Temperature measurement device, temperature adjustment device, electronic component handling device, and electronic component testing device

Abstract

To provide a temperature measurement device which improves sensing response of a temperature sensor.SOLUTION: A temperature measurement device 8 for measuring a temperature of a DUT 300, comprises: a first heat transfer member 73 to be thermally connected to the DUT 300; and a temperature sensor 812 in contact with the first heat transfer member 73. The first heat transfer member 73 is a sheet-like member extending in a horizontal direction.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a temperature measuring device, a temperature adjusting device, an electronic device handling device, and an electronic device testing device. [Background technology]

[0002] A pusher equipped with a temperature regulator consisting of a heater and a cooler for controlling the temperature of an IC device is known (see, for example, Patent Document 1). This pusher is also provided with a temperature sensor, and the operation of the heater and cooler is controlled based on the measurement results of the temperature sensor to maintain the IC device at a predetermined temperature. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2009 / 057203 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned conventional pusher, if the heater and cooler are far from the IC device, the temperature adjustment performance is degraded. On the other hand, if the temperature regulator is placed as close as possible to the IC device, the temperature sensor cannot be placed between the temperature regulator and the IC device, which causes a problem that the sensing response of the temperature sensor is degraded.

[0005] An object of the present invention is to provide a temperature measuring device, a temperature adjusting device, an electronic device handling device, and an electronic device testing device that can improve the sensing response of a temperature sensor. [Means for solving the problem]

[0006] [1] A first aspect of the present invention is a temperature measuring device for measuring the temperature of a DUT or a DUT housed in a carrier, comprising a first heat transfer member thermally connected to the DUT or the carrier, and a temperature sensor in contact with the first heat transfer member, wherein the first heat transfer member is a sheet-like member extending along a first direction.

[0007] [2] A second aspect of the present invention is the temperature measurement device of the first aspect, further comprising a first biasing member biasing the temperature sensor toward the first heat transfer member, the first biasing member biasing the temperature sensor along a direction substantially perpendicular to the first direction.

[0008] [3] A third aspect of the present invention may be a temperature measuring device according to the first or second aspect, wherein the first heat transfer member is a sheet-like member that preferentially diffuses heat transferred from the DUT or the carrier in the first direction.

[0009] [4] A fourth aspect of the present invention may be the temperature measuring device of any one of the first to third aspects, wherein the first heat transfer member is a graphite sheet.

[0010] [5] A fifth aspect of the present invention may be a temperature measuring device in which, in any one of the first to fourth aspects, the temperature sensor is arranged on the opposite side of the first heat transfer member from the DUT or the carrier.

[0011] [6] A sixth aspect of the present invention may be a temperature measuring device according to any one of the first to fifth aspects, wherein the first direction is substantially parallel to an extending direction of a main surface of the DUT or the carrier.

[0012] [7] A seventh aspect of the present invention may be the temperature measuring device of any one of the first to sixth aspects, wherein the temperature measuring device includes a heat insulating member that covers the temperature sensor.

[0013] [8] An eighth aspect of the present invention may be the temperature measuring device of the seventh aspect, wherein the insulating member is made of a porous material.

[0014] [9] A ninth aspect of the present invention may be a temperature measuring device according to the seventh or eighth aspect, wherein the insulating member is made of an elastic material, the temperature measuring device includes a pressing member that presses the insulating member toward the first heat transfer member, the insulating member is sandwiched between the pressing member and the first heat transfer member, and the insulating member urges the temperature sensor toward the first heat transfer member.

[0015]

[10] A tenth aspect of the present invention is a temperature adjustment device that adjusts the temperature of a DUT or a DUT housed in a carrier, the temperature adjustment device being equipped with a temperature measurement device of any of aspects 1 to 9.

[0016]

[11] An eleventh aspect of the present invention may be a temperature adjustment device according to the tenth aspect, wherein the temperature adjustment device includes a heater unit which is a heat source, and the heater unit includes a planar heater and the first heat transfer member arranged on one main surface of the planar heater.

[0017]

[12] A twelfth aspect of the present invention is a temperature adjustment device according to the eleventh aspect, wherein the first heat transfer member has an exposed portion exposed from the planar heater, and the temperature sensor is in contact with the exposed portion.

[0018]

[13] A thirteenth aspect of the present invention may be a temperature adjustment device according to the eleventh or twelfth aspect, wherein the first heat transfer member is positioned closer to the DUT or the carrier than the planar heater.

[0019]

[14] A fourteenth aspect of the present invention may be the temperature adjustment device of any one of the eleventh to thirteenth aspects, wherein the temperature sensor is disposed away from the planar heater.

[0020]

[15] A fifteenth aspect of the present invention may be a temperature adjustment device according to any one of the eleventh to fourteenth aspects, wherein the heater unit includes a second heat transfer member disposed on the other main surface of the planar heater.

[0021]

[16] A sixteenth aspect of the present invention may be a temperature adjustment device according to the fifteenth aspect, wherein the second heat transfer member is a sheet-like member that preferentially diffuses heat transferred from the DUT or the carrier in the first direction.

[0022]

[17] A seventeenth aspect of the present invention may be the temperature adjustment device of either of the fifteenth or sixteenth aspects, wherein the second heat transfer member is a graphite sheet.

[0023]

[18] An eighteenth aspect of the present invention may be a temperature adjustment device according to any one of aspects fifteen to seventeen, wherein the first heat transfer member has an exposed portion exposed from the planar heater and the second heat transfer member, and the temperature sensor is in contact with the exposed portion.

[0024]

[19] A nineteenth aspect of the present invention is a temperature control device according to any one of aspects 11 to 18, wherein the sheet heater includes a first resin layer, a second resin layer laminated on the first resin layer, and metal wiring interposed between the first and second resin layers.

[0025]

[20] A twentieth aspect of the present invention may be the temperature adjustment device of any one of the eleventh to nineteenth aspects, wherein the sheet heater is a polyimide heater.

[0026]

[21] A twenty-first aspect of the present invention may be the temperature adjustment device of any one of the eleventh to twentieth aspects, wherein the heater unit is a sheet-like laminate having a thickness of 400 μm or less.

[0027]

[22] Aspect 22 of the present invention may be a temperature adjustment device according to any one of aspects 11 to 21, further comprising a cooler unit which is a cooling source and is in contact with the heater unit, the cooler unit having a flow path through which a refrigerant passes, the cooler unit comprising a nozzle member having an outlet for spraying the refrigerant, and a cold plate facing the outlet and positioned at a distance from the outlet, against which the refrigerant is sprayed from the nozzle member, the flow path including an air gap formed between the nozzle member and the cold plate, and the refrigerant sprayed from the outlet passes through the air gap after reaching the cold plate.

[0028]

[23] Aspect 23 of the present invention is a temperature adjustment device according to aspect 22, wherein the heater unit is arranged on the other main surface of the planar heater and comprises a second heat transfer member in contact with the cold plate, the planar heater has a resistive heating element and comprises a planar heating portion in contact with the second heat transfer member from the side opposite the cold plate, and a draw-out portion having draw-out wiring connecting to the resistive heating element and extending from the heating portion, and the flow path may be a temperature adjustment device comprising a passage connected to the air gap and for passing the refrigerant along the draw-out portion.

[0029]

[24] Aspect 24 of the present invention may be a temperature adjustment device of aspect 22 or 23, wherein the heater unit includes a second heat transfer member arranged on the other main surface of the planar heater, the cold plate is in contact with the second heat transfer member, the first heat transfer member includes the planar heater, the second heat transfer member, and an exposed portion exposed from the cold plate, and the temperature sensor is in contact with the exposed portion.

[0030]

[25] A twenty-fifth aspect of the present invention may be a temperature adjustment device according to any one of aspects twenty-two to twenty-four, wherein the cold plate has a first opposing surface opposing the nozzle member, the nozzle member has a second opposing surface opposing the cold plate, the air gap is formed between the first opposing surface and the second opposing surface, and the first and second opposing surfaces are both flat surfaces.

[0031]

[26] A twenty-sixth aspect of the present invention may be the temperature adjustment device of any one of the twenty-second to twenty-fifth aspects, wherein the thickness of the air gap is 1 mm or less.

[0032]

[27] Aspect 27 of the present invention is an electronic device handling device for handling a DUT or a carrier housing the DUT, the electronic device handling device comprising a pressing device for pressing the DUT or the carrier toward the socket to electrically connect the DUT and the socket, the pressing device comprising a temperature adjustment device of any of aspects 7 to 26 and a contact plate in contact with the DUT or the carrier, the contact plate being interposed between the first heat transfer member of the temperature adjustment device and the DUT or between the first heat transfer member and the carrier, and the temperature sensor being in contact with a second main surface of the first heat transfer member opposite to the first main surface in contact with the contact plate.

[0033]

[28] A twenty-eighth aspect of the present invention is an electronic device testing apparatus for testing a DUT, the electronic device testing apparatus comprising the electronic device handling apparatus of the twenty-seventh aspect and a tester having a socket. Effect of the Invention

[0034] According to the present invention, even if a structure is adopted in which the temperature adjustment device is close to the DUT, the temperature sensor can sense the temperature of the DUT or the carrier through the first heat transfer member, thereby enabling faster sensing. [Brief description of the drawings]

[0035] [Figure 1] FIG. 1 is a block diagram showing an example of the configuration of an electronic device test apparatus according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view showing a state of a pusher before sucking and holding a DUT in the embodiment of the present invention. [Diagram 3] FIG. 3 is a cross-sectional view showing a state of the pusher after sucking and holding the DUT in the embodiment of the present invention. [Figure 4] FIG. 4 is an enlarged cross-sectional view of the contact plate and the temperature adjustment device in the embodiment of the present invention, and is an enlarged view of a portion IV in FIG. [Diagram 5] FIG. 5 is an enlarged cross-sectional view of the sheet heater. [Figure 6] FIG. 6 is a development view of an example of a heater unit according to an embodiment of the present invention, seen from below. [Figure 7] FIG. 7 is a perspective view of an example of a nozzle member in an embodiment of the present invention, as viewed from below. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0036] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a block diagram showing an example of the configuration of an electronic device test apparatus 100 in this embodiment. Fig. 2 is a cross-sectional view showing a state of a pusher 6 before sucking and holding a DUT 300 in this embodiment. Fig. 3 is a cross-sectional view showing a state of a pusher 6 after sucking and holding a DUT 300 in this embodiment.

[0037] As shown in Fig. 1, the electronic device test apparatus 100 in this embodiment is an apparatus for testing electrical characteristics of a DUT 300. Specific examples of the DUT 300 to be tested include a SoC (System on a chip), a logic device, or a memory device. As shown in Fig. 2, the DUT 300 in this embodiment includes a substrate 301, an IC chip 302, a temperature detection circuit 303, a molded resin 304, and a plurality of terminals 305.

[0038] In this DUT 300, an IC chip 302 and a temperature detection circuit 303 are mounted on the upper surface of a substrate 301, and the IC chip 302 and the temperature detection circuit 303 are covered with a molded resin 304. Furthermore, terminals 305 electrically connected to the IC chip 302 and the temperature detection circuit 303 are provided on the lower surface of the substrate 301, and these terminals 305 come into contact with and are electrically connected to a socket 2 described below. Note that, in this embodiment, the temperature detection circuit 303 is described as an electronic component separate from the IC chip 302, but this is not limiting, and the temperature detection circuit 303 may be included in the IC chip 302.

[0039] As shown in FIG. 1, the electronic device test apparatus 100 includes a tester 1 that tests a DUT 300, a socket 2 that electrically connects the DUT 300 and the tester 1, and a handler 3 that carries the DUT 300 and presses it against the socket 2.

[0040] The tester 1 includes a mainframe 11 and a test head 12. The mainframe 11 is connected to the test head 12 via a cable 13. The mainframe 11 tests the DUT 300 by sending a test signal to the DUT 300 via the test head 12, and evaluates the DUT 300 according to the test results. The test head 12 is connected to the mainframe 11 via the cable 13, and sends the test signal sent from the mainframe 11 to the DUT 300 when testing the DUT 300.

[0041] As shown in FIG. 3, the test head 12 is electrically connected to the DUT 300 via the socket 2. The socket 2 includes a socket body 21 and a contact 22. The socket body 21 is fixed to the upper surface of the test head 12. The contact 22 is disposed on the socket body 21. Although not shown in the figure, the contact 22 is electrically connected to a load board or the like disposed on the upper surface of the test head 12, and is also electrically connected to the DUT 300 by contacting a terminal 305 of the DUT 300. In this embodiment, a pogo pin is used as the contact 22, but something other than a pogo pin may be used as the contact 22. For example, a cantilever-type probe needle, an anisotropic conductive rubber sheet, or a membrane-type contact in which bumps are formed on an insulating film may be used.

[0042] 1, the DUT 300 is pressed against the socket 2 by the handler 3. The handler 3 includes a thermostatic chamber 4, a contact arm 5, a pusher 6, and a coolant supply unit 9. The handler 3 corresponds to an example of an "electronic device handling device" in an aspect of the present invention, and the contact arm 5 and the pusher 6 correspond to an example of a "pressing device" in an aspect of the present invention.

[0043] The thermostatic chamber 4 can adjust the temperature of the atmosphere inside to a desired temperature, and can apply a high or low temperature to the DUT 300. The thermostatic chamber 4 can adjust the temperature, for example, within a range of −55° C. to +155° C., although not particularly limited thereto. The thermostatic chamber 4 houses a contact arm 5 and a pusher 6. Furthermore, the thermostatic chamber 4 houses the socket 2 through an opening formed in the bottom of the thermostatic chamber 4. The handler 3 does not necessarily have to include the thermostatic chamber 4.

[0044] The contact arm 5 is supported by a rail (not shown) provided on the handler 3. The contact arm 5 is equipped with an actuator (not shown) for horizontal movement, and can move back and forth and left and right along the rail. The contact arm 5 is also equipped with an actuator (not shown) for vertical drive, and can move in the vertical direction.

[0045] A pusher 6 is disposed at the lower end of the contact arm 5. As shown in Fig. 2, the pusher 6 includes a pusher body 61, a contact plate 62, a holding portion 65, a vertical guide 69, a temperature adjustment device 7, and a temperature measurement device 8.

[0046] 2, the pusher body 61 in this embodiment has a plurality of (two in this example) first suction holes 611 and a first refrigerant supply hole 612. The first suction hole 611 is a through hole that opens on the lower surface of the pusher body 61, and the opening is connected to a second suction hole 67 (described later) of the holding part 65. The first suction hole 611 is connected to a vacuum pump (not shown), and the inside of the first suction hole 611 is made negative pressure by the vacuum pump.

[0047] The first refrigerant supply hole 612 is also a through hole that opens on the lower surface of the pusher body 61, and is connected to a through hole 781 (described later) of a nozzle member 78 (described later). A refrigerant is supplied to this first refrigerant supply hole 612 from a refrigerant supply source 200 provided outside the handler 3. Note that the dashed arrows in Figs. 2 to 4 indicate the flow of the refrigerant. Also, the first suction hole 611 and the first refrigerant supply hole 612 may be provided in a portion other than the pusher body 61.

[0048] As shown in Fig. 2, the contact plate 62 is a plate having a convex shape bent so as to protrude downward. As shown in Fig. 3, the contact plate 62 is a member that comes into direct contact with the DUT 300 when the pusher 6 holds the DUT 300. The contact plate 62 is in contact with the temperature adjustment device 7 and is fixed to the holding part 65 in a state in which the contact plate 62 presses the temperature adjustment device 7 toward the pusher body 61. In this way, the contact plate 62 presses the temperature adjustment device 7, so that the temperature adjustment device 7 can heat or cool the DUT 300 at high speed via the contact plate 62.

[0049] The contact plate 62 may be made of a metal having an insulating film formed on its surface. Specifically, for example, aluminum having an anodized film on its surface may be used. In order to transmit heat from the temperature adjustment device 7 to the DUT 300, the contact plate 62 is preferably made of a metal material having high thermal conductivity. Furthermore, by using a metal having an insulating film formed on its surface, it is possible to shield the DUT 300 from electromagnetic noise generated by the pusher 6 and to electrically insulate the pusher 6 from the DUT 300. Although not shown, the contact plate 62 may be electrically connected to ground to prevent electrostatic discharge (ESD).

[0050] The contact plate 62 has a contact portion 621 and a fixing portion 622. The contact portion 621 extends along a direction substantially parallel to the DUT 300. The contact portion 621 has a contact surface 621a that comes into contact with the DUT 300. In this embodiment, the contact surface 621a is the lower surface of the contact portion 621, and as shown in FIG. 3, when the pusher 6 holds the DUT 300, the contact surface 621a comes into contact with and presses the DUT 300. The temperature adjustment device 7 applies heat to the DUT 300 via the contact surface 621a. As shown in FIG. 4, the thickness T 1 is not particularly limited, but may be 500 μm to 550 μm (500 μm≦T1 ≦550μm).

[0051] 2, the fixed portion 622 is provided on the outer side of the contact portion 621. In this embodiment, the fixed portion 622 is formed integrally with the contact portion 621. The fixed portion 622 can be formed, for example, by bending the outer periphery of the plate-shaped contact plate 62 toward the pusher body 61. Note that the fixed portion 622 may be a separate member from the contact portion 621.

[0052] The fixing portion 622 is fixed to the holding portion 65 by a screw 63. The screw 63 fastens the fixing portion 622 and the holding portion 65. Since the contact plate 62 is fixed to the holding portion 65 by the screw 63 at the fixing portion 622 connected to the contact portion 621 in a stepped shape, the contact plate 62 presses a heater unit 71 (described later) of the temperature adjustment device 7 toward the pusher body 61.

[0053] By fixing the contact plate 62 with the screws 63 as in this embodiment, the contact plate 62 can be pressed against the temperature adjustment device 7 by a substantially constant axial force of the screws 63. Furthermore, the axial force of the screws 63 can be easily adjusted by the dimensions, fastening torque, etc. of the screws 63. In this way, since the contact plate 62 can be pressed against the temperature adjustment device 7 with a substantially constant pressing force, the stability of the temperature adjustment of the DUT 300 by the temperature adjustment device 7 can be improved.

[0054] Moreover, the fixing portion 622 in this embodiment is disposed closer to the pusher body 61 than the contact portion 621. This makes it possible to prevent interference between the screw 63 provided in the fixing portion 622 and the DUT 300 when the pusher 6 holds the DUT 300, as shown in FIG.

[0055] 2 and 3, a holding portion 65 is provided on the outer side of the contact plate 62. In this embodiment, the holding portion 65 is fixed to the lower surface of the pusher body. Although not particularly shown, the holding portion 65 can be fixed to the pusher body 61 by a fastener such as a screw.

[0056] The holding portion 65 in this embodiment has a second suction hole 67 and a suction pad 68. The second suction hole 67 penetrates the holding portion 65. The upper end of this second suction hole 67 is connected to the first suction hole 611 of the pusher body 61. The second suction hole 67 is connected to a vacuum pump (not shown) via the first suction hole 611, so that the inside of the second suction hole 67 is under negative pressure.

[0057] A suction pad 68 is provided at the lower end of the second suction hole 67. As shown in Fig. 3, this suction pad 68 comes into contact with the DUT 300 to form a space surrounded by the suction pad 68 and the DUT 300. Since this space is connected to the second suction hole 67, the DUT 300 can be sucked and held on the lower end surface of the holding part 65.

[0058] 2 and 3, a temperature adjustment device 7 is disposed inside the holding portion 65. The temperature adjustment device 7 adjusts the temperature of the DUT 300 via the contact plate 62.

[0059] Fig. 4 is an enlarged cross-sectional view of the contact plate 62 and the temperature adjustment device 7 in this embodiment. Fig. 5 is an enlarged cross-sectional view of the sheet heater. Fig. 6 is a planar development view showing an example of the configuration of the heater unit in the embodiment of the present invention.

[0060] As shown in Fig. 4, the temperature adjustment device 7 includes a heater unit 71 which is a heating source, and a cooler unit 75 which is a cooling source. The heater unit 71 is disposed on the contact portion 621 of the contact plate 62. The heater unit 71 is a sheet-like laminated body in which a planar heater 72, a first heat transfer member 73, and a second heat transfer member 74 are laminated. The thickness T 2is not particularly limited, but is 400 μm or less (T 2 ≦400μm).

[0061] The sheet heater 72 has a planar shape (sheet shape). Since the sheet heater 72 is thin, the heat capacity of the sheet heater 72 is smaller than that of a ceramic heater or the like. This makes it possible to improve the temperature rise speed of the temperature adjustment device 7, thereby improving the responsiveness.

[0062] The thickness T of the sheet heater 72 shown in FIG. 3 is not particularly limited, but can be set to 100 μm to 150 μm (100 μm≦T 3 ≦150 μm). As the sheet heater 72, for example, a resin film heater such as a polyimide heater or a polyester heater can be used. In particular, it is preferable to use a polyimide heater as the sheet heater 72. Among heaters using resin, a polyimide heater has excellent heat resistance. Furthermore, a polyimide heater is less expensive than a ceramic heater or the like, and therefore costs can be reduced.

[0063] As shown in FIG. 5 and FIG. 6, the sheet heater 72 has a resin layer 721, a metal wiring 724, and a terminal 725. The resin layer 721 is a sheet-like layer. As shown in FIG. 5, the resin layer 721 includes a first resin layer 722 and a second resin layer 723 laminated on the first resin layer 722. The first resin layer 722 and the second resin layer 723 are, but are not limited to, resin films and are bonded to each other via an adhesive (not shown). The first and second resin layers 722, 723 may be bonded to each other without an adhesive. The first and second resin layers 722, 723 are made of a resin material such as polyimide or polyester. In particular, from the viewpoint of heat resistance, it is preferable to use polyimide as the resin material.

[0064] A metal wiring 724 is sandwiched between the first and second resin layers 722, 723. The metal wiring 724 is made of a metal such as stainless steel. In the sheet heater 72, a current is supplied to the metal wiring 724 to generate resistance heat.

[0065] 6, the planar heater 72 has a heat generating portion 72a and a pair of lead-out portions 72b. The heat generating portion 72a is a planar portion that serves as a heat source and heats the contact plate 62. The heat generating portion 72a is in contact with a second heat transfer member 74 from the side opposite (lower side) to a cold plate 76 (described later). In this heat generating portion 72a, the metal wiring 724 meanders to form a resistance heating element 724a, which increases the density of the metal wiring 724 in the heat generating portion 72a and increases the amount of resistance heat generation.

[0066] As shown in Fig. 4 and Fig. 6, the lead-out portion 72b has a band shape and extends from the heat generating portion 72a. This lead-out portion 72b supplies power from a power source external to the sheet heater 72 to the resistance heating element 724a. Although details will be described later, the lead-out wiring 724b is electrically connected to a control unit 93 (described later), and the amount of power received by the lead-out wiring 724b is adjusted by the control unit 93. Note that, in this embodiment, the lead-out wiring 724b has a width equal to that of the resistance heating element 724a, but is not limited thereto. The lead-out wiring 724b may have a width greater than that of the resistance heating element 724a in order to reduce the resistivity of the lead-out wiring 724b.

[0067] 4, the drawn-out portion 72b in this embodiment extends in a direction different from the extending direction of the first and second main surfaces 721a, 721b of the heat generating portion 72a. The planar heater 72 is bent at the boundary between the heat generating portion 72a and the drawn-out portion 72b. In this embodiment, the pair of drawn-out portions 72b are arranged to sandwich a cold plate 76 (described later).

[0068] 6, in this lead-out portion 72b, the metal wiring 724 constitutes lead-out wiring 724b that is connected to the resistance heating element 724a. In addition, in this lead-out portion 72b, the lead-out wiring 724b is connected to a terminal 725. This terminal 725 is a portion that is electrically connected to a control unit 93 (described later).

[0069] 4 and 5, a first heat transfer member 73 is disposed on a first main surface (lower surface) 721a of the planar heater 72. Therefore, the first heat transfer member 73 is disposed closer to the DUT 300 than the planar heater 72, and is thermally connected to the DUT 300 via the contact plate 62.

[0070] In addition, a second heat transfer member 74 is also disposed on the second main surface (upper surface) 721b of the planar heater 72. For this reason, the second heat transfer member 74 is disposed farther from the DUT 300 than the planar heater 72, and is in contact with the cooler unit 75.

[0071] These first and second heat transfer members 73, 74 are made of a thermally conductive material that dissipates heat generated from the planar heater 72 from the planar heater 72. The thickness T of the first and second heat transfer members 73, 74 shown in FIG. 4 ,T 5 is not particularly limited, but can be set to 50 μm to 100 μm (50 μm≦T 4 ,T 5 ≦100μm).

[0072] The first heat transfer member 73 is larger than the heat generating portion 72a of the planar heater 72 and is also larger than the second heat transfer member 74. Therefore, the first heat transfer member 73 has a contact portion 73a that contacts the planar heater 72 and an exposed portion 73b that is exposed from the planar heater 72 and the second heat transfer member 74. On the other hand, the entire second heat transfer member 74 is in contact with the planar heater 72.

[0073] In a planar heater, the metal wiring generates heat, which causes a local temperature rise near the metal wiring, and the temperature of the resin layer near the metal wiring becomes too high locally, which may result in the resin layer being burned. On the other hand, in the heater unit 71 of this embodiment, the first and second heat transfer members 73, 74 diffuse heat to areas other than the vicinity of the metal wiring 724, thereby suppressing the local temperature rise near the metal wiring 724 and suppressing the occurrence of burn damage to the resin layer 721.

[0074] For example, a thermal interface material (TIM) can be used as the first and second heat transfer members 73, 74. For example, a metal foil made of aluminum or copper, a graphite sheet, a silicone rubber sheet in which a thermally conductive filler is dispersed and held, a sheet containing carbon nanotubes (CNTs), a gel in which a thermally conductive filler is dispersed, etc. can be used as the TIM.

[0075] The first and second heat transfer members 73, 74 preferably diffuse the heat from the planar heater 72 preferentially in a first direction (horizontal direction in this example) parallel to the first and second main surfaces 721a, 721b of the planar heater 72. The heat transfer member that diffuses the heat preferentially in the first direction refers to a heat transfer member whose thermal conductivity in the first direction is greater than its thermal conductivity in a direction perpendicular to the first direction when pressed with a predetermined pressure. Examples of such a material include the above-mentioned graphite sheet and a sheet manufactured by bundling CNTs extending along the first direction.

[0076] As shown in FIG. 5, in the sheet heater 72, the metal wiring 724 generates heat, so that the first portion 73a located in the vicinity of the metal wiring 724 of the contact portion 73a of the first heat transfer member 73 1 On the other hand, the heat is likely to concentrate in the second portion 73a which is located away from the metal wiring 724 of the first heat transfer member 73. 2Therefore, in this embodiment, the first heat transfer member 73 that preferentially diffuses heat in a first direction is used, so that the first portion 73a 1 to the second part 73a 2 Therefore, the heat can be preferentially transferred toward the first portion 73a. 1 This can prevent the portion of the sheet heater 72 near the metal wiring 724 from being excessively heated. This can effectively prevent the portion of the sheet heater 72 near the metal wiring 724 from being locally heated to a high temperature. For the same reason, the second heat transfer member 74 can also effectively prevent the portion of the sheet heater 72 near the metal wiring 724 from being locally heated to a high temperature.

[0077] 4, in this embodiment, the first and second heat transfer members 73, 74 are pressed toward the pusher body 61 (see FIGS. 2 and 3) by the contact plate 62, whereby the first and second heat transfer members 73, 74 are in close contact with the planar heater 72. This makes it possible to speed up the transfer of heat from the planar heater 72 to the first and second heat transfer members 73, 74.

[0078] Furthermore, as described above, the pressing force of the contact plate 62 is set by the dimensions of the screws 63, so that the state in which the first and second heat transfer members 73, 74 and the planar heater 72 are in close contact with each other can be stabilized.

[0079] 2 to 4, a cooler unit 75 is disposed on the heater unit 71. This cooler unit 75 cools the heater unit 71 during heat generation to adjust the temperature of the heater unit 71 to a desired temperature. In addition, the cooler unit 75 can also cool the DUT 300 via the heater unit 71 and the contact plate 62.

[0080] The cooler unit 75 includes a cold plate 76, a nozzle member 78, and a flow path 79. The cold plate 76 is a plate-like member that is disposed on the heater unit 71 and cools the heater unit 71 by contacting the heater unit 71. As with the contact plate 62 described above, the cold plate 76 can be made of a material such as a metal having an insulating coating formed on its surface.

[0081] The thickness T of the cold plate 76 shown in FIG. 6 is, for example, 300 μm to 400 μm (300 μm≦T 6 ≦400 μm). Also, the thickness T 6 and the thickness T of the heater unit 71 2 and the thickness of the contact plate T 1 The sum of T 7 is less than 2 mm (T 6 +T 2 +T 1 ≦1 mm). By shortening the distance between the cold plate 76 and the DUT 300 in this manner, the responsiveness of the temperature adjustment can be improved.

[0082] In addition, the cold plate 76 has a first opposing surface 76a that faces the nozzle member 78. The first opposing surface 76a is flat.

[0083] A nozzle member 78 is disposed on the cold plate 76. As shown in Fig. 2 and Fig. 3, the nozzle member 78 is a member for bringing the refrigerant supplied from the first refrigerant supply hole 612 of the pusher body 61 into contact with the first opposing surface 76a of the cold plate 76.

[0084] 4, the nozzle member 78 has a through hole 781, an ejection port 782, and a protrusion 785. The through hole 781 is connected to the first refrigerant supply hole 612 of the pusher body 61. The through hole 781 constitutes a part of the flow path 79. An ejection port 782 is formed at approximately the center of the lower end surface (second opposing surface 78a) of the through hole 781. The ejection port 782 is separated from the cold plate 76, and ejects the refrigerant supplied from the second refrigerant supply hole 772a of the refrigerant guide 77 toward the cold plate 76.

[0085] The nozzle member 78 also has a second opposing surface 78a that faces the first opposing surface 76a of the cold plate 76 and is spaced apart from the first opposing surface 76a. Therefore, an air gap 791 is formed between the first opposing surface 76a and the second opposing surface 78a. This air gap 791 also constitutes a part of the flow path 79, and the refrigerant injected from the injection port 782 flows through the air gap 791 after reaching the first opposing surface 76a of the cold plate 76. By circulating the refrigerant through the air gap 791 on the cold plate 76, the refrigerant can be accelerated on the first opposing surface 76a, and the cooling speed can be improved. Therefore, the responsiveness in temperature adjustment can be improved.

[0086] 7 is a perspective view showing the nozzle member 78 in this embodiment as seen from below. The second opposing surface 78a is flat. This second opposing surface 78a includes a plurality of grooves 783 (four in this example) and a step 784. The plurality of grooves 783 extend from the ejection port 782 radially outward of the nozzle member 78. By providing such grooves 783, the refrigerant ejected from the ejection port 782 can be guided by the grooves 783 and circulate radially outward.

[0087] The width of groove 783 becomes wider toward the center of second opposing surface 78a. Therefore, the coolant can flow at high speed even at the tip of groove 783.

[0088] Furthermore, the multiple grooves 783 are arranged at approximately equal intervals around the ejection port 782 in the circumferential direction of the ejection port 782. In the air gap 791, the coolant can be caused to flow evenly outward in the radial direction.

[0089] A step 784 is formed on the outside of the groove 783. The step 784 has an annular shape. The second opposing surface 78a is partitioned by the step 784 and includes an outer opposing surface 78b located on the outside of the step 784 and an inner opposing surface 78c located on the inside of the step 784. The thickness of the air gap 791 is larger at the outer opposing surface 78b and smaller at the inner opposing surface 78c. By providing such a step 784, the refrigerant can be accelerated at the outer periphery of the second opposing surface 78a.

[0090] Also, the thickness T of the air gap 791 8 can be appropriately set depending on the pressure of the refrigerant to be supplied, but can be set to, for example, 1 mm or less (T 8 ≦1mm). Thickness of air gap 791 T 8 If the distance is 1 mm or less, the coolant flowing through the air gap 791 can be accelerated, and the cooling speed can be improved. Therefore, the responsiveness in temperature adjustment can be improved.

[0091] 4 and 7, a plurality of protrusions 785 are disposed on the second opposing surface 78a. The protrusions 785 are spacers interposed between the first opposing surface 76a and the second opposing surface 78a, and separate the first and second opposing surfaces 76a, 78a. The tips of the protrusions 785 are in contact with the first opposing surface 76a of the cold plate 76, and define the air gap 791 described above.

[0092] 4, a passage 792 is formed between the nozzle member 78 and the drawn-out portion 72b. The passage 792 is connected to the air gap 791 and constitutes a part of the flow path 79. The passage 792 passes the coolant that has passed through the air gap 791 along the drawn-out portion 72b. This makes it possible to cool the drawn-out portion 72b, and therefore makes it possible to prevent the drawn-out portion 72b from burning even if heat is generated in the drawn-out portion 72b.

[0093] In this embodiment, the refrigerant that has passed through the passage 792 is discharged to the outside of the pusher 6. However, the refrigerant may be collected in the refrigerant supply source 200 without being discharged to the outside of the pusher 6.

[0094] 2 to 4 measures the temperature of the DUT 300. As shown in FIG. 4, the temperature measuring device 8 in this embodiment is provided on the exposed portion 73b of the first heat transfer member 73 and is in contact with the exposed portion 73b. Moreover, the temperature measuring device 8 in this embodiment is disposed away from the planar heater 72. It is sufficient for the temperature measuring device 8 to be in contact with the exposed portion 73b, and the position of the temperature measuring device 8 relative to the exposed portion 73b can be changed as appropriate depending on the arrangement of the exposed portion 73b.

[0095] This temperature measuring device 8 includes a sensor board 81, a porous material 82, and a pressing member 83. The sensor board 81 is a circuit board including a resin base material 811 and a temperature sensor 812. Although not particularly shown, the sensor board 81 may include electronic components other than wiring and the temperature sensor 812. The porous material 82 corresponds to an example of a "first biasing member," "elastic material," and "thermal insulation member" in the aspects of the present invention.

[0096] The resin base material 811 is a plate-shaped resin member. The material constituting the resin base material 811 is not particularly limited, but may be polyimide or the like.

[0097] The temperature sensor 812 is mounted on the resin base material 811. This temperature sensor 812 measures the temperature of the exposed portion 73b. Although not particularly limited, a platinum resistance temperature sensor is used as the temperature sensor 812 in this embodiment. Furthermore, although not particularly limited, sensors such as metal resistance temperature sensors other than platinum, thermocouples, thermistor temperature sensors, etc. can also be used as the temperature sensor 812.

[0098] The temperature sensor 812 is disposed on the opposite side of the first heat transfer member 73 from the DUT 300, and is in direct contact with the exposed portion 73b. The temperature sensor 812 and the planar heater 72 are arranged along the first direction so as to be spaced apart from each other.

[0099] As described above, the first heat transfer member 73 can quickly diffuse the heat generated from the planar heater 72 in the first direction. This reduces the heat propagation lag to the temperature sensor 812, enabling the temperature of the DUT 300 to be measured at high speed.

[0100] A porous material 82 is provided on the sensor substrate 81 so as to cover the temperature sensor 812. The porous material 82 in this embodiment is a sponge made of a resin material in which a large number of pores are formed. Therefore, the porous material 82 has both heat insulation and elasticity.

[0101] By covering the temperature sensor 812 with the insulating porous material 82, the temperature sensor 812 can be made less susceptible to the effects of wind caused by the flow of the refrigerant described above, etc. This makes it possible to improve the accuracy of temperature measurement by the temperature sensor 812.

[0102] Furthermore, the porous material 82 in this embodiment is pressed by the pressing member 83 toward the exposed portion 73b of the first heat transfer member 73. Therefore, the porous material 82 is sandwiched between the pressing member 83 and the first heat transfer member 73 in a compressed state, and the temperature sensor 812 is urged toward the first heat transfer member 73 by an elastic force. That is, the porous material 82 urges the temperature sensor 812 along a direction substantially perpendicular to the first direction.

[0103] Since the porous material 82 biases the temperature sensor 812 toward the first heat transfer member 73, the temperature sensor 812 can be brought into close contact with the first heat transfer member 73, thereby enabling efficient heat transfer from the first heat transfer member 73 to the temperature sensor 812 and speeding up sensing.

[0104] In addition, in order to insulate and press the temperature sensor 812, a material having heat insulating properties and elasticity other than the porous material 82 may be used. Alternatively, a material having heat insulating properties and a material having elasticity may be used in combination.

[0105] The pressing member 83 presses the porous material 82 toward the first heat transfer member 73. The pressing member 83 is a member having rigidity, and is fixed to the lower surface of the pusher body 61.

[0106] In this embodiment, the distance D from the pressing surface 831 of the pressing member 83 to the temperature sensor 812 is 1 is the height H of the porous material 82 when the porous material 82 is not stretched. 1 (not shown) (D 1 <H 1 For this reason, the porous material 82 is sandwiched between the pressing surface 831 and the temperature sensor 812 in a compressed state, and the restoring force from this compression presses the temperature sensor 812 toward the first heat transfer member 73.

[0107] 2 and 3, the vertical guide 69 is disposed on the outside of the holding portion 65. This vertical guide 69 is fixed to the lower surface of the pusher body 61 and extends downward from the lower surface of the pusher body 61. Although not particularly limited, the vertical guide 69 can be fixed to the pusher body 61 by a fastener such as a bolt. As shown in FIG. 3, this vertical guide 69 abuts against the DUT 300 when the pusher 6 adsorbs and holds the DUT 300, thereby enabling the positioning of the DUT 300 relative to the pusher 6 in the vertical and horizontal directions.

[0108] As shown in FIG. 1, the coolant supply unit 9 supplies a coolant to the pusher 6. The coolant supply unit 9 includes a connection unit 91, a valve 92, and a control unit 93. The connection unit 91 is connected to a coolant supply source 200 provided outside the electronic device test apparatus 100. The coolant supplied by the coolant supply source 200 may be compressed dry air, liquid nitrogen, or the like. When the coolant supply source 200 supplies compressed dry air, the coolant supply source 200 may include, for example, a compressor that takes in and compresses outside air, and a dryer that dries the compressed air. Alternatively, the coolant supply source 200 may be existing factory piping capable of supplying compressed dry air. When the coolant supply source 200 supplies liquid nitrogen, the coolant supply source 200 may be, for example, a pressure vessel that stores liquid nitrogen at high pressure, or factory piping for supplying liquid nitrogen.

[0109] A valve 92 is provided downstream of the connection part 91. This valve 92 adjusts the flow rate of the refrigerant supplied from the refrigerant supply source 200. The refrigerant that has passed through this valve 92 is supplied to the first refrigerant supply hole 612 of the pusher body 61, as shown in FIG.

[0110] As shown in Fig. 1, the control unit 93 controls the opening and closing of the valve 92. Also, as shown in Fig. 6, the control unit 93 controls the output of the planar heater 72. The control unit 93 in this embodiment receives a detection value from the temperature detection circuit 303 (see Fig. 2) of the DUT 300, as well as a detection value from the temperature sensor 812 (see Fig. 4) of the temperature measurement device 8. The control unit 93 performs PID control according to the input detection value so that the temperature of the DUT 300 becomes a desired value. Note that the control method of the control unit 93 is not limited to PID control, and other control methods may be used.

[0111] With the electronic device testing apparatus 100 as described above, even if a structure is adopted in which the temperature adjustment device 7 is placed close to the DUT 300, the temperature sensor 812 can sense the temperature of the DUT 300 via the first heat transfer member 73, thereby achieving faster sensing.

[0112] In the electronic device test apparatus 100 of this embodiment, the heater unit 71 of the temperature adjustment device 7 has a planar heater 72. Since the planar heater 72 is thin, the heat capacity of the planar heater 72 is smaller than the heat capacity of a ceramic heater. This makes it possible to improve the temperature rise speed of the heater unit 71, thereby improving responsiveness.

[0113] Furthermore, in the electronic device test apparatus 100 of this embodiment, the first and second heat transfer members 73, 74 are provided on the first and second main surfaces 721a, 721b of the planar heater 72. Therefore, even if the planar heater 72 is suddenly heated, the first and second heat transfer members 73, 74 can prevent the planar heater 72 from becoming locally hot, and can dissipate heat from the planar heater 72. Therefore, damage to the planar heater 72 can be prevented.

[0114] Furthermore, in the electronic device test apparatus 100 of this embodiment, since a ceramic heater, which tends to be heavy, is not used, the pusher 6 can be made lighter.

[0115] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0116] For example, in the above embodiment, the pusher 6 suction-holds the DUT 300, but is not limited to this. The pusher 6 may suction-hold a carrier 400 (see FIG. 1) that houses the DUT. Such a carrier 400 is not particularly limited, but may be, for example, a carrier described in Japanese Patent Application Laid-Open No. 2019-197012 and Japanese Patent Application Laid-Open No. 2013-79860.

[0117] The pusher 6 may also be configured to push a plurality of DUTs 300 mounted on a test tray on which a plurality of DUTs 300 are mounted. In this case, the handler 3 includes a plurality of pushers 6, and the plurality of pushers 6 push the plurality of DUTs 300 mounted on the test tray, respectively. In this case, all of the pushers 6 may have the configuration as in the present embodiment described above.

[0118] Furthermore, the fixed portion 622 of the contact plate 62 is fixed to the holding portion 65, but is not limited to this. For example, the fixed portion 622 may be fixed to the pusher body 61, or may be fixed to another member that is fixed to the pusher body 61 in a state in which it does not move relative to the pusher body 61. [Explanation of symbols]

[0119] 100...Electronic component test equipment 1. Tester 11…Mainframe 12...Test head 13…Cable 2…Socket 21...Socket body 22...Contact 3. Handler 4…Thermostatic bath 5…Contact arm 6... Pusher 61…Pusher body 611...First suction hole 612...first coolant supply hole 62…Contact plate 621…Contact part 621a…Contact surface 622…Fixed part 63…Screw 65...Holding part 67…Second suction hole 68…Suction pad 69…Vertical guide 7…Temperature adjustment device 71...Heater unit 72...Surface heater 72a…heat generating part 72b…drawer section 721…Resin layer 721a, 721b...first and second main surfaces 722, 723...First and second resin layers 724…Metal wiring 724a…Resistance heating element 724b…Exit wiring 725…Terminal 73...First heat transfer member 73a…Contact part 73a 1 ,73a 2 ...First and second parts 73b…Exposed part 74...Second heat transfer member 75…Cooler unit 76…Cold plate 76a...first opposing surface 78...Nozzle member 78a...second opposing surface 78b…Outside facing surface 78c…Inner facing surface 781...Through hole 782…Injection port 783...Groove 784…Step 785...protrusion 79...Flow path 791…Air gap 792...passing route 8…Temperature measuring device 81...Sensor board 811...Resin substrate 812...Temperature sensor 82...Porous material 83...Pressing member 9…Refrigerant supply section 91…Connection 92…Valve 93...Control unit 200…Refrigerant supply source 300…DUT 301...Substrate 302...IC chip 303...Temperature detection circuit 304…Mold resin 305…Terminal 400…Career

Claims

1. A temperature measuring device for measuring a temperature of a DUT or a DUT contained in a carrier, comprising: a first heat transfer member thermally connected to the DUT or the carrier; a temperature sensor in contact with the first heat transfer member, The temperature measuring device, wherein the first heat transfer member is a sheet-like member extending along a first direction.

2. 2. The temperature measuring device according to claim 1, the temperature measuring device includes a first biasing member that biases the temperature sensor toward the first heat transfer member; The temperature measurement device, wherein the first biasing member biases the temperature sensor along a direction substantially perpendicular to the first direction.

3. 2. The temperature measuring device according to claim 1, The first heat transfer member is a sheet-like member that preferentially diffuses heat transferred from the DUT or the carrier in the first direction.

4. 2. The temperature measuring device according to claim 1, The temperature sensor is a temperature measuring device disposed on the opposite side of the first heat transfer member from the DUT or the carrier.

5. 2. The temperature measuring device according to claim 1, The temperature measuring device includes a heat insulating member covering the temperature sensor.

6. The temperature measuring device according to claim 5, The temperature measuring device, wherein the insulating member is made of a porous material.

7. The temperature measuring device according to claim 5, The heat insulating member is made of an elastic material, the temperature measuring device includes a pressing member that presses the heat insulating member toward the first heat transfer member, the heat insulating member is sandwiched between the pressing member and the first heat transfer member, The thermal insulating member biases the temperature sensor toward the first heat transfer member.

8. A temperature adjustment device for adjusting a temperature of a DUT or a DUT accommodated in a carrier, comprising: The temperature adjustment device includes a temperature measurement device according to any one of claims 1 to 7, The temperature adjustment device includes a heater unit that is a heat source, The heater unit includes: A sheet heater; the first heat transfer member disposed on one main surface of the planar heater.

9. The temperature adjustment device according to claim 8, the first heat transfer member has an exposed portion exposed from the planar heater, The temperature sensor is in contact with the exposed portion.

10. The temperature adjustment device according to claim 8, The temperature adjustment device, wherein the first heat transfer member is disposed closer to the DUT or the carrier than the planar heater.

11. The temperature adjustment device according to claim 8, The heater unit is a temperature adjustment device including a second heat transfer member disposed on the other main surface of the planar heater.

12. The temperature adjustment device according to claim 8, The planar heater includes: A first resin layer; a second resin layer laminated on the first resin layer; a metal wiring interposed between the first and second resin layers.

13. The temperature adjustment device of claim 8, the temperature adjustment device further includes a cooler unit which is a cooling source and is in contact with the heater unit; The cooler unit includes a flow path through which a refrigerant passes, The cooler unit includes: a nozzle member having an ejection port for ejecting a refrigerant; a cold plate that is disposed opposite to the injection port and spaced apart from the injection port, and to which the refrigerant is sprayed from the nozzle member; the flow passage includes an air gap formed between the nozzle member and the cold plate; A temperature adjustment device in which the coolant injected from the injection port passes through the air gap after reaching the cold plate.

14. The temperature adjustment device according to claim 13, the heater unit includes a second heat transfer member disposed on the other main surface of the planar heater and in contact with the cold plate; The planar heater includes: a planar heat generating portion having a resistance heating element and in contact with the second heat transfer member from a side opposite to the cold plate; a lead-out portion having a lead-out wiring connected to the resistive heating element and extending from the heat generating portion; The flow path is connected to the air gap, and the temperature adjustment device includes a passage for passing the refrigerant along the drawing portion.

15. An electronic device handling device for handling a DUT or a carrier housing the DUT, comprising: the electronic device handling device includes a pressing device that presses the DUT or the carrier toward a socket to electrically connect the DUT and the socket, The pressing device is The temperature adjustment device according to claim 8 ; a contact plate that contacts the DUT or the carrier; the contact plate is interposed between the first heat transfer member of the temperature adjustment device and the DUT, or between the first heat transfer member and the carrier, The temperature sensor is in contact with a second main surface of the first heat transfer member opposite a first main surface in contact with the contact plate.

16. An electronic device test apparatus for testing a DUT, comprising: An electronic device handling device according to claim 15; and a tester having the socket.

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