Multilayer electronic component

Abstract

To provide a method for improving the reliability of a multilayer electronic component by preventing external moisture and plating solution from penetrating into the inside of the body.SOLUTION: A multilayer electronic component includes: a body 110 including a dielectric layer 111, a first internal electrode 121, and a second internal electrode 122; and external electrodes 131, 132 including lower electrode layers 131a, 132a arranged at both ends in a second direction and disposed between an extension line E1 of a first surface and an extension line E2 of a second surface, upper electrode layers 131b, 132b arranged on the lower electrode layers to extend onto the first and second surfaces, and glass layers 131c, 132c arranged between the lower electrode layers and the upper electrode layers. Therein: the lower electrode layers each include a first glass including one or more of Ag, Ba, Zn, and S; and the upper electrode layers each include a second glass including one or more of Cu, Al, and Si.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic component, are chip-type capacitors that are mounted on printed circuit boards of various electronic products, such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and serve to charge and discharge electricity. Multi-layered ceramic capacitors can be used as components of various electronic devices due to their advantages of being small in size, high capacity, and easy to mount.

[0003] A multilayer ceramic capacitor is basically composed of a body and external electrodes that form a capacitance. Recently, there has been a trend to reduce the thickness of the external electrodes of the multilayer ceramic capacitor in order to increase the capacitance per unit volume of the multilayer ceramic capacitor.

[0004] However, as the thickness of the external electrodes decreases, moisture and plating solution from the outside become more likely to penetrate into the body, resulting in a problem of reduced reliability of the multilayer ceramic capacitor. Summary of the Invention [Problem to be solved by the invention]

[0005] One of several objects of the present invention is to prevent moisture and plating solution from the outside from penetrating into the inside of the body and to improve the reliability of the multilayer electronic component.

[0006] However, the scope of the present invention is not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0007] According to an embodiment of the present invention, there is provided a main body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing the third direction, a first lower electrode layer disposed on the third surface and between an extension of the first surface and an extension of the second surface, a first upper electrode layer disposed on the first lower electrode layer and extending onto a portion of the first surface and the second surface, and a second electrode layer disposed between the first lower electrode layer and the first a first external electrode including a first glass layer disposed between an upper electrode layer and the first glass layer, a second lower electrode layer disposed on the fourth surface and disposed between an extension of the first surface and an extension of the second surface, a second upper electrode layer disposed on the second lower electrode layer and disposed extending onto a portion of the first surface and the second surface, and a second external electrode including a second glass layer disposed between the second lower electrode layer and the second upper electrode layer, wherein the first and second lower electrode layers each include Ag and a first glass, and the first and second upper electrode layers each include Cu and a second glass. Effect of the Invention

[0008] One of the various effects of the present invention is that it is possible to prevent moisture and plating solution from the outside from penetrating into the inside of the main body, thereby improving the reliability of the multilayer electronic component. [Brief description of the drawings]

[0009] [Figure 1] 1 is a perspective view showing a schematic configuration of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] FIG. 2 is an exploded perspective view showing a schematic view of the main body of FIG. [Diagram 3] 2 is a cross-sectional view that illustrates a cross section taken along line II' in FIG. 1. [Figure 4]2 is a cross-sectional view that shows a schematic cross section taken along line II-II' in FIG. 1. [Diagram 5] FIG. 4 is an enlarged view of a K1 region in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shape and size of elements in the drawings may be exaggerated for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0011] In order to clearly explain the present invention in the drawings, parts that are not relevant to the explanation are omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited to those shown in the drawings. Components having the same function within the same concept are described using the same reference numerals. Furthermore, throughout the specification, when a part is said to "include" a certain component, this does not mean that other components are excluded, but that the part may further include other components, unless otherwise specified.

[0012] In the drawings, the first direction can be defined as a thickness T direction, the second direction can be defined as a length L direction, and the third direction can be defined as a width W direction.

[0013] Multilayer Electronic Components FIG. 1 is a perspective view that shows a schematic view of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is an exploded perspective view that shows a schematic view of a main body of FIG. 1, FIG. 3 is a cross-sectional view that shows a schematic view of a cut section taken along line I-I' in FIG. 1, FIG. 4 is a cross-sectional view that shows a schematic view of a cut section taken along line II-II' in FIG. 1, and FIG. 5 is an enlarged view of area K1 in FIG. 3.

[0014] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 5. Also, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the present invention is not limited thereto and can be applied to various multilayer electronic components such as inductors, piezoelectric elements, varistors, thermistors, etc.

[0015] A multilayer electronic component 100 according to one embodiment of the present invention includes a body 110 including a dielectric layer 111 and internal electrodes 121 and 122 , and external electrodes 131 and 132 .

[0016] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawing, the body 110 may have a hexahedral shape or a shape similar thereto. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process and grinding of the corners, the body 110 may have a substantially hexahedral shape, although it is not a hexahedral shape with perfect straight lines.

[0017] The main body 110 may have a first surface and a second surface 1, 2 facing in a first direction, a third surface and a fourth surface 3, 4 connected to the first surface and the second surface 1, 2 and facing in the second direction, and a fifth surface and a sixth surface 5, 6 connected to the first surface to the fourth surface 1, 2, 3, 4 and facing in the third direction.

[0018] The main body 110 may include a 1-3 corner C1-3 connecting the first surface 1 and the third surface 3, a 1-4 corner C1-4 connecting the first surface 1 and the fourth surface 4, a 2-3 corner C2-3 connecting the second surface 2 and the third surface 3, and a 2-4 corner C2-4 connecting the second surface 2 and the fourth surface 4. In addition, the main body 110 may include a 1-5 corner connecting the first surface 1 and the fifth surface 5, a 1-6 corner connecting the first surface 1 and the sixth surface 6, a 2-5 corner connecting the second surface 2 and the fifth surface 5, and a 2-6 corner connecting the second surface 2 and the sixth surface 6. The corners may have a rounded shape by performing a separate process to round the corners connecting the surfaces of the main body 110. The first to sixth faces 1, 2, 3, 4, 5, 6 of the main body 110 may be generally flat surfaces, and the non-flat areas may be considered as corners.

[0019] The body 110 may include a dielectric layer 111 and first and second internal electrodes 121, 122 alternately disposed with the dielectric layer 111 sandwiched therebetween. The plurality of dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 may be integrated to such an extent that they are difficult to see without using a scanning electron microscope (SEM).

[0020] The dielectric layer 111 can be formed by preparing a ceramic slurry containing a ceramic powder, an organic solvent, and a binder, applying the slurry onto a carrier film, drying the slurry to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as a sufficient electrostatic capacity can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, or a strontium titanate-based material can be used. Examples of the ceramic particles include BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. (BaTiO3). 1-x Ca x )TiO3(0 <x<1)、Ba(Ti 1-y Ca y )O3(0 <y<1)、(Ba1-x Ca x )(Ti 1-y Zr y )O3(0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O3(0 < y < 1), etc. can be mentioned.

[0021] The internal electrodes 121 and 122 can be alternately arranged with the dielectric layer 111, for example, in the first direction. The first internal electrode 121 is separated from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 is separated from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4 side.

[0022] The conductive metal contained in the internal electrodes 121 and 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably may contain Ni, but the present invention is not limited thereto.

[0023] The internal electrodes 121 and 122 can be formed by applying a conductive paste for internal electrodes containing a conductive metal with a predetermined thickness on the above ceramic green sheet and firing it. As the printing method of the conductive paste for internal electrodes, a screen printing method or a gravure printing method, etc. can be used, but the present invention is not limited thereto.

[0024] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 do not need to be particularly limited. The average thickness td of the dielectric layer 111 may be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 may be, for example, 0.1 μm to 3.0 μm. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to the desired characteristics and applications. For example, in the case of a high-voltage electric equipment electronic component to achieve miniaturization and high capacity, the average thickness td of the dielectric layer 111 may be less than 2.8 μm, and the average thickness te of the internal electrodes 121 and 122 may be less than 1 μm. In the case of a small IT electronic component to achieve miniaturization and high capacity, the average thickness td of the dielectric layer 111 may be 0.4 μm or less, and the average thickness te of the internal electrodes 121 and 122 may be 0.4 μm or less.

[0025] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 refer to the sizes of the dielectric layer 111 and the internal electrodes 121, 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 can be measured by scanning the cross sections of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thickness at a number of points, for example, 30 points equally spaced in the second direction, of one dielectric layer 111, and then averaging the thicknesses. In addition, the average thickness te of the internal electrodes 121, 122 can be measured by measuring the thickness at a number of points, for example, 30 points equally spaced in the second direction, of one internal electrode 121, 122, and then averaging the thicknesses. The 30 equally spaced points can be designated by the capacitance forming portion Ac. Meanwhile, by measuring such average values ​​for 10 dielectric layers 111 and 10 internal electrodes 121, 122, respectively, and then measuring the average values, the average thickness td of the dielectric layers 111 and the average thickness te of the internal electrodes 121, 122 can be further generalized.

[0026] The body 110 may include a capacitance forming part Ac that is disposed inside the body 110 and includes first and second internal electrodes 121, 122 that are alternately disposed with a dielectric layer 111 therebetween to form a capacitance, and a first cover part 112 and a second cover part 113 that are disposed on both sides of the capacitance forming part Ac facing each other in a first direction. The cover parts 112, 113 may basically serve to prevent damage to the internal electrodes due to physical or chemical stress. The cover parts 112, 113 may have the same configuration as the dielectric layer 111, except that they do not include internal electrodes.

[0027] The average thickness tc of the cover parts 112, 113 does not need to be particularly limited. That is, the average thickness tc of the cover parts 112, 113 can be set arbitrarily according to the desired characteristics and applications. For example, in order to reduce the size and increase the capacity of the multilayer electronic component, the average thickness tc of the cover parts 112, 113 may be 300 μm or less, 100 μm or less, 30 μm or less, or 20 μm or less, but the present invention is not limited thereto. Here, the average thickness tc of the cover parts 112, 113 means the average thickness of each of the first cover part 112 and the second cover part 113.

[0028] The average thickness tc of the cover parts 112, 113 may mean the average size of the cover parts 112, 113 in the first direction, and may be the average value of the size in the first direction measured at five equally spaced points on the cross sections of the body 110 in the first and second directions.

[0029] The body 110 may include a first margin portion 114 and a second margin portion 115 disposed on both sides of the capacitance forming portion Ac facing the third direction. That is, the margin portions 114 and 115 may refer to regions between both ends of the internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross section obtained by cutting the body 110 in the first and third directions.

[0030] The margin portions 114, 115 may include the same material as the dielectric layer 111, except that they do not include the internal electrodes 121, 122. The margin portions 114, 115 may essentially serve to prevent damage to the internal electrodes 121, 122 due to physical or chemical stress.

[0031] The margin portions 114, 115 may be formed by applying a conductive paste for internal electrodes to the ceramic green sheets and firing the sheets, except for the portions where the margin portions are to be formed. Alternatively, in order to suppress steps due to the internal electrodes 121, 122, the internal electrodes 121, 122 after lamination are cut so as to be exposed on the fifth and sixth faces 5, 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac facing the third direction, thereby forming the margin portions 114, 115.

[0032] The average thickness tm of the margin portions 114, 115 does not need to be particularly limited. The average thickness tm of the margin portions 114, 115 can be set arbitrarily according to the desired characteristics and applications. For example, in order to reduce the size and increase the capacity of the multilayer electronic component, the average thickness tm of the margin portions 114, 115 may be 100 μm or less, 20 μm or less, or 15 μm or less, but the present invention is not limited thereto. Here, the average thickness tm of the margin portions 114, 115 means the average thickness of each of the first margin portion 114 and the second margin portion 115.

[0033] The average thickness tm of the margin portions 114, 115 may mean the average size in the third direction of the margin portions 114, 115, and may be the average value of the sizes in the third direction measured at five equally spaced points in the cross sections of the body 110 in the first and third directions.

[0034] The external electrodes 131, 132 may be disposed on the third and fourth surfaces 3, 4 of the body 110, and may extend onto parts of the first, second, fifth and sixth surfaces 1, 2, 5, 6. Of the external electrodes 131, 132, the areas disposed on the third and fourth surfaces 3, 4 may be defined as connection portions, and the areas disposed on the first, second, fifth and sixth surfaces 1, 2, 5, 6 may be defined as band portions.

[0035] The external electrodes 131, 132 may include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122. A region of the first external electrode 131 disposed on the third surface 3 may be defined as a first connection portion, and a region of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6 may be defined as a first band portion. A region of the second external electrode 132 disposed on the fourth surface 4 may be defined as a second connection portion, and a region of the first surface, the second surface, the fifth surface, and the sixth surface 1, 2, 5, and 6 may be defined as a second band portion.

[0036] The first external electrode 131 may include a first lower electrode layer 131a arranged on the third surface 3 and between an extension line E1 of the first surface and an extension line E2 of the second surface, a first upper electrode layer 131b arranged on the first lower electrode layer 131a and extending onto portions of the first and second surfaces 1 and 2, a first glass layer 131c arranged between the first lower electrode layer 131a and the first upper electrode layer 131b, and a first plating layer 131d arranged on the first upper electrode layer 131b.

[0037] The second external electrode 132 may include a second lower electrode layer 132a arranged on the fourth surface 4 and between the extension line E1 of the first surface and the extension line E2 of the second surface, a second upper electrode layer 132b arranged on the second lower electrode layer 132a and extending onto portions of the first surface and the second surfaces 1, 2, a second glass layer 132c arranged between the second lower electrode layer 132a and the second upper electrode layer 132b, and a second plating layer 132d arranged on the second upper electrode layer 132b.

[0038] The first lower electrode layer 131a may essentially be in contact with the third surface 3 and serve to connect the first internal electrode 121 and the first external electrode 131, and the second lower electrode layer 132a may essentially be in contact with the fourth surface 4 and serve to connect the second internal electrode 122 and the second external electrode 132.

[0039] The first and second lower electrode layers 131a and 132a may include a first metal and a first glass, respectively. The first metal included in the first and second lower electrode layers 131a and 132a may include Ag. More specifically, the first metal may include Ag as a main component. Here, the first metal including Ag as a main component may mean that the ratio of the number of moles of Ag to the total number of moles of metal elements constituting the first metal is 70% or more.

[0040] Ag is a low-melting point metal with low reactivity. The lower electrode layers 131a and 132a in contact with the third and fourth surfaces 3 and 4 of the main body 110 contain Ag, and thus can prevent moisture and plating solution from the outside from penetrating into the inside of the main body 110.

[0041] Meanwhile, the first lower electrode layer 131a is disposed between the extension line E1 of the first surface and the extension line E2 of the second surface, and the second lower electrode layer 132a is disposed between the extension line E1 of the first surface and the extension line E2 of the second surface, thereby reducing the size of the multilayer electronic component 100 in the first direction and improving the capacitance per unit volume. Here, the extension line of each surface may mean a line extended based on a flat portion of each surface. That is, the first lower electrode layer 131a does not have to be extended to the first band portion side, and the second lower electrode layer 132 does not have to be extended to the second band portion side.

[0042] In one embodiment, the ends of the first lower electrode layer 131a may be disposed on the 1-3 corner C1-3 and the 2-3 corner C2-3, and the ends of the second lower electrode layer 132a may be disposed on the 1-4 corner C1-4 and the 2-4 corner C2-4. Moisture and / or plating solution from the outside tend to penetrate into the inside of the body 110 through the corners of the body 110 where the distance to the internal electrodes 121 and 122 is short. At this time, by disposing the ends of the first and second lower electrode layers 131a and 132a containing Ag having low reactivity on the corners of the body 110, it is possible to more effectively prevent moisture and plating solution from the outside from penetrating into the inside of the body 110.

[0043] The method for forming the first and second lower electrode layers 131a, 132a does not need to be particularly limited, but the first and second lower electrode layers 131a, 132a can be formed, for example, by transferring a conductive sheet containing a first metal powder containing Ag, a first glass, a binder, an organic solvent, etc. onto the third and fourth surfaces 3, 4, and then firing the same.

[0044] The first upper electrode layer 131b is disposed on the first lower electrode layer 131a and may be extended onto parts of the first and second surfaces 1 and 2. The first upper electrode layer 131b may also be extended onto parts of the fifth and sixth surfaces 5 and 6. The second upper electrode layer 132b is disposed on the second lower electrode layer 132a and may be extended onto parts of the first and second surfaces 1 and 2. The second upper electrode layer 132b may also be extended onto parts of the fifth and sixth surfaces 5 and 6. The first and second upper electrode layers 131b and 132b are basically extended toward the band portion side, and may thus play a role in connecting the external electrodes 131 and 132 to a substrate on which the multilayer electronic component 100 is mounted.

[0045] The first and second upper electrode layers 131b and 132b may include a second metal and a second glass, respectively. The second metal included in the first and second upper electrode layers 131b and 132b may include Cu. More specifically, the second metal may include Cu as a main component. Here, the second metal including Cu as a main component may mean that the ratio of the number of moles of Cu to the total number of moles of metal elements constituting the second metal is 70% or more.

[0046] Cu has excellent wettability with respect to metal plating layers, and therefore, when the first and second upper electrode layers 131b and 132b contain Cu, it is possible to improve the plating properties with respect to plating layers 131d and 132d, which will be described later.

[0047] The method for forming the first and second upper electrode layers 131b, 132b is not particularly limited, but the first and second upper electrode layers 131b, 132b may be formed, for example, by dipping the body 110 on which the first and second lower electrode layers 131a, 132a are formed into a conductive paste including a second metal powder containing Cu, a second glass, a binder, an organic solvent, etc., and then firing the same.

[0048] The first glass layer 131c may be formed at the interface between the first lower electrode layer 131a and the first upper electrode layer 131b, and the second glass layer 132c may be formed at the interface between the second lower electrode layer 132a and the second upper electrode layer 132b. The glass layers 131c and 132c may serve to prevent moisture or a plating solution from the outside from penetrating into the body 110 at the interfaces between the lower electrode layers 131a and 132a and the upper electrode layers 131b and 132b.

[0049] The glass layers 131c, 132c may be formed only at the interface between the lower electrode layers 131a, 132a and the upper electrode layers 131b, 132b, and therefore the glass layers 131c, 132c do not have to extend onto the first, second, fifth and sixth surfaces 1, 2, 5, 6, but the present invention is not limited to this.

[0050] The glass layers 131c and 132c may contain the same components as the first glass and / or the second glass components. The glass layers 131c and 132c may contain, for example, one or more of Ba, Zn, Al, Si, and B.

[0051] The glass layers 131c, 132c can be formed by the second glass migrating to the interface between the lower electrode layers 131a, 132a and the upper electrode layers 131b, 132b during the process of applying and firing a conductive paste for forming the upper electrode layers 131b, 132b.

[0052] The plating layers 131d and 132d can improve mounting characteristics. The type of the plating layers 131d and 132d is not particularly limited, and may be a plating layer containing Ni, Sn, Pd and / or an alloy containing these, or may be formed of multiple layers. The plating layers 131d and 132d may be, for example, a Ni plating layer or a Sn plating layer, and may be in a form in which a Ni plating layer and a Sn plating layer are formed in sequence. The plating layers 131d and 132d may also include multiple Ni plating layers and / or multiple Sn plating layers. The method of forming the plating layers 131d and 132d does not need to be particularly limited, and they can be formed using an electrolytic plating method and / or an electroless plating method.

[0053] In the drawings, the multilayer electronic component 100 is shown to have a structure having two external electrodes 131, 132, but this is not limited to this, and the number and shape of the external electrodes 131, 132 can be changed depending on the shape of the internal electrodes 121, 122 and other purposes.

[0054] Hereinafter, the first external electrode 131 of the multilayer electronic component 100 according to an embodiment of the present invention will be described in more detail with reference to Fig. 5. However, the first external electrode 131 and the second external electrode 132 have a similar configuration except that the first external electrode 131 is connected to the first internal electrode 121 and the second external electrode 132 is connected to the second internal electrode 122. Therefore, the following description of the first external electrode 131 shall be deemed to include a description of the second external electrode 132.

[0055] In one embodiment, the first glass G1 included in the first lower electrode layer 131a may include one or more of Ba, Zn, and Si, and the second glass G2 included in the first upper electrode layer 131c may include one or more of Al and Si. The first glass G1 may be, for example, borosilicate glass including one or more of BaO and ZnO, and the second glass G2 may be, for example, aluminosilicate glass.

[0056] Ba and / or Zn contained in the first glass G1 can lower the softening temperature of the first glass G1 and sufficiently fill the voids in the first lower electrode layer 131a. That is, the first glass G1 can improve the sealing property of the first lower electrode layer 131a covering the third surface 3 of the body 110 where the first internal electrode 121 is exposed, and can prevent the penetration of moisture or plating solution from the outside.

[0057] On the other hand, it is important to ensure sealing properties in the first lower electrode layer 131a disposed on the inner side of the first upper electrode layer 131b. Therefore, in one embodiment, the total number of moles of Ba and Zn relative to the total number of moles of the remaining elements excluding oxygen among the elements constituting the first glass G1 may be greater than the total number of moles of Ba and Zn relative to the total number of moles of the remaining elements excluding oxygen among the elements constituting the second glass G2.

[0058] Meanwhile, since the first upper electrode layer 131b is disposed in contact with the first plating layer 131d, the corrosion resistance characteristic may be more important for the second glass G2 included in the first upper electrode layer 131b than for the first glass G1 included in the first lower electrode layer 131a. The second glass G2 contains Al and / or Si, which have excellent corrosion resistance, and thus can prevent the second glass G2 from being corroded by a plating solution and the resulting penetration of the plating solution.

[0059] Since it is important to ensure corrosion resistance in the first upper electrode layer 131b arranged outside the first lower electrode layer 131a, in one embodiment, the number of moles of Al relative to the total number of moles of the remaining elements excluding oxygen among the elements constituting the second glass G2 may be greater than the number of moles of Al relative to the total number of moles of the remaining elements excluding oxygen among the elements constituting the first glass G1.

[0060] The number of moles of each component constituting the first glass G1 and the number of moles of each component constituting the second glass G2 can be measured, for example, by obtaining images by scanning the cross sections in the first and second directions passing through the center of the third direction of the main body 110 with a scanning electron microscope (SEM), and then measuring the number of moles of each component constituting the first glass G1 and the number of moles of each component constituting the second glass G2 by energy dispersive spectroscopy (EDS) for the region in the image where the first glass G1 is disposed and the region in the image where the second glass G2 is disposed.

[0061] In one embodiment, the first glass layer 131c has a discontinuous region D, and the first lower electrode layer 131a and the first upper electrode layer 131b may be in contact with each other in at least a portion of the discontinuous region D. More specifically, the first metal M1 and the second metal M2 may be in contact with each other in at least a portion of the discontinuous region D.

[0062] As a result, an alloy containing Ag and Cu may be disposed in at least a portion of the discontinuous region D. Such an alloy may be formed by a reaction between a first metal M1 of the first lower electrode layer 131a and a second metal M2 of the first upper electrode layer 132a. The alloy formed by the reaction between the first metal M1 and the second metal M2 may suppress the penetration of moisture from the outside.

[0063] On one hand, for thinning of the first external electrode 131, the thickness of the first base electrode layer 131a is preferably thin and constant. In one embodiment, when the thickness of the central region of the first lower electrode layer 131a in the first direction in the cross-section of the multilayer electronic component 100 in the first direction and the second direction is t1, and the thickness of the central region of the first upper electrode layer 131b in the first direction is t2, the above t1 and t2 can satisfy t1 < t2. Here, the thickness of the first lower electrode layer 131a means the size of the first lower electrode layer 131a in the second direction, and the thickness of the first upper electrode layer 131b means the size of the first upper electrode layer 131b in the second direction.

[0064] The method of making the thickness of the first lower electrode layer 131a thinner and constant than that of the first upper electrode layer 131b is not particularly limited. However, since the first lower electrode layer 131a is formed by baking after transferring a conductive sheet to the main body 110, and the first upper electrode layer 131b is formed by baking after dipping the main body 110 in a conductive paste, t1 < t2 can be satisfied.

[0065] Although the above t1 is not particularly limited, it may be 5 μm or more and 7 μm or less. If the above t1 is less than 5 μm, the effect of improving the moisture resistance reliability of the present invention may be slight. On the other hand, if the above t1 exceeds 7 μm, it may be disadvantageous for thinning of the first external electrode 131.

[0066] On one hand, the thickness of the first glass layer 131c is not particularly limited. However, in one embodiment, the thickness t3 of the central region of the first glass layer 131c in the first direction may be 1 μm or more and 3 μm or less. If the above t3 is less than 1 μm, the effect of improving the moisture resistance reliability of the present invention may be slight. Also, if the above t3 exceeds 3 μm, there may be a side effect that the ESR of the multilayer electronic component 100 increases.

[0067] The above t1, t2, and t3 can be measured, for example, with an image obtained by scanning a cross-section of the multilayer electronic component 100 in the first direction and the second direction passing through the center in the third direction of the main body 110 with a scanning electron microscope (SEM).

[0068] The present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications and changes can be made by a person having ordinary knowledge in the art without departing from the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0069] In addition, the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and describe unique features that are different from each other. However, the above-mentioned one embodiment does not exclude being realized in combination with features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0070] Furthermore, expressions such as "first, second" are used to distinguish one component from another, and do not limit the order and / or importance of the components. In some cases, the first component may be named the second component, and similarly the second component may be named the first component, within the scope of the rights. [Explanation of symbols]

[0071] 100: Multilayer electronic components 110: Main unit 112, 113: Cover part 114, 115: Margin 121, 122: Internal electrode 131, 132: External electrode 131a, 132a: Lower electrode layer 131b, 132b: Upper electrode layer 131c, 132c: Glass layer 131d, 132d: plating layer M1, M2: Metal G1, G2: Glass

Claims

1. a body including a dielectric layer and first and second internal electrodes alternately disposed with the dielectric layer therebetween, the body including a first surface and a second surface facing a first direction, a third surface and a fourth surface connected to the first surface and the second surface facing the second direction, and a fifth surface and a sixth surface connected to the first surface, the second surface and the fifth surface facing the third direction; a first external electrode including a first lower electrode layer disposed on the third surface and between an extension of the first surface and an extension of the second surface, a first upper electrode layer disposed on the first lower electrode layer and extending onto a portion of the first surface and the second surface, and a first glass layer disposed between the first lower electrode layer and the first upper electrode layer; a second external electrode including a second lower electrode layer disposed on the fourth surface and between an extension of the first surface and an extension of the second surface, a second upper electrode layer disposed on the second lower electrode layer and extending onto a portion of the first surface and the second surface, and a second glass layer disposed between the second lower electrode layer and the second upper electrode layer, the first and second lower electrode layers each include Ag and a first glass; The first and second upper electrode layers each include Cu and a second glass.

2. The first glass includes at least one of Ba, Zn, and Si, The multilayer electronic component according to claim 1 , wherein the second glass contains at least one of Al and Si.

3. 3. The multilayer electronic component according to claim 2, wherein a mole number of Al relative to a total mole number of remaining elements excluding oxygen among the elements constituting the second glass is larger than a mole number of Al relative to a total mole number of remaining elements excluding oxygen among the elements constituting the first glass.

4. 3. The multilayer electronic component according to claim 2, wherein a total number of moles of Ba and Zn relative to a total number of moles of remaining elements excluding oxygen among the elements constituting the first glass is greater than a total number of moles of Ba and Zn relative to a total number of moles of remaining elements excluding oxygen among the elements constituting the second glass.

5. the first glass layer having discontinuous regions; 2. The multilayer electronic component according to claim 1, wherein the first lower electrode layer and the first upper electrode layer are in contact with each other in at least a portion of the discontinuous region.

6. the first glass layer having discontinuous regions; The multilayer electronic component according to claim 1 , wherein an alloy containing Ag and Cu is disposed in at least a portion of the discontinuous regions.

7. the main body includes a first-third corner connecting the first surface and the third surface, a first-fourth corner connecting the first surface and the fourth surface, a second-third corner connecting the second surface and the third surface, and a second-fourth corner connecting the second surface and the fourth surface; 2. The multilayer electronic component according to claim 1, wherein ends of the first lower electrode layer are disposed on the first-3 corner and the second-3 corner, and ends of the second lower electrode layer are disposed on the first-4 corner and the second-4 corner.

8. In cross sections of the multilayer electronic component in a first direction and a second direction, When a thickness of the first lower electrode layer in the central region in the first direction is t1 and a thickness of the first upper electrode layer in the central region in the first direction is t2, The multilayer electronic component according to claim 1 , wherein t1 and t2 satisfy t1<t2.

9. 9. The multilayer electronic component according to claim 8, wherein t1 is equal to or greater than 5 μm and equal to or less than 7 μm.

10. the first external electrode further includes a first plating layer disposed on the first upper electrode layer, The multilayer electronic component according to claim 1 , wherein the second external electrode further includes a second plating layer disposed on the second upper electrode layer.

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