Light-emitting device

Abstract

To miniaturize a light-emitting device.SOLUTION: A light-emitting device is provided, comprising: a light-emitting element; a base having an upper surface facing the lower surface of the light-emitting element and directly or indirectly supporting the light-emitting element; a flat lid body having a lower surface facing the upper surface of the light-emitting element; and a first frame portion provided on the upper surface of the substrate and surrounding the light-emitting element, and the substrate includes a first conductor portion joined to the lower surface of the light-emitting element, the lid body includes a second conductor portion joined to the upper surface of the light-emitting element, and the first frame portion is directly or indirectly joined to the lid body.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Patent Document 1 discloses a light emitting device including a semiconductor light emitting chip, a first submount and a second submount connected to both sides of the semiconductor light emitting chip, and a first sidewall and a second sidewall provided between the first submount and the second submount. Patent Document 1 also discloses that after providing the first sidewall and the second sidewall, a light-transmitting member is further bonded to the first sidewall and the second sidewall to hermetically seal the semiconductor light emitting chip. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 256421 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present disclosure is to simplify the manufacturing process of a light emitting device. [Means for solving the problem]

[0005] A light emitting device according to one embodiment of the present disclosure comprises a light emitting element, a base having an upper surface facing a lower surface of the light emitting element and directly or indirectly supporting the light emitting element, a flat lid body having a lower surface facing an upper surface of the light emitting element, and a first frame portion provided on the upper surface of the base and surrounding the light emitting element, wherein the base comprises a first conductor portion joined to the lower surface of the light emitting element, the lid body comprises a second conductor portion joined to the upper surface of the light emitting element, and the first frame portion is directly or indirectly joined to the lid body. Effect of the Invention

[0006] According to an embodiment of the present disclosure, the manufacturing process of a light emitting device can be simplified. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view illustrating an example of a light emitting device according to a first embodiment. [Diagram 2] 2 is a perspective view of the light emitting device shown in FIG. 1 with a lid and a second frame portion removed. FIG. [Diagram 3] 2 is a perspective view of the light emitting device shown in FIG. 1 with a base body and a first frame portion removed. FIG. [Figure 4] FIG. 2 is a bottom view illustrating an example of the light emitting device according to the first embodiment. [Diagram 5] 13 is a perspective view of a light emitting device including a modified first frame portion. FIG. [Figure 6] 6 is a cross-sectional view showing a cross section of the light emitting device and a current path taken along the line VI-VI shown in FIG. [Figure 7] FIG. 11 is a perspective view showing an example of a light emitting device according to a second embodiment. [Figure 8] 8 is a perspective view of the light emitting device shown in FIG. 7 with a lid and a second frame portion removed. FIG. [Figure 9] 8 is a perspective view of the light emitting device shown in FIG. 7 with a base body and a first frame portion removed. FIG. [Figure 10] 8 is a cross-sectional view showing a cross section of the light emitting device and a current path taken along the line XX shown in FIG. 7. [Figure 11] FIG. 11 is a perspective view illustrating an example of a light emitting device according to a third embodiment. [Figure 12] 12 is a perspective view of the light emitting device shown in FIG. 11 with a lid and a second frame portion removed. FIG. [Figure 13] 12 is a perspective view of the light emitting device shown in FIG. 11 with a base body and a first frame portion removed. FIG. [Figure 14] 13 is a perspective view showing an example of a light emitting device according to a third embodiment and a current path. FIG. [Figure 15] FIG. 13 is a perspective view illustrating an example of a light emitting device according to a fourth embodiment. [Figure 16] FIG. 13 is a perspective view showing an example of a light emitting device according to a fourth embodiment and a current path. [Figure 17] FIG. 13 is a perspective view illustrating an example of a light emitting device according to a fifth embodiment. [Figure 18] 13 is a perspective view showing an example of a light emitting device according to a fifth embodiment and a current path. FIG. [Figure 19] FIG. 13 is a perspective view illustrating an example of a light emitting device according to a sixth embodiment. [Figure 20] FIG. 13 is a perspective view showing an example of a light emitting device according to a sixth embodiment and a current path. [Figure 21] FIG. 13 is a perspective view illustrating an example of a light emitting device according to a seventh embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the mode for carrying out the invention will be described with reference to the drawings. In the following description, terms indicating specific directions or positions (for example, "upper", "lower", and other terms including these terms) will be used as necessary. However, the use of these terms is for the purpose of facilitating understanding of the invention with reference to the drawings, and the meaning of these terms does not excessively limit the technical scope of the present invention. For example, when "upper surface" is described, it does not mean that the invention must always be used facing upward. Also, parts with the same reference numerals appearing in multiple drawings indicate the same or equivalent parts or members.

[0009] In addition, in this disclosure, polygons such as triangles and quadrangles are referred to as polygons, including shapes in which the corners of the polygons have been processed by rounding, chamfering, removing corners, rounding, etc. In addition, shapes in which processing has been applied not only to the corners (edges of the sides) but also to the middle parts of the sides are similarly referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the interpretation of "polygon" described in this disclosure.

[0010] The same applies not only to polygons, but also to terms expressing specific shapes such as trapezoids, circles, and irregularities. The same also applies to terms relating to the sides that form the shape. In other words, even if the corners or middle part of a side have been processed, the interpretation of "side" includes the processed part. Note that when distinguishing a "polygon" or "side" that has no partial processing from a processed shape, the word "strict" is added, for example, "strict quadrangle."

[0011] Furthermore, the embodiments shown below are illustrative of a light-emitting device for embodying the technical idea of ​​the present invention, and do not limit the present invention to the following. Furthermore, unless otherwise specified, the dimensions, materials, shapes, and relative arrangements of the components described below are intended to be merely illustrative, and are not intended to limit the scope of the present invention. Furthermore, the contents described in one embodiment are applicable to other embodiments and modified examples. Furthermore, the sizes and positional relationships of the components shown in the drawings may be exaggerated in order to clarify the explanation. Furthermore, in order to avoid the drawings becoming overly complicated, a schematic diagram in which some components are omitted may be used. Furthermore, an end view showing only the cut surface may be used as a cross-sectional view.

[0012] In each drawing, for reference, an X-axis, a Y-axis, and a Z-axis that are orthogonal to each other are shown. The direction parallel to the X-axis is called the X-direction. In addition, in the X-direction, the direction in which the arrow points is called the +X-direction, and the opposite direction of the +X-direction is called the -X-direction. In the Y-direction, the direction in which the arrow points is called the +Y-direction, and the opposite direction of the +Y-direction is called the -Y-direction. In the Z-direction, the direction in which the arrow points is called the +Z-direction, and the opposite direction of the +Z-direction is called the -Z-direction. However, these do not limit the orientation of the light-emitting device when it is used, and the orientation of the light-emitting device is arbitrary.

[0013] In addition, in this specification or claims, when there are multiple elements of a certain type and each element is to be expressed with a distinction, the elements may be distinguished by adding "first," "second," etc. to the beginning of the element. In addition, the objects to be distinguished may differ between this specification and the claims. Therefore, even if the claims describe an element with the same notation as this specification, the object identified by this element may not match between this specification and the claims.

[0014] For example, in this specification, there are elements distinguished by the notation "first", "second", and "third", and when the elements to which "first" and "third" are attached in this specification are described in the scope of a patent claim, or when the element to which "first" is attached and the element to which no specific ordinal number is attached are described in the scope of a patent claim, the elements may be distinguished by the notation "first" and "second" in the scope of a patent claim from the viewpoint of readability. In this case, the elements to which "first" and "second" are attached in the scope of a patent claim refer to the elements to which "first" and "third" are attached in this specification, or the elements to which no specific ordinal number is attached, respectively. Note that the application of this rule is not limited to elements, and it can be applied rationally and flexibly to other objects as well.

[0015] First Embodiment An example of the configuration of the light emitting device 100 according to the first embodiment will be described with reference to Figs. 1 to 5. Fig. 1 is a perspective view showing an example of the light emitting device 100 according to the first embodiment. Fig. 2 is a perspective view of the light emitting device 100 shown in Fig. 1 with the cover body 130 and the second frame portion 150 removed. Fig. 3 is a perspective view of the light emitting device 100 shown in Fig. 1 with the base body 120 and the first frame portion 140 removed. Fig. 4 is a bottom view of the light emitting device 100. Fig. 5 is a perspective view of the light emitting device 100 including a modified first frame portion (first frame portion 145).

[0016] 1 to 4, the light emitting device 100 according to this embodiment includes a light emitting element 110, a base 120, a cover 130, and a first frame 140. The light emitting device 100 may further include a second frame 150, a light reflecting member 160, a protective element 170, a first electrode 181, and a second electrode 182. Each component of the light emitting device 100 will be described in detail below.

[0017] (Light emitting element 110) The light emitting element 110 is a light source of the light emitting device 100. The light emitting element 110 of this embodiment is, for example, a semiconductor laser element including an n-type cladding layer, an active layer, and a p-type cladding layer, which are stacked in this order in the Z direction. However, the type of the light emitting element 110 is not limited to a semiconductor laser element. Other examples of the light emitting element 110 include a light emitting diode (LED) and an organic light emitting diode (OLED).

[0018] The light emitting element 110 has an upper surface 111 (a surface on the +Z direction side) and a lower surface 112 (a surface on the -Z direction side). The light emitting element 110 also has one or more side surfaces connected to each of the upper surface 111 and the lower surface 112. The one or more side surfaces connect the outer edges of the upper surface 111 and the lower surface 112 to each other.

[0019] The light emitting element 110 of this embodiment has a rectangular parallelepiped outer shape extending along the X direction. However, the light emitting element 110 is not limited to having a rectangular parallelepiped outer shape, and may have other shapes.

[0020] The upper surface 111 and the lower surface 112 of the light-emitting element 110 of this embodiment are each a flat surface having a rectangular outer shape. Unless specifically mentioned to exclude a square, the rectangle includes a square. However, the outer shapes of the upper surface 111 and the lower surface 112 of the light-emitting element 110 are not limited to a rectangle. The outer shapes of the upper surface 111 and the lower surface 112 of the light-emitting element 110 may be any shape such as a circle, an ellipse, a polygon, etc. when viewed from above. Note that "top view" refers to viewing an object from the +Z direction side. The same applies hereinafter to "top view".

[0021] The light emitting element 110 has four side surfaces. Each side surface of the light emitting element 110 is a flat surface having a rectangular outer shape. Of the four side surfaces of the light emitting element 110, the side surface 113 that is disposed on the -X direction side and faces the light reflecting member 160 corresponds to a light exit surface that emits light. Hereinafter, the side surface 113 that emits light is referred to as the "light exit surface 113."

[0022] The light emitting element 110 emits visible light. Examples of the light emitting element that emits visible light include a light emitting element that emits blue light, a light emitting element that emits green light, and a light emitting element that emits red light. The light emitting element that emits blue light is a light emitting element whose emission peak wavelength of the emitted light is in the range of 405 nm to 494 nm. The light emitting element that emits green light is a light emitting element whose emission peak wavelength of the emitted light is in the range of 495 nm to 570 nm. The light emitting element that emits red light is a light emitting element whose emission peak wavelength of the emitted light is in the range of 605 nm to 750 nm.

[0023] The light emitting element 110 that emits blue or green light may be a semiconductor laser element that includes a nitride semiconductor. Examples of nitride semiconductors include GaN, InGaN, and AlGaN. The light emitting element 110 that emits red light may be a semiconductor laser element that includes an InAlGaP-based, GaInP-based, GaAs-based, or AlGaAs-based semiconductor.

[0024] However, the color of the light emitted from the light emitting element 110 may be a color other than blue, green, and red. Furthermore, the light emitted from the light emitting element 110 is not limited to visible light, and may be ultraviolet light or infrared light.

[0025] (Base 120) The base 120 is a member disposed on the -Z direction side with respect to the light emitting element 110, and directly or indirectly supports the light emitting element 110. Here, the configuration "directly supporting the light emitting element 110" refers to a configuration in which the base 120 and the light emitting element 110 are bonded with a bonding material or without a bonding material. In contrast, the configuration "indirectly supporting the light emitting element 110" refers to a configuration in which the light emitting element 110 is bonded to another member with a bonding material or without a bonding material, and the base 120 supports the other member, thereby supporting the light emitting element 110 via the other member.

[0026] The length of the base 120 in the X direction is longer than the length of the base 120 in the Y direction. The base 120 in the present embodiment has a rectangular parallelepiped outer shape. However, the base 120 is not limited to having a rectangular parallelepiped outer shape, and may have other shapes.

[0027] The base 120 includes an upper surface 121 (surface on the +Z direction side), a lower surface 122 (surface on the -Z direction side), four side surfaces connecting the outer edges of the upper surface 121 and the lower surface 122, and a first conductor portion .

[0028] The upper surface 121 and the lower surface 122 of the base 120 are each a flat surface having a rectangular outer shape. However, the outer shapes of the upper surface 121 and the lower surface 122 of the base 120 are not limited to a rectangle. The outer shapes of the upper surface 121 and the lower surface 122 of the base 120 may be any shape, such as a circle, an ellipse, or a polygon, when viewed from above. In addition, each side surface of the base 120 is also a flat surface having a rectangular outer shape.

[0029] The base 120 includes, for example, an insulating material. Examples of insulating materials include aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide. The base 120 may also include an insulating region made of an insulating material and a conductive region made of a conductive material. However, the insulating region is disposed in a portion of the base 120 that contacts the first conductor 124.

[0030] The first conductor portion 124 is arranged on the upper surface 121 side of the base 120 and comprises an outer layer portion 124a to which the lower surface 112 of the light-emitting element 110 is joined, and a first inner layer wiring 124b arranged on the -Z direction side of the outer layer portion 124a and provided inside the base 120.

[0031] The outer layer portion 124a is a flat conductor portion having a thickness in the Z direction and a length in the X direction longer than that in the Y direction. The outer layer portion 124a has a plurality of regions having different lengths in the X direction. In this embodiment, the central region of the plurality of regions of the outer layer portion 124a has the longest length in the X direction and extends to the vicinity of the light reflecting member 160. The light emitting element 110 is joined to the central region.

[0032] As an example, as shown in FIG. 2, the central region of the outer layer portion 124a has a region that protrudes in the -X direction more than the other two regions. The light emitting element 110 is bonded to at least the region that protrudes in the -X direction in the central region of the outer layer portion 124a. In addition, the light emitting surface 113 of the light emitting element 110 is disposed near the end of the central region of the outer layer portion 124a on the -X direction side in top view. This allows the light emitting surface 113 of the light emitting element 110 to be closer to the light reflecting surface 161 of the light reflecting member 160. As a result, the light emitting device 100 can be made smaller in size.

[0033] Among the multiple regions of the outer layer portion 124a, two regions having a shorter length in the X direction than the central region are disposed on the +Y direction side and the -Y direction side, respectively, with the central region in between. In this embodiment, the protective element 170 is bonded to the region on the -Y direction side of the central region. The light emitting element 110 and the protective element 170 are electrically connected via the outer layer portion 124a.

[0034] However, the outer layer portion 124a does not have to have a plurality of regions with different lengths in the X direction. The outer layer portion 124a may be, for example, a flat portion having a rectangular outer shape in a top view. In addition, the positions of the light emitting element 110 and the protective element 170 on the outer layer portion 124a are not limited.

[0035] The first inner layer wiring 124b is a conductor portion extending in the Z direction. The upper end (end portion on the +Z direction side) of the first inner layer wiring 124b is connected to the lower surface (surface on the -Z direction side) of the outer layer portion 124a. As shown in FIG. 4, the lower end (end portion on the -Z direction side) of the first inner layer wiring 124b is connected to the first electrode 181. That is, the first inner layer wiring 124b electrically connects the outer layer portion 124a and the first electrode 181. The first inner layer wiring 124b is not limited to having a shape extending in the Z direction. The first inner layer wiring 124b may have a shape that is bent at one or more points.

[0036] The upper surface (the surface on the +Z direction side) of the outer layer portion 124a is joined to the lower surface 112 of the light emitting element 110. In other words, the first conductor portion 124 electrically connects the light emitting element 110 and the first electrode 181.

[0037] The base 120 may further include a second inner layer wiring 125 provided inside the base 120 and extending in the Z direction. The second inner layer wiring 125 is a conductor part parallel to the first inner layer wiring 124b in the Z direction. The second inner layer wiring 125 does not have to be parallel to the first inner layer wiring 124b in the Z direction. In addition, the second inner layer wiring 125 is not limited to having a shape extending in the Z direction. The second inner layer wiring 125 may have a shape that is bent at one or more points. Note that "parallel" includes an error of ±5° in the angle between the objects. The same applies to "parallel" hereinafter.

[0038] An upper end (end on the +Z direction side) of second inner layer wiring 125 is connected to the lower surface (surface on the -Z direction side) of first frame portion 140. In contrast, a lower end (end on the -Z direction side) of second inner layer wiring 125 is connected to second electrode 182. That is, second inner layer wiring 125 electrically connects first frame portion 140 and second electrode 182. As shown in FIG. 4, at least a part of the lower end of second inner layer wiring 125 overlaps first frame portion 140 in a bottom view. In contrast, a lower end of first inner layer wiring 124b does not overlap first frame portion 140 in a bottom view and is disposed inside first frame portion 140.

[0039] (First frame portion 140) The first frame portion 140 is disposed on the upper surface 121 of the base 120 outside the light emitting element 110, and is a rectangular ring-shaped member surrounding the light emitting element 110 in a top view. The first frame portion 140 protrudes from the upper surface 121 of the base 120 in the +Z direction.

[0040] In this embodiment, the first frame portion 140 protrudes in the +Z direction from the upper surface 121 of the base body 120. However, the connection configuration between the first frame portion 140 and the base body 120 is not limited to this. For example, the first frame portion 140 and the base body 120 may be connected to each other with a part of the lower side (-Z direction side) of the first frame portion 140 embedded in the base body 120.

[0041] In this embodiment, the first frame portion 140 is disposed near the outer edge of the upper surface 121 of the base body 120. However, the position of the first frame portion 140 is not limited thereto. It is sufficient that the first frame portion 140 is disposed so as to surround the light emitting element 110.

[0042] The first frame portion 140 includes a conductive region made of a conductive material. The entire first frame portion 140 of this embodiment is made of a conductive material. However, the configuration of the first frame portion 140 is not limited to this. The first frame portion 140 may include a conductive region and an insulating region. When the first frame portion 140 includes a conductive region and an insulating region, the conductive region of the first frame portion 140 is connected to the second inner layer wiring 125.

[0043] 1, the upper surface (the surface on the +Z direction side) of the first frame portion 140 is joined to the lower surface (the surface on the -Z direction side) of the second frame portion 150. The light emitting element 110 is hermetically sealed in a space defined by the base body 120, the lid body 130, the first frame portion 140, and the second frame portion 150.

[0044] (Modification of the first frame portion) The first frame portion 140 according to the basic example shown in Fig. 1 and Fig. 2 is joined to the second frame portion 150. In contrast, the first frame portion 145 according to the modified example shown in Fig. 5 is joined to the lower surface 132 (the surface on the -Z direction side) of the lid body 130. In other words, when the first frame portion 145 according to the modified example is used, the second frame portion 150 can be omitted. In this case, the light emitting element 110 is hermetically sealed in a space defined by the base body 120, the lid body 130, and the first frame portion 145.

[0045] A configuration in which the first frame 145 and the lid 130 are joined together without the second frame 150, as in the modified example, corresponds to a configuration in which "the first frame is directly joined to the lid." In contrast, a configuration in which the second frame 150 is interposed between the first frame 140 and the lid 130, as in the basic example, corresponds to a configuration in which "the first frame is indirectly joined to the lid."

[0046] (Cover 130) 1, the lid 130 is disposed on the +Z direction side of the light emitting element 110 and the base 120, and is a flat plate-like member that covers the upper surface 111 of the light emitting element 110 and the upper surface 121 of the base 120. However, the lid 130 only needs to be a member that covers at least the first frame portion 140 and the second frame portion 150 in a top view. The lid 130 includes an upper surface 131 (a surface on the +Z direction side), a lower surface 132 (a surface on the -Z direction side), one or more side surfaces that connect the outer edges of the upper surface 131 and the lower surface 132, and a second conductor portion 134. The lower surface 132 of the lid 130 faces the upper surface 111 of the light emitting element 110.

[0047] The lid body 130 of this embodiment has a rectangular parallelepiped shape whose length in the X direction is longer than its length in the Y direction. However, the lid body 130 is not limited to having a rectangular parallelepiped shape, and may have other shapes.

[0048] In this embodiment, the upper surface 131 and the lower surface 132 of the lid body 130 are flat surfaces each having a rectangular outer shape. However, the outer shapes of the upper surface 131 and the lower surface 132 of the lid body 130 are not limited to a rectangle. The outer shapes of the upper surface 131 and the lower surface 132 of the lid body 130 may be any shape such as a circle, an ellipse, a polygon, etc., when viewed from above.

[0049] The lid 130 of this embodiment has four side surfaces. Each of the four side surfaces of the lid 130 connects different outer edges of the upper surface 131 and the lower surface 132. Each of the four side surfaces of the lid 130 is also a flat surface having a rectangular outer shape.

[0050] The cover 130 has a light-transmitting region that transmits light emitted from the light-emitting surface 113 of the light-emitting element 110. The light-transmitting region is disposed in a region through which light that is emitted from the light-emitting surface 113 of the light-emitting element 110 and reflected upward by the light reflecting member 160 passes.

[0051] In this embodiment, the lid 130 includes a material that is transparent to visible light, such as quartz or glass.

[0052] 3, the second conductor 134 includes a first layer 134a bonded to the upper surface 111 of the light emitting element 110, and a second layer 134b connected to the upper surface (the surface on the +Z direction side) of the first layer 134a. Each of the first layer 134a and the second layer 134b is a flat conductor having a thickness in the Z direction and a length in the X direction longer than the length in the Y direction. The first layer 134a and the second layer 134b may be made of the same conductive material or different conductive materials.

[0053] The first layer 134a has a band-like outer shape extending along the X direction in parallel to the light emitting element 110. A side surface of the first layer 134a on the +X direction side is connected to the second frame portion 150. In other words, the first layer 134a electrically connects the light emitting element 110 and the second frame portion 150.

[0054] The second layer 134b has a flat plate-like outer shape that is longer in the Y direction than the first layer 134a. In top view, a part of the lower surface (the surface on the -Z direction side) of the second layer 134b does not overlap with the upper surface of the first layer 134a. The part of the lower surface of the second layer 134b that does not overlap with the first layer 134a is bonded to the upper surface (the surface on the +Z direction side) of the protection element 170.

[0055] In the second layer 134b, at least one of the three side surfaces excluding the side surface on the -X direction side is connected to the second frame portion 150. That is, the second layer 134b electrically connects the protective element 170 and the second frame portion 150. However, when the light emitting device 100 does not include the protective element 170, the second layer 134b may be omitted. Furthermore, when the thickness of the light emitting element 110 and the thickness of the protective element 170 are the same, the first layer 134a may be omitted, and the second layer 134b may be bonded to each of the light emitting element 110 and the protective element 170.

[0056] 3, the side surface of the first layer 134a on the -X direction side and the side surface of the second layer 134b on the -X direction side are disposed at substantially the same position in the X direction. In contrast, the light emission surface 113 of the light emitting element 110 is disposed at a position further away in the -X direction than the side surface of the first layer 134a on the -X direction side and the side surface of the second layer 134b on the -X direction side. That is, in a top view, the second conductor 134 is provided at a position away in the +X direction from the light emission surface 113 of the light emitting element 110. This makes it possible to suppress vignetting of the light emitted from the light emission surface 113 of the light emitting element 110 by the second conductor 134.

[0057] (Second frame portion 150) 3, the second frame portion 150 is a rectangular annular member that protrudes in the -Z direction from the lower surface 132 of the lid body 130. The second frame portion 150 is disposed outside the light emitting element 110 in a top view and surrounds the light emitting element 110.

[0058] In this embodiment, the second frame 150 protrudes in the -Z direction from the lower surface 132 of the lid body 130. However, the connection configuration between the second frame 150 and the lid body 130 is not limited to this. For example, the second frame 150 and the lid body 130 may be connected with a part of the upper side (+Z direction side) of the second frame 150 embedded in the lid body 130.

[0059] In this embodiment, the second frame portion 150 is disposed near the outer edge of the lower surface 132 of the lid body 130, and is disposed at a position overlapping with the first frame portion 140. However, the position of the second frame portion 150 is not limited thereto. It is sufficient that the second frame portion 150 is disposed at least on the outer side of the light emitting element 110 in a state in which the upper surface 121 of the base body 120 and the lower surface 132 of the lid body 130 face each other. Furthermore, the width of the second frame portion 150 may be the same as or different from the width of the first frame portion.

[0060] The second frame portion 150 includes a conductive region made of a conductive material. The entire second frame portion 150 of this embodiment is made of a conductive material. However, the configuration of the second frame portion 150 is not limited to this. The second frame portion 150 may include a conductive region and an insulating region. When the second frame portion 150 includes a conductive region and an insulating region, the conductive region of the second frame portion 150 is joined to each of the second conductor portion 134 and the conductive region of the first frame portion 140.

[0061] (Light reflecting member 160) The light reflecting member 160 is a member that reflects light emitted from the light emitting surface 113 of the light emitting element 110 toward the light transmitting region of the cover body 130. As shown in Fig. 1, the light reflecting member 160 includes a light reflecting surface 161, a lower surface, and a plurality of side surfaces intersecting with the light reflecting surface 161 and the lower surface. In this embodiment, the light reflecting surface 161, the lower surface, and the plurality of side surfaces are each flat.

[0062] The light reflecting surface 161 faces the light emitting surface 113 of the light emitting element 110. The light reflecting surface 161 reflects the light emitted from the light emitting surface 113 toward the light transmitting region of the lid body 130. The light reflecting surface 161 is an inclined flat surface, but is not limited to this as long as it is configured to be able to reflect the light emitted from the light emitting surface 113 toward the lid body 130. For example, the light reflecting surface 161 may be a curved surface, or may include a flat region and a curved region.

[0063] The light reflecting surface 161 may be formed of glass, metal, or the like as a main material forming its outer shape. The main material is preferably a heat-resistant material, for example, glass such as quartz or BK7 (borosilicate glass), metal such as aluminum, or Si. The light reflecting surface 161 may be formed of metal such as Ag or Al, or a dielectric multilayer film such as Ta2O5 / SiO2, TiO2 / SiO2, or Nb2O5 / SiO2.

[0064] However, in the light-emitting element 110, for example, if the upper surface 111 is the light emission surface and there is no material between the upper surface 111 and the lid body 130 that blocks the light emitted from the upper surface 111, the light reflecting member 160 does not need to be provided.

[0065] (Protection element 170) The protective element 170 is a component for protecting the light emitting element 110. For example, the protective element 170 is a component for preventing the light emitting element 110 from being destroyed by an excessive current flowing therethrough. For example, a Zener diode is an example of the protective element 170. The protective element 170 may also be a component for measuring the temperature of the light emitting element 110 itself or the temperature in the vicinity of the light emitting element 110. By providing the protective element 170 as such a temperature measuring element, for example, it is possible to prevent the light emitting element 110 from being exposed to an excessively high temperature environment and breaking down. For example, a thermistor is an example of the temperature measuring element. When the protective element 170 is used as a temperature measuring element, it is preferable to place it near the light emitting surface 113 of the light emitting element 110.

[0066] The protective element 170 has an upper surface and a lower surface. The lower surface of the protective element 170 is bonded to the upper surface of the outer layer portion 124a provided on the upper surface 121 of the base 120, similar to the lower surface 112 of the light emitting element 110. In addition, the upper surface of the protective element 170 is bonded to the second layer 134b of the second conductor portion 134 provided on the lower surface 132 of the lid 130.

[0067] (Joining layer) In this embodiment, when different components are joined together, the components may be joined together via a bonding layer formed by hardening a conductive adhesive. In this way, a configuration in which components are joined together via a bonding layer is included in a configuration in which components are "directly joined" to each other or "directly supported" to each other.

[0068] Examples of the bonding layer include a bonding layer 124c disposed between the light emitting element 110 and the outer layer 124a of the first conductor 124, a bonding layer disposed between the protective element 170 and the outer layer 124a of the first conductor 124, a bonding layer 134c disposed between the light emitting element 110 and the first layer 134a of the second conductor 134, a bonding layer disposed between the protective element 170 and the second layer 134b of the second conductor 134, and a bonding layer 141 disposed between the first frame 140 and the second frame 150. These multiple bonding layers may be made of the same material or different materials. An example is a bonding layer such as AuSn.

[0069] By bonding each component to another via a bonding layer, the interface resistance between each component can be reduced. Also, by bonding each component to another via a bonding layer, the thickness of the laminate in which each component is stacked via the bonding layer can be adjusted.

[0070] (Current Path in Light Emitting Device 100) Next, a current path in the light emitting device 100 will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing a cross section of the light emitting device 100 and a current path taken along the VI-VI cross-sectional line shown in Fig. 1.

[0071] When the first electrode 181 is a positive electrode and the second electrode 182 is a negative electrode, the current flowing through the light emitting device 100 can flow along the following path. As shown in Fig. 6, the current flows from the first electrode 181 through the first inner layer wiring 124b and the outer layer 124a in the first conductor 124 of the base 120, and then to the light emitting element 110. Furthermore, the current flowing through the light emitting device 100 passes through the first layer 134a and the second layer 134b in the second conductor 134 of the lid 130, and then passes through the second frame 150 in contact with the second layer 134b, the first frame 140, and the second inner layer wiring 125, and then to the second electrode 182.

[0072] Conversely, when the second electrode 182 is the positive electrode and the first electrode 181 is the negative electrode, the current flowing through the light emitting device 100 can flow along the following path: from the second electrode 182, through the second inner layer wiring 125, the first frame portion 140, the second frame portion 150, the second layer 134b, and the first layer 134a, in that order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 100 flows through the outer layer portion 124a and the first inner layer wiring 124b, in that order, to the first electrode 181.

[0073] The light emitting device 100 includes a current path in which the first electrode 181, the first conductor 124 of the base 120, the light emitting element 110, the second conductor 134 of the lid 130, the second frame 150, the first frame 140, and the second inner layer wiring 125 of the base 120 are connected in series. That is, according to this configuration of the light emitting device 100, a current can be supplied to the light emitting element 110 without using a conductor wire such as a bonding wire arranged outside the base 120 and the lid 130. In addition, the light emitting element 110 is hermetically sealed in a space defined by the base 120, the lid 130, the first frame 140, and the second frame 150. As a result, the number of parts used to form a space in which the light emitting element 110 is hermetically sealed can be reduced, and the manufacturing process of the light emitting device 100 can be simplified. In addition, by making the first frame portion 140, the second frame portion 150 and the second inner layer wiring 125, which are electrically connected to the light-emitting element 110 through the second conductor portion 134, part of the current path, the current path in the light-emitting device 100 can be shortened.

[0074] <Second embodiment> Next, a configuration example of a light emitting device 200 according to a second embodiment will be described with reference to Fig. 7 to Fig. 9. The light emitting device 200 according to the second embodiment differs from the other embodiments in that the cover 130 further includes a third conductor 135 and the base 120 further includes a fourth conductor 127.

[0075] Fig. 7 is a perspective view showing an example of a light emitting device 200 according to a second embodiment. Fig. 8 is a perspective view of the light emitting device 200 shown in Fig. 7 with the cover 130 and the second frame 150 removed. Fig. 9 is a perspective view of the light emitting device 200 shown in Fig. 7 with the base 120 and the first frame 140 removed.

[0076] As shown in FIG. 7, the light emitting device 200 of this embodiment includes a light emitting element 110, a base body 120, a cover body 130, a first frame portion 140, a second frame portion 150, a light reflecting member 160, a first electrode 181, and a second electrode 182.

[0077] (Third conductor portion 135) 9, the cover 130 further includes a third conductor 135. The third conductor 135 is a conductor connected to the lower surface (the surface on the -Z direction side) of the second conductor 134. The lower surface of the second conductor 134 is joined to the upper surface 111 of the light emitting element 110 at a position different from the connection position with the third conductor 135. In other words, the light emitting element 110 and the third conductor 135 are electrically connected via the second conductor 134.

[0078] The third conductor portion 135 has a band-like outer shape extending along the X direction. However, the outer shape of the third conductor portion 135 is not limited to this. In this embodiment, the thickness of the third conductor portion 135 is approximately the same as the thickness of the light emitting element 110. However, the thickness of the third conductor portion 135 may be thicker or thinner than the thickness of the light emitting element 110.

[0079] The third conductor portion 135 is not in contact with the second frame portion 150. The second conductor portion 134 is also not in contact with the second frame portion 150. In other words, the third conductor portion 135 and the second conductor portion 134 are not electrically connected to the second frame portion 150.

[0080] (Fourth conductor portion 127) 8, the base 120 further includes a fourth conductor portion 127. The fourth conductor portion 127 is a conductor portion provided on the upper surface 121 of the base 120. In addition, the lower surface (the surface on the -Z direction side) of the fourth conductor portion 127 is connected to the upper end of the second inner layer wiring 125 provided inside the base 120. As a result, the fourth conductor portion 127 is electrically connected to the second electrode 182 via the second inner layer wiring 125.

[0081] Furthermore, the upper surface (surface on the +Z direction side) of the fourth conductor portion 127 is joined to the lower surface (surface on the -Z direction side) of the third conductor portion 135. This electrically connects the fourth conductor portion 127 and the third conductor portion 135. That is, the third conductor portion 135 is electrically connected to the second electrode 182 via the fourth conductor portion 127 and the second inner layer wiring 125. Note that the fourth conductor portion 127 may not be provided, and the lower surface of the third conductor portion 135 may be directly joined to the upper end of the second inner layer wiring 125.

[0082] The fourth conductor portion 127 has a band-like outer shape whose length in the X direction is longer than its length in the Y direction. However, the outer shape of the fourth conductor portion 127 is not limited to this. The fourth conductor portion 127 of the present embodiment extends in the X direction parallel to the outer layer portion 124a of the first conductor portion 124. However, the fourth conductor portion 127 and the outer layer portion 124a may be non-parallel to each other.

[0083] In this embodiment, the thickness of the fourth conductor portion 127 is substantially the same as the thickness of the outer layer portion 124a. However, the thickness of the fourth conductor portion 127 may be thicker or thinner than the thickness of the outer layer portion 124a.

[0084] (Current Path in Light Emitting Device 200) Next, a current path in the light emitting device 200 will be described with reference to Fig. 10. Fig. 10 is a cross-sectional view showing a cross section of the light emitting device 200 and a current path taken along the line XX shown in Fig. 7.

[0085] When the first electrode 181 is a positive electrode and the second electrode 182 is a negative electrode, the current flowing through the light emitting device 200 can flow along the following path. As shown in Fig. 10, the current flows from the first electrode 181 through the first inner layer wiring 124b and the outer layer portion 124a in the first conductor portion 124 of the base 120, in that order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 200 flows through the second conductor portion 134 and the third conductor portion 135 of the lid 130, the fourth conductor portion 127 of the base 120, and the second inner layer wiring 125, in that order, to the second electrode 182.

[0086] Conversely, when the second electrode 182 is the positive electrode and the first electrode 181 is the negative electrode, the current flowing through the light emitting device 200 can flow along the following path: from the second electrode 182, through the second inner layer wiring 125, the fourth conductor portion 127, the third conductor portion 135, and the second conductor portion 134, in that order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 200 flows through the outer layer portion 124a and the first inner layer wiring 124b, in that order, to the first electrode 181.

[0087] The light emitting device 200 includes a current path that connects the first electrode 181, the first conductor 124 of the base 120, the light emitting element 110, the second conductor 134 of the lid 130, the third conductor 135, the fourth conductor 127 of the base 120, and the second inner layer wiring 125 in series. That is, unlike the first embodiment, the current path in the light emitting device 200 does not pass through the first frame 140 and the second frame 150. According to this configuration of the light emitting device 200, the current path for supplying current to the light emitting element 110 can be provided inside the first frame 140 and the second frame 150. This allows the light emitting device 200 to be made smaller in size, and the current path of the light emitting device 200 to be further shortened. In addition, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space that hermetically seals the light emitting element 110. This makes it possible to reduce the number of parts used to form the space to be hermetically sealed, and to simplify the manufacturing process of the light emitting device 200. Other effects and advantages of this embodiment than those described above are the same as those of the first embodiment.

[0088] <Third embodiment> Next, a configuration example of a light emitting device 300 according to a third embodiment will be described with reference to Fig. 11 to Fig. 13. The light emitting device 300 according to the third embodiment differs from the other embodiments in the positions of a first electrode 381 and a second electrode 382.

[0089] Fig. 11 is a perspective view showing an example of a light emitting device 300 according to a third embodiment. Fig. 12 is a perspective view of the light emitting device 300 shown in Fig. 11 with the cover 130 and the second frame 150 removed. Fig. 13 is a perspective view of the light emitting device 300 shown in Fig. 11 with the base 120 and the first frame 140 removed.

[0090] As shown in FIG. 11, the light emitting device 300 of this embodiment includes a light emitting element 110, a base body 120, a cover body 130, a first frame portion 140, a second frame portion 150, a light reflecting member 160, a first electrode 381, and a second electrode 382.

[0091] (1st electrode 381) 11 and 12, the first electrode 381 is disposed on the upper surface 121 of the base 120. In addition, as shown in Fig. 12, the first electrode 381 is connected to a first conductor 324, which is also disposed on the upper surface 121 of the base 120, via a first frame portion 140.

[0092] Unlike the first conductor portion 124 of the first and second embodiments, the first conductor portion 324 of this embodiment does not include a first inner layer wiring 124b and a second inner layer wiring 125. That is, unlike the first and second embodiments, the first conductor portion 324 and the first electrode 381 of this embodiment are electrically connected to each other without passing through a wiring portion provided inside the base 120.

[0093] An upper surface (surface on the +Z direction side) of the first conductor portion 324 is joined to a lower surface of the light emitting element 110. The light emitting element 110 and the first electrode 381 are electrically connected via the first conductor portion 324. In addition, the upper surface of the first conductor portion 324 is joined to the lower surface of the protection element 170 at a position different from the joining position of the light emitting element 110.

[0094] (2nd electrode 382) 11 and 12, the second electrode 382 is disposed at a position different from the first electrode 381 on the upper surface 121 of the base 120. In this embodiment, the first electrode 381 and the second electrode 382 are disposed adjacent to each other near the outer edge of the upper surface 121 on the +X direction side.

[0095] Unlike the first electrode 381, the second electrode 382 does not contact the first frame portion 140. Meanwhile, as shown in FIG. 13, the second conductor portion 334 of this embodiment includes a first layer 334a disposed on the upper surface 111 of the light emitting element 110, a second layer 334b ​​disposed between the first layer 334a and the lower surface 132 of the lid body 130, and a wall portion 334c connected to the second layer 334b. As shown in FIG. 13, the second electrode 382 is connected to the wall portion 334c of the second conductor portion 334. The light emitting element 110 and the second electrode 382 are electrically connected via the second conductor portion 334.

[0096] The first layer 334a has a band-like shape whose length in the X direction is longer than its length in the Y direction. The second layer 334b ​​has a flat plate-like shape whose length in the Y direction is longer than that of the first layer 334a. The end of the second layer 334b ​​on the +X direction side extends to the wall portion 334c.

[0097] The lower surface (surface on the -Z direction side) of the second layer 334b ​​is bonded to the upper surface of the protective element 170. However, when the light emitting device 300 does not include the protective element 170, the second layer 334b ​​may be omitted. Furthermore, when the thickness of the light emitting element 110 and the thickness of the protective element 170 are the same, the first layer 334a may be omitted, and the second layer 334b ​​may be bonded to each of the light emitting element 110 and the protective element 170.

[0098] The wall portion 334c is disposed outside the frame formed by the second frame portion 150, and is connected to the second electrode 382. In contrast, the second layer 334b ​​joined to the wall portion 334c extends to the wall portion 334c from the inside to the outside of the second frame portion 150. Therefore, in order to prevent a short circuit between the second layer 334b ​​and the second frame portion 150, it is preferable to interpose an insulating film between the second layer 334b ​​and the second frame portion 150.

[0099] (Current Path in Light Emitting Device 300) Next, the current paths in the light emitting device 300 will be described with reference to Fig. 14. Fig. 14 is a perspective view showing the light emitting device 300 and the current paths with the light emitting element 110 inside seen through.

[0100] When the first electrode 381 is a positive electrode and the second electrode 382 is a negative electrode, the current flowing through the light emitting device 300 can follow the following path. As shown in Fig. 14, the current flows from the first electrode 381 through the first conductor 324 of the base 120 to the light emitting element 110. Furthermore, the current flowing through the light emitting device 300 passes through the first layer 334a, the second layer 334b, and the wall portion 334c of the second conductor 334 of the lid 130 in this order, and flows to the second electrode 382.

[0101] Conversely, when the second electrode 382 is a positive electrode and the first electrode 381 is a negative electrode, the current flowing through the light emitting device 300 can follow the following path: from the second electrode 382, ​​through the wall portion 334c, the second layer 334b, and the first layer 334a in this order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 300 passes through the first conductor portion 324 and flows to the first electrode 381.

[0102] In the light emitting device 300, the first electrode 381 and the second electrode 382 are each provided on the upper surface 121 of the base 120, so that the base 120 can be directly mounted on a heat dissipation member such as a heat sink. This can improve the heat dissipation properties of the light emitting device 300.

[0103] The first electrode 381, the second electrode 382, ​​and the light emitting element 110 are supported on the upper surface 121 of the base 120. That is, the first electrode 381, the second electrode 382, ​​and the light emitting element 110 are disposed in positions close to each other. This allows the current path in the light emitting device 300 to be shortened, and the electrical resistance in the current path to be reduced. In addition, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space that hermetically seals the light emitting element 110. Therefore, the number of parts used to form the space to be hermetically sealed can be reduced, and the manufacturing process of the light emitting device 300 can be simplified. The effects and advantages of this embodiment other than those described above are the same as those of the first and second embodiments.

[0104] <Fourth embodiment> Next, a configuration example of a light emitting device 400 according to a fourth embodiment will be described with reference to Fig. 15. The light emitting device 400 according to the fourth embodiment differs from the other embodiments in that it includes a fifth conductor portion 490. Fig. 15 is a perspective view showing an example of the light emitting device 400 according to the fourth embodiment.

[0105] As shown in FIG. 15, the light emitting device 400 of this embodiment includes a light emitting element 110, a base 120, a cover 130, a first frame portion 140, a second frame portion 150, a fifth conductor portion 490, a light reflecting member 160, a first electrode 381, and a second electrode 382.

[0106] (Fifth conductor portion 490) The fifth conductor 490 is a conductor for electrically connecting the second conductor 434 of the lid 130 and the second electrode 382. The fifth conductor 490 includes a first columnar portion 490a extending in the Z direction from the upper surface (surface on the +Z direction side) of the second conductor 434 inside the lid 130, a second columnar portion 490b extending in the Z direction inside the lid 130 from the upper surface (surface on the +Z direction side) of the second electrode 382, ​​and a beam portion 490c connecting the first columnar portion 490a and the second columnar portion 490b.

[0107] Each of the first columnar portion 490a, the second columnar portion 490b, and the beam portion 490c has a rectangular parallelepiped outer shape, but may have another shape. Also, the beam portion 490c is exposed above the upper surface 131 of the lid body 130, but may be provided inside the lid body 130. That is, the entire fifth conductor portion 490 may be provided inside the lid body 130. In this case, the thickness in the Z direction of the second electrode 382 is the sum of the thickness in the Z direction of the first frame portion 140 and the thickness in the Z direction of the second frame portion 150.

[0108] 15, the side surface of the lid body 130 on the +X direction side is disposed outside the second frame portion 150. The fifth conductor portion 490 is provided so as to straddle the second frame portion 150. That is, the beam portion 490c crosses the second frame portion 150 while the beam portion 490c and the second frame portion 150 are spatially separated from each other. In addition, when the light emitting device 400 does not include the second frame portion 150 and the first frame portion 140 and the lid body 130 are joined together, the fifth conductor portion 490 is provided so as to straddle the first frame portion 140.

[0109] The second conductor 434 disposed between the lower surface 132 of the lid 130 and the upper surface 111 of the light emitting element 110 has a flat plate-like outer shape. However, the outer shape of the second conductor 434 is not limited to this.

[0110] (Current Path in Light Emitting Device 400) Next, a current path in the light emitting device 400 will be described with reference to Fig. 16. Fig. 16 is a perspective view showing the light emitting device 400 and the current path with the light emitting element 110 inside seen through.

[0111] When the first electrode 381 is a positive electrode and the second electrode 382 is a negative electrode, the current flowing through the light emitting device 400 can flow along the following path. As shown in Fig. 16, the current flows from the first electrode 381 through the first conductor 324 of the base 120 to the light emitting element 110. Furthermore, the current flowing through the light emitting device 400 flows through the second conductor 434 and the fifth conductor 490 of the lid 130 in this order to the second electrode 382.

[0112] Conversely, when the second electrode 382 is a positive electrode and the first electrode 381 is a negative electrode, the current flowing through the light emitting device 400 can flow along the following path: from the second electrode 382, ​​through the fifth conductor part 490 and the second conductor part 434 in this order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 400 passes through the first conductor part 324 and flows to the first electrode 381.

[0113] The light emitting device 400 includes a fifth conductor 490 having a structure straddling the second frame 150 as a conductor for electrically connecting the second conductor 434 and the second electrode 382. This makes it possible to prevent a short circuit between the fifth conductor 490 and the second frame 150 without interposing an insulating member such as an insulating film between them. Furthermore, when the light emitting device 400 does not include the second frame 150 and the first frame 140 and the lid 130 are joined, the fifth conductor 490 is provided so as to straddle the first frame 140. This makes it possible to prevent a short circuit between the fifth conductor 490 and the first frame 140 without interposing an insulating member such as an insulating film between them. Furthermore, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space in which the light emitting element 110 is hermetically sealed. Therefore, the number of parts used to form the space to be hermetically sealed can be reduced, and the manufacturing process of the light emitting device 400 can be simplified. The effects and advantages of this embodiment other than those described above are the same as those of the third embodiment.

[0114] <Fifth embodiment> Next, a configuration example of a light emitting device 500 according to a fifth embodiment will be described with reference to Fig. 17. The light emitting device 500 according to the fifth embodiment differs from the other embodiments in that a first electrode 581 and a second electrode 582 are provided on the lower surface 132 of the lid body 130.

[0115] FIG. 17 is a perspective view showing an example of a light emitting device 500 according to the fifth embodiment.

[0116] As shown in FIG. 17, the light emitting device 500 of this embodiment includes a light emitting element 110, a base body 120, a cover body 130, a first frame portion 140, a second frame portion 150, a light reflecting member 160, a first electrode 581, and a second electrode 582.

[0117] (1st electrode 581) The first electrode 581 is provided on the lower surface 132 of the cover 130. Here, the base 120 further includes a sixth conductor 595. The sixth conductor 595 is a conductor that electrically connects the first electrode 581 and the first conductor 524 of the base 120.

[0118] As shown in FIG. 17, the sixth conductor portion 595 includes a first layer 595a extending in the X direction from the first electrode 581 along the lower surface 132 of the lid body 130, and a second layer 595b arranged between the lower surface (the surface on the -Z direction side) of the first layer 595a and the first conductor portion 524.

[0119] The first layer 595a extends from the outside of the second frame portion 150 where the first electrode 581 is arranged to the inside of the second frame portion 150 where the second layer 595b is arranged, so as to extend from the outside to the inside of the second frame portion 150. In order to prevent a short circuit between the first layer 595a and the second frame portion 150, it is preferable to interpose an insulating film between the first layer 595a and the second frame portion 150.

[0120] (2nd electrode 582) The second electrode 582 is provided on the lower surface 132 of the lid body 130. Here, the lid body 130 further includes a seventh conductor portion 597. The seventh conductor portion 597 is a conductor portion that electrically connects the second electrode 582 and the second conductor portion 534 of the lid body 130.

[0121] 17, the seventh conductor 597 extends in the X direction from the second electrode 582 along the lower surface 132 of the lid 130, and is joined to the upper surface (the surface on the +Z direction side) of the second conductor 534. That is, the seventh conductor 597 extends from the outside of the second frame 150 on which the second electrode 582 is arranged, to the inside of the second frame 150 on which the second conductor 534 is arranged, so as to extend from the outside to the inside of the second frame 150. In order to prevent a short circuit between the seventh conductor 597 and the second frame 150, it is preferable to interpose an insulating film between the seventh conductor 597 and the second frame 150.

[0122] (Current Path in Light Emitting Device 500) Next, a current path in the light emitting device 500 will be described with reference to Fig. 18. Fig. 18 is a perspective view showing the light emitting device 500 and the current path with the light emitting element 110 inside seen through.

[0123] 18, the current flows from the first electrode 581 through the sixth conductor 595 in the lid 130 and the first conductor 524 in the base 120 to the light emitting element 110. Furthermore, the current flows through the light emitting device 500 through the second conductor 534 and the seventh conductor 597 in the lid 130 to the second electrode 582.

[0124] Conversely, when the second electrode 582 is a positive electrode and the first electrode 581 is a negative electrode, the current flowing through the light emitting device 500 can flow along the following path: from the second electrode 582, through the seventh conductor portion 597 and the second conductor portion 534 in this order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 500 passes through the first conductor portion 524 and the sixth conductor portion 595 in this order, to the first electrode 581.

[0125] The first electrode 581 and the second electrode 582 are each joined to the lower surface 132 of the lid 130 and are protected by the lid 130. This can increase the durability of the first electrode 581 and the second electrode 582. In addition, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space that hermetically seals the light emitting element 110. Therefore, the number of parts used to form the space to be hermetically sealed can be reduced, and the manufacturing process of the light emitting device 500 can be simplified. The effects and advantages of this embodiment other than those described above are the same as those of the third embodiment.

[0126] Sixth embodiment Next, a configuration example of a light emitting device 600 according to a sixth embodiment will be described with reference to Fig. 19. The light emitting device 600 according to the sixth embodiment differs from the other embodiments in that a first electrode 681 and a second electrode 682 are provided on an upper surface 131 of a lid body 130. Fig. 19 is a perspective view showing an example of the light emitting device 600 according to the sixth embodiment.

[0127] As shown in FIG. 19, the light emitting device 600 of this embodiment includes a light emitting element 110, a base body 120, a cover body 130, a first frame portion 140, a second frame portion 150, a light reflecting member 160, a first electrode 681, and a second electrode 682.

[0128] The first electrode 681 and the second electrode 682 are disposed at different positions on the upper surface 131 of the lid 130. The lid 130 includes inner layer wirings 637a and 637b. The inner layer wirings 637a and 637b are provided inside the lid 130.

[0129] The first electrode 681 is connected to an upper end (end on the +Z direction side) of the inner layer wiring 637a. A lower end (end on the -Z direction side) of the inner layer wiring 637a is connected to the second frame portion 150. The second frame portion 150 is joined to the first frame portion 140. The first frame portion 140 is connected to the first conductor portion 624 of the base 120. The first conductor portion 624 is joined to the light-emitting element 110. This electrically connects the first electrode 681 and the light-emitting element 110.

[0130] The second electrode 682 is connected to an upper end (end on the +Z direction side) of the inner layer wiring 637b. A lower end (end on the -Z direction side) of the inner layer wiring 637b is connected to a second conductor portion 634 of the lid 130. The second conductor portion 634 is joined to the light emitting element 110. This electrically connects the second electrode 682 and the light emitting element 110.

[0131] (Current Path in Light Emitting Device 600) Next, a current path in the light emitting device 600 will be described with reference to Fig. 20. Fig. 20 is a perspective view showing the light emitting device 600 and the current path with the light emitting element 110 inside seen through.

[0132] When the first electrode 681 is a positive electrode and the second electrode 682 is a negative electrode, the current flowing through the light emitting device 600 can flow along the following path. As shown in Fig. 20, the current flows from the first electrode 681 through the inner layer wiring 637a of the lid 130, the second frame 150, the first frame 140, the first conductor 624 of the base 120, in this order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 600 flows through the second conductor 634 and the inner layer wiring 637b in the lid 130, in this order, to the second electrode 682.

[0133] Conversely, when the second electrode 682 is a positive electrode and the first electrode 681 is a negative electrode, the current flowing through the light emitting device 600 can follow the following path: from the second electrode 682, through the inner layer wiring 637b and the second conductor 634, in that order, to the light emitting element 110. Furthermore, the current flowing through the light emitting device 600 passes through the first conductor 624, the first frame 140, the second frame 150, and the inner layer wiring 637a, in that order, to the first electrode 681.

[0134] Since the first electrode 681 and the second electrode 682 are provided on the upper surface 131 of the lid 130, the first electrode 681 and the second electrode 682 can be provided without increasing the size of the lid 130. This allows the light emitting device 600 to be made smaller. In addition, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space in which the light emitting element 110 is hermetically sealed. Therefore, the number of parts used to form the space to be hermetically sealed can be reduced, and the manufacturing process of the light emitting device 600 can be simplified. The other effects of this embodiment are the same as those of the third embodiment.

[0135] Seventh embodiment Next, a configuration example of a light emitting device 700 according to a seventh embodiment will be described with reference to Fig. 21. The light emitting device 700 according to the seventh embodiment differs from the other embodiments in the configuration of the lid body 730. Fig. 21 is a perspective view showing an example of the light emitting device 700 according to the seventh embodiment.

[0136] 21, the light emitting device 700 of this embodiment includes a light emitting element 110, a base 120, a cover 730, a first frame 140, a second frame 150, and a light reflecting member 160. The light emitting device 700 further includes a first electrode and a second electrode for supplying a current to the light emitting element 110.

[0137] The lid body 730 includes a light shielding portion 737. The light shielding portion 737 is provided on at least one of an upper surface 731 and a lower surface 732 of the lid body 730. The light shielding portion 737 of the present embodiment is provided on the lower surface 732 of the lid body 730.

[0138] An area of ​​the lid 730 where the light blocking portion 737 is not provided is a light transmitting area. For example, openings are provided in a plurality of areas of the light blocking portion 737. The plurality of openings provided in the light blocking portion 737 correspond to the light transmitting areas 737a to 737e of the lid 730, respectively.

[0139] The light-transmitting region 737a is located above the light emission surface 113 of the light-emitting element 110 and the light reflecting member 160. The light-transmitting region 737a is a region through which the emitted light from the light-emitting element 110 passes. Hereinafter, a light-transmitting region through which the emitted light from the light-emitting element 110 passes, such as the light-transmitting region 737a, is referred to as a "first light-transmitting region."

[0140] In contrast, the light-transmitting regions 737b and 737c are located above the center of the light-emitting element 110. That is, the center of the light-emitting element 110 can be seen through the light-transmitting regions 737b and 737c. The light-transmitting regions 737d and 737e are located above the end of the light-emitting element 110 on the +X direction side. That is, the end of the light-emitting element 110 on the +X direction side can be seen through the light-transmitting regions 737d and 737e. A light-transmitting region that is arranged at a position where a region of the light-emitting element 110 that does not include the light exit surface 113 can be seen, such as the light-transmitting regions 737b, 737c, 737d, and 737e, is hereinafter referred to as a "second light-transmitting region." The number of the first light-transmitting regions is not limited. The number of the second light-transmitting regions is also not limited.

[0141] Incidentally, a bonding layer 734c made of a cured conductive adhesive is disposed between the light emitting element 110 and the first conductor 734. By disposing the first light transmitting region 737a and the second light transmitting regions 737b to 737e so that a plurality of regions of the light emitting element 110 in the X direction can be visually confirmed, the degree of spread of the bonding layer 734c between the light emitting element 110 and the first conductor 734 can be visually confirmed. This allows confirmation of poor bonding between the light emitting element 110 and the first conductor 734. In addition, the base 120, the lid 130, the first frame 140, and the second frame 150 can form a space that hermetically seals the light emitting element 110. Therefore, the number of parts used to form the space that is hermetically sealed can be reduced, and the manufacturing process of the light emitting device 700 can be simplified. The other effects and advantages of this embodiment are the same as those of the first embodiment.

[0142] Although the preferred embodiments have been described in detail above, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the claims.

[0143] In addition to the above-described embodiment, the following supplementary notes are further disclosed. (Appendix 1) A light-emitting element; a base having an upper surface facing a lower surface of the light emitting element and directly or indirectly supporting the light emitting element; a flat plate-shaped lid having a lower surface facing an upper surface of the light-emitting element; a first frame portion provided on the upper surface of the base and surrounding the light emitting element; Equipped with the base includes a first conductor portion joined to the lower surface of the light-emitting element, the lid body includes a second conductor portion joined to the upper surface of the light emitting element, The first frame portion is directly or indirectly joined to the lid body. Light emitting device. (Appendix 2) Further, a second frame portion is provided on the lower surface of the lid body and directly joined to the first frame portion. 2. The light-emitting device of claim 1. (Appendix 3) the light-emitting element is hermetically sealed in a space defined by the base, the lid, the first frame portion, and the second frame portion; 3. The light-emitting device of claim 2. (Appendix 4) a bonding layer formed by hardening an adhesive is disposed between the lower surface of the light-emitting element and the first conductor portion, between the upper surface of the light-emitting element and the second conductor portion, and between the first frame portion and the second frame portion, 4. The light-emitting device according to claim 2 or 3. (Appendix 5) The light reflective member is disposed on the upper surface of the base and reflects the light emitted from the light emitting element toward the lid. 5. The light emitting device according to claim 1 , (Appendix 6) the first frame portion includes a conductive region, The conductive region is a part of a current path for passing a current to the light-emitting element. 6. The light emitting device according to claim 1 , (Appendix 7) the lid body includes a third conductor portion protruding from the second conductor portion toward the upper surface of the base body, the base body includes a fourth conductor portion joined to the third conductor portion, the third conductor portion and the fourth conductor portion are part of a current path for passing a current to the light emitting element; 6. The light emitting device according to claim 1 , (Appendix 8) a first electrode electrically connected to the first conductor; a second electrode electrically connected to the second conductor; Further equipped with the first electrode is disposed on a lower surface of the base; the first conductor portion includes an outer layer portion disposed between the upper surface of the base and the lower surface of the light emitting element, and an inner layer wiring provided inside the base and joined to the outer layer portion and the first electrode, 8. The light emitting device according to claim 1 . (Appendix 9) a first electrode electrically connected to the first conductor; a second electrode electrically connected to the second conductor; Further equipped with the first electrode and the second electrode are each disposed on the upper surface of the substrate; 8. The light emitting device according to claim 1 . (Appendix 10) a first electrode electrically connected to the first conductor; a second electrode electrically connected to the second conductor; Further equipped with The first electrode and the second electrode are each disposed on the upper surface of the lid. 8. The light emitting device according to claim 1 . (Appendix 11) a first electrode electrically connected to the first conductor; a second electrode electrically connected to the second conductor; Further equipped with the first electrode and the second electrode are each disposed on the lower surface of the lid; 8. The light emitting device according to claim 1 . (Appendix 12) the lid further includes a fifth conductor portion joined to the second conductor portion and the second electrode and provided so as to straddle the first frame portion, At least a portion of the fifth conductor portion is provided inside the lid. 11. The light-emitting device according to claim 9 or 10. (Appendix 13) A second frame portion is provided on the lower surface of the lid body and is directly joined to the first frame portion, The fifth conductor portion is provided so as to straddle the second frame portion. 13. The light-emitting device of claim 12. (Appendix 14) the lid body has a light-shielding portion on at least one of an upper surface and a lower surface, the cover body includes a plurality of light-transmitting regions in which the light-shielding portion is not provided when viewed from above, One of the plurality of light-transmitting regions is a first light-transmitting region through which light emitted from the light-emitting element passes, and at least another of the plurality of light-transmitting regions is a second light-transmitting region disposed at a position where an area not including a light emission surface of the light-emitting element can be viewed. 14. The light emitting device according to claim 1. [Industrial Applicability]

[0144] The light emitting device according to the present disclosure is applicable to light sources such as projectors, in-vehicle headlights, lighting, head-mounted displays, and backlights for other displays. [Explanation of symbols]

[0145] 100,200,300,400,500,600,700 Light-emitting device 110 Light emitting element 111 above 112 below 113 Light exit surface 120 Matrix 121 above 122 below 124,324,524,734 1st conductor part 124a Outer layer 124b 1st inner layer wiring 125 2nd inner layer wiring 127 4th Conductor Section 595 6th Conductor Section 595a Level 1 595b Layer 2 130,730 Cover 131,731 above 132,732 below 134,334,434,534 Second conductor part 134a Level 1 134b Layer 2 134c Bonding layer 334a Level 1 334b Layer 2 334c Wall 135 The third conductor 597 7th Conductor Division 637a,637b Inner wiring 737 shading part 737a 1st light transmission area 737b,737c,737d,737e Second light transmission area 140 Part 1 141 Bonding layer 150 Part 2 160 Light reflective materials 161 Light reflecting surface 170 Protecting the Elements 181,381,581,681 1st electrode 182,382,582,682 Second electrode 490 5th Conductor Section 490a 1st Pillar 490b Second column 490c Beam

Claims

1. A light-emitting element; a base having an upper surface facing a lower surface of the light emitting element and directly or indirectly supporting the light emitting element; a flat plate-shaped lid having a lower surface facing an upper surface of the light-emitting element; a first frame portion provided on the upper surface of the base and surrounding the light emitting element; Equipped with the base body includes a first conductor portion joined to the lower surface of the light emitting element, the lid body includes a second conductor portion joined to the upper surface of the light emitting element, The first frame portion is directly or indirectly joined to the lid body. Light emitting device.

2. Further, a second frame portion is provided on the lower surface of the lid body and directly joined to the first frame portion. The light emitting device according to claim 1 .

3. the light-emitting element is hermetically sealed in a space defined by the base, the lid, the first frame portion, and the second frame portion; The light emitting device according to claim 2 .

4. a bonding layer formed by hardening an adhesive is disposed between the lower surface of the light-emitting element and the first conductor portion, between the upper surface of the light-emitting element and the second conductor portion, and between the first frame portion and the second frame portion, The light emitting device according to claim 2 or 3.

5. The light reflective member is disposed on the upper surface of the base and reflects the light emitted from the light emitting element toward the lid. The light emitting device according to claim 1 .

6. the first frame portion includes a conductive region, The conductive region is a part of a current path for passing a current to the light-emitting element. The light emitting device according to claim 1 .

7. the lid body includes a third conductor portion protruding from the second conductor portion toward the upper surface of the base body, the base body includes a fourth conductor portion joined to the third conductor portion, the third conductor portion and the fourth conductor portion are part of a current path for passing a current to the light emitting element; The light emitting device according to claim 1 .

8. a first electrode electrically connected to the first conductor; A second electrode electrically connected to the second conductor portion; Further equipped with the first electrode is disposed on a lower surface of the base; the first conductor portion includes an outer layer portion disposed between the upper surface of the base and the lower surface of the light emitting element, and an inner layer wiring provided inside the base and joined to the outer layer portion and the first electrode, The light emitting device according to claim 1 .

9. a first electrode electrically connected to the first conductor; A second electrode electrically connected to the second conductor portion; Further equipped with the first electrode and the second electrode are each disposed on the upper surface of the substrate; The light emitting device according to claim 1 .

10. a first electrode electrically connected to the first conductor; A second electrode electrically connected to the second conductor portion; Further equipped with The first electrode and the second electrode are each disposed on an upper surface of the lid. The light emitting device according to claim 1 .

11. a first electrode electrically connected to the first conductor; A second electrode electrically connected to the second conductor portion; Further equipped with the first electrode and the second electrode are each disposed on the lower surface of the lid; The light emitting device according to claim 1 .

12. the lid further includes a fifth conductor portion joined to the second conductor portion and the second electrode and provided so as to straddle the first frame portion, At least a portion of the fifth conductor portion is provided inside the lid.

11. A light emitting device according to claim 9 or 10.

13. A second frame portion is provided on the lower surface of the lid body and is directly joined to the first frame portion, The fifth conductor portion is provided so as to straddle the second frame portion.

13. The light emitting device according to claim 12.

14. the lid body has a light-shielding portion on at least one of an upper surface and a lower surface, the cover includes a plurality of light-transmitting regions in which the light-shielding portion is not provided when viewed from above, One of the plurality of light-transmitting regions is a first light-transmitting region through which light emitted from the light-emitting element passes, and at least another one of the plurality of light-transmitting regions is a second light-transmitting region disposed at a position where an area not including a light emission surface of the light-emitting element can be viewed. The light emitting device according to claim 1 .

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