Sheet for adiabatic board, method for manufacturing sheet for adiabatic board, adiabatic board and method for manufacturing adiabatic board

Abstract

To provide a sheet for an adiabatic board capable of obtaining an adiabatic board with excellent designability and incombustibility, and a method for manufacturing a sheet for an adiabatic board.SOLUTION: A sheet 10 for an adiabatic board has a metal foil 1, a design layer 2, a protective layer 3, and a release film 4 in this order in a thickness direction. A method for manufacturing a sheet for an adiabatic board has: a transfer sheet preparation step of preparing a transfer sheet having a release film and a transfer layer arranged on one side of the release film, where the transfer layer has, from the release film side, a protective layer and a design layer in this order in a thickness direction; and a bonding step of opposing one surface of a metal foil to a surface of the transfer sheet on a design layer side and bonding the two together.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a sheet for an insulation board and a method for producing the same, and to an insulation board and a method for producing the same. [Background technology]

[0002] Insulating materials are used for the purpose of energy saving in buildings, etc. Due to the instability of power supply and demand, the soaring energy prices, environmental considerations, etc., the use of insulating boards in buildings is expected to increase more than ever before, and insulating boards are required to have high insulating properties. For example, foam insulating materials such as rigid urethane foam are widely used as insulating materials contained in insulating boards.

[0003] Since foam insulation materials such as rigid urethane foam are flammable, there is a demand for flame retardancy. As a flame retardant technology, for example, a technology has been proposed for insulating boards having insulating material, in which a metal surface material such as aluminum foil is attached to one or both sides of the foam insulation material to increase the flame retardancy of the insulating board (for example, Patent Documents 1 to 4). The purpose of using metal foil in this way is to suppress the combustion of the insulating material by the heat shielding effect of the metal foil, etc.

[0004] In recent years, in order to ensure safety against earthquakes, etc., non-combustible insulating boards, which are lighter than gypsum boards, etc., are preferably used for interior materials such as ceilings and walls in some cases. Since such insulating boards for use in ceilings, walls, etc. are exposed to the living environment, they are required to have good design. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2021-084395 [Patent Document 2] JP 2021-162032 A [Patent Document 3] JP 2023-039769 A [Patent Document 4] JP 2023-041448 A Summary of the Invention [Problem to be solved by the invention]

[0006] For the above reasons, there is a demand for an insulation board with excellent design and non-combustibility, and it has been considered to place a surface material having a metal foil and a design layer on the surface of the insulation material. In addition, building materials are often required to have surface properties such as abrasion resistance and weather resistance. Therefore, the present inventors have considered using a sheet for insulation boards having a base sheet, a decorative sheet having a design layer and a protective layer, and a metal foil as a surface material for insulation boards. On the other hand, since the sheet for insulation boards including such a decorative sheet has a relatively thick base sheet, the organic mass due to the resin contained in the base sheet is large. Therefore, an insulation board having such a sheet for insulation boards as a surface material may have reduced non-combustibility.

[0007] The present disclosure has been made in consideration of the above-mentioned circumstances, and has as its main object to provide a sheet for an insulation board that can provide an insulation board having excellent designability and non-combustibility. [Means for solving the problem]

[0008] The present disclosure provides a sheet for a heat insulating board, which has a metal foil, a design layer, a protective layer, and a release film in this order in the thickness direction.

[0009] The present disclosure provides a method for manufacturing a sheet for an insulation board, the method comprising: a transfer sheet preparation step of preparing a transfer sheet having a release film and a transfer layer arranged on one side of the release film, the transfer layer having a protective layer and a design layer in that order in the thickness direction from the release film side; and a bonding step of opposing one side of a metal foil to the design layer side of the transfer sheet and bonding the two together.

[0010] The present disclosure provides an insulating board having an insulating material, a metal foil, a design layer, and a protective layer in this order in the thickness direction.

[0011] The present disclosure provides a method for manufacturing an insulation board, comprising: an integration step of obtaining an insulation board with a release film in which an insulation material and the above-mentioned insulation board sheet are integrated and the metal foil is arranged on the insulation material side; and a peeling step of peeling the release film from the insulation board with the release film. Effect of the Invention

[0012] The present disclosure has an effect of providing a sheet for an insulation board that can provide an insulation board having excellent design and non-combustibility. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic cross-sectional view illustrating a sheet for an insulation board according to the present disclosure. [Diagram 2] 1 is a schematic cross-sectional view illustrating a method for producing a sheet for an insulation board in the present disclosure. FIG. [Diagram 3] FIG. 1 is a schematic cross-sectional view illustrating an insulation board according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] The following describes the embodiments with reference to the drawings. However, the present disclosure can be implemented in many different forms and should not be limited to the description of the embodiments exemplified below. In addition, the drawings may show the width, thickness, and shape of each part in a schematic manner compared to the actual form in order to make the description clearer, but this is merely an example and should not be interpreted as being limiting.

[0015] In this specification, when describing a mode in which another component is disposed on a certain component, the term "above" or "below" includes both cases in which another component is disposed directly above or below the certain component so as to be in contact with the component, and cases in which another component is disposed above or below the certain component with another component interposed therebetween, unless otherwise specified. In addition, in this specification, when describing a mode in which another component is disposed on the surface of a certain component, the term "on the surface" includes both cases in which another component is disposed directly above or below the certain component so as to be in contact with the component, and cases in which another component is disposed above or below the certain component with another component interposed therebetween, unless otherwise specified.

[0016] Hereinafter, the sheet for an insulation board, the method for manufacturing the sheet for an insulation board, the insulation board, and the method for manufacturing an insulation board according to the present disclosure will be described in detail.

[0017] A. Sheet for heat insulation board 1(a), 1(b) and 1(c) are schematic cross-sectional views illustrating a sheet for a heat insulating board according to the present disclosure. As shown in FIG. 1(a), the sheet for a heat insulating board 10 according to the present disclosure includes a metal foil 1, a design layer 2, a protective layer 3 and a release film 4 arranged in a thickness direction D. T 1(b), the sheet for heat insulation board 10 of the present disclosure may have an adhesive layer 5 between the metal foil 1 and the design layer 2. As shown in FIG. 1(c), the sheet for heat insulation board 10 of the present disclosure may have, as the protective layer 3, a first protective layer 31 and a second protective layer 32 from the release film 4 side.

[0018] The sheet for heat insulating board in the present disclosure has a design layer, and thus has excellent design. Furthermore, the sheet for heat insulating board in the present disclosure is, for example, a sheet made using a transfer sheet having a release film, a protective layer, and a design layer, and has a smaller organic mass and excellent non-flammability compared to a surface material for heat insulating board made using a decorative sheet including a base sheet. The above-mentioned "non-flammable" refers to a property of being difficult to burn, and is a concept including so-called flame retardancy.

[0019] 1. Metal foil The sheet for insulation board in the present disclosure includes a metal foil. The metal foil is a layer that imparts a heat ray reflection function to the insulation board when the insulation board is constructed. In addition, the barrier effect of the metal foil can suppress leakage of insulation gas such as fluorine gas enclosed in the foam insulation material to the outside.

[0020] The thickness of the metal foil can be, for example, 5 μm or more, and preferably 7 μm or more. By making the thickness of the metal foil greater than or equal to the above value, the influence of pinholes can be suppressed, and the decrease in the heat shielding effect can be suppressed. On the other hand, the thickness of the metal foil can be, for example, 50 μm or less, and preferably 35 μm or less. By making the thickness of the metal foil less than or equal to the above value, weight reduction can be achieved, which is also preferable in terms of cost.

[0021] The metal foil is usually a metal (single element) or a metal alloy. The metal or metal alloy is preferably one having heat ray reflectivity that reflects near infrared rays or infrared rays, and is preferably, for example, aluminum, magnesium, silver, copper, titanium and their alloys, or stainless steel. Among them, aluminum foil, aluminum alloy foil, or stainless steel foil is preferable because of its good corrosion resistance. In particular, aluminum foil is more preferable because it has high heat ray reflectivity, moisture resistance, and gas barrier properties, good processability, low cost, and light weight.

[0022] Metal foils generally have oil on their surfaces due to manufacturing processes such as rolling. From the viewpoint of increasing the adhesive strength between the metal foil and the adhesive layer and between the metal foil and the insulating material, it is preferable that the amount of residual oil on the metal foil is small.

[0023] The metal foil is preferably a soft metal foil, since this provides good web handling properties and a small amount of residual oil, resulting in high adhesive strength. The metal foil preferably has a dyne number of 32 mN / m or more as determined by a wet tension check pen, since this improves the adhesive strength described above. As the wet tension check pen, for example, a film wet tension check pen manufactured by Pacific Chemical Co., Ltd. can be used.

[0024] In the present disclosure, the sheet for heat insulating board is preferably arranged so that the matte side of the metal foil is on the design layer side. This is because the matte side of the metal foil has a higher reflectance than the other side (glossy side), and therefore can effectively obtain the reflection effect of radiant heat. In other words, when the reflectance differs between the front and back of the metal foil, it is preferable that the side with the higher reflectance is the design layer side. The solar reflectance of the matte side of the metal foil is, for example, 70% or more, and may be 80% or more. On the other hand, the solar reflectance of the matte side is, for example, 95% or less, and may be 90% or less. The method for measuring the solar reflectance is the same as the method for measuring the solar reflectance of the sheet for heat insulating board described later.

[0025] The arithmetic mean roughness Ra of the matte surface of the metal foil is, for example, 0.1 μm or more, and may be 0.2 μm or more. On the other hand, the arithmetic mean roughness Ra of the matte surface of the metal foil is, for example, 1.0 μm or less, and may be 0.5 μm or less. On the other hand, the arithmetic mean roughness Ra of the glossy surface of the metal foil is, for example, 0.1 μm or less, and may be 0.05 μm or less. On the other hand, the arithmetic mean roughness Ra of the glossy surface of the metal foil is, for example, 0.01 μm or more.

[0026] The arithmetic mean roughness Ra is a value measured in accordance with JIS B0601:2001. A stylus-type surface roughness measuring instrument is used as the measuring device. The arithmetic mean roughness Ra is the average value of measurements taken at any 10 points.

[0027] The 60° gloss value of the matte side of the metal foil is, for example, 100 or more, and may be 120 or more. On the other hand, the 60° gloss value of the matte side of the metal foil is, for example, 170 or less, and may be 150 or less.

[0028] The 60° gloss value of the matte side of the metal foil is a value measured by the following method: The metal foil is placed on a non-glossy black mount with the matte side facing up, and the 60° specular gloss is measured using a gloss meter ("Micro Trigloss (model name)" manufactured by BYK Gardner) in accordance with Method 3 of JIS Z 8741:1997.

[0029] 2. Design layer The sheet for heat insulation board in the present disclosure has a design layer between the metal foil and the protective layer. By providing the design layer, the design of the heat insulation board is improved. The design layer and the protective layer may be arranged so as to be in direct contact with each other, or may be arranged via another layer. When the sheet for heat insulation board has an adhesive layer, the design layer is arranged, for example, between the adhesive layer and the protective layer.

[0030] Examples of the design layer include a solid layer (a layer coated with ink) and a pattern layer (a layer printed with ink). The sheet for heat insulating board may have, as the design layer, a pattern layer and a solid layer in this order from the release film side. Examples of the pattern in the pattern layer include wood grain, stone grain, sand grain, tiled pattern, brickwork pattern, cloth grain pattern, leather-squeezed pattern, geometric figures, letters, symbols, abstract patterns, and floral patterns.

[0031] The design layer usually contains a colorant and a binder resin. Examples of the colorant include inorganic pigments such as carbon black (ink), iron black, titanium white, antimony white, yellow lead, titanium yellow, red iron oxide, cadmium red, ultramarine blue, and cobalt blue, organic pigments (including dyes) such as quinacridone red, isoindolinone yellow, nickel azo complex, phthalocyanine blue, and azomethine azo black, metal pigments such as aluminum and brass, and pearl pigments such as titanium dioxide-coated mica and basic lead carbonate.

[0032] Examples of the binder resin include urethane resin, acrylic polyol resin, (meth)acrylic resin, ester resin, amide resin, butyral resin, styrene resin, urethane acrylic copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinyl acetate-acrylic copolymer, chlorinated propylene resin, nitrocellulose resin, and cellulose acetate resin. Among them, it is more preferable to use an acrylic polyol resin in combination with a urethane resin.

[0033] The indentation hardness of the cross section of the design layer is not particularly limited, but may be, for example, 100 MPa or more and 300 MPa or less, 120 MPa or more and 270 MPa or less, or 140 MPa or more and 250 MPa or less. If the indentation hardness of the cross section of the design layer is within the above range, for example, good weather-resistant adhesion can be obtained between the adhesive layer or the protective layer. The method for measuring the indentation hardness of the design layer is the same as the method described for the protective layer below.

[0034] The design layer may contain additives such as a hardener, an ultraviolet absorber, a light stabilizer, a plasticizer, and a catalyst, as necessary. When the design layer contains a hardener, the water resistance is improved. The thickness of the design layer is, for example, 0.5 μm or more and 20 μm or less, or may be 1 μm or more and 10 μm or less, or may be 2 μm or more and 5 μm or less.

[0035] 3.Protective layer The sheet for heat insulating board in the present disclosure has a protective layer between the release film and the design layer. The protective layer is preferably in contact with the release film. The protective layer contains, for example, a cured product of a curable resin. For example, the protective layer is composed of a cured product of a curable resin composition containing a curable resin. This can improve, for example, scratch resistance. The protective layer preferably contains a weathering agent. This improves weather resistance.

[0036] The protective layer may have a single layer structure or a multilayer structure. When a weathering agent is blended into the protective layer to impart high weather resistance, the adhesion between the protective layer and the design layer is likely to decrease. In the present disclosure, it is preferable to provide a first protective layer and a second protective layer from the release film side as the protective layer. In the present disclosure, it is preferable that both the first protective layer and the second protective layer contain a weathering agent. This makes it possible to impart high weather resistance while maintaining the characteristics required for the first protective layer (for example, surface characteristics such as scratch resistance) and the characteristics required for the second protective layer (for example, adhesion). The first protective layer and the second protective layer will be described in detail below.

[0037] 3.1 First protective layer The sheet for heat insulation board in the present disclosure preferably has a first protective layer as a protective layer. The first protective layer preferably contains a weathering agent. This contributes to improving weather resistance. Furthermore, the first protective layer also contributes to improving the surface properties (e.g., scratch resistance and stain resistance) of the heat insulation board. The first protective layer and the release film may be arranged so as to be in direct contact with each other, or may be arranged via another layer.

[0038] (1) Indentation hardness In the present disclosure, the indentation hardness of the cross section of the first protective layer is, for example, 50 MPa or more, may be 100 MPa or more, or may be 150 MPa or more. If the indentation hardness of the cross section of the first protective layer is low, good scratch resistance and abrasion resistance may not be obtained. On the other hand, the indentation hardness of the cross section of the first protective layer is, for example, 400 MPa or less, may be 300 MPa or less, or may be 250 MPa or less. If the indentation hardness of the cross section of the first protective layer is the above value or less, cracks can be suppressed when cutting the insulation board or when using the insulation board for construction (when driving screws or drilling piping holes). In addition, the second protective layer has good conformability to the first protective layer, and good weather-resistant adhesion can be obtained.

[0039] The indentation hardness of the first protective layer is preferably greater than the indentation hardness of the second protective layer.

[0040] The indentation hardness of the cross section of the first protective layer can be adjusted, for example, by the number of functional groups of the curable resin in the first curable resin composition for producing the first protective layer. For example, by reducing the number of functional groups of the ionizing radiation curable compound, the number of crosslinking points in the cured product of the first curable resin composition can be reduced, resulting in a more flexible structure and a lower indentation hardness.

[0041] The indentation hardness of the cross section of the first protective layer was a value obtained by measuring a cross-sectional sample piece prepared using a resin embedding method and a microtome according to the indentation hardness measuring method described below.

[0042] (Method of preparing cross-sectional sample pieces for measurement) The transfer sheet is cut to an arbitrary size to prepare a cut sample. The cut sample is embedded in resin (a room temperature curing type epoxy two-part curing resin) and left at room temperature for 24 hours or more to harden, thereby preparing an embedded sample in which the cut sample is embedded in resin (resin embedding method). The embedded sample is cut vertically using a microtome to expose the cross section of the layer to be measured, thereby preparing a cross-sectional sample piece for indentation hardness measurement. Specifically, a cross section is prepared in an environment of -120°C by using an ultramicrotome (Leica EM UC6, manufactured by Leica Microsystems) equipped with a freezing cutting system (Leica EM FC6, manufactured by Leica Microsystems) and a diamond knife, exposing the cross section of the layer to be measured. Compared to a cross section cut in an environment of room temperature, cross-sectional roughness can be suppressed, and a cross section suitable for indentation testing can be obtained. In particular, cross-sectional roughness can be suppressed in the case of soft materials.

[0043] (Method of measuring indentation hardness) In this specification, "indentation hardness" refers to hardness measured by nanoindentation, a method for continuously measuring the load and displacement during the process of pressing an indenter into a sample surface and unloading the surface, and calculating mechanical quantities from the obtained load-displacement curve.

[0044] Specifically, the indentation hardness in the cross section of the first protective layer is measured by pressing a Berkovich indenter (material: diamond triangular pyramid) perpendicularly into the cut surface of the above-mentioned measurement sample using the following nanoindenter. The measurement device and measurement conditions are as follows. Here, the position where the Berkovich indenter is pressed is preferably approximately the center in the thickness direction of the first protective layer. Approximately the center means that when the thickness of the first protective layer is defined as T [μm], the deviation from the center in the thickness direction of the first protective layer is within ±0.1 T. In addition, when fine particles such as a filler (e.g., silica) are contained in the layer, the Berkovich indenter is pressed into a position that avoids the fine particles.

[0045] Equipment used: Nanoindenter (TI 950 TriboIndenter, manufactured by BRUKER) Indenter used: Berkovich indenter (model number: TI-0039, manufactured by BRUKER) Push-in control method: Displacement control method (no lift operation) Maximum indentation depth: 100nm Push rate: 10nm / sec Loading time: 10 seconds (pushing from 0 to 100 nm) ·Holding time: 5 seconds (100nm constant) Unloading time: 10 seconds (100 nm → return to 0) Number of measurements: 5

[0046] The indentation hardness of the cross section of the first protective layer can be calculated as follows. First, the indentation depth h (nm) corresponding to the indentation load P (N) is continuously measured, and a load-displacement curve is created. The created load-displacement curve is analyzed to determine the maximum indentation load P max(N) is expressed as the projected area A (mm 2 ) is the indentation hardness H IT can be calculated (formula (1) below). H IT =P max / A …(1) Here, A is the contact projected area obtained by correcting the indenter tip shape using a standard sample of fused quartz in a standard manner.

[0047] In this specification, the indentation hardness at the cross section of the first protective layer is the arithmetic average value of five measurements of the same sample, with the position shifted. Each measurement is measured with a shift of 5 μm or more. During the measurement, in order to confirm that the correction of the indenter shape is correctly performed and that there are no problems with the operation and measurement of the device, it is preferable to confirm that the measurement is performed within ±5% of the reference value using fused quartz, which is the standard sample of the device manufacturer. The indentation hardness is measured in an atmosphere with a temperature of 23°C ±5°C and a humidity of 40% to 65%.

[0048] (2) Linear expansion coefficient The first protective layer in the present disclosure has a linear expansion coefficient of, for example, 3×10 -4 (1 / ℃) or less, and may be 1×10 -4 (1 / °C) or less.

[0049] The linear expansion coefficient is measured in accordance with JIS K 7179:1991. Specifically, a monolayer film (thickness 20 μm) of the layer to be evaluated is prepared. Next, the monolayer film is cut out to prepare a measurement sample with a length of 10 mm, a width of 5 mm, and a thickness of 20 μm. The prepared sample is set in a thermomechanical analyzer (e.g., TMA-60, manufactured by Shimadzu Corporation), and the linear expansion coefficient is measured under the following conditions. <Measurement conditions> Atmosphere gas: Nitrogen Load: 2g / 5mm Measurement mode: Tensile and temperature program Step 1: Raise the temperature to 30°C at a rate of 10°C / min, then hold at 30°C for 10 minutes. Step 2: Raise the temperature to 100°C at a rate of 5°C / min, then hold at 100°C for 1 minute. Step 3: Cool to 0℃ at -30℃ / min.

[0050] (3) Resin component The first protective layer contains, for example, a cured product (crosslinked structure) of the first curable resin composition. The cured product of the first curable resin composition preferably contains a (meth)acrylic component and a urethane component. The (meth)acrylic component refers to an acrylic component or a methacrylic component. The urethane component refers to a urethane bond. The proportion of the cured product of the first curable resin composition is, for example, 70% by mass or more, may be 90% by mass or more, may be 95% by mass or more, or may be 100% by mass, based on the total resin components constituting the first protective layer.

[0051] Examples of the first curable resin composition include an ionizing radiation curable resin composition and a heat curable resin composition. Examples of the ionizing radiation curable resin composition include an electron beam curable resin composition and an ultraviolet ray curable resin composition. Among these, an electron beam curable resin composition is preferred because it does not require a polymerization initiator, has little odor, and is less likely to cause coloring.

[0052] The ionizing radiation curable resin composition is a composition containing a compound having an ionizing radiation curable functional group (hereinafter also referred to as "ionizing radiation curable compound"). The ionizing radiation curable functional group is a group that crosslinks and cures when irradiated with ionizing radiation. The ionizing radiation curable resin composition preferably contains at least a compound having a (meth)acryloyl group. The (meth)acryloyl group refers to an acryloyl group or a methacryloyl group. The ionizing radiation curable resin composition may also contain a compound having a functional group having an ethylenic double bond, such as a vinyl group or an allyl group, in addition to the compound having a (meth)acryloyl group.

[0053] Ionizing radiation refers to electromagnetic waves or charged particle beams that have an energy quantum capable of polymerizing or crosslinking molecules. Examples of ionizing radiation include electron beams (EB) and ultraviolet rays (UV). Other examples of ionizing radiation include electromagnetic waves such as X-rays and gamma rays, and charged particle beams such as alpha rays and ion beams.

[0054] The ionizing radiation curable resin composition preferably contains at least a urethane (meth)acrylate as an ionizing radiation curable compound. (Meth)acrylate refers to acrylate or methacrylate. The ionizing radiation curable resin composition may further contain at least one of epoxy (meth)acrylate, polyester (meth)acrylate, polyether (meth)acrylate, polycarbonate (meth)acrylate, and acrylic (meth)acrylate as an ionizing radiation curable compound in addition to the urethane (meth)acrylate. The ionizing radiation curable resin composition preferably contains a caprolactone-based urethane (meth)acrylate as the urethane (meth)acrylate.

[0055] The ionizing radiation curable resin composition preferably contains a hydroxyl group-containing (meth)acrylate. Examples of the hydroxyl group-containing (meth)acrylate include hydroxyethyl acrylate, hydroxyethyl methacrylate, hydroxypropyl acrylate, hydroxypropyl methacrylate, hydroxybutyl acrylate, hydroxybutyl methacrylate, 1,4-cyclohexane dimethanol monoacrylate, polyethylene glycol monoacrylate, polyethylene glycol monomethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, glycidyl acrylate, glycidyl methacrylate, isocyanuric acid monoacrylate, isocyanuric acid monomethacrylate, isocyanuric acid diacrylate, isocyanuric acid dimethacrylate, glycerin diacrylate, and glycerin dimethacrylate. The hydroxyl group-containing (meth)acrylate may be a hydroxyl group-containing (meth)acrylate modified with ethylene oxide (EO), propylene oxide (PO), caprolactone, or the like.

[0056] The proportion of the hydroxyl group-containing (meth)acrylate in the ionizing radiation curable resin composition is, for example, 10% by mass or more and 90% by mass or less. If the proportion of the hydroxyl group-containing (meth)acrylate is low, the adhesion between the first protective layer and the second protective layer may decrease. If the proportion of the hydroxyl group-containing (meth)acrylate is high, the stain resistance of the first protective layer may decrease.

[0057] The number average molecular weight of the ionizing radiation curable compound is, for example, from 200 to 10,000, may be from 1,000 to 10,000, or may be from 2,000 to 10,000. The number average molecular weight is an average molecular weight measured by GPC analysis and converted into standard polystyrene.

[0058] For example, when the ionizing radiation curable compound is an ultraviolet ray curable compound, the ionizing radiation curable compound preferably contains at least one of a photopolymerization initiator and a photopolymerization accelerator. Examples of the photopolymerization initiator include acetophenone, benzophenone, α-hydroxyalkylphenone, Michler's ketone, benzoin, benzyl dimethyl ketal, benzoyl benzoate, α-acyloxime ester, acylphosphine oxide, and thioxanthones. Examples of the photopolymerization accelerator include p-dimethylaminobenzoic acid isoamyl ester and p-dimethylaminobenzoic acid ethyl ester.

[0059] The first curable resin composition may be a thermosetting resin composition. Details of the thermosetting resin composition are the same as those described in "3.2 Second Protective Layer" below.

[0060] (4) Weatherproofing agent The first protective layer preferably contains a weathering agent. Examples of the weathering agent include an ultraviolet absorbing agent and a light stabilizer. The first protective layer preferably contains at least one of an ultraviolet absorbing agent and a light stabilizer. The first protective layer may contain one or more ultraviolet absorbing agents. Similarly, the first protective layer may contain one or more light stabilizers.

[0061] Examples of the ultraviolet absorbing agent contained in the first protective layer include organic ultraviolet absorbing agents such as triazine-based ultraviolet absorbing agents, benzotriazole-based ultraviolet absorbing agents, benzophenone-based ultraviolet absorbing agents, oxybenzophenone-based ultraviolet absorbing agents, salicylic acid ester-based ultraviolet absorbing agents, and cyano(meth)acrylate-based ultraviolet absorbing agents, and inorganic ultraviolet absorbing agents such as titanium dioxide, cerium oxide, and zinc oxide. Among these, triazine-based ultraviolet absorbing agents are more preferable.

[0062] Examples of triazine-based ultraviolet absorbers include hydroxyphenyl triazine-based ultraviolet absorbers. Examples of hydroxyphenyl triazine-based ultraviolet absorbers include 2-(2-hydroxy-4-[1-octyloxycarbonylethoxy]phenyl)-4,6-bis(4-phenylphenyl)-1,3,5-triazine, 2-[4-[(2-hydroxy-3-dodecyloxypropyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2,4-bis[2-hydroxy-4-butoxyphenyl]-6-(2,4-dibutoxyphenyl)-1,3,5-triazine, azine, 2-[4-[(2-hydroxy-3-tridecyloxypropyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, 2-[4-[(2-hydroxy-3-(2'-ethyl)hexyl)oxy]-2-hydroxyphenyl]-4,6-bis(2,4-dimethylphenyl)-1,3,5-triazine, and 2-(4,6-diphenyl-1,3,5-triazin-2-yl)-5[2-(2-ethylhexanoyloxy)ethoxy]phenol.

[0063] The content of the ultraviolet absorbing agent contained in the first protective layer is, for example, 0.5 parts by mass or more and 10 parts by mass or less, 0.8 parts by mass or more and 8 parts by mass or less, or 1 part by mass or more and 5 parts by mass or less, relative to 100 parts by mass of the ionizing radiation curable compound. If the content of the ultraviolet absorbing agent is high, the ultraviolet absorbing agent may bleed out to the second protective layer side, and the adhesion with the second protective layer may decrease. If the content of the ultraviolet absorbing agent is low, sufficient ultraviolet absorbing performance may not be obtained.

[0064] The light stabilizer contained in the first protective layer may be, for example, a hindered amine light stabilizer. Examples of the hindered amine light stabilizer include 1,2,2,6,6-pentamethyl-4-piperidinyl methacrylate, bis(1,2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(2,2,6,6-pentamethyl-4-piperidyl)sebacate, bis(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidinyl)sebacate, and 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-tetramethylpiperidin-4-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazine).

[0065] The content of the light stabilizer in the first protective layer is, for example, 1 part by mass to 10 parts by mass, or may be 1.5 parts by mass to 8 parts by mass, or may be 2 parts by mass to 5 parts by mass, relative to 100 parts by mass of the ionizing radiation curable compound. If the content of the light stabilizer is high, bleeding out of the light stabilizer may occur, and if the content of the light stabilizer is low, sufficient light stability may not be obtained.

[0066] (5)Other The first protective layer may contain additives such as silicone compounds, polymerization inhibitors, crosslinking agents, antistatic agents, adhesion improvers, antioxidants, leveling agents, thixotropic agents, coupling agents, plasticizers, antifouling agents, defoamers, and fillers. The thickness of the first protective layer is, for example, 2 μm or more and 20 μm or less, 3 μm or more and 15 μm or less, or 4 μm or more and 7 μm or less. If the first protective layer is thin, sufficient weather resistance may not be obtained, and if the first protective layer is thick, the non-flammability of the insulation board may be reduced.

[0067] 3.2 Second protective layer The sheet for heat insulation board in the present disclosure preferably has a second protective layer as a protective layer. The second protective layer contributes to improving the adhesion between the first protective layer and the design layer. The second protective layer and the first protective layer may be arranged so as to be in direct contact with each other, or may be arranged via another layer.

[0068] (1) Indentation hardness In the present disclosure, the indentation hardness of the cross section of the second protective layer is, for example, 2 MPa or more, may be 5 MPa or more, or may be 10 MPa or more. On the other hand, the indentation hardness of the cross section of the second protective layer is, for example, 50 MPa or less, may be 40 MPa or less, or may be 30 MPa or less. If the indentation hardness of the cross section of the second protective layer is high, the adhesion (especially the initial adhesion) with the first protective layer may be reduced. Note that the method of preparing the cross section sample piece of the transfer sheet and the method of measuring the indentation hardness of the cross section of the second protective layer are the same as those described for the first protective layer above.

[0069] (2) Linear expansion coefficient The second protective layer in the present disclosure has a linear expansion coefficient of, for example, 5×10 -4 (1 / ℃) or less, and may be 4×10 -4 (1 / ° C.) or less. The method for measuring the linear expansion coefficient of the second protective layer is the same as that described above for the first protective layer.

[0070] (3) Resin The second protective layer contains, for example, a cured product (crosslinked structure) of the second curable resin composition. The cured product of the second curable resin composition preferably contains a (meth)acrylic component and a urethane component. The proportion of the cured product of the second curable resin composition is, for example, 70% by mass or more, may be 90% by mass or more, may be 95% by mass or more, or may be 100% by mass, based on the total resin components constituting the second protective layer.

[0071] The second curable resin composition may be, for example, a thermosetting resin composition. The thermosetting resin composition is a composition containing at least a thermosetting resin, and is a composition that is cured by heating. The thermosetting resin composition preferably contains at least a urethane (meth)acrylic resin as a thermosetting resin. The second curable resin composition may further contain at least one of a (meth)acrylic resin, a urethane resin, a phenolic resin, a urea melamine resin, an epoxy resin, an unsaturated polyester resin, and a silicone resin as a thermosetting resin in addition to the urethane (meth)acrylic resin. The thermosetting resin composition may further contain a curing agent such as an isocyanate curing agent or an epoxy curing agent.

[0072] In addition, when the second curable resin composition contains a urethane (meth)acrylic resin, the urethane (meth)acrylic resin is preferably a urethane (meth)acrylic copolymer, more preferably a polycarbonate-based urethane (meth)acrylic copolymer. The polycarbonate-based urethane (meth)acrylic copolymer is a resin obtained by radically polymerizing a (meth)acrylic monomer with a polycarbonate-based polyurethane polymer obtained by reacting a polycarbonate diol with a (di)isocyanate.

[0073] Examples of the (di)isocyanate include aromatic isocyanates such as 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 1,5-naphthalene diisocyanate, n-isocyanate phenylsulfonyl isocyanate, o-isocyanate phenylsulfonyl isocyanate, and p-isocyanate phenylsulfonyl isocyanate; aliphatic isocyanates such as 1,6-hexamethylene diisocyanate; and alicyclic isocyanates such as isophorone diisocyanate, hydrogenated xylylene diisocyanate, and hydrogenated diphenylmethane diisocyanate.

[0074] Examples of the (meth)acrylic monomer include (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, n-propyl (meth)acrylate, isopropyl (meth)acrylate, n-butyl (meth)acrylate, and isobutyl (meth)acrylate.

[0075] In the polycarbonate-based urethane (meth)acrylic copolymer, the mass ratio of the urethane component to the total of the (meth)acrylic component and the urethane component ([urethane component] / ([(meth)acrylic component]+[urethane component]) is, for example, 65% by mass or more and 95% by mass or less, and may be 70% by mass or more and 90% by mass or less. By setting the mass ratio to 65% by mass or more, the proportion of the polycarbonate structure in the polycarbonate-based urethane (meth)acrylic copolymer can be increased, and the structure of the polycarbonate-based urethane acrylic copolymer becomes more rigid. Therefore, the indentation hardness of the cross section of the second protective layer can be adjusted to a predetermined value or more. Furthermore, by setting the mass ratio to 95% by mass or less, the indentation hardness of the cross section of the second protective layer can be adjusted to a predetermined value or less.

[0076] (4) Weatherproofing agent The second protective layer preferably contains a weathering agent. Examples of weathering agents include an ultraviolet absorber and a light stabilizer. The second protective layer preferably contains at least one of an ultraviolet absorber and a light stabilizer. The preferred types and modes of the weathering agent are the same as those described in "3.1 First Protective Layer" above, and therefore will not be described here. In particular, the second protective layer preferably contains a triazine-based ultraviolet absorber. The second protective layer preferably contains a hindered amine-based light stabilizer.

[0077] The content of the ultraviolet absorber in the second protective layer is, for example, 0.1 parts by mass or more and 50 parts by mass or less, or may be 3 parts by mass or more and 40 parts by mass or less, or may be 10 parts by mass or more and 35 parts by mass or less, relative to 100 parts by mass of the resin component. The content of the ultraviolet absorber in the second protective layer (content relative to 100 parts by mass of the resin component) may be greater than the content of the ultraviolet absorber in the first protective layer (content relative to 100 parts by mass of the resin component).

[0078] The content of the light stabilizer in the second protective layer is, for example, 0.1 to 15 parts by mass, or 1 to 15 parts by mass, or 3 to 10 parts by mass, relative to 100 parts by mass of the resin component. The content of the light stabilizer in the second protective layer (content relative to 100 parts by mass of the resin component) may be greater than the content of the light stabilizer in the first protective layer (content relative to 100 parts by mass of the resin component).

[0079] (5)Other The second protective layer may contain additives such as silicone compounds, polymerization inhibitors, crosslinking agents, antistatic agents, adhesion improvers, antioxidants, leveling agents, thixotropic agents, coupling agents, plasticizers, antifouling agents, defoamers, and fillers. The thickness of the second protective layer is, for example, 1 μm or more and 10 μm or less, or may be 1 μm or more and 5 μm or less, or may be 1 μm or more and 2 μm or less. If the second protective layer is thick, the non-flammability of the sheet for heat insulation board may be reduced.

[0080] 4.Release film The transfer sheet in the present disclosure has a release film (first release film) on the side of the protective layer opposite the design layer. The release film and the protective layer may be arranged so as to be in direct contact with each other, or may be arranged via another layer.

[0081] The release film preferably contains a resin film, for example, an ester resin, an olefin resin, a styrene resin, a vinyl resin, a (meth)acrylic resin, an amide resin, an imide resin, or a carbonate resin.

[0082] The resin film preferably contains an ester-based resin or an olefin-based resin. Examples of ester-based resins include polyethylene terephthalate (PET), polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), and polyethylene terephthalate-isophthalate copolymers. Among these, PET or PBT is preferred, and PET is more preferred, from the viewpoint of being less susceptible to thermal shrinkage during the production of the transfer sheet and shrinkage due to irradiation with ionizing radiation.

[0083] Examples of olefin resins include polyethylene, polypropylene, polybutene, ethylene-propylene copolymer, and ethylene-propylene-butene copolymer. Among these, polypropylene is preferred from the viewpoint of being less susceptible to thermal shrinkage during the production of the transfer sheet and shrinkage due to irradiation with ionizing radiation.

[0084] The resin film may be a stretched film or may be an unstretched film. The stretch ratio in the machine direction (MD) of the stretched film is, for example, 5 times or more and 30 times or less. The stretch ratio in the width direction (TD) of the stretched film is, for example, 5 times or more and 30 times or less. The thickness of the release film is, for example, 10 μm or more, may be 30 μm or more, or may be 50 μm or more. By having the thickness of the release film in the above range, even if the thickness of the metal foil is thin, appearance defects are unlikely to occur during the integration process with the heat insulating material. In addition, when the metal foil is thin, the release film can be used as a carrier film. On the other hand, the thickness of the release film is, for example, 200 μm or less, may be 150 μm or less, or may be 100 μm or less.

[0085] As the release film in the present disclosure, a mirror film or a low gloss film can be used depending on the desired surface shape of the first protective layer.

[0086] When the release film is a low gloss film, the 60° gloss value of the first surface (S1 in FIG. 1(a)) located on the opposite side of the protective layer of the release film is not particularly limited, and may be, for example, 10 or more and may be 15 or more. On the other hand, it may be, for example, 120 or less and may be 110 or less.

[0087] In addition, the 60 ° gloss value of the second surface (S2 in FIG. 1 (a)) located on the protective layer side of the release film is, for example, 20 or less, may be 15 or less, may be 12 or less, or may be 10 or less. If the 60 ° gloss value of the second surface of the release film is the above value or less, the protective layer after the release film is peeled off will have a low gloss feeling. Therefore, for example, it can be preferably used for insulation boards for ceiling applications. On the other hand, the 60 ° gloss value of the second surface is, for example, 0.5 or more, may be 1.0 or more, or may be 5.0 or more. If the 60 ° gloss value of the second surface is low, the resin of the protective layer (for example, the first protective layer) may get into the fine matte shape, making peeling difficult. In addition, it may not be possible to form the desired shape.

[0088] The 60° gloss values ​​of the first and second sides of the release film are values ​​measured by the following method: The release film peeled off from the transfer sheet is placed on a non-glossy black mount with the first or second side facing up, and the 60° specular gloss of the first and second sides is measured using a gloss meter ("Micro Trigloss (model name)", manufactured by BYK Gardner) in accordance with Method 3 of JIS Z 8741:1997.

[0089] The arithmetic mean roughness Ra of the first surface of the release film is preferably smaller than the arithmetic mean roughness of the second surface described below. The arithmetic mean roughness Ra of the first surface is not particularly limited, but is, for example, 0.8 μm or less, may be 0.7 μm or less, or may be 0.5 μm or less.

[0090] The arithmetic mean roughness Ra of the first surface of the release film is a value measured using the following measuring device and conditions in a rectangular measurement area (1024 μm×768 μm) at any location on the first surface of the release film. Measurement equipment: Shape analysis laser microscope (VK-X1000, manufactured by Keyence Corporation) Objective lens: 50x Measurement mode: Shape measurement mode Measurement pitch: 12μm Measurement quality: High speed mode Scan mode: Laser confocal

[0091] In this specification, the arithmetic mean roughness Ra is the average value of measurements taken at any ten points.

[0092] The release film has an arithmetic mean roughness Ra of the second surface of, for example, 0.3 μm or more, and may be 0.4 μm or more. If the arithmetic mean roughness Ra of the second surface is low, the transfer layer after the release film is peeled off is less likely to exhibit a low gloss feeling. On the other hand, the arithmetic mean roughness Ra of the second surface may be, for example, 0.9 μm or less, and may be 0.8 μm or less. The arithmetic mean roughness Ra of the second surface is a value measured on the second surface of the release film using the same method as the method for measuring the arithmetic mean roughness Ra of the first surface.

[0093] The release film in the present disclosure is not particularly limited, and may be a single layer or may have a multi-layer structure. When the release film is a low-gloss film, for example, it is preferable that the release film has a film layer including the above-mentioned first surface and a matte layer that is disposed on the surface of the protective layer side of the film layer and includes the above-mentioned second surface.

[0094] (1) Film layer The film layer is not particularly limited as long as it has the above-mentioned first surface, but is preferably the above-mentioned resin film.

[0095] (2) Matte layer The mat layer is not particularly limited as long as it has the above-mentioned second surface, and may contain, for example, a resin component and particles as a matting agent. Hereinafter, a matting layer containing a resin component and particles as a matting agent is referred to as a first matting layer. The resin component in the first matting layer is typically a cured product (crosslinked structure) of a curable resin. On the other hand, the resin component may be a thermoplastic resin. In particular, the first matting layer preferably contains a cured product of a curable resin. When the first matting layer contains a cured product of a curable resin, the releasability from the first protective layer is improved.

[0096] When the second surface of the release film is the surface of the first matte layer, the above-mentioned 60° gloss value and arithmetic mean roughness Ra can be adjusted by selecting the type of particles, adjusting the average particle size and content, and the like.

[0097] Examples of the curable resin include ionizing radiation curable resins and thermosetting resins. Examples of the ionizing radiation curable resin include electron beam curable resins and ultraviolet ray curable resins.

[0098] The ionizing radiation curable resin (ionizing radiation curable compound) is not limited as long as it undergoes a crosslinking polymerization reaction upon irradiation with ionizing radiation and changes into a three-dimensional polymer structure. Examples of the ionizing radiation curable resin include prepolymers, oligomers, and monomers having polymerizable unsaturated bonds or epoxy groups in the molecule that can be crosslinked upon irradiation with ionizing radiation. In the present disclosure, only one type of ionizing radiation curable resin may be used, or two or more types may be used. Among them, it is preferable to use at least one of a polyfunctional monomer and an oligomer as the ionizing radiation curable resin.

[0099] Examples of ionizing radiation curable resins include (meth)acrylate-based resins such as urethane (meth)acrylate, ester (meth)acrylate, and epoxy (meth)acrylate; silicon-based resins such as siloxane; ester-based resins; and epoxy-based resins. (Meth)acrylate-based resins refer to acrylate-based resins or methacrylate-based resins.

[0100] The weight average molecular weight of the ionizing radiation curable resin is, for example, from 500 to 80,000, and may be from 1,000 to 50,000. The weight average molecular weight is a value measured by gel permeation chromatography (GPC) using polystyrene as a standard substance.

[0101] The ionizing radiation curable resin preferably contains at least a polyfunctional monomer or oligomer having a weight average molecular weight of at least 500. Examples of such polyfunctional monomers or oligomers include (meth)acrylate-based resins such as dipentaerythritol hexa(meth)acrylate, dipentaerythritol penta(meth)acrylate, urethane (meth)acrylate, ester (meth)acrylate, and epoxy (meth)acrylate.

[0102] On the other hand, examples of thermosetting resins include unsaturated ester resins, urethane resins (including two-component curing polyurethanes), epoxy resins, aminoalkyd resins, phenolic resins, urea resins, diallyl phthalate resins, melamine resins, guanamine resins, melamine urea co-condensation resins, silicon resins, and siloxane resins.

[0103] Examples of the particles include inorganic particles and synthetic resin particles. Examples of the inorganic particles include silica, alumina, calcium carbonate, magnesium carbonate, calcium sulfate, barium sulfate, and kaolin. Examples of the synthetic resin particles include acrylic beads, urethane beads, nylon beads, silicone beads, silicone rubber beads, polycarbonate beads, and polyolefin wax (e.g., polypropylene wax, polyethylene wax).

[0104] The average particle size of the particles is preferably 1.0 μm or more and 10 μm or less, and more preferably 2.0 μm or more and 8.0 μm or less.

[0105] The content of the particles in the first mat layer is preferably 3 parts by mass or more and 80 parts by mass or less, and more preferably 5 parts by mass or more and 60 parts by mass or less, based on 100 parts by mass of the resin component.

[0106] The first matte layer may contain additives such as a release agent, an ultraviolet absorber, an infrared absorber, a light stabilizer, a polymerization inhibitor, a crosslinking agent, an antistatic agent, an antioxidant, a leveling agent, a coupling agent, a plasticizer, an antifoaming agent, a filler, a thermal radical generator, an aluminum chelating agent, etc. The thickness of the first matte layer is not particularly limited, but is, for example, 0.1 μm or more and 10 μm or less.

[0107] The first matte layer can be obtained, for example, by applying a matte layer-forming ink containing a curable resin onto one surface of the film layer and curing the ink.

[0108] The mat layer may be, for example, a layer (second mat layer) having an uneven shape formed by irregular wrinkles on one side. The material and forming method of the release layer described in JP 2022-149930 A can be used as the material and forming method of such a second mat layer.

[0109] The first matte layer and the second matte layer may be formed on the entire surface of one side of the film layer, or may be formed on a partial area of ​​one side of the film layer. The entire surface of one side of the film layer refers to 90% or more of the area of ​​one side of the film layer. The matte layer may be arranged so as to cover 95% or more of one side of the film layer, or may be arranged so as to cover 100%. On the other hand, the matte layer may be arranged so as to cover 50% or less of one side of the film layer, or may be arranged so as to cover 40% or less, or may be arranged so as to cover 30% or less.

[0110] 5.Adhesive layer The sheet for heat insulation board in the present disclosure preferably has an adhesive layer between the metal foil and the design layer. Examples of the adhesive layer include an adhesive layer and a heat seal layer. That is, the sheet for heat insulation board in the present disclosure preferably has at least one of an adhesive layer and a heat seal layer between the metal foil and the design layer.

[0111] The adhesive component in the adhesive layer may be a general adhesive, and the type is not particularly limited. Examples of the adhesive include polyether adhesives, polyester adhesives, polyurethane adhesives, vinyl adhesives, (meth)acrylic adhesives, polyamide adhesives, epoxy adhesives, and rubber adhesives. The adhesive may be a one-component curing type or a two-component curing type. The adhesive layer may contain only one type of these adhesive components, or may contain two or more types.

[0112] The heat seal layer exhibits adhesiveness by heat. Examples of the resin contained in the heat seal layer include thermoplastic resins. Examples of the thermoplastic resin include (meth)acrylic resins, polyacrylic polyols, urethane resins, vinyl chloride resins, vinyl acetate resins, vinyl chloride-vinyl acetate copolymer resins, styrene-acrylic copolymer resins, acrylic-vinyl acetate copolymer resins, polyester resins, amide resins, cyanoacrylate resins, and epoxy resins, which can be used alone or in combination.

[0113] The glass transition temperature (Tg) of the (meth)acrylic resin is not particularly limited, but may be, for example, 90° C. or more and 150° C. or less, or 95° C. or more and 120° C. or less. The glass transition temperature (Tg) of the vinyl chloride-vinyl acetate copolymer resin is not particularly limited, but may be, for example, 50° C. or more and 85° C. or less, or 55° C. or more and 80° C. or less. When the heat seal layer contains a (meth)acrylic resin and a vinyl chloride-vinyl acetate copolymer resin, the ratio of the (meth)acrylic resin to the total of the (meth)acrylic resin and the vinyl chloride-vinyl acetate copolymer resin may be, for example, 30% by mass or more and 70% by mass or less, or 40% by mass or more and 60% by mass or less.

[0114] The thickness of the adhesive layer is, for example, 1 μm or more, preferably 2 μm or more. When the thickness of the adhesive layer is the above value or more, it is easy to improve the adhesion between the metal foil and the transfer sheet during the production of the sheet for heat insulation board. On the other hand, for example, it is 10 μm or less, preferably 4 μm or less. When the thickness of the adhesive layer is the above value or less, the non-flammability of the sheet for heat insulation board is improved. The thickness of the adhesive layer refers to the total thickness of the layers constituting the adhesive layer, and when the adhesive layer includes both the adhesive layer and the heat seal layer, it refers to the total thickness of the adhesive layer and the heat seal layer. The thickness of the adhesive layer is preferably 2 μm or more, and 4 μm or less.

[0115] The organic mass of the adhesive layer is, for example, 5 g / m 2 Less than or equal to 4 g / m 2 It may be less than 3 g / m 2 If the organic mass of the adhesive layer is large, the non-combustibility of the sheet for heat insulation board may be reduced. On the other hand, the organic mass of the adhesive layer may be, for example, 1 g / m or less. 2 That's all.

[0116] 6.Sheets for heat insulation boards (1) Thickness The thickness of the sheet for heat insulation board in the present disclosure is, for example, 40 μm or more, may be 60 μm or more, or may be 70 μm or more. If the thickness is too thin, it is likely to cause poor appearance during the integration process with the heat insulation material. Furthermore, at high temperatures, when stress is applied to the surface material due to the expansion of the insulating gas in the foamed insulation material or the thermal expansion of the foamed insulation material itself, cracks are likely to occur. On the other hand, the thickness of the sheet for heat insulation board is, for example, 120 μm or less, and may be 110 μm or less. If the thickness is too thick, it is disadvantageous in terms of cost. In the present disclosure, the "thickness of the sheet for heat insulation board" refers to the total thickness of the layers constituting the sheet for heat insulation board, including the thickness of the release film.

[0117] The total thickness of the layers present between the metal foil and the release film of the sheet for heat insulation board is preferably 15 μm or less, and more preferably 12 μm or less. On the other hand, for example, it is 5 μm or more, and preferably 10 μm or more. The total thickness of the layers present between the metal foil and the release film is the total thickness of the protective layer, the design layer, and the adhesive layer when the sheet for heat insulation board includes an adhesive layer. When the sheet for heat insulation board does not include an adhesive layer, it is the total thickness of the protective layer and the design layer. If the total thickness of the layers present between the metal foil and the release film is large, the non-combustibility of the sheet for heat insulation board may be reduced.

[0118] (2) Arithmetic mean roughness Ra In the sheet for heat insulating board of the present disclosure, the arithmetic mean roughness Ra of the protective layer surface after peeling off the release film is, for example, 0.3 μm or more, and may be 0.4 μm or more. If the arithmetic mean roughness Ra of the protective layer surface is low, it is difficult to express a low gloss feeling. On the other hand, the arithmetic mean roughness Ra of the protective layer surface may be, for example, 0.9 μm or less, and may be 0.8 μm or less. The arithmetic mean roughness Ra of the protective layer surface is measured by the same method as the method for measuring the arithmetic mean roughness Ra of the first surface of the release film.

[0119] (3) Solar reflectance The solar reflectance of the sheet for heat insulating board according to the present disclosure measured from the protective layer side after removing the release film varies depending on the design of the design layer, but may be, for example, 20% or more and 40% or less, or, for example, 65% or more and 86% or less.

[0120] The solar reflectance of the sheet for heat insulation board in the present disclosure after the release film is peeled off is a value measured by the following measurement method. Using a UV-Vis-Near-Infrared Spectrophotometer UH4150 (manufactured by Hitachi High-Technologies), the spectral reflectance is measured from the protective layer side at an incident angle of 10°. Using the obtained data, the solar reflectance in the wavelength range of 780 to 2500 nm in accordance with JIS K 5602:2008 is calculated.

[0121] (4) 60° gloss value The sheet for heat insulation board in the present disclosure has a 60° gloss value measured from the release film side of, for example, 10 or more, and may be 15 or more. On the other hand, it may be, for example, 120 or less, and may be 110 or less. In the present disclosure, the 60° gloss value measured from the release film side is a value measured by the following method. The sheet for heat insulation board is placed with the release film side facing up, and the 60° specular gloss is measured from the release film side using a glossmeter in accordance with Method 3 of JIS Z 8741:1997. The 60° gloss value is the average value of the measured values ​​at any 10 points.

[0122] In the sheet for heat insulating board according to the present disclosure, the 60° gloss value measured from the protective layer side after peeling off the release film is, for example, 20 or less, or may be 15 or less, or may be 12 or less, or may be 10 or less. If the 60° gloss value measured from the protective layer side is the above value or less, the protective layer exhibits a low gloss. On the other hand, for example, it is 0.5 or more, or may be 1.0 or more, or may be 5.0 or more.

[0123] (5)Organic mass From the viewpoint of non-combustibility, it is preferable that the organic mass of the surface material for the insulation board (excluding the organic mass of the release film) is small. The total organic mass of the layer between the metal foil and the release film of the surface material for the insulation board in the present disclosure is 19 g / m 2 It is preferable that the thickness is less than 15 g / m 2 On the other hand, the organic mass of the surface material for the heat insulating board is, for example, 10 g / m 2 The organic mass is measured, for example, by a pyrogenicity test based on ISO 5660-1.

[0124] The sheet for a thermal insulation board according to the present disclosure is, for example, wound into a roll for storage and transportation. Furthermore, the sheet for a thermal insulation board according to the present disclosure is usually attached to a thermal insulation material before use.

[0125] B. Manufacturing method of sheets for thermal insulation boards 2(a), 2(b) and 2(c) are schematic cross-sectional views illustrating a method for manufacturing a sheet for a heat insulating board according to the present disclosure. First, as shown in FIG. 2(a), a transfer sheet 20 is prepared (transfer sheet preparation step). The transfer sheet 20 has a release film 4 and a transfer layer 21 arranged on one side of the release film 4. The transfer layer 21 transfers the protective layer 3 and the design layer 2 from the release film 4 side in the thickness direction D. T 2(b), one side of the metal foil 1 and the side of the transfer sheet 20 facing the design layer 2 are placed opposite each other and brought into close contact (adhesion process). The "side of the transfer sheet 20 facing the design layer 2" refers to the side of the transfer sheet 20 that is located on the design layer 2 side when the release film 4 is used as a reference. This allows the metal foil 1, the design layer 2, the protective layer 3 and the release film 4 to be aligned in the thickness direction D T In this order, a sheet for a heat insulating board 10 having the above-mentioned components is obtained. In the adhesion step, an adhesive layer 5 may be interposed between one surface of the metal foil 1 and the surface of the transfer sheet 20 facing the design layer 2, as shown in Fig. 2(c). The release film 4 is peeled off, for example, after the sheet for a heat insulating board and the heat insulating material are integrally processed.

[0126] 1. Preparation process The preparation step in the present disclosure is a step of preparing a transfer sheet having a release film and a transfer layer disposed on one side of the release film. The transfer layer has a protective layer and a design layer in this order in the thickness direction from the release film side. The transfer layer may have an adhesive layer on the side of the design layer opposite the protective layer. On the other hand, the transfer layer may not have an adhesive layer. The release film, protective layer, design layer, and adhesive layer are the same as those described above, so their explanations are omitted here.

[0127] The concealment rate of the metal foil by the transfer layer is, for example, 80% or more, may be 85% or more, or may be 90% or more. On the other hand, the concealment rate of the metal foil is, for example, 100%, or may be less than 100%. Depending on the application of the surface material for the insulation board, it is preferable that the concealment rate of the metal foil by the transfer layer is high.

[0128] The hiding rate in the present disclosure is measured as follows. 1) Cut the transfer sheet to the specified size for the area where you want to measure the coverage rate. 2) Apply tape to the top edge of the transfer surface (the surface on the design layer side) of the cut transfer sheet, and peel the transfer layer from the release film. Then, remove the tape to obtain a single transfer layer. 3) The transfer layer is placed on a single layer on a hiding ratio test paper conforming to JIS K 5600-4-1, and the tristimulus values ​​YW and YB are measured using a spectrophotometer (Konica Minolta spectrophotometer CM-3700A), and the hiding ratio YB / YW is calculated as a percentage.

[0129] The transfer sheet in the present disclosure may have a second release film on the surface of the transfer layer on the design layer side. For example, when the transfer sheet is wound into a roll and manufactured, the occurrence of blocking can be suppressed. The second release film is usually peeled off from the transfer sheet before the adhesion process described below. Details of the second release film are the same as those described for the first release film above, so the description here is omitted.

[0130] The manufacturing method of the transfer sheet in the present disclosure is not particularly limited, but an example thereof includes a method in which a first protective layer is formed on the surface of a release film, then a second protective layer is formed on the surface of the first protective layer opposite the release film, and then a design layer is formed on the surface of the second protective layer opposite the first protective layer.

[0131] The method for forming the first protective layer may be, for example, a method of applying a composition for forming the first protective layer to the surface of a release film and curing the composition. The method for applying the composition may be, for example, a gravure printing method, a bar coating method, a roll coating method, a reverse roll coating method, or a comma coating method. The curing method may be, for example, a method of irradiating ionizing radiation such as an electron beam or ultraviolet light.

[0132] The method for forming the second protective layer may, for example, be a method of applying a composition for forming the second protective layer to the surface of the first protective layer opposite to the release film, and curing it as necessary. The method for applying the composition may, for example, be a gravure printing method, a bar coating method, a roll coating method, a reverse roll coating method, or a comma coating method. The curing method may, for example, be heat. The method for forming the design layer may, for example, be a method of applying an ink containing a colorant, a binder resin, and a solvent to the surface of the second protective layer opposite to the first protective layer.

[0133] 2. Adhesion process The adhesion step in the present disclosure is a step of bringing one side of the metal foil and the design layer side of the transfer sheet into contact with each other and adhering them together. When bringing the transfer sheet and the metal foil into contact with each other, they may be arranged so as to be in direct contact with each other, or may be arranged with another layer interposed therebetween.

[0134] For example, at least one of an adhesive layer and a heat seal layer may be disposed between the two as an adhesive layer. In this case, the total thickness of the transfer layer and the adhesive layer is, for example, 10 μm or more, and may be 12 μm or more. If the total thickness of the transfer layer and the adhesive layer is thin, sufficient weather resistance may not be obtained. On the other hand, the total thickness of the transfer layer and the adhesive layer is, for example, 15 μm or less, and may be 13 μm or less. If the transfer layer is thick, the non-flammability of the sheet for insulation board may be reduced.

[0135] The adhesion step preferably includes an adhesive layer forming process for forming at least one of an adhesive layer and a heat seal layer, and an adhesion process for adhering the transfer sheet, the adhesive layer, and the metal foil. The adhesion step preferably includes a supply process for supplying the transfer sheet from a transfer sheet roll before the adhesive layer forming process. The roll-shaped transfer sheet usually does not have an adhesive layer.

[0136] When the adhesive layer is an adhesive layer, in the adhesive layer forming process, the adhesive layer may be formed by applying a coating liquid for the adhesive layer to the surface of the transfer sheet facing the design layer. In this case, there is an advantage that the coating liquid for the adhesive layer can be uniformly applied to the transfer sheet. On the other hand, in the adhesive forming process, the adhesive layer may be formed by applying a coating liquid for the adhesive layer to the surface of the metal foil.

[0137] When the adhesive layer is a heat seal layer, in the adhesive layer forming process, the heat seal layer composition may be applied to the surface of the transfer sheet on the design layer side to form a heat seal layer. On the other hand, in the adhesive forming process, the heat seal layer composition may be applied to the surface of the metal foil to form a heat seal layer. The method of forming the heat seal layer is not limited to the above, and may include, for example, a method of laminating a film that has been previously manufactured with an adhesive. For example, the adhesive used for the adhesive layer described above may be used as the adhesive.

[0138] In the adhesion treatment, the method of adhering the transfer sheet and the metal foil includes, for example, a lamination method. In the lamination method, for example, a laminate having the transfer sheet and the metal foil is heated and pressed from the transfer sheet side. For example, the method of heating and pressing includes a method using a roll transfer device. The roll temperature of the roll transfer device is, for example, 200°C or less, and may be 180°C or less. If the roll temperature is high, the transfer sheet may be softened more than necessary. On the other hand, the roll temperature of the roll transfer device is, for example, 100°C or more, may be 110°C or more, or may be 120°C or more.

[0139] C. Insulation board 3(a) and 3(b) are schematic cross-sectional views showing an example of a heat insulating board according to the present disclosure. The heat insulating board 100 according to the present disclosure is a board in which a heat insulating material 50, a metal foil 1, a design layer 2, and a protective layer 3 are arranged in a thickness direction D. T In this order, the insulation board 10 may be an insulation board with a release film having a release film 4 on the surface of the protective layer 3 opposite the design layer 2, as shown in Fig. 3(a), or may be an insulation board without a release film, as shown in Fig. 3(b). The insulation board in the present disclosure preferably has an adhesive layer between the metal foil and the design layer.

[0140] The heat insulating board of the present disclosure has a metal foil 1, a design layer 2 and a protective layer 3 on at least one surface of a heat insulating material in a thickness direction D T Since the components are arranged in this order, the insulation board has good design and excellent non-combustibility. Each component of the insulation board according to the present disclosure will be described below.

[0141] 1. Thermal insulation The heat insulating material is, for example, in the form of a plate. The plate shape refers to a thin, flat shape having two opposing surfaces and a peripheral side surface connecting the two surfaces.

[0142] A preferred example of the heat insulating material is a foam heat insulating material. The foam heat insulating material has a higher combustibility than gypsum board and the like, and therefore the sheet for heat insulating board of the present disclosure can be suitably used. In addition, since the foam heat insulating material is lightweight, when used in a ceiling or the like, the risk of the ceiling falling can be reduced. The foam heat insulating material is composed of a rigid material having heat insulating properties. As the foam heat insulating material, a foam heat insulating material generally used in heat insulating boards can be used, and examples thereof include rigid urethane foam and phenol foam. Examples of the heat insulating gas enclosed in the internal bubbles include fluorocarbon gases such as CFC (chlorofluorocarbon), HCFC (hydrochlorofluorocarbon), and HFC (hydrofluorocarbon).

[0143] Rigid urethane foam is mainly formed by the reaction of hydroxyl group (OH group) with isocyanate group, and includes isocyanurate foam, which is generally included in the definition of rigid urethane foam. Rigid urethane foam can be formed, for example, using a polyol compound having a hydroxyl group (OH group), an isocyanate compound having an isocyanate group, and a foaming agent. The polyol compound is not particularly limited, and for example, polyether polyol, polyester polyol, polyether ester polyol, etc. can be used. The polyol compound may be used alone or in combination of two or more. For example, an aliphatic or aromatic polyisocyanate having two or more isocyanate groups, a mixture thereof, and a modified polyisocyanate obtained by modifying them can be used as the isocyanate compound.

[0144] The phenolic foam can be formed using, for example, a phenolic resin, a foaming agent, and a hardener.

[0145] The foaming agent may be, for example, a fluorine-based foaming agent. Specifically, a fluorocarbon material with low thermal conductivity, particularly a hydrofluorocarbon (HFC) material, may be used. The raw material for the foam insulation may contain, for example, a catalyst, an additive, a flame retardant, etc.

[0146] As the insulating material, materials other than foam insulating materials such as wood veneer, plywood, and particle board, and FRP (fiber reinforced plastic) can also be used.

[0147] The shape of the heat insulating material in a plan view is not particularly limited, and it can be cut into any shape, such as a rectangle, a polygon, or a circle, for use.

[0148] 2. Metal foil, design layer, protective layer and adhesive layer The metal foil, the design layer, the protective layer and the adhesive layer have been described in detail in the above section "A. Sheet for Insulation Board", so a detailed description will be omitted here. As shown in Figures 3(a) and 3(b), the metal foil 1, the design layer 2 and the protective layer 3 constitute the surface material of the insulation board. The surface material may be disposed on one of the main surfaces of the insulation material. It may also be disposed on both main surfaces of the insulation material.

[0149] 3.Insulation board In the insulation board of the present disclosure, the above-mentioned surface material may be disposed on at least one surface of the insulation material. For example, (i) the above-mentioned surface material may be disposed on both surfaces of the insulation material, (ii) the above-mentioned surface material may be disposed on one surface of the insulation material and the other surface of the insulation material may be exposed, or (iii) the above-mentioned shielding surface material may be disposed on one surface of the insulation material and another surface material may be disposed on the other surface of the insulation material.

[0150] As the other surface materials, surface materials generally used for insulating boards can be used, such as glass paper, plastic sheets, moisture-proof paper, calcium carbonate paper, resin-impregnated paper, coated paper, nonwoven fabric, etc.

[0151] 4.Other In order to evaluate non-combustible materials under the Building Standards Act, heat generation tests are conducted on insulation boards using a cone calorimeter conforming to ISO5660-1:2015. A cone calorimeter is a device that heats a sample with a cone-shaped heater, ignites it with a spark igniter, burns it, and measures the oxygen concentration in the generated gas. The cone calorimeter can measure the total heat generation amount, maximum heat generation rate, burning time from ignition to extinguishing, mass retention (mass percentage after the test based on the mass before the test), etc., to evaluate flammability.

[0152] In the heat-generating test based on ISO5660-1, the heat-insulating board in the present disclosure is preferably a flame-retardant material based on the Building Standards Act, more preferably a semi-noncombustible material, and even more preferably a noncombustible material. Specifically, the amount of heat generated during heating is measured using a cone calorimeter, and the heating time that satisfies all of the following conditions (i) to (iii) is measured. If the heating time is 5 minutes or more, it is a flame-retardant material, if it is 10 minutes or more, it is a semi-noncombustible material, and if it is 20 minutes or more, it is a noncombustible material. The heat-insulating board in the present disclosure is preferably a noncombustible material. (i) Total calorific value is 8 MJ / m 2 Is less than or equal to (ii) The maximum heat release rate is 200 kW / m for more than 10 seconds continuously. 2 Not to exceed (iii) There are no cracks or holes that penetrate to the back surface and are harmful to fire resistance.

[0153] 5.Applications The heat insulating board of the present disclosure can be used as a building material that requires heat insulation, non-combustibility and design. The building material may be an interior member or an exterior member. Examples of the interior member include ceilings, walls, floors, etc. of buildings such as houses, office buildings, gymnasiums, indoor pools, stores, hospitals, etc. Examples of the exterior member include eaves ceilings, exterior walls, roofs, etc. of buildings. In particular, the heat insulating board of the present disclosure is lighter than gypsum board, and therefore can be preferably used for, for example, the ceiling of a building. This is because the risk of the ceiling falling can be reduced. Furthermore, the heat insulating board of the present disclosure has good weather resistance, and therefore can be preferably used for, for example, window ceilings and eaves ceilings.

[0154] D. Manufacturing method of insulation board The method for manufacturing an insulation board in the present disclosure includes an integration step of obtaining an insulation board with a release film in which an insulation material and the above-mentioned insulation board sheet are integrated and the metal foil is arranged on the insulation material side, and a peeling step of peeling the release film from the insulation board with the release film.

[0155] According to the present disclosure, by using the above-mentioned sheet for insulation board, an insulation board having excellent design and non-combustibility can be easily manufactured.

[0156] 1.Integration process In this process, the insulating material and the above-mentioned sheet for insulating board are integrated, and an insulating board with a release film is obtained in which the metal foil is arranged on the insulating material side. For example, this process can be performed in the following ways: 1) a method in which the insulating material and the sheet for insulating board are integrated at the same time as the foam insulating material is formed, and 2) a method in which the foam insulating material and the sheet for insulating board are prepared separately and then bonded together with an adhesive or the like.

[0157] The above "1) integrated foaming method" can be carried out in a continuous molding line. For example, the raw material of the foamed insulation material is discharged onto the metal foil side of the sheet for insulation board being conveyed to form a raw material layer of the foamed insulation material, while the other sheet for insulation board is supplied and arranged on the opposite side of the raw material layer to the sheet for insulation board side so that the metal foil side faces. Next, the two sheets for insulation board are heated, for example, to 120°C in a state of contact with the raw material layer to foam and harden, and a foamed insulation material is formed from the raw material layer. Thereby, the insulation material and the above-mentioned sheet for insulation board are integrated at the same time as the foamed insulation material is formed. The closed cell ratio of the foamed insulation material is preferably 10% or more and 40% or less. The closed cell ratio in the present invention is a value measured in accordance with ASTM D 2856. The rigid urethane foam used in the foamed insulation has self-adhesiveness and is bonded to the surface material by the integrated foaming method. In addition, a general adhesive may be used on the surface of the surface material that contacts the foamed insulation material in order to improve adhesion.

[0158] As the adhesive used in the above-mentioned "2) method of separately preparing a foam insulation material and a sheet for an insulation board and bonding them together", any adhesive known in the art can be used.

[0159] 2. Peeling process This step is a step of peeling off the release film from the insulation board with the release film, thereby obtaining an insulation board having the insulation material, the metal foil, the design layer, and the protective layer in this order in the thickness direction.

[0160] E.Other In the present disclosure, a transfer sheet for producing a sheet for heat insulation board can be provided, which has a design layer, a protective layer, and a release film in this order in the thickness direction. The transfer sheet in the present disclosure has the design layer, protective layer, and release film described in "A. Sheet for Heat Insulation Board" in this order in the thickness direction. The sheet for heat insulation board described above is produced by facing the design layer side of the transfer sheet in the present disclosure and one side of the metal foil and adhering them together. With such a transfer sheet, it is possible to produce a sheet for heat insulation board that can produce an insulation board with excellent design and non-combustibility for the reasons described above.

[0161] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and anything that has substantially the same configuration as the technical idea described in the claims of the present disclosure and exhibits similar effects is included in the technical scope of the present disclosure. EXAMPLES

[0162] [Example 1] (Preparation of transfer sheet) A release PET film (thickness 50 μm, Ra of the second surface: 0.40 μm, 60° gloss value: 16) including a first matte layer was prepared as the release film. The following resin composition for forming the first protective layer was applied to the surface of the release PET film on the first matte layer side to form an uncured resin layer. Then, the film was irradiated with 50 kGy of electron beams at an acceleration voltage of 165 kV to cure the film, forming a first protective layer having a thickness of 6 μm.

[0163] <Resin composition for forming first protective layer> ·Ionizing radiation curable resin composition: 100 parts by mass Caprolactone-based urethane acrylate (urethane oligomer, molecular weight approximately 8000): 30 parts by mass Pentaerythritol triacrylate (hydroxyl group-containing acrylate, molecular weight 369): 70 parts by mass Triazine-based UV absorber: 3.5 parts by weight (3 parts by weight of "Tinuvin479" (manufactured by BASF), 0.5 parts by weight of "ADEKA STAB LA-46" (manufactured by ADEKA Corporation) Light stabilizer: 3 parts by weight (Product name: LS-3410, manufactured by Nippon Nyukazai Co., Ltd.)

[0164] Next, the resin composition for forming the second protective layer described below was applied by gravure coating onto the surface of the obtained first protective layer, and dried to form a second protective layer having a thickness of 2 μm. <Resin composition for forming second protective layer> Polycarbonate-based urethane acrylic copolymer: 100 parts by weight (Urethane component / acrylic component = 90 / 10 (mass ratio)) Triazine-based UV absorber: 35 parts by weight (20 parts by weight of "Tinuvin 479" (manufactured by BASF), 15 parts by weight of "Tinuvin 400" (manufactured by BASF)) Light stabilizer: 3.5 parts by weight ("Tinuvin 123" (BASF)) Hexamethylene diisocyanate hardener: 6 parts by weight

[0165] Next, a pattern ink containing a resin component containing an acrylic polyol resin and a urethane resin and an organic pigment was applied to the surface of the obtained second protective layer by gravure coating, and dried to form a pattern layer. Furthermore, a solid ink containing a resin component containing an acrylic polyol resin and a urethane resin and an inorganic pigment was applied to the surface of the pattern layer by gravure coating, and dried to form a solid layer. The total thickness of the design layer including the solid layer and the pattern layer was 3 μm. As a result, a transfer sheet having a release film, a first protective layer, a second protective layer, a pattern layer, and a solid layer in this order in the thickness direction was obtained. Furthermore, the resin composition for forming the heat seal layer described below was applied to the surface of the design layer side of the transfer sheet, and dried to form a heat seal layer with a thickness of 2 μm. As a result, a transfer sheet with a heat seal layer having a release film, a first protective layer, a second protective layer, a pattern layer, a solid layer, and a heat seal layer in this order in the thickness direction was obtained.

[0166] <Resin composition for forming heat seal layer> Mixture of vinyl chloride-vinyl acetate copolymer (Tg: approx. 65°C) / acrylic resin (Tg: approx. 100°C): 100 parts by weight (Vinyl chloride / acrylic component = 50 / 50 (mass ratio)) Solvent: appropriate amount (Methyl ethyl ketone)

[0167] In the examples, as a verification experiment, the non-combustibility and design of the insulation board were evaluated by bonding an insulation base material having aluminum foil to the above-mentioned transfer sheet.

[0168] (Insulation board manufacturing) A heat insulating material (urethane foam insulation material) and a heat insulating substrate 1 (Thermax SIII, manufactured by Inoac Corporation, thickness 30 mm) having aluminum foil arranged on the surface of the heat insulating material were prepared. The heat seal layer surface of the transfer sheet with the heat seal layer was placed opposite the heat insulating substrate 1, and a laminator was used to heat and press from the transfer sheet side to adhere the transfer sheet, heat seal layer and heat insulating substrate. As a result, a heat insulating board having a configuration of urethane foam insulation material / aluminum foil / heat seal layer (2 μm) / design layer / second protective layer / first protective layer / release film was obtained. The total thickness of the heat seal layer, design layer and protective layer (first protective layer and second protective layer) (total decorative layer thickness in Table 1) was 13 μm. The total organic mass in the heat seal layer, design layer and protective layer (first protective layer and second protective layer) is also shown in Table 1.

[0169] [Example 2] (Insulation board manufacturing) The surface of the design layer of the transfer sheet (transfer sheet before the heat seal layer is formed) in Example 1 and the above-mentioned heat insulating substrate 1 were arranged so as to face each other through the adhesive layer 1 having a thickness of 2 μm. The adhesive layer 1 was formed by applying a urethane-based two-liquid curing adhesive (containing 5 parts by mass of polyisocyanate curing agent relative to 100 parts by mass of the main agent, and containing the same amount of ethyl acetate as the main agent as a dilution solvent). Next, the transfer sheet, the adhesive layer 1 and the heat insulating substrate were adhered to each other. As a result, a heat insulating board having a configuration of foamed urethane insulation material / aluminum foil / adhesive layer 1 (2 μm) / design layer / second protective layer / first protective layer / release film was obtained. The total thickness of the adhesive layer 1, the design layer and the protective layer (first protective layer and second protective layer) (total thickness of the decorative layer in Table 1) was 13 μm. The total organic mass in the adhesive layer 1, the design layer and the protective layer (first protective layer and second protective layer) is shown in Table 1.

[0170] [Example 3] (Insulation board manufacturing) The surface of the design layer of the transfer sheet with heat seal produced in Example 1 and the above-mentioned heat insulating substrate 1 were arranged so as to face each other through an adhesive layer 1 having a thickness of 2 μm (total thickness of heat seal layer and adhesive layer 1: 4 μm). The adhesive layer 1 was formed by applying a urethane-based two-liquid curing adhesive (containing 5 parts by mass of polyisocyanate curing agent relative to 100 parts by mass of main agent, and containing the same amount of ethyl acetate as the main agent as a dilution solvent). Next, the transfer sheet, the heat seal layer, the adhesive layer 1, and the heat insulating substrate 1 were adhered together by applying heat and pressure from the transfer sheet side using a laminator. This resulted in an insulating board having a configuration of foamed urethane insulation material / aluminum foil / heat seal layer and adhesive layer 1 (total thickness: 4 μm) / design layer / second protective layer / first protective layer / release film. The total thickness (total thickness of decorative layer in Table 1) of the heat seal layer, adhesive layer 1, design layer, and protective layer (first protective layer and second protective layer) was 15 μm. Table 1 also shows the total organic mass in the heat seal layer, adhesive layer 1, design layer and protective layer (first protective layer and second protective layer).

[0171] [Example 4] (Insulation board manufacturing) A heat insulating material (polystyrene foam heat insulating material) and a heat insulating substrate 2 (Varishield, Ushiomatex Co., Ltd., thickness 25 mm) having aluminum foil arranged on the surface of the heat insulating material were prepared. The surface of the design layer of the transfer sheet (transfer sheet before the heat seal layer is formed) in Example 1 and the heat insulating substrate 2 were arranged so as to face each other through an adhesive layer 1 having a thickness of 2 μm. The adhesive layer 1 was formed by applying a urethane-based two-liquid curing adhesive (containing 5 parts by mass of polyisocyanate curing agent relative to 100 parts by mass of the main agent, and containing the same amount of ethyl acetate as the main agent as a dilution solvent). Next, the transfer sheet, the adhesive layer 1 and the heat insulating substrate 2 were adhered to each other. As a result, a heat insulating board having a configuration of polystyrene foam heat insulating material / aluminum foil / adhesive layer 1 (thickness 2 μm) / design layer / second protective layer / first protective layer / release film was obtained. The total thickness of the adhesive layer 1, the design layer and the protective layer (first protective layer and second protective layer) (total thickness of the decorative layer in Table 1) was 13 μm. Table 1 also shows the total organic mass in the adhesive layer 1, the design layer and the protective layer (the first protective layer and the second protective layer).

[0172] [Example 5] (Insulation board manufacturing) The surface of the design layer of the transfer sheet (transfer sheet before the heat seal layer is formed) in Example 1 and the heat insulating substrate 1 were arranged so as to face each other through the adhesive layer 1 having a thickness of 8 μm. The adhesive layer 1 was formed by applying a urethane-based two-liquid curing adhesive (containing 5 parts by mass of polyisocyanate curing agent relative to 100 parts by mass of the main agent, and containing the same amount of ethyl acetate as the dilution solvent as the main agent). Next, the transfer sheet, the adhesive layer 1 and the heat insulating substrate 1 were adhered to each other. As a result, a heat insulating board having a configuration of foamed urethane insulation material / aluminum foil / adhesive layer 1 (thickness 8 μm) / design layer / second protective layer / first protective layer / release film was obtained. The total thickness of the adhesive layer 1, the design layer and the protective layer (first protective layer and second protective layer) (total thickness of the decorative layer in Table 1) was 19 μm. The total organic mass in the adhesive layer 1, the design layer and the protective layer (first protective layer and second protective layer) is shown in Table 1.

[0173] [Example 6] The surface of the design layer of the transfer sheet (transfer sheet before the heat seal layer is formed) in Example 1 and the above-mentioned heat insulating substrate 1 were arranged so as to face each other through the adhesive layer 2 having a thickness of 2 μm. The adhesive layer 2 was formed by applying a polyester-based two-liquid curing adhesive (containing 10 parts by mass of polyisocyanate curing agent per 100 parts by mass of base agent, and containing the same amount of ethyl acetate as the base agent as a dilution solvent). Next, the transfer sheet, the adhesive layer 2 and the heat insulating substrate were adhered to each other. As a result, a heat insulating board having a configuration of urethane foam insulation material / aluminum foil / adhesive layer 2 (2 μm) / design layer / second protective layer / first protective layer / release film was obtained. The total thickness of the adhesive layer 2, the design layer and the protective layer (first protective layer and second protective layer) (total thickness of the decorative layer in Table 1) was 13 μm. The total organic mass in the adhesive layer 2, the design layer and the protective layer (first protective layer and second protective layer) is shown in Table 1.

[0174] [Comparative Example 1] The above-mentioned heat insulating substrate 1 was prepared as a heat insulating board.

[0175] [Comparative Example 2] The above-mentioned heat insulating base material 2 was prepared as a heat insulating board.

[0176] [Comparative Example 3] (Insulation board manufacturing) A decorative sheet 1 having a layer structure from the surface layer side of a surface protective coating layer (5 μm) / transparent vinyl chloride layer (80 μm) / pattern layer (2 μm) / colored vinyl chloride layer (80 μm) / adhesive layer (45 μm) was prepared. The surface of the adhesive layer of the decorative sheet 1 and the heat insulating substrate 1 were arranged so as to face each other via the adhesive layer of the decorative sheet 1. Next, the decorative sheet 1 and the heat insulating substrate 1 were brought into close contact with each other. This resulted in an insulating board having a structure of urethane foam insulation material / aluminum foil / decorative sheet 1. The thickness of the decorative sheet 1 was 212 μm. The total organic mass of the decorative sheet 1 is shown in Table 2.

[0177] [Comparative Example 4] (Insulation board manufacturing) A decorative sheet 2 having a layer structure of, from the surface layer side, surface protective coating layer (5 μm) / transparent olefin (60 μm) / pattern layer (2 μm) / colored olefin (60 μm) was prepared. The decorative sheet 2 and the insulating base material 1 were arranged facing each other with a 50 μm thick adhesive layer (Cemedine High Super 30 (epoxy type)) in between, and the decorative sheet 2, adhesive layer and insulating base material 1 were adhered together. This resulted in an insulating board having a configuration of urethane foam insulation / aluminum foil / adhesive layer / decorative sheet 2. The total thickness of the adhesive layer and decorative sheet 2 was 177 μm. The total organic mass in the adhesive layer and decorative sheet 2 is shown in Table 2.

[0178] [Comparative Example 5] (Insulation board manufacturing) A decorative sheet 3 having, from the surface layer side, a topcoat layer (10 μm) / pattern ink layer (3 μm) / vinyl chloride foam resin layer (150 μm) / backing paper (97 μm) was prepared. The decorative sheet 3 and the insulating substrate 1 were arranged facing each other with a 50 μm thick adhesive layer (Cemedine High Super 30 (epoxy type)) between them, and the decorative sheet 3, adhesive layer and insulating substrate 1 were adhered together. This resulted in an insulating board having a configuration of urethane foam insulation / aluminum foil / adhesive layer / decorative sheet 3. The total thickness of the adhesive layer and decorative sheet 3 was 310 μm. The total organic mass in the adhesive layer and decorative sheet 3 is shown in Table 2.

[0179] [Non-flammable rating] The obtained heat insulating board was subjected to a heat generation test using a cone calorimeter conforming to ISO5660-1:2002 and was judged according to the following criteria. The device used was a cone calorimeter C-3 manufactured by Toyo Seiki Seisakusho Co., Ltd. The results are shown in Tables 1 and 2. (Judgment criteria) (i) The total heat generation rate for the first 20 minutes after the start of heating is 8 MJ / m 2 Is less than or equal to (ii) No cracks or holes penetrating to the back surface for 20 minutes after the start of heating (iii) For 20 minutes after the start of heating, the heat generation rate is 200 kW / m continuously for more than 10 seconds 2 Not to exceed In Tables 1 and 2, "A" indicates that the above criteria are met. If the criteria are not met, the above criteria (i) Total calorific value (MJ / m 2 ), (iii) A heat generation rate of 200 kW / m continuously 2 The time (seconds) over which the

[0180] [Table 1]

[0181] [Table 2]

[0182] In Examples 1 to 6, the design of the design layer was visible, and the insulation boards obtained were excellent in design (design judgement A). On the other hand, in Comparative Examples 1 and 2, the insulation board surface was metallic in color, and the design was poor (design judgement B). It was also confirmed that the insulation boards of Examples 1 to 6 had good non-combustibility compared to the insulation boards of Comparative Examples 3 to 5, which have surface materials using decorative sheets. It was also confirmed that the insulation boards of Examples 1 to 4 and Example 6 had a thin adhesive layer in the surface material, and were insulation boards with even better non-combustibility than Example 5.

[0183] Thus, in the present disclosure, for example, the following inventions are provided:

[0184] [1] A sheet for a heat insulating board, comprising a metal foil, a design layer, a protective layer and a release film in this order in the thickness direction.

[0185] [2] The sheet for insulation board described in [1] has an adhesive layer between the metal foil and the design layer.

[0186] [3] The sheet for a heat insulation board according to [2], having at least one of an adhesive layer and a heat seal layer as the adhesive layer.

[0187] [4] The sheet for insulation board according to any one of [1] to [3], wherein the total thickness of the layers between the metal foil and the release film is 15 μm or less.

[0188] [5] The sheet for heat insulating board according to [2] or [3], wherein the thickness of the adhesive layer is 2 μm or more and 4 μm or less.

[0189] [6] The sheet for heat insulation board has a total organic mass in the layer between the metal foil and the release film of 19 g / m 2 The sheet for insulation board according to any one of [1] to [5] below.

[0190] [7] The sheet for insulation board according to any one of [1] to [6], wherein the protective layer has, from the release film side, a first protective layer and a second protective layer.

[0191] [8] The sheet for a heat insulating board according to [7], wherein the first protective layer comprises a cured product of an ionizing radiation curable resin composition.

[0192] [9] The sheet for a heat insulating board according to [7] or [8], wherein the second protective layer comprises a cured product of a thermosetting resin composition.

[0193]

[10] The sheet for insulation board according to any one of [7] to [9], wherein the first protective layer contains at least one of an ultraviolet absorber and a light stabilizer.

[0194]

[11] The sheet for insulation board according to any one of [7] to

[10] , wherein the second protective layer contains at least one of an ultraviolet absorber and a light stabilizer.

[0195]

[12] The sheet for heat insulation board according to any one of [1] to

[11] , wherein the metal foil is an aluminum foil or an aluminum alloy foil.

[0196]

[13] a transfer sheet preparation step of preparing a transfer sheet having a release film and a transfer layer disposed on one surface of the release film, the transfer layer having a protective layer and a design layer in this order from the release film side in a thickness direction; a bonding process in which one surface of the metal foil and a surface of the transfer sheet on the design layer side are placed opposite each other and bonded to each other; A method for producing a sheet for a heat insulating board, comprising the steps of:

[0197]

[14] The method for manufacturing a sheet for insulation board described in

[13] , wherein in the adhesion step, an adhesive layer is placed between one side of the metal foil and the design layer side of the transfer sheet, and the transfer sheet, the adhesive layer, and the metal foil are adhered to each other.

[0198]

[15] The method for producing a sheet for a heat insulating board according to

[14] , wherein the total thickness of the transfer layer and the adhesive layer is 15 μm or less.

[0199]

[16] An insulating board having an insulating material, a metal foil, a decorative layer, and a protective layer in this order in the thickness direction.

[0200]

[17] The insulation board according to

[16] , having an adhesive layer between the metal foil and the decorative layer.

[0201]

[18] An integration step of obtaining an insulation board with a release film, in which an insulation material and the sheet for insulation board according to any one of [1] to

[12] are integrated and the metal foil is arranged on the insulation material side; A method for producing an insulation board, comprising: a peeling step of peeling the release film from the insulation board with release film. [Explanation of symbols]

[0202] 1 … Metal foil 2 … Design layer 3…protective layer 4 … Release film 5 … Adhesive layer 10...Sheet for insulation board 20 ... Transfer sheet 100 ... Insulation board

Claims

1. A sheet for a heat insulating board, comprising a metal foil, a design layer, a protective layer and a release film in this order in the thickness direction.

2. The sheet for a thermal insulation board according to claim 1 , further comprising an adhesive layer between the metal foil and the design layer.

3. The sheet for a thermal insulation board according to claim 2 , wherein the adhesive layer comprises at least one of an adhesive layer and a heat seal layer.

4. 3. The sheet for heat insulation board according to claim 2, wherein the total thickness of the layers present between the metal foil and the release film is 15 μm or less.

5. The sheet for a heat insulating board according to claim 2, wherein the thickness of the adhesive layer is 2 μm or more and 4 μm or less.

6. The sheet for heat insulation board has a total organic mass in the layer between the metal foil and the release film of 19 g / m ２ 2. The sheet for insulation board according to claim 1, wherein:

7. The sheet for insulation board according to claim 1 , wherein the protective layer has, from the release film side, a first protective layer and a second protective layer.

8. The sheet for a heat insulating board according to claim 7 , wherein the first protective layer comprises a cured product of an ionizing radiation curable resin composition.

9. The sheet for a thermal insulation board according to claim 7 , wherein the second protective layer comprises a cured product of a thermosetting resin composition.

10. The sheet for a heat insulation board according to claim 7, wherein the first protective layer contains at least one of an ultraviolet absorbing agent and a light stabilizer.

11. The sheet for a heat insulation board according to claim 7, wherein the second protective layer contains at least one of an ultraviolet absorbing agent and a light stabilizer.

12. 2. The sheet for heat insulation board according to claim 1, wherein the metal foil is an aluminum foil or an aluminum alloy foil.

13. a transfer sheet preparation step of preparing a transfer sheet having a release film and a transfer layer disposed on one surface of the release film, the transfer layer having a protective layer and a design layer in this order from the release film side in a thickness direction; a bonding process in which one surface of the metal foil and a surface of the transfer sheet on the design layer side are placed opposite each other and bonded to each other; A method for producing a sheet for a heat insulating board, comprising the steps of:

14. The manufacturing method of a sheet for insulation board described in claim 13, wherein in the adhesion process, an adhesive layer is placed between one side of the metal foil and the design layer side of the transfer sheet, and the transfer sheet, the adhesive layer, and the metal foil are adhered to each other.

15. The method for producing a sheet for a thermal insulation board according to claim 14, wherein the total thickness of the transfer layer and the adhesive layer is 15 μm or less.

16. An insulating board having an insulating material, a metal foil, a decorative layer, and a protective layer in this order in the thickness direction.

17. 17. The insulation board of claim 16 having an adhesive layer between the metal foil and the decorative layer.

18. An integration step of obtaining an insulation board with a release film, in which an insulation material and the sheet for insulation board according to any one of claims 1 to 12 are integrated and the metal foil is disposed on the insulation material side; A method for producing an insulation board, comprising: a peeling step of peeling the release film from the insulation board with release film.

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