Production device of polishing liquid and production method of polishing liquid

Abstract

To enable reliable production of polishing liquid of a predetermined concentration without requiring a step of forming a medicine into a tablet.SOLUTION: A production device 1 of polishing liquid includes at least: a placement part 20 on which an opening 13 of a container 10 is placed downward, the container 10 having the opening 13 storing a powder type medicine 3; a storage tank 30 that is arranged below the placement part 20 and stores a solvent 4; a supply member 40 that supplies the medicine 3 from the container 10 to the storage tank 30; and an agitation unit 50 that agitates the medicine 3 and the solvent 4 after the medicine 3 is input to the storage tank 30. By placing the container 10 on the placement part 20 and connecting the supply member 40 to the opening 13 of the container 10, the powder type medicine 3 in the container 10 is input to the storage tank 30.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an apparatus for producing a polishing liquid and a method for producing a polishing liquid. [Background technology]

[0002] Wafers with multiple devices such as ICs (Integrated Circuits) and LSIs (Large Scale Integration) formed on their front surface have their back surfaces ground to a specified thickness, and then are separated into individual devices by a separating device for use in electrical equipment such as mobile phones and personal computers.

[0003] The grinding process for grinding the back surface of the wafer uses a known grinding device, and a grinding wheel is attached to the spindle of the grinding device to process the wafer through rough grinding and finish grinding to a predetermined thickness (see, for example, Patent Document 1).

[0004] Normally, when the back surface of a wafer is ground, grinding marks (saw marks) remain on the ground surface. Therefore, after the grinding process, the back surface of the wafer is polished by CMP (Chemical Mechanical Polishing) to remove the saw marks (see, for example, Patent Document 2).

[0005] As one embodiment of the above-mentioned CMP, a fixed abrasive polishing pad containing abrasive grains is placed on the upper surface of a rotating table of a known polishing device, and a wafer held by a suction holding member above the fixed abrasive polishing pad is pressed against the fixed abrasive polishing pad, and polishing is performed while supplying a polishing liquid to the fixed abrasive polishing pad. As another embodiment of the above-mentioned CMP, polishing is performed while supplying a polishing liquid containing abrasive grains (free abrasive grains) to a polishing pad that does not contain abrasive grains.

[0006] The polishing liquid used in the polishing process may be stored in a tank adjusted to a predetermined concentration inside the polishing device, or a polishing liquid supplying device may be provided adjacent to the polishing device, which adjusts a concentrated polishing liquid (stock liquid tank) to a polishing liquid of a predetermined concentration and supplies the polishing liquid to the polishing device.

[0007] In either case, the worker had to carry the tank containing the polishing liquid (for example, a container with a capacity of 20 L) to the device and replace it, which was a heavy burden on the worker.

[0008] Therefore, the applicant invented and filed a patent application for a manufacturing method in which a predetermined amount of powdered chemicals is formed into solid tablets and a predetermined number of tablets are added to a stirring tank to produce a polishing liquid (see, for example, Patent Document 3). [Prior art documents] [Patent documents]

[0009] [Patent Document 1] JP 2000-288881 A [Patent Document 2] Japanese Patent Application Publication No. 8-099265 [Patent Document 3] JP 2018-187750 A Summary of the Invention [Problem to be solved by the invention]

[0010] However, the manufacturing method described in the above Patent Document 3 requires a step of molding the drug, which is costly. In addition, if the tablet is chipped when it is delivered to the customer, the tablet will not reach the specified weight, and a polishing solution of the specified concentration cannot be produced.

[0011] An object of the present invention is to provide an apparatus for producing a polishing liquid and a method for producing a polishing liquid that can reliably produce a polishing liquid of a predetermined concentration without requiring a process of forming a drug into a tablet. [Means for solving the problem]

[0012] In order to solve the above-mentioned problems and achieve the object, the polishing liquid manufacturing apparatus of the present invention is an apparatus for manufacturing a polishing liquid, which at least comprises a container having an opening in which a powdered chemical is contained, a mounting means for mounting the container with the opening facing downward, a storage tank for storing a solvent disposed below the mounting means, a supply means for supplying the chemical from the container to the storage tank, and a stirring means for feeding the chemical into the storage tank and stirring the chemical and the solvent, and is characterized in that the powdered chemical in the container is fed into the storage tank by placing the container on the mounting means and connecting the supply means to the opening of the container.

[0013] The method for producing a polishing liquid of the present invention is characterized in that a container containing a powdered chemical is placed with its opening facing downward on a mounting means, a supply means provided on the mounting means supplies the chemical in the container to a storage tank for storing a solvent arranged below the mounting means, the chemical and the solvent in the storage tank are stirred to produce the polishing liquid, and the chemical is stored in the container in an amount sufficient to produce a polishing liquid of a concentration used for chemical mechanical polishing of a workpiece. Effect of the Invention

[0014] The present invention has the effect of making it possible to reliably produce a polishing solution of a predetermined concentration without requiring a step of forming a drug into a tablet. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a diagram illustrating a configuration example of a polishing liquid manufacturing apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a cross-sectional view that typically shows a container placed on the placement means of the polishing liquid manufacturing apparatus shown in FIG. [Diagram 3] FIG. 3 is a diagram illustrating a configuration example of a polishing liquid manufacturing apparatus according to Modification 1 of the first embodiment. [Figure 4] FIG. 4 is a diagram illustrating a configuration example of a polishing liquid manufacturing apparatus according to Modification 2 of the first embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0017] [Embodiment 1] An apparatus for producing a polishing liquid according to a first embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a diagram that illustrates a configuration example of the apparatus for producing a polishing liquid according to the first embodiment. Fig. 2 is a cross-sectional diagram that illustrates a container placed on a placement means of the apparatus for producing a polishing liquid shown in Fig. 1.

[0018] The polishing liquid manufacturing apparatus 1 of embodiment 1 is an apparatus for manufacturing a polishing liquid 2 to be supplied to a workpiece 200 when the polishing apparatus 100 shown in FIG. 1 performs CMP (Chemical Mechanical Polishing) on ​​the workpiece 200.

[0019] (Workpiece) 1 is a substrate made of silicon, sapphire, gallium, SiC, GaN, LT, or the like, or a wafer such as a disk-shaped semiconductor wafer or optical device wafer having a substrate on whose surface an oxide film, nitride film, or metal film such as Cu is formed. The workpiece 200 has a surface 201 partitioned by planned division lines set in a lattice pattern, and devices (not shown) are formed in each of the regions.

[0020] The device is, for example, an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), an image sensor such as a CCD (Charge Coupled Device) or a CMOS (Complementary Metal Oxide Semiconductor), a MEMS (Micro Electro Mechanical Systems) or a semiconductor memory (storage device).

[0021] In the first embodiment, the workpiece 200 has a back surface 202 behind the front surface 201 ground by a known grinding device to be thinned to a predetermined finishing thickness, and minute irregularities called saw marks (also called grinding marks) are formed on the back surface 202. After the back surface 202 of the workpiece 200 is chemically mechanically polished by the polishing device 100, the workpiece 200 is divided into individual devices along the planned division lines.

[0022] (polishing equipment) The polishing apparatus 100 is a processing apparatus that chemically and mechanically polishes a back surface 202 of a workpiece 200 to remove saw marks from the back surface 202 of the workpiece 200. As shown in FIG 1, the polishing apparatus 100 includes a chuck table 110, a polishing unit 120, and a control unit (not shown).

[0023] The upper surface of the chuck table 110 is made of a porous material such as porous ceramics, and the upper surface is a holding surface 111 on which the workpiece 200 is placed. The holding surface 111 of the chuck table 110 is connected to a suction source (not shown), and the holding surface 111 is sucked by the suction source, thereby suction-holding the workpiece 200 placed on the holding surface 111. During chemical mechanical polishing, the chuck table 110 is rotated by a rotation mechanism around an axis parallel to the vertical direction.

[0024] The polishing unit 120 is a processing unit that is disposed above the chuck table 110 and that chemically mechanically polishes the back surface 202 of the workpiece 200 held on the holding surface 111 of the chuck table 110 by mounting a polishing plate 122 on which a polishing pad 121 is disposed for chemically mechanically polishing the back surface 202 exposed above the workpiece 200 held by the chuck table 110. The polishing unit 120 mounts the polishing plate 122 on the lower end of a spindle 123 that is rotated around an axis parallel to the vertical direction by a motor (not shown). The polishing unit 120 mounts the polishing plate 122 on the lower end of the spindle 123 and positions the polishing pad 121 of the polishing plate 122 facing the holding surface 111 of the chuck table 110.

[0025] The polishing unit 120 chemically mechanically polishes the back surface 202 of the workpiece 200 by rotating the spindle 123 and the polishing plate 122 around the axis by a motor and supplying the polishing liquid 2 to the back surface 202 of the workpiece 200 held on the chuck table 110 while pressing the polishing pad 121 against the chuck table 110 by a polishing feed unit not shown.

[0026] The control unit controls each of the above-mentioned constituent units constituting the polishing apparatus 100, and causes the polishing apparatus 100 to perform a processing operation on the workpiece 200. The control unit is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device.

[0027] The arithmetic processing device of the control unit performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the polishing apparatus 100 to the above-mentioned components of the polishing apparatus 100 via the input / output interface device. The control unit is also connected to a display unit configured with a liquid crystal display device or the like for displaying the status and images of the processing operation, an input unit used by the operator to register processing content information, and a notification unit for notifying the operator.

[0028] The input unit is composed of at least one of a touch panel provided on the display unit, a keyboard, etc. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0029] The polishing liquid manufacturing apparatus 1 supplies the polishing liquid 2 to the polishing apparatus 100. In the first embodiment, the polishing liquid 2 is composed of a chemical agent 3 (shown in FIG. 1) and a solvent 4 for dissolving the chemical agent 3. In the first embodiment, the chemical agent 3 becomes acidic or alkaline when dissolved in the solvent 4. In the first embodiment, the solvent 4 is pure water. Furthermore, the concentration of the chemical agent 3 in the polishing liquid 2 is predetermined when chemically mechanically polishing the workpiece 200.

[0030] The drug 3 is contained in a container 10 shown in Fig. 2. In the first embodiment, the drug 3 is contained in the container 10 in a powdered state. That is, the container 10 contains the drug 3 in powder form. The drug 3 refers to a drug in powder or granular form.

[0031] The container 10 has a main body 11 having a cylindrical appearance, and a truncated cone portion 12 that is connected to one end of the main body 11 and has a truncated cone-like appearance, and a space for containing the drug 3 is formed inside, spanning the main body 11 and the truncated cone portion 12.

[0032] The truncated cone portion 12 has a cylindrical opening 13 at the top that communicates between the inside and the outside. The opening 13 is closed by a sheet material 14 such as paper or film. The container 10 also contains an amount of chemicals 3 that is sufficient to produce a polishing liquid 2 having a concentration used for chemical mechanical polishing of a workpiece 200. That is, all of the chemicals 3 in the container 10 are supplied to a storage tank 30 that stores a solvent 4 of the polishing liquid production apparatus 1, and the chemicals 3 are dissolved in the solvent 4, thereby obtaining a polishing liquid 2 having a concentration used for chemical mechanical polishing.

[0033] 1, the polishing liquid manufacturing apparatus 1 includes a mounting unit 20 serving as a mounting means, a storage tank 30, a supply member 40 serving as a supply means, an agitation unit 50 serving as an agitation means, and a control unit (not shown). The mounting unit 20 mounts the container 10 with the opening 13 of the container 10 facing downward. In the first embodiment, the mounting unit 20 is formed in a cylindrical shape, and the inner circumferential surface is formed in the same shape as the outer shape of the truncated cone portion 12 of the container 10. The truncated cone portion 12 of the container 10 is placed on the inner circumferential surface of the mounting unit 20.

[0034] The storage tank 30 is formed in a box shape with an opening 31 formed at the top, and the solvent 4 is supplied into the storage tank 30 from a solvent tank 60 via a pump 61. In the present invention, the solvent 4 in the storage tank 30 may be supplied from a pure water supply source instead of the solvent tank 60. The opening 31 of the storage tank 30 is disposed below the mounting part 20 and the supply member 40. The storage tank 30 stores the solvent 4 supplied from the solvent tank 60.

[0035] The supply member 40 supplies the drug 3 from the container 10 to the storage tank 30. The supply member 40 is formed in a cylindrical shape with an outer diameter smaller than the inner diameter of the opening 13 of the container 10, and is attached to the inner circumference of the mounting part 20. In the first embodiment, the supply member 40 has an upper end formed in a notched shape. The supply member 40 has an upper end pierced into the sheet material 14 of the container 10 mounted on the mounting part 20, enters the opening 13 of the container 10, and supplies the drug 3 in the container 10 to the inside and to the storage tank 30.

[0036] The stirring unit 50 stirs the drug 3 and the solvent 4 when the drug 3 is introduced into the storage tank 30 in which the solvent 4 is stored. The stirring unit 50 includes a propeller-shaped stirrer 51 disposed in the storage tank 30, a motor for rotating the stirrer 51 about its axis, and the like. The stirring unit 50 stirs the drug 3 and the solvent 4 in the storage tank 30 by rotating the stirrer 51 about its axis by the motor.

[0037] Moreover, in the polishing liquid manufacturing apparatus 1 according to the first embodiment, the storage tank 30 is provided with a supply port 32 for supplying the polishing liquid 2 in the storage tank 30 to the workpiece 200 held on the chuck table 110 .

[0038] The control unit controls each of the above-mentioned constituent units constituting the polishing liquid manufacturing apparatus 1, and causes the polishing liquid manufacturing apparatus 1 to perform the operation of manufacturing the polishing liquid 2. The control unit is a computer having an arithmetic processing device having a microprocessor such as a CPU (central processing unit), a storage device having a memory such as a ROM (read only memory) or a RAM (random access memory), and an input / output interface device.

[0039] The arithmetic processing device of the control unit performs arithmetic processing in accordance with a computer program stored in the storage device, and outputs control signals for controlling the polishing liquid manufacturing apparatus 1 to the above-mentioned components of the polishing liquid manufacturing apparatus 1 via the input / output interface device. The control unit is also connected to a display unit configured with a liquid crystal display device or the like for displaying the status and images of the manufacturing operation, an input unit used by an operator to register manufacturing conditions and the like, and a notification unit for notifying the operator.

[0040] The input unit is composed of at least one of a touch panel provided on the display unit, a keyboard, etc. The notification unit notifies the operator by emitting at least one of sound, light, and a message on the touch panel.

[0041] Next, the operation of the polishing liquid manufacturing apparatus 1 for manufacturing the polishing liquid 2 will be described. The polishing liquid manufacturing apparatus 1 supplies a predetermined amount of solvent 4 from the solvent tank 60 to the storage tank 30, and stores the predetermined amount of solvent 4 in the storage tank 30. The storage tank 30 may be provided with a function for detecting the predetermined amount. For example, the function for detecting the predetermined amount is realized by a load cell, a concentration detection means, or the like. In the polishing liquid manufacturing apparatus 1, the container 10 is placed on the placement part 20 with the opening 13 facing downward.

[0042] Then, the upper end of the supply member 40 pierces the sheet material 14 and enters the opening 13. Also, the bottom 15 of the main body 11 of the container 10, which is far from the opening 13, is connected to a cylindrical communication member 16, and pure water (liquid) is supplied into the container 10 through the communication member 16. Then, all of the powdered chemical 3 in the container 10 is supplied to the storage tank 30. In this way, the polishing liquid manufacturing device 1 places the container 10 on the placement part 20, and the supply member 40 enters the opening 13 of the container 10, and the supply member 40 is connected to the opening 13 of the container 10, so that the powdered chemical 3 in the container 10 is introduced into the storage tank 30. Also, in the first embodiment, the container 10 is connected to the communication member 16, and pure water (liquid) is supplied into the container 10 through the communication member 16, so that the powdered chemical 3 is prevented from remaining in the container 10.

[0043] The polishing liquid manufacturing apparatus 1 rotates the stirrer 51 of the stirring unit 50 about its axis for a predetermined time to stir the chemical 3 and the solvent 4 in the storage tank 30 to generate the polishing liquid 2. The polishing liquid manufacturing apparatus 1 supplies the generated polishing liquid 2 to the workpiece 200 held by suction on the chuck table 110 during chemical mechanical polishing by the polishing apparatus 100.

[0044] Thus, in the first embodiment, the polishing liquid manufacturing apparatus 1 places the opening 13 of the container 10 containing the powdered chemical 3 on the mounting part 20 with the opening 13 facing downward, and the supply member 40 provided on the mounting part 20 supplies the chemical 3 in the container 10 to the storage tank 30 for storing the solvent 4 disposed below the mounting part 20, and agitates the chemical 3 and the solvent 4 in the storage tank 30 to manufacture the polishing liquid 2. Also, in the first embodiment, the polishing liquid manufacturing apparatus 1 stores in the container 10 an amount of the chemical 3 sufficient to manufacture the polishing liquid 2 having a concentration used for chemical mechanical polishing of the workpiece 200.

[0045] As described above, the polishing liquid manufacturing apparatus 1 and the polishing liquid manufacturing method of embodiment 1 produce the polishing liquid 2 by supplying a powdered chemical 3 from a container 10, so there is no need for a process of forming the chemical 3 into a tablet.

[0046] Furthermore, the polishing liquid manufacturing apparatus 1 and the polishing liquid manufacturing method of embodiment 1 contain a quantity of chemical 3 in the container 10 sufficient to produce a polishing liquid 2 at a concentration used for chemical mechanical polishing of the workpiece 200, and supply all of the chemical 3 in the container 10 to the storage tank 30 to produce the polishing liquid 2, thereby ensuring the production of a polishing liquid 2 at a predetermined concentration.

[0047] As a result, the polishing liquid manufacturing apparatus 1 and the polishing liquid manufacturing method of embodiment 1 have the advantage of being able to reliably manufacture a polishing liquid 2 of a predetermined concentration without requiring a process of forming the drug 3 into a tablet.

[0048] [Modifications] An apparatus for producing a polishing liquid according to a modification of the first embodiment will be described with reference to the drawings. Fig. 3 is a diagram showing a typical configuration example of an apparatus for producing a polishing liquid according to a modification 1 of the first embodiment. Fig. 4 is a diagram showing a typical configuration example of an apparatus for producing a polishing liquid according to a modification 2 of the first embodiment. In Figs. 3 and 4, the same reference numerals are used to designate the same parts as those in the first embodiment, and the description thereof will be omitted.

[0049] In addition to the configuration of the polishing liquid manufacturing apparatus 1 of embodiment 1, the polishing liquid manufacturing apparatus 1-1 of variant example 1 further includes a dilution tank 70 to which the solvent 4 is supplied from the solvent tank 60 and the polishing liquid 2 is supplied from the storage tank 30 to dilute the polishing liquid 2, as shown in FIG. 3, and a supply tank 71 to which the diluted polishing liquid 2 is supplied from the dilution tank 70 and which supplies the supplied polishing liquid 2 to the polishing apparatus 100.

[0050] The polishing liquid manufacturing apparatus 1-2 of variant example 2 includes, in addition to the configuration of the polishing liquid manufacturing apparatus 1 of embodiment 1, a supply tank 71 that receives the polishing liquid 2 from the storage tank 30 and supplies the supplied polishing liquid 2 to the polishing apparatus 100, as shown in FIG. 4.

[0051] Similar to the first embodiment, the polishing solution manufacturing apparatuses 1-1 and 1-2 have the advantage of being able to reliably manufacture the polishing solution 2 of a predetermined concentration without requiring a step of forming the drug 3 into tablets.

[0052] The present invention is not limited to the above embodiment. That is, various modifications can be made without departing from the gist of the present invention. In the present invention, the polishing liquid manufacturing apparatus 1, 1-1, 1-2 may have one or more containers 10. Also, in the present invention, the polishing liquid manufacturing apparatus 1, 1-1, 1-2 may cut the opening 13 of the container 10 with a cutter to allow the chemical 3 to be introduced into the storage tank 30.

[0053] 1. Polishing fluid manufacturing equipment 2 Polishing liquid 3. Drugs 4. Solvent 10 containers 13 Aperture 20 Placement section (placement means) 30 Reservoir 40 Supply member (supply means) 50 Mixing unit (mixing means)

Claims

1. An apparatus for producing a polishing liquid, comprising: A powdered medicine is contained in a container having an opening, and a placement means is provided for placing the container with the opening facing downward; a storage tank disposed below the placement means and configured to store a solvent; a supply means for supplying the drug from the container to the reservoir; a mixing means for mixing the chemical with the solvent when the chemical is introduced into the storage tank; At least The container is placed on the placement means, and the supply means is connected to the opening of the container, whereby the powdered drug in the container is introduced into the storage tank. Equipment for manufacturing polishing fluid.

2. A method for producing a polishing liquid, comprising the steps of: A container containing a powdered chemical is placed on a placement means with the opening facing downward, and a supply means provided on the placement means supplies the chemical in the container to a storage tank for storing a solvent disposed below the placement means, and the polishing liquid is produced by stirring the chemical and the solvent in the storage tank; The chemical is contained in the container in an amount sufficient to produce a polishing solution having a concentration suitable for chemical mechanical polishing of a workpiece. A method for producing a polishing liquid.

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