Integrated encapsulating sheet, light-emitting electronic component and method for manufacturing light-emitting electronic component

Abstract

To provide an integrated encapsulating sheet capable of manufacturing a light-emitting electronic component in a shorter process time, a light-emitting electronic component using the sheet, and a method for manufacturing a light-emitting electronic component.SOLUTION: The present invention provides: an integrated encapsulating sheet 1 that is pressure-bonded to a surface on which a plurality of light-emitting elements are arranged in an element-mounted substrate on which the plurality of light-emitting elements are arranged, where a transparent curable resin layer 10 and a semi-transparent layer 11 are laminated in this order from the side closest to the plurality of light-emitting elements when pressure-bonded, and the transparent curable resin layer 10 contains a photocurable resin composition; a light-emitting electronic component; and a method for manufacturing the light-emitting electronic component.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an integrated encapsulating sheet, a light-emitting electronic component, and a method for manufacturing a light-emitting electronic component. [Background technology]

[0002] In recent years, displays using extremely small light-emitting diodes called mini-LEDs or micro-LEDs have been attracting attention. There are roughly two known methods for using such extremely small light-emitting diodes in displays. One is to arrange a large number of light-emitting diodes on a substrate to form a backlight for liquid crystal, and to locally control the brightness of the backlight. The other is to make light-emitting diodes of each color (red, green, and blue) emit light, sending each color of light to the viewer's eyes on a pixel-by-pixel basis.

[0003] Light-emitting diodes such as mini LEDs or micro LEDs are generally arranged on a substrate. When multiple light-emitting diodes (referred to as light-emitting elements) are arranged on a substrate, it is necessary to prevent light diffusion between adjacent light-emitting elements. As a method for shielding light between multiple light-emitting elements with a resin having a light diffusion prevention function, for example, a method using a dry film is known (see Patent Document 1). The dry film is a film obtained by applying and drying a light-diffusing resin composition on a protective film.

[0004] When the dry film is pressed onto a substrate from above a number of light-emitting elements, a light-diffusing resin layer is formed not only in the gaps between the light-emitting elements but also on the upper surface (light-emitting surface) of the light-emitting elements. Under such circumstances, the resin layer may block the light from reaching the viewer of the display. To prevent this, the above-mentioned conventional technology employs a method in which the light-emitting surface of the light-emitting element is etched by plasma treatment or the like to remove the resin layer on the light-emitting surface, and the removed surface is covered with a light-transmitting sealant. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2022-22562 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the above-mentioned conventional technology requires a long time for the etching process, which leads to an increase in manufacturing costs. Also, it is difficult to completely remove the resin layer on the light-emitting surface of the light-emitting element, and as a result, it is difficult to completely prevent the diffusion of light that should reach the viewer side of the display. In addition, a step of laminating a highly transparent sealing film is required after the etching process, which increases the number of manufacturing processes.

[0007] In view of the above problems, the present inventors have developed an integrated encapsulating sheet having one or more curable resin layers formed on one surface of a film substrate prior to the present invention. The inventors have found that a structure that can reduce light diffusion between light-emitting elements and does not block light emitted from the light-emitting elements can be realized by pressing the integrated encapsulating sheet against a light-emitting element so that the curable resin layer side faces the light-emitting surface side of the light-emitting element and curing the curable resin layer.

[0008] However, it was found that the technology developed prior to the present invention required further improvement. A thermosetting resin is generally used as a raw material for the curable resin layer. Since the thermosetting resin requires a long time to cure, there is a problem that the process time required for production is long.

[0009] The present invention has been made to solve the above problems, and aims to provide an integrated encapsulating sheet capable of manufacturing light-emitting electronic components in a shorter process time, a light-emitting electronic component using the sheet, and a method for manufacturing a light-emitting electronic component. [Means for solving the problem]

[0010] (1) An integrated encapsulating sheet according to one embodiment for achieving the above object is an integrated encapsulating sheet that is pressure-bonded to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface being in contact with the element-mounted substrate, the surface being in contact with the surface of ... During the compression bonding, a transparent curable resin layer and a semi-transparent layer are laminated in this order from the side closer to the plurality of light-emitting elements, The transparent curable resin layer contains a photocurable resin composition. (2) In the integrated encapsulating sheet according to another embodiment, preferably, the semi-transparent layer may have a total light transmittance of 20 to 80%. (3) In the integrated encapsulating sheet according to another embodiment, preferably, the transparent curable resin layer has a total light transmittance of 50% or more, and may be higher than the total light transmittance of the semitransparent layer. (4) In the integrated encapsulating sheet according to another embodiment, preferably, the semi-transparent layer may have a transmittance of 10% or more for ultraviolet light having a wavelength of 365 nm. (5) In the integrated encapsulating sheet according to another embodiment, preferably, the translucent layer is formed by laminating at least a coating layer and a support film layer, The coating layer may be in contact with the transparent curable resin layer. (6) In the integrated encapsulating sheet according to another embodiment, preferably, the translucent layer is formed by laminating at least the support film layer and a hard coat layer, The support film layer may be located on the transparent curable resin layer side. (7) In the integrated encapsulating sheet according to another embodiment, preferably, at least one of the support film layer, the coating layer, and / or the hard coat layer may have a total light transmittance of 20 to 70%. (8) In the integral encapsulating sheet according to another embodiment, preferably, at least one of the support film layer, the coating layer, and / or the hard coat layer may contain a black pigment or a black dye. (9) In the integrated encapsulating sheet according to another embodiment, preferably, the black pigment may be carbon black. (10) In the integrated encapsulating sheet according to another embodiment, preferably, the transparent curable resin layer has a storage modulus of 1.0×10 at 100° C. 7 It may be less than Pa. (11) In the integrated encapsulating sheet according to another embodiment, preferably, the transparent curable resin layer contains a high molecular weight resin, The high molecular weight resin may have a weight average molecular weight of 100,000 to 1,000,000. (12) In the integrated encapsulating sheet according to another embodiment, preferably, the high molecular weight resin may have a weight average molecular weight of 120,000 to 500,000. (13) In the integrated encapsulating sheet according to another embodiment, preferably, a black curable resin layer is provided on a surface of the transparent curable resin layer opposite to the translucent layer, The black curable resin layer may have a total light transmittance of 0 to 30%. (14) In the integrated encapsulating sheet according to another embodiment, preferably, the storage modulus of the black curable resin layer at 100° C. is 1.0×10 5 Pa or less and may be lower than the storage modulus of the transparent curable resin layer. (15) In order to achieve the above object, a light-emitting electronic component according to one embodiment includes: an element-mounted substrate having a plurality of light-emitting elements disposed on the substrate; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, the integrated encapsulating cured sheet has a resin layer and a semi-transparent layer laminated in this order from the side closer to the element-mounted substrate, At least a portion of the resin layer may be filled between the plurality of light emitting elements. (16) In the light-emitting electronic component according to another embodiment, preferably, the resin layer includes at least a transparent resin layer, and the thickness of the transparent resin layer is 1.05 to 5 times the height of the plurality of light-emitting elements. (17) In a light-emitting electronic component according to another embodiment, the resin layer preferably includes at least a black resin layer in addition to the transparent resin layer, the black resin layer is formed between the element-mounted substrate and the transparent resin layer, The transparent resin layer may have a thickness of 0.1 to 5 times the height of the plurality of light emitting elements, and the black resin layer may have a thickness of 0.1 to 0.9 times the height of the plurality of light emitting elements. (18) A method for producing an integrated encapsulating sheet according to one embodiment for achieving the above object comprises: In an element-mounted substrate having a plurality of light-emitting elements arranged on a substrate, a surface on which the plurality of light-emitting elements are arranged is provided, The integrated encapsulating sheet according to (1) or (13) is pressed, At least a portion of the transparent curable resin layer is filled between the plurality of light emitting elements; The transparent curable resin layer is photocured. Effect of the Invention

[0011] According to the present invention, it is possible to provide an integrated encapsulating sheet capable of producing a light-emitting electronic component in a shorter process time, a light-emitting electronic component using the sheet, and a method for producing a light-emitting electronic component. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet according to one embodiment when cut along the thickness direction. [Diagram 2] FIG. 2 shows a cross-sectional view taken in the same manner as FIG. 1 when the integrated encapsulating sheet of FIG. 1 is disposed so that the transparent curable resin layer thereof is in contact with the top surface of the light emitting element of the element-mounted substrate. [Diagram 3] 3 shows a cross-sectional view taken in the same direction as FIG. 1, in a state where the integrated encapsulating sheet has been pressure-bonded to the element-mounted substrate, proceeding from the stage shown in FIG. 2, up to a state where a part of the transparent curable resin layer shown in FIG. 1 is embedded between the light-emitting elements. [Figure 4] FIG. 4 shows a cross-sectional view, seen from the same angle as FIG. 1, of a light-emitting electronic component manufactured by proceeding further from the stage shown in FIG. 3, peeling off the protective film on the hard coat layer, and carrying out a curing treatment. [Diagram 5]FIG. 5 shows a cross-sectional view of an integrated encapsulating sheet according to another embodiment when cut along the thickness direction. [Figure 6] FIG. 6 shows a cross-sectional view taken in the same direction as FIG. 5 of a light-emitting electronic component manufactured by pressure-bonding the integrated encapsulating sheet of FIG. 5 to a substrate with elements thereon and carrying out a curing treatment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Next, an embodiment of the present invention will be described with reference to the drawings. Note that the embodiment described below does not limit the invention according to the claims, and not all of the elements and combinations described in the embodiment are necessarily essential to the solution of the present invention. In this specification and claims, the main component means a component that accounts for 50% by mass or more of the total solid content of the entire composition. A numerical range represented by "~" means a numerical range with the numbers before and after ~ as the lower and upper limits.

[0014] (First embodiment) FIG. 1 shows a cross-sectional view of an integrated encapsulating sheet according to an embodiment when cut along the thickness direction. FIG. 2 shows a cross-sectional view of the integrated encapsulating sheet of FIG. 1 when the transparent curable resin layer is disposed in contact with the top surface of the light-emitting element of the element-attached substrate, as seen from FIG. 1. FIG. 3 shows a cross-sectional view of the integrated encapsulating sheet of FIG. 1 when the integrated encapsulating sheet is pressed against the element-attached substrate until a part of the transparent curable resin layer of FIG. 1 is embedded between the light-emitting elements, as seen from FIG. 1. FIG. 4 shows a cross-sectional view of a light-emitting electronic component manufactured by peeling off the protective film on the hard coat layer and performing a curing treatment, as seen from FIG. 1, as seen from FIG. 3.

[0015] 1. Integrated encapsulating sheet The integrated encapsulating sheet 1 according to the first embodiment has a structure in which at least a transparent curable resin layer 10 and a semi-transparent layer 11 are laminated, as shown in FIG. 1. When the integrated encapsulating sheet 1 is not used, the transparent curable resin layer 10 is an uncured layer. The semi-transparent layer 11 is a cured layer. The "semi-transparent" of the semi-transparent layer 11 means a transparency between completely transparent and completely opaque, and means a property in which the total light transmittance measured in accordance with JIS K 7136 using a haze meter as a measuring instrument is 20% or more and 95% or less. The semi-transparent layer 11 preferably includes a coating layer 111, a support film layer 110, and a hard coat layer 112. Therefore, the integrated encapsulating sheet 1 is preferably a laminate of the transparent curable resin layer 10, the coating layer 111, the support film layer 110, and the hard coat layer 112. The semi-transparent layer 11 may not necessarily include the coating layer 111 and the hard coat layer 112 as long as it includes the support film layer 110 made of resin.

[0016] For ease of handling, the integrated encapsulating sheet 1 may further include a protective film on the outer surface of either one or both of the transparent curable resin layer 10 and the hard coat layer 112. Fig. 1 shows an example of the integrated encapsulating sheet 1 having protective films 12, 13 on the outer surfaces of both the transparent curable resin layer 10 and the hard coat layer 112. More specifically, the integrated encapsulating sheet 1 has a structure in which the protective film 13, the transparent curable resin layer 10, the coating layer 111, the support film layer 110, the hard coat layer 112, and the protective film 12 are laminated in this order.

[0017] As shown in FIG. 2, the integrated encapsulating sheet 1 is used to fill spaces between a plurality of light emitting elements 21, 22, and 23 of an element-attached substrate 2 in which a plurality of light emitting elements (a light emitting element 21, a light emitting element 22, and a light emitting element 23, typified by LEDs) are arranged on a substrate 20. The details of the element-attached substrate 2 will be described later. The integrated encapsulating sheet 1 is used such that the transparent curable resin layer 10 contacts the element-attached substrate 2 as shown in FIG. 2 during pressure bonding. At this time, the integrated encapsulating sheet 1 is laminated in the order of the transparent curable resin layer 10 and the semi-transparent layer 11 from the side closer to the plurality of light emitting elements 21, 22, and 23 during the pressure bonding. The transparent curable resin layer 10 of the integrated encapsulating sheet 1 is in an uncured state until pressure bonding to the element-attached substrate 2 is completed. A specific method of obtaining a light emitting electronic component 3 by pressure bonding the integrated encapsulating sheet 1 to the element-attached substrate 2 will be described later.

[0018] [Transparent curable resin layer] The transparent curable resin layer 10 is a layer containing a photocurable resin composition. In this specification, the "photocurable resin composition" is preferably a photocurable resin composition containing at least one resin selected from an epoxy resin, an acrylic resin, and a silicone resin, and a photopolymerization initiator. Among the above photocurable resin compositions, a photocurable resin composition containing an epoxy resin having excellent heat resistance and reliability, and a photocationic polymerization initiator is preferred.

[0019] (Epoxy resin) In the present application, an epoxy resin is a compound having an epoxy group in a molecule. The epoxy resin used in this embodiment is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure is formed by reaction with a modified resin having a functional group capable of reacting with an epoxy group, and the cured product can exhibit high heat resistance. In addition, when an epoxy resin having two or more epoxy groups is used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance is obtained in the cured product.

[0020] Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in a molecule, polyfunctional epoxy resins having three or more epoxy groups in a molecule, and high molecular weight epoxy resins having a weight average molecular weight of 10,000 or more. They may also be hydrogenated epoxy resins. In this application, high molecular weight epoxy resins are not classified as bifunctional epoxy resins or polyfunctional epoxy resins, but as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule. The weight average molecular weight of an epoxy resin is a polystyrene-equivalent molecular weight measured by gel permeation chromatography.

[0021] Examples of epoxy resins include bisphenol-based epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, or phenoxy type epoxy resins obtained by polymerizing these resins, and hydrogenated versions of these resins; novolac type epoxy resins such as phenol novolac epoxy resins, o-cresol novolac epoxy resins, bisphenol A novolac epoxy resins, xylene structure-containing novolac epoxy resins, and naphthol novolac type epoxy resins; glycidyl ester-based epoxy resins such as phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, p-hydroxybenzoic acid glycidyl ester, tetrahydrophthalic acid diglycidyl ester, succinic acid diglycidyl ester, adipic acid diglycidyl ester, sebacic acid diglycidyl ester, and trimellitic acid triglycidyl ester; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycidyl ether-based epoxy resins such as tetraglycidyl diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, and polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil; and special skeleton epoxy resins such as brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, and bisphenol S type epoxy resins. However, the epoxy resins are not limited to these.

[0022] Examples of high molecular weight epoxy resins that can be used include phenoxy type epoxy resins, epoxy modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy modifying other resins, etc. These epoxy resins may be used alone or in combination of two or more.

[0023] Among the above epoxy resins, the epoxy resin used in the transparent curable resin layer 10 is preferably a phenoxy type epoxy resin or a polyfunctional epoxy resin from the viewpoint of increasing the crosslink density after curing. Among polyfunctional epoxy resins, novolac type epoxy resins are particularly preferred because they are epoxy resins that can be appropriately introduced with a flexible skeleton and can adjust the flexibility and softening point, making the cured product less likely to suffer brittle fracture, improving the stability of performance over long-term use of the cured product of the epoxy resin composition, increasing the crosslink density, and improving heat resistance.

[0024] Specific examples of phenoxy type epoxy resins include "1256", "YX7200", "YX8100", and "YX7180" manufactured by Mitsubishi Chemical Corporation, "YP-50", "YP-50S", and "YP-70" manufactured by Nippon Steel Chemical & Material Co., Ltd., "N-690" manufactured by DIC Corporation, and "H-157" and "EXA-192" manufactured by DIC Corporation.

[0025] Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0026] (Photopolymerization initiator) The photopolymerization initiator contained in the photocurable resin composition is not particularly limited, but from the viewpoint of curing the epoxy resin, a photocationic polymerization initiator is preferable. Specific examples of the photocationic polymerization initiator include "WPI-113", "WPI-116", "WPI-124", and "WPI-170" manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.

[0027] (sensitizer) The photocurable resin composition may contain a sensitizer. Specific examples of the sensitizer include "127" and "TPO H" manufactured by IGM Resins BV.

[0028] The photocurable resin composition may be cured by light of various wavelengths such as visible light, electron beam, and / or ultraviolet light, but is preferably cured by ultraviolet light from the viewpoint of handling and cost. That is, the transparent curable resin layer 10 is preferably an ultraviolet-curable resin.

[0029] (High molecular weight resin) The transparent curable resin layer 10 preferably contains a high molecular weight resin in addition to a resin such as an epoxy resin.

[0030] As the high molecular weight resin, a thermosetting high molecular weight resin, generally called "rubber", is preferred because it provides excellent heat resistance. By including the high molecular weight resin, it becomes easy to control the storage modulus, i.e., the fluidity. Examples of the thermosetting high molecular weight resin include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, silicone resin, and the like. Among them, NBR is preferred because it has good compatibility with epoxy resins, allows control of the fluidity of the transparent curable resin layer 10 at around 100°C, and has good adhesion to the element-mounted substrate 2.

[0031] The weight-average molecular weight of the high molecular weight resin is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. When the weight-average molecular weight of the high molecular weight resin is within the above range, the storage modulus of the transparent curable resin layer 10 can be controlled, and the flowability during compression bonding can be ensured. When the weight-average molecular weight of the high molecular weight resin is equal to or less than the above upper limit, the compatibility with the epoxy resin is improved, and the flowability during thermocompression bonding can be more effectively controlled.

[0032] In particular, when the transparent curable resin layer 10 is made of a photocurable resin composition containing an epoxy resin, it is preferable that the transparent curable resin layer 10 contains a modified high molecular weight resin having a functional group capable of reacting with an epoxy group. Since the transparent curable resin layer 10 can react and bond with the epoxy resin, the heat resistance and reliability against thermal shock are improved.

[0033] Examples of functional groups capable of reacting with an epoxy group include acid groups such as a carboxy group, a sulfo group, a nitro group, and a phosphoric acid group, as well as their acid anhydride groups, a hydroxyl group, and an amino group. Among these, an acid group or an acid anhydride group is preferred, and a carboxy group or a carboxylic acid anhydride group is particularly preferred, since they can be cured at low temperatures and can ensure a long pot life.

[0034] That is, when the transparent curable resin layer 10 is composed of a photocurable resin composition containing an epoxy resin, it preferably contains an acid-modified high molecular weight resin having an acid group or an acid anhydride group, more preferably contains an acid-modified high molecular weight resin having a carboxy group, and particularly preferably contains a modified NBR having a carboxy group.

[0035] The modified NBR having a carboxy group is preferably a carboxylated acrylonitrile rubber having acrylic acid, methacrylic acid, maleic anhydride, etc. Commercially available products of the carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more types of modified high molecular weight resins having a functional group capable of reacting with an epoxy group may be used in combination.

[0036] The blending amount of the high molecular weight resin in the transparent curable resin layer 10 is preferably 0 to 50% by mass, more preferably 1 to 70% by mass, and even more preferably 5 to 50% by mass, relative to 100% by mass of the total resin solid content of the transparent curable resin layer 10. Within the above range, the storage modulus can be controlled, and appropriate fluidity during thermocompression bonding can be ensured. In addition, pressure unevenness during thermocompression bonding can be prevented, and a uniform appearance can be maintained. In addition, outflow of the resin outside the range can be prevented, and the film thickness after compression bonding can be ensured.

[0037] (Total light transmittance) The total light transmittance of the transparent curable resin layer 10 is not particularly limited, but is preferably 50% or more and higher than the total light transmittance of the semitransparent layer 11 described below. It is preferably 50% to 99%, more preferably 55% to 95%, and particularly preferably 60% to 90%.

[0038] (Storage modulus) The storage modulus of the transparent curable resin layer 10 is not particularly limited, but is preferably 1.0×10 7 Pa or less, and 1.0×10 2 Pa or more, 1.0×10 6 Pa or less, and more preferably 1.0×10 3 Pa or more, 1.0×10 5 It is more preferable that the pressure is 0.1 Pa or less.

[0039] In an uncured state, the storage modulus of the transparent curable resin layer 10 at 100°C is equal to or less than the preferred upper limit, so that the transparent curable resin layer 10 has an appropriate flowability when pressure-bonded to the element-mounted substrate 2, and can follow the unevenness of the element-mounted substrate 2 due to the light-emitting elements 21, 22, 23, and can sufficiently fill the gaps between the light-emitting elements 21, 22, 23. The transparent curable resin layer 10 is prevented from cracking during thermocompression bonding, and crack-like defects are less likely to occur. In addition, the transparent curable resin layer 10 flows appropriately, so that the transparent curable resin layer 10 is less likely to remain above the light-emitting elements, and the surface of the integrated encapsulating sheet 1 is less likely to have an uneven shape to match the light-emitting elements, resulting in poor appearance.

[0040] When the storage modulus of the transparent curable resin layer 10 at 100°C in an uncured state is equal to or greater than the preferred lower limit, the fluidity of the transparent curable resin layer 10 is appropriate, so that the film thickness after thermocompression bonding becomes uniform, and appearance defects such as unevenness on the surface of the integrated encapsulating sheet 1 are unlikely to occur.

[0041] [Semi-transparent layer] The semi-transparent layer 11 is a layer made of resin, and is a layer that forms the integrated encapsulating sheet 1 by being laminated with the transparent curable resin layer 10 .

[0042] (Total light transmittance) The total light transmittance of the semitransparent layer 11 is not particularly limited as long as it is lower than the total light transmittance of the transparent curable resin layer 10, but is preferably 20 to 95%, more preferably 20 to 90%, and particularly preferably 20 to 80%. When the total light transmittance of the semitransparent layer 11 is equal to or higher than the lower limit, the light reaching the viewer side is not hindered. When the total light transmittance of the semitransparent layer 11 is equal to or lower than the upper limit, the degree of blackness is easily ensured, and contrast is improved.

[0043] (Transmittance to ultraviolet light with a wavelength of 365 nm) When the transparent curable resin layer 10 is an ultraviolet curable resin, the transmittance of the semi-transparent layer 11 to ultraviolet light with a wavelength of 365 nm is preferably 10% or more, more preferably 15% or more, and particularly preferably 20% or more, from the viewpoint of not inhibiting the ultraviolet curing of the transparent curable resin layer 10.

[0044] The semitransparent layer 11 is preferably a laminate of at least a coating layer 111 and a support film layer 110. In this case, the coating layer 111 is preferably in contact with the transparent curable resin layer 10. In addition, the semitransparent layer 11 is preferably a laminate of at least a support film layer 110 and a hard coat layer 112. In this case, the support film layer 110 is preferably located on the transparent curable resin layer 10 side. In this embodiment, the semitransparent layer 11 includes the coating layer 111, the support film layer 110, and the hard coat layer 112.

[0045] Although there are no particular limitations on the total light transmittance of the support film layer 110, the coating layer 111, and / or the hard coat layer 112, it is preferable that the total light transmittance of at least one layer is 20 to 70%. When the total light transmittance of these layers is equal to or greater than the lower limit, light is not prevented from reaching the viewer's side.

[0046] The colors of the support film layer 110, the coating layer 111, and / or the hard coat layer 112 are not particularly limited, but it is preferable that at least one layer contains a black pigment or black dye. The black pigment is not particularly limited, but it is particularly preferable that it is carbon black.

[0047] [Support film layer] The support film layer 110 is a layer for protecting the light emitting elements 21, 22, and 23 from external physical impacts, humidity, moisture, and the like, and for supporting the coating layer 111 and / or the hard coat layer 112.

[0048] (Total light transmittance) The support film layer 110 is preferably adjusted to have a total light transmittance of 20 to 99%, more preferably 20 to 95%, and even more preferably 20 to 70%. When the total light transmittance of the support film layer 110 is equal to or greater than the lower limit, light is not prevented from reaching the viewer's side.

[0049] (resin) The support film layer 110 may be made of a thermoplastic resin or a thermosetting resin. Examples of the resin constituting the support film layer 110 include polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, polycarbonate resin, triacetyl cellulose resin, polymethylpentene resin, phenoxy resin, syndiotactic polystyrene resin, polyimide resin, etc., and it is preferable to include at least one resin selected from polyethylene terephthalate resin, polyethylene 2,6-naphthalate resin, and polycarbonate resin in terms of heat resistance, weather resistance, availability, cost, etc. By including these resins, deformation during pressure bonding can be prevented. The support film layer 110 may contain a black pigment or black dye to suppress uneven light emission and color unevenness.

[0050] (Film thickness) The thickness of the support film layer 110 is preferably 10 to 250 μm, more preferably 20 to 225 μm, and even more preferably 25 to 150 μm. When the thickness of the support film layer 110 is equal to or greater than the preferred lower limit, the support film layer 110 has sufficient strength to protect the element. When the thickness of the support film layer 110 is equal to or less than the preferred upper limit, the visibility is improved and costs can be reduced.

[0051] [Hard coat layer] The hard coat layer 112 is a layer for protecting the light-emitting electronic component 3 from scratches.

[0052] (hardness) The pencil hardness of the surface of the hard coat layer 112 is preferably H or higher, more preferably 2H or higher, and even more preferably 3H or higher.

[0053] (Surface roughness) The arithmetic surface roughness (Ra) of the surface of the hard coat layer 112 is preferably 0.1 to 1 μm, more preferably 0.2 to 1 μm, and even more preferably 0.3 to 1 μm. When the Ra of the hard coat layer 112 is equal to or greater than the preferred lower limit, the reflectance of the surface of the hard coat layer 112 can be reduced. When the Ra of the hard coat layer 112 is equal to or less than the preferred upper limit, production becomes easier.

[0054] (Total light transmittance) The hard coat layer 112 is preferably prepared so that the total light transmittance is 20 to 99%, more preferably so that the total light transmittance is 20 to 95%, and even more preferably so that the total light transmittance is 20 to 70%. When the total light transmittance of the hard coat layer 112 is equal to or greater than the lower limit, the light reaching the viewer side is not prevented.

[0055] (resin) The hard coat layer 112 may be made of either a thermoplastic resin or a thermosetting resin, and is preferably made of a thermosetting resin. Examples of the thermosetting resin constituting the hard coat layer 112 include an acrylic resin, a urethane resin, a silicone resin, a melamine resin, and the like, and may contain one or more of these. The hard coat layer 112 may contain a black pigment or dye.

[0056] (fine particles) The hard coat layer 112 preferably contains fine particles. As the fine particles, one or both of inorganic fine particles and organic fine particles can be used. As inorganic fine particles, silica fine particles and titanium fine particles can be mentioned. As organic fine particles, polymethyl methacrylate resin (PMMA resin) and urethane resin can be mentioned. Among them, silica fine particles are preferable. By including fine particles, it is possible to adjust the surface roughness of the hard coat layer 112 and to improve the surface hardness.

[0057] (Film thickness) The thickness of the hard coat layer 112 is preferably 1 to 20 μm, more preferably 2 to 10 μm, and even more preferably 3 to 8 μm. When the thickness of the hard coat layer 112 is equal to or greater than the preferred lower limit, sufficient hardness can be ensured. When the thickness of the hard coat layer 112 is equal to or less than the preferred upper limit, defects such as curling do not occur.

[0058] [Coating layer] The coating layer 111 is a layer for adjusting the total light transmittance of the semi-transparent layer 11 to an appropriate value.

[0059] (Total light transmittance) The coating layer 111 is preferably prepared so that the total light transmittance is 20 to 80%, more preferably so that the total light transmittance is 20 to 70%, and even more preferably so that the total light transmittance is 30 to 65%. When the total light transmittance of the coating layer 111 is equal to or greater than the lower limit, the light is not prevented from reaching the viewer side.

[0060] (Curable resin composition) The coating layer 111 includes a curable resin composition. For example, the curable resin composition may be a thermosetting resin composition including at least one resin selected from an epoxy resin, an acrylic resin, a polyester resin, and a polyurethane resin, and a curing agent. Among the above curable resin compositions, an epoxy resin composition that can achieve curing at low temperatures and has excellent heat resistance and reliability is preferred. In this specification, the epoxy resin composition is a composition including an epoxy resin as a main component, or a composition including an epoxy resin and a curing agent as main components.

[0061] When the coating layer 111 is made of an epoxy resin composition, it may contain a curing agent for epoxy resin other than the modified high molecular weight resin having a functional group capable of reacting with an epoxy group. Examples of the other curing agent include known curing agents such as phenol-based curing agents, acid anhydride-based curing agents, and amine-based curing agents. Two or more types of the other curing agents may be used in combination.

[0062] (Epoxy resin) In the present application, an epoxy resin is a compound having an epoxy group in a molecule. The epoxy resin used in the present invention is preferably one having two or more epoxy groups in one molecule. This is because a crosslinked structure is formed by reaction with a modified resin having a functional group capable of reacting with an epoxy group, and the cured product can exhibit high heat resistance. In addition, when an epoxy resin having two or more epoxy groups is used, the degree of crosslinking with a curing agent having a functional group capable of reacting with an epoxy group is sufficient, and sufficient heat resistance is obtained in the cured product.

[0063] Examples of epoxy resins include bifunctional epoxy resins having two epoxy groups in a molecule, polyfunctional epoxy resins having three or more epoxy groups in a molecule, and high molecular weight epoxy resins having a weight average molecular weight of 10,000 or more. They may also be hydrogenated epoxy resins. In this application, high molecular weight epoxy resins are not classified as bifunctional epoxy resins or polyfunctional epoxy resins, but as phenoxy-type epoxy resins, regardless of the number of epoxy groups in the molecule. The weight average molecular weight of an epoxy resin is a polystyrene-equivalent molecular weight measured by gel permeation chromatography.

[0064] Examples of epoxy resins include bisphenol-based epoxy resins such as bisphenol A type epoxy resins, bisphenol F type epoxy resins, or phenoxy type epoxy resins obtained by polymerizing these resins, and hydrogenated versions of these resins; novolac type epoxy resins such as phenol novolac epoxy resins, o-cresol novolac epoxy resins, bisphenol A novolac epoxy resins, xylene structure-containing novolac epoxy resins, and naphthol novolac type epoxy resins; glycidyl ester-based epoxy resins such as phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, p-hydroxybenzoic acid glycidyl ester, tetrahydrophthalic acid diglycidyl ester, succinic acid diglycidyl ester, adipic acid diglycidyl ester, sebacic acid diglycidyl ester, and trimellitic acid triglycidyl ester; ethylene glycol diglycidyl ether, propylene glycol diglycidyl ether, 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether, glycidyl ether-based epoxy resins such as tetraglycidyl diglycidyl ether, trimethylolpropane triglycidyl ether, pentaerythritol tetraglycidyl ether, tetraphenyl glycidyl ether ethane, triphenyl glycidyl ether ethane, polyglycidyl ether of sorbitol, and polyglycidyl ether of polyglycerol; glycidyl amine-based epoxy resins such as triglycidyl isocyanurate and tetraglycidyl diaminodiphenylmethane; linear aliphatic epoxy resins such as epoxidized polybutadiene and epoxidized soybean oil; and special skeleton epoxy resins such as brominated bisphenol A type epoxy resins, phosphorus-containing epoxy resins, fluorine-containing epoxy resins, dicyclopentadiene skeleton-containing epoxy resins, naphthalene skeleton-containing epoxy resins, anthracene type epoxy resins, tertiary butyl catechol type epoxy resins, triphenylmethane type epoxy resins, tetraphenylethane type epoxy resins, biphenyl type epoxy resins, and bisphenol S type epoxy resins. However, the epoxy resins are not limited to these.

[0065] Examples of high molecular weight epoxy resins that can be used include phenoxy type epoxy resins, epoxy modified polybutadiene, copolymers of glycidyl methacrylate and methyl methacrylate, modified polymers obtained by epoxy modifying other resins, etc. These epoxy resins may be used alone or in combination of two or more.

[0066] Among the above epoxy resins, the epoxy resin used in the coating layer 111 is preferably a multifunctional epoxy resin from the viewpoint of increasing the crosslink density after curing. Among the multifunctional epoxy resins, novolac-type epoxy resins are particularly preferable because they are epoxy resins to which an appropriate amount of flexible skeleton can be introduced and whose flexibility and softening point can be adjusted, making the cured product less susceptible to brittle fracture, improving the stability of performance over long-term use of the cured product of the epoxy resin composition, increasing the crosslink density, and improving heat resistance.

[0067] Specific examples of novolac-type epoxy resins include "YX7700" manufactured by Mitsubishi Chemical Corporation, "NC7000L", "XD1000", and "EOCN-1020" manufactured by Nippon Kayaku Co., Ltd., "ESN485" manufactured by Nippon Steel Chemical & Material Co., Ltd., and "N-690", "N-695", and "HP-7200H" manufactured by DIC Corporation.

[0068] (Black pigment or black dye) The coating layer 111 may be colored. For coloring, it is preferable that the coating layer 111 contains a black pigment or a black dye, more preferable that the coating layer 111 contains a black pigment, and further preferable that the coating layer 111 contains carbon black.

[0069] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and particularly preferably 10 to 100 nm. The particle size refers to the average particle size, and can be determined by a measuring device using the dynamic light scattering method. An example of a measuring device using the dynamic light scattering method is NanotracWave II UT151 manufactured by Microtrack Bell.

[0070] As the carbon black, one or more of known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may also be used.

[0071] [Protective film] The protective films 12 and 13 have a role of protecting the integrated encapsulating sheet 1, and can also be used as a film to which a coating liquid of a curable resin composition is applied when the integrated encapsulating sheet 1 is formed.

[0072] Examples of the protective films 12 and 13 that can be used include polyester films such as polyethylene terephthalate and polyethylene naphthalate, films made of thermoplastic resins such as polyimide films, polyamideimide films, polyethylene films, polytetrafluoroethylene films, polypropylene films, and polystyrene films, as well as surface-treated paper.

[0073] Among these, polyester films are preferably used from the viewpoints of heat resistance, mechanical strength, ease of handling, etc. The thickness of the protective films 12, 13 is not particularly limited and is appropriately selected from the range of about 10 to 150 μm depending on the application. The surfaces of the protective films 12, 13 on which the resin layer is to be provided may be subjected to a release treatment.

[0074] 2. Manufacturing method of integrated encapsulating sheet In order to obtain the integrated encapsulating sheet 1 according to the present embodiment, for example, a coating liquid for the coating layer 111 is applied and dried on the surface opposite to the hard coat layer 112 of the support film layer 110 in advance. Thereafter, a coating liquid of a photocurable resin composition for the transparent curable resin layer 10 is applied and dried on the dried coating layer 111, thereby obtaining a laminate in which the transparent curable resin layer 10, the coating layer 111, the support film layer 110, and the hard coat layer 112 are sequentially laminated. A protective film 13 may be laminated on the outer surface of the transparent curable resin layer 10 as necessary, and a protective film 12 may be laminated on the outer surface of the hard coat layer 112 as necessary.

[0075] The coating liquid of the photocurable resin composition of the transparent curable resin layer 10 preferably contains an organic solvent in an amount that provides a viscosity that allows coating without hindrance. The organic solvent is not particularly limited, but examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specific examples of the organic solvent include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethyl ... Examples of the solvent include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine. When carbon black is blended into the coating liquid, carbon black powder may be added, or a liquid in which carbon black has been previously dispersed (carbon black dispersion) may be added.

[0076] Examples of the method for applying the coating liquid include various coaters such as a die coater, a gravure coater, a roll coater, a curtain flow coater, a spin coater, a bar coater, a reverse coater, a kiss coater, a fountain coater, a rod coater, an air doctor coater, a knife coater, a blade coater, a cast coater, a screen coater, etc. The drying temperature is preferably 60 to 160°C, more preferably 80 to 130°C, and even more preferably 90 to 120°C.

[0077] The hard coat layer 112 formed on the support film layer 110 can be obtained by applying a coating agent for the hard coat layer 112 to the surface of the support film layer 110 and curing the coating agent. Examples of methods for applying the coating agent include various coaters such as a die coater, gravure coater, roll coater, curtain flow coater, spin coater, bar coater, reverse coater, kiss coater, fountain coater, rod coater, air doctor coater, knife coater, blade coater, cast coater, and screen coater. Examples of methods for curing the coating agent include heat curing, ultraviolet curing, and electron beam curing.

[0078] 3. Substrate with elements As shown in Fig. 2, the element-mounted substrate 2 has a plurality of light-emitting elements 21, 22, and 23 arranged on a substrate 20. Fig. 2 and other figures show a schematic view of a portion where three light-emitting elements (light-emitting element 21, light-emitting element 22, and light-emitting element 23) are arranged.

[0079] There is no limitation on the material of the substrate 20, but a known printed circuit board can be suitably used. Examples of known printed circuit boards include a glass epoxy board, a fluororesin board, and a ceramic board.

[0080] The light emitting elements 21, 22, and 23 are typically light emitting diodes. The present invention is particularly suitable for use when the light emitting elements 21, 22, and 23 are extremely small. For example, a light emitting diode having a height of 1000 nm to 200 μm and a side length of 0.001 to 0.5 mm can be used. For the element-mounted substrate 20 for obtaining mini LEDs or micro LEDs, the light emitting elements 21, 22, and 23 can be light emitting diodes of three colors, R, G, and B, or the light emitting elements 21, 22, and 23 can be blue light emitting diodes.

[0081] 4. Light-emitting electronic components and manufacturing method thereof 4, the light-emitting electronic component 3 according to this embodiment includes an element-mounted substrate 2 having a plurality of light-emitting elements 21, 22, 23 arranged on a substrate 20, and an integrated encapsulating cured sheet 30 that is pressure-bonded to the surface of the element-mounted substrate 2 on which the plurality of light-emitting elements 21, 22, 23 are arranged. The integrated encapsulating cured sheet 30 is laminated in the order of a resin layer and a semi-transparent layer 11 from the side closer to the substrate 20. The resin layer may include at least a transparent resin layer 31, and is the transparent resin layer 31 in this embodiment.

[0082] At least a portion of the transparent resin layer 31 is filled between the multiple light emitting elements 21, 22, and 23. The thickness of the transparent resin layer 31 is not particularly limited, but is preferably 1.05 to 5 times the height of the multiple light emitting elements 21, 22, and 23.

[0083] The manufacturing method of the light-emitting electronic component according to the present embodiment is a method in which the above-mentioned integrated encapsulating sheet 1 is arranged on the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, 23 are arranged, so that the transparent curable resin layer 10 of the integrated encapsulating sheet 1 is in contact with the surface on which the light-emitting elements 21, 22, 23 are arranged, the transparent curable resin layer 10 is filled between the light-emitting elements 21, 22, 23 by press bonding, and the transparent curable resin layer 10 is cured by light irradiation. The light irradiation is preferably ultraviolet irradiation. Hereinafter, the manufacturing method of the light-emitting electronic component according to one embodiment (also simply referred to as "the manufacturing method according to one embodiment") will be described with reference to Figs. 2 to 4.

[0084] In the manufacturing method of this embodiment, first, as shown in FIG. 2, an integrated encapsulating sheet 1 from which the protective film 13 has been peeled off to expose the transparent curable resin layer 10 is placed on the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, so that the transparent curable resin layer 10 is in contact with the surface.

[0085] The thickness of the transparent curable resin layer 10 before compression bonding is preferably 105 to 500% of the height of the light emitting elements 21, 22, 23. The lower limit is more preferably 110% or more, and even more preferably 120% or more. The upper limit is more preferably 400% or less, and even more preferably 300% or less.

[0086] When the thickness of the transparent curable resin layer 10 is 105% or more of the height of the light emitting elements 21, 22, 23, it can sufficiently conform to the gaps above the light emitting elements 21, 22, 23, and easily functions as a sealing layer. In addition, when the storage modulus of the transparent curable resin layer 10 is relatively high and the fluidity of the layer 10 is suppressed, the transparent curable resin layer 10 can be suppressed from flowing during thermocompression bonding, and appearance defects are unlikely to occur on the surface.

[0087] 2, at least a part of the transparent curable resin layer 10 of the integrated encapsulating sheet 1 is embedded between the light emitting elements 21, 22, and 23 as shown in Fig. 3. At this time, if the storage modulus of the transparent curable resin layer 10 is relatively low and the fluidity of the layer 10 is ensured, the transparent curable resin layer 10 will easily fill between the light emitting elements 21, 22, and 23 while following the unevenness of the light emitting elements 21, 22, and 23.

[0088] The temperature in the compression bonding is preferably 80 to 120° C., and more preferably 90 to 110° C. By setting the temperature in the compression bonding to 80° C. or higher, the fluidity of the integrated encapsulating sheet 1 is easily ensured. Furthermore, by setting the temperature in the compression bonding to 120° C. or lower, the light emitting elements 21, 22, and 23 are less likely to be damaged. By setting the temperature in the compression bonding to 90 to 110° C., the fluidity can be controlled more precisely, and the occurrence of unevenness or crack-like defects can be suppressed.

[0089] The pressure in the compression bonding is preferably 0.05 to 1.0 MPa, and more preferably 0.1 to 0.5 MPa. By setting the pressure in the compression bonding to the preferred lower limit or more, the transparent curable resin layer 10 can be sufficiently filled between the light emitting elements 21, 22, and 23. By setting the pressure to the preferred upper limit or less, the light emitting elements 21, 22, and 23 are less likely to be damaged. The compression bonding is preferably performed using a vacuum press machine capable of molding in a vacuum state. This makes it easier to avoid defects caused by air being mixed into the obtained light emitting electronic component 3.

[0090] 4, the protective film 12 is peeled off and then photocured by irradiation with light such as ultraviolet light, so that the transparent curable resin layer 10 of the integrated encapsulating sheet 1 becomes a transparent resin layer 31 (a cured layer of the transparent curable resin layer 10). In this way, a light-emitting electronic component 3 is obtained.

[0091] The type of light used for photocuring is not particularly limited and may be visible light, ultraviolet light, electron beam, etc., but ultraviolet light is preferred. Among ultraviolet light, near ultraviolet light of 200 to 380 nm is preferred, UV-A of 320 to 380 nm is more preferred, and UV-A of 365 nm is particularly preferred.

[0092] The light-emitting electronic component 3 preferably has Lab values ​​from the hard coat layer 112 side measured in accordance with JIS Z8722 using a light source D65, a field of view of 2°, and a transmission method of L: 3 to 25, a: -2 to 2, and b: -2 to 2. When the Lab values ​​from the hard coat layer 112 side are in the preferred ranges, the light-emitting electronic component 3 has sufficient blackness, and the contrast of the display can be improved.

[0093] 2 to 4, a light-emitting electronic component 3 is obtained in which an integrated sealing cured sheet 30 is pressure-bonded to the surface of the element-mounted substrate 2 on which the light-emitting elements 21, 22, and 23 are arranged, the surface being formed by the element-mounted substrate 2 having the light-emitting elements 21, 22, and 23 arranged on the substrate 20. The transparent curable resin layer 10 is cured in the obtained light-emitting electronic component 3. At least a part of the transparent resin layer 31 formed by the cured transparent curable resin layer 10 is filled between the light-emitting elements 21, 22, and 23.

[0094] Second embodiment Next, a second embodiment will be described. The same reference numerals are used for parts common to the first embodiment, and duplicated explanations will be omitted. Fig. 5 shows a cross-sectional view of an integrated encapsulating sheet according to another embodiment when cut along the thickness direction. Fig. 6 shows a cross-sectional view, as seen from the same perspective as Fig. 5, of a light-emitting electronic component manufactured by pressure-bonding the integrated encapsulating sheet of Fig. 5 to a substrate with elements and performing a curing treatment.

[0095] 1. Integrated encapsulating sheet As shown in FIG. 5, the integrated encapsulating sheet 1b according to the second embodiment includes a black curable resin layer 14 in addition to the configuration of the first embodiment described above. The black curable resin layer 14 is provided on the surface of the transparent curable resin layer 10 opposite to the semitransparent layer 11. When the integrated encapsulating sheet 1b is not in use, the black curable resin layer 14 is an uncured layer. The integrated encapsulating sheet 1b is preferably a laminate of the black curable resin layer 14, the transparent curable resin layer 10, the coating layer 111, the support film layer 110, and the hard coat layer 112. The black curable resin layer 14 and the transparent curable resin layer 10 constitute a curable resin layer 15.

[0096] The black curable resin layer 14 is a layer for preventing light diffusion between the light emitting elements 21, 22, and 23 and improving the contrast of the display. The black curable resin layer 14 also serves to sufficiently fill the spaces between the multiple light emitting elements 21, 22, and 23 arranged on the element-mounted substrate 2 in a bonding process represented by thermocompression bonding, and to prevent poor appearance due to expansion of unfilled gaps in the curing process and damage to the light emitting elements 21, 22, and 23 due to external factors in a later process.

[0097] (Lab value) The black curable resin layer 14 preferably has Lab values ​​in a cured state measured in accordance with JIS Z8722 using a light source of D65, a field of view of 2°, and a transmission method of L: 5 to 60, a: -3 to 7, and b: -20 to 20, and more preferably L: 10 to 50, a: -2 to 5, and b: -15 to 15. When the Lab values ​​in the cured state are within the preferred ranges, light diffusion between the light emitting elements 21, 22, and 23 can be further prevented, and the contrast of the display can be further improved.

[0098] (Curable resin composition) The black curable resin layer 14, like the transparent curable resin layer 10, contains a photocurable resin composition.

[0099] The blending amount of the polyfunctional epoxy resin in the black curable resin layer 14 is preferably 10 to 99 mass%, more preferably 40 to 95 mass%, and even more preferably 60 to 90 mass%, relative to 100 mass% of the total resin solid content of the black curable resin layer 14. When the blending amount is equal to or greater than the lower limit, the crosslinking density can be increased to impart chemical resistance and heat resistance. When the blending amount is equal to or less than the upper limit, the storage modulus during compression bonding can be adjusted, and the fluidity of the black curable resin layer 14 can be ensured.

[0100] The black curable resin layer 14 does not preferably contain a high molecular weight epoxy resin, or if it contains a high molecular weight epoxy resin, it preferably contains it in an amount less than that of the transparent curable resin layer 10. This makes it easier to ensure sufficient fluidity during compression bonding. The amount of high molecular weight epoxy resin in the black curable resin layer 14 is preferably less than 50% by mass, more preferably less than 30% by mass, and even more preferably less than 10% by mass, relative to 100% by mass of the total resin solid content of the black curable resin layer 14.

[0101] From the viewpoint of ensuring sufficient fluidity during compression bonding, the black curable resin layer 14 preferably contains an epoxy resin having a softening point or melting point of 100° C. or less. From the viewpoint of handleability and heat resistance of the cured product, it is more preferable that the black curable resin layer 14 contains an epoxy resin having a softening point or melting point of 50 to 95° C. By containing an epoxy resin having a softening point or melting point within the above range, it becomes possible to control the storage modulus.

[0102] The total amount of epoxy resin in the black curable resin layer 14 is preferably 10 to 100% by mass, more preferably 20 to 99% by mass, and even more preferably 35 to 95% by mass, relative to 100% by mass of the total resin solid content of the black curable resin layer 14. Within the above range, the storage modulus can be controlled, and appropriate fluidity during compression bonding can be ensured. Furthermore, if it is equal to or greater than the above lower limit, heat resistance after curing can be improved.

[0103] (High molecular weight resin) The black curable resin layer 14 preferably contains a high molecular weight resin in addition to a resin such as an epoxy resin. By containing a high molecular weight resin, it becomes easier to control the storage modulus, that is, to control the fluidity.

[0104] As the high molecular weight resin, a thermosetting high molecular weight resin, generally called "rubber", is preferred because it has excellent heat resistance. Examples of the thermosetting high molecular weight resin include acrylonitrile butadiene rubber (NBR), which is a random copolymer of butadiene and acrylonitrile, acrylic rubber, styrene butadiene rubber, vinyl acetate resin, silicone resin, etc. Among them, NBR is preferred because it has good compatibility with epoxy resins, allows control of the fluidity of the black curable resin layer 14 at around 100°C, and has good adhesion to the transparent curable resin layer 10 and the element-mounted substrate 2.

[0105] The weight average molecular weight of the high molecular weight resin is preferably 100,000 to 1,000,000, more preferably 120,000 to 500,000, and even more preferably 150,000 to 300,000. When the weight average molecular weight of the high molecular weight resin is within the above range, the storage modulus of the black curable resin layer 14 can be controlled, and the flowability during compression bonding can be ensured. When the weight average molecular weight of the high molecular weight resin is equal to or less than the above upper limit, the compatibility with the epoxy resin is improved, and the flowability during thermocompression bonding can be more effectively controlled.

[0106] In particular, when the black curable resin layer 14 is composed of a photocurable resin composition containing an epoxy resin, it is preferable to include a modified high molecular weight resin having a functional group capable of reacting with an epoxy group. Since it can react and bond with the epoxy resin, it improves heat resistance and reliability against thermal shock. Furthermore, the difference in polarity between the functional group capable of reacting with the epoxy resin and the resin skeleton has a favorable effect on dispersibility, and good dispersibility can be obtained when carbon black is contained in the black curable resin layer 14.

[0107] Examples of functional groups capable of reacting with an epoxy group include acid groups such as a carboxy group, a sulfo group, a nitro group, and a phosphoric acid group, as well as their acid anhydride groups, a hydroxyl group, and an amino group. Among these, an acid group or an acid anhydride group is preferred, and a carboxy group or a carboxylic acid anhydride group is particularly preferred, since they can be cured at low temperatures and can ensure a long pot life.

[0108] That is, when the black curable resin layer 14 is made of a photocurable resin composition containing an epoxy resin, it preferably contains an acid-modified high molecular weight resin having an acid group or an acid anhydride group, more preferably contains an acid-modified high molecular weight resin having a carboxy group, and particularly preferably contains a modified NBR having a carboxy group.

[0109] The modified NBR having a carboxy group is preferably a carboxylated acrylonitrile rubber having acrylic acid, methacrylic acid, maleic anhydride, etc. Commercially available products of the carboxylated acrylonitrile rubber include "NX775" and "1072CGJ" manufactured by Zeon Corporation. Two or more types of modified high molecular weight resins having a functional group capable of reacting with an epoxy group may be used in combination.

[0110] The amount of high molecular weight resin in the black curable resin layer 14 is preferably greater than the amount of high molecular weight resin in the transparent curable resin layer 10. This allows the storage modulus of the black curable resin layer 14 during compression bonding to be adjusted to an appropriate range lower than that of the transparent curable resin layer 10, and also allows flow during compression bonding to be suppressed, when the black curable resin layer 14 contains a large amount of low molecular weight components such as polyfunctional epoxy. As a result, it is possible to ensure appropriate flowability of the black curable resin layer 14 during compression bonding.

[0111] The blending amount of the high molecular weight resin in the black curable resin layer 14 is preferably 0.01 to 90 mass%, more preferably 1 to 80 mass%, and even more preferably 5 to 65 mass%, relative to 100 mass% of the total resin solid content of the black curable resin layer 14. Within the above range, the storage modulus can be controlled, and appropriate fluidity during compression bonding can be ensured. Furthermore, when it is equal to or greater than the above lower limit, the dispersibility of carbon black is improved. Furthermore, the film-forming property is improved, and the film thickness distribution can be narrowed when a photocurable resin composition containing an epoxy resin is applied to form a film.

[0112] (Black pigment or black dye) The black curable resin layer 14 is colored black. For coloring, it is preferable that the black curable resin layer 14 contains a black pigment or a black dye, more preferable that the black pigment is contained, and further preferable that the black curable resin layer 14 contains carbon black. By being colored black, the light diffusion prevention property between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2 is obtained.

[0113] The particle size of the carbon black is preferably 10 to 500 nm, more preferably 10 to 300 nm, and particularly preferably 10 to 100 nm. The particle size refers to the average particle size, and can be determined by a measuring device using the dynamic light scattering method. An example of a measuring device using the dynamic light scattering method is NanotracWave II UT151 manufactured by Microtrack Bell.

[0114] As the carbon black, one or more of known carbon blacks such as gas black, channel black, furnace black, thermal black, and lamp black can be used. Resin-coated carbon black may also be used. Furthermore, carbon nanofibers and carbon nanotubes may also be used.

[0115] Among the above carbon blacks, gas black is preferred because it has a large amount of surface functional groups, has high dispersibility, and exerts a sufficient light diffusion prevention function even when added in a small amount. In addition, when the black curable resin layer 14 contains a modified high molecular weight resin having a functional group capable of reacting with an epoxy resin, the dispersibility is further increased due to the interaction between the surface functional group of the gas black and the functional group of the modified high molecular weight resin having a functional group capable of reacting with an epoxy resin, and good light diffusion prevention properties and coating liquid stability can be ensured.

[0116] The amount of carbon black is preferably 0.1 to 15 mass %, and more preferably 0.3 to 5 mass %, based on the total solid content of the black curable resin layer 14. When the amount of carbon black is equal to or more than the lower limit, sufficient light blocking properties can be obtained. When the amount of carbon black is greater than the upper limit, the resin cannot be cured sufficiently. In addition, the thixotropy of the black curable resin layer 14 increases, and the fluidity during pressure bonding decreases, making it impossible to sufficiently fill the spaces between the multiple light emitting elements 21, 22, and 23 of the element-mounted substrate 2.

[0117] (Total light transmittance) The total light transmittance of the black curable resin layer 14 in the cured state is lower than that of the transparent curable resin layer 10 in the cured state. Specifically, the black curable resin layer 14 is prepared so that the total light transmittance of the black curable resin layer 14 in the cured state is 0 to 50%. The black curable resin layer 14 is preferably prepared so that the total light transmittance of the black curable resin layer 14 in the cured state is 0 to 40%, more preferably 0 to 30%. When the total light transmittance of the black curable resin layer 14 in the cured state is equal to or less than the upper limit value such as 50%, 40%, or 30%, the light diffusion between the light emitting elements 21, 22, and 23 can be further prevented. The total light transmittance in this specification can be measured by a haze meter in accordance with JIS K 7136. The total light transmittance of the cured state can be changed mainly by the presence or absence of carbon black or the amount of carbon black. The total light transmittance of the cured state can also be changed by the thickness of the black curable resin layer 14 and the type of resin composition.

[0118] (Storage modulus) The storage modulus of the black curable resin layer 14 in an uncured state is preferably smaller than the storage modulus of the transparent curable resin layer 10 in an uncured state. The storage modulus of the black curable resin layer 14 in an uncured state is preferably 1.0×10 5 Pa or less, and 1.0×10 2 Pa or more 1.0×10 5 Pa or less, and more preferably 1.0×10 3 Pa or more 5.0×104 It is even more preferable that the storage modulus at 100°C is equal to or less than 100 Pa. When the black curable resin layer 14 is uncured, the storage modulus at 100°C is equal to or less than the preferred upper limit, so that sufficient fluidity is obtained when the layer is pressed against the element-mounted substrate 2, and the layer can sufficiently fill the gaps between the light-emitting elements 21, 22, and 23 by following the unevenness of the element-mounted substrate 2 due to the light-emitting elements 21, 22, and 23. When the black curable resin layer 14 is uncured, the storage modulus at 100°C is equal to or more than the preferred lower limit, so that uneven pressure during pressing can be prevented, and a uniform appearance can be maintained. In addition, the resin can be prevented from flowing out of the range, and the film thickness after pressing can be ensured.

[0119] The storage modulus of the transparent curable resin layer 10 before curing is 1.0×10 7 Pa or less, and 1.0×10 4 Pa or more, 1.0×10 7 Pa or less, and 5.0×10 4 Pa or more, 5.0×10 6 It is more preferable that the pressure is 0.1 Pa or less.

[0120] Since the storage modulus at 100°C of the transparent curable resin layer 10 before curing is within a preferred range, sufficient fluidity is obtained that does not hinder the flow of the black curable resin layer when it is pressed against the element-mounted substrate 2, and the black curable resin layer 14 can conform to the unevenness of the element-mounted substrate 2 caused by the multiple light-emitting elements 21, 22, 23 and sufficiently fill the spaces between the multiple light-emitting elements 21, 22, 23.

[0121] When the storage modulus at 100°C of the transparent curable resin layer 10 before curing is equal to or less than the preferred upper limit, the transparent curable resin layer 10 has sufficient fluidity, making it easier to sufficiently press the black curable resin layer 14 between the multiple light-emitting elements 21, 22, and 23, and preventing cracks from occurring in the transparent curable resin layer 10 during thermocompression bonding, making it less likely that crack-like defects will occur.

[0122] When the storage modulus at 100°C of the transparent curable resin layer 10 before curing is equal to or greater than the preferred lower limit, the black curable resin layer 14 on the light-emitting element can be sufficiently removed. In addition, since the transparent curable resin layer 10 has an appropriate fluidity, the black curable resin layer 14 is not partially pressed in too much during thermocompression bonding, making it difficult for uneven shading to occur.

[0123] In an uncured state, the storage modulus of the black curable resin layer 14 at 100° C. is preferably 1 / 1000 to 1 / 10 times, and more preferably 1 / 500 to 1 / 30 times, that of the transparent curable resin layer 10.

[0124] (Other Ingredients) The black curable resin layer 14 may contain an inorganic filler to improve flame retardancy and heat resistance and to adjust the refractive index. The black curable resin layer 14 may further contain, as necessary, a resin other than the epoxy resin and the high molecular weight resin, a thickener, a defoamer and / or a leveling agent, an adhesion imparting agent such as a coupling agent, and a flame retardant.

[0125] 2. Manufacturing method of integrated encapsulating sheet In order to obtain the integrated encapsulating sheet 1b according to the present embodiment, for example, a protective film 13 obtained in the same manner as in the first embodiment is coated with a coating liquid of a photocurable resin composition for the black curable resin layer 14 and dried, and a support film layer 110 on which a hard coat layer 112 has been formed in advance is coated with a coating liquid of a photocurable resin composition for the transparent curable resin layer 10 on the surface opposite to the hard coat layer 112 and dried.

[0126] Thereafter, these are stacked and laminated so that the transparent curable resin layer 10 and the black curable resin layer 14 are in contact with each other, thereby obtaining a laminate in which the black curable resin layer 14, the transparent curable resin layer 10, the coating layer 111, the support film layer 110, and the hard coat layer 112 are stacked in this order on the protective film 13. A protective film 12 may be laminated on the outer surface of the hard coat layer 112 as necessary.

[0127] The coating liquid of the photocurable resin composition of the black curable resin layer 14 preferably contains an organic solvent in an amount that provides a viscosity that allows coating without hindrance. The organic solvent is not particularly limited, but examples thereof include ketones, aromatic hydrocarbons, glycol ethers, glycol ether acetates, esters, alcohols, aliphatic hydrocarbons, and petroleum-based solvents. Specific examples of the organic solvent include ketones such as methyl ethyl ketone, cyclohexanone, methyl butyl ketone, and methyl isobutyl ketone; aromatic hydrocarbons such as toluene, xylene, and tetramethylbenzene; glycol ethers such as cellosolve, methyl cellosolve, butyl cellosolve, carbitol, methyl carbitol, butyl carbitol, ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether, dipropylene glycol diethyl ether, and triethylene glycol monoethyl ether; ethyl acetate, butyl acetate, isobutyl acetate, ethyl ... Examples of the solvent include esters such as propylene glycol monoethyl ether acetate, dipropylene glycol methyl ether acetate, propylene glycol methyl ether acetate, propylene glycol ethyl ether acetate, and propylene glycol butyl ether acetate; alcohols such as ethanol, propanol, 2-methoxypropanol, n-butanol, isobutyl alcohol, isopentyl alcohol, ethylene glycol, and propylene glycol; aliphatic hydrocarbons such as octane and decane; petroleum solvents such as petroleum ether, petroleum naphtha, hydrogenated petroleum naphtha, and solvent naphtha, as well as N,N-dimethylformamide (DMF), tetrachloroethylene, and turpentine. When carbon black is blended into the coating liquid, carbon black powder may be added, or a liquid in which carbon black has been previously dispersed (carbon black dispersion) may be added.

[0128] The temperature during lamination is preferably 20 to 120°C, more preferably 30 to 100°C, and even more preferably 40 to 80°C. By setting the temperature during lamination to a preferable lower limit or higher, it is possible to ensure adhesion between the black curable resin layer 14 and the transparent curable resin layer 10 that allows handling even when uncured. In addition, by setting the temperature during lamination to a preferable upper limit or lower, it is possible to prevent the formation of air bubbles and wrinkles. Lamination can be performed using, for example, a roll laminator, a press machine, a vacuum press machine, or the like.

[0129] 3. Substrate with elements The element-mounted substrate 2 is the same as that in the above-mentioned first embodiment.

[0130] 4. Light-emitting electronic components and manufacturing method thereof The light-emitting electronic component 3b according to this embodiment may further include at least a black resin layer 32 as the resin layer 35 in addition to the transparent resin layer 31 as shown in FIG. 6. When the black resin layer 32 is included, the resin layer 35 is laminated in the order of the black resin layer 32 and the transparent resin layer 31 from the side closer to the substrate 20. The manufacturing method of the light-emitting electronic component 3b according to this embodiment is a method in which the above-mentioned integrated encapsulating sheet 1b is arranged on the surface on which the plurality of light-emitting elements 21, 22, 23 are arranged in the element-mounted substrate 2 in which the plurality of light-emitting elements 21, 22, 23 are arranged on the substrate 20 so that the curable resin layer 15 (in one example, the black curable resin layer 14) of the integrated encapsulating sheet 1b is in contact with the surface, the curable resin layer 15 is filled between the plurality of light-emitting elements 21, 22, 23 by press bonding, and the transparent curable resin layer 10 and the black curable resin layer 14 are cured by light irradiation. The light irradiation is preferably ultraviolet light irradiation.

[0131] The black resin layer 32 is entirely filled between the multiple light emitting elements 21, 22, 23, and at least a portion of the transparent resin layer 31 is filled between the multiple light emitting elements 21, 22, 23. The thickness of the transparent resin layer 31 when the black resin layer 32 is formed is not particularly limited, but is preferably 0.1 to 5 times the height of the multiple light emitting elements 21, 22, 23. The thickness of the black resin layer 32 is not particularly limited, but is preferably 0.1 to 0.9 times the height of the multiple light emitting elements 21, 22, 23.

[0132] Before compression bonding, the thickness of the black curable resin layer 14 is preferably 10 to 95% of the height of the light emitting elements 21, 22, 23. The lower limit is more preferably 15% or more, and even more preferably 30% or more. The upper limit is more preferably 85% or less, even more preferably 75% or less, and particularly preferably 55% or less.

[0133] When the thickness of the black curable resin layer 14 is 10% or more of the height of the light emitting elements 21, 22, 23, the function of preventing light diffusion between the light emitting elements 21, 22, 23 is sufficient. In addition, when the storage modulus of the black curable resin layer 14 is relatively low and the layer 14 is rich in fluidity, the resin can be sufficiently filled between the light emitting elements 21, 22, 23. When the thickness of the black curable resin layer 14 is less than 15% of the height of the light emitting elements 21, 22, 23, if the fluidity of the transparent curable resin layer 10 is relatively low, crack-like defects may occur on the surface. When the thickness of the black curable resin layer 14 is 30% or more of the height of the light emitting elements 21, 22, 23, the black curable resin layer 14 having the light diffusion prevention function can be appropriately filled between the light emitting elements 21, 22, 23.

[0134] If the thickness of the black curable resin layer 14 is 95% or less of the height of the light emitting elements 21, 22, 23, leakage to the outside of the black curable resin layer 14 during compression can be prevented, and light from the light emitting elements 21, 22, 23 is unlikely to be hindered from reaching the viewer. If the thickness of the black curable resin layer 14 exceeds 85% of the height of the light emitting elements 21, 22, 23, black shading may be observed due to the variation in the film thickness of the black curable resin layer 14 that flows after pressing. If the thickness of the black curable resin layer 14 is 75% or less of the height of the light emitting elements 21, 22, 23, the black curable resin layer 14 having the light diffusion prevention function can be appropriately filled between the light emitting elements 21, 22, 23.

[0135] When the storage modulus of the transparent curable resin layer 10 is relatively high and the fluidity of the layer 10 is suppressed during compression bonding, the transparent curable resin layer 10 can sufficiently press the black curable resin layer 14. When the storage modulus of the black curable resin layer 14 is relatively low and the fluidity of the layer 14 is ensured, the black curable resin layer 14 is likely to fill between the light emitting elements 21, 22, and 23 by following the unevenness of the light emitting elements 21, 22, and 23, and is also unlikely to remain on the light emitting elements 21, 22, and 23, which is preferable.

[0136] The total thickness of the black curable resin layer 14 and the transparent curable resin layer 10 before pressure bonding is preferably 110 to 550% of the height of the light emitting elements 21, 22, 23, more preferably 120 to 400%, and even more preferably 150 to 300%. If the total thickness of the black curable resin layer 14 and the transparent curable resin layer 10 is equal to or greater than the lower limit of the height of the light emitting elements 21, 22, 23, the integrated encapsulating sheet 1b can be sufficiently embedded between the light emitting elements 21, 22, 23. If the total thickness of the black curable resin layer 14 and the transparent curable resin layer 10 is equal to or less than the upper limit of the height of the light emitting elements 21, 22, 23, thickness unevenness is unlikely to occur during pressure bonding, and appearance defects are unlikely to occur on the surface.

[0137] The ratio of the thickness of the black cured resin layer 14 before compression to the total thickness of the transparent cured resin layer 10 and the black cured resin layer 14 before compression is preferably 10 to 90%, more preferably 15 to 70%, and even more preferably 20 to 50%. If the ratio of the thickness of the black cured resin layer 14 before compression to the total thickness of the transparent cured resin layer 10 and the black cured resin layer 14 is equal to or greater than the lower limit, the degree of blackness can be increased and the contrast of the display can be sufficiently improved. If the ratio of the thickness is equal to or less than the upper limit, the black cured resin layer 14 is unlikely to remain on the light emitting elements 21, 22, and 23 during compression, and the brightness can be sufficiently improved.

[0138] The pressure in the compression bonding is preferably 0.05 to 1.0 MPa, and more preferably 0.1 to 0.5 MPa. By setting the pressure in the compression bonding to the preferred lower limit or more, the black curable resin layer 14 does not remain on the light emitting elements 21, 22, 23, and the light from the light emitting elements 21, 22, 23 is not prevented from reaching the viewer. By setting the pressure to the preferred upper limit or less, the light emitting elements 21, 22, 23 are less likely to be damaged. The compression bonding is preferably performed using a vacuum press machine capable of molding in a vacuum state. This makes it easier to avoid defects caused by air being mixed into the obtained light emitting electronic component 3b.

[0139] After the compression and curing, a light-emitting electronic component 3b is obtained that includes an integrated encapsulating cured sheet 30b in which the black curable resin layer 14 of the integrated encapsulating sheet 1b is made into a black resin layer 32 (cured layer of the black curable resin layer 14) and the transparent curable resin layer 10 is made into a transparent resin layer 31 (cured layer of the transparent curable resin layer 10), as shown in Fig. 6. The entire black resin layer 32 and a part of the transparent resin layer 31 are filled between the multiple light-emitting elements 21, 22, and 23. EXAMPLES

[0140] The present invention will be specifically described below with reference to examples, although the present invention is not limited to these examples.

[0141] <Raw materials> The raw materials used in each example are as follows: [Epoxy resin] EOCN (registered trademark)-1020-55: Manufactured by Nippon Kayaku Co., Ltd., cresol novolac type multifunctional epoxy resin (solid), softening point 55.7°C, epoxy equivalent 195g / eq. jER (registered trademark) YX7200B35: Manufactured by Mitsubishi Chemical Corporation, a phenoxy-type epoxy resin (MEK solution, solid content 35 mass%), an epoxy resin having a glass transition temperature of 150°C, an epoxy equivalent of 8750 g / eq., and a weight average molecular weight of 27,218. EPICLON(registered trademark) HP7200H: Manufactured by DIC, cyclopentadiene novolac type multifunctional epoxy resin (solid), softening point 82°C, epoxy equivalent 227g / eq.

[0142] [High molecular weight resin] Nipol(R) NX775: Manufactured by Zeon Corporation, carboxy-modified nitrile rubber, elastomer with a weight average molecular weight of 208,000.

[0143] [Curing catalyst] Curesol (registered trademark) 2E4MZ: 2-ethyl-4-methylimidazole, manufactured by Shikoku Kasei Corporation. [Photocationic polymerization initiator] · WPI-170: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. [Sensitizer] Omnirad(R) TPO H: Manufactured by IGM Resins BV.

[0144] [Carbon black] Special Black#4: ORION ENGINEERED CARBONS, gas black, pH 3, average particle size 25nm. [solvent] MEK: Methyl ethyl ketone, manufactured by Junsei Chemical Co., Ltd. PGM: Propylene glycol monomethyl ether, manufactured by Junsei Chemical Co., Ltd. [Support film layer] -Cosmoshine (registered trademark) A4300: Toyobo Co., Ltd., PET film, thickness 75 μm. [Resin for hard coat layer] 8KX-078: Taisei Fine Chemical Co., Ltd., solid content 40% by mass, UV-curable acrylic polymer, weight average molecular weight 40,000.

[0145] [Fine particles] Chemisnow (registered trademark) MX-500L: manufactured by Soken Chemical & Engineering Co., Ltd., cross-linked acrylic monodisperse particles, average particle diameter 5 μm. [Photoradical polymerization initiator] Omnirad(R) TPO H: Manufactured by IGM Resins BV. [Protective film] 1-E: Release film manufactured by Nippa, thickness 50μm.

[0146] <Preparation of coating solution> The raw material composition of the coating liquid for each layer is shown in Tables 1 to 4. The raw material composition for each layer is shown in terms of the mass part ratio relative to the amount of non-volatile components.

[0147] [Table 1]

[0148] [Table 2]

[0149] [Table 3]

[0150] [Table 4]

[0151] [Coating agent for hard coat layer] 100 parts by mass of 8KX-078 (manufactured by Taisei Fine Chemical Co., Ltd.), 15 parts by mass of microparticles MX-500L (manufactured by Soken Chemical Industries, Ltd.), and 2 parts by mass of photoradical polymerization initiator TPO H (manufactured by IGM Resins BV) were mixed with MEK solvent to prepare raw material 1, a coating agent for the hard coat layer with a solid content concentration of 30% by mass.

[0152] [Coating layer coating liquid] 80 parts by mass of epoxy resin 1020-55 (manufactured by Nippon Kayaku Co., Ltd.), 20 parts by mass of high molecular weight resin NX775 (manufactured by Nippon Zeon Co., Ltd.), 3 parts by mass of curing catalyst 2E4MZ (manufactured by Shikoku Kasei Co., Ltd.), and 0.5 parts by mass of carbon black Special Black 4 (manufactured by Orion Engineered Carbons) were mixed with MEK solvent to prepare a coating liquid for the coating layer (raw material 2) with a solids concentration of 20% by mass.

[0153] [Coating liquid for transparent curable resin layer] Epoxy resin 1020-55 (manufactured by Nippon Kayaku Co., Ltd.) 50 parts by mass, epoxy resin YX7200B35 (manufactured by Mitsubishi Chemical Co., Ltd.) 30 parts by mass, high molecular weight resin NX775 (manufactured by Nippon Zeon Co., Ltd.) 2 parts by mass, photocationic polymerization initiator WPI-170 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.) 2 parts by mass, and sensitizer TPO H (manufactured by IGM Resins BV) 2 parts by mass were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for transparent curable resin layer with a solid content concentration of 35% by mass as raw material 3-1. In addition, raw material 3-2 was prepared in the same manner as raw material 3-1, except that epoxy resin 1020-55 (manufactured by Nippon Kayaku Co., Ltd.) and YX7200B35 (manufactured by Mitsubishi Chemical Co., Ltd.) were changed to 40 parts by mass each.

[0154] [Coating liquid for black curable resin layer] 70 parts by mass of epoxy resin HP-7200H (manufactured by DIC Corporation), 30 parts by mass of high molecular weight resin NX775 (manufactured by Zeon Corporation), 2 parts by mass of photocationic polymerization initiator WPI-170 (manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.), 2 parts by mass of sensitizer TPO H (manufactured by IGM Resins BV), and 4 parts by mass of carbon black Special Black 4 (manufactured by ORION ENGINEERED CARBONS) were mixed in a solvent of MEK / PGM = 80 / 20 (volume ratio) to prepare a coating liquid for a black curable resin layer with a solids concentration of 35 mass% as raw material 4.

[0155] <Preparation of sheets for each example> [Example 1] Raw material 2 (coating liquid for coating layer) was applied to the first surface of the support film layer (A4300: manufactured by Toyobo Co., Ltd.) using a bar coater so that the dry film thickness was 10 μm, and dried at 120° C. for 5 minutes. Raw material 2 was then cured by heating in a hot air circulating oven at 80° C. for 72 hours to form a coating layer. Next, a corona treatment was performed on the second surface of the support film layer opposite the coating layer, and raw material 1 (coating agent for hard coat layer) was applied to the second surface using a bar coater so that the dry film thickness was 3 μm. Then, after drying at 120° C. for 5 minutes, 400 mJ / cm 2 By irradiating the raw material 1 with ultraviolet light of 1000 nm, the raw material 1 was cured to form a hard coat layer. As a result, a first sheet in which the coating layer and the hard coat layer were supported by the support film layer was obtained.

[0156] Further, the coating liquid for transparent curable resin layer was applied to the coating layer on the first surface of the support film layer of this first sheet using an applicator so that the dry film thickness was 80 μm. Then, it was dried at 120° C. for 5 minutes to obtain a second sheet in which the coating layer and the transparent curable resin layer were supported on the first surface of the support film layer and the hard coat layer was supported on the second surface of the support film layer.

[0157] The obtained second sheet and release PET 1-E (manufactured by Nippa Corporation, 50 μm) were overlapped so that the transparent curable resin layer was in contact with the release surface of the release PET 1-E, and laminated with a roll laminator at 60°C to obtain an integrated sealing sheet of Example 1.

[0158] [Example 2] The integrated encapsulating sheet of Example 2 was produced in the same manner as in Example 1, except that Raw Material 2 was applied so as to give a dry film thickness of 7 μm.

[0159] [Example 3] A third sheet was obtained in the same manner as in Example 2, except that the coating liquid for the transparent curable resin layer was applied so as to give a dry film thickness of 30 μm. The coating liquid for the black curable resin layer was applied to the release surface of release PET 1-E (manufactured by Nippa Corporation, 50 μm) using an applicator so as to give a dry film thickness of 50 μm, and dried at 120° C. for 5 minutes to obtain a fourth sheet in which the black curable resin layer was supported by the release PET.

[0160] The obtained third sheet and fourth sheet were overlapped so that the transparent curable resin layer and the black curable resin layer were in contact with each other, and laminated with a roll laminator at 60° C. to obtain an integrated encapsulating sheet of Example 3.

[0161] <Total light transmittance> The total light transmittance of each layer was measured in accordance with JIS K 7361 using a haze meter NDH5000 manufactured by Nippon Denshoku Industries Co., Ltd. The first sheet described in the above Example 1 was used for the measurement of the semi-transparent layer. The coating layer was measured using a measurement sheet that had been subjected to the formation of the coating layer as described in the above Example 1. The total light transmittance of the semi-transparent layer and the coating layer was calculated based on A4300. The measurement sheet used for the measurement of the transparent resin layer was prepared as follows. The transparent curable resin layer coating liquid was applied to the haze meter surface of release PET 1-E (manufactured by Nippa Corporation) using an applicator so that the dry film thickness was 80 μm. The applied transparent curable resin layer coating liquid was dried at 120° C. for 5 minutes to obtain a sheet supporting a transparent curable resin layer. The obtained sheet was irradiated with ultraviolet light having a wavelength of 365 nm at 2000 mJ / cm. 2 The transparent curable resin layer was photocured to prepare a measurement sheet. The total light transmittance of the transparent resin layer was measured based on 1-E.

[0162] <Storage modulus> The storage modulus at 60°C of the semi-transparent layer including the support film layer, the hard coat layer and the coating layer was measured in accordance with JIS K 7244 using a viscoelasticity measuring device (RSA-G2 manufactured by TA Instruments) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min.

[0163] The storage modulus of the transparent curable resin layer and the black curable resin layer at 100°C was measured as follows. The coating liquid for the transparent curable resin layer and the coating liquid for the black curable resin layer were applied to the release surface of release PET 1-E (Nippa Corporation, 50 μm) using an applicator so that the dry film thickness was 40 μm, and the coating liquid was dried at 120°C for 5 minutes, and then the release PET 1-E was peeled off to obtain a single-layer sheet of the transparent curable resin layer and the black curable resin layer. The storage modulus of the obtained single-layer sheet of the transparent curable resin layer and the black curable resin layer at 100°C was measured according to JIS K 7244 using a viscoelasticity measuring device (TA Instruments RSA-G2) under conditions of a measurement frequency of 1 Hz and a heating rate of 5°C / min. The results are shown in Table 5.

[0164] <Total light transmittance and storage modulus of semi-transparent layer> In Table 5, the term "semi-transparent layer" refers to a laminate of a support film layer, a hard coat layer, and a coating layer.

[0165] <Substrate with evaluation element> A substrate with LED light emitting elements for evaluation was prepared by arranging multiple LED light emitting elements, each of which was 0.1×0.2 mm and 65 μm high, on an epoxy glass substrate.

[0166] <Evaluation of integrated encapsulating sheet> The release PET of the integrated encapsulating sheet of each example was peeled off, and the transparent curable resin layer (black curable resin layer in Example 3) was placed in contact with the LED light emitting element of the evaluation element-attached substrate. Thereafter, the transparent curable resin layer, or the black curable resin layer and the transparent curable resin layer, were filled between the light emitting elements in a vacuum press under conditions of a vacuum degree of 100 hPa, 100°C, 0.36 MPa, and 3 minutes, and ultraviolet rays having a wavelength of 365 nm were applied at 2000 mJ / cm. 2 The resin was irradiated and photocured to produce 10 light-emitting electronic components of each example.

[0167] [Lab] For each example, the Lab values ​​on the hard coat layer side of the ten light-emitting electronic components obtained were measured using a spectrophotometer CM-5 manufactured by Konica Minolta in accordance with JIS K 8722. Table 5 shows the average results of the Lab values ​​of the ten light-emitting electronic components for each example.

[0168] [Table 5]

[0169] From the above results, it was possible to manufacture the light-emitting electronic components shown in Table 5 in a shorter process time without the need for time-consuming etching treatment or long-term thermal curing. [Industrial Applicability]

[0170] The integrated encapsulating sheet according to the present invention can be used, for example, as a sheet for encapsulating a substrate on which a plurality of light emitting elements are arranged. [Explanation of symbols]

[0171] DESCRIPTION OF SYMBOLS 1, 1b...integrated encapsulating sheet, 2...substrate with element, 3, 3b...light-emitting electronic component, 10...transparent curable resin layer, 11...semi-transparent layer, 12, 13...protective film, 14...black curable resin layer, 20...substrate, 21, 22, 23...light-emitting element, 30, 30b...integrated encapsulating cured sheet, 31...transparent resin layer, 32...black resin layer, 35...resin layer, 110...support film layer, 111...coating layer, 112...hard coat layer.

Claims

1. An integrated encapsulating sheet that is pressure-bonded to a surface of an element-mounted substrate on which a plurality of light-emitting elements are arranged, the surface being formed with the plurality of light-emitting elements, During the compression bonding, a transparent curable resin layer and a semi-transparent layer are laminated in this order from the side closer to the plurality of light-emitting elements, The integrated encapsulating sheet, wherein the transparent curable resin layer contains a photocurable resin composition.

2. The integrated encapsulating sheet according to claim 1, wherein the translucent layer has a total light transmittance of 20 to 80%.

3. 3. The integrated encapsulating sheet according to claim 1, wherein the transparent curable resin layer has a total light transmittance of 50% or more and is higher than a total light transmittance of the semitransparent layer.

4. The integrated encapsulating sheet according to claim 1 , wherein the semi-transparent layer has a transmittance of 10% or more for ultraviolet light having a wavelength of 365 nm.

5. The semi-transparent layer is formed by laminating at least a coating layer and a support film layer, The integrated encapsulating sheet according to claim 1 , wherein the coating layer is in contact with the transparent curable resin layer.

6. the semi-transparent layer is a laminate of at least the support film layer and a hard coat layer, The integrated encapsulating sheet according to claim 1 , wherein the support film layer is located on the transparent curable resin layer side.

7. The integrated encapsulating sheet according to claim 5 or 6, characterized in that at least one of the support film layer, the coating layer, and / or the hard coat layer has a total light transmittance of 20 to 70%.

8. 7. The integral encapsulating sheet according to claim 5 or 6, wherein at least one of the support film layer, the coating layer, and / or the hard coat layer contains a black pigment or a black dye.

9. 9. The integral encapsulating sheet according to claim 8, wherein the black pigment is carbon black.

10. The storage modulus of the transparent curable resin layer is 1.0×10 ７ The integrated encapsulating sheet according to claim 1 or 2, characterized in that the compressive strength is 0.01 Pa or less.

11. the transparent curable resin layer comprises a high molecular weight resin, The integrated encapsulating sheet according to claim 1 or 2, characterized in that the high molecular weight resin has a weight average molecular weight of 100,000 to 1,000,000.

12. The integrated encapsulating sheet according to claim 11, characterized in that the high molecular weight resin has a weight average molecular weight of 120,000 to 500,000.

13. a black curable resin layer is provided on a surface of the transparent curable resin layer opposite to the translucent layer; The integrated encapsulating sheet according to claim 1, wherein the black curable resin layer has a total light transmittance of 0 to 30%.

14. The storage modulus of the black curable resin layer is 1.0×10 ５ The integrated encapsulating sheet according to claim 13, wherein the storage modulus of the transparent curable resin layer is 0.01 Pa or less and is lower than the storage modulus of the transparent curable resin layer.

15. a substrate having a plurality of light emitting elements disposed thereon; an integrated encapsulating cured sheet pressure-bonded to a surface of the element-mounted substrate on which the plurality of light-emitting elements are arranged, the integrated encapsulating cured sheet has a resin layer and a semi-transparent layer laminated in this order from the side closer to the element-mounted substrate, A light-emitting electronic component, characterized in that at least a part of the resin layer is filled between the plurality of light-emitting elements.

16. 16. The light-emitting electronic component according to claim 15, wherein the resin layer includes at least a transparent resin layer, and the thickness of the transparent resin layer is 1.05 to 5 times the height of the plurality of light-emitting elements.

17. the resin layer includes at least a black resin layer in addition to the transparent resin layer, the black resin layer is formed between the element-mounted substrate and the transparent resin layer, The light-emitting electronic component according to claim 15, characterized in that the thickness of the transparent resin layer is 0.1 to 5 times the height of the plurality of light-emitting elements, and the thickness of the black resin layer is 0.1 to 0.9 times the height of the plurality of light-emitting elements.

18. The integrated encapsulating sheet according to claim 1 or 13 is pressure-bonded to a surface of a substrate on which a plurality of light-emitting elements are arranged, the surface being provided with the light-emitting elements; At least a portion of the transparent curable resin layer is filled between the plurality of light emitting elements; The method for producing a light-emitting electronic component further comprises photocuring the transparent curable resin layer.

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