Contact probe and contacting member thereof, method of manufacturing contacting member, probe system using the contacting member, method of testing unpackaged semiconductor device, tested semiconductor device and method of producing the same

Abstract

To provide a contacting member of a contact probe for a probe system for performing a functionality test to a measurement object.SOLUTION: A contacting member includes a body, a contact tip, and a tip transition section between the body and the contact tip. A bottom side of the contacting member, which faces toward the measurement object when performing a functionality test to the measurement object, includes a lower surface at the body, a tip bottom surface at the contact tip, and a tip transition surface at the tip transition section. A contact end of the contact tip for contacting the measurement object is located on a front side of the tip bottom surface. A rear side of the tip bottom surface and the lower surface have a height difference therebetween. The tip transition surface gradually changes in height from the lower surface to the rear side of the tip bottom surface. The contacting member has high precision and structural strength.SELECTED DRAWING: Figure 10

Description

[Technical field]

[0001] The present invention relates to a contact probe used for inspecting and measuring electronic components, and in particular to a contact probe having a three-dimensional needle tip (3D tip) and its contactor, a manufacturing method for the contactor, a probe system using the contactor, a testing method for an unpackaged semiconductor device, and a tested semiconductor device and a manufacturing method thereof. [Background technology]

[0002] The contacts of the current contact probes with three-dimensional needle tips are made by microelectromechanical technology to construct a three-dimensional needle tip structure. Alternatively, the three-dimensional needle tip structure is formed by bending a flat contact. Contacts made by these methods have problems in terms of accuracy and structural strength.

[0003] Specifically, contacts made by microelectromechanical technology are formed by stacking materials layer by layer. In particular, for the contact tips of contacts directly formed in this way, this stacking process makes it difficult to achieve precise alignment between each layer. This leads to problems with the accuracy of the needle tip (i.e., the contact tip). More specifically, each layer must be precisely aligned with the previous layer to ensure that the final structure is precisely formed. Any inaccurate alignment leads to reduced accuracy. However, the stacking process of the microelectromechanical manufacturing process makes it difficult to achieve precise alignment between each layer. This leads to reduced accuracy of the final product.

[0004] In addition, the manufacturing method of forming a three-dimensional needle tip structure by bending a planar contactor results in significant creases and curves in the bent parts (bonding wires and tiny slits), which causes stress concentration in the material and reduces the structural integrity of the contactor, reducing the structural strength of the contactor and shortening its lifespan. Summary of the Invention [Problem to be solved by the invention]

[0005] The present invention has been made to solve the above-mentioned problems, and aims to provide a contact for a contact probe and a manufacturing method thereof, which does not require microelectromechanical technology or bending of the contact, and has good precision, high structural strength, and a relatively long life. [Means for solving the problem]

[0006] In order to achieve the above object, a contact of a contact probe according to the present invention is used in a probe system for performing a functionality test on an object to be measured. The contactor includes a body portion, a contact tip portion, and a tip transition section located between the body portion and the contact tip portion, the contact tip portion having a contact end used to contact the object under test. The contactor has a top side and a bottom side, and the bottom side of the contactor faces the object under test when the contactor performs a functionality test on the object under test. The bottom side of the contactor includes a lower surface located in the body portion, a tip bottom surface located in the contact tip portion, and a tip transition surface located in the tip transition section. The contact end is located on the front side of the tip bottom surface and has a step between the rear side of the tip bottom surface and the lower surface, and the tip transition surface has a gradual change in height and extends from the lower surface to the rear side of the tip bottom surface.

[0007] As a result, the bottom side (i.e., the side facing the object to be measured) of the contact of the present invention has a step between the contact tip and the body. That is, it has a so-called three-dimensional needle tip structure, which is advantageous for the contact end of the contact tip to contact the contact pad of the object to be measured, and the accuracy and reliability of the test can be improved. In addition, there is a tip transition section between the contact tip and the body, and the tip transition surface extends from the lower surface to the tip bottom surface with a gradual change in height. That is, the tip transition surface does not have a vertical surface or other abrupt change, but smoothly connects the lower surface having the step and the tip bottom surface. Such a contact cannot be formed by stacking layers by microelectromechanical technology or by bending, but is formed by other processing methods. Therefore, the problems of poor accuracy, stress concentration, poor structural strength, and short life caused by microelectromechanical technology or bending can be avoided. In addition, the smooth tip transition surface as described above reduces stress concentration, improves structural integrity, and further improves the durability and reliability of the contact.

[0008] Preferably, the contact is formed by cutting a substrate having the step. That is, the step of the contact is an inherent step of the substrate, not a step of the contact formed by stacking layers by microelectromechanical technology. Such a contact is integrally molded and does not need to be bent, and the shape of the contact can be defined by the cutting process. Thus, stress concentration is reduced, structural integrity is improved, and the contact has high structural strength and long life. The cutting process can be, for example, laser cutting, electric discharge cutting, etc., and can accurately cut the desired shape of the contact. In particular, the positional accuracy of the contact end of the contact tip is good. That is, it can be accurately aligned with the contact pad of the object to be measured, which is advantageous for carrying out the test.

[0009] Preferably, the tip transition surface comprises a gradual transition curve and / or an inclined flat surface.

[0010] Thus, the gradual change transition surface has a gradual change in radius of curvature according to the extending length, and can realize a smooth step without abrupt change in curvature. The inclined surface can also achieve a smooth step effect to a certain extent. Both can reduce stress concentration, improve structural integrity, and further improve the structural strength of the contact. According to different manufacturing processes, the tip transition surface can be a gradual change transition surface, an inclined plane, or can include a gradual change transition surface and an inclined plane at the same time.

[0011] Preferably, the surface roughness of the lower surface and the tip transition surface differs from the surface roughness of the tip bottom surface.

[0012] Thus, the step can be formed by performing a surface settling process on one plane. For example, when the contact is formed by cutting a substrate having the step, the substrate is formed by a surface settling process of a flat plate. Thus, a relatively low surface and a transition surface whose height changes stepwise are formed. The surface settling process can be chemical etching, laser etching, etc., and the surface roughness of the relatively low surface and the transition surface is different from that of the original flat plate. After the substrate is processed into a contact by a cutting process, the relatively low surface and the transition surface become the lower surface and the tip transition surface of the contact, respectively. This makes it easy to manufacture a substrate with a desired step and transition surface, and improves the accuracy and structural strength of the contact.

[0013] Preferably, the body includes a thin section, a thick section, and a body transition section located between the thin section and the thick section. The lower surface is located in the thin section. The bottom side of the contact further includes a body bottom surface located in the thick section of the body, and a body transition surface located in the body transition section. The step is between the body bottom surface and the lower surface. The body transition surface has a gradual change in height and extends from the lower surface to the body bottom surface.

[0014] As a result, the main body of the contact also has a step, and the thin section is located near the contact tip. Therefore, it is still possible to form a so-called three-dimensional needle tip structure. It is advantageous for the contact end of the contact tip to contact the contact pad of the device under test. Thus, the accuracy and reliability of the test can be improved. The section of the body of the contactor away from the contact tip is formed relatively thick, which can increase the structural strength of the body of the contactor, and is advantageous for fixing the body of the contactor to another member to form a contact probe. In addition, the step of the body of the contactor is caused by the step inherent in the substrate. This method of manufacturing a contactor does not require microelectromechanical technology or bending of the contactor, and ensures that the contactor has good precision, high structural strength, and a relatively long life. The body has a body transition section between the thin section and the thick section, and the body transition surface has a gradual change in height and smoothly connects the lower surface having the step to the bottom surface of the body, reducing stress concentration, improving structural integrity, and further improving the durability and reliability of the contactor.

[0015] Preferably, the body transition surface comprises a gradual transition curve and / or an inclined flat surface.

[0016] According to different manufacturing processes, the body transition surface may be a gradual transition curved surface, a sloping plane, or may include a gradual transition curved surface and a sloping plane at the same time.

[0017] Preferably, the surface roughness of the lower surface, the tip transition surface and the body transition surface differs from the surface roughness of the body bottom surface.

[0018] Thus, the step between the contact tip and the body, and the step of the body itself can be formed by performing a surface sinking process on one plane. For example, when the contact is formed by a cutting process of a substrate having the step, the substrate is also formed by a surface sinking process of a flat plate. Thus, a relatively low surface and two transition surfaces located on both sides of the relatively low surface and having a gradually changing height are formed, and the surface roughness of the relatively low surface and the transition surface is different from the surface roughness of the original flat plate. After the substrate is processed into the contact through a cutting process, the relatively low surface and the transition surface become the lower surface, the tip transition surface, and the body transition surface of the contact, respectively. This makes it easy to manufacture a substrate with a desired step and transition surface, and improves the precision and structural strength of the produced contact.

[0019] Preferably, the contact tip further comprises an extension section located between the body portion and the tip transition section, the body portion having a width greater than the widths of the extension section, the tip transition section and the contact tip, the lower surface being partially located in the extension section.

[0020] Thus, the tip transition section is not limited to being directly connected to the body section. There may be an extension section between the two. A portion of the lower surface is located in the extension section. That is, at the bottom side of the contact, the extension section and the body section share the same plane. However, the extension section is narrower than the body section. Such an extension section provides greater elasticity when the contact tip contacts the contact pad of the device under test, which is advantageous for the progress of the test.

[0021] Preferably, the lower surface is planar.

[0022] Thereby, as described above, the step can be formed by performing a surface sinking process on a plane. The surface sinking process can form the relatively low surface. The relatively low surface is used to form the lower surface of the contact. By making the relatively low surface flat, the lower surface of the contact can be flat. Not only is it easy to manufacture, but it also has good structural integrity and structural strength.

[0023] Preferably, the top side of the contact has an upper surface located at the body portion and a tip top surface located at the contact tip portion, the tip top surface extending from the upper surface to the contact end so as to be inclined relative to the upper surface.

[0024] As a result, the top side of the contact is originally flat, and then the tip top surface is formed by, for example, polishing. For example, when the contact is formed by a cutting process of a substrate having the step, the top side of the contact is formed by the flat surface of the substrate. After the shape of the contact is defined by the cutting process, the tip top surface can be formed on the top side of the contact by, for example, polishing. As a result, the shape of the contact tip can be adjusted so that the contact end is located at a desired position, and it can be accurately aligned with the contact pad of the device under test, which is advantageous for performing the test.

[0025] Further, a contact probe according to the present invention is used in a probe system for performing a functionality test on an object to be measured, and includes a coaxial cable and a plurality of the above-mentioned contacts. The coaxial cable includes an inner electrical conductor, an outer electrical conductor, and a dielectric disposed between the inner electrical conductor and the outer electrical conductor. In the plurality of contacts, the top side of each of the contacts has an upper surface located at the main body. A part of the upper surface of each of the contacts is fixed to the coaxial cable, so that the main body of each of the contacts extends from a position where it is fixed to the coaxial cable and passes the end of the coaxial cable, and each of the contacts includes a cantilever segment extending from the end of the coaxial cable. The contact tip of each of the contacts is located at the end of the cantilever segment. The bottom surfaces of the tips of the plurality of contacts are flush with each other. The plurality of contacts includes one first contact and at least one second contact. The upper surface of the first contact is electrically connected to and fixed to the inner electrical conductor of the coaxial cable. The upper surface of the second contact is electrically connected to and secured to the outer electrical conductor of the coaxial cable.

[0026] In this way, the coaxial cable transmits the test signal and ground signal through the inner and outer conductors, so that the first and second contacts electrically connected to the inner and outer conductors reach good impedance matching. Such contact probes can be used for high frequency testing. In addition, the contacts have good precision and high structural strength, which results in a long life and improved test accuracy and reliability.

[0027] Further, a contact probe according to the present invention is used in a probe system for performing a functionality test on an object to be measured, and includes a circuit board and a plurality of the above-mentioned contactors. The circuit board includes a plurality of electrically conductive circuits. In the plurality of contactors, the top side of each of the contactors has an upper surface located on the main body portion. A portion of the upper surface of each of the contactors is electrically connected and fixed to the electrically conductive circuit of the circuit board, so that the main body portion of each of the contactors extends from a position where it is fixed to the circuit board and passes an end of the circuit board, and each of the contactors includes a cantilever segment extending from the end of the circuit board. The contact tip of each of the contactors is located at the end of the cantilever segment. The bottom surfaces of the tips of the plurality of contactors are flush with each other.

[0028] This allows the circuit board to transmit the test signal and the ground signal through different electrical conductive circuits, so that the first contact and the second contact electrically connected to the electrical conductive circuits reach a good impedance matching. Such contact probes can be used for high frequency testing. In addition, the contacts have good precision and high structural strength, so they have a long life and improve the accuracy and reliability of the test.

[0029] Furthermore, a method for manufacturing a contactor according to the present invention includes the following steps 1 and 2. The contactor is used in a contact probe for carrying out a functionality test on an object to be measured.

[0030] Step 1: Provide a substrate. The substrate is made of an electrically conductive material and includes a thin block, at least one thick block, and at least one transition block that extends from the thin block to the thick block with a gradually increasing thickness. The upward facing side of the substrate includes a first surface located on the thin block, at least one second surface located on the thick block, and at least one transition surface located on the transition block. The second surface is higher than the first surface. The transition surfaces extend from the first surface to the second surface with a gradually changing height.

[0031] Step 2: A plurality of the contacts are defined by removing material from the substrate. The step of defining the plurality of contacts includes the steps of defining a contact tip portion of each of the contacts in the thick block of the substrate, defining a body portion of each of the contacts in the thin block of the substrate, and cutting into the substrate based on the external contours of the plurality of contacts.

[0032] Thus, the above-mentioned manufacturing method is used to manufacture the above-mentioned contactor provided by the present invention, so that the contactor has good precision and high structural strength, thus having a long service life and improving the accuracy and reliability of testing.

[0033] Preferably, the method of manufacturing a contactor further includes a step of shaping the contact tip of each of the contactors to form from each of the contact tips a tip top surface, a tip bottom surface, and a contact end located where the tip top surface and the tip bottom surface intersect and used to contact the object to be measured.

[0034] Thus, after the shape of the contact is defined, the contact member is formed with a top tip surface and a bottom tip surface by, for example, polishing, so that the shape of the contact tip is adjusted, the contact end is positioned at a desired position, the accuracy of the contact end is improved, and it can be accurately aligned with the contact pad of the device under test, facilitating testing.

[0035] Preferably, the substrate includes two transition blocks located on opposing sides of the thin block and two thick blocks connected to the two transition blocks, respectively. The upward side of the substrate includes two of the second surfaces located on the two thick blocks, respectively, and two of the transition surfaces located on the two transition blocks, respectively. The step of defining the contacts includes the steps of defining the contact tip of each of the contacts in one of the two thick blocks and defining a body of each of the contacts in the thin block and the other of the two thick blocks.

[0036] That is, the upward side of the substrate has two relatively high second surfaces and one relatively low first surface located between the two second surfaces. Between the two second surfaces and one first surface, there is a transition surface whose height gradually decreases. The contact tip of each contactor defined by the thick block can form a so-called three-dimensional needle tip structure, which is advantageous for the contact end of the contact tip to contact the contact pad of the device under test, and improves the accuracy and reliability of the test. By defining the body of each contactor by the thin block and the other of the two thick blocks, the section of the body of the contactor away from the contact tip is formed relatively thick, which can increase the structural strength of the body of the contactor, and is advantageous for fixing the body of the contactor to another member to form a contact probe.

[0037] Preferably, the substrate is formed as a flat plate through a surface dipping process, the first surface and the transition surface are formed by the surface dipping process, and the surface roughness of the first surface and the transition surface is different from the surface roughness of the second surface, the surface dipping process being performed prior to the step of defining the plurality of contacts by removing a portion of material of the substrate.

[0038] Thus, the surface depression process can be chemical etching, laser etching, etc., and the surface roughness of the first surface and the transition surface generated can be different from the surface roughness of the original second surface of the plate. Such a method can easily manufacture a substrate having a desired step and transition surface, and can improve the precision and structural strength of the contacts produced.

[0039] Furthermore, a probe system according to the present invention is used to perform a functionality test on an object to be measured formed on a substrate. The object to be measured includes a plurality of contact pads. The probe system includes a mounting table and a contact probe. The mounting table is arranged to support the substrate. The contact probe includes a plurality of the contactors according to claim 1, and the contact ends of the contactors contact the contact pads of the object to electrically connect the contact probe and the object to be measured, and the probe system is used to perform a functionality test on the object to be measured.

[0040] Therefore, the above-mentioned probe system adopts the above-mentioned contactor provided by the present invention, which has good precision, high structural strength and long service life, and can improve the test accuracy and reliability of the probe system.

[0041] Furthermore, a test method according to the present invention is a test method for an unpackaged semiconductor device, and includes the following steps 1, 2, and 3. Step 1: Providing at least one contact probe, the contact probe including a plurality of the contacts described above. Step 2: The contacts are mechanically and electrically contacted to a plurality of contact pads of an unpackaged semiconductor device. Step 3: Performing a test on the unpackaged semiconductor device with at least one of the contact probes.

[0042] As a result, the contact probe used in the above-described testing method includes the contactor according to the present invention described above, and has good accuracy, high structural strength, and a long service life, thereby improving the accuracy and reliability of testing of unpackaged semiconductor devices.

[0043] Further, the manufacturing method of the tested semiconductor device according to the present invention includes the following steps 1, 2, and 3. Step 1: Providing at least one contact probe, the contact probe including a plurality of the contacts described above. Step 2: Mechanically and electrically contacting a plurality of said contacts to a plurality of contact pads of an unpackaged semiconductor device. Step 3: Performing a test on the unpackaged semiconductor device with at least one of the contact probes.

[0044] Thus, the semiconductor device manufactured by the above-mentioned manufacturing method has been tested. The test utilizes the contact of the present invention, which has good accuracy, high structural strength, and long service life, and can improve the accuracy and reliability of the test results of the semiconductor device.

[0045] Further, the present invention provides a tested semiconductor device comprising a plurality of contact pads, the testing process being performed by mechanical and electrical contact with at least one contact probe, the contact probe including a plurality of the aforementioned contacts, the testing process being performed by contacting the contact ends of the plurality of the contacts with the plurality of the contact pads.

[0046] Thus, the aforementioned semiconductor device has been tested. The test utilizes the contact of the present invention, which has good accuracy, high structural strength, and long service life, and can improve the accuracy and reliability of the test results of the semiconductor device.

[0047] Detailed structures, features, assembly, or usage of the contact probe and its contacts, the manufacturing method of the contacts, the probe system using the contacts, the testing method of the unpackaged semiconductor device, and the tested semiconductor device and the manufacturing method thereof according to the present invention will be described in the following detailed description of the preferred embodiment of the present invention. However, those having ordinary skill in the art of the present invention should understand that such detailed description and the specific embodiments enumerated for carrying out the present invention are merely for the purpose of explaining the present invention, and are not intended to limit the scope of the claims of the present invention. [Brief description of the drawings]

[0048] [Figure 1] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Diagram 2] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Diagram 3] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Figure 4] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Diagram 5] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Figure 6] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Figure 7] 3A to 3C are schematic diagrams illustrating a method for manufacturing a contact according to the first embodiment of the present invention. [Figure 8] 1 is a schematic diagram showing a side view of a probe system according to a first embodiment of the present invention. [Figure 9] 3 is a schematic diagram showing a bottom surface of a coaxial cable of a contact probe of the probe system according to the first embodiment of the present invention. FIG. [Figure 10] 1 is a schematic diagram showing a contact and a part of an object to be measured according to a first embodiment of the present invention; [Figure 11] FIG. 4 is a schematic diagram showing a side view of a probe system according to a second embodiment of the present invention. [Figure 12] 11 is a schematic diagram showing a bottom surface of a circuit board of a contact probe of a probe system according to a second embodiment of the present invention. FIG. [Figure 13] 5A to 5C are schematic diagrams illustrating a method for manufacturing a contact according to a third embodiment of the present invention. [Figure 14] 5A to 5C are schematic diagrams illustrating a method for manufacturing a contact according to a third embodiment of the present invention. [Figure 15] 5A to 5C are schematic diagrams illustrating a method for manufacturing a contact according to a third embodiment of the present invention. [Figure 16] 11 is a schematic diagram showing a contact and a part of an object to be measured according to a third embodiment of the present invention. FIG. [Figure 17] FIG. 13 is a schematic perspective view showing a part of a contact according to a fourth embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0049] The applicant hereby explains that in the embodiments and drawings introduced below, the same reference numerals represent the same or similar components or structural features thereof. It should be noted that the components and structures in the drawings are not illustrated based on actual proportions and quantities for convenience of illustration, and that the features of different embodiments may be applied to each other if possible. In addition, when referring to a component being installed on another component, it means that the aforementioned component is directly installed on the other component, or that the aforementioned component is indirectly installed on the other component, that is, one or more other components are further installed between the two components. When a component is "directly" installed on another component, it means that no other components are installed between the two components.

[0050] First embodiment 1 to 8, a contact manufacturing method according to a first embodiment of the present invention is used to manufacture contacts 40A, 40B of a contact probe 30 (see FIG. 5). The manufacturing method includes the following steps a) to c).

[0051] Step A): As shown in Figures 1 to 3, a substrate 50 is provided. The substrate 50 is made of an electrically conductive material. The substrate 50 includes a thin block 51, a thick block 52, and a transition block 53 that extends from the thin block 51 to the thick block 52 with a gradually increasing thickness. An upward side 54 of the substrate 51 includes a first surface 541 located on the thin block 51, a second surface 542 located on the thick block 52, and a transition surface 543 located on the transition block 53. The second surface 542 is higher than the first surface 541. The transition surface 543 extends from the first surface 541 to the second surface 542 with a gradually changing height.

[0052] Further, the substrate 50 provided in this step is shown in Fig. 2 and 3. The substrate 50 is formed by a surface settling process of a flat plate 61 as shown in Fig. 1. The surface settling process includes chemical etching, laser etching, etc., and is used to reduce the thickness of the flat plate 61 locally, and a local surface of a flat surface 611 facing the upper side of the flat plate 61 is settling, so as to form a first surface 541 and a transition surface 543 of the substrate 50. The non-settled portion of the flat surface 611 of the flat plate 61 forms a second surface 542 of the substrate 50. Thus, the surface roughness of the first surface 541 and the transition surface 543 formed through the surface settling process is different from the surface roughness of the second surface 542 obtained from the flat surface 611 of the original flat plate 61. This surface settling process can quickly and easily manufacture a desired substrate 50. The first surface 541 and the second surface 542 have a predetermined step, and the transition surface 543 smoothly connects the first surface 541 and the second surface 542. for example, The thin block 51 has a thickness of 60 microns, the thick block 52 has a thickness of 80 microns, and the step d is 20 microns. Surface roughness is the step (roughness) of the surface contour. Specifically, the absolute deviation of the actual surface contour is the average value (Ra) with respect to the mean line. Therefore, when viewed under a microscope, differences in the object surface are clearly visible, such as differences in gloss, brightness, etc. In addition, differences in surface roughness include differences in the object surface (such as differences in gloss, brightness, etc.) that are noticeable under a microscope even after a surface coating process (e.g., after a plating process) has been performed.

[0053] Step B): 4 and 5, a plurality of contacts 40A, 40B are defined by removing a portion of material of the substrate 50. The step of defining the contacts 40A, 40B includes the steps of defining a contact tip portion 41 of each of the contacts 40A, 40B in a thick block 52 of the substrate 50, defining a body portion 42 of each of the contacts 40A, 40B in a thin block 51 of the substrate 50, and cutting the substrate 50 based on one of the outer contours C of the contacts 40A, 40B.

[0054] As shown in Figs. 4 and 5, the manufacturing method according to the present embodiment simultaneously manufactures three contacts 40A, 40B. In this step, cutting is performed based on the external contour C formed by the three contacts 40A, 40B together, and each of the contacts 40A, 40B is cut based on the desired shape. In the cutting step, the position of the contact tip 41 relative to the body 42 can be adjusted as necessary, and the contact tip 41 does not necessarily need to be positioned at the center of one end face of the body 42. As shown in Fig. 5, the three contacts 40A, 40B include one relatively short contact 40A (also referred to as the first contact in the present invention) and two relatively long contacts 40B (also referred to as the second contact in the present invention), and the contact 40A is located between the contacts 40B. In this step, the contact tips 41 of the three contacts 40A, 40B are connected by one connecting portion 62, and the body 42 of the contact 40B is connected by one connecting portion 63. When the manufacture of the contacts 40A, 40B is completed, the connection portion 62 is removed or divided by a step of shaping the contact tips described below, and the contact tips 41 of the contacts 40A, 40B are separated from each other. The three contacts 40A, 40B shown in FIG. 5 constitute one probe having three probe tips. Depending on the needs of the test, the probe may include any suitable number of probe tips. For example, one probe tip, two probe tips, three probe tips, or more than three probe tips. In the case where two probe tips are included, a signal probe tip and a ground probe tip are generally included, and are also referred to as a GS (ground-signal) probe tip arrangement. In the case where three probe tips are included (as shown in FIG. 5), a signal probe tip (i.e., the contact 40A) is located in the center, and a pair of ground probe tips (i.e., the two contacts 40B) are located on either side of the signal probe tip are generally included, and are also referred to as a GSG (ground-signal-ground) probe tip arrangement. 4 illustrates, by way of example only, a single GSG probe having an outer contour C collectively defined by three contacts 40A, 40B on substrate 50. For example, multiple probes having the same and / or different outer contours C may be defined on substrate 50.

[0055] When this step b) is completed, the contacts 40A, 40B have a profile shape as shown in Figure 6. Each contact 40A, 40B includes a contact tip 41 formed by a thick block 52 of the substrate 50, a body portion 42 formed by a thin block 51 of the substrate 50, and a tip transition section 43 formed by a transition block 53 of the substrate 50 and located between the body portion 42 and the contact tip 41.

[0056] Step c): 6 and 7, the step of sharpening the contact tip 41 of the contactors 40A and 40B may include, for example, lapping with an abrasive cloth, forming each contact tip 41 with a tip top surface 411, a tip bottom surface 412, and a contact end 413 located at the intersection of the tip top surface 411 and the tip bottom surface 412. The contact end 413 is used to contact one contact pad 231 (see FIG. 10) of one device under test 23.

[0057] Here, the arrangement direction of the contacts 40A, 40B shown in Fig. 7 in the manufacturing process and the arrangement direction during actual use are as shown in Fig. 10. To explain more clearly, the contacts 40A, 40B have one top side 44 and one bottom side 45. Fig. 7 shows the bottom side 45 facing up. When the contacts 40A, 40B perform a functionality test on the object under test 23, the bottom side 45 of the contacts 40A, 40B faces the object under test 23, as shown in Fig. 10.

[0058] As shown in Figures 7 and 10, the bottom side 45 of the contact 40A, 40B includes a lower surface 421 located on the body portion 42, a tip bottom surface 412 located on the contact tip 41, and a tip transition surface 431 located on the tip transition section 43. The contact end 413 is located on a front side 412a of the tip bottom surface 412. There is a step d between a rear side 412b of the tip bottom surface 412 and the lower surface 421. The tip transition surface has a gradual change in height and extends from the lower surface 421 to the rear side 412b of the tip bottom surface 412. The top side 44 of the contact 40A, 40B includes an upper surface 422 located on the body portion 42, and a tip top surface 411 located on the contact tip 41. The tip top surface 411 extends from the upper surface 422 to the contact end 413 so as to be inclined relative to the upper surface 422. The lower surface 421 of the body 42 and the tip transition surface 431 of the tip transition section 43 are respectively formed by the first surface 541 and the transition surface 543 of the substrate 50 shown in FIG. 3, so that the surface roughness of the lower surface 421 and the tip transition surface 431 is different from the surface roughness of the tip bottom surface 412, the tip top surface 411, or the upper surface 422. Furthermore, in the step of shaping the contact tips, polishing is performed on the contact tips 41 of the contactors 40A and 40B along the imaginary lines 415 and 416 shown in FIG. 6. First, polishing is performed along the imaginary line 415 to align the contact tips 413 of the contactors 40A and 40B. Then, polishing is performed along the imaginary line 416 so that the tip bottom surfaces 412 of the contactors 40A and 40B have the same flatness.

[0059] After the shape of the contacts 40A, 40B is defined in step b), step c) is performed to further shape the contact tip 41. This allows the contact end 413 to easily contact the contact pad 231 of the object to be measured 23, and the position of the contact end 413 can be further adjusted so that the contact end 413 is accurately positioned at a desired position, and the accuracy of the contact end 413 can be further improved and accurately matched with the contact pad 231 of the object to be measured 23, which is advantageous for testing. The tip bottom surface 412 formed in step c) does not need to be connected to the tip transition surface 431, and part of the flat surface 414 of the contact tip 41 shown in FIG. 6 is retained, so that the tip bottom surface includes the surface formed in step c) and part of the flat surface 414. Alternatively, the manufacturing method of the contact of the present invention may not include step c). The contacts 40A, 40B that have not undergone the shape-shaping step c) are as shown in FIG. 6. Such contacts 40A, 40B can still contact the contact pad 231 of the object to be measured 23 with the contact end at a right angle as shown in the upper right of FIG. 6. In this case, the plane 414 is the tip bottom surface. As shown in FIG. 10, when the front side 412a of the tip bottom surface 412 contacts the contact pad 231 of the object to be measured 23, the tip top surface 411 at the far end of each contact tip 41 is inclined backward from the vertical direction at a predetermined angle 450. Thus, as shown in FIG. 10, the tip top surface 411 extends at an inner obtuse angle 460 that is greater than 90 degrees with respect to the upper surface 422 of the main body 42. Therefore, when an operator observes the contact tip 41 from above down through a microscope, video camera, etc., the operator can observe the relative positional relationship between the contact end 413 and the contact pad 231, and can determine the relative position of each contact tip 41 with respect to the contact pad 231, which is advantageous for alignment.

[0060] As shown in Fig. 8, the probe system 11 according to this embodiment includes one mounting table 21 and one contact probe 30. The contact probe 30 includes one base portion 31, one coaxial joint 32 fixed to the base portion 31, a coaxial cable 33 electrically connected to the base portion 31 and the coaxial joint 32, and the above-mentioned three contacts 40A, 40B. The three contacts 40A, 40B are arranged in parallel, and only one of them, contact 40B, is shown in Fig. 8, and the other two contacts 40A, 40B are shielded by contact 40B and cannot be seen in Fig. 8.

[0061] Furthermore, the coaxial cable 33 is cut to have an obliquely cut surface 331, so that the internal structure of the coaxial cable 33 is exposed on the obliquely cut surface 331 in a relatively wide area. As shown in FIG. 9, the coaxial cable 33 includes one inner electrical conductor 332, one outer electrical conductor 333, and a dielectric 334 provided between the inner electrical conductor 332 and the outer electrical conductor 333. The upper surfaces 422 of the contacts 40A and 40B are each partially fixed to the obliquely cut surface 331 of the coaxial cable 33. For example, the obliquely cut surface 331 of the coaxial cable 33 has an angle of 45 degrees with respect to the horizontal plane, so that the attachment angle of the contacts 40A and 40B when fixed to the coaxial cable 33 is 45 degrees. That is, the upper surfaces 422 of the contacts 40A and 40B have an angle of 45 degrees with respect to the horizontal plane. More specifically, the upper surface 422 of the contact 40A (first contact) is electrically connected to and fixed to the inner electrical conductor 332. The upper surfaces 422 of the two contacts 40B (second contact) are electrically connected to and fixed to the outer electrical conductor 333, and are located on the two opposite blocks 333a and 333b of the inner electrical conductor 332, respectively. The main body portions 42 of the three contacts 40A, 40B all extend from the position fixed to the obliquely cut surface 331 to the left in FIG. 9 and pass the end 335 of the coaxial cable 33, so that each contact 40A, 40B includes a cantilever segment 46 extending from the end 335 of the coaxial cable 33 (see FIG. 8). The cantilever segment 46 includes a part of the main body portion 42, as well as the entire tip transition section 43 and the contact tip 41. The contact tip 41 is located at one end 461 of the cantilever segment 46. The bottom surfaces 412 of the tips of the three contacts 40A, 40B are flush with one another. The manufacturing method described above manufactures the three contacts 40A, 40B simultaneously, so that the contacts 40A, 40B can be easily flush with one another.

[0062] As shown in FIG. 8, the probe system 11 is used to perform a functionality test on a test object 23 (see FIG. 10) formed on a substrate 22. The substrate 22 is supported by a mounting table 21 of the probe system 11. For example, the substrate 22 is a wafer, and the test object 23 is an unpackaged semiconductor device on the wafer. Since the test object 23 is actually very small, the test object 23 is not shown in FIG. 8, and the test object 23 is illustrated diagrammatically in FIG. 10. The test object 23 has a plurality of contact pads 231, and only one of the contact pads 231 is illustrated diagrammatically in FIG. 10. The contact probe 30 is electrically connected to the test object 23 by contacting the bottom surfaces 412 of the tips of the contactors 40A and 40B with the contact pads 231 of the test object 23. At this time, the bottom surfaces 412 of the tips of the contactors 40A and 40B are inclined slightly upward (for example, at an angle of less than 7 degrees) with respect to the surface of the contact pad 231 of the object to be measured 23 (see FIG. 10). When the coaxial joint 32 of the contact probe 30 is electrically connected to a test device (not shown) via another coaxial cable (not shown), the contactors 40A and 40B come into contact with the contact pad 231 of the object to be measured 23, thereby enabling a functionality test of the object to be measured 23 to be performed. In the coaxial cable 33, the inner electrical conductor 332 is used to transmit a test signal, and the outer electrical conductor 333 is used to transmit a ground signal, so that the contactor 40A transmits the test signal and the contactor 40B transmits the ground signal. By arranging the contactor 40B transmitting the ground signal on both sides of the contactor 40A transmitting the test signal in parallel and at a distance, a transmission line having a desired impedance matching effect can be formed, and a good impedance matching effect can be obtained, and the contact probe 30 can be used for high-frequency testing.

[0063] As a result, the bottom side 45 (i.e., the side facing the object to be measured 23) of the contacts 40A, 40B of the present invention has a step d between the contact tip 41 and the body 42. That is, it has a so-called three-dimensional needle tip structure, which is advantageous for the contact end 413 of the contact tip 41 to contact the contact pad 231 of the object to be measured 23, and can improve the accuracy and reliability of the test. In addition, there is a tip transition section 43 between the contact tip 41 and the body 42, and its tip transition surface 431 gradually changes in height and extends from the lower surface 421 of the body 42 to the tip bottom surface 412. That is, the tip transition surface 431 smoothly connects the lower surface 421 with the step d and the tip bottom surface 412, rather than having a vertical surface or other abrupt transition. This reduces stress concentration and improves structural integrity, making the contacts 40A, 40B have good structural strength, good durability, and good reliability.

[0064] Moreover, the contacts 40A, 40B are formed through a cutting process from a substrate 50 having a step d. That is, in the contacts 40A, 40B, the step d between the contact tip 41 and the body 42 is the original step of the substrate 50, and is not the step of the contacts formed by stacking layers by microelectromechanical technology. Such contacts 40A, 40B are integrally molded and do not need to be bent, and the shape of the contacts 40A, 40B can be defined by the cutting process. Thus, the concentration of stress is reduced, the structural integrity is improved, and the contacts 40A, 40B have high structural strength and a long life. Furthermore, the cutting process (for example, laser cutting, electric discharge cutting, etc.) can accurately cut the desired shape of the contacts 40A, 40B. In particular, the positional accuracy of the contact end 413 of the contact tip 41 is good. That is, it can be accurately aligned with the contact pad 231 of the object to be measured 23, which is advantageous for carrying out the test.

[0065] As shown in FIG. 10, in this embodiment, the tip transition surface 431 of the contacts 40A and 40B includes one gradual transition surface 432 and one inclined plane 433. The gradual transition surface 432 is directly connected to the lower surface 421 of the body 42 and extends toward the rear side 412b of the tip bottom surface 412. The gradual transition surface 432 has a gradual change in curvature radius according to the extending length, and can realize a smooth step without a sudden change in curvature. The inclined plane 433 is connected between the gradual transition surface 432 and the rear side 412b of the tip bottom surface 412, and has the effect of realizing a step to a certain extent smoothly. In other words, the gradual transition surface 432 has a relatively smooth effect of realizing a step, and is better than the inclined plane 433 in reducing stress concentration. Both the gradual transition surface 432 and the inclined flat surface 433 can reduce stress concentration, improve structural integrity, and further improve the structural strength of the contacts 40A, 40B. Depending on different manufacturing processes, the tip transition surface 431 can be a gradual transition surface 432 (e.g., produced by chemical etching), a inclined flat surface 433, or can include the gradual transition surface 432 and the inclined flat surface 433 at the same time as shown in this embodiment.

[0066] In addition, in this embodiment, the step d between the contact tip 41 and the body 42 of the contacts 40A, 40B is formed by performing a surface sinking process on the plane 611 of the flat plate 61 as shown in FIG. 1. This surface sinking process forms a planar first surface 541 (see FIG. 3). Then, the lower surface 421 of the contacts 40A, 40B is formed by the first surface 541. Thus, the lower surface 421 of each of the contacts 40A, 40B is a single plane. By making the first surface 541 planar, the lower surface 421 of the contacts 40A, 40B can be made planar. This manufacturing method is easy and ensures that the body 42 of the contacts 40A, 40B has good structural integrity and structural strength.

[0067] Second Embodiment The contacts 40A and 40B according to the present invention are not limited to being applied to the probe system 11 shown in FIG. 8. For example, they can also be applied to a probe system 12 according to a second embodiment shown in FIG. 11. The probe system 12 is similar to the probe system 11, and differs in that a different type of contact probe 70 is used. The contact probe 70 includes one base portion 71, one coaxial joint 72 fixed to the base portion 71, a circuit board 73 electrically connected to the base portion 71 and the coaxial joint 72, and three contacts 40A and 40B similar to those of the first embodiment. The three contacts 40A and 40B are arranged in parallel on one bottom surface 731 of the circuit board 73, and only one contact 40B is shown in FIG. 11, and the other two contacts 40A and 40B are hidden by the contact 40B and cannot be seen in FIG. 11.

[0068] 12, the bottom surface 731 of the circuit board 73 is provided with one electrically conductive circuit 732 and two electrically conductive circuits 733 located on opposite sides of the electrically conductive circuit 732. The upper surface 422 of the contact 40A (first contact) is electrically connected to and partially fixed to the electrically conductive circuit 732. The upper surfaces 422 of the two contacts 40B (second contact) are electrically connected to and partially fixed to the electrically conductive circuit 733. The main body portions 42 of the three contacts 40A, 40B all extend from the positions fixed to the circuit board 73 to the left in FIG. 12 and pass the end 735 of the circuit board 73, so that each of the contacts 40A, 40B includes a cantilever segment 46 extending from the end 735 of the circuit board 73 (see FIG. 11). The cantilever segment 46 includes a part of the main body portion 42, as well as the entire tip transition section 43 and the contact tip portion 41. The contact tip 41 is located at one end 461 of the cantilever segment 46. The bottom tip surfaces 412 of the three contacts 40A, 40B are flush with each other.

[0069] In other words, the main difference between the contact probe 30 according to the first embodiment and the contact probe 70 according to the present embodiment is that the coaxial cable 33 is replaced by a circuit board 73. Such a contact probe 70 can also perform a functionality test on the object to be measured 23. In the circuit board 73, the electrically conductive circuit 732 is used to transmit a test signal, and the electrically conductive circuit 733 is used to transmit a ground signal, so that the contact 40A transmits the test signal and the contact 40B transmits the ground signal. By arranging the contact 40B transmitting the ground signal on both sides of the contact 40A transmitting the test signal in parallel and spaced apart, a transmission line having a desirable impedance matching effect can be formed, and a good impedance matching effect can be obtained, so that the contact probe 70 can be used for high frequency testing.

[0070] Third embodiment As shown in FIGS. 13 to 16, the third embodiment of the present invention provides contacts 40C and 40D (also referred to as a first contact and a second contact, respectively, in the present invention).

[0071] The manufacturing method of the contacts 40C, 40D is similar to that of the contacts 40A, 40B, and includes the same steps a) to c). The main difference is that in this embodiment, the thin block 51 of the substrate 50 shown in FIG. 2 is replaced by a thin block 55, a thick block 56, and a transition block 57. As shown in FIGS. 13 and 14, in step a) of this embodiment, the substrate 50 provided includes one thin block 55, transition blocks 53, 57 located on opposite sides of the thin block 55, and two thick blocks 52, 56 connected to the transition blocks 53, 57, respectively. The transition blocks 53, 57 extend from the thin block 55 to the thick blocks 52, 56 with their thicknesses gradually increasing. Thus, the upward side 54 of the substrate 50 includes a first surface 541 located on the thin block 55, two second surfaces 542 located on the thick blocks 52 and 56, respectively, and two transition surfaces 543 located on the transition blocks 53 and 57, respectively. The two second surfaces 542 are both higher than the first surface 541 and have the same step height d between them. The two transition surfaces 543 have the same shape and extend from the first surface 541 to the second surface 542 with a gradually changing height.

[0072] Furthermore, in this embodiment, the substrate 50 provided in step a) of this embodiment is similarly formed by a flat plate 61 shown in FIG. 1 through a surface sinking process. The difference is that in this embodiment, the area of ​​the surface that is sinked on the flat surface 611 of the flat plate 61 is relatively small. A part of the flat plate 61 is surface sinked to form the first surface 541 and the transition surface 543 of the substrate 50. The non-sinking surface of the flat surface 611 of the flat plate 61 becomes the second surface 542 of the substrate 50.

[0073] 13 and 15, in step b) of this embodiment, the step of defining the contacts 40C, 40D includes the steps of defining the contact tip 41 of each of the contacts 40C, 40D with a thick block 53, and defining the body 42 of each of the contacts 40C, 40D with a thin block 55, a transition block 57, and a thick block 56. Then, in step c), the shape of the contact tip 41 of each of the contacts 40C, 40D is adjusted so that the contacts 40C, 40D become as shown in FIG.

[0074] Thus, the contacts 40C, 40D according to this embodiment have the same contact tip 41 and tip transition section 43 as the contacts 40A, 40B described above. However, the body portion 42 of the contacts 40C, 40D according to this embodiment includes a thin section 423 formed by the thin block 55 of the substrate 50, a thick section 424 formed by the thick block 56 of the substrate 50, and a body transition section 425 formed by the transition block 57 of the substrate 50 and located between the thin section 423 and the thick section 424. The bottom side 45 of the contacts 40C, 40D has a tip bottom surface 412 located at the contact tip 41, a tip transition surface 431 located at the tip transition section 43, a lower surface 421 located at the thin section 423 of the body portion 42, a body transition surface 426 located at the body transition section 425, and a body bottom surface 427 located at the thick section 424 of the body portion 42. In addition to the step d between the rear side 412b of the tip portion bottom surface 412 and the lower surface 421, a step d is also formed between the body portion bottom surface 427 and the lower surface 421. The body portion transition surface 426 extends with a gradual change in height from the lower surface 421 to the body portion bottom surface 427. Furthermore, the body portion transition surface 426 has a gradual change transition curved surface 428 and an inclined plane 429, which are similar to the gradual change transition curved surface 432 and inclined plane 433 of the tip portion transition surface 431. Tip transition surface 431, body transition surface 426, and lower surface 421 are formed by transition surface 543 and first surface 541, respectively, as shown in FIG. 14, i.e., by surfaces formed by a surface settling process, so that the surface roughness of tip transition surface 431, body transition surface 426, and lower surface 421 is different from the surface roughness of tip bottom surface 412, tip top surface 411, upper surface 422, or body bottom surface 427.

[0075] As a result, the contacts 40C and 40D according to this embodiment have the same effect as the contacts 40A and 40B described above. In addition, since the thickness of the section of the main body 42 of the contacts 40C and 40D away from the contact tip 41 is large (i.e., the thick section 424), the structural strength of the main body 42 of the contacts 40C and 40D is improved, and it is advantageous to configure a contact probe by fixing the main body 42 of the contacts 40C and 40D to another member. For example, the contacts 40C and 40D can configure the contact probe 30 shown in FIG. 8 by fixing the thick section 424 of the main body 42 to the oblique cut surface 331 of the coaxial cable 33 shown in FIG. 9. Alternatively, the contacts 40C and 40D can configure the contact probe 70 shown in FIG. 11 by fixing the thick section 424 of the main body 42 of the contacts 40C and 40D to the circuit board 73 shown in FIG. 12. In the body 42 of the contacts 40C, 40D, the step d between the thin section 423 and the thick section 424 is the original step d of the substrate 50. The manufacturing method of the contacts 40C, 40D does not require microelectromechanical technology or bending of the contacts, and the contacts 40C, 40D have good precision, high structural strength, and a relatively long life. In addition, the body 42 has a body transition section 425 between the thin section 423 and the thick section 424, and the body transition surface 426 has a gradually changing height and smoothly connects the lower surface 421 with the step d and the body bottom surface 427, thereby reducing stress concentration and improving structural integrity, and further improving the durability and reliability of the contacts 40C, 40D.

[0076] (Fourth embodiment) As shown in Fig. 17, the fourth embodiment of the present invention provides a contact 40E of another form. Here, Fig. 17 shows a case where six contacts 40E are manufactured at the same time. The six contacts 40E are in a state where the contact tip portions 41 remain connected to the connecting portions 62. The six contacts 40E may be two sets of contacts shown in Fig. 5 or two sets of contacts shown in Fig. 15. That is, the main body portion 42 of the contact 40E is not limited to a uniform thickness and may have a step d.

[0077] The contactor 40E according to this embodiment differs from the contactors 40A-D according to the above-described embodiments in that it further includes an extension section 47 located between the body section 42 and the tip transition section 43. The body section 42 has a width greater than the widths of the extension section 47, the tip transition section 43, and the contact tip 41. A part of the lower surface 421 is located in the extension section 47. In other words, on the bottom side 45 (i.e., the side facing the object to be measured 23) of the contactor 40E, the extension section 47 shares the same plane as the body section 42, i.e., there is a step d between the body section 42 and the contact tip 41 as shown in FIG. 6. However, the extension section 47 is narrower than the body section 42. The width of the extension section 47 is close to the width of the contact tip 41. Compared to the previous embodiment in which the tip transition section 43 is directly connected to the body 42, this embodiment has an extension section 47 between the tip transition section 43 and the body 42. This provides greater elasticity when the contact tip 41 of the contactor 40E contacts the contact pad of the device under test, which is advantageous for the progress of the test.

[0078] As described above, the contacts 40A-E, the contact probes 30, 70, and the probe systems 11, 12 according to the present invention are used to perform a functionality test on an unpackaged semiconductor device (object under test 23). Thus, the present invention further provides a method for testing an unpackaged semiconductor device, a method for manufacturing a tested semiconductor device, and a tested semiconductor device, as described above.

[0079] The method for testing an unpackaged semiconductor device includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe (eg, contact probe 30 or contact probe 70), which includes a plurality of the aforementioned contacts (eg, contacts 40A, 40B or contacts 40C, 40D). Step 2: The contacts are mechanically and electrically contacted to a plurality of contact pads of the unpackaged semiconductor device. Step 3: Performing a test on the unpackaged semiconductor device with at least one contact probe. As a result, the contact probe used in this testing method includes the contactor according to the present invention described above, has good accuracy, high structural strength, and a long service life, and can improve the accuracy and reliability of testing unpackaged semiconductor devices.

[0080] The manufacturing method of the tested semiconductor device includes the following steps 1, 2, and 3. Step 1: Provide at least one contact probe (eg, contact probe 30 or contact probe 70). The contact probe includes a plurality of the contacts described above (eg, contacts 40A, 40B or contacts 40C, 40D). Step 2: The contacts are mechanically and electrically contacted to a plurality of contact pads of the unpackaged semiconductor device. Step 3: Test the unpackaged semiconductor device with contact probes. The semiconductor device manufactured by this manufacturing method has been tested, and the test utilizes the contact of the present invention, which has good accuracy, high structural strength, and long service life, and can improve the accuracy and reliability of the test results of the semiconductor device.

[0081] The semiconductor device under test includes a plurality of contact pads 231, and undergoes a test process by mechanical and electrical contact with at least one contact probe (e.g., contact probe 30 or contact probe 70). The contact probe includes a plurality of the aforementioned contacts (e.g., contacts 40A, 40B or contacts 40C, 40D). The test process is performed by contacting the contact ends 431 of the contacts with the contact pads 231.

[0082] Thus, the aforementioned semiconductor device has been tested. The test utilizes the contact of the present invention, which has good accuracy, high structural strength, and long service life, and can improve the accuracy and reliability of the test results of the semiconductor device.

[0083] Finally, it is reiterated that the components disclosed in the embodiments according to the present invention are for illustrative purposes only and do not limit the scope of the present invention, and that the replacement or modification of other equivalent components should be included in the scope of the claims of the present invention. [Explanation of symbols]

[0084] 11, 12: Probe system 21: Placement table 22: Circuit board 23: Object to be measured 231: Contact pad 30: Contact probe 31: Base section 32: Coaxial coupling 33: Coaxial cable 331: Oblique cutting surface 332: Inner Electrical Conductor 333: Outer Electrical Conductor 333a, 333b: Block 334: Dielectric 335: Terminal 40A, 40B, 40C, 40D, 40E: Contact 41: Contact tip 411:Tip top surface 412: Bottom of tip 412a: Front side 412b: Rear side 413: Contact end 414: Plane 415, 416: Virtual lines 42: Main body 421: Lower surface 422: Upper surface 423: Thin section 424: Thick section 425: Body transition section 426: Body transition surface 427: Bottom of main body 428: Gradual change transition surface 429: Inclined plane 43: Tip transition section 431: Tip transition surface 432: Gradual change transition surface 433: Inclined plane 44:Top side 45: Bottom side 450:Angle 46: Cantilever segment 460:Inner obtuse angle 461:Terminal 47: Extension section 50: Circuit board 51: Thin block 52: Thick block 53: Transition block 54: Upward 541: First surface 542:Second surface 543:Transition surface 55: Thin block 56: Thick block 57: Transition block 61: Flat plate 611: Plane 62, 63: Connection part 70: Contact probe 71: Base section 72: Coaxial coupling 73: Circuit board 731: Bottom 732, 733: Electrical conduction circuits 735: Terminal C: Outer contour d: Step

Claims

1. A contact of a contact probe, Used in a probe system for performing a functionality test on an object to be measured, A main body portion, a contact tip having a contact end adapted to contact the object to be measured; a tip transition section located between the body portion and the contact tip, the contactor has a top side and a bottom side, the bottom side of the contactor facing the device under test when the contactor performs a functionality test on the device under test; a bottom side of the contact including a lower surface located at the body portion, a tip bottom surface located at the contact tip, and a tip transition surface located at the tip transition section; the contact end is located on the front side of the tip bottom surface; A step is provided between the rear side of the tip bottom surface and the lower surface, The tip transition surface has a gradual change in height and extends from the lower surface to the rear of the tip bottom surface. A contact of a contact probe.

2. A contact of the contact probe according to claim 1, The contacts are formed by subjecting the substrate having the step to a cutting process. A contact of a contact probe.

3. A contact of the contact probe according to claim 1, The tip transition surface includes at least one of a gradual transition surface and an inclined flat surface. A contact of a contact probe.

4. A contact of the contact probe according to claim 1, The surface roughness of the lower surface and the tip transition surface is different from the surface roughness of the tip bottom surface. A contact of a contact probe.

5. A contact of the contact probe according to claim 1, the body portion includes a thin section, a thick section, and a body portion transition section located between the thin section and the thick section; the lower surface is located in the thinned section; the bottom side of the contact further includes a body bottom surface located in the thick section of the body and a body transition surface located in the body transition section, the step being between the body bottom surface and the lower surface; The body transition surface has a gradual change in height and extends from the lower surface to the body bottom surface. A contact of a contact probe.

6. A contact of the contact probe according to claim 5, The body transition surface includes at least one of a gradually changing transition curved surface and an inclined flat surface. A contact of a contact probe.

7. A contact of the contact probe according to claim 5, The surface roughness of the lower surface, the tip transition surface, and the body transition surface is different from the surface roughness of the body bottom surface. A contact of a contact probe.

8. A contact of the contact probe according to claim 1, An extension section located between the body section and the tip transition section, the body portion has a width greater than a width of the extension section, the tip transition section, and the contact tip; The lower surface is partly located in the extending section. A contact of a contact probe.

9. A contact of the contact probe according to claim 1, The lower surface is planar. A contact of a contact probe.

10. A contact of the contact probe according to claim 1, the top side of the contact has an upper surface located at the body portion and a tip top surface located at the contact tip; The tip top surface extends from the upper surface to the contact end such that the tip top surface is inclined relative to the upper surface. A contact of a contact probe.

11. A contact probe, A probe system for performing a functionality test on an object to be measured, comprising: a coaxial cable; and the contactor according to claim 1; The coaxial cable includes an inner electrical conductor, an outer electrical conductor, and a dielectric disposed between the inner electrical conductor and the outer electrical conductor; The contacts are multiple, a top side of each of the contacts having an upper surface located on the body portion; A portion of the upper surface of each of the contacts is fixed to the coaxial cable, The body portion of each of the contacts extends from a position where the body portion is fixed to the coaxial cable and passes an end of the coaxial cable, each said contact including a cantilever segment extending from a distal end of said coaxial cable; the contact tip of each of the contacts is located at an end of the cantilever segment; The bottom surfaces of the tips of the plurality of contacts are flush with one another; Among the plurality of contacts, there is one first contact and at least one second contact; an upper surface of the first contact electrically connected to and secured to the inner electrical conductor of the coaxial cable; The upper surface of the second contact is electrically connected to and secured to the outer electrical conductor of the coaxial cable. A contact probe comprising:

12. A contact probe, A probe system for performing a functionality test on an object to be measured, comprising: a circuit board; and the contactor according to claim 1; the circuit board includes a plurality of electrically conductive circuits; The contacts are multiple, a top side of each of the contacts having an upper surface located on the body portion; A portion of the upper surface of each of the contacts is electrically connected to and fixed to the electrically conductive circuit of the circuit board, the body portion of each of the contacts extends from a position where it is fixed to the circuit board and past an end of the circuit board; each said contact including a cantilever segment extending from an end of said circuit board; the contact tip of each of the contacts is located at an end of the cantilever segment; The bottom surfaces of the tips of the plurality of contacts are flush with each other. A contact probe comprising:

13. A method for manufacturing a contact, comprising the steps of: The contact is used in a contact probe for performing a functionality test on an object to be measured, The method for manufacturing the contact includes the steps of: Providing a substrate; removing material of the substrate to define a plurality of the contacts; The substrate is a thin block, at least one thick block, and at least one transition block extending from the thin block to the thick block with an increasing thickness; the upward facing side of the substrate includes a first surface located at the thin block, at least one second surface located at the thick block, and at least one transition surface located at the transition block; the second surface is higher than the first surface; the transition surface extends with a gradual change in height from the first surface to the second surface; The step of defining a plurality of contacts includes: defining a contact tip of each of the contacts in the thick block of the substrate; defining a body portion of each of the contacts in the thinned block of the substrate; and performing a cut on the substrate based on an outer contour of the plurality of contacts. A method for manufacturing a contact comprising the steps of:

14. A method for manufacturing the contact according to claim 13, comprising the steps of: and forming from each of the contact tips a top tip surface, a bottom tip surface, and a contact terminus located at an intersection of the top tip surface and the bottom tip surface and adapted to contact the object to be measured. A method for manufacturing a contact comprising the steps of:

15. A method for manufacturing the contact according to claim 13, comprising the steps of: The substrate includes two transition blocks located on opposite sides of the thin block, and two thick blocks connected to the two transition blocks, respectively; the upward facing side of the substrate includes two of the second surfaces located on two of the thick blocks respectively, and two of the transition surfaces located on two of the transition blocks respectively; The step of defining a plurality of contacts includes: defining the contact tip of each of the contacts in one of the two thick blocks; and defining a body portion of each of the contacts with the thin block and the other of the two thick blocks. A method for manufacturing a contact comprising the steps of:

16. A method for manufacturing the contact according to claim 13, comprising the steps of: The substrate is a flat plate formed through a surface precipitation process; the first surface and at least one of the transition surfaces are formed by the facet settling process; a surface roughness of the first surface and at least one of the transition surfaces differs from a surface roughness of the at least one of the second surfaces; The surface depression process is preceded by a step of removing material of the substrate to define a plurality of the contacts. A method for manufacturing a contact comprising the steps of:

17. A probe system used to perform a functionality test on a test object formed on a substrate, comprising: the device under test includes a plurality of contact pads; The probe system includes a mounting table and a contact probe. the mounting table is positioned to support the substrate, The contact probe includes a plurality of the contactors according to claim 1, and is used to electrically connect the contact probe and the object to be measured by contacting the contact ends of the contactors with the contact pads of the object to be measured, thereby performing a functionality test on the object to be measured. A probe system comprising:

18. 1. A method for testing an unpackaged semiconductor device, comprising: providing at least one contact probe including a plurality of the contacts of claim 1; mechanically and electrically contacting the contacts to a plurality of contact pads of an unpackaged semiconductor device; and performing a test on an unpackaged semiconductor device with at least one of the contact probes. A test method comprising:

19. A method for manufacturing a tested semiconductor device, comprising the steps of: providing at least one contact probe including a plurality of the contacts of claim 1; mechanically and electrically contacting a plurality of said contacts to a plurality of contact pads of an unpackaged semiconductor device; and performing a test on an unpackaged semiconductor device with at least one of the contact probes. A manufacturing method comprising the steps of:

20. A tested semiconductor device, A plurality of contact pads are provided, A test process is performed by mechanical and electrical contact with at least one contact probe; The contact probe includes a plurality of the contacts according to claim 1 , The test process is performed by contacting the contact ends of the plurality of contacts with the plurality of contact pads. A semiconductor device comprising:

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