Film deposition apparatus

Abstract

To preferably control a position relationship between a member abutting to a substrate and the substrate in a film deposition apparatus for depositing a film with the substrate and a mask aligned.SOLUTION: A film deposition apparatus to be used includes: a chamber for depositing a film on a substrate; a substrate support part that is arranged in the chamber and supports a periphery of the substrate; a mask support part that is arranged in the chamber and supports a mask so as to be parallel to the substrate; first alignment means that adjusts a distance between the substrate and the mask as well as adjusts a relative position in plane with a first member, the substrate, and the mask, the first member being arranged in the chamber through the substrate on an opposite side to the mask and being capable of abutting to the substrate; and second alignment means that adjust a distance between the first member and at least either of the substrate and the mask as well as adjusts a relative position in plane with the first member and at least either of the substrate and the mask.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a film forming apparatus. [Background technology]

[0002] In recent years, the panels used in organic electroluminescence (EL) display devices and the like have become larger, and the substrates used in manufacturing these panels have also become larger. As a result, when manufacturing panels by depositing evaporation material onto a substrate in a deposition chamber, the substrate is increasingly deflecting due to its own weight at the center.

[0003] In order to reduce the bending of the substrate due to its own weight, the method of Patent Document 1 aligns the substrate and the mask, and then presses a cooling plate against the substrate from the opposite side of the substrate on which the film is to be formed. This makes it possible to keep the substrate in close contact with the mask while suppressing the temperature rise of the substrate during film formation. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 6351918 Summary of the Invention [Problem to be solved by the invention]

[0005] However, in the method of Patent Document 1, the positional relationship between the substrate and the cooling plate is not adjusted. Here, since there is a limit to the accuracy of transport when the substrate is brought into the deposition chamber, even if the substrate and the mask are well aligned, it is not guaranteed that the positional relationship between the substrate and the cooling plate is good. If the variation in the positional relationship between the cooling plate for each substrate becomes large, the contact position when the cooling plate is pressed against the substrate may vary, which may affect the positional relationship between the substrate and the mask.

[0006] In addition, when the mask contains a metal material, the mask may be attracted to the substrate by abutting a magnet on the surface opposite to the surface in contact with the mask, thereby increasing the adhesion between the substrate and the mask. However, if the positional relationship between the substrate and the magnet varies greatly from substrate to substrate, this may affect the positional relationship between the substrate and the mask, as in the case of the cooling plate.

[0007] The present invention has been made in consideration of the above problems, and has an object to suitably control the positional relationship between a member that contacts a substrate and the substrate in a film formation apparatus that performs film formation by aligning a substrate and a mask. [Means for solving the problem]

[0008] The present invention employs the following configuration. a chamber in which a film is deposited on a substrate; a substrate support disposed within the chamber and supporting an outer edge of the substrate; a mask support disposed in the chamber and supporting a mask parallel to the substrate; a first member disposed in the chamber on the opposite side of the mask with respect to the substrate, the first member being capable of contacting the substrate; a first alignment means for adjusting the relative positions of the substrate and the mask in a plane and for adjusting the distance between the substrate and the mask; A relative position in a plane between the first member and at least one of the substrate and the mask. a second alignment means for adjusting the position of the first member and the distance between the first member and at least one of the substrate and the mask; The film forming apparatus is characterized by comprising: Effect of the Invention

[0009] According to the present invention, in a film formation apparatus which performs film formation by aligning a substrate and a mask, the positional relationship between a member which comes into contact with the substrate and the substrate can be suitably controlled. [Brief description of the drawings]

[0010] [Figure 1] Schematic diagram of part of an electronic device manufacturing line [Diagram 2] Schematic diagram of a film forming apparatus according to an embodiment. [Diagram 3] FIG. 1 is a perspective view showing a configuration related to alignment. [Figure 4] Alignment and deposition flow chart [Diagram 5] FIG. 1 is a cross-sectional view of a main part showing an alignment state in the first embodiment; [Figure 6] 4 is a cross-sectional view of a main part showing an alignment state in the first embodiment; FIG. [Figure 7] FIG. 1 is a cross-sectional view of a main part showing a film formation process in the first embodiment. [Figure 8] FIG. 11 is a cross-sectional view of a main part showing an alignment state in the second embodiment. [Figure 9] FIG. 11 is a cross-sectional view of a main part showing an alignment state in the third embodiment. [Figure 10] Diagram of the manufacturing process of an organic EL display device DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the mode for carrying out the present invention will be described in detail by way of example with reference to the drawings. However, unless otherwise specified, the dimensions, materials, shapes, relative positions, etc. of the components described in the examples are not intended to limit the scope of the present invention to those alone. Although the embodiments describe a number of features, the embodiments may be modified in various ways. Not all of the features are essential to the invention, and multiple features may be combined in any manner. This may also be the case.

[0012] The present invention is suitable for a film formation apparatus that forms a thin film of a film formation material by deposition or the like on a surface of a film formation target such as a substrate aligned with a mask. The present invention can be understood as an alignment apparatus, a film formation apparatus, an alignment method, and a film formation method. The present invention can also be understood as an electronic device manufacturing apparatus and a control method thereof, and an electronic device manufacturing method. The present invention can also be understood as a program for causing a computer to execute the control method or manufacturing method, or a storage medium storing the program. The storage medium may be a non-transitory storage medium readable by a computer.

[0013] In the present invention, any material can be used for the substrate, such as glass, resin, metal, silicon, etc. Any material can be used for the film formation, such as organic materials and inorganic materials (metals, metal oxides). In the following description, the term "substrate" includes substrate materials on whose surfaces one or more films have already been formed. The technology of the present invention is typically applied to manufacturing equipment for electronic devices and optical components. In particular, it is suitable for organic electronic devices, such as organic EL displays equipped with organic EL elements and organic EL display devices using the same. The present invention can also be used for thin-film solar cells and organic CMOS image sensors.

[0014] [Embodiment 1] The configuration of an apparatus and a process flow in the first embodiment of the present invention will be described.

[0015] <Electronic device manufacturing line> 1 is a schematic diagram showing a part of the configuration of a manufacturing line for electronic devices to which the film forming apparatus of the present invention can be applied. The manufacturing line in FIG. 1 is used, for example, for manufacturing display panels for organic electroluminescence (EL) display devices. The substrates 100 are sequentially transported to the film forming units 301 and film is formed thereon.

[0016] In the film formation unit 301, a plurality of film formation chambers 303a to 303d in which film formation processing is performed on the substrate 100 and a mask storage chamber 305 in which masks before and after use are stored are arranged around a transfer chamber 302. A transfer robot 302a for transferring the substrate 100 is arranged in the transfer chamber 302. The transfer robot 302a includes a hand for holding the substrate 100 and an articulated arm for moving the hand in the horizontal direction. The film formation unit 301 has a cluster type configuration in which a plurality of film formation chambers 303a to 303d are arranged so as to surround the transfer robot 302a. When the film formation chambers 303a to 303d are collectively referred to or when no distinction is made, they are referred to as film formation chambers 303.

[0017] In the transport direction (arrow direction) of the substrate 100, a buffer chamber 306, a swirl chamber 307, and a delivery chamber 308 are disposed on the upstream side and downstream side of the film formation unit 301, respectively. In the manufacturing process, each chamber is maintained in a vacuum state. Although only one film formation unit 301 is illustrated in FIG. 1, the manufacturing line according to this embodiment has a plurality of film formation units 301, and the plurality of film formation units 301 are connected by a connection device composed of the buffer chamber 306, the swirl chamber 307, and the delivery chamber 308. The configuration of the connection device is not limited to this, and may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0018] The transport robot 302a transports the substrate 100 from the upstream delivery chamber 308 to the transport chamber 302, transports the substrate 100 between the film formation chambers 303, transports the mask between the mask storage chamber 305 and the film formation chamber 303, and transports the substrate 100 from the transport chamber 302 to the downstream buffer chamber 306.

[0019] The buffer chamber 306 is a chamber for temporarily storing the substrates 100 depending on the operating status of the production line. The buffer chamber 306 is provided with a substrate storage shelf also called a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure capable of storing a plurality of substrates 100 while maintaining the substrates 100 in a horizontal state with the surfaces to be processed (surfaces to be film-formed) facing downward in the direction of gravity. The lifting mechanism raises and lowers the substrate storage shelf to match the stage where the substrates 100 are carried in or out with the transport position. This allows the buffer chamber 306 to temporarily store and retain a plurality of substrates 100.

[0020] The swirl chamber 307 is equipped with a device for changing the orientation of the substrate 100. In this embodiment, the swirl chamber 307 rotates the orientation of the substrate 100 by 180 degrees using a transport robot provided in the swirl chamber 307. The transport robot provided in the swirl chamber 307 rotates 180 degrees while supporting the substrate 100 received in the buffer chamber 306 and delivers it to the delivery chamber 308, so that the front end and the rear end of the substrate are swapped between the buffer chamber 306 and the delivery chamber 308. As a result, the orientation of the substrate 100 when it is carried into the film formation chamber 303 is the same in each film formation unit 301, so that the scan direction of film formation on the substrate S and the orientation of the mask can be made consistent in each film formation unit 301. With this configuration, the orientation of the mask installed in the mask storage chamber 305 in each film formation unit 301 can be made consistent, simplifying mask management and improving usability.

[0021] The control system of the manufacturing line includes a higher-level device 300 that controls the entire line as a host computer, and control devices 14a-14d, 309, and 310 that control each component, and these can communicate with each other via a wired or wireless communication line 300a. The control devices 14a-14d are provided corresponding to the film formation chambers 303a-303d, and control the film formation apparatus 1 described below. When the control devices 14a-14d are collectively referred to or when there is no need to distinguish between them, they are referred to as the control device 14.

[0022] The control device 309 controls the transfer robot 302a. The control device 310 controls the devices in the swirl chamber 307. The host device 300 transmits information about the substrate 100 and instructions such as transfer timing to each of the control devices 14, 309, and 310, and each of the control devices 14, 309, and 310 controls each component based on the received instructions.

[0023] <Overview of the deposition equipment> FIG. 2 is a schematic diagram of the film forming apparatus 1. The film forming apparatus 1 provided in the film forming chamber 303 is an apparatus for forming a film of a deposition material on a substrate 100, and forms a thin film of the deposition material in a predetermined pattern using a mask 101. Note that the film forming method is not limited to deposition, and various film forming methods such as sputtering can be applied. In the figure, arrow Z indicates the vertical direction (gravity direction), and arrows X and Y indicate horizontal directions perpendicular to each other. Also, for components that appear symmetrically on the left and right, one of the reference symbols may be omitted.

[0024] The film forming apparatus 1 has a box-shaped vacuum chamber 3 (also simply called a chamber) capable of maintaining a vacuum inside. An internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In this embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown). In this specification, "vacuum" refers to a state filled with gas at a pressure lower than atmospheric pressure, in other words, a reduced pressure state. In the internal space 3a of the vacuum chamber 3, a substrate support unit 6 that supports a substrate 100 in a horizontal position, a mask stage 5 that supports a mask 101 so as to be parallel to the substrate 100, a film forming unit 4 as a film forming source (evaporation source), and a plate unit 9 are arranged.

[0025] The mask 101 (mask support) is a metal mask having an opening pattern corresponding to the thin film pattern to be formed on the substrate 100, and is placed on the mask stage 5. The mask stage 5 can be replaced with other means for fixing the mask 101 at a predetermined position. For example, a mechanism for clamping and holding the mask 101 or a mechanism for adsorbing and holding the mask 101 may be used. The mask 101 may be a mask having a structure in which a mask foil having a thickness of about several μm to several tens of μm is welded and fixed to a frame-shaped mask frame. After the substrate 100 and the mask 101 are parallel to each other, their in-plane positions are adjusted relatively. After that, a film formation process is performed with the substrate 100 and the mask 101 overlapped.

[0026] The plate unit 9 (first member) includes a cooling plate 10 (cooling plate) and a magnet plate 11 including a magnet. The magnet plate 11 is provided above the cooling plate 10 so as to be displaceable in the Z direction relative to the cooling plate 10. The plate unit 9 is disposed on the opposite side of the mask 101 across the substrate 100. In other words, the plate unit 9 is disposed on the surface of the substrate 100 opposite to the surface on which a film is to be formed. The cooling plate 10 can come into contact with the substrate 100 by displacing the plate unit 9 in the Z direction.

[0027] The cooling plate 10 has a function of suppressing heat rise by contacting the substrate 100 during film formation. The cooling plate 10 can be a member equipped with a water cooling mechanism or the like to actively cool the substrate 100, or a plate-like member that removes heat from the substrate 100 by thermal conduction. The magnetic plate 11 is a plate-like member that functions as a mask support means that attracts the mask 101 by magnetic force. The magnet of the magnetic plate 11 exerts a magnetic force on the mask 101 from the upper surface of the substrate 100 via the cooling plate 10 and the substrate 100, thereby improving the adhesion between the substrate 100 and the mask 101 and improving the accuracy of film formation according to the pattern.

[0028] It is also possible to provide only one of the cooling plate 10 and the magnet plate 11, and omit the other. In this case, the one of the provided members is the first member. For example, if the heat rise of the substrate 100 is limited, the cooling plate 10 does not need to be provided. Also, if the mask 101 can be held by force using a physical holding mechanism, an electrostatic chuck, or the like, the magnet plate 11 can be provided. In addition, the cooling plate 10 and the magnet plate 11 do not have to move as a unit.

[0029] Furthermore, the plate unit 9 functions as a pressing member that presses the substrate 100 downward after alignment with the mask 101, thereby increasing the degree of contact between the substrate 100 and the mask 101. That is, the pressing member can be considered as the first member. When the plate unit 9 has only the cooling plate 10, the cooling plate 10 functions as the pressing member. When the plate unit 9 has only the magnet plate 11, the magnet plate 11 functions as the pressing member. Also, the plate unit 9 may have neither the cooling plate 10 nor the magnet plate 11, and function only as the pressing member.

[0030] The film forming unit 4 is composed of a container for storing a material, a heater for heating the container, a shutter, an evaporation source drive mechanism, an evaporation rate monitor, etc., and is an evaporation source that deposits an evaporation material onto the substrate 100. The film forming unit 4 is disposed below the mask table 5 in the vertical direction. The film forming unit 4 is disposed on the same side as the mask 101 when viewed from the substrate 100. The film forming unit 4 forms a film on the substrate 100 via the mask 101.

[0031] <Alignment device> The film forming apparatus 1 includes an alignment device 2 that aligns a substrate 100 and a mask 101. The alignment device 2 includes a substrate supporting unit 6, a substrate position adjusting unit 20, a substrate distance adjusting unit 22, a plate position adjusting unit 13, a plate distance adjusting unit 19, a first measurement unit 7, and a second measurement unit 8. Each component of the alignment device will be described below.

[0032] (Substrate support unit) The alignment device 2 includes a substrate support unit 6 (substrate support portion) that supports the outer edge of the substrate 100. The substrate support unit 6 includes a frame-shaped substrate support base 61 supported by a support shaft R1, and a plurality of placement portions 62 protrude from the substrate support base 61 toward the inside of the substrate. The placement portions 62 are also called "receiving claws." When the substrate 100 is carried into the vacuum chamber 3 by the transfer robot 302a, the plurality of placement portions 62 receive and support the edges of the peripheral portion of the substrate 100. The placement portions 62 can be formed of, for example, finger-shaped plate members. When a leaf spring is used as the placement portion 62, the substrate 100 can be pressed against the plate unit 9 by the elastic force of the leaf spring.

[0033] The substrate support unit 6 is provided with a plurality of clamping parts 63 corresponding to the plurality of mounting parts 62. The clamping actuator moves the clamping parts 63 up and down in the Z direction toward the mounting parts 62, thereby switching the substrate 100 between a clamped state and an open state. In the clamped state, the mounting parts 62 and the clamping parts 63 sandwich the substrate 100, thereby fixing the substrate 100.

[0034] (Substrate position adjustment unit / Substrate distance adjustment unit) The alignment apparatus 2 includes a substrate position adjustment unit 20 that adjusts the relative position between the substrate 100, the peripheral portion of which is supported by the substrate support unit 6, and the mask 101. The substrate position adjustment unit 20 adjusts the relative in-plane position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 on the XY plane. The substrate position adjustment unit 20 moves the substrate support unit 6 in the X and Y directions and rotates it around an axis in the Z direction. In the alignment of this embodiment, the position of the mask 101 is fixed and the substrate 100 is displaced, but the mask 101 may be displaced, or both the substrate 100 and the mask 101 may be displaced.

[0035] As an example, the substrate position adjustment unit 20 may have a configuration including a fixed plate fixed on the upper wall portion 30 of the vacuum chamber 3, an actuator arranged on the fixed plate for performing XY movement and θ rotation, and a movable plate that displaces in response to the movement of the actuator. In this embodiment, a first lift plate 220 is connected to the movable plate of the substrate position adjustment unit 20, and the substrate distance adjustment unit 22 is supported by the first lift plate 220.

[0036] The substrate distance adjustment unit 22 is, for example, a rod-shaped linear motion mechanism equipped with an actuator and a ball screw, and can raise and lower the first lift plate 220 in the Z direction. That is, the driving force in the Z direction by the substrate distance adjustment unit 22 is transmitted to the substrate support unit 6 via the first lift plate 220, so that the substrate 100 rises and falls. As a result, the substrate 100 and the mask 101 approach or move away from each other. In addition, the XY movement and θ rotation by the substrate position adjustment unit 20 are transmitted to the substrate support unit 6 via the first lift plate 220, so that the in-plane position of the substrate 100 is adjusted. In this embodiment, the position of the mask table 5 is fixed, and the distance in the Z direction of the substrate support unit 6 is adjusted, but this is not limited to this. The adjustment may be performed by moving the side of the mask table 5, or both the substrate support unit 6 and the mask table 5 may be moved.

[0037] Any configuration may be adopted for the substrate position adjustment unit 20 and the substrate distance adjustment unit 22 as long as the position adjustment and distance adjustment are possible. For example, a substrate carrier that levitates the substrate by magnetic force may be provided. The substrate position adjustment unit 20 and the substrate distance adjustment unit 22 can be collectively referred to as a first alignment means that adjusts the relative position in the plane of the substrate 100 and the mask 101 and adjusts the distance in the normal direction of the plane.

[0038] (Plate position adjustment unit / Plate distance adjustment unit) The plate position adjustment unit 13 is a mechanism that adjusts the position of the plate unit 9 in the XY plane, thereby adjusting the in-plane positional relationship between the plate unit 9 and the substrate 100 (or mask 101). As the plate position adjustment unit 13, for example, a drive mechanism equipped with an actuator that performs XY movement and θ rotation can be used, similar to the substrate position adjustment unit 20. The XY movement and θ rotation by the plate position adjustment unit 13 are transmitted to the plate unit 9 via the support shaft R2, thereby displacing the in-plane position of the plate unit 9. As a result, the cooling plate 10 and the magnet plate 11 are aligned with the substrate 100 (or mask 101).

[0039] The plate distance adjustment unit 19 is, for example, a rod-shaped linear motion mechanism equipped with an actuator and a ball screw, and can raise and lower the second lift plate 230 in the Z direction. That is, the driving force in the Z direction by the plate distance adjustment unit 19 is transmitted to the plate unit 9 via the second lift plate 230, so that the plate unit 9 rises and falls. As a result, the cooling plate 10 and the magnet plate 11 approach or separate from the substrate 100. For example, when pressing the cooling plate 10 against the substrate 100 before film formation, the plate position adjustment unit 13 aligns the substrate 100 and the cooling plate 10, and then the plate distance adjustment unit 19 brings the substrate 100 and the cooling plate 10 closer to each other. Note that this embodiment is not limited to a configuration in which the plate unit 9 moves up and down, and may be a configuration in which the substrate support unit 6 moves up and down, or may be a configuration in which both the plate unit 9 and the substrate support unit 6 move up and down. The plate position adjustment unit 13 and the plate distance adjustment unit 19 can be collectively referred to as a second alignment means that adjusts the relative positions in the plane between the substrate 100 and / or mask 101 and the cooling plate 10 and / or magnet plate 11, and adjusts the distance in the normal direction to the plane.

[0040] (Measuring unit) The alignment device 2 is a substrate 100 having a peripheral portion supported by a substrate support unit 6. The present embodiment is equipped with measurement units (first measurement unit 7 and second measurement unit 8) that measure the positional deviation of the substrate 100 and the mask 101. Description will be made with reference to FIG. 5 in addition to FIG. 2. FIG. 5 is an explanatory diagram of the first measurement unit 7 and the second measurement unit 8, and shows the manner in which the positional deviation between the substrate 100 and the mask 101 is measured. The first measurement unit 7 and the second measurement unit 8 in this embodiment are both imaging devices (cameras) that capture images. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall portion 30, and are capable of capturing images of the inside of the vacuum chamber 3 through a window portion formed in the upper wall portion 30.

[0041] 3, substrate rough alignment mark 100a and substrate fine alignment mark 100b are formed on substrate 100, and mask rough alignment mark 101a and mask fine mark 101b are formed on mask 101. Hereinafter, substrate rough alignment mark 100a will be referred to as substrate rough mark 100a, substrate fine alignment mark 100b will be referred to as substrate fine mark 100b, and both will be collectively referred to as substrate marks. Further, mask rough alignment mark 101a will be referred to as mask rough mark 101a, mask fine alignment mark 101b will be referred to as mask fine mark 101b, and both will be collectively referred to as mask marks.

[0042] Substrate rough mark 100a is formed in the center of a short side of substrate 100. Substrate fine marks 100b are formed at the four corners of substrate 100. Mask rough mark 101a is formed in the center of a short side of mask 101 in correspondence with substrate rough mark 100a. Furthermore, mask fine mark 101b is formed in the four corners of mask 101 in correspondence with substrate fine mark 100b.

[0043] The first measurement unit 7 is a low-magnification CCD camera having a relatively wide field of view but low resolution, and measures a rough positional deviation between the substrate 100 and the mask 101. Although Fig. 3 shows a configuration in which the entire substrate 100 is imaged by one first measurement unit 7, the present invention is not limited to this, and a total of two first measurement units 7, one on each short side, may be provided.

[0044] Four second measurement units 8 are provided (second measurement units 8a to 8d) so as to capture images of each pair (four pairs in this case) of corresponding substrate fine marks 100b and mask fine marks 101b. The second measurement units 8 are high-magnification CCD cameras with a relatively narrow field of view but high resolution. The configurations of the first measurement unit and the second measurement unit 8 are not limited to this. For example, the number and positions of the cameras used for rough alignment and fine alignment can be appropriately determined according to the size of the substrate and the required alignment accuracy. The type of camera is also not limited to CCD cameras, and CMOS cameras or other imaging means may be used.

[0045] In this embodiment, after rough positional adjustment between the substrate 100 and the mask 101 is performed based on the measurement results of the first measurement unit 7, precise positional adjustment between the substrate 100 and the mask 101 is performed based on the measurement results of the second measurement unit 8.

[0046] <Control device> The control device 14 includes a processing unit 141, a storage unit 142, an I / O 143 as an input / output interface, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 is a processor such as a CPU, and controls the film forming apparatus 1 by executing a program stored in the storage unit 142. The storage unit 142 is a storage device such as a ROM, a RAM, or a HDD, and stores various types of control information in addition to the program executed by the processing unit 141. The I / O 143 transmits and receives signals between the processing unit 141 and an external device.

[0047] The communication unit 144 communicates with a host device 300 or other control devices 14, 30 via a communication line 300a. The control devices 14, 309, 310 and the host device 300 are communication devices that communicate with each other, and the processing unit 141 receives information from the host device 300 via the communication unit 144, or transmits information to the host device 300. The display unit 145 is, for example, a liquid crystal display, and displays various information. The input unit 146 is, for example, a keyboard or a pointing device, and accepts various inputs from the user. Note that all or part of the control devices 14, 309, 310 and the host device 300 may be configured with a PLC, an ASIC, or an FPGA.

[0048] <Processing flow> A description will be given of the process flow of the embodiment 1. In this embodiment, alignment is performed between the plate unit 9 and the substrate 100, and the timing of the alignment is after rough alignment has been performed.

[0049] The flowchart in Fig. 4 begins at the point when loading of the substrate 100 into the vacuum chamber 3 begins. In step S101, the transfer robot 302a, with the substrate 100 placed on its fingers, enters the vacuum chamber 3 and places the substrate 100 on the placement portion 62 of the substrate support unit 6. Fig. 5(a) is a cross-sectional view of the vacuum chamber 3 at the time of S101, and shows only the components necessary for explanation.

[0050] In step S102, as shown in FIG. 5(b), rough alignment of the substrate 100 and the mask 101 is performed. At this time, after the transfer robot 302a retreats from the vacuum chamber 3, the clamp portion 63 of the substrate support unit 6 descends and clamps the substrate 100 between the clamp portion 63 and the placement portion 62. Then, the substrate distance adjustment unit 22 descends the substrate support unit 6, and the distance between the substrate 100 and the mask 101 is set as the rough alignment distance S1. Then, the first measurement unit 7 captures the substrate rough mark 100a and the mask rough mark 101a to obtain an image. The control device 14 determines whether the positional relationship (distance and angle) between the substrate rough mark 100a and the mask rough mark 101a in the image is within a predetermined range, and if it is outside the predetermined range, causes the substrate position adjustment unit 20 to adjust the in-plane position of the substrate 100. Then, when the positional relationship is within the predetermined range, the rough alignment is completed.

[0051] In step S103, the plate unit 9 and the substrate 100 are aligned, which is characteristic of this embodiment. Since the plate unit 9 includes the cooling plate 10 and the magnet plate 11, in step S103, it can be said that the cooling plate 10 and the substrate 100 are aligned, or that the magnet plate 11 and the substrate 100 are aligned. In addition, considering that the substrate 100 and the mask 101 have been roughly aligned at the time of step S103, it can be said that the plate unit 9 and the mask 101 are aligned, or that the cooling plate 10 and the mask 101 are aligned, or that the magnet plate 11 and the mask 101 are aligned. In addition, considering that the plate unit 9 can also function as a pressing member that presses the substrate 100 against the mask 101, it can be said that the pressing member and the substrate 100 are aligned, or that the pressing member and the mask 101 are aligned.

[0052] In this step S103, as shown in FIG. 6(a), first, the plate distance adjustment unit 19 is driven to lower the plate unit 9, thereby bringing the distance between the lower surface of the plate unit 9 and the substrate 100 closer to a predetermined plate alignment distance S2. Then, the first measurement unit 7 captures an image of the plate unit 9 and the substrate 100. The control device 14 analyzes the plate unit 9 and the substrate 100 in the image and judges whether they are within a predetermined positional relationship range. Note that, during the image analysis, the position of the mark provided on the plate unit 9 may be compared with the position of the substrate rough mark, or a judgment may be made based on the respective shapes of the plate unit 9 and the substrate 100. Also, instead of the first measurement unit 7, the second measurement unit 7 may be used. An image may be captured by unit 8. If the positional relationship is outside a predetermined range, plate position adjustment unit 13 is caused to adjust the in-plane position of plate unit 9. Then, when the positional relationship is within the predetermined range, alignment of plate unit 9 is completed.

[0053] In step S104, as shown in FIG. 6(b), highly accurate fine alignment of the substrate 100 and the mask 101 is performed. First, the substrate distance adjustment unit 22 lowers the substrate support unit 6 to bring the distance between the substrate 100 and the mask 101 closer to the fine alignment distance S3. Then, the second measurement unit 8 captures the substrate fine mark 100b and the mask fine mark 101b to obtain an image. The control device 14 determines whether the positional relationship (distance and angle) between the substrate fine mark 100b and the mask fine mark 101b in the image is within a predetermined range, and if it is outside the predetermined range, causes the substrate position adjustment unit 20 to adjust the in-plane position of the substrate 100. Then, when the positional relationship is within the predetermined range, the fine alignment is completed.

[0054] In step S105, as shown in FIG. 7(a), the plate unit 9 presses the substrate 100 and the mask 101 to bring them into close contact with each other. First, the substrate distance adjustment unit 22 further lowers the substrate support unit 6 so that the lower surface of the substrate 100 and the upper surface of the mask 101 are at the same height, bringing the substrate 100 and the mask 101 into close contact with each other. Then, the clamp section 63 rises to move the end of the substrate 100 from the clamped state to the released state. Then, the plate distance adjustment unit 19 lowers the plate unit 9 to press the substrate 100 against the mask 101. At this time, since the clamp on the end of the substrate is released, the bending or waviness of the substrate 100 is relieved toward the end of the substrate, improving the flatness of the substrate 100.

[0055] In step S106, a film formation process is performed as shown in Fig. 7(b). At this time, the control device 14 applies an electric current to a heater of the film formation unit 4, which is a film formation source, to heat the deposition material. As a result, the vaporized deposition material is ejected from the film formation unit 4 and adheres to the film formation surface of the substrate 100 through the mask 101. As a result, a thin film according to the mask pattern is formed.

[0056] In this flow, since the plate unit 9 fixes the substrate 100 after the fine alignment is completed, the substrate 100 and the mask 101 are aligned with high precision, and the contact state between the substrate 100 and the mask is stable. In addition, the cooling plate 10 included in the plate unit 9 suppresses the temperature rise of the substrate 100, which contributes to the stability of the film formation. In addition, the magnet plate 11 included in the plate unit 9 attracts the mask, and the contact state between the substrate 100 and the mask 101 is stable. Furthermore, since the plate unit 9 and the substrate 100 are aligned in step S103, the substrate 100 can be fixed with high precision by the plate unit 9, and there is no risk of misalignment when the plate unit 9 is pressed against the substrate 100.

[0057] [Embodiment 2] Next, a description will be given of a second embodiment of the present invention. Descriptions of configurations and processes similar to those of the first embodiment will be omitted.

[0058] 8, before the substrate is loaded into the vacuum chamber 3, the plate unit 9 and the mask 101 are aligned. Since the plate unit 9 includes the cooling plate 10 and the magnet plate 11, in this embodiment, it can be said that the cooling plate 10 and the mask 101 are aligned, or that the magnet plate 11 and the mask 101 are aligned. In addition, considering that the plate unit 9 can also function as a pressing member that presses the substrate 100 against the mask 101, it can be said that the pressing member and the mask 101 are aligned in this embodiment.

[0059] In this embodiment, the plate unit 9 and the mask 101 are aligned before the substrate 100 is carried in. Note that the substrate 100 is aligned with the mask 101 by rough alignment and fine alignment in a subsequent process, so that the positional relationship between the plate unit 9, the substrate 100, and the mask 101 falls within a suitable range.

[0060] [Embodiment 3] Next, a third embodiment of the present invention will be described. Descriptions of configurations and processes similar to those of the above-mentioned embodiments will be omitted.

[0061] 9, in this embodiment, before fine alignment of the substrate 100 and the mask 101 is performed, the plate unit 9 and the mask 101 are aligned. That is, after the substrate 100 reaches the fine alignment distance S3, the plate distance adjustment unit 19 lowers the plate unit 9 to bring it closer to the substrate 100. Then, based on the image captured by the second measurement unit 8, the control device 14 adjusts the in-plane position of the plate unit 9 using the plate position adjustment unit 13 until the positional relationship between the plate unit 9 and the substrate 100 falls within a predetermined range.

[0062] Since the plate unit 9 includes the cooling plate 10 and the magnet plate 11, in this embodiment, it can be said that the cooling plate 10 and the substrate 100 are aligned, and it can be said that the magnet plate 11 and the substrate 100 are aligned. Considering that the plate unit 9 can also function as a pressing member that presses the substrate 100 against the mask 101, it can be said that the pressing member and the substrate 100 are aligned in this embodiment. Considering that the substrate 100 and the mask 101 have already been roughly aligned, it can be said that the plate unit 9 (or any one of the cooling plate 10, the magnet plate 11, and the pressing member) and the mask 101 are aligned in this embodiment.

[0063] [Other embodiments] The present invention can take various modified forms. For example, the alignment of the substrate 100 and the mask 101 may be a one-step alignment instead of a two-step alignment. In the case of a one-step alignment, the timing of the position adjustment of the plate unit 9 may be any time before the plate unit 9 presses the substrate 100. For example, the timing may be any of the following: before the substrate is carried in, after the substrate is carried in, before the alignment of the substrate and the mask, and after the alignment of the substrate and the mask.

[0064] In the above embodiment, the cooling plate 10 and the magnet plate 11 are displaced as one unit, but they may be separate. In that case, it is preferable to adjust the position between the plate closer to the substrate 100 and the substrate 100. Also, the plate unit 9 may be configured to include only one of the cooling plate 10 and the magnet plate 11.

[0065] In the above embodiment, the plate unit 9 is moved relative to the substrate 100 or the mask 101. However, the present invention is not limited to this. The substrate 100 or the mask 101 may be moved relative to the plate unit 9.

[0066] In the above embodiment, the plate unit 9 is imaged using a camera (the first measurement unit 7 or the second measurement unit 8) used for aligning the substrate 100 and the mask 101, but this is not limiting. For example, a camera for aligning the plate unit 9 may be disposed above the vacuum chamber 3. Also, the plate unit 9 may be imaged using a measuring device such as an encoder. The position information of the target unit 9 may be acquired.

[0067] As described above, according to each embodiment of the present invention, even if the position of the substrate 100 in the chamber is not constant due to a problem with the accuracy of the transfer robot 302a, for example, the positional relationship between the substrate 100 and / or the mask 101 and the cooling plate 10 and / or the magnet plate 11 can be kept within a suitable range. As a result, when the substrate 100 is brought into close contact with the mask 101 by the cooling plate 10 and / or the magnet plate 11, the possibility that the positional relationship between the substrate 100 and the mask 101 will be shifted can be reduced.

[0068] <Electronic device manufacturing method> Next, a description will be given of an example of a method for manufacturing an electronic device using the film forming apparatus of this embodiment. Below, the configuration of an organic EL display device will be shown as an example of an electronic device, and a method for manufacturing the organic EL display device will be illustrated.

[0069] First, the organic EL display device to be manufactured will be described. Fig. 10(a) is an overall view of an organic EL display device 180, and Fig. 10(b) shows the cross-sectional structure of one pixel.

[0070] As shown in FIG. 10(a), a plurality of pixels 52 each including a plurality of light-emitting elements are arranged in a matrix in a display area 51 of an organic EL display device 50. Although details will be described later, each light-emitting element has a structure including an organic layer sandwiched between a pair of electrodes. Note that the pixel here refers to the smallest unit that allows a desired color to be displayed in the display area 51. In the case of the organic EL display device according to this embodiment, the pixel 52 is configured by a combination of a first light-emitting element 52R, a second light-emitting element 52G, and a third light-emitting element 52B that emit light different from each other. The pixel 52 is often configured by a combination of a red light-emitting element, a green light-emitting element, and a blue light-emitting element, but may also be a combination of a yellow light-emitting element, a cyan light-emitting element, and a white light-emitting element, and is not particularly limited as long as it is at least one color.

[0071] Fig. 10(b) is a schematic partial cross-sectional view taken along line AB in Fig. 10(a). The pixel 52 is made up of a plurality of light-emitting elements, and each light-emitting element has a first electrode (anode) 54, a hole transport layer 55, any one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a second electrode (cathode) 58 on a substrate 53. Among these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In this embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to the light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively.

[0072] The first electrode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the second electrode 58 may be formed in common for the plurality of light-emitting elements 52R, 52G, and 52B, or may be formed for each light-emitting element. In order to prevent the first electrode 54 and the second electrode 58 from being shorted out by foreign matter, an insulating layer 59 is provided between the first electrodes 54. Furthermore, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer 40 is provided to protect the organic EL element from moisture and oxygen.

[0073] 10(b), the hole transport layer 55 and the electron transport layer 57 are shown as single layers, but depending on the structure of the organic EL display element, they may be formed of multiple layers including a hole blocking layer and an electron blocking layer. In addition, a hole injection layer having an energy band structure that can smoothly inject holes from the first electrode 54 to the hole transport layer 55 can be formed between the first electrode 54 and the hole transport layer 55. Similarly, an electron injection layer can be formed between the second electrode 58 and the electron transport layer 57.

[0074] Next, an example of a method for manufacturing an organic EL display device will be specifically described.

[0075] First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and a first electrode 54 are formed is prepared.

[0076] An acrylic resin is formed by spin coating on the substrate 53 on which the first electrode 54 is formed, and the acrylic resin is patterned by lithography so as to form an opening in the portion where the first electrode 54 is formed, thereby forming an insulating layer 59. This opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0077] The substrate 53 on which the insulating layer 59 has been patterned is carried into a first organic material film forming apparatus, and the substrate is held by a substrate support table and an electrostatic chuck, and a hole transport layer 55 is formed as a common layer on the first electrodes 54 in the display region. The hole transport layer 55 is formed by vacuum deposition. In practice, the hole transport layer 55 is formed to be larger than the display region 51, so that a high-definition mask is not required.

[0078] Next, the substrate 53 on which the hole transport layer 55 has been formed is carried into a second organic material film forming apparatus and held by a substrate support table and an electrostatic chuck. The substrate and a mask are aligned, and the substrate is placed on the mask. A red light emitting layer 56R is formed on the portion of the substrate 53 where the red light emitting element is to be disposed.

[0079] Similar to the formation of the light-emitting layer 56R, a green light-emitting layer 56G is formed by a third organic material film formation apparatus, and a blue light-emitting layer 56B is formed by a fourth organic material film formation apparatus. After the formation of the light-emitting layers 56R, 56G, and 56B is completed, an electron transport layer 57 is formed over the entire display area 51 by a fifth film formation apparatus. The electron transport layer 57 is formed as a layer common to the three color light-emitting layers 56R, 56G, and 56B.

[0080] The substrate on which the electron transport layer 57 has been formed is moved in a metallic evaporation material deposition device, and a second electrode 58 is deposited.

[0081] Thereafter, the substrate is transferred to a plasma CVD apparatus, where a protective layer 40 is formed, and the organic EL display device 50 is completed.

[0082] If the substrate 53 on which the insulating layer 59 is patterned is exposed to an atmosphere containing moisture or oxygen from the time when it is carried into the film forming apparatus until the film formation of the protective layer 40 is completed, the light emitting layer made of an organic EL material may be deteriorated by moisture or oxygen. Therefore, in this embodiment, the substrate is carried in and out of the film forming apparatus in a vacuum atmosphere or an inert gas atmosphere. [Explanation of symbols]

[0083] 3: vacuum chamber, 5: mask table, 6: substrate support unit, 9: plate unit, 10: cooling plate, 11: magnet plate, 13: plate position adjustment unit, 19: plate distance adjustment unit, 20: substrate position adjustment unit, 22: substrate distance adjustment unit, 62: placement unit

Claims

1. a chamber in which a film is deposited on a substrate; a substrate support disposed within the chamber and supporting an outer edge of the substrate; a mask support disposed in the chamber and supporting a mask parallel to the substrate; a first member disposed in the chamber on the opposite side of the mask with respect to the substrate, the first member being capable of contacting the substrate; a first alignment means for adjusting a relative position between the substrate and the mask in a plane and for adjusting a distance between the substrate and the mask; a second alignment means for adjusting a relative position between the first member and at least one of the substrate and the mask in a plane, and for adjusting a distance between the first member and at least one of the substrate and the mask; A film forming apparatus comprising:

2. The first member is a cooling plate that contacts the substrate to suppress a temperature rise of the substrate.

2. The film forming apparatus according to claim 1.

3. The first member is a magnet that attracts the mask via the substrate.

2. The film forming apparatus according to claim 1.

4. The first member is a pressing member that presses the substrate toward the mask.

2. The film forming apparatus according to claim 1.

5. The second alignment means adjusts the relative position and distance in a plane between the first member and the mask before the substrate is loaded into the chamber.

5. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus having a film forming section.

6. The second alignment means adjusts the relative position and distance between the first member and the substrate in a plane after the substrate is carried into the chamber.

5. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus having a film forming section.

7. The second alignment means adjusts the relative position and distance in a plane between the first member and the substrate after the first alignment means adjusts the relative position and distance in a plane between the substrate and the mask.

5. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus having a film forming section.

8. The first alignment means performs a two-stage alignment including a rough alignment for roughly adjusting the relative position and distance between the substrate and the mask in the plane, and a fine alignment for highly accurately adjusting the relative position and distance between the substrate and the mask in the plane.

5. The film forming apparatus according to claim 1, wherein the film forming apparatus is a film forming apparatus having a film forming section.

9. The second alignment means adjusts the relative position and distance in a plane between the first member and the substrate after the rough alignment and before the fine alignment.

9. The film forming apparatus according to claim 8.

10. The second alignment means adjusts the relative position and distance between the first member and the substrate in a plane after the rough alignment and the fine alignment.

9. The film forming apparatus according to claim 8.

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