Method for manufacturing substrate of semiconductor integrated circuit using graphite or amorphous carbon

Abstract

To solve a problem of difficulty in mass-producing graphite or amorphous carbon required for a substrate of an integrated circuit although the graphite that is a carbon isotope and the amorphous carbon such as carbon black are known as a material that can control higher power than silicon that is a main material of the substrate of the semiconductor integrated circuit.SOLUTION: The problem is solved by preparing a required size and shape by using two processing methods: resin bonding processing for solidifying graphite or amorphous carbon such as carbon black with resin up to a required size and shape for a substrate of an integrated circuit; and high temperature sintering processing for performing sintering at high temperature after press molding.SELECTED DRAWING: None

Description

[Technical field]

[0001] The present invention relates to an application technology of powder particle solidification and bonding technology. [Background technology]

[0002] Molding processing technology used in permanent magnets, etc. Summary of the Invention [Problem to be solved by the invention]

[0003] The material used for the substrate of semiconductor integrated circuits is mainly silicon, but because there are restrictions on the amount of power (current, voltage) that can be controlled (that the material can withstand), it could not be used in integrated circuits for devices that require large amounts of power. Graphite, a carbon allotrope, is known as a material capable of controlling larger amounts of electricity, but it has been difficult to mass-produce (crystallize) it in the size and shape required for integrated circuit substrates. [Means for solving the problem]

[0004] It is difficult to mass-produce (crystallize) graphite in the size and shape required for integrated circuit substrates, but fine-grained graphite is mass-produced (crystallized). This finely divided graphite is used as a material. There is a type of permanent magnet called a bonded magnet, in which magnetic powder is solidified (glued and bonded) with resin. Similarly, the problem is solved by a processing method that uses graphite instead of magnetic powder and bonds it with resin (resin bonding processing). (Unlike permanent magnets, semiconductor integrated circuit boards require electricity to flow through them, so the resin that holds the microparticles together is a conductive polymer that allows electricity to flow through.) Additionally, there is a type of permanent magnet called a sintered magnet, which is made by molding magnetic powder in a molding machine (press machine) and then sintering it at high temperatures (bonding it by heat treatment). Similarly, the problem is solved by using a processing method in which graphite, instead of magnetic powder, is pressed into a mold and then sintered at high temperatures (high-temperature sintering processing). (Sintering, which involves baking at high temperatures, is a process that bonds materials together at temperatures where they do not melt, rather than melting and compounding them.) Even if amorphous carbon (amorphous carbon) such as carbon black is used instead of graphite using these two processing methods, it is possible to control a similarly large amount of electricity, thereby solving the problem.

Claims

1. It is known that when graphite, a carbon allotrope, is used for the substrate of semiconductor integrated circuits, it can control much greater amounts of power (current, voltage) (is durable against large amounts of power) than silicon, which is currently the predominant material used. If this were used as a substrate material, it would be possible to control transportation and equipment that requires large amounts of electricity; however, it has not been put to practical use because it is difficult to mass-produce graphite in the size and shape required for integrated circuits (mass crystallization). It is difficult to manufacture (crystallize) large-sized graphite, but fine granular graphite is mass-produced, and this is the material we use. This is one of the methods for manufacturing permanent magnets, in which magnetic powder is solidified with resin into the required size and shape to create a bonded magnet. With this manufacturing method, the required amount of graphite (fine particles) rather than magnetic powder is collected and solidified with resin into the required size and shape to create the substrate for the integrated circuit. (Unlike permanent magnets, the substrate of a semiconductor integrated circuit requires the flow of electricity, so the resin that solidifies the microparticles is a conductive polymer that allows electricity to flow.)

2. 2. The method according to claim 1, wherein the material used is amorphous carbon (non-crystalline carbon) such as carbon black instead of graphite (fine particles).

3. Sintered magnets are a method of manufacturing permanent magnets in which magnetic powder is molded into the required size and shape using a molding machine (press) and then sintered at high temperature to harden the magnet. With this manufacturing method, the required amount of graphite (fine particles) rather than magnetic powder is collected, molded into the required size and shape using a molding machine, and then baked at high temperature to create the substrate for the integrated circuit. (Sintering, which involves baking at high temperatures, is a processing method that does not melt and synthesize materials, but rather bonds and solidifies fine particles at a temperature that does not melt them.)

4. 4. The method according to claim 3, wherein the material used is amorphous carbon such as carbon black instead of graphite (fine particles).

5. A component or device using the method according to any one of claims 1 to 4.

6. A service or business using the part or device according to claim 5.