Substrate heating apparatus

JP2025029398AActive Publication Date: 2025-03-06SCREEN HOLDINGS CO LTD
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Patent Information

Application Number
JP2023134009
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-08-21
Publication Date
2025-03-06
Estimated Expiration
2043-08-21

AI Technical Summary

Benefits of technology

【0019】 第1態様から第10態様の基板加熱装置によれば、リブ部により天板の剛性を高めることができる。したがって、蓋部の断熱性を高く維持しつつ、蓋部の熱反りを低減できる。

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Abstract

To provide a technique of reducing thermal warpage of a lid while maintaining high heat-insulating properties of the lid in a substrate heating apparatus.SOLUTION: A substrate heating apparatus 1 comprises a hot plate 20, a housing 40, and a lid 50. The hot plate 20 is configured to heat a substrate. The housing 40 has an opening 41 at the top. The housing 40 is capable of storing the hot plate 20 inside. The lid 50 is configured to close the opening 41 in the top of the housing 40. The lid 50 has a top board panel 51 and a reinforcement panel 53. The top board panel 51 includes a heat insulating material. The reinforcement panel 53 has a first rib 533 and a second rib 535 that are jointed to a lower surface of the top plate panel 51. The first rib 533 and the second rib 535 project from the lower surface of the top plate panel 51 downwardly. The first rib 533 and the second rib 535 are formed to extend in parallel with the lower surface of the top plate panel 51.SELECTED DRAWING: Figure 2
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Description

[Technical field]

[0001] The subject matter disclosed herein relates to a substrate heating apparatus. [Background technology]

[0002] For example, in the process of treating various substrates such as glass substrates for display devices, a coating liquid is applied to the substrate, and then the substrate is heated to volatilize the components contained in the coating liquid. Substrate heating devices for carrying out such heating processes are generally configured to accommodate the substrate in a processing chamber and to heat the substrate in the processing chamber.

[0003] Patent Document 1 describes the application of a structure in which a heat insulating material is molded with fiber-reinforced resin to the wall surface of a processing chamber that houses a hot plate. With such a structure, the high temperature inside the processing chamber can be insulated and the temperature of the inner wall surface can be kept high, so that it is possible to suppress adhesion and solidification of sublimates that occur when photoresist is heated inside the wall constituting the processing chamber. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2022-052854 A Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, when constructing a processing chamber, a configuration may be adopted in which an opening is provided at the top of a housing that accommodates a hot plate, and the opening is closed with a lid. In a processing chamber with such a configuration, if the thermal insulation is increased, the temperature difference between the lower surface and the upper surface of the lid increases, and as a result, there is a possibility that the lid will be thermally warped. In particular, the larger the device size, the more likely it is that thermal warping will occur. Such thermal warping of the lid may cause problems such as a decrease in the airtightness of the processing chamber or poor opening and closing of the lid.

[0006] An object of the present invention is to provide a technique for reducing thermal warping of a lid portion in a substrate heating device while maintaining high thermal insulation of the lid portion. [Means for solving the problem]

[0007] In order to solve the above problems, a first aspect is a substrate heating device comprising: a hot plate for heating a substrate; a housing having an opening at the top and capable of housing the hot plate inside; and a lid for closing the opening at the top of the housing, wherein the lid has a top plate including a thermal insulating material and a reinforcing member having a rib portion connected to an underside of the top plate, the rib portion protruding downward from the underside of the top plate and extending parallel to the underside of the top plate.

[0008] A second aspect is the substrate heating device of the first aspect, wherein the rib portion includes a fiber reinforced resin.

[0009] A third aspect is a substrate heating device of the first or second aspect, wherein the rib portion includes a first rib portion extending in a first direction and a second rib portion extending in a second direction intersecting the first direction.

[0010] A fourth aspect is the substrate heating device according to the first or second aspect, wherein the reinforcing member further has a bottom plate portion connected to a lower portion of the rib portion and facing the top plate with a gap therebetween.

[0011] A fifth aspect is the substrate heating device of the fourth aspect, wherein a lower surface of the bottom plate portion is a flat surface.

[0012] A sixth aspect is the substrate heating device of the fourth aspect, wherein the rib portion and the bottom plate portion are integrally formed.

[0013] A seventh aspect is the substrate heating device of the fourth aspect, in which the reinforcing member has a low expansion portion that is located below the bottom plate portion and has a linear expansion coefficient lower than that of the reinforcing member.

[0014] An eighth aspect is the substrate heating device of the fourth aspect, wherein the lid portion further has a fixing portion that fixes the top plate to the reinforcing panel, and the fixing portion has a spacer positioned between the top plate and the bottom plate portion, and a spacer screw that engages with a screw hole provided on the upper part of the spacer and connects the top plate to the spacer.

[0015] A ninth aspect is the substrate heating apparatus of the eighth aspect, in which the top plate has an insulating plate including a heat insulating material, and a back plate located below the insulating plate and having higher abrasion resistance than the insulating plate.

[0016] A tenth aspect is the substrate heating device of the ninth aspect, wherein the fixing portion further has an annular first collar fixed between the head of the spacer screw and the spacer, and into which the threaded portion of the spacer screw is inserted, and the thickness of the first collar is greater than the thickness of the back plate, so that a gap is formed between the head of the spacer screw and the back plate.

[0017] An eleventh aspect is the substrate heating apparatus of the tenth aspect, in which the top plate further includes a decorative plate located above the insulating plate and having higher abrasion resistance than the insulating plate.

[0018] A twelfth aspect is the substrate heating device of the eleventh aspect, wherein the fixing part further includes a screw that engages with a screw hole provided in the upper part of the spacer screw, and a ring-shaped second collar fixed between the head of the screw and the head of the spacer screw and into which the threaded part of the screw is inserted, and the thickness of the second collar is greater than the thickness of the decorative plate, so that a gap is formed between the head of the screw and the decorative plate. Effect of the Invention

[0019] According to the substrate heating device of the first to tenth aspects, the rigidity of the top plate can be increased by the rib portion, and therefore the thermal warping of the lid portion can be reduced while maintaining high thermal insulation of the lid portion.

[0020] According to the substrate heating device of the second aspect, it is possible to reduce thermal warping of the lid while avoiding an increase in the weight of the lid.

[0021] According to the substrate heating device of the third aspect, since the ribs intersect, the rigidity of the top plate can be increased compared to a case in which the ribs do not intersect.

[0022] According to the substrate heating device of the fourth aspect, the rib portion can form a space between the top plate and the reinforcing member, thereby obtaining the effect of air insulation.

[0023] According to the substrate heating device of the fifth aspect, even if sublimate material from the coating liquid on the substrate adheres to the lower surface of the bottom plate portion, it can be easily removed by cleaning such as wiping it off.

[0024] According to the substrate heating device of the sixth aspect, by eliminating the joints between the components, it is possible to facilitate the assembly work of the reinforcing panel 53. Furthermore, by eliminating the joints between the components, it is possible to reduce the weight of the lid and increase its durability.

[0025] According to the substrate heating device of the seventh aspect, thermal warping of the bottom plate portion can be further reduced, and therefore thermal warping of the lid portion can be reduced.

[0026] According to the substrate heating device of the eighth aspect, the position of the top panel with respect to the bottom plate portion can be appropriately adjusted while ensuring the gap between the top panel and the bottom plate portion of the reinforcing panel by the spacer screw.

[0027] According to the substrate heating apparatus of the ninth aspect, the generation of dust and the like from the heat insulating plate can be reduced.

[0028] According to the substrate heating device of the tenth aspect, since the rear plate is not fixed by the spacer screws, even if the rear plate thermally expands, the deformation of the rear plate is not suppressed by the spacer screws, and therefore the stress inside the rear plate can be reduced, and thus deformation such as thermal warping or damage such as cracks in the rear plate can be reduced.

[0029] According to the substrate heating apparatus of the eleventh aspect, it is possible to reduce the generation of dust and the like from the heat insulating plate.

[0030] According to the substrate heating device of the twelfth aspect, since the decorative board is not fixed with screws, even if the decorative board expands thermally, the deformation of the decorative board is not suppressed by the screws, and therefore the stress inside the decorative board can be reduced, and thus the deformation such as thermal warping or damage such as cracks in the decorative board can be reduced. [Brief description of the drawings]

[0031] [Figure 1] 1 is a perspective view showing a substrate heating device according to a first embodiment. [Diagram 2] 2 is a cross-sectional view of the substrate heating device taken along the line II-II in FIG. 1. [Diagram 3] FIG. 2 is an exploded perspective view showing the structure of the lid portion shown in FIG. [Figure 4] FIG. 4 is a partially enlarged view showing a cross section of the lid portion. [Diagram 5] 13 is a diagram showing a lid portion provided in the substrate heating apparatus according to the second embodiment. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0032] Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings. Note that the components described in the embodiment are merely examples, and are not intended to limit the scope of the present invention. In the drawings, the dimensions and numbers of each part may be exaggerated or simplified as necessary for ease of understanding.

[0033] <1. First embodiment> Fig. 1 is a perspective view showing a substrate heating apparatus 1 according to a first embodiment. Fig. 2 is a diagram showing a cross section of the substrate heating apparatus 1 at a position along the line II-II shown in Fig. 1. Fig. 3 is an exploded perspective view showing the structure of a lid portion 50 shown in Fig. 1.

[0034] In some drawings, arrows indicating XYZ orthogonal coordinate axes may be added to facilitate understanding of the positional relationships of elements. The XY plane corresponds to the horizontal plane, and the Z axis corresponds to the vertical axis. The (-Z) direction corresponds to the vertical downward direction. In the following explanation, the vertical upward direction may be simply referred to as "upward" or "upper", and the vertical downward direction may be simply referred to as "downward" or "lower".

[0035] The substrate heating apparatus 1 volatilizes the solvent component in the coating liquid by heating the substrate 9 with the substrate 9, the surface of which is coated with a coating liquid such as photoresist, housed therein. The substrate heating apparatus 1 can be used, for example, for the purpose of forming a photoresist film on the surface of the substrate 9. The substrate 9 is, for example, various substrates to be processed for electronic devices, specifically, a semiconductor wafer, a glass substrate for a liquid crystal display or a plasma display, a glass or ceramic substrate for a magnetic disk or an optical disk, a glass substrate for an organic electroluminescence (EL) display, a glass or silicon substrate for a solar cell, a flexible substrate, a printed circuit board, etc.

[0036] The substrate heating apparatus 1 includes a processing chamber 10, a hot plate 20, and a substrate lifting mechanism 30. The hot plate 20 is accommodated inside the processing chamber 10. The hot plate 20 has a flat upper surface 20a. A heater such as an electric heating wire is built into the hot plate 20. When the heater is driven, the temperature of the upper surface 20a is raised to a predetermined temperature.

[0037] The substrate lifting mechanism 30 has a plurality of lift pins 31 and a lifting drive unit 33. The plurality of lift pins 31 extend vertically and are arranged in a horizontally distributed manner. The plurality of lift pins 31 are inserted into several through holes provided in the bottom wall of the housing unit 40 and the hot plate 20 in the processing chamber 10, and penetrate the bottom wall of the housing unit 40 and the hot plate 20. The lifting drive unit 33 raises and lowers the plurality of lift pins 31 together. The lifting drive unit 33 is arranged outside and below the processing chamber 10. The lifting drive unit 33 is configured, for example, by a rack and pinion mechanism or a ball screw mechanism including a motor.

[0038] The substrate 9 is supported by the upper ends of the plurality of lift pins 31. The lift drive unit 33 moves the plurality of lift pins 31 between a close position where the substrate 9 approaches the upper surface 20a of the hot plate 20 and an upper position that is higher than the close position. The operation of the lift drive unit 33 is controlled by a control unit constituted by, for example, a computer.

[0039] The processing chamber 10 has a substantially rectangular parallelepiped shape. The processing chamber 10 has a housing 40 and a lid 50. The housing 40 has an opening 41 at an upper portion. The housing 40 accommodates a hot plate 20 inside.

[0040] The lid part 50 has a generally plate-like shape and closes the opening 41 at the top of the housing part 40. The lid part 50 is removable from the top of the housing part 40. The lid part 50 is placed on the top of the housing part 40 via the seal part 43. The seal part 43 is a member that closes the gap between the housing part 40 and the lid part 50.

[0041] When the cover 50 is removed from the housing 40, the inner surface of the housing 40 is exposed to the outside through the opening 41 of the housing 40. In this state, various maintenance operations such as part replacement or cleaning inside the housing 40 are performed through the opening 41 of the housing 40.

[0042] The housing 40 has an entrance 45 on the (-Y) side. The housing 40 also has an opening / closing member 47. The opening / closing member 47 is moved by an opening / closing drive unit (not shown) constituted by a motor or the like between a closed position where the entrance 45 is closed and an open position where the entrance 45 is opened. The operation of such an opening / closing mechanism is controlled by a control unit.

[0043] As shown in FIG. 2, the lid 50 has a hollow plate-like structure having a cavity inside. The lid 50 has a top panel 51. The top panel 51 is a plate-like member having a rectangular shape when viewed from above. The top panel 51 has an insulating plate 511 (see FIG. 3) formed of an insulating material. As the insulating material, for example, a fiber-based insulating material, a foam-based insulating material, aerogel, fumed silica, a vacuum insulating material, or a combination of some of these can be used. The fiber-based insulating material includes, for example, glass wool, rock wool, cellulose fiber, carbonized cork, wool insulating material, or wood fiber. The foam-based insulating material includes, for example, urethane foam, phenol foam, polystyrene foam, bead-processed polystyrene (EPS), foamed rubber (FEF), or extruded polystyrene (XPS). The aerogel includes, for example, silica aerogel, carbon aerogel, or alumina aerogel.

[0044] At least a part of the outer surface of the insulating board 511 may be covered with fiber-reinforced resin. Fiber-reinforced resin is a composite material that combines resin and fiber. As the fiber-reinforced resin, glass fiber-reinforced plastic (GFRP), carbon fiber-reinforced plastic (CFRP), aramid fiber-reinforced plastic (AFRP), natural fiber-reinforced plastic, or a combination of these may be used. Also, a plurality of fiber-reinforced resins of the same or different types may be laminated on the outer surface of the insulating board 511. By covering the insulating board 511 with fiber-reinforced resin, the abrasion resistance of the insulating board 511 can be improved. This can reduce scattering of dust of the insulating material.

[0045] 3, the top panel 51 has an insulating plate 511, a decorative plate 513 superimposed on the upper side of the insulating plate 511, and a back plate 515 superimposed on the lower side of the insulating plate 511. The decorative plate 513 and the back plate 515 are preferably formed of a material having higher abrasion resistance than the insulating plate 511, specifically, a carbon plate or the like. Note that the decorative plate 513 and the back plate 515 may be omitted.

[0046] In addition, as shown in FIG. 3, the top panel 51 has a structure in which four blocks are arranged in two rows and two columns. Each block has a structure in which a decorative plate 513 and a back plate 515 are layered on an insulating plate 511. By dividing the top panel 51 into a plurality of blocks, even if the top panel 51 expands and deforms due to heating, each block expands independently, so that the deformation can be limited to a localized deformation. Therefore, the deformation of the entire top panel 51 can be reduced. Even if thermal expansion occurs, stress according to the size of each block acts, so that the overall stress can be reduced. This reduces deformation such as warping or damage such as cracks in the top panel 51.

[0047] The lid portion 50 further has a reinforcing panel 53. The reinforcing panel 53 has a bottom plate portion 531, a plurality (here, five) of first rib portions 533, a plurality (here, five) of second rib portions 535, and an outer frame portion 537. The bottom plate portion 531 is a plate-like member having a quadrangular shape in a top view. Each of the first rib portions 533, each of the second rib portions 535, and the outer frame portion 537 protrude upward from the upper surface of the bottom plate portion 531. The lower surface of the bottom plate portion 531 is preferably a flat surface.

[0048] Each of the first rib portions 533 extends in the X direction (first direction), preferably parallel to the X direction. Each of the second rib portions 535 extends in the Y direction (second direction), preferably parallel to the Y direction. That is, the second rib portions 535 intersect with the first rib portions 533, preferably perpendicular to the first rib portions 533. Both ends of each of the first rib portions 533 and both ends of each of the second rib portions 535 are connected to the outer frame portion 537.

[0049] The outer frame portion 537 has a rectangular tubular shape standing upward from the four sides of the peripheral portion of the bottom plate portion 531. The upper part of the outer frame portion 537 is located higher than the upper parts of the first rib portions 533 and the upper parts of the second rib portions 535. When the top panel 51 is attached to the reinforcing panel 53, the top panel 51 is fitted inside the outer frame portion 537. The lower surface of the top panel 51 is in contact with the upper parts of the first rib portions 533 and the upper parts of the second rib portions 535.

[0050] The reinforcing panel 53 is integrally molded from, for example, fiber reinforced resin. That is, the bottom plate portion 531, the first rib portion 533, and the second rib portions 535 and 537 are integrally molded from fiber reinforced resin. As the fiber reinforced resin, carbon fiber reinforced resin can be used. As a molding method for the reinforcing panel 53, for example, RTM (Resin Transfer Molding) molding can be adopted.

[0051] It is not essential that the reinforcing panel 53 is integrally formed. In other words, some of the bottom plate portion 531, the first rib portion 533, the second rib portion 535, and the outer frame portion 537 may be formed of a different material from the remaining portions.

[0052] Fig. 4 is a partially enlarged view showing a part of a cross section of the lid part 50. As shown in Fig. 4, the lid part 50 has a plurality of fixing parts 60 for connecting the top panel 51 to the reinforcing panel 53. Each fixing part 60 includes a spacer 61, a spacer screw 63, a screw 65, a first collar 67, and a second collar 69.

[0053] The spacer 61 is provided to ensure a gap between the top panel 51 and the bottom plate portion 531 of the reinforcing panel 53 in the Z direction and to appropriately adjust the position of the top panel 51 with respect to the bottom plate portion 531. The spacer 61 is fixed to the bottom plate portion 531 of the reinforcing panel 53 via an adhesive or the like. The spacer 61 may also be fixed to the first rib portion 533 or the second rib portion 535 via an adhesive or the like.

[0054] In the illustrated example, one spacer 61 is disposed on each of the +Y side and the -Y side of the first rib portion 533. However, the location of the spacer 61 is not limited thereto. Also, the spacer 61 is a separate member from the reinforcing panel 53, but may be molded integrally with the reinforcing panel 53, for example.

[0055] The spacer 61 is located between the top panel 51 (more specifically, the back panel 515) and the bottom plate portion 531 of the reinforcing panel 53, and is sandwiched between the top panel 51 and the bottom plate portion 531. In the Z direction, the dimension of the spacer 61 is approximately the same as the dimensions of the first rib portion 533 and the second rib portion 535.

[0056] The spacer screw 63 has a head 631 and a threaded portion 633. In the Z direction, the head 631 of the spacer screw 63 is located between the decorative plate 513 and the back plate 515. In the Z direction, the size of the head 631 of the spacer screw 63 is approximately the same as the size of the heat insulating plate 511. A screw hole that engages with the threaded portion 633 of the spacer screw 63 is provided in the upper part of the spacer 61. The threaded portion 633 of the spacer screw 63 penetrates the back plate 515 and is fixed to the screw hole of the spacer 61. The head 631 is inserted into a through hole provided in the heat insulating plate 511. The spacer screw 63 ensures a gap between the decorative plate 513 and the back plate 515 in the Z direction. This allows the position of the decorative plate 513 relative to the back plate 515 to be appropriately adjusted. In addition, in the Z direction, the position of the back plate 515 is regulated by the head 631 of the spacer screw 63 and the spacer 61.

[0057] The screw 65 has a head 651 and a threaded portion 653. A screw hole that engages with the threaded portion 653 of the screw 65 is provided at the upper portion of the spacer screw 63. The threaded portion 653 of the screw 65 penetrates the decorative plate 513 and is fixed to the screw hole of the spacer screw 63. The decorative plate 513 is disposed between the head 651 of the screw 65 and the head 631 of the spacer screw 63.

[0058] The first collar 67 is a member having an annular shape in a top view. The first collar 67 is sandwiched and fixed between the head 631 of the spacer screw 63 and the spacer 61 in the Z direction. The thickness of the first collar 67 in the Z direction is slightly larger than the thickness of the back plate 515. Therefore, when the spacer screw 63 is fixed to the spacer 61, a small gap is formed between the head 631 and the back plate 515 in the Z direction.

[0059] The second collar 69 is a member having an annular shape in a top view. The second collar 69 is fixed by being sandwiched between the head 651 of the screw 65 and the head 631 of the spacer screw 63 in the Z direction. The thickness of the second collar 69 in the Z direction is slightly larger than the thickness of the decorative plate 513. Therefore, when the screw 65 is fixed to the spacer screw 63, a small gap is formed between the head 651 and the decorative plate 513 in the Z direction.

[0060] As described above, the substrate heating device 1 of the present embodiment includes the hot plate 20, the housing 40, and the lid 50. The hot plate 20 heats the substrate 9. The housing 40 has an opening 41 at the top. The housing 40 can accommodate the hot plate 20 inside. The lid 50 closes the opening 41 at the top of the housing 40. The housing 40 has a top panel 51 as a top plate and a reinforcing panel 53 as a reinforcing member. The top panel 51 includes a heat insulating material. The reinforcing panel 53 has a first rib portion 533 and a second rib portion 535 as rib portions connected to the lower surface of the top panel 51. The first rib portion 533 and the second rib portion 535 protrude downward from the lower surface of the top panel 51 and extend parallel to the lower surface of the top panel 51. According to this configuration, the rigidity of the top panel 51 can be increased by the first rib portion 533 and the second rib portion 535. Therefore, the thermal warping of the lid portion 50 can be reduced while maintaining high thermal insulation of the lid portion 50.

[0061] The first rib portion 533 and the second rib portion 535 include a fiber reinforced resin. With this configuration, it is possible to prevent the lid portion 50 from becoming heavy, and to reduce thermal warping of the lid portion 50.

[0062] The rib portion includes a first rib portion 533 extending in a first direction (X direction) and a second rib portion 535 extending in a second direction (here, Y direction perpendicular to the X direction) intersecting the first direction. With this configuration, the bottom plate portion 531 and the second rib portion 535 intersect with each other, so that the rigidity of the top panel 51 can be further increased compared to when they do not intersect.

[0063] The reinforcing panel 53 has a bottom plate portion 531. The bottom plate portion 531 is connected to lower portions of the first rib portion 533 and the second rib portion 535. The bottom plate portion 531 faces the top panel 51 with a gap therebetween in the Z direction. With this configuration, a space can be formed between the top panel 51 and the reinforcing panel 53 by the first rib portion 533 and the second rib portion 535. This provides an air insulation effect.

[0064] The lower surface of the bottom plate portion 531 is a flat surface. With this configuration, even if sublimate material from the coating liquid for the substrate 9 adheres to the lower surface of the bottom plate portion 531, it can be easily removed by cleaning such as wiping.

[0065] The first rib portion 533, the second rib portion 535 and the bottom plate portion 531 are integrally molded. With this configuration, by eliminating joints between the parts, it is possible to facilitate the assembly work of the reinforcing panel 53. Furthermore, by eliminating joints between the parts, it is possible to reduce the weight of the lid portion 50 while increasing its durability.

[0066] The lid portion 50 further has a fixing portion 60 that fixes the top panel 51 to the reinforcing panel 53. The fixing portion 60 has a spacer 61 and a spacer screw 63. The spacer 61 is located between the top panel 51 and the bottom plate portion 531. The spacer screw 63 engages with a screw hole provided in the upper portion of the spacer 61. The spacer screw 63 connects the top panel 51 to the spacer 61. According to this configuration, the position of the top panel 51 relative to the bottom plate portion 531 can be appropriately adjusted while ensuring the gap between the top panel 51 and the bottom plate portion 531 of the reinforcing panel 53 by the spacer screw 63.

[0067] The top panel 51 has an insulating plate 511 and a back plate 515. The insulating plate 511 includes a heat insulating material. The back plate 515 is located below the insulating plate 511. The back plate 515 has higher abrasion resistance than the insulating plate 511. With this configuration, it is possible to reduce the generation of dust and the like from the insulating plate 511.

[0068] The fixing part 60 further has a first collar 67. The first collar 67 is fixed between the head 631 of the spacer screw 63 and the spacer 61. The first collar 67 is thicker than the back plate 515. The first collar 67 has an annular shape into which the threaded part 633 of the spacer screw 63 is inserted. A gap is formed between the head 631 of the spacer screw 63 and the back plate 515. According to this configuration, since the back plate 515 is not fixed by the spacer screw 63, even if the back plate 515 thermally expands, the deformation of the back plate 515 is not suppressed by the spacer screw 63, so that the stress inside the back plate 515 can be reduced. Therefore, deformation such as thermal warping or damage such as cracks in the back plate 515 can be reduced.

[0069] The top panel 51 further has a decorative plate 513. The decorative plate 513 is located above the insulating plate 511 and has higher abrasion resistance than the insulating plate 511. With this configuration, the generation of dust and the like from the insulating plate 511 can be reduced.

[0070] The fixing part 60 has a screw 65 and a second collar 69. The screw 65 engages with a screw hole provided in the upper part of the spacer screw 63. The second collar 69 is fixed between the head 651 of the screw 65 and the head 631 of the spacer screw 63. The thickness of the second collar 69 is greater than the thickness of the decorative plate 513. The second collar 69 has an annular shape into which the threaded part 653 of the screw 65 is inserted. A gap is formed between the head 651 of the screw 65 and the decorative plate 513. According to this configuration, since the decorative plate 513 is not fixed by the screw 65, even if the decorative plate 513 thermally expands, the deformation of the decorative plate 513 is not suppressed by the screw 65, so that the stress inside the decorative plate 513 can be reduced. Therefore, deformation such as thermal warping or damage such as cracks in the decorative plate 513 can be reduced.

[0071] <2. Second embodiment> Next, a second embodiment will be described. In the following description, elements having the same functions as elements already described will be given the same reference numerals or reference numerals with an additional alphabetical character, and detailed description thereof may be omitted.

[0072] 5 is a diagram showing a lid part 50a provided in the substrate heating apparatus 1 according to the second embodiment. Like the lid part 50, the lid part 50a includes a top panel 51 and a reinforcing panel 53. However, the lid part 50a further includes a low-expansion member 55. The low-expansion member 55 is located below the reinforcing panel 53, and in this embodiment, is joined to the lower surface of a bottom plate part 531 of the reinforcing panel 53.

[0073] The linear expansion coefficient of the low expansion member 55 is lower than that of the reinforcing panel 53. For example, a prepreg material (carbon fiber sheet pre-impregnated with resin) can be used as the low expansion member 55. The low expansion member 55 may also be a coating layer formed by applying a coating agent containing a resin or the like. The coating agent is appropriately selected depending on the surface material of the bottom plate portion 531. For example, when the reinforcing panel 53 is a flame-retardant fiber-reinforced resin, a coating agent containing a brominated bisphenol A type epoxy acrylate resin can be used.

[0074] In this way, the reinforcing panel 53 of the lid portion 50a is located below the bottom plate portion 531 and has the low expansion member 55 having a lower linear expansion coefficient than the reinforcing panel 53. With this configuration, thermal warping of the bottom plate portion 531 can be actively reduced, and therefore thermal warping of the lid portion 50 can be reduced.

[0075] Although the present invention has been described in detail, the above description is merely illustrative in all respects, and the present invention is not limited thereto. It is understood that countless variations not illustrated can be envisioned without departing from the scope of the present invention. The configurations described in the above embodiments and variations can be appropriately combined or omitted as long as they are not mutually contradictory. [Explanation of symbols]

[0076] 1 Substrate heating device 9 Substrate 20 Hot Plate 40 Housing 41 Aperture 43 Seal part 50,50a Lid 51 Top panel (top) 53 Reinforcement panel (reinforcement member) 55 Low expansion material (low expansion part) 60 Fixed part 61 Spacer 63 Spacer screw 65 bis 67 1st Color 69 2nd Color 511 Insulation board 513 Decorative Panel 515 Back plate 531 Bottom plate part 533 First rib 535 Second rib section

Claims

1. A substrate heating device, comprising: A hot plate for heating the substrate; A housing part having an opening at an upper part and capable of accommodating the hot plate therein; A cover portion that closes an opening at an upper portion of the housing portion; Equipped with The lid portion is A top plate including a thermal insulation material; A reinforcing member having a rib portion connected to the lower surface of the top plate; having The rib portion protrudes downward from a lower surface of the top plate and extends parallel to the lower surface of the top plate.

2. 2. The substrate heating apparatus according to claim 1, The rib portion includes a fiber reinforced resin.

3. 3. The substrate heating apparatus according to claim 1, The rib portion is A first rib portion extending in a first direction; A second rib portion extending in a second direction intersecting the first direction; A substrate heating device comprising:

4. 3. The substrate heating apparatus according to claim 1, The reinforcing member is The substrate heating device further includes a bottom plate portion connected to a lower portion of the rib portion and facing the top plate with a gap therebetween.

5. The substrate heating apparatus according to claim 4, A substrate heating device, wherein the lower surface of the bottom plate portion is a flat surface.

6. The substrate heating apparatus according to claim 4, The rib portion and the bottom plate portion are integrally formed.

7. The substrate heating apparatus according to claim 4, The reinforcing member is located below the bottom plate portion and has a low expansion portion having a linear expansion coefficient lower than that of the reinforcing member.

8. The substrate heating apparatus according to claim 4, The lid portion further includes a fixing portion that fixes the top plate to the reinforcing panel, The fixing portion is a spacer positioned between the top plate and the bottom plate; a spacer screw that engages with a screw hole provided in an upper portion of the spacer and connects the top plate to the spacer; A substrate heating device comprising:

9. 9. The substrate heating apparatus according to claim 8, The top plate is An insulating board including a thermal insulating material; A back plate located below the heat insulating plate and having higher abrasion resistance than the heat insulating plate; A substrate heating device comprising:

10. 10. The substrate heating apparatus according to claim 9, The fixing portion is a first annular collar fixed between the head of the spacer screw and the spacer, and into which the threaded portion of the spacer screw is inserted; and The thickness of the first collar is greater than the thickness of the back plate; A substrate heating apparatus, wherein a gap is formed between the head of the spacer screw and the back plate.

11. The substrate heating apparatus according to claim 10, The top plate is A decorative plate located above the insulating plate and having higher abrasion resistance than the insulating plate; The substrate heating apparatus further comprises:

12. The substrate heating apparatus according to claim 11, The fixing portion is a screw that engages with a screw hole provided in an upper portion of the spacer screw; a second collar having an annular shape, the second collar being fixed between the head of the screw and the head of the spacer screw and into which the threaded portion of the screw is inserted; and The thickness of the second collar is greater than the thickness of the decorative board; A substrate heating device, wherein a gap is formed between the head of the screw and the decorative plate.

Citation Information

Patent Citations

  • Substrate processing apparatus

    JP2022052854A