Electrostatic chuck and method for manufacturing the same

Abstract

To provide an electrostatic chuck in which a measurement error is relatively reduced when temperature of a workpiece is measured.SOLUTION: An electrostatic chuck 1 is provided that includes: a substrate 2 that includes a first surface 21 having electrical insulation properties and a second surface 22 that is a surface on an opposite side to the first surface 21, and in which a through-hole 23 that penetrates the first surface 21 and the second surface 22 is formed; a bushing 5 that is a bottomed cylindrical body including a side wall 51 formed with an opening 511 and a bottom plate 52, being inserted into the through-hole 23 such that the opening 511 is on a second surface 22 side and the bottom plate 52 is on a first surface 21 side, and being configured to be able to attach a temperature sensor 7 that measures the temperature of the bottom plate 52; an adsorption electrode 3 that is formed on the first surface 21 and made of a conductor; a dielectric layer 4 that is formed so as to cover the bushing 5 and the adsorption electrode 3, being configured to be able to adsorb a workpiece W, and being made of a dielectric; and a temperature adjustment device 6 that is configured to be able to adjust the temperature of the workpiece W.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an electrostatic chuck and a method for manufacturing an electrostatic chuck. [Background technology]

[0002] An electrostatic chuck is a gripping device that attracts and holds a workpiece by electrical attractive forces such as Coulomb force, Johnsen-Rahbek force, and gradient force, which are generated by applying a voltage to an adsorption electrode installed inside. An electrostatic chuck comprises a base, an adsorption electrode formed on the base, and a dielectric layer covering the adsorption electrode, and attracts a workpiece by electrical attractive force generated in the dielectric layer when a voltage is applied to the adsorption electrode. Hereinafter, the surface of the base on which the adsorption electrode is formed is referred to as the first surface, and the surface opposite the first surface is referred to as the second surface. In addition, the surface that is in direct contact with the dielectric layer of the workpiece is referred to as the adsorption surface, and the surface opposite the adsorption surface is referred to as the non-adsorption surface.

[0003] In some cases, a temperature adjustment device is provided in the electrostatic chuck to adjust the temperature of the workpiece. In this case, it is preferable to measure the temperature of the workpiece with a temperature sensor and use the measured temperature for feedback control or the like.

[0004] For the following reasons, it is difficult to directly measure the temperature of the workpiece. When measuring the non-adsorption surface of the workpiece, the use of a contact temperature sensor is not preferable in order to prevent scratches and contamination of the workpiece. In addition, in order to use a non-contact temperature sensor, it is necessary to have no obstacles between the non-contact temperature sensor and the workpiece, which makes the design complicated. In addition, when the electrostatic chuck is used in a vacuum, the non-contact temperature sensor requires measures to withstand pressure, which increases the manufacturing cost. When measuring the adsorption surface of the workpiece, a through hole is provided that penetrates the base and the dielectric layer, and a temperature sensor is installed in the through hole to measure the adsorption surface. At this time, the efficiency of heat transfer between the temperature adjustment device and the workpiece decreases around the through hole, so that temperature unevenness is likely to occur on the workpiece.

[0005] For this reason, conventionally, a bottomed hole is formed on the second surface side of the base, and the temperature of the bottom of the bottomed hole is measured to indirectly measure the temperature of the workpiece. Patent Document 1 discloses an electrostatic chuck in which a thermocouple is embedded in a plate-shaped ceramic body. In this case, since an error may occur between the temperature acquired by the temperature sensor and the actual temperature of the workpiece, a predetermined offset value is added to the measured value to be regarded as the actual temperature of the workpiece. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2000-286331 A Summary of the Invention [Problem to be solved by the invention]

[0007] It is not easy to determine an appropriate offset value because the appropriate value can change depending on various conditions, such as the environment around the electrostatic chuck and the temperature before the workpiece is attracted.

[0008] If the distance between the bottom surface of the blind hole and the first surface of the base can be reduced, the distance between the temperature measurement position and the workpiece will also be reduced, and the measurement error will decrease. However, since providing a thin-walled portion in the base may cause cracks, there is a design limit to how small the distance between the bottom surface of the blind hole and the first surface of the base can be.

[0009] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide an electrostatic chuck and a manufacturing method thereof that relatively reduces measurement errors when measuring the temperature of a workpiece. [Means for solving the problem]

[0010] According to the present invention, there is provided an electrostatic chuck comprising: a base including an electrically insulating first surface and a second surface opposite to the first surface, the base being a bottomed cylindrical body including a side wall having an opening and a bottom plate, the bushing being inserted into the through hole so that the opening is on the second surface side and the bottom plate is on the first surface side and the bushing is configured to be capable of mounting a temperature sensor for measuring the temperature of the bottom plate; an adsorption electrode formed on the first surface and made of a conductor; a dielectric layer made of a dielectric material formed so as to cover the bushing and the adsorption electrode and configured to be capable of adsorbing a workpiece; and a temperature adjustment device configured to adjust the temperature of the workpiece.

[0011] The present invention also provides a method for manufacturing an electrostatic chuck, the method including: a base preparation step of preparing a base including an electrically insulating first surface and a second surface that is the surface opposite to the first surface, the base having a through hole formed therein that penetrates the first surface and the second surface; a bushing insertion step of inserting a bushing that is a bottomed cylindrical body including a side wall having an opening formed therein and a bottom plate, the bushing being configured to be able to accommodate a temperature sensor that measures the temperature of the bottom plate, into the through hole so that the opening faces the second surface and the bottom plate faces the first surface; an attraction electrode formation step of forming an attraction electrode made of a conductor on the first surface; a dielectric layer formation step of forming a dielectric layer made of a dielectric material configured to be able to attract a workpiece, the dielectric layer covering the attraction electrode and the bushing; and a temperature adjustment device installation step of installing a temperature adjustment device configured to be able to adjust the temperature of the workpiece. Effect of the Invention

[0012] In the electrostatic chuck according to the present invention, a through hole is formed in the base, and a bushing which is a cylindrical body with a bottom is inserted into the through hole. A dielectric layer is formed so as to cover the chucking electrode and the bushing. To measure the temperature of the workpiece, a temperature sensor is attached to the bushing and the temperature of the bottom plate of the bushing is measured. With this configuration, it is possible to design the distance between the temperature measurement position and the workpiece to be relatively small, thereby realizing an electrostatic chuck with relatively reduced temperature measurement error. [Brief description of the drawings]

[0013] [Figure 1] FIG. 2 is a cross-sectional view of an electrostatic chuck. [Diagram 2] FIG. 2 is an enlarged view of a range II in FIG. [Diagram 3] FIG. 2 is a bottom view of a base having an adsorption electrode formed on a first surface thereof. [Figure 4] FIG. [Diagram 5] FIG. 2 is a top view of a base having a heater electrode formed on a second surface thereof. [Figure 6] 1 is a flowchart illustrating a method for manufacturing an electrostatic chuck. [Figure 7] 1 is an explanatory diagram of a method for manufacturing an electrostatic chuck, showing a base body in which grooves and through holes are formed. [Figure 8] 1 is an explanatory diagram of a manufacturing method of an electrostatic chuck, showing a base body through which a bushing is inserted. [Figure 9] 4 is an explanatory diagram of the manufacturing method of the electrostatic chuck, showing the state after a conductor is thermally sprayed. [Figure 10] 4 is an explanatory diagram of the manufacturing method of the electrostatic chuck, showing the state after the conductor is ground. [Figure 11] 1 is an explanatory diagram of a manufacturing method of an electrostatic chuck, showing the state after a dielectric is thermally sprayed. [Figure 12] 1 is an explanatory diagram of a manufacturing method of an electrostatic chuck, showing a state after a dielectric material has been ground. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In each drawing, each component is shown in a schematic manner, and the shape and scale are not necessarily as shown in the drawing. The various modified examples described below can be implemented in any combination.

[0015] The electrostatic chuck 1 of the present embodiment can be suitably used as a wafer gripping device in a vacuum chamber of a semiconductor manufacturing device, although the application field of the electrostatic chuck 1 is not limited thereto.

[0016] The electrostatic chuck 1 of the present embodiment is particularly suitable for use when the workpiece W to be chucked is made of a material such as glass that has low thermal conductivity and is prone to temperature variations. Specifically, the electrostatic chuck 1 is particularly suitable for use when the thermal conductivity of the workpiece W (at room temperature) is 3.0 W / m K or less.

[0017] As shown in FIGS. 1 and 2, an electrostatic chuck 1 of the present embodiment includes a base 2, an attraction electrode 3, a dielectric layer 4, a bushing 5, a temperature adjustment device 6, and a temperature sensor 7.

[0018] The base 2 is a plate-shaped base material on which the chucking electrode 3 and the dielectric layer 4 are formed. The base 2 includes a first surface 21 and a second surface 22, which is the surface opposite to the first surface 21. The first surface 21 is the surface on which the chucking electrode 3 and the dielectric layer 4 are formed, and has electrical insulation. The base 2 of this embodiment is specifically an integrally formed sintered ceramic body, and has the above-mentioned insulation as a whole, but may be made of a composite material, and it is sufficient that at least the first surface 21 has electrical insulation. The base 2 is formed with a through hole 23 that penetrates the first surface 21 and the second surface 22 in the plate thickness direction, and a bush 5 is inserted into the through hole 23.

[0019] The electrostatic chuck 1 of the present embodiment is particularly suitable for use in the case where the base 2 is made of a material that is prone to cracking when a thin-walled portion is provided. Specifically, the electrostatic chuck 1 is particularly suitable for use in the case where the base 2 is made of ceramic or glass. As the ceramic, for example, alumina may be used.

[0020] The chucking electrode 3 is an electrode made of a conductor and formed on the first surface 21 of the base 2. The chucking electrode 3 may be a monopolar type having only one of the positive electrode 31 and the negative electrode 32, or may be a bipolar type having both the positive electrode 31 and the negative electrode 32. The chucking electrode 3 in this embodiment is a bipolar type, and has a so-called comb-tooth shape in which the positive electrodes 31 and the negative electrodes 32 are alternately arranged with a predetermined gap therebetween, as shown in FIG. 3. When the workpiece W is chucking, a predetermined voltage is applied to the positive electrode 31 and the negative electrode 32 via terminals 311 and 322, respectively.

[0021] The material of the chucking electrode 3 is not particularly limited as long as it can be used as an electrode, but when the chucking electrode 3 is made of the same material as the filling layer 54 described below, it is preferable that the material has high thermal conductivity. The chucking electrode 3 may be made of, for example, aluminum, copper, silver, nickel, tungsten, or an alloy containing any of these as its main components.

[0022] The dielectric layer 4 is a layer made of a dielectric material, formed so as to cover the bushing 5 and the chucking electrode 3. The dielectric layer 4 is configured so as to be able to chucking the workpiece W, and the workpiece W is held by being in direct contact with the dielectric layer 4. Specifically, when a predetermined voltage is applied to the chucking electrode 3, electrical attractive forces such as Coulomb force, Johnsen-Rahbek force, and gradient force are generated within the dielectric layer 4, and the workpiece W is chucking.

[0023] The material of the dielectric layer 4 is selected from any dielectric material depending on the desired electrical resistivity. The dielectric layer 4 may be made of, for example, zircon, alumina, zirconia, titania, aluminum nitride, silica, and mixtures thereof. The thickness of the dielectric layer 4 is, for example, about 0.2 mm or more and about 0.5 mm or less.

[0024] The bush 5 is a bottomed cylinder configured to allow the temperature sensor 7 to be attached. As shown in FIG. 4, the bush 5 includes a side wall 51, a bottom plate 52, and a flange 53. An opening 511 is formed on one end of the side wall 51, and the bottom plate 52 is provided on the other end. As shown in FIG. 2, the bush 5 is inserted into the through hole 23 of the base 2 so that the opening 511 faces the second surface 22 and the bottom plate 52 faces the first surface 21. The temperature sensor 7 is inserted into the side wall 51 through the opening 511 to measure the temperature of the bottom plate 52 in order to grasp the temperature of the workpiece W. With this configuration, the temperature can be measured at a position closer to the workpiece W without providing a thin-walled portion in the base 2, and the temperature measurement error can be reduced.

[0025] The material of the bushing 5 is not particularly limited, but is preferably one with good thermal conductivity. The bushing 5 may be made of, for example, metals such as aluminum, stainless steel, iron, and alloys containing these as main components, machinable ceramics, and alumina. In particular, aluminum (including aluminum alloys) is preferable as the material of the bushing 5, since it has excellent thermal conductivity, workability, and availability.

[0026] It is preferable that the thickness t1 of the bottom plate 52 of the bush 5 is as small as possible in order to bring the temperature measurement position closer to the workpiece W. The thickness t1 of the bottom plate 52 is, for example, about 3 mm or less. There is no particular limit to the lower limit of the thickness t1 of the bottom plate 52, but about 0.5 mm is a general processing limit.

[0027] The flange 53 is a flange portion formed on the periphery of the bottom plate 52. By providing the flange 53, the temperature measurement area by the temperature sensor 7 can be substantially enlarged. In addition, the falling off of the bush 5 during manufacturing can be prevented. On the other hand, when the bush 5 is made of a conductor, the bush 5 and the chucking electrode 3 need to be provided in a non-contact state. In designing the bush 5 so as not to contact the chucking electrode 3, if the area of ​​the flange 53 is large, the area in which the chucking electrode 3 can be formed is accordingly reduced, which may affect the chucking force of the electrostatic chuck 1. In view of the above, it is preferable that the area of ​​the flange 53 is large enough to improve the temperature measurement accuracy without affecting the chucking force, and the diameter D of the flange 53 is, for example, about 8 mm or more and about 10 mm or less.

[0028] 2, a filling layer 54 may be formed between the bottom plate 52 of the bush 5 and the dielectric layer 4. The significance of providing the filling layer 54 will be described later.

[0029] The temperature adjustment device 6 is a device configured to be able to adjust the temperature of the workpiece W. The temperature adjustment device 6 preferably performs feedback control based on the temperature of the workpiece W measured by a temperature sensor 7. The temperature adjustment device 6 includes at least one of a heater 61 that heats the workpiece W and a cooler 62 that cools the workpiece W. In this embodiment, the temperature adjustment device 6 is provided adjacent to the second surface of the base 2, but at least a part of it may be provided inside the base 2.

[0030] The heater 61 of this embodiment has a heater electrode 611. The heater electrode 611 is an electrode made of a resistance heating element. The resistance heating element may be, for example, nichrome. In this embodiment, as shown in FIG. 5, the heater electrode 611 is formed directly on the second surface 22 of the base 2. Therefore, the second surface 22 needs to have electrical insulation. When the workpiece W is heated, a predetermined voltage is applied to the heater electrode 611 via a terminal 612.

[0031] The heater 61 is not limited to having a heater electrode 611. For example, the heater 61 may have a heating pipe that is a pipe through which a hot medium can flow, a sheath heater, or a sheet heater such as a polyimide heater or a polyester heater.

[0032] The cooler 62 of this embodiment has a cooling pipe 622. The cooling pipe 622 is a pipe through which air or a refrigerant can flow. The cooler 62 is not limited to having the cooling pipe 622. For example, the cooler 62 may have a Peltier element.

[0033] The temperature sensor 7 measures the temperature of the bottom plate 52 of the bush 5 to indirectly obtain the temperature of the workpiece W. The temperature sensor 7 is preferably a contact-type temperature sensor. More specifically, the temperature sensor 7 may be, for example, a thermocouple, a resistance temperature detector, or a thermistor. The positions and the number of the temperature sensors 7 and the bushes 5 through which the temperature sensors 7 are inserted are not particularly limited, but in order to measure the temperature of the workpiece W more accurately, it is preferable to provide a plurality of temperature sensors 7 and bushes 5 distributed over the entire surface of the electrostatic chuck 1. The electrostatic chuck 1 of this embodiment includes nine temperature sensors 7 and bushes 5.

[0034] A method for manufacturing the electrostatic chuck 1 of this embodiment will be described below with reference to Fig. 6 to Fig. 12. In Fig. 7 to Fig. 12, the configuration of the electrostatic chuck 1 is shown in a particularly simplified manner.

[0035] First, a base preparation step of preparing a base 2 is performed (S1). As shown in Fig. 7, a through hole 23 penetrating the first surface 21 and the second surface 22 is formed in the base 2, and a groove 24 is formed in the first surface 21. The through hole 23 has a first portion having a diameter substantially the same as the outer diameter of the side wall 51 of the bush 5 and a second portion having a diameter substantially the same as the outer diameter of the flange 53 of the bush 5, the first portion being located on the second surface 22 side and the second portion being located on the first surface 21 side. The groove 24 has the same shape as the chucking electrode 3 to be formed.

[0036] A bushing insertion step is carried out to insert the bushing 5 into the through hole 23 of the base 2 (S2). As shown in Fig. 8, the bushing 5 is inserted from the first surface 21 side, and is arranged so that the opening 511 faces the second surface 22 and the bottom plate 52 faces the first surface 21. Here, it is preferable that a slight clearance C is formed between the bottom plate 52 of the bushing 5 and the first surface 21 when the bushing 5 is pressed in until the flange 53 abuts against the boundary surface between the first and second portions of the through hole 23.

[0037] After the bushing 5 is inserted, a conductor is sprayed on the entire surface of the first surface 21 side as shown in FIG. 9 (S3). Next, the sprayed conductor is ground to remove unnecessary conductor (S4). Specifically, grinding is performed until the base 2 is exposed in the portions other than the through holes 23 and the grooves 24. In this manner, the attraction electrode forming step is performed, and an attraction electrode 3 including a positive electrode 31 and a negative electrode 32 and a filling layer 54 are formed on the first surface 21 of the base 2 as shown in FIG. 10. In other words, the attraction electrode forming step of this embodiment includes a step of spraying a conductor at least on the grooves 24 and the clearance C, and a step of removing unnecessary portions of the sprayed conductor to form an attraction electrode 3 in the grooves 24 and a filling layer 54 in the clearance C.

[0038] In this embodiment, the attraction electrode 3 is formed by thermal spraying, but the method of forming the attraction electrode 3 is not limited to this. For example, the attraction electrode 3 may be formed by printing. Also, the attraction electrode 3 may be formed by adhering an electric wire. Also, when forming the base 2 from a fired ceramic body, a conductor may be placed on the ceramic material before firing and then fired together to create the base 2 integrated with the attraction electrode 3.

[0039] In addition, in this embodiment, when forming the attraction electrode 3 by thermal spraying, a conductor is thermally sprayed on the entire surface and unnecessary portions are removed by grinding. This method has the advantage that it is easy to make the gap between the electrodes close to the design dimension, and the thickness of the electrodes is approximately uniform, thereby suppressing variation in attraction performance. However, the attraction electrode 3 may be formed by placing a mask on which a desired electrode pattern is formed and spraying a conductor on the mask. In this case, it is not necessary to provide the groove 24 in the base 2.

[0040] When the entire surface is sprayed with a conductor and unnecessary portions are removed by grinding, it is necessary to prevent the bush 5 from being damaged by grinding. In this embodiment, a clearance C is provided between the bottom plate 52 and the first surface 21 of the bush 5 to prevent damage to the bush 5. In addition, the clearance C is filled with a spray material to form a filling layer 54. The spray material charged in the clearance C may be a material different from the conductor forming the chucking electrode 3, but it is preferable that the material is the same in terms of simplifying the manufacturing process. In other words, it is preferable that the filling layer 54 is made of the same material as the chucking electrode. It is preferable that the thickness t2 of the filling layer 54 is as small as possible in order to bring the temperature measurement position and the workpiece W closer to each other. The thickness t2 of the filling layer 54 is, for example, about 0.1 mm or more and about 0.5 mm or less.

[0041] After the chucking electrode 3 is formed, a dielectric is sprayed onto the entire surface of the first surface 21 side (S5), as shown in Fig. 11. Next, the sprayed dielectric is ground to flatten the surface (S6). In this manner, the dielectric layer forming step is performed, and the dielectric layer 4 is formed so as to cover the chucking electrode 3 and the bushing 5, as shown in Fig. 11.

[0042] In this embodiment, the dielectric layer 4 is formed by thermal spraying, but the method of forming the dielectric layer 4 is not limited to this. For example, the dielectric layer 4 may be formed by adhering a plate-shaped or film-shaped dielectric.

[0043] Then, a temperature adjustment device installation step is performed in which a temperature adjustment device is installed (S7). When a heater electrode 611 constituting the heater 61 is provided, the heater electrode 611 may be formed by thermally spraying a resistance heating element on the second surface 22 of the base 2. When forming the heater electrode 611 by thermal spraying, the heater electrode 611 may be formed by forming a groove in the second surface 22, thermally spraying the resistance heating element on the entire surface on the second surface 22 side, and grinding the sprayed resistance heating element to remove unnecessary resistance heating element. Alternatively, the heater electrode 611 may be formed by placing a mask on which a desired electrode pattern is formed, and thermally spraying the resistance heating element on the mask.

[0044] The order of the steps in the manufacturing method described above may be changed within the scope of feasibility. For example, the heater electrode 611 may be formed at any time before the dielectric layer 4 is formed.

[0045] The present invention is not limited to the configurations of the embodiments described above, and various modifications and applications are possible without departing from the technical spirit of the present invention. [Explanation of symbols]

[0046] 1. Electrostatic chuck 2 Base 21 Page 1 22 Side 2 23 Through hole 24 groove 3 Adsorption electrode 4 Dielectric Layer 5. Bush 51 Side wall 511 Aperture 52 Bottom plate 53 Flange 54 Filled bed 6 Temperature adjustment device 61 Heater 611 Heater electrode 62 Cooler 7 Temperature Sensor C. Clearance Double work

Claims

1. A substrate including a first surface having electrical insulation properties and a second surface opposite to the first surface, the substrate having a through hole formed therein penetrating the first surface and the second surface; a bushing that is a bottomed cylinder including a side wall having an opening and a bottom plate, the bushing being inserted into the through hole so that the opening faces the second surface side and the bottom plate faces the first surface side, and that is configured to be able to mount a temperature sensor that measures a temperature of the bottom plate; an attraction electrode formed on the first surface and made of a conductor; a dielectric layer made of a dielectric material, the dielectric layer being formed so as to cover the bush and the chucking electrode and being configured to be capable of chucking a workpiece; and a temperature adjustment device configured to adjust the temperature of the workpiece.

2. The electrostatic chuck of claim 1 , wherein the bottom plate has a thickness of 3 mm or less.

3. The electrostatic chuck of claim 1 , wherein the bushing further includes a flange formed on a periphery of the bottom plate.

4. 4. The electrostatic chuck of claim 3, wherein the flange has a diameter of 8 mm or more and 10 mm or less.

5. The electrostatic chuck of claim 1 , further comprising a filler layer formed between said base plate and said dielectric layer.

6. 6. The electrostatic chuck according to claim 5, wherein the filling layer has a thickness of 0.1 mm or more and 0.5 mm or less.

7. 6. The electrostatic chuck according to claim 5, wherein the filling layer is made of the same material as the attracting electrode.

8. The electrostatic chuck of claim 1 , wherein the temperature adjustment device comprises a heater.

9. the second surface is electrically insulating; 9. The electrostatic chuck according to claim 8, wherein the heater has a heater electrode formed on the second surface and made of a resistive heating element.

10. The electrostatic chuck of claim 1 , wherein the temperature adjustment device comprises a chiller.

11. The electrostatic chuck of claim 1 , wherein the temperature sensor is a contact type temperature sensor.

12. 2. The electrostatic chuck of claim 1, wherein the workpiece has a thermal conductivity of 3.0 W / m·K or less.

13. 2. The electrostatic chuck of claim 1, wherein the substrate is made of ceramic or glass.

14. a base preparation step of preparing a base including a first surface having electrical insulation and a second surface that is a surface opposite to the first surface, the base having a through hole formed therein that penetrates the first surface and the second surface; a bushing insertion process for inserting a bushing configured to be capable of mounting a temperature sensor for measuring a temperature of the bottom plate, the bushing being a bottom-closed cylindrical body including a side wall having an opening and a bottom plate, into the through hole so that the opening faces the second surface side and the bottom plate faces the first surface side; an attraction electrode forming step of forming an attraction electrode made of a conductor on the first surface; a dielectric layer forming step of forming a dielectric layer made of a dielectric material configured to be able to adsorb a workpiece so as to cover the adsorption electrode and the bush; and a temperature adjustment device installation process for installing a temperature adjustment device configured to be able to adjust the temperature of the workpiece.

15. A groove is formed in the first surface; A clearance is formed between the bottom plate of the bush inserted into the through hole and the first surface, The adsorption electrode forming step includes: spraying the conductor at least into the groove and the clearance; 15. The method for manufacturing an electrostatic chuck according to claim 14, further comprising the steps of: removing an unnecessary portion of the sprayed conductor; forming the attracting electrode in the groove; and forming a filling layer in the clearance.

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