Processing apparatus, processing method, joining device, and method for manufacturing article

Abstract

To provide a processing apparatus advantageous in joining a plurality of types of dies considering the grades of the dies.SOLUTION: A processing apparatus has: a moving unit that moves a first type die held in a first holding unit and a second type die held in a second holding unit to a third holding unit; and a control unit that controls the moving unit. The first holding unit holds a plurality of first type dies, and the second holding unit holds a plurality of second type dies. The control unit acquires information on the grades of the dies held in the first holding unit and second holding unit, and controls the moving unit to move, to the third holding unit, the plurality of types of dies including the first type dies and the second type dies selected on the basis of the acquired information on the grades of the dies.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a processing apparatus, a processing method, a joining apparatus, and a method for manufacturing an article. [Background technology]

[0002] In a bonding apparatus (die bonder apparatus) that bonds individual dies obtained through a dicing process to a bonding area of ​​a substrate, a die of a desired grade may be selected as the die to be used for bonding from among a plurality of dies classified into a plurality of grades.

[0003] Patent Document 1 describes a method of replacing a substrate according to the grade of the die remaining in the holder, so that dies of the same grade are bonded to all bonded regions on the substrate when multiple dies of one type contain multiple grades. Specifically, if the holder is depleted of dies of the desired grade before the bonding process is completed for all bonded regions of the substrate, the substrate, some of which have been bonded to, is moved to a buffer section for storage. If dies of a different grade remain in the holder, another substrate is placed on a stage for bonding, and the dies of the different grade are bonded. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2022-13070 Summary of the Invention [Problem to be solved by the invention]

[0005] In some cases, multiple types of dies are bonded to a bonding region of a substrate. When multiple types of dies are bonded, if the method described in Patent Document 1 is applied, the substrates need to be frequently replaced, and furthermore, many substrates exist on which bonding processing has not been completed for all bonding regions, making management of the substrates complicated.

[0006] Therefore, an object of the present invention is to provide a processing apparatus that is advantageous when joining a plurality of types of dies, taking into consideration the grade of each die. [Means for solving the problem]

[0007] In order to achieve the above-mentioned object, a processing apparatus as one aspect of the present invention has a moving unit that moves a first type of die held in a first holding unit and a second type of die held in a second holding unit to a third holding unit, and a control unit that controls the moving unit, wherein the first holding unit holds a plurality of the first type of dies and the second holding unit holds a plurality of the second type of dies, and the control unit acquires information on the grades of the die held in the first holding unit and the second holding unit, and controls the moving unit to move a plurality of types of dies including the first type of die and the second type of die selected based on the acquired information on the grades of the die to the third holding unit.

[0008] Further objects or other aspects of the present invention will become apparent from the embodiments described below with reference to the drawings. Effect of the Invention

[0009] According to the present invention, it is possible to provide a processing apparatus that is advantageous when bonding a plurality of types of dies by taking into consideration the grade of each die. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic view of a joining device according to a first embodiment. [Diagram 2] This is an example in which multiple types of dies are bonded to the bonding region of the substrate. [Diagram 3] This is an example of multiple types of dies. [Figure 4] FIG. 2 is a schematic diagram of a processing unit (processing device) in the first embodiment. [Diagram 5]4 is an example of a die held by a carrier in the first embodiment. [Figure 6] 4 is a flowchart of a processing method of a processing unit in the first embodiment. [Figure 7] 1 is a diagram showing an example of a map (grade information) that indicates the grade (quality grade) of each of a plurality of bonded regions of a substrate, the map being stored in a storage unit; [Figure 8] 10 is a flowchart of a processing method of a processing unit in a second embodiment. [Figure 9] FIG. 11 is a schematic diagram of a processing unit (processing device) in a third embodiment. [Figure 10] 13 is a flowchart of a processing method of a processing unit in a third embodiment. [Figure 11] 10 is a flowchart of a method for manufacturing an article in a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Note that the following embodiment does not limit the invention according to the claims. Although a plurality of features are described in the embodiment, not all of these features are necessarily essential to the invention, and each embodiment may be arbitrarily combined. Furthermore, in the drawings, the same reference numbers are used for the same or similar configurations, and duplicated explanations are omitted.

[0012] In addition, in this specification and drawings, directions are basically indicated by an XYZ coordinate system in which the vertical direction is the Z axis and the horizontal plane perpendicular to the vertical direction is the XY plane, and the axes are mutually orthogonal. However, if an XYZ coordinate system is shown in each drawing, that coordinate system takes precedence.

[0013] A specific configuration will be described below for each embodiment.

[0014] First Embodiment FIG. 1 is a schematic diagram of a bonding apparatus 100 in this embodiment. The bonding apparatus 100 includes a processing section (processing apparatus) 10, a pre-processing section 60 that performs pre-processing on objects to be bonded before the bonding process, and a bonding processing section 20 that performs the bonding process. The processing section 10 performs a process of moving multiple types of dies 30 to a carrier (third holding section) 72 based on the grade (quality grade) of each die 30 used in the bonding process. Furthermore, the bonding apparatus 100 includes a first inter-apparatus conveying section 50, a second inter-apparatus conveying section 51, and a first control section 101. The first inter-apparatus conveying section 50 conveys the carrier 72 holding the multiple dies 30 from the processing section 10 to the pre-processing section 60.

[0015] The second inter-apparatus conveying section 51 conveys the carrier 72 holding the plurality of dies 30 preprocessed in the pre-processing section 60 from the pre-processing section 60 to the bonding processing section 20. The first control section 101 is a control section that controls each part of the bonding apparatus 100. The first inter-apparatus conveying section 50 and the second inter-apparatus conveying section 51 are, for example, conveying hands. In this embodiment, an example is shown in which the carrier 72 is conveyed between the apparatuses by an inter-apparatus conveying section separate from the processing section 10, the pre-processing section 60, and the bonding processing section 20. However, the carrier 72 may be conveyed by a conveying section that constitutes a part of the processing section 10, the pre-processing section 60, or the bonding processing section 20.

[0016] In this embodiment, an example is shown in which the processing unit 10 moves (holds) the die 30 to the carrier 72 before the pretreatment by the pretreatment unit 60. However, the pretreatment unit 60 may pretreatment the die 30 for each predetermined unit (for example, each substrate unit to be diced in the dicing process), and the processing unit 10 may move the die 30 pretreated by the pretreatment unit 60 to the carrier 72. By moving the die 30 to the carrier 72 by the processing unit 10 before the pretreatment by the pretreatment unit 60, it is possible to pretreatment the required number of dies 30, and to reduce the number of dies 30 that are not used for the bonding process despite having been pretreated.

[0017] The bonding processing unit 20 performs a process of bonding a substrate (first object) 2 on which a semiconductor device is formed, and a die (chip) 30 including a semiconductor device. The pre-processing unit 60 performs a pre-processing for the bonding process on the object (substrate 2 or die 30) on which the bonding process is to be performed. This pre-processing is, for example, a process of applying a material to the object on which the bonding process is to be performed, changing the properties of the object's surface, etc. Note that the pre-processing unit 60 may perform the pre-processing on both the substrate 2 and the die 30.

[0018] In the pretreatment section 60, a pretreatment is performed according to the bonding method in the bonding section 20. The bonding method in the bonding section 20 is, for example, bonding with an adhesive, temporary bonding with a temporary adhesive, bonding with hybrid bonding, atomic diffusion bonding, vacuum bonding, bump bonding, etc., and various temporary bonding and permanent bonding methods can be used. For example, when the bonding method in the bonding section 20 is bonding with an adhesive, the pretreatment is a process of applying a material such as an adhesive. For example, when the bonding method in the bonding section 20 is hybrid bonding, the pretreatment is a process of changing the properties of the surface of the die 30. The pretreatment may also include a process of detecting an abnormality in the die 30 and repairing it.

[0019] An example of a series of pre-processing steps performed by the pre-processing unit 60 will be described. When the pre-processing unit 60 includes a cleaning unit (not shown), an activation processing unit (not shown), and a hydrophilic processing unit (not shown), first, the target object is cleaned in the cleaning unit. Next, the activation processing unit performs a process of activating the surface of the target object using plasma or the like. Next, the hydrophilic processing unit performs a process of providing OH groups to the surface of the target object. In this manner, a series of pre-processing steps is performed in the pre-processing unit 60.

[0020] The substrate 2 may be a silicon wafer, a silicon wafer on which wiring is formed, a glass wafer, a glass panel on which wiring is formed, a printed wiring board (PWB) on which wiring is formed, a printed circuit board (PCB) on which electronic components are mounted, or a metal panel. Alternatively, the substrate 2 may be a substrate in which a die on which a semiconductor device is formed is bonded to a wafer on which a semiconductor device is formed.

[0021] For example, the die 30 may be a die 30 that has been singulated through a dicing process (cutting process), a stack of several singulated dies 30, or a structure such as a small piece of material, an optical element, a MEMS, etc.

[0022] FIG. 2 shows an example in which multiple types of dies 30 are bonded to the bonded region 21 of the substrate 2. The substrate 2 has multiple bonded regions 21, and multiple types of dies 30 are bonded to each of the multiple bonded regions 21. In the example of FIG. 2, one first type die 31, two second type dies 32, and three third type dies 33 are bonded to one bonded region 21. Here, in FIG. 2, only one bonded region 21 is marked with a reference symbol, but multiple types of dies 30 are similarly bonded to the other multiple bonded regions 21. In addition, in this embodiment, an example is shown in which there are three types of dies 30 and the number of dies of each type is different from each other, but the type of die 30 and the number of dies of each type are not particularly limited. And, it is not necessary to bond the same type and number of dies 30 to all of the multiple bonded regions 21, and the type and number of dies 30 bonded to each bonded region 21 may be different from each other.

[0023] Here, in this embodiment, dies 30 of the same type refer to dies 30 that are devices with the same function, and the grade of the die 30 is not related to the type of die 30; even if the grades are different, dies 30 are of the same type as long as they are devices with the same function.

[0024] 3 shows an example of multiple types of dies 30. As shown in Fig. 3(a), the dies 30 separated by the dicing process are held by dicing tapes 311, 321, and 331 attached to dicing frames 312, 322, and 332 for each predetermined unit for which the dicing process has been performed. For example, each predetermined unit for which the dicing process has been performed refers to each substrate unit diced in the dicing process.

[0025] The first holding unit 310 that holds (supplies) the first type of die 31 includes a dicing frame 312 and a dicing tape 311 that holds (places) the first type of die 31. The second holding unit 320 that holds (supplies) the second type of die 32 includes a dicing frame 322 and a dicing tape 321 that holds (places) the second type of die 32. The third holding unit 330 that holds (supplies) the third type of die 33 includes a dicing frame 332 and a dicing tape 331 that holds (places) the third type of die 33. Note that, although an example in which the holding unit includes a dicing tape and a dicing frame has been shown in this embodiment, the holding unit may hold the die 30 in another form. The first holding unit 310, the second holding unit 320, and the third holding unit 330 are each placed on a placement table (not shown).

[0026] The dies 30 have different qualities due to, for example, shape quality (chips, cracks), electrical characteristics, etc. Chips and cracks can occur, for example, during a dicing process. For example, if it is desired to bond dies 30 of the same quality grade to all of the bonded regions 21 of the substrate 2, the characteristics (shape, electrical characteristics, etc.) of each die 30 are inspected and each die 30 is classified into a plurality of grades. Then, the die to be used for bonding can be selected (determined) based on information on the classified grades (grade information).

[0027] The inspection of the die 30 may be performed within the bonding apparatus 100, or may be performed by an inspection device outside the bonding apparatus 100. When the inspection of the characteristics of each die 30 is performed within the bonding apparatus 100, the first control unit 101 or the second control unit 14 described later classifies each die 30 into a plurality of grades based on the results of the inspection by an inspection unit (not shown). When the inspection of the characteristics of each die 30 is performed by an inspection device outside the bonding apparatus 100, the first control unit 101 or the second control unit 14 classifies each die 30 into a plurality of grades based on the inspection results obtained from the inspection device. The results of the classification by the first control unit 101 or the second control unit 14 are stored as grade information in the storage unit 15 described later. In this embodiment, the grade information is a map that maps the relationship between the position of each die 30 in each holding unit and the grade of the die 30, and the storage unit 15 stores the map of each holding unit as grade information. Note that the inspection device may classify each die 30 into a plurality of grades, and the storage unit 15 may store the results of the classification as grade information.

[0028] FIG. 3(b) is a diagram showing an example of a map (grade information) showing the grades (quality grades) of the first type of die 31, the second type of die 32, and the third type of die 33 stored in the storage unit 15. FIG. 3(b) shows a first map 410 of the first type of die 31 held in the first holding unit 310, a second map 420 of the second type of die 32 held in the second holding unit 320, and a third map 430 of the third type of die 33 held in the third holding unit 330. In this embodiment, the grade of the die 30 is classified into three stages, A, B, and C, but the stages of the grade classification are not limited to this example. The quality is classified in order of A, B, and C. In this embodiment, the grade information is a map, but the grade information may be in other forms such as a table or graph.

[0029] Here, when it is desired to bond dies 30 of the same grade to all of the bonded regions 21 of the substrate 2, there is a method of replacing the substrate according to the grade of the dies 30 remaining in the holder. This method is effective when one type of die 30 is bonded to the bonded region 21, but may not be effective when multiple types of die 30 are bonded to the bonded region 21. When multiple types of die 30 are bonded, the multiple types of die 30 are held by each holder and supplied for each type. That is, each of the multiple holders holds a different type of die 30. Then, the die 30 is taken out of each of the multiple holders based on the grade information, and a bonding process is performed to bond the multiple types of die 30 to the bonded region 21. When the die 30 is sequentially taken out of each of the multiple holders for the bonding process, the number and grade of the dies 30 remaining in each holder may vary between the holders. As a result, if the substrate 2 to be bonded is replaced based on the grade of the die 30 remaining in each holder, frequent replacement of the substrate 2 is required. Furthermore, there are many substrates 2 in which the bonding process has not been completed for all of the bonded regions 21, which makes the management of the substrates 2 complicated. Therefore, when bonding multiple types of dies 30, the method of replacing substrates according to the grade of the dies 30 remaining in the holder is not effective. Also, if the operation of picking up the dies 30 to be used for bonding from each of the multiple holders using a transport hand or the like and bonding them is repeated, the bonding process takes time.

[0030] Therefore, in this embodiment, when multiple types of dies 30 are bonded in consideration of the grade of each die 30, the multiple types of dies 30 are moved to the same carrier 72 based on the grade information of the die 30 stored in the storage unit 15. That is, the multiple types of dies 30 to be used for bonding, selected based on the grade information, are grouped in the carrier 72 by grade. Then, the dies 30 grouped by grade are transported to the pre-processing unit 60 or the bonding processing unit 20 as necessary, and the dies 30 grouped by grade that have not yet been processed in the pre-processing unit 60 or the bonding processing unit 20 are stored in carrier 72 units. As a result, even when multiple types of dies 30 are bonded, it is not necessary to frequently replace the substrate 2. And, even if the desired grade is changed when bonding to another substrate after bonding to a certain substrate is completed, the multiple types of dies 30 grouped by grade are stored in carrier 72 units in advance, so that it is possible to quickly provide multiple types of dies 30 grouped by the desired grade. In addition, since multiple types of dies 30 grouped by grade are transported in units of carrier 72, the required die 30 can be picked up in a short time with simpler transport movements than a method in which a die 30 is picked up from each of multiple holding sections and joined.

[0031] 4 is a schematic diagram of a processing unit (processing device) 10 in this embodiment. The processing unit 10 in this embodiment has a first moving unit 71, a second moving unit 74, a carrier stocker 73 that stores a plurality of carriers 72 that do not hold dies 30, a second control unit 14, a memory unit 15, and a first storage unit 75. The first moving unit 71 and the second moving unit 74 are, for example, a transport hand. The second control unit 14 is a control unit that controls each part of the processing unit 10.

[0032] The first control unit 101 and the second control unit 14 may be configured, for example, by a CPU, a PLD such as an FPGA, an ASIC, a general-purpose or dedicated computer with a built-in program, or a combination of all or part of these. Note that, in the present embodiment, an example is shown in which the first control unit 101 and the second control unit 14 are separate, but the second control unit 14 may control each part of the bonding apparatus 100 together, or the first control unit 101 may control each part of the bonding apparatus 100 by itself without providing a control unit in the processing unit 10.

[0033] The first moving unit 71 may include, for example, a pickup head (not shown) and a release head (not shown). The first moving unit 71 peels off the die 30 to be moved to the carrier 72 from the dicing tape 41 by the release head, holds the die 30 by suction with the pickup head, and moves (transports) the die 30 to the carrier 72. Note that the first moving unit 71 does not need to include a pickup head or a release head, and the method of acquiring the die 30 for the first moving unit 71 to move the die 30 is not limited to this method. Here, in this embodiment, the number of types of die 30 is three, and the number of first moving units 71 is three, which is the same as the number of types of die 30, but the number of first moving units 71 is not particularly limited. The carrier 72 may hold the die 30 by using only the weight of the die 30. That is, in this embodiment, the carrier 72 holding the die 30 includes a state in which the die 30 is placed on the carrier 72. Alternatively, the die 30 may be held by using the weight of the die 30 and a holding mechanism (for example, an adsorption mechanism) provided in the carrier 72.

[0034] The processing of the processing unit 10 of this embodiment will be described with reference to FIG. 4. First, the second moving unit 74 holds the carrier 72 stored in the carrier stocker 73, and moves the carrier 72 to a position where the carrier 72 can receive the die 31. Next, the first moving unit 71 acquires the die 31 of the desired grade from the first holding unit 310 based on the grade information of the die 31 held in the first holding unit 310 stored in the memory unit 15, and moves it to the carrier 72. This operation of the first moving unit 71 is repeated until the required number of dies 31 are moved to the carrier 72. The desired grade is the grade of multiple types of dies 30 to be moved to the target carrier 72. The second moving unit 74 moves the carrier 72 to a position where the carrier 72 holding the die 31 can receive the die 32. Next, the first moving unit 71 acquires the die 32 of the desired grade from the second holding unit 320 based on the grade information of the die 32 held in the second holding unit 320 stored in the memory unit 15, and moves it to the carrier 72. The operation of the first moving unit 71 is repeated until the required number of dies 32 are moved to the carrier 72. The second moving unit 74 moves the carrier 72 to a position where the carrier 72 holding the dies 31 and 32 can receive the dies 33. Next, the first moving unit 71 acquires the dies 33 of the desired grade from the third holding unit 330 based on the grade information of the dies 33 held in the third holding unit 330 stored in the memory unit 15, and moves the dies 33 to the carrier 72. The operation of the first moving unit 71 is repeated until the required number of dies 33 are moved to the carrier 72. Through these operations, the carrier 72 holds multiple types of dies 30 of the desired grade. In other words, the second control unit 14 controls the operations of the first moving unit 71 and the second moving unit 74 based on the grade information stored in the memory unit 15 to collect multiple types of dies 30 on the carrier 72.

[0035] For example, an example will be described in which the second control unit 14 collects multiple types of dies 30 (one first type die 31, two second type dies 32, and three third type dies 33) to be bonded to one bonded region 21 having a grade of A in a carrier 72. In this case, the second control unit 14 controls the first moving unit 71 to move one first type die 31, two second type dies 32, and three third type dies 33 having a grade of A to the carrier 72 based on the grade information stored in the storage unit 15. FIG. 5 is an example of a die 30 held by the carrier 72 in this embodiment. As shown in FIG. 5, in this embodiment, multiple types of dies 30 of the same grade (A) to be bonded to one bonded region 21 (one first type die 31, two second type dies 32, and three third type dies 33) can be collected in one carrier 72.

[0036] In the case where the bonding process in the bonding process section 20 requires a die 30 of grade A immediately, the carrier 72 is transported to the pre-processing section 60 or the bonding process section 20. When the carrier 72 holds a plurality of types of dies 30 unified with grades B or C together, and the dies 30 of these grades are not immediately used in the bonding process in the bonding process section 20, the carrier 72 holding these dies 30 is stored in the first storage section 75. When the bonding process section 20 requires the dies 30 stored in the first storage section 75 for each grade, the dies 30 are carried out from the first storage section 75 in units of carriers 72. This makes it possible to quickly provide a plurality of types of dies 30 of the desired grade. In this embodiment, an example in which the first storage section 75 is inside the processing section 10 is shown, but the first storage section 75 may be outside the processing section 10, for example, in a position for storing the carrier 72 holding the dies 30 preprocessed in the pre-processing section 60.

[0037] FIG. 6 is a flowchart of the processing method of the processing unit 10 in this embodiment. First, the second control unit 14 acquires grade information of the dies 30 held in each of the multiple holding units from the memory unit 15 (acquisition step, S110). For example, the second control unit 14 acquires grade information of the multiple first type dies 31 held in the first holding unit 310 and the multiple second type dies 32 held in the second holding unit 320. Next, the second control unit 14 controls the first moving unit 71 to move the multiple types of dies 30 to the carrier 72 based on the grade information acquired in the acquisition step (S120, moving step). In other words, the multiple types of dies 30 selected based on the grade information are moved to the carrier 72. For example, the first type of dies 31 are moved from the first holding unit 310, and the second type of dies 32 are moved from the second holding unit 320 to the carrier 72. Next, the second control unit 14 determines whether the carrier 72 holding the multiple types of dies 30 should be transported to the first storage unit 75 or to the next process (pre-processing unit 60 or bonding processing unit 20) (S130, determination process). Then, the second control unit 14 transports the carrier 72 to the destination determined in the determination process (S140, transport process). Note that if the moving process is performed with the destination already determined, the determination process does not need to be performed. Also, if the first storage unit 75 is outside the processing unit 10, all of the carriers 72 are transported outside the processing unit 10, so there is no need to perform the determination process.

[0038] As described above, the types and the number of each type of die 30 bonded in each bonded region 21 may be different from each other. For example, one first type die 31, two second type dies 32, and three third type dies 33 may be used for bonding to a certain bonded region 21, and three first type dies 31 and one second type die 32 may be used for bonding to another bonded region 21. In other words, the third type die 33 may not be used for bonding to another bonded region 21. In this case, the second control unit 14 controls the movement (holding) of an appropriate type and number of dies 30 to each carrier 72 based on the grade information, based on the information on the dies 30 used in the bonding process stored in advance in the storage unit 15. Here, the information on the dies 30 used in the bonding process specifically refers to information on the required type and required number of dies 30 in the bonding process. Or, based on information on the die 30 used in the bonding process transmitted from another device (information on the required type and number of dies 30 in the bonding process), the second control unit 14 controls at least one of the first moving unit 71 and the second moving unit 74 to move the appropriate type and number of dies 30 to the carrier 72 based on the grade information. That is, based on information on the die 30 stored in the storage unit 15 or transmitted from another device, the second control unit 14 controls at least one of the first moving unit 71 and the second moving unit 74 to move the appropriate type and number of dies 30 to the carrier 72. For example, the second control unit 14 controls the first moving unit 71 to move the appropriate type and number of dies 30 to the carrier 72. Then, for the carrier 72 holding the bonding region 21 that does not use the third type of die 33, the second control unit 14 moves the carrier 72 to the next position without moving the carrier 72 to a position where the die 33 can be received.

[0039] In the present embodiment, an example has been shown in which a plurality of types of dies 30 to be bonded to one of the plurality of bonded regions 21 of the substrate 2 are moved to the carrier 72. However, the present invention is not limited to this example, and a plurality of types of dies 30 to be bonded to the plurality of bonded regions 21 may be held by the carrier 72. For example, all the dies 30 to be used for bonding all of the bonded regions 21 of the substrate 2 may be held by the carrier 72 together.

[0040] In the present embodiment, the second control unit 14 controls the multiple types of dies 30 to be moved to the carrier 72 so that the grades of the multiple types of dies 30 are the same based on the grade information of the dies 30, but the multiple types of dies 30 may be controlled so that the grades of the multiple types of dies 30 are different from each other. For example, the first type of die 31 and the second type of die 32 may be of grade A, and the third type of die 33 may be of grade B, so that the quality of the multiple types of dies 30 is intentionally made different.

[0041] In this embodiment, an example in which the memory unit 15 is located inside the processing unit 10 has been described, but the memory unit 15 may be located outside the processing unit 10 and the bonding device 100. In this case, the second control unit 14 controls the die 30 to be moved to the carrier 72 based on the grade information transmitted from the external memory unit.

[0042] According to this embodiment, even when multiple types of dies 30 are bonded, there is no need to frequently replace the substrate 2. Even if the desired grade is changed when bonding to a certain substrate is completed and another substrate is to be bonded, multiple types of dies 30 can be quickly provided in the desired grade because the dies 30 are stored in advance by grade in carrier 72 units. In addition, since multiple types of dies 30 grouped by grade are transported in carrier 72 units, the required dies 30 can be picked up in a short time with a simpler transport movement than a method of picking up the dies 30 from each of multiple holders and bonding them.

[0043] <Second embodiment> In addition to the features of the first embodiment, this embodiment is characterized in that the second control unit 14 selects (determines) multiple types of dies 30 to be moved to the carrier 72 based on the grades of the multiple bonding regions 21 of the substrate 2.

[0044] The multiple bonded regions 21 of the substrate 2 may also differ in quality from one another. This is because the characteristics and shapes of the wiring patterns and insulating layers formed in the bonded regions 21 vary from one bonded region 21 to another.

[0045] In general, it is preferable to bond dies 30 of the same grade (quality grade) as the grade of the bonded region 21 of the substrate 2. For example, if the grade of the bonded region 21 is A, it is preferable that the grade of the multiple types of dies 30 to be bonded is also A. Therefore, in this embodiment, the multiple types of dies 30 are moved to the carrier 72 not only based on the grade information of the die 30 but also based on the grade information of the bonded region 21 of the substrate 2.

[0046] The quality of the bonded regions 21 of the substrate 2 may be inspected within the bonding apparatus 100 or by an inspection device outside the bonding apparatus 100. When the quality of each bonded region 21 is inspected within the bonding apparatus 100, the first control unit 101 or the second control unit 14 classifies each bonded region 21 into a plurality of grades based on the result of inspection by an inspection unit (not shown). When the quality of each bonded region 21 is inspected by an inspection device outside the bonding apparatus 100, the first control unit 101 or the second control unit 14 classifies each bonded region 21 into a plurality of grades based on the inspection result obtained from the inspection device. The result of classification by the first control unit 101 or the second control unit 14 is stored in the storage unit 15 as grade information of the bonded region 21. In this embodiment, the grade information of the bonded region 21 is a map that maps the relationship between the position of each bonded region 21 on the substrate 2 and the grade of the bonded region 21. Alternatively, the inspection device may classify each bonded region 21 into a plurality of grades, and the storage unit 15 may store the classification results as grade information.

[0047] 7 is a diagram of a map (grade information) 22 that indicates the grade (quality grade) of each of the multiple bonded regions 21 of the substrate 2, which is stored in the memory unit 15. In this embodiment, the grades of the multiple bonded regions 21 are classified into three levels, A, B, and C, but the levels of the grade classification are not limited to this example. The order of quality is A, B, and C. Note that, although the grade information is a map in this embodiment, the grade information may be in other forms, such as a table or graph.

[0048] 8 is a flowchart of the processing method of the processing unit 10 in this embodiment. First, the second control unit 14 acquires the grade information of the die 30 held in each of the multiple holders and the grade information of the bonded region 21 of the substrate 2 from the storage unit 15 (acquisition step, S210). Next, the second control unit 14 determines the grade of the die 30 to be moved to the carrier 72 based on the grade information of the bonded region 21 acquired in the acquisition step (determination step, S220). Next, the second control unit 14 controls the carrier 72 to move multiple types of die 30 based on the grade determined in the determination step and the grade information of the die 30 (S230, movement step). In other words, the multiple types of die 30 selected based on the grade of the die 30 determined in the determination step and the grade information of the die 30 are moved to the carrier 72. Next, the second control unit 14 judges whether the carrier 72 holding the multiple types of dies 30 is to be transported to the first storage unit 75 or to the next process (pre-processing unit 60 or bonding processing unit 20) (S240, judgment process). Then, the second control unit 14 transports the carrier 72 to the destination determined in the judgment process (S250, transport process). Note that in this embodiment, multiple types of dies 30 of grades corresponding to the grades of the multiple bonded regions 21 of the substrate 2 need to be bonded, and dies 30 of various grades need to be transported to the bonding processing unit 20, so the judgment process may not be performed. Also, when the first storage unit 75 is outside the processing unit 10, all the carriers 72 are transported outside the processing unit 10, so there is no need to perform the judgment process.

[0049] In the present embodiment, an example has been shown in which a plurality of types of dies 30 of the same grade as that of the bonded region 21 of the substrate 2 are moved to the carrier 72. However, the grade of the bonded region 21 of the substrate 2 and the grade of the plurality of types of dies 30 may be controlled to be different from each other. For example, even if the grade of the bonded region 21 of the substrate 2 is A, the grade of the plurality of types of dies 30 to be bonded may be B, so that the grade of the bonded region 21 of the substrate 2 and the grade of the plurality of types of dies 30 may be different from each other.

[0050] In the present embodiment, the grade index of the bonding region 21 of the substrate 2 and the grade index of the multiple types of dies 30 are the same, A, B, and C. However, the grade index does not have to be the same, and it is sufficient to select (determine) the multiple types of dies 30 to be moved to the carrier 72 so that the bonding region 21 of the substrate 2 and the multiple types of dies 30 of similar grades can be bonded to each other.

[0051] According to this embodiment, in addition to the effects described in the first embodiment, a plurality of types of dies 30 having the same grade as that of the bonding region 21 of the substrate 2 can be bonded.

[0052] <Third embodiment> This embodiment differs from the first embodiment in the handling of the holder that holds (supplies) the die 30. Fig. 9 is a schematic diagram of a processing section (processing device) 11 in this embodiment. The processing section 11 in this embodiment does not include a first storage section 75, but includes a second storage section 76 and a holder transport section 77. The holder transport section 77 can be, for example, a transport hand. Fig. 10 is a flowchart of a processing method of the processing section 11 in this embodiment.

[0053] The processing method of the processing unit 11 in this embodiment will be described with reference to the schematic diagram of Fig. 9 and the flow chart of Fig. 10. First, the second control unit 14 acquires, from the memory unit 15, the grade information of the die 30 held in each of the multiple holders and the grade information of the bonded region 21 of the substrate 2 (acquisition step, S310). Next, the second control unit 14 determines the grade of the die 30 to be moved to the carrier 72 based on the grade information of the bonded region 21 acquired in the acquisition step (determination step, S320).

[0054] Next, the second control unit 14 judges whether each of the multiple holding units holds a die 30 of the grade determined in the determination step (judging step, S330). If each of the multiple holding units does not hold a die 30 of the grade determined in the determination step, the holding unit that does not hold a die 30 of the determined grade is replaced with a holding unit that holds a die 30 of the determined grade (replacement step, S340). For example, assume that the grade of the bonded region 21 is A and the carrier 72 is to move a die 30 including a first type of die 31 of grade A. In this case, if the first holding unit 310 does not have the first type of die 31 of grade A, the second control unit 14 controls the holding unit transport unit 77 to transport the currently installed first holding unit 310 to the second storage unit 76. Then, the second control unit 14 controls the holder transport unit 77 to transport the first holder 310 holding the first type of die 31 of the determined grade obtained from the second storage unit 76 or from outside the processing unit 11 to the location where the previous first holder 310 was installed. In this embodiment, an example in which the second storage unit 76 is located inside the processing unit 11 has been shown, but the second storage unit 76 may be located outside the processing unit 11. In the replacement process, replacement of the holder is performed for all holders that do not hold the die 30 of the determined grade. After the replacement process, or if it is determined in step S330 that each of the multiple holders holds the die 30 of the grade determined in the determination process, the process proceeds to step S350. The second control unit 14 controls the carrier 72 to move multiple types of dies 30 based on the grade determined in the determination process and the grade information of the die 30 (S350, moving process). In other words, the multiple types of dies 30 selected based on the grade determined in the determination process and the grade information of the die 30 are moved to the carrier 72. Then, the second control unit 14 controls the second moving unit 74 to transport the carrier 72 to the outside of the processing unit 11 (to the first inter-apparatus transport unit 50) (S360, transport step).

[0055] For example, there may be a case where two second type dies 32 of grade A need to be moved to the carrier 72, but there is only one second type die 32 of grade A in the second holding unit 320. In such a case, after one of the second type dies 32 of grade A held in the second holding unit 320 is moved to the carrier 72, an exchange step may be performed to move the missing second type dies 32 of grade A from the newly installed second holding unit to the carrier 72. Alternatively, if it is determined in the determination step that the second holding unit 320 does not hold the desired number of dies of the desired grade, an exchange step may be performed before starting the movement step to replace the second holding unit with one holding the desired number of dies of the desired grade.

[0056] Here, the grade of the bonded region 21 of the substrate 2 and the grade of the multiple types of dies 30 may be controlled to be different from each other. For example, even if the grade of the bonded region 21 of the substrate 2 is A, the grade of the multiple types of dies 30 to be bonded may be B. In this way, the grade of the bonded region 21 of the substrate 2 and the grade of the multiple types of dies 30 may be made different from each other.

[0057] According to this embodiment, in addition to the effects described in the first embodiment, it is possible to bond a plurality of types of dies 30 having the same grade as that of the bonded region 21 of the substrate 2. Also, it is not necessary to provide a first storage unit 75 for storing the carriers 72 holding the dies 30, and the number of carriers 72 required may be smaller than that of the second embodiment. In this embodiment, the holder is replaced depending on the dies 30 required for the bonding process in the bonding processing unit 20, so that the dies 30 required for the bonding process in the bonding processing unit 20 can be quickly supplied.

[0058] <Fourth embodiment> This embodiment is characterized in that an article is manufactured using the processing apparatus described above.

[0059] FIG. 11 is a flowchart of the method for manufacturing an article in this embodiment. First, the second control unit 14 acquires grade information of the dies 30 held in each of the multiple holding units from the memory unit 15 (acquisition step, S410). For example, the second control unit 14 acquires grade information of the multiple first type dies 31 held in the first holding unit 310 and the multiple second type dies 32 held in the second holding unit 320. Next, the second control unit 14 controls the first moving unit 71 to move the multiple types of dies 30 to the carrier 72 (third holding unit) based on the grade information acquired in the acquisition step (moving step, S420). In other words, the multiple types of dies 30 selected based on the grade information are moved to the carrier 72. For example, the first type of dies 31 are moved from the first holding unit 310, and the second type of dies 32 are moved from the second holding unit 320 to the carrier 72. Next, a bonding process is performed to bond the multiple types of dies 30 moved to the carrier 72 to a first object (substrate 2) different from the dies 30 (bonding process, S430). Then, an article is manufactured from a second object composed of the dies 30 and the first object bonded in the bonding process (manufacturing process, S440).

[0060] Products manufactured by this manufacturing method include, for example, semiconductor IC elements, liquid crystal display elements, color filters, MEMS, LEDs, sensors, optical devices, and the like.

[0061] The manufacturing process includes, for example, packaging. According to this manufacturing method, when performing a bonding process on a plurality of types of dies 30 in consideration of the grade of the dies 30, it is possible to manufacture an article without replacing the substrate 2.

[0062] The disclosure of the present specification includes the following processing apparatus, processing method, joining apparatus, and method for manufacturing an article.

[0063] [Item 1] a moving unit that moves the first type of die held by the first holding unit and the second type of die held by the second holding unit to a third holding unit; A control unit that controls the moving unit, the first holding unit holds a plurality of the first type of dies, and the second holding unit holds a plurality of the second type of dies; the control unit acquires information on the grades of the dies held in the first holding unit and the second holding unit, and controls the moving unit to move a plurality of types of dies including the first type of die and the second type of die selected based on the acquired information on the grades of the dies to the third holding unit. A processing device comprising:

[0064] [Item 2] 2. The processing device according to item 1, characterized in that the information on the grade of the die is information that maps the relationship between the position of the die held in the first holding unit or the second holding unit and the grade of the die.

[0065] [Item 3] 3. The processing device according to item 1 or 2, characterized in that the control unit acquires information on the grade of the die from a storage unit that stores information on the grade of the die, or from a device other than the processing device.

[0066] [Item 4] The processing device according to any one of items 1 to 3, characterized in that the control unit acquires information on a grade of a bonding area where the multiple types of dies are bonded, and controls the moving unit based on the information on the grade of the bonding area.

[0067] [Item 5] 5. The processing apparatus according to item 4, wherein the control unit controls the moving unit to move the die having the same grade as the grade of the bonding region to the third holding unit.

[0068] [Item 6] 6. The processing apparatus according to any one of items 1 to 5, further comprising a storage unit that stores the third holding unit that holds the plurality of types of dies.

[0069] [Item 7] 7. The processing apparatus according to item 6, wherein the control unit determines whether the third holding unit is to be transported to the storage unit or to a next process.

[0070] [Item 8] 8. The processing apparatus according to any one of items 1 to 7, wherein the plurality of types of dies held by the third holding unit are dies of the same grade.

[0071] [Item 9] 9. The processing apparatus according to any one of items 1 to 8, wherein the control unit replaces the first holding unit or the second holding unit based on information on a grade of the die.

[0072] [Item 10] 10. The processing apparatus according to any one of items 1 to 9, wherein the third holding unit holds the die corresponding to one bonding region to which the die is to be bonded.

[0073] [Item 11] 10. The processing apparatus according to any one of items 1 to 9, wherein the third holding unit holds the die corresponding to a plurality of bonding regions to which the die is to be bonded.

[0074] [Item 12] An acquisition step of acquiring grade information of a plurality of first type dies held in a first holding unit and a plurality of second type dies held in a second holding unit; a moving step of moving the first type of die and the second type of die selected based on the grade information acquired in the acquisition step from the first holding unit and the second holding unit to a third holding unit; A processing method comprising the steps of:

[0075] [Item 13] In the obtaining step, information on the grade of the bonding region to which the die is bonded is also obtained; Item 13. The processing method according to item 12, further comprising a determination step of determining a grade of the die to be moved to the third holding unit based on information on the grade of the bonded region.

[0076] [Item 14] Item 14. The processing method according to item 13, further comprising a replacement step of replacing the first holding unit or the second holding unit that does not hold the die of the grade determined in the determination step.

[0077] [Item 15] a moving unit that moves the first type of die held by the first holding unit and the second type of die held by the second holding unit to a third holding unit; A control unit that controls the moving unit; A joining processing unit that joins the die and a first object different from the die, the first holding unit holds a plurality of the first type of dies, and the second holding unit holds a plurality of the second type of dies; the control unit acquires information on the grades of the dies held in the first holding unit and the second holding unit, and controls the moving unit to move a plurality of types of dies including the first type of die and the second type of die selected based on the acquired information on the grades of the dies to the third holding unit; The bonding processing unit bonds the plurality of types of dies to the first object. A joining device characterized by:

[0078] [Item 16] An acquisition step of acquiring grade information of a plurality of first type dies held in a first holding unit and a plurality of second type dies held in a second holding unit; a moving step of moving the first type of die and the second type of die selected based on the grade information acquired in the acquisition step from the first holding unit and the second holding unit to a third holding unit; a joining step of joining the die moved to the third holding unit to a first object different from the die; a manufacturing process for manufacturing an article from a second object constituted by the die and the first object joined in the joining process; A method for producing an article, comprising the steps of:

[0079] The invention is not limited to the above-described embodiments, and various modifications and variations are possible without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention.

Claims

1. a moving unit that moves the first type of die held by the first holding unit and the second type of die held by the second holding unit to a third holding unit; A control unit that controls the moving unit, the first holding unit holds a plurality of the first type of dies, and the second holding unit holds a plurality of the second type of dies; the control unit acquires information on the grades of the dies held in the first holding unit and the second holding unit, and controls the moving unit to move a plurality of types of dies including the first type of die and the second type of die selected based on the acquired information on the grades of the dies to the third holding unit. A processing device comprising:

2. 2. The processing device according to claim 1, wherein the information on the grade of the die is information that maps a relationship between the position of the die held in the first holding unit or the second holding unit and the grade of the die.

3. 2 . The processing device according to claim 1 , wherein the control unit acquires the information on the grade of the die from a storage unit that stores the information on the grade of the die, or from a device other than the processing device.

4. The processing apparatus according to claim 1 , wherein the control unit acquires information on a grade of a bonding region where the plurality of types of dies are bonded, and controls the moving unit based on the information on the grade of the bonding region.

5. The processing apparatus according to claim 4 , wherein the control unit controls the moving unit to move the die having the same grade as the grade of the bonding region to the third holding unit.

6. The processing apparatus according to claim 1 , further comprising a storage unit for storing the third holder that holds the plurality of types of dies.

7. The processing apparatus according to claim 6 , wherein the control unit determines whether the third holding unit is to be transported to the storage unit or to a next process.

8. The processing apparatus according to claim 1 , wherein the plurality of types of dies held by the third holding section are dies of the same grade.

9. The processing apparatus according to claim 1 , wherein the control unit replaces the first holder or the second holder based on information on the grade of the die.

10. The processing apparatus according to claim 1 , wherein the third holding section holds the die corresponding to one bonding region to which the die is bonded.

11. The processing apparatus according to claim 1 , wherein the third holding section holds the die corresponding to a plurality of bonding regions to which the die is to be bonded.

12. an acquiring step of acquiring grade information of a plurality of first type dies held in the first holding unit and a plurality of second type dies held in the second holding unit; a moving step of moving the first type of die and the second type of die selected based on the grade information acquired in the acquisition step from the first holding unit and the second holding unit to a third holding unit; A processing method comprising the steps of:

13. In the obtaining step, information on the grade of the bonding region to which the die is bonded is also obtained; The processing method according to claim 12 , further comprising a determining step of determining a grade of the die to be moved to the third holding unit based on information on the grade of the bonded region.

14. The processing method according to claim 13, further comprising a replacement step of replacing the first holder or the second holder that does not hold the die of the grade determined in the determination step.

15. a moving unit that moves the first type of die held by the first holding unit and the second type of die held by the second holding unit to a third holding unit; A control unit that controls the moving unit; A joining processing unit that joins the die and a first object different from the die, the first holding unit holds a plurality of the first type of dies, and the second holding unit holds a plurality of the second type of dies; the control unit acquires information on the grades of the dies held in the first holding unit and the second holding unit, and controls the moving unit to move a plurality of types of dies including the first type of die and the second type of die selected based on the acquired information on the grades of the dies to the third holding unit; The bonding processing unit bonds the plurality of types of dies to the first object. A joining device characterized by:

16. an acquiring step of acquiring grade information of a plurality of first type dies held in the first holding unit and a plurality of second type dies held in the second holding unit; a moving step of moving the first type of die and the second type of die selected based on the grade information acquired in the acquisition step from the first holding unit and the second holding unit to a third holding unit; a joining step of joining the die moved to the third holding unit to a first object different from the die; a manufacturing process for manufacturing an article from a second object constituted by the die and the first object joined in the joining process; A method for producing an article, comprising the steps of:

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