Flip LED packaging device and preparation method and application thereof

Abstract

The invention discloses a preparation method of an inverted LED packaging device, and relates to the technical field of semiconductor devices.The inverted preparation method comprises the steps that stamping, electroplating and injection molding are conducted on a tape-winding type metal plate, and a tape-winding type LED support is formed; bonding the flip LED chip on the tape winding type LED bracket through soldering paste to complete die bonding; the bonding pad of the flip LED chip is connected with the conductive area on the winding type LED support through the soldering paste in a reflow soldering mode; packaging glue is filled in the groove of the tape type LED support in a glue brushing mode, and baking and curing are carried out; according to the flip LED packaging device and the manufacturing method of the flip LED packaging device, the technical problem that in the prior art, a sheet type LED support is adopted for packaging, and the process efficiency is low can be solved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and in particular to a flip-chip LED packaging device and a preparation method and application thereof. Background Art

[0002] Flip-chip LED packaging devices have the advantages of energy saving, durability and pollution-free. They are currently widely used in lighting, display and backlight fields, and have attracted widespread attention as a next-generation lighting method with clear advantages.

[0003] Typically, the packaging process for flip-chip LED devices involves stamping, electroplating, and injection molding, followed by corner cutting to create a chip-type LED bracket, which then flows into the subsequent packaging process for the flip-chip LED device. The subsequent packaging components of the flip-chip LED device include the bracket, chip, glue, and phosphor. The product is completed through die bonding, wire bonding, dispensing, and testing. Currently, the packaging process for flip-chip LED devices is performed on a chip-by-chip basis, which is limited by equipment size and cannot achieve maximum efficiency. Summary of the Invention

[0004] In view of the shortcomings of the existing technology, the purpose of the present invention is to provide a flip-chip LED packaging device and its preparation method and application, aiming to solve the technical problem of low process efficiency in the existing technology of using chip-type LED brackets for packaging.

[0005] A first aspect of the present invention is to provide a method for preparing a flip-chip LED package device, the method comprising:

[0006] The rolled metal sheet is stamped, electroplated and injection molded to form a rolled LED bracket;

[0007] Bond the flip-chip LED chip to the tape-and-reel LED bracket using solder paste to complete the die bonding.

[0008] The solder paste connects the pads of the flip-chip LED chip to the conductive area on the tape-and-reel LED bracket by reflow soldering;

[0009] Fill the encapsulation glue into the groove of the tape-and-reel LED bracket by brushing, and bake and cure;

[0010] The tape-type LED bracket is cut and split to obtain a flip-chip LED package device.

[0011] Compared with the prior art, the beneficial effects of the present invention are: through the preparation method of the flip-chip LED packaging device provided by the present invention, a roll-type LED bracket is adopted for circulation, and soldering is achieved through tinning, crystal bonding, and reflow, which can effectively solve the problems of short circuit, twisting or broken wires in the welding line caused by the roll-type structure, and simplifies the process steps, greatly improving the process efficiency. The brushing method is used to achieve continuous and uniform glue dispensing, improve uniformity, and further improve process efficiency, thereby solving the technical problem of low process efficiency in the prior art of using a chip-type LED bracket for packaging.

[0012] According to one aspect of the above technical solution, the step of filling the groove of the tape-and-roll LED bracket with the encapsulation glue by brushing the glue specifically includes:

[0013] Open holes in the mesh to leave space for grooves, and place the mesh on the roll-up LED bracket with the holes corresponding to the grooves.

[0014] The encapsulation glue is pushed by a rolling cutter to fill the groove of the tape-type LED bracket.

[0015] According to one aspect of the above technical solution, the packaging glue includes fluorescent glue and silica gel.

[0016] According to one aspect of the above technical solution, before the step of cutting and splitting the tape-type LED bracket to obtain the flip-chip LED device, the method further includes:

[0017] Cut and bend the tape-type LED bracket.

[0018] According to one aspect of the above technical solution, the electroplated material includes silver and nickel, the thickness of the silver is 0.3 μm to 2 μm, and the thickness of the nickel is 0.3 μm to 0.5 μm.

[0019] According to one aspect of the above technical solution, the material of the rolled metal plate includes one of an iron metal substrate, a copper metal substrate, an aluminum metal substrate, and a multi-layer copper-aluminum structure metal substrate.

[0020] A second aspect of the present invention is to provide a flip-chip LED package device, wherein the flip-chip LED package device is prepared by the above-mentioned method for preparing the flip-chip LED package device.

[0021] The third aspect of the present invention is to provide an application of the above-mentioned flip-chip LED package device in the fields of display, backlight and lighting. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of the embodiments with reference to the accompanying drawings, in which:

[0023] Figure 1This is a schematic diagram of the process of a method for preparing a flip-chip LED package device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0024] To make the objectives, features, and advantages of the present invention more readily apparent, the following detailed description of specific embodiments of the present invention is provided in conjunction with the accompanying drawings. The accompanying drawings illustrate several embodiments of the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an element centered thereon. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an element centered thereon. The terms "vertical", "horizontal", "left", "right", "up", "down" and similar expressions used herein are for illustrative purposes only and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore should not be understood as limiting the present invention.

[0026] In the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," and the like should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to mechanical connections or electrical connections; they may refer to direct connections or indirect connections through an intermediate medium; and they may refer to internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances. The term "and / or" as used herein includes any and all combinations of one or more of the relevant listed items.

[0027] The technical solution of the present invention is described in detail below with reference to specific embodiments.

[0028] See also Figure 1 , shown is a method for preparing a flip-chip LED package device provided by an embodiment of the present invention, the preparation method includes: steps S10 to S14.

[0029] Step S10, stamping, electroplating, and injection molding the roll-to-roll metal plate to form a roll-to-roll LED bracket;

[0030] The material of the roll-to-roll metal plate includes one of an iron metal substrate, a copper metal substrate, an aluminum metal substrate, and a multi-layer copper-aluminum structure metal substrate. The roll-to-roll LED bracket circulation can effectively improve efficiency.

[0031] In addition, the electroplated material includes silver and nickel, the thickness of the silver is 0.3 μm to 2 μm, and the thickness of the nickel is 0.3 μm to 0.5 μm.

[0032] Furthermore, the rolled metal sheet is subjected to high-speed stamping by using a precision mold to form the rolled metal sheet with a specific conductive area and pin shape.

[0033] Engineering plastics (such as PPS, LCP) are injected into specific areas of the rolled metal sheet to form an insulating layer, a reflective cup or a fixed structure.

[0034] Step S11, bonding the flip-chip LED chip to the tape-and-reel LED bracket using solder paste to complete die bonding;

[0035] Solder paste is used as a bonding medium, and the electrode surface (ie, the "flip surface") of the flip-chip LED chip is aligned downwardly to the conductive area of the tape-and-roll LED bracket.

[0036] Furthermore, the solder pads of the flip-chip LED chip are in direct contact with the tape-and-reel LED bracket, eliminating the traditional wire bonding step, reducing resistance and inductance, and improving heat dissipation efficiency and high-frequency performance.

[0037] Step S12, using reflow soldering to connect the pads of the flip-chip LED chip to the conductive areas on the tape-and-reel LED bracket using solder paste;

[0038] Among them, the tape-type LED bracket with completed die bonding is sent to the reflow oven and heated according to the preset temperature curve (preheating → heating → peak → cooling). The solder paste melts at high temperature and wets the pads of the flip-chip LED chip and the conductive area of the tape-type LED bracket to form an intermetallic compound. After cooling, it solidifies to achieve a firm electrical and mechanical connection.

[0039] To maximize efficiency and optimization, the traditional five steps of adhesive application, die bonding, baking, cleaning, and wire welding to form electrical interconnection can be reduced to three steps through tinning, die bonding, and reflow.

[0040] Furthermore, since the tape-type LED bracket is prone to short-circuiting, twisting or breaking of the welding line due to its tape-type structure during the traditional wire welding process, affecting the performance of the flip-chip LED packaging device, soldering through tinning, solid crystal and reflow can effectively solve the problems of short-circuiting, twisting or breaking of the welding line caused by the tape-type structure, and simplifies the process steps, greatly improving the process efficiency.

[0041] Step S13, filling the groove of the tape-and-roll LED bracket with the encapsulation glue by brushing, and baking and curing;

[0042] Specifically, a hole is opened on the mesh cover to reserve a groove position, and the mesh cover is placed on the roll-up LED bracket, with the hole corresponding to the groove;

[0043] The encapsulation glue is pushed by a rolling cutter to fill the groove of the tape-type LED bracket.

[0044] It should be noted that the traditional sheet-structured LED bracket is an independent structure for small batches, and it is impossible to achieve a continuous structure. The glue dispensing efficiency is low if it is dispensed separately. It is precisely because of the tape structure and continuous tape structure of the tape-type LED bracket that the glue brushing method can be used to achieve continuous and uniform glue dispensing, improve uniformity, and further improve process efficiency.

[0045] Step S14: cutting and splitting the tape-and-roll LED bracket to obtain a flip-chip LED package device.

[0046] Before the steps of cutting and splitting the tape-and-reel LED bracket to obtain flip-chip LED devices, the following steps are also included:

[0047] Cut and bend the tape-type LED bracket.

[0048] Traditionally, the bending process is performed before die bonding. However, due to the tape structure of a reel-type LED holder, this can easily lead to an unstable connection between the flip-chip LED chip and the holder, posing a risk of cracking or even breakage. Therefore, corner bending is not performed before packaging is complete to improve the stability of the reel-type LED holder.

[0049] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that a specific feature, structure, material, or characteristic described in conjunction with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0050] The above-described embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that a person skilled in the art would be able to make numerous modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. A method for preparing a flip-chip LED package device, characterized in that: The preparation method comprises: The rolled metal sheet is stamped, electroplated and injection molded to form a rolled LED bracket; Bond the flip-chip LED chip to the tape-and-reel LED bracket using solder paste to complete the die bonding. The solder paste connects the pads of the flip-chip LED chip to the conductive area on the tape-and-reel LED bracket by reflow soldering; Fill the groove of the tape-and-reel LED bracket with encapsulation glue by brushing, and bake and cure; The tape-type LED bracket is cut and split to obtain a flip-chip LED package device.

2. The method for preparing a flip-chip LED package device according to claim 1, wherein: The step of filling the groove of the tape-and-roll LED bracket with the encapsulation glue by brushing the glue specifically includes: Open holes in the mesh to reserve grooves, and place the mesh on the roll-up LED bracket with the holes corresponding to the grooves. The encapsulation glue is pushed by a rolling cutter to fill the groove of the tape-type LED bracket.

3. The method for preparing a flip-chip LED package device according to claim 1, wherein: The packaging glue includes fluorescent glue and silica gel.

4. The method for preparing a flip-chip LED package device according to claim 1, wherein: Before the steps of cutting and splitting the tape-and-reel LED bracket to obtain flip-chip LED devices, the following steps are also included: Cut and bend the tape-type LED bracket.

5. The method for preparing a flip-chip LED package device according to claim 1, wherein: The electroplated materials include silver and nickel, the thickness of the silver is 0.3 μm to 2 μm, and the thickness of the nickel is 0.3 μm to 0.5 μm.

6. The method for preparing a flip-chip LED package device according to claim 1, wherein: The material of the rolled metal plate includes one of an iron metal substrate, a copper metal substrate, an aluminum metal substrate, and a multi-layer copper-aluminum structure metal substrate.

7. A flip-chip LED package device, characterized in that: The flip-chip LED package device is prepared by the method for preparing a flip-chip LED package device according to any one of claims 1 to 6.

8. Application of the inverted LED package device according to claim 7 in the fields of display, backlight and lighting.

Images