Resin molding device and method for manufacturing resin molded product

Abstract

To provide a resin molding device capable of preventing a molding object from falling even if the molding object is warped.SOLUTION: In a resin molding device that places a molding object between upper and lower molds and performs compression molding, the upper mold includes: a plurality of suction holes formed in a lower surface of the upper mold so as to open thereto, for suctioning the molding object; a first suction mechanism capable of sucking air from at least one first suction hole among the plurality of suction holes; and a second suction mechanism capable of sucking air through at least one second suction hole among the plurality of suction holes and capable of sucking air through the second suction hole independently of the first suction mechanism.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a resin molding apparatus and a method for manufacturing a resin molded product. [Background technology]

[0002] Patent Document 1 discloses a resin molding apparatus that performs compression molding on a workpiece. In the resin molding apparatus described in Patent Document 1, a suction device is connected to a suction passage formed in an upper die. The suction passage is opened at a plurality of locations on the lower surface (mold surface) of the upper die. By operating the suction device and sucking air through the suction passage, the workpiece can be adsorbed and held on the upper die. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-3677 A Summary of the Invention [Problem to be solved by the invention]

[0004] Here, the workpiece described in Patent Document 1 may be deformed (warped) due to the influence of electronic components fixed to the workpiece or molded resin. In a resin molding device described in Patent Document 1, if the workpiece attracted to the upper die is deformed so as to move away from the upper die and the suction path is opened even partially, the air pressure in the entire suction path and the air pressure in the space below the workpiece will match, making it impossible to attract the workpiece and causing the workpiece to fall from the upper die.

[0005] The present invention has been made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a resin molding apparatus and a method for manufacturing a resin molded product that are capable of preventing the molded object from falling even if the molded object warps. [Means for solving the problem]

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the resin molding apparatus of the present invention is a resin molding apparatus in which an object to be molded is placed between an upper mold and a lower mold and compression molding is performed, the upper mold has a plurality of suction holes formed in the upper mold so as to open to the lower surface of the upper mold and for suctioning the object to be molded, and is equipped with a first suction mechanism capable of sucking air through at least one first suction hole among the plurality of suction holes, and a second suction mechanism capable of sucking air through at least one second suction hole among the plurality of suction holes and capable of sucking air through the second suction hole independently of the first suction mechanism.

[0007] In addition, the manufacturing method of a resin molded product according to the present invention is a manufacturing method of a resin molded product using the resin molding apparatus, and includes an adsorption process for adsorbing the molded object to the lower surface of the upper mold, and a mold clamping process for clamping the upper mold and the lower mold. Effect of the Invention

[0008] According to the present invention, even if the molding object is warped, it is possible to prevent the molding object from falling. [Brief description of the drawings]

[0009] [Figure 1] 1 is a front cross-sectional view showing a configuration of a resin molding apparatus according to a first embodiment. [Diagram 2] (a) is a front cross-sectional view showing an upper die holder and an upper die, (b) is a bottom view showing the upper die. [Diagram 3] 4 is a flowchart showing a method for manufacturing a resin molded product. [Figure 4] FIG. 2 is a front cross-sectional view showing the resin molding apparatus with the mold storage space sealed. [Diagram 5] FIG. 4 is a front cross-sectional view showing the resin molding apparatus with the molds opened. [Figure 6] FIG. 11 is a front cross-sectional view showing the configuration of a resin molding apparatus according to a second embodiment. [Figure 7]FIG. 11 is a front cross-sectional view showing the configuration of a resin molding apparatus according to a third embodiment. [Figure 8] 13A is a front cross-sectional view showing an upper die holder and an upper die according to a modified example, and FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] <Resin molding apparatus 100 (first embodiment)> First, a resin molding apparatus 100 according to a first embodiment will be described with reference to FIG.

[0011] The resin molding apparatus 100 shown in FIG. 1 is an apparatus capable of resin molding by compression molding. The resin molding apparatus 100 according to this embodiment can resin-seal electronic elements such as semiconductor chips fixed to a substrate W, which is a molding target, to produce a resin molded product. As the substrate W, a semiconductor substrate such as a silicon wafer, a metal substrate, a glass substrate, a ceramic substrate, a resin substrate, or the like can be used. The substrate W may or may not be wired. In each embodiment described below, a circular substrate W is used. The resin molding apparatus 100 mainly includes a lower mold holder 110, an upper mold holder 120, a seal member 130, a lower mold 140, an upper mold 150, a decompression pump 160, a central suction pump 170, an outer suction pump 180, and a mold clamping mechanism 190.

[0012] The lower die holder 110 supports the lower die 140. The lower die holder 110 includes a bottom surface portion 110a that supports the lower die 140 from below, and a side surface portion 110b that is formed so as to surround the lower die 140 from the sides.

[0013] The upper die holder 120 supports the upper die 150. The upper die holder 120 has an upper surface portion 120a that supports the upper die 150 from above, and a side surface portion 120b formed to surround the upper die 150 from the side. The lower die holder 110 and the upper die holder 120 form a space (accommodation space) that accommodates the molding dies (lower die 140 and upper die 150) during resin molding. In addition, the upper die holder 120 is formed with a pressure reduction path 121, a central suction path 122, and an outer suction path 123.

[0014] Decompression path 121 is an air suction path for sucking air when the storage space of the casting mold is decompressed. Decompression path 121 is formed so as to connect the inside (storage space of the casting mold) and the outside of upper mold holder 120. Decompression path 121 is formed on the lower surface of upper surface portion 120a so as to open at a position that does not overlap with upper mold 150 (around upper mold 150).

[0015] The central suction path 122 is an air suction path for sucking air when the substrate W is suctioned by the central suction hole 151a formed in the upper mold 150. The central suction path 122 is formed so as to connect the inside (the mold accommodation space) and the outside of the upper mold holder 120. The central suction path 122 is formed on the lower surface of the upper surface portion 120a so as to open at a position overlapping with the central suction hole 151a of the upper mold 150.

[0016] The outer suction path 123 is an air suction path for sucking air when the substrate W is suctioned by the outer suction holes 151b formed in the upper mold 150. The outer suction path 123 is formed to connect the inside (the mold storage space) and the outside of the upper mold holder 120. The outer suction path 123 is formed on the lower surface of the upper surface portion 120a so as to open at a position overlapping with the outer suction holes 151b of the upper mold 150.

[0017] The pressure reduction path 121, the central suction path 122, and the outer suction path 123 are formed independently of one another (so as not to be connected to one another).

[0018] 1 and the like are schematic diagrams, and there are no particular limitations on the specific shapes of the pressure reduction path 121, the central suction path 122, and the outer suction path 123. In other words, each path can be bent or branched as necessary.

[0019] The seal member 130 is for sealing the gap between the lower mold holder 110 and the upper mold holder 120. The seal member 130 is in the shape of a rectangular ring and is made of an elastic material. The seal member 130 is disposed, for example, on the bottom surface of the side surface portion 120b of the upper mold holder 120 (the portion facing the side surface portion 110b of the lower mold holder 110). When the lower mold holder 110 and the upper mold holder 120 approach each other, the seal member 130 is sandwiched between the lower mold holder 110 and the upper mold holder 120, thereby sealing the gap between the lower mold holder 110 and the upper mold holder 120.

[0020] In the illustrated example, the seal member 130 is provided on the upper holder 120, but it is also possible to provide the seal member 130 on the lower holder 110, or to provide the seal member 130 on both the lower holder 110 and the upper holder 120. It is also possible to provide a plurality of seal members 130. As a first example, another seal member 130 different from the seal member 130 arranged between the upper holder 120 and the lower holder 110 may be arranged in the middle of the side portion 120b of the upper holder 120. In this case, the other seal member 130 is sandwiched between the two side portions 120b. As a second example, another seal member 130 different from the seal member 130 arranged between the upper holder 120 and the lower holder 110 may be arranged in the middle of the side portion 110b of the lower holder 110. In this case, the other seal member 130 is sandwiched between the two side portions 110b. Furthermore, the shape of the seal member 130 is not limited to a rectangular annular shape, but may be, for example, a circular annular shape.

[0021] The lower die 140 forms the lower part of the molding die and mainly includes a bottom member 141, a side member 142, an elastic member 143, and the like.

[0022] The bottom surface member 141 forms the bottom surface of the cavity C. The bottom surface member 141 is formed in a circular shape in a plan view. The bottom surface member 141 is formed to have an appropriate vertical width. The bottom surface member 141 is disposed in a state in which it is placed on the central portion of the bottom surface portion 110a of the lower die holder 110.

[0023] The side surface member 142 surrounds the bottom surface member 141 from the sides. The side surface member 142 is frame-shaped and formed to have an appropriate vertical width. A hollow portion is formed in the side surface member 142, penetrating the center of the side surface member 142 from top to bottom. The hollow portion of the side surface member 142 is formed in a shape that generally matches the outer shape of the bottom surface member 141 in a plan view.

[0024] In this way, the side member 142 is formed into a circular frame shape in a plan view. The bottom member 141 is disposed in the hollow portion of the side member 142. The side member 142 is disposed in a state of being placed on the bottom portion 110a of the lower die holder 110 via an elastic member 143. The upper surface of the side member 142 is located higher than the upper surface of the bottom member 141. The side member 142, the bottom member 141, and the upper die 150 define a cavity C for resin molding.

[0025] The elastic member 143 is disposed between the side member 142 and the bottom surface portion 110a of the lower die holder 110. The elastic member 143 is formed of, for example, a compression coil spring that is vertically expandable and contractible.

[0026] In addition, suction holes (not shown) for suctioning and holding a release film (not shown) are appropriately formed on the upper surface of the lower mold 140 (the bottom member 141 and the side member 142). By applying negative pressure to these suction holes using a pump or the like (not shown), the release film can be suctioned and held.

[0027] The upper die 150 forms the upper part of the molding die. The upper die 150 is formed in a circular shape when viewed from the bottom. The upper die 150 is formed to have an appropriate vertical width. The upper die 150 is fixed to the center part of the lower surface of the upper surface part 120a of the upper die holder 120. The upper die 150 has a suction hole 151 formed therein.

[0028] The suction holes 151 shown in Fig. 2 are for suctioning the substrate W. The suction holes 151 are formed so as to penetrate the upper mold 150 from top to bottom. As shown in Fig. 2(b), a plurality of suction holes 151 are formed over the entire area (circular area) facing the substrate W to be suctioned. In this embodiment, the plurality of suction holes 151 are classified into central suction holes 151a and outer suction holes 151b. A plurality of central suction holes 151a and outer suction holes 151b are provided.

[0029] The central suction hole 151a is a suction hole 151 formed in a predetermined range including the center (geometric center) of the shape (circular) of the substrate W when viewed from the bottom. A group consisting of multiple central suction holes 151a is formed in a predetermined range. In this embodiment, the suction hole 151 inside an area L (area indicated by a dashed dotted line in FIG. 2(b)) set concentrically with the substrate W is set as the central suction hole 151a. The predetermined range corresponds to the area L. The predetermined range may be a range including the center (geometric center) of the area for suctioning the substrate W.

[0030] The outer suction holes 151b are suction holes 151 formed around the central suction hole 151a. In this embodiment, the suction holes 151 outside the region L (the region surrounding the region L) are set as the outer suction holes 151b. Note that the central suction hole 151a and the outer suction holes 151b according to this embodiment are embodiments of the first suction hole and the second suction hole according to the present invention, respectively.

[0031] When upper mold 150 is attached to upper mold holder 120, central suction hole 151a is connected to central suction path 122 of upper mold holder 120. Also, outer suction hole 151b is connected to outer suction path 123 of upper mold holder 120.

[0032] The decompression pump 160 is for sucking air from the decompression path 121. The decompression pump 160 is connected to the decompression path 121 of the upper die holder 120 via a decompression connection path 161 configured with an appropriate hose or the like. When the decompression pump 160 operates with the lower die holder 110 and the upper die holder 120 in close contact with each other via the seal member 130, the storage space of the mold is decompressed via the decompression path 121. This makes it possible to suppress the generation of voids in the resin molded product. The decompression pump 160 according to this embodiment is one embodiment of a decompression mechanism according to the present invention.

[0033] The central suction pump 170 is for sucking air from the central suction path 122. The central suction pump 170 is connected to the central suction path 122 of the upper mold holder 120 via a connection path 171 formed of an appropriate hose or the like. When the central suction pump 170 is operated, air is sucked from the central suction hole 151a of the upper mold 150 via the central suction path 122. This allows the substrate W to be sucked and held by the central suction hole 151a.

[0034] The outer suction pump 180 is for sucking air from the outer suction path 123. The outer suction pump 180 is connected to the outer suction path 123 of the upper mold holder 120 via a connection path 181 formed of an appropriate hose or the like. When the outer suction pump 180 is operated, air is sucked from the outer suction holes 151b of the upper mold 150 via the outer suction path 123. This makes it possible to suck and hold the substrate W in the outer suction holes 151b. The central suction pump 170 and the outer suction pump 180 are embodiments of a first pump and a second pump according to the present invention, respectively.

[0035] In this manner, in the first embodiment, a central suction mechanism A for sucking air from the central suction hole 151a and an outer suction mechanism B for sucking air from the outer suction hole 151b are provided independently. The central suction mechanism A includes a central suction pump 170, a connection path 171, and a central suction path 122. The outer suction mechanism B includes an outer suction pump 180, a connection path 181, and an outer suction path 123. The central suction mechanism A and the outer suction mechanism B can suck air from the central suction hole 151a and the outer suction hole 151b independently of each other. The central suction mechanism A and the outer suction mechanism B according to this embodiment are embodiments of the first suction mechanism and the second suction mechanism according to the present invention, respectively.

[0036] The mold clamping mechanism 190 lifts and lowers the lower mold 140 to perform mold clamping and mold opening, etc. A ball screw mechanism, a hydraulic cylinder, a toggle mechanism, etc. can be used as the mold clamping mechanism 190. The mold clamping mechanism 190 is disposed below the lower mold holder 110, and can lift and lower the lower mold 140 via the lower mold holder 110.

[0037] The operations of each part of the above-mentioned resin molding apparatus 100 are appropriately controlled by a control device (not shown).

[0038] <Manufacturing method for resin molded products> Next, an example of a method for producing a resin molded product using the resin molding apparatus 100 will be described.

[0039] 3, the method for producing a resin molded product according to this embodiment mainly includes a film arrangement step S10, a carry-in step S20, a decompression step S30, a mold clamping step S40, a resin molding step S50, a mold opening step S60, and a carry-out step S70. These steps will be described in order below.

[0040] The film placement step S10 is a step of placing a release film (not shown) on the lower mold 140.

[0041] Specifically, in the film placement step S10, a release film is carried into the molding die by a predetermined conveying device. The release film is adsorbed to the upper surface of the lower die 140 and held so as to conform to the shape of the upper surface of the lower die 140.

[0042] By providing a release film on the lower die 140, it is possible to prevent the resin material R from adhering to the surface of the lower die 140. Furthermore, if a foreign matter adheres to the surface of the lower die 140 (the release film), the foreign matter can be easily removed by replacing the release film. Note that in the film arrangement step S10, a release film may be arranged not only on the lower die 140 but also on the upper die 150.

[0043] After the release film is adsorbed to the lower die 140, the process proceeds from the film placement step S10 to the loading step S20.

[0044] The loading step S20 is a step of loading the resin material R and the substrate W into the molding die.

[0045] Specifically, in the carrying-in step S20, the resin material R is carried into the molding die by a predetermined carrying device. As shown in Fig. 1, the resin material R is contained within the lower die 140 (inside the side member 142). Note that as the resin material R, resins in various states can be used, such as solid powdered resin (including granular resin) and liquid resin.

[0046] In the loading step S20, the substrate W is loaded into the molding die by a predetermined transport device. As shown in Fig. 1, the central suction pump 170 of the central suction mechanism A and the outer suction pump 180 of the outer suction mechanism B are operated to suction the substrate W into the suction holes 151 (the central suction hole 151a and the outer suction hole 151b) of the upper die 150.

[0047] Here, warping may occur in the substrate W due to the influence (difference in linear expansion coefficient) of the fixed electronic elements, etc. However, by adsorbing the substrate W along the lower surface of the upper mold 150 by the suction holes 151 (the central suction hole 151a and the outer suction holes 151b), the substrate W can be held in a state in which the warping of the substrate W is corrected.

[0048] In the loading step S20, in addition to suction through the suction holes 151, it is also possible to hold the substrate W on the upper mold 150 by a mechanical clamper (not shown) provided on the upper mold 150. This makes it possible to prevent the substrate W from falling even if a problem occurs with suction through the suction holes 151.

[0049] Further, the order in which the resin material R and the substrate W are carried in is not particularly limited. Either the resin material R or the substrate W may be carried in the molding die first, or the resin material R and the substrate W may be carried in the molding die simultaneously. The carrying-in step S20 according to this embodiment is one embodiment of the adsorption step according to the present invention.

[0050] After the loading of the resin material R and the substrate W is completed, the loading step S20 is followed by a depressurization step S30.

[0051] The depressurization step S30 is a step of reducing the pressure in the accommodation space of the casting mold.

[0052] Specifically, by driving the mold clamping mechanism 190, the lower mold holder 110 rises toward the upper mold holder 120. When the lower mold holder 110 rises to a predetermined position, the upper surface of the side surface portion 110b comes into contact with the lower surface of the side surface portion 120b of the upper mold holder 120 via the seal member 130. This seals the accommodation space of the molding dies (lower mold 140 and upper mold 150) (see FIG. 4). Note that in this state, the lower mold 140 and the upper mold 150 are not yet in contact with each other.

[0053] In this state, the pressure reduction pump 160 is operated to reduce the pressure (vacuum drawing) in the housing space of the casting mold, thereby discharging the air or gas in the resin material R and suppressing the generation of voids in the resin molded product.

[0054] Furthermore, when the substrate W is held by a mechanical clamper, the clamper's hold is released before the lower mold 140 and the upper mold 150 come into contact with each other (when there is a gap between the lower mold 140 and the upper mold 150). By releasing the clamper's hold when there is a gap between the lower mold 140 and the upper mold 150 in this way, it becomes unnecessary to form a recess in the lower mold 140 to prevent the clamper from coming into contact with the lower mold 140. This makes it possible to use a side member 142 with a small frame thickness. In this case, the cavity C can be made wide.

[0055] Here, when the decompression pump 160 is operated to reduce the pressure in the accommodation space, the air pressure difference between the top and bottom of the substrate W adsorbed to the upper mold 150 decreases. Specifically, the difference between the air pressure inside the suction hole 151 adsorbing the substrate W and the air pressure below the substrate W (the accommodation space) decreases. When the air pressure inside the suction hole 151 is lower than the air pressure below the substrate W, the substrate W is pushed from the bottom to the top, and the substrate W is adsorbed to the upper mold 150. The suction force for adsorbing the substrate W increases as the pressure difference between the air pressure inside the suction hole 151 and the air pressure below the substrate W increases. When the air pressure difference between the suction hole 151 and the accommodation space decreases, if the substrate W is warped as described above, the suction force of the suction hole 151, which has decreased due to the decrease in the pressure difference, is not enough to correct the warpage of the substrate W, and the substrate W may be separated from the upper mold 150.

[0056] 4 shows an example in which the outer peripheral portion of the substrate W is bent (warped) downward so as to move away from the upper mold 150. When such deformation occurs, the outer suction holes 151b formed on the outside among the multiple suction holes 151 move away from the substrate W and become connected to the accommodation space. In this state, even if the outer suction pump 180 is operating, the outer suction holes 151b cannot suction the substrate W because there is no pressure difference between the air pressure at the outer suction holes 151b and the air pressure in the accommodation space.

[0057] However, in this embodiment, the substrate W is suctioned from the central suction hole 151a via a path independent of the outer suction holes 151b. Therefore, even if the outer suction holes 151b are connected to the accommodation space, a certain degree of pressure difference between the air pressure at the central suction hole 151a and the air pressure in the accommodation space can be ensured, and the substrate W can be suctioned by the central suction hole 151a. In this way, by suctioning the substrate W via a plurality of independent paths, it is possible to prevent the substrate W from falling.

[0058] After the accommodation space is depressurized, the process proceeds from the depressurization step S30 to the mold clamping step S40.

[0059] The mold clamping step S40 is a step of closing (clamping) the forming molds (lower mold 140 and upper mold 150).

[0060] Specifically, in the mold clamping step S40, first, the resin material R contained in the cavity C is heated by a heating mechanism (not shown) provided in the lower mold 140. A thermosetting resin material is used as the resin material R. When the temperature of the thermosetting resin material is increased, the viscosity of the resin material decreases once, and then the resin material hardens. When the resin material R is heated, the viscosity of the resin material R decreases. When the resin material R is a solid resin material, the resin material R is melted by heating.

[0061] Next, the mold clamping mechanism 190 is driven, and the lower mold holder 110 rises while compressing the seal member 130 vertically. Accordingly, the lower mold 140 rises toward the upper mold 150. When the lower mold 140 rises to a predetermined position, the upper surface of the side member 142 comes into contact with the lower surface of the upper mold 150 via the substrate W, and the lower mold 140 (the space containing the resin material R) is blocked from above by the upper mold 150. Note that, although an example in which the lower mold 140 and the upper mold 150 come into contact with each other via the substrate W is shown in this embodiment, for example, the substrate W may be formed to a size that fits inside the cavity C, and the lower mold 140 and the upper mold 150 may come into direct contact with each other.

[0062] Further, by driving the mold clamping mechanism 190, the bottom member 141 of the lower mold 140 further rises toward the upper mold 150. At this time, the side member 142 does not rise because it is in contact with the upper mold 150. In other words, the bottom member 141 rises relative to the side member 142. When the bottom member 141 rises, the resin material R contained in the lower mold 140 is pressurized. When the bottom member 141 has risen to a certain extent, mold clamping is completed.

[0063] After the mold clamping is completed, the mold clamping step S40 is followed by the resin molding step S50.

[0064] The resin molding step S50 is a step of hardening the resin material R to perform resin molding.

[0065] Specifically, in the resin molding step S50, the resin material R is kept in a pressurized state for a predetermined time. This causes the temperature of the thermosetting resin material R to further increase, and the resin material R hardens. As a result, the resin molding can be performed on the substrate W.

[0066] After the resin material R has hardened, the process moves from the resin molding process S50 to the mold opening process S60.

[0067] The mold opening step S60 is a step of opening the forming molds (lower mold 140 and upper mold 150).

[0068] 5, in the mold opening step S60, the mold clamping mechanism 190 is driven to lower the lower mold 140 so as to separate from the upper mold 150. As a result, the lower mold 140 separates from the lower surface of the upper mold 150.

[0069] Here, due to the difference in thermal shrinkage rate between the substrate W and the resin material R when cooled by mold opening, there is a possibility that deformation (warping) will occur in the resin-molded substrate W (resin molded product). For example, FIG. 5 shows an example in which the outer peripheral portion of the resin-molded substrate W is bent downward. When such deformation occurs, the outer suction holes 151b formed on the outside of the multiple suction holes 151 are separated from the substrate W and connected to the accommodation space. In this state, even if the outer suction pump 180 is operating, the pressure difference between the air pressure of the outer suction holes 151b and the air pressure of the accommodation space disappears, so that the suction force decreases and the outer suction holes 151b cannot suction the substrate W.

[0070] However, in this embodiment, the substrate W is suctioned from the central suction hole 151a via a path independent of the outer suction holes 151b. Therefore, even if the outer suction holes 151b are connected to the accommodation space, a certain degree of pressure difference between the air pressure at the central suction hole 151a and the air pressure in the accommodation space can be ensured, and the substrate W can be suctioned by the central suction hole 151a. In this way, by suctioning the substrate W via a plurality of independent paths, it is possible to prevent the substrate W from falling.

[0071] After the mold opening is completed, the mold opening process S60 is followed by a carry-out process S70.

[0072] The carrying-out step S70 is a step of carrying out the resin molded article from the molding die by a predetermined conveying device.

[0073] In this manner, in this embodiment, even if the substrate W (resin molded product) adsorbed to the upper die 150 is deformed before or after resin molding, the substrate W can be prevented from falling.

[0074] 5 and the like show an example in which the central portion of the lower surface of the substrate W is sealed with resin. However, for example, a method (overmolding) in which not only the central portion of the lower surface of the substrate W but also the edge portion of the substrate W is sealed with resin may be performed.

[0075] <Resin molding apparatus 200 (second embodiment)> The resin molding apparatus 200 according to the second embodiment will be described below with reference to FIG.

[0076] The resin molding apparatus 200 according to the second embodiment differs from the resin molding apparatus 100 according to the first embodiment in that it can suck air independently from the central suction hole 151a and the outer suction hole 151b by using two valves (the central suction valve 220 and the outer suction valve 230). Therefore, the following mainly describes this difference, and the description of the same configuration as the first embodiment is omitted.

[0077] The resin molding apparatus 200 according to the second embodiment includes a suction pump 210, a central suction valve 220, and an outer suction valve 230.

[0078] The suction pump 210 is for sucking air from the central suction path 122 and the outer suction path 123. The suction pump 210 is connected to the central suction path 122 and the outer suction path 123 of the upper holder 120 via a connection path 211 formed of an appropriate hose or the like. Specifically, the connection path 211 connected to the suction pump 210 branches into two connection paths 211a and 211b at a midway point. One connection path 211a is connected to the central suction path 122 of the upper holder 120. The other connection path 211b is connected to the outer suction path 123 of the upper holder 120. The connection path 211b and the outer suction path 123 according to this embodiment are one embodiment of the suction path according to the present invention.

[0079] The central suction valve 220 opens and closes the connection path 211a, thereby switching between allowing and not allowing air to flow through the connection path 211a. The central suction valve 220 is provided in the middle of the connection path 211a.

[0080] The outer suction valve 230 opens and closes the connection path 211b to switch between allowing and not allowing air to flow through the connection path 211b. The outer suction valve 230 is provided in the middle of the connection path 211b. The outer suction valve 230 according to this embodiment is one embodiment of a valve according to the present invention.

[0081] In this way, in the second embodiment, the central suction valve 220, the connection path 211a, and the central suction path 122 (hereinafter referred to as "central suction mechanism A") for sucking air from the central suction hole 151a, and the outer suction valve 230, the connection path 211b, and the outer suction path 123 (hereinafter referred to as "outer suction mechanism B") for sucking air from the outer suction holes 151b are provided independently. Also, in the second embodiment, a common suction pump 210 is used to suck air by the central suction mechanism A and the outer suction mechanism B.

[0082] In the second embodiment thus configured, when the substrate W is adsorbed to the upper mold 150 in the above-described loading step S20, the adsorption pump 210 is operated with the central adsorption valve 220 and the outer adsorption valve 230 open. This allows the substrate W to be adsorbed to the central adsorption hole 151a and the outer adsorption hole 151b.

[0083] As described above, in the depressurization step S30, the mold opening step S60, etc., if the outer peripheral portion of the substrate W separates from the upper mold 150 due to warping of the substrate W (see FIGS. 4, 5, etc.), the outer suction valve 230 of the outer suction mechanism B is closed. In this state, the substrate W can be held by the central suction hole 151a. Even if the outer suction hole 151b is connected to the accommodation space due to warping of the substrate W, the outer suction valve 230 is closed, so that a certain degree of pressure difference between the air pressure at the central suction hole 151a and the air pressure in the accommodation space can be secured, and the substrate W can be prevented from falling.

[0084] The timing for opening and closing the outer suction valve 230 can be set arbitrarily. For example, if the timing at which warping occurs in the substrate W is known in advance according to the resin molded product to be manufactured, it is possible to configure the outer suction valve 230 to close in accordance with that timing. It is also possible to detect the presence or absence of warping in the substrate W using various sensors and control the operation of the outer suction valve 230 according to the detection result.

[0085] Furthermore, when manufacturing a resin molded product with the central suction valve 220 always open (when only the outer suction valve 230 is opened and closed), it is not necessarily necessary to provide the central suction valve 220.

[0086] <Resin molding apparatus 300 (third embodiment)> Hereinafter, a resin molding apparatus 300 according to the third embodiment will be described with reference to FIG.

[0087] The resin molding apparatus 300 according to the third embodiment differs from the resin molding apparatus 100 according to the first embodiment in that the outer suction mechanism B for sucking air from the outer suction holes 151b is further configured with a plurality of independent paths (two in the illustrated example). Therefore, the following mainly describes this difference, and the description of the same configuration as the first embodiment is omitted.

[0088] In the resin molding apparatus 300 according to the third embodiment, the outer suction holes 151b formed outside the central suction hole 151a are further classified into two types of suction holes 151 (first outer suction hole 151ba and second outer suction hole 151bb).

[0089] The first outer suction hole 151ba is one that is formed on the inner side among the plurality of outer suction holes 151b, and the second outer suction hole 151bb is one that is formed on the outer side of the first outer suction hole 151ba.

[0090] The upper holder 120 is also formed with a first outer suction path 123a connected to the first outer suction hole 151ba, and a second outer suction path 123b connected to the second outer suction hole 151bb.

[0091] The outer suction mechanism B can suction the substrate W to the first outer suction hole 151ba by the first outer suction pump 180a, the first connection path 181a, and the first outer suction path 123a. The outer suction mechanism B can suction the substrate W to the second outer suction hole 151bb by the second outer suction pump 180b, the second connection path 181b, and the second outer suction path 123b. In this way, the substrate W can be independently suctioned by the first outer suction hole 151ba and the second outer suction hole 151bb by the multiple independent paths.

[0092] By configuring the outer suction mechanism B in this manner, the substrate W can be appropriately suctioned according to the degree of warping of the substrate W. For example, when the substrate W has a relatively large warp and moves away from the first outer suction hole 151ba and the second outer suction hole 151bb, the substrate W can be suctioned by the central suction hole 151a to prevent the substrate W from falling. When the substrate W has a relatively small warp and moves away from the second outer suction hole 151bb (but does not move away from the first outer suction hole 151ba), the substrate W can be suctioned by the central suction hole 151a and the first outer suction hole 151ba to more firmly suction and hold the substrate W.

[0093] In the third embodiment, an example is shown in which the outer suction mechanism B is configured with two independent paths, but the present invention is not limited to this, and it is also possible to configure it with three or more independent paths.

[0094] In the third embodiment, an example has been shown in which three pumps (the central suction pump 170, the first outer suction pump 180a, and the second outer suction pump 180b) are used to suction the substrate W independently from three types of suction holes 151 (the central suction hole 151a, the first outer suction hole 151ba, and the second outer suction hole 151bb). However, the present invention is not limited to this. For example, as in the second embodiment (see FIG. 6), it is also possible to configure the substrate W to be suctioned independently from three types of suction holes 151 using valves. It is also possible to appropriately combine a plurality of pumps and valves to suction the substrate W independently from a plurality of types of suction holes 151.

[0095] <Modifications of the arrangement of the suction holes 151> A modified example of the arrangement of the suction holes 151 will be described below with reference to FIG.

[0096] In the first to third embodiments, an example has been shown in which the suction holes 151 are formed in a range facing the circular substrate W (circular range) assuming that a circular substrate W is used (see Figure 2 (b)), but the present invention is not limited to this, and the suction holes 151 can be formed in any range depending on the shape of the substrate W.

[0097] For example, Fig. 8 shows an example (variation) of the arrangement of the suction holes 151 when it is assumed that a rectangular (square) substrate W is used. In the example shown in Fig. 8, the suction holes 151 are formed over the entire area (rectangular area) facing the rectangular substrate W.

[0098] In the example of FIG. 8, the suction hole 151 formed in a predetermined range (area L) including the center (geometric center) of the shape (rectangle) of the substrate W in bottom view is set as the central suction hole 151a.

[0099] The arrangement of the first suction hole (central suction hole 151a) and the second suction hole (outer suction hole 151b) according to the present invention is not limited to the example shown in the above embodiment, and can be set arbitrarily. That is, the arrangement of the first suction hole and the second suction hole according to the present invention can be set arbitrarily as long as they are capable of sucking air (adsorbing the substrate W) independently. Generally, since it is expected that the outer periphery of the substrate W will deform (warp) so as to move away from the upper mold 150, it is preferable to set the second suction holes so as to surround the periphery of the first suction hole, and further, it is preferable to set the range including the center of the substrate W as the first suction hole.

[0100] In addition, when the warping of the substrate W is known in advance, the first suction holes and the second suction holes may be set at positions according to the warping of the substrate W. For example, when a longitudinal substrate W (such as a rectangular substrate W) is used, if it is known in advance that both longitudinal ends will be warped, the suction holes 151 that suction both longitudinal ends of the substrate W may be set as the second suction holes, and the suction holes 151 that suction the longitudinal central portion of the substrate W may be set as the first suction holes.

[0101] Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0102] For example, in the above embodiment, an example was shown in which a circular substrate W (see FIG. 2) was mainly used, but the shape of the substrate W is not limited to this, and any shape of substrate W can be used. In addition, depending on the shape of the substrate W (circular, rectangular, etc.), the shape of each part (lower mold 140, upper mold 150, etc.) of the resin molding apparatus 100 can be arbitrarily changed to a circular shape in a plan view, a rectangular shape in a plan view, etc.

[0103] Moreover, the manufacturing method of the resin molded product shown in each of the above embodiments (see FIG. 3) is an example, and can be modified as appropriate. For example, in each of the above embodiments, an example is shown in which the mold clamping step S40 is performed after the pressure reduction of the accommodation space in the pressure reduction step S30, but it is also possible to perform the pressure reduction step S30 and the mold clamping step S40 in parallel. Also, in each of the above embodiments, an example is shown in which a release film is placed on the molding die in the film placement step S10, and then the resin material R is carried in the carry-in step S20, but it is also possible, for example, to place the resin material R on the release film to be placed on the lower die 140, and then place the release film together with the resin material R on the lower die 140.

[0104] In addition, in each of the above-described embodiments, an example in which a thermosetting resin material is used as the resin material R has been described, but the present invention is not limited thereto, and a thermoplastic resin material may be used. Furthermore, in each of the above-described embodiments, an example in which the number of each of the central suction holes 151a and the outer suction holes 151b is two or more has been described. However, the number of each of the central suction holes 151a and the outer suction holes 151b may be one.

[0105] <Additional Notes> The resin molding apparatus 100, 200, 300 according to the first aspect of the present disclosure includes: A resin molding apparatus 100, 200, 300 for compressing a molding target (substrate W) placed between an upper mold 150 and a lower mold 140, The upper mold 150 has a plurality of suction holes 151 formed on the lower surface of the upper mold 150 to suction the molding object, a first suction mechanism (central suction mechanism A) capable of sucking air from at least one first suction hole (central suction hole 151a) among the plurality of suction holes 151; a second suction mechanism (outer suction mechanism B) capable of sucking air from at least one second suction hole (outer suction hole 151b) among the plurality of suction holes 151 and capable of sucking air through the second suction hole independently of the first suction mechanism; Equipped with: According to the resin molding apparatuses 100, 200, and 300 of the first aspect of the present disclosure, even if the molding object (substrate W) is warped, the molding object can be prevented from falling. That is, by adsorbing the molding object with a first suction mechanism and a second suction mechanism that are independent of each other, even if one suction mechanism is unable to adsorb the molding object due to warping of the molding object, the molding object can be adsorbed and held by the other suction mechanism.

[0106] In the resin molding apparatus 100 / 200 / 300 of the second aspect according to the first aspect, The first suction hole (the central suction hole 151a) and the second suction hole (the outer suction hole 151b) are each provided in a plurality of parts, The second suction holes are formed on the lower surface of the upper mold 150 around a group formed of the first suction holes. According to the resin molding apparatuses 100, 200, 300 of the second aspect of the present disclosure, the molding object (substrate W) can be appropriately held in the upper mold 150 even if warping occurs in the outer periphery of the molding object.

[0107] In a resin molding apparatus 100 according to a third aspect of the first or second aspect, The first suction mechanism (central suction mechanism A) includes a first pump (central suction pump 170) that sucks air from the first suction hole (central suction hole 151a), The second suction mechanism (outer suction mechanism B) includes a second pump (outer suction pump 180) that sucks air from the second suction holes (outer suction holes 151b). According to the resin molding apparatus 100 of the third aspect of the present disclosure, it is possible to prevent the object to be molded from falling without performing complex control such as opening and closing of valves.

[0108] In a resin molding apparatus 200 according to a fourth aspect of any one of the first to third aspects, The second suction mechanism (outer suction mechanism B) is a suction path (connection path 211b, outer suction path 123) connected to the second suction hole (outer suction hole 151b) and guiding air sucked from the second suction hole; A valve (outer suction valve 230) capable of switching between allowing and not allowing air to flow through the suction path; Equipped with: According to the resin molding apparatus 200 of the fourth aspect of the present disclosure, it is possible to prevent the molding object from falling even when a common pump (the suction pump 210) is used for the first suction mechanism and the second suction mechanism.

[0109] The resin molding apparatus 100, 200, 300 according to a fifth aspect of the present invention is The mold further includes a pressure reducing mechanism (pressure reducing pump 160) capable of reducing the pressure of the space (accommodation space) in which the upper mold 150 and the lower mold 140 are arranged. According to the resin molding apparatuses 100, 200, 300 of the fifth aspect of the present disclosure, it is possible to reduce the pressure in the accommodation space and suppress the generation of voids in the resin molded product, and also to prevent the molding object from falling when the pressure is reduced.

[0110] A method for manufacturing a resin molded product according to a sixth aspect of the present invention includes the steps of: A method for manufacturing a resin molded product using a resin molding apparatus 100, 200, or 300 according to any one of first to fifth aspects, a suction step (loading step S20) for suctioning the molding object (substrate W) onto the lower surface of the upper mold 150; a clamping step S40 for clamping the upper die 150 and the lower die 140; Includes. According to the method for manufacturing a resin molded product according to the sixth aspect of the present disclosure, even if the object to be molded (substrate W) is warped, it is possible to prevent the object from falling. [Explanation of symbols]

[0111] 100 Resin molding equipment 140 Lower mold 150 upper mold 151 Adsorption hole 151a Central suction hole 151b Outside suction hole 170 Central suction pump 180 External suction pump 210 Adsorption pump 220 Central suction valve 230 Outer suction valve A Central suction mechanism B Outside suction mechanism W substrate

Claims

1. A resin molding apparatus in which a molding object is placed between an upper mold and a lower mold and compression molding is performed, The upper mold has a plurality of suction holes formed in a lower surface of the upper mold for suctioning the molding object, a first suction mechanism capable of sucking air from at least one first suction hole among the plurality of suction holes; a second suction mechanism capable of sucking air through at least one second suction hole among the plurality of suction holes and capable of sucking air through the second suction hole independently of the first suction mechanism; A resin molding device comprising:

2. The first suction hole and the second suction hole are each provided in a plurality of holes, The second suction holes are formed on the lower surface of the upper mold around a group of the first suction holes. The resin molding apparatus according to claim 1 .

3. the first suction mechanism includes a first pump that sucks air through the first suction hole; The second suction mechanism includes a second pump that sucks air through the second suction hole. The resin molding apparatus according to claim 1 or 2.

4. The second suction mechanism is a suction path connected to the second suction hole and guiding air sucked through the second suction hole; A valve capable of switching between allowing and not allowing air to flow through the suction path; Equipped with The resin molding apparatus according to any one of claims 1 to 3.

5. Further comprising a pressure reducing mechanism capable of reducing the pressure in a space in which the upper mold and the lower mold are arranged. The resin molding apparatus according to any one of claims 1 to 4.

6. A method for producing a resin molded product using the resin molding apparatus according to any one of claims 1 to 5, a suction step of suctioning the molding object onto a lower surface of the upper mold; a mold clamping process for clamping the upper mold and the lower mold; A method for producing a resin molded product comprising the steps of:

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