Stencil printer

Abstract

To provide a stencil printer and a method for controlling the stencil printer.SOLUTION: The present disclosure provides a stencil printer comprising a stencil support and a clamping assembly. The stencil support is movable relative to a stencil, and comprises a holder and an attraction portion. The holder is movably connected to the attraction portion. The attraction portion is capable of applying an attraction force to the stencil. The clamping assembly is capable of clamping or releasing the attraction portion. When the attraction portion is clamped by the clamping assembly, the holder is capable of moving a predetermined distance relative to the attraction portion in a direction away from the attraction portion. The attraction portion is capable of keeping in position relative to the stencil. The stencil printer in the present disclosure can prevent residual solder paste from dripping on the stencil because of shaking of the stencil when a processing element is away from the stencil.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] Technical Field The present disclosure relates to stencil printers, and more particularly to solder paste stencil printers for printed circuit boards. [Background technology]

[0002] background In a typical surface mount circuit board manufacturing process, a stencil printer is used to print solder paste onto a printed circuit board. A circuit board, commonly referred to as an electronic board, having a pattern of pads or some other conductive surface on which solder paste can be deposited is fed into the stencil printer. Small holes or marks, called fiducials, on the circuit board are used to align the circuit board to the stencil or screen of the stencil printer prior to printing of the solder paste onto the circuit board. The fiducials are used as reference points in aligning the circuit board to the stencil. Once the circuit board is aligned to the printer's stencil, the circuit board is raised up to the stencil and secured against it by a circuit board support. The circuit board support can be, for example, a table with pins or other object supports. The solder paste is then dispensed by moving a squeegee or scraper across the stencil to push the solder paste through multiple holes formed in the stencil and onto the circuit board. As the scraper moves across the stencil, the solder paste rolls in front of the scraper to facilitate filling within the holes in the screen or stencil, allowing the solder paste to be mixed and sheared as desired to achieve the desired adhesion. The solder paste is typically dispensed onto the stencil from a standard solder paste supply cartridge. After the printing operation is completed, the circuit board is released and lowered away from the stencil and then transported to another location in the printed circuit board manufacturing line.

[0003] The pattern on the circuit board matches the pattern formed by the mesh holes in the stencil, allowing the solder paste to be printed through the mesh holes into the desired location on the circuit board and printed correctly onto the circuit board. Summary of the Invention

[0004] overview The present disclosure provides a stencil printer comprising a stencil support and a clamp assembly, the stencil support being movable relative to the stencil, comprising a holder and an attraction portion, the holder being movably connected to the attraction portion, the attraction portion being capable of applying an attraction force to the stencil, the clamp assembly being capable of clamping or releasing the attraction portion, and when the attraction portion is clamped by the clamp assembly, the holder is capable of moving a predetermined distance relative to the attraction portion in a direction away from the attraction portion, and the attraction portion is capable of maintaining a predetermined position relative to the stencil.

[0005] In the above-mentioned stencil printer, the stencil support has a first operating position and a second operating position in which the attachment portion of the stencil support is close to the stencil, and a release position in which the stencil support is away from the stencil, and during the change of the stencil support from the first operating position to the second operating position, the attachment portion is clamped by the clamp assembly, thereby allowing the holder to move relative to the attachment portion in a direction away from the attachment portion, and during the change of the stencil support from the second operating position to the release position, the attachment portion is released by the clamp assembly and the attachment portion moves away from the stencil.

[0006] The above-mentioned stencil printer further includes an attachment portion moving assembly connected to the holder and the attachment portion, the attachment portion moving assembly being configured to be capable of being driven to move the attachment portion toward the holder.

[0007] The above-mentioned stencil printer further includes a control device and an execution device, the execution device being capable of executing or stopping the attraction operation of the attraction section, and the control device being capable of sending a control signal to the execution device to execute or stop the attraction operation of the attraction section.

[0008] In the above-mentioned stencil printer, the control device is configured to control the execution device to perform the attracting operation of the attracting section when the stencil support is in the first operating position and the second operating position, and to control the execution device to stop the attracting operation of the attracting section when the stencil support is away from the first operating position and the second operating position.

[0009] The above-mentioned stencil printer further comprises a vacuum device connected to the attraction part by the execution device, and the vacuum device can provide an attraction force to the attraction part.

[0010] In the stencil printer described above, in a first operative position of the stencil support the processing element is in contact with the stencil, and in a second operative position of the stencil support the processing element is separated from the stencil.

[0011] The above-mentioned stencil printer further comprises a table movement assembly connectable to the holder, the table movement assembly being movable to drive the stencil support to move towards or away from the stencil.

[0012] In the stencil printer described above, the clamping assembly includes a cylinder or an electric motor.

[0013] In the above-mentioned stencil printer, the attachment moving assembly comprises a cylinder or an electric motor.

[0014] In the above-mentioned stencil printer, the predetermined distance is greater than 1 mm.

[0015] In the above-mentioned stencil printer, during the change of the stencil support from the second operating position to the release position, the attractor moving assembly can drive the attractor to move towards the holder.

[0016] The present disclosure further provides a method of controlling a stencil printer comprising a stencil support and a printing device, the method comprising: a. moving the stencil support and the processing element so that the stencil support and the processing element contact the stencil; b. printing on the processing element with a printing device; c. moving the processing element away from the stencil, the stencil support maintaining contact with the stencil during movement of the processing element away from the stencil; d. moving the stencil support away from the stencil; Includes.

[0017] In the above-mentioned method of controlling a stencil printer, in steps b and c, the stencil support applies an attractive force to the stencil.

[0018] In the above-mentioned method of controlling a stencil printer, after step c is completed, the stencil support stops applying an attractive force to the stencil and step d is performed.

[0019] The solder paste printer in the present disclosure is used for printing on processing elements such as circuit boards. The stencil printer in the present disclosure includes a stencil support and a clamp assembly. The stencil support includes an attracting portion that can attract the stencil to prevent the stencil from moving or vibrating. The clamp assembly can clamp or release the attracting portion of the stencil support, so that at the moment when the processing element is printed and moves away from the stencil, the clamp assembly clamps the attracting portion to allow the attracting portion to continue to attract the stencil, thereby preventing the residual solder paste on the stencil from dripping onto the processing element due to the movement of the stencil. [Brief description of the drawings]

[0020] [Figure 1] FIG. 1 is a schematic diagram of a stencil printer according to the present disclosure. [Figure 2A] FIG. 2 is a perspective view of a transport and support device of a stencil printer according to the present disclosure. [Figure 2B] FIG. 2B is an exploded view of the transport and support device of the stencil printer in FIG. 2A. [Figure 3A] FIG. 2B is a perspective view of one of the stencil supports in FIG. 2A. [Figure 3B] FIG. 3B is an exploded view of the stencil support in FIG. 3A. [Figure 4] FIG. 2B is a schematic diagram of a transport and support device of the stencil printer in FIG. 2A. [Figure 5A] FIG. 13 is a schematic diagram of the transport and support device when the table moving assembly is in an initial state. [Figure 5B] 13 is a schematic diagram of the transport and support apparatus when the table movement assembly moves until the circuit board support contacts the circuit board. [Figure 5C] 13 is a schematic diagram of the transport and support apparatus as the table movement assembly moves until the circuit board is flush with the top of the stencil support. [Figure 5D]13 is a schematic diagram of the transport and support apparatus as the table movement assembly moves until the circuit board contacts the stencil. FIG. [Figure 5E] 1 is a schematic diagram of the transport and support apparatus when the clamping assembly clamps the attachment portion and the circuit board is in contact with the stencil. FIG. [Figure 5F] 1 is a schematic diagram of the transport and support apparatus when the clamping assembly clamps the attachment portion and the circuit board is separated from the stencil. FIG. [Figure 5G] 13 is a schematic diagram of the transport and support device after the clamping assembly has released the hook. FIG. [Figure 6] 1 is a flow chart of one embodiment of a method for controlling a stencil printer according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0021] Detailed Description Various specific embodiments of the present disclosure are described below with reference to the accompanying drawings, which form a part of this specification. In this disclosure, orientation terms such as "front", "rear", "upper", "lower", "left", "right", "top" and "bottom" are used to describe the orientation of exemplary structures and elements in various examples of the present disclosure, but it should be understood that these terms used in this specification are merely for ease of description and are determined based on the exemplary orientation as shown in the accompanying drawings. Since the embodiments disclosed in this disclosure can be arranged in different orientations, these orientation terms are merely exemplary and should not be considered as limiting. Wherever possible, the same or similar reference numbers used in this disclosure refer to the same components.

[0022] FIG. 1 is a schematic diagram of a stencil printer according to the present disclosure. As shown in FIG. 1, the stencil printer includes a frame 101, a printing device 102, and a stencil 103. The stencil 103 is provided with mesh holes. The stencil 103 is connected to the frame 101. A transport and support device 200 (hidden by the stencil 103 in FIG. 1) is disposed below the stencil 103. The transport and support device 200 can transport and fix a processing element (e.g., a circuit board) to a corresponding position below the stencil 103. The printing device 102 is disposed above the stencil. The printing device 102 can apply and coat solder paste on the stencil 103, and the solder paste is printed on the surface of the processing element through the mesh holes of the stencil 103.

[0023] FIG. 2A is a perspective view of a transport and support device of a stencil printer in the present disclosure, and FIG. 2B is an exploded view of the transport and support device of the stencil printer in FIG. 2A. As shown in FIG. 2A and FIG. 2B, the transport and support device has a height direction H, a length direction L, and a width direction W. The transport and support device includes a pair of rail assemblies 212 and 213, a pair of stencil supports 202 and 203, a circuit board support 201, and a table movement assembly 208. FIG. 2A and FIG. 2B further show a schematic diagram of a circuit board 210. The pair of rail assemblies 212 and 213 and the pair of stencil supports 202 and 203 extend in the length direction of the transport and support device. The rail assemblies 212 and 213 can transport the circuit board 210 in the length direction L. The pair of rail assemblies 212 and 213 are arranged in the width direction W of the transport and support device, and there is a gap between them. The circuit board support 201 is disposed between a pair of rail assemblies 212 and 213 and is used to support the circuit board 210. The pair of stencil supports 202 and 203 are disposed outside the pair of rail assemblies 212 and 213, respectively, and are used to support the stencil 103. The table movement assembly 208 is disposed below the rail assemblies 212 and 213 and the circuit board support 201. The table movement assembly includes a platform portion 231 and a power portion 232. The power portion 232 can be driven to move the platform portion 231 toward the stencil 103 or away from the stencil 103. The stencil supports 202 and 203 and the circuit board support 201 can be connected to the platform portion 231 so that the stencil supports 202 and 203 and the circuit board support 201 can move together with the platform portion 231.

[0024] In the present disclosure, rail assemblies 212 and 213 are similar in structure, and stencil supports 202 and 203 are similar in structure. The structure of the stencil supports is described below taking stencil support 202 as an example.

[0025] 3A is a perspective view of one of the stencil supports in FIG. 2A, and FIG. 3B is an exploded view of the stencil support in FIG. 3A. FIG. 3A and FIG. 3B illustrate the structure of the stencil support 202 in FIG. 2A. As shown in FIG. 3A and FIG. 3B, the stencil support 202 includes a holder 305, an attachment part 306, an attachment part moving assembly 314, and a clamp assembly 330. The attachment part 306 is slidably connected to the holder 305 so that the attachment part 306 can move relative to the holder 305 in the height direction H of the transport and support device of the stencil printer. The clamp assembly 330 includes a first part 317 and a second part 318. The first part 317 and the second part 318 are respectively disposed below the two ends of the attachment part 306 in the length direction, and can support and release the attachment part 306. The attachment portion moving assembly 314 is attached to the holder 305 and connected to the attachment portion 306 such that the attachment portion moving assembly 314 can apply a pulling force to the attachment portion 306 .

[0026] The attracting portion 306 has a cavity 362, which is connected to a vacuum device 450. A plurality of holes 361 are formed on the top surface of the attracting portion 306, which are connected to the cavity 362. The vacuum device 450 can reduce the internal pressure of the cavity 362 so that the top surface of the attracting portion 306 has an attractive force and can attract the stencil.

[0027] In one embodiment of the present disclosure, the hook moving assembly 314 and the first and second portions 317, 318 of the clamp assembly 330 are each a cylinder. In another embodiment of the present disclosure, one or more of the hook moving assembly 314 and the first and second portions 317, 318 of the clamp assembly 330 are electric motors.

[0028] FIG. 4 is a schematic diagram of the transport and support device of the stencil printer in FIG. 2A. FIG. 4 is a schematic diagram of the transport and support device of the stencil printer in FIG. 2A when viewed in the length direction. As shown in FIG. 2A and FIG. 4, there is a gap between the rail assemblies 212 and 213 that corresponds to the width of the processing element to be transported, and the two ends of the processing element can be supported and transported by the rail assemblies 212 and 213. The circuit board support 201 is disposed between the rail assemblies 212 and 213 in the width direction of the transport and support device. The bottom 411 of the circuit board support 201 is connected to the table moving assembly 208, and the top 412 of the circuit board support 201 is configured to support a circuit board. The top 412 of the circuit board support 201 is provided with a cavity 426, and a plurality of holes 425 are formed on the surface of the top 412, and the plurality of holes 425 are connected to the cavity 426. The cavity 426 is connected to a vacuum device 450 by a second execution device 403. The vacuum device 450 can reduce the air pressure in the cavity 426 so that the surface of the top 412 of the circuit board support 201 has an attractive force and can attract the circuit board. That is, the top 412 of the circuit board support 201 is provided with a circuit board attracting portion.

[0029] The stencil support 202 is disposed outside the rail assembly 212 and slidably connected to the rail assembly 212, and a limiting device (not shown) is provided between the stencil support 202 and the rail assembly 212 to limit the downward movement distance of the stencil support 202 relative to the rail assembly 212 in the height direction H of the transport and support device, i.e., the stencil support 202 can slide relative to the rail assembly 212 within a certain range in the height direction H of the transport and support device. The stencil support 202 has a holder 305 and an attraction portion 306. A magnetic part that can be attracted to or separated from the top surface of the table movement assembly 208 is provided at the bottom of the holder 305.

[0030] Similarly, the stencil support 203 is disposed outside the rail assembly 213 and slidably connected to the rail assembly 213, and a limiting device (not shown) is provided between the stencil support 203 and the rail assembly 213 to limit the downward movement distance of the stencil support 203 relative to the rail assembly 213 in the height direction H of the transport and support device, i.e., the stencil support 203 can slide relative to the rail assembly 213 within a certain range in the height direction H of the transport and support device. The stencil support 203 has a holder 405 and an attraction portion 406. A magnetic part that can be attracted to or separated from the top surface of the table moving assembly 208 is provided at the bottom of the holder 405.

[0031] The attracting unit 306 and the attracting unit 406 are connected to the vacuum device 450 by the first performing device 402. The first performing device 402 is connected to the control device 401 and can receive a signal from the control device 401 to turn the first performing device on or off. When the first performing device 402 is turned on, the attracting unit 306 and the attracting unit 406 can perform an attracting operation to generate an attractive force that attracts the stencil, and when the first performing device 402 is turned off, the attracting unit 306 and the attracting unit 406 stop the attracting operation so that the attracting unit 306 and the attracting unit 406 no longer generate an attractive force.

[0032] The clamp assemblies 330 and 430 are provided below the attachment portions 306 and 406, respectively, and the clamp assemblies 330 and 430 are connected to the control device 401 and can receive signals from the control device 401 to clamp or release the attachment portions 306 and 406, respectively.

[0033] The attachment part moving assemblies 314 and 414 are connected to the control device 401 and can receive signals from the control device 401 to pull the attachment parts 306 and 406, respectively. The attachment part moving assemblies 314 and 414 are configured to overcome friction between the attachment parts 306 and 406 and the holders 305 and 405, thereby allowing the attachment parts 306 and 406 to return to positions closest to the holders 305 and 405.

[0034] In one embodiment of the present disclosure, the first enforcement unit 402 and the second enforcement unit 403 are solenoid valves.

[0035] 5A is a schematic diagram of the conveying and supporting device when the table moving assembly is in the initial state, FIG. 5B is a schematic diagram of the conveying and supporting device when the table moving assembly moves until the circuit board support contacts the circuit board, FIG. 5C is a schematic diagram of the conveying and supporting device when the table moving assembly moves until the circuit board is flush with the top of the stencil support, FIG. 5D is a schematic diagram of the conveying and supporting device when the table moving assembly moves until the circuit board contacts the stencil, FIG. 5E is a schematic diagram of the conveying and supporting device when the clamp assembly clamps the attachment part and the circuit board contacts the stencil, FIG. 5F is a schematic diagram of the conveying and supporting device when the clamp assembly clamps the attachment part and the circuit board is away from the stencil, and FIG. 5G is a schematic diagram of the conveying and supporting device after the clamp assembly releases the attachment part. FIG. 5A-FIG. 5G illustrate the operation process of the conveying and supporting device.

[0036] As shown in FIG. 5A, the circuit board 210 is carried by the rail assemblies 212 and 213 until it reaches a specific position below the stencil 103. Here, the circuit board 210 is supported by the rail assemblies 212 and 213, there is a gap between the circuit board 210 and the stencil 103, and the circuit board 210 is aligned with a specific area of ​​the stencil 103. The table moving assembly 208 is at the furthest position relative to the stencil 103, i.e., the lowest position in the height direction of the carrying and supporting device. The circuit board support 201 is connected to the table moving assembly 208, and the circuit board support 201 is also at the furthest position relative to the stencil 103, the circuit board support 201 is located below the circuit board 210, and there is a gap between the circuit board support 201 and the circuit board 210. The stencil supports 202 and 203 are at the furthest positions relative to the stencil 103. The stencil supports 202 and 203 are supported by rail assemblies 212 and 213 and are separated from the table moving assembly 208, and there is a gap between the stencil supports 202 and 203 and the table moving assembly 208. The clamp assemblies 330 and 430 are in a released state, and there is a gap between the clamp assemblies 330 and 430 and the attachment portions of the stencil supports 202 and 203. In one embodiment of the present disclosure, in the initial state, the stencil supports 202 and 203 have a distance of 35 mm to 50 mm from the stencil 103.

[0037] As shown in FIG. 5B, when the printing operation on the circuit board starts, the table moving assembly 208 moves upward in the height direction H (i.e., in the direction toward the stencil 103), so that the circuit board support 201 moves toward the stencil 103 together with the table moving assembly 208. The circuit board support 201 gradually approaches the circuit board 210 and can contact the circuit board 210. FIG. 5B illustrates the position where the circuit board support 201 contacts the circuit board 210. During the movement from FIG. 5A to FIG. 5B, the table moving assembly 208 and the circuit board support 201 move together, the stencil supports 202 and 203 are maintained in a predetermined position, and the gap between the stencil supports 202 and 203 and the table moving assembly 208 gradually decreases. The clamp assemblies 330 and 430 maintain a released state.

[0038] As shown in Fig. 5C, the table movement assembly 208 drives the circuit board support 201 to continue moving toward the stencil 103, and the circuit board support 201 drives the circuit board 210 to move away from the rail assemblies 212 and 213 toward the stencil 103. When the circuit board 210 is flush with the tops of the stencil supports 202 and 203, the bottoms of the stencil supports 202 and 203 come into contact with the table movement assembly 208. The bottoms of the stencil supports 202 and 203 are provided with magnetic elements that can attract the surface of the table movement assembly 208 so that the table movement assembly 208 is connected to the stencil supports 202 and 203. The clamp assemblies 330 and 430 remain in a released state.

[0039] 5D, the table moving assembly 208 continues to move toward the stencil 103, and then the table moving assembly 208 drives the circuit board support 201 and the stencil supports 202 and 203 together to continue to move toward the stencil 103 until the circuit board 210 and the tops of the stencil supports 202 and 203 contact the stencil 103 and the stencil supports 202 and 203 reach the first operating position. When the stencil supports 202 and 203 move to the first operating position, the control device 401 controls the first executing device 402 and the second executing device 403 to be on, so that the circuit board support 201 performs the attracting action to generate an attractive force to attract the circuit board 210, and the stencil supports 202 and 203 perform the attracting action to generate an attractive force to attract the stencil 103. 5D, the printing device 102 performs a printing operation in the position where the first execution device 402 and the second execution device 403 are kept on. Because the circuit board 210 and the stencil 103 are both subjected to the action of an attractive force, the circuit board 210 and the stencil 103 can be kept relatively stable during printing and are not likely to vibrate or shift, which helps to ensure the printing quality.

[0040] As shown in FIG. 5E, during or after printing by the printing device 102, the clamp assemblies 330 and 430 clamp and lock the attachment portions 306 and 406 of the stencil supports 202 and 203, such that the attachment portions 306 and 406 are maintained in a first operating position in contact with the stencil 103 and cannot move in the height direction H.

[0041] As shown in FIG. 5F, after the printing device 102 finishes printing, the control device 401 controls the table moving assembly 208 to move downward, i.e., away from the stencil 103. The circuit board support 201 moves downward together with the table moving assembly 208, so that the circuit board 210 moves away from the stencil 103. The holders 305 and 405 of the stencil supports 202 and 203 can attract the table moving assembly 208 under magnetic action, so that the holders 305 and 405 move downward together with the table moving assembly 208. The attracting parts 306 and 406 of the stencil supports 202 and 203 are clamped by the clamping assemblies 330 and 430, so that they cannot move downward together with the table moving assembly 208, so that the attracting parts 306 and 406 slide relative to the holders 305 and 405, and the stencil supports 202 and 203 reach the second operating position.

[0042] During the movement of the stencil supports 202 and 203 from the first working position to the second working position, the circuit board support 201 moves downward together with the table moving assembly 208, the second execution device 403 is kept on, and the circuit board 210 is attracted by the circuit board support 201 and moves away from the stencil 103 together with the circuit board support 201. During the process of the circuit board 210 moving away from the stencil 103, a certain adhesion occurs between the circuit board 210 and the stencil 103, and the movement of the circuit board 210 will drive the stencil 103 to have a tendency to move downward. In practice, it is expected that the stencil 103 will be kept stable when the circuit board 210 moves away from the stencil 103, in order to prevent the residual solder paste on the stencil 103 from dripping onto the printed circuit board 210. In the present disclosure, during movement of the stencil supports 202 and 203 from the first operating position to the second operating position, the first execution device 402 is kept on, and the attachment units 306 and 406 continue to perform the attachment operation on the stencil 103 so that the stencil 103 can be kept stable and less likely to vibrate or shift, thereby preventing residual solder paste on the stencil 103 from affecting the printed circuit board 210.

[0043] In one embodiment of the present disclosure, during movement of stencil supports 202 and 203 from the first operating position to the second operating position, holders 305 and 405 move a predetermined distance of 1 mm to 3 mm relative to attachment portions 306 and 406, i.e., circuit board 210 moves 1 mm to 3 mm. The predetermined distance is sensed by a position sensor or electric motor of table movement assembly 208.

[0044] 5G, after the circuit board 210 is released from the stencil 103, the control device 401 sends a control signal to the clamp assemblies 330 and 430 to enable the clamp assemblies 330 and 430 to release the attracting portions 306 and 406. The control device 401 sends a control signal to the moving assemblies 314 and 414, which then pull the attracting portions 306 and 406 to move toward the holders 305 and 405 to enable the attracting portions 306 and 406 to leave the stencil 103, so that the stencil supports 202 and 203 reach the release position.

[0045] As shown in Fig. 5G, after the stencil supports 202 and 203 reach the release position, the table movement assembly 208 drives the stencil supports 202 and 203 and the circuit board support 201 to continue moving downward until the position shown in Fig. 5C is reached, but the stencil supports 202 and 203 are restricted by the rail assemblies 212 and 213 and cannot continue moving downward. The table movement assembly 208 continues to move downward so as to be separated from the stencil supports 202 and 203, overcoming the magnetic force between the table movement assembly 208 and the stencil supports 202 and 203. The table movement assembly 208 continues to drive the circuit board support 201 to continue moving downward until the position shown in Fig. 5B is reached, and the circuit board 210 contacts the rail assemblies 212 and 213. Then, the table moving assembly 208 continues to move downward, the circuit board support 201 moves away from the circuit board 210, the circuit board 210 is supported by the rail assemblies 212 and 213, there is a gap from the circuit board support 201, and the conveying and supporting device returns to the initial state when the table moving assembly reaches the position shown in Fig. 5A. Now, the printed circuit board 210 will be conveyed to the next position by the rail assemblies 212 and 213, and another circuit board that has not been processed will reach a position below the stencil 103 and be ready for printing.

[0046] In the existing design, the circuit board 210 and the stencil supports 202 and 203 are separated from the stencil 103 at the same time, and at the moment when the circuit board 210 is separated from the stencil 103, the stencil 103 may move or vibrate slightly, and the residual solder paste on the stencil 103 may drip onto the circuit board 210, affecting the processing accuracy of the circuit board 210. In the present disclosure, the attracting parts 306 and 406 of the stencil supports 202 and 203 can be clamped by the clamping assemblies 330 and 430, and thus can move relative to the holders 305 and 405. During the process of the circuit board 210 being separated from the stencil 103, the attracting parts 306 and 406 can maintain contact with the stencil 103 and keep applying the attracting force, which can prevent the stencil from moving or vibrating when the circuit board 210 is separated from the stencil 103. That is, in the present disclosure, the attraction portions 306 and 406 of the stencil supports 202 and 203 separate from the stencil 103 at a time different from the time at which the circuit board 210 separates from the stencil 103, so that the attraction portions 306 and 406 do not separate from the stencil 103 at the moment the circuit board 210 separates from the stencil 103, and the attraction portions 306 and 406 can continue to attract the stencil 103 for a certain period of time, thereby maintaining the stencil 103 relatively stable.

[0047] 6 is a flow chart of one embodiment of a method for controlling a stencil printer according to the present disclosure. As shown in FIG. 6, the method for controlling a stencil printer begins in step 601. Before the method begins, processing elements such as circuit board 210 and stencil supports 202 and 203 are at their furthest positions relative to stencil 103.

[0048] In step 602, the table movement assembly 208 drives the stencil supports 202 and 203 and the processing elements to move toward the stencil 103 until both the stencil supports 202 and 203 and the processing elements contact one side of the stencil 103, and the printing device 102 is located on the other side of the stencil 103.

[0049] In step 603, the control device 401 controls the first execution device 402 to be on so that the stencil supports 202 and 203 can apply an attractive force to the stencil 103. Furthermore, when step 603 is performed, the control device 401 controls the second execution device 403 to be on so that the circuit board support 201 applies an attractive force to the processing element.

[0050] In step 604, stencil supports 202 and 203 attract stencil 103 and keep it relatively stable. Circuit board support 201 attracts processing elements and keeps them relatively stable. The processing elements are printed by printing device 102.

[0051] In step 605, the table movement assembly 208 drives to move the circuit board support 201 so that the processing elements move away from the stencil 103. The attracting portions 306 and 406 of the stencil supports 202 and 203 are clamped by the clamping assemblies 330 and 340 so that the attracting portions 306 and 406 maintain contact with the stencil 103. In step 605, the first execution device 402 is kept on and the attracting portions 306 and 406 of the stencil supports 202 and 203 continuously attract the stencil.

[0052] In step 606 , the control device 401 controls the first execution device 402 to turn off so that the stencil supports 202 and 203 stop applying an attractive force to the stencil 103 .

[0053] In step 607, the stencil supports 202 and 203 move away from the stencil 103. The circuit board support 201 and the stencil supports 202 and 203 move to their initial positions.

[0054] Thereafter, the process proceeds from step 607 to step 608, where the printing operation is completed.

[0055] In the method shown in FIG. 6, after printing is completed, at the moment the processing element moves away from the stencil 103, the stencil supports 202 and 203 maintain contact with the stencil and attract the stencil 103 to keep it stable.

[0056] While the present disclosure has been described in connection with the exemplary embodiments outlined above, various alternatives, modifications, variations, improvements, and / or substantially equivalents currently known or anticipated, or soon to be anticipated, may be apparent to at least one of ordinary skill in the art. Moreover, the technical effects and / or technical problems described herein are illustrative rather than limiting, and thus the disclosure herein may be used to solve other technical problems and have other technical effects. Thus, the exemplary embodiments of the present disclosure described above are intended to be illustrative rather than limiting. Various changes may be made without departing from the spirit and scope of the present disclosure. Thus, the present disclosure is intended to embrace all known or previously disclosed alternatives, modifications, variations, improvements, and / or substantially equivalents.

Claims

1. A stencil printer, a stencil support (202, 203) movable relative to the stencil and comprising a holder (305, 405) and an attraction part (306, 406), the holder (305, 405) being movably connected to the attraction part (306, 406), the attraction part (306, 406) being capable of applying an attraction force to the stencil; a clamping assembly (330, 430) capable of clamping or releasing the attachment portion (306, 406), wherein when the attachment portion (306, 406) is clamped by the clamping assembly (330, 430), the holder (305, 406) is capable of moving a predetermined distance relative to the attachment portion (306, 406) in a direction away from the attachment portion (306, 406), and the attachment portion (306, 406) is capable of being maintained at a predetermined position relative to the stencil; A stencil printer.

2. the stencil support (202, 203) has a first operating position and a second operating position in which the attachment portion (306, 406) of the stencil support (202, 203) is close to the stencil, and a release position in which the stencil support is away from the stencil; during the change of the stencil support (202, 203) from the first operating position to the second operating position, the attachment portion (306, 406) is clamped by the clamping assembly (330, 430), thereby allowing the holder (305, 405) to move relative to the attachment portion (306, 406) in a direction away from the attachment portion (306, 406); During the change of the stencil support (202, 203) from the second operating position to the release position, the attraction portion (306, 406) is released by the clamp assembly (330, 430) and the attraction portion (306, 406) moves away from the stencil.

2. The stencil printer according to claim 1.

3. The stencil printer of claim 2, further comprising an attachment portion moving assembly (314, 414) connected to the holder (305, 405) and the attachment portion (306, 406), the attachment portion moving assembly (314, 414) being configured to be capable of being driven to move the attachment portion (306, 406) toward the holder (305, 405).

4. The stencil printer according to claim 2, further comprising a control device (401) and an execution device (402), the execution device (402) being capable of executing or stopping the attraction operation of the attraction unit (306, 406), and the control device (401) being capable of sending a control signal to the execution device (402) to execute or stop the attraction operation of the attraction unit (306, 406).

5. The stencil printer of claim 4, wherein the control device (401) is configured such that when the stencil support (202, 203) is in the first operating position and the second operating position, the control device (401) controls the execution device (402) to execute the attracting operation of the attracting unit (306, 406), and when the stencil support is away from the first operating position and the second operating position, the control device (401) controls the execution device (402) to stop the attracting operation of the attracting unit.

6. 6. The stencil printer of claim 5, further comprising a vacuum device (450) connected to the attraction portion (306, 406) by the execution device (402), the vacuum device (450) being capable of enabling an attraction capability of the attraction portion (306, 406).

7. 3. The stencil printer of claim 2, wherein in the first operating position of the stencil support (202, 203), a processing element is in contact with the stencil, and in the second operating position of the stencil support (202, 203), the processing element is separated from the stencil.

8. 2. The stencil printer of claim 1, further comprising a table movement assembly (208) connectable to the holder (305, 405), the table movement assembly (208) movable to drive the stencil support (202, 203) to move closer to or away from the stencil.

9. The stencil printer of claim 1 , wherein the clamping assembly (330) comprises a cylinder or an electric motor.

10. The stencil printer of claim 3 , wherein the attachment moving assembly comprises a cylinder or an electric motor.

11. The stencil printer of claim 1 , wherein the predetermined distance is greater than 1 mm.

12. 4. The stencil printer of claim 3, wherein the attachment portion moving assembly (314) is capable of driving the attachment portion (306) to move toward the holder (305) during the change of the stencil support (202, 203) from the second operating position to the release position.

13. 1. A method for controlling a stencil printer comprising a stencil support and a printing device, the method comprising: a. moving the stencil support and processing elements to bring the stencil support and processing elements into contact with a stencil; b. printing to said processing element by said printing device; c. moving the processing element away from the stencil, the stencil support maintaining contact with the stencil during movement of the processing element away from the stencil; d. moving the stencil support away from the stencil; A method comprising:

14. The method of controlling a stencil printer according to claim 13 , wherein in steps b and c, the stencil support applies an attractive force to the stencil.

15. 15. The method of controlling a stencil printer of claim 14, wherein after step c is completed, the stencil support stops applying the attractive force to the stencil and step d is performed.

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