System including array of bonding heads and array of die transfer seats, and method of using the same

Abstract

To provide a system including an array of bonding heads and an array of die transfer seats, which reduces a movement during alignment or bonding operations, and a method of using the same.SOLUTION: A device 110 includes a source substrate chuck 122, a transfer destination substrate chuck 148, an array 124 of M bonding heads, an array 144 of N*M die transfer seats, and a carriage 146. The transfer destination substrate chuck and the array of N*M (N and M are an integer of greater than 1) die transfer seats are positioned along the carriage. A method of using the system includes: transferring a first set of dies from the array of N*M die transfer seats to the array of M bonding heads; bonding the first set of dies to a transfer destination substrate; transferring a second set of dies from the array of N*M die transfer seats to the array of M bonding heads; and bonding the second set of dies to the transfer destination substrate.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a system that includes an array of bond heads and an array of die transfer sheets, and methods of use thereof. [Background technology]

[0002] Advanced packaging techniques require high throughput and precise die placement. Hybrid bonding can be particularly challenging when misalignment tolerances are tight. Single die transfer techniques can achieve high accuracy but have low throughput. Multi-die transfer techniques can achieve high throughput but can be difficult to precisely place the die. High throughput placement is required while still meeting die placement specifications. Summary of the Invention

[0003] In one embodiment, a system can include a first substrate chuck, an array of M bonding heads, an array of N*M die transfer sheets, and a carriage, wherein the first substrate chuck and the array of N*M die transfer sheets can be positioned along the carriage, where each of N and M is an integer greater than 1.

[0004] In one embodiment, N is up to 10.

[0005] In another embodiment, the system further comprises a bridge and a part coupled to the bridge, and the array of N*M die transfer sheets includes a body and a die chuck, and the bridge or the part coupled to the bridge is closer to the die chuck than the body.

[0006] In a specific embodiment, a bond head chuck surface of the array of M bond heads is oriented to face the first substrate chuck when the carriage is beneath the array of M bond heads.

[0007] In yet another embodiment, the system further comprises an alignment reference and a plurality of optical components positioned along the carriage, the plurality of optical components oriented to face the alignment reference when the carriage is in a third position.

[0008] In certain embodiments, the array of M bonding heads has an A*B matrix configuration, and the plurality of optical components has A optical components, B optical components, or an A*B matrix configuration, where each of A and B is an integer.

[0009] In a further embodiment, the system further comprises a second substrate chuck, the second substrate chuck being closer to the die chucks of the N*M die transfer sheets than to the main bodies of the N*M die transfer sheets when the carriage is over the array of the N*M die transfer sheets.

[0010] In a particular embodiment, the array of N*M die transfer sheets is an array of N*M pick-up heads.

[0011] In another embodiment, the system further comprises a die loading machine configured to load a die transfer sheet in the array of N*M die transfer sheets.

[0012] In yet another embodiment, the array of M bonding heads has a bonding head pitch, and the N*M die transfer sheets include a first set of die transfer sheets and a second set of die transfer sheets, each die transfer sheet in the first set of die transfer sheets and the second set of die transfer sheets is at a pitch within 2.0% of the bonding head pitch.

[0013] In certain embodiments, the second set of die transfer sheets are offset in a first direction from the first set of die transfer sheets by a first distance that is within 2.0% of 0.5 times the bonding head pitch.

[0014] In a more particular embodiment, the N*M die transfer sheets further include a third set of die transfer sheets and a fourth set of die transfer sheets, each of the die transfer sheets in the third set of die transfer sheets and the fourth set of die transfer sheets being at a pitch within 2.0% of the bonding head pitch.

[0015] In a further more particular embodiment, the third set of die transfer sheets are offset in a second direction perpendicular to the first direction from the first set of die transfer sheets by a second distance that is within 2.0% of 0.5 times the bonding head pitch, and the fourth set of die transfer sheets are offset in the first direction by the first distance and in the second direction by the second distance from the first set of die transfer sheets.

[0016] In another embodiment, the system further comprises a base and a bridge spaced apart from the base, the carriage coupled to the base and the array of M bonding heads coupled to the bridge.

[0017] In another aspect, a method may include transferring a first set of dies from an array of N*M die transfer sheets to an array of M bonding heads, bonding the first set of dies to a destination substrate, transferring a second set of dies from the array of N*M die transfer sheets to the array of M bonding heads, and bonding the second set of dies to the destination substrate, where each of N and M is an integer greater than 1.

[0018] In one embodiment, the method further includes loading a die transfer sheet in the array of N*M die transfer sheets with the first set of dies and the second set of dies, wherein loading the first set of dies and the second set of dies is performed before transferring the first set of dies to the array of M bonding heads and before transferring the second set of dies to the array of M bonding heads.

[0019] In certain embodiments, loading a die transfer sheet in the array of N*M die transfer sheets includes picking up the first set of dies, the second set of dies, or both the first set of dies and the second set of dies using an array of N*M pick-up heads.

[0020] In another particular embodiment, loading the die transfer sheet is performed using a die loading machine.

[0021] In another embodiment, the array of M bonding heads has a bonding head pitch, the array of N*M die transfer sheets is positioned at a first position before transferring a first set of dies, and the array of N*M die transfer sheets is positioned at a second position before transferring a second set of dies, and the distance between the first position and the second position is within 2.0% of 0.5 times the bonding head pitch.

[0022] In a further embodiment, bonding the first set of dies, bonding the second set of dies, or bonding the first set of dies and bonding the second set of dies is part of a hybrid bonding operation. [Brief description of the drawings]

[0023] Embodiments are illustrated by way of example and not limitation in the accompanying figures.

[0024] [Figure 1] FIG. 1 includes a conceptual diagram of an apparatus that can be used to transfer a die from a source substrate to a destination substrate.

[0025] [Diagram 2] FIG. 2 includes a bottom view of the bridge of the device of FIG.

[0026] [Diagram 3] FIG. 3 includes a top view of the base of the device of FIG.

[0027] [Figure 4] FIG. 4 includes an illustration of a die transfer sheet configuration according to one embodiment.

[0028] [Diagram 5] FIG. 5 includes a diagram of a die transfer sheet configuration according to another embodiment.

[0029] [Figure 6] FIG. 6 includes a diagram of a die transfer sheet configuration according to a further embodiment.

[0030] [Figure 7] FIG. 7 includes a conceptual diagram of an apparatus that can be used to transfer the die from the die transfer sheet to the destination substrate.

[0031] [Figure 8] FIG. 8 contains a process flow diagram for transferring a die to a destination bonding site of a destination substrate. [Figure 9] FIG. 9 contains a process flow diagram for transferring a die to a destination bonding site of a destination substrate.

[0032] [Figure 10] FIG. 10 includes a side view of a portion of the apparatus after a source substrate has been loaded onto the source substrate chuck and a destination substrate has been loaded onto the destination substrate chuck.

[0033] [Figure 11] FIG. 11 includes a side view of the apparatus of FIG. 10 after the die has been transferred to the array on the die transfer sheet.

[0034] [Figure 12] FIG. 12 includes a top view of the base of the apparatus of FIG. 10 after the die has been transferred to the array on the die transfer sheet.

[0035] [Figure 13] FIG. 13 includes a side view of the apparatus of FIG. 11 when using optics to position the carriage under an alignment datum coupled to the bridge.

[0036] [Figure 14] FIG. 14 includes a side view of the apparatus of FIG. 13 after positioning a set of die under the array of bond heads.

[0037] [Figure 15] FIG. 15 includes a side view of the apparatus of FIG. 14 after transferring a set of dies from the array on the die transfer sheet to the array on the bonding head.

[0038] [Figure 16] FIG. 16 includes a side view of the apparatus of FIG. 15 when measuring alignment errors between the carriage and the array of bonding heads.

[0039] [Figure 17] FIG. 17 includes a top view of the base of the device showing the arrangement of the optical components.

[0040] [Figure 18] FIG. 18 includes a top view of the base of the device showing an alternative configuration of the optical components.

[0041] [Figure 19] FIG. 19 includes a side view of the apparatus of FIG. 16 after positioning a set of dies on a destination substrate.

[0042] [Figure 20] FIG. 20 includes a side view of the apparatus of FIG. 19 after bonding a set of die to destination bonding sites of a destination substrate.

[0043] [Figure 21] FIG. 21 includes a top view of the base of the apparatus of FIG. 20 after bonding a set of die to the destination bonding sites of the destination substrate.

[0044] [Figure 22] FIG. 22 includes a side view of the apparatus of FIG. 21 after another set of dies has been positioned under the array of bond heads.

[0045] [Figure 23] FIG. 23 includes a side view of the apparatus of FIG. 22 after transferring another set of dies from the array on the die transfer sheet to the array on the bonding head.

[0046] [Figure 24] FIG. 24 includes a side view of the apparatus of FIG. 23 after positioning another set of dies on the destination substrate.

[0047] [Diagram 25] FIG. 25 includes a side view of the apparatus of FIG. 24 after bonding another set of die to another destination bonding site of the destination substrate.

[0048] [Figure 26] FIG. 26 includes a top view of the base of the apparatus of FIG. 25 after bonding another set of die to other destination bonding sites of the destination substrate.

[0049] Those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale, for example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help understand embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0050] The following description in combination with the drawings is provided to aid in understanding the teachings disclosed herein. The following discussion focuses on specific embodiments of the teachings. This focus is provided to help explain the teachings and should not be construed as a limitation on the scope or applicability of the teachings.

[0051] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention belongs. Materials, methods, and examples are illustrative only and are not intended to be limiting. To the extent not described herein, many details regarding specific materials and processing acts are conventional and can be found in textbooks and other sources in the art.

[0052] The system may include a substrate chuck, an array of M bonding heads, an array of N*M die transfer sheets, and a carriage. The substrate chuck and the array of N*M die transfer sheets may be positioned along the carriage. Each of N and M may be an integer greater than 1. A method of using the system may include transferring a first set of dies from the array of N*M die transfer sheets to the array of M bonding heads, bonding the first set of dies to a destination substrate, transferring a second set of dies from the array of N*M die transfer sheets to the array of M bonding heads, and bonding the second set of dies to a destination substrate. In an embodiment, the system may be in the form of an apparatus. In another embodiment, the system may further include a die loading machine configured to load the dies onto the array of die transfer sheets.

[0053] The system can enable a relatively high throughput of dies for bonding methods while meeting the increasingly stringent dimensional requirements of hybrid bonding. A carriage with multiple die transfer seats and a destination substrate chuck can help reduce vibrations or other motions during alignment and bonding, as compared to a dual carriage arrangement having one carriage with multiple die transfer seats and another carriage with a destination substrate chuck.

[0054] The number of die transfer sheets can be selected to achieve an acceptable throughput. As the value of N (number of die transfer sheets / number of bonding heads) increases, the throughput approaches that of a dual carriage apparatus. Those skilled in the art can determine the value of N that provides a good balance between throughput, cost, and mechanical complexity of the apparatus.

[0055] The system may be in the form of an apparatus or may include a combination of an apparatus and a die loading machine. The system and its method of use will be better understood with the aid of the following description in conjunction with the corresponding figures.

[0056] 1-3 include a conceptual diagram of the apparatus 110, as well as bottom and top views of portions of the apparatus 110. The apparatus 110 may be used to transfer a plurality of dies coupled to a source substrate chuck 122 to a destination substrate coupled to a destination substrate chuck 148. The apparatus 110 includes a bridge 120, a base 140, a controller 160, and a memory 162. The controller may be coupled to the bridge 120, the base 140, or one or more components coupled to the bridge 120 or the base 140. Each of the bridge 120 and the base 140 may be a support structure. The bridge 120 may be coupled to the source substrate chuck 122, the array of bonding heads 124, the alignment fiducials 128, and the optics 130. The base 140 may be coupled to a carriage 146.

[0057] In Figure 1, bridge 120, base 140, and components physically coupled to bridge 120 or base 140 may be configured along an X-direction, a Y-direction, a Z-direction, or a combination thereof. With respect to Figure 1 and other side views in the figures, the X-direction is between the left and right sides of the figure, the Z-direction is between the top and bottom, and the Y-direction is into and out of the drawing sheet. Unless otherwise noted to the contrary, rotation occurs along an XY plane defined by the X- and Y-directions.

[0058] The source substrate chuck 122 can be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The source substrate chuck 122 may be coupled to the bridge 120 by being directly attached to the bridge or may be coupled to the bridge via a carriage (not shown). The source substrate chuck 122 has a source-holding surface facing the base 140 or a component coupled to the base 140.

[0059] FIG. 2 includes a bottom view of bridge 120. Array of bonding heads 124 (shown within dashed lines) includes M bonding heads and may be configured in an A×B array. The A×B array may be a vector (rows or columns of bonding heads, A or B = 1) or a matrix (at least two rows and at least two columns of bonding heads, A and B = at least 2 each). For a matrix, the number of bonding heads in array of bonding heads 124 may vary between rows, columns, or between rows and columns. Some array configurations may be 3×1, 6×1, 2×2, 2×3, 2×4, 4×2, 10×10, or other rectangular shapes, with a first number corresponding to the number of bonding heads along a row or column and a second number corresponding to the number of bonding heads along the other of the rows or columns. As shown in FIG. 2, array of bonding heads 124 has a 2×4 array of bonding heads, where M is 8. In one embodiment, the matrix of bond heads may take the form of any one of a square lattice, a staggered lattice, a diamond lattice, a rectangular lattice, or a rhomboid lattice.

[0060] Each of the bond heads in the array of bond heads 124 may include a die chuck and a body disposed between the die chuck and the bridge 120. Each of the die chucks may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, or the like. Alternatively, the die chuck may be a non-contact die chuck, in which case the die chuck contacts a side surface of the die rather than a device face or a back surface. The device face is the face of the die on which the electrical components are formed, the back surface of the die is opposite that face, and the side surface is disposed between the device face and the back surface of the die. In other embodiments, the non-contact die chuck may be a Bernoulli chuck. If the die includes through-substrate vias (TSVs), the TSVs may be exposed along the back surface of the die. The non-contact chuck may help reduce the likelihood that an activation surface for bonding will contact the bond head. In one embodiment, the activation surface may include a device face, a back surface, or both the device face and the back surface. The side surface may not be activated for bonding.

[0061] The bonding heads may be configured such that the die chucks have a limited range of motion relative to their corresponding bodies to provide better positioning when the die are transferred from the array of bonding heads 124 to a destination substrate (not shown in FIGS. 1 and 2) coupled to the destination substrate chuck 148. Each bonding head may include a positioning stage that moves each bonding head independently in one or more of x, y, z, tip, tilt, and rotation. With reference to FIGS. 2 and 3, the bonding heads in the array of bonding heads 124 may have a greater degree of movement compared to the die transfer sheets in the array of die transfer sheets 144. Further details regarding positioning are described with respect to the method of using the apparatus 110. The die transfer sheets in the array of die transfer sheets 144 may occupy less area of ​​the carriage 146 relative to the bridge 120 compared to the area occupied by the bonding heads in the array of bonding heads 124.

[0062] 1 and 2, alignment datum 128 is coupled to bridge 120. The alignment datum may include marks or other features that may assist in properly positioning carriage 146 relative to bridge 120. Alignment datum 128 and optics 150 (FIGS. 1 and 3) may be used during alignment operations. Further details regarding optics 150 are described below with respect to components coupled to base 140.

[0063] An optical component 130 may be coupled to bridge 120 and used in determining the pitch of array 144 of die transfer sheets. Optical component 130 may also be used to verify the presence or identity (e.g., part number or die type) of a die coupled to a transfer sheet in array 144 of die transfer sheets or a destination substrate coupled to destination substrate chuck 148. More than one optical component 130 may be coupled to bridge 120 if necessary or desired. Optical component 130 may also be used to determine the location of bonding pads on a destination substrate coupled to destination substrate chuck 148.

[0064] 1 and 3, carriage 146 is coupled to base 140. Carriage 146 may be a positioning stage and may provide translational motion in the X, Y, or Z directions along base 140, or rotational motion about one or more axes, such as rotation about the Z axis along a plane aligned with the X and Y directions.

[0065] The array of die transfer sheets 144 is coupled to a carriage 146. The array of die transfer sheets 144 has a body and a die chuck. The body is coupled to the carriage 146. The bridge 120 or components coupled to the bridge 120 are closer to the die chuck than the bodies of the die transfer sheets in the array of die transfer sheets. In FIG. 3, the array of die transfer sheets 144 is shown in dashed lines. In the embodiment shown in FIG. 3, the array of die transfer sheets 144 includes a set of die transfer sheets 1442 and another set of die transfer sheets 1444. For simplicity, the set of die transfer sheets 1442 is referred to below as set 1442 and the set of other die transfer sheets 1444 is referred to below as set 1444. The significance of the sets 1442 and 1444 and their relationship to the array of bonding heads 124 will be explained in more detail below. In one embodiment, the die transfer sheet can have a die chuck that can be of any type described with respect to the array of bonding heads 124. The die transfer sheet and the bonding heads can be the same type or different types. In one embodiment, a die transfer sheet in the array of die transfer sheets can be a pick-up head.

[0066] The array 144 of die transfer sheets may be configured as a vector (row or column of pick-up heads), or as a matrix (at least two rows and at least two columns of pick-up heads), or as a staggered arrangement. For a matrix, the number of bonding heads in the array 144 of die transfer sheets may vary from row to row, column to column, or between rows and columns. Some array configurations may be 3×1, 6×1, 2×2, 2×3, 2×4, 4×2, 10×10, or other rectangular shapes, with a first number corresponding to the number of pick-up heads along a row or column and a second number corresponding to the number of pick-up heads along the other of the rows or columns. In theory, all the dies from an entire source wafer may be transferred at once. For such a configuration, the array of die transfer sheets 144 has fewer pick-up heads along rows closer to the top and bottom of the array compared to the row or pair of rows closest to the center of the array, and the array of die transfer sheets 144 has fewer pick-up heads along columns closer to the left and right sides of the array compared to the column or pair of columns closest to the center of the array. After reading this specification, one of ordinary skill in the art will be able to determine an array configuration for the array of die transfer sheets 144 that meets the needs or desires for a particular application.

[0067] Array of die transfer sheets 144 can be configured to have at least N*M die transfer sheets, where M is the number of bonding heads and N is a multiplier. Each of N and M is greater than 1. In one embodiment, each of N and M is at least 2. In the same or a different embodiment, N may be an integer or a non-integer, e.g., 1.5. In theory, N is not limited, but in practice N may be up to 10. As shown in FIG. 2 and FIG. 3, array of bonding heads 124 has 8 bonding heads (M=8) and array of die transfer sheets 144 has 16 die transfer sheets, so N is 2.

[0068] 2 and 3, the array of bonding heads 124 has an A×B array configuration. For the array of die transfer sheets 144, each of the sets 1442 and 1444 has an A×B array configuration. In particular, the array of bonding heads 124 and the sets 1442 and 1444 have a 2×4 matrix configuration. The array of bonding heads 124 has a bonding head pitch. The die transfer sheets in each of the sets 1442 and 1444 can have a bonding head-matching pitch, where the bonding head-matching pitch is within 2.0%, 1.0%, or 0.5% of the bonding head pitch. The array of bonding heads 124 has an X-direction bonding head pitch and a Y-direction bonding head pitch, where each of the sets 1442 and 1444 can be positioned to have an X-direction bonding head-matching pitch and a Y-direction bonding head-matching pitch. In the same or a different embodiment, the X-direction bonding head-matching pitch of each of sets 1442 and 1444 can be within 2.0%, 1.0%, or 0.5% of the X-direction bonding head pitch of array of bonding heads 124, and the Y-direction bonding head-matching pitch of each of sets 1442 and 1444 can be within 2.0%, 1.0%, or 0.5% of the Y-direction bonding head pitch of array of bonding heads 124.

[0069] 4-6 show how the sets of die transfer sheets can be offset to achieve different arrays of die transfer sheets. FIG. 4 corresponds to the array of die transfer sheets 144 shown in FIG. 3. In FIG. 4, sets 1442 and 1444 are offset from each other horizontally by half the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%. The array of die transfer sheets 144 has a 4×4 matrix configuration. FIG. 5 includes an array of die transfer sheets 544, which had the same sets as the array of die transfer sheets 144. In FIG. 5, sets 1442 and 1444 are offset from each other vertically by half the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%. The array of die transfer sheets 544 has a 2×8 matrix configuration. N is 2 for each of the arrays of die transfer sheets 144 and 544.

[0070] 6 includes sets 1442 and 1444, and further includes sets 6446 and 6448. The X-direction bond head-matching pitch of each of sets 6446 and 6448 can be within 2.0%, 1.0%, or 0.5% of the X-direction bond head pitch of array of bonding heads 124, and the Y-direction bond head-matching pitch of each of sets 6446 and 6448 can be within 2.0%, 1%, or 0.5% of the Y-direction bond head pitch of array of bonding heads 124. Sets 1442 and 1444 are offset from each other horizontally by half of the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%, and sets 1442 and 6448 are offset from each other vertically by half of the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%. Sets 1442 and 6446 are offset from each other vertically by half the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%, and by half the bonding head pitch + / - 2.0%, + / - 1.0%, or + / - 0.5%. Array of die transfer sheets 644 has a 4x8 matrix configuration. N is 4 for array of die transfer sheets 644.

[0071] Any of the arrays of die transfer sheets 144, 544, and 644 may be configured to have an adjustable pitch that can be reversibly changed between a source-matching pitch and a bonding head-matching pitch. The arrays of die transfer sheets 144, 544, or 644, or the carriage 146, may include motors, electrical components, etc. that can be actuated to move the die transfer sheets to achieve a desired pitch. In one embodiment, the arrays of die transfer sheets 144, 544, or 644 may be at a source-matching pitch when picking up a set of dies coupled to the source substrate chuck 122, and at a bonding head-matching pitch when transferring the dies to the array of bonding heads 124. After the dies are transferred to the array of bonding heads 124, the pitch of the arrays of die transfer sheets 144, 544, or 644 may be returned to a source-matching pitch before picking up additional dies.

[0072] In other embodiments, the source substrate chuck 122 may not be present or may not be used. System 700 includes apparatus 710 and die loading machine 720 of FIG. 7. Apparatus 710 may be the same as apparatus 110, except that it does not have a source substrate chuck. In this embodiment, the arrays 144, 544 and 644 of the die transfer sheets are set to a bond head-matching pitch and cannot be changed to a source-matching pitch during a transfer operation, which may include one or more transfer cycles.

[0073] The die loading machine 720 may be used to load the die transfer sheet of the apparatus 710. The die loading machine 720 may include a base 722, a positioning shaft 724, a positioning arm 726, and a die transfer head 728. The positioning shaft 724 may move in the X direction, the Y direction, or both the X and Y directions. The positioning shaft 724 may or may not be configured to extend or retract in the Z direction. The positioning arm 726 may be oriented and rotated along a plane defined by the X and Y directions. The positioning arm 726 may or may not be configured to extend or retract in a direction from or towards the positioning shaft 724. The die transfer head 728 may obtain a die or multiple dies from a source substrate (not shown in FIG. 7) and transfer the die or multiple dies to the multiple die transfer sheets 144 in the apparatus 710.

[0074] The terms "transfer operation" and "transfer cycle" are referred to to aid in understanding the embodiments described herein. A transfer operation begins with loading a first set of dies onto the array 144, 544 or 644 of the die transfer sheet and ends with bonding of a last set of dies to a destination bonding site of a destination substrate on the destination substrate chuck 148. A transfer cycle begins with movement of the carriage 146 to position a set of dies on the array 144 of the die transfer sheet for transfer to the bonding head array 124 until the same particular set of dies is bonded to a destination bonding site of a destination substrate coupled to the destination substrate chuck 148. A transfer operation may include one or more transfer cycles.

[0075] In one embodiment, the arrays 144, 544 and 644 of die transfer sheets need not be pick-up heads. The die transfer sheets in the arrays 144, 544 and 644 of die transfer sheets may or may not be extendable in the Z direction (towards the bridge 120 or a component coupled to the bridge 120). The die may be loaded onto the die transfer sheets in any of the arrays 144, 544 and 644 of die transfer sheets by a die loading machine. The die loading machine may be a robot, a pick-and-place tool, or the like. The system may be in the form of the apparatus 110 or a combination of the die loading machine and the apparatus 710 of FIG. 7. Alternatively, the die may be loaded manually by a human operator. Thus, the system may be in the form of the apparatus 710 when the apparatus 710 is configured to have the die loaded by a human operator.

[0076] 1 and 7 may be coupled to the carriage 146 and used during alignment operations. Four optical components 150 are shown in FIG. 3. In practice, more or fewer optical components 150 may be used. The optical components 150 may be part of registration and alignment hardware used to align the carriage 146 with the alignment datum 128, identify the die held by the array of bonding heads 124, position the bonding heads, measure misalignment errors of the die held by the array of bonding heads 124, etc.

[0077] In the embodiment shown in FIG. 3, the optical components 150 may be configured in an array, more specifically a 1×4 vector. The optical components 150 may have a pitch that is + / −2.0%, + / −1.0%, or + / −0.5% of the Y-direction bonding head pitch. The optical components 150 may position and measure misalignment errors of four dies held by the array of bonding heads 124, e.g., a row of bonding heads in FIG. 2, during one period of time, and may measure misalignment errors of another four dies held by another row of bonding heads in the array of bonding heads 124, e.g., a row of bonding heads in FIG. 2, during another period of time. Thus, the optical components 150 may help reduce process time compared to using a single optical component. Other configurations may also be used with the optical components. The optical components 150 may be configured as a 2×2 matrix, or may be configured as a 2×4 matrix with eight optical components 150. More or fewer optical components 150 and other configurations of optical components 150 may be used. The number and configuration of optical components 150 may or may not depend on the configuration of the array 124 of bonding heads.

[0078] The optical components 150 may become exponentially more complex as the number of optical components 150 increases, and may or may not be more complex depending on the particular configuration of the optical components 150. For example, the optical components 150 may include lenses optically coupled to mirrors, prisms, gratings, light sources, optical fibers, apertures, tubes, cameras, or combinations thereof. Optical couplers occupy significant space in the carriage 146 and may be difficult to route due to other components present in the carriage 146, such as the array of die transfer sheets 144 and the destination substrate chuck 148. After reading this specification, one of ordinary skill in the art will be able to determine the number of optical components 150, the configuration of the optical components 150, and the positioning of the optical components 150 within the carriage 146.

[0079] 1 and 3, the destination substrate chuck 148 may be coupled to a carriage 146 that is coupled to the base 140. In one embodiment, the destination substrate chuck 148 is mounted to the carriage 146. The destination substrate chuck 148 may hold a destination substrate having destination bonding sites. The destination substrate chuck 148 may be a vacuum chuck, a pin-type chuck, a groove-type chuck, an electrostatic chuck, an electromagnetic chuck, etc. The destination substrate chuck 148 may be heated, cooled, or both heated and cooled. The destination substrate chuck 148 may include a heater. In the same or a different embodiment, a fluid (not shown) may flow through the destination substrate chuck 148 to increase or decrease the temperature of the destination substrate chuck 148.

[0080] The device 110 may be operated using a controller 160 in communication with the bridge 120, any components coupled to the bridge 120, the base 140, any components coupled to the base 140, or any combination thereof. The controller 160 may be operated using a computer readable program, optionally stored in the memory 162. The controller 160 may include a processor (e.g., a central processing unit of a microprocessor or microcontroller), a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), or the like. The controller 160 may be within the device 110. In other embodiments (not shown), the controller 160 may be at least a part of a computer external to the device 110, such a computer being bidirectionally coupled to the device 110. The memory 162 may include a non-transitory computer readable medium including instructions for performing actions associated with or during a transfer operation. In other embodiments, bridge 120 , a component coupled to bridge 120 , base 140 , or a component coupled to base 140 may include a local controller that provides some of the functionality provided by controller 160 .

[0081] Although much of the hardware description refers to the apparatus 110 of FIG. 1, the hardware description, and potential design and configuration options, also apply to the system 700 of FIG.

[0082] Attention now turns to the method of use of the apparatus 110. Figures 8 and 9 contain process flow diagrams of the methods described with respect to Figures 10-16 and 19-26. Some parts of the apparatus 110 shown in Figure 1, such as the controller 160 and memory 162, are not shown in Figures 10-16 and 19-26 to facilitate understanding of the methods. Although much of the hardware and methods are described with respect to the apparatus 110, such hardware and methods also apply to the apparatus 710, except as noted herein.

[0083] The method may include loading a destination substrate onto a destination substrate chuck at block 822 of Figure 8, and loading a source substrate onto a source substrate chuck at block 824 of Figure 8. As shown in Figure 10, the carriage 146 may be moved to allow easier access to the source substrate chuck 122 and the destination substrate chuck 148. The actions at blocks 822 and 824 may be performed in either order.

[0084] 10, a destination substrate 1048 is loaded onto the destination substrate chuck 148. The destination substrate 1048 may include a semiconductor wafer, a package substrate, a printed wiring board, a circuit board, an interposer, and the like. A microelectronic device may be part of the destination substrate 1048, such as a semiconductor wafer. The package substrate, printed wiring board, circuit board, or interposer may or may not have a die mounted thereon. Some or all of the sides of the destination substrate 1048 may be activated for hybrid bonding. In one embodiment, the activated surfaces for hybrid bonding are shown as dark bands along the exposed surface of the destination substrate 1048.

[0085] A source substrate 1022 may be mounted on the source substrate chuck 122. A plurality of dies 1024 may be attached to the source substrate 1022. All or only a portion (but not all) of the plurality of dies 1024 are transferred to a destination substrate 1048. The source substrate 1022 may be an adhesive tape, which may be in the form of a tape frame or tape reel, a container having a lattice that defines a matrix of regions that may hold the plurality of dies 1024, or the like. The plurality of dies 1024 may have an activated bonding surface (shown as a dark band) that faces the base 140 or a component coupled to the base 140.

[0086] Any or all of the dies in the plurality of dies 1024 may include a microprocessor, a microcontroller, a graphics processing unit, a digital signal processor, a memory die (e.g., level 2 or level 3 cache, flash memory, etc.), a field programmable gate array (FPGA), a power transistor die, a power circuit die, a charge coupled device (CCD), an image sensor, semiconductor circuit elements, etc. The die has a device side having most or all of the electrical circuit elements of the die and a back side opposite the device side. In the embodiment shown in FIG. 10, the back side of a die in the plurality of dies 1024 is disposed between the source substrate chuck 122 and the device side of the die. In other embodiments, the device side of a die in the plurality of dies 1024 is disposed between the source substrate chuck 122 and the back side of the die. The side of the die facing the base 140 is activated for hybrid bonding to the destination substrate 1048, and a dark band along the bottom of the die is used to indicate the activated side. Any one or more of the dies may have through-substrate vias (TSVs) or electrical components along their backside, and such dies may also include backside bond sites that may act as future destination substrate bond sites that may be used later.

[0087] The method may further include performing registration and metrology on the plurality of dies on the source substrate and the plurality of die transfer sheets in block 832 of FIG. 8. Referring to FIG. 10, registration and metrology operations may be performed on the plurality of dies 1024 and the array of die transfer sheets 144. Any one or more of the optical components 150 may be used to gather information about the plurality of dies 1024. Information from the optical components 150 may be sent to the controller 160 or a local controller and used to determine a source pitch of the plurality of dies 1024 coupled to the source substrate chuck 122. The source pitch may include an X-direction source pitch, a Y-direction source pitch, or both an X-direction source pitch and a Y-direction source pitch. If necessary or desired, the information may be used to identify or verify that the plurality of dies 1024 and the destination substrate 1048 are correct.

[0088] The method may further include changing the pitch of the array of die transfer sheets to a source-matching pitch in block 842 of FIG. 8. In FIG. 11, the array of die transfer sheets 144 is adjusted to have a source-matching pitch. The source-matching pitch may be the same as the source pitch or may be within a tolerance of the source pitch. Like the source pitch, the source-matching pitch may include an X-direction source-matching pitch, a Y-direction source-matching pitch, or both an X-direction source-matching pitch and a Y-direction source-matching pitch. The tolerance may take into account slight differences that may be due to repeatability of equipment or manufacturing processes. As used herein, the tolerance may be within 2.0%, 1.0%, or 0.5% of the desired value. For example, the source-matching pitch may be within 2.0%, 1.0%, or 0.5% of the source pitch.

[0089] The method may include loading a plurality of die transfer sheets at block 844 of FIG. 8. Referring to FIG. 11, a die chuck of the array 144 of die transfer sheets may extend toward the source substrate 1122, pick up a plurality of dies 1124, and retract the die chuck away from the source substrate 1122. Picking up a die is a particular type of loading. Other types of loading with respect to the apparatus 710 of FIG. 7 are described later in this specification. The dies picked up may be the dies closest to each other, or there may be one or more other dies between the picked up dies, as shown in FIG. 11. The dies not picked up remain coupled to the source substrate chuck 122, as shown in FIG. 11.

[0090] In one embodiment, the die chuck of the array of die transfer sheets 144 does not contact the active surfaces of the plurality of dies 1124. The plurality of dies 1124 are held by the die chuck, but are illustrated in FIG. 11 as being spaced apart from the array of die transfer sheets 144 to indicate that the active surfaces of the dies do not contact the die transfer sheet. The array of die transfer sheets 144 can have a design that allows for picking up the dies along a side of the die, the side being between the device face and the back face of the die.

[0091] If the die is too thin to be held by its sides, a backing plate may be coupled to the die. For example, the die may have a thickness of less than 50 microns. The thickness of the backing plate, or the backing plate and die combination, is sufficient to allow the pick-up head to pick up the backing plate, or the backing plate and die combination, without having the active surface of the die contact the pick-up head. The backing plate may have a thickness in the range of 100 microns to 500 microns.

[0092] The backing plate may be coupled to the die using an adhesive compound. The backing plate may be later removed or may remain attached to the die in the completed electrical device. After the die is bonded to the destination substrate 1048, the backing plate may be removed. In one embodiment, the adhesive compound may be inactivated by exposure to actinic radiation. The actinic radiation may be in the range of 100 nm to 1000 nm. In such an embodiment, at least 70% of the actinic radiation is transmitted through the backing plate. In other embodiments, a solvent may be used to remove the adhesive compound from between the die and the backing plate.

[0093] In other embodiments, a die may not have an active surface, but may have relatively fragile components along the surface that will be bonded to the destination substrate 1048, and such surface should not be brought into contact with a die transfer sheet in the array of die transfer sheets 144. A die transfer sheet as described for a die having an active surface may be used with a die that has fragile components along the surface that faces the die transfer sheet.

[0094] In further embodiments, the die chuck of the array of die transfer sheets 144 can have a design where the die chuck contacts the bottom side of the plurality of dies 1124. After reading this entire specification, one of ordinary skill in the art will be able to determine whether the array of die transfer sheets 144 should contact the device side or the back side of the die and determine a design that meets the needs or desires of a particular application.

[0095] The method may further include changing the pitch of the sets of die transfer sheets to a bonding head-matching pitch in block 846 of Figure 8. The array 144 of the die transfer sheets includes set 1442 and set 1444, as shown in Figure 3. Figure 12 includes a top view of a portion of the base 140 at this point in the process. Sets 1442 and 1444 are present but are not shown in Figure 12 because sets 1442 and 1444 are covered by the plurality of dies 1124. With reference to Figures 3 and 12, the set of dies corresponding to set 1442 is transferred to the destination substrate 1048 before the other set of dies corresponding to set 1444 is transferred to the destination substrate 1048.

[0096] The die transfer sheets in sets 1442 and 1444 may or may not be at the bond head-matching pitch. For example, the die transfer sheets in both sets 1442 and 1444 may be at the bond head-matching pitch at the start of the transfer operation and throughout the transfer operation. The action at block 846 of FIG. 8 may be omitted.

[0097] If the die transfer sheets in either or both of sets 1442 and 1444 are not at the bonding head-matching pitch, the action at block 846 may be performed for the affected set. During the transfer cycle, at least the die transfer sheets in set 1442 are changed to the bonding head-matching pitch during this operation if the die transfer sheets are not already at the bonding head-matching pitch. If the die transfer sheets in set 1444 are not at the bonding head-matching pitch, the die transfer sheets with set 1444 may be changed to the bonding head-matching pitch now or before the die of the set corresponding to set 1444 are transferred to the array of bonding heads 124. In the embodiment shown in FIGS. 11 and 12, the die transfer sheets in sets 1442 and 1444 are at the bonding head-matching pitch.

[0098] In a different embodiment, the plurality of die transfer sheets 144 may have a higher density of die transfer sheets and not all die transfer sheets are at the bonding head-matching pitch at the same time. At least one set of die transfer sheets, but not all, in the plurality of die transfer sheets 144 may be changed to the bonding head-matching pitch for one transfer cycle and at least one different set of die transfer sheets, but not all, in the plurality of die transfer sheets 144 may be changed to the bonding head-matching pitch for another transfer cycle.

[0099] The bonding head-matching pitch may be the same as or within a tolerance of the bonding head pitch of the array of bonding heads 124. The bonding head-matching pitch and the bonding head pitch may include the X-direction bonding head-matching pitch, the Y-direction bonding head-matching pitch, or both the X-direction bonding head-matching pitch and the Y-direction bonding head-matching pitch. The tolerance may take into account slight differences that may be due to repeatability of equipment or manufacturing processes. As used herein, the tolerance may be within 2.0%, 1%, or 0.5% of the desired value. For example, the bonding head-matching pitch may be within 2.0%, 1%, or 0.5% of the bonding head pitch.

[0100] The method may include moving the carriage to an alignment position in block 922 of FIG. 9. In FIG. 13, the carriage 146 is moved such that the alignment fiducials 128 are over the optics 150. Information collected from the optics 150 may be received by the controller 160 or a local controller. The controller 160 or a local controller may use the information to send a signal to the carriage to move to a desired position. In one embodiment, as shown in FIG. 14, the carriage 146 is moved such that the array of bonding heads 124 is over a set of dies corresponding to the set of die transfer sheets 1442. The movement may include moving the carriage in the X and Y directions, rotating the carriage along the XY plane, or a combination thereof.

[0101] The method may further include transferring the set of dies from the set of die transfer sheets to the array of bonding heads at block 924 of Figure 9. The die chucks of the set of die transfer sheets 1442 may extend toward the array of bonding heads 124, the die chucks of bonding heads in the array of bonding heads 124 may extend toward the set of die transfer sheets 1442, or both. Figure 15 includes a set 1524 of dies from the plurality of dies 1124 being transferred from the set of die transfer sheets 1442 to the array of bonding heads 124.

[0102] The method may include measuring alignment of the die set using a plurality of optical components at block 932 of Figure 9. Optical components 150 coupled to the carriage 146 may be used to position the die set 1524, measure alignment errors of the die set 1524, or both.

[0103] Better positioning of the dies may be achieved by measuring the alignment error as the position of each die on each bond head relative to the ideal position of the die on the bond head. Information from the optics 150 may be sent to and received by the controller 160 or local controller. The controller 160 or local controller may use the information to determine the alignment error and the amount of positioning of the die so that the die is more closely aligned to the corresponding destination bonding site of the destination substrate 1048. The controller 160 or local controller may send a signal so that the position of each die is adjusted by moving the die chuck of the bond head using the limited range of movement of the die chuck relative to its corresponding body. Thus, in one embodiment, moving the die chuck allows the position of the die to be adjusted relative to the destination substrate 1048 held by the destination substrate chuck 148. The positioning and alignment error measurements may be performed iteratively until the alignment error is zero or an acceptably low value.

[0104] The optical components 150 may be arranged in an array based at least in part on the array of bonding heads 124. With reference to FIG. 2, the array of bonding heads 124 has two rows and four columns in a 2×4 matrix. The array of bonding heads 124 has an X-direction bonding head pitch corresponding to the rows of bonding heads and a Y-direction bonding head pitch corresponding to the columns of bonding heads. In FIG. 3, four optical components 150 are oriented along the columns. The optical components 150 may be arranged in a vector (1×4) having a Y-direction pitch substantially the same as the Y-direction pitch of the array of bonding heads 124. In non-limiting embodiments, the Y-direction of the optical components 150 may be within 2.0%, 1.0%, or 0.5% of the Y-direction bonding head pitch of the array of bonding heads 124.

[0105] In the configurations shown in FIGS. 2, 3 and 16, positioning the die as needed and measuring the alignment error of a row of dies in the set of dies 1524 that corresponds to a row of bond heads in the array of bond heads 124 occurs over the same period T PM (time for positioning, if necessary, and time for measuring alignment errors). Positioning (if necessary) and measuring alignment errors for other rows of dies in die set 1524 corresponding to other rows of bonding heads in array of bonding heads 124 may then be performed for another period T PM The T of various rows of the die can be performed PM The values ​​of T may be approximately the same. Therefore, the positioning (if necessary) and alignment error measurement for the set of dies 1524 is performed with twice the T PM (2*T PM ) may be required.

[0106] Increasing the number of optical components can reduce cycle time, but can make the design of the device substantially more complex. With reference to FIG. 3, optical components 150 can refer to lenses into which light may enter. FIG. 3 may include other optical components not shown in FIG. 3, such as mirrors, optical tubes, other lenses, cameras, supporting electrical components that can be used to focus the lens, transmit collected data, and the like. Such other components are referred to herein as "additional components." Additional components are present but not shown in FIG. 3.

[0107] The array of die transfer sheets 144 may have motors that control X-, Y-, or Z-motion, tip, tilt, rotation, or a combination of orientation. If additional components are routed underneath the array of die transfer sheets 144, the carriage 146 may need to be taller (larger in the Z direction). If additional components are routed underneath the destination substrate chuck 148, the additional components need to be positioned so that the destination substrate chuck 148 has adequate mechanical support during the bonding operation. Additionally, the destination substrate chuck 148 may be heated or cooled, which may adversely affect the additional components.

[0108] Figure 17 shows a carriage 1746 that is similar to carriage 146, except that carriage 1746 is longer in the X direction. Support part 172 is shown with an outer boundary having a dashed line to indicate that some or all of the support part is within carriage 1746 and may or may not be visible from a top view of carriage 1746. In the embodiment shown in Figure 17, the length of support part 172 is oriented in the X direction.

[0109] 3, if only one optical component 150 is present, the particular optical component 150 may be near the top or bottom of FIG. 3, the other optical component 150 may be removed, and the add-on component 172 for the particular optical component 150 may have a length in the Y direction. In this configuration, positioning (if necessary) and measuring alignment errors may be performed eight times, taking 8*T PM It is necessary.

[0110] In other embodiments, the X dimension of the carriage may be limited by the design of the device or other considerations. FIG. 18 shows a carriage 1846 similar to carriage 146 except that carriage 1846 is shorter in the X direction and longer in the Y direction. Optical components 150 are arranged in a 2×1 vector. Support components 172 are shown with a dashed outer boundary to indicate that some or all of the support components may be within carriage 1846 and may or may not be visible from a top view of carriage 1846. In the embodiment shown in FIG. 18, the length of support components 172 is oriented in the Y direction. In this configuration, positioning (if necessary) and measuring alignment errors are performed four times, taking 4*T PM It is necessary.

[0111] After reading this specification, one of ordinary skill in the art will understand that there may be trade-offs between cycle time and equipment complexity, and will be able to determine the configuration and design of optical component 150 and additional components 172 to meet the needs or desires of a particular application.

[0112] The method description continues with the apparatus as described with respect to apparatus 110 of Figures 1-3. The method may include moving the carriage such that the array of bond heads is above the destination substrate at block 934 of Figure 9. In Figure 19, the carriage 146 is moved such that the set of die 1524 is above the destination bonding site of the destination substrate 1048.

[0113] The method may further include bonding the set of dies to corresponding destination bonding sites of the destination substrate in block 936 of FIG. 9. The die chuck for the array of bonding heads 124 may extend towards the destination substrate 1048, the destination substrate chuck 148 may extend towards the array of bonding heads 124, or both. Pressure is applied to bond the set of dies 1524 to corresponding destination bonding sites of the destination substrate 1048 in FIG. 20. In one embodiment, the bonding may be oxide-oxide bonding. The pressure during bonding may be 0.5 N / cm. 2 ~20N / cm 2 The bonding can be performed at room temperature (e.g., at a temperature in the range of 20° C. to 25° C.) or above. The bonding is performed at a temperature lower than the subsequent anneal to expand the conductive metal in the die and at the destination bonding site. The temperature and pressure can be limited depending on the films present during bonding or components in the device 110. For example, the temperature may be about 200° C. or less. After reading this specification, one of ordinary skill in the art will be able to determine the pressure and temperature to be used for bonding.

[0114] Figure 21 includes a top view of base 140 and components coupled to base 140 after set of die 1524 has been bonded to corresponding destination bonding sites of destination substrate 1048. Set of die 1524 was previously on set of die transfer sheets 1442 (Figure 12), which is visible in Figure 21 at this point in the method. Although other set of die transfer sheets 1444 is present, it is not visible because it is covered by the remaining dies in plurality of dies 1124. At this point in the method, one transfer cycle is completed.

[0115] 9, a determination is made as to whether another set of die should be transferred to the destination substrate. If no more die are to be transferred ("no" branch), the transfer operation is complete and the method for transferring die ends.

[0116] If more die are to be transferred (the "YES" branch from decision diamond 938 in FIG. 9), the method continues starting at block 924 in FIG. 9. Referring to FIG. 3 and FIG. 21, the die on the other set of die transfer sheets 1444 are transferred to the destination substrate 1048. Because the plurality of die 1124 was preloaded before the set of die 1524 was transferred to the array of bonding heads 124, the operations described with respect to blocks 832, 842, 844 and 846 in FIG. 8 and block 922 in FIG. 9 do not need to be repeated. The carriage 146 may be moved to a position such that the die in the plurality of die 1124 corresponding to the other set of die transfer sheets 1444 is under the array of bonding heads 124, as shown in FIG. 22.

[0117] The method may further include transferring the set of dies from the set of die transfer sheets to the array of bonding heads at block 924 of Figure 9. The die chucks of the set of other die transfer sheets 1444 may extend toward the array of bonding heads 124, the die chucks of the bonding heads in the array of bonding heads 124 may extend toward the set of other die transfer sheets 1444, or both. Figure 23 includes a set 2324 of dies from the plurality of dies 1124 transferred from the set of other die transfer sheets 1444 to the array of bonding heads 124.

[0118] The method may include measuring alignment of the set of dies using a plurality of optical components at block 932 of Figure 9. The positioning (if required) and alignment error measurements that may be performed for the set of dies 2324 may be performed using any of the actions and configurations as described above with respect to the set of dies 1524. The positioning (if required), alignment error measurements, and specific configuration of the optical components 150 for the set of dies 2324 may be the same or different than the positioning (if required), alignment error measurements, and specific configuration of the optical components 150 for the set of dies 1524.

[0119] The method may include moving the carriage so that the array of bond heads is over the destination substrate in block 934 of Figure 9. In Figure 24, the carriage 146 is moved so that the set of dies 2324 is over the destination bonding site of the destination substrate 1048.

[0120] The method may further include bonding the set of dies to corresponding destination bonding sites of the destination substrate at block 936 of FIG. 9. The die chuck of the array of bonding heads 124 may extend towards the destination substrate 1048, the destination substrate chuck 148 may extend towards the array of bonding heads 124, or both. Pressure is applied to bond the set of dies 2324 to corresponding destination bonding sites of the destination substrate 1048. In one embodiment, the bonding may be oxide-oxide bonding. The pressure during bonding may be 0.5 N / cm 2 ~20N / cm 2The bonding can be performed at room temperature (e.g., at a temperature in the range of 20° C. to 25° C.) or above. The bonding is performed at a temperature lower than the subsequent anneal to expand the conductive metal in the die and at the destination bonding site. The temperature and pressure can be limited depending on the films present during bonding or components in the device 110. For example, the temperature may be about 200° C. or less. After reading this specification, one of ordinary skill in the art will be able to determine the pressure and temperature to be used for bonding.

[0121] 25 and 26 include side and top views, respectively, of base 140 and components coupled to base 140 after a plurality of dies 2524 have been bonded to corresponding destination bonding sites of destination substrate 1048. The plurality of dies 2524 includes die sets 1524 and 2324. Die transfer sheet sets 1442 and 1444 are as seen in FIG. 26. At this point in the method, another transfer cycle is completed.

[0122] The hybrid bonding process may include three steps including a bonding operation, a first anneal to expand and contact the metals in the die and at the destination bond site, and a second anneal to cross the metal-metal interface and reduce contact resistance. The method described above with respect to the flow charts of Figures 8 and 9 may correspond to the bonding operation of the hybrid bonding process as described and illustrated in Figures 10-16 and 19-26. The destination substrate 1048 may be removed from the apparatus 110 or moved to a different part or tool of the apparatus 110 to perform the anneal operation.

[0123] The method described with respect to the process flow diagrams of Figures 8 and 9 need not be performed in the order depicted in Figures 8 and 9. For example, loading the destination substrate at block 822 may be performed before or after loading the source substrate at block 824. Additionally, loading the destination substrate at block 822 and loading the source substrate at block 824 may be performed such that at least some of the loading actions are performed simultaneously. As with blocks 822 and 824, the operations described with respect to block 846 (changing pitch for the die transfer sheet) and block 922 (moving the carriage) of Figure 9 may be performed in either order or such that at least some of the actions of blocks 846 and 922 are performed simultaneously.

[0124] The apparatus 710 of Figure 7 may be used to transfer a plurality of dies from the array 144 of the die transfer sheet to a destination bonding site of a destination substrate on the destination substrate chuck 148. Please refer to the process flow diagrams of Figures 8 and 9 as needed. The order of some operations and the specific actions of the operations may vary depending on the apparatus 710. Additionally, Figures 10-26 may apply to the apparatus 710, except that the source substrate chuck 122, source substrate 1022, and plurality of dies 1024 are not present.

[0125] The array 144 of the die transfer sheet does not need to be source-matched because there is no source substrate on the array 144 of the die transfer sheet. The array 144 of the die transfer sheet may already be at bond head-matching pitch. The die may be loaded onto the array 144 of the die transfer sheet by a human operator or by a die loading machine, such as die loading machine 720. The die loading machine may be a robot, a pick and place tool, or the like.

[0126] If a die loading machine is used, the operations at block 832 may be modified for the die loading machine. The die loading machine may include one or more optical components similar to any of the optical components 130 and 150. The one or more optical components of the die loading machine may be used when performing registration and metrology for the die loading machine and the plurality of die transfer sheets 144. The registration and metrology is similar to block 832 of FIG. 8 described above.

[0127] Next, the method may include loading the multiple die transfer sheets at block 844 of Figure 8. The dies for the multiple die transfer sheets 144 may be transferred individually (one at a time) in sets (a set of dies for die transfer sheet set 1442 and another set of dies for die transfer sheet 1444), all dies for the multiple die transfer sheets 144 simultaneously, or other groups of dies.

[0128] The operation of block 846 may or may not need to be performed depending on whether the set of die transfer sheets 144 is already at a bond head-matching pitch. The remainder of the method, including the operations recited in blocks 922, 924, 932, 934, 936, and decision diamond 938, are performed for apparatus 710 in substantially the same manner as apparatus 110.

[0129] Working Example The examples described below are provided to demonstrate the throughput per unit time using different designs of the apparatus, which are described in more detail later in this specification.

[0130] Table 1 below includes the actions and the time each action takes. A brief description of the operations is provided in Table 1.

[0131] Table 1 - Action times JPEG2025019996000002.jpg67170

[0132] Action A corresponds to moving the carriage 146 to a position below the source substrate 1022 in Fig. 10. Action B is to load the die onto the multiple die transfer sheet 144 in Fig. 11. In this embodiment, the multiple die transfer sheet 144 is multiple pick-up heads, which pick up multiple dies 1124 from the source substrate 1022.

[0133] Action 1 is to move carriage 146 to the bonding head position. Part of the process can be using optics 150 and alignment datum 128 in FIG. 13 and moving carriage 146 to a position to transfer set of dies 1524 in FIG. 14. Action 2 is to transfer set of dies from set 1442 of die transfer sheets to array of bonding heads 124. An example can be set of dies 1524 transferred to array of bonding heads in FIG. 15.

[0134] Action 3 is to move the carriage to the alignment position of the die, die column, or die row, action 4 is to measure the alignment error, and action 5 is to step to the next die, next die column, or next die row, if applicable. These actions are generally described with respect to FIG.

[0135] Actions 3-4 may depend on the number and configuration of optical components 150 on the carriage 146. If the carriage 146 has only one optical component 150 and the array 124 of bonding heads has a 2×4 configuration, positioning and alignment will be performed in eight separate steps, resulting in 8*T PM It takes time.

[0136] When the optics 150 has a 1×4 configuration as seen in FIG. 3 and FIG. 12, positioning and alignment are performed row by row. In other words, the optics 150 is used to perform positioning and alignment error measurements for a die coupled to a row of bonding heads in the array of bonding heads 124 before performing positioning and alignment error measurements for a die coupled to a different row of bonding heads in the array of bonding heads 124. For a die in each row, the positioning and alignment error measurements may be performed in one period. With the array of bonding heads 124 and the optics 150 in a 1×4 configuration, positioning and alignment are performed twice, once for each row, resulting in a 2*T PM It takes time.

[0137] When the optics 150 have a 2×1 configuration as seen in FIG. 18 , positioning and alignment are performed row by row. In other words, the optics 150 is used to perform positioning and alignment error measurements for a die coupled to a row of bond heads in the array of bond heads 124 before performing positioning and alignment error measurements for a die coupled to a different row of bond heads in the array of bond heads 124. For a die in each row, the positioning and alignment error measurements may be performed in one period. With the array of bond heads 124 and the optics 150 in a 2×1 configuration, positioning and alignment are performed four times, one for each row, resulting in 4*T PM It takes time.

[0138] The number and configuration of optical components 150 may be selected to increase throughput, but increasing throughput may result in a substantial increase in design complexity associated with additional components 172 that may be present, as described with respect to Figures 17 and 18.

[0139] Action 6 is stepping to a bonding position (and making alignment corrections, if necessary or desired). Action 6 is shown and described with respect to FIG. 19. Action 7 is a bonding operation. Action 7 can include a Z-down movement as the array of bonding heads 124 moves the die to a destination bonding site of the destination substrate 1048 to perform bonding, and a Z-up movement as the array of bonding heads 124 moves away from the destination substrate 1048. FIGS. 20 and 21 include side and top views after the set of die 1524 has been bonded to the destination bonding site of the destination substrate 1048.

[0140] Actions 1-7 are repeated for another set of dies to be bonded to other destination bonding sites of the destination substrate, as generally shown and described with respect to Figures 22-26.

[0141] Examples 1-4 compare different equipment configurations in terms of throughput. All examples have an array of bonding heads with a 2x4 configuration and contain 8 bonding heads (M=8). The optical components 150 have a 1x4 configuration and contain 4 optical components. The following equipment has an operating rate of 80%. In Examples 1-4, the die transfer sheet is a pick-up head that is a specific type of die transfer sheet.

[0142] Example 1 is similar to apparatus 110, except that the multiple die transfer sheet (pick-up heads in the example) is on a separate carriage compared to optics 150 and destination substrate chuck 148. The multiple die transfer sheet has the same number and configuration as array of bonding heads 124.

[0143] Example 2 is similar to apparatus 110, except that multiple pick-up heads can include sets of die transfer sheets 1442 or 1444, but not both. The number of die transfer sheets divided by the number of bonding heads (M) in array of bonding heads 124 is one (N=1).

[0144] Example 3 is represented by apparatus 110. The multiple pick-up heads may be arranged in a 4×4 matrix, as shown by set of die transfer sheets 144 in Figure 4. Alternatively, the multiple pick-up heads may be arranged in a 2×8 matrix, as shown by set of die transfer sheets 544 in Figure 5. For each of the 4×4 and 2×8 matrices, the number of die transfer sheets divided by the number of bonding heads (M) in array of bonding heads 124 is two (N=2).

[0145] Example 4 is similar to apparatus 110, except that plurality of die transfer sheets 644 (FIG. 6) can include sets of die transfer sheets 1442, 1444, 6446, and 6448. Plurality of die transfer sheets 644 are arranged in a 4×8 matrix. The number of die transfer sheets in plurality of die transfer sheets 644 divided by the number of bonding heads (M) in array of bonding heads 124 is four (N=4).

[0146] Table 2 includes information about each of the examples, the value of N, the actions per cycle, the cycle time, and the throughput.

[0147] Table 2 - Throughput comparison of Examples 1 to 4 JPEG2025019996000003.jpg41170

[0148] Example 1 has the highest throughput at 4851 units / hour. In example 1, actions A and B may be executed while actions 1-7 are executed. Actions 1-7 take longer to complete compared to actions A and B. Therefore, actions 1-7 are the limiting actions in example 1.

[0149] The dual carriage configuration of Example 1 may complicate the method. The carriage with the multiple die transfer seats, the other carriage with the optical components, and the destination substrate chuck are physically connected to each other through the base of the apparatus. The carriage with the multiple die transfer seats may move independently of the other carriages. The other carriages may perform operations such as alignment, bonding, or other actions requiring high precision while the carriage with the multiple die transfer seats is starting, stopping, or while the pick-up head is extending towards the source substrate chuck 122, picking up a die from the source substrate 102, or retracting the pick-up head from the source substrate chuck 122.

[0150] Vibrations or other motions caused by actions being performed by the multiple pickup heads or their corresponding carriages may be transferred to the other carriages carrying the optics and the destination substrate chuck 148. Such transferred vibrations or other motions may interfere with the alignment or placement of the die on the destination substrate 1048. The misalignment tolerance of the bonding operation in hybrid bonding is substantially smaller than other methods of connecting dies, such as wire bonding or flip chip packaging. As dimensions continue to shrink, the misalignment tolerances decrease as well. Example 1 has the highest throughput, but as misalignment tolerances continue to decrease, the dual carriage design may not be an acceptable option.

[0151] For Example 2, the value of N is 1. The carriage returns to the source loading position after each set of dies is bonded to the destination bonding sites of the destination substrate 1048. Frequent trips back and forth to the source position to get more dies has a large negative impact on throughput. Example 2 has a throughput of 3491 dies per hour. If the minimum throughput is 4000 dies / hour, Example 2 is an unacceptable alternative.

[0152] In Example 3, the value of N is 2 and the throughput is 4060 units / hour. In Example 4, the value of N is 4 and the throughput is 4420 units / hour. The throughputs of Examples 3 and 4 are above 4000 units / hour and are acceptable.

[0153] As the value of N continues to increase, the throughput approaches that of a dual carriage configuration. In theory, N can be a very high number, but in practice, the manufacturing costs of the device, the design complexity of the device, or both, may increase exponentially with a linear increase in N. After reading this specification, one of ordinary skill in the art will be able to determine a value of N that achieves a relatively high throughput without excessive manufacturing costs or design complexity.

[0154] The embodiments described herein allow for a relatively high throughput of dies for bonding methods and can still meet increasingly stringent dimensional requirements for hybrid bonding. A carriage with multiple die transfer seats and a destination substrate chuck can help reduce vibration or other motion during alignment and bonding, as compared to other carriages with multiple die transfer seats and transfer substrate chucks. The reduced vibration or other motion can allow the apparatus to be used as dimensional requirements for hybrid bonding continue to decrease, while a dual carriage configuration may no longer be able to meet the dimensional requirements.

[0155] The number of die transfer sheets can be selected to achieve an acceptable throughput. As the value of N (number of die transfer sheets / number of bonding heads) increases, the throughput approaches that of a dual carriage apparatus. One skilled in the art will be able to determine a value of N that provides a good balance between throughput, cost, and mechanical complexity of the apparatus.

[0156] It should be noted that not all of the activities described above in the general description or examples are required, some of the specific activities may not be required, and one or more additional activities may be performed in addition to those described. Furthermore, the order in which the activities are listed is not necessarily the order in which they are performed.

[0157] Benefits, other advantages, and solutions to problems have been described above with respect to particular embodiments. However, the benefits, advantages, solutions to problems, and any features that may give rise to or make more pronounced any benefit, advantage, or solution should not be construed as critical, necessary, or essential features of any or all of the claims.

[0158] The specification and illustrations of the embodiments described herein are intended to provide a general understanding of the structure of the various embodiments. The specification and drawings are not intended to serve as an exhaustive and comprehensive description of all of the elements and features of the apparatus and systems that use the structures or methods described herein. Separate embodiments may also be provided in combination in a single embodiment, and conversely, various features that are described for brevity in the context of a single embodiment may also be provided separately or in any subcombination. Furthermore, references to values ​​described in ranges include each and every value within that range. Many other embodiments may become apparent to those skilled in the art only after reading this specification. Other embodiments may be used and derived from the present disclosure, such that structural substitutions, logical substitutions, or other changes may be made without departing from the scope of the present disclosure. Thus, the present disclosure should be considered as illustrative, and not restrictive.

Claims

1. A first substrate chuck; an array of M bonding heads; an array of N*M die transfer sheets; A carriage; the first substrate chuck and the array of N*M die transfer sheets are positioned along the carriage, where each of N and M is an integer greater than one.

2. The system of claim 1 , wherein N is at most 10.

3. Further comprising a bridge and a component connected to the bridge, 2. The system of claim 1, wherein the array of N*M die transfer sheets includes a body and a die chuck, and the bridge or the part coupled to the bridge is closer to the die chuck than the body.

4. 4. The system of claim 3, wherein a bond head chuck surface of the array of M bond heads is oriented to face the first substrate chuck when the carriage is beneath the array of M bond heads.

5. an alignment reference and a plurality of optical components positioned along the carriage; The system of claim 1 , wherein the plurality of optical components are oriented to face the alignment datum when the carriage is in a third position.

6. 6. The system of claim 5, wherein the array of M bonding heads has an A*B matrix configuration, and the plurality of optical components has A optical components, B optical components, or an A*B matrix configuration, where each of A and B is an integer.

7. Further comprising a second substrate chuck; 2. The system of claim 1, wherein the second substrate chuck is closer to a die chuck of the N*M die transfer sheets than to a body of the N*M die transfer sheets when the carriage is over the array of the N*M die transfer sheets.

8. 8. The system of claim 7, wherein the array of N*M die transfer sheets is an array of N*M pick-up heads.

9. 10. The system of claim 1, further comprising a die loading machine configured to load a die transfer sheet in the array of N*M die transfer sheets.

10. the array of M bond heads has a bond head pitch; the N*M die transfer sheets include a first set of die transfer sheets and a second set of die transfer sheets; 2. The system of claim 1, wherein each die transfer sheet of the first set of die transfer sheets and the second set of die transfer sheets is at a pitch within 2.0% of the bonding head pitch.

11. 11. The system of claim 10, wherein the second set of die transfer sheets are offset in a first direction from the first set of die transfer sheets by a first distance that is within 2.0% of 0.5 times the bonding head pitch.

12. the N*M die transfer sheets further include a third set of die transfer sheets and a fourth set of die transfer sheets; 12. The system of claim 11, wherein each die transfer sheet of the third set of die transfer sheets and the fourth set of die transfer sheets is at a pitch within 2.0% of the bonding head pitch.

13. the third set of die transfer sheets are offset in a second direction perpendicular to the first direction from the first set of die transfer sheets by a second distance that is within 2.0% of 0.5 times the bonding head pitch; 13. The system of claim 12, wherein the fourth set of die transfer sheets are offset from the first set of die transfer sheets by the first distance in the first direction and by the second distance in the second direction.

14. a base and a bridge spaced apart from the base, 2. The system of claim 1, wherein said carriage is coupled to said base and said array of M bonding heads is coupled to said bridge.

15. Transferring a first set of dies from the array of N*M die transfer sheets to the array of M bonding heads; bonding the first set of dies to a destination substrate; transferring a second set of dies from the array of N*M die transfer sheets to the array of M bonding heads; and bonding the second set of dies to the destination substrate. A method wherein each of N and M is an integer greater than one.

16. 16. The method of claim 15, further comprising loading a die transfer sheet in the array of N*M die transfer sheets with the first set of dies and the second set of dies, wherein loading the first set of dies and the second set of dies occurs before transferring the first set of dies to the array of M bonding heads and before transferring the second set of dies to the array of M bonding heads.

17. 17. The method of claim 16, wherein loading the die transfer sheets in the array of N*M die transfer sheets comprises picking up the first set of dies, the second set of dies, or both the first set of dies and the second set of dies with an array of N*M pick-up heads.

18. The method of claim 16, wherein the loading of the die transfer sheet is performed using a die loading machine.

19. the array of M bond heads has a bond head pitch; positioning the array of N*M die transfer sheets at a first position prior to transferring the first set of dies; positioning the array of N*M die transfer sheets at a second location prior to transferring the second set of dies; 16. The method of claim 15, wherein the distance between the first location and the second location is within 2.0% of 0.5 times the bonding head pitch.

20. 16. The method of claim 15, wherein bonding the first set of dies, bonding the second set of dies, or bonding the first set of dies and bonding the second set of dies is part of a hybrid bonding operation.

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