Suction plate, cutting device, and method for manufacturing electronic components

Abstract

To provide a suction plate capable of forming a half-cut groove with high accuracy.SOLUTION: A suction plate for holding a cutting target object having a substrate and a resin layer, and includes a base member that has a base portion to be arranged on a base provided with a suction mechanism, and a protruding portion formed so as to protrude upward from the base portion and having an adsorption surface capable of adsorbing the resin layer, and a frame-shaped member arranged to surround the periphery of the protruding portion, the frame-shaped member having a mounting surface which is formed to be located above the adsorption surface and on which the substrate can be mounted. A discharge passage capable of discharging foreign matter within a defined space defined by the protrusion and the frame-shaped member to the outside of the defined space is formed in at least one of the base member and the frame-shaped member.SELECTED DRAWING: Figure 13

Description

[Technical field]

[0001] The present invention relates to a technique for a suction plate, a cutting device, and a manufacturing method for electronic components. [Background technology]

[0002] Patent Document 1 discloses a cutting device capable of performing half cuts and full cuts on an object placed on a table using a blade. The cutting device described in Patent Document 1 can correct the height position of the blade based on the amount of wear of the blade. By correcting the height position of the blade in this way, it is possible to suppress variation in the depth of the half-cut groove formed in the object. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2022-151243 A Summary of the Invention [Problem to be solved by the invention]

[0004] Here, since half-cut grooves generally require high dimensional accuracy, there is a demand for technology that enables the formation of half-cut grooves with higher accuracy.

[0005] The present invention has been made in consideration of the above-mentioned circumstances, and the problem it aims to solve is to provide a suction plate, a cutting device, and a method for manufacturing electronic components that are capable of forming half-cut grooves with high precision. [Means for solving the problem]

[0006] The problem that the present invention aims to solve is as described above, and in order to solve this problem, the suction plate of the present invention is an suction plate that holds a cutting object having a substrate and a resin layer, and comprises a base member having a base that is placed on a base provided with a suction mechanism, and a protrusion that is formed to protrude upward from the base and has an suction surface capable of suctioning the resin layer, and a frame-shaped member that is arranged to surround the periphery of the protrusion and has a mounting surface on which the substrate can be placed, formed to be positioned above the suction surface, and at least one of the base member and the frame-shaped member is formed with a discharge passage that can discharge foreign matter within a defined space defined by the protrusion and the frame-shaped member to outside the defined space.

[0007] A cutting device according to the present invention includes the suction plate and the base on which the suction mechanism is provided.

[0008] In addition, the manufacturing method for electronic components of the present invention includes a half-cut process in which a half-cut is applied to the object to be cut using the cutting device, and a full-cut process in which a full-cut is applied to the object to be cut on which the half-cut has been applied in the half-cut process using the cutting device. Effect of the Invention

[0009] According to the present invention, the half-cut groove can be formed with high accuracy. [Brief description of the drawings]

[0010] [Figure 1] 1A is a bottom view of a package substrate, and FIG. [Diagram 2] FIG. 1 is a perspective view showing a semiconductor package in which a step portion is formed. [Diagram 3] FIG. 2 is a plan view illustrating a schematic configuration of a cutting device. [Figure 4] FIG. 2 is a side view showing a schematic configuration of a cutting device. [Diagram 5] FIG. 4 is a block diagram showing the electrical connections of the cutting device. [Figure 6] FIG. [Figure 7] 1A is a plan view showing a schematic diagram of a half-cut groove formed in a package substrate, and FIG. 1B is a side view showing a schematic diagram of a half-cut groove formed in a package substrate. [Figure 8] 11 is a flowchart showing a procedure for half cutting. [Figure 9] FIG. [Figure 10] FIG. [Figure 11] FIG. [Figure 12] 11(a) is a schematic diagram showing a cross section taken along line X1-X1 in FIG. 10. (b) is a schematic diagram showing a cross section taken along line X2-X2 in FIG. [Figure 13] FIG. 4 is a perspective view showing a path through which foreign matter is discharged from the suction plate. [Figure 14] FIG. [Figure 15] 13A is a plan view showing a suction plate on which a chamfered portion is formed, and FIG.13B is a plan view showing a suction plate according to a first modified example. [Figure 16] FIG. 11 is a plan view showing a suction plate according to a second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In the following description, the description will be given according to the directions indicated by the arrows in the drawings. Also, for the sake of convenience, the drawings used in the following description are drawn in a schematic manner with shapes, numbers, etc. appropriately omitted or exaggerated.

[0012] <Configuration of Package Substrate 70> First, a package substrate 70 will be described below as an example of an object to be cut by the cutting apparatus 1.

[0013] The package substrate 70 shown in FIG. 1 is, for example, a wettable flank QFN (Quad Flat Non-leaded) package substrate. The package substrate 70 includes a substrate 71 formed of a metal such as a copper plate, and a rectangular resin layer 72 that seals one surface of the substrate 71 with resin. The substrate 71 may be a lead frame, a printed wiring board, or the like. In this embodiment, as an example, a lead frame is used as the substrate 71. In the following description, the surface of the substrate 71 on which the resin layer 72 is formed is referred to as a first surface, and the surface opposite to the first surface is referred to as a second surface.

[0014] On the first surface of the substrate 71, semiconductor chip mounting portions (die pads) (not shown) are arranged in a matrix. Electronic elements 73, such as semiconductor chips, resistor elements, and capacitor elements, are fixed to the die pads. The substrate 71 is made of metal such as copper (Cu) or 42 alloy (Fe-Ni) and has electrical conductivity. A lead-free metal plating layer or a lead-free solder plating layer (not shown) may be formed in advance on the surface of the substrate 71. A large number of leads, which are terminals for connection to the outside, are arranged around each die pad. These leads are each connected to a tie bar, which is a metal frame arranged in a lattice on the substrate 71. A plurality of electrodes (not shown) provided on each electronic element 73 are electrically connected to the respective leads arranged around the die pad via bonding wires made of gold wires or copper wires.

[0015] The substrate 71 of this embodiment includes a rectangular used region 71a and a non-used region 71b surrounding the used region 71a. The non-used region 71b is an area including the outer edge of the substrate 71, is not used as a product, and is removed later. On the other hand, the used region 71a is an area used as a product, and includes the die pad, the lead, and the tie bar of the lead frame described above. The resin layer 72 is formed in a rectangular shape so as to cover the used region 71a of the substrate 71 and a part of the non-used region 71b outside the used region 71a. That is, the electronic element 73 and the bonding wires arranged in the used region 71a are sealed by the resin layer 72. By forming the resin layer 72, a step is formed between the first surface of the substrate 71 and the end surface of the resin layer 72 (the lower surface in FIG. 1(b)) by the thickness of the resin layer 72.

[0016] In addition to the above-mentioned examples, the substrate 71 constituting the package substrate 70 may be a semiconductor substrate, a metal substrate, a ceramic substrate, a glass substrate, a resin substrate, or the like. If the substrate is not made of metal and does not have electrical conductivity, the portion of the substrate that comes into contact with the frame member 150 of the suction plate 100 (the outer periphery described below) may be configured to have electrical conductivity. Furthermore, the substrate 71 constituting the package substrate 70 may or may not be provided with wiring.

[0017] A semiconductor package (electronic component) 80 as shown in Fig. 2 is manufactured by performing half cuts and full cuts on the package substrate 70 shown in Fig. 1. A specific method for performing half cuts and full cuts on the package substrate 70 will be described later.

[0018] In the semiconductor package 80 shown in FIG. 2, a step portion 81 is formed at the boundary between the top surface (the surface on which the terminals 82 are formed) and the side surface. When the semiconductor package 80 is surface-mounted, the solder enters the step portion 81. This allows a fillet-shaped solder connection structure to be realized for the semiconductor package 80, and ensures a reliable connection. In addition, since the solder enters the step portion 81 and forms a fillet, the solder connection state can be easily observed from the side surface of the semiconductor package 80 during visual inspection after mounting. In this way, the semiconductor package 80 has various advantages. A method for forming the step portion 81 will be described later.

[0019] <Cutting device configuration> Next, the configuration of the cutting device 1 will be described with reference to FIGS.

[0020] The cutting device 1 cuts the package substrate 70 to manufacture a plurality of semiconductor packages 80, which are cut products. In this embodiment, "cutting" includes separating the object to be cut into a plurality of individual cut products, and removing a portion of the object to be cut. Hereinafter, cutting that separates the object to be cut into a plurality of individual cut products is referred to as a full cut, and cutting that does not separate the object to be cut but removes a portion of it in the thickness direction is referred to as a half cut. The cutting device 1 mainly includes a cutting unit 10, a holding unit 20, a detection unit 30, a control unit 40, and the like.

[0021] <Configuration of cutting unit 10> 3 and 4 is for cutting a package substrate 70. The cutting unit 10 mainly includes a blade 11 and a spindle unit 12. The cutting device 1 may have a twin spindle configuration including a pair of spindle units 12, or a single spindle configuration including only one spindle unit 12.

[0022] The blade 11 is an annular blade. The blade 11 is detachably attached to the tip of the spindle portion 12. The blade 11 can rotate around the X-axis.

[0023] The spindle portion 12 supports the blade 11 and rotates the blade 11. The spindle portion 12 is disposed to extend in the X-axis direction. The spindle portion 12 can be moved along the X-axis and Z-axis in Figs. 3 and 4 by a moving mechanism (not shown). The movement of the spindle portion 12 (the operation of the moving mechanism) is controlled by a control unit 40, which will be described later. Note that hereinafter, the Z-axis direction in Figs. 3 and 4 may also be referred to as the height direction of the spindle portion 12 and the blade 11.

[0024] The blade 11 attached to the spindle portion 12 can perform half cuts and full cuts on the package substrate 70 by rotating at high speed with the rotation transmitted from the spindle portion 12. Hereinafter, the blade for half cuts is referred to as the first blade 11A, the blade for full cuts is referred to as the second blade 11B, and the first blade 11A and the second blade 11B are collectively referred to as the blade 11. The first blade 11A has a first thickness, and the second blade 11B has a second thickness smaller than the first thickness. In other words, the thickness of the second blade 11B is smaller than the thickness of the first blade 11A. In this embodiment, either the first blade 11A or the second blade 11B is attached to the spindle portion 12, and cutting is performed.

[0025] The first blade 11A is made of a conductive material. When the first blade 11A is attached to the spindle portion 12, the first blade 11A is electrically connected to the spindle portion 12. The spindle portion 12 is electrically connected to a detection circuit 32, which will be described later.

[0026] When the package substrate 70 is half-cut, the first blade 11A moves relative to the table 50 described below, thereby cutting the package substrate 70. Specifically, a part of the package substrate 70 is removed in the thickness direction. By performing half-cuts along the longitudinal direction and the lateral direction on the package substrate 70, a half-cut groove G1 extending in the longitudinal direction of the package substrate 70 and a half-cut groove G2 extending in the lateral direction of the package substrate 70 are formed (see FIG. 7(a)). On the other hand, when the package substrate 70 is fully cut, the second blade 11B moves relative to the table 50, thereby cutting the package substrate 70 along the groove pattern. As a result, the portions of the half-cut grooves G1 and G2 are separated, and the package substrate 70 is divided into a plurality of separated semiconductor packages 80 (see FIG. 2).

[0027] <Configuration of holding unit 20> 3 and 4 holds a package substrate 70. The holding unit 20 mainly includes a table 50 and a moving mechanism 60. The cutting device 1 may have a twin-cut table configuration including two holding units 20, may include one holding unit 20, or may include three or more holding units 20.

[0028] The table 50 shown in FIG. 6 mainly includes a base 51, a suction plate 100, a suction mechanism 52, and the like.

[0029] The suction plate 100 is fixed to the base 51. The base 51 includes a first portion 51a in contact with the lower surface of the suction plate 100, and a second portion 51c fixed to the lower surface of the first portion 51a via an insulating layer 51b. The first portion 51a and the second portion 51c are made of a conductive material such as stainless steel.

[0030] An air passage 51d is formed in the first portion 51a, which is connected to a recess 161 of the suction plate 100, which will be described later. The air passage 51d is formed so as to penetrate from the upper surface to the lower surface of the first portion 51a. A through hole 51e is formed in the second portion 51c so as to connect to the air passage 51d of the first portion 51a. A pipe 52a of the suction mechanism 52, which will be described later, is arranged in the through hole 51e.

[0031] The suction plate 100 mainly includes a base member 110 and a frame-shaped member 150 .

[0032] The base member 110 includes a plate-shaped portion 111 formed in a rectangular plate shape, a protruding portion 112 protruding upward from the plate-shaped portion 111, and the like. The plate-shaped portion 111 is an embodiment of the base according to the present invention. The plate-shaped portion 111 is formed to have a thickness in the vertical direction greater than that of the protruding portion 112. The upper surface of the protruding portion 112 constitutes an adsorption surface 112a capable of adsorbing the resin layer 72 of the package substrate 70. As shown in the enlarged view of FIG. 6, a thin-film resin film 113 is provided on the adsorption surface 112a. For convenience of explanation, the resin film 113 is omitted from the illustrations in the other drawings. The resin film 113 is not necessarily provided, and it is possible to omit it or to arrange another member (for example, a plate-shaped member having flexibility) instead.

[0033] A recess 114 is formed on the bottom surface of the base member 110. The recess 114 is formed in a shape generally similar to that of the suction surface 112a when viewed from the bottom. A plurality of suction holes 115 are formed on the base member 110. The suction holes 115 are formed so as to penetrate the base member 110 from top to bottom. More specifically, the upper ends of the suction holes 115 are opened on the suction surface 112a, and the lower ends of the suction holes 115 are opened on the recess 114. Note that through holes (not shown) are formed on the resin film 113 at positions corresponding to the suction holes 115.

[0034] By forming the recess 114, the overall length of the suction hole 115 can be shortened. This can improve the suction force through the suction hole 115. A plurality of columnar portions 116 extending vertically are formed in the recess 114. The configuration of the columnar portions 116 will be described later.

[0035] The frame-shaped member 150 is formed so as to surround the periphery of the protruding portion 112 from the sides. Specifically, an opening 151 corresponding to the protruding portion 112 is formed in the frame-shaped member 150. With the protruding portion 112 inserted into the inside of the opening 151 of the frame-shaped member 150, the frame-shaped member 150 is placed on the base member 110. In this state, the upper surface of the frame-shaped member 150 is located above the adsorption surface 112a of the protruding portion 112. The upper surface of the frame-shaped member 150 constitutes a placement surface 152 on which the substrate 71 of the package substrate 70 can be placed.

[0036] In this manner, by arranging the frame-shaped member 150 so as to surround the periphery of the protruding portion 112, a recessed portion 161 is formed by the protruding portion 112 and the frame-shaped member 150. Furthermore, this recessed portion 161 defines an arrangement space 162 in which the resin layer 72 of the package substrate 70 is to be arranged. Note that the arrangement space 162 is one embodiment of the defined space according to the present invention.

[0037] The shape of the recess 161 in plan view is formed to be generally the same as or slightly larger than the shape (rectangular shape) of the resin layer 72 of the package substrate 70. The depth of the recess 161 (arrangement space 162) is formed to be generally the same as or slightly larger than the thickness of the resin layer 72. The depth of the recess 161 means the depth from the mounting surface 152 of the frame-shaped member 150 to the adsorption surface 112a (more specifically, the upper surface of the resin film 113 provided on the adsorption surface 112a). By configuring the recess 161 in this way, the resin layer 72 can be accommodated in the recess 161 when the package substrate 70 is mounted on the frame-shaped member 150.

[0038] When the resin layer 72 is accommodated in the recess 161, the unused region 71b (hereinafter also referred to as the "periphery") (see FIG. 1) of the substrate 71 comes into contact with the upper surface of the mounting surface 152 of the frame-shaped member 150 that is outside the recess 161. Since the frame-shaped member 150 and the base member 110 are formed of a conductive material such as stainless steel, when the peripheral portion of the package substrate 70 is placed on the frame-shaped member 150, the frame-shaped member 150 and the base member 110 are electrically connected to the package substrate 70.

[0039] A discharge passage for discharging foreign matter from the recess 161 (arrangement space 162) is formed in the suction plate 100. A specific configuration of the discharge passage will be described later.

[0040] The suction mechanism 52 sucks the package substrate 70 onto the table 50 by performing suction through the suction holes 115. The suction mechanism 52 mainly includes a pipe 52a and a pump 52b.

[0041] At least a part of the pipe 52a is disposed in the through hole 51e of the second portion 51c, and is connected to the lower end of the air passage 51d. The pump 52b is connected to the pipe 52a. By driving the pump 52b, air is sucked from the plurality of suction holes 115 through the through hole 51e and the recess 114. As a result, the resin layer 72 is sucked onto the suction surface 112a, and the package substrate 70 is held on the suction plate 100. Even if the thickness of the resin layer 72 is thinner than expected and the resin layer 72 is not in contact with the upper surface of the suction surface 112a when the package substrate 70 is placed on the suction plate 100, the air in the recess 161 closed by the package substrate 70 is sucked in, creating a negative pressure in the recess 161, and the substrate 71 is sucked downward, and the resin layer 72 is in contact with and held on the suction surface 112a.

[0042] The moving mechanism 60 shown in Figures 3 and 4 is for moving the table 50. The moving mechanism 60 supports the table 50 from below. The moving mechanism 60 can rotate the table 50 in the θ direction in Figure 3 (i.e., on a horizontal plane). The moving mechanism 60 can also move the table 50 along the Y axis in Figure 3. The operation of the holding unit 20 is controlled by the control unit 40, which will be described later.

[0043] <Configuration of detection unit 30> 3 and 4 is for detecting the positions of the spindle portion 12 and the first blade 11A in the height direction (Z-axis direction). The detection unit 30 mainly includes a CCS (Contact Cutter Setup) block 31, a detection circuit 32, a detection device 33, etc.

[0044] The CCS block 31 is attached to the side of the table 50 and can move together with the table 50. The CCS block 31 is conductive and is electrically connected to the suction plate 100. Therefore, when the package substrate 70 is placed on the suction plate 100, the package substrate 70 and the CCS block 31 are electrically connected to each other.

[0045] The detection circuit 32 is configured to pass electricity through the first blade 11A and the CCS block 31 when the first blade 11A comes into contact with the upper surface of the CCS block 31. The detection circuit 32 is electrically connected to the CCS block 31 and the spindle portion 12. A detection device 33 is incorporated in the detection circuit 32. In addition, since the suction plate 100 is conductive and in contact with the CCS block 31 (see FIG. 6), the detection circuit 32 also passes electricity when the first blade 11A comes into contact with a conductive portion of the package substrate 70.

[0046] The detection circuit 32 is configured to apply a constant voltage between the CCS block 31 and the spindle portion 12 by a power supply (not shown). The detection device 33 detects a change in the presence or absence of electricity in the detection circuit 32. More specifically, the detection device 33 detects contact between the first blade 11A (more precisely, the outer edge of the first blade 11A) and the CCS block 31, and contact between the first blade 11A and the package substrate 70, and notifies the control unit 40 described later.

[0047] <Configuration of control unit 40> 3 to 5 is electrically connected to the cutting unit 10, the holding unit 20, and the detection unit 30, and controls the operations of each of the units 10 to 30. The control unit 40 may be configured integrally with each of the units 10 to 30, or may be configured separately from each of the units 10 to 30. As shown in Fig. 5, the control unit 40 mainly includes a control unit 41, a display unit 42, an input unit 43, and a storage unit 44.

[0048] The control unit 41 includes a CPU, a RAM, a ROM, etc. An operation program 41a for controlling the operation of each of the units 10 to 30 is stored in the ROM. The CPU reads out the operation program 41a from the ROM and executes it. The ROM is used appropriately for the CPU's arithmetic processing. The operation program 41a may be stored in the storage unit 44 instead of in the ROM.

[0049] The display unit 42 is configured to display, for example, various types of information to the user, and is also configured to display a user interface screen for receiving input of cutting parameters and detection parameters (described later) from the user. The display unit 42 can be realized in any manner, such as a liquid crystal display element, a liquid crystal display, an organic EL display, or a touch panel display.

[0050] The input unit 43 is used to input, for example, various fixed values ​​and various parameters for cutting. The input unit 43 can be realized in any form, such as a keyboard, a push button, a touch panel display, etc. When the input unit 43 is realized by a touch panel display, the input unit 43 may also function as the display unit 42.

[0051] The parameters for cutting are not particularly limited, but include, for example, cutting parameters that specify the positions at which the package substrate 70 should be cut. Since the package substrate 70 is usually cut according to a lattice-shaped cutting pattern, the vertical and horizontal cutting lines are determined by determining the cutting parameters.

[0052] <Calculating the half cut height> Next, the calculation of the half-cut height by the control unit 41 will be described. The half-cut height is the position of the bottom end of the first blade 11A when half-cutting the package substrate 70. The control unit 41 controls the position of the spindle unit 12 in the height direction, and moves the first blade 11A closer to the upper surface of the CCS block 31. The control unit 41 recognizes the coordinate of the height direction of the spindle unit 12 when contact between the new, unworn first blade 11A and the CCS block 31 is detected as a reference Z coordinate (hereinafter referred to as the reference coordinate). As a result, the height position of the spindle unit 12 and further the height position of the first blade 11A are detected with respect to the upper surface of the CCS block 31. Furthermore, the control unit 41 controls the position of the spindle unit 12 in the height direction so as to move the first blade 11A closer to the upper surface of the package substrate 70. The height position of the spindle portion 12 controlled by the control unit 41 is specifically, for example, the position of the rotation axis of the spindle portion 12 in the Z-axis direction, and the control unit 41 can determine the position of the spindle portion 12 in the Z-axis direction by converting the rotation direction and rotation speed of the motor that moves the spindle portion 12 along the ball screw into a movement distance in the Z-axis coordinate.

[0053] As an example, the half-cut height can be calculated as follows. First, the distance (fixed value B) from the top surface of the CCS block 31 to the top surface of the suction plate 100 and the thickness (fixed value C) of the package substrate 70 are added to the reference coordinate (A), and the height coordinate (A+B+CDE) is calculated by subtracting the half-cut cutting depth (fixed value D) and the correction amount (measured value E) caused by wear of the first blade 11A at the start of the half-cut. Then, the height position of the spindle part 12 is controlled so that the bottom end part of the first blade 11A is positioned at the calculated coordinate (hereinafter referred to as the basic processing coordinate). The fixed values ​​are input and stored in the cutting device 1 in advance. The correction amount (measured value) caused by wear of the first blade 11A at the start of the half cut can be calculated from the height coordinate when the first blade 11A comes into contact with the CCS block 31 and the above-mentioned reference coordinate (for wear of the first blade 11A and the correction of the height position of the first blade 11A caused by that wear, see Patent Publication 2022-151243).

[0054] Furthermore, the position of the spindle 12 in the height direction is controlled in consideration of the actual thickness of the package substrate 70. Specifically, the control unit 41 brings the first blade 11A into contact with the package substrate 70. From the coordinate (F) in the height direction at this time, the difference between the actual thickness of the package substrate 70 and the thickness of the package substrate 70 (fixed value C) is calculated as an offset amount (A+B+CF) of the height of the package substrate 70. Then, in consideration of this offset amount, the processing basic coordinates are corrected, and the position of the spindle 12 in the height direction is controlled so that the bottom end portion of the first blade 11A is positioned.

[0055] Furthermore, correction due to wear of the first blade 11A caused by performing half-cutting is performed, for example, when the half-cut length or half-cut time exceeds a set value. That is, when the half-cut length or half-cut time exceeds a set value (this may be the timing after the half-cut of one cutting line is completed, or may be the timing during the half-cut), the first blade 11A is brought into contact with the CCS block 31, and the height coordinate at this time is obtained. Then, from this and the above-mentioned reference coordinate, the correction amount caused by wear of the first blade 11A is calculated (see JP 2022-151243 A), and the height position of the spindle part 12 is corrected.

[0056] <Individuation of Package Substrate 70> Next, a method of cutting the package substrate 70 and forming the semiconductor package 80 will be described with reference to FIG. 7. First, a first blade 11A having a first thickness is attached to the spindle unit 12. Using this first blade 11A, the package substrate 70 is half-cut along a cutting line to form a groove pattern consisting of a plurality of half-cut grooves G1, G2 as shown in FIG. 7(a). Each time the formation of one half-cut groove G1, G2 is completed, for example, a cutting distance, which will be described later, may be determined. Note that the outermost part of the package substrate 70 cut by the first blade 11A is the boundary line (the dashed line shown in FIG. 7(a)) between the used area 71a and the unused area 71b. The unused area 71b is an area that does not include a semiconductor chip or the like after full cutting and does not become the semiconductor package 80. This boundary line cut by the first blade 11A is above the resin layer 72 and is within the recess 161 in a plan view.

[0057] 7(b) is a schematic side view of the vicinity of the half-cut grooves G1 and G2 of the package substrate 70. After the groove pattern is formed, a second blade 11B having a second thickness smaller than the first thickness is attached to the spindle portion 12, and the package substrate 70 is fully cut at position P1 by the second blade 11B to separate the package substrate 70. The position P1 is preferably the center of the half-cut grooves G1 and G2. This produces a plurality of semiconductor packages 80 having step portions 81 formed therein as shown in FIG. 2. The cross-sectional shape of the half-cut grooves G1 and G2 is not limited to the shape shown in FIG. 7(b).

[0058] When forming a groove pattern in the package substrate 70 by half-cutting, it is important that the half-cut grooves G1, G2 are formed on the package substrate 70 with as uniform depth as possible, and high precision is required. Therefore, in this embodiment, the half-cut is controlled as follows. The process of half-cutting the package substrate 70 (half-cut process) will be described below with reference to the flow charts shown in Figs. 6 and 8.

[0059] <Half-cut of package substrate 70> First, the package substrate 70 is aligned and placed in the recess 161 of the holding unit 20, and air is sucked through the suction holes 115 of the base member 110 to hold the package substrate 70 on the suction plate 100 (step S1). As a result, the unused area 71b of the substrate 71 of the package substrate 70 comes into contact with the upper surface of the suction plate 100 (the mounting surface 152 of the frame-shaped member 150), so that the package substrate 70 and the suction plate 100 are electrically connected to each other.

[0060] Next, the spindle unit 12 and the moving mechanism 60 are operated to align the first blade 11A with the package substrate 70 (step S2). Subsequently, the spindle unit 12 is moved to bring the first blade 11A into contact with the CCS block 31, and the height position of the first blade 11A at this time is stored in the storage unit 44. Thereby, as described above, the correction amount caused by wear of the first blade 11A is calculated and stored in the storage unit 44 (step S3).

[0061] Next, if the height of the upper surface of the package substrate 70 has not been measured (NO in step S4), the spindle unit 12 is moved to bring the first blade 11A into contact with the second surface of the substrate 71 of the package substrate 70. More specifically, the first blade 11A is brought into contact with a portion of the non-use area 71b of the second surface of the substrate 71 of the package substrate 70, which is below the non-use area 71b and has the resin layer 72 formed on the first surface side. Since the outer periphery of the package substrate 70 is in contact with the suction plate 100, a current flows through the first blade 11A and the substrate 71, and the current is detected by the detection device 33. As a result, the height position of the first blade 11A is calculated (step S5) and stored in the storage unit 44. Based on this, the above-mentioned offset amount is calculated and stored in the storage unit 44. On the other hand, if the height of the upper surface of the package substrate 70 has been measured (YES in step S4), the half-cut height is calculated (step S6) as follows.

[0062] That is, the half-cut height of the first blade 101A is calculated from the correction amount and offset amount calculated as above and the basic processing coordinates (step S6). Based on this, the height position of the bottom end portion of the first blade 11A is adjusted to a position lower than the height position where the first blade 11A contacts the package substrate 70 by the cutting depth of the half-cut.

[0063] Thereafter, the spindle unit 12 is moved to half-cut the package substrate 70 along the above-mentioned cutting line (step S7). At this time, the blade tip at the lower end of the first blade 11A is held at the above-mentioned half-cut height to perform the half-cut. In this process, when the half-cut on one cutting line is completed, if the cutting distance by the first blade 11A exceeds a set value (YES in step S8), it is determined that the first blade 11A is worn, and the above-mentioned correction amount is calculated (step S3). On the other hand, if the cutting distance does not exceed the set value (NO in step S8), it is determined whether or not the half-cut has been performed on all the cutting lines on the package substrate (step S9). In step S8, instead of the cutting distance by the first blade 11A, it may be determined whether or not the cutting time by the first blade 11A exceeds a set value.

[0064] In step S9, if half cuts have not been performed on all the cutting lines (NO in step S9), another half cut is performed on another cutting line (step S7). If half cuts have been performed on all the cutting lines (YES in step S9), the package substrate 70 is washed and dried, and then removed from the suction plate 100 and carried out (step S10). Following this, the table 50 is washed with washing water and dried (step S11). When washing the table 50, foreign matter (e.g., cutting chips, etc.) in the recess 161 of the suction plate 100 is discharged to the outside through a discharge passage described later. This makes it possible to prevent foreign matter from being caught between the suction surface 112a of the suction plate 100 and the package substrate 70, and allows the half cut to be performed with high accuracy.

[0065] Thereafter, when half-cutting of all package substrates 70 is completed (YES in step S12), the operation of the cutting device 1 is terminated, and if package substrates 70 to be half-cut remain (NO in step S12), a new package substrate 70 is held on the suction plate 100 (step S1) and half-cutting is continued.

[0066] Thereafter, the cutting device 1 can further perform a step of performing a full cut (full cut step). In this case, the blade is replaced, and a second blade 11B is attached to the spindle unit 12 in place of the first blade 11A. Then, a full cut is performed by the replaced second blade 11B. The second blade 11B cuts and separates the package substrate 70 in the thickness direction according to the formed groove pattern. This results in semiconductor packages 80, which are a plurality of individual electronic components. The semiconductor packages 80 after the full cut may be sent to another unit included in the cutting device 1.

[0067] The cutting device 1 can also be provided with a pressing mechanism for pressing the package substrate 70 to be cut (particularly, half-cut). The pressing mechanism can press the package substrate 70 to eliminate warping or lifting of the package substrate 70, and half-cut the package substrate 70, or the first blade 11A can be brought into contact with the package substrate 70 to measure the height of the upper surface of the package substrate 70, thereby forming a half-cut groove with higher accuracy. As the pressing mechanism, for example, a mechanism described in JP 2022-79910 A can be used.

[0068] <Configuration of the suction plate 100> The configuration of the suction plate 100 will be described in more detail below.

[0069] 9 to 12, a discharge passage is formed for discharging foreign matter (e.g., cutting chips, etc.) in the recess 161 (arrangement space 162). Specifically, the discharge passage is mainly constituted by a step portion 121, a chamfered portion 122, a first groove portion 123, a second groove portion 124, etc., which are formed in the base member 110.

[0070] The step portion 121 is formed along the outer peripheral edge of the upper end portion (adsorption surface 112a) of the protruding portion 112. The step portion 121 is formed around the entire circumference of the protruding portion 112. As a result, the step portion 121 is formed so as to surround the periphery of the adsorption surface 112a. The step portion 121 is formed so as to be slightly lower than the central portion (adsorption surface 112a) of the protruding portion 112. The step portion 121 is one embodiment of a third passage according to the present invention.

[0071] The chamfered portion 122 is formed by cutting out the four corners of the protruding portion 112 which is formed in a rectangular shape in a plan view. The chamfered portion 122 is formed from the upper end to the lower end of the protruding portion 112. By forming the chamfered portion 122, a gap is formed between the protruding portion 112 and the inner surface (opening 151) of the frame-shaped member 150 from top to bottom. The upper end of the chamfered portion 122 is connected to the step portion 121. The chamfered portion 122 is one embodiment of the first passage according to the present invention.

[0072] 9 and 11 is formed along the short sides of the protruding portion 112 which is formed into a rectangular shape in a plan view. The first groove portion 123 is formed by recessing portions along a pair of short sides of the protruding portion 112 on the upper surface of the plate-shaped portion 111. As a result, the first groove portion 123 is formed so as to extend in a direction parallel to the short sides of the package substrate 70 held by the suction plate 100.

[0073] The second groove 124 shown in FIG. 9, FIG. 10, and FIG. 11 is formed along the long sides of the protruding portion 112 formed in a rectangular shape in a plan view. The second groove 124 is formed by recessing the portion along the pair of long sides of the protruding portion 112 on the upper surface of the plate-like portion 111. As a result, the second groove 124 is formed to extend in a direction parallel to the long sides of the package substrate 70 held by the suction plate 100. In addition, both ends of the second groove 124 in the longitudinal direction are formed to extend to the ends of the plate-like portion 111. As a result, both ends of the second groove 124 are formed to open to the side surfaces of the plate-like portion 111. The second groove 124 is one embodiment of the second passage according to the present invention.

[0074] The middle part of the second groove part 124 is connected to the first groove part 123 near the corner part of the protruding part 112. Also, at this part, the first groove part 123 and the second groove part 124 are connected to the chamfered part 122. In this manner, the step part 121, the chamfered part 122, the first groove part 123 and the second groove part 124 are connected to one another.

[0075] When the frame-shaped member 150 is attached to the base member 110 having the step portion 121 and the like formed thereon, the side surface of the protrusion 112 and the inner surface (opening 151) of the frame-shaped member 150 are fitted together, thereby enabling the frame-shaped member 150 to be positioned relative to the base member 110.

[0076] In a state where the frame-shaped member 150 is attached to the base member 110, as shown in Figs. 12 and 13, the recess 161 (arrangement space 162) is connected to the outside of the suction plate 100 via the discharge passage (the step portion 121, the chamfered portion 122, the first groove portion 123, and the second groove portion 124). Therefore, when the table 50 (the suction plate 100) is washed in step S11 of Fig. 8, foreign matter in the recess 161 is discharged to the outside together with the washing water via the discharge passage (for example, discharged along the dotted arrow in Fig. 12(b)). This makes it possible to prevent foreign matter from being caught between the suction surface 112a of the suction plate 100 and the package substrate 70, and makes it possible to perform the half cut with high accuracy.

[0077] As shown in FIG. 12(a) and FIG. 14, the recess 114 is formed with a plurality of vertically extending pillars 116. The pillars 116 are formed, for example, in a rectangular column shape. The pillars 116 are formed so as to extend downward from the upper surface of the recess 114. The vertical length of the pillars 116 is formed to be approximately the same as the depth of the recess 114. The pillars 116 are formed at positions that do not overlap with the suction holes 115. The lower ends of the pillars 116 contact the upper surface of the base 51 (see FIG. 6). The pillars 116 can support the base member 110 in which the recess 114 is formed. This can suppress deformation of the base member 110 when air is sucked in by the suction mechanism 52 and the inside of the recess 114 becomes negative pressure.

[0078] The shape and number of the columnar portions 116 are not particularly limited. For example, the columnar portions 116 may be formed in a shape other than a rectangular column (such as a cylindrical shape). The arrangement and number of the columnar portions 116 may be changed as desired.

[0079] Also, the discharge passage can be formed to be appropriately inclined so as to promote the discharge of foreign matter through the discharge passage. For example, the second groove portion 124 shown in Fig. 11 can be formed to descend from the left-right center toward both left-right ends of the plate-shaped portion 111. This can promote the discharge of foreign matter flowing through the second groove portion 124 together with the cleaning water to the outside. Also, not only the second groove portion 124 but also other portions (for example, the step portion 121, the first groove portion 123, etc.) can be inclined.

[0080] Although an embodiment of the present invention has been described above, the present invention is not limited to the above embodiment, and appropriate modifications are possible within the scope of the technical idea of ​​the invention described in the claims.

[0081] For example, in the above embodiment, as shown in FIG. 15(a), an example was shown in which a chamfered portion 122 is formed at the corner of the protrusion 112 to connect the recess 161 (arrangement space 162) to the first groove portion 123 and the second groove portion 124 formed in the lower part of the protrusion 112, but the present invention is not limited to this.

[0082] As an example, FIG. 15(b) shows a suction plate 100A (base member 110A) according to a first modified example. In the base member 110A according to the first modified example, a step portion 121 is left near the corner of the protrusion 112, and a notch portion 125 is formed in the middle of one side of the protrusion 112 that is rectangular in plan view. In this configuration, the recess 161 (arrangement space 162) is connected to the first groove portion 123 and the second groove portion 124 formed in the lower part of the protrusion 112 through the notch portion 125. In this configuration, the side surface of the step portion 121 left at the corner of the protrusion 112 and the inner side surface (opening 151) of the frame member 150 are fitted together, so that the frame member 150 can be positioned relative to the base member 110A.

[0083] In this way, the configuration of the discharge passage for discharging foreign matter from the recess 161 (arrangement space 162) is not particularly limited, and the configuration (shape, position, number of passages, etc.) can be changed arbitrarily as long as it is possible to discharge foreign matter from the recess 161.

[0084] For example, in the above embodiment, the step 121 is formed on the outer periphery of the protruding portion 112, but the step 121 (groove) may be appropriately formed in a portion (for example, near the center) other than the outer periphery of the protruding portion 112. Also, it is not always necessary to form the step 121 on the protruding portion 112, and the chamfered portion 122 and the recess 161 may be directly connected.

[0085] In the above embodiment, the end of the second groove 124 is formed to open on the side surface of the base member 110 (plate-shaped portion 111) and foreign matter is discharged to the outside from this opening, but the present invention is not limited to this. For example, instead of the second groove 124, the first groove 123 may be formed to open on the side surface of the base member 110, or both the first groove 123 and the second groove 124 may be formed to open on the side surface of the base member 110.

[0086] In addition, in the above embodiment, an example is shown in which the first groove portion 123 and the second groove portion 124 are formed to extend parallel to each side of the protrusion portion 112 which is rectangular in plan view, but the shape and extension direction of the groove portions are not limited to this, and groove portions can be formed in any shape and direction.

[0087] In the above embodiment, the foreign matter is discharged to the outside (to the side of the base member 110) through the second groove portion 124 that opens in the side surface of the base member 110 (plate-shaped portion 111), but the present invention is not limited to this. For example, it is also possible to form a collection portion capable of collecting foreign matter in the discharge passage, and configure it to collect the foreign matter discharged from the recess 161 (arrangement space 162).

[0088] In addition, in the above embodiment, a rectangular shaped suction plate 100 (see FIG. 10, etc.) is illustrated assuming that a rectangular package substrate 70 is to be cut. However, the present invention is not limited to this, and the shape of the suction plate 100 can be changed as desired depending on the shape of the object to be cut (package substrate 70, etc.).

[0089] As an example, Fig. 16 shows an adsorption plate 100B (base member 110B) according to a second modified example. In the base member 110B according to the second modified example, the protruding portion 112 is formed in a square shape in a plan view. Although not shown, an opening 151 having a shape (square shape in a plan view) corresponding to the protruding portion 112 is also formed in the frame member 150. This allows the adsorption plate 100B to hold the square-shaped package substrate 70. The adsorption plate 100B having such a shape is suitable for adsorbing a relatively large package substrate 70.

[0090] In addition, in the base member 110B according to the second modification shown in FIG. 16, similarly to the base member 110A according to the first modification (see FIG. 15(b)), step portions 121 are left at the corners of the protruding portion 112, and notches 125 are formed on each side of the protruding portion 112. In addition, in the base member 110B according to the second modification, a plurality of third groove portions 126 are formed parallel to the second groove portions 124 so as to connect to the middle portions of the first groove portions 123. The ends of the third groove portions 126 are formed so as to open on the side surfaces of the base member 110B. In this way, by increasing the number of groove portions that open on the side surfaces of the base member 110B, it is possible to efficiently promote the discharge of foreign matter.

[0091] In this way, the shape of the suction plate 100B (base member 110B) can be changed arbitrarily as long as it is a shape that can suction and hold the object to be cut (such as the package substrate 70).

[0092] In the above embodiment, the discharge passages (step portion 121, chamfered portion 122, first groove portion 123, second groove portion 124, etc.) are formed by appropriately processing base member 110, but the discharge passages do not necessarily have to be formed in base member 110. For example, the discharge passages may be formed by forming appropriate grooves, etc. in frame-shaped member 150 instead of base member 110, or by forming appropriate grooves, etc. in both base member 110 and frame-shaped member 150.

[0093] The cutting device 1 according to the above embodiment may also include units other than those described above. For example, the cutting device 1 may include a substrate supply unit that supplies the package substrate 70, an inspection unit that inspects the package substrate 70 and / or the semiconductor package 80, a cleaning unit that cleans and / or dries the cut semiconductor package 80, a transport unit that transports the cut semiconductor package 80 to a storage unit, and the like.

[0094] <Additional Notes> The suction plate 100 according to the first aspect of the present disclosure is A suction plate 100 for holding a package substrate 70 (object to be cut) having a substrate 71 and a resin layer 72, a base member 110 including a plate-like portion 111 (base portion) arranged on a base 51 on which a suction mechanism 52 is provided, and a protruding portion 112 formed so as to protrude upward from the plate-like portion 111 and having an adsorption surface 112a capable of adsorbing the resin layer 72; a frame-shaped member 150 including a mounting surface 152 on which the substrate 71 can be placed, the mounting surface 152 being disposed so as to surround the periphery of the protruding portion 112 and positioned above the adsorption surface 112a; Equipped with At least one of the base member 110 and the frame-shaped member 150 has a discharge passage (step portion 121, chamfered portion 122, first groove portion 123 and / or second groove portion 124) formed therein, which can discharge foreign matter within the arrangement space 162 (defined space) defined by the protrusion 112 and the frame-shaped member 150 to outside the arrangement space 162. According to the suction plate 100 of the first aspect of the present disclosure, the half-cut groove can be formed with high accuracy. Specifically, since foreign matter in the arrangement space 162 can be discharged to the outside, it is possible to prevent foreign matter from being caught between the suction surface 112a and the package substrate 70.

[0095] In the suction plate 100 of the second side according to the first side, The discharge passage is formed between the protruding portion 112 and the frame-shaped member 150 and includes a chamfered portion 122 (first passage) connected to the arrangement space 162 . According to the suction plate 100 of the second aspect of the present disclosure, foreign matter within the arrangement space 162 can be discharged to the outside via the chamfered portion 122.

[0096] In the suction plate 100 of the third side according to the second side, The discharge passage includes a second groove portion 124 (second passage) that connects the chamfered portion 122 and the side surface of the plate-shaped portion 111 . According to the suction plate 100 of the third aspect of the present disclosure, foreign matter discharged from the arrangement space 162 can be discharged to the outside of the base member 110.

[0097] In the suction plate 100 of the fourth side according to the third side, The package substrate 70 is formed in a rectangular shape. The second groove portion 124 is formed so as to extend in a direction parallel to at least one side (long side) of the package substrate 70 adsorbed by the adsorption surface 112a. According to the suction plate 100 of the third aspect of the present disclosure, the suction plate 100 can be formed relatively compact by forming the second groove portion 124 in a direction according to the shape of the package substrate 70. In particular, in the above embodiment, the second groove portion 124 opening on the side surface of the base member 110 is formed only in a direction parallel to the long side of the package substrate 70 (one direction), so that a decrease in the rigidity of the base member 110 can be suppressed. Note that "parallel" has not only a strict meaning but also a substantial meaning. Therefore, even if the side of the package substrate 70 and the second groove portion 124 are not completely parallel, they are parallel if they are within the range of error due to, for example, the arrangement of the package substrate 70.

[0098] In the fifth side suction plate 100 according to any one of the second to fourth sides, The discharge passage is formed around the suction surface 112a and includes a step portion 121 (third passage) connected to the chamfered portion 122. According to the suction plate 100 of the fifth aspect of the present disclosure, the foreign matter can be guided to the chamfered portion 122 via the stepped portion 121, and the discharge of the foreign matter can be effectively promoted.

[0099] In the suction plate 100 of the sixth side according to any one of the first to fifth sides, The thickness of the plate-like portion 111 in the vertical direction is formed to be greater than the thickness of the protruding portion 112 in the vertical direction. According to the suction plate 100 of the sixth aspect of the present disclosure, the thickness of the plate-like portion 111 in the vertical direction is made relatively large, which makes it easier to ensure the flatness of the suction surface 112a.

[0100] In the seventh side of the suction plate 100 according to any one of the first to sixth sides, The base member 110 has a bottom surface formed with a recess 114 connected to the suction hole 115 formed in the suction surface 112a. At least one columnar portion 116 capable of coming into contact with the base 51 is formed inside the recess 114 . According to the suction plate 100 of the seventh aspect of the present disclosure, the base member 110 can be prevented from being deformed by the negative pressure generated by the package substrate 70.

[0101] Moreover, the cutting device 1 according to an eighth aspect of the present disclosure is An adsorption plate 100 on any one of the first to seventh sides; The base 51 on which the suction mechanism 52 is provided; It is equipped with the following. According to the cutting device 1 according to the eighth aspect of the present disclosure, it is possible to form half-cut grooves with high accuracy.

[0102] A method for producing an electronic component according to a ninth aspect of the present disclosure includes the steps of: a half-cutting process in which a half-cut is performed on the package substrate 70 using an eighth side cutting device 1; a full-cut process in which a full cut is performed on the package substrate 70 that has been half-cut in the half-cut process using the cutting device 1; It includes. According to the cutting device 1 according to the ninth aspect of the present disclosure, it is possible to form half-cut grooves with high accuracy. [Explanation of symbols]

[0103] 1 cutting device 51 Foundation 52 Suction mechanism 70 Package Substrate 71 Substrate 72 Resin layer 100 Adsorption Plate 110 Base material 111 Plate-shaped part 112 Protrusion 112a Adsorption surface 114 Recess 115 Adsorption hole 116 Columnar part 121 Step 122 Chamfered part 123 First Groove 124 Second groove 150 Frame-shaped member 152 Placement surface 162 Placement space

Claims

1. A suction plate for holding an object to be cut having a substrate and a resin layer, a base member including a base portion disposed on a base provided with a suction mechanism, and a protruding portion formed so as to protrude upward from the base portion and having an adsorption surface capable of adsorbing the resin layer; a frame-shaped member including a mounting surface on which the substrate can be placed, the mounting surface being disposed so as to surround the periphery of the protruding portion and positioned above the adsorption surface; Equipped with At least one of the base member and the frame-shaped member is formed with a discharge passage capable of discharging foreign matter within a defined space defined by the protrusion and the frame-shaped member to outside the defined space. Suction plate.

2. The discharge passage includes a first passage formed between the protrusion and the frame-shaped member and connected to the defined space. The suction plate of claim 1.

3. The discharge passage includes a second passage connecting the first passage and a side surface of the base. The suction plate according to claim 2.

4. The object to be cut is formed into a rectangular shape, The second passage is formed to extend in a direction parallel to at least one side of the workpiece attracted to the attraction surface. The suction plate according to claim 3.

5. the discharge passage includes a third passage formed around the suction surface and connected to the first passage; An adsorption plate according to any one of claims 2 to 4.

6. The thickness of the base in the vertical direction is formed to be greater than the thickness of the protrusion in the vertical direction. An adsorption plate according to any one of claims 1 to 5.

7. A recess is formed on a bottom surface of the base member to be connected to the suction hole formed on the suction surface, At least one columnar portion capable of contacting the base is formed inside the recess. An adsorption plate according to any one of claims 1 to 6.

8. A suction plate according to any one of claims 1 to 7, The base on which the suction mechanism is provided; A cutting device comprising:

9. a half-cutting step in which a half-cut is applied to the object to be cut using the cutting device according to claim 8; a full-cut process in which a full cut is performed on the object to be cut that has been half-cut in the half-cut process by using the cutting device; Including, A method for manufacturing electronic components.

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