Electronic apparatus, resin housing manufacturing method, housing, and electronic apparatus manufacturing method

Abstract

To improve heat dissipation in a resin housing with a metallic layer on the outer surface.SOLUTION: Electronic apparatus has a substrate on which electronic components are mounted, a heat sink that comes into contact with the electronic components, and a resin housing. The resin housing has a metal-filled through-hole that comes into contact with the heat sink and a metal layer on the outer surface.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to an electronic device, a resin housing manufacturing method, a housing, and an electronic device manufacturing method. [Background technology]

[0002] It has been known that noise resistance and heat dissipation can be improved by forming a metal layer on the outer surface of a resin housing by plating, etc. In relation to this, it has been proposed to improve heat dissipation by forming the housing from a polyphenylene sulfide resin composition with excellent thermal conductivity (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2011-63707 A Summary of the Invention [Problem to be solved by the invention]

[0004] When a housing is made of a resin material, the thermal conductivity of the resin is inferior to that of metal, so there is a risk that the heat dissipation of electronic components such as a processor housed inside the plastic housing and mounted on an electronic board may not be sufficient. Furthermore, even if a metal layer is formed by plating, the heat dissipation performance of the plastic housing also depends on the thermal conductivity of the resin material, making it difficult to further improve the heat dissipation performance.

[0005] The technology disclosed herein has been made in consideration of the above-mentioned circumstances, and has an object to improve heat dissipation in a resin housing having a metal layer formed on the outer surface. [Means for solving the problem]

[0006] In order to solve the above problems, the technology disclosed herein employs the following configuration: An electronic device according to one aspect of the technology disclosed herein includes a substrate on which electronic components are mounted, a heat sink in contact with the electronic components, and a resin housing. The resin housing has a through hole filled with metal in contact with the heat sink, and a metal layer on an outer surface. Effect of the Invention

[0007] According to the present disclosure, it is possible to improve heat dissipation properties in a resin housing having a metal layer formed on the outer surface. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is an overall view of an electronic device according to an embodiment. [Diagram 2] FIG. 2 is a cross-sectional view of the electronic device according to the embodiment, taken along a cross section along the central axis of a through hole. [Diagram 3] FIG. 3 is a cross-sectional view of a plastic housing after plating according to a first modified example of the embodiment, taken along a cross section along the central axis of a through hole. [Figure 4] FIG. 4 is a cross-sectional view of a plastic housing according to a second modified example of the embodiment before plating, taken along a cross section along the central axis of a through hole. [Diagram 5] FIG. 5 is a cross-sectional view of a plastic housing after plating according to a second modification of the embodiment, taken along a cross section along the central axis of a through hole. [Figure 6] FIG. 6 is a flow chart showing steps of plating on a plastic casing according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that each configuration and their combinations in the present embodiment are merely examples, and addition, omission, substitution, and other modifications of the configurations are possible as appropriate within the scope of the gist of the present disclosure. In addition, the present disclosure is not limited by the embodiments, but is limited only by the claims.

[0010] <Embodiment> [Overall structure] FIG. 1 is an overall view of an electronic device 10 according to an embodiment. The electronic device 10 in this embodiment is used in, for example, a vehicle such as an automobile. The electronic device 10 may be placed outside the vehicle cabin, such as in an engine room, or inside the vehicle cabin, such as inside the dashboard. The electronic device 10 is used, for example, as an ECU that controls a prime mover such as an engine or a motor, which is placed in an engine room, or as part of an in-vehicle device or entertainment system, such as an audio device, a head unit, or a car navigation system, which is placed on the dashboard. The electronic device 10 includes a housing 11 and a board 12.

[0011] The housing 11 is made of resin and is capable of housing the substrate 12 therein. The resin in this embodiment is ABS, heat-resistant ABS, flame-retardant ABS, PC / ABS, etc. Examples of the resin include PC, PBT, PA, SPS, POM, PPE, PES, PPS, PEI, LCP, PI, PEEK, PC / ASA, PU, ​​and photolithography materials. The resin may be a resin other than the resins exemplified here, as long as it is a resin to which electroless plating, which will be described later, can be applied. The housing 11 in this embodiment includes a plate portion 11P, and is formed in a box shape by a plurality of panels including the plate portion 11P. That is, the plate portion 11P forms a wall surface as the outer surface of the housing 11. As a result, as shown in FIG. 1, the housing 11 in this embodiment has an internal space 11S. In addition, the plate portion 11P is formed with a through hole 111 that is a circular through hole centered on the central axis C. However, the housing 11 is not limited to a box shape, and may be, for example, a frame formed of a material other than resin, in which a heat shield plate or the like is installed. In this case, the plate portion 11P functions as the heat shield plate, and the plate portion 11P does not have to be a wall surface that forms the internal space 11S. Furthermore, the embodiment of the housing 11 is not limited to this, and as long as at least the plate portion 11P is formed of resin, the member that constitutes the housing 11 is not limited to resin.

[0012] In this embodiment, for convenience, the plate portion 11P side is referred to as the upper side (front side) and the substrate 12 side is referred to as the lower side (rear side) as shown in Fig. 1. Note that the terms "upper side" and "lower side" in this embodiment merely indicate the relative positional relationship of each element in this embodiment.

[0013] A substrate 12 is stored in the internal space 11S of the housing 11. The substrate 12 is disposed so as to face the plate portion 11P. However, the arrangement of the substrate 12 and the plate portion 11P is merely an example, and for example, a configuration in which a part of the plate portion 11P covers the substrate 12 or a configuration in which a part of the plate portion 11P is deformed so that a part of the substrate 12 faces a part of the plate portion 11P may be adopted.

[0014] The substrate 12 is an electronic substrate on which an electric circuit is formed, and is formed of a general printed circuit board or the like. Electronic components are mounted on the substrate 12. In the example shown in FIG. 1, a processor 13 is disposed on the substrate 12 as an example of an electronic component, and is electrically connected to an electric circuit on the substrate 12. The processor 13 is a processing unit that executes control of the electronic device 10, and receives signals from an input device or the like connected to the electronic device 10 and performs processing. When performing the processing, the processor 13 generates heat, and dissipates the heat from a heat dissipation surface 131. However, the electronic components in the present disclosure are not limited to the processor 13, and may be, for example, other chips or capacitors mounted on the substrate 12.

[0015] [Heat dissipation structure] 2 is a cross-sectional view of an electronic device 10 including a heat dissipation structure 1 according to an embodiment, viewed from a cross section along a central axis C of a through hole 111. The heat dissipation structure 1 includes a plate portion 11P having a through hole 111, a plating layer 20 which is a metal layer formed on the plate portion 11P, a processor 13 which is a heat-generating component, and a thermally conductive grease 14 which thermally connects the processor 13 and the plating layer 20. The heat dissipation structure 1 included in the electronic device 10 according to this embodiment will be described below with reference to FIG. 2.

[0016] The plate portion 11P includes a front surface 11PF and a back surface 11PB. The front surface 11PF is the surface of the plate portion 11P opposite to the processor 13, and the back surface 11PB is the surface of the plate portion 11P facing the processor 13 and forming a wall surface. The through hole 111 formed in the plate portion 11P is formed in a cylindrical shape with a diameter d1 centered on the central axis C, and communicates between the front surface 11PF and the back surface 11PB of the plate portion 11P. In this embodiment, the through hole 111 is formed so that the diameter d1 is about 2.0 mm to 3.0 mm. However, the size of the diameter d1 is not limited to this, and it is sufficient that the through hole 111 is a small hole that can be molded during the molding process of the housing 11. In addition, the through hole 111 is not limited to a cylindrical shape, and may be a prismatic or pyramidal shape as long as it communicates between the front surface 11PF and the back surface 11PB of the plate portion 11P.

[0017] In the heat dissipation structure 1, the processor 13 is located directly below the through-hole 111. More specifically, the heat dissipation surface 131 of the processor 13 and the back surface 11PB of the plate portion 11P are disposed to face each other. Furthermore, in a plan view viewed along the central axis C (i.e., viewed in the thickness direction of the plate portion 11P), the heat dissipation surface 131 of the processor 13 and the through-hole 111 are formed to overlap. However, the positions of the heat dissipation surface 131 and the through-hole 111 may be changed as appropriate, and in this case, it is preferable that at least a portion of the heat dissipation surface 131 and the through-hole 111 are formed to overlap each other in a plan view viewed along the central axis C.

[0018] A plating layer 20 (an example of a "metal layer" in the present disclosure) is formed on the plate portion 11P by plating. The plating layer 20 includes an electroless plating layer 21 and an electrolytic plating layer 22. The electroless plating layer 21 is exemplified by metals such as nickel, copper, cobalt, and alloys thereof in the case of electroless plating with autocatalysis, and by gold, silver, tin, solder, and the like in the case of electroless plating without autocatalysis. In this embodiment, the electroless plating layer 21 is a plating film formed by electroless nickel plating. The electroless plating layer 21 is also formed on the front surface 11PF and the back surface 11PB, and on the inner walls of the through holes 111. The electrolytic plating layer 22 is exemplified by metals such as copper, zinc, chromium, nickel, and gold, and in this embodiment, the electrolytic plating layer 22 is a nickel plating film formed by nickel. The electrolytic plating layer 22 is formed on the front surface 11PF and the back surface 11PB outside the electroless plating layer 21 as viewed from the plate portion 11P. Furthermore, the electrolytic plating layer 22 fills the inner wall of the through hole 111 outside the electroless plating layer 21 as viewed from the plate portion 11P so as to close the through hole 111.

[0019] In the plating layer 20, a black plating layer or the like may be formed on the outer side of the electrolytic plating layer 22 as viewed from the plate portion 11P in order to protect the electrolytic plating layer 22 and improve the emissivity. In this case, the black plating layer is exemplified by electroless black nickel plating, electrolytic black nickel plating, etc. Also, the plating layer 20 may be formed on the entire housing 11, which helps dissipate heat from the internal space 11S.

[0020] The electrolytic plating layer 22 formed on the plate portion 11P is formed to a thickness d2. In this embodiment, the electrolytic plating layer 22 is formed so that the thickness d2 is about 30 μm. At this time, even if the electrolytic plating layer 22 having the thickness d2 is formed on the plate portion 11P, it is not possible to fill the through holes 111 so as to close them. However, in the electrolytic plating process described below, the through holes 111 are filled with the electrolytic plating layer 22.

[0021] As described above, the electrolytic plating layer 22 is filled so as to block the through-holes 111. As a result, the front surface 11PF and the back surface 11PB of the plate portion 11P are thermally connected by the electrolytic plating layer 22. Also, the heat dissipation surface 131 and the electrolytic plating layer 22 formed on the back surface 11PB are thermally connected by the thermal conductive grease 14 (an example of a "heat dissipator" in this disclosure). That is, the processor 13 is in contact with the thermal conductive grease 14, and the thermal conductive grease 14 is in contact with the through-holes 111 filled with the electrolytic plating layer 22. As a result, the heat generated by the processor 13 is transferred quickly from the back surface 11PB side to the front surface 11PF side through the thermal conductive grease 14, the plating layer 20, and the plate portion 11P in the direction along the central axis C, and the heat dissipation can be improved even in a resin housing. Therefore, it can be said that the electrolytic plating layer 22 filled in the through-holes 111 is a metal for dissipating heat of the processor 13. However, the thermally conductive grease 14 that thermally connects the heat dissipation surface 131 and the electrolytic plating layer 22 is just one example, and other embodiments may also be used, such as a thermally conductive sheet, or the heat dissipation surface 131 and the electrolytic plating layer 22 being in direct contact with each other.

[0022] When multiple electronic components are arranged on the substrate 12, it is preferable that a through hole 111 is formed directly above each of the multiple electronic components arranged on the substrate 12. It is also preferable that each electronic component and the electrolytic plating layer 22 are thermally connected by a heat sink at a position corresponding to each through hole 111.

[0023] In addition, although the present embodiment shows an aspect in which one through hole 111 is formed for each electronic component 13, a plurality of through holes 111 may be formed on the heat dissipation surface 131. This allows heat dissipation from the heat dissipation surface 131 to be transferred to the surface 11PF more efficiently. Furthermore, the through holes 111 may be formed not only directly above the processor 13, but also directly below the processor 13, that is, in the plate portion on the opposite side of the processor 13 across the board 12. In this case, the heat generated by the processor 13 that moves to the opposite side through the board 12 is dissipated by the through holes 111 formed in the plate portion on the opposite side of the processor 13 across the board 12.

[0024] In addition, in the present embodiment, the plated layer 20 is formed on both the front surface 11PF and the back surface 11PB of the plate portion 11P, but the plated layer 20 may be formed on only one surface of the plate portion 11P. In other words, the plated layer 20 may be formed on at least one surface of the front surface 11PF or the back surface 11PB. In this way, the amount of metal used can be reduced, which helps reduce costs.

[0025] However, the embodiment of the electronic device 10 is merely an example, and the electronic device 10 may be, for example, an electronic device such as a personal computer or a mobile terminal. The heat dissipation structure 1 in the present embodiment may be used for dissipating heat from a heat-generating component (heat source) other than an electronic device, such as an engine or a motor. More specifically, the electronic component may be replaced with the heat-generating component exemplified above, and the heat dissipation structure 1 may be used for dissipating heat from the heat-generating component.

[0026] <First Modification of the Embodiment> Fig. 3 is a cross-sectional view of the housing 11A after plating according to the first modification of the embodiment, as viewed from a cross section along the central axis C of the through hole 111A. Hereinafter, the housing 11A according to the first modification of the embodiment will be described with reference to Fig. 3. Note that the description of this modification will focus on the differences from the housing 11 described in Fig. 2. Also, among the members constituting the housing 11A, members common to the housing 11 will be given the same reference numerals and detailed description will be omitted.

[0027] A through hole 111A is formed in a plate portion 11AP of the housing 11A. The through hole 111A is centered on a central axis C, and has a cross-sectional shape along the central axis C that is approximately an hourglass shape (the upper and lower portions of the through hole 111A are The through hole 111A is formed in a line-symmetric shape so that the center in the axial direction is a constricted shape. More specifically, the through hole 111A is shaped so that the diameter decreases toward the center in the axial direction. As a result, the plate portion 11AP has a corner portion 11AE protruding radially inward of the through hole 111A near the center in the vertical direction of the inner wall portion of the through hole 111A. This makes it easy to create a mold used to butt the upper and lower sides of the plate portion 11AP when molding resin, and to remove the mold. Also, in the electrolytic plating process described later, the through hole 111A can be easily filled with the electrolytic plating layer 22.

[0028] <Modification 2 of the embodiment> FIG. 4 is a cross-sectional view of the housing 11 according to the second modification of the embodiment before plating, as viewed from a cross section along the central axis C of the through hole 111. FIG. 5 is a cross-sectional view of the housing 11 according to the second modification of the embodiment after plating, as viewed from a cross section along the central axis C of the through hole 111. Hereinafter, the housing 11 according to the second modification of the embodiment will be described with reference to FIGS. 4 and 5. Note that in the description of this modification, differences from the embodiment will be mainly described. Also, among the members described in the embodiment, the members common to the second modification of the embodiment will be denoted by the same reference numerals, and detailed description thereof will be omitted.

[0029] 4, prior to the electroless plating step described below, masking tape 30 is applied to locations where electroless plating layer 21 is not to be formed. In this embodiment, masking tape 30 is applied to surface 11PF, and masking tape 30 is disposed around and along the opening of through hole 111. This allows a large current to flow locally at the interface of masking tape 30 in the electrolytic plating step described below, facilitating the formation of electrolytic plating layer 22 so as to easily fill through hole 111.

[0030] As shown in FIG. 5, after the electrolytic plating process described later, a non-plated area 23 (an example of a "non-metallic part" in the present disclosure) is formed on the surface 11PF of the plate part 11P. The position of the non-plated area 23 coincides with the position of the masking tape 30 attached before the electrolytic plating process, and is formed by peeling off the masking tape 30 after the electrolytic plating process. In addition, since the resin surface of the surface 11PF is exposed to the atmosphere in the non-plated area 23, the emissivity can be improved. This is because the emissivity of the resin surface is about 0.9, whereas the emissivity of the metal-plated surface remains at about 0.2 to 0.7. Therefore, when the plating layer 20 is formed on the entire surface of the plate part 11P, the emissivity to the atmosphere may decrease compared to when the resin surface of the housing 11 is exposed to the atmosphere. In addition, in order to improve the emissivity of the metal-plated surface, it is necessary to form a metal plating using an expensive metal. Therefore, by forming unplated area 23 in the vicinity of the opening of through hole 111 and exposing the resin surface of surface 11PF to the atmosphere, the heat dissipation performance of housing 11 can be improved inexpensively by using radiation.

[0031] In this embodiment, the unplated region 23 is formed using masking tape 30, but the method of forming the unplated region 23 is not limited to this, and for example, the unplated region 23 may be formed by applying an insulating paint or the like. In addition, regarding the position of the unplated region 23, in order to improve the emissivity of the plate portion 11P, the unplated region 23 may be disposed at any position on the surface 11PF other than the vicinity of the opening.

[0032] [Manufacturing method] Next, a method for manufacturing the housing 11 and the housing 11A according to each embodiment and a method for assembling the electronic device 10 using the housing 11 and the housing 11A will be described. However, the method for manufacturing the housing 11 and the housing 11A according to each embodiment and the method for assembling the electronic device 10 using the housing 11 and the housing 11A are not limited to the following methods. Below, the description will be given based on the flowchart in FIG. 6 with reference to the embodiment, the first modified example of the embodiment, and the second modified example of the embodiment. do.

[0033] In the hole making process of step S1, holes are made in the plate portion 11P of the housing 11. In this step, in the embodiment and the modified example 2 of the embodiment, the through hole 111 is formed by pouring resin into a mold capable of forming the through hole 111 when molding the housing 11, or by preparing a housing 11 without the through hole 111 and making a hole with a pin or the like at a position where the through hole 111 is to be formed in the plate portion 11P. In the modified example 1 of the embodiment, the through hole 111A and the corner portion 11AE are formed by pressing a mold against the plate portion 11AP from the upper and lower sides to form the through hole 111A. This makes it possible to easily remove the through hole 111A while preventing molding defects.

[0034] In the degreasing step of step S2, the housing 11 is degreased. This removes oil and the like that has adhered during processing such as step S1. In the etching step of step S3, the surface of the housing 11 is chemically sparsely formed by selectively dissolving butadiene, and etching is performed to form anchor holes in the housing 11. In the catalyst application step of step S4, a catalyst such as iron, nickel, or palladium is applied to the anchor holes formed in the housing 11 by etching in step S3 using a catalyst accelerator method, thereby preparing to promote the reaction in step S5.

[0035] Step S5 is an electroless plating process, in which an electroless plating layer 21 is formed on the plate portion 11P or the plate portion 11AP by plating. The electroless plating process is exemplified by chemical reduction plating, in which plating is precipitated by a chemical reaction using a chemical reducing agent in a plating solution to form a plating layer. More specifically, in the case of nickel (Ni) plating, which is an example of chemical reduction plating, hypophosphite (H2PO2 - ) is used as a reducing agent. The reducing agent is oxidized by the catalyst added in step S4 to phosphorous acid (H2PO3 - ) and electrons are released (1), which causes nickel ions (Ni 2+ ) precipitates (2). These reactions can be expressed as follows: (1)H2PO2 - →H2PO3 - +2e - (2) Ni 2+ +2e - →Ni In addition, the nickel ions become a catalyst for the oxidation of hypophosphite, so that nickel is precipitated one after another, forming an electroless plating layer 21 of nickel. This allows the electroless plating layer 21 to be uniformly formed on the plate portion 11P. In addition, in the second modification of the embodiment, before step S5, a masking process is performed around the through hole 111A on the surface 11PF of the plate portion 11P so that a plating layer is not formed around the opening of the through hole 111A. Specifically, a masking process is performed by attaching a masking tape 30 to the vicinity of the through hole 111. At this time, the attachment position of the masking tape 30 may be appropriately changed, and this allows the degree of formation of the electrolytic plating layer 22 in step S6 to be controlled.

[0036] Step S6 is an electrolytic plating step, in which electrolytic plating layer 22 is formed on the outside of electroless plating layer 21 by plating. In the electrolytic plating step, a positive electrode and a negative electrode connected to a DC power source and a plating solution in which the positive electrode and the negative electrode are immersed are used. In the plating solution, a metal that is to be plated is connected to the positive electrode, and plate portion 11P is connected to the negative electrode. In this case, for example, if the metal that is to be plated is nickel (Ni), and electricity is applied from the DC power source in this state, the nickel at the positive electrode separates from electrons in the plating solution to become metal ions (Ni 2+ ) and dissolves in the plating solution (1). Metal ions in the plating solution move to the negative electrode, and these metal ions receive electrons flowing from the DC power source to the electroless plating layer 21 formed on the plate portion 11P. The ions that have received the electrons return to metal, so that an electrolytic plating layer 22 is formed on the outside of the electroless plating layer 21 (2). These reactions can be expressed by the following formula: (1) Ni → Ni 2+ +2e - (2) Ni 2+ +2e - →Ni Here, electrolytic plating has a feature that the thickness of the film changes depending on the strength of the current. Using this feature, the through hole 111 or the through hole 111A is filled so as to be blocked by the electrolytic plating layer 22. More specifically, in the embodiment, the current flows concentrating on the edge of the through hole 111 formed on the front surface 11PF and the back surface 11PB, so that the electrolytic plating layer 22 is formed thickly on the through hole 111. In the first modification of the embodiment, the current flows concentrating on the corner 11AE of the plate portion 11AP, so that the electrolytic plating layer 22 is formed thickly on the through hole 111A. In the second modification of the embodiment, the current flows concentrating on the interface between the plate portion 11P and the masking tape 30 at the location where the masking tape 30 is arranged, so that the electrolytic plating layer 22 is formed thickly on the through hole 111. In this way, the electrolytic plating layer 22 can be filled in the through hole 111 or the through hole 111A.

[0037] In step S6, when filling through holes 111 and through holes 111A so as to close them with electrolytic plating layer 22, for example, a process of passing a strong current may be added as a separate process from the process of forming electrolytic plating layer 22 on the outside of electroless plating layer 21, thereby forming a thick electrolytic plating layer 22 in through holes 111 and through holes 111A. Alternatively, for example, in order to close through holes 111, a method such as embedding another metal part may be used to close through holes 111 through a process other than a plating process.

[0038] Step S7 is an assembly process, in which the board 12 on which the processor 13 is mounted is stored inside the housing 11 and the housing 11A on which the plating layer 20 is formed by plating. In the processes from step S1 to step S6, the through-hole 111 is filled with metal by a plating process or the like, and the plating layer 20 is formed on the plate portion 11P, so that the housing 11 is prepared to have a metal layer. In step S7, first, the heat dissipation surface 131 of the processor 13 is coated with the thermal conductive grease 14. Next, the board 12 is stored in the housing 11 so that the thermal conductive grease 14 contacts the electrolytic plating layer 22 formed on the plate portion 11P. At this time, by assembling so that the processor 13 is located directly below the through-hole 111, the processor 13 and the metal filled in the through-hole 111 come into contact with each other via the thermal conductive grease 14.

[0039] Furthermore, by inserting a water washing step between each of steps S1 to S6, the plating layer 20 can be formed smoothly.

[0040] [Effects] Generally, the thermal conductivity of resin is about 0.3 W / mK. In contrast, the thermal conductivity of copper is about 400 W / mK. In each embodiment of the present disclosure, when the electrolytic plating layer 22 is formed by copper plating, the through holes 111 are filled with the electrolytic plating layer 22, so that the transfer of heat from the back surface 11PB side to the front surface 11PF side of the plate portion 11P is performed by the electrolytic plating layer 22, which has a higher thermal conductivity than the material of the plate portion 11P. In this way, by forming the electrolytic plating layer 22 having a higher thermal conductivity than the resin, the heat transfer performance to the front surface 11PF of the plate portion 11P, that is, the surface of the housing 11, can be improved.

[0041] In plate portion 11P or plate portion 11AP, plating layer 20 has a two-layer structure consisting of an electroless plating layer 21 and an electrolytic plating layer 22, which makes it possible to reflect and attenuate noise emitted by substrate 12 placed in internal space 11S, processor 13 placed on substrate 12, and other electronic components placed in internal space 11S.

[0042] In each embodiment, the housing 11 is formed in a substantially box shape. Therefore, by forming the plating layer 20 not only on the plate portion 11P but also on the entire housing 11, the contact surface with the atmosphere can be made large, so that the heat dissipation surface of the housing 11 can be made large, and the heat dissipation performance can be improved.

[0043] Although the embodiments according to the present disclosure have been described above, each aspect disclosed in this specification can be combined with any other feature disclosed in this specification. [Explanation of symbols]

[0044] 1: Heat dissipation structure 10:Electronic equipment 11, 11A: Housing 12: Substrate 20: Plating layer d1: diameter of through hole d2: Film thickness of electrolytic plating layer

Claims

1. A substrate on which electronic components are mounted; a heat sink in contact with the electronic component; a resin housing having a through hole filled with a metal in contact with the heat sink and a metal layer on an outer surface; Electronic equipment equipped with

2. In a cross section taken along the central axis of the through hole, The cross-sectional shape of the through hole is formed into an hourglass shape.

2. The electronic device according to claim 1.

3. Of the outer surface, On a surface opposite to the surface facing the electronic component, A non-metallic portion having an exposed resin surface is provided around the opening of the through hole.

3. The electronic device according to claim 1 or 2.

4. the electronic component has a heat dissipation surface facing the outer surface, In a plan view seen along a central axis of the through hole, at least a portion of the heat dissipation surface and at least a portion of the through hole are formed to overlap with each other.

3. The electronic device according to claim 1 or 2.

5. The housing is formed into a roughly box shape.

3. The electronic device according to claim 1 or 2.

6. forming a through hole having a corner on an inner wall of a resin housing; forming a metal layer on an outer surface of the resin housing by plating and filling the through hole with metal; Plastic housing manufacturing method.

7. Prior to the plating process, a masking process is performed on the outer surface opposite to the surface facing the electronic component, around the opening of the through hole. The method for manufacturing a plastic housing according to claim 6.

8. A housing for storing a substrate on which electronic components are mounted, A resin housing having a metal layer on an outer surface thereof, The resin housing has a through hole filled with a metal for dissipating heat of the electronic component. Housing.

9. preparing a resin housing having a through hole filled with metal and a metal layer on an outer surface; an assembling step of storing the substrate on which the electronic components are mounted inside the resin housing such that the electronic components and the metal filled in the through holes are in contact with each other via a heat sink; An electronic device manufacturing method comprising:

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