Vaporization device, water vapor treatment system, and water vapor treatment method

Abstract

To provide a technique capable of stably supplying water vapor while promoting miniaturization of a device.SOLUTION: A vaporization device generates water vapor. The vaporization device includes: a first cylindrical unit having a central axis extending in a vertical direction; and two second cylindrical units projecting symmetrically in a direction orthogonal to the central axis, forming a T-shape between the first cylindrical unit and the second cylindrical unit, and having a water storage space therein. Further, the vaporization device includes: a plurality of water vapor releasing pipes connected to an upper end of the first cylindrical unit and configured to release water vapor from the water storage space; and a heating device in contact with a lower portion of the two second cylindrical units and configured to heat the two second cylindrical units.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a vaporizer, a water vapor processing system, and a water vapor processing method. [Background technology]

[0002] Patent Document 1 discloses a water vapor processing system that generates water vapor using a vaporizer and supplies the generated water vapor to a processing vessel, thereby reacting with chlorine or chlorine-based compounds remaining on substrates in the processing vessel to remove the chlorine or chlorine-based compounds. In this type of water vapor processing system, it is considered to install multiple processing vessels in order to improve the efficiency of water vapor processing for multiple substrates. However, installing multiple vaporizers corresponding to multiple processing vessels increases the footprint and costs. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-22938 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a technique that can stably supply water vapor while facilitating miniaturization of the device. [Means for solving the problem]

[0005] According to one aspect of the present disclosure, there is provided an evaporation device for generating water vapor, comprising: a first cylindrical portion having a central axis extending vertically; two second cylindrical portions extending symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the first cylindrical portion, the two second cylindrical portions having a water storage space therein; a plurality of water vapor discharge pipes connected to the upper end of the first cylindrical portion for releasing water vapor from the water storage space; and a heating device in contact with the lower portions of the two second cylindrical portions for heating the two second cylindrical portions. Effect of the Invention

[0006] According to one aspect, water vapor can be stably supplied while facilitating miniaturization of the device. [Brief description of the drawings]

[0007] [Figure 1] 1 is a block diagram illustrating an overall configuration of a water vapor processing system according to an embodiment. [Diagram 2] 1 is a side view showing an example of installation of a processing device main body and a vaporization device in a water vapor processing system. FIG. [Diagram 3] Fig. 3(A) is a side cross-sectional view taken along the central axis of the vertical cylindrical portion and the cylindrical portion of the main tank. Fig. 3(B) is a cross-sectional view taken along line IIIB-IIIB of Fig. 3(A). Fig. 3(C) is a plan view of the main tank. [Figure 4] Fig. 4(A) is a side view showing a water vapor discharge pipe according to an embodiment, and Fig. 4(B) is a graph showing the relationship between the diameter of an orifice and the flow rate of water vapor. [Diagram 5] 2 is a flowchart showing a water vapor processing method according to the embodiment. [Figure 6] Fig. 6(A) is a cross-sectional view illustrating a water level sensor of an evaporation device, and Fig. 6(B) is a graph showing changes in temperature and pressure of liquid water accompanying refilling of the main tank with liquid water. [Figure 7] Fig. 7(A) is a graph showing the change in steam flow rate and water temperature in an alternating pattern of two processing vessels, and Fig. 7(B) is a graph showing the change in steam flow rate and water temperature in a synchronous pattern of two processing vessels. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0009] Fig. 1 is a block diagram showing a schematic overall configuration of a water vapor processing system 1 according to an embodiment. As shown in Fig. 1, the water vapor processing system 1 according to the embodiment is provided in a substrate processing system 100 that forms a plurality of light-emitting elements and semiconductor devices for driving the light-emitting elements on the surface of a substrate G. For example, the substrate processing system 100 has a substrate processing apparatus 2 that forms electrodes for a plurality of semiconductor devices using a processing gas containing chlorine (Cl). The water vapor processing system 1 is incorporated in a process subsequent to this substrate processing apparatus 2, and performs water vapor processing that removes residues on the substrate G using water vapor.

[0010] An example of the substrate G to be subjected to the water vapor treatment is a glass substrate applied to a flat panel display (FPD) such as a liquid crystal display (LCD). In this case, a thin film transistor is formed as a semiconductor device on the surface of the substrate G. The thin film transistor is formed by performing a dry etching process on a metal film laminated on an insulating layer of the substrate G using a process gas containing chlorine (Cl), such as chlorine gas (Cl2), boron trichloride (BCl3), or carbon tetrachloride (CCl4), to form an electrode. Therefore, chlorine remains on the substrate G after the electrode is formed. As the metal film forming the electrode, for example, a laminated film such as Ti / Al / Ti is used.

[0011] The water vapor processing system 1 includes a processing apparatus main body 10 that performs water vapor processing on a substrate G as an after-treatment after the formation of electrodes. The processing apparatus main body 10 exposes the substrate G to water vapor in the water vapor processing, thereby causing chlorine or chlorine-based compounds remaining on the surface of the substrate G to react with the water vapor to generate hydrogen chloride (HCl). The generated hydrogen chloride is separated from the substrate G. As a result, chlorine and chlorine-based compounds are removed from the surface of the substrate G, and the generation of substances that cause corrosion, such as aluminum hydroxide, is suppressed on the substrate G.

[0012] In order to perform the above water vapor treatment, the water vapor treatment system 1 includes, in addition to the treatment device main body 10, a supply unit 20 that supplies water vapor to the treatment device main body 10, and a discharge unit 50 that discharges waste material containing water vapor from the treatment device main body 10. The water vapor treatment system 1 also has a control unit 70 that controls the water vapor treatment system 1. The control unit 70 controls the treatment of the water vapor treatment system 1 based on a command from a control device (not shown) that controls the entire substrate treatment system 100. The control device of the substrate treatment system 100 may also serve as the control unit 70 of the water vapor treatment system 1.

[0013] The processing apparatus main body 10 includes a plurality of processing vessels 11 (two in FIG. 1) that accommodate substrates G therein and perform water vapor processing. Each processing vessel 11 has, for example, a processing space 11s therein for performing water vapor processing on the substrate G, and also has a loading / unloading port 12 through which the substrate G can be loaded and unloaded between the outside of each processing vessel 11 and the processing space 11s (see FIG. 2). The loading / unloading port 12 is opened and closed by a gate valve (not shown). Note that the processing apparatus main body 10 preferably includes a plurality of processing vessels 11 to improve the efficiency of water vapor processing, but the number is not particularly limited, and three or more may be included. A supply path 20L of a supply unit 20 and a discharge path 50L of a discharge unit 50 are connected to each processing vessel 11.

[0014] Supply unit 20 of water vapor processing system 1 forms an upstream portion of water vapor processing system 1 that generates water vapor from liquid water (H2O: hereinafter referred to as liquid water) and supplies the water vapor to processing device main body 10 via supply path 20L. Supply unit 20 includes, in order from the upstream side to the downstream side in the flow direction of liquid water in supply path 20L, factory water supply source 21, water storage tank 22, and vaporizer 30.

[0015] The factory water supply source 21 is a supply source of liquid water in a factory, and may have various structures for producing liquid water with no or few impurities. For example, the factory water supply source 21 is connected to an external supply source that supplies city water, and has an impurity removal section (not shown) such as a filter, and a pump (not shown) that pumps the liquid water. The factory water supply source configured in this way can steadily send liquid water, from which impurities have been removed, from the upstream side of the supply section 20 to the downstream side by the pump.

[0016] The water storage tank 22 is formed as a cylindrical body that is long in the vertical direction and has a bottom, has an internal space of a predetermined volume, and temporarily stores the supplied liquid water.

[0017] On the other hand, the vaporizer 30 of the supply unit 20 heats the liquid water supplied from the water storage tank 22, vaporizes it into water vapor, and causes the water vapor to flow into the downstream supply path 20L. The configuration of the vaporizer 30 will be described in detail later.

[0018] On the other hand, the discharge unit 50 forms a downstream portion of the water vapor processing system 1 that discharges waste products (such as water vapor supplied to the processing space 11s of the processing vessel 11 and hydrogen chloride which is a product of the water vapor processing) from each processing vessel 11 of the processing apparatus main body 10 via a discharge path 50L. The discharge unit 50 includes, in order from the upstream side to the downstream side in the flow direction of the waste products in the discharge path 50L, a plurality of dry pumps 51, a heat exchanger 52, a discharge side tank 53, a waste liquid pump 54, a factory waste liquid unit 55, and a factory exhaust unit 56.

[0019] The dry pumps 51 are connected to the processing vessels 11 via branched exhaust paths 50L. Each dry pump 51 applies a negative pressure to the processing space 11s of the connected processing vessel 11 (suctions the processing space 11s) under the control of the controller 70. As a result, each dry pump 51 creates a vacuum atmosphere (reduced pressure atmosphere) in the processing space 11s of the connected processing vessel 11, and discharges waste from the processing apparatus main body 10 to the discharge part 50. Each dry pump 51 also pumps the waste that has discharged from the processing apparatus main body 10 to the discharge path 50L downstream of the dry pump 51.

[0020] The heat exchanger 52 is a gas-liquid separation unit that separates the discharged material into exhaust gas (gas) and waste liquid (liquid) by cooling the discharged material that has flowed in from the discharge path 50L. This heat exchanger 52 can be configured in a known manner. For example, the heat exchanger 52 can be configured to include a main body that is provided around a common discharge pipe (not shown) and performs heat exchange using a refrigerant, a chiller unit that cools the refrigerant, and a circulation path having a pump that circulates the refrigerant between the main body and the chiller unit (all not shown). In addition, the heat exchanger 52 may be capable of adjusting the temperature of the discharged material based on the control of the control unit 70. Alternatively, instead of providing the main body around the common discharge pipe, a flow path through which the discharged material flows directly may be provided in the main body to perform efficient heat exchange. The gas-liquid separation unit is not limited to the heat exchanger 52, and various structures that separate the discharged material into exhaust gas and waste liquid may be applied.

[0021] The discharge tank 53 is provided vertically below the heat exchanger 52 and is formed as a vertically long cylinder with a bottom. The exhaust gas and waste liquid separated by the heat exchanger 52 flow into the discharge tank 53 via the discharge path 50L. The exhaust gas and waste liquid maintain a separated state in the internal space, with the waste liquid accumulating at the bottom side and the exhaust gas accumulating at the upper end side. The inner surface of the discharge tank 53 is coated to suppress corrosion by hydrogen chloride.

[0022] The discharge unit 50 connects the discharge tank 53 and the factory drainage unit 55 via a drainage path 61 (part of the drainage path 50L). The drainage path 61 is connected to the bottom side of the discharge tank 53, and is configured to allow the liquid stored in the discharge tank 53 to flow through it. In addition, the drainage path 61 is provided with a drainage pump 54 that sucks up the drainage stored in the discharge tank 53 and sends it to the factory drainage unit 55. The operation and stop of the drainage pump 54, the amount of drainage sent out, etc. are controlled by the control unit 70.

[0023] The factory drainage section 55 is a place or device that can continuously receive the wastewater discharged from the discharge tank 53. The factory drainage section 55 may be, for example, a wastewater treatment device that is installed inside or outside the factory and can collectively treat liquids discharged from other equipment in the factory, or a drainage pipe leading to the outside of the factory.

[0024] Furthermore, the exhaust unit 50 connects the discharge tank 53 and the factory exhaust unit 56 through an exhaust path 62 (a part of the exhaust path 50L). The exhaust path 62 is connected to the upper end side of the discharge tank 53 and is configured to allow the gas accumulated in the discharge tank 53 to circulate.

[0025] The factory exhaust unit 56 is a place or device that can continuously receive the gas discharged from the discharge tank 53. The factory exhaust unit 56 may be, for example, an exhaust treatment device that is installed inside or outside a factory and can collectively treat gases discharged from other facilities in the factory.

[0026] Next, the installation state of the processing device main body 10 and the vaporizer 30 will be described with reference to Fig. 2. Fig. 2 is a side view that shows a schematic example of the installation of the processing device main body 10 and the vaporizer 30 in the water vapor processing system 1. As shown in Fig. 2, the vaporizer 30 is disposed vertically below the processing device main body 10, and supplies the generated water vapor to the processing device main body 10 above. Note that the vaporizer 30 is not limited to being disposed vertically below the processing device main body 10, but may be disposed laterally below. Also, as long as the water vapor can be smoothly supplied, the vaporizer 30 is not limited to being disposed on the lower side.

[0027] As described above, the processing apparatus main body 10 includes two processing vessels 11. Hereinafter, the upper processing vessel 11 in Fig. 2 is also referred to as a first processing vessel 11A, and the lower processing vessel 11 in Fig. 2 is also referred to as a second processing vessel 11B. The first processing vessel 11A and the second processing vessel 11B have the same shape and configuration.

[0028] For example, the first processing vessel 11A and the second processing vessel 11B each have a mounting table 13 on which the substrate G is placed, and a shower head 14 that discharges water vapor onto the entire surface of the substrate G placed on the mounting table 13. The mounting table 13 has a plurality of lift pins (not shown) for receiving and transferring the substrate G to and from a transfer device (not shown) that transfers the substrate G. The mounting table 13 may also have a temperature adjustment mechanism (not shown) that can adjust the temperature of the placed substrate G to a temperature appropriate for the water vapor treatment.

[0029] The shower head 14 is provided vertically above the mounting table 13, and horizontally diffuses the water vapor supplied from the water vapor inlet 15 of each processing vessel 11, and uniformly discharges the water vapor into the processing space 11s through a plurality of holes. In addition to the above configuration, the processing apparatus main body 10 may also include a purge gas supply unit (not shown) that supplies a purge gas (inert gas) such as nitrogen to the processing space 11s to purge exhaust from the processing space 11s.

[0030] The water vapor introduction section 15 of the first processing vessel 11A and the water vapor introduction section 15 of the second processing vessel 11B are each connected to a supply path 20L of the supply section 20. Specifically, a first water vapor supply pipe 20L1 is connected to the first processing vessel 11A. A second water vapor supply pipe 20L2 is connected to the second processing vessel 11B. The first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2 are connected to a plurality (two) water vapor discharge pipes 38 of the vaporizer 30 described below.

[0031] The vaporization device 30 includes one main tank 31 that supplies water vapor to two processing containers 11, a sub-tank 32 connected to the main tank 31, a heating device 33 that heats the main tank 31, and a heating drive unit 34 that drives the heating device 33.

[0032] The main tank 31 constitutes a portion of the vaporizer 30 that actually produces water vapor from liquid water. The main tank 31 is formed in a T-shape in a side view. Specifically, the main tank 31 has one vertical cylinder portion 311 extending in the vertical direction, and two (a pair) horizontal cylinder portions 312, 313 that are connected to the lower portion of the vertical cylinder portion 311 and extend in the horizontal direction. The two horizontal cylinder portions 312, 313 are connected such that their central axes are aligned in a straight line, forming a continuous cylinder portion 314.

[0033] The main tank 31 has a T-shaped internal space 31a in accordance with its T-shaped external configuration. That is, the internal space 31a is continuous throughout the interiors of the one vertical cylindrical portion 311 and the two horizontal cylindrical portions 312, 313.

[0034] FIG. 3(A) is a side cross-sectional view along the central axis of the vertical cylindrical portion 311 and the cylindrical portion 314 of the main tank 31. FIG. 3(B) is a cross-sectional view along the line IIIB-IIIB of FIG. 3(A). FIG. 3(C) is a plan view of the main tank 31. As shown in FIG. 3(A) to FIG. 3(C), the T-shape of the main tank 31 is formed by burring. This reduces the number of welded parts, and also forms a smoothly curved curved portion 316 (beautiful R surface) between the vertical cylindrical portion 311 and the cylindrical portion 314 (horizontal cylindrical portions 312, 313). The curved portion 316 reduces the resistance to the movement of water vapor in the horizontal cylindrical portions 312, 313, and allows the water vapor to be smoothly directed to the vertical cylindrical portion 311. The vertical cylindrical portion 311 and the cylindrical portion 314 may be connected by welding. The inner surface of the main tank 31, including the welded parts, is passivated by electrolytic polishing.

[0035] The vertical cylindrical portion 311 has a central axis extending in the vertical direction, and constitutes the first cylindrical portion of the main tank 31. The vertical cylindrical portion 311 is formed into a cylinder having a perfect circle shape in a cross section perpendicular to the central axis, and has a flow space 311a therein that constitutes the internal space 31a. The axial length (vertical direction) of the vertical cylindrical portion 311 is shorter than the axial lengths of the horizontal cylindrical portions 312, 313.

[0036] The outer diameter of the vertical cylinder portion 311 depends on the overall shape and volume of the main tank 31, but is preferably set to, for example, within a range of about 200 mm to 400 mm. The outer diameter of the vertical cylinder portion 311 according to this embodiment is set to 318.5 mm. Here, the main tank 31 is designed to have a thickness within a range of about 3 mm to 10 mm, and has sufficient rigidity to be able to maintain its shape. In this embodiment, the wall thickness of the main tank 31 is set to 4.5 mm. Therefore, the inner diameter of the vertical cylinder portion 311 is set to 309.5 mm.

[0037] A lid portion 35 collecting a plurality of ports 36 is attached to an upper end portion 315 of the vertical cylindrical portion 311 to close the flow space 311a. The upper end portion 315 may be formed of, for example, a flange that protrudes outward in the horizontal direction.

[0038] On the other hand, the two horizontal cylindrical portions 312, 313 constitute two second cylindrical portions that protrude symmetrically (protrude in opposite directions from each other with the central axis of the vertical cylindrical portion 311 as a base point) in a direction (horizontal direction) perpendicular to the central axis of the vertical cylindrical portion 311. Each of the horizontal cylindrical portions 312, 313 is formed into a cylinder having a perfect circle shape in a cross section perpendicular to the central axis.

[0039] The axial length of each horizontal cylindrical portion 312, 313 is set to be the same. The axial length of each horizontal cylindrical portion 312, 313 may be set to an appropriate dimension taking into consideration the amount of steam to be supplied, etc., and is preferably set to, for example, within a range of about 300 mm to 1200 mm. The axial length of each horizontal cylindrical portion 312, 313 according to the embodiment is set to 734 mm. Therefore, the total length of the tube portion 314 including the horizontal cylindrical portions 312, 313 is 1468 mm. In addition, the thickness of the end wall of each protruding end of each horizontal cylindrical portion 312, 313 is set to 14 mm. Therefore, the axial length of the internal space 31a in the tube portion 314 is 1440 mm.

[0040] Moreover, the outer diameters of the horizontal cylindrical portions 312, 313 according to the embodiment are the same as each other, and are set to be the same as the outer diameter of the vertical cylindrical portion 311. That is, the outer diameter of each of the horizontal cylindrical portions 312, 313 according to the embodiment is 318.5 mm, and the inner diameter of each of the horizontal cylindrical portions 312, 313 is 309.5 mm. The outer diameter and inner diameter of each of the horizontal cylindrical portions 312, 313 may be different from the outer diameter and inner diameter of the vertical cylindrical portion 311.

[0041] With the above-mentioned configuration, the horizontal cylinder portions 312, 313 are symmetrical with respect to the central axis of the vertical cylinder portion 311. This makes it easier to install the heating device 33 in the main tank 31, and can improve vaporization efficiency by promoting convection of water vapor in the internal space 31a. The water storage space 314a formed by the two horizontal cylinder portions 312, 313 constitutes most of the internal space 31a, and has a volume that can adequately store liquid water.

[0042] Under the control of the control unit 70, the vaporizer 30 adjusts the water level of the liquid water stored in the water storage space 314a to approximately half the height of the tubular portion 314. Because the vertical cross section of the tubular portion 314 is circular, as can be seen from Fig. 3(B) , by setting the water level to approximately half the height of the tubular portion 314, the evaporation surface of the liquid water is aligned with the central axis of the tubular portion 314, and the evaporation area of ​​the liquid water is maximized.

[0043] The amount of water vapor (evaporation rate) generated from the liquid water in the tubular portion 314 varies depending on the evaporation area of ​​the liquid water and the surface flow rate of the water vapor flowing on the surface (water surface) of the liquid water. At a position approximately halfway in the height direction of the water storage space 314a, the axial length described above is 1440 mm, and the diameter of the water storage space 314a is 309.5 mm, so that the evaporation area of ​​the liquid water is 0.4457 m 2 As a result, the main tank 31 can supply 240 slm or more of steam required for steam treatment when the liquid water temperature is about 84° C., for example.

[0044] On the other hand, the lid part 35 attached to the upper end part 315 of the vertical cylinder part 311 is formed in a disk shape, and has a ring-shaped seal member 351 between the upper end part 315 and the lid part 35. The lid part 35 is airtightly attached to the upper end part 315 by the seal member 351. Also, the lid part 35 is provided with a plurality of ports 36 (eight in FIG. 3(C)) that connect the internal space 31a of the main tank 31 to the outside of the main tank 31.

[0045] The multiple ports 36 have holding holes that hold each component of the vaporizer 30 while preventing the leakage of water vapor. A water injection pipe 37, two water vapor discharge pipes 38, two water level sensors 39, a temperature sensor 40, and a pressure sensor 41 are installed in the multiple ports 36. In FIG. 3(C), seven of the eight ports 36 are used, and one port 36 is reserved. Each pipe and each sensor is inserted into the internal space 31a through a holding hole provided in the upper end portion 315.

[0046] The water injection pipe 37 connects the main tank 31 and the sub tank 32 (see FIG. 2), and injects liquid water from the sub tank 32 into the main tank 31. In the internal space 31a of the main tank 31, the lower end of the water injection pipe 37 extends to near the bottom of the cylindrical portion 314, with a gap between the lower end and the bottom of the cylindrical portion 314 that is large enough to allow the injection of liquid water into the internal space 31a.

[0047] The two water vapor discharge pipes 38 constitute a part of the two supply paths 20L, and supply water vapor from the main tank 31 to the first processing vessel 11A and the second processing vessel 11B. Although the two water vapor discharge pipes 38 are shown side by side in FIG. 2 for ease of understanding, the two water vapor discharge pipes 38 are arranged side by side in a direction perpendicular to the central axis of the cylindrical portion 314 as shown in FIG. 3(C). That is, each water vapor discharge pipe 38 is located exactly at the center of the axial direction of the cylindrical portion 314 (each horizontal cylindrical portion 312, 313). This allows the two water vapor discharge pipes 38 to reduce variation in the flow rate of water vapor flowing out from the internal space 31a. Also, each water vapor discharge pipe 38 is installed, for example, so that the lower end is at the same distance from the upper end portion 315 of the main tank 31.

[0048] The two water level sensors 39 detect the water level of the liquid water stored in the water storage space 314a. The upper end of each water level sensor 39 protrudes outside the main tank 31 and is communicatively connected to the control unit 70. Each water level sensor 39 is fixed near the center of the lid portion 35, and its lower end extends to near the bottom of the tube portion 314. For example, the water level sensors 39 may be located at about the same position as the lower end of the water injection pipe 37. The configuration of each water level sensor 39 and control using the detection results will be described in detail later.

[0049] The temperature sensor 40 detects the temperature (water temperature) of the liquid water stored in the water storage space 314a. The upper end of the temperature sensor 40 protrudes outside the main tank 31 and is communicatively connected to the control unit 70, while the lower end of the temperature sensor 40 extends to near the bottom of the tubular portion 314. For example, it may be located at about the same position as the lower end of the water injection pipe 37.

[0050] The pressure sensor 41 detects the pressure (internal pressure) in the internal space 31a of the main tank 31. An upper end of the pressure sensor 41 protrudes to the outside of the main tank 31 and is communicatively connected to the control unit 70, while a lower end of the pressure sensor 41 extends to a midway position within the flow space 311a of the vertical cylindrical portion 311.

[0051] As described above, the main tank 31 has each tube and each sensor installed in one lid portion 35 and attached to the upper end of the vertical cylindrical portion 311, so that these components can be concentrated at the axial center position of the cylindrical portion 314. This allows the cylindrical portion 314 of the main tank 31 to have a simplified structure and be specialized for the function of generating water vapor from the stored liquid water (reducing heating loss, etc.). Furthermore, the main tank 31 can uniformly supply water vapor to each processing vessel 11 from the upper end of the concentrated vertical cylindrical portion 311, and can stabilize the detection results of the sensors.

[0052] Returning to Fig. 2, the sub-tank 32 of the vaporizer 30 is provided upstream of the main tank 31, and temporarily stores liquid water supplied from the external water storage tank 22 and supplies it to the main tank 31 via a water injection pipe 37. A supply-side opening / closing valve 42 is provided midway along the water injection pipe 37. The supply-side opening / closing valve 42 opens and closes the flow path of the water injection pipe 37 under the control of the control unit 70. The vaporizer 30 supplies liquid water from the sub-tank 32 to the main tank 31 by opening the supply-side opening / closing valve 42, and stops the supply of liquid water from the sub-tank 32 by closing the supply-side opening / closing valve 42.

[0053] The heating device 33 of the vaporizer 30 is mounted on the exterior of the cylindrical portion 314 of the main tank 31, and heats the liquid water stored in the cylindrical portion 314. The heating device 33 is formed in a semicircular shape that covers the entire lower side of the central axis of the cylindrical portion 314 (see also FIG. 3(B)). This allows the heating device 33 to efficiently heat the entire liquid water stored in approximately half of the cylindrical portion 314. The configuration of the heating device 33 is not particularly limited, and may be a hard member with a semicircular cross section, or conversely, may be a flexible sheet member. The heating device 33 may be configured to cover the protruding ends (ends opposite to the connecting portions) of each of the horizontal cylindrical portions 312 and 313. The heating device 33 may also be a jacket heater that covers the entire main tank 31 and the lid portion 35. The jacket heater can be configured, for example, as four parts, with a center part covering the connecting part between horizontal cylindrical part 312 and horizontal cylindrical part 313 and vertical cylindrical part 311, two side parts covering the remaining parts of horizontal cylindrical parts 312 and 313, respectively, and a top part covering upper end part 315 and lid part 35. Also, a heat insulating material may be provided at each end of the two side parts. However, the configuration of the jacket heater is not limited to this.

[0054] Heating drive unit 34 of vaporizer 30 is connected to a power source (not shown) and to control unit 70, and controls the power supplied to heating device 33 under the control of control unit 70 to heat liquid water stored in main tank 31 to a target temperature. For example, control unit 70 heats heating device 33 via heating drive unit 34 so as to maintain heating device 33 at a target temperature of 85°C. Note that the temperature of liquid water heated by heating device 33 drops by about 1°C from 85°C to about 84°C due to the release of heat of evaporation.

[0055] The vaporizer 30 also includes outlet-side opening / closing valves 43, 44 on each of the two water vapor discharge pipes 38. The outlet-side opening / closing valve 43 opens and closes the water vapor discharge pipe 38 connected to the first processing vessel 11A under the control of the control unit 70. The outlet-side opening / closing valve 44 opens and closes the water vapor discharge pipe 38 connected to the second processing vessel 11B under the control of the control unit 70. The vaporizer 30 supplies water vapor from the main tank 31 by opening the outlet-side opening / closing valves 43, 44, and stops the supply of water vapor from the main tank 31 by closing the outlet-side opening / closing valves 43, 44.

[0056] FIG. 4(A) is a side view showing a water vapor discharge pipe 38 according to the embodiment. FIG. 4(B) is a graph showing the relationship between the diameter of the orifice 45o and the flow rate of water vapor. Each water vapor discharge pipe 38 is provided with a gasket 45 that narrows the flow path of water vapor at a midpoint. For example, the water vapor discharge pipe 38 is provided with a first pipe 381 between the main tank 31 and the outlet side opening / closing valve 43 (44), and is provided with a second pipe 382 downstream of the outlet side opening / closing valve 43 (44). The second pipe 382 of each water vapor discharge pipe 38 extends vertically upward and is continuous with the first water vapor supply pipe 20L1 (second water vapor supply pipe 20L2).

[0057] The gasket 45 is provided on the first pipe 381. The gasket 45 is formed in a circular plate shape having a circular orifice 45o at the center. By providing the gasket 45 on each water vapor discharge pipe 38 (first pipe 381), the water vapor passes through the orifice 45o, which is narrower than the diameter of the flow path of each water vapor discharge pipe 38, and is supplied to the first processing vessel 11A and the second processing vessel 11B. That is, the orifice 45o functions as a physical structure that limits the flow rate of the water vapor. In general, the pressure of the gas upstream of the orifice is less likely to be affected by the outflow of the gas downstream of the orifice. This allows stable supply of water vapor from the vaporizer 30 to the processing space 11s.

[0058] As shown in the graph of FIG. 4(B), the diameter of the orifice 45o and the flow rate of the water vapor flowing through the orifice 45o have a nonlinear increasing relationship with each other. In other words, the flow rate of the water vapor can be controlled by setting the diameter of the orifice 45o to a dimension corresponding to the target flow rate of the water vapor. For example, when the temperature of the water vapor is 85° C. and the target flow rate is set to 120 slm, the diameter of the orifice 45o can be set to 5.1 mm. The vaporizer 30 can supply water vapor at a target flow rate (120 slm) evenly from the main tank 31 to each of the first processing vessel 11A and the second processing vessel 11B by installing the gasket 45 having the set orifice 45o on each of the two water vapor discharge pipes 38. Also, even when water vapor is supplied from the main tank 31 to, for example, only the first processing vessel 11A, the target flow rate of 120 slm can be stably maintained by the orifice 45o. At this time, the vaporizer 30 needs to have a capacity to supply a total of 240 sml or more of water vapor.

[0059] Returning to Fig. 1, the control unit 70 of the water vapor processing system 1 is a computer having one or more processors 71, a memory 72, and an input / output interface and a communication interface (not shown). The one or more processors 71 are one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a circuit made of a plurality of discrete semiconductors, and execute a program stored in the memory 72. The memory 72 includes a main storage device made of a semiconductor memory or the like, and an auxiliary storage device made of a disk, a semiconductor memory (flash memory), or the like.

[0060] The control unit 70 controls the water vapor processing method of the water vapor processing system 1 by having one or more processors 71 execute a program stored in the memory 72. For example, the control unit 70 selects one of the first processing container 11A and the second processing container 11B that can perform water vapor processing, and loads the substrate G held by the transfer device into the processing container 11 (for example, the first processing container 11A) through the load / unload port 12. Then, the control unit 70 adjusts the processing space 11s of the first processing container 11A to a vacuum atmosphere (reduced pressure atmosphere) by the exhaust unit 50, and further supplies water vapor from the supply unit 20 to perform water vapor processing on the substrate G in the processing space 11s. After the water vapor processing, the substrate processing system 100 holds the substrate G by the transfer device and loads it out of the first processing container 11A, and transports the substrate G to, for example, the outside of the substrate processing system 100 or to a new substrate processing apparatus 2.

[0061] The control unit 70 can stably supply water vapor to the first processing vessel 11A and the second processing vessel 11B by controlling the generation and supply state (supply timing, flow rate, temperature) of water vapor by the vaporizer 30. Note that in the embodiment, the control unit 70 of the water vapor processing system 1 is configured to control the vaporizer 30, but for example, the water vapor processing system 1 may include a dedicated control device (such as a computer) for the vaporizer 30, and the control device may control the vaporizer 30 by receiving a command from the control unit 70.

[0062] The water vapor processing system 1 according to the embodiment is basically configured as described above, and its operation (water vapor processing method) will be described below with reference to Fig. 5. Fig. 5 is a flowchart showing the water vapor processing method according to the embodiment.

[0063] The control unit 70 of the water vapor processing system 1 controls the process flow of steps S101 to S111 in the water vapor processing method.

[0064] First, as a preliminary preparation for the water vapor treatment method, the control unit 70 opens the supply-side opening / closing valve 42 to inject liquid water from the sub-tank 32 into the main tank 31, and accumulates the liquid water up to half of the vertical level of the tubular portion 314 (step S101). This is not strictly limited to "half", and there may be an allowable range in which the liquid water level goes up or down slightly from "half". When the control unit 70 determines, under monitoring by the water level sensor 39, that the liquid water has been accumulated in the water storage space 314a, it closes the supply-side opening / closing valve 42.

[0065] Next, the control unit 70 drives the heating drive unit 34 to start heating the main tank 31 with the heating device 33 (step S102). As a result, the temperature inside the main tank 31 rises to a target temperature (e.g., 85°C), and water vapor is generated from the evaporation surface of the liquid water. However, the control unit 70 closes the outlet side opening and closing valves 43, 44 to stop the supply of water vapor from the vaporizer 30 until the substrates G are accommodated in each processing container 11. Note that the heating of the main tank 31 by the heating device 33 continues in the following steps, and this heating is stopped, for example, when it is determined that the water vapor processing is completed (step S109 described below).

[0066] When the advance preparation is completed, the control unit 70 selects the processing vessel 11 in which the water vapor processing will be performed from the first processing vessel 11A and the second processing vessel 11B (step S103). Then, the control unit 70 transports the substrate G using the transport device and loads the substrate G into the selected first processing vessel 11A (step S104). Note that if the water vapor processing can be performed in both of the two processing vessels 11, the control unit 70 may load the substrate G into the previously selected processing vessel 11, and then select the other processing vessel 11 to load the substrate G therein.

[0067] The control unit 70 starts the water vapor processing of the substrate G in the processing vessel 11 by opening the outlet side opening / closing valves 43, 44 corresponding to the processing vessel 11 into which the substrate G has been loaded (step S105). In this water vapor processing, the water vapor discharge pipe 38 is provided with the orifice 45o as described above, so that water vapor is continuously supplied from the main tank 31 to the processing vessel 11 at a specified target flow rate (e.g., 120 slm). The water vapor enables the processing vessel 11 to remove chlorine attached to the substrate G.

[0068] After the water vapor treatment is performed, the control unit 70 determines whether the water vapor treatment is to be terminated (step S106). For example, the control unit 70 measures the implementation time at the start and monitors whether the implementation time reaches a preset time threshold. If the implementation time does not reach the time threshold (step S106: NO), the control unit 70 continues the water vapor treatment, whereas if the implementation time reaches the time threshold (step S106: YES), the control unit 70 determines whether the water vapor treatment is to be terminated.

[0069] The control unit 70 closes the outlet side opening / closing valves 43, 44 of the corresponding water vapor release pipes 38 for the processing vessels 11 for which it has determined that the water vapor processing has been completed (step S107). Furthermore, the control unit 70 causes the transfer device to unload the substrate G from the processing vessels 11 for which the water vapor processing has been completed (step S108).

[0070] Then, the control unit 70 determines whether or not there is a new substrate G to be subjected to the water vapor treatment (step S109), and if there is no new substrate G (step S9: NO), the control unit 70 ends the current water vapor treatment method. On the other hand, if there is a new substrate G (step S9: YES), the control unit 70 proceeds to step S110 to supply water vapor again from the vaporizer 30.

[0071] In step S110, the control unit 70 determines whether the water level detected by the water level sensor 39 is below the water supply request position. If the water level is equal to or higher than the water supply request position (step S110: NO), the control unit 70 returns to step S103 and repeats the same process flow. On the other hand, if the water level detected by the water level sensor 39 is below the water supply request position (step S110: YES), the control unit 70 proceeds to step S111. In step S111, the control unit 70 refills the main tank 31 with liquid water from the sub tank 32.

[0072] FIG. 6(A) is a cross-sectional view illustrating the water level sensor 39 of the vaporizer 30. FIG. 6(B) is a graph showing changes in the temperature and pressure of the liquid water caused by refilling the main tank 31 with the liquid water. As shown in FIG. 6(A), the two water level sensors 39 are composed of two sensors, a first water level sensor 391 and a second water level sensor 392, and are configured as float switches that measure four positions as the level of the liquid water in the water storage space 314a. For example, the first water level sensor 391 is used for interlocking and is capable of detecting an upper limit position HH and a lower limit position LL in the tube portion 314. On the other hand, the second water level sensor 392 is used for controlling the level of the liquid water and is capable of detecting a water supply stop position H and a water supply request position L in the tube portion. The water supply stop position H detected by the second water level sensor 392 is set to a position slightly higher than the center position M (the central axis of the tube portion 314). Furthermore, the water supply request position L detected by the second water level sensor 392 is set to a position slightly lower (the same distance as the distance between the center position M and the water supply stop position H) with respect to the center position M. The water supply stop position H and the water supply request position L are determined in advance by a method such as a preliminary experiment or calculation to determine the range of water levels at which steam can be stably supplied.

[0073] The control unit 70 uses the detection result of the second water level sensor 392 to control the injection of liquid water into the main tank 31. For example, when the water level falls below the water supply request position L, the control unit 70 opens the supply side opening / closing valve 42 after the steam treatment of the treatment vessel 11 to replenish the main tank 31 with liquid water. The control unit 70 then monitors the second water level sensor 392 when injecting liquid water from the sub tank 32, and when the water level falls to the water supply stop position H or higher, closes the supply side opening / closing valve 42 to stop the replenishment of liquid water into the main tank 31. The control unit 70 then returns to step S103, and repeats the same process flow thereafter.

[0074] As shown in FIG. 6B, by controlling the level of the liquid water based on the water supply stop position H and the water supply request position L of the second water level sensor 392, the amount of liquid water injected into the main tank 31 is small compared to the liquid water stored in the main tank 31. This prevents the temperature of the liquid water in the water storage space 314a from decreasing due to the injected liquid water, and the water temperature can be kept generally constant. In addition, the evaporation area of ​​the liquid water does not fluctuate greatly, so that the pressure in the internal space 31a of the main tank 31 does not fluctuate greatly and decreases gradually during the generation of steam, thereby stabilizing the flow rate of the steam. In addition, for example, when an abnormality or the like occurs in the second water level sensor 392, the control unit 70 can control an emergency stop of the steam processing or the like using the detection result of the first water level sensor 391.

[0075] As described above, the water vapor processing method according to the embodiment can stably supply water vapor at a target flow rate from the main tank 31 of the vaporizer 30 to the processing vessel 11. In particular, the main tank 31 can increase the amount of water vapor that can be sent out by generating water vapor in the two horizontal cylindrical portions 312 and 313, and can stably supply water vapor to each of the first processing vessel 11A and the second processing vessel 11B. Note that the water level sensor 39 does not have to be configured with two sensors, the first water level sensor 391 and the second water level sensor 392, and may be configured to have one sensor with four measurement positions.

[0076] Next, the control of supplying water vapor to two processing vessels 11 (first processing vessel 11A, second processing vessel 11B) from one main tank 31 will be described with reference to Fig. 7. Fig. 7(A) is a graph showing changes in water vapor flow rate and water temperature in an alternating pattern for two processing vessels 11. Fig. 7(B) is a graph showing changes in water vapor flow rate and water temperature in a synchronous pattern for two processing vessels 11.

[0077] For example, the time for the water vapor processing in the first processing vessel 11A and the second processing vessel 11B is set to 124 seconds. Also, for example, the time required for exhausting water vapor and loading and unloading the substrate G in the first processing vessel 11A and the second processing vessel 11B (time for stopping the supply of water vapor) is set to 62 seconds, respectively. In this case, the water vapor processing method generates an alternating pattern in which the water vapor processing is performed in one of the first processing vessel 11A and the second processing vessel 11B and the other is paused, and a synchronous pattern in which the water vapor processing is performed in both the first processing vessel 11A and the second processing vessel 11B. Note that, in the processing method according to the embodiment, even in the case of the alternating pattern, the water vapor processing in the first processing vessel 11A and the water vapor processing in the second processing vessel 11B are not completely separated in time, and the water vapor processing in both processing vessels overlaps at some time. However, the time for the water vapor processing or the time for stopping the supply of water vapor may be changed to completely separate them in time.

[0078] 6(A), the flow rate of water vapor supplied from the main tank 31 alternates between 120 slm when supplied to one of the two processing vessels 11 and 240 slm when supplied to both of the two processing vessels 11. For example, the period during which water vapor is supplied to one of the two processing vessels 11 is 186 seconds, and the period during which water vapor is supplied to both of the two processing vessels 11 is 62 seconds.

[0079] In the case of the alternating pattern, liquid water is replenished to the main tank 31 when steam is supplied to one of the two processing vessels 11. The water temperature of the main tank 31 drops when the liquid water is replenished, but as described above, the amount of liquid water replenished is small compared to the amount of liquid water stored. Therefore, the drop in the liquid water temperature is suppressed to within 1°C, and a flow rate of 120 slm can be stably secured even when steam is supplied to the other processing vessel 11.

[0080] 6(B), the flow rate of water vapor supplied from the main tank 31 repeatedly changes between 240 slm when the water vapor is supplied to both of the two processing vessels 11 and 0 slm when the water vapor supply is stopped to both of the two processing vessels 11. For example, the period during which the water vapor is supplied to both of the two processing vessels 11 is 124 seconds, and the period during which the water vapor supply to both of the two processing vessels 11 is stopped is 62 seconds.

[0081] In the case of the synchronous pattern, liquid water is replenished to the main tank 31 during the period when the supply to both of the two processing vessels 11 is stopped. At this time, the amount of liquid water replenished is greater than the amount of liquid water replenished in the alternating pattern, so the water temperature in the synchronous pattern is lower than the water temperature in the alternating pattern. However, because water vapor is not supplied to both of the two processing vessels 11, the water temperature easily recovers during the period when the supply is stopped. As a result, a stable flow rate of water vapor can be ensured in either the alternating pattern or the synchronous pattern.

[0082] The water vapor processing system 1 and the water vapor processing method according to the embodiment are not limited to the above embodiment, and various modifications are possible. For example, the main tank 31 is not limited to a configuration having a cylindrical tube portion 314 (two horizontal tube portions 312, 313), and may have a tube portion 314 formed into a square tube. By forming each of the horizontal tube portions 312, 313 into a square tube, the evaporation area can be maintained constant even if the water level of the stored liquid water changes.

[0083] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0084] A first aspect of the present disclosure is an evaporation device 30 that generates water vapor, comprising a first tubular portion (vertical tubular portion 311) having a central axis extending vertically, two second tubular portions (horizontal tubular portions 312, 313) that extend symmetrically in a direction perpendicular to the central axis to form a T-shape between the first tubular portion and have a water storage space therein, a plurality of water vapor discharge pipes 38 connected to the upper end of the first tubular portion and that release water vapor from the water storage space, and a heating device 33 that contacts the lower portions of the two second tubular portions and heats the two second tubular portions.

[0085] As described above, the vaporizer 30 can stably supply water vapor from the multiple water vapor discharge pipes 38 while promoting miniaturization of the device. That is, the tank (main tank 31) that forms a T-shape with the first cylindrical portion (vertical cylindrical portion 311) and two second cylindrical portions (horizontal cylindrical portions 312, 313) can store a large amount of liquid water while ensuring a sufficient evaporation area for the liquid water. Therefore, the vaporizer 30 can reduce the cost of separately providing multiple tanks, and can sufficiently reduce the footprint of the device by suppressing protrusion in any direction other than the direction in which the horizontal cylindrical portions 312, 313 are connected.

[0086] Further, the plurality of water vapor discharge pipes 38 include valves (outlet side opening / closing valves 43, 44) for opening and closing the flow paths of the plurality of water vapor discharge pipes 38, and an orifice 45o disposed between the valves and the upper end of the first cylindrical portion (vertical cylindrical portion 311). This orifice 45o enables the vaporizer 30 to easily adjust the flow rate of water vapor to be supplied to a target flow rate and to stably supply the water vapor.

[0087] The plurality of water vapor discharge pipes 38 are arranged side by side at the center of the connecting direction of the two second cylindrical portions (horizontal cylindrical portions 312, 313) and in a direction perpendicular to the connecting direction. This allows the vaporizer 30 to uniformly discharge the water vapor generated in the two second cylindrical portions.

[0088] The cross-sectional shape of the first cylindrical portion (vertical cylindrical portion 311) and the cross-sectional shape of the two second cylindrical portions (horizontal cylindrical portions 312, 313) are circular and have the same diameter. This allows the vaporizer 30 to stably generate water vapor in the two second cylindrical portions and smoothly guide the water vapor to the first cylindrical portion by the buoyancy of the water vapor.

[0089] Moreover, the first cylindrical portion (vertical cylindrical portion 311) and the two second cylindrical portions (horizontal cylindrical portions 312, 313) are connected via curved portion 316. This enables the vaporizer 30 to increase the efficiency of extracting water vapor, and also improves corrosion resistance by minimizing the welding points between the first cylindrical portion and the two second cylindrical portions.

[0090] A second aspect of the present disclosure is a water vapor processing system 1 for processing a substrate G with water vapor, the water vapor processing system 1 including: a vaporizer 30 for generating water vapor; a first processing vessel 11A and a second processing vessel 11B for accommodating a substrate G therein and processing the substrate G with the water vapor supplied from the vaporizer 30; a first water vapor supply pipe 20L1 connecting the vaporizer 30 to the first processing vessel 11A; and a second water vapor supply pipe 20L2 connecting the vaporizer 30 to the second processing vessel 11B. The vaporizer 30 has a central axis extending in a vertical direction. The water vapor processing system 1 includes a first cylindrical portion (vertical cylindrical portion 311) having a water storage space therein, two second cylindrical portions (horizontal cylindrical portions 312, 313) that extend symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the two second cylindrical portions, a plurality of water vapor discharge pipes 38 that are connected to the upper end of the first cylindrical portion and to each of the first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2 and discharge water vapor from the water storage space, and a heating device 33 that contacts the lower portions of the two second cylindrical portions and heats the two second cylindrical portions. Even in this case, the water vapor processing system 1 can stably supply water vapor while promoting miniaturization of the device.

[0091] In addition, the multiple water vapor discharge pipes 38 are equipped with valves (outlet side opening / closing valves 43, 44) that open and close the flow paths of the multiple water vapor discharge pipes 38, and an orifice 45o arranged between the valves and the upper end of the first cylindrical portion (vertical cylindrical portion 311).

[0092] Further, the multiple water vapor release pipes 38 are arranged side by side in a direction perpendicular to the direction in which the two second cylindrical portions (horizontal cylindrical portions 312, 313) are connected together.

[0093] The cross-sectional shape of the first cylindrical portion (vertical cylindrical portion 311) and the cross-sectional shape of the two second cylindrical portions (horizontal cylindrical portions 312, 313) are both circular and have the same diameter.

[0094] The first cylindrical portion (vertical cylindrical portion 311) and the two second cylindrical portions (horizontal cylindrical portions 312, 313) are connected via a curved portion 316.

[0095] In addition, the vaporization device 30 is disposed vertically below the first processing vessel 11A and the second processing vessel 11B, and the multiple water vapor discharge pipes 38 extend vertically upward and are continuous with each of the first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2.

[0096] A third aspect of the present disclosure is a water vapor processing method for subjecting a substrate G to a water vapor treatment in a water vapor processing system 1, the water vapor processing system 1 including: an evaporation device 30 that generates water vapor; a first processing container 11A and a second processing container 11B that accommodate a substrate G therein and treat the substrate G with the water vapor supplied from the evaporation device 30; a first water vapor supply pipe 20L1 that connects the evaporation device 30 to the first processing container 11A; and a second water vapor supply pipe 20L2 that connects the evaporation device 30 to the second processing container 11B. The evaporation device 30 includes a first cylindrical portion (vertical cylindrical portion 311) having a central axis extending in the vertical direction, and two cylindrical portions each having a water storage space therein, the first cylindrical portion (vertical cylindrical portion 311) and the second cylindrical portion (vertical cylindrical portion 312) extending symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the second cylindrical portion. The apparatus includes a second cylindrical portion (horizontal cylindrical portions 312, 313), a plurality of water vapor discharge pipes 38 connected to the upper end of the first cylindrical portion and connected to each of the first water vapor supply pipe 20L1 and the second water vapor supply pipe 20L2, and discharging water vapor from a water storage space, and a heating device 33 in contact with the lower portion of the two second cylindrical portions and heating the two second cylindrical portions, and includes a step of generating water vapor by heating the water stored inside the two second cylindrical portions with the heating device 33, and a step of supplying the water vapor generated in the step of generating water vapor to one or both of the first processing container 11A and the second processing container 11B via the plurality of water vapor discharge pipes 38, the first water vapor supply pipe 20L1, and the second water vapor supply pipe 20L2, and performing a process with water vapor on a substrate G. Even in this case, the water vapor processing method can stably supply water vapor while promoting miniaturization of the apparatus.

[0097] Furthermore, in the process of subjecting substrate G to water vapor processing, the water vapor supplied to first processing vessel 11A and second processing vessel 11B is adjusted to the same flow rate by orifices 45o provided in the multiple water vapor discharge pipes 38. This allows the water vapor processing method to stably introduce water vapor at the same flow rate to first processing vessel 11A and second processing vessel 11B.

[0098] The vaporizer 30, the water vapor processing system 1, and the water vapor processing method according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various forms without departing from the scope and spirit of the appended claims. The matters described in the above embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent.

[0099] The substrate processing apparatus 2 of the present disclosure can be applied to any type of apparatus, such as an Atomic Layer Deposition (ALD) apparatus, a Capacitively Coupled Plasma (CCP), an Inductively Coupled Plasma (ICP), a Radial Line Slot Antenna (RLSA), an Electron Cyclotron Resonance Plasma (ECR), or a Helicon Wave Plasma (HWP). [Explanation of symbols]

[0100] 1. Water Vapor Treatment System 11A First Processing Container 11B Second processing vessel 30 Vaporizer 311 Vertical cylindrical part 312, 313 Horizontal cylindrical part 33 Heating device 38 Steam discharge pipe G board

Claims

1. 1. A vaporizer for generating water vapor, comprising: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical portions protruding symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the two second cylindrical portions having a water storage space therein; A plurality of water vapor discharge pipes connected to an upper end of the first cylindrical portion and configured to discharge water vapor from the water storage space; a heating device that contacts lower portions of the two second cylindrical portions and heats the two second cylindrical portions, Evaporation device.

2. The plurality of water vapor discharge pipes include a valve for opening and closing the flow paths of the plurality of water vapor discharge pipes; and an orifice disposed between the valve and the upper end of the first cylindrical portion.

2. The vaporizer of claim 1.

3. The plurality of water vapor discharge pipes are arranged at a center position of the connection direction of the two second cylindrical portions and in a direction perpendicular to the connection direction.

3. The vaporizer according to claim 1 or 2.

4. The cross-sectional shape of the first cylindrical portion and the cross-sectional shapes of the two second cylindrical portions are circular and have the same diameter.

3. The vaporizer according to claim 1 or 2.

5. The first cylindrical portion and the two second cylindrical portions are connected via a curved portion.

3. The vaporizer according to claim 1 or 2.

6. 1. A water vapor processing system for subjecting a substrate to a process using water vapor, comprising: A vaporizer for generating the water vapor; a first processing vessel and a second processing vessel for accommodating the substrate therein and processing the substrate with the water vapor supplied from the vaporizer; a first water vapor supply pipe connecting the vaporizer and the first processing chamber; a second water vapor supply pipe connecting the vaporizer and the second processing chamber; The vaporizer includes: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical portions protruding symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the two second cylindrical portions having a water storage space therein; a plurality of water vapor discharge pipes connected to an upper end of the first cylindrical portion and connected to each of the first water vapor supply pipe and the second water vapor supply pipe, the water vapor being discharged from the water storage space; a heating device that contacts lower portions of the two second cylindrical portions and heats the two second cylindrical portions, Water vapor handling system.

7. The plurality of water vapor discharge pipes include a valve for opening and closing the flow paths of the plurality of water vapor discharge pipes; and an orifice disposed between the valve and the upper end of the first cylindrical portion. The water vapor treatment system of claim 6.

8. The plurality of water vapor discharge pipes are arranged at a center position of the connection direction of the two second cylindrical portions and in a direction perpendicular to the connection direction.

8. The water vapor treatment system according to claim 6 or 7.

9. The cross-sectional shape of the first cylindrical portion and the cross-sectional shapes of the two second cylindrical portions are circular and have the same diameter.

8. The water vapor treatment system according to claim 6 or 7.

10. The first cylindrical portion and the two second cylindrical portions are connected via a curved portion.

8. The water vapor treatment system according to claim 6 or 7.

11. the vaporizer is disposed vertically below the first processing vessel and the second processing vessel, The plurality of water vapor discharge pipes extend vertically upward and are continuous with each of the first water vapor supply pipe and the second water vapor supply pipe.

8. The water vapor treatment system according to claim 6 or 7.

12. 1. A water vapor processing method for subjecting a substrate to a water vapor processing in a water vapor processing system, comprising: The water vapor treatment system comprises: A vaporizer for generating the water vapor; a first processing vessel and a second processing vessel for accommodating the substrate therein and processing the substrate with the water vapor supplied from the vaporizer; a first water vapor supply pipe connecting the vaporizer and the first processing chamber; a second water vapor supply pipe connecting the vaporizer and the second processing chamber; The vaporizer includes: A first cylindrical portion having a central axis extending in a vertical direction; Two second cylindrical portions protruding symmetrically in a direction perpendicular to the central axis to form a T-shape between the first cylindrical portion and the two second cylindrical portions having a water storage space therein; a plurality of water vapor discharge pipes connected to an upper end of the first cylindrical portion and connected to each of the first water vapor supply pipe and the second water vapor supply pipe, the water vapor being discharged from the water storage space; a heating device that contacts lower portions of the two second cylindrical portions and heats the two second cylindrical portions, generating the water vapor by heating the water stored inside the two second cylindrical portions with the heating device; supplying the water vapor generated in the water vapor generating step to one or both of the first processing vessel and the second processing vessel via the plurality of water vapor discharge pipes, the first water vapor supply pipe, and the second water vapor supply pipe, and subjecting the substrate to a process using the water vapor; Steam treatment method.

13. In the step of subjecting the substrate to the water vapor treatment, the water vapor supplied to the first treatment vessel and the second treatment vessel are adjusted to have the same flow rate by orifices provided in the plurality of water vapor discharge pipes. The method of claim 12 .

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