of the light emitting module 1 of this embodiment includes a flattening step. In the flattening step, a roller 310 is pressed against the film 140 to press the light source 20 and the light reflective resin 130a. This makes it possible to expose the electrodes 22a and 22b from the light reflective resin 130a.

[0094] The hardness of pressing surface S310 of roller 310 is set to be lower than the hardness of light source 20 and higher than the hardness of light reflective resin 130a. Roller 310 presses light source 20 and light reflective resin 130a via film 140, thereby lowering the position of the upper surface of light reflective resin 130a while maintaining the position of light source 20. Since light source 20 is disposed on light guide member 110 with electrodes 22a, 22b facing up, by appropriately setting the degree of pressing by roller 310, it is possible to lower the position of the upper surface of light reflective resin 130a while maintaining the position of light source 20, thereby exposing electrodes 22a, 22b.

[0095] By rolling roller 310 in a constant direction on film 140, the degree of pressure applied to light source 20 and light reflective resin 130a can be made substantially constant over the entire surface of light guide member 110. Therefore, the upper surface of light reflective resin 130a is flattened, and electrodes 22a and 22b can be exposed from flattened light reflective resin 130a.

[0096] The flattened light-reflective resin can be subjected to a provisional curing step and a full curing step to form a cured light-reflective member. By introducing a provisional curing step in which heating is performed for a short time, it is possible to easily peel off the resin film 140. After the film 140 is peeled off, a heating step is performed for a predetermined time to form the light-reflective member 30 having the desired hardness. Depending on the materials of the film 140 and the light-reflective resin 130, it is possible to form the light-reflective member in a single full curing step without performing the provisional curing step.

[0097] Second embodiment The method of forming the light-reflective member 30 applied to the light-emitting module 1 of the first embodiment can also be applied to the method of forming the sealing member 26 of the light source 20 shown in Fig. 3. In this embodiment, a method of manufacturing the light source 20 will be described. The light-emitting device according to this embodiment is the light source 20 shown in Fig. 3, and will hereinafter be referred to as the light-emitting device 20. The configuration of the light-emitting device 20 is the same as the light source described in relation to Fig. 3, and detailed description will be omitted.

[0098] (Method of Manufacturing Light Emitting Device 20) 15A to 17B are schematic cross-sectional views illustrating the method for manufacturing the light emitting device according to this embodiment.

[0099] 15A, a base material (also referred to as a support member) 1001 is prepared. A phosphor sheet 1024 is disposed on one surface 1002a of the base material 1001. The phosphor sheet 1024 is disposed on the base material 1001, for example, using an adhesive or the like disposed between the phosphor sheet 1024 and the base material 1001, and the phosphor sheet 1024 is fixed onto the surface 1002a of the base material 1001.

[0100] The phosphor sheet 1024 is divided into individual pieces when the light emitting device 20 is formed, and functions as the light-transmitting member 24 shown in FIG. 3. Therefore, the phosphor sheet 1024 is formed of the same material as the light-transmitting member 24. The base material 1001 is provided to fix the intermediate formed on the phosphor sheet 1024 at a desired position together with the phosphor sheet 1024. The base material 1001 is, for example, a tape-shaped member made of a polyimide resin-based material. Note that the intermediate product formed on the phosphor sheet 1024 is called an intermediate, as in the description of the manufacturing method for the light emitting module 1 of the first embodiment.

[0101] 15B, there is a step of preparing an intermediate (also referred to as a second member) 1000 including a light emitting element 21 and a base material 1001 on which the light emitting element 21 is arranged. For example, the light emitting element 21 is arranged on a phosphor sheet 1024 to form the intermediate 1000. The light emitting element 21 is arranged with the light extraction surface 21a facing the phosphor sheet 1024 and the electrode formation surface 21b facing the opposite side to the phosphor sheet 1024.

[0102] In the description of the manufacturing method of the light emitting device 20, as in the description of the manufacturing method of the light emitting module 1 of the first embodiment, for convenience of illustration, the direction from the light extraction surface 21a of the light emitting device 20 toward the electrode forming surface 21b is referred to as "upper", "upper part", or "upper", and the direction from the electrode forming surface 21b toward the light extraction surface 21a is referred to as "lower", "lower part", or "below". As in the case of the manufacturing method of the light emitting module 1, these do not necessarily coincide with the direction of gravity. Therefore, the light emitting element 21 is arranged with the light extraction surface 21a facing downward and the electrode forming surface 21b facing upward.

[0103] In the intermediate body 1000, two light emitting elements 21 are arranged side by side in this example, but three or more light emitting elements 21 may be arranged side by side, or an intermediate body 1000 may be formed for each light emitting element 21. In the intermediate body 1000, the light emitting elements 21 are not limited to being arranged side by side in a row, and may be arranged in a matrix.

[0104] In the phosphor sheet 1024, a light-transmitting adhesive is applied in advance to the surface on which the light-emitting element 21 is to be disposed, and the light extraction surface 21a of the light-emitting element 21 is disposed on the adhesive. After that, the intermediate body 1000 is heated for a predetermined time to harden the adhesive and form the light-transmitting layer 25.

[0105] As shown in FIG. 15C, the method includes a step of disposing the sealing resin 1026 on the electrodes 22a, 22b and the electrode formation surface 21b. For example, the sealing resin 1026 is disposed on the electrodes 22a, 22b and the electrode formation surface 21b of the light-emitting element 21, and the intermediate body 1000a is formed. In this example, the sealing resin 1026 is disposed over the entire electrode formation surface 21b and the electrodes 22a, 22b, and is disposed so as to cover a part of the light-transmitting layer 25. The sealing resin 1026 may cover the entire electrodes 22a, 22b and cover a part of the electrode formation surface 21b. When a plurality of light-emitting elements 21 are disposed in the intermediate body 1000a, the sealing resin 1026 may be disposed continuously over the plurality of light-emitting elements 21 arranged in a row, not limited to the case where the sealing resin 1026 is disposed for each light-emitting element 21. In this case, the sealing resin 1026 is disposed over the plurality of light-emitting elements 21, and is also disposed in the area between the light-emitting elements 21. The sealing resin 1026 is not limited to being disposed on the light emitting element 21, but may be disposed along the region between adjacent light emitting elements 21.

[0106] As shown in FIG. 16A, the intermediate 1000b is formed by the resin pressurizing apparatus 200 described in relation to FIGS. 9A to 10B. In forming the intermediate 1000b, a resin pressurizing step is performed by the resin pressurizing apparatus 200. The space depressurizing step is a step of arranging a film 1140 on the surface 1024a of the phosphor sheet 1024, on the light emitting element 21, and on the sealing resin 1026a under reduced pressure. The resin pressurizing step is a step of pressurizing the sealing resin 1026 with the film 1140. In this example, the resin pressurizing apparatus 200 simultaneously performs the space depressurizing step and the resin pressurizing step, but the space depressurizing step may be performed after the resin pressurizing step, as in the case of the manufacturing method of the light emitting module 1 of the first embodiment.

[0107] In the space decompression step, air bubbles remaining in the sealing resin 1026, spaces or air bubbles between the sealing resin 1026 and one surface 1024a of the phosphor sheet 1024, and spaces or air bubbles between the sealing resin 1026 and the light emitting elements 21 are discharged.

[0108] In the resin pressurizing step, the sealing resin 1026 placed on the light emitting element 21 is formed into sealing resin 1026a that spreads over one surface 1024a of the phosphor sheet 1024 and the entire light emitting element 21.

[0109] As shown in Fig. 16B, an intermediate body 1000c is formed by the resin-planarizing apparatus 300 described in relation to Fig. 11A and Fig. 11B. The intermediate body 1000c includes a planarized sealing resin 1026b.

[0110] As shown in FIG. 16B, the roller 310 of the resin flattening device 300 moves in the direction of the arrow AR2 while pressing the intermediate body 1000c in the direction of the arrow AR1 on the film 1140. The hardness of the pressing surface S310 of the roller 310 is higher than the hardness of the sealing resin 1026b and lower than the hardness of the light emitting element 21. Therefore, the thickness of the sealing resin 1026b in the intermediate body 1000c is reduced. As described in relation to FIG. 14A and FIG. 14B, the pressing amount of the roller 310 is appropriately set, so that the electrodes 22a and 22b are exposed from the sealing resin 1026b. Furthermore, the upper surface of the sealing resin 1026b is flattened by the movement of the roller 310 in the direction of the arrow AR2.

[0111] 17A, an intermediate body 1000d is formed by heating at a predetermined temperature for a predetermined time. In the intermediate body 1000d, the sealing resin 1026b is hardened by heating at a predetermined temperature for a predetermined time, and a sealing member 1026c is formed.

[0112] 17B, ​​a peeling step of peeling off the film 1140 is performed to form an intermediate 1000e. In the intermediate 1000e, the film 1140 is peeled off from the cured sealing member 1026c. By peeling off the film 1140, the flattened surface S1026c of the sealing member 1026c is exposed. The sealing resin may not be cured all at once, but may be temporarily cured by heating for a short period of time, and then the film 1140 may be peeled off, and then the sealing resin may be cured by heating for a predetermined period of time, as in the manufacturing method of the light emitting module 1 of the first embodiment.

[0113] FIG. 17C is a schematic cross-sectional view illustrating a modification of the manufacturing method for the light emitting device according to the second embodiment. 17C shows an intermediate 1000e1 which is a modification of the intermediate 1000e shown in FIG. 17B. As shown in FIG. 17C, in the intermediate 1000e1, the sealing member 1026c may be concave between adjacent light emitting elements 21. In the concave portion of the sealing member 1026c, the exposed surface S1026c is concave. This is because the amount of sealing resin forming the sealing member 1026c1 between adjacent light emitting elements 21 is relatively large, and therefore the amount of shrinkage is large when the resin is cured. The degree of concavity may be adjusted by the distance between adjacent light emitting elements 21 or by the pressing amount of the roller 310.

[0114] Thereafter, the intermediate body 1000e is cut between adjacent light emitting elements 21 and separated into individual pieces, whereby the light emitting devices 20 are formed.

[0115] The above-mentioned forming process of the sealing member 26 can be applied to the light source 20 shown in FIG. 3 as well as to the manufacturing method of the light source 20a shown in FIG. 4A. In the application to the manufacturing method of the light source 20a, after the preparation process of the base material 1001 described in relation to FIG. 15A, the light adjustment member 27 may be arranged before the phosphor sheet 1024 is arranged on the base material 1001, and the phosphor sheet 1024 may be arranged on the light adjustment member 27. In addition, the forming process of the sealing member 26 may be applied to the manufacturing method of the light source 20e shown in FIG. 5B. In the application to the manufacturing method of the light source 20e, it can be realized by using a light-transmitting sheet that does not contain phosphor instead of the phosphor sheet 1024. Before arranging the light-transmitting sheet, the light adjustment member 27 is arranged on the base material 1001, and the light-transmitting sheet is arranged on the light adjustment member 27, so that the sealing member 26 of the light source 20e in FIG. 5B can be formed.

[0116] The effects of the method for manufacturing the light emitting device 20 of this embodiment will be described. The manufacturing method of the light emitting device 20 of this embodiment includes a step (also referred to as a placement step) of placing the film 1140 on one surface 1024a of the phosphor sheet 1024, on the light emitting element 21, and on the sealing resin 1026 under a reduced pressure atmosphere. By performing this step, it is possible to discharge air bubbles remaining in the sealing resin 1026, spaces and air bubbles existing between the sealing resin 1026 and the surface 1024a, and spaces and air bubbles existing between the sealing resin 1026 and the light emitting element 21. By discharging these spaces and air bubbles, it is possible to prevent defects such as cracks that may occur when the sealing resin 1026 is hardened, and it is possible to form a stably thin sealing member 26.

[0117] When the arrangement step is performed, a resin pressurizing step can be performed, which is a step of pressurizing the sealing resin 1026 between the film 1140 and the surface 1024a. By performing the resin pressurizing step, the sealing resin 1026 can be arranged almost evenly over the entire surface of the surface 1024a and the light emitting element 21, even if the sealing resin 1026 is not arranged over the entire surface of the surface 1024a and the light emitting element 21 in advance.

[0118] The manufacturing method of light emitting device 20 of this embodiment includes a step (also called a pressing step) of pressing light emitting element 21 and sealing resin 1026a by pressing roller 310 against film 1140. This makes it possible to expose electrodes 22a and 22b from sealing resin 1026a.

[0119] The hardness of the pressing surface S310 of the roller 310 is set to be lower than the hardness of the light emitting element 21 and higher than the hardness of the sealing resin 1026. By pressing the light emitting element 21 and the sealing resin 1026a via the film 1140 with the roller 310, the position of the upper surface of the sealing resin 1026a is lowered while the position of the light emitting element 21 is maintained. Since the light emitting element 21 is disposed on the phosphor sheet 1024 with the electrodes 22a, 22b facing up, by appropriately setting the degree of pressing by the roller 310, the position of the upper surface of the sealing resin 1026a can be lowered to expose the electrodes 22a, 22b while maintaining the position of the light emitting element 21.

[0120] By rolling and moving the roller 310 in a constant direction on the film 1140, the degree of pressure on the light emitting element 21 and the sealing resin 1026a can be made almost constant over the entire surface of the intermediate body 1000c. Therefore, the upper surface of the sealing resin 1026a is flattened, and the electrodes 22a and 22b can be exposed from the flattened sealing resin 1026a.

[0121] According to the embodiment described above, it is possible to realize a method for manufacturing a light emitting module and a method for manufacturing a light emitting device that can stably reduce the thickness.

[0122] The embodiments of the present invention may include the following methods for manufacturing a light emitting module and a light emitting device.

[0123] [Section 1] preparing a first member including a light source having an electrode and a light guiding member having a first surface and a second surface located opposite to the first surface, the light source being disposed on the second surface with the electrode facing up; disposing a light reflective resin on the second surface of the light guiding member; disposing a film on the second surface of the light guiding member, on the light source, and on the light reflective resin in a reduced pressure atmosphere; a step of pressing the light source and the light reflective resin by pressing a pressing member against the film; peeling off the film; A method for manufacturing a light emitting module comprising:

[0124] [Section 2] The step of preparing the first member includes: Providing the light source; preparing the light guide member; placing a light source on the second surface with the electrode facing up; Item 2. A method for producing a light-emitting module according to item 1, comprising:

[0125] [Section 3] 3. The method for manufacturing a light emitting module according to item 1 or 2, wherein the step of arranging the film includes a step of pressing the light reflective member between the film and the light guiding member.

[0126] [Section 4] The pressing member is a roller, 4. The method for manufacturing a light-emitting module according to any one of items 1 to 3, wherein the hardness of a pressing surface of the roller that presses against the film is lower than the hardness of the light source and higher than the hardness of the light-reflecting resin before curing.

[0127] [Section 5] 5. The method for manufacturing a light emitting module according to item 4, wherein in the pressing step, the shortest distance from the first surface of the light guiding member to the pressing surface is set shorter than the shortest distance from the first surface to the tip of the electrode.

[0128] [Section 6] a step of temporarily curing the light reflective resin after the pressing step and before the peeling step of the film; 5. The method for producing a light emitting module according to any one of items 1 to 4, further comprising a step of curing the provisionally cured light reflective resin after the step of peeling off the film.

[0129] [Section 7] the light guide member includes a recess on the second surface, 7. The method for manufacturing a light emitting module according to any one of items 1 to 6, wherein the step of arranging the light source includes a step of arranging the light source in the recess.

[0130] [Section 8] preparing a second member including a light emitting element including a light extraction surface, an electrode formation surface located on the opposite side of the light extraction surface, and an electrode disposed on the electrode formation surface, and a support member on one surface of which the light emitting element is disposed from the light extraction surface side; placing a sealing resin on the electrodes and on the electrode formation surface; placing a film on the one surface of the support member, on the light emitting element, and on the sealing resin in a reduced pressure atmosphere; a step of pressing the light emitting element and the sealing resin by pressing a pressing member against the film; peeling off the film; A method for manufacturing a light emitting device comprising the steps of:

[0131] [Section 9] a step of temporarily curing the sealing resin after the pressing step and before the peeling step; 9. The method for producing a light emitting device according to item 8, further comprising the step of curing the provisionally cured sealing resin after the step of peeling off the film.

[0132] [Section 10] 9. The method for producing a light emitting module according to item 8, further comprising a step of curing the sealing resin after the pressing step and before the film peeling step.

[0133] [Section 11] 11. The method for producing a light emitting device according to any one of items 8 to 10, wherein the step of preparing the second member comprises disposing the light emitting element on one surface of the support member via a wavelength conversion member.

[0134] [Section 12] 11. The method for manufacturing a light emitting device according to any one of items 8 to 10, wherein the step of preparing the second member comprises arranging the light emitting element on one surface of the support member via a light blocking member and a wavelength conversion member arranged on the light blocking member.

[0135] Although several embodiments of the present invention have been described above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]

[0136] 1 light emitting module, 10 light guide member, 10a first surface, 10b second surface, 10d recess (second recess), 10e groove, 20, 20a to 20f light source (light emitting device), 21 light emitting element, 22a, 22b electrode, 24, 24a light transmissive member, 26 sealing member, 27 light adjustment member, 30 light reflective member, 40 wiring layer, 50 insulating film, 60 light adjustment member, 70 fixing member, 100, 100a to 100h intermediate body, 110 light guide member, 130, 130a, 130b light reflective resin, 130c light reflective member, 200 resin pressure device, 300 resin flattening device, 310 roller, 1001 base material, 1024 phosphor sheet, 1026, 1026a, 1026b Sealing resin, 1026c sealing material, S310 pressing surface

Claims

1. preparing a first member including a light source having an electrode and a light guiding member having a first surface and a second surface located on the opposite side of the first surface, the light source being disposed on the second surface with the electrode facing up; disposing a light reflective resin on the second surface of the light guiding member; disposing a film on the second surface of the light guiding member, on the light source, and on the light reflective resin in a reduced pressure atmosphere; a step of pressing the light source and the light reflective resin by pressing a pressing member against the film; peeling off the film; A method for manufacturing a light emitting module comprising:

2. The step of preparing a first member includes: Providing the light source; preparing the light guide member; placing a light source on the second surface with the electrode facing up; A method for manufacturing the light emitting module according to claim 1 , comprising:

3. The method for manufacturing a light emitting module according to claim 1 , wherein the step of disposing the film includes a step of pressing the light reflective member between the film and the light guide member.

4. The pressing member is a roller, 4. A method for manufacturing a light-emitting module according to claim 1, wherein the hardness of the pressing surface of the roller that presses against the film is lower than the hardness of the light source and higher than the hardness of the light-reflecting resin before curing.

5. The method for manufacturing a light emitting module according to claim 4 , wherein in the pressing step, a shortest distance from the first surface of the light guiding member to the pressing surface is set shorter than a shortest distance from the first surface to a tip of the electrode.

6. a step of temporarily curing the light reflective resin after the pressing step and before the peeling step of the film; 4. The method for manufacturing a light emitting module according to claim 1, further comprising the step of curing the provisionally cured light reflective resin after the step of peeling off the film.

7. the light guide member includes a recess on the second surface, 4. The method for manufacturing a light emitting module according to claim 1, wherein the step of arranging the light source includes a step of arranging the light source in the recess.

8. preparing a second member including a light emitting element including a light extraction surface, an electrode formation surface located on the opposite side of the light extraction surface, and an electrode disposed on the electrode formation surface, and a support member on one surface of which the light emitting element is disposed from the light extraction surface side; placing a sealing resin on the electrodes and on the electrode formation surface; placing a film on the one surface of the support member, on the light emitting element, and on the sealing resin in a reduced pressure atmosphere; a step of pressing the light emitting element and the sealing resin by pressing a pressing member against the film; peeling off the film; A method for manufacturing a light emitting device comprising the steps of:

9. a step of temporarily curing the sealing resin after the pressing step and before the peeling step; The method for manufacturing a light emitting device according to claim 8 , further comprising the step of curing the provisionally cured sealing resin after the step of peeling off the film.

10. The method for manufacturing a light emitting module according to claim 8 , further comprising the step of hardening the sealing resin after the pressing step and before the step of peeling off the film.

11. 11. The method for manufacturing a light emitting device according to claim 8, wherein the step of preparing the second member comprises disposing the light emitting element on one surface of the support member via a wavelength conversion member.

12. The method for manufacturing a light emitting device described in any one of claims 8 to 10, wherein the step of preparing the second member comprises arranging the light emitting element on one surface of the support member via a light-shielding member and a wavelength conversion member arranged on the light-shielding member.

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