Vibration piece, vibration device, and wafer

Abstract

To improve a break-off part of a vibration piece.SOLUTION: A vibration piece is broken off from a crystal substrate at a connection part connected with the crystal substrate, and the vibration piece has a first surface, a second surface that is a rear face of the first surface, side faces that connect the first surface and the second surface to each other; and a remaining part of the connection part. The remaining part has a first portion that is located on the side faces and is the same surface as the first surface, and a second portion that is the same surface as the second surface. When the length of the first portion is defined as A and the length of the second portion as B when the remaining part is seen from a direction perpendicular to the side faces, the following (formula 1) and (formula 2) are satisfied. (Formula 1): A2 / |B-A|≤84.8. (Formula 2): 0<A<B.SELECTED DRAWING: Figure 6

Description

Technical Field

[0001] The present invention relates to a vibrating piece, a vibration device, and a wafer.

Background Art

[0002] Patent Document 1 discloses a preferable shape of a folding portion that connects a vibrating piece formed on a wafer and a support frame.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] According to Patent Document 1, by forming arc-shaped portions at both ends of the folding portion and setting the distance between the arc-shaped portions at both ends within a specific dimension range, it is possible to make it difficult for a part of the folding portion to remain on the vibrating piece when the vibrating piece is folded. However, there is room for improvement in the folding portion of the vibrating piece.

Means for Solving the Problems

[0005] The vibrating piece is a vibrating piece folded from a crystal substrate at a connecting portion connecting to the crystal substrate, and has a first surface, a second surface that is the back surface of the first surface, a side surface connecting the first surface and the second surface, and a residue of the connecting portion. The residue is located on the side surface and has a first portion that is on the same surface as the first surface and a second portion that is on the same surface as the second surface. When the length of the first portion is A and the length of the second portion is B when viewed from a direction perpendicular to the side surface, the following (Equation 1) and (Equation 2) are satisfied. A 2 / │B - A│≦84.8 ··· (Equation 1) 0 < A < B ··· (Equation 2)

[0006] The vibration device includes the above-mentioned vibrating piece, a container for housing the vibrating piece, and a lid for closing the container.

[0007] The wafer is a wafer composed of a quartz substrate, and includes a plurality of vibrating pieces and a support frame for connecting each of the plurality of vibrating pieces through a connecting portion provided for each vibrating piece. Each of the plurality of vibrating pieces has a first surface, a second surface which is the back surface of the first surface, and a side surface connecting the first surface and the second surface. The connecting portion is located on the side surface of the vibrating piece and has a first portion which is on the same plane as the first surface and a second portion which is on the same plane as the second surface. When the length of the narrowest part of the first portion is A when the first surface is viewed in plan and the length of the narrowest part of the second portion is B when the second surface is viewed in plan, the following (Equation 6) and (Equation 7) are satisfied. A 2 / │B - A│≦84.8 ··· (Equation 6) 0 < A < B ··· (Equation 7)

Brief Description of the Drawings

[0008] [Figure 1] Exploded perspective view showing the vibration device. [Diagram 2] Exploded perspective view showing the vibration device. [Diagram 3] Plan view showing the wafer. [Figure 4] Enlarged view of part D in Figure 3. [Diagram 5] Plan view showing the vibrating piece. [Figure 6] Perspective view showing the vibrating piece. [Figure 7] Perspective view showing the vibrating piece. [Figure 8] Schematic view of the remaining mark viewed from a direction perpendicular to the side surface. [Figure 9] Figure showing the measurement results of a sample of the vibrating piece. [Figure 10] Graph showing the relationship between the protrusion amount and A2 / │B - A│. [Figure 11] Enlarged view of part E in Figure 4. [Figure 12] FIG. [Figure 13] FIG. [Figure 14] FIG. [Figure 15] Schematic diagram of the trace viewed from a direction perpendicular to the side. [Figure 16] FIG. [Figure 17] FIG. [Figure 18] FIG. [Figure 19] FIG. [Figure 20] FIG. [Figure 21] FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] As shown in FIG. 1, the vibration device 1 has a case 2, a vibrating element 3, and a lid 4. FIG. 1 is indicated with an X-axis, a Y-axis, and a Z-axis. The X-axis, the Y-axis, and the Z-axis are mutually orthogonal coordinate axes. The X-axis, the Y-axis, and the Z-axis are also indicated as necessary in the figures shown in FIG. 1 and subsequent figures. In this case, the X-axis, the Y-axis, and the Z-axis in each figure correspond to the X-axis, the Y-axis, and the Z-axis in FIG. 1. FIG. 1 shows a state in which the vibration device 1 is placed on an XY plane defined by the X-axis and the Y-axis.

[0010] In the following description, when the X-axis, Y-axis, and Z-axis are indicated in a diagram or description showing a component or unit of the vibration device 1, they refer to the X-axis, Y-axis, and Z-axis in a state in which the component or unit is incorporated into the vibration device 1. The X-axis, Y-axis, and Z-axis in this case correspond to the X-axis, Y-axis, and Z-axis when the vibration device 1 is placed on the XY plane. The X-axis, Y-axis, and Z-axis are each indicated with an arrow. For each of the X-axis, Y-axis, and Z-axis, the direction of the arrow indicates the + (positive) direction, and the direction opposite to the direction of the arrow indicates the - (negative) direction. The Z-axis is an axis perpendicular to the XY plane. A plan view is a view of the vibration device 1 when viewed in the -Z direction.

[0011] A concave cavity 7 is formed in the case 2. An electrode pad 8 is formed inside the cavity 7. An electrode (not shown) is formed on the vibrating element 3. As shown in FIG. 2, the vibrating element 3 is accommodated in the cavity 7. An electrode of the vibrating element 3 is connected to the electrode pad 8 shown in FIG. 1. An electrical signal is transmitted to and received from the vibrating element 3 via the electrode pad 8. As shown in FIG. 2, the case 2 is closed by the lid 4 with the vibrating element 3 accommodated in the cavity 7. That is, the vibrating device 1 has the case 2 that accommodates the vibrating element 3 and the lid 4 that closes the case 2. The case 2 is an example of a container. The lid 4 is an example of a cover.

[0012] The vibrating piece 3 is a tuning fork-type vibrating element made of a quartz substrate. The vibrating piece 3 is formed by dry etching the quartz substrate. For example, a Z-cut quartz substrate is used as the quartz substrate. The Z-cut quartz substrate is a quartz substrate whose thickness direction is the Z-axis, which is the crystal axis of quartz. The Z-axis of quartz is also called the optical axis. It is preferable that the Z-axis coincides with the thickness direction of the Z-cut quartz substrate. However, from the viewpoint of reducing the frequency temperature change near room temperature, the Z-axis may be tilted with respect to the thickness direction of the substrate.

[0013] As shown in FIG. 3, the vibrating pieces 3 are manufactured in the form of a wafer 10 made of a quartz substrate. The wafer 10 is used in the process of forming the vibrating pieces 3 from the quartz substrate. The wafer 10 is formed by performing dry etching on the quartz substrate. The wafer 10 has a plurality of vibrating pieces 3 and a support frame 11. The support frame 11 supports the plurality of vibrating pieces 3.

[0014] As shown in FIG. 4, which is an enlarged view of part D in FIG. 3, the vibrating bar 3 is connected to the support frame 11 via a connecting portion 12. A connecting portion 12 is provided for each vibrating bar 3. Each of the multiple vibrating bars 3 is connected to the support frame 11 via a connecting portion 12 provided for each vibrating bar 3. The vibrating bar 3 has a base 15 and a pair of vibrating arms 16. The pair of vibrating arms 16 extend from the base 15 in the -Y direction. Both of the pair of vibrating arms 16 extend from the base 15 in the -Y direction. The pair of vibrating arms 16 are adjacent to each other along the X-axis.

[0015] The connecting portion 12 extends from the support frame 11. The connecting portion 12 extends from the support frame 11 in the -Y direction. The connecting portion 12 extending from the support frame 11 is connected to the base portion 15. The vibrating piece 3 is located in the -Y direction of the connecting portion 12. The connecting portion 12 is a portion between the support frame 11 and the base portion 15. The vibrating piece 3 is separated from the wafer 10 by breaking off the vibrating piece 3 from the wafer 10. That is, when the vibrating piece 3 is separated from the wafer 10, the vibrating piece 3 is broken off from the wafer 10. The vibrating piece 3 is separated from the wafer 10 by breaking off the vibrating piece 3 from the wafer 10. The vibrating piece 3 is broken off from the wafer 10 at the connecting portion 12.

[0016] As shown in FIG. 5, the individualized vibrating piece 3 has a residual mark 21 formed when it is broken off from the wafer 10. The residual mark 21 is a trace of the connecting portion 12 formed when the vibrating piece 3 is broken off from the wafer 10. The residual mark 21 can also be expressed as a burr remaining on the vibrating piece 3 when the vibrating piece 3 is broken off from the wafer 10. The residual mark 21 occurs on the base 15. The residual mark 21 is formed on the end of the base 15 in the +Y direction. The residual mark 21 protrudes from the base 15. The residual mark 21 protrudes in the +Y direction from the end of the base 15 in the +Y direction. The amount of protrusion of the residual mark 21 from the base 15 is represented as L.

[0017] As shown in FIG. 6, the vibrating element 3 has a first surface 23, a side surface 24, and a first portion 25. The first surface 23 is a surface perpendicular to the Z axis. The first surface 23 is a surface facing the +Z direction. The first portion 25 is a part of the trace 21. The first portion 25 is a surface of the trace 21 facing the +Z direction. The first portion 25 is flush with the first surface 23. The first portion 25 and the first surface 23 are continuous with each other. The flush surface is not limited to the same plane. As long as the first portion 25 and the first surface 23 are continuous with each other, the first portion 25 may be a curved surface. The first portion 25 and the first surface 23 being continuous with each other refers to a state in which there is no discontinuous step between the first portion 25 and the first surface 23.

[0018] As shown in FIG. 7, the vibrating element 3 has a second surface 26 and a second portion 27. The second surface 26 is a surface perpendicular to the Z axis. The second surface 26 is a surface facing the -Z direction. The second surface 26 is the back surface of the first surface 23. The second portion 27 is a part of the trace 21. The second portion 27 is a surface of the trace 21 facing the -Z direction. The second portion 27 is flush with the second surface 26. The second portion 27 and the second surface 26 are continuous with each other. The flush surface is not limited to the same plane. As long as the second portion 27 and the second surface 26 are continuous with each other, the second portion 27 may be a curved surface. The second portion 27 and the second surface 26 are continuous with each other means that there is no discontinuous step between the second portion 27 and the second surface 26. The side surface 24 is a surface that connects the first surface 23 and the second surface 26. The side surface 24 is a surface that surrounds the periphery of the vibrating element 3 .

[0019] The trace 21 is formed on the side surface 24. The trace 21 is formed on the side surface 24 of the base 15 facing the +Y direction. The trace 21 protrudes in the +Y direction from the side surface 24 facing the +Y direction. On the other hand, the pair of vibrating arms 16 is formed on the side surface 24 of the base 15 facing the -Y direction. The pair of vibrating arms 16 protrude in the -Y direction from the side surface 24 facing the -Y direction. That is, the pair of vibrating arms 16 extend from one end of the base 15, and the trace 21 is located at the other end opposite to the one end of the base 15. The pair of vibrating arms 16 and the trace 21 extend in opposite directions from the base 15. According to this embodiment, the vibrating piece 3 can be easily broken off from the wafer 10.

[0020] FIG. 8 is a schematic view of the remaining mark 21 as viewed from a direction perpendicular to the side surface 24. As shown in FIG. 8, the remaining mark 21 has a length A along the X-axis of the first portion 25 and a length B along the X-axis of the second portion 27. For a plurality of vibrating pieces 3 folded from the wafer 10, the protruding amount L shown in FIG. 5, the length A and the length B shown in FIG. 8 were measured. As shown in FIG. 9, for six vibrating pieces 3 from sample 1 to sample 6, the protruding amount L, the length A and the length B were measured. Based on the measurement results shown in FIG. 9, the following approximate formula could be found. L = 0.40(A 2 / │B - A│)+5.97 ··· (approximate formula)

[0021] FIG. 10 is a graph showing the relationship between the protruding amount L and A 2 / │B - A│. The approximate line P in FIG. 10 is an approximate straight line based on the above approximate formula. As shown in FIG. 10, it can be seen that there is a correlation between the protruding amount L and A 2 / │B - A│. Based on the above approximate formula, the following matters can be derived.

[0022] The vibrating piece 3 satisfying the following (Formula 1) and (Formula 2) is preferable. A 2 / │B - A│≦84.8 ··· (Formula 1) 0 < A < B ··· (Formula 2) According to the vibrating piece 3 satisfying (Formula 1) and (Formula 2), the protruding amount L of the remaining mark 21 can be made 40 μm or less. Thereby, it is easy to avoid an increase in the inner dimension of the cavity 7 in the vibration device 1. Therefore, the vibration device 1 can be easily miniaturized.

[0023] The vibrating piece 3 satisfying the following (Formula 3) is preferable. A 2 / │B - A│≦34.0 ··· (Formula 3) According to the vibrating piece 3 satisfying (Formula 3), the protruding amount L of the remaining mark 21 can be made 20 μm or less. Thereby, it is even easier to avoid an increase in the inner dimension of the cavity 7 in the vibration device 1. Therefore, the vibration device 1 can be even more easily miniaturized.

[0024] It is preferable that the vibrating piece 3 satisfies the following (Formula 4). A 2 / │B - A│≤ 10.1 ··· (Formula 4) According to the vibrating piece 3 that satisfies (Formula 4), the protruding amount L of the residual mark 21 can be made 10 μm or less. Thereby, it is easier to further avoid an increase in the inner dimension of the cavity 7 in the vibration device 1. Therefore, it is easier to further miniaturize the vibration device 1.

[0025] It is preferable that the vibrating piece 3 satisfies the following (Formula 5). 0.02 ≤ A 2 / │B - A│ ··· (Formula 5) According to the vibrating piece 3 that satisfies (Formula 5), while avoiding an increase in the protruding amount L of the residual mark 21, it is easy to prevent the vibrating piece 3 from falling off the wafer 10.

[0026] In the above vibrating piece 3, the surface facing the +Z direction is defined as the first surface 23, and the surface facing the -Z direction is defined as the second surface 26. However, the directions of the first surface 23 and the second surface 26 may be reversed. That is, the surface facing the -Z direction may be defined as the first surface 23, and the surface facing the +Z direction may be defined as the second surface 26. Accordingly, A and B also become opposite to each other.

[0027] In the wafer 10, it is preferable to satisfy the following (Formula 6) and (Formula 7). A 2 / │B - A│≤ 84.8 ··· (Formula 6) 0 < A < B ··· (Formula 7) FIG. 11 is an enlarged view of part E in FIG. 4. As shown in FIG. 11, in the wafer 10, the length A is the length of the narrowest part of the first portion 25 when the first surface 23 is viewed in plan. In the wafer 10, the length B is the length of the narrowest part of the second portion 27 when the second surface 26 is viewed in plan. According to the wafer 10 that satisfies (Equation 6) and (Equation 7), when the resonator element 3 is broken off from the wafer 10, the protruding amount L of the residue 21 of the connecting portion 12 remaining on the resonator element 3 can be set to 40 μm or less. This makes it easy to prevent the inner dimension of the cavity 7 in the resonator device 1 from becoming large. Therefore, the resonator device 1 can be easily miniaturized.

[0028] It is preferable that the above-mentioned wafer 10 satisfies the following formula (8). A 2 / │BA│≦34.0...(Formula 8) With a wafer 10 that satisfies formula 8, when the resonator element 3 is broken off from the wafer 10, the protruding amount L of the trace 21 of the connecting portion 12 that remains on the resonator element 3 can be set to 20 μm or less. This makes it easy to prevent the inner dimension of the cavity 7 in the resonator device 1 from becoming large. This makes it easy to miniaturize the resonator device 1.

[0029] It is preferable that the above-mentioned wafer 10 satisfies the following formula (9). A 2 / │BA│≦10.1...(Equation 9) With a wafer 10 that satisfies formula 9, when the resonator element 3 is broken off from the wafer 10, the protruding amount L of the trace 21 of the connecting portion 12 that remains on the resonator element 3 can be set to 10 μm or less. This makes it easy to prevent the inner dimension of the cavity 7 in the resonator device 1 from becoming large. This makes it easy to miniaturize the resonator device 1.

[0030] It is preferable that the above-mentioned wafer 10 satisfies the following formula (10). 0.02≦A 2 / │BA│...(Equation 10) With a wafer 10 that satisfies (Formula 10), it is easy to prevent the protruding amount L of the trace 21 of the connecting portion 12 remaining on the vibrating piece 3 from becoming large when the vibrating piece 3 is broken off from the wafer 10. In addition, with a wafer 10 that satisfies (Formula 10), it is easy to prevent the vibrating piece 3 from falling off the wafer 10.

[0031] In the above-described vibrating piece 3 and wafer 10, a pair of vibrating arms 16 extend from one end of the base 15, and the connecting portion 12 is located at the other end of the base 15 opposite to the one end. The position of the connecting portion 12 is not limited thereto. For example, as shown in FIG. 12, the connecting portion 12 may be located on the side surface 24 of the base 15 in the -X direction. The connecting portion 12 may be located on the side surface 24 of the base 15 in the +X direction. When the connecting portion 12 is located on the side surface 24 of the base 15 in the -X direction, the trace 21 formed on the vibrating piece 3 is also located on the side surface 24 of the base 15 in the -X direction. When the connecting portion 12 is located on the side surface 24 of the base 15 in the +X direction, the trace 21 formed on the vibrating piece 3 is also located on the side surface 24 of the base 15 in the +X direction. The same effect can be obtained even if the connecting portion 12 is located on the side surface 24 of the base 15 in the -X direction or the side surface 24 in the +X direction.

[0032] In the above-described vibrating piece 3 and wafer 10, one connecting portion 12 is provided on one vibrating piece 3. The number of connecting portions 12 is not limited to this. A configuration in which a plurality of connecting portions 12 are provided on one vibrating piece 3 can also be applied. For example, as shown in FIG. 13, a wafer 110 having two connecting portions 12 on one vibrating piece 3 can be adopted. In the wafer 110, a through hole 31 is formed between the two connecting portions 12. The wafer 110 makes it easy to prevent the vibrating piece 3 from falling off. When the vibrating piece 3 is broken off from the wafer 110, two traces 21 are formed on the base portion 15 of the vibrating piece 3 as shown in FIG. 14. In the vibrating piece 3 having two traces 21, each of the two traces 21 has a first portion 25 and a second portion 27 as shown in FIG. 15. The two first portions 25 each have a length A, and the two second portions 27 each have a length B. The two connecting portions 12 may be located on the side surface 24 of the base portion 15 in the −X direction or on the side surface 24 in the +X direction.

[0033] As shown in FIG. 16, the vibrating piece 3 may have two support arms 35 extending from the base 15. Of the two support arms 35, the support arm 35A protrudes in the -X direction from the side surface 24 of the base 15 in the -X direction and then bends toward the -Y direction. The support arm 35A bending toward the -Y direction extends in the -Y direction. Of the two support arms 35, the support arm 35B protrudes in the +X direction from the side surface 24 of the base 15 in the +X direction and then bends toward the -Y direction. The support arm 35B bending toward the -Y direction extends in the -Y direction. When the vibrating piece 3 is viewed in a plan view, the pair of vibrating arms 16 is located between the two support arms 35.

[0034] As shown in Fig. 17, in a vibrating piece 3 having two supporting arms 35, a form in which the two supporting arms 35 are connected to a supporting frame 11 can be applied. In a wafer 120 shown in Fig. 17, the ends of the two supporting arms 35 in the -Y direction are connected to the supporting frame 11 via connecting parts 12. When the vibrating piece 3 is broken off from the wafer 120, a trace 21 is formed on the ends of the two supporting arms 35 in the -Y direction. The trace 21 formed on each of the two supporting arms 35 satisfies Equation 1 and Equation 2. The wafer 120 satisfies Equation 6 and Equation 7.

[0035] As shown in Fig. 18, a configuration can also be applied in which the connecting portions 12 that connect the two support arms 35 and the support frame 11 are provided at the -X direction end of the support arm 35A and the +X direction end of the support arm 35B. When the vibrating element 3 is broken off from the wafer 130 shown in Fig. 18, a trace 21 is formed at the -X direction end of the support arm 35A and the +X direction end of the support arm 35B. The traces 21 formed on each of the two support arms 35 satisfy Equation 1 and Equation 2. The wafer 130 satisfies Equation 6 and Equation 7.

[0036] As shown in FIG. 19, the vibrating piece 3 may have one support arm 35 extending from the base 15. The support arm 35 extends in the -Y direction from the side surface 24 of the base 15 in the -Y direction. The support arm 35 is located between a pair of vibrating arms 16. As shown in FIG. 20, the vibrating piece 3 having one support arm 35 may have a configuration in which the support arm 35 is connected to the support frame 11. In the wafer 140 shown in FIG. 20, the end of the support arm 35 in the -Y direction is connected to the support frame 11 via the connecting portion 12. When the vibrating piece 3 is broken off from the wafer 140, a trace 21 is formed at the end of the support arm 35 in the -Y direction. The trace 21 formed on the support arm 35 satisfies the formula 1 and formula 2. The wafer 140 satisfies the formula 6 and formula 7.

[0037] The vibrating piece 3 is not limited to a tuning fork type vibrating element. Thickness-shear vibrating elements such as AT-cut vibrating elements and SC-cut vibrating elements, contour vibrating elements, and vibrating elements made of silicon are also applicable. FIG. 21 shows an example in which an AT-cut vibrating element is applied as the vibrating piece 3. The AT-cut vibrating element is a vibrating element made of an AT-cut quartz substrate. In the wafer 150 shown in FIG. 21, the vibrating piece 3, which is an AT-cut vibrating element, is connected to the support frame 11 via a connecting portion 12. When the vibrating piece 3 is broken off from the wafer 150, a trace 21 is formed at the end of the vibrating piece 3. The trace 21 formed on the vibrating piece 3 satisfies the formula 1 and the formula 2. The wafer 150 satisfies the formula 6 and the formula 7. [Explanation of symbols]

[0038] 1...vibration device, 2...case, 3...vibrating piece, 4...lid, 7...cavity, 8...electrode pad, 10...wafer, 11...support frame, 12...connecting portion, 15...base, 16...vibrating arm, 21...residue, 23...first surface, 24...side, 25...first portion, 26...second surface, 27...second portion, 31...through hole, 35...support arm, 35A...support arm, 35B...support arm, 110...wafer, 120...wafer, 130...wafer, 140...wafer, 150...wafer, A...length, B...length, L...protrusion amount, P...approximation line.

Claims

1. A vibrating piece broken off from a quartz substrate at a connecting portion connected to the quartz substrate, The first page and A second surface that is a reverse surface of the first surface; A side surface connecting the first surface and the second surface; and a trace of the connection portion; the trace has a first portion located on the side surface and flush with the first surface and a second portion flush with the second surface; When the residual mark is viewed in a direction perpendicular to the side surface, the length of the first portion is A and the length of the second portion is B, and the following (Formula 1) and (Formula 2) are satisfied: vibrating piece. A 2 / │B-A│≦84.8・・・(Formula 1) 0<A<B...(Formula 2)

2. Satisfy the following (Formula 3): The vibrator element according to claim 1 . A 2 / │B-A│≦34.0・・・(Formula 3)

3. Satisfy the following (Formula 4): The vibrator element according to claim 1 . A 2 / │B-A│≦10.1・・・(Formula 4)

4. Satisfy the following (Formula 5): The vibrator element according to claim 1 . 0.02≦A 2 / │B-A│・・・(Formula 5)

5. A plurality of the traces are provided, Each of the plurality of traces has the first portion and the second portion. The vibrator element according to claim 1 .

6. A base and a pair of vibrating arms extending from the base, The trace is located at the base. The vibrator element according to claim 1 .

7. The pair of vibrating arms extend from one end of the base, The trace is located at the other end opposite to the one end of the base. The vibrator element according to claim 6 .

8. A base portion, a pair of vibrating arms extending from the base portion, and a support arm extending from the base portion, The trace is located on the support arm. The vibrator element according to claim 1 .

9. The vibrator element according to any one of claims 1 to 3, A container that accommodates the vibrating piece; A lid body that closes the container, Vibration devices.

10. A wafer comprising a quartz substrate, A plurality of vibrating arms; Each of the plurality of vibration arms has a support frame connected via a connecting portion provided for each of the vibration arms, Each of the plurality of vibrating arms is The first page and A second surface that is a reverse surface of the first surface; a side surface connecting the first surface and the second surface, The connecting portions each include a first portion located on the side surface of the vibrating element and flush with the first surface, and a second portion located on the side surface of the vibrating element and flush with the second surface; When the length of the narrowest portion of the first portion when the first surface is viewed in a plan view is A, and the length of the narrowest portion of the second portion when the second surface is viewed in a plan view is B, the following (Formula 6) and (Formula 7) are satisfied, Wafer. A 2 / │B-A│≦84.8・・・(Formula 6) 0<A<B...(Formula 7)

11. Satisfy the following (Formula 8): The wafer of claim 10. A 2 / │B-A│≦34.0・・・(Formula 8)

12. Satisfy the following (Formula 9): The wafer of claim 10. A 2 / │B-A│≦10.1・・・(Formula 9)

13. Satisfy the following (Formula 10): A wafer according to any one of claims 10 to 12. 0.02≦A 2 / │B-A│・・・(Formula 10)

14. The vibrating element has a base and a pair of vibrating arms extending from the base, The connecting portion is located at the base portion. A wafer according to any one of claims 10 to 12.

15. The pair of vibrating arms extend from one end of the base, The connecting portion is located at the other end opposite to the one end of the base portion. The wafer of claim 14.

16. The vibrating element has a base, a pair of vibrating arms extending from the base, and a supporting arm extending from the base, The connecting portion is located on the support arm. A wafer according to any one of claims 10 to 12.

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