Light-emitting module and method for manufacturing light-emitting module

Abstract

To provide an improved and novel light-emitting module and a method for manufacturing the light-emitting module, which are capable of more reliably or more easily achieving the desired positioning accuracy of a light-emitting device with respect to a base.SOLUTION: A light-emitting module includes, for example, a light-emitting device and a base that includes: a mounting surface, which faces in a first direction and on which the light-emitting device is mounted through a solder; and at least one protrusion which is adjacent to the mounting surface in a direction intersecting the first direction and protrudes in the first direction relatively with respect to the mounting surface. The at least one protrusion has a plurality of first surfaces that are in contact with the light-emitting device in mutually different directions intersecting the first direction. A side surface of the light-emitting device is partially in contact with the first surfaces, and a portion of the side surface at which an electroconductive part is exposed is not in contact with the first surfaces.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a light emitting module and a method for manufacturing the light emitting module. [Background technology]

[0002] 2. Description of the Related Art Conventionally, there is known a light emitting module in which light output from a light emitting device provided on a base is guided to an end of an optical fiber via a plurality of optical components provided on the base (for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2017 / 134911 Summary of the Invention [Problem to be solved by the invention]

[0004] In this type of light-emitting module, the positioning accuracy of the light-emitting device with respect to the base is important from the viewpoint of increasing the efficiency of use of light output from the light-emitting device.

[0005] Therefore, one of the objects of the present invention is to provide an improved and novel light-emitting module and a method for manufacturing the light-emitting module that makes it possible to more reliably or more easily achieve the desired positioning accuracy of the light-emitting device relative to the base. [Means for solving the problem]

[0006] The light-emitting module of the present invention, for example, comprises a light-emitting device, a mounting surface facing a first direction and on which the light-emitting device is mounted via a bonding material, and a conductive base having at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface, the at least one protrusion having a plurality of first faces that contact the light-emitting device in different directions intersecting the first direction, the light-emitting device having a light-emitting element and a side on which a conductor portion electrically connected to an electrode of the light-emitting element is exposed, a portion of the side face is in contact with the first face, and the portion of the side face on which the conductor portion is exposed is not in contact with the first face.

[0007] Furthermore, a manufacturing method for a light-emitting module of the present invention includes, for example, a light-emitting device, a mounting surface facing a first direction and on which the light-emitting device is mounted via a bonding material, and a base having at least one protrusion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface, the at least one protrusion having a plurality of first surfaces in contact with the light-emitting device in different directions intersecting the first direction, the manufacturing method for a light-emitting module including a first step of applying a paste-like bonding material or placing a sheet-like bonding material on the mounting surface, a second step of placing the light-emitting device on the bonding material and the mounting surface with the plurality of first surfaces in contact with the light-emitting device, a third step of heating and melting the bonding material after the second step, and a fourth step of mounting the light-emitting device on the mounting surface via the bonding material by solidifying the bonding material after the third step. Effect of the Invention

[0008] According to the present invention, it is possible to provide an improved and novel light emitting module and a method for manufacturing the light emitting module, which makes it possible to more reliably or more easily achieve a desired positioning accuracy with respect to a base of a light emitting device. [Brief description of the drawings]

[0009] [Figure 1]FIG. 1 is an illustrative schematic plan view of a light-emitting module according to an embodiment. [Diagram 2] FIG. 2 is an exemplary schematic perspective view of a portion of the light emitting module of the embodiment. [Diagram 3] FIG. 3 is an exemplary schematic plan view of a portion of the light-emitting module of the embodiment, in a state where the light-emitting module is not mounted on the base. [Figure 4] FIG. 4 is an exemplary schematic plan view of a portion of the light-emitting module of the embodiment, showing the light-emitting module mounted on a base. [Diagram 5] FIG. 5 is a schematic cross-sectional view illustrating an example of a light emitting device according to an embodiment. [Figure 6] FIG. 6 is a flowchart showing an example of a procedure of a method for manufacturing a light emitting module according to an embodiment. [Figure 7] FIG. 7 is a cross-sectional view taken along line VII-VII of FIG. [Figure 8] FIG. 8 is a cross-sectional view taken along line VIII-VIII of FIG. [Figure 9] FIG. 9 is a cross-sectional view taken along line IX-IX of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Exemplary embodiments of the present invention are disclosed below. The configurations of the embodiments shown below, and the actions and results (effects) brought about by the configurations are merely examples. The present invention can be realized by configurations other than those disclosed in the following embodiments. Furthermore, according to the present invention, it is possible to obtain at least one of the various effects (including derivative effects) obtained by the configurations.

[0011] In this specification, ordinal numbers are given for the sake of convenience to distinguish between parts, members, locations, directions, processes, etc., and do not indicate a priority order or sequence.

[0012] In each figure, the X direction is represented by an arrow X, the Y direction is represented by an arrow Y, and the Z direction is represented by an arrow Z. The X direction, the Y direction, and the Z direction intersect with each other and are perpendicular to each other. In this specification, the line of sight seen in the opposite direction to the Z direction is referred to as a plan view. The directions are the directions when each component is assembled into the light-emitting module.

[0013] 1 and 5, the optical path of the laser light L is indicated by a solid arrow.

[0014] [Embodiment] [Light emitting module configuration] FIG. 1 is a schematic diagram of a light emitting module 100 according to an embodiment, and is a plan view of the inside of the light emitting module 100 as viewed in the opposite direction to the Z direction.

[0015] As shown in FIG. 1, the light emitting module 100 includes a base 10, a plurality of subunits 101, a light combining unit 107, condenser lenses 104 and 105, an optical fiber 30, and an optical fiber holding unit .

[0016] Each subunit 101 includes a laser light source 20, a collimating lens 102, and a mirror 103. The collimating lens 102 collimates the laser light in the X direction, in this example, in the slow axis direction. In this embodiment, the collimating lens that collimates the laser light in the Z direction, in this example, in the fast axis direction, is included in the laser light source 20. However, this is just one example, and the collimating lens that collimates the laser light in the fast axis direction may be provided outside the laser light source 20, between the laser light source 20 and the collimating lens 102. In that case, the collimating lens that collimates in the fast axis direction is included in the subunit 101. The laser light source 20 is an example of a light emitting device.

[0017] The laser light output from each laser light source 20 passes through the collimating lens 102 and the mirror 103 of each subunit 101, and is further guided to the end 30a of the optical fiber 30 via the light combining unit 107 and the condensing lenses 104 and 105, and is optically coupled to the optical fiber 30. The optical fiber 30 is an example of a first optical component. The collimating lens 102, the mirror 103, the light combining unit 107, and the condensing lenses 104 and 105 are an example of a second optical component that guides the laser light output from each of the multiple laser light sources 20 to the optical fiber 30 so as to be optically coupled to the optical fiber 30.

[0018] The subunits 101, the light combining unit 107, the condenser lenses 104 and 105, the end 30a of the optical fiber 30, and at least a part of the optical fiber holding unit 106 are all attached to the base 10 directly or indirectly via other members, and are housed in a housing chamber formed between the base 10 and the cover. As an example, the housing chamber is hermetically sealed, but it does not have to be hermetically sealed.

[0019] The base 10 has multiple stepped surfaces that face the Z direction and are shifted a certain distance in the opposite direction to the Z direction as they are shifted in the X direction, as mounting surfaces for the subunits 101. The subunits 101 have subunits 101a1, 101a2, ..., 101an (n is an integer of 2 or more) that constitute an array A1 lined up in the X direction, and subunits 101b1, 101b2, ..., 101bn that constitute an array A2 lined up in the X direction.

[0020] Each of the laser light sources 20 outputs a laser beam. The laser beam output from the laser light source 20 travels in the X direction via the collimator lens 102 and the mirror 103. As described above, each of the subunits 101 is provided on a stepped mounting surface. Therefore, the laser beam traveling in the X direction from the mirror 103 of each subunit 101 does not interfere with the mirrors of other subunits 101 that are shifted in the X direction relative to the mirror 103.

[0021] The laser light from each mirror 103 is input to the light combining section 107 and combined in the light combining section 107. The light combining section 107 includes a combiner 107a, a mirror 107b, and a 1 / 2 wavelength plate 107c.

[0022] Mirror 107b directs the laser light from subunits 101 of array A1 to combiner 107a via half wave plate 107c, which rotates the plane of polarization of the light from array A1.

[0023] On the other hand, the laser light from the subunits 101 of array A2 is input directly to combiner 107a.

[0024] The combiner 107a combines the laser lights from the two arrays A1 and A2. The combiner 107a may also be referred to as a polarization combining element.

[0025] The laser light from the combiner 107a is focused by the focusing lenses 104 and 105 toward the end 30a of the optical fiber 30. The focusing lens 104 focuses the laser light in the fast axis, and the focusing lens 105 focuses the laser light in the slow axis.

[0026] The optical fiber holding portion 106 holds the optical fiber 30 via, for example, an adhesive.

[0027] The base 10 is made of a material with a relatively high thermal conductivity, such as a metal material. The base 10 is made of, for example, a copper-based material with a surface that is plated. The components of the subunit 101, the components of the light combining unit 107, and the condenser lenses 104 and 105 are attached to the base 10 via a bonding material such as an adhesive or solder. These components may be indirectly attached to the base 10 via another member. The optical fiber holding unit 106 may be a member separate from the base 10, or may be a part of the base 10.

[0028] The base 10 is also provided with a refrigerant passage 108 for cooling the subunit 101 including the laser light source 20, the optical fiber holding unit 106, the condenser lenses 104 and 105, the combiner 107a, and the like. In the refrigerant passage 108, for example, a refrigerant such as a cooling liquid flows. The refrigerant passage 108 passes, for example, near the mounting surface of each component of the base 10, for example, directly below or in the vicinity thereof, and the inner surface of the refrigerant passage 108 and the refrigerant in the refrigerant passage 108 are thermally connected to the components and parts to be cooled, i.e., the subunit 101, the optical fiber holding unit 106, the condenser lenses 104 and 105, the combiner 107a, and the like. The components and parts to be cooled are cooled by heat exchange with the refrigerant via the base 10.

[0029] [Laser light source mounting structure] Fig. 2 is a perspective view of a portion of the light-emitting module 100. Fig. 3 is a plan view of a portion of the light-emitting module 100 in a state in which the laser light source 20 is not mounted. Fig. 4 is a plan view of a portion of the light-emitting module 100 in a state in which the laser light source 20 is mounted.

[0030] Fig. 2 shows the portions of the base 10 where the laser light sources 20 included in the two subunits 101b1 and 101b2 of the array A2 are mounted. For ease of explanation, Fig. 2 shows a state where the laser light source 20 of the subunit 101b1 has not yet been mounted, and the laser light source 20 of the subunit 101b2 has been mounted.

[0031] As shown in FIG. 2, the base 10 is provided with a plurality of surfaces 12a. The surfaces 12a are each oriented in the Z direction, and intersect and are perpendicular to the Z direction. As shown in FIG. 2, in the array A2, the plurality of surfaces 12a are provided in a stepped shape such that as they are shifted by a certain length in the X direction, they are shifted by a certain length in the opposite direction to the Z direction. Not limited to the portions shown in FIG. 2, the portions of the base 10 corresponding to the two laser light sources 20 adjacent in the X direction in the arrays A1 and A2 all have the same shape as in FIG. 2. However, the portions of the base 10 corresponding to the two laser light sources 20 adjacent in the X direction in the array A1 have a configuration that is a mirror image of FIG. 2.

[0032] Each of the faces 12a is provided with a first recess 11 that accommodates a part of the laser light source 20. The first recess 11 is recessed with a substantially constant depth in the opposite direction to the Z direction with respect to the face 12a. The first recess 11 has a substantially rectangular shape in a plan view. That is, the bottom surface 11a of each of the first recesses 11 has a substantially rectangular shape in a plan view. The bottom surface 11a faces the Z direction, intersects with the Z direction, and is substantially perpendicular thereto. The laser light source 20 is surface-mounted on the bottom surface 11a via the solder 40 by so-called reflow soldering. The bottom surface 11a is an example of a mounting surface. The solder 40 is an example of a bonding material. The Z direction is an example of a first direction.

[0033] Each bottom surface 11a is offset by a fixed length (depth) in the opposite direction to the Z direction from the corresponding surface 12a. As described above, in each of the arrays A1 and A2, the multiple surfaces 12a are arranged in a stepped manner such that as they are offset by a fixed length in the X direction, they are also offset by a fixed length in the opposite direction to the Z direction. Therefore, in each of the arrays A1 and A2, the multiple bottom surfaces 11a are arranged in a stepped manner such that as they are offset by a fixed length in the X direction, they are also offset by a fixed length in the opposite direction to the Z direction.

[0034] The surface 12a is shifted in the Z direction with respect to each of the bottom surfaces 11a. That is, in this embodiment, it can be said that a protrusion 12 having the surface 12a as a top surface is formed with respect to each of the bottom surfaces 11a configured in a stepped shape. The protrusion 12 protrudes in the Z direction relative to the bottom surface 11a at a position adjacent to the bottom surface 11a in a direction intersecting the Z direction. In this embodiment, the base 10 is provided with two protrusions 12A and 12B with respect to each of the bottom surfaces 11a. However, the number of protrusions 12 with respect to the bottom surface 11a is not limited to two, and may be one, or may be three or more. That is, it is sufficient that the base 10 is provided with at least one protrusion 12 corresponding to each of the bottom surfaces 11a. In this embodiment, the positions in the Z direction of the top surfaces (surfaces 12a in this embodiment) of the multiple protrusions 12 corresponding to one bottom surface 11a are the same, that is, flat. In this case, after forming the surface 12a, the first recess 11 and the notch 12c are formed, so that the multiple protrusions 12 can be formed relatively easily. The top surfaces of the multiple protrusions 12 may be shifted in the Z direction. Also, a collimating lens 102 and a mirror 103 may be mounted on the surface 12a at a position away from the first recess 11.

[0035] 2 and 3, the protrusion 12 has four faces 12b1 to 12b4 constituting the side surfaces of the first recess 11. The face 12b1 faces in the direction opposite to the X direction, intersects with the X direction and is approximately perpendicular to it. The face 12b2 faces in the Y direction, intersects with the Y direction and is approximately perpendicular to it. The face 12b3 faces in the X direction, intersects with the X direction and is approximately perpendicular to it. The face 12b4 faces in the direction opposite to the Y direction, intersects with the Y direction and is approximately perpendicular to it.

[0036] As shown in FIG. 4, the laser light source 20 has four side surfaces 21b1 to 21b4 facing the four surfaces 12b1 to 12b4 of the protrusion 12, respectively. The side surface 21b1 faces the X direction, intersects the X direction and is approximately perpendicular to the X direction, and faces the surface 12b1. The side surface 21b2 faces the opposite direction to the Y direction, intersects the Y direction and is approximately perpendicular to the Y direction, and faces the surface 12b2. The side surface 21b3 faces the opposite direction to the X direction, intersects the X direction and is approximately perpendicular to the X direction, and faces the surface 12b3. The side surface 21b4 faces the Y direction, intersects the Y direction and is approximately perpendicular to the Y direction, and faces the surface 12b4 of the first recess 11.

[0037] As shown in FIG. 4, the laser light source 20 is disposed in the first recess 11 in the opposite direction to the Y direction and in the X direction. That is, the laser light source 20 is mounted on the base 10 with the side surface 21b1 in contact with the surface 12b1 of the protruding portion 12B, 12 and the side surface 21b2 in contact with the surface 12b2 of the protruding portion 12A, 12. That is, in this embodiment, the surface 12b1 and the surface 12b2 are used to position the laser light source 20 with respect to the base 10. The surface 12b1 and the surface 12b2 are in contact with the laser light source 20 in different directions intersecting with the Z direction, in this embodiment, as an example, in the opposite direction to the X direction and in the Y direction. With this configuration, the laser light source 20 can be accurately positioned with respect to the base 10 in different directions intersecting with the Z direction. In addition, with this configuration, it is possible to suppress deviation such as rotation of the laser light source 20 around the Z axis with respect to the base 10. The surfaces 12b1 and 12b2 are examples of first surfaces, and may also be referred to as contact surfaces or positioning surfaces. Note that the direction opposite to the X direction and the Y direction are different directions and intersect with each other.

[0038] 2 and 3, in this embodiment, the bottom surface 11a is provided with a second recess 11b for accommodating the solder 40. The second recess 11b is recessed with a substantially constant depth in the opposite direction to the Z direction with respect to the bottom surface 11a. The second recess 11b has a substantially rectangular shape in a plan view. That is, the bottom surface 11b1 of the second recess 11b has a substantially rectangular shape in a plan view. The bottom surface 11b1 faces the Z direction, intersects with the Z direction, and is substantially perpendicular to the Z direction. Before melting, the solder 40 has a rectangular and sheet-like shape that is smaller than the bottom surface 11b1 of the second recess 11b and has a substantially constant thickness in a plan view. The solder 40 may be in a paste form. The second recess 11b can be used as a target for the position where the solder 40 is placed on the bottom surface 11a before melting. The second recess 11b can also accommodate the solder that has melted and spread out. In other words, by providing the second recess 11b in the bottom surface 11a to accommodate the solder 40, the effect is obtained that the solder 40 can be kept in a position suitable for mounting the laser light source 20 both before and after melting.

[0039] [Laser light source configuration] 5 is a cross-sectional view of a laser light source 20 serving as a light emitting device. As shown in FIG. 5, the laser light source 20 includes a housing 21, an electrode 22, a cover member 23, a chip-on submount 24, a bottom member 25, a collimator lens 26, an internal mirror 27, an external mirror 28, and a bonding material 29.

[0040] The housing 21 has a laminated structure in which a plurality of plate-shaped members 21A to 21C are laminated. The housing 21 is, for example, a ceramic package. In this case, the members 21A to 21C are made of ceramics. The members 21A to 21C are an example of layers. The members 21A to 21C each have a through hole. The members 21A to 21C are laminated and integrated so that their through holes overlap in the Z direction. The lid member 23 is integrated in a state in which it covers the through hole of the member 21C and is in contact with the member 21C in the Z direction. The bottom member 25 is integrated in a state in which it penetrates the through hole of the member 21A and is in contact with the member 21B in the opposite direction to the Z direction and is in a state in which it covers the through hole of the member 21B. With this configuration, a component storage chamber R surrounded by the members 21A to 21C, the lid member 23, and the bottom member 25 is formed inside the laser light source 20. The cover member 23 is made of a material that transmits laser light, such as sapphire or glass. The surface of the end of the cover member 23 on the opposite side in the Z direction is covered with a shielding film that blocks the laser light, except for a window portion 23a (see FIG. 4) through which the laser light passes. The shielding film is, for example, a metal film. The bottom member 25 is made of a material with relatively high thermal conductivity, such as a metal material, and functions as a heat dissipation portion. The bottom member 25 is integrated with the housing 21 in a state in which it protrudes slightly in the opposite direction in the Z direction from the surface 21a of the end of the housing 21 on the opposite side in the Z direction.

[0041] The electrode 22 is provided on the surface 21c of the end portion in the Z direction of the housing 21, at a position away from the cover member 23. The electrode 22 is made of a material having a relatively high electrical conductivity, such as a metal material. Examples of the metal material that can be used include silver, copper, tungsten, molybdenum, gold, nickel, platinum, titanium, and palladium.

[0042] The accommodation chamber R accommodates a chip-on submount 24, a collimator lens 26, and an internal mirror 27. The chip-on submount 24 has a submount 24a and a light-emitting element 24b.

[0043] The submount 24a has, for example, a plate shape that intersects with the Z direction and is substantially perpendicular to the Z direction. The submount 24a can be made of an insulating material with a relatively high thermal conductivity, such as ceramics such as aluminum nitride, silicon nitride, aluminum oxide, and silicon carbide, or glass. The submount 24a is mounted on the bottom member 25.

[0044] The light-emitting element 24b is, for example, a semiconductor laser element having a fast axis and a slow axis. The light-emitting element 24b has an elongated shape extending in the Y direction. The light-emitting element 24b outputs laser light L in the Y direction. The chip-on submount 24 is mounted such that the fast axis of the light-emitting element 24b is aligned along the Z direction and the slow axis is aligned along the X direction.

[0045] The collimating lens 26 collimates the laser light L traveling in the Y direction in the Z direction, in this example, in the fast axis direction. The collimating lens 26 is attached to the submount 24a or a lens holder.

[0046] The internal mirror 27 reflects, in the Z direction, the laser light L that passes through the collimator lens 26 and travels in the Y direction. The laser light L reflected by the internal mirror 27 passes through the window portion 23a of the cover member 23 and exits from the laser light source 20.

[0047] The external mirror 28 reflects, in the Y direction, the light that passes through the window portion 23a and travels in the Z direction. The external mirror 28 is bonded onto the surface 23b of the lid member 23 via a bonding material 29. The surface 23b is located at the end of the lid member 23 in the Z direction, faces the Z direction, and intersects with and is substantially perpendicular to the Z direction.

[0048] Here, the reflecting surface 28a of the external mirror 28 extends in the direction toward the Y direction as it moves toward the Z direction, that is, in the direction between the Y direction and the Z direction. Therefore, by adjusting the relative mounting position of the external mirror 28 with respect to the lid member 23 in the Y direction as indicated by the arrow D1, the relative position (height) of the laser light L with respect to the lid member 23 in the Z direction as indicated by the arrow D2 can be adjusted. In addition, by adjusting the angles of the external mirror 28 relative to the lid member 23 about the X axis, the Y axis, and the Z axis, respectively, the direction of the laser light L can be adjusted. In this case, first, the external mirror 28 and the lid member 23 are positioned using a jig or the like so that the desired position and direction of the laser light L can be obtained before or after the application of the bonding material 29, while the bonding material 29 is in a soft state and not yet solidified. Then, the bonding material 29 is solidified while maintaining the relative positioning state. According to such a configuration and method, the position and direction of the laser light L can be adjusted with higher accuracy. The bonding material 29 is, for example, a thermosetting or ultraviolet-curing bonding material. The Z direction is an example of a second direction, the external mirror 28 is an example of a mirror, and the surface 23b is an example of a second surface.

[0049] In the housing 21, a conductor layer made of a conductive metal material is provided at the boundaries B1 and B2 where the multiple members 21A to 21C are adjacent to each other. The conductor layer is electrically connected to the electrode 24b1 or the electrode 24b2 of the light-emitting element 24b through an electrode, a bonding wire, or the like provided on the submount 24a. The conductor layer is also electrically connected to the electrode 22 through a via hole or the like provided in the housing 21. That is, the conductor layer provided at the boundaries B1 and B2 constitutes a part of the wiring that electrically connects the electrodes 24b1 and 24b2 of the light-emitting element 24b to the electrode 22 of the laser light source 20. The metal material of the conductor layer is, for example, silver, copper, tungsten, molybdenum, gold, nickel, platinum, titanium, palladium, or an alloy thereof.

[0050] [Installation of laser light source on the base] FIG. 6 is a flow chart showing an example of a procedure for mounting the laser light source 20 on the base 10 in the manufacturing method of the light emitting module 100. As shown in FIG. 6, first, a sheet-like solder 40 is placed on the bottom surface 11a as a mounting surface, or in this embodiment, on the bottom surface 11b1 of the second recess 11b, or a paste-like solder 40 is applied (S11). Next, the laser light source 20 as a light emitting device is placed on the solder 40 and the bottom surface 11a (S12). In S12, it is preferable to appropriately set the thickness of the solder 40, the depth from the bottom surface 11a of the second recess 11b, and the protruding height from the surface 21a of the bottom member 25 so that the solder 40 and the bottom member 25 of the laser light source 20 are in contact with each other reliably. S11 and S12 are performed sequentially for all bottom surfaces 11a included in the light emitting module 100. S11 is an example of a first step, and S12 is an example of a second step.

[0051] Next, the solder 40 is heated to melt (S13), and the melted solder 40 is cooled and solidified, thereby surface-mounting the laser light source 20 on the bottom surface 11a (S14). S13 is an example of a third step, and S14 is an example of a fourth step.

[0052] In S13, when the solder 40 melts, the laser light source 20 floats on the melted solder 40, and the position and posture become unstable, and there is a risk that the laser light source 20 may be displaced from the intended position when the solder 40 solidifies in S14. Therefore, in this embodiment, in S12, the laser light source 20 is placed on the solder 40 in a state in which the side surface 21b1 and the surface 12b1 of the protruding portion 12B are in contact with each other, and the side surface 21b2 and the surface 12b2 of the protruding portion 12A are in contact with each other. As a result, in S13 and S14, the contact between the surface 12b1 and the side surface 21b1 limits the movement of the laser light source 20 in the X direction relative to the base 10, and the contact between the surface 12b2 and the side surface 21b2 limits the movement of the laser light source 20 in the opposite direction to the Y direction relative to the base 10. In addition, the friction between the side surface 21b1 and the surface 12b1 may limit the movement of the laser light source 20 in the Y direction and the opposite direction to the Y direction relative to the base 10, and the friction between the surface 12b2 and the side surface 21b2 may limit the movement of the laser light source 20 in the X direction and the opposite direction to the X direction. As a result, in S13 and S14, the movement of the laser light source 20 in a direction intersecting the Z direction and the rotation of the laser light source 20 around the Z axis are suppressed, and the desired positioning accuracy of the laser light source 20 relative to the base 10 can be achieved more reliably or more easily. Even if the bonding material is other than the solder 40, the same effect can be obtained if the bonding material has fluidity before it hardens, if a volume change occurs, if the shape changes, etc. Examples of such bonding materials include metal pastes (Au, Ag, Cu, etc.), brazing materials, resin materials, etc.

[0053] In addition, in S13 and S14, as shown in FIG. 4, the laser light source 20 may be pressed in the X direction by a pressing member or the like relative to the base 10, or may be pressed in the opposite direction to the Y direction by a force F1. The force F1 is a pressing force that presses the side surface 21b1 against the surface 12b1, and the force F2 is a pressing force that presses the side surface 21b2 against the surface 12b2. This makes it possible to more reliably obtain the effects of the contact between the surface 12b1 and the side surface 21b1 and the contact between the surface 12b2 and the side surface 21b2. The forces F1 and F2 are set as small as possible within a range in which the above-mentioned effects can be obtained, and are applied so as not to cause the laser light source 20 to tilt. The forces F1 and F2 may be applied both or only one of them.

[0054] 7 to 9 are cross-sectional views showing a state after S14, that is, after surface mounting of the laser light source 20 on the bottom surface 11a is completed. Fig. 7 is a cross-sectional view taken along line VII-VII in Fig. 4. Fig. 8 is a cross-sectional view taken along line VIII-VIII in Fig. 4. Fig. 9 is a cross-sectional view taken along line IX-IX in Fig. 4.

[0055] When the laser light source 20 is mounted on the base 10, the side surface 21b1 of the laser light source 20 contacts the surface 12b1 of the protruding portion 12B as shown in Fig. 7 and 9. Also, the side surface 21b2 of the laser light source 20 contacts the surface 12b2 of the protruding portion 12A as shown in Fig. 8. Due to the contact at these two points, the laser light source 20 is positioned relative to the base 10 in the X direction and the Y direction that intersect with the Z direction.

[0056] In this embodiment, an end portion of the conductor layer 21d formed at the boundary B1 (see FIG. 5) between the member 21A and the member 21B is exposed on the side surface 21b4 (FIG. 7), the side surface 21b3 (FIG. 8), and the side surface 21b1 (FIG. 9) of the housing 21. The conductor layer 21d constitutes a part of the wiring that electrically connects the electrode 24b1 or the electrode 24b2 of the light emitting element 24b to the electrode 22 of the laser light source 20. The conductor layer 21d is an example of a conductor portion.

[0057] The conductor layer 21d is formed, for example, by electroplating on the surface of the end of the member 21A in the Z direction before the members 21A to 21C are stacked and integrated. The electroplating process for the member 21A is performed on an original member in which regions for a plurality of laser light sources 20 (hereinafter referred to as package regions) are arranged in a matrix, and the package regions cut out from the original member become the members 21A corresponding to the laser light sources 20, respectively. In this case, the boundaries between the adjacent package regions become the member 21A, i.e., the side surface of the housing 21. Here, the electroplating process is performed collectively on the plurality of package regions in the original member. For this reason, the wiring pattern for the electroplating process is formed so as to straddle the boundaries between the plurality of package regions. Therefore, in this embodiment, the parts of the wiring pattern straddling the boundaries between the package regions are exposed as the ends of the conductor layer 21d on the side surfaces 21b1, 21b3, and 21b4 of the housing 21.

[0058] When the base 10 is made of a conductive material such as a metal material, if the end of the conductor layer 21d exposed on the side surfaces 21b1 and 21b2 contacts the surfaces 12b1 and 12b2 of the protruding portion 12, there is a risk of a short circuit occurring between the electrodes 24b1 and 24b2 of the light emitting element 24b and the base 10. Therefore, in this embodiment, as shown in FIG. 9, the side surface 21b1 contacting the surface 12b1 is configured so that the end of the conductor layer 21d is exposed at a position away from the protruding portion 12B. In other words, the base 10 is provided with the protruding portion 12B having the surface 12b1 at a position away from the end of the conductor layer 21d. In further words, a part of the side surface 21b1 contacts the surface 12b1, and the part of the side surface 21b1 where the end of the conductor layer 21d is exposed is not in contact with the surface 12b1. Specifically, as shown in Figs. 2 to 4, the base 10 is provided with a notch 12c between the protruding portion 12A and the protruding portion 12B to expose the end of the conductor layer 21d. With this configuration, when the base 10 is made of a conductive material and the end of the conductor layer 21d is exposed on the side surface 21b1 of the housing 21 of the laser light source 20, the conductor layer 21d comes into contact with the base 10, and a short circuit occurs between the electrodes 24b1, 24b2 of the light emitting element 24b and the base 10. In addition, it is possible to suppress an event in which the molten solder 40 moves in the Z direction from the bottom surface 11a through the gap between the side surface 21b1 and the surface 12b1 due to wettability, capillary phenomenon, etc., and a short circuit occurs between the end of the conductor layer 21d and the surface 12b1 via the solder 40.

[0059] 4, the length L2 in the Y direction of the portion of the surface 12b1 that contacts the side surface 21b1 is shorter than the length L1 in the Y direction of the side surface 21b1 of the laser light source 20 that contacts the surface 12b1. With this configuration, the notch 12c can be provided adjacent to the protrusion 12B having the surface 12b1 as a non-forming portion of the protrusion 12B and the surface 12b1. If the amount of solder 40 applied in S12 is greater than the expected amount, and the solder 40 melted in S13 remains in the first recess 11, the solder 40 will be solidified in S14 in contact with the end of the conductor layer 21d exposed on the side surface 21b1, and there is a risk of a short circuit occurring between the end of the conductor layer 21d and the surface 12b1 via the solder 40. In this regard, in the present embodiment, even if the amount of solder 40 is greater than the expected amount, in S13, the molten solder 40 can be caused to flow out of the first recess 11 from the notch 12c as the non-forming portion. This can prevent a short circuit from occurring between the end of the conductor layer 21d and the surface 12b1 via the solder 40. The Y direction is an example of the third direction.

[0060] As described above, in this embodiment, the protrusion 12 protruding in the Z direction (first direction) from the bottom surface 11a (mounting surface) of the base 10 has a surface 12b1 (first surface) in contact with the laser light source 20 (light emitting device) in the X direction and a surface 12b2 (first surface) in contact with the laser light source 20 in the Y direction. According to this configuration, the laser light source 20 is surface-mounted on the bottom surface 11a (mounting surface) in a state in which the surfaces 12b1 and 12b2 are in contact with each other in different directions, so that the desired positioning accuracy of the laser light source 20 with respect to the base 10 can be achieved more easily or more reliably.

[0061] Furthermore, in this embodiment, the laser light source 20 has a light emitting element 24b and a side surface 21b1 on which a conductor layer 21d (conductor portion) electrically connected to the electrodes 24b1 and 24b2 of the light emitting element 24b is exposed. A part of the side surface 21b1 is in contact with the surface 12b1 of the protruding portion 12B, and the part of the side surface 21b1 on which the conductor layer 21d is exposed is not in contact with the surface 12b1. With this configuration, it is possible to suppress a short circuit between the light emitting element 24b and the base 10 due to contact between the conductor layer 21d and the surface 12b1.

[0062] In this embodiment, the bottom surface 11a is provided with a second recess 11b that accommodates the solder 40. With this configuration, the solder 40 can be held in a position suitable for mounting the laser light source 20 both before and after melting, and thus the laser light source 20 can be prevented from moving from its intended position due to the flow of the melted solder 40 in S13. That is, with this configuration, the desired positioning accuracy of the laser light source 20 with respect to the base 10 can be achieved more easily or more reliably.

[0063] Although the embodiment of the present invention has been illustrated above, the above embodiment is merely an example and is not intended to limit the scope of the invention. The above embodiment can be implemented in various other forms, and various omissions, substitutions, combinations, and modifications can be made without departing from the gist of the invention. In addition, the specifications of each configuration, shape, and the like (structure, type, direction, model, size, length, width, thickness, height, number, arrangement, position, material, etc.) can be appropriately changed and implemented. [Explanation of symbols]

[0064] 10. Bass 11...First recess 11a…Bottom surface (mounting surface) 11b...Second recess 11b1…Bottom surface 12,12A,12B…Protrusion 12a…side 12b1,12b2…Side (first side) 12b3,12b4...plane 12c…notch 20...Laser light source (light emitting device) 21…Case 21A~21C...Materials (layers) 21a...side 21b1,21b2,21b3,21b4…side 21c…plane 21d...conductor layer (conductor portion) 22...Electrode 23...Cover member 23a…Window section 23b…Side (second side) 24…Chip-on-submount 24a…Submount 24b...Light emitting element 24b1,24b2...electrode 25...Bottom member 26...Collimating lens 27…Interior mirror 28…Exterior mirror (mirror) 28a…Reflective surface 29...Joining material 30...Optical fiber (first optical component) 30a...end 40…Solder 100...Light emitting module 101, 101a1~101an, 101b1~101bn...Subunits 102...Collimating lens (second optical component) 103...Mirror (second optical component) 104...Condenser lens (second optical component) 105...Condenser lens (second optical component) 106...Optical fiber holding part 107…Photosynthesis division 107a...Combiner (second optical component) 107b...Mirror (second optical component) 107c...1 / 2 wavelength plate (second optical component) 108...Refrigerant passage A1, A2…Array B1,B2…boundary D1, D2...Arrow (direction) F1,F2…force L: Laser light L1…Length L2…Length R…Containment room X…direction Y…direction (third direction) Z…direction (first direction, second direction)

Claims

1. A light emitting device; a conductive base having a mounting surface facing a first direction and on which the light emitting device is mounted via a bonding material, and at least one protruding portion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface; Equipped with the at least one protrusion has a plurality of first surfaces that contact the light emitting device in different directions intersecting the first direction, The light emitting device includes a light emitting element and a side surface on which a conductor portion electrically connected to an electrode of the light emitting element is exposed, A light-emitting module, wherein a portion of the side surface is in contact with the first surface, and a portion of the side surface where the conductor portion is exposed is not in contact with the first surface.

2. The light emitting module according to claim 1 , wherein the mounting surface is provided with a recess for accommodating the bonding material.

3. the light emitting device has a housing having the side surface and housing the light emitting element, The housing has a plurality of layers stacked in the first direction, The light-emitting module according to claim 1 , wherein the conductor portion exposed on the side surface is an end portion of a conductor layer formed at a boundary between two adjacent layers among the plurality of layers.

4. The housing has a window portion through which light output from the light-emitting element passes in a second direction, the light emitting device has a mirror that reflects the light that is transmitted through the window and travels in the second direction in a direction intersecting the second direction, The light-emitting module according to claim 3 , wherein the mirror is bonded to a second surface of the light-emitting device facing the second direction via a bonding material.

5. The light emitting module according to claim 1 , wherein a length of the first surface in a third direction intersecting the first direction is shorter than a length of the side surface in the third direction.

6. the base has a plurality of mounting surfaces as the mounting surface, The light emitting module includes: A plurality of light emitting devices as the light emitting device; a plurality of second optical components that guide light output from each of the light emitting devices to a first optical component; The light emitting module according to any one of claims 1 to 5, comprising:

7. A light emitting device; a base having a mounting surface facing a first direction and on which the light emitting device is mounted via a bonding material, and at least one protruding portion adjacent to the mounting surface in a direction intersecting the first direction and protruding in the first direction relative to the mounting surface; Equipped with The at least one protrusion has a plurality of first surfaces that contact the light emitting device in different directions intersecting the first direction, a first step of applying a paste-like bonding material or placing a sheet-like bonding material on the mounting surface; a second step of placing the light emitting device on the bonding material and the mounting surface in a state in which the plurality of first surfaces and the light emitting device are in contact with each other after the first step; a third step of heating and melting the bonding material after the second step; a fourth step of mounting the light emitting device on the mounting surface via the bonding material by solidifying the bonding material after the third step; A method for manufacturing a light emitting module comprising:

8. A recess is provided on the mounting surface, The method for manufacturing a light emitting module according to claim 7 , wherein in the first step, a paste-like bonding material is applied or a sheet-like bonding material is placed on the bottom surface of the recess.

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