Substrate mounting method

Abstract

To provide a substrate mounting method for preventing an error mounting of a component in a print circuit board that can selectively mount a plurality of various components at the same position.SOLUTION: A substrate mounting method is a manufacturing method of a control circuit board that includes a projection part at each different position of a mounting surface to a print circuit board 3, and in which at least any one component from a plurality of various components is mounted onto the print circuit board 3 that can be mounted to a plurality of through holes 32 and 33 in which the plurality of various components are formed at a position corresponding to each projection part included in the plurality of various components at the same position. The method contains steps of: applying a cream solder so as to cover each through whole that corresponds to the projection part provided to a component that will not be mounted of the plurality of through holes 32 and 33 of the print circuit board 3; solidifying the cream solder after melting; and inserting a component which will be mounted after solidifying the cream solder.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a substrate mounting method. [Background technology]

[0002] When manufacturing control boards or power supply boards for electrical devices, there are printed circuit boards that allow different types of components to be mounted in the same position on the same printed circuit board. This allows one printed circuit board to be shared between multiple models, and allows the mounting of multiple types of components to be switched depending on the supply situation of the components.

[0003] However, with such a printed circuit board, there is a risk that the components to be mounted may be mixed up and erroneously mounted.

[0004] The following Patent Documents 1 and 2 disclose a configuration in which a boss is provided on the printed circuit board mounting surface of a socket connector (post with base) for mounting a connector, and a boss hole for mounting the boss is formed at the mounting position of the post with base on the printed circuit board. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2010-97747 A [Patent Document 2] Utility Model Registration No. 2554662 Summary of the Invention [Problem to be solved by the invention]

[0006] According to these patent documents, it is possible to easily position the base-equipped post to be mounted on the printed circuit board. However, in order to enable multiple types of base-equipped posts to be mounted in the same position on the printed circuit board, it is necessary to provide a boss in a different position for each type of base-equipped post and provide multiple boss holes in corresponding positions on the printed circuit board, or to provide a boss in a position common to the multiple types of base-equipped posts. In either case, the problem of incorrect mounting when mounting components is not solved.

[0007] The present invention has been made to solve the above-mentioned problems, and has an object to provide a board mounting method that can prevent erroneous mounting of components on a printed circuit board on which multiple types of components can be selectively mounted in the same position. [Means for solving the problem]

[0008] A board mounting method according to one embodiment of the present invention is a board mounting method for mounting one of a plurality of types of components on a printed board capable of mounting the plurality of types of components in the same position, wherein the plurality of types of components have protrusions at different positions on a mounting surface to the printed board, and the printed board has a plurality of through holes formed at positions corresponding to each of the protrusions of the plurality of types of components, and the method includes the steps of applying cream solder to cover through holes of the plurality of through holes of the printed board that correspond to the protrusions provided on components that are not to be mounted, melting the cream solder and then solidifying it, and inserting the components to be mounted after solidifying the cream solder.

[0009] According to the above method, when any one of a plurality of types of components is mounted at the same position on a printed circuit board, the through-holes corresponding to the protrusions provided on the components that are not to be mounted are blocked with solder. This physically prevents the components that are not to be mounted from being mounted on the printed circuit board in the subsequent component mounting process. Therefore, it is possible to prevent erroneous mounting of components on a printed circuit board on which a plurality of types of components can be selectively mounted at the same position.

[0010] The step of inserting the component to be installed may be performed by manual insertion, thereby making it possible to prevent erroneous installation in manual work that is not performed by a machine by taking measures before the manual work is performed.

[0011] The multiple types of parts may be multiple types of connectors, each of which has a lead terminal and a positioning boss, the multiple types of connectors having bosses in different positions relative to the lead terminals, and the protrusion may be the boss.

[0012] The method may further include a step of plating an inner surface of a plurality of boss holes formed in advance in the printed circuit board at positions corresponding to the bosses of the plurality of types of connectors to convert the plurality of boss holes into the plurality of through holes. By converting the boss holes into through holes, solder can be fixed to the boss holes, and the boss holes can be appropriately sealed.

[0013] The multiple types of components may be multiple types of coils or relays having multiple lead terminals in different positions, and the protrusions may be the multiple lead terminals.

[0014] The cream solder may be melted and then solidified, so that the through-holes are blocked by flux contained in the cream solder. Effect of the Invention

[0015] According to one aspect, it is possible to prevent erroneous mounting of components on a printed circuit board on which a plurality of types of components can be selectively mounted at the same position. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a diagram showing an example of a first connector to be mounted on a printed circuit board to which a board mounting method according to an embodiment of the present invention is applied. [Diagram 2] FIG. 2 is a diagram showing an example of a second connector to be mounted on a printed circuit board to which the board mounting method according to one embodiment of the present invention is applied. [Diagram 3] FIG. 3 is a diagram showing a connector mounting area of ​​a printed circuit board on which the connector of FIG. 1 and FIG. 2 is mounted. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV of FIG. [Diagram 5] FIG. 5 is a diagram illustrating a flow of a substrate forming process in this embodiment. [Figure 6] FIG. 6 is a diagram showing how a connector is manually inserted into a printed circuit board. [Figure 7] FIG. 7 is a diagram showing examples of multiple types of coils and coil mounting areas on a printed circuit board. [Figure 8] FIG. 8 is a diagram showing examples of multiple types of relays and relay mounting areas on a printed circuit board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the following, the same or corresponding elements are denoted by the same reference numerals throughout the drawings, and duplicated description thereof will be omitted.

[0018] [One embodiment] 1 and 2 are diagrams showing an example of a connector mounted on a printed circuit board to which a board mounting method according to an embodiment of the present invention is applied. In FIG. 1, Ia is a front view, Ib is a right side view, and Ic is a diagram showing the positional relationship between the lead terminals and the protrusions as viewed from above. Similarly, in FIG. 2, IIa is a front view, IIb is a right side view, and IIc is a diagram showing the positional relationship between the lead terminals and the protrusions as viewed from above. Note that only a post with a base, which is a mounting portion of the connector to the printed circuit board, is shown in FIG. 1 and FIG. 2.

[0019] The first connector 1 shown in Fig. 1 comprises a main body 10, a plurality of lead terminals 11 (seven in the example of Fig. 1), and a positioning boss (protrusion) 12. The plurality of lead terminals 11 are arranged in a row on a bottom surface 13 of the main body 10, which is the surface that faces when the connector is attached to a printed circuit board, so as to protrude downward. The protrusion 12 is arranged on the right end of the bottom surface 13 of the main body 10 when viewed from the front, so as to protrude downward. The protrusion 12 is provided for positioning when the connector is attached to the printed circuit board and for preventing the connector from being attached in the wrong direction. The protrusion 12 is arranged offset to the right with respect to the lead terminals 11 when viewed from the right side surface.

[0020] The second connector 2 shown in FIG. 2 also includes a main body 20, a plurality of lead terminals 21 (seven in the example of FIG. 2), and a boss (protrusion) 22 for positioning. The plurality of lead terminals 21 are arranged in a line on a lower surface 23 of the main body 20, which is the surface that faces when the connector is attached to a printed circuit board, so as to protrude downward. The interval between the plurality of lead terminals 21 is the same as the interval between the plurality of lead terminals 11 in the first connector 1. The protrusion 22 is arranged on the right end of the lower surface 23 of the main body 20 as viewed from the front, so as to protrude downward. The protrusion 22 is provided for positioning when the connector is attached to a printed circuit board and for preventing an incorrect orientation when the connector is attached. The protrusion 22 is arranged offset to the left with respect to the lead terminal 21 as viewed from the right side. In this way, the protrusion 12 of the first connector 1 and the protrusion 22 of the second connector 2 are arranged at different positions with respect to the positions of the lead terminals 11 and 21.

[0021] 3 is a diagram showing a connector mounting area of ​​a printed circuit board to which the connectors of FIG. 1 and FIG. 2 are mounted. The printed circuit board 3 has terminal holes 31 through which the lead terminals 11, 21 are inserted in the connector mounting area A, a first boss hole 32 formed at a position corresponding to the protrusion 12 of the first connector 1, and a second boss hole 33 formed at a position corresponding to the protrusion 22 of the second connector 2. In this embodiment, the terminal holes 31, the first boss hole 32, and the second boss hole 33 are all formed as through holes that electrically connect the front and back surfaces of the printed circuit board 3. In this way, the multiple types of connectors 1, 2 have protrusions 12, 22 at different positions on the mounting surface to the printed circuit board 3, and correspondingly, the printed circuit board 3 has multiple through holes (boss holes) 32, 33 formed at positions corresponding to the protrusions 12, 22 of the multiple types of connectors 1, 2.

[0022] Fig. 4 is a cross-sectional view taken along line IV-IV in Fig. 3. Although terminal hole 31 is not actually visible in the cross-sectional view taken along line IV-IV, to facilitate understanding, terminal hole 31 is shown as a partially see-through view so that its position can be seen. Fig. 4A shows the first connector 1 in an attached state, and Fig. 4B shows the second connector 2 in an attached state.

[0023] 4A, when the first connector 1 is mounted in the connector mounting area A of the printed circuit board 3, the multiple lead terminals 11 of the first connector 1 are inserted into the multiple terminal holes 31, and the protrusion 12 is inserted into the first boss hole 32. Also, as shown in FIG. 4B, when the second connector 2 is mounted in the connector mounting area A of the printed circuit board 3, the multiple lead terminals 21 of the second connector 2 are inserted into the multiple terminal holes 31, and the protrusion 22 is inserted into the second boss hole 33.

[0024] In this manner, a board such as a control board or a power board is manufactured by mounting components such as the connectors 1 and 2 on the printed circuit board 3. In the printed circuit board 3 of this embodiment, both the first connector 1 and the second connector 2 can be mounted at the same position (connector mounting area A) of the printed circuit board. Here, the components connected to the first connector 1 and the components connected to the second connector 2 may have different performance, specifications, etc. Therefore, if the second connector 2 is mistakenly connected in a manufacturing process in which the first connector 1 should be connected to the printed circuit board 3, problems may occur such as an inability to mount an appropriate connector housing, a component with a different capacity than expected being connected, and the quantity of components cannot be managed.

[0025] Therefore, in this embodiment, before the specified connectors 1, 2 are attached to the printed circuit board 3 in the manual insertion process, the boss holes corresponding to the protrusions provided on the connectors other than the connector to be attached are blocked in the board formation process.

[0026] Fig. 5 is a diagram illustrating the flow of a board formation process in this embodiment. The board formation process shown in Fig. 5 includes a through-hole formation process in the printed circuit board 3 and a surface mounting process on the printed circuit board 3. In general, the through-hole formation process in the printed circuit board 3 is a mechanized process realized by a through-hole formation device. Also, in general, the surface mounting process on the printed circuit board 3 is a mechanized process automated by a surface mounting system in which a solder paste applicator and a reflow oven are arranged in sequence.

[0027] In addition to the above steps, the board formation process may include, as mechanized steps (not shown), a step of mounting axial and radial components on the front surface of the printed circuit board 3 and a step of mounting surface-mounted components on the back surface of the printed circuit board 3. The step of mounting surface-mounted components on the back surface of the printed circuit board 3 includes a bond application step of applying adhesive to the back surface of the printed circuit board 3, a component mounting step of mounting the surface-mounted components, and a curing step of curing the adhesive in a curing oven. After these mechanized steps, a step of attaching manually inserted components such as connectors 1 and 2 is carried out.

[0028] 5, a process for making through holes that need to be made into through holes out of a plurality of through holes preliminarily formed in the printed circuit board 3 is performed. For example, a conductive thin film 34 is formed by plating or the like on the side surface of the target through hole and on the front and back surfaces of the printed circuit board 3 around the through hole. All of the through holes 31, 32, 33 in the connector mounting area A are made into through holes. That is, in this process, plating is performed on the inner surfaces of a plurality of boss holes 32, 33 that are preliminarily formed at positions corresponding to the protrusions 12, 22 of the plurality of types of connectors 1, 2, respectively, to make the plurality of boss holes 32, 33 into a plurality of through holes.

[0029] The boss holes are only used for inserting positioning bosses, and the bosses and boss holes are not electrically connected, so in the conventional embodiment, the boss holes are not made into through holes. However, in the present embodiment, as described below, unnecessary boss holes are filled with solder, so that the solder is fixed in the boss holes.

[0030] Next, in step S2, cream solder 35 is applied so as to close those boss holes corresponding to the protrusions provided on the connector that is not to be attached, among the multiple boss holes 32, 33 that are through holes in the printed circuit board 3. In the example of Fig. 5, the connector to be attached is set to the second connector 2. In this case, cream solder 35 is applied so as to close the first boss hole 32, among the boss holes 32, 33, that corresponds to the protrusions 12 provided on the first connector 1 that is not to be attached.

[0031] Cream solder is a conductive paste, also known as solder paste. The cream solder applicator prints the cream solder from a metal mask placed on the printed circuit board 3, which covers areas other than the area to be coated with the solder paste. After printing, the metal mask is removed, leaving the cream solder 35 applied to the specified locations on the printed circuit board 3.

[0032] The process of applying cream solder onto the boss holes can be the same as the process of applying cream solder to mounting locations of components such as IC chips to be surface mounted on the printed circuit board 3. In this case, one metal mask is formed with openings for applying cream solder onto the boss holes and openings for applying cream solder to mounting locations of components to be surface mounted.

[0033] Thereafter, in a chip mounting device, components such as IC chips to be surface-mounted on the printed circuit board 3 are placed on the cream solder at the mounting location.

[0034] Next, in step S3, the printed circuit board 3 is introduced into a reflow furnace, where the cream solder is melted and then solidified. As a result, the cream solder 35 on the first boss hole 32 melts and flows into the first boss hole 32, and solidifies in that state. The first boss hole 32 is blocked by the solidified solder 36 that has flowed into the first boss hole 32.

[0035] Incidentally, the solidified solder 36 may lose the conductive material contained in the original cream solder 35. That is, the first boss hole 32 may be blocked by the flux contained in the cream solder 35. Also, the first boss hole 32 does not need to be blocked completely, but it may be blocked to the extent that the corresponding protrusion 12 of the first connector 1 cannot be inserted into the first boss hole 32, for example by reducing the diameter.

[0036] The printed circuit board 3 thus formed is brought to a process for attaching manually inserted components including the second connector 2 to be installed. In this process, the second connector 2 to be installed is inserted into the printed circuit board 3 by an operator, whereby the second connector 2 is installed on the printed circuit board 3.

[0037] Figure 6 is a diagram showing how a connector is inserted into a printed circuit board. Figure 6A shows a state in which a second connector 2 to be mounted is mounted on a printed circuit board 3. Meanwhile, Figure 6B shows a state in which a first connector 1, which is not to be mounted on a printed circuit board 3, is about to be mounted.

[0038] 6A , when the second connector 2 to be installed is inserted into the printed circuit board 3, the second boss hole 33 of the printed circuit board 3 corresponding to the protrusion 22 of the second connector 2 is open, so that the lead terminal 21 is inserted into the terminal hole 31 of the printed circuit board 3 with the second connector 2 in an appropriate orientation, whereby the protrusion 22 is also inserted into the second boss hole 33. In this way, the second connector 2 to be installed can be appropriately installed on the printed circuit board 3.

[0039] 6B, when an attempt is made to insert a first connector 1 that is not to be attached into the printed circuit board 3, the first boss hole 32 of the printed circuit board 3 corresponding to the protrusion 12 of the first connector 1 is blocked by the solder 36 solidified within the first boss hole 32, so that even if an attempt is made to insert the lead terminal 11 into the terminal hole 31 of the printed circuit board 3 with the first connector 1 oriented in an appropriate direction, the protrusion 12 cannot be inserted into the corresponding first boss hole 32. In this way, it is possible to prevent erroneous attachment of a first connector 1 that is not to be attached to the printed circuit board 3.

[0040] If the connector to be attached is the first connector 1, the printed circuit board 3 is formed in the same manner as above, except that in step S2, cream solder 35 is applied onto the second boss hole 33 instead of the first boss hole 32. As a result, the second boss hole 33 is blocked by the solidified solder 36 inside the second boss hole 33, so that the second connector 2 cannot be attached, whereas the attachment of the first connector 1 is permitted.

[0041] Thus, according to this embodiment, when any one of a plurality of types of components is mounted at the same position on the printed circuit board 3, the through-holes corresponding to the protrusions provided on the components not to be mounted are blocked with solidified solder 36. This physically prevents the components not to be mounted from being mounted on the printed circuit board 3 in the subsequent component mounting process. Therefore, it is possible to prevent erroneous mounting of components on the printed circuit board 3, which allows multiple types of components to be selectively mounted at the same position.

[0042] Furthermore, in this embodiment, since the component mounting process is performed manually and not by machine, the occurrence of incorrect mounting during this manual process can be prevented by taking measures before the manual process is performed (by blocking in advance through holes corresponding to protrusions of components that are not to be mounted).

[0043] Furthermore, by forming the boss holes 32, 33 as through holes, it is possible to fix the boss holes 32, 33 with solder, and it is possible to properly close the boss holes 32, 33.

[0044] [Variation 1] In the above embodiment, multiple types of connectors 1, 2 in which the lead terminals 11, 21 are in a common position but the positioning bosses 12, 22 are in different positions have been exemplified as multiple types of components that can be mounted in the same position on the printed circuit board 3. Alternatively, the multiple types of components may be multiple types of coils in which the positions of multiple lead terminals are different from each other.

[0045] 7 is a diagram showing examples of multiple types of coils and coil mounting areas on a printed circuit board. The first coil 4 and the second coil 5 each have four lead terminals 41, 51. Using the position of one lead terminal 41, 51 as a reference, the other lead terminals 41 of the first coil 4 are arranged at positions different from the other lead terminals 51 of the second coil 5.

[0046] The printed circuit board 3 has, in the coil mounting area B, a first terminal hole 37 through which the lead terminal 41 of the first coil 4 is inserted, and a second terminal hole 38 through which the lead terminal 51 of the second coil 5 is inserted. The four first terminal holes 37 and the four second terminal holes 38 are formed at different positions on the printed circuit board 3. The terminal holes 37, 38 are formed as through holes. In this way, the multiple types of coils 4, 5 have lead terminals 41, 51 that become protrusions at different positions on the mounting surface to the printed circuit board 3, and correspondingly, the printed circuit board 3 has multiple through holes (terminal holes) 37, 38 formed at positions corresponding to the lead terminals 41, 51 of the multiple types of coils 4, 5, respectively.

[0047] In this case, the process of forming the printed circuit board 3 is the same as in the above embodiment. The terminal holes 37, 38 through which the lead terminals 41, 51 of the coils 4, 5 are inserted are through holes that should originally be formed as through holes. Therefore, there is no need to increase the number of through holes to be made into through holes in the printed circuit board 3 during separate design.

[0048] When the coil to be mounted is the first coil 4, cream solder is applied onto the second terminal hole 38 of the printed circuit board 3, and the second terminal hole 38 is blocked by melting and solidifying. As a result, when the first coil 4 to be mounted is inserted into the printed circuit board 3, the first terminal hole 37 of the printed circuit board 3 corresponding to the lead terminal 41, which is the protrusion of the first coil 4, is open, so that the first coil 4 can be properly mounted on the printed circuit board 3.

[0049] On the other hand, when an attempt is made to insert a second coil 5 that is not to be mounted into the printed circuit board 3, the second terminal hole 38 of the printed circuit board 3 corresponding to the lead terminal 51 of the second coil 5 is blocked by the solder solidified within the second terminal hole 38, and therefore the second coil 5 cannot be mounted on the printed circuit board 3. In this way, it is possible to prevent the second coil 5 that is not to be mounted from being erroneously mounted on the printed circuit board 3. When the coil to be mounted is the second coil 5, the first terminal hole 37 of the printed circuit board 3 is blocked by solder, thereby achieving the same effect.

[0050] In this modified example, it is sufficient that at least one of the four terminal holes corresponding to the coils that are not to be attached is blocked with solder.

[0051] [Variation 2] In the above-described first modification, the four first terminal holes 37 through which the four lead terminals 41 of the first coil 4 are inserted and the four second terminal holes 38 through which the four lead terminals 51 of the second coil 5 are inserted are all different from each other. Alternatively, the multiple types of components may be multiple types of relays in which the position of at least one of the multiple lead terminals is different from each other and the positions of the remaining lead terminals are the same.

[0052] 8 is a diagram showing examples of relay mounting areas on a printed circuit board and a plurality of types of relays. Each of the first relay 6 and the second relay 7 has four lead terminals. The first relay 6 has three common lead terminals 61 that are inserted into the three common terminal holes 39 when mounted on the printed circuit board 3, and a lead terminal 62 that is inserted into the first relay terminal hole 39A when mounted on the printed circuit board 3. The second relay 7 has three common lead terminals 71 that are inserted into the three common terminal holes 39 when mounted on the printed circuit board 3, and a lead terminal 72 that is inserted into the second relay terminal hole 39B that is located at a position different from the first relay terminal hole 39A when mounted on the printed circuit board 3.

[0053] The printed circuit board 3 has the above-mentioned three common terminal holes 39, a first relay terminal hole 39A, and a second relay terminal hole 39B in the relay mounting area C. The terminal holes 39, 39A, and 39B are formed as through holes. In this manner, the multiple types of relays 6 and 7 have lead terminals 62 and 72 serving as protrusions at different positions on the mounting surface to the printed circuit board 3, and correspondingly, the printed circuit board 3 has multiple through holes (terminal holes) 39A and 39B formed at positions corresponding to the lead terminals 62 and 72 of the multiple types of relays 6 and 7.

[0054] In this case, the process of forming the printed circuit board 3 is the same as in the above embodiment. The terminal holes 39A, 39B into which the lead terminals 62, 72 of the relays 6, 7 are inserted are originally through holes that should be formed as through holes. Therefore, there is no need to increase the number of through holes to be made into through holes in the printed circuit board 3 during the design process.

[0055] When the relay to be mounted is the first relay 6, cream solder is applied onto the terminal hole 39B for the second relay of the printed circuit board 3, and the solder is melted and solidified to close the terminal hole 39B for the second relay. As a result, when the first relay 6 to be mounted is inserted into the printed circuit board 3, the terminal hole 39A for the first relay of the printed circuit board 3 corresponding to the lead terminal 62, which is the protrusion of the first relay 6, is open, so that the first relay 6 can be properly mounted on the printed circuit board 3.

[0056] On the other hand, when an attempt is made to insert a second relay 7 that is not to be installed into the printed circuit board 3, the second relay terminal hole 39B of the printed circuit board 3 corresponding to the lead terminal 72 of the second relay 7 is blocked by the solder solidified in the second relay terminal hole 39B, and therefore the second relay 7 cannot be installed on the printed circuit board 3. In this way, it is possible to prevent the second relay 7 that is not to be installed from being erroneously installed on the printed circuit board 3. When the coil to be installed is the second relay 7, the first relay terminal hole 39A of the printed circuit board 3 is blocked by solder, thereby achieving the same effect.

[0057] Although the embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and various improvements, changes, and modifications are possible without departing from the spirit of the present invention.

[0058] [Other embodiments] For example, in the above embodiment and modified examples, examples of connectors 1 and 2 with different positions of positioning bosses, and coils 4 and 5 and relays 6 and 7 with different positions of lead terminals are shown as examples of multiple types of components, but the multiple types of components are not limited to these. Also, in multiple types of coils and relays with the same lead terminal positions, by providing positioning bosses at different positions, it is possible to realize a mis-attachment prevention mode similar to that of connectors 1 and 2. Also, in connectors with different positions or numbers of lead terminals, it is possible to realize a mis-attachment prevention mode similar to that of coils 4 and 5 or relays 6 and 7 shown in modified examples 1 and 2.

[0059] The number of protrusions whose positions differ from one another among the multiple types of components may be one as in the above embodiment and modified example 2, may be the same as the number of lead terminals as in modified example 1, or may be some other number. The number of multiple types of components that can be mounted in the same location may be three or more.

[0060] In addition, in the above embodiment, an example was given of the form in which the boss holes 32, 33 are made into through holes in the same process as the process of making the terminal hole 31 through which the lead terminals 11, 21 are inserted, but the through holes may be made in a separate process from the process of making the other through holes such as the terminal hole 31.

[0061] In addition, in the above embodiment, an example has been given of the application and reflow process of cream solder to boss holes 32, 33 being performed in the same process as the application and reflow process of cream solder to other locations, but it may also be performed in a separate process from the other locations.

[0062] In addition, in the above embodiment, an example has been shown in which the component mounting process is performed by manual insertion, but automatic insertion by machine may also be used. For example, if the component insertion machine and the machine used in the process of forming the printed circuit board 3 are independent of each other (they are not linked by communication or the like), there is a possibility that a component that is not intended to be mounted may be mistakenly mounted due to incorrect settings or forgetting to change settings in the component insertion machine. Even in such a case, the method of the above embodiment can prevent a component different from the component that is intended to be mounted in the process of forming the printed circuit board 3 from being mounted.

[0063] [Summary of this disclosure] Each of the following sections discloses a preferred embodiment of the present disclosure.

[0064] [Item 1] A board mounting method for mounting one of a plurality of types of components on a printed board capable of mounting the plurality of types of components in the same position, the plurality of types of components having protrusions at different positions on a mounting surface to the printed board, the printed board having a plurality of through holes formed at positions corresponding to each of the protrusions of the plurality of types of components, the board mounting method comprising the steps of: applying cream solder to cover through holes of the plurality of through holes of the printed board that correspond to the protrusions provided on a component that is not to be mounted; melting the cream solder and then solidifying it; and inserting the component to be mounted after the cream solder has solidified.

[0065] [Item 2] 2. The board mounting method according to claim 1, wherein the step of inserting the components to be mounted is performed by manual insertion.

[0066] [Item 3] 3. The substrate mounting method according to item 1 or 2, wherein the plurality of types of components are a plurality of types of connectors, each of the plurality of types of connectors includes a lead terminal and a boss for positioning, the positions of the bosses relative to the lead terminals are different from one another in the plurality of types of connectors, and the protrusions are the bosses.

[0067] [Item 4] 4. The board mounting method according to item 3, further comprising a step of plating inner surfaces of a plurality of boss holes that are pre-formed in the printed circuit board at positions corresponding to the bosses of the plurality of types of connectors, thereby converting the plurality of boss holes into the plurality of through holes.

[0068] [Item 5] 3. The substrate mounting method according to claim 1, wherein the plurality of types of components are a plurality of types of coils or relays having a plurality of lead terminals in different positions, and the protrusions are the plurality of lead terminals.

[0069] [Item 6] 6. The board mounting method according to any one of items 1 to 5, wherein the cream solder is melted and then solidified, thereby sealing the through-holes with flux contained in the cream solder. [Industrial Applicability]

[0070] The present invention is useful for preventing erroneous component mounting on a printed circuit board on which multiple types of components can be selectively mounted at the same position. [Explanation of symbols]

[0071] 1 first connector, 2 second connector, 3 printed circuit board, 4 first coil, 5 second coil, 6 first relay, 7 second relay, 11, 21 connector lead terminal, 12, 22 boss (projection), 32, 33 boss hole (through hole corresponding to the projection), 35 cream solder, 36 solidified solder, 37, 38 terminal hole (through hole corresponding to the projection), 39A, 39B terminal hole (through hole corresponding to the projection), 41, 51 coil lead terminal (projection), 62, 72 relay lead terminal (projection)

Claims

1. A board mounting method for mounting one of a plurality of types of components on a printed board on which the plurality of types of components can be mounted at the same position, comprising the steps of: the plurality of types of components have protrusions at different positions on a surface to be mounted on the printed circuit board, the printed circuit board has a plurality of through holes formed at positions corresponding to the protrusions of the plurality of types of components, applying cream solder to cover through holes corresponding to protrusions provided on components that are not to be mounted among the plurality of through holes of the printed circuit board; melting the cream solder and then solidifying it; and inserting a component to be mounted after the cream solder has solidified.

2. 2. The board mounting method according to claim 1, wherein the step of inserting the component to be mounted is performed by manual insertion.

3. the plurality of types of components are a plurality of types of connectors, Each of the plurality of types of connectors includes a lead terminal and a boss for positioning, The plurality of types of connectors are different from one another in the positions of the bosses relative to the lead terminals, The substrate mounting method according to claim 1 , wherein the protrusion is the boss.

4. 4. The board mounting method according to claim 3, further comprising a step of plating inner surfaces of a plurality of boss holes pre-formed in the printed circuit board at positions corresponding to the bosses of the plurality of types of connectors, thereby converting the plurality of boss holes into the plurality of through holes.

5. the plurality of types of components are a plurality of types of coils or relays having a plurality of lead terminals each having a different position; 3. The substrate mounting method according to claim 1, wherein the protrusions are the plurality of lead terminals.

6. 3. The substrate mounting method according to claim 1, wherein the cream solder is melted and then solidified, thereby blocking the through-holes with flux contained in the cream solder.

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