Wiring board, package for electronic component accommodation, and electronic module

Abstract

To provide a wiring board, a package for an electronic component accommodation, and an electronic module with a higher high-frequency transmission characteristic.SOLUTION: One embodiment of a wiring board includes a first insulator, a second insulator, a first signal conductor, a second signal conductor, a first ground conductor, a second ground conductor, and a third insulator. The first signal conductor is exposed to a first surface of the first insulator. The second signal conductor is exposed to a second surface of the second insulator. A direction where the first signal conductor extends is a first direction. The first ground conductor exists surrounding a part of the first insulator in a cross-sectional view intersecting with the first direction. The second ground conductor exists surrounding a part of the second insulator in the cross-sectional view intersecting with the first direction. When a surface of the first ground conductor that is in contact with the first insulator is a third surface, the third surface exists along the first signal conductor in the first direction. When a surface of the second ground conductor that is in contact with the second insulator is a fourth surface, the fourth surface exists along the second signal conductor in the first direction.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a wiring board, an electronic component storage package, and an electronic module. [Background technology]

[0002] 2. Description of the Related Art Conventionally, in wiring boards, ground via conductors are provided in a fence-like pattern at intervals around the periphery of wiring in order to adjust impedance and reduce the effects of noise (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 084601 Summary of the Invention [Problem to be solved by the invention]

[0004] In a wiring board having differential wiring, when ground via conductors are provided at intervals around the wiring, resonance due to high frequency signals is likely to occur, and the high frequency transmission characteristics of the differential wiring may not be fully exhibited. In addition, the electric field is likely to be disturbed especially at the bent parts of the wiring, which also reduces the high frequency transmission characteristics.

[0005] An object of the present disclosure is to provide a wiring board, an electronic component storage package, and an electronic module having improved high-frequency transmission characteristics. [Means for solving the problem]

[0006] (1) One aspect of a wiring board according to the present disclosure is a first insulator having a first surface; a second insulator positioned alongside the first insulator and having a second surface; a first signal conductor exposed on the first surface and extending in a first direction; a second signal conductor exposed on the second surface and positioned along the first signal conductor; a first ground conductor in contact with the first insulator and surrounding a portion of the first insulator in a cross-sectional view intersecting the first direction; a second ground conductor in contact with the second insulator and surrounding a portion of the second insulator in a cross-sectional view intersecting the first direction; a third insulator positioned to surround a portion of the first ground conductor and a portion of the second ground conductor; when a surface of the first ground conductor that is in contact with the first insulator is defined as a third surface, the third surface is located along the first signal conductor in the first direction, When a surface of the second ground conductor that is in contact with the second insulator is defined as a fourth surface, the fourth surface is positioned along the second signal conductor in the first direction.

[0007] (2) One aspect of the wiring board according to the present disclosure is a first insulator having a first surface; a first signal conductor exposed on the first surface and extending in a first direction; a second signal conductor exposed on the first surface and positioned along the first signal conductor; a first ground conductor in contact with the first insulator and surrounding a portion of the first insulator in a cross-sectional view intersecting the first direction; a third insulator positioned surrounding a portion of the first ground conductor; When a surface of the first ground conductor that is in contact with the first insulator is defined as a third surface, the third surface is positioned along the first signal conductor and the second signal conductor in the first direction.

[0008] (3) One aspect of the wiring board according to the present disclosure is The wiring board according to (1) or (2), In a cross-sectional view intersecting the first direction, the third surface is arc-shaped.

[0009] (4) One aspect of the wiring board according to the present disclosure is The wiring board according to (1), the first ground conductor is exposed on the first surface; the second ground conductor is exposed on the second surface; In a cross-sectional view intersecting the first direction, The third surface and the fourth surface are semicircular arc-shaped, the first signal conductor overlaps a center point of the third surface; The second signal conductor overlaps with a center point of the fourth surface.

[0010] (5) One aspect of the wiring board according to the present disclosure is A wiring board according to any one of (1), (3), and (4), In a cross-sectional view intersecting the first direction, the distance between the first signal conductor and the third surface is constant.

[0011] (6) One aspect of the wiring board according to the present disclosure is The wiring board according to (1) or (2), In a cross-sectional view intersecting the first direction, the third surface has a polygonal linear shape having three or more corners.

[0012] (7) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards (1) and (3) to (6) above, The first ground conductor and the second ground conductor are continuous.

[0013] (8) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards according to (1) to (7), In a cross-sectional view intersecting the first direction, the first signal conductor and the second signal conductor have a semicircular shape.

[0014] (9) One aspect of the wiring board according to the present disclosure is The wiring board according to (4), In a cross-sectional view intersecting the first direction, the first signal conductor and the second signal conductor have a semicircular shape.

[0015] (10) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards (1) and (3) to (9) above, The antenna further includes a third ground conductor electrically connecting the first ground conductor and the second ground conductor.

[0016] (11) One aspect of the wiring board according to the present disclosure is The wiring board according to (10), The third ground conductor is exposed between the first surface and the second surface.

[0017] (12) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards according to (1) to (11), The first insulator has a dielectric constant smaller than the dielectric constant of the third insulator.

[0018] (13) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards according to (1) to (12), The first insulator has one or more holes, The hole is located along the first signal conductor.

[0019] (14) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards (1) and (3) to (9) above, the first ground conductor has a plurality of first openings; the second ground conductor has a plurality of second openings; In a plan view, the first openings overlap the first signal conductor and are arranged side by side along the first signal conductor; In a plan view, the second openings overlap the second signal conductor and are arranged side by side along the second signal conductor.

[0020] (15) One aspect of the wiring board according to the present disclosure is Any one of the wiring boards according to (2), (3), (6), (8), (12), and (13), the first ground conductor has a plurality of first openings and a plurality of second openings; In a plan view, the first openings overlap the first signal conductor and are arranged side by side along the first signal conductor; In a plan view, the second openings overlap the second signal conductor and are positioned side by side along the second signal conductor.

[0021] (16) One aspect of the electronic component storage package according to the present disclosure is A substrate; A frame body located on the substrate; and a wiring board according to any one of (1) to (15) above, joined to the frame.

[0022] (17) One aspect of the electronic module according to the present disclosure is The package for storing electronic components according to (16) above; an electronic component located on the substrate and electrically connected to the first signal conductor and the second signal conductor; and a lid body located on the frame body. Effect of the Invention

[0023] According to the present disclosure, it is possible to further improve the high-frequency transmission characteristics of a wiring board, an electronic component housing package, and an electronic module. [Brief description of the drawings]

[0024] [Figure 1] FIG. [Diagram 2] FIG. [Diagram 3] FIG. [Figure 4] FIG. [Diagram 5] FIG. [Figure 6]FIG. [Figure 7] FIG. [Figure 8] FIG. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] FIG. [Figure 13] FIG. [Figure 14] FIG. [Figure 15] FIG. [Figure 16] FIG. 1 is a perspective view of a wiring board used in a simulation. [Figure 17] 13 is a graph showing a simulation result. [Figure 18] FIG. 1 is a perspective view of a wiring board used in a simulation. [Figure 19] 13 is a graph showing a simulation result. [Figure 20] FIG. 2 is a perspective view of an electronic component storage package. [Figure 21] FIG. 2 is an exploded perspective view of the electronic module. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. However, for the sake of convenience, each of the drawings referred to below shows only the main components necessary for explaining the embodiment in a simplified form. Therefore, the wiring board, electronic component storage package, and electronic module of the present disclosure may include any component not shown in each of the drawings referred to. Furthermore, the dimensions of the components in each drawing do not faithfully represent the dimensions, dimensional ratios, etc. of the actual components.

[0026] In addition, in the embodiments described below, expressions such as "constant", "orthogonal", "vertical", "parallel", "perfect circle", "ellipse", "semicircle" or "semi-ellipse" may be used, but these expressions do not necessarily mean "constant", "orthogonal", "vertical", "parallel", "perfect circle", "ellipse", "semicircle" or "semi-ellipse" strictly. In other words, each of the above expressions allows for deviations due to, for example, manufacturing accuracy, installation accuracy, etc.

[0027] [Wiring board] The embodiments of the wiring board of the present disclosure are roughly divided into a first embodiment and a second embodiment. The first embodiment refers to an embodiment in which the wiring board has a second insulator and a second ground conductor, and the second signal conductor is exposed on the second surface of the second insulator. The second embodiment refers to an embodiment in which the wiring board does not have a second insulator and a second ground conductor, and the second signal conductor is exposed on the first surface of the first insulator together with the first signal conductor. Each of the first embodiment and the second embodiment includes other embodiments.

[0028] FIG. 1 is a perspective view of a first embodiment of a wiring board according to the present disclosure.

[0029] The wiring board 1 shown in FIG. 1 includes a first insulator 2, a second insulator 3, a first signal conductor 4, a second signal conductor 5, a first ground conductor 6, a second ground conductor 7, and a third insulator 8.

[0030] The first insulator 2 has a first surface S1. The second insulator 3 is positioned alongside the first insulator 2 and has a second surface S2. The first surface S1 and the second surface S2 are located on the same plane.

[0031] The first signal conductor 4 is exposed to the first surface S1. The second signal conductor 5 is exposed to the second surface S2 and is located along the first signal conductor 4. The direction in which the first signal conductor 4 extends is defined as a first direction X. If the first signal conductor 4 is not linear, the first direction X changes for each portion in accordance with the shape of the first signal conductor 4. The first signal conductor 4 and the second signal conductor 5 are a signal conductor pair for differential signal transmission.

[0032] The first ground conductor 6 is in contact with the first insulator 2 and is positioned so as to surround a portion of the first insulator 2 (excluding the first surface S1) in a cross-sectional view intersecting with the first direction X. The second ground conductor 7 is in contact with the second insulator 3 and is positioned so as to surround a portion of the second insulator 3 (excluding the second surface S2) in a cross-sectional view intersecting with the first direction X.

[0033] The third insulator 8 is positioned to surround a portion of the first ground conductor 6 and a portion of the second ground conductor 7 .

[0034] The surface of the first ground conductor 6 that contacts the first insulator 2 is defined as the third surface S3. The third surface S3 is located along the first signal conductor 4 in the first direction X. In the embodiment shown in FIG. 1, the third surface S3 is a curved surface. Note that, when the first insulator 2 has a polygonal shape in a cross section intersecting with the first direction X, the first ground conductor 6 may have a plurality of surfaces that contact the first insulator 2. In such a case, the plurality of surfaces are collectively defined as the third surface S3. The third surface S3 is located along the first signal conductor 4, for example, continuously for at least 0.2 mm or more.

[0035] The surface of the second ground conductor 7 that contacts the second insulator 3 is defined as the fourth surface S4. The fourth surface S4 is located along the second signal conductor 5 in the first direction X. In the embodiment shown in FIG. 1, the fourth surface S4 is a curved surface. Note that, when the second insulator 3 has a polygonal shape in a cross section intersecting with the first direction X, the second ground conductor 7 may have a plurality of surfaces that contact the second insulator 3. In such a case, the plurality of surfaces are collectively defined as the fourth surface S4. The fourth surface S4 is located along the second signal conductor 5, for example, continuously for at least 0.2 mm or more.

[0036] In a conventional wiring board in which ground via conductors are provided around the signal conductors at intervals, the ground conductors are not continuous along the signal conductors. In contrast, in the wiring board 1 of the first embodiment, the first ground conductor 6 is located continuously along the first signal conductor 4, and the second ground conductor 7 is located continuously along the second signal conductor 5. As a result, in the wiring board 1 of the first embodiment, resonance is unlikely to occur even when a high-frequency signal is transmitted, and electric field disturbance is unlikely to occur even in portions where the wiring is bent.

[0037] The third surface S3 and the fourth surface S4 in the embodiment shown in FIG. 1 are semicircular in cross section crossing the first direction X. This makes it easier for the distance between the first signal conductor 4 and the first ground conductor 6 to be constant in cross section crossing the first direction X. Similarly, the distance between the second signal conductor 5 and the second ground conductor 7 to be constant in cross section crossing the first direction X. This further reduces the occurrence of resonance and electric field disturbance. The semicircular shape refers to a perfect circular arc shape with a central angle of 170 to 190°. Note that the semicircular shape in the present disclosure is one that allows for deviations in manufacturing accuracy, installation accuracy, and the like, and may have a wobble.

[0038] In addition, the third surface S3 and the fourth surface S4 of the wiring board 1 of the present disclosure may be an arc shape other than a semicircular arc shape, may be a polygonal line shape having two corners, or may be a polygonal line shape having three or more corners, and are not particularly limited, in a cross section intersecting with the first direction X. The arc shape includes a perfect circular arc shape and an elliptical arc shape. In addition, the arc shape in the present disclosure allows for deviations in manufacturing accuracy, installation accuracy, and the like, and may have a wobble. The elliptical arc shape includes a semi-elliptical arc shape. The semi-elliptical arc shape refers to an elliptical arc shape with a central angle of 170 to 190°.

[0039] 1, the first ground conductor 6 is exposed on the first surface S1, and the second ground conductor 7 is exposed on the second surface S2. As a result, the first signal conductor 4 is covered by the first ground conductor 6 through the first insulator 2 inside the wiring board 1. Also, the second signal conductor 5 is covered by the second ground conductor 7 through the second insulator 3 inside the wiring board 1. This further reduces the occurrence of resonance and electric field disturbance.

[0040] In the embodiment shown in FIG. 1, the first signal conductor 4 and the second signal conductor 5 are semicircular in cross section crossing the first direction X. In cross section crossing the first direction X, the third surface S3 is semicircular and the first signal conductor 4 is semicircular with the arc facing the inside of the wiring conductor, so that the distance between the first signal conductor 4 and the first ground conductor 6 is likely to be constant. Similarly, in cross section crossing the first direction X, the fourth surface S4 is semicircular and the second signal conductor 5 is semicircular with the arc facing the inside of the wiring conductor, so that the distance between the second signal conductor 5 and the second ground conductor 7 is likely to be constant. This further reduces the occurrence of resonance and electric field disturbance. Note that the semicircular shape in the present disclosure is to allow for deviations in manufacturing accuracy, installation accuracy, and the like, and may have wobble.

[0041] In the embodiment shown in Fig. 1, the first signal conductor 4 overlaps with the center point of the third surface S3 in a cross-sectional view intersecting with the first direction X, and the second signal conductor 5 overlaps with the center point of the fourth surface S4. This makes it easier for the distance between the first signal conductor 4 and the first ground conductor 6 to be constant in the cross-sectional view. Similarly, the distance between the second signal conductor 5 and the second ground conductor 7 to be constant in the cross-sectional view. This further reduces the occurrence of resonance and electric field disturbance.

[0042] 1, the distance between the first signal conductor 4 and the third surface S3 is constant in a cross-sectional view intersecting with the first direction X. The distance between the second signal conductor 5 and the fourth surface S4 is also constant in a cross-sectional view intersecting with the first direction X. This further reduces the occurrence of resonance and electric field disturbance. A constant distance in a cross-sectional view means that the distance is constant (which may include an error of about 1 to 10 μm) in any direction, such as vertical, horizontal, or diagonal.

[0043] 1, the first ground conductor 6 and the second ground conductor 7 are continuous, which strengthens the ground potential and reduces the occurrence of crosstalk noise.

[0044] Fig. 2 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. The first ground conductor 6 and the second ground conductor 7 in the embodiment shown in Fig. 2 are in the form of a film. The first ground conductor 6 and the second ground conductor 7 in the embodiment shown in Fig. 2 are not continuous, unlike the first ground conductor 6 and the second ground conductor 7 in the embodiment shown in Fig. 1. In the present disclosure, "film-like" refers to a thickness of, for example, 1 µm or more and 20 µm or less.

[0045] Fig. 3 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 3, the wiring board 1 may include a third ground conductor 9. The third ground conductor 9 electrically connects the first ground conductor 6 and the second ground conductor 7. This strengthens the ground potential and reduces the occurrence of crosstalk noise.

[0046] In the embodiment shown in FIG. 3, the third ground conductor 9 is exposed between the first surface S1 and the second surface S2.

[0047] 4 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in FIG. 4, the third ground conductor 9 may have a semicircular shape in a cross section intersecting with the first direction X.

[0048] 5 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in FIG.

[0049] Fig. 6 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 6, each of the third surface S3 and the fourth surface S4 may have a polygonal linear shape in a cross section intersecting with the first direction X.

[0050] Fig. 7 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 7, each of the third surface S3 and the fourth surface S4 may have a polygonal linear shape having four corners in a cross-sectional view intersecting with the first direction X.

[0051] Fig. 8 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 8, each of the third surface S3 and the fourth surface S4 may have a stepped polygonal linear shape having six corners in a cross-sectional view intersecting with the first direction X.

[0052] Fig. 9 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 9, each of the third surface S3 and the fourth surface S4 may have a semi-elliptical arc shape in a cross section intersecting with the first direction X. This allows the wiring board 1 to be made thinner. In this case, the first signal conductor 4 may have a semi-elliptical shape in a cross section intersecting with the first direction X. In addition, the second signal conductor 5 may also have a semi-elliptical shape in a cross section intersecting with the first direction X.

[0053] 9, the distance between the first signal conductor 4 and the third surface S3 is constant in a cross-sectional view intersecting with the first direction X. The distance between the second signal conductor 5 and the fourth surface S4 is also constant in a cross-sectional view intersecting with the first direction X. In other words, the shape of the first signal conductor 4 and the shape of the third surface S3 may be similar in a cross-sectional view intersecting with the first direction X.

[0054] FIG. 10 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in FIG. 10, the first insulator 2 may have one or more tubular holes 10 located along the first signal conductor 4, and the second insulator 3 may have one or more tubular holes 10 located along the second signal conductor 5. The above-mentioned holes 10 may be, for example, circular, elliptical, or rectangular in a cross-sectional view intersecting with the first direction X. The tubular holes 10 are, for example, voids. This can reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and reduce the decrease in impedance of the first signal conductor 4 and the second signal conductor 5.

[0055] FIG. 11 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in FIG. 11, the first insulator 2 may have a plurality of spherical holes 10 located along the first signal conductor 4, and the second insulator 3 may have a plurality of spherical holes 10 located along the second signal conductor 5. The spherical holes 10 are, for example, voids. This can reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and can reduce the decrease in impedance of the first signal conductor 4 and the second signal conductor 5. Here, the holes 10 may have any three-dimensional shape, and may be, for example, a prismatic, cylindrical, or conical shape other than the above-mentioned spherical shape.

[0056] FIG. 12 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in FIG. 12, the first ground conductor 6 may have a plurality of first openings 11, and the second ground conductor 7 may have a plurality of second openings 12. The plurality of first openings 11 overlap the first signal conductor 4 in a plan view and are positioned side by side along the first signal conductor 4. The plurality of second openings 12 overlap the second signal conductor 5 in a plan view and are positioned side by side along the second signal conductor 5. This can reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and can reduce the decrease in impedance of the first signal conductor 4 and the second signal conductor 5. The shapes of the first openings 11 and the second openings 12 may be circular, elliptical, or rectangular in a plan view. The shapes of the plurality of first openings 11 and the plurality of second openings 12 may be the same or different.

[0057] FIG. 13 is a perspective view of a wiring board 1 according to a second embodiment of the present disclosure.

[0058] The wiring board 1 in the embodiment shown in FIG. 13 includes a first insulator 2, a first signal conductor 4, a second signal conductor 5, a first ground conductor 6, and a third insulator 8.

[0059] The first insulator 2 has a first surface S1.

[0060] The first signal conductor 4 is exposed to the first surface S1. The second signal conductor 5 is exposed to the first surface S1 and is located along the first signal conductor 4. The direction in which the first signal conductor 4 extends is defined as a first direction X. If the first signal conductor 4 is not linear, the first direction X changes for each portion in accordance with the shape of the first signal conductor 4. The first signal conductor 4 and the second signal conductor 5 are a signal conductor pair for differential signal transmission.

[0061] The first ground conductor 6 is in contact with the first insulator 2 and is positioned so as to surround a part of the first insulator 2 (a part excluding the first surface S1) in a cross section intersecting the first direction X.

[0062] The third insulator 8 is positioned to surround a portion of the first ground conductor 6 .

[0063] The surface of the first ground conductor 6 that contacts the first insulator 2 is defined as the third surface S3. The third surface S3 is located along the first signal conductor 4 and the second signal conductor 5 in the first direction X. In the embodiment shown in FIG. 13, the third surface S3 is a curved surface. As described above, when the first insulator 2 has a polygonal shape in a cross section intersecting with the first direction X, the first ground conductor 6 may have a plurality of surfaces that contact the first insulator 2. In such a case, the plurality of surfaces are collectively defined as the third surface S3. The third surface S3 may be located along the first signal conductor 4 and the second signal conductor 5 for at least 0.2 mm or more in a continuous manner.

[0064] Inside the wiring board 1 in the second embodiment, the first ground conductor 6 is positioned continuously along the first signal conductor 4 and the second signal conductor 5. As a result, in the second embodiment as in the first embodiment, resonance is unlikely to occur even when a high-frequency signal is transmitted, and electric field disturbance is unlikely to occur even in portions where the wiring is bent.

[0065] 13, the third surface S3 has a semi-elliptical arc shape in a cross section intersecting with the first direction X. The first ground conductor 6 is exposed on the first surface S1. The first signal conductor 4 and the second signal conductor 5 have a semicircular or semi-elliptical shape in a cross section intersecting with the first direction X.

[0066] Fig. 14 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 14, the first ground conductor 6 may be in the form of a film.

[0067] Fig. 15 is a perspective view of another embodiment of the wiring board 1 of the present disclosure. As shown in Fig. 15, the third surface S3 may be polygonal in a cross-sectional view intersecting with the first direction X. The polygonal shape includes a polygonal shape having four corners, a polygonal shape having six corners, and the like, which has steps.

[0068] In the second embodiment, the first ground conductor 6 may also have a plurality of first openings 11 and a plurality of second openings 12. In a plan view, the plurality of first openings 11 overlap the first signal conductor 4 and are positioned side by side along the first signal conductor 4. In addition, in a plan view, the plurality of second openings 12 overlap the second signal conductor 5 and are positioned side by side along the second signal conductor 5. This can reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and can reduce a decrease in impedance of the first signal conductor 4 and the second signal conductor 5.

[0069] Next, the materials of each member will be described. The following description is common to the first and second embodiments.

[0070] The material of the first insulator 2, the second insulator 3, and the third insulator 8 is a ceramic sintered body such as an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a mullite sintered body, or a glass ceramic.

[0071] Furthermore, the material of the first insulator 2, the second insulator 3, and the third insulator 8 may be a resin such as an epoxy resin, a polyimide, or a liquid crystal polymer. By using, for example, a polyimide or a liquid crystal polymer as the material of the first insulator 2, the second insulator 3, and the third insulator 8, the wiring board 1 can be used as a flexible printed circuit board (FPC) or a printed circuit board (PCB).

[0072] The dielectric constant of the first insulator 2 may be smaller than that of the third insulator 8. In this case, the material of the first insulator 2 may be, for example, a mullite sintered body or a resin, and the material of the third insulator 8 may be, for example, an aluminum oxide sintered body. This can increase the airtightness of the third insulator 8 while reducing the decrease in impedance of the first signal conductor 4. In the first embodiment, the dielectric constant of the second insulator 3 may also be smaller than that of the third insulator 8. This can increase the airtightness of the third insulator 8 while reducing the decrease in impedance of the second signal conductor 5. The dielectric constants of the first insulator 2 and the second insulator 3 may be the same or different.

[0073] The materials for the first signal conductor 4, the second signal conductor 5, the first ground conductor 6, the second ground conductor 7, and the third ground conductor 9 may be, for example, metals such as tungsten, molybdenum, manganese, copper, gold, silver, etc., or alloys thereof.

[0074] The wiring board 1 according to the present disclosure can be produced by, for example, 3D printing.

[0075] Next, with reference to FIGS. 16 to 19, a description will be given of the results of a simulation showing the effects of the wiring board 1 according to the present disclosure.

[0076] 16 is a perspective view of a wiring board 1, which is a comparative example. The wiring board 1 includes a signal conductor pair of a first signal conductor 4 and a second signal conductor 5 connecting a first port P1 and a second port P2, and a signal conductor pair of a first signal conductor 4 and a second signal conductor 5 connecting a third port P3 and a fourth port P4, on an insulating plate 41. The wiring board 1 includes a surface ground conductor 42 and an inner layer ground conductor 43, and further includes ground via conductors 44 that electrically connect these and are arranged in a fence shape at intervals around each signal conductor.

[0077] FIG. 17 is a graph showing a simulation result when a signal is transmitted to the wiring board 1 shown in FIG. 16. The vertical axis of the graph is the insertion loss [dB]. The horizontal axis of the graph is the frequency [GHz] of the transmission signal. St (Diff2, Diff1) shown by a solid line indicates the insertion loss between the first port P1 (transmitting side) and the second port P2 (receiving side). St (Diff4, Diff3) shown by a dashed line indicates the insertion loss between the third port P3 (transmitting side) and the fourth port P4 (receiving side). From the graph, it can be confirmed that in the conventional wiring board 1 shown in FIG. 16, the absolute value of the insertion loss becomes significantly larger (the amount of insertion loss becomes larger) when the frequency exceeds about 100 GHz. This is considered to be due to the occurrence of resonance and disturbance of the electric field due to the transmission of the high-frequency signal.

[0078] FIG. 18 is a perspective view of a wiring board 1 according to the present disclosure. The wiring board 1 includes a signal conductor pair of a first signal conductor 4 and a second signal conductor 5 connecting a first port P1 and a second port P2, and a signal conductor pair of a first signal conductor 4 and a second signal conductor 5 connecting a third port P3 and a fourth port P4. All of the signal conductor pairs have the structure according to the first embodiment. The first ground conductor 6 surrounding the first signal conductor 4 connecting the first port P1 and the second port P2, the second ground conductor 7 surrounding the second signal conductor 5 connecting the first port P1 and the second port P2, the first ground conductor 6 surrounding the first signal conductor 4 connecting the third port P3 and the fourth port P4, and the second ground conductor 7 surrounding the second signal conductor 5 connecting the third port P3 and the fourth port P4 are integrally continuous. The cross-sectional shape of each signal conductor in the direction in which it extends is semicircular. The cross-sectional shape of the third surface S3 or the fourth surface S4 of each ground conductor in the direction in which the signal conductor it surrounds extends is a semicircular arc. In the cross-sectional view in the direction in which each signal conductor extends, the distance between the first signal conductor 4 and the third surface S3 is constant, and the distance between the second signal conductor 5 and the fourth surface S4 is constant.

[0079] Fig. 19 is a graph showing a simulation result when a signal is transmitted to the wiring board 1 shown in Fig. 18. The vertical axis, horizontal axis, solid line, and dashed line of the graph are the same as those of the graph shown in Fig. 17. From the graph, it can be confirmed that the amount of insertion loss is not significantly larger when a high-frequency signal is transmitted in the wiring board 1 according to the present disclosure shown in Fig. 18 compared to the conventional wiring board 1 shown in Fig. 16. The insertion loss is reduced in the wiring board 1 according to the present disclosure shown in Fig. 18, particularly when a signal in a high-frequency band of 100 GHz or more is transmitted. This is believed to be because the occurrence of resonance and electric field disturbance due to the transmission of a high-frequency signal can be reduced.

[0080] [Package for storing electronic components] The use of the wiring board of the present disclosure is not particularly limited, but the wiring board of the present disclosure can be used, for example, as a package for storing electronic components. The package for storing electronic components can store electronic components in an airtight manner.

[0081] 20 is a perspective view of an embodiment of an electronic component storage package according to the present disclosure. An electronic component storage package 20 of this embodiment includes a substrate 21, a frame 22, and the wiring board 1 of the present disclosure.

[0082] The substrate 21 is, for example, a rectangular plate-like member. The frame body 22 is a frame-like member provided at a position surrounding an area for mounting electronic components in a plan view. As shown in Fig. 20, the frame body 22 may have a light-transmitting portion 23 for transmitting and receiving light between the inside and the outside of the electronic component housing package 20.

[0083] The substrate 21 and the frame 22 may be configured, for example, by laminating a plurality of insulating substrates. As the insulating substrate, for example, an aluminum oxide sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a mullite sintered body, a ceramic sintered body such as glass ceramics, etc. The material of the substrate 21 and the frame 22 may be a metal. Examples of the metal include copper, tungsten, molybdenum, iron, nickel, cobalt, and alloys thereof. Specific examples of the alloy include a copper-tungsten alloy, a copper-molybdenum alloy, and an iron-nickel-cobalt alloy. The material of the substrate 21 and the material of the frame 22 may be the same or different.

[0084] 20 further includes a seal ring 24. The seal ring 24 is located on the upper surface of the frame 22. The seal ring 24 functions as a sealant when the electronic component 32 is mounted on the electronic component storage package 20 and then the package 20 is hermetically sealed with a lid 34. The seal ring 24 may be formed by joining a frame-shaped metal plate containing an Fe-Ni alloy, an Fe-Ni-Co alloy, or the like, to a frame formed of a conductive paste containing a high-melting point metal such as tungsten or molybdenum, using a brazing material or the like.

[0085] [Electronic Module] 21 is an exploded perspective view of an embodiment of an electronic module according to the present disclosure. An electronic module 30 of this embodiment includes an electronic component storage package 20 according to the present disclosure, an electronic component 32, and a lid .

[0086] The electronic component 32 is located on a mount member 31 provided on the substrate 21. The electronic component 32 is electrically connected to the first signal conductor 4 and the second signal conductor 5 by a connection member such as a bonding wire 33. The electronic component 32 is an electronic component that inputs or outputs a high-frequency signal (e.g., a frequency band of about 10 GHz or more) related to optical communication. Specific examples of the electronic component 32 include a light-emitting element and a light-receiving element. However, these are merely examples, and the electronic component 32 is not limited to the above.

[0087] The lid 34 is located on the frame 22. The lid 34 is, for example, a plate-shaped member. The lid 34 may be any material that can reduce the intrusion of foreign matter such as moisture and fine particles into the interior (which may also be referred to as a cavity) of the electronic module 30. The lid 34 is, for example, made of the same metal material as the seal ring 24, or the same ceramic material as the substrate 21 and frame 22, which is processed and formed into a plate shape.

[0088] As described above, the wiring board 1 of the first embodiment according to the present disclosure includes the first insulator 2, the second insulator 3, the first signal conductor 4, the second signal conductor 5, the first ground conductor 6, the second ground conductor 7, and the third insulator 8. The first insulator 2 has a first surface S1. The second insulator 3 is located alongside the first insulator 2 and has a second surface S2. The first signal conductor 4 is exposed on the first surface S1 and extends in the first direction X. The second signal conductor 5 is exposed on the second surface S2 and is located along the first signal conductor 4. The first ground conductor 6 is in contact with the first insulator 2 and is located so as to surround a part of the first insulator 2 in a cross-sectional view intersecting with the first direction X. The second ground conductor 7 is in contact with the second insulator 3 and is located so as to surround a part of the second insulator 3 in a cross-sectional view intersecting with the first direction X. The third insulator 8 is positioned to surround a part of the first ground conductor 6 and a part of the second ground conductor 7. When a surface of the first ground conductor 6 in contact with the first insulator 2 is defined as a third surface S3, the third surface S3 is positioned along the first signal conductor 4 in the first direction X. When a surface of the second ground conductor 7 in contact with the second insulator 3 is defined as a fourth surface S4, the fourth surface S4 is positioned along the second signal conductor 5 in the first direction X. Inside the wiring board 1 in the first embodiment, the first ground conductor 6 is positioned continuously along the first signal conductor 4, and the second ground conductor 7 is positioned continuously along the second signal conductor 5. This makes it difficult for resonance to occur even when a high-frequency signal is transmitted to the first signal conductor 4 and the second signal conductor 5, and also makes it difficult for electric field disturbance to occur in portions where the wiring is bent.

[0089] A wiring board 1 according to a second embodiment of the present disclosure includes a first insulator 2, a first signal conductor 4, a second signal conductor 5, a first ground conductor 6, and a third insulator 8. The first insulator 2 has a first surface S1. The first signal conductor 4 is exposed on the first surface S1 and extends in a first direction X. The second signal conductor 5 is exposed on the first surface S1 and is located along the first signal conductor 4. The first ground conductor 6 is in contact with the first insulator 2 and is located surrounding a part of the first insulator 2 in a cross-sectional view intersecting with the first direction X. The third insulator 8 is located surrounding a part of the first ground conductor 6. When the surface of the first ground conductor 6 in contact with the first insulator 2 is defined as a third surface S3, the third surface S3 is located along the first signal conductor 4 and the second signal conductor 5 in the first direction X. Inside the wiring board 1 in the second embodiment, the first ground conductor 6 is positioned continuously along the first signal conductor 4 and the second signal conductor 5. This makes it difficult for resonance to occur even when a high-frequency signal is transmitted to the first signal conductor 4 and the second signal conductor 5, and also makes it difficult for electric field disturbance to occur in the portion where the wiring is bent.

[0090] In addition, in a cross section intersecting the first direction X, the third surface S3 may be arc-shaped. This allows the first ground conductor 6 to have a shape that can effectively reduce the occurrence of resonance and disturbance of the electric field.

[0091] In addition, in a cross section intersecting with the first direction X, the fourth surface S4 may be arc-shaped. This allows the second ground conductor 7 to have a shape that can effectively reduce the occurrence of resonance and electric field disturbance.

[0092] In the first embodiment, the first ground conductor 6 may be exposed on the first surface S1, and the second ground conductor 7 may be exposed on the second surface S2. In a cross-sectional view intersecting with the first direction X, the third surface S3 and the fourth surface S4 may be semicircular arc-shaped. The first signal conductor 4 may overlap with the center point of the third surface S3, and the second signal conductor 5 may overlap with the center point of the fourth surface S4. This allows the first ground conductor 6 and the second ground conductor 7 to have a shape that can effectively reduce the occurrence of resonance and electric field disturbance.

[0093] In the first embodiment, in a cross-sectional view intersecting the first direction X, the distance between the first signal conductor 4 and the third surface S3 may be constant. This allows the first ground conductor 6 to have a shape that can effectively reduce the occurrence of resonance and disturbance of the electric field.

[0094] In the first embodiment, in a cross-sectional view intersecting the first direction X, the distance between the second signal conductor 5 and the fourth surface S4 may be constant. This allows the second ground conductor 7 to have a shape that can effectively reduce the occurrence of resonance and electric field disturbance.

[0095] In addition, in a cross-sectional view intersecting with the first direction X, the third surface S3 may be in the form of a polygonal line having three or more corners. This allows the first ground conductor 6 to have a shape that can effectively reduce the occurrence of resonance and disturbance of the electric field.

[0096] In addition, in a cross-sectional view intersecting with the first direction X, the fourth surface S4 may be in the form of a polygonal line having three or more corners. This allows the second ground conductor 7 to have a shape that can effectively reduce the occurrence of resonance and electric field disturbance.

[0097] In the first embodiment, the first ground conductor 6 and the second ground conductor 7 may be continuous. This strengthens the ground potential and reduces the generation of crosstalk noise.

[0098] In addition, in a cross section intersecting the first direction X, the first signal conductor 4 and the second signal conductor 5 may have a semicircular shape. This may make it possible for the first signal conductor 4 and the second signal conductor 5 to be less susceptible to resonance and electric field disturbance.

[0099] In the first embodiment, a third ground conductor 9 that electrically connects the first ground conductor 6 and the second ground conductor 7 may be further provided. This strengthens the ground potential and reduces the generation of crosstalk noise.

[0100] Furthermore, the third ground conductor 9 may be exposed between the first surface S1 and the second surface S2. This strengthens the ground potential and reduces the generation of crosstalk noise.

[0101] The relative dielectric constant of the first insulator 2 may be smaller than the relative dielectric constant of the third insulator 8 . This makes it possible to reduce the decrease in impedance of the first signal conductor 4 and to increase the airtightness of the third insulator 8.

[0102] The second insulator 3 may have a smaller relative dielectric constant than the third insulator 8 . This makes it possible to reduce the decrease in impedance of the second signal conductor 5 and to increase the airtightness of the third insulator 8.

[0103] The first insulator 2 may also have one or more holes 10 located along the first signal conductor 4 . This makes it possible to reduce the relative dielectric constant around the first signal conductor 4, and thus to reduce the decrease in impedance of the first signal conductor 4.

[0104] The second insulator 3 may also have one or more holes 10 located along the second signal conductor 5 . This makes it possible to reduce the relative dielectric constant around the second signal conductor 5, and thus to reduce the decrease in impedance of the second signal conductor 5.

[0105] In the first embodiment, the first ground conductor 6 may have a plurality of first openings 11. The second ground conductor 7 may have a plurality of second openings 12. In a plan view, the plurality of first openings 11 may overlap the first signal conductor 4 and be positioned side by side along the first signal conductor 4. In a plan view, the plurality of second openings 12 may overlap the second signal conductor 5 and be positioned side by side along the second signal conductor 5. This makes it possible to reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and thus to reduce the decrease in impedance of the first signal conductor 4 and the second signal conductor 5.

[0106] In addition, in the second embodiment, the first ground conductor 6 has a plurality of first openings 11 and a plurality of second openings 12, and in a planar view, the plurality of first openings 11 overlap the first signal conductor 4 and are positioned in a row along the first signal conductor 4, and in a planar view, the plurality of second openings 12 may overlap the second signal conductor 5 and be positioned in a row along the second signal conductor 5. This makes it possible to reduce the relative dielectric constant around the first signal conductor 4 and the second signal conductor 5, and thus to reduce the decrease in impedance of the first signal conductor 4 and the second signal conductor 5.

[0107] An electronic component storage package 20 according to the present disclosure includes a substrate 21, a frame body 22 located on the substrate 21, and the above-mentioned wiring board 1 joined to the frame body 22. An electronic module 30 according to the present disclosure includes the above-mentioned electronic component storage package 20, an electronic component 32 located on the substrate 21 and electrically connected to a first signal conductor 4 and a second signal conductor 5, and a lid body 34 located on the frame body 22. By including the wiring board 1 in which the occurrence of resonance and electric field disturbance is further reduced, the electronic component storage package 20 and the electronic module 30 according to the present disclosure have excellent high-frequency transmission characteristics.

[0108] Although each embodiment of the present disclosure has been described above, the wiring board 1, the electronic component storage package 20, and the electronic module 30 of the present disclosure are not limited to the above-described embodiments.

[0109] For example, the first ground conductor 6 may not be exposed on the first surface S1, and the second ground conductor 7 may not be exposed on the second surface S2.

[0110] The thickness of the first ground conductor 6 may or may not be constant. The thickness of the second ground conductor 7 may or may not be constant.

[0111] The first signal conductor 4 and the second signal conductor 5 may have a curved portion when viewed from above the wiring board 1.

[0112] The second signal conductor 5 may have a portion that does not extend along the first direction X.

[0113] The first signal conductor 4 and the second signal conductor 5 may have the same length or different lengths.

[0114] The width (dimension in a direction perpendicular to the first direction X) of each signal conductor on the first surface S1 or the second surface S2 is, for example, 10 μm to 100 μm, but is not particularly limited. The width may be constant or may not be constant.

[0115] The distance between the first signal conductor 4 and the second signal conductor 5 is, for example, not less than 0.1 mm and not more than 1 mm, but is not particularly limited to this distance. The distance may or may not be constant.

[0116] In the first embodiment, the width of the first signal conductor 4 on the first surface S1 may be smaller or larger than the distance between the first signal conductor 4 and the first ground conductor 6 on the first surface S1. The width of the second signal conductor 5 on the second surface S2 may be smaller or larger than the distance between the second signal conductor 5 and the second ground conductor 7 on the second surface S2.

[0117] In the first embodiment, the distance (dimension in a direction perpendicular to the first direction X) between the first signal conductor 4 and the first ground conductor 6 on the first surface S1 is, for example, 20 μm to 200 μm, but is not particularly limited. The distance (dimension in a direction perpendicular to the first direction X) between the second signal conductor 5 and the second ground conductor 7 on the second surface S2 is, for example, 20 μm to 200 μm, but is not particularly limited.

[0118] In the second embodiment, the distance (dimension in a direction perpendicular to the first direction X) between the first signal conductor 4 and the first ground conductor 6 (the first ground conductor 6 located on the opposite side of the second signal conductor 5 as seen from the first signal conductor 4) on the first surface S1 is, for example, 20 μm or more and 200 μm or less, but is not particularly limited. In the second embodiment, the distance (dimension in a direction perpendicular to the first direction X) between the second signal conductor 5 and the first ground conductor 6 (the first ground conductor 6 located on the opposite side of the first signal conductor 4 as seen from the second signal conductor 5) on the first surface S1 is, for example, 20 μm or more and 200 μm or less, but is not particularly limited.

[0119] In the first embodiment, the first signal conductor 4 does not have to overlap with the center point of the third surface S3, and the second signal conductor 5 does not have to overlap with the center point of the fourth surface S4.

[0120] In the first embodiment, the distance between the first signal conductor 4 and the third surface S3 in a cross section intersecting with the first direction X may not be constant. In the first embodiment, the distance between the second signal conductor 5 and the fourth surface S4 in a cross section intersecting with the first direction X may not be constant.

[0121] The third surface S3 and the fourth surface S4 may be V-shaped, U-shaped, or the like in a cross section intersecting with the first direction X.

[0122] The shapes of the third surface S3 and the fourth surface S4 may be the same or different. When the third surface S3 and the fourth surface S4 are both semicircular, the diameter of the third surface S3 and the diameter of the fourth surface S4 in a cross-sectional view intersecting with the first direction X may be the same or different.

[0123] In the first embodiment, the minimum distance between the third surface S3 and the first signal conductor 4 is, for example, 10 μm to 200 μm, but is not particularly limited. In the first embodiment, the minimum distance between the fourth surface S4 and the second signal conductor 5 is, for example, 10 μm to 200 μm, but is not particularly limited.

[0124] In the second embodiment, the minimum distance between the third surface S3 and the first signal conductor 4 is, for example, 10 μm to 200 μm, but is not particularly limited. In the second embodiment, the minimum distance between the third surface S3 and the second signal conductor 5 is, for example, 10 μm to 200 μm, but is not particularly limited.

[0125] A dielectric film may be located on the first signal conductor 4 and the second signal conductor 5 .

[0126] The number and shape of the holes 10 are not particularly limited. When the holes 10 are tubular, the diameter of the holes 10 in a cross-sectional view intersecting with the first direction X is, for example, 5 μm or more and 50 μm or less, but is not particularly limited. When the holes 10 are spherical, the diameter of the holes 10 is, for example, 5 μm or more and 50 μm or less, but is not particularly limited.

[0127] There is no particular limitation on the number and shape of the first openings 11 and the second openings 12. The diameter of the first openings 11 and the second openings 12 in a plan view is, for example, 5 μm or more and 50 μm or less when converted into the diameter of a circle having the same area, but is not particularly limited.

[0128] In the electronic component storage package 20 or the electronic module 30, the wiring board 1 may be located entirely inside the electronic component storage package 20 or the electronic module 30 (cavity).

[0129] In electronic component storage package 20, substrate 21, frame 22, and wiring board 1 may be separate members or may be an integrated member.

[0130] In addition, the details shown in the above embodiments can be appropriately modified without departing from the spirit of the present disclosure. The scope of the present invention includes the scope of the invention described in the claims and its equivalents. Various combinations of the embodiments are not limited to the examples of the above embodiments. In addition, combinations of the embodiments with each other are also possible. [Explanation of symbols]

[0131] 1. Wiring board 2 First insulator 3 Second insulator 4 First Signal Conductor 5 Second signal conductor 6 First Ground Conductor 7 Secondary Ground Conductor 8 Third Insulator 9. Third Ground Conductor 10 hole 11 First opening 12 Second opening 20 Electronic component storage packages 21 Substrate 22 Frame 23 Translucent part 24 Seal ring 30 Electronic Module 31 Mounting material 32 Electronic Components 33 Bonding Wire 34 Lid 41 Insulating plate 42 Surface Ground Conductor 43 Inner layer ground conductor 44 Ground Via Conductor S1 1st page S2 side 2 S3 3rd page P1 First port P2 2nd port P3 3rd port P4 4th port X 1st direction

Claims

1. a first insulator having a first surface; a second insulator positioned alongside the first insulator and having a second surface; a first signal conductor exposed on the first surface and extending in a first direction; a second signal conductor exposed on the second surface and positioned along the first signal conductor; a first ground conductor in contact with the first insulator and surrounding a portion of the first insulator in a cross-sectional view intersecting the first direction; a second ground conductor in contact with the second insulator and surrounding a portion of the second insulator in a cross-sectional view intersecting the first direction; a third insulator positioned to surround a portion of the first ground conductor and a portion of the second ground conductor; a surface of the first ground conductor that is in contact with the first insulator is defined as a third surface, the third surface being located along the first signal conductor in the first direction; When a surface of the second ground conductor that is in contact with the second insulator is defined as a fourth surface, the fourth surface is located along the second signal conductor in the first direction. Wiring board.

2. a first insulator having a first surface; a first signal conductor exposed on the first surface and extending in a first direction; a second signal conductor exposed on the first surface and positioned along the first signal conductor; a first ground conductor in contact with the first insulator and surrounding a portion of the first insulator in a cross-sectional view intersecting the first direction; a third insulator positioned surrounding a portion of the first ground conductor; When a surface of the first ground conductor that is in contact with the first insulator is defined as a third surface, the third surface is located along the first signal conductor and the second signal conductor in the first direction. Wiring board.

3. In a cross-sectional view intersecting the first direction, the third surface is arc-shaped. The wiring board according to claim 1 .

4. the first ground conductor is exposed on the first surface; the second ground conductor is exposed on the second surface; In a cross-sectional view intersecting the first direction, The third surface and the fourth surface are semicircular arc-shaped, the first signal conductor overlaps a center point of the third surface; the second signal conductor overlaps with a center point of the fourth surface; The wiring board according to claim 1 .

5. In a cross-sectional view intersecting the first direction, a distance between the first signal conductor and the third surface is constant. The wiring board according to claim 4 .

6. In a cross-sectional view intersecting the first direction, the third surface has a polygonal linear shape having three or more corners. The wiring board according to claim 1 .

7. the first ground conductor and the second ground conductor are continuous. The wiring board according to claim 1 .

8. In a cross-sectional view intersecting the first direction, the first signal conductor and the second signal conductor have a semicircular shape. The wiring board according to claim 1 .

9. In a cross-sectional view intersecting the first direction, the first signal conductor and the second signal conductor have a semicircular shape. The wiring board according to claim 4 .

10. a third ground conductor electrically connecting the first ground conductor and the second ground conductor, The wiring board according to claim 1 .

11. the third ground conductor is exposed between the first surface and the second surface. The wiring board according to claim 10.

12. The dielectric constant of the first insulator is smaller than the dielectric constant of the third insulator. The wiring board according to claim 1 .

13. The first insulator has one or more holes, The hole is located along the first signal conductor. The wiring board according to claim 1 .

14. the first ground conductor has a plurality of first openings; the second ground conductor has a plurality of second openings; In a plan view, the first openings overlap the first signal conductor and are arranged along the first signal conductor, In a plan view, the second openings overlap the second signal conductor and are arranged side by side along the second signal conductor. The wiring board according to claim 1 .

15. the first ground conductor has a plurality of first openings and a plurality of second openings; In a plan view, the first openings overlap the first signal conductor and are arranged along the first signal conductor, In a plan view, the second openings overlap the second signal conductor and are arranged side by side along the second signal conductor. The wiring board according to claim 2 .

16. A substrate; A frame body located on the substrate; The wiring board according to claim 1 or 2, which is joined to the frame body. Package for storing electronic components.

17. The electronic component storage package according to claim 16 , an electronic component located on the substrate and electrically connected to the first signal conductor and the second signal conductor; A lid body positioned on the frame body, Electronic module.

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