Semiconductor manufacturing apparatus and manufacturing method of semiconductor device

Abstract

To provide a technique capable of reducing the number of switching steps of solder molding tools when producing a wide variety of semiconductor devices.SOLUTION: A semiconductor manufacturing apparatus comprises: a solder wire supply unit 2 for supplying a solder wire 1 onto a heated base material 3; a solder molding unit 5 including a solder molding tool 6 for molding a fused solder 1a in contact with the solder 1a which is fused by bringing the solder wire 1 into contact with the base material 3; a first drive mechanism 10 for driving the solder wire supply unit 2 movably in a horizontal direction and a vertical direction; a second drive mechanism 20 for driving the solder molding unit 5 movably in the horizontal direction and the vertical direction; and a control section 30 for controlling the first drive mechanism 10 and the second drive mechanism 20. The control section 30 controls the second drive mechanism 20 in such a manner that the solder molding tool 6 is brought into contact with the fused solder 1a and then the solder molding unit 5 is moved in the horizontal direction in such state.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a semiconductor manufacturing apparatus and a method for manufacturing a semiconductor device. [Background technology]

[0002] In the manufacture of semiconductor devices, a bonding material is applied to a base material such as a substrate or a lead frame, and a semiconductor chip is mounted on the bonding material to produce a product. When solder wire is used as the bonding material, the solder wire is melted by contacting it with a heated base material, and the semiconductor chip is mounted on the solder wire.

[0003] In addition, in order to mold the molten solder into a desired shape, there is a method in which a solder molding tool designed to a specified shape is pressed against the upper surface of the molten solder to stir it. One example of this method is described in Patent Document 1. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2013-207246 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, the method described in Patent Document 1 requires switching the solder forming tool for each size of the semiconductor chip, which means that when manufacturing semiconductor devices including semiconductor chips of multiple sizes, the solder forming tool needs to be switched, making the method unsuitable for multi-product production.

[0006] Therefore, an object of the present disclosure is to provide a technique capable of reducing the number of steps required for switching between solder forming tools when producing a wide variety of semiconductor devices. [Means for solving the problem]

[0007] The semiconductor manufacturing apparatus of the present disclosure includes a solder wire supply unit having a nozzle that supplies solder wire onto a heated base material, a solder shaping unit having a solder shaping tool that brings the solder wire into contact with the base material and melts the solder to shape the molten solder, a first drive mechanism that drives the solder wire supply unit so as to move it in horizontal and vertical directions, a second drive mechanism that drives the solder shaping unit so as to move it in the horizontal and vertical directions, and a control unit that controls the first drive mechanism and the second drive mechanism, wherein the control unit controls the second drive mechanism to bring the solder shaping tool into contact with the molten solder and then move the solder shaping unit in the horizontal direction in this state. Effect of the Invention

[0008] According to the present disclosure, since it is possible to form solder of a plurality of sizes using one type of solder forming tool, it is possible to reduce the number of steps required for switching between solder forming tools when producing a wide variety of semiconductor devices. [Brief description of the drawings]

[0009] [Figure 1] FIG. 2 is a front view of a portion of a semiconductor manufacturing apparatus for illustrating a process of melting a solder wire in an embodiment. [Diagram 2] FIG. 2 is a front view of a portion of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in an embodiment. [Diagram 3] 2 is a perspective view showing a drive mechanism included in the semiconductor manufacturing apparatus according to the embodiment; FIG. [Figure 4] FIG. 2 is a top view of a portion of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in an embodiment. [Diagram 5] FIG. 2 is a top view of a portion of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in an embodiment. [Figure 6]FIG. 11 is a front view of a part of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in a first modified example of the embodiment. [Figure 7] FIG. 11 is a top view of a portion of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in a second modification of the embodiment. [Figure 8] FIG. 13 is a top view of a portion of a semiconductor manufacturing apparatus for illustrating a process of shaping molten solder in a third modified example of the embodiment. [Figure 9] FIG. 13 is a front view of a semiconductor manufacturing apparatus for illustrating a step of shaping molten solder in a fourth modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] <Embodiment> The following describes an embodiment with reference to the drawings. Fig. 1 is a front view of a part of a semiconductor manufacturing apparatus for explaining a process of melting a solder wire 1 in the embodiment. Fig. 2 is a front view of a part of a semiconductor manufacturing apparatus for explaining a process of shaping a molten solder 1a in the embodiment.

[0011] In FIG. 1, the X direction, the Y direction, and the Z direction are mutually orthogonal. The X direction, the Y direction, and the Z direction shown in the following figures are also mutually orthogonal. In the following, the direction including the X direction and the -X direction opposite to the X direction is also referred to as the "X-axis direction". In the following, the direction including the Y direction and the -Y direction opposite to the Y direction is also referred to as the "Y-axis direction". In the following, the direction including the Z direction and the -Z direction opposite to the Z direction is also referred to as the "Z-axis direction".

[0012] Fig. 1 shows a configuration for performing a process of melting solder wire 1, which is one part of the process performed by the semiconductor manufacturing equipment. Fig. 2 shows a configuration for performing a process of shaping molten solder 1a, which is the remaining part of the process performed by the semiconductor manufacturing equipment. Therefore, the overall configuration of the semiconductor manufacturing equipment is a combination of the configuration shown in Fig. 1 and the configuration shown in Fig. 2.

[0013] As shown in FIGS. 1 and 2, the semiconductor manufacturing apparatus includes a solder wire supply unit 2, a solder forming unit 5, a first driving mechanism 10, a second driving mechanism 20, and a control unit 30.

[0014] First, a description will be given of the configuration shown in Fig. 1. As shown in Fig. 1, the solder wire supply unit 2 includes a nozzle 2b and a drive unit 2a.

[0015] The nozzle 2b supplies the solder wire 1 onto the base material 3 arranged on the upper surface of the heater 4. The base material 3 is a substrate or a lead frame that is a part of a component constituting a semiconductor device. The driving unit 2a includes, for example, a spool (not shown) around which the solder wire 1 is wound, a roller (not shown), and a motor (not shown), and the roller is rotated by driving the motor to pay out the solder wire 1 from the nozzle 2b. When the solder wire 1 paid out from the nozzle 2b comes into contact with the base material 3 heated by the heater 4, the solder wire 1 melts and molten solder 1a is formed.

[0016] The first drive mechanism 10 is connected to the drive section 2a of the solder wire supply unit 2, and drives the solder wire supply unit 2 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction).

[0017] Next, a description will be given of the configuration shown in Fig. 2. As shown in Fig. 2, the solder molding unit 5 includes a solder molding tool 6, an attachment section 5a, a heater 5b, and a drive section 5c.

[0018] The solder shaping tool 6 has a rectangular shape in top view, extending vertically (Z-axis direction), and is attached to the lower end (-Z direction end) of the attachment part 5a. The tip side (-Z direction) of the solder shaping tool 6 is brought into contact with the molten solder 1a to shape the molten solder 1a. The heater 5b is provided on the attachment part 5a, and heats the solder shaping tool 6 via the attachment part 5a. The drive part 5c includes a motor (not shown) and the like, and adjusts the amount of protrusion of the solder shaping tool 6 from the attachment part 5a, as well as activating and stopping the heater 5b.

[0019] The second driving mechanism 20 is connected to the driving section 5c of the solder molding unit 5, and drives the solder molding unit 5 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction).

[0020] The control unit 30 includes a processor (not shown) such as a CPU (Central Processing Unit). The control unit 30 controls the first drive mechanism 10 and the second drive mechanism 20 based on a control program stored in its own memory, which is related to the process of melting the solder wire 1 and the process of shaping the molten solder 1a. A plurality of control programs are prepared according to the product, and the operator selects a control program to move the solder wire supply unit 2 and the solder shaping unit 5 to the predetermined positions.

[0021] The control unit 30 also controls the drive unit 2a of the solder wire supply unit 2 and the drive unit 5c of the solder forming unit 5 based on a control program related to the process of melting the solder wire 1 and the process of forming the molten solder 1a.

[0022] Next, the first drive mechanism 10 will be described. Fig. 3 is a perspective view showing a drive mechanism provided in the semiconductor manufacturing apparatus according to the embodiment. Since the first drive mechanism 10 and the second drive mechanism 20 have the same configuration, only the first drive mechanism 10 will be described here.

[0023] 3, the first drive mechanism 10 is a linear motion mechanism including a ball screw 10a to which the drive unit 2a of the solder wire supply unit 2 is attached, a linear guide 10b, and a motor 10c. The linear motion mechanism is a well-known technique, so a detailed description will be omitted. Note that the linear motion mechanism may include an actuator and a timing belt instead of the above configuration.

[0024] Next, the process of melting the solder wire 1 and the process of shaping the molten solder 1a will be described.

[0025] 1, the control unit 30 moves the solder wire supplying unit 2 downward (in the -Z direction) to bring the solder wire 1 supplied from the nozzle 2b of the solder wire supplying unit 2 into contact with the base material 3 heated by the heater 4. As a result, the solder wire 1 melts, and a hemispherical molten solder 1a is formed.

[0026] Next, as shown in Fig. 2, the control unit 30 moves the solder forming unit 5 in the horizontal direction (X direction) to bring the solder forming tool 6 of the solder forming unit 5 into contact with the molten solder 1a, and then moves the solder forming unit 5 in the horizontal direction (X direction) while the solder forming tool 6 is in contact with the molten solder 1a. As a result, the molten solder 1a is formed into a plate shape. In Fig. 2, the symbol 1b indicates the formed solder.

[0027] Next, a method for adjusting the molten solder 1a to a size corresponding to a plurality of sizes of semiconductor chips will be described with reference to Figs. 4 and 5. Figs. 4 and 5 are top views of a part of a semiconductor manufacturing apparatus for explaining a process for forming the molten solder 1a in the embodiment. Specifically, Fig. 4 is a view showing a case where the solder forming unit 5 is moved in the X direction, and Fig. 5 is a view showing a case where the solder forming unit 5 is moved in the Y direction. Note that Figs. 4 and 5 show the lower side (-Z direction) from the solder forming tool 6.

[0028] When manufacturing a semiconductor device having semiconductor chips of multiple sizes, it is necessary to make the molten solder 1a into a size corresponding to the semiconductor chips of multiple sizes. By adjusting the size, the movement start point, and the amount of movement in the horizontal direction (X-axis direction and Y-axis direction) of the solder forming tool 6, it is possible to form the molten solder 1a into a size corresponding to the semiconductor chips of multiple sizes. For example, when the size A shown in FIG. 4 is taken as the standard, as in the case of size B, by adjusting the amount of movement in the X direction of the solder forming tool 6 to be larger than that in the case of size A, it is possible to adjust the size of the molten solder 1a in the X direction. Also, as in the case of size C shown in FIG. 5, by changing the movement start point of the solder forming tool 6 of size A and adjusting the amount of movement in the Y direction, it is possible to adjust the size of the molten solder 1a in the Y direction.

[0029] 4 and 5 show an example in which the solder forming tool 6 is moved in both the X and Y directions, so the size of the solder forming tool 6 must be determined taking into account both the X and Y directions. This makes the solder forming tool 6 thicker, but if the solder forming tool 6 is moved in only one of the X or Y directions, the thickness of the solder forming tool 6 can be made thinner.

[0030] Although not shown, by adjusting the clearance between the solder forming tool 6 and the base material 3, it is possible to adjust the thickness of the molten solder 1a.

[0031] As described above, the semiconductor manufacturing apparatus according to the embodiment includes the solder wire supply unit 2 having the nozzle 2b for supplying the solder wire 1 onto the heated base material 3, the solder forming unit 5 having the solder forming tool 6 for contacting the base material 3 with the solder wire 1 to form the molten solder 1a, the first drive mechanism 10 for driving the solder wire supply unit 2 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction), the second drive mechanism 20 for driving the solder forming unit 5 so as to be movable in the horizontal direction (X-axis direction and Y-axis direction) and the vertical direction (Z-axis direction), and the control unit 30 for controlling the first drive mechanism 10 and the second drive mechanism 20. The control unit 30 controls the second drive mechanism 20 to move the solder forming unit 5 in the horizontal direction after bringing the solder forming tool 6 into contact with the molten solder 1a.

[0032] Therefore, since solder of a plurality of sizes can be formed using one type of solder forming tool 6, the number of steps required for switching between solder forming tools 6 can be reduced when producing a wide variety of semiconductor devices.

[0033] <Modifications of the embodiment> Next, modified examples of the embodiment will be described. FIG. 6 is a front view of a part of a semiconductor manufacturing apparatus for explaining the process of forming the molten solder 1a in a first modified example of the embodiment. FIG. 7 is a top view of a part of a semiconductor manufacturing apparatus for explaining the process of forming the molten solder 1a in a second modified example of the embodiment. FIG. 8 is a top view of a part of a semiconductor manufacturing apparatus for explaining the process of forming the molten solder 1a in a third modified example of the embodiment. FIG. 9 is a front view of a semiconductor manufacturing apparatus for explaining the process of forming the molten solder 1a in a fourth modified example of the embodiment. Note that FIGS. 7 and 8 show the lower side (-Z direction) from the solder forming tool 8.

[0034] 6, the solder forming unit 5 may have a solder forming tool 7 instead of the solder forming tool 6. The portion of the solder forming tool 7 that comes into contact with the molten solder 1a is formed in a tapered shape. More specifically, the entire portion of the solder forming tool 7 in the X direction is formed in a tapered shape. This can promote the flow of the molten solder 1a, allowing for more stable forming of the molten solder 1a.

[0035] 7, the solder forming unit 5 may have a solder forming tool 8 instead of the solder forming tool 6. A notch 8a is provided in a portion of the solder forming tool 8 that comes into contact with the molten solder 1a. More specifically, two notches 8a are provided along the Y-axis direction in a portion of the solder forming tool 8 in the X-direction. This allows the flow paths of the molten solder 1a to be dispersed, making it possible to form the molten solder 1a into a greater variety of shapes.

[0036] 8, a protrusion 9 may be provided on the outer periphery of the portion of the solder forming tool 8 that comes into contact with the molten solder 1a. More specifically, two protrusions 9 are provided so as to protrude in the X direction from both outer peripheries of the X direction portion of the solder forming tool 8. This makes it possible to suppress the molten solder 1a from spilling out from the solder forming tool 8. Note that while FIG. 8 shows an example in which two protrusions 9 are provided on the solder forming tool 8, two protrusions 9 may be provided on the solder forming tool 6 or the solder forming tool 7. In this case as well, the same effect as in FIG. 8 can be obtained.

[0037] The control unit 30 may also control the first drive mechanism 10 and the second drive mechanism 20 so as to move the solder wire supply unit 2 and the solder shaping unit 5 simultaneously and in the same direction. In this case, as shown in FIG. 9, the solder wire supply unit 2 and the solder shaping unit 5 may be integrated, and the second drive mechanism 20 may drive the solder wire supply unit 2 and the solder shaping unit 5. This simplifies the control compared to the case where the solder wire supply unit 2 and the solder shaping unit 5 are individually controlled, and the semiconductor manufacturing apparatus can be made smaller by using only one drive mechanism. Here, FIG. 9 shows an example in which the solder shaping unit 5 has the solder shaping tool 6, but the solder shaping unit 5 may have the solder shaping tool 7 or the solder shaping tool 8, or the solder shaping tool 6, the solder shaping tool 7, or the solder shaping tool 8 may be provided with two protrusions 9.

[0038] In addition, the embodiments can be modified or omitted as appropriate.

[0039] Various aspects of the present disclosure are summarized below as appendices.

[0040] (Appendix 1) a solder wire supply unit having a nozzle for supplying a solder wire onto the heated workpiece; a solder forming unit having a solder forming tool that is brought into contact with the solder wire and the base material to form the molten solder; a first drive mechanism that drives the solder wire supply unit so as to be movable in horizontal and vertical directions; a second driving mechanism that drives the solder molding unit so as to be movable in the horizontal direction and the vertical direction; a control unit that controls the first drive mechanism and the second drive mechanism, The control unit controls the second drive mechanism to bring the solder forming tool into contact with the molten solder and then move the solder forming unit in this state in the horizontal direction.

[0041] (Appendix 2) 2. The semiconductor manufacturing apparatus of claim 1, wherein the control unit controls the first drive mechanism and the second drive mechanism to move the solder wire supply unit and the solder shaping unit simultaneously and in the same direction.

[0042] (Appendix 3) 3. The semiconductor manufacturing apparatus according to claim 1, wherein a portion of the solder forming tool that comes into contact with the molten solder is formed into a tapered shape.

[0043] (Appendix 4) 3. The semiconductor manufacturing apparatus according to claim 1, wherein a notch is provided in a portion of the solder molding tool that comes into contact with the molten solder.

[0044] (Appendix 5) 5. The semiconductor manufacturing apparatus according to claim 1, wherein a protrusion is provided on an outer periphery of a portion of the solder forming tool that comes into contact with the molten solder.

[0045] (Appendix 6) A step of contacting a solder wire supplied from a nozzle of a solder wire supply unit onto a heated base material to form molten solder; a step of contacting a solder forming tool of a solder forming unit with the molten solder and then moving the solder forming unit in a horizontal direction in this state; The manufacturing method of a semiconductor device comprising the steps of: [Explanation of symbols]

[0046] 1 solder wire, 1a molten solder, 2 solder wire supply unit, 2b nozzle, 3 base material, 5 solder forming unit, 6, 7, 8 solder forming tool, 8a notch, 9 protrusion, 10 first drive mechanism, 20 second drive mechanism, 30 control unit.

Claims

1. a solder wire supply unit having a nozzle for supplying a solder wire onto the heated workpiece; a solder forming unit having a solder forming tool that is brought into contact with the solder wire and the base material to form the molten solder; a first drive mechanism that drives the solder wire supply unit so as to be movable in horizontal and vertical directions; a second driving mechanism that drives the solder molding unit so as to be movable in the horizontal direction and the vertical direction; a control unit that controls the first drive mechanism and the second drive mechanism, The control unit controls the second drive mechanism to bring the solder molding tool into contact with the molten solder and then move the solder molding unit in this state in the horizontal direction.

2. The semiconductor manufacturing apparatus according to claim 1 , wherein the control unit controls the first driving mechanism and the second driving mechanism to move the solder wire supply unit and the solder shaping unit simultaneously and in the same direction.

3. The semiconductor manufacturing apparatus according to claim 1 , wherein a portion of the solder molding tool that contacts the molten solder is formed into a tapered shape.

4. The semiconductor manufacturing apparatus according to claim 1 , wherein a notch is provided in a portion of the solder molding tool that contacts the molten solder.

5. 2. The semiconductor manufacturing apparatus according to claim 1, wherein a protrusion is provided on an outer periphery of a portion of the solder molding tool that comes into contact with the molten solder.

6. A step of contacting a solder wire supplied from a nozzle of a solder wire supply unit onto a heated base material to form molten solder; a step of contacting a solder forming tool of a solder forming unit with the molten solder and then moving the solder forming unit in a horizontal direction in this state; The manufacturing method of a semiconductor device comprising the steps of:

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