Semiconductor manufacturing device, wafer mounting device, dicing device, semiconductor manufacturing method

Abstract

To provide a technology capable of suppressing non-uniformity in the force applied to a dicing blade when cutting an orientation flat.SOLUTION: A semiconductor manufacturing device includes a stage and a transport machine. On the stage, a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed together with a dicing tape. The transport machine transports the jig such that the jig faces the orientation flat on the stage.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus, a wafer mounting apparatus, a dicing apparatus, and a semiconductor manufacturing method. [Background technology]

[0002] In the manufacture of semiconductor devices, generally, semiconductor chips cut from a semiconductor wafer by a dicing device are mounted on a semiconductor module. In addition, generally, when cutting the semiconductor wafer by the dicing device, the semiconductor wafer is attached to a dicing tape so that the semiconductor chips do not move (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2015 / 056303 Summary of the Invention [Problem to be solved by the invention]

[0004] Semiconductor wafers are often provided with an orientation flat, which is a cutout for adjusting the position and rotation angle of the semiconductor wafer, and depending on the design of the semiconductor chip, a dicing device may cut the orientation flat along a linear orientation flat. In this case, however, one side of the plate-like dicing blade that cuts the orientation flat receives force from the semiconductor wafer, but the other side is adjacent to the space and does not receive force, so an uneven force is applied to the dicing blade. As a result, there are problems such as the dicing blade being easily damaged and the lifespan of the dicing blade being shortened.

[0005] Therefore, the present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a technology that can suppress non-uniformity in the force applied to a dicing blade when cutting an orientation flat. [Means for solving the problem]

[0006] The semiconductor manufacturing apparatus according to the present disclosure includes a stage on which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used to cut the orientation flat with a dicing blade are fixed together with dicing tape, and a transport device that transports the jig on the stage so that the jig faces the orientation flat. Effect of the Invention

[0007] According to the present disclosure, the jig is transported on the stage so as to face the orientation flat. With this configuration, it is possible to suppress non-uniformity in the force applied to the dicing blade when cutting the orientation flat. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic cross-sectional view showing a configuration of a wafer mounting device according to a first embodiment. [Diagram 2] FIG. 2 is a plan view showing an example of a cut structure. [Diagram 3] 1 is a schematic cross-sectional view showing a configuration of a dicing device according to a first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, the embodiments will be described with reference to the accompanying drawings. The features described in each of the following embodiments are merely examples, and not all features are necessarily required. In addition, in the following description, similar components in multiple embodiments are given the same or similar reference numerals, and different components are mainly described. In addition, in the following description, specific positions and directions such as "upper", "lower", "left", "right", "front" or "back" do not necessarily correspond to positions and directions in actual implementation.

[0010] <Embodiment 1> Fig. 1 is a schematic cross-sectional view showing the configuration of a wafer mounting device including a semiconductor manufacturing apparatus according to the present embodiment 1. The semiconductor manufacturing apparatus of the wafer mounting device of Fig. 1 includes a wafer table 1, which is a stage, and a transport device 2. The wafer mounting device of Fig. 1 also includes not only the semiconductor manufacturing apparatus, but also an application roller 3, which is a tape application unit.

[0011] The wafer table 1 is a stage on which the semiconductor wafer 21 and the jig 22 are fixed to each other with a dicing tape 26. In the present embodiment 1, the semiconductor wafer 21, the jig 22, and the wafer ring 23 are mounted on the wafer table 1 and then attached to the dicing tape 26. Fig. 2 is a plan view showing an example of a cut structure in which the semiconductor wafer 21, the jig 22, and the wafer ring 23 are attached to the dicing tape 26. The semiconductor wafer 21, which is one of the cut structures, is cut by a dicing device, as described later.

[0012] The semiconductor wafer 21 has an orientation flat 21a. The semiconductor wafer 21 is provided with a semiconductor chip including at least one of a metal oxide semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), a reverse conducting IGBT (RC-IGBT), a Schottky barrier diode (SBD), and a PN junction diode (PND). In this specification, for example, at least one of A, B, C, ..., and Z means any one of all combinations of one or more elements extracted from the group of A, B, C, ..., and Z.

[0013] The semiconductor wafer 21 may be made of normal silicon (Si) or a wide band gap semiconductor such as silicon carbide (SiC), gallium nitride (GaN), diamond, etc. When the semiconductor wafer 21 is made of a wide band gap semiconductor, stable operation of the semiconductor device under high temperature and high voltage conditions and high switching speed can be achieved.

[0014] 1 is provided with a recess 1a, and a semiconductor wafer 21 is loaded onto the wafer table 1 manually, by a carrier 2, or by other carriers so that only the outer periphery of the semiconductor wafer 21 is supported on the wafer table 1. The recess 1a prevents the surface structure of a semiconductor chip provided on the semiconductor wafer 21 from coming into contact with the wafer table 1.

[0015] Jig 22 in Fig. 2 has a shape corresponding to orientation flat 21a, and is a jig used to cut orientation flat 21a with a dicing blade. In the example of Fig. 2, the right side of jig 22 has a shape corresponding to orientation flat 21a, which is a straight line shape corresponding to the straight line shape of orientation flat 21a. Also, in the example of Fig. 2, jig 22 as a whole has a bow shape that complements the circle of semiconductor wafer 21. However, the shape of jig 22 is not limited to the shape in Fig. 2, as long as jig 22 has a shape corresponding to orientation flat 21a.

[0016] The transfer machine 2 transfers the jig 22 so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a on the wafer table 1. In this way, the jig 22 is mounted on the wafer table 1.

[0017] The wafer ring 23 is placed on the wafer table 1 manually, by the conveyor 2, or by another conveyor so as to surround the semiconductor wafer 21 and the jig 22 in a plan view. The material of the wafer ring 23 is, for example, stainless steel.

[0018] The application roller 3 applies the semiconductor wafer 21, the jig 22 facing the orientation flat 21a, and the wafer ring 23 surrounding the semiconductor wafer 21 and the jig 22, which are mounted on the wafer table 1, to the dicing tape 26. Specifically, the application roller 3 applies the dicing tape 26 by pressing the dicing tape 26 fed by a feeder (not shown) against the semiconductor wafer 21, the jig 22, and the wafer ring 23. This forms the cut structure shown in FIG. 2. The application roller 3 is made of a material such as Si rubber, and the dicing tape 26 is made of a material such as UV-curable polyolefin.

[0019] 2 is cut by a dicing blade similar to dicing blade 8 in Fig. 3 described below, thereby cutting semiconductor chips from semiconductor wafer 21. When cutting orientation flat 21a, the dicing blade comes into contact with jig 22 and cuts orientation flat 21a along the linear shape of orientation flat 21a.

[0020] <Summary of the first embodiment> In the semiconductor manufacturing apparatus according to the first embodiment as described above, the transport machine 2 transports the jig 22 on the wafer table 1 so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a. With this configuration, it is possible to form a cut structure in which the semiconductor wafer 21 and the jig 22 are fixed to each other with the jig 22 facing the orientation flat 21a as shown in FIG. 2. As a result, when cutting the orientation flat 21a, one side of the dicing blade cutting the orientation flat 21a receives a force from the semiconductor wafer 21 and the other side receives a force from the jig 22, thereby suppressing unevenness in the force applied to the dicing blade. As a result, damage to the dicing blade can be suppressed.

[0021] <Embodiment 2> Fig. 3 is a schematic cross-sectional view showing the configuration of a dicing device including a semiconductor manufacturing apparatus according to the present embodiment 2. The semiconductor manufacturing apparatus of the dicing device of Fig. 3 includes a dicing table 6 which is a stage, and a conveyor 2. The dicing device of Fig. 3 also includes a ring holder 7 and a dicing blade 8 in addition to the semiconductor manufacturing apparatus.

[0022] The dicing table 6 is a stage on which the semiconductor wafer 21 and the jig 22 are fixed to each other with a dicing tape 26. In the second embodiment, the semiconductor wafer 21 and the dicing tape 26 to which the wafer ring 23 surrounding the semiconductor wafer 21 is attached are loaded onto the dicing table 6 manually, by the conveyor 2, or by another conveyor. Note that the portion of the dicing table 6 on which the semiconductor wafer 21 is loaded may be provided with a porosity capable of air-adsorbing the semiconductor wafer 21 via the dicing tape 26.

[0023] After the dicing tape 26 is placed on the dicing table 6, the conveyor 2 conveys the jig 22 so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a on the dicing table 6, thereby attaching the jig 22 to the dicing tape 26. This forms the cut structure shown in FIG.

[0024] 2, semiconductor wafer 21, which is the structure to be cut, is cut into semiconductor chips by dicing blade 8. When cutting orientation flat 21a, dicing blade 8 cuts orientation flat 21a along the linear shape of orientation flat 21a while in contact with jig 22. Dicing blade 8 is, for example, a blade made of abrasive grains bound with a bonding material. Ring holder 7 holds wafer ring 23 to fix semiconductor wafer 21 while dicing blade 8 is cutting.

[0025] <Summary of the second embodiment> In the semiconductor manufacturing apparatus according to the second embodiment as described above, conveyor 2 conveys jig 22 on wafer table 1 so that the linear shape of jig 22 faces the linear shape of orientation flat 21a. With this configuration, a cut structure can be formed in which semiconductor wafer 21 and jig 22 are fixed to each other with jig 22 facing orientation flat 21a, as shown in FIG. 2. As a result, when cutting orientation flat 21a, one side of the dicing blade cutting orientation flat 21a receives a force from semiconductor wafer 21, and the other side receives a force from jig 22, thereby suppressing unevenness in the force applied to the dicing blade. As a result, damage to the dicing blade can be suppressed.

[0026] <Modification> In the explanation of the first and second embodiments, the jig 22 is transported by the transport machine 2. However, this is not limited to this, and the jig 22 may be transported manually so that the linear shape of the jig 22 faces the linear shape of the orientation flat 21a.

[0027] Furthermore, in the first embodiment, the semiconductor wafer 21 and the like are mounted on the wafer table 1 and then affixed to the dicing tape 26, and in the second embodiment, the dicing tape 26 and the like are mounted on the dicing table 6 and then the jig 22 is affixed to the dicing tape 26. However, the operations of the first embodiment and the second embodiment may be interchanged. That is, in the first embodiment, the dicing tape 26 and the like are mounted on the wafer table 1 and then the jig 22 is affixed to the dicing tape 26, and in the second embodiment, the semiconductor wafer 21 and the like are mounted on the dicing table 6 and then the jig 22 is affixed to the dicing tape 26.

[0028] <Embodiment 3> In the present embodiment 3, the material of jig 22 is the same as the material of semiconductor wafer 21 in embodiments 1 and 2. With this configuration, it is possible to further suppress non-uniformity in the force applied to dicing blade 8 when dicing blade 8 comes into contact with orientation flat 21a, compared to a configuration in which semiconductor wafer 21 and jig 22 are made of different materials.

[0029] <Fourth embodiment> In the present embodiment 4, the thickness of the jig 22 and the thickness of the semiconductor wafer 21 are the same as in the embodiments 1 and 2. The fact that the thickness of the jig 22 and the thickness of the semiconductor wafer 21 are the same includes the difference between the thickness of the jig 22 and the thickness of the semiconductor wafer 21 being within 5% of the larger of the thicknesses of the jig 22 and the semiconductor wafer 21. With this configuration, it is possible to further suppress the non-uniformity of the force applied to the dicing blade when the dicing blade 8 comes into contact with the orientation flat 21a, compared to a configuration in which the thicknesses of the semiconductor wafer 21 and the jig 22 are different.

[0030] <Modification> The configuration of the third embodiment may be combined with the configuration of the fourth embodiment. That is, in the first and second embodiments, the material of the jig 22 and the material of the semiconductor wafer 21 may be the same, and the thickness of the jig 22 and the thickness of the semiconductor wafer 21 may be the same. With this configuration, it is possible to further suppress the non-uniformity of the force applied to the dicing blade when the dicing blade 8 comes into contact with the orientation flat 21a, compared to a configuration in which the thicknesses of the semiconductor wafer 21 and the jig 22 are different.

[0031] <Embodiment 5> In the fifth embodiment, the conveyor 2 in the first and second embodiments conveys the jig 22 so that a gap is formed between the jig 22 and the orientation flat 21a. With such a configuration, wear of the dicing blade 8 can be suppressed, and therefore, it is expected that the life of the dicing blade 8 will be extended. Note that the fifth embodiment may be combined with at least one of the configurations of the third embodiment and the fourth embodiment.

[0032] It should be noted that the embodiments and modifications may be freely combined, and the embodiments and modifications may be modified or omitted as appropriate.

[0033] Various aspects of the present disclosure are summarized below as appendices.

[0034] (Appendix 1) a stage on which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed together with a dicing tape; a conveyor that conveys the jig on the stage so that the jig faces the orientation flat; A semiconductor manufacturing apparatus comprising:

[0035] (Appendix 2) A semiconductor manufacturing apparatus according to claim 1; a tape attachment unit that attaches the semiconductor wafer, the jig facing the orientation flat, and a wafer ring surrounding the semiconductor wafer and the jig, which are mounted on the stage, to the dicing tape; A wafer mounting apparatus comprising:

[0036] (Appendix 3) A semiconductor manufacturing apparatus according to claim 1; The dicing blade and Equipped with The conveyor is transporting the jig to the dicing tape on which the semiconductor wafer and a wafer ring surrounding the semiconductor wafer are attached and which is mounted on the stage, and attaching the jig to the dicing tape; The dicing blade is A dicing device that cuts the orientation flat along the orientation flat while in contact with the jig.

[0037] (Appendix 4) A semiconductor manufacturing apparatus according to any one of claims 1 to 3, The material of the jig is the same as that of the semiconductor wafer.

[0038] (Appendix 5) A semiconductor manufacturing apparatus according to any one of claims 1 to 4, A semiconductor manufacturing apparatus, wherein a thickness of the jig is the same as a thickness of the semiconductor wafer.

[0039] (Appendix 6) A semiconductor manufacturing apparatus according to any one of claims 1 to 5, The transport device transports the jig so that a gap is formed between the jig and the orientation flat.

[0040] (Appendix 7) preparing a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade; the jig is transported so as to face the orientation flat on a stage on which the semiconductor wafer and the jig are fixed to each other with a dicing tape. [Explanation of symbols]

[0041] 1 wafer table, 2 conveyor, 3 lamination roller, 6 dicing table, 8 dicing blade, 21 semiconductor wafer, 21a orientation flat, 22 jig, 23 wafer ring, 26 dicing tape.

Claims

1. a stage on which a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade are fixed together with a dicing tape; a conveyor that conveys the jig on the stage so that the jig faces the orientation flat; A semiconductor manufacturing apparatus comprising:

2. The semiconductor manufacturing apparatus according to claim 1 ; a tape attachment unit that attaches the semiconductor wafer, the jig facing the orientation flat, and a wafer ring surrounding the semiconductor wafer and the jig, which are mounted on the stage, to the dicing tape; A wafer mounting apparatus comprising:

3. The semiconductor manufacturing apparatus according to claim 1 ; The dicing blade and Equipped with The conveyor is transporting the jig to the dicing tape on which the semiconductor wafer and a wafer ring surrounding the semiconductor wafer are attached and which is mounted on the stage, and attaching the jig to the dicing tape; The dicing blade is A dicing device that cuts the orientation flat along the orientation flat while in contact with the jig.

4. 2. The semiconductor manufacturing apparatus according to claim 1, The material of the jig is the same as that of the semiconductor wafer.

5. The semiconductor manufacturing apparatus according to claim 1 or 4, A semiconductor manufacturing apparatus, wherein a thickness of the jig is the same as a thickness of the semiconductor wafer.

6. 2. The semiconductor manufacturing apparatus according to claim 1, The transport device transports the jig so that a gap is formed between the jig and the orientation flat.

7. preparing a semiconductor wafer having an orientation flat and a jig having a shape corresponding to the orientation flat and used for cutting the orientation flat with a dicing blade; the jig is transported so as to face the orientation flat on a stage on which the semiconductor wafer and the jig are fixed to each other with a dicing tape.

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