Method for evaluating resin composition, method for manufacturing electronic component device, structure and method for manufacturing structure

Abstract

To provide a method for evaluating a resin composition that can be carried out using a simple method, a method for manufacturing electronic component devices that uses this evaluation method, and a method for manufacturing structures and structures used in this evaluation method.SOLUTION: A method for evaluating a resin composition includes forming a groove on one side of a first substrate, arranging a second substrate so that it faces the grooved surface of the first substrate, filling the space formed between the first and second substrates with a resin composition, and evaluating the condition of the space filled with the resin composition.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a method for evaluating a resin composition, a method for manufacturing an electronic component device, a structure, and a method for manufacturing a structure. [Background technology]

[0002] As a manufacturing technique for electronic component devices, a technique called wafer level packaging has been attracting attention in recent years (see, for example, Patent Document 1). In wafer level packaging, packaging is performed in the wafer state and then the wafer is cut, rather than packaging the wafer after cutting the wafer into the size of individual electronic component devices. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2020-17717 A Summary of the Invention [Problem to be solved by the invention]

[0004] As a method for mounting electronic components in wafer level packaging, there is a method (flip chip bonding) in which an electronic component having a protruding electrode called a bump is arranged so that the bump faces a circuit formed on a substrate, and the electronic component is electrically connected to the circuit. In this method, a step of filling the space between the electronic component and the substrate with a resin composition is carried out. In order to ensure the reliability of the electronic component device, it is desirable to prepare a sample that simulates the state of the space between the electronic component and the substrate in the electronic component device and to confirm whether the space is sufficiently filled with the resin composition. On the other hand, in recent years, the bumps have become finer with the increasing integration density of electronic device devices, and the process of forming bumps on electronic devices has become more complicated. For this reason, it is desired to reduce the technical and cost burdens required for preparing samples for evaluating the filling property of a resin composition.

[0005] In view of the above circumstances, an object of one embodiment of the present disclosure is to provide a method for evaluating a resin composition that can be carried out in a simple manner, a method for manufacturing an electronic component device using this evaluation method, and a structure used in this evaluation method and a method for manufacturing a structure. [Means for solving the problem]

[0006] Specific means for solving the above problems include the following aspects. <1> forming a groove on one surface of a first substrate; disposing a second substrate so as to face a surface of the first substrate on which the grooves are formed; filling a space formed between the first substrate and the second substrate with a resin composition; and evaluating the state of the space filled with the resin composition. <2> For selecting a resin composition to be used in the manufacture of electronic component devices, <1> A method for evaluating a resin composition according to claim 1. <3> The depth of the groove is 1 μm or more and 200 μm or less. <1> or <2> A method for evaluating a resin composition according to claim 1. <4> The width of the groove is 1 μm or more and 200 μm or less. <1> ~ <3> 13. A method for evaluating a resin composition according to claim 12. <5> At least one of the first substrate and the second substrate is a silicon wafer; <1> ~ <4> 13. A method for evaluating a resin composition according to claim 12. <6> The groove is formed using a dicing blade. <1> ~ <5> 13. A method for evaluating a resin composition according to claim 12. <7> The resin composition is liquid at room temperature. <1> ~ <6> 13. A method for evaluating a resin composition according to claim 12. <8> <1> ~ <7> Selecting a resin composition based on a result obtained by the method for evaluating a resin composition according to any one of the above items; and manufacturing an electronic component device using the selected resin composition. <9> <1> ~ <7> A structure for use in the method for evaluating a resin composition according to any one of claims 1 to 4, a first substrate having a groove on one surface; A second substrate disposed opposite the surface of the first substrate having the groove. <10> <1> ~ <7> A method for producing a structure for use in the method for evaluating a resin composition according to any one of claims 1 to 4, comprising the steps of: forming a groove on one surface of a first substrate; and disposing a second substrate so as to face the surface of the first substrate on which the grooves are formed. <11> forming a groove on one side of a substrate; filling a groove formed in a substrate with a resin composition; and evaluating the condition of the groove filled with the resin composition. Effect of the Invention

[0007] According to one embodiment of the present disclosure, there are provided a method for evaluating a resin composition that can be performed in a simple manner, a method for manufacturing an electronic component device using this evaluation method, and a structure used in this evaluation method and a method for manufacturing a structure. [Brief description of the drawings]

[0008] [Figure 1] 4 is a cross-sectional view showing an example of a state of a groove formed on one surface of a first substrate. FIG. [Diagram 2] 1 is a cross-sectional view that illustrates an example of a state in which a second substrate is disposed so as to face a surface of a first substrate on which grooves are formed. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] In the present disclosure, the term "step" includes not only a step that is independent of other steps, but also a step that cannot be clearly distinguished from other steps as long as the purpose of the step is achieved. In the present disclosure, a numerical range indicated using "~" includes the numerical values ​​before and after "~" as the minimum and maximum values, respectively. In the numerical ranges described in the present disclosure in stages, the upper or lower limit value described in one numerical range may be replaced with the upper or lower limit value of another numerical range described in stages. In addition, in the numerical ranges described in the present disclosure, the upper or lower limit value of the numerical range may be replaced with a value shown in the examples. In the present disclosure, each component may contain multiple types of the corresponding substance. When multiple substances corresponding to each component are present in the composition, the content or amount of each component means the total content or amount of the multiple substances present in the composition, unless otherwise specified.

[0010] <Method of evaluating resin composition> The first embodiment of the present disclosure is forming a groove on one surface of a first substrate; disposing a second substrate so as to face a surface of the first substrate on which the grooves are formed; filling a space formed between the first substrate and the second substrate with a resin composition; and evaluating the state of the space filled with the resin composition.

[0011] According to the method of this embodiment, the resin composition can be evaluated in a simple manner. Specifically, a second substrate is disposed so as to face the surface of the first substrate on which the grooves are formed, and a space corresponding to the grooves formed in the first substrate is formed between the first substrate and the second substrate. This space is regarded as an internal space of an electronic component device and is filled with a resin composition. Based on the state of the space filled with the resin composition, the filling property when the resin composition is used to fill the internal space of an electronic component device can be evaluated.

[0012] That is, in the method of the present embodiment, a substrate with grooves formed therein is used instead of an electronic component having bumps to prepare a structure for evaluating the filling property of a resin composition. For example, a silicon wafer is used as the substrate, and a device for dicing silicon wafers is used to form grooves, thereby making it possible to prepare a structure for evaluating the filling property of a resin composition at low cost.

[0013] Hereinafter, the process of forming a groove on one side of the first substrate may be referred to as a groove forming process, the process of positioning the second substrate so that it faces the side of the first substrate on which the groove is formed may be referred to as a positioning process, the process of filling the space formed between the first substrate and the second substrate with a resin composition may be referred to as a filling process, and the process of evaluating the state of the space filled with the resin composition may be referred to as an evaluation process.

[0014] (Groove formation process) In the groove forming step, grooves are formed on one surface of the first substrate. The method for forming the grooves on one surface of the first substrate is not particularly limited, and can be selected depending on the type of the first substrate, etc. For example, the grooves may be formed on one surface of the first substrate using a means used for dicing a wafer, specifically, a dicing blade, a laser, plasma, etc.

[0015] FIG. 1 is a cross-sectional view that illustrates a state in which grooves are formed on one surface of a first substrate. 1 has a groove 2 formed on one surface of the first substrate 1. The dimension of the groove 2 in the surface direction of the first substrate 1 is defined as the groove width X1, the dimension of the groove 2 in the thickness direction of the first substrate 1 is defined as the groove depth X2, and the dimension of the area between adjacent grooves 2 where no groove 2 is formed is defined as the groove distance X3.

[0016] The width X1 of the groove may be set to match, for example, the width of the space between bumps in an electronic component device manufactured using the resin composition to be evaluated. Specifically, the groove width X1 may be 1 μm or more, 2 μm or more, or 5 μm or more, and may be 200 μm or less, 100 μm or less, or 50 μm or less. When the width of the groove is not constant, the dimension at the entrance of the groove is defined as the width X1 of the groove.

[0017] The depth X2 of the groove may be set to match, for example, the distance between an electronic component and a substrate in an electronic component device manufactured using the resin composition to be evaluated. Specifically, the groove depth X2 may be 1 μm or more, 2 μm or more, or 5 μm or more, and may be 200 μm or less, 100 μm or less, or 50 μm or less. If the depth of the groove is not constant, the dimension at the deepest part of the groove shall be the groove depth X2.

[0018] The groove distance X3 may be set to match, for example, the width of a bump in an electronic component device manufactured using the resin composition to be evaluated. Specifically, the groove distance X3 may be 1 μm or more, 2 μm or more, or 5 μm or more, and may be 200 μm or less, 100 μm or less, or 50 μm or less. When the groove distance is not constant, the dimension at the entrance of the groove is taken as the groove distance X3.

[0019] (Placement process) In the positioning step, the second substrate is positioned so as to face the surface of the first substrate on which the grooves are formed. FIG. 2 is a cross-sectional view that illustrates an example of a state in which a second substrate is disposed so as to face the surface of a first substrate on which grooves are formed. As shown in FIG. 2, a space 20 is formed between the first substrate 1 and the second substrate 2 by disposing the second substrate 2 so as to face the surface of the first substrate 1 on which the grooves are formed.

[0020] The first and second substrates are preferably fixed to each other. There are no particular limitations on the means for fixing the first and second substrates, and examples of the means include adhesive, solder, clips, and the like. When the first substrate and the second substrate are fixed together using an adhesive, the adhesive may be applied to either the first substrate or the second substrate. When applying the adhesive to the first substrate, the adhesive may be applied to the first substrate before the grooves are formed, or may be applied to the first substrate after the grooves are formed. From the viewpoint of the dimensional accuracy of the grooves, it is preferable that the adhesive is applied to the first substrate before the grooves are formed (i.e., the grooves are formed with the adhesive applied to the surface of the first substrate). The adhesive may be a layered adhesive (adhesive layer), and a film-like adhesive such as a die attach film (DAF) used in the manufacture of electronic component devices may be used as the adhesive layer.

[0021] The first substrate may be the same size as the second substrate, larger than the second substrate, or smaller than the second substrate. The number of the first substrate and the second substrate may be one each, or one of them may be multiple. For example, one second substrate may be disposed for multiple first substrates, or multiple second substrates may be disposed for one first substrate.

[0022] The material of the first substrate and the second substrate is not particularly limited, and may be, for example, an inorganic material such as silicon, glass, metal, or carbon, an organic material such as resin, or a composite of an inorganic material and an organic material. The first and second substrates may be made of the same or different materials. From the standpoint of cost reduction, at least one of the first substrate and the second substrate may be a silicon wafer, or both the first substrate and the second substrate may be silicon wafers.

[0023] (filling process) In the filling step, the space formed between the first substrate and the second substrate is filled with a resin composition. The method for filling the space formed between the first and second substrates with the resin composition is not particularly limited, and may be, for example, a method according to an actual manufacturing method for electronic component devices. In the filling step, the space formed between the first substrate and the second substrate is filled with the resin composition, and the periphery of the first substrate or the second substrate may be coated with the resin composition. If necessary, the space formed between the first substrate and the second substrate may be filled with a resin composition, and then the resin composition may be cured.

[0024] (Evaluation process) The method for evaluating the state of the space filled with the resin composition is not particularly limited. For example, either the first substrate or the second substrate may be removed by polishing or the like to observe the state of the space filled with the resin composition, or a transparent material such as glass may be used for either the first substrate or the second substrate to observe without removing the first substrate or the second substrate. Alternatively, the state of the space filled with the resin composition may be evaluated without visual inspection using an ultrasonic flaw detector or the like. Specific evaluation items in the evaluation step include the presence or absence of unfilled parts, the filling speed, and the like. The results obtained in the evaluation process are used, for example, in selecting a resin composition to be used in the manufacture of electronic device components.

[0025] The type of resin composition evaluated by the method of the present embodiment is not particularly limited. In the present disclosure, a resin composition refers to a material that contains at least a resin. The resin in the resin composition may be a thermosetting resin. The thermosetting resin may be selected from epoxy resin, phenolic resin, urea resin, melamine resin, unsaturated polyester resin, urethane resin, silicone resin, and maleimide resin. In an embodiment, the thermosetting resin may be an epoxy resin.

[0026] The resin composition may contain components other than the resin, such as a filler, a curing agent, a curing accelerator, a coupling agent, an ion exchanger, a release agent, a flame retardant, and a colorant. The resin composition may be liquid at room temperature (25° C.) or may be solid at room temperature (25° C.). The resin composition that is liquid at room temperature may be used as an underfill material.

[0027] When the resin composition evaluated by the method of the present embodiment is used for manufacturing an electronic component device, the space filled with the resin composition in the electronic component device is not particularly limited. For example, the space filled with the resin composition in the electronic component device may be the space between an electronic component and a substrate, the space between electronic components, the space between a substrate and an intermediate substrate (interposer), the space between an intermediate substrate and an electronic component, etc.

[0028] <Electronic component device manufacturing method> A second embodiment of the present disclosure is Selecting a resin composition based on the results obtained by the above-mentioned resin composition evaluation method; and manufacturing an electronic component device using the selected resin composition.

[0029] In the method of the present embodiment, an electronic component device is manufactured using a resin composition selected based on the results obtained by the resin composition evaluation method. That is, the electronic component device according to the present embodiment is manufactured using a resin composition with excellent filling properties, and therefore has excellent reliability.

[0030] The resin composition is used, for example, to fill a space in an electronic component device. The space in the electronic component device to be filled with the resin composition may be a space between an electronic component and a substrate, a space between electronic components, a space between a substrate and an intermediate substrate (interposer), a space between an intermediate substrate and an electronic component, etc.

[0031] In the present embodiment, the resin composition used in the manufacture of the electronic component device may be one type or two or more types. When two or more types of resin compositions are used in the manufacture of the electronic component device, at least one type of resin composition is selected based on the results obtained by the above-mentioned method for evaluating the resin composition.

[0032] In the method of this embodiment, the method for manufacturing the electronic component device is not particularly limited and can be selected from known methods. In some embodiments, the method for manufacturing the electronic device may be wafer level packaging.

[0033] Examples of electronic component devices manufactured by the method of the present embodiment include devices obtained by mounting elements (active elements such as semiconductor chips, transistors, diodes, and thyristors, and passive elements such as capacitors, resistors, and coils) on a support member such as a lead frame, a pre-wired tape carrier, a wiring board, glass, a silicon wafer, or an organic substrate, and then sealing the resulting element portion with a resin composition. More specifically, typical resin-sealed ICs such as DIP (Dual Inline Package), PLCC (Plastic Leaded Chip Carrier), QFP (Quad Flat Package), SOP (Small Outline Package), SOJ (Small Outline J-lead package), TSOP (Thin Small Outline Package), and TQFP (Thin Quad Flat Package) have a structure in which an element is fixed on a lead frame, and terminal portions of the element such as bonding pads and lead portions are connected by wire bonding, bumps, or the like, and then sealed by transfer molding or the like using a resin composition; TCP (Tape Carrier Package) has a structure in which an element connected to a tape carrier by bumps is sealed with a resin composition; and COB (Chip On Board) has a structure in which an element is connected to wiring formed on a support member by wire bonding, flip chip bonding, solder, or the like, and sealed with a resin composition. Examples of such modules include ball grid arrays (BGAs), chip size packages (CSPs), and multi-chip packages (MCPs), which have a structure in which elements are mounted on the surface of a support member having terminals for connecting a wiring board formed on the back surface thereof, the elements are connected to wiring formed on the support member by bump or wire bonding, and the elements are then sealed with a resin composition.

[0034] <Structure> A third embodiment of the present disclosure is A structure for use in the above-mentioned resin composition evaluation method, a first substrate having a groove on one surface; and a second substrate disposed opposite the surface of the first substrate having the groove.

[0035] For details and preferred aspects of the first substrate and the second substrate used in the structure according to this embodiment, reference can be made to the details and preferred aspects of the first substrate and the second substrate used in the above-mentioned method for evaluating a resin composition.

[0036] <Method of manufacturing the structure> A fourth embodiment of the present disclosure is A method for producing a structure for use in the above-mentioned resin composition evaluation method, comprising the steps of: forming a groove on one surface of a first substrate; and disposing a second substrate so as to face the surface of the first substrate on which the grooves are formed.

[0037] For details and preferred aspects of the first substrate and the second substrate used in the structure according to this embodiment, reference can be made to the details and preferred aspects of the first substrate and the second substrate used in the above-mentioned method for evaluating a resin composition.

[0038] <Method of evaluating resin composition> A fifth embodiment of the present disclosure is forming a groove on one side of a substrate; filling a groove formed in a substrate with a resin composition; and evaluating the state of the groove filled with the resin composition.

[0039] The method of this embodiment differs from the method of the first embodiment in that the space formed between the first substrate and the second substrate is filled with the resin composition, in that the groove formed in the substrate is filled with the resin composition. For details and a preferred range of the substrate and the method for forming grooves in the substrate in this embodiment, reference can be made to the details and a preferred range of the first substrate and the method for forming grooves in the first substrate in the first embodiment. [Explanation of symbols]

[0040] 1: First board 2: Second board 10: Groove 20: Space

Claims

1. forming a groove on one surface of a first substrate; disposing a second substrate so as to face a surface of the first substrate on which the grooves are formed; filling a space formed between the first substrate and the second substrate with a resin composition; and evaluating the state of the space filled with the resin composition.

2. The method for evaluating a resin composition according to claim 1 for selecting a resin composition to be used in the manufacture of an electronic component device.

3. The method for evaluating a resin composition according to claim 1 , wherein the depth of the groove is 1 μm or more and 200 μm or less.

4. The method for evaluating a resin composition according to claim 1 , wherein the groove has a width of 1 μm or more and 200 μm or less.

5. The method for evaluating a resin composition according to claim 1 , wherein at least one of the first substrate and the second substrate is a silicon wafer.

6. The method for evaluating a resin composition according to claim 1 , wherein the groove is formed using a dicing blade.

7. The method for evaluating a resin composition according to claim 1 , wherein the resin composition is a liquid at room temperature.

8. Selecting a resin composition based on a result obtained by the method for evaluating a resin composition according to any one of claims 1 to 7; and manufacturing an electronic component device using the selected resin composition.

9. A structure for use in the method for evaluating a resin composition according to any one of claims 1 to 7, A first substrate having a groove on one surface; a second substrate disposed opposite the surface of the first substrate having the groove.

10. A method for producing a structure for use in the method for evaluating the resin composition according to any one of claims 1 to 7, comprising the steps of: forming a groove on one surface of a first substrate; and disposing a second substrate so as to face the surface of the first substrate on which the grooves are formed.

11. forming a groove on one side of a substrate; filling a groove formed in a substrate with a resin composition; and evaluating the condition of the groove filled with the resin composition.

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