Mounting device and mounting method

Abstract

To provide a mounting device which can suppress the generation of a mounting failure and is in a compact, and provide a mounting method of them.SOLUTION: A mounting device 1 comprises: a first metal molding 1010 that is constructed by holding substrates SB1 and SB2 onto which electron components CH11, CH12, CH21, and CH22 are mounted; a second metal molding 20 arranged oppositely to the first metal molding 10; and a gas supply mechanism that supplies an inactive gas. The second metal molding 20 includes movable mechanisms 22A, 22B, 22C, and 22D, and elastic elements 23A, 23B, 23C, and 23D. In a state where the first metal molding 10 and the second metal molding 20 are closed in a molding, the electron components CH11, CH12, CH21, and CH22 are pressed in accordance with an elastic force of elastic elements 23A, 23B, 23C, and 23D by the movable mechanisms 22A, 22B, 22C, and 22D.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a mounting apparatus and a mounting method. [Background technology]

[0002] When mounting electronic components on a substrate via a bonding material, a mounting device is known that simultaneously presses a plurality of electronic components against at least one substrate. In such a mounting device, each of the plurality of electronic components may be individually pressed to prevent mounting failures caused by insufficient or excessive pressure on the electronic components due to differences in dimensions of the plurality of electronic components.

[0003] For example, Patent Document 1 discloses a semiconductor mounting device that includes a plurality of pressure blocks for individually pressurizing a plurality of semiconductor elements, a plurality of shafts for linearly moving the plurality of pressure blocks, a plurality of pressurizing blocks for pressurizing the plurality of blocks via the plurality of shafts, and an elastic body for collectively pressurizing the plurality of pressurizing blocks, in which air pressure or compressed gas pressure is supplied to a pressurizing valve to expand the elastic body toward the plurality of pressurizing blocks, thereby pressurizing the plurality of pressurizing blocks. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2002-110744 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the semiconductor mounting device described in Patent Document 1 needs to include a compressor or a high-pressure tank for supplying air pressure or compressed gas pressure, and piping for passing the air or compressed gas, etc. Therefore, the device may become large in size.

[0006] The present invention has been made in view of the above circumstances, and has an object to provide a compact mounting device capable of suppressing the occurrence of mounting defects, and a mounting method using the same. [Means for solving the problem]

[0007] A mounting apparatus according to one embodiment of the present invention is a mounting apparatus for mounting one or more electronic components on at least one substrate, and includes a first mold configured to hold the substrate on which the electronic components are placed, a second mold arranged opposite the first mold, and a gas supply mechanism for supplying an inert gas to a space between the first mold and the second mold, the second mold having a movable mechanism and an elastic element, and when the first mold and the second mold are closed, the electronic component is pressurized by the movable mechanism in accordance with the elastic force of the elastic element.

[0008] A mounting method according to another embodiment of the present invention is a mounting method using a mounting apparatus for mounting one or more electronic components on at least one substrate, and includes preparing a first mold configured to hold the substrate on which the electronic components are placed, and preparing a second mold arranged opposite the first mold, the second mold having a movable mechanism and an elastic element, and the mounting method further includes supplying an inert gas to a space between the first mold and the second mold, closing the first mold and the second mold, and, with the first mold and the second mold closed, pressurizing the electronic component by the movable mechanism in accordance with the elastic force of the elastic element. Effect of the Invention

[0009] According to the present invention, it is possible to provide a compact mounting device capable of suppressing the occurrence of mounting defects, and a mounting method using the same. [Brief description of the drawings]

[0010] [Figure 1] 1 is a diagram showing an overall outline of a mounting apparatus according to an embodiment of the present invention; [Diagram 2] 1 is a flowchart illustrating a part of an implementation method according to an embodiment of the present invention. [Diagram 3] 1 is a flowchart illustrating a part of an implementation method according to an embodiment of the present invention. [Figure 4] 4 is a graph showing a temperature profile of a mounting method according to an embodiment of the present invention. [Diagram 5] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 6] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 7] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 8] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. [Figure 9] FIG. 1 is a diagram showing a mounting apparatus in one step of a mounting method. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The following describes the embodiments of the present invention. In the following description of the drawings, the same or similar components are denoted by the same or similar reference numerals. The drawings are illustrative, and the dimensions, shapes and numbers of each part are schematic, and the technical scope of the present invention should not be interpreted as being limited to the embodiments.

[0012] <Mounting equipment> First, the configuration of a mounting apparatus 1 according to an embodiment of the present invention will be described with reference to Fig. 1. Fig. 1 is a diagram showing an overall outline of a mounting apparatus according to an embodiment of the present invention.

[0013] The mounting device 1 performs mounting processing on the workpieces W1 and W2. The workpiece W1 includes electronic components CH11 and CH12, bonding materials SN11 and SN12, and a substrate SB1. The workpiece W2 includes electronic components CH21 and CH22, bonding materials SN21 and SN22, and a substrate SB2. That is, the mounting device 1 mounts the electronic component CH11 on the substrate SB1 via the bonding material SN11, mounts the electronic component CH12 on the substrate SB1 via the bonding material SN12, mounts the electronic component CH21 on the substrate SB2 via the bonding material SN21, and mounts the electronic component CH22 on the substrate SB2 via the bonding material SN22. Inside the mounting device 1, the workpiece W1 is installed so that the substrate SB1 faces the lower mold 10 and the electronic components CH11 and CH12 face the upper mold 20, and the workpiece W2 is installed so that the substrate SB2 faces the lower mold 10 and the electronic components CH21 and CH22 face the upper mold 20. Before the mounting process is performed by the mounting apparatus 1, the electronic components CH11 and CH12 are placed on the board SB1, and the electronic components CH21 and CH22 are placed on the board SB2. After the mounting process is performed by the mounting apparatus 1, the electronic components CH11 and CH12 are bonded to the board SB1, and the electronic components CH21 and CH22 are bonded to the board SB2. In the following description, the sides on which the electronic components CH11, CH12, CH21, and CH22 are provided are referred to as the front surfaces of the boards SB1 and SB2, and the opposite sides are referred to as the back surfaces of the boards SB1 and SB2.

[0014] The electronic components CH11, CH12, CH21, and CH22 are, for example, semiconductor chips. The substrates SB1 and SB2 are, but are not limited to, DBA (Direct Bonded Aluminum) substrates (high heat dissipation ceramic insulating substrate with aluminum circuit) or DBC (Direct Bonded Copper) substrates (high heat dissipation ceramic insulating substrate with copper circuit). The bonding materials SN11, SN12, SN21, and SN22 are, for example, sintering materials containing silver (Ag) nanoparticles. The mounting device 1 is a sintering device that heats and pressurizes the bonding materials SN11, SN12, SN21, and SN22 to sinter them. The heights of the substrates SB1 and SB2 are, for example, different from each other, but may be the same height. The heights of the electronic components CH11 and CH12 are, for example, different from each other, but may be the same height. The heights of the electronic components CH21 and CH22 are, for example, different from each other, but may be the same height. The bonding materials SN11, SN12, SN21, and SN22 may have the same thickness. Furthermore, the number of electronic components on one substrate is at least one and is not limited to two.

[0015] The mounting device according to an embodiment of the present invention is not limited to a sintering device as long as it applies pressure to electronic components, and may be any other suitable device such as a flip chip bonder. The electronic components according to an embodiment of the present invention are not limited to semiconductor chips, and may be passive elements such as resistors, inductors, capacitors, and quartz oscillators, or active elements such as diodes, transistors, thyristors, and operational amplifiers.

[0016] The substrate according to an embodiment of the present invention is not limited to a ceramic substrate, and may be, for example, a semiconductor substrate such as a silicon substrate, a metal substrate such as a lead frame, or an insulating substrate such as a PCB (Printed Circuit Board) substrate. Two electronic components are mounted on the substrate, and the electronic components may be arranged in a matrix with multiple rows and multiple columns. The substrate may be an electronic component, and in this case, the mounting device according to an embodiment of the present invention is a device for bonding electronic components together. The bonding material according to an embodiment of the present invention is not limited to a sintering material, and may be a semi-sintering material, a metal solder, an organic adhesive, or an inorganic adhesive. The form of the bonding material is, for example, a powder aggregate, but may also be liquid, semi-solid, solid, or film-like.

[0017] The number of substrates according to an embodiment of the present invention is not limited to 2, but may be at least 1. Similarly, the number of electronic components is not limited to 4, but may be at least 1 on one substrate.

[0018] 1, the mounting apparatus 1 includes a press device 3 and a die 2 attached to the press device 3. In the illustrated example, the mounting apparatus 1 further includes degassing chambers 31 and 32. The press device 3 includes a pair of upper and lower platens 4 and 5 connected by a tie bar.

[0019] The mold 2 includes an upper mold base 21E fixed to the upper platen 5, and a lower mold base 11F fixed to the lower platen 4. The main plates constituting the mold 2 (support plates 21D, 21C, upper mold chase 21B, lower mold chase 11B, ejector pin plate 11C, retainer plate 11D, etc.) are fixed between the upper mold base 21E and the lower mold base 11F.

[0020] In the following description, the various plates and their parts fixed to lower die base 11F are collectively referred to as lower die 10, and the various plates and their parts fixed to upper die base 21E are collectively referred to as upper die 20. Lower die 10 is an example of a "first die," and upper die 20 is an example of a "second die."

[0021] The lower die 10 mainly includes a lower die base 11F, a support pillar 11E, a retainer plate 11D, an ejector pin plate 11C, a lower die chase 11B, etc. It is fixed above the lower die base 11F via a plurality of support pillars 11E that protrude from the lower die base 11F in a columnar shape.

[0022] An ejector pin plate 11C and a retainer plate 11D are disposed below the lower die chase 11B. The ejector pin plate 11C and the retainer plate 11D have holes through which the support pillars 11E pass. The ejector pin plate 11C and the retainer plate 11D are fixed to each other and configured to be slidable up and down between the lower die chase 11B and the lower die base 11F.

[0023] Various parts including the cavity plate 11A are fixed to the lower die chase 11B. In the illustrated example, the cavity plate 11A, a side block 18 for fixing the cavity plate 11A, a heat insulating member 15 arranged to surround the lower surface and side surfaces of the cavity plate 11A, a spring 17B, and a spring sleeve 17A are fixed to the lower die chase 11B.

[0024] A plurality of lifter pins 12A, 12B that can be protruded and retracted from the cavity plate 11A, and a set pin 16 that abuts against the upper die 20 when the die is clamped are fixed to the ejector pin plate 11C and the retainer plate 11D.

[0025] The cavity plate 11A is provided at a position closest to the upper die 20, and contacts the space between the lower die 10 and the upper die 20 when the die is opened. A heater 14 is provided inside the cavity plate 11A. When the lower die 10 and the upper die 20 are closed, the heater 14 heats the substrates SB1 and SB2 via the cavity plate 11A. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0026] The heat insulating member 15 is provided between the cavity plate 11A and the lower die chase 11B, and between the cavity plate 11A and the side block 18. The heat insulating member 15 suppresses direct heat conduction from the cavity plate 11A to the lower die chase 11B, and suppresses heat conduction from the cavity plate 11A to the lower die chase 11B via the side block 18.

[0027] In other words, the heat insulating member 15 is disposed so as to separate the gas piping provided in the lower die chase 11B from the heater 14, and suppresses the rise in temperature of the nitrogen gas supplied from the gas supply port 13. The heat insulating member 15 is also disposed so as to separate the spring 17B from the heater 14, and suppresses the decrease in the elastic force of the spring 17B. In other words, the heat insulating member 15 speeds up the temperature rise caused by the heater 14 by limiting the heating target to the cavity plate 11A, and also makes it difficult for other members to be affected by the heat.

[0028] The side block 18 is provided on the side of the lower die chase 11B facing the upper die 20. When viewed from above from the upper die 20, the side block 18 is provided on the outer side of the cavity plate 11A. The side block 18 comes into contact with the upper die 20 when the lower die 10 and the upper die 20 are closed.

[0029] The gas supply port 13 supplies gas such as nitrogen (N2) gas toward the electronic components CH11, CH12, CH21, and CH22 and the boards SB1 and SB2. In the illustrated example, the gas supply port 13 is provided on the heat insulating member 15 side of the cavity plate 11A, which is outside the heater 14. The gas supply port 13 is provided on the surface of the cavity plate 11A facing the upper die 20, and opens toward the upper die 20. Therefore, the gas supply port 13 quickly removes oxidizing gas from around the workpieces W1 and W2 during heating, and places the workpieces W1 and W2 under a nitrogen atmosphere.

[0030] The gas supply ports 13 apply nitrogen gas to the workpieces W1 and W2 during cooling, thereby gas-cooling the workpieces W1 and W2. When viewed from above from the upper die 20, a plurality of gas supply ports 13 are provided on the outside of the workpieces W1 and W2. Gas piping through which the nitrogen gas supplied by the gas supply ports 13 passes is provided in the lower die chase 11B. The gas supply ports 13 are an example of a "gas supply mechanism" that supplies an inert gas to the space between the lower die 10 and the upper die 20.

[0031] The inert gas supplied by the gas supply port is not limited to nitrogen gas, and may be, for example, carbon dioxide, fluorocarbon, or a rare gas. The gas supply port may be opened toward the electronic component, the bonding material, or the substrate, and the inert gas may be directly sprayed onto the electronic component, the bonding material, or the substrate. The gas supply port may be provided in the upper mold, or may be provided in both the lower mold and the upper mold. The gas supply port may be provided in at least one of the side blocks 18, 28 of the lower mold and the upper mold, or may be provided in a degassing chamber described later. The inert gas and degassing are not necessarily required.

[0032] The spring 17B biases the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B (upward movement). The base end (upper end) of the spring sleeve 17A is a stepped bolt (or a washer, sleeve and bolt) and is fixed to the lower surface of the lower die chase 11B. The tip end (lower end) of the spring sleeve 17A is provided with a flange (in the shape of an enlarged nail head).

[0033] The retainer plate 11D has a through hole larger than the tip of the spring sleeve 17A. The ejector pin plate 11C has a counterbore larger than the tip of the spring sleeve 17A and a through hole larger than the base end of the spring sleeve 17A. The spring sleeve 17A is inserted through the through hole of the retainer plate 11D and the through hole of the ejector pin plate 11C.

[0034] The spring 17B is provided in a spiral shape around the spring sleeve 17A between the flange of the spring sleeve 17A and the countersunk portion of the ejector pin plate 11C. In other words, the spring sleeve 17A is inserted into the spiral spring 17B. The spring 17B exerts an elastic force in a direction that moves the ejector pin plate 11C and the flange at the tip of the spring sleeve 17A away from each other.

[0035] That is, the spring 17B biases the ejector pin plate 11C and the retainer plate 11D toward the lower die chase 11B via the spring sleeve 17A. The spring 17B is an example of an elastic member, and the elastic member is not limited to a spring as long as it can exert the above-mentioned elastic force. The elastic member may be, for example, rubber or a leaf spring.

[0036] The lifter pins 12A and 12B are inserted into through holes that penetrate the cavity plate 11A, the lower die chase 11B, the ejector pin plate 11C, and the heat insulating member 15. The lifter pins 12A and 12B are the same length, and three or more pins are used to hold the workpiece W1 in parallel. The top end is on the upper die 20 side, and the bottom end is on the lower die base 11F side. The bottom ends of the lifter pin 12B and the set pin 16 are sandwiched between the ejector pin plate 11C and the retainer plate 11D and screwed in place. The lifter pin 12B and the set pin 16 move up and down in conjunction with the ejector pin plate 11C and the retainer plate 11D.

[0037] The lifter pin 12A supports the substrate SB1 by bringing its tip into contact with the rear surface of the substrate SB1, and the lifter pin 12B supports the substrate SB2 by bringing its tip into contact with the rear surface of the substrate SB2. The lifter pins 12A and 12B are configured to be able to adjust the distance between the substrates SB1 and SB2 and the cavity plate 11A, and move the substrates SB1 and SB2 close to or away from the cavity plate 11A.

[0038] Specifically, the lifter pins 12A, 12B are configured to be able to advance and retreat from the cavity plate 11A to the upper die 20. When the lifter pins 12A, 12B advance into the space between the lower die 10 and the upper die 20 (when the die is opened), the workpieces W1, W2 supported by the lifter pins 12A, 12B move away from the cavity plate 11A. When the lifter pins 12A, 12B retreat from the space between the lower die 10 and the upper die 20 (when the die is closed), the workpieces W1, W2 are supported in contact with the cavity plate 11A.

[0039] When the ejector pin plate 11C and the retainer plate 11D approach the cavity plate 11A (move upward), the tips of the lifter pins 12A and 12B protrude from the cavity plate 11A. That is, the lifter pins 12A and 12B advance into the space between the lower mold 10 and the upper mold 20.

[0040] When the ejector pin plate 11C and the retainer plate 11D move away from the cavity plate 11A (move downward), the tips of the lifter pins 12A and 12B are stored inside the cavity plate 11A. That is, the lifter pins 12A and 12B retract from the space between the lower die 10 and the upper die 20. The lifter pins 12A and 12B correspond to an example of a "holding portion." Note that the holding portion is not limited to a lifter pin. The holding portion may be a long, thin plate-like member that holds the end of the workpiece.

[0041] The set pin 16 is inserted through a through hole that penetrates the side block 18, the lower die chase 11B, and the ejector pin plate 11C. The set pin 16 has a tip end on the upper die 20 side and a base end on the lower die base 11F side. The base end of the set pin 16 is sandwiched between the ejector pin plate 11C and the retainer plate 11D. The tip end of the set pin 16 faces the side block 28 of the upper die 20.

[0042] When the lower die 10 and the upper die 20 are closed, the set pins 16 are pressed by the side blocks 28 to push down the ejector pin plate 11C and the retainer plate 11D. By pushing down the ejector pin plate 11C and the retainer plate 11D, the lifter pins 12B are pushed down in conjunction with each other, and the substrates SB1 and SB2 on the lifter pins 12B move downward. In order to push down the ejector pin plate 11C and the retainer plate 11D in parallel, it is preferable to arrange about four set pins 16 at the four corners of the work.

[0043] The upper mold 20 mainly includes an upper mold base 21E, an upper support plate 21D, a lower support plate 21C, an upper mold chase 21B, and a pressure adjustment mechanism 9. The upper support plate 21D and the lower support plate 21C are fixed to the upper mold base 21E. The upper mold chase 21B is fixed to the upper mold base 21E via the upper support plate 21D and the lower support plate 21C.

[0044] Various parts including the cavity plate 21A are fixed to the upper die chase 21B. In the illustrated example, the upper die chase 21B is provided with the cavity plate 21A, a side block 28 for fixing the cavity plate 21A, a heat insulating member 25 arranged to surround the upper and side surfaces of the cavity plate 21A, and a part of the pressure adjusting mechanism 9.

[0045] The cavity plate 21A is provided at a position closest to the lower mold 10. A heater 24 is provided inside the cavity plate 21A. The heater 24 heats the movable pieces 22Ab, 22Bb, 22Cb, and 22Db (described later) through the cavity plate 21A. When the lower mold 10 and the upper mold 20 are closed, the heater 24 heats the electronic components CH11, CH12, CH21, and CH22 through the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the film F. This heats the bonding materials SN11, SN12, SN21, and SN22.

[0046] The side block 28 is provided on the side of the upper die chase 21B facing the lower die 10. When viewed from above from the upper die 20, the side block 28 is provided on the outer side of the cavity plate 21A. The side block 28 is a portion of the upper die 20 that comes into contact with the lower die 10 when the lower die 10 and the upper die 20 are closed. In other words, the side block 28 comes into contact with the set pin 16 when the lower die 10 and the upper die 20 are closed.

[0047] The heat insulating member 25 is provided between the cavity plate 21A and the upper die chase 21B, and between the cavity plate 21A and the side block 28. The heat insulating member 25 suppresses direct heat conduction from the cavity plate 21A to the upper die chase 21B, and suppresses heat conduction from the cavity plate 21A to the upper die chase 21B via the side block 28.

[0048] The heat insulating member 25 separates the heater 24 from the upper die chase 21B, thereby suppressing thermal deterioration of the springs 23A, 23B, 23C, and 23D described below. In other words, the heat insulating member 25 limits the heating target to the cavity plate 21A, thereby accelerating the temperature rise caused by the heater 24 and making other members less susceptible to the effects of heat.

[0049] When performing the mounting process, a film F is stretched on the surface of the cavity plate 21A facing the lower die 10. The lower surface of the cavity plate is provided with suction holes (not shown) for sucking the film F and adsorbing the film F. The suction holes are connected to an external vacuum suction pump and the suction is controlled to be turned on and off.

[0050] Examples of film F that can be suitably used include film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (ethylene-tetrafluoroethylene copolymer), PET (polyethylene terephthalate), FEP (tetrafluoroethylene-hexafluoropropylene copolymer), fluorine-impregnated glass cloth, PP (polypropylene), and PVDC (polyvinylidine chloride).

[0051] The film F prevents powder and gas generated from the bonding materials SN11, SN12, SN21, and SN22 from entering the gaps in the upper die 20, thereby suppressing malfunction of the upper die 20. In addition, the film F functions as a buffer between the movable pieces 22Ab, 22Bb, 22Cb, and 22Db and the electronic components CH11, CH12, CH21, and CH22, and has the effect of suppressing damage to the electronic components CH11, CH12, CH21, and CH22 when pressure is applied.

[0052] The pressure adjusting mechanism 9 absorbs the difference in thickness between the boards SB1 and SB2, the difference in height between the electronic components CH11, CH12, CH21 and CH22, and the difference in thickness between the bonding materials SN11, SN12, SN21 and SN22, and applies a substantially uniform pressure to the bonding materials SN11, SN12, SN21 and SN22. The pressure adjusting mechanism 9 has movable mechanisms 22A, 22B, 22C and 22D and springs 23A, 23B, 23C and 23D.

[0053] Movable mechanism 22B is provided closest to movable mechanism 22A. Movable mechanism 22D is provided closest to movable mechanism 22C. Similarly, spring 23B is provided closest to spring 23A. Spring 23D is provided closest to spring 23C.

[0054] Movable mechanism 22A is connected to spring 23A and configured to be movable up and down. Similarly, movable mechanism 22B is connected to spring 23B and configured to be movable up and down, movable mechanism 22C is connected to spring 23C and configured to be movable up and down, and movable mechanism 22D is connected to spring 23D and configured to be movable up and down.

[0055] The rod-shaped members such as the movable mechanisms 22A, 22B, 22C, and 22D in the upper mold 20 have a base end on the upper mold base 21E side and a tip end on the lower mold 10 side. The base end of the movable mechanism 22A receives the elastic force of the spring 23A, and the tip end of the movable mechanism 22A presses the electronic component CH11 based on the elastic force of the spring 23A. As a result, the bonding material SN11 is pressed by the movable mechanism 22A through the electronic component CH11. Similarly, the movable mechanism 22B presses the electronic component CH12 based on the elastic force of the spring 23B, and the bonding material SN12 is pressed by the movable mechanism 22B through the electronic component CH12. The movable mechanism 22C presses the electronic component CH21 based on the elastic force of the spring 23C, and the bonding material SN21 is pressed by the movable mechanism 22C through the electronic component CH21. The movable mechanism 22D presses the electronic component CH22 by the elastic force of the spring 23D, and the bonding material SN22 is pressed by the movable mechanism 22D through the electronic component CH22.

[0056] The movable mechanism 22A has a rod 22Aa and a movable piece 22Ab. The movable mechanism 22B has a rod 22Ba and a movable piece 22Bb. The movable mechanism 22C has a rod 22Ca and a movable piece 22Cb. The movable mechanism 22D has a rod 22Da and a movable piece 22Db.

[0057] The rod 22Aa is provided at the base end of the movable mechanism 22A. The rod 22Aa is provided slidably relative to the cavity plate 21A, the upper die chase 21B, the heat insulating member 25, and the lower support plate 21C. The base end of the rod 22Aa is disposed inside a recess that opens to the upper die chase 21B side of the lower support plate 21C, and is provided in a nail head shape with a larger diameter than the tip of the rod 22Aa. The base end of the rod 22Aa is configured to be slidable relative to the lower support plate 21C, and the limit of downward movement is determined by the upper die chase 21B. The tip of the rod 22Aa is disposed inside a through hole that penetrates the cavity plate 21A, the upper die chase 21B, and the heat insulating member 25, and the tip of the tip of the rod 22Aa is rounded in a bullet shape. The very base end of the base end of the rod 22Aa is connected to the spring 23A, and the tip of the tip is in point contact with the movable piece 22Ab. The rod 22Aa transmits the up and down movement of the movable piece 22Ab to the spring 23A, and transmits the elastic force generated in the spring 23A to the movable piece 22Ab.

[0058] The movable piece 22Ab is provided at the tip of the movable mechanism 22A. The movable piece 22Ab is provided slidably relative to the cavity plate 21A. The tip of the movable piece 22Ab protrudes from the cavity plate 21A. The base end of the movable piece 22Ab is located inside the cavity plate 21A and is connected to the tip of the rod 22Aa. The movable piece 22Ab is a movable nest that moves up and down and is prevented from falling. When the lower mold 10 and the upper mold 20 are closed, the tip of the movable piece 22Ab comes into contact with the upper surface of the electronic component CH11 via the film, and applies the pressure of the spring 23A transmitted via the rod 22Aa to the electronic component CH11.

[0059] The rod 22Ba is provided at the base end of the movable mechanism 22B. The rod 22Ba is provided slidably relative to the cavity plate 21A, the upper die chase 21B, the heat insulating member 25, the lower support plate 21C, and the upper support plate 21D. The base end of the rod 22Ba is disposed inside a recess that opens to the lower support plate 21C side of the upper support plate 21D, and is provided in a nail head shape with a larger diameter than the tip of the rod 22Ba. The base end of the rod 22Ba is configured to be slidable relative to the upper support plate 21D, and the limit of the downward movement is determined by the lower support plate 21C. The tip of the rod 22Ba is disposed inside a through hole that penetrates the cavity plate 21A, the upper die chase 21B, the heat insulating member 25, and the lower support plate 21C, and the tip of the tip of the rod 22Ba is rounded in a bullet shape. The rod 22Ba has a base end connected to the spring 23B and a tip end in point contact with the movable piece 22Bb. The rod 22Ba transmits the vertical movement of the movable piece 22Ab to the spring 23B and transmits the elastic force generated in the spring 23B to the movable piece 22Ab.

[0060] The structure and function of the rod 22Ca are similar to those of the rod 22Aa. The structure and function of the rod Da are similar to those of the rod 22Ba. The structure and function of the movable pieces 22Bb, 22Cb, and 22Db are similar to those of the movable piece 22Ab. Therefore, the description of the rods 22Ca and 22Da and the movable pieces 22Bb, 22Cb, and 22Db will be omitted.

[0061] When performing the mounting process, the sides of the movable pieces 22Ab, 22Bb, 22Cb, 22Db that come into contact with the electronic components CH11, CH12, CH21, CH22 are covered with a continuous film F. The film F prevents dust generated from the bonding materials SN11, SN12, SN21, SN22, etc. from adhering to and contaminating the upper die 20, and also reduces damage to the chips CH11, CH12, CH21, CH22.

[0062] The movable piece 22Ab, which comes into contact with the electronic component CH11 via the film F, is pushed up based on the thicknesses of the substrate SB1, the bonding material SN11, and the electronic component CH11. The pushed-up movable piece 22Ab pushes up the rod 22Aa, compresses the spring 23A, and generates an elastic force. The elastic force generated by the spring 23A is transmitted by the rod 22Aa and applied to the electronic component CH11 by the movable piece 22Ab. Similarly, the movable piece 22Bb is pushed up based on the thicknesses of the substrate SB1, the bonding material SN12, and the electronic component CH12, and applies the elastic force generated by the spring 23B to the electronic component CH12. The movable piece 22Cb is pushed up based on the thicknesses of the substrate SB2, the bonding material SN21, and the electronic component CH21, and applies the elastic force generated by the spring 23C to the electronic component CH21. The movable piece 22Db is pushed up based on the thicknesses of the substrate SB2, the bonding material SN22, and the electronic component CH22, and applies the elastic force generated by the spring 23D to the electronic component CH22.

[0063] Springs 23A, 23B, 23C, and 23D act independently of each other. Therefore, the pressure applied to electronic component CH11 is not affected by springs 23B, 23C, and 23D, but is determined only by the elastic force of spring 23A. The pressure applied to electronic component CH12 is not affected by springs 23A, 23C, and 23D, but is determined only by the elastic force of spring 23B. The pressure applied to electronic component CH21 is not affected by springs 23A, 23B, and 23D, but is determined only by the elastic force of spring 23C. The pressure applied to electronic component CH22 is not affected by springs 23A, 23B, and 23C, but is determined only by the elastic force of spring 23D. The differences in thickness of the substrates SB1, SB2, the differences in height of the electronic components CH11, CH12, CH21, CH22, and the differences in thickness of the bonding materials SN11, SN12, SN21, SN22 are absorbed by the springs 23A, 23B, 23C, 23D, and the bonding materials SN11, SN12, SN21, SN22 are pressed with approximately uniform pressure.

[0064] The springs 23A, 23B, 23C, and 23D generate elastic forces in a direction to push down the movable mechanisms 22A, 22B, 22C, and 22D by being compressed in the vertical direction. The springs 23A, 23B, 23C, and 23D are coil springs formed using a metal material. The springs 23A and 23C are provided inside a recess that opens to the upper die chase 21B side of the lower support plate 21C. The springs 23B and 23D are provided inside a recess that opens to the lower support plate 21C side of the upper support plate 21D. In the opening and closing direction of the lower die 10 and the upper die 20, there is a gap between the springs 23A and 23B. Also, in the opening and closing direction of the lower die 10 and the upper die 20, there is a gap between the springs 23C and 23D. That is, the base ends of the springs 23A and 23C are provided closer to the lower die 10 than the tip ends of the springs 23B and 23D. When viewed from above from the lower mold 10, the springs 23A and 23B partially overlap each other, and the springs 23C partially overlap each other with a gap therebetween. The springs 23A, 23B, 23C, and 23D move the movable mechanisms 22A, 22B, 22C, and 22D based on their elastic forces. The springs 23A, 23B, 23C, and 23D are an example of an "elastic element."

[0065] The elastic element is not limited to a coil spring as long as it can generate an elastic force in a direction to press down the movable mechanisms 22A, 22B, 22C, and 22D. The elastic element may be, for example, a rubber or a leaf spring.

[0066] The degassing chambers 31 and 32 are openable and closable vacuum chambers surrounding the lower mold 10 and the upper mold 20. The degassing chamber 31 is connected to the lower mold base 11F of the lower mold 10. When viewed from above from the upper mold 20, the degassing chamber 31 is provided outside the side block 18. A degassing path 33 through which the degassed gas passes is provided between the degassing chamber 31 and the lower mold chase 11B, the ejector pin plate 11C, the retainer plate 11D, the support pillar 11E, and the side block 18. The degassing chamber 32 is connected to the upper mold base 21E of the upper mold 20. When viewed from above from the lower mold 10, the degassing chamber 32 is provided outside the side block 28. A degassing path 34 through which the degassed gas passes is provided between the degassing chamber 32 and the upper mold chase 21B, the lower support plate 21C, the upper support plate 21D, and the side block 28. The degassing path 34 is connected to a degassing path 27 provided in the upper mold base 21E. The degassing path 27 is connected to a degassing port 29 provided in the upper mold base 21E. The degassing port 29 is connected to a vacuum pump outside the mold. The atmosphere of the lower mold 10 and the upper mold 20 in the degassing chambers 31, 32 is degassed by the degassing port 29.

[0067] <Implementation method> Next, a mounting method using the mounting device 1 according to this embodiment will be described with reference to Figs. 2 to 9. Figs. 2 and 3 are flow charts showing a part of the mounting method according to one embodiment of the present invention. Fig. 4 is a graph showing a temperature profile of the mounting method according to one embodiment of the present invention. Figs. 5 to 9 are diagrams showing the mounting device in one step of the mounting method. In the graph of Fig. 4, the horizontal axis indicates time and the vertical axis indicates the temperature of the workpiece.

[0068] First, the lower mold 10 and the upper mold 20 are prepared (S11), and preheating of the lower mold 10 and the upper mold is started (S12). As shown in Fig. 4, the temperatures of the workpieces W1 and W2 at this time are room temperature (RT).

[0069] Next, the workpieces W1 and W2 are placed on the lifter pins 12A and 12B (S13). In the workpiece W1, the electronic components CH11 and CH12 are placed on the board SB1. In the workpiece W2, the electronic components CH21 and CH22 are placed on the board SB2. Next, the degassing chambers 31 and 32 are closed to start degassing (S14), and the supply of nitrogen gas is started (S15). The bonding materials SN11, SN12, SN21, and SN22 are degassed before being heated to the sintering treatment temperature, and the bonding materials SN11, SN12, SN21, and SN22 are surrounded by a nitrogen gas atmosphere, thereby suppressing oxidation of the bonding materials SN11, SN12, SN21, and SN22. As shown in FIG. 5, when the degassing chambers 31 and 32 are closed, the tip of the set pin 16 abuts against the side block 28 of the upper mold 20. The side blocks 18, 28 of the lower die 10 and the upper die 20 are spaced apart from each other, and the workpieces W1, W2 are spaced apart from the cavity plate 11A. The boards SB1, SB2 are heated by thermal radiation from the cavity plate 11A of the lower die 10, and the electronic components CH11, CH12, CH21, CH22 are heated by thermal radiation from the movable pieces 22Ab, 22Bb, 22Cb, 22Db of the upper die 20. As shown in Fig. 4, the temperature of the workpieces W1, W2 at this time is about 100°C to 150°C.

[0070] Next, the mold is closed a little further, the lifter pins 12A and 12B are lowered, and the substrates SB1 and SB2 are brought into contact with the cavity plate 11A of the upper mold 20 (S16). As shown in FIG. 6, the lower mold 10 and the upper mold 20 approach each other, and the set pin 16 is pushed down by the side block 28 of the upper mold 20. The pushed down set pin 16 pushes down the ejector pin plate 11C and the retainer plate 11D connected to the base end of the set pin 16. The pushed down ejector pin plate 11C and the retainer plate 11D push down the lifter pins 12A and 12B whose base ends are connected to the ejector pin plate 11C and the retainer plate 11D. As a result, the workpieces W1 and W2 come into contact with the cavity plate 11A. The substrates SB1 and SB2 are heated by thermal conduction from the cavity plate 11A of the lower mold 10, and the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation from the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. As shown in Fig. 4, the temperature of the workpieces W1 and W2 at this time is raised from a preheating temperature of 100°C to 150°C to a sintering treatment temperature of 250°C to 300°C.

[0071] Next, the lower die 10 and the upper die 20 are further closed, and the movable mechanisms 22A, 22B, 22C, and 22D come into contact with the electronic components CH11, CH12, CH21, and CH22 via the film F (S21). As shown in FIG. 7, when the side blocks 18 and 28 of the lower die 10 and the upper die 20 come into contact with each other and the closing of the die is completed, the set pin 16 is pushed down to its maximum. The movable piece 22Ab of the movable mechanism 22A comes into contact with the electronic component CH11 via the film F, and the spring 23A is compressed by the amount that the rod 22Aa of the movable mechanism 22A is pushed up. The movable piece 22Bb of the movable mechanism 22B comes into contact with the electronic component CH12 via the film F, and the spring 23B is compressed by the amount that the rod 22Ba of the movable mechanism 22B is pushed up. Movable piece 22Cb of movable mechanism 22C comes into contact with electronic component CH21 via film F, and spring 23C is compressed by the amount that rod 22Ca of movable mechanism 22C is pushed up. Movable piece 22Db of movable mechanism 22D comes into contact with electronic component CH22 via film F, and rod 22Da of movable mechanism 22D is pushed up, and spring 23D is compressed by the amount that rod 22Da of movable mechanism 22D is pushed up.

[0072] Since the springs 23A, 23B, 23C, and 23D are independent of each other, the compression amount of the spring 23A is determined by the thicknesses of the board SB1, the bonding material SN11, and the electronic component CH11, and is not substantially affected by the thicknesses of the board SB2, the bonding materials SN12, SN21, and SN22, and the electronic components CH12, CH21, and CH22. In other words, insufficient or excessive pressure on the electronic component CH11 due to the influence of the thicknesses of the board SB2, the bonding materials SN12, SN21, and SN22, and the electronic components CH12, CH21, and CH22 is suppressed. Similarly, the compression amount of the spring 23B is determined by the thicknesses of the board SB1, the bonding material SN12, and the electronic component CH12, and is not substantially affected by the thicknesses of the board SB2, the bonding materials SN11, SN21, and SN22, and the electronic components CH11, CH21, and CH22. Insufficient or excessive pressure on the electronic component CH12 due to the influence of the thicknesses of the board SB2, the bonding materials SN11, SN21, SN22, and the electronic components CH11, CH21, CH22 is suppressed. The compression amount of the spring 23C is determined by the thicknesses of the board SB2, the bonding materials SN21, and the electronic component CH21, and is substantially not affected by the thicknesses of the board SB1, the bonding materials SN11, SN12, SN22, and the electronic components CH11, CH12, CH22. Insufficient or excessive pressure on the electronic component CH21 due to the influence of the thicknesses of the board SB1, the bonding materials SN11, SN12, SN22, and the electronic components CH11, CH12, CH22 is suppressed. The compression amount of the spring 23D is determined by the thicknesses of the board SB2, the bonding materials SN22, and the electronic component CH22, and is substantially not affected by the thicknesses of the board SB1, the bonding materials SN11, SN12, SN21, and the electronic components CH11, CH12, CH21. Insufficient or excessive pressure on electronic component CH22 due to the influence of the thickness of substrate SB1, bonding materials SN11, SN12, SN21, and electronic components CH11, CH12, CH21 is suppressed. Bonding materials SN11, SN12, SN21, SN22 are simultaneously applied with an appropriate pressure via electronic components CH11, CH12, CH21, CH22. Note that some electronic components are resistant to pressure and some are not, and bonding materials can be changed depending on the electronic components, so some require strong pressure and some do not, and it is also possible to change the spring pressure for each of springs 23A, 23B, 23C, 23D.

[0073] The movable mechanisms 22A, 22B, 22C, and 22D come into contact with the electronic components CH11, CH12, CH21, and CH22 via the film F, thereby improving the adhesion between the cavity plate 11A of the lower mold 10 and the substrates SB1 and SB2. Therefore, compared to step S16 in which the substrates SB1 and SB2 were placed on the cavity plate 11A, the efficiency of heat conduction from the lower mold 10 to the substrates SB1 and SB2 is improved, and the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the lower mold 10 is improved. In addition, the electronic components CH11, CH12, CH21, and CH22 are heated by heat conduction from the movable pieces 22Ab, 22Bb, 22Cb, and 22Db of the upper mold 20. Therefore, the heating efficiency of the bonding materials SN11, SN12, SN21, and SN22 by the upper die 20 is improved compared to steps S13 to S16 in which the electronic components CH11, CH12, CH21, and CH22 are heated by thermal radiation. As shown in Fig. 4, the temperature of the workpieces W1 and W2 at this time is raised from the preheating temperature of 100°C to 150°C to the sintering treatment temperature of 250°C to 300°C.

[0074] The bonding materials SN11, SN12, SN21, and SN22 are sintered by heating and pressing. The sintered bonding material SN11 bonds and electrically connects the electronic component CH11 and the board SB1, the sintered bonding material SN12 bonds and electrically connects the electronic component CH12 and the board SB1, the sintered bonding material SN21 bonds and electrically connects the electronic component CH21 and the board SB2, and the sintered bonding material SN22 bonds and electrically connects the electronic component CH22 and the board SB2. In other words, the electronic components CH11 and CH12 are mounted on the board SB1, and the electronic components CH21 and CH22 are mounted on the board SB2.

[0075] Next, the mold is opened to raise the lifter pins 12A and 12B, and the substrates SB1 and SB2 are separated from the cavity plate 11A of the lower mold 10 (S22). As shown in FIG. 8, the side block 28 of the upper mold 20 is separated from the side block 18 of the lower mold 10. The spring 17B applies an elastic force in a direction to move the ejector pin plate 11C closer to the lower mold chase 11B to which the base end (the screw-in side of the stepped bolt, the upper side) of the spring sleeve 17A is screwed. Since the position of the lower mold chase 11B is fixed by the support pillar 11E, the ejector pin plate 11C and the retainer plate 11D connected to the ejector pin plate 11C are pushed up. As a result, the ejector pin plate 11C and the retainer plate 11D are lifted up, and the lifter pins 12A and 12B, whose base ends are sandwiched between the ejector pin plate 11C and the retainer plate 11D, are also lifted up. The tips of the lifter pins 12A and 12B protrude from the cavity plate 11A and contact the rear surfaces of the substrates SB1 and SB2, and the workpieces W1 and W2 move away from the cavity plate 11A. The gas supply port 13 supplies nitrogen gas toward the workpieces W1 and W2. As the workpieces W1 and W2 move away from the cavity plate 11A, which is the heat source, and receive the supply of nitrogen gas, cooling of the workpieces W1 and W2 begins. As shown in FIG. 4, the temperature of the workpieces W1 and W2 at this time is about 250°C to 300°C, which is the sintering processing temperature.

[0076] Next, the supply of nitrogen gas is stopped, and degassing is stopped (S23). When the workpieces W1 and W2 are cooled to about 100°C to 150°C as shown in Fig. 4, the supply of nitrogen gas from the gas supply port 13 is stopped, and then degassing from the degassing port 29 is stopped. This completes the cooling of the workpieces W1 and W2 in the mounting device 1.

[0077] Finally, the molds are further opened to open the degassing chambers 31 and 32, and the workpieces W1 and W2 are removed (S24). As shown in Fig. 9, the degassing chambers 31 and 32 are separated from each other, and the workpieces W1 and W2 are released. The workpieces W1 and W2 are collected from above the lifter pins 12A and 12B.

[0078] In the present embodiment, a configuration has been described in which one electronic component is pressurized by one movable mechanism, and one movable mechanism is moved by one elastic element, but the embodiments of the present invention are not limited to this.

[0079] For example, a plurality of electronic components may be pressed by one movable mechanism. In such a configuration, when the heights of the plurality of electronic components are different, the tip surface of the movable piece may be provided with unevenness according to the heights of the plurality of electronic components. According to this, a plurality of electronic components having different heights can be pressed with a substantially uniform pressure by one movable mechanism. Also, one electronic component may be pressed by multiple movable mechanisms. According to this, even if one electronic component includes parts having different heights, the entirety of one electronic component can be pressed with a substantially uniform pressure by pressing each part with a different movable mechanism. Also, for example, one movable mechanism may be moved by multiple elastic elements, or multiple movable mechanisms may be moved by one elastic element. The multiple movable mechanisms are arranged side by side on the paper surface of the drawing, for example, but may be arranged side by side in the depth direction of the paper surface. The multiple movable mechanisms may be arranged in a matrix so as to press each of the multiple electronic components arranged in a matrix on the substrate.

[0080] In addition, in this embodiment, an example has been described in which the upper mold has two support plates (a lower support plate and an upper support plate) and the two closest elastic elements are provided on different support plates, but embodiments of the present invention are not limited to this.

[0081] If two closest elastic elements can be provided on one support plate, the upper mold may have only one support plate. In this case, the two closest elastic elements may be provided side by side in a direction intersecting the opening and closing direction of the lower mold and the upper mold, or may be provided so that they partially overlap each other in the opening and closing direction of the lower mold and the upper mold. For example, one support plate may be provided with an upper surface recess that opens on the upper surface and a lower surface recess that opens on the lower surface, and the upper surface recess and the lower surface recess may partially overlap each other in the vertical direction, and an elastic element may be disposed inside each of the upper surface recess and the lower surface recess. In addition, the upper mold may have three or more support plates, and an elastic element may be provided on each support plate. According to this, the elastic elements and the movable mechanisms can be provided more densely than in a configuration in which the number of support plates provided on the upper mold is two, so that each of the electronic components arranged more densely can be simultaneously and individually pressed with an appropriate pressure.

[0082] Some or all of the embodiments of the present invention will be described below. Note that the present invention is not limited to the following descriptions.

[0083] [Appendix 1] A mounting device for mounting one or more electronic components on at least one substrate, the mounting device comprising: a first mold configured to hold the substrate on which the electronic components are placed; a second mold arranged opposite the first mold; and a gas supply mechanism for supplying an inert gas to a space between the first mold and the second mold, the second mold having a movable mechanism and an elastic element, and when the first mold and the second mold are closed, the electronic component is pressurized by the movable mechanism in accordance with the elastic force of the elastic element.

[0084] According to this aspect, an elastic force is generated in the elastic element by the upward movement of the movable mechanism according to the height of the electronic component and the board, and the electronic component is pressurized by the elastic force. That is, an elastic force suitable for pressurizing the electronic component is naturally generated in the mold. Therefore, it is possible to achieve a smaller size than a mounting device that pressurizes the electronic component through a fluid supplied from the outside of the second mold. In addition, the gas supply mechanism removes oxidizing gas from the surroundings of the electronic component and the board, and creates an inert gas atmosphere around the electronic component and the board. This makes it possible to suppress poor bonding due to oxidation of the bonding material that bonds the electronic component to the board, and to perform the bonding process at high temperatures. In addition, when cooling the electronic component and the board after the bonding process, the electronic component and the board can be gas-cooled with an inert gas.

[0085] [Appendix 2] The mounting device described in [Appendix 1], wherein the second mold has a plurality of movable mechanisms and a plurality of elastic elements, each of which is independently movable by a mutually different elastic element.

[0086] According to this embodiment, the elastic force of one elastic element is determined based on the thickness and desired pressure of one electronic component, and is not substantially affected by the thicknesses and desired pressures of other electronic components. Therefore, insufficient or excessive pressure on the one electronic component due to the influence of the thicknesses and desired pressures of the other electronic components is suppressed. In other words, each of the multiple electronic components can be simultaneously and individually pressurized with an appropriate pressure.

[0087] [Appendix 3] The mounting device described in [Appendix 2], wherein the second mold has a plurality of support plates, and at least two of the plurality of elastic elements are provided on different support plates.

[0088] According to this aspect, the two elastic elements can be arranged so that parts of the two elastic elements overlap with a gap in the opening and closing direction of the first and second molds. That is, the multiple elastic elements can be arranged densely. Therefore, even if multiple electronic components are arranged densely, each of the multiple electronic components can be simultaneously and individually pressurized with an appropriate pressure.

[0089] [Appendix 4] The gas supply mechanism is a gas supply port provided in at least one of the first mold and the second mold, and has a gas supply port that supplies an inert gas toward the electronic components and the substrate. A mounting device described in any one of [Appendix 1] to [Appendix 3].

[0090] According to this aspect, the inert gas can be directly sprayed onto the electronic components and the substrate from the gas supply port facing the electronic components and the substrate. When the electronic components and the substrate are heated, the surroundings of the electronic components and the substrate can be efficiently made into an inert gas atmosphere. Therefore, poor bonding due to oxidation of the bonding material can be suppressed. In addition, when cooling the electronic components and the substrate, the surroundings of the electronic components and the substrate can be efficiently gas-cooled by applying the inert gas to the electronic components and the substrate. Since the cooling speed of the mounted components is improved, the time required to remove the mounted components from the mounting device is shortened, and production efficiency can be improved.

[0091] [Appendix 5] A mounting apparatus described in any one of [Appendix 1] to [Appendix 4], further comprising an openable and closable degassing chamber surrounding the first mold and the second mold.

[0092] According to this aspect, the electronic components and the substrate can be surrounded by a vacuum atmosphere or an inert gas atmosphere, so that oxidation can be suppressed. Therefore, the electronic components and at least one substrate can be heated to a high temperature.

[0093] [Appendix 6] A mounting device described in any one of [Appendix 1] to [Appendix 5], wherein the movable mechanism has a movable piece that applies an elastic force transmitted from the elastic element to the electronic component, and the second mold further has a heater that heats the movable piece and a heat insulating member that separates the heater and the elastic element.

[0094] According to this aspect, when the heater heats the movable piece, the temperature rise of the elastic element can be suppressed, and therefore, the change in characteristics and damage of the elastic element due to heat can be suppressed.

[0095] [Appendix 7] A mounting device described in any one of [Appendix 1] to [Appendix 6], wherein the elastic element is a coil spring formed using a metal material.

[0096] [Appendix 8] The mounting apparatus is a sintering apparatus, the mounting apparatus being described in any one of [Appendix 1] to [Appendix 7].

[0097] [Appendix 9] A mounting method using a mounting device for mounting one or more electronic components on at least one substrate, the mounting method including: preparing a first mold configured to hold the substrate on which the electronic components are placed; and preparing a second mold arranged opposite the first mold, the second mold having a movable mechanism and an elastic element; the mounting method further including: supplying an inert gas to a space between the first mold and the second mold; closing the first mold and the second mold; and, with the first mold and the second mold closed, applying pressure to the electronic component by the movable mechanism in accordance with the elastic force of the elastic element.

[0098] According to this aspect, an elastic force is generated in the elastic element by the upward movement of the movable mechanism according to the height of the electronic component and the board, and the electronic component is pressurized by the elastic force. That is, an elastic force suitable for pressurizing the electronic component is naturally generated in the mold. Therefore, it is possible to achieve a smaller size than a mounting device that pressurizes the electronic component through a fluid supplied from the outside of the second mold. In addition, the gas supply mechanism removes oxidizing gas from the surroundings of the electronic component and the board, and creates an inert gas atmosphere around the electronic component and the board. This makes it possible to suppress poor bonding due to oxidation of the bonding material that bonds the electronic component to the board, and to perform the bonding process at high temperatures. In addition, when cooling the electronic component and the board after the bonding process, the electronic component and the board can be gas-cooled with an inert gas.

[0099] As described above, it is possible to provide a compact mounting device capable of suppressing the occurrence of mounting defects and a mounting method using the same.

[0100] The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements of the embodiments, as well as their arrangements, materials, conditions, shapes, sizes, etc., are not limited to those illustrated, and can be changed as appropriate. In addition, configurations shown in different embodiments can be partially substituted or combined with each other. [Explanation of symbols]

[0101] 1...Mounting device 10…Lower mold 11A…Cavity plate 11B...Lower Chase 11C…Ejector pin plate 11D…Retainer plate 11E…Support pillar 11F…Lower base 12A, 12B... Lifter pins 13…Gas supply port 14…Heater 15…Heat insulation material 16...Set pin 17A…Spring sleeve 17B…Spring 18…Side block 20…Upper mold 21A…Cavity plate 21B…Upper Chase 21C…Lower support plate 21D…Upper support plate 21E…Upper base 22A, 22B, 22C, 22D…Movable mechanism 22Aa, 22Ba, 22Ca, 22Da...Rod 22Ab, 22Bb, 22Cb, 22Db…Movable piece 23A, 23B, 23C, 23D...Spring 24…Heater 25…Heat insulation material 27…Vacuum path 28…Side block 29…Ventilator 31, 32…Degassing chamber 33, 34…Vacuum path

Claims

1. A mounting apparatus for mounting one or more electronic components on at least one substrate, comprising: A first mold configured to hold the substrate on which the electronic component is placed; A second mold disposed opposite to the first mold; a gas supply mechanism for supplying an inert gas to a space between the first mold and the second mold; Equipped with The second mold has a movable mechanism and an elastic element, When the first mold and the second mold are closed, the movable mechanism applies pressure to the electronic component in accordance with the elastic force of the elastic element. Mounting equipment.

2. the second mold has a plurality of the movable mechanisms and a plurality of the elastic elements; Each of the plurality of movable mechanisms is independently movable by a different elastic element. The mounting device according to claim 1 .

3. The second mold has a plurality of support plates, At least two of the elastic elements are provided on different support plates. The mounting device according to claim 2 .

4. the gas supply mechanism has a gas supply port provided in at least one of the first mold and the second mold, the gas supply port supplying the inert gas toward the electronic component and the substrate; The mounting device according to claim 1 .

5. Further comprising an openable and closable degassing chamber surrounding the first mold and the second mold. The mounting device according to claim 1 .

6. the movable mechanism has a movable piece that applies the elastic force transmitted from the elastic element to the electronic component, The second mold is A heater for heating the movable piece; a heat insulating member that separates the heater from the elastic element; Further comprising The mounting device according to claim 1 .

7. The elastic element is a coil spring formed using a metal material. The mounting device according to claim 1 .

8. The mounting apparatus is a sintering apparatus. The mounting device according to claim 1 .

9. A mounting method using a mounting apparatus for mounting one or more electronic components on at least one substrate, comprising the steps of: providing a first mold configured to hold the substrate on which the electronic component is placed; preparing a second mold disposed opposite the first mold; Including, The second mold has a movable mechanism and an elastic element, The mounting method includes: supplying an inert gas into a space between the first mold and the second mold; closing the first mold and the second mold; pressurizing the electronic component by the movable mechanism in accordance with the elastic force of the elastic element in a state in which the first mold and the second mold are closed; Further comprising: How to implement it.

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