Chip transfer device

Abstract

To provide a chip transfer device of which a construction is simple, and which can be reduced in size and weight.SOLUTION: A chip transfer device that transfers a plurality of chips, comprises: a plurality of holding parts that holds a chip, respectively; a plurality of movement mechanisms that moves each holding part so as to be connected to each holding part; and a motor that is connected to the plurality of holding part via a coupling member. The motor integrally rotates the plurality of holding parts.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a chip transfer device that transfers a plurality of chips. [Background technology]

[0002] A wafer on which a plurality of devices are formed is divided and diced into individual chips, thereby manufacturing a plurality of chips (device chips) each including a device. A package substrate is formed by mounting a plurality of device chips on a predetermined substrate and covering and sealing the mounted device chips with a resin layer (mold resin). A package substrate is divided and diced into individual chips, thereby manufacturing a plurality of chips (packaged devices) each including a plurality of packaged device chips. The device chips and package devices are incorporated into various electronic devices such as mobile phones and personal computers.

[0003] When dividing a workpiece such as a wafer or a package substrate into chips, the workpiece is processed by various processing devices. For example, the workpiece is processed by a processing device such as a cutting device or a laser processing device, and divided into multiple chips. The multiple chips are then transferred from the processing device to another processing device or an inspection device, where the chips are subjected to the next processing (processing, inspection, etc.).

[0004] When transferring multiple chips obtained by dividing a workpiece, an operator must repeatedly pick up the chips one by one from the transfer source and transfer them to the transfer destination, which is time-consuming and laborious. Therefore, a chip transfer device capable of transferring multiple chips at once has been proposed. For example, Patent Document 1 discloses a chip transfer device equipped with multiple suction nozzles capable of holding chips. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] International Publication No. 2011 / 128980 Summary of the Invention [Problem to be solved by the invention]

[0006] As described above, by using a chip transfer device equipped with multiple holding parts constituted by suction nozzles or the like, it becomes possible to automatically transfer multiple chips at once, improving the efficiency of the chip transfer work. However, depending on the content of the next processing (machining, inspection, etc.) to be performed, it is desirable that the angles (orientations) of the multiple transferred chips are uniform. Therefore, it has been proposed to configure a chip transfer device in which a motor is connected to each of the multiple holding parts, and the angle of the holding parts can be changed. By using such a chip transfer device, it becomes possible to adjust the angle of the chip held by the holding parts, and multiple chips can be placed at the transfer destination with the angle aligned.

[0007] However, when a motor is connected to each of the multiple holders that hold the chips, the chip transfer device is equipped with many motors. This increases the size and weight of the chip transfer device, and also increases costs. In addition, the arrangement of many motors within the chip transfer device reduces the freedom in the number and arrangement (spacing) of the holders, which can limit the efficient simultaneous transfer of multiple chips.

[0008] The present invention has been made in view of the above problems, and has an object to provide a chip transfer device that has a simple configuration and can be made compact and lightweight. [Means for solving the problem]

[0009] According to one aspect of the present invention, a chip transfer device is provided that transfers a plurality of chips, the chip transfer device comprising a plurality of holding parts that respectively hold the chips, a plurality of moving mechanisms that are respectively connected to the holding parts and move the holding parts, and a motor connected to the plurality of holding parts via connecting members, the motor rotating the plurality of holding parts in unison.

[0010] Preferably, the chip transport device further includes a controller for controlling the holding of the chip by the holding part, and the controller repeats a first setting process for controlling the motor to collectively set the angles of the multiple holding parts from a reference angle to a holding angle corresponding to the angle of the specific chip, a pick-up process for controlling the moving mechanism to have the specific holding part pick up the specific chip, and a second setting process for controlling the motor to collectively set the angles of the multiple holding parts from the holding angle to the reference angle, thereby causing the multiple holding parts to hold the chip. Also, preferably, the chip transport device further includes an imaging unit for imaging the chip to generate an image, and the controller obtains angle information indicating the angle of the specific chip based on the image, and sets the holding angle based on the angle information.

[0011] Further, preferably, the chip transfer device further comprises a plurality of pulleys respectively connected to the holding parts and around which the connecting member is hung, and each of the plurality of pulleys is arranged to overlap a part of the other pulleys in the moving direction of the holding part. Also, preferably, the plurality of holding parts pick up the chips from a tray that fixes the plurality of chips by tacking force. Effect of the Invention

[0012] The chip transport device according to one embodiment of the present invention includes a motor connected to a plurality of holders, and the rotation of the plurality of holders is collectively controlled by the motor. Therefore, there is no need to provide a motor for each of the plurality of holders, and the configuration of the chip transport device is simplified. This allows the chip transport device to be made smaller, lighter, and less expensive. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a perspective view showing a chip transfer device. [Diagram 2] FIG. 2(A) is a side view showing the transfer unit, and FIG. 2(B) is a plan view showing the transfer unit. [Diagram 3]FIG. 13 is a plan view showing a chip to be transferred. [Figure 4] FIG. 2 is a front view showing an imaging unit that images a chip. [Diagram 5] 13 is a front view showing the transfer unit when the angles of the multiple holding parts are set to the holding angle. FIG. [Figure 6] 13 is a front view showing the transfer unit when the chip is held by the holder. FIG. [Figure 7] FIG. 13 is a front view showing the transfer unit when the chip is removed from the tray. [Figure 8] 13 is a front view showing the transfer unit when the angles of the multiple holding parts are set to a reference angle. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] An embodiment according to one aspect of the present invention will be described below with reference to the accompanying drawings. First, a configuration example of a chip transfer device according to this embodiment will be described. Fig. 1 is a perspective view showing a chip transfer device 2. In Fig. 1, the X-axis direction (left-right direction, first horizontal direction) and the Y-axis direction (front-back direction, second horizontal direction) are perpendicular to each other and parallel to a horizontal plane. The Z-axis direction (height direction, up-down direction, vertical direction) is perpendicular to the X-axis direction and the Y-axis direction.

[0015] The chip transfer device 2 is a transfer device (transport device) capable of transferring (transporting) a plurality of chips 11 collectively from a predetermined transfer source to a predetermined transfer destination. The chips 11 correspond to individual pieces obtained by dividing a predetermined workpiece.

[0016] For example, the workpiece is a disk-shaped substrate (wafer) made of a semiconductor material such as single crystal silicon, and has a front surface and a back surface that are generally parallel to each other. The workpiece is divided into a plurality of rectangular regions by a plurality of streets (planned division lines) arranged in a lattice pattern so as to intersect with each other. Devices such as ICs (Integrated Circuits), LSIs (Large Scale Integrations), LEDs (Light Emitting Diodes), and MEMS (Micro Electro Mechanical Systems) devices are formed in each of the regions divided by the streets. By dividing the workpiece along the streets, a plurality of chips (device chips), each of which includes a device, are manufactured.

[0017] The workpiece may be a package substrate such as a CSP (Chip Size Package) substrate or a QFN (Quad Flat Non-leaded package) substrate. For example, a package substrate is formed by mounting a plurality of device chips on a predetermined substrate and covering and sealing the mounted device chips with a resin layer (mold resin). By dividing and singulating the package substrate, a plurality of chips (packaged devices) each including a plurality of packaged device chips are manufactured.

[0018] The individual pieces such as the device chips and packaged devices are transferred as chips 11 by the chip transfer device 2. In this embodiment, as an example, a case where the chip 11 is a rectangular individual piece having four sides will be described. However, there are no limitations on the type, material, shape, structure, size, etc. of the chip 11.

[0019] The chip transfer device 2 includes a transfer unit 4 that holds and transfers a plurality of chips 11. The transfer unit 4 also includes a housing (cover) 6 that houses each of the components that make up the transfer unit 4. For example, the housing 6 is a rectangular parallelepiped member made of metal, resin, or the like. Inside the housing 6, a rectangular parallelepiped storage section (storage space) 6b that opens at the bottom surface 6a of the housing 6 is provided.

[0020] The storage section 6b of the housing 6 contains a plurality of chip holding units 8A, 8B that hold chips 11. The chip holding units 8A, 8B are arranged alternately along the X-axis direction and supported within the storage section 6b. Although three sets of chip holding units 8A and four sets of chip holding units 8B are illustrated in Fig. 1, there is no limit to the number of chip holding units 8A, 8B.

[0021] Each of the tip holding units 8A, 8B includes a cylindrical support shaft 10 arranged along the Z-axis direction. A holding part 12 that holds a tip 11 is attached to the tip end (one end, lower end) of the support shaft 10. A moving mechanism (advancing and retreating mechanism) 14 that moves (advances and retreats) the holding part 12 is connected to the base end (the other end, upper end) of the support shaft 10. That is, the moving mechanism 14 is connected to the holding part 12 via the support shaft 10.

[0022] For example, the holder 12 is configured with a suction nozzle that suctions and holds the tip 11. In this case, the tip surface (lower surface) of the nozzle constitutes the suction surface that suctions the tip 11. A suction passage (not shown) is provided inside the holder 12, one end side (lower end side) of which is exposed at the suction surface, and the other end side (upper end side) of the suction passage is connected to a suction source (not shown) such as an ejector via a valve (not shown). When the suction force (negative pressure) of the suction source is applied to the suction surface with the suction surface of the suction nozzle in contact with the tip 11, the tip 11 is suction-held by the suction nozzle.

[0023] However, the configuration of the holding part 12 is not limited as long as the holding part 12 can hold the tip 11. For example, the holding part 12 may be a Bernoulli chuck that holds the tip 11 in a non-contact manner, or may be a clamp that clamps and holds the tip 11.

[0024] The moving mechanism 14 moves (advances and retreats) the support shaft 10 and the holding part 12 along the Z-axis direction. For example, the moving mechanism 14 is configured with an air cylinder, and includes a cylinder case and a columnar piston rod housed in the cylinder case. The piston rod is arranged along the Z-axis direction, and the base end side of the support shaft 10 is fixed to the lower end of the piston rod. When the air cylinder is operated, the support shaft 10 and the holding part 12 move along the Z-axis direction together with the piston rod. That is, in this embodiment, the moving mechanism 14 functions as an elevation mechanism that raises and lowers the holding part 12 along the Z-axis direction.

[0025] A pulley 16A is fixed to the support shaft 10 of the tip holding unit 8A, and a pulley 16B is fixed to the support shaft 10 of the tip holding unit 8B. That is, the pulley 16A or the pulley 16B is connected to each of the multiple holding parts 12 via the support shaft 10.

[0026] The pulleys 16A and 16B are formed in a substantially cylindrical shape and have the same configuration. The pulleys 16A and 16B have the same diameter. However, the positions of the pulleys 16A and 16B relative to the support shaft 10 (the positions of the pulleys 16A and 16B in the Z-axis direction) are different. FIG. 1 illustrates an example in which the pulley 16A is fixed closer to the base end side of the support shaft 10 (the moving mechanism 14 side) than the pulley 16B. Therefore, the pulleys 16A and 16B are arranged so as not to overlap each other in the X-axis direction and the Y-axis direction.

[0027] The housing 6 also houses a motor 18 that rotates the tip holding units 8A and 8B in the housing section 6b. The motor 18 is equipped with a cylindrical output shaft 20 and is configured by a servo motor, a stepping motor, or the like that is capable of controlling the rotation angle (amount of rotation) of the output shaft 20. The output shaft 20 is disposed along the Z-axis direction so as to be generally parallel to the multiple support shafts 10. When the motor 18 is driven, the output shaft 20 rotates a predetermined amount in both directions around a rotation axis that is generally parallel to the Z-axis direction.

[0028] The multiple tip holding units 8A are connected to the output shaft 20 of the motor 18 via a connecting member 22A. Similarly, the multiple tip holding units 8B are connected to the output shaft 20 of the motor 18 via a connecting member 22B. This makes it possible to transmit the power of the motor 18 to the multiple tip holding units 8A, 8B via the connecting members 22A, 22B.

[0029] Fig. 2(A) is a side view showing the transfer unit 4, and Fig. 2(B) is a plan view showing the transfer unit 4. For ease of explanation, Fig. 2(A) and Fig. 2(B) show only some of the components of the transfer unit 4. Also, in Fig. 2(B), in order to distinguish between the connecting member 22A and the connecting member 22B, the connecting member 22A is shown by a solid line, and the connecting member 22B is shown by a dashed line.

[0030] As shown in FIG. 2B, the pulleys 16A and 16B are arranged in a straight line at a predetermined interval along the X-axis direction. Each of the pulleys 16A and 16B is arranged so as to overlap with a part of the other pulleys 16A and 16B in the Z-axis direction (corresponding to the moving direction of the holding unit 12 (see FIG. 1)). Specifically, a part of the pulley 16A and a part of the pulley 16B overlap with each other in the Z-axis direction. Note that L in FIG. 2B indicates the length (offset length) in the X-axis direction of the region (offset region) where the pulleys 16A and 16B overlap. By providing the offset region, the interval between the pulleys 16A and 16B can be narrowed, and the number of the holding units 12 (see FIG. 1) can be increased.

[0031] A plurality of intermediate pulleys 24A are provided between the pulley 16A in the Y-axis direction and the motor 18. The intermediate pulleys 24A are installed at the same height position (position in the Z-axis direction) as the pulley 16A (see FIG. 2(A)), and are arranged at predetermined intervals along the X-axis direction (see FIG. 2(B)).

[0032] An endless connecting member 22A formed of a belt, chain, or the like is hung between the multiple pulleys 16A, the output shaft 20 of the motor 18, and the multiple intermediate pulleys 24A. The connecting member 22A is installed so that it runs from the output shaft 20 of the motor 18, alternately passing through the pulley 16A and the intermediate pulley 24A, and back to the output shaft 20 of the motor 18. As a result, the holding part 12 (see FIG. 1) of the tip holding unit 8A and the output shaft 20 of the motor 18 are connected via the support shaft 10, the pulley 16A, and the connecting member 22A, forming a power transmission mechanism that transmits the power of the motor 18 to the holding part 12.

[0033] A plurality of intermediate pulleys 24B are provided between the pulley 16B in the Y-axis direction and the motor 18. The intermediate pulleys 24B are installed at the same height position (position in the Z-axis direction) as the pulley 16B (see FIG. 2(A)), and are arranged at predetermined intervals along the X-axis direction (see FIG. 2(B)).

[0034] An endless connecting member 22B formed of a belt, chain, or the like is hung between the multiple pulleys 16B, the output shaft 20 of the motor 18, and the multiple intermediate pulleys 24B. The connecting member 22B is installed so that it runs from the output shaft 20 of the motor 18, alternately passing through the pulley 16B and the intermediate pulley 24B, and then returns to the output shaft 20 of the motor 18. As a result, the holding part 12 (see FIG. 1) of the tip holding unit 8B and the output shaft 20 of the motor 18 are connected via the support shaft 10, the pulley 16B, and the connecting member 22B, forming a power transmission mechanism that transmits the power of the motor 18 to the holding part 12.

[0035] When the motor 18 is driven to rotate the output shaft 20, the connecting members 22A and 22B hung on the output shaft 20 are sent out, and the pulleys 16A and 16B and the intermediate pulleys 24A and 24B also rotate. That is, the output shaft 20 of the motor 18 functions as a driving pulley, and the pulleys 16A and 16B and the intermediate pulleys 24A and 24B function as driven pulleys. Then, the connecting member 22A passes alternately between the pulley 16A and the intermediate pulley 24A, and is then sent back to the output shaft 20 from the last pulley 16A. Similarly, the connecting member 22B passes alternately between the pulley 16B and the intermediate pulley 24B, and is then sent back to the output shaft 20 from the last pulley 16B.

[0036] When the transfer unit 4 is operated as described above, the pulleys 16A, 16B rotate simultaneously at the same rotational speed, and the holders 12 (see FIG. 1) also rotate simultaneously at the same rotational speed as the pulleys 16A, 16B. In this way, the transfer unit 4 can rotate the holders 12 simultaneously using one motor 18.

[0037] 1, a support arm 26 that supports the housing 6 is connected to the upper wall side of the housing 6. A movement mechanism 28 that moves the housing 6 is also connected to the support arm 26. The movement mechanism 28 moves the support arm 26 along the XY plane and raises and lowers it along the Z-axis direction. This allows the housing 6 to be positioned at any position.

[0038] The configuration of the moving mechanism 28 is not limited as long as it is possible to position the housing 6 at a desired position. For example, the moving mechanism 28 may be a ball screw type moving mechanism that moves the housing 6 along the X-axis, Y-axis, and Z-axis directions, or may be a multi-joint arm that can position the housing 6 at an arbitrary position.

[0039] The chip transfer device 2 also includes an imaging unit 30 that captures an image of the chip 11 held by the holder 12. The imaging unit 30 includes an image sensor such as a CCD (Charged-Coupled Devices) sensor or a CMOS (Complementary Metal-Oxide-Semiconductor) sensor, and captures an image of one or more chips 11. There is no limitation on the type of imaging unit 30, and for example, a visible light camera or an infrared camera is used.

[0040] For example, the imaging unit 30 is connected to the housing 6, and the position of the imaging unit 30 is adjusted by the moving mechanism 28. However, an independent moving mechanism for moving the imaging unit 30 may be connected to the imaging unit 30. The imaging unit 30 is then positioned above the chip 11 to be held by the holding part 12, and captures an image of the chip 11. In this way, captured images representing one or more chips 11 are obtained. The captured images of the chip 11 are used to identify the position and angle of the chip 11, as described below.

[0041] Furthermore, the chip transfer device 2 includes a controller (control unit, control section, control device) 40 that controls the chip transfer device 2. The controller 40 is connected to each component of the chip transfer device 2 (the holding section 12, the moving mechanism 14, the motor 18, the moving mechanism 28, the imaging unit 30, etc.). The controller 40 controls the holding and transfer of the chip 11 by the chip transfer device 2 by outputting control signals to the components of the chip transfer device 2. For example, the controller 40 is configured by a computer and includes a processor such as a CPU (Central Processing Unit) and memories such as a ROM (Read Only Memory) and a RAM (Random Access Memory).

[0042] 1 shows a block diagram illustrating the functional configuration of the controller 40. The controller 40 includes a transfer control unit 42 that controls the transfer of the chip 11 by the transfer unit 4, and a storage unit (memory) 44 that stores various information (data, programs, etc.) used in the transfer of the chip 11 by the transfer unit 4.

[0043] The transfer control unit 42 includes an identification unit 42a that identifies the position and angle of the chip 11. The identification unit 42a is connected to the imaging unit 30, and a captured image of the chip 11 acquired by the imaging unit 30 is input to the identification unit 42a. Then, the identification unit 42a identifies the position and angle of the chip 11 by performing image processing on the captured image of the chip 11.

[0044] For example, the identification unit 42a extracts the outer periphery (contour) of the chip 11 from the captured image by performing edge detection processing on the captured image. Then, the identification unit 42a calculates, for example, the center coordinates (coordinates of the intersection of diagonals) of the chip 11 based on the coordinates of the outer periphery of the chip 11. These center coordinates are stored in the storage unit 44 as position information indicating the position of the chip 11. However, as long as the position of the chip 11 can be identified by the position information, the content and calculation method of the position information are not limited.

[0045] Furthermore, the determination unit 42a calculates the angle of one side of the chip 11 based on the coordinates of the outer periphery of the chip 11. For example, the determination unit 42a calculates the inclination angle of one side of the chip 11 with respect to the X-axis direction or the Y-axis direction. This inclination angle is stored in the storage unit 44 as angle information indicating the angle of the chip 11. However, as long as the angle of the chip 11 can be specified by the angle information, the content of the angle information and the calculation method are not limited.

[0046] The above process is repeated for each chip 11 to obtain position information and angle information for all chips 11. If it is difficult to image all chips 11 at once with the imaging unit 30, imaging is performed multiple times while changing the position of the imaging unit 30. Then, the identification unit 42a extracts position information and angle information for all chips 11 by performing image processing on each of the multiple images obtained by the imaging unit 30.

[0047] However, the chip 11 to be transferred by the transfer unit 4 may already be placed at a predetermined position. In this case, the position information of each chip 11 may be stored in advance in the storage unit 44, and the identification unit 42a may extract only the angle information of the chip 11 from the captured image. This makes it possible to omit the process of acquiring the position information of the chip 11 based on the captured image.

[0048] Further, the transfer control unit 42 includes a movement control unit 42b that controls the movement of the holder 12, an angle control unit 42c that controls the angle of the holder 12, and a holding control unit 42d that controls the holding of the chip 11 by the holder 12. The pick-up of the multiple chips 11 by the multiple holders 12 is controlled by the movement control unit 42b, the angle control unit 42c, and the holding control unit 42d.

[0049] The movement control unit 42b outputs a control signal to the movement mechanism 28 to control the movement mechanism 28 and move the housing 6 to an arbitrary position. This makes it possible to position the multiple holding units 12 supported by the housing 6 to desired positions.

[0050] The angle control unit 42c outputs a control signal to the motor 18 to control the motor 18, thereby rotating the output shaft 20 by a predetermined angle in a predetermined direction. As a result, the multiple holding units 12 connected to the output shaft 20 of the motor 18 via the connecting members 22A, 22B, the pulleys 16A, 16B, and the support shaft 10 rotate collectively by a predetermined angle in a predetermined direction at the same time.

[0051] The holding control unit 42d outputs a control signal to each of the moving mechanisms 14 provided in the multiple tip holding units 8A, 8B to control the multiple moving mechanisms 14, thereby controlling the movement (advancement and retreat) of the holding unit 12. In addition, the holding control unit 42d outputs a control signal to a valve (not shown) connected to the suction path of the holding unit 12 to control the opening and closing of the valve, thereby switching on and off the suction of the tip 11 by the holding unit 12.

[0052] Next, a specific example of a method for transporting chips 11 using chip transport device 2 will be described. Fig. 3 is a plan view showing chips 11 to be transported. As an example, a case in which multiple chips 11 are transported from tray 50A to tray 50B will be described below.

[0053] Tray 50A corresponds to the transfer source of chips 11, and multiple chips 11 are placed on tray 50A. For example, tray 50A is a plate-shaped member made of metal, resin, etc., and sheet 52A that supports chips 11 is provided on the upper surface side of tray 50A. For example, sheet 52A is made of a weakly adhesive gel sheet or the like, and holds multiple chips 11 by tack force. This prevents chips 11 from shifting position.

[0054] Tray 50B corresponds to the destination of chips 11. Tray 50B is configured similarly to tray 50A, and includes sheet 52B having the same configuration as sheet 52A. The multiple chips 11 transferred to tray 50B are placed on sheet 52B and held by the tack force of sheet 52B.

[0055] For example, multiple chips 11 after being processed by a processing device or inspected by an inspection device are placed on tray 50A with random positions and angles. Then, chip transfer device 2 (see FIG. 1) picks up multiple chips 11 from tray 50A, transfers them all at once, and places them on tray 50B in a predetermined arrangement and angle. Thereafter, tray 50B on which multiple chips 11 are placed is transported to another processing device or inspection device. The details of the transfer of multiple chips 11 by chip transfer device 2 are described below.

[0056] Fig. 4 is a front view showing the imaging unit 30 that images the chip 11. When transferring multiple chips 11, first, the imaging unit 30 images the multiple chips 11 to obtain the captured images, and then obtains position information and angle information for each of the multiple chips 11 based on the captured images. Note that Fig. 4 illustrates a case where the leftmost chip 11 (chip 11A) is positioned at a different angle from the other chips 11.

[0057] When the imaging unit 30 captures an image of the chip 11, the imaging unit 30 is disposed above a tray 50A on which a plurality of chips 11 are placed, and the position of the imaging unit 30 is adjusted so that the plurality of chips 11 falls within the imaging region (field of view) of the imaging unit 30. Then, the imaging unit 30 captures images of the plurality of chips 11, and a captured image including an image of the chip 11 is obtained.

[0058] At this time, if all the chips 11 fit within the imaging area of ​​the imaging unit 30, it is sufficient to acquire one captured image. On the other hand, if all the chips 11 do not fit within the imaging area of ​​the imaging unit 30, imaging is performed multiple times while moving the imaging unit 30 relative to the tray 50A, and multiple captured images showing one or multiple chips 11 are acquired.

[0059] The captured image acquired by the imaging unit 30 is input to the identification unit 42a of the controller 40. Then, as described above, the identification unit 42a extracts position information and angle information of each of the multiple chips 11, and stores it in the storage unit 44. However, the position information and angle information of the chip 11 may be acquired by a method other than image processing by the identification unit 42a and stored in advance in the storage unit 44. In this case, the imaging of the chip 11 by the imaging unit 30 can be omitted.

[0060] Next, the transfer unit 4 (see FIG. 1) picks up the multiple chips 11. The transfer unit 4 performs the task of picking up a specific chip 11 with a specific holder 12 for each of the multiple holders 12 in turn, thereby causing all of the holders 12 to hold the chips 11. Below, as a representative example, a case will be described in which the specific chip 11 is the leftmost chip 11A (see FIGS. 5 to 8) and the specific holder 12 is the leftmost holder 12A (see FIGS. 5 to 8).

[0061] When the holder 12A picks up the chip 11A, the controller 40 first executes a process (first setting process) for collectively setting the angles of the multiple holders 12 to a holding angle corresponding to the angle of the chip 11A. Fig. 5 is a front view showing the transfer unit 4 when the angles of the multiple holders 12 are set to the holding angles.

[0062] When the first setting process is performed, the holder 12A is placed directly above the chip 11A. Specifically, position information of the chip 11A is read from the storage unit 44 and input to the movement control unit 42b. Then, the movement control unit 42b controls the movement mechanism 28 based on the read position information, and adjusts the position of the housing 6 so that the holder 12A overlaps with the chip 11A in the Z-axis direction.

[0063] The angle of the multiple holders 12 before holding the chip 11 is set to a reference angle (initial angle). For example, the reference angle corresponds to the angle of the holders 12 suitable for holding a rectangular chip 11 whose four sides are arranged parallel to the X-axis or Y-axis direction. However, the reference angle can be set arbitrarily.

[0064] Next, the angle information of the tip 11A is read out from the storage unit 44 and input to the angle control unit 42c. Then, the angle control unit 42c controls the motor 18 based on the read angle information to rotate the multiple holders 12 simultaneously.

[0065] Specifically, the angle control unit 42c identifies the angle of the chip 11A based on the angle information of the chip 11A, and sets the angle of the holding unit 12A suitable for holding the chip 11A as the holding angle. For example, when the chip 11A on the sheet 52A is arranged at an angle and the four sides of the chip 11A are inclined at a predetermined angle with respect to the X-axis direction or the Y-axis direction, the angle of the holding unit 12 when the holding unit 12 is rotated by the inclination angle of the chip 11A from the reference angle is set as the holding angle.

[0066] Then, angle control unit 42c outputs a control signal to motor 18 to rotate output shaft 20 of motor 18 by a predetermined angle in a predetermined direction so that the angles of each of multiple holders 12 are set from the reference angle to a holding angle. As a result, each of multiple holders 12 rotates by the same angle in the same direction, and the angles of the multiple holders 12 are collectively set to a holding angle suitable for holding tip 11A.

[0067] Next, the controller 40 executes a process (pickup process) for making a specific holder 12 (holder 12A) pick up a specific chip 11 (chip 11A). When picking up the chip 11A, the holder 12A is advanced (lowered) to make the holder 12A hold the chip 11A (see FIG. 6), and then the holder 12A is retreated (raised) to separate the chip 11A from the sheet 52A of the tray 50A (see FIG. 7).

[0068] 6 is a front view showing the transfer unit 4 when the chip 11A is held by the holder 12A. After the position and angle of the holder 12A are adjusted, the hold control unit 42d controls the movement mechanism 14 connected to the holder 12A to move (lower) the holder 12A along the Z-axis direction and bring the suction surface of the holder 12A into contact with the chip 11A. In this state, the suction force of a suction source (not shown) is applied to the suction surface of the holder 12A, so that the chip 11A is suction-held by the holder 12A.

[0069] In addition, the angle of the holder 12A is set to a holding angle suitable for holding the tip 11A by the above-mentioned first setting process (see FIG. 5). Therefore, no matter what angle (direction) the tip 11A is arranged at, the holder 12A can appropriately suck and hold the tip 11A.

[0070] 7 is a front view showing the transfer unit 4 when the chip 11A is removed from the tray 50A. After the chip 11A is sucked and held by the holder 12A, the hold control unit 42d controls a control signal to the moving mechanism 14 connected to the holder 12A to move the holder 12A backward (upward) along the Z-axis direction. This causes the chip 11A to be removed from the sheet 52A and picked up from the tray 50A.

[0071] The suction force of holding part 12A acting on chip 11A is stronger than the tack force of sheet 52A to chip 11A. Therefore, even if chip 11A is fixed to sheet 52A, holding part 12A can detach chip 11A from sheet 52A.

[0072] Next, the controller 40 executes a process (second setting process) for collectively setting the angles of the plurality of holders 12 to the reference angle. Fig. 8 is a front view showing the transfer unit 4 when the angles of the plurality of holders 12 are set to the reference angle.

[0073] When the holder 12A has completed picking up the chip 11A, the angle control unit 42c outputs a control signal to the motor 18, and rotates the output shaft 20 of the motor 18 by a predetermined angle in a predetermined direction so that the angles of the multiple holders 12 are set from the respective holding angles to the reference angle. As a result, the multiple holders 12 rotate in the opposite direction by the same angle as in the first setting process (see FIG. 5), and the angles of the multiple holders 12 are collectively set to the reference angle. As a result, the angle of the chip 11A held by the holder 12A is adjusted so that the four sides of the chip 11A are aligned with the X-axis direction or the Y-axis direction.

[0074] As described above, the transfer unit 4 can hold the chip 11A at a predetermined angle by rotating the holder 12A with the motor 18 before and after picking up the chip 11A. Note that, although an example in which the rectangular chip 11A is held so that its four sides are aligned along the X-axis direction or the Y-axis direction has been described above, the angle of the chip 11A can be set appropriately depending on the specifications of the transport destination, the shape of the chip 11A, and the like.

[0075] Thereafter, the first setting process (see FIG. 5), the holding process (see FIG. 6 and FIG. 7), and the second setting process (see FIG. 8) are repeated using the other holding units 12, so that the other chips 11 are picked up in sequence by the other holding units 12. As a result, the chips 11 are respectively held by all of the holding units 12, and the angles (orientations) of all the held chips 11 become uniform.

[0076] When all the holders 12 hold the chips 11, the movement control unit 42b controls the moving mechanism 28 (see FIG. 1) to transport the multiple chips 11 to directly above the tray 50B (see FIG. 3). Then, the holding control unit 42d controls the multiple moving mechanisms 14 (see FIG. 1) to move the multiple holders 12 forward (downward). This causes the multiple chips 11 to come into contact with the sheet 52B (see FIG. 3) of the tray 50B. Thereafter, the suction and holding of the multiple chips 11 by the multiple holders 12 is released, so that the multiple chips 11 are placed on the sheet 52B of the tray 50B with the angles aligned.

[0077] As described above, the chip transfer device 2 according to this embodiment includes a motor 18 connected to multiple holders 12, and the rotation of the multiple holders 12 is collectively controlled by the motor 18. This eliminates the need to provide a motor for each of the multiple holders 12, simplifying the configuration of the chip transfer device 2. This allows the chip transfer device 2 to be made smaller, lighter, and more cost-effective.

[0078] Furthermore, the chip transfer device 2 according to this embodiment can pick up the chip 11 while adjusting the angle of the holder 12 in accordance with the angle of the chip 11. This makes it possible to transfer a plurality of chips 11 with the angles aligned.

[0079] There is no limitation on the origin and destination of the multiple chips 11 transferred by the chip transfer device 2 according to this embodiment. For example, the chip transfer device 2 can be used to transport chips 11 between processing devices that process workpieces, between inspection devices that inspect the workpieces, or between a processing device and an inspection device. The chip transfer device 2 can also be used as a transport mechanism that transports chips within a processing device or an inspection device.

[0080] In addition, the structures, methods, etc. according to the above-described embodiments can be modified as appropriate without departing from the scope of the object of the present invention. [Explanation of symbols]

[0081] 11,11A chip 2 Chip transfer device 4. Transport Unit 6 Housing (cover) 6a Bottom 6b Storage section (storage space) 8A,8B Chip holding unit 10 Support shaft 12,12A holding part 14 Moving mechanism 16A, 16B Pulley 18 Motor 20 Output shaft 22A, 22B Connecting member 24A, 24B Intermediate pulley 26 Support Arm 28 Moving mechanism 30 Imaging unit 40 Controller (control unit, control section, control device) 42 Transport Control Section 42a Specific part 42b Movement control section 42c Angle control section 42d Retention control section 44 Memory unit (memory) 50A, 50B Tray 52A, 52B seats

Claims

1. A chip transfer device for transferring a plurality of chips, A plurality of holders each holding the chip; A plurality of moving mechanisms each connected to the holding portion for moving the holding portion; a motor connected to the plurality of holding portions via a connecting member; The motor rotates the plurality of holders in unison.

2. a controller for controlling the holding of the tip by the holding unit; The chip transfer device of claim 1, characterized in that the controller causes the multiple holding parts to hold the chips respectively by repeating a first setting process of controlling the motor to collectively set the angles of the multiple holding parts from a reference angle to a holding angle corresponding to the angle of a specific chip, a pick-up process of controlling the moving mechanism to pick up a specific chip by a specific holding part, and a second setting process of controlling the motor to collectively set the angles of the multiple holding parts from the holding angle to the reference angle.

3. An imaging unit for imaging the chip to generate an image, 3. The chip transfer device according to claim 2, wherein the controller acquires angle information indicating an angle of the specific chip based on the captured image, and sets the holding angle based on the angle information.

4. The coupling member is further provided in a plurality of pulleys connected to the holding portion, the pulleys being connected to the holding portion, and the coupling member is hung therearound.

4. The chip transfer device according to claim 1, wherein each of the pulleys is arranged so as to overlap a part of the other pulleys in the moving direction of the holding portion.

5. 4. The chip transfer device according to claim 1, wherein the plurality of holders pick up the chips from a tray which fixes the chips by tacking force.

Images